Connector and computing device

Abstract

The embodiment of the invention provides a connector and computing equipment. The connector comprises a connector body and a photoelectric conversion assembly, the connector body is used for being connected with a function card in the computing device, and the connector body is provided with a plurality of first terminals. The photoelectric conversion assembly comprises a plurality of photoelectric conversion units, and the number of the photoelectric conversion units is smaller than that of the first terminals; the plurality of first terminals are divided into a plurality of groups according to the number of the photoelectric conversion units, and each group of first terminals is correspondingly connected to one photoelectric conversion unit. According to the connector provided by the embodiment of the invention, the loss of signal transmission in the computing equipment is relatively small, and parts in the computing equipment are easy to arrange.

Description

Technical Field

[0001] This application relates to the field of computing technology, and more particularly to a connector and a computing device. Background Technology

[0002] With the rapid development of big data, cloud computing, and artificial intelligence (AI), the demand for signal transmission quality and layout density of servers has increased dramatically.

[0003] A server comprises multiple circuit boards connected by cables and connectors to transmit signals between them. However, this connector-and-cable method suffers from significant signal loss during transmission. Furthermore, connectors have hundreds of terminals, requiring a corresponding number of cables. As the number of circuit boards increases, so does the number of cables, leading to complex cabling and difficult maintenance. Alternatively, circuit boards can be connected using polytetrafluoroethylene (PTFE) adapter boards for signal transmission. PTFE adapter boards can reduce signal loss during transmission, but their fabrication is not very feasible. Another method is to connect circuit boards using optical modules and fiber optic cables. Optical modules convert optical signals into electrical signals for transmission over fiber optic cables, where signal loss is lower. However, a single optical module can only transmit a specific wavelength or wavelength range, and each module corresponds to only one or a portion of the connector terminals. Therefore, multiple optical modules are needed to meet signal transmission requirements, but the space on existing circuit boards is insufficient to accommodate them all.

[0004] Therefore, there is an urgent need for a connector that can minimize signal transmission loss in servers and facilitate the deployment of components within servers. Summary of the Invention

[0005] This application provides a connector and a computing device. The connector can reduce signal transmission loss in the computing device and make the components in the computing device easier to arrange.

[0006] In a first aspect, embodiments of this application provide a connector, including a connector body and a photoelectric conversion component. The connector body is used to connect to a function card in a computing device. The connector body has multiple first terminals, which are used to output electrical signals. The photoelectric conversion component includes multiple photoelectric conversion units, the number of which is less than the number of first terminals. The multiple first terminals are divided into multiple groups according to the number of photoelectric conversion units, with each group of first terminals corresponding to one photoelectric conversion unit, and each group of first terminals connected to one photoelectric conversion unit.

[0007] The connector provided in this application embodiment comprises a connector body and a photoelectric conversion component. The connector body is used to connect to a function card in a computing device and has multiple first terminals. The photoelectric conversion component includes multiple photoelectric conversion units, which are integrated into the component, resulting in a smaller size for each unit and consequently a smaller connector, facilitating the placement of devices on the function card. The number of photoelectric conversion units is less than the number of first terminals. The multiple first terminals are divided into multiple groups based on the number of photoelectric conversion units, with each group of first terminals corresponding to one photoelectric conversion unit. Each photoelectric conversion unit converts the electrical signal in its corresponding group of first terminals into an optical signal. Therefore, the number of output optical signal branches of the connector is less than the number of input electrical signal branches, resulting in a smaller number of branches in the adapter connected to the connector, facilitating the placement of the adapter in the computing device. Since the transmission loss of optical signals is less than that of electrical signals, converting electrical signals into optical signals for transmission in the adapter reduces signal transmission loss in the computing device.

[0008] In one possible implementation, the connector provided in this application includes a photoelectric conversion unit comprising a wavelength division multiplexer (WDM) and multiple photoelectric converters corresponding to the WDM. The number of photoelectric converters in each photoelectric conversion unit is the same as the number of first terminals in each group, and they are connected one-to-one with the first terminals. The photoelectric conversion unit integrates photoelectric converters and a WDM, which not only converts optical signals into electrical signals but also reduces the number of second branches in the connector, thereby reducing the number of transmission branches in the adapter and facilitating its installation. Furthermore, the integration of photoelectric converters and WDM reduces the volume occupied by the photoelectric conversion components, making it easier to install the connector on the function card.

[0009] In one possible implementation, the connector provided in this application embodiment further includes an adapter circuit board. The side of the adapter circuit board facing the connector body is connected to the connector body, and the photoelectric conversion component is disposed on the side of the adapter circuit board away from the connector body. The adapter circuit board can support the photoelectric conversion component, absorb some of the stress generated by slight deformation of the connector body, and prevent the photoelectric conversion component from being subjected to excessive force.

[0010] In one possible implementation, the connector provided in this application embodiment has a plurality of second terminals on the side of the adapter circuit board facing the connector body, with the first terminals connected to the second terminals in a one-to-one correspondence; the side of the adapter circuit board facing the photoelectric conversion component has a plurality of third terminals, with the third terminals and second terminals connected to each other in a one-to-one correspondence through internal wiring of the adapter circuit board, and the photoelectric converter connected to the third terminals in a corresponding manner. By setting the adapter circuit board and connecting the connector body and the photoelectric conversion component through the terminals on both sides of the adapter circuit board, the connector body can be used with more photoelectric conversion components of different specifications, improving the compatibility of the connector body.

[0011] In one possible implementation, the connector provided in this application embodiment has a connector body with multiple fourth terminals for connecting to a function card in a computing device. The connector also includes a mounting component that covers and connects to the connector body and the photoelectric conversion component. The mounting component is used for connecting to the function card of the computing device. While protecting the connector, the mounting component can prevent all the interaction forces between the connector body and the function card from being applied to the fourth terminals, making the connection between the fourth terminals and the function card more reliable.

[0012] In one possible implementation, the connector provided in this application embodiment further includes a liquid-cooled heat sink, which is located within and connected to the mounting assembly; a portion of the liquid-cooled heat sink is attached to the side of the photoelectric conversion assembly facing away from the connector body. The photoelectric conversion assembly utilizes liquid cooling for heat dissipation, which, compared to the solid-state conductive heat dissipation used in related technologies for optical modules, offers higher heat dissipation efficiency and occupies less space.

[0013] In one possible implementation, the connector provided in this application includes a connector body comprising a first surface facing the photoelectric conversion component and second and third surfaces located on either side of the first surface, with the third and second surfaces forming an angle with the first surface; a liquid-cooled heat sink includes a first heat dissipation portion and second and third heat dissipation portions located on either side of the first heat dissipation portion; the first heat dissipation portion is fitted to the photoelectric conversion component, the second heat dissipation portion is fitted to the second surface, and the third heat dissipation portion is fitted to the third surface. The shape of the liquid-cooled heat sink can match the shape of the structure formed by the heat sink body and the photoelectric conversion module, which not only makes the space occupied by the liquid-cooled heat sink in the connector smaller, making the connector structure more compact, but also gives the entire connector a better heat dissipation effect.

[0014] In one possible implementation, the connector provided in this application embodiment includes a plurality of first optical connectors, each of which is connected to a wavelength division multiplexer; the mounting component has a plurality of sockets, and the first optical connectors are inserted into the sockets one by one, so that the mounting component can fix the first optical connectors and facilitate the docking of the first optical connectors with the adapter.

[0015] Secondly, embodiments of this application provide a computing device, including a function card, an adapter, and the aforementioned connector. The connector is disposed on the function card, and the adapter is used to connect connectors located on different function cards.

[0016] In one possible implementation, the computing device provided in this application embodiment includes a connector comprising multiple first optical connectors; the adapter is an optical cable comprising multiple first optical fiber bundles, with second optical connectors connected to both ends of the first optical fiber bundles, and the second optical connectors mating with the first optical connectors; alternatively, the adapter is an optical backplane, with multiple optical channels arranged in the optical backplane, and second optical connectors connected to both ends of the optical channels, and the second optical connectors mating with the first optical connectors. By providing second optical connectors, the second optical connectors can be adapted to both optical cable and optical backplane structures. Therefore, the form of the adapter can be selected according to the specific structure of the computing device, facilitating the layout of components in the computing device. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a computing device provided in an embodiment of this application;

[0019] Figure 2 A side view of a computing device provided in an embodiment of this application;

[0020] Figure 3 Another side view of the computing device provided in an embodiment of this application;

[0021] Figure 4 This is a schematic diagram of the connector structure provided in an embodiment of this application;

[0022] Figure 5 A diagram illustrating the usage status of the connector provided in an embodiment of this application;

[0023] Figure 6 for Figure 4 An explosion diagram;

[0024] Figure 7 for Figure 6 Another structural diagram from another perspective;

[0025] Figure 8 This is a schematic diagram of the internal structure of the photoelectric conversion component in the connector provided in the embodiments of this application;

[0026] Figure 9 This is a schematic diagram of the signal transmission path of a computing device provided in an embodiment of this application;

[0027] Figure 10 This is a schematic diagram of another signal transmission path for a computing device provided in an embodiment of this application;

[0028] Figure 11 This is a schematic diagram of the internal structure of the connector provided in an embodiment of this application;

[0029] Figure 12 Another usage state diagram of the connector provided in the embodiments of this application;

[0030] Figure 13 for Figure 12 Another view;

[0031] Figure 14 for Figure 12 An explosion diagram;

[0032] Figure 15 for Figure 12 Another diagram illustrating an explosion;

[0033] Figure 16 for Figure 12 A diagram illustrating another explosion;

[0034] Figure 17 This is a schematic diagram of the structure of the adapter in the computing device provided in the embodiments of this application;

[0035] Figure 18 This is another structural schematic diagram of the adapter in the computing device provided in the embodiments of this application;

[0036] Figure 19 Another schematic diagram of the computing device provided in an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 10-Computing devices;

[0039] 100 - Function card; 100a - First function card; 100b - Second function card; 110 - First mounting hole;

[0040] 200 - Adapter; 200a - Optical cable; 200b - Optical backplane; 210 - First fiber bundle; 220 - Optical channel; 230 - Second optical connector;

[0041] 300-Connector;

[0042] 310 - Connector body; 310a - First side; 310b - Second side; 310c - Third side;

[0043] 310d - Fourth face; 310e - Fifth face; 310f - Sixth face;

[0044] 311 - First terminal; 312 - Fourth terminal;

[0045] 320 - Photoelectric conversion component; 321 - Photoelectric conversion unit; 322 - Photoelectric converter;

[0046] 323 - Wavelength division multiplexer; 324 - First optical connector; 325 - Second fiber bundle;

[0047] 330 - Adapter circuit board; 331 - Second terminal; 332 - Third terminal; 333 - Internal wiring;

[0048] 340 - Install components;

[0049] 341-First mounting plate; 3411-Plug-in part;

[0050] 342 - Second mounting plate; 3421 - First opening; 343 - Third mounting plate;

[0051] 344 - Fourth mounting plate; 3441 - Second opening; 345 - Fifth mounting plate; 346 - Socket;

[0052] 350 - Liquid-cooled radiator; 351 - Radiator body; 352 - Liquid inlet; 352a - Liquid inlet port;

[0053] 353 - Liquid outlet; 353a - Liquid outlet; 354 ​​- First heat dissipation section; 355 - Second heat dissipation section; 356 - Third heat dissipation section;

[0054] 400 - Cabinet;

[0055] 500 - Node; 500a - Compute Node; 500b - Switching Node;

[0056] 600 - Motherboard; 610 - Processor;

[0057] 700 - Daughterboard; 710 - Hard Disk; 720 - Expansion Card;

[0058] X - First direction;

[0059] Y - Second direction;

[0060] Z - Third-party orientation. Detailed Implementation

[0061] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0062] This application provides a connector and a computing device. The connector can reduce signal transmission loss in the computing device and make the components in the computing device easier to arrange.

[0063] The computing device can be a server, such as a high-density server, tower server, rack server, or full-rack server. Full-rack servers have the advantages of high space utilization and simple deployment.

[0064] The following section uses a rack-mount server as an example to illustrate the specific structure of the computing device 10.

[0065] Figure 1 This is a schematic diagram of the structure of a computing device provided in an embodiment of this application. Figure 2 This is a side view of a computing device provided in an embodiment of this application. Figure 3 Another side view of the computing device provided in an embodiment of this application.

[0066] See Figures 1 to 3 As shown, the computing device 10 includes a function card 100, an adapter 200, and a connector 300. The connector 300 is disposed on the function card 100, and the adapter 200 is used to connect the connector 300 located in different function cards 100.

[0067] Please continue reading Figure 1 As shown, the computing device 10 also includes a cabinet 400 and multiple nodes 500 located within the cabinet 400. The cabinet 400 is typically a cuboid structure and includes a first direction X, a second direction Y, and a third direction Z. Multiple nodes 500 are arranged along the third direction Z within the cabinet 400. Each node 500 can be a computing node 500a or a switching node 500b, and the number of switching nodes 500b can be less than the number of computing nodes 500a. Figure 2 The diagram schematically illustrates two compute nodes 500a and one switching node 500b. Figure 3 The diagram schematically illustrates four compute nodes 500a and two switching nodes 500b. It should be noted that the compute nodes 500a in a rack server can also be high-density servers, tower servers, or rack servers, etc.

[0068] The function card 100 in computing node 500a is a first function card 100a, and the function card 100 in switching node 500b is a second function card 100b. Both the first function card 100a and the second function card 100b are equipped with connectors 300. The connectors 300 on the first function card 100a and the second function card 100b are connected via an adapter 200, allowing multiple first function cards 100a to connect to the second function card 100b. Signals can be transmitted between multiple first function cards 100a and second function cards 100b via the connectors 300 and the adapter 200.

[0069] The specific structure of connector 300 will be described below.

[0070] Figure 4 This is a schematic diagram of the connector structure provided in an embodiment of this application. Figure 5 This is a diagram showing the usage status of the connector provided in an embodiment of this application. Figure 6 for Figure 4 An explosion diagram. Figure 7 for Figure 6 Another structural diagram from the perspective of Figure 8 This is a schematic diagram of the internal structure of the photoelectric conversion component in the connector provided in the embodiments of this application.

[0071] See Figures 4 to 8 As shown, the connector 300 provided in this embodiment includes a connector body 310 and a photoelectric conversion component 320. The connector body 310 is used to connect to the function card 100 in the computing device 10. The connector body 310 has a plurality of first terminals 311, which are used to transmit electrical signals. The photoelectric conversion component 320 includes a plurality of photoelectric conversion units 321, the number of which is less than the number of first terminals 311. The plurality of first terminals 311 are divided into multiple groups according to the number of photoelectric conversion units 321. Each group of first terminals 311 is correspondingly arranged with one photoelectric conversion unit 321, and each group of first terminals 311 is correspondingly connected to one photoelectric conversion unit 321.

[0072] Please continue reading Figure 6 and Figure 7 As shown, the connector body 310 has a first surface 310a, a second surface 310b, a third surface 310c, a fourth surface 310d, a fifth surface 310e, and a sixth surface 310f. The first surface 310a and the fourth surface 310d are positioned opposite each other, the second surface 310b and the third surface 310c are positioned opposite each other, and the fifth surface 310e and the sixth surface 310f are positioned opposite each other. These surfaces form a cuboid structure for the connector body 310. The connector body 310 can also be other polyhedral structures.

[0073] Either side of the connector body 310 can be connected to the function card 100. Figures 5 to 7 In the illustrated embodiment, the side facing the function card 100 is the sixth side 310f. The connector body 310 is disposed on the edge of the function card 100, and the sixth side 310f of the connector body 310 is connected to the function card 100.

[0074] The connector body 310 has a first terminal 311, which can be disposed on a surface other than the sixth surface 310f, for example, on... Figures 5 to 7 In the connector body 310, a first terminal 311 is disposed on the first surface 310a. The first terminal 311 can be a solder joint or a pin. Multiple first terminals 311 are arranged in a rectangular array, thereby improving the space utilization of the connector body 310 on the first surface 310a, allowing for the placement of more first terminals 311 on the first surface 310a to facilitate the transmission of more signals. The substrate of the first terminal 311 can be an input / output material, carbon-based material, etc., and the first terminal 311 is used to transmit electrical signals.

[0075] Please continue reading Figure 8 As shown, the photoelectric conversion component 320 includes multiple photoelectric conversion units 321, meaning that the photoelectric conversion component 320 can be a chip integrated from multiple photoelectric conversion units 321. The integration of multiple photoelectric conversion units 321 into the photoelectric conversion component 320 has the following advantages: Compared to related technologies that require multiple optical modules, each with its own housing and peripheral devices, resulting in a large individual optical module size, this embodiment integrates multiple photoelectric conversion units 321 into a single photoelectric conversion component 320. These multiple photoelectric conversion units 321 can share the housing and peripheral devices, resulting in a smaller photoelectric conversion component 320. The photoelectric conversion component 320 also occupies less space on the function card 100, facilitating the placement of devices on the function card 100. Figure 8 In the illustration, the photoelectric conversion component 320 is divided into six photoelectric conversion units 321.

[0076] Figure 9 This is a schematic diagram of the signal transmission path of the computing device provided in the embodiments of this application. Figure 10 This is a schematic diagram of another signal transmission path for a computing device provided in an embodiment of this application.

[0077] See Figure 9 and Figure 10As shown, the number of photoelectric conversion units 321 is less than the number of first terminals 311. Based on the number of photoelectric conversion units 321 in the photoelectric conversion assembly 320, the first terminals 311 on the connector body 310 are divided into multiple groups. For example, the photoelectric conversion assembly 320 includes six photoelectric conversion units 321. Therefore, the first terminals 311 can be divided into six groups, with each first terminal 311 in each group connected to one of the photoelectric conversion units 321. Figure 9 and Figure 10 In the diagram, two first terminals 311 are schematically shown, and the remaining first terminals 311 are schematically shown with dashed lines. The photoelectric conversion unit 321 converts the electrical signals in its corresponding set of first terminals 311 into optical signals. Each first terminal 311 forms a first branch, and each photoelectric conversion unit 321 forms a second branch. By making the number of photoelectric conversion units 321 less than the number of first terminals 311, and dividing the first terminals 311 into multiple groups based on the number of photoelectric conversion units 321, the number of second branches of the connector 300 can be less than the number of first branches.

[0078] Please continue reading Figure 9 As shown, in one possible implementation, the adapter 200 may include an optical cable 200a, which includes multiple first fiber bundles 210. Each first fiber bundle 210 is connected to a photoelectric conversion unit 321, and each photoelectric conversion unit 321 transmits optical signals through a first fiber bundle 210, which serves as a transmission branch in the optical cable 200a. For example, a connector 300 on a first function card 100a can transmit optical signals to a connector 300 on a second function card 100b through multiple first fiber bundles 210, and vice versa. The number of photoelectric conversion units 321 is less than the number of first terminals 311, thus the number of first fiber bundles 210 is also less, facilitating the deployment of the optical cable 200a. It is understood that each first fiber bundle 210 may include multiple optical fibers. The optical cable 200a can be bent, making it easy to adjust the position of the optical cable 200a according to the specific position of the components in the computing device 10.

[0079] Please continue reading Figure 10As shown, in another possible implementation, the adapter 200 may include an optical backplane 200b, which is a plate-shaped component with multiple optical channels 220 arranged therein. Each optical channel 220 is connected to a photoelectric conversion unit 321, and each photoelectric conversion unit 321 transmits optical signals through the optical channel 220, which serves as a transmission branch in the optical backplane 200b. For example, the connector 300 on the first function card 100a can transmit optical signals to the connector 300 on the second function card 100b through multiple optical channels 220, and vice versa. The number of photoelectric conversion units 321 is less than the number of first terminals 311, thus the number of optical channels 220 is also less, resulting in a smaller space occupied by the optical backplane 200b, which facilitates its installation. The optical backplane 200b has high strength and can provide good support and protection for the optical channel 220.

[0080] The transmission loss of optical signals in the adapter 200 is less than that of electrical signals in the cable. By converting electrical signals into optical signals for transmission in the adapter 200, the signal transmission loss in the computing device 10 can be reduced.

[0081] The connector 300 provided in this embodiment of the application includes a connector body 310 and a photoelectric conversion component 320. The connector body 310 is used to connect to the function card 100 in the computing device 10, and has multiple first terminals 311. The photoelectric conversion component 320 includes multiple photoelectric conversion units 321. Integrating multiple photoelectric conversion units 321 into the photoelectric conversion component 320 reduces the size of the photoelectric conversion component 320, thereby reducing the size of the connector 300 and facilitating the placement of devices on the function card 100. The number of photoelectric conversion units 321 is less than the number of first terminals 311. The multiple first terminals 311 are divided into multiple groups according to the number of photoelectric conversion units 321, and each group of first terminals 311 is connected to one photoelectric conversion unit 321. The photoelectric conversion unit 321 can convert the electrical signals in a set of first terminals 311 connected to it into optical signals. Therefore, the number of output optical signal branches of the connector 300 is less than the number of input electrical signal branches. Consequently, the number of branches in the adapter 200 connected to the connector 300 is also smaller, facilitating the deployment of the adapter 200 in the computing device 10. The transmission loss of optical signals is less than that of electrical signals. By converting electrical signals into optical signals for transmission in the adapter 200, the signal transmission loss in the computing device 10 can be reduced.

[0082] Please continue reading Figures 8 to 10As shown, each photoelectric conversion unit 321 includes a wavelength division multiplexer 323 and a plurality of photoelectric converters 322 corresponding to a wavelength division multiplexer 323; the number of photoelectric converters 322 in each photoelectric conversion unit 321 is the same as the number of each group of first terminals 311 and they are connected one-to-one with the first terminals 311.

[0083] Specifically, the photoelectric conversion component 320 includes multiple photoelectric converters 322 and multiple wavelength division multiplexers 323. The photoelectric converters 322 are correspondingly disposed and connected to the first terminal 311. The multiple photoelectric converters 322 are divided into multiple groups according to the number of wavelength division multiplexers 323. Each group of photoelectric converters 322 corresponds to one wavelength division multiplexer 323, and each group of photoelectric converters 322 and its corresponding wavelength division multiplexer 323 form a photoelectric conversion unit 321.

[0084] The photoelectric converter 322 can convert electrical signals into optical signals, and vice versa. The correspondence between the first terminal 311 and the photoelectric converter 322 in the connector body 310 means that the photoelectric converter 322 corresponds to the electrical signal transmitted by the first terminal 311. For example, when the signal is transmitted in a single-ended manner, each first terminal 311 can correspond to one photoelectric converter 322; when the signal is transmitted in a differential pair manner, every two first terminals 311 can correspond to one photoelectric converter 322. The photoelectric converter 322 can convert the electrical signal sent by the first terminal 311 into an optical signal, or convert the optical signal into an electrical signal and send it to the first terminal 311.

[0085] Different photoelectric converters 322 have different wavelengths of optical signals. Wavelength division multiplexer 323 can couple optical signals of different wavelengths from different photoelectric converters 322 into one channel for transmission, or it can separate multi-wavelength signals that are together and send them to different photoelectric converters 322 for processing.

[0086] Please continue reading Figure 9 and Figure 10 As shown, when a signal is transmitted from computing node 500a to switching node 500b, at connector 300 on the first function card 100a, the multiple electrical signals of the first function card 100a converge to connector body 310. The photoelectric conversion component 320 converts the multiple electrical signals into optical signals, groups and converges the multiple optical signals, and then outputs them. The optical signals are transmitted through adapter 200 to connector 300 on the second function card 100b. At the second function card 100b, the photoelectric conversion component 320 in connector 300 separates the multiple optical signals and converts them into electrical signals, which are then transmitted to the second function card 100b. The process of signal transmission from switching node 500b to computing node 500a is the reverse of the process of signal transmission from computing node 500a to switching node 500b, and will not be described in detail here.

[0087] In this embodiment, an optoelectronic converter 322 is used to convert the electrical signals on the first terminal 311 into optical signals. Based on the number of wavelength division multiplexers 323 in the optoelectronic conversion component 320, the optoelectronic converter 322 is divided into multiple groups. For example, the optoelectronic conversion component 320 includes six wavelength division multiplexers 323. Thus, the optoelectronic converter 322 can be divided into six groups. Each group of optoelectronic converters 322 corresponds to one wavelength division multiplexer 323. One wavelength division multiplexer 323 and the optoelectronic converter 322 corresponding to this wavelength division multiplexer 323 form an optoelectronic conversion unit 321.

[0088] The photoelectric conversion unit 321 integrates the photoelectric converter 322 and the wavelength division multiplexer 323. The photoelectric conversion unit 321 not only converts optical signals into electrical signals, but also reduces the number of second branches in the connector 300, thereby reducing the number of transmission branches in the adapter 200 and facilitating its installation. The integration of the photoelectric conversion unit 321 with the photoelectric converter 322 and the wavelength division multiplexer 323 also reduces the size occupied by the photoelectric conversion component 320, making it easier to install the connector 300 on the function card 100.

[0089] Please continue reading Figures 4 to 7 As shown, in one possible implementation, the connector 300 further includes an adapter circuit board 330, the side of the adapter circuit board 330 facing the connector body 310 is connected to the connector body 310, and the photoelectric conversion component 320 is disposed on the side of the adapter circuit board 330 away from the connector body 310.

[0090] Since the photoelectric conversion component 320 is in the form of a bare chip, it is not convenient to connect it directly to the connector body 310. The photoelectric conversion component 320 can be placed on the adapter circuit board 330 first, and then connected to the connector body 310 through the adapter circuit board 330. The adapter circuit board 330 can support the photoelectric conversion component 320 and absorb some of the stress generated by the slight deformation of the connector body 310, so as to avoid the photoelectric conversion component 320 being subjected to excessive force.

[0091] Figure 11 This is a schematic diagram of the internal structure of the connector provided in an embodiment of this application.

[0092] See Figure 11 As shown, the adapter circuit board 330 has multiple second terminals 331 on the side facing the connector body 310, and the first terminal 311 is connected to the second terminal 331 in a one-to-one correspondence. The adapter circuit board 330 has multiple third terminals 332 on the side facing the photoelectric conversion assembly 320, and the third terminals 332 and the second terminals 331 are connected in a one-to-one correspondence through the internal wiring 333 of the adapter circuit board 330. The photoelectric converter 322 is connected to the third terminals 332 in a corresponding manner.

[0093] Multiple second terminals 331 are disposed on the side of the adapter circuit board 330 facing the connector body 310, so as to connect one-to-one with the first terminals 311 on the connector body 310. In one possible embodiment, when the first terminal 311 is a solder joint, the second terminal 331 can also be a solder joint, and the first terminal 311 and the second terminal 331 are soldered one-to-one, so that the first terminal 311 and the second terminal 331 are connected one-to-one. In another possible embodiment, one of the first terminal 311 and the second terminal 331 can be a pin, and the other can be a socket, and the pin is inserted into the socket one-to-one, so that the first terminal 311 and the second terminal 331 are inserted one-to-one.

[0094] Multiple third terminals 332 are disposed on the side of the adapter circuit board 330 facing the photoelectric conversion assembly 320. The correspondence between the third terminals 332 and the photoelectric converter 322 means that the photoelectric converter 322 corresponds to the electrical signal transmitted by the third terminals 332. For example, when the signal is transmitted in a single-ended manner, each third terminal 332 can correspond to one photoelectric converter 322; when the signal is transmitted in a differential pair manner, every two third terminals 332 can correspond to one photoelectric converter 322. The photoelectric converter 322 can convert the electrical signal transmitted by the third terminals 332 into an optical signal, or convert the optical signal into an electrical signal and transmit it to the third terminals 332. Therefore, one third terminal 332 needs to be aligned with one photoelectric converter 322 (single-ended transmission), or two third terminals 332 need to be aligned with one photoelectric converter 322 (differential pair transmission).

[0095] The adapter circuit board 330 has internal wiring 333, through which multiple third terminals 332 can be electrically connected to the second terminals 331 one-to-one. The line width and spacing of the internal wiring 333 can be adjusted according to the spacing and position of the second terminals 331 and the third terminals 332, so that the position and shape of the second terminals 331 can be adapted to the first terminal 311, and the position of the third terminals 332 can be aligned with the photoelectric converter 322. Therefore, by setting the adapter circuit board 330 and connecting the connector body 310 and the photoelectric conversion component 320 through the terminals on both sides of the adapter circuit board 330, the connector body 310 can be used with more photoelectric conversion components 320 of different specifications, thus improving the compatibility of the connector body 310.

[0096] Figure 12 This is another usage state diagram of the connector provided in the embodiments of this application. Figure 13 for Figure 12 Another view; Figure 14 for Figure 12 An explosion diagram.

[0097] See Figure 7 , Figures 12 to 14 As shown, the connector body 310 has a plurality of fourth terminals 312 for connecting to the function card 100 in the computing device 10. The connector 300 also includes a mounting assembly 340, which covers the connector body 310 and the photoelectric conversion assembly 320 and is connected to the connector body 310. The mounting assembly 340 is used for connecting to the function card 100 of the computing device 10.

[0098] The fourth terminal 312 can be located on the sixth surface 310f of the connector body 310. The fourth terminal 312 can be a solder joint or a pin. The function card 100 has multiple fifth terminals (not shown in the figure). When the fourth terminal 312 is a solder joint, the fifth terminal is also a solder joint, and the fourth terminal 312 is soldered to the fifth terminal in a one-to-one correspondence. When the fourth terminal 312 is a pin, the fifth terminal is a slot, and the slot is inserted into the pin in a one-to-one correspondence. In this way, the connector body 310 and the function card 100 can be electrically connected.

[0099] Figure 15 for Figure 12 Another diagram of an explosion. Figure 16 for Figure 12 Another diagram of an explosion.

[0100] See Figures 14 to 16 As shown, the mounting assembly 340 can be a frame structure composed of multiple mounting plates. The mounting assembly 340, formed by multiple mounting plates, covers the connector body 310 and the photoelectric conversion assembly 320 to protect them. For example, the mounting assembly 340 includes five mounting plates: a first mounting plate 341, a second mounting plate 342, a third mounting plate 343, a fourth mounting plate 344, and a fifth mounting plate 345. The first mounting plate 341 is located on one side of the first surface 310a, and the second mounting plate 342 and the third mounting plate 343 are connected to both ends of the first mounting plate 341. For example, the first mounting plate 341 has insertion portions 3411 at both ends, and the second mounting plate 342 and the third mounting plate 343 have first openings 3421, into which the insertion portions 3411 are inserted. The second mounting plate 342 is located on one side of the second surface 310b, and the third mounting plate 343 is located on one side of the third surface 310c. The fourth mounting plate 344 and the fifth mounting plate 345 are integrally formed. The fourth mounting plate 344 is located on the fourth surface 310d side, and the fifth mounting plate 345 is located on the fifth surface 310e side. The fifth mounting plate 345 is snapped into the first mounting plate 341. Thus, the mounting assembly 340 can protect the connector 300 from five surfaces, with the sixth surface 310f of the connector body 310 facing the function card 100. In other embodiments, the mounting assembly 340 can also be composed of different numbers or shapes of mounting plates.

[0101] Mounting component 340 can be mounted on function card 100 by fasteners. For example, function card 100 has a plurality of spaced first mounting holes 110 on the periphery of connector 300, and mounting component 340 has second mounting holes (not shown in the figure) corresponding to the first mounting holes 110. Fasteners are inserted into the first mounting holes 110 and the second mounting holes to connect mounting component 340 to function card 100.

[0102] A mounting plate of the mounting assembly 340 facing the connector body 310 can be connected to the connector body 310. Thus, while protecting the connector 300, the mounting assembly 340 can prevent the interaction force between the connector body 310 and the function card 100 from being entirely applied to the fourth terminal 312, making the connection between the fourth terminal 312 and the function card 100 more reliable.

[0103] Please continue reading Figures 14 to 16 As shown, the connector 300 also includes a liquid cooling heat sink 350, which is located within and connected to the mounting assembly 340; a portion of the liquid cooling heat sink 350 is attached to the side of the photoelectric conversion assembly 320 opposite to the connector body 310.

[0104] The liquid-cooled radiator 350 includes a radiator body 351 with cooling channels for coolant flow. The radiator 350 includes an inlet end 352 and an outlet end 353 located on opposite sides of the radiator body 351. A fourth mounting plate 344 has two second openings 3441 into which the inlet end 352 and outlet end 353 are respectively inserted to connect the liquid-cooled radiator 350 to the mounting assembly 340. This avoids the need for additional connectors to connect the liquid-cooled radiator 350 and the mounting assembly 340, simplifying the structure of the connector 300.

[0105] Please continue reading Figure 13 As shown, the inlet end 352 has an inlet port 352a, and the outlet end 353 has an outlet port 353a. Both the inlet port 352a and the outlet port 353a are connected to the cooling channel and to an external liquid supply device. Coolant enters the cooling channel through the inlet port 352a and flows out through the outlet port 353a. A portion of the liquid-cooled radiator 350 is attached to the side of the photoelectric conversion component 320 facing away from the connector body 310. The heat from the photoelectric conversion component 320 is transferred to the radiator body 351 and then to the coolant in the cooling channel, where the coolant dissipates heat from the photoelectric conversion component 320 as it flows.

[0106] By setting up a liquid-cooled heat sink 350 and connecting the liquid-cooled heat sink 350 to the mounting component 340, the photoelectric conversion component 320 is cooled by liquid cooling. Compared with the solid conduction heat dissipation used in optical modules in related technologies, liquid cooling has higher heat dissipation efficiency and the liquid-cooled heat sink 350 occupies less space.

[0107] Please continue reading Figures 14 to 16 As shown, the liquid-cooled radiator 350 includes a first heat dissipation part 354 and a second heat dissipation part 355 and a third heat dissipation part 356 located on both sides of the first heat dissipation part 354; the first heat dissipation part 354 is attached to the photoelectric conversion component 320, the second heat dissipation part 355 is attached to the second surface 310b, and the third heat dissipation part 356 is attached to the third surface 310c.

[0108] Specifically, the heat sink body 351 may consist of a first heat dissipation section 354 and a second heat dissipation section 355 and a third heat dissipation section 356 located on both sides of the first heat dissipation section 354. The first heat dissipation section 354 is attached to the photoelectric conversion component 320 to dissipate heat from the photoelectric conversion component 320. The liquid inlet end 352 is located at the end of the second heat dissipation section 355 opposite to the first heat dissipation section 354, and the liquid outlet end 353 is located at the end of the third heat dissipation section 356 opposite to the first heat dissipation section 354.

[0109] The second heat dissipation part 355 is bent from one end of the first heat dissipation part 354 to fit against the second surface 310b of the connector body 310, and the third heat dissipation part 356 is bent from the other end of the first heat dissipation part 354 to fit against the third surface 310c of the connector body 310. The heat generated by the connector body 310 can be transferred from the second surface 310b to the second heat dissipation part 355, and also from the third surface 310c to the third heat dissipation part 356. In other words, the liquid cooling radiator 350 can also dissipate heat for the connector body 310.

[0110] Therefore, the shape of the liquid-cooled heat sink 350 can match the shape of the structure formed by the connector body 310 and the photoelectric conversion component 320. This not only allows the liquid-cooled heat sink 350 to occupy less space in the connector 300, making the structure of the connector 300 more compact, but also reduces the space occupied by the connector 300 on the function card 100. Furthermore, the liquid-cooled heat sink 350 also ensures better heat dissipation for the entire connector 300.

[0111] Please continue reading Figures 14 to 16 As shown, the photoelectric conversion component 320 also includes a plurality of first optical connectors 324, each of which is connected to a wavelength division multiplexer 323. The mounting component 340 has a plurality of sockets 346, and the first optical connectors 324 are inserted into the sockets 346 in a corresponding manner.

[0112] The photoelectric conversion component 320 also includes a plurality of second fiber bundles 325. One end of the second fiber bundle 325 is connected to the wavelength division multiplexer 323, and the other end of the second fiber bundle 325 is connected to the first optical connector 324. Thus, the second fiber bundle 325 can connect the wavelength division multiplexer 323 and the first optical connector 324.

[0113] The first mounting plate 341 of the mounting assembly 340 has the same number of slots 346 as the first optical connectors 324. The multiple first optical connectors 324 are respectively inserted into different slots 346, so that the mounting assembly 340 can fix the first optical connectors 324 and facilitate the first optical connectors 324 to be connected with the adapter 200.

[0114] Figure 17 This is a schematic diagram of the structure of the adapter in the computing device provided in the embodiments of this application. Figure 18 This is another structural schematic diagram of the adapter in the computing device provided in the embodiments of this application.

[0115] See Figure 17 and Figure 18 As shown, the adapter 200 is equipped with a second optical connector 230, which mates with the first optical connector 324. Please continue reading. Figure 17 As shown, when the adapter 200 includes optical cable 200a, two second optical connectors 230 are connected to both ends of the first fiber bundle 210 in optical cable 200a. Please continue to see... Figure 18 As shown, when the adapter 200 includes an optical backplane 200b, two second optical connectors 230 are connected to both ends of the optical channel 220 in the optical backplane 200b. By providing the second optical connectors 230, the second optical connectors 230 can be adapted to both the optical cable 200a and the optical backplane 200b structures. Therefore, the form of the adapter 200 can be selected according to the specific structure of the computing device 10, which facilitates the layout of components in the computing device 10.

[0116] The computing device 10 can also be a high-density server, a tower server, or a rack server. The rack server can be configured with different function cards according to different needs, which has the advantages of high flexibility and wide applicability.

[0117] The following section uses a rack server as an example to illustrate the structure of computing device 10.

[0118] Figure 19 Another schematic diagram of the computing device provided in an embodiment of this application.

[0119] See Figure 19As shown, the computing device 10 includes a motherboard 600 and multiple daughterboards 700. Each daughterboard 700 can be a hard disk 710 or an expansion card 720. Each expansion card 720 can be a Peripheral Component Interconnect Express card (PCIE). Both the motherboard 600 and the daughterboards 700 are function cards 100.

[0120] Both the motherboard 600 and the daughterboard 700 are equipped with the connector 300 provided in this embodiment. The motherboard 600 is equipped with a processor 610. Each daughterboard 700 is electrically connected to the motherboard 600 through the connector 300 and the adapter 200, thereby enabling signal transmission between them and the processor on the motherboard 600. The space on the motherboard 600 and the daughterboard 700 is relatively small, and the space in the rack server is also relatively compact. The connector 300 provided in this embodiment is designed with a connector body 310 and a photoelectric conversion component 320. The photoelectric conversion component 320 includes multiple photoelectric conversion units 321, which are integrated into the photoelectric conversion component 320. This makes the photoelectric conversion component 320 smaller, and consequently, the connector 300 smaller, facilitating the layout of devices on the motherboard 600 and the daughterboard 700. The photoelectric conversion unit 321 can convert the electrical signals in a set of first terminals 311 connected to it into optical signals. Therefore, the number of output optical signal branches of the connector 300 is less than the number of input electrical signal branches. Consequently, the number of branches in the adapter 200 connected to the connector 300 is also smaller, facilitating the deployment of the adapter 200 in the rack server. The transmission loss of optical signals is less than that of electrical signals. By converting electrical signals into optical signals for transmission in the adapter 200, signal transmission loss in the rack server can be reduced.

[0121] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0122] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A connector, characterized in that, include: A connector body for connecting to a function card in a computing device, the connector body having a plurality of first terminals; The first terminal is used to transmit electrical signals; A photoelectric conversion component includes multiple photoelectric conversion units, the number of which is less than the number of the first terminals; the multiple first terminals are divided into multiple groups according to the number of the photoelectric conversion units, each group of first terminals is correspondingly set with one photoelectric conversion unit, and each group of first terminals is correspondingly connected to one photoelectric conversion unit.

2. The connector according to claim 1, characterized in that, Each photoelectric conversion unit includes a wavelength division multiplexer and a plurality of photoelectric converters corresponding to the wavelength division multiplexer; the number of photoelectric converters in each photoelectric conversion unit is the same as the number of the first terminals in each group and they are connected one-to-one with the first terminals.

3. The connector according to claim 2, characterized in that, It also includes an adapter circuit board, the side of which faces the connector body is connected to the connector body, and the photoelectric conversion component is disposed on the side of the adapter circuit board away from the connector body.

4. The connector according to claim 3, characterized in that, The adapter circuit board has a plurality of second terminals on the side facing the connector body, and the first terminal is connected to the second terminal in a one-to-one correspondence. The adapter circuit board has multiple third terminals on the side facing the photoelectric conversion component. The third terminals and the second terminals are connected one-to-one through the internal wiring of the adapter circuit board, and the photoelectric converter is connected to the corresponding third terminals.

5. The connector according to any one of claims 2 to 4, characterized in that, The connector body has a plurality of fourth terminals, which are used to connect to a function card in the computing device; The connector also includes a mounting component, which covers the connector body and the photoelectric conversion component and is connected to the connector body. The mounting component is used to connect to the function card of the computing device.

6. The connector according to claim 5, characterized in that, It also includes a liquid-cooled heat sink, which is located within and connected to the mounting assembly; a portion of the liquid-cooled heat sink is attached to the side of the photoelectric conversion assembly opposite to the connector body.

7. The connector according to claim 6, characterized in that, The connector body includes a first surface facing the photoelectric conversion component and a second and a third surface located on both sides of the first surface, wherein the third and second surfaces form an angle with the first surface; The liquid-cooled heat sink includes a first heat dissipation section and a second heat dissipation section and a third heat dissipation section located on both sides of the first heat dissipation section; the first heat dissipation section is attached to the photoelectric conversion component, the second heat dissipation section is attached to the second surface, and the third heat dissipation section is attached to the third surface.

8. The connector according to claim 5, characterized in that, The photoelectric conversion component also includes a plurality of first optical connectors, each of which is connected to the wavelength division multiplexer in a corresponding manner; the mounting component has a plurality of sockets, and each of the first optical connectors is inserted into the socket in a corresponding manner.

9. A computing device, characterized in that, It includes a function card, an adapter, and a connector as described in any one of claims 1 to 8, the connector being disposed on the function card, and the adapter being used to connect the connector located on different function cards.

10. The computing device according to claim 9, characterized in that, The connector includes a plurality of first optical connectors; The adapter is an optical cable, which includes multiple first optical fiber bundles. The two ends of each first optical fiber bundle are connected to second optical connectors, and the second optical connectors are mated with the first optical connectors. Alternatively, the adapter is an optical backplane, in which multiple optical channels are arranged, and the two ends of the optical channels are connected to the second optical connectors, which are mated with the first optical connectors.

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