Conductive contact assembly and preparation method thereof

Abstract

The invention discloses a conductive contact assembly and a preparation method of the conductive contact assembly, and belongs to the technical field of electric connectors, the conductive contact assembly comprises an insulating part and a plurality of conductive units, the insulating part is provided with a plurality of mounting holes, the plurality of conductive units are arranged in the mounting holes in a one-to-one correspondence manner, and each conductive unit comprises a conductive spring and a conductive part. The conductive spring is arranged in the mounting hole in a penetrating mode, the conductive spring is connected with the insulating piece through the conductive piece, the conductive piece comprises a gluing base body and conductive particles, and the conductive particles are evenly distributed in the gluing base body; and the conductive particles are uniformly distributed in the glued substrate, so that the inductive effect of the conductive spring can be effectively eliminated, and signal distortion is avoided, thereby adapting to the transmission of high-frequency and high-speed signals and being beneficial to the stable transmission of the signals.

Description

Technical Field

[0001] This application relates to the field of electrical connector technology, and in particular to a conductive contact component and a method for preparing the conductive contact component. Background Technology

[0002] Conductive contact components refer to contact components that can provide stable elastic pressure and achieve reliable electrical connection.

[0003] In related technologies, conductive elements typically employ spring pins, utilizing the mechanical deformation of a metal spring to provide restoring force. However, in high-frequency signal transmission, the metal spring can cause signal distortion due to the inductive effect, affecting the stable transmission of the signal. Summary of the Invention

[0004] One of the objectives of this application is to provide a conductive contact component that facilitates stable signal transmission, thereby at least partially solving the aforementioned technical problems.

[0005] Another objective of this application is to provide a method for preparing a conductive contact component.

[0006] To achieve the above objectives, according to a first aspect of this application, a conductive contact assembly is provided, comprising: Insulating component with multiple mounting holes; Multiple conductive units are arranged one-to-one in the mounting hole. Each conductive unit includes a conductive spring and a conductive component. The conductive spring passes through the mounting hole, and the conductive component connects the conductive spring to the insulating component. The conductive component includes an adhesive matrix and conductive particles, with the conductive particles evenly distributed in the adhesive matrix.

[0007] Optionally, the conductive particles include a particle body and a conductive coating covering the particle body, wherein the particle body is made of an elastic material.

[0008] Optionally, the conductive spring has a target axis, a spring body, and two spring ends located on both sides of the spring body along the target axis. The spring body has a first radial dimension, and the spring ends have a second radial dimension, wherein the first radial dimension is not less than the second radial dimension.

[0009] Optionally, the conductive spring has a first axial dimension along the target axis direction, and the conductive element has a second axial dimension along the target axis direction, the first axial dimension being larger than the second axial dimension, so that at least a portion of the spring end is exposed to the outside of the conductive element.

[0010] Optionally, the insulating component is made of an elastic material, the adhesive matrix is ​​made of an elastic material, and the Shore hardness of the insulating component is greater than that of the adhesive matrix.

[0011] Optionally, the insulating member has a third axial dimension along the target axis direction, the third axial dimension being smaller than the second axial dimension, so that at least a portion of the conductive unit is exposed on the outside of the insulating member; Multiple conductive units are arranged in an array, with a center distance between adjacent conductive units. Each conductive unit has a protrusion height that protrudes from the insulating element along the target axis, and the center distance is not less than the protrusion height.

[0012] Optionally, the volume ratio of the conductive spring to the conductive particles is between 1:0.3 and 1:2.

[0013] Optionally, the mass of the conductive particles accounts for 15% to 60% of the mass of the adhesive matrix.

[0014] According to a second aspect of this application, a method for preparing a conductive contact component is provided, comprising the following steps: An insulating component is provided, which has multiple mounting holes; Conductive particles are mixed with uncured adhesive matrix under vacuum to form a uniform conductive slurry. Place the conductive spring into the mounting hole and inject the conductive paste into the mounting hole to fill it with the conductive paste. The conductive slurry injected into the insulating component is cured to form a conductive component, thereby obtaining a conductive contact assembly.

[0015] Optionally, the conductive particles are vacuum-mixed with the uncured adhesive matrix, specifically including: The conductive particles and the adhesive matrix are mixed at a stirring speed of 20 rpm to 50 rpm for 30 to 60 minutes. After mixing, the mixture is degassed under vacuum.

[0016] Optionally, the conductive paste injected into the insulating component is cured, specifically including: The conductive paste inside the mounting hole is hot-pressed and vulcanized at a temperature of 150°C to 180°C and a pressure of 5 MPa to 15 MPa.

[0017] In the conductive contact assembly of this application embodiment, conductive particles are uniformly distributed in the adhesive matrix, which can effectively eliminate the inductive effect of the conductive spring, avoid signal distortion, and thus adapt to the transmission of high-frequency signals, which is beneficial to the stable transmission of signals. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0019] Figure 1 This is a schematic diagram of the structure of the conductive contact assembly used in circuit board connection according to an exemplary embodiment of this disclosure; Figure 2 This is a cross-sectional view of a conductive contact assembly in an exemplary embodiment of this disclosure; Figure 3 This is a process flow diagram of a conductive contact component preparation method according to an exemplary embodiment of this disclosure; Figure 4 This is a process flow diagram of a method for preparing a conductive contact component according to another exemplary embodiment of this disclosure; Figure 5 This is a process flow diagram of a method for preparing a conductive contact component according to another exemplary embodiment of this disclosure.

[0020] Explanation of reference numerals in the attached figures: 1. Insulating component; 11. Mounting hole; 2. Conductive unit; 21. Conductive spring; 211. Spring body; 212. Spring end; 22. Conductive component; 221. Adhesive matrix; 222. Conductive particles; 3. Circuit board; 31. Electrode; 4. Support components; Z, target axis; D1, first radial dimension; D2, second radial dimension; D3, third radial dimension; L1, first axial dimension; L2, second axial dimension; L3, third axial dimension; S, center distance; H, protrusion height. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0022] It should be understood that terms such as “having,” “comprising,” and “including” as used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0023] In the various figures of this application, for ease of illustration, certain dimensions of structures or parts may be exaggerated relative to other structures or parts; therefore, they are only used to illustrate the basic structure of the subject matter of this application.

[0024] According to the first aspect of this application, referring to Figure 1 This disclosure provides a conductive contact assembly, including an insulating element 1 and a plurality of conductive units 2.

[0025] In some embodiments, the insulating member 1 has a plurality of mounting holes 11, and a plurality of conductive units 2 are disposed in the mounting holes 11 in a corresponding manner.

[0026] In this embodiment, multiple mounting holes 11 are arranged in an array. The conductive units 2 are inserted into the mounting holes 11 one by one, and can be used to make elastic contact with the electrodes 31 of the circuit board 3 or other components that require electrical contact. Compared with the solution of "using conductive contact components to perform performance checks on semiconductor components", the conductive units 2 in this solution can achieve long-term elastic compression and have better creep resistance.

[0027] In other embodiments, the conductive contact assembly can also be used for performance testing of semiconductor components. For example, a test socket that uses conductive unit 2 to electrically connect the contact pad of the testing device to the terminals of the semiconductor component.

[0028] In some embodiments, the conductive unit 2 includes a conductive spring 21 and a conductive element 22. The conductive spring 21 passes through the mounting hole 11, and the conductive element 22 connects the conductive spring 21 to the insulating element 1.

[0029] In this embodiment, the conductive spring 21 provides stable mechanical rebound, avoiding the creep problem that easily occurs in conventional conductive rubber or conductive elastomers, and its lifespan is also longer than that of conductive rubber and conductive elastomers. The conductive spring 21 can be connected to the insulating component 1 by the curing of the conductive component 22.

[0030] For example, the conductive spring 21 is coaxially arranged with the mounting hole 11.

[0031] In some embodiments, the conductive element 22 includes an adhesive matrix 221 and conductive particles 222, wherein the conductive particles 222 are uniformly distributed in the adhesive matrix 221.

[0032] In some embodiments, the conductive element 22 is configured to be uniformly mixed with the adhesive matrix 221 and conductive particles 222, and then cured within the mounting hole 11.

[0033] In this embodiment, compared to the solution where "conductive particles are not uniformly dispersed in the adhesive matrix", the adhesive matrix 221 and conductive particles 222 are uniformly mixed, allowing the conductive particles 222 to be uniformly dispersed within the adhesive matrix 221. Furthermore, the fabrication process of the conductive component 22 is also simpler.

[0034] In this embodiment, the conductive spring 21 and the conductive particles 222 are connected in parallel to conduct electricity, which reduces the contact resistance and volume resistance, and can improve the current carrying capacity compared with conductive rubber or conductive elastomer.

[0035] For example, during the use of the conductive contact assembly, after applying axial pressure to the conductive unit 2, the conductive unit 2 is compressed, and the conductive particles 222 within the adhesive matrix 221 come into close contact under pressure, forming multi-path conductivity. Some of the conductive particles 222 contact the conductive spring 21, and a parallel conductive network and electric field short circuit can be formed between the conductive spring 21 and the conductive element 22, effectively eliminating inductance and reducing high-frequency impedance, making it suitable for signal transmission from DC to terahertz. After the pressure applied to the conductive unit 2 is released, the conductive unit 2 returns to its initial shape before deformation.

[0036] After the adhesive matrix 221 and conductive particles 222 are uniformly mixed, they are filled and cured in the mounting hole 11, so that the conductive particles 222 are evenly distributed in the adhesive matrix 221. This can effectively eliminate the inductive effect of the conductive spring 21, avoid signal distortion, and thus adapt to the transmission of high-frequency and high-speed signals, which is conducive to the stable transmission of signals.

[0037] In some embodiments, continue to refer to Figure 1 As shown, the conductive particle 222 includes a particle body (not shown in the figure) and a conductive coating (not shown in the figure) covering the particle body. The particle body is made of an elastic material.

[0038] In this embodiment, when the conductive unit 2 is compressed, the elastic particle body inside the conductive element 22 can undergo elastic deformation instead of brittle fracture or rigid displacement. This ensures that during the compression and rebound cycle, the conductive particles 222 and the conductive spring 21 can maintain stable and sufficient physical contact, thereby maintaining the integrity of the conductive network and making the contact resistance fluctuate less under long-term use or frequent insertion and removal, thus ensuring dynamic conductivity.

[0039] In this embodiment, the elastic particle body can absorb and disperse some of the mechanical stress, reducing the risk of damage and peeling of the conductive coating due to direct shearing or compression, and improving the overall mechanical durability of the conductive component 22. Moreover, the uniformly dispersed elastic conductive particles 222 can quickly recover after deformation, which helps to maintain the uniformity of the dispersion state of the conductive particles 222. The stability of this structure makes the electrical parameters (such as equivalent inductance and impedance) of the parallel conductive network composed of the conductive spring 21 and the conductive particles 222 more stable at high frequencies, which is beneficial to ensuring the consistency of high-frequency signal transmission.

[0040] In this embodiment, the elastic material of the particle body (e.g., silicone rubber or carbon nanotubes) itself has good deformation ability, while the conductive coating on the surface (e.g., silver plating) ensures excellent conductivity. This allows the two functions of the conductive particle 222, namely "providing deformation" and "providing conductivity", to be separated, so that the material design can be adjusted within a wide range to simultaneously meet different elastic modulus and conductivity requirements.

[0041] For example, the conductive particles 222 can be flexible conductive media that adapt to deformation, such as metallized elastic high-temperature resistant silicone rubber microspheres, elastomer microspheres, metallized carbon nanotubes, or metallized PI chopped fibers. Further halogenation treatment or the addition of silver halide (e.g., silver iodide, silver bromide) powder can reduce the amount of conductive media required, decrease the number of silver particles, reduce the percolation domain value, and achieve quantum tunneling.

[0042] For example, the method to improve the conductivity of conductive particles 222 can be to improve the conductivity of the material itself, such as through metallization coating (chemical plating, electroplating, sintering, etc.). The conductive coating can be a silver material.

[0043] For example, the main body of the particles can be silicone rubber microspheres or carbon nanotubes, and the conductive particles 222 can be silver-plated silicone rubber microspheres or silver-plated carbon nanotubes. With the excellent resilience of the conductive component 22, a contact resistance of less than 15 mΩ can be achieved, with a fluctuation range of less than 10%.

[0044] In other embodiments, the conductive particles 222 may also be at least one or a combination of conductive powders such as silver-plated silicone rubber microspheres, silver-plated carbon nanotubes, metallized hollow plastic microspheres, silver-plated carbon black, silver-plated aluminum powder, silver-plated copper powder, nickel-plated aluminum powder, nickel-plated carbon black, gold-plated nickel powder, highly conductive carbon black, carbon nanotubes, and graphene, which can meet different needs for conductivity and cost.

[0045] In other embodiments, the adhesive matrix 221 may also be made of viscous silicone oil (e.g., phenyl silicone oil) or fluorinated oil (e.g., perfluoropolyether fluorinated oil), which, when combined with conductive particles 222 uniformly dispersed within the adhesive matrix 221, forms silicone grease or fluorinated grease. This makes the conductive contact assembly more suitable for long-term contact with the electrodes 31 of the circuit board 3. In this case, since the conductive element 22 (e.g., silicone grease or fluorinated grease) has certain rheological properties, when non-elastic materials (e.g., silver-plated carbon black, silver-plated aluminum powder, silver-plated copper powder, nickel-plated aluminum powder, nickel-plated carbon black, gold-plated nickel powder, highly conductive carbon black, carbon nanotubes, graphene, etc.) are selected, the shear force on the conductive particles 222 can be reduced.

[0046] In some embodiments, in conjunction with reference Figure 1 and Figure 2As shown, the conductive spring 21 has a target axis Z, a spring body 211 and two spring ends 212. The two spring ends 212 are located on both sides of the spring body 211 along the target axis Z. The spring body 211 has a first radial dimension D1 and the spring ends 212 have a second radial dimension D2. The first radial dimension D1 is greater than the second radial dimension D2.

[0047] In this embodiment, when there is a slight positional deviation (e.g., misalignment) between the electrode 31 of the circuit board 3 and the conductive contact assembly, a guiding slope is provided at the end 212 of the spring with a smaller radial dimension, which makes it easier to accommodate the offset of the electrode 31 and causes the conductive spring 21 to automatically correct itself during compression, thereby ensuring that a stable, low-resistance electrical contact is formed between the conductive spring 21 and the electrode 31, and improving the connection reliability.

[0048] In this embodiment, when the conductive spring 21 is compressed, the smaller radial dimension of the spring end 212 reduces the extent to which the spring end 212 approaches the adjacent conductive unit 2 when the conductive spring 21 is tilted. This effectively increases the creepage distance and electrical clearance between adjacent conductive units 2, preventing arcing, short circuits, or signal crosstalk that may be caused by insufficient distance, and improving the electrical safety performance of the conductive contact assembly in high-density, high-voltage, or high-reliability applications. Furthermore, it allows the stress to transition more smoothly from the spring end 212 to the spring body 211 when the conductive spring 21 is compressed, which helps to improve the fatigue life of the conductive spring 21.

[0049] For example, in its natural state, the second radial dimension D2 of the conductive spring 21 can be 0.8 to 0.95 times the first radial dimension D1 (e.g., any value among 0.8, 0.85, 0.9, and 0.95, or a range between any two values). Of course, the second radial dimension D2 can also be any multiple between 0.8 and 0.95 times the first radial dimension D1.

[0050] In other embodiments, the first radial dimension D1 is equal to the second radial dimension D2, thereby reducing the manufacturing difficulty of the conductive spring 21 and reducing the manufacturing cost of the conductive contact assembly.

[0051] For example, the conductive element 22 (i.e., the adhesive substrate 221) has a third radial dimension D3, which is greater than the first radial dimension D1. The first radial dimension D1 can be 0.7 to 0.9 times the third radial dimension D3 (e.g., any value among 0.7, 0.8, and 0.9, or a range between any two values). Of course, the first radial dimension D1 can also be any multiple between 0.7 and 0.9 times the third radial dimension D3.

[0052] For example, the conductive spring 21 is a helical spring, and the material can be a metal with high elasticity such as beryllium copper, stainless steel, titanium copper, copper-nickel-tin alloy, etc. The surface of the conductive spring 21 can be plated with gold, silver, etc.

[0053] For example, the conductive spring 21 is made of copper and its surface is gold-plated. For instance, the conductive spring 21 can be a gold-plated beryllium copper compression spring. The wire diameter of the conductive spring 21 is between 0.03 mm and 0.1 mm (e.g., any value or a range between any two of 0.03 mm, 0.05 mm, 0.07 mm, 0.09 mm, and 0.1 mm).

[0054] In some embodiments, continue to refer to Figure 1 and Figure 2 As shown, the conductive spring 21 has a first axial dimension L1 along the target axis Z direction, and the conductive element 22 has a second axial dimension L2 along the target axis Z direction. The first axial dimension L1 is greater than the second axial dimension L2, so that at least a portion of the spring end 212 is exposed to the outside of the conductive element 22.

[0055] In this embodiment, when the conductive contact component is initially connected to the electrode 31 of the circuit board 3, the protruding spring end 212, which has excellent elasticity and conductivity, will first establish physical contact and electrical connection, avoiding the situation where the conductive component 22 contacts the electrode 31 before the spring end 212, which would cause unstable conductivity (for example, the conductive particles 222 and the adhesive matrix 221 may be unevenly mixed, resulting in unstable conductivity, or the metal shavings caused by the shedding of conductive particles 222 may contaminate or even short-circuit the signal transmission). This achieves a fast and reliable electrical connection.

[0056] In this embodiment, as the compression stroke of the conductive spring 21 continues, the protruding conductive spring 21 is pressed back, and the end face of the conductive element 22 begins to contact the electrode 31. At this time, the conductive particles 222, which are pre-uniformly dispersed in the adhesive matrix 221, form a dense conductive network under pressure, which is connected in parallel with the conductive spring 21. This structure effectively eliminates spring inductance at high frequencies through multi-path current shunting, while providing a large current path at DC or low frequencies. The conductive spring 21 always provides the core rebound force and a low-resistance main path throughout the process.

[0057] In this embodiment, the initial contact and elastic deformation of the conductive spring 21 absorbs part of the impact energy during the alignment process, which buffers and protects the internal precision conductive components 22 (e.g., brittle conductive particles 222), thereby improving the overall mechanical durability and impact resistance of the conductive contact assembly.

[0058] In this embodiment, the protruding spring end 212 design also ensures that the conductive element 22 still has elasticity after long-term compression, ensuring the stability of signal transmission of the conductive contact assembly. Moreover, the independent deformation of each conductive spring 21 ensures that each contact point can obtain sufficient contact pressure, thereby improving the coplanarity and connection stability of the entire contact array.

[0059] For example, in its natural state, at least a portion of the conductive spring 21 (e.g., spring end 212) protrudes from the end faces of the conductive member 22 along the target axis Z. When the conductive unit 2 is compressed to its rated compression stroke, its resistance is <20mΩ, its rebound rate after long-term compression is >90%, and its inductance is low at high frequencies. Thus, the conductive unit 2 can achieve long-term elastic compression and has better creep resistance.

[0060] For example, the conductive unit 2 can maintain a contact resistance change rate of <10% within the rated compression stroke (e.g., 0.5 mm to 2.0 mm), thus achieving a stable electrical connection.

[0061] In some embodiments, continue to refer to Figure 1 As shown, the insulating component 1 is made of an elastic material, the adhesive matrix 221 is made of an elastic material, and the Shore hardness of the insulating component 1 is greater than that of the adhesive matrix 221.

[0062] In this embodiment, since the Shore hardness (e.g., Shore A hardness) of the insulating component 1 is greater than that of the adhesive matrix 221 (e.g., Shore A hardness), it can effectively resist the radial expansion force generated by the conductive unit 2 when compressed along the target axis Z. This suppresses the lateral deformation or displacement between adjacent conductive units 2, ensuring that even under extreme compression or long-term pressure, a sufficient safe distance can be maintained between adjacent conductive units 2, avoiding the risk of short circuit (bridging) caused by the insulating component 1 being too soft and the conductive unit 2 tilting to the side.

[0063] In this embodiment, the insulating component 1 made of high-hardness elastic material has a higher modulus and elastic recovery force. This allows the insulating component 1 to provide stable and durable support when subjected to long-term compressive loads, preventing the elasticity of the conductive unit 2 from weakening or the contact pressure from decreasing due to creep of the insulating component 1 itself, thereby ensuring the reliability of the electrical connection in long-term use.

[0064] For example, the Shore A hardness of the insulating component 1 can be greater than or equal to 70, and the Shore A hardness of the adhesive matrix 221 can be between 10 and 40. The insulating component 1 can be made of rubber material (such as silicone rubber, fluororubber, nitrile rubber, etc.), and the adhesive matrix 221 can be made of silicone rubber.

[0065] In some embodiments, continue to refer to Figure 1 and Figure 2As shown, the insulating member 1 has a third axial dimension L3 along the target axis Z direction, the third axial dimension L3 being smaller than the second axial dimension L2, so that at least a portion of the conductive unit 2 is exposed on the outside of the insulating member 1.

[0066] In this embodiment, at least one end of the conductive unit 2 along the target axis Z is exposed on the outside of the insulating member 1. When the conductive contact assembly docks with the electrode 31 of the circuit board 3, the protruding end of the conductive unit 2 will make contact first, while the end face of the insulating member 1 remains in a non-contact, suspended state, thus preventing the insulating member 1 from making contact with the circuit board 3 first.

[0067] In some embodiments, a plurality of conductive units 2 are arranged in an array, with a center distance S between adjacent conductive units 2, and the conductive unit 2 has a protrusion height H that protrudes from the insulating member 1 along the target axis Z, and the center distance S is not less than the protrusion height H.

[0068] In this embodiment, the center distance S is not less than the protrusion height H, providing a safety margin for possible tilting or lateral displacement of each conductive unit 2 under pressure. This ensures that even under the most unfavorable tilting conditions, the ends of adjacent conductive units 2 are unlikely to make physical contact, thereby reducing the risk of short circuits due to contact. Therefore, the conductive contact assembly can be safely applied to conductive units 2 in high-density array layouts (e.g., center distance S less than 0.4 mm).

[0069] In this embodiment, the sufficient center distance S effectively reduces parasitic capacitance and electromagnetic coupling between adjacent conductive units 2, reduces signal crosstalk and reflection, and helps ensure the integrity and stability of high-frequency and high-speed signal transmission. Physical space is reserved for the elastic movement of the conductive units 2, avoiding the risk of accidental contact between conductive units 2 due to creep or fatigue of the insulating component 1 during long-term compression or frequent insertion and removal, thus improving the long-term reliability and durability of the conductive contact assembly in harsh working environments.

[0070] In some embodiments, the volume ratio of the conductive spring 21 to the conductive particles 222 is between 1:0.3 and 1:2.

[0071] In this embodiment, when the relative volume of the conductive particles 222 is relatively high (e.g., the volume ratio of the conductive spring 21 to the conductive particles 222 is 1:2), the parallel conductive network formed by the conductive particles 222 in and around the coil of the conductive spring 21 is denser and more complete. This not only significantly reduces contact resistance and volume resistance, but the dense conductive particles 222 can also more effectively form an "electric field short circuit" between the coils of the conductive spring 21, minimizing the parasitic inductance effect of the spring. This makes the conductive contact assembly suitable for transmitting high-frequency signals up to the terahertz level, while also improving current carrying capacity.

[0072] In this embodiment, when the relative volume of the conductive particles 222 is low (e.g., the volume ratio of the conductive spring 21 to the conductive particles 222 is 1:0.3), the conductive spring 21 dominates in the conductive unit 2, becoming the main source of the rebound force. This ensures that the conductive contact assembly can provide strong and stable contact pressure even under long-term compression or frequent insertion and removal conditions, effectively avoiding the contact failure problem caused by matrix creep of traditional conductive elastomers, and is suitable for scenarios with high requirements for mechanical life and elasticity consistency.

[0073] In this embodiment, the aforementioned ratio range (i.e., the volume ratio of the conductive spring 21 to the conductive particles 222 is between 1:0.3 and 1:2) provides flexible performance tuning freedom. By adjusting the volume ratio within this range, and combining it with parameters such as the wire diameter and number of turns of the conductive spring 21, conductive contact components that meet specific compression stroke, contact resistance, rebound force, and high-frequency response requirements can be precisely customized, greatly expanding the application adaptability of the product.

[0074] For example, the volume ratio of the conductive spring 21 to the conductive particles 222 can also be between 1:0.5 and 1:1.5, thereby achieving a balance between mechanical and electrical properties. For example, the volume ratio can be any ratio or any ratio within the range of 1:0.5, 1:1.0, and 1:1.5.

[0075] In some embodiments, the mass of conductive particles 222 accounts for 15% to 60% of the mass of the adhesive matrix 221.

[0076] In this embodiment, the mass percentage of conductive particles 222 to the mass of the adhesive matrix 221 is 15% to 60%, ensuring that the amount of conductive particles 222 added exceeds the penetration threshold for forming a continuous conductive network, thereby guaranteeing reliable conductivity of the conductive contact component along the target axis Z direction. Simultaneously, the maximum percentage of conductive particles 222 to the mass of the adhesive matrix 221 is 60%, avoiding problems such as loss of elasticity, increased brittleness, or difficulty in processing of the adhesive matrix 221 due to excessive filler, thus ensuring both manufacturability and functionality of the product.

[0077] For example, the percentage of the mass of the conductive particles 222 to the mass of the adhesive matrix 221 can be any value among 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, and 60%, or any value between 15% and 60%.

[0078] In this embodiment, the percentage of the mass of the conductive particles 222 to the mass of the adhesive matrix 221 can be in the range of 15% to 30%. This allows the original high elasticity and flexibility of the adhesive matrix 221 to be maintained to the maximum extent possible while ensuring the formation of a basic conductive path. The resulting conductive component 22 has low hardness and strong deformation capability, making it suitable for applications requiring high resilience and primarily demanding DC or low-frequency conductivity, while also having a lower material cost.

[0079] In this embodiment, the percentage of the mass of the conductive particles 222 to the mass of the adhesive matrix 221 can be in the range of 30% to 45%. Thus, the conductive particles 222 are sufficient to form a high-density, low-resistance, and stable three-dimensional conductive network. With this ratio, the conductive element 22 maintains good elasticity while achieving a significantly reduced and minimally fluctuating volume resistance and contact resistance. Furthermore, this proportion of conductive network can most effectively "wrap" and "short-circuit" the conductive spring 21 coil, resulting in a significant effect on eliminating parasitic inductance and optimizing high-frequency signal integrity, thus balancing electrical performance, mechanical lifespan, and reliability.

[0080] In this embodiment, the percentage of the mass of conductive particles 222 to the mass of the adhesive matrix 221 can be in the range of 45% to 60%. Therefore, the high content of conductive particles 222 allows for the construction of a high-density conductive path, achieving lower volume resistance and excellent electromagnetic shielding effectiveness. This is suitable for applications with high requirements for current carrying capacity, conduction resistance, or shielding performance. In this case, the increase in elastic modulus of the adhesive matrix 221 due to the increased filler can be compensated by adjusting the spring parameters, thereby maintaining the overall compression and rebound characteristics.

[0081] In some embodiments, continue to refer to Figure 1 As shown, the conductive contact assembly includes a support member 4, and an insulating member 1 is connected to the support member 4. The support member 4 is used to connect the conductive contact assembly to the circuit board 3, or the support member 4 can be positioned on the inspection device.

[0082] For example, the insulating component 1 can be a sheet-like plate structure. The supporting component 4 can be a plastic or metal frame structure with a certain rigidity, used for supporting, positioning, or welding conductive contact components.

[0083] For example, when the support component 4 is made of plastic, it can be a liquid crystal polymer (LCP), polyphenylene sulfide (PPS), polyimide (PI), polyether ether ketone (PEEK), polyetherimide (PEI), polystyrene (PS), polypropylene (PP), or modified polyphenylene oxyether (MPPO), etc. When the support component 4 is made of metal, it can be stainless steel or copper, etc.

[0084] According to a second aspect of this disclosure, a method for preparing a conductive contact component is provided. This preparation method is applicable to the aforementioned conductive contact component, which possesses all the aforementioned beneficial effects, which will not be elaborated further herein.

[0085] Reference Figure 3 As shown, a method for preparing a conductive contact component includes the following steps: S101. Provide an insulating component 1, which has a plurality of mounting holes 11; S102. The conductive particles 222 are mixed with the uncured adhesive matrix 221 under vacuum to form a uniform conductive slurry. S103. Place the conductive spring 21 into the mounting hole 11 and inject the conductive paste into the mounting hole 11 so that the conductive paste fills the mounting hole 11. S104. The conductive slurry injected into the insulating component 1 is cured to form the conductive component 22, thereby obtaining the conductive contact assembly.

[0086] In this embodiment, the "vacuum stirring and mixing" step in step S102 ensures that the conductive particles 222 are uniformly dispersed at the molecular level in the adhesive matrix 221, avoiding particle agglomeration. This results in a highly uniform and isotropic three-dimensional conductive network being constructed inside the conductive component 22 after curing. This network can be effectively connected in parallel with the conductive spring 21 and eliminate inductive effects, achieving excellent high-frequency transmission performance.

[0087] In this embodiment, the mixing process in a vacuum environment during step S102 effectively removes air from the conductive slurry, preventing bubbles or voids from forming inside or at the interface of the conductive component 22 after curing. This not only avoids local resistance increases and current concentration caused by voids, but also eliminates potential mechanical weaknesses, improving the voltage withstand strength, current carrying capacity, and mechanical life of the conductive contact component.

[0088] In this embodiment, in step S103, a uniform conductive paste is injected into the mounting hole 11 of the pre-placed conductive spring 21, ensuring that the conductive paste fully and completely fills all coil gaps of the conductive spring 21 and the space between the conductive spring 21 and the hole wall. This avoids structural defects or localized interruptions in conductive pathways caused by incomplete filling. After the conductive paste cures, the conductive spring 21, conductive particles 222, and adhesive matrix 221 combine into a robust composite whole, ensuring the structural integrity and contact reliability of the conductive unit 2 during long-term compression cycles.

[0089] For example, in step S103, after cleaning and plating (e.g., gold plating) the conductive spring 21, the conductive spring 21 is precisely fixed in a preset position inside the cavity of the mold.

[0090] In some embodiments, in conjunction with reference Figure 4 As shown, the method for preparing the conductive contact component in this embodiment includes the following steps: S201. An insulating component 1 is provided, the insulating component 1 having a plurality of mounting holes 11; S202. Stir the conductive particles 222 and the adhesive matrix 221 at a stirring speed of 20 rpm to 50 rpm for 30 to 60 minutes. After stirring and mixing, perform vacuum degassing.

[0091] S203. Place the conductive spring 21 into the mounting hole 11 and inject the conductive paste into the mounting hole 11 so that the conductive paste fills the mounting hole 11. S204. The conductive slurry injected into the insulating component 1 is cured to form the conductive component 22, thereby obtaining the conductive contact assembly.

[0092] In this embodiment, in step S202, a low stirring speed of 20 rpm (Revolutions Per Minute) to 50 rpm is used. This provides sufficient shear force to break up the agglomerates of conductive particles 222 while avoiding excessive centrifugal force or eddies caused by excessive speed, which could lead to the fractionation or reagglomeration of the conductive particles 222. Combined with a thorough mixing time of 30 to 60 minutes, this ensures that all conductive particles 222 are wetted and coated by the adhesive matrix 221, achieving a good uniform dispersion state and obtaining a stable, low-resistance conductive slurry.

[0093] In this embodiment, in step S202, maintaining a deep vacuum environment with an absolute pressure below 5 kPa (e.g., vacuum degree ≤ -0.095 MPa) for degassing can minimize the internal pressure of air bubbles entrained in the conductive slurry, making it easier for the bubbles to float, break, and be extracted under the combined action of stirring shear force and negative pressure. The combination of this vacuum degree with the duration and speed reduces the number of bubbles in the conductive slurry, resulting in better density and reliability of the conductive component 22 after curing.

[0094] In this embodiment, in step S202, the percentage of the mass of conductive particles 222 to the mass of the adhesive matrix 221 is controlled between 15% and 60%, for example, the mass of silver-plated carbon nanotubes accounts for 35% of the mass of silicone rubber. This parameter, combined with the above process combination, finds an optimal balance between ensuring mixing quality and preventing premature vulcanization or performance degradation of the adhesive matrix 221 caused by prolonged high-speed stirring. This ensures production efficiency while maintaining the rheological properties of the slurry and the final mechanical properties after curing.

[0095] In some embodiments, in conjunction with reference Figure 5 As shown, the method for preparing the conductive contact component in this embodiment includes the following steps: S301. An insulating component 1 is provided, the insulating component 1 having a plurality of mounting holes 11; S302. The conductive particles 222 are mixed with the uncured adhesive matrix 221 under vacuum to form a uniform conductive slurry. S303. Place the conductive spring 21 into the mounting hole 11 and inject the conductive paste into the mounting hole 11 so that the conductive paste fills the mounting hole 11. S304. The conductive paste in the mounting hole 11 is hot-pressed and vulcanized, with a molding temperature of 150°C to 180°C and a molding pressure of 5 MPa to 15 MPa.

[0096] In this embodiment, in step S304, within a temperature range of 150°C to 180°C, the adhesive matrix 221 (e.g., silicone rubber) can achieve a rapid and sufficient vulcanization crosslinking reaction, forming a stable three-dimensional network structure. This process simultaneously "solidifies" the uniformly dispersed conductive particles 222 in their final positions, ensuring that the conductive network around the spring is microscopically highly uniform and its position is fixed, thus guaranteeing the consistency of the electrical performance (especially high-frequency response) of the conductive contact component.

[0097] In this embodiment, the pressure of 5 MPa to 15 MPa in step S304 can eliminate the trace amounts of gas remaining in the conductive slurry and ensure that the conductive slurry tightly wraps around the conductive spring 21 in a liquid state, fully filling all gaps. After the conductive slurry cures, the conductive spring 21, conductive particles 222, and adhesive matrix 221 combine to form a dense, non-porous, and firmly bonded composite, significantly improving the mechanical strength, current carrying capacity, and long-term environmental reliability of the conductive unit 2.

[0098] In this embodiment, the simultaneous control of the temperature range (e.g., 150°C to 180°C) and pressure range (e.g., 5 MPa to 15 MPa) in step S304 represents an optimal process window between ensuring sufficient vulcanization, achieving optimal material properties, and preventing excessive temperature or pressure from causing annealing, deformation of the conductive spring 21, or degradation of the adhesive matrix 221. Combined with time parameters determined based on the thickness of the conductive component 22, precise control of the vulcanization degree for products of different specifications is achieved, optimizing the production cycle while ensuring quality.

[0099] For example, in step S304, the hot-press vulcanization time can be determined based on the total thickness of the conductive element 22, for example, vulcanization time of 5 to 15 minutes. Hot-press vulcanization in a mold allows for precise control of the final product's dimensions and the protrusion height H of each conductive unit 2. The mold's constraint ensures the high uniformity (coplanarity) of the end faces of all conductive units 2 in the array, which is crucial for achieving reliable contact at high density and multiple points. After demolding, the end faces of the conductive element 22 along the target axis Z are plasma-cleaned or laser-polished to expose fresh conductive surfaces, forming low-resistance electrode surfaces.

[0100] For example, the conductive contact component can be obtained according to the preparation method of this application.

[0101] In some embodiments, the conductive unit 2 has a cylindrical structure with a diameter between 0.2 mm and 0.6 mm. In its natural state, the axial length of the conductive unit 2 is 1 to 4 times its own diameter. The conductive particles 222 are silver-plated silicone rubber microspheres with a particle size ranging from 10 μm to 50 μm. The mass of the silver-plated silicone rubber microspheres accounts for 30-60% of the mass of the silicone rubber matrix. Testing shows that, within the compression stroke, thanks to the resilience of the conductive particles 222, a contact resistance of less than 15 mΩ can be achieved, with a resistance fluctuation range of less than ±10%.

[0102] In other embodiments, the conductive unit 2 is cylindrical, with a diameter between 0.3 and 1.0 mm. In its natural state, the axial length of the conductive unit 2 is 1 to 3 times its diameter. The conductive particles 222 are silver-plated carbon nanotubes. Due to their extremely high aspect ratio and the excellent conductivity provided by the silver plating layer, the silver-plated carbon nanotubes can construct a highly interconnected three-dimensional flexible conductive network within the adhesive matrix 221. The mass of the silver-plated carbon nanotubes accounts for 20% to 50% of the mass of the silicone rubber matrix. Testing has shown that this conductive contact component exhibits extremely low and stable contact resistance. The initial contact resistance can be below 5 mΩ, and the resistance value remains highly stable within a certain compression stroke. Furthermore, thanks to the synergistic effect of the flexibility of the silver-plated carbon nanotube network structure and the precise rebound force of the conductive spring 21, the electrical connection remains reliable after tens of thousands of insertion and removal cycles, with a low contact resistance decay rate, demonstrating excellent mechanical durability and environmental adaptability. Therefore, it can be used for precision miniature electrical connection interfaces with stringent requirements for contact resistance stability, insertion and removal life and space constraints.

[0103] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0104] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0105] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0106] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A conductive contact assembly, characterized in that, include: Insulating component with multiple mounting holes; Multiple conductive units are disposed in the mounting holes in a one-to-one correspondence. Each conductive unit includes a conductive spring and a conductive component. The conductive spring passes through the mounting hole, and the conductive component connects the conductive spring to the insulating component. The conductive component includes an adhesive matrix and conductive particles, wherein the conductive particles are uniformly distributed in the adhesive matrix.

2. The conductive contact assembly as described in claim 1, characterized in that, The conductive particles include a particle body and a conductive coating covering the particle body, wherein the particle body is made of an elastic material.

3. The conductive contact assembly as described in claim 1, characterized in that, The conductive spring has a target axis, a spring body, and two spring ends. The two spring ends are located on both sides of the spring body along the target axis. The spring body has a first radial dimension, and the spring ends have a second radial dimension. The first radial dimension is not less than the second radial dimension.

4. The conductive contact assembly as described in claim 3, characterized in that, The conductive spring has a first axial dimension along the target axis, and the conductive element has a second axial dimension along the target axis, the first axial dimension being larger than the second axial dimension, such that at least a portion of the spring end is exposed to the outside of the conductive element.

5. The conductive contact assembly as described in claim 1, characterized in that, The insulating component is made of an elastic material, the adhesive matrix is ​​made of an elastic material, and the Shore hardness of the insulating component is greater than that of the adhesive matrix.

6. The conductive contact assembly as described in claim 4, characterized in that, The insulating member has a third axial dimension along the target axis direction, the third axial dimension being smaller than the second axial dimension, so that at least a portion of the conductive unit is exposed on the outside of the insulating member; The conductive units are arranged in an array, with a center distance between adjacent conductive units. Each conductive unit has a protrusion height that protrudes from the insulating member along the target axis, and the center distance is not less than the protrusion height.

7. The conductive contact assembly as claimed in claim 1, characterized in that, The volume ratio of the conductive spring to the conductive particles is between 1:0.3 and 1:

2.

8. The conductive contact assembly as claimed in claim 1, characterized in that, The mass of the conductive particles accounts for 15% to 60% of the mass of the adhesive matrix.

9. A method for preparing a conductive contact component, characterized in that, Includes the following steps: An insulating component is provided, the insulating component having a plurality of mounting holes; Conductive particles are mixed with uncured adhesive matrix under vacuum to form a uniform conductive slurry. The conductive spring is placed in the mounting hole, and the conductive paste is injected into the mounting hole so that the conductive paste fills the mounting hole; The conductive slurry injected into the insulating component is cured to form a conductive component, thereby obtaining a conductive contact assembly.

10. The method for preparing the conductive contact component as described in claim 9, characterized in that, The conductive particles are vacuum-mixed with the uncured adhesive matrix, specifically including: The conductive particles are mixed with the adhesive matrix at a stirring speed of 20 rpm to 50 rpm for 30 to 60 minutes, and then the mixture is degassed under vacuum.

11. The method for preparing the conductive contact component as described in claim 9, characterized in that, The conductive slurry injected into the insulating component undergoes a curing process, specifically including: The conductive paste inside the mounting hole is subjected to hot-press vulcanization molding at a molding temperature of 150°C to 180°C and a molding pressure of 5 MPa to 15 MPa.

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