Microphone and electronic equipment

Abstract

The invention discloses a microphone and electronic equipment, and the microphone comprises a substrate which comprises an insulating main body and a conductive part, the insulating main body comprises a first surface and a second surface which are oppositely arranged, the conductive part is arranged on the insulating main body, at least part of the conductive part is located on the first surface, at least part of the conductive part is located on the second surface, and the insulating main body is made of a ceramic material; the shell is arranged on the first surface, and an accommodating cavity is defined by the shell and the substrate; the MEMS chip is positioned in the accommodating cavity and is electrically connected with the conductive part; the circuit board is arranged on the second surface, and the circuit board is electrically connected with the conductive part; the insulation main body is provided with a first sound inlet hole, and the waterproof film is arranged between the circuit board and the insulation main body and covers the first sound inlet hole. According to the technical scheme provided by the invention, a large-size waterproof film can be mounted, and the requirements of thinning and thinning of the microphone can be met.

Description

Technical Field

[0001] This application belongs to the field of electronic product technology, and also relates to a microphone and electronic device. Background Technology

[0002] With the trend towards thinner and lighter consumer electronics, the size, performance, and process adaptability of MEMS microphones, as key acoustic devices, have become a major bottleneck restricting the overall design of devices.

[0003] Currently, MEMS microphone packaging designs in the industry typically employ a printed circuit board and metal housing structure. To ensure mechanical strength, the printed circuit board is usually thickened, which increases the overall thickness of the microphone, making it difficult to meet the urgent need for a thinner and lighter design. Summary of the Invention

[0004] One object of this application is to provide a microphone and an electronic device.

[0005] According to a first aspect of the embodiments of this application, a microphone is provided, comprising: A substrate comprising an insulating body and a conductive element, the insulating body comprising a first surface and a second surface disposed opposite to each other, the conductive element being disposed on the insulating body, at least a portion of the conductive element being located on the first surface and at least a portion of the conductive element being located on the second surface, the insulating body being made of ceramic material; A housing, wherein the housing is disposed on the first surface and forms a receiving cavity with the substrate; A MEMS chip, wherein the MEMS chip is located in the receiving cavity and is electrically connected to the conductive element; A circuit board, wherein the circuit board is disposed on the second surface and is electrically connected to the conductive component; A waterproof membrane is provided, wherein the insulating body has a first sound inlet hole, and the waterproof membrane is disposed between the circuit board and the insulating body and covers the first sound inlet hole.

[0006] Optionally, the MEMS chip includes a first chip body and a first connection portion, the first connection portion being disposed on the first chip body and facing the first surface, and the first connection portion being electrically connected to the conductive element via solder paste.

[0007] Optionally, the MEMS chip includes a first chip body and a first connection portion, the first connection portion is disposed on the first chip body, the first connection portion does not face the first surface, and the first connection portion is electrically connected to the conductive element through a first wire.

[0008] Optionally, the microphone further includes an ASIC chip located in the receiving cavity and spaced apart from the MEMS chip, and the ASIC chip is electrically connected to the conductive element.

[0009] Optionally, the ASIC chip includes a second chip body and a second connection portion, the second connection portion being disposed on the second chip body and facing the first surface, and the second connection portion being electrically connected to the conductive element via solder paste.

[0010] Optionally, the ASIC chip includes a second chip body and a second connection portion, the second connection portion being disposed on the second chip body, the second connection portion not facing the first surface, and the second connection portion being electrically connected to the conductive element through a second wire.

[0011] Optionally, the circuit board has a second sound inlet, the first sound inlet and the second sound inlet are arranged opposite to each other, and the MEMS chip is opposite to the first sound inlet.

[0012] Optionally, the second surface has a first groove, and the waterproof membrane is disposed in the first groove.

[0013] Optionally, the circuit board has a second groove on the side facing the substrate, and the waterproof membrane is disposed in the second groove.

[0014] Optionally, the second surface has a first groove, and the circuit board has a second groove on the side facing the substrate. The first groove and the second groove are opposite each other. In the thickness direction of the waterproof membrane, part of the waterproof membrane is located in the first groove, and another part of the waterproof membrane is located in the second groove.

[0015] Optionally, the conductive element is located at one end of the second surface near one edge of the substrate and avoids the first groove.

[0016] According to a second aspect of the embodiments of this application, an electronic device is provided, including the microphone described above.

[0017] One technical advantage of this application embodiment is that the ceramic insulating body has extremely high rigidity, and the substrate hardly bends during the packaging process. Even under high temperature or mechanical stress, the substrate hardly bends, thus providing mechanical support for the MEMS chip. Furthermore, due to the extremely high rigidity of the ceramic insulating body, the insulating body can be made very thin (e.g., 0.1mm-0.3mm). While meeting the mechanical performance requirements, the circuit board needs to provide support, so the thickness of the circuit board can be reduced, thereby meeting the requirement for a thinner and lighter microphone. In addition, depending on the placement of the conductive components, a large-area waterproof membrane can be set on the insulating body to further improve the acoustic and waterproof performance of the microphone.

[0018] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0020] Figure 1 This is a schematic diagram of the microphone structure in an embodiment of this application; Figure 2 This is a schematic diagram of the microphone structure in an embodiment of this application; Figure 3 This is a schematic diagram of the microphone structure in an embodiment of this application; Figure 4 This is a schematic diagram of the microphone structure in an embodiment of this application; Figure 5 This is a schematic diagram of the substrate structure in an embodiment of this application; Figure 6 This is a schematic diagram of the structure of the substrate and circuit board in the embodiments of this application.

[0021] Figure labeling: Microphone 100; Substrate 1; Conductive element 11; First end 111; Second end 112; Insulating body 12; First sound inlet 121; First groove 122; First surface 123; Second surface 124; Circuit board 2; second sound inlet 21; second groove 22; Shell 3; Receiving cavity 31; MEMS chip 4; ASIC chip 5; Waterproof membrane 6; First conductor 7; Second conductor 8. Detailed Implementation

[0022] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0023] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0024] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0025] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0026] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0027] In the specification and claims of this invention, the terms "first" and "second" may explicitly or implicitly include one or more of those features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0028] In the description of this invention, it should be understood that if the terms "axial", "radial", etc., are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0030] like Figures 1-6 As shown, according to a first aspect of the embodiments of this application, a microphone 100 is provided, including a substrate 1, a housing 3, a MEMS chip 4, a circuit board 2, and a waterproof membrane 6; the substrate 1 includes an insulating body 12 and a conductive element 11, the insulating body 12 includes a first surface 123 and a second surface 124 disposed opposite to each other, the conductive element 11 is disposed on the insulating body 12, at least a portion of the conductive element 11 is located on the first surface 123, at least a portion of the conductive element 11 is located on the second surface 124, and the insulating body 12 is made of ceramic material; the housing 3 is disposed on the first surface 123 and forms a receiving cavity 31 with the substrate 1; the MEMS chip 4 is located in the receiving cavity 31 and is electrically connected to the conductive element 11; the circuit board 2 is disposed on the second surface 124 and is electrically connected to the conductive element 11; the insulating body 12 has a first sound inlet 121, and the waterproof membrane 6 is disposed between the circuit board 2 and the insulating body 12 and covers the first sound inlet 121.

[0031] like Figures 1-6 As shown, the microphone 100 includes a substrate 1, a housing 3, a MEMS chip 4, and a circuit board 2; wherein, the substrate 1 includes an insulating body 12 and a conductive element 11.

[0032] In one embodiment, the conductive element 11 is embedded inside the insulating body 12. The insulating body 12 has a first surface 123 and a second surface 124, which are opposite each other in the thickness direction of the insulating body 12. The conductive element 11 includes a first end 111 and a second end 112, with the first end 111 located on the first surface 123 and the second end 112 located on the second surface 124. The conductive element 11 can be made of copper, silver, or gold, while the insulating body 12 is made of ceramic. The housing 3 is disposed on the first surface of the insulating body 12. 123, the housing 3 and the substrate 1 form a receiving cavity 31, the MEMS chip 4 is located in the receiving cavity 31, and the MEMS chip 4 is electrically connected to the first end 111 of the conductive element 11. The MEMS chip 4 is disposed on the first surface 123, and the substrate 1 can provide support for the MEMS chip 4. The circuit board 2 is disposed outside the receiving cavity 31, the circuit board 2 is disposed on the second surface 124, and the circuit board 2 is electrically connected to the second end 112 of the conductive element 11, thereby realizing that the MEMS chip 4 can be electrically connected to the circuit board 2 through the substrate 1.

[0033] In another embodiment, a portion of the conductive element 11 is embedded inside the insulating body 12. A portion of the conductive element 11 is located on the first surface 123, and a portion of the conductive element 11 is also located on the second surface 124. The MEMS chip 4 is electrically connected to the portion of the conductive element 11 located on the first surface 123. The MEMS chip 4 is disposed on the first surface 123, and the substrate 1 can provide support for the MEMS chip 4. The circuit board 2 is disposed outside the receiving cavity 31, and the circuit board 2 is disposed on the second surface 124. The circuit board 2 is electrically connected to the portion of the conductive element 11 located on the second surface 123, thereby realizing that the MEMS chip 4 can be electrically connected to the circuit board 2 through the substrate 1.

[0034] To further explain, the waterproof membrane 6 can cover the first sound inlet 121. While ensuring that the MEMS chip 4 can sense external sounds, the waterproof membrane 6 can prevent external moisture or dust and other impurities from entering the receiving cavity 31 to protect the MEMS chip 4 and ensure the stability of the MEMS chip 4's operation. Furthermore, depending on the position of the conductive component 11, a large-area waterproof membrane 6 can be set on the insulating body 12 to further improve the microphone's acoustic and waterproof performance.

[0035] Among them, the waterproof membrane 6 can be a waterproof and breathable membrane. The waterproof and breathable membrane can allow sound waves to pass through, and can also prevent liquid or gaseous moisture such as water droplets and water vapor from entering the first sound inlet 121.

[0036] In this embodiment, the ceramic insulating body 12 has extremely high rigidity, and the substrate 1 will hardly bend during the packaging process. Even under high temperature or mechanical stress, the substrate 1 will hardly bend, thus providing mechanical support for the MEMS chip 4. Furthermore, due to the extremely high rigidity of the ceramic insulating body 12, the insulating body 12 can be made very thin (e.g., 0.1mm-0.3mm). While meeting the mechanical performance requirements, the circuit board 2 needs to provide support, so the thickness of the circuit board 2 can be reduced, thereby meeting the requirement of making the microphone 100 thinner and lighter.

[0037] The conductive component 11 and the insulating body 12 can be bonded together by a high-temperature sintering process to form a substrate 1. The substrate 1 can connect electronic components and is suitable for harsh environments such as high power, high frequency and high temperature, thereby enabling the microphone 100 to be used in relatively harsh environments.

[0038] In one embodiment, the circuit board 2 is provided with one or more connection terminals, and the second end 112 of the conductive element 11 is electrically connected to the connection terminal by conductive adhesive or solder paste.

[0039] like Figure 3 and Figure 4As shown, in one optional embodiment, the MEMS chip 4 includes a first chip body and a first connection portion. The first connection portion is disposed on the first chip body and faces the first surface 123. The first connection portion is electrically connected to the conductive element 11 via solder paste. Specifically, the first connection portion may include one, two, or more first pads. The first pads are disposed on the first chip body, and a corresponding number of first pads can be disposed on the first chip body as needed. The first chip body can be glued to the insulating body 12, and the first pads... Facing the first surface 123 of the insulating body 12, the first end 111 of the conductive element 11 is located on the first surface 123. Therefore, the first pad can be electrically connected to the first end 111 of the conductive element 11 through solder paste. In this embodiment, since the first end 111 of the conductive element 11 of the substrate 1 is located on the first surface 123, it is easier for the first pad of the MEMS chip 4 to be directly electrically connected to the first end 111 of the conductive element 11. This eliminates the need for wires and also reduces the height of the MEMS chip 4 in the receiving cavity 31, thereby reducing the thickness of the microphone 100 and making the microphone 100 thinner and lighter.

[0040] like Figure 1 and Figure 2 As shown, in an optional embodiment, the MEMS chip 4 includes a first chip body and a first connection portion. The first connection portion is disposed on the first chip body and does not face the first surface 123. The first connection portion is electrically connected to the conductive element 11 via a first wire 7. Specifically, the first connection portion may include one, two, or more first pads. The first pads are disposed on the first chip body, and a corresponding number of first pads can be disposed on the first chip body as needed. The first chip body can be glued to the first surface 123 of the insulating body 12. Since the first pads do not face the first surface 123 (for example, the first pads may face the side away from the first surface 123), the first pads need to be electrically connected to the first end 111 of the conductive element 11 via the first wire 7. In this embodiment, the MEMS chip 4 and the substrate 1 are electrically connected by the first wire 7, which allows the substrate 1 to be made into a universal component, eliminating the need to design conductive elements 11 at different positions according to different microphones 100.

[0041] The first conductor 7 can be a copper wire, a silver wire, or a gold wire.

[0042] like Figures 1-4As shown, in an optional embodiment, the microphone 100 further includes an ASIC chip 5, which is located in the receiving cavity 31 and spaced apart from the MEMS chip 4. The ASIC chip 5 is electrically connected to the conductive element 11. Specifically, the ASIC chip 5 is located in the receiving cavity 31, disposed on the first surface 123 of the insulating body 12, and electrically connected to the first end 111 of the conductive element 11, so that the ASIC chip 5 is electrically connected to the circuit board 2 through the substrate 1. Therefore, the ASIC chip 5 is also electrically connected to the MEMS chip 4.

[0043] Among them, MEMS chip 4 can convert mechanical motion into electrical signals to sense external sound signals and realize sound pickup of MEMS package structure; ASIC chip 5 can amplify, filter, digitize and other processes the raw signals collected by MEMS chip 4, and perform corresponding control operations according to the needs of the system.

[0044] Since both MEMS chip 4 and ASIC chip 5 generate heat during operation, the ASIC chip 5 and MEMS chip 4 are arranged at intervals on the insulating body 12, which can reduce the thermal coupling between MEMS chip 4 and ASIC chip 5, so as to avoid mutual interference between ASIC chip 5 and MEMS chip 4, thereby improving the working stability of ASIC chip 5 and MEMS chip 4.

[0045] like Figure 3 and Figure 4 As shown, in one optional embodiment, the ASIC chip 5 includes a second chip body and a second connection portion. The second connection portion is disposed on the second chip body and faces the first surface 123. The second connection portion is electrically connected to the conductive element 11 via solder paste. Specifically, the second connection portion may include one, two, or more second pads. The second pads are disposed on the second chip body, and a corresponding number of second pads can be disposed on the second chip body as needed. The second chip body can be attached to the insulating body 12 by adhesive, while the second pads... Facing the first surface 123 of the insulating body 12, the first end 111 of the conductive element 11 is located on the first surface 123. Therefore, the second pad can be electrically connected to the first end 111 of the conductive element 11 through solder paste. In this embodiment, since the first end 111 of the conductive element 11 of the substrate 1 is located on the first surface 123, it is easier for the second pad of the ASIC chip 5 to be directly electrically connected to the first end 111 of the conductive element 11. This eliminates the need for wires and also reduces the height of the ASIC chip 5 in the receiving cavity 31, thereby reducing the thickness of the microphone 100 and making the microphone 100 thinner and lighter.

[0046] like Figure 1 and Figure 2 As shown, in an optional embodiment, the ASIC chip 5 includes a second chip body and a second connecting portion. The second connecting portion is disposed on the second chip body and does not face the first surface 123. The second connecting portion is electrically connected to the conductive element 11 via a second wire 8. Specifically, the second connecting portion may include one, two, or more second pads. The second pads are disposed on the second chip body, and a corresponding number of second pads can be disposed on the second chip body as needed. The second chip body can be glued to the first surface 123 of the insulating body 12. Since the second pads do not face the first surface 123 (for example, the second pads may face the side away from the first surface 123), the second pads need to be electrically connected to the first end 111 of the conductive element 11 via the second wire 8. In this embodiment, the ASIC chip 5 and the substrate 1 are electrically connected by the second wire 8, which allows the substrate 1 to be made into a universal component, eliminating the need to design conductive elements 11 at different positions according to different microphones 100.

[0047] The second conductor 8 can be a copper wire, a silver wire, or a gold wire.

[0048] In one specific embodiment, the substrate 1 includes a plurality of conductive elements 11, each conductive element 11 including a first end 111 and a second end 112, the first end 111 being located on a first surface 123 and the second end 112 being located on a second surface 124; wherein, one conductive element 11 will only connect to either the MEMS chip 4 or the ASIC chip 5, therefore, a plurality of conductive elements 11 are provided to connect the MEMS chip 4 and the ASIC chip 5.

[0049] like Figure 3 and Figure 4 As shown, in one embodiment, the first connection portion of the MEMS chip 4 is electrically connected to the conductive element 11 via solder paste; the second connection portion of the ASIC chip 5 is electrically connected to the conductive element 11 via solder paste.

[0050] In one embodiment, the first connection portion of the MEMS chip 4 is electrically connected to the conductive element 11 via solder paste; the second connection portion of the ASIC chip 5 is electrically connected to the conductive element 11 via a second wire 8.

[0051] In one embodiment, the first connection portion of the MEMS chip 4 is electrically connected to the conductive element 11 via a first wire 7; the second connection portion of the ASIC chip 5 is electrically connected to the conductive element 11 via solder paste. like Figure 1 and Figure 2As shown, in one embodiment, the first connection portion of the MEMS chip 4 is electrically connected to the conductive element 11 via a first wire 7; the second connection portion of the ASIC chip 5 is electrically connected to the conductive element 11 via a second wire 8.

[0052] like Figures 1-4 As shown, in one optional embodiment, the insulating body 12 has a first sound inlet 121, the circuit board 2 has a second sound inlet 21, the first sound inlet 121 and the second sound inlet 21 are arranged opposite to each other, and the MEMS chip 4 is opposite to the first sound inlet 121; specifically, the insulating body 12 has a first sound inlet 121, which penetrates the first surface 123 and the second surface 124, and the circuit board 2 has a second sound inlet 21, which is opposite to the first sound inlet 121. The first sound inlet 121 and the second sound inlet 21 are arranged opposite each other, and the first sound inlet 121 and the second sound inlet 21 can be arranged concentrically. The first sound inlet 121 and the second sound inlet 21 are the channels for sound waves to enter the receiving cavity 31. The MEMS chip 4 is arranged opposite to the first sound inlet 121. Through the first sound inlet 121 and the second sound inlet 21, the MEMS chip 4 can sense external sound signals, thereby enabling the MEMS chip 4 to communicate with the external acoustic environment and enabling the MEMS chip 4 to perform its acoustic detection or acquisition function normally.

[0053] The waterproof membrane 6 is disposed between the insulating body 12 and the circuit board 2. Since the waterproof membrane 6 has poor hardness and rigidity, placing the waterproof membrane 6 between the insulating body 12 and the circuit board 2 can prevent the waterproof membrane 6 from contacting other components, thereby improving the reliability of the waterproof membrane 6.

[0054] like Figure 1 and Figure 4 As shown, in an optional embodiment, the second surface 124 has a first groove 122, and the waterproof membrane 6 is disposed in the first groove 122. Specifically, the second surface 124 has a first groove 122, the depth of the first groove 122 extends from the second surface 124 toward the first surface 123, the first sound inlet 121 communicates with the first groove 122, the waterproof membrane 6 is disposed in the first groove 122, and the edge of the waterproof membrane 6 is connected to the inner wall of the first groove 122. In this embodiment, by disposing of the waterproof membrane 6 in the first groove 122, the size occupied by the waterproof membrane 6 in the thickness direction of the microphone 100 can be reduced, thereby making the microphone 100 thinner and lighter.

[0055] like Figure 2 and Figure 3As shown, in an optional embodiment, the circuit board 2 has a second groove 22 on the side facing the substrate 1, and the waterproof membrane 6 is disposed in the second groove 22. Specifically, the circuit board 2 has a second groove 22 on the side facing the substrate 1, the depth of the second groove 22 extends from the side of the circuit board 2 away from the substrate 1, the second sound inlet 21 communicates with the second groove 22, the waterproof membrane 6 is disposed in the second groove 22, and the edge of the waterproof membrane 6 is connected to the inner wall of the second groove 22. In this embodiment, by disposing of the waterproof membrane 6 in the second groove 22, the size occupied by the waterproof membrane 6 in the thickness direction of the microphone 100 can be reduced, thereby making the microphone 100 thinner and lighter.

[0056] In one optional embodiment, the second surface 124 has a first groove 122, and the circuit board 2 has a second groove 22 on the side facing the substrate 1. The first groove 122 and the second groove 22 are opposite to each other. In the thickness direction of the waterproof membrane 6, a portion of the waterproof membrane 6 is located in the first groove 122, and another portion of the waterproof membrane 6 is located in the second groove 22. Specifically, the second surface 124 has a first groove 122, the depth of which extends from the second surface 124 toward the first surface 123. The first sound inlet 121 communicates with the first groove 122. The circuit board 2 has a second groove 22 on the side facing the substrate 1, and the depth of which extends from the circuit board 2 toward the side away from the substrate 1. The first groove 122 and the second groove 22 are arranged opposite to each other. In the thickness direction of the waterproof membrane 6, a portion of the waterproof membrane 6 is located in the first groove 122, and another portion of the waterproof membrane 6 is located in the second groove 22. The edges of the waterproof membrane 6 are connected to the inner walls of the first groove 122 and the second groove 22, respectively. In this embodiment, part of the waterproof membrane 6 is located in the first groove 122, and another part of the waterproof membrane 6 is located in the second groove 21. Compared with installing it separately in the first groove 122 or the second groove 21, the waterproof membrane 6 is installed together in the first groove 122 and the second groove 21. The first groove 122 opened on the insulating body 12 is thinner, and the second groove 21 opened on the circuit board 2 is thinner, thereby ensuring the structural strength of the substrate 1 and the structural strength of the circuit board 2.

[0057] like Figure 5 and Figure 6As shown, in an optional embodiment, one end of the conductive element 11 located on the second surface 124 is close to one edge of the substrate 1 and avoids the first groove 122; specifically, the second end 112 of the conductive element 11 located on the second end 112 surface is close to one edge of the substrate 1 and avoids the first groove 122. Since the second end 112 is close to the edge of the substrate 1, a second groove 22 with a larger area can be formed on the second surface 124 of the insulating body 12, thereby enabling the formation of a waterproof membrane 6 with a larger area to improve the acoustic and waterproof performance of the microphone 100.

[0058] According to a second aspect of the embodiments of this application, an electronic device is provided, including the microphone 100 described above.

[0059] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A microphone, characterized in that, include: A substrate comprising an insulating body and a conductive element, the insulating body comprising a first surface and a second surface disposed opposite to each other, the conductive element being disposed on the insulating body, at least a portion of the conductive element being located on the first surface and at least a portion of the conductive element being located on the second surface, the insulating body being made of ceramic material; A housing, wherein the housing is disposed on the first surface and forms a receiving cavity with the substrate; A MEMS chip, wherein the MEMS chip is located in the receiving cavity and is electrically connected to the conductive element; A circuit board, wherein the circuit board is disposed on the second surface and is electrically connected to the conductive component; A waterproof membrane is provided, wherein the insulating body has a first sound inlet hole, and the waterproof membrane is disposed between the circuit board and the insulating body and covers the first sound inlet hole.

2. The microphone according to claim 1, characterized in that, The MEMS chip includes a first chip body and a first connection portion. The first connection portion is disposed on the first chip body and faces the first surface. The first connection portion is electrically connected to the conductive element through solder paste.

3. The microphone according to claim 1, characterized in that, The MEMS chip includes a first chip body and a first connection portion. The first connection portion is disposed on the first chip body and does not face the first surface. The first connection portion is electrically connected to the conductive component through a first wire.

4. The microphone according to claim 1, characterized in that, The microphone also includes an ASIC chip, which is located in the receiving cavity and spaced apart from the MEMS chip, and is electrically connected to the conductive element.

5. The microphone according to claim 4, characterized in that, The ASIC chip includes a second chip body and a second connection portion. The second connection portion is disposed on the second chip body and faces the first surface. The second connection portion is electrically connected to the conductive component through solder paste.

6. The microphone according to claim 4, characterized in that, The ASIC chip includes a second chip body and a second connection portion. The second connection portion is disposed on the second chip body and does not face the first surface. The second connection portion is electrically connected to the conductive element through a second wire.

7. The microphone according to claim 1, characterized in that, The circuit board has a second sound inlet hole, and the first sound inlet hole and the second sound inlet hole are arranged opposite to each other. The MEMS chip is opposite to the first sound inlet hole.

8. The microphone according to claim 7, characterized in that, The second surface has a first groove, and the waterproof membrane is disposed in the first groove.

9. The microphone according to claim 7, characterized in that, The circuit board has a second groove on the side facing the substrate, and a waterproof membrane is disposed in the second groove.

10. The microphone according to claim 7, characterized in that, The second surface has a first groove, and the circuit board has a second groove on the side facing the substrate. The first groove and the second groove are opposite each other. In the thickness direction of the waterproof membrane, part of the waterproof membrane is located in the first groove, and another part of the waterproof membrane is located in the second groove.

11. The microphone according to claim 8 or 10, characterized in that, The conductive element is located at one end of the second surface near one edge of the substrate and avoids the first groove.

12. An electronic device, characterized in that, Includes the microphone as described in any one of claims 1-11.

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