Parallel grounding device and method for flying probe test

Abstract

The invention discloses a parallel grounding device and method for a flying probe test, and the device comprises an X-direction driver which is fixedly disposed in an inner cavity of a circuit board conveying track, and the outer end of a piston rod of the X-direction driver is fixedly connected with a probe translation pedestal. A probe translation base is fixedly connected to the upper end of the circuit board conveying track, a Z-direction driver is fixedly connected to the outer side of the probe translation base, a plurality of array type parallel concentrated grounding modules are fixedly connected to the upper end of a piston rod of the Z-direction driver, and the array type parallel concentrated grounding modules are horizontally arranged in the transverse direction of the circuit board conveying track. During the flying probe test, the test equipment control terminal controls the independent communication of the array type parallel concentrated grounding module, thereby realizing the parallel grounding of a single board and multiple jointed boards, reducing the time of independent switching grounding, improving the operation efficiency, realizing the parallel grounding function of the flying probe test, and greatly improving the test efficiency and stability.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, specifically to a parallel grounding device and method for flying probe testing. Background Technology

[0002] In the field of flying probe testing, grounding is a crucial step in ensuring test accuracy. Existing technologies typically use a single flying probe for grounding, requiring one probe resource in the testing system. This reduces the number of flying probes available for actual testing, significantly decreasing overall testing efficiency. Especially in multi-panel testing scenarios, the grounding flying probe needs to be moved and adjusted individually according to the position of each panel. This process not only increases operational complexity but also introduces mechanical vibration and positioning errors due to frequent movements, affecting test stability and reliability. Existing technologies lack parallel processing capabilities, preventing simultaneous connection to multiple grounding points and limiting the improvement of testing speed. Therefore, this invention provides a parallel grounding device and method for flying probe testing. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a parallel grounding device and method for flying probe testing, aiming to solve the aforementioned problems.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a parallel grounding device for flying probe testing, comprising an X-direction driver fixedly installed in the inner cavity of a circuit board transport track. A transport track is provided at the top of the circuit board transport track, and multiple circuit boards under test are placed on the transport track. The X-direction driver is fixed to the bottom of the inner cavity of the circuit board transport track, and the piston rod of the X-direction driver is arranged parallel to the transport direction of the circuit board transport track. A probe translation base is fixedly connected to the outer end of the piston rod of the X-direction driver, and a Z-direction driver is fixedly connected to the outer side of the probe translation base. The piston rod of the Z-direction driver is vertically upward, and multiple array-type parallel centralized grounding modules are fixedly connected to the upper end of the piston rod of the Z-direction driver. The multiple array-type parallel centralized grounding modules are arranged horizontally along the circuit board transport track, and all multiple array-type parallel centralized grounding modules are electrically connected to a test equipment control terminal via communication cables. The test equipment control terminal has a built-in adaptive position optimization algorithm for automatically controlling the operation sequence and position of the grounding modules according to the parameters of the product under test.

[0005] Preferably, the array-type parallel centralized grounding module adopts a T-shaped probe structure, including an upright probe column and an insulating mounting base horizontally fixed at the top of the probe column. The outer end of the insulating mounting base extends toward the material feeding direction of the circuit board conveying track, and a probe fixing socket is fixedly connected to the center of the outer end of the insulating mounting base. A grounding probe is inserted into the outer end of the probe fixing socket, and a probe fixing screw is threadedly connected to the side wall of the probe fixing socket near the outer side. The probe fixing screw passes through the probe fixing socket and abuts against the side wall of the grounding probe.

[0006] Preferably, the array-type parallel centralized grounding module further includes a spacing adjustment unit. The spacing between the grounding probes can be flexibly adjusted through the spacing adjustment unit, with an adjustment range of 5-50mm and an accuracy of ±0.1mm. The spacing adjustment unit includes an adjustment slide rail fixed at the upper end of the Z-direction driver piston rod. The upper end of the adjustment slide rail has a T-shaped groove, and an adjustment slider is slidably connected in the T-shaped groove. The adjustment slider is fixedly connected to the bottom of the probe column. The upper end of the adjustment slide rail has a locking groove corresponding to the inner side of the adjustment slider, and a spacing fixing bolt is threadedly connected to the upper end of the adjustment slider corresponding to the locking groove.

[0007] Preferably, the bottom of the adjusting slide rail is fixed with multiple vertical guide rods at equal intervals corresponding to the upper end of the probe translation base, and the upper end of the probe translation base is provided with guide holes corresponding to the positions of the multiple vertical guide rods. The vertical guide rods are movably inserted into the guide holes at the upper end of the probe translation base one by one. The bottom of both sides of the circuit board conveying track is fixedly connected with side guide rails, and the two sides of the probe translation base are fixedly connected to the sliders of the side guide rails.

[0008] Preferably, a fixed bracket is fixedly connected to the bottom of the inner cavity of the circuit board conveying track, and the X-direction driver is fixedly connected to the center of the bottom of the fixed bracket. The X-direction driver uses an adjustable cylinder with a stroke of 0-200mm to push the grounding module to extend and retract in the horizontal direction, and the Z-direction driver uses an adjustable cylinder with a stroke of 0-100mm to push the grounding module to rise and fall in the vertical direction, so as to avoid interfering with the product flow line. The X-direction driver and the Z-direction driver receive the PWM signal from the control terminal of the test equipment through a solenoid valve, and adjust the air pressure to make the cylinder piston rod move at a speed of 0.1-1m / s to achieve precise positioning.

[0009] Preferably, the spacing adjustment of the grounding probes is based on the panel layout file, and the optimal spacing d is calculated using the formula: Among them W total W represents the total width of the product. pancl The width of a single panel is given, N is the number of panels, and the output value d is used to manually adjust the slider position.

[0010] Preferably, a communication cable is inserted through the center of the insulating mounting base, and the front end of the communication cable is electrically connected to the grounding probe after passing through the probe fixing socket, and the rear end of the communication cable is electrically connected to the control terminal of the test equipment.

[0011] A parallel grounding method for flying probe testing includes the following steps:

[0012] S1. The multi-panel circuit board under test is moved to the top of the array-type parallel centralized grounding module via the circuit board conveyor track.

[0013] S2. Use X-direction and Z-direction drivers to adjust the position of the array-type parallel centralized grounding module. The movement trajectory is pre-calculated based on product parameters, so that multiple grounding probes simultaneously contact the grounding point of the multi-panel. Pressure feedback closed-loop control is used during the adjustment process.

[0014] S3. Parallel grounding is tested, and the flying probe is released for test operation. The grounding status is verified by the current sensor in the control terminal of the test equipment.

[0015] S4. After the test is completed, control the X-direction driver and Z-direction driver to retract the array-type parallel centralized grounding module and reset it to the initial position.

[0016] Preferably, the pressure feedback closed-loop control in S2 is achieved by integrating a pressure sensor at the connection position between the probe fixing socket and the insulating mounting base to monitor the contact pressure between the grounding pin and the product surface in real time;

[0017] The formula for calculating the Z-direction movement ΔZ by the control terminal of the test equipment is ΔZ=k×(P) set -P actual ), where P set The preset contact pressure is 0.5-1N, P actual The pressure measured by the sensor is k, which is a proportionality coefficient, defaulting to 0.1 mm / N; the pressure sampling frequency is 100 Hz, when P actual When the threshold is exceeded, fine-tuning is triggered to prevent overpressure damage to the product.

[0018] Preferably, the movement trajectory in S2 is pre-calculated based on product parameters. The input values ​​include the number of panels N, a list of grounding point coordinates [(x1,y1),(x2,y2),...], and product dimensions (length L, width W); the output value is the target position (X) of the grounding module. target Z target The calculation formula is: X target Z represents the average x-coordinate of the grounding point. target =H+δ, where H is the product height and δ is the safety margin, which is 2mm by default. It automatically optimizes the docking point and reduces test preparation time.

[0019] Beneficial effects

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] This invention utilizes multiple array-type parallel centralized grounding modules. During flying probe testing, the test equipment control terminal controls the independent connection of these modules, enabling parallel grounding of single boards and multiple boards. This reduces the time required for independent grounding switching, improves operational efficiency, and allows for flexible unified grounding of products with any number of boards. The spacing between each array-type parallel centralized grounding module is adjustable, accommodating products with any number of boards and spacing. An X-direction driver extends and retracts the grounding pin module in the X-direction, accommodating different product lengths and grounding positions. A Z-direction driver extends and retracts the array-type parallel centralized grounding module in the Z-direction, ensuring that as multiple boards under test pass by, the modules retract into the board transport track without interfering with the product flow. Throughout the process, all components work closely together, achieving parallel grounding functionality in flying probe testing through precise calculation and control, significantly improving testing efficiency and stability. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0023] Figure 2 This is a side sectional view of the present invention;

[0024] Figure 3 This is a diagram of the internal structure of the array-type parallel centralized grounding module of the present invention;

[0025] Figure 4 This is the present invention. Figure 3 Enlarged view of point A in the middle;

[0026] Figure 5 This is a schematic diagram of the multi-panel circuit board under test being grounded in this invention.

[0027] In the diagram: 1. X-direction driver; 2. Probe translation base; 3. Z-direction driver; 4. Adjustment rail; 5. Adjustment slider; 6. Probe column; 7. Insulating mounting base; 8. Probe fixing socket; 9. Grounding probe; 10. Probe fixing screw; 11. Communication cable; 12. Spacing fixing bolt; 13. Side guide rail; 14. Vertical guide rod; 15. Fixing bracket; 16. Circuit board conveying track; 17. Multi-panel circuit board under test. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Please see Figure 1-5 A parallel grounding device for flying probe testing includes an X-direction driver 1 fixedly installed inside a circuit board transport track 16. A transport track is provided at the top of the circuit board transport track 16, and multiple circuit boards under test 17 are placed on the transport track. The X-direction driver 1 is fixed to the bottom of the inner cavity of the circuit board transport track 16, and the piston rod of the X-direction driver 1 is arranged parallel to the transport direction of the circuit board transport track 16. A probe translation base 2 is fixedly connected to the outer end of the piston rod of the X-direction driver 1, and a Z-direction driver 3 is fixedly connected to the outer side of the probe translation base 2. The piston rod of the Z-direction driver 3 is vertically upward, and multiple array-type parallel centralized grounding modules are fixedly connected to the upper end of the piston rod of the Z-direction driver 3. The multiple array-type parallel centralized grounding modules are arranged horizontally along the circuit board transport track 16, and all multiple array-type parallel centralized grounding modules are electrically connected to a test equipment control terminal via a communication cable 11. The test equipment control terminal has a built-in adaptive position optimization algorithm for automatically controlling the operation sequence and position of the grounding modules according to the parameters of the product under test.

[0030] After the multi-panel test circuit board 17 is transported above the array-type parallel centralized grounding module, the test equipment control terminal, based on a preset adaptive position optimization algorithm and combined with product parameters such as the number of panels, the list of grounding point coordinates, and product dimensions, accurately calculates the target position of the grounding module. Subsequently, it controls the X-direction driver 1 and the Z-direction driver 3 to move the array-type parallel centralized grounding module according to the pre-calculated trajectory.

[0031] When multiple grounding probes 9 simultaneously contact the grounding point of the multi-panel board, parallel grounding begins. The test equipment uses the released probes to perform test operations on the circuit board. During the test, the current sensor in the control terminal of the test equipment verifies the grounding status in real time to ensure the stability and reliability of the grounding.

[0032] Once the test is completed, the test equipment control terminal will issue a command to control the X-direction driver 1 and Z-direction driver 3 to retract the array-type parallel centralized grounding module, resetting it to its initial position to prepare for the next test.

[0033] By setting up multiple array-type parallel centralized grounding modules, during flying probe testing, the test equipment control terminal controls the independent connection of the array-type parallel centralized grounding modules to achieve parallel grounding of single boards and multiple boards, reducing the time for independent grounding switching, improving work efficiency, and flexibly grounding products with any number of boards. The spacing between each array-type parallel centralized grounding module can be flexibly adjusted to accommodate product testing with any number of boards and spacing. The X-direction driver 1 pushes the grounding pin module to extend and retract in the X direction, accommodating different product lengths and grounding positions. The Z-direction driver 3 pushes the array-type parallel centralized grounding module to extend and retract in the Z direction, so that when the multi-board-to-test circuit board 17 passes by, the array-type parallel centralized grounding module is retracted into the circuit board conveying track 16 without interfering with the product flow. Throughout the process, all components work closely together, and through precise calculation and control, the parallel grounding function of flying probe testing is realized, greatly improving testing efficiency and stability.

[0034] Specifically, the array-type parallel centralized grounding module adopts a 7-shaped probe structure, including an upright probe post 6 and an insulating mounting base 7 horizontally fixed at the top of the probe post 6. The outer end of the insulating mounting base 7 extends towards the material receiving direction of the circuit board conveying track 16, and a probe fixing socket 8 is fixedly connected to the center of the outer end of the insulating mounting base 7. A grounding probe 9 is inserted into the outer end of the probe fixing socket 8. A probe fixing screw 10 is threadedly connected to the side wall of the probe fixing socket 8 near the outer side. The probe fixing screw 10 passes through the probe fixing socket 8 and abuts against the side wall of the grounding probe 9. The setting of the probe fixing socket 8 makes the installation and removal of the grounding probe 9 more convenient, and facilitates the timely replacement of worn or damaged probes. Moreover, the insulating mounting base 7 can effectively prevent current leakage and ensure safety and stability during the testing process. When the grounding probe 9 contacts the grounding point of the multi-panel test circuit board 17, in the actual testing process, since different multi-panel test circuit boards 17 may have different grounding point layouts and requirements, the 7-shaped probe structure can better adapt to various complex grounding point positions. The upright probe post 6 provides sufficient height space so that the grounding probe 9 can smoothly contact the grounding point on the circuit board, while the horizontal insulating mounting base 7 provides a stable platform for the installation and fixation of the grounding probe 9.

[0035] Specifically, the array-type parallel centralized grounding module also includes a spacing adjustment unit. The spacing between the grounding probes 9 can be flexibly adjusted through the spacing adjustment unit, with an adjustment range of 5-50mm and an accuracy of ±0.1mm. The spacing adjustment unit includes an adjustment slide rail 4 fixed to the upper end of the piston rod of the Z-direction driver 3. The upper end of the adjustment slide rail 4 has a T-shaped groove, and an adjustment slider 5 is slidably connected within the T-shaped groove. The adjustment slider 5 is fixedly connected to the bottom of the probe column 6. The upper end of the adjustment slide rail 4 has a locking groove corresponding to the inner side of the adjustment slider 5, and a spacing fixing bolt 12 is threadedly connected to the upper end of the adjustment slider 5 corresponding to the locking groove. When it is necessary to adjust the spacing of the grounding probes 9, the spacing fixing bolt 12 is first loosened, allowing the adjustment slider 5 to slide freely within the T-shaped groove of the adjustment slide rail 4. The operator manually pushes the adjustment slider 5 to move within the T-shaped groove according to the calculated optimal spacing d, thereby moving the probe column 6 and the grounding probes 9 to the appropriate position. After adjusting to the target spacing, tighten the spacing fixing bolt 12 to fix the adjusting slider 5 on the adjusting slide rail 4, thereby ensuring that the spacing of the grounding probes 9 remains stable. This flexible spacing design allows the parallel grounding device to adapt to the testing needs of multi-panel circuit boards 17 with different panel numbers and panel spacings. In practical applications, facing various complex circuit board panel layouts, operators only need to calculate the optimal spacing d according to the panel layout file, and then perform simple manual operation through the spacing adjustment unit to quickly complete the adjustment of the grounding probe 9 spacing, making full preparation for the parallel grounding work of flying probe testing, and further improving the flexibility and efficiency of testing.

[0036] Specifically, the bottom of the adjusting slide rail 4 is fixed with multiple vertical guide rods 14 at equal intervals corresponding to the upper end of the probe translation base 2, and the upper end of the probe translation base 2 is provided with guide holes corresponding to the positions of the multiple vertical guide rods 14. The vertical guide rods 14 are movably inserted into the guide holes at the upper end of the probe translation base 2. The bottom of both sides of the circuit board conveying track 16 is fixedly connected with side guide rails 13, and the sliders of the two sides of the probe translation base 2 are fixedly connected to the side guide rails 13. The cooperation between the vertical guide rods 14 and the guide holes can provide precise guidance for the movement of the adjusting slide rail 4 in the Z direction, ensuring its stability and accuracy during the up and down movement. This ensures that the array-type parallel centralized grounding module will not deviate or shake when it is adjusted in the Z direction, thereby ensuring that the grounding probe 9 can accurately contact the grounding point of the multi-panel circuit board under test 17. At the same time, the connection between the side guide rails 13 and the probe translation base 2 provides reliable guidance and support for the movement in the X direction. When the X-direction actuator 1 pushes the probe translation base 2 to extend and retract in the X direction, the side guide rail 13 can effectively reduce friction and resistance during the movement, making the entire movement smoother. Moreover, this guiding structure can also ensure that the probe translation base 2 and the arrayed parallel centralized grounding module on it move accurately along the predetermined path, further improving the accuracy of the grounding process.

[0037] Specifically, a fixed bracket 15 is fixedly connected to the bottom of the inner cavity of the circuit board conveying track 16, and the X-direction driver 1 is fixedly connected to the center of the bottom of the fixed bracket 15. The X-direction driver 1 uses an adjustable cylinder with a stroke of 0-200mm to push the grounding module to extend and retract in the horizontal direction. The Z-direction driver 3 uses an adjustable cylinder with a stroke of 0-100mm to push the grounding module to rise and fall in the vertical direction to avoid interfering with the product flow line. The X-direction driver 1 and the Z-direction driver 3 receive the PWM signal from the control terminal of the test equipment through the solenoid valve, and adjust the air pressure to make the cylinder piston rod move at a speed of 0.1-1m / s to achieve precise positioning. By using an adjustable cylinder as a driver, and cooperating with the solenoid valve to receive the PWM signal to adjust the air pressure and the piston rod movement speed, precise control of the X-direction and Z-direction movement can be achieved.

[0038] Specifically, the spacing adjustment of the grounding probes 9 is based on the panel layout file, and the optimal spacing d is calculated using the formula: Among them W total W represents the total width of the product. panclLet d be the width of a single panel, N be the number of panels, and the output value d be used to manually adjust the slider position. The optimal spacing d is based on the relationship between the total product width, the width of a single panel, and the number of panels. In a multi-panel circuit board under test, the total product width is composed of the widths of multiple single panels and the spacing between them. Assuming that the spacing between each panel is equal to d, then the total product width is equal to the width of N single panels plus the width of N-1 spacing elements.

[0039] Specifically, a communication cable 11 is inserted through the center of the insulating mounting base 7, and the front end of the communication cable 11 is electrically connected to the grounding probe 9 via the probe fixing socket 8. The rear end of the communication cable 11 is electrically connected to the test equipment control terminal. The communication cable 11 ensures a stable electrical connection between the grounding probe 9 and the test equipment control terminal. During flying probe testing, the test equipment control terminal can obtain the grounding status of the grounding probe 9 in real time through the communication cable 11, and can also transmit control signals to the grounding probe 9. When the test equipment control terminal issues a test command, the command is quickly and accurately transmitted to the grounding probe 9 through the communication cable 11, enabling the grounding probe 9 to respond promptly and make contact with the grounding point of the multi-panel test circuit board 17 to achieve parallel grounding. During the test, the grounding probe 9 feeds back the detected grounding current, voltage, and other data information to the test equipment control terminal through the communication cable 11, allowing the test equipment control terminal to monitor and verify the grounding status in real time, ensuring the stability and reliability of the test process.

[0040] A parallel grounding method for flying probe testing includes the following steps:

[0041] S1. The multi-panel test circuit board 17 is moved to the top of the array-type parallel centralized grounding module via the circuit board conveyor track 16.

[0042] S2. Use X-direction driver 1 and Z-direction driver 3 to adjust the position of the array-type parallel centralized grounding module. The movement trajectory is pre-calculated based on product parameters, so that multiple grounding probes 9 simultaneously contact the grounding point of the multi-panel. Pressure feedback closed-loop control is used during the adjustment process.

[0043] S3. Parallel grounding is tested, and the flying probe is released for test operation. The grounding status is verified by the current sensor in the control terminal of the test equipment.

[0044] S4. After the test is completed, control the X-direction driver 1 and Z-direction driver 3 to retract the array-type parallel centralized grounding module and reset it to the initial position.

[0045] Parallel grounding significantly improves testing efficiency. Multiple grounding probes 9 contact the grounding point simultaneously, enabling simultaneous grounding tests on multiple parts of the multi-panel test circuit board 17. Compared to the traditional method of grounding one by one, this allows for completion of the test in a shorter time. Secondly, the use of pressure feedback closed-loop control ensures the stability and reliability of the contact between the grounding probes 9 and the grounding point, avoiding test errors caused by poor contact and improving the accuracy of test results. Furthermore, the current sensor in the test equipment control terminal verifies the grounding status in real time, promptly detecting grounding anomalies and ensuring the safety and stability of the testing process, reducing the risk of equipment damage and test failure due to grounding problems. Finally, the grounding module automatically resets after testing, facilitating rapid commencement of the next round of testing, improving the continuity and automation of the entire testing process, and reducing manual operation costs and labor intensity.

[0046] Specifically, the pressure feedback closed-loop control in S2 is achieved by integrating a pressure sensor at the connection position between the probe fixing socket 8 and the insulating mounting base 7 to monitor the contact pressure between the grounding pin and the product surface in real time;

[0047] The formula for calculating the Z-direction movement ΔZ by the control terminal of the test equipment is ΔZ=k×(P) set -P actual ), where P set The preset contact pressure is 0.5-1N, P actual The pressure measured by the sensor is k, which is a proportionality coefficient, defaulting to 0.1 mm / N; the pressure sampling frequency is 100 Hz, when P actual When the threshold is exceeded, fine-tuning is triggered to prevent overpressure damage to the product;

[0048] During the movement of the array-type parallel centralized grounding module, the pressure sensor monitors the contact pressure between the grounding probe 9 and the product surface in real time at a sampling frequency of 100Hz. The test equipment control terminal dynamically fine-tunes the module position based on the difference between the measured pressure and the preset contact pressure. When the measured pressure exceeds the threshold, the fine-tuning mechanism is immediately triggered to ensure that the contact pressure between the grounding probe and the product surface remains within a safe range, avoiding overpressure damage to the product.

[0049] Specifically, in S2, the movement trajectory is pre-calculated based on product parameters. The input values ​​include the number of panels N, the list of grounding point coordinates [(x1,y1),(x2,y2),…], and the product dimensions (length L, width W); the output value is the target position (X) of the grounding module. target Z target The calculation formula is: X target Z represents the average x-coordinate of the grounding point. target=H + δ, where H is the product height and δ is the safety margin, defaulting to 2mm. This automatically optimizes the connection point, reducing test preparation time. By pre-calculating the target position of the grounding module based on product parameters, the system automatically optimizes the connection point, allowing the array-type parallel centralized grounding module to move more accurately to the appropriate position, further reducing test preparation time. In practical applications, operators only need to input parameters such as the number of panels, the list of grounding point coordinates, and product dimensions into the test equipment control terminal, and the system can quickly calculate the target position of the grounding module. In this way, after multiple panels of the circuit board under test are transported above the array-type parallel centralized grounding module, the grounding module can quickly and accurately move to the corresponding position, allowing the grounding probe to quickly contact the grounding point, saving a significant amount of time for subsequent testing operations.

[0050] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0051] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or parallel grounding device and method for flying probe testing that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or parallel grounding device and method for flying probe testing.

[0052] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A parallel grounding device for flying probe testing, comprising an X-direction driver (1) fixedly installed in the inner cavity of a circuit board transport track (16), wherein a transport track is provided on the top of the circuit board transport track (16), and multiple circuit boards under test (17) are placed on the transport track, characterized in that, The X-direction driver (1) is fixed to the bottom of the inner cavity of the circuit board conveying track (16), and the piston rod of the X-direction driver (1) is set parallel to the conveying direction of the circuit board conveying track (16). The outer end of the piston rod of the X-direction driver (1) is fixedly connected to the probe translation base (2), and the outer side of the probe translation base (2) is fixedly connected to the Z-direction driver (3). The piston rod of the Z-direction driver (3) is set vertically upward, and the upper end of the piston rod of the Z-direction driver (3) is fixedly connected to multiple array-type parallel centralized grounding modules. The multiple array-type parallel centralized grounding modules are arranged horizontally along the circuit board conveying track (16), and the multiple array-type parallel centralized grounding modules are electrically connected to the test equipment control terminal through the communication cable (11). The test equipment control terminal has a built-in adaptive position optimization algorithm, which is used to automatically control the operation sequence and position of the grounding module according to the parameters of the product under test.

2. The parallel grounding device for flying probe testing according to claim 1, characterized in that, The array-type parallel centralized grounding module adopts a 7-shaped probe structure, including an upright probe column (6) and an insulating mounting base (7) horizontally fixed on the top of the probe column (6). The outer end of the insulating mounting base (7) extends towards the material receiving direction of the circuit board conveying track (16), and a probe fixing socket (8) is fixedly connected to the center of the outer end of the insulating mounting base (7). A grounding probe (9) is inserted into the outer end of the probe fixing socket (8). A probe fixing screw (10) is threadedly connected to the side wall of the probe fixing socket (8) near the outer side. The probe fixing screw (10) passes through the probe fixing socket (8) and abuts against the side wall of the grounding probe (9).

3. A parallel grounding device for flying probe testing according to claim 2, characterized in that, The array-type parallel centralized grounding module also includes a spacing adjustment unit. The spacing between the grounding probes (9) can be flexibly adjusted through the spacing adjustment unit. The adjustment range is 5-50mm and the accuracy is ±0.1mm. The spacing adjustment unit includes an adjustment slide rail (4) fixed at the upper end of the piston rod of the Z-direction driver (3). The upper end of the adjustment slide rail (4) is provided with a T-shaped slide groove, and an adjustment slider (5) is slidably connected in the T-shaped slide groove. The adjustment slider (5) is fixedly connected to the bottom of the probe column (6). The upper end of the adjustment slide rail (4) is provided with a locking slide groove corresponding to the inner side of the adjustment slider (5), and the upper end of the adjustment slider (5) is threaded with a spacing fixing bolt (12) corresponding to the locking slide groove.

4. A parallel grounding device for flying probe testing according to claim 3, characterized in that, The bottom of the adjustment slide rail (4) is fixed with multiple vertical guide rods (14) at equal intervals on the upper end of the probe translation base (2), and the upper end of the probe translation base (2) is provided with guide holes corresponding to the positions of the multiple vertical guide rods (14). The vertical guide rods (14) are movably inserted into the guide holes on the upper end of the probe translation base (2). The bottom of both sides of the circuit board conveying track (16) is fixedly connected with side guide rails (13), and the two sides of the probe translation base (2) are fixedly connected to the sliders of the side guide rails (13).

5. A parallel grounding device for flying probe testing according to claim 3, characterized in that, The bottom of the inner cavity of the circuit board conveying track (16) is fixedly connected to a fixed bracket (15), and the X-direction driver (1) is fixedly connected to the bottom center of the fixed bracket (15). The X-direction driver (1) uses an adjustable cylinder with a stroke of 0-200mm to push the grounding module to extend and retract in the horizontal direction. The Z-direction driver (3) uses an adjustable cylinder with a stroke of 0-100mm to push the grounding module to rise and fall in the vertical direction to avoid interfering with the product flow line. The X-direction driver (1) and the Z-direction driver (3) receive the PWM signal from the control terminal of the test equipment through the solenoid valve, adjust the air pressure to make the cylinder piston rod move at a speed of 0.1-1m / s to achieve precise positioning.

6. A parallel grounding device for flying probe testing according to claim 3, characterized in that, The spacing adjustment of the grounding probes (9) is based on the panel layout file, and the optimal spacing d is calculated using the following formula: Among them W total W represents the total width of the product. pancl The width of a single panel is given, N is the number of panels, and the output value d is used to manually adjust the slider position.

7. A parallel grounding device for flying probe testing according to claim 3, characterized in that, The insulating mounting base (7) has a communication cable (11) inserted through its center. The front end of the communication cable (11) is electrically connected to the grounding probe (9) after passing through the probe fixing socket (8). The rear end of the communication cable (11) is electrically connected to the control terminal of the test equipment.

8. A parallel grounding method for flying probe testing, characterized in that, Includes the following steps: S1. The multi-panel test circuit board (17) is transported via the circuit board transport track (16) and moved to the top of the array-type parallel centralized grounding module; S2. Use X-direction driver (1) and Z-direction driver (3) to adjust the position of the array-type parallel centralized grounding module. The movement trajectory is pre-calculated based on the product parameters, so that multiple grounding probes (9) simultaneously contact the grounding point of the multi-panel. Pressure feedback closed-loop control is used during the adjustment process. S3. Parallel grounding is tested, and the flying probe is released for test operation. The grounding status is verified by the current sensor in the control terminal of the test equipment. S4. After the test is completed, control the X-direction driver (1) and Z-direction driver (3) to retract the array-type parallel centralized grounding module and reset it to the initial position.

9. A parallel grounding method for flying probe testing according to claim 8, characterized in that, The pressure feedback closed-loop control in S2 is achieved by integrating a pressure sensor at the connection position between the probe fixing socket (8) and the insulating mounting base (7) to monitor the contact pressure between the grounding pin and the product surface in real time. The formula for calculating the Z-direction movement ΔZ by the control terminal of the test equipment is ΔZ=k×(P) set -P actual ), where P set The preset contact pressure is 0.5-1N, P actual The pressure measured by the sensor is k, which is a proportionality coefficient, defaulting to 0.1 mm / N; the pressure sampling frequency is 100 Hz, when P actual When the threshold is exceeded, fine-tuning is triggered to prevent overpressure damage to the product.

10. A parallel grounding method for flying probe testing according to claim 9, characterized in that, The movement trajectory in S2 is pre-calculated based on product parameters. The input values ​​include the number of panels N, the list of grounding point coordinates [(x1,y1),(x2,y2),…], and the product dimensions (length L, width W). The output value is the target position of the grounding module (X). target Z target The calculation formula is: X target Z represents the average x-coordinate of the grounding point. target =H+δ, where H is the product height and δ is the safety margin, which is 2mm by default. It automatically optimizes the docking point and reduces test preparation time.

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