High-integration transceiving common-caliber four-beam phased-array antenna
By nesting and integrating the antenna with the RF chip, and through an integrated design, the integration and heat management issues of phased array antennas on portable and unmanned aerial vehicle (UAV) terminal platforms have been solved, achieving high integration and multi-beam control, and supporting high-power phased array antenna applications.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-26
- Publication Date
- 2026-04-07
AI Technical Summary
Existing phased array antennas on portable and unmanned aerial vehicle (UAV) terminal platforms suffer from problems such as large system size, heavy weight, difficult heat management, severe electromagnetic coupling, and high cost, making it difficult to achieve an effective balance between high integration and multi-beam functionality.
The antenna and RF chip are nested together, and the four-beam RF-power-control integrated design is combined with a low thermal resistance heat transfer path and independent beam control to form a highly integrated four-beam phased array antenna with the same aperture for both transmit and receive.
It achieves high antenna integration, low thermal resistance, independent beam control, and high transmit power, supports simultaneous operation of multiple beams, and is suitable for lightweight, multi-functional satellite communication terminals.
Smart Images
Figure CN121812958A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of phased array antenna technology, and particularly relates to a highly integrated transceiver co-aperture four-beam phased array antenna. Background Technology
[0002] Phased array antenna technology, with its superior performance in electronic beam scanning, rapid agility, and high pointing accuracy, is gradually replacing traditional mechanically scanned antennas and becoming the preferred solution for modern satellite communication terminals. Phased array antennas can achieve instantaneous beam pointing and switching in space without mechanical rotation, greatly improving system response speed and multi-target tracking capabilities, providing technical support for continuous and reliable communication in highly mobile scenarios.
[0003] Traditional phased array antennas consist of numerous independent transmit / receive (T / R) components, phase shifters, power dividers / combiners, and radiating elements, resulting in a large and heavy system that limits its application on portable terminals, UAV-borne terminals, and other platforms. Therefore, achieving high integration and lightweight design of antenna arrays, RF channels, and components is an effective way to improve the performance of terminal platforms. Furthermore, to improve spectrum utilization and system capacity, modern satellite communications commonly employ frequency reuse technology, which requires terminals to simultaneously generate multiple independently controllable beams to interface with multiple satellites. Therefore, achieving independent beam formation and synchronous operation of multiple beams on the same physical aperture (common aperture) has become a key technology for realizing the miniaturization and multi-functionality of terminals.
[0004] Currently, the industry has conducted a series of explorations to improve the integration level and multi-beam capability of phased array antennas for satellite terminals. In terms of improving integration, due to the complexity of multi-beam phased array antennas, brick-like or tile-like integration methods are often used, resulting in low integration density. Some studies have proposed to improve the integration level of multi-beam phased array antennas based on antenna-in-package (AiP) or three-dimensional system-in-package (3D-SiP) technology, but the channel transmit power under these two integration methods is generally around 10mW, making it difficult to achieve a larger channel transmit power. In terms of multi-beam, it mainly relies on analog beamforming networks such as Butler matrices and Blass matrices or architectures based on digital beamforming (DBF).
[0005] Despite significant advancements in existing technologies, multi-beam phased array antennas still face numerous bottlenecks.
[0006] First, the system architecture is complex, integrating transceiver channels and multiple beamforming networks within a limited physical space, which poses a serious challenge to electromagnetic coupling and threatens isolation and beam independence.
[0007] Secondly, phased array antennas with multi-beam functionality generate more heat during operation compared to single-beam phased array antennas. How to quickly transfer the heat to the cold end to ensure the antenna works normally is a very challenging problem.
[0008] In addition, while purely digital beamforming (DBF)-based schemes are flexible, their channel count and power consumption costs are too high, while analog beamforming networks have limited flexibility and higher losses.
[0009] Therefore, current technology urgently needs an innovative multi-beam phased array antenna solution to achieve a high degree of integration between transmit and receive with multi-beam functionality, effectively balancing system performance, integration, complexity, and cost, and providing ideal core hardware for next-generation lightweight, multi-functional satellite communication terminals.
[0010] It should be noted that the above content falls within the inventor's technical knowledge and does not necessarily constitute prior art. Summary of the Invention
[0011] To address the aforementioned issues, the present invention aims to provide a highly integrated transceiver co-aperture four-beam phased array antenna. This antenna employs techniques such as nested installation of the antenna and RF chip, and integrated design of four-beam RF-power-control to compress the profile height. Compared to traditional co-aperture four-beam phased array antenna integration methods, it achieves higher integration.
[0012] To achieve the above objectives, this invention proposes a highly integrated transceiver co-aperture four-beam phased array antenna, which includes an antenna array, a four-channel four-beam transceiver RF chip, a multi-functional integrated board, a metal backing plate, a busbar, a low-frequency connector, an RF connector, and a heat-conducting copper block.
[0013] The lower surface of the antenna array is welded to a multi-functional integrated board, and there is a U-shaped groove on the back, in which a four-channel, four-beam transceiver RF chip is nested.
[0014] The lower surface of the four-channel four-beam transceiver RF chip is connected to the multi-functional integrated board by welding.
[0015] The multifunctional integrated board is welded to the metal backing plate, and the busbar is welded to the surface of the multifunctional integrated board to supply power to the phased array antenna.
[0016] The low-frequency connector is soldered to the surface of the multi-functional integrated board to provide low-frequency control signals for the four-channel four-beam transceiver RF chip. The RF connector is soldered to the surface of the multi-functional integrated board to receive or transmit RF signals. The thermally conductive copper block is embedded inside the multi-functional integrated board.
[0017] Preferably, the antenna array operates in the Ku band and is polarized in a dual circular polarization manner, capable of radiating both left-hand circularly polarized electromagnetic waves and right-hand circularly polarized electromagnetic waves.
[0018] Preferably, the radio frequency connector has the function of forming four beams simultaneously in free space, and each beam is independently controlled.
[0019] Preferably, the heat generated by the four-channel four-beam transceiver RF chip during operation is conducted from the BGA metal ball at its bottom to the heat-conducting copper block, and then from the heat-conducting copper block to the bottom soldering surface of the multi-functional integrated board, forming a low thermal resistance heat transfer path. The multi-functional integrated board then quickly conducts the heat to the metal backing plate. The maximum single-channel transmit power of the four-channel four-beam transceiver RF chip is 500mW.
[0020] Preferably, the antenna array is nested and installed with a four-channel four-beam transceiver RF chip.
[0021] Preferably, the multi-functional integrated board integrates four sets of radio frequency feed networks for forming four beams.
[0022] Preferably, the multi-functional integrated board incorporates an integrated design for radio frequency, power supply, and control functions.
[0023] Preferably, the busbar is soldered to the surface of the multi-functional integrated board and can carry a current of up to 20A.
[0024] Preferably, the low-frequency signal transmitted by the low-frequency connector includes a switching information codeword for receiving and transmitting functions.
[0025] Preferably, the welding process between the multi-functional integrated board and the four-channel four-beam transceiver RF chip and the antenna array is BGA ball-mounted soldering.
[0026] The multifunctional integrated board and the metal backing plate are welded together using solder sheets.
[0027] The highly integrated transceiver co-aperture four-beam phased array antenna proposed in this invention can bring the following beneficial effects:
[0028] 1. The phased array antenna device of the present invention uses techniques such as nested installation of antenna and radio frequency chip and integrated design of four-beam radio frequency-power supply-control to compress the profile height, which has a higher integration degree compared with the traditional common aperture four-beam phased array antenna integration method;
[0029] 2. The phased array antenna device of the present invention uses a four-channel four-beam transceiver RF chip, which can individually control the amplitude and phase of each beam transceiver channel through serial information codewords, thereby realizing four independent controllable beams within the same aperture.
[0030] 3. The phased array antenna device of this invention proposes a low thermal resistance heat transfer path, which can quickly conduct the heat generated by the RF chip during operation to the cold end, supporting a single-channel transmit power of up to 500mW;
[0031] 4. The phased array antenna device of the present invention can be used to splice multiple antenna devices as subarrays to form a larger-scale antenna array. Attached Figure Description
[0032] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:
[0033] Figure 1 This is a schematic diagram of the structure of a highly integrated transceiver co-aperture four-beam phased array antenna device according to the present invention;
[0034] Figure 2 This is a partially exploded schematic diagram of a highly integrated transceiver co-aperture four-beam phased array antenna device according to the present invention.
[0035] Figure 3 This is a timing diagram of the RF channel amplitude, phase, and transceiver control of a highly integrated transceiver four-beam phased array antenna device according to the present invention. Detailed Implementation
[0036] To more clearly illustrate the overall concept of the present invention, a detailed description will be provided below with reference to the accompanying drawings and examples.
[0037] Embodiments of the present invention propose a highly integrated transceiver co-aperture four-beam phased array antenna, such as... Figure 1 , Figure 2 As shown, the phased array antenna includes an antenna array 1, a four-channel four-beam transceiver RF chip 2, a multi-functional integrated board 3, a metal backing plate 4, a busbar 5, a low-frequency connector 6, an RF connector 7, and a heat-conducting copper block 8.
[0038] The antenna array 1 operates in the Ku band and is polarized in a dual circular polarization mode, capable of radiating both left-hand circularly polarized electromagnetic waves and right-hand circularly polarized electromagnetic waves.
[0039] The lower surface of the antenna array 1 is soldered to the multi-functional integrated board 3 via BGA ball-mounting. There is a U-shaped groove on the back, and the four-channel four-beam transceiver RF chip 2 can be nested in the U-shaped groove.
[0040] The lower surface of the four-channel, four-beam transceiver RF chip 2 is soldered to the multi-functional integrated board 3 via BGA ball-mounting. The multi-functional integrated board 3 is soldered to the metal backing plate 4 via solder pads. The busbar 5 is soldered to the surface layer of the multi-functional integrated board 3 to power the phased array antenna.
[0041] Low-frequency connector 6 is soldered to the surface of multi-functional integrated board 3, providing low-frequency control signals for the four-channel four-beam transceiver RF chip 2. RF connector 7 is soldered to the surface of multi-functional integrated board 3, receiving or transmitting RF signals. Thermally conductive copper block 8 is embedded inside multi-functional integrated board 3. Low-frequency connector 6 has the function of simultaneously forming four beams in free space, each beam being independently controlled, and low-frequency connector 6 has the function of receiving and transmitting beams.
[0042] The heat generated by the four-channel four-beam transceiver RF chip 2 during operation can be quickly conducted to the metal liner, which serves as the cold end, through the low thermal resistance heat transfer path formed by the BGA metal ball-thermal conductive copper block 8-the bottom solder surface of the multi-functional integrated board 3. The maximum transmit power of a single channel is 500mW.
[0043] Antenna array 1 and four-channel four-beam transceiver RF chip 2 are nested and installed;
[0044] The multi-functional integrated board 3 integrates four sets of radio frequency (RF) feed networks for forming four beams. Each RF feed network forms good electromagnetic shielding, which enables high isolation between different beams. The multi-functional integrated board 3 has an integrated design that combines RF, power supply and control functions.
[0045] The timing diagram of the RF channel amplitude, phase, and transmit / receive control of the phased array antenna device is as follows: Figure 3 As shown.
[0046] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.
[0047] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.
Claims
1. A highly integrated transceiver co-aperture four-beam phased array antenna, characterized in that, The phased array antenna includes an antenna array (1), a four-channel four-beam transceiver RF chip (2), a multi-functional integrated board (3), a metal backing plate (4), a busbar (5), a low-frequency connector (6), an RF connector (7), and a heat-conducting copper block (8). The lower surface of the antenna array (1) is welded to the multi-functional integrated board (3), and there is a U-shaped groove on the back. The four-channel four-beam transceiver RF chip (2) is nested in the U-shaped groove. The lower surface of the four-channel four-beam transceiver RF chip (2) is connected to the multi-functional integrated board (3) by welding; The multifunctional integrated board (3) is welded to the metal backing plate (4), and the busbar (5) is welded to the surface of the multifunctional integrated board (3) to supply power to the phased array antenna. The low-frequency connector (6) is soldered to the surface of the multi-functional integrated board (3) to provide low-frequency control signals for the four-channel four-beam transceiver RF chip (2). The RF connector (7) is soldered to the surface of the multi-functional integrated board (3) to receive or transmit RF signals. The thermally conductive copper block (8) is embedded inside the multi-functional integrated board (3).
2. The highly integrated transceiver co-aperture four-beam phased array antenna according to claim 1, characterized in that, The antenna array (1) operates in the Ku band and is polarized in a dual circular polarization manner, capable of radiating both left-hand circularly polarized electromagnetic waves and right-hand circularly polarized electromagnetic waves.
3. The highly integrated transceiver co-aperture four-beam phased array antenna according to claim 2, characterized in that, The radio frequency connector (7) has the function of forming four beams simultaneously in free space, and each beam is independently controlled.
4. The highly integrated transceiver co-aperture four-beam phased array antenna according to claim 3, characterized in that, The heat generated by the four-channel four-beam transceiver RF chip (2) during operation is conducted from the BGA metal ball at its bottom to the heat-conducting copper block (8), and then from the heat-conducting copper block (8) to the bottom soldering surface of the multi-functional integrated board (3), forming a low thermal resistance heat transfer path. The multi-functional integrated board (3) then quickly conducts the heat to the metal backing plate (4). The maximum single-channel transmit power of the four-channel four-beam transceiver RF chip (2) is 500mW.
5. A highly integrated transceiver co-aperture four-beam phased array antenna according to claim 4, characterized in that, The antenna array (1) is nested with the four-channel four-beam transceiver RF chip (2).
6. The highly integrated transceiver co-aperture four-beam phased array antenna according to claim 5, characterized in that, The multi-functional integrated board (3) integrates four sets of radio frequency feed networks for forming four beams.
7. A highly integrated transceiver co-aperture four-beam phased array antenna according to claim 6, characterized in that, The multi-functional integrated board (3) incorporates an integrated design for radio frequency, power supply, and control functions.
8. A highly integrated transceiver co-aperture four-beam phased array antenna according to claim 7, characterized in that, The busbar (5) is welded to the surface of the multi-functional integrated board (3) and can carry a current of up to 20A.
9. A highly integrated transceiver co-aperture four-beam phased array antenna according to claim 8, characterized in that, The low-frequency signal transmitted by the low-frequency connector (6) contains switching information codewords for receiving and transmitting functions.
10. A highly integrated transceiver co-aperture four-beam phased array antenna according to claim 9, characterized in that, The welding process between the multi-functional integrated board (3) and the four-channel four-beam transceiver RF chip (2) and the antenna array (1) is BGA ball-mounted welding. The multifunctional integrated board (3) and the metal backing plate (4) are welded together by solder sheets.