Multi-layer printed PCB circuit board with efficient heat dissipation and use method of multi-layer printed PCB circuit board

Abstract

The invention discloses a multi-layer printed PCB (Printed Circuit Board) capable of efficiently dissipating heat and a use method of the multi-layer printed PCB. The circuit board has the beneficial effects that when the circuit board is mounted in the mounting shell, the insertion rod is inserted into the insertion groove in the limiting plate in a pressing manner, so that the circuit board body can be quickly limited through the matching of the clamping head and the clamping hole when the insertion rod is inserted into the insertion groove, and the circuit board body can be quickly mounted; meanwhile, when the circuit board body is disassembled, the two shifting plates on the same limiting plate are moved close to each other, so that the clamping heads can be moved out of the clamping holes under the action of the shifting plates and the pull rods, and the insertion rods are ejected outwards on the ejection plate and the second spring, so that the circuit board body is quickly disassembled; meanwhile, under the action of the heat dissipation mechanism, the heat dissipation area is increased, the heat uniformizing and structure supporting effects are further achieved, a point heat source is rapidly diffused into a surface heat source, then the surface heat source is efficiently guided to the heat dissipation aluminum plate at the bottom, a high-temperature area is not prone to being formed below the circuit board body, and the overall heat dissipation efficiency is higher.

Description

Technical Field

[0001] This invention relates to the field of multilayer printed circuit board technology, and in particular to a multilayer printed circuit board with high heat dissipation and its usage method. Background Technology

[0002] A multilayer printed circuit board (PCB) is a type of circuit board made of alternating layers of conductive and insulating materials. This PCB structure typically consists of three or more conductive layers interconnected by vias (such as through-holes, blind vias, or buried vias) to enable complex circuit designs. Multilayer PCBs offer higher circuit density and more compact design space, and are widely used in high-end electronic devices.

[0003] Existing multilayer printed circuit boards (PCBs) are primarily secured to the chassis or heat sink using multiple screws. Tightening all screws is necessary to ensure uniform pressure at the heat dissipation interface, a cumbersome and time-consuming process. This necessitates the use of additional tools during assembly and disassembly, resulting in numerous steps, low efficiency, and risks of screw stripping or loss. Uneven tightening torque can also negatively impact heat dissipation. Furthermore, existing multilayer PCBs rely on a single thermal pad to conduct heat from the PCB to the chassis, or utilize small, isolated onboard heat sinks. This results in a single heat conduction path and insufficient lateral diffusion, easily leading to localized high-temperature zones below the heat source and overall low heat dissipation efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a multilayer printed PCB with high heat dissipation and its usage method in order to solve the above-mentioned problems.

[0005] The present invention achieves the above objectives through the following technical solutions:

[0006] A high-efficiency heat dissipation multilayer printed circuit board includes a mounting housing. A circuit board body is mounted in the center of the mounting housing. Two limiting plates are parallel to each other on both sides of the bottom end of the mounting housing. A limiting component is installed between each limiting plate and the bottom end of the circuit board body. The limiting component includes slots symmetrically formed on both sides of the top of the limiting plate. A plug rod is installed at the bottom end of the circuit board body where it mates with the slot. A locking hole is formed on the lower part of one side wall of the plug rod, and a locking head is installed in the locking hole. A pull rod is installed on the middle part of the side wall of the locking head facing away from the locking hole. A sliding cavity is reserved on the limiting plate where it mates with the locking head. A spring is installed between the locking head and the sliding cavity. A lever is connected to the side of the pull rod facing away from the locking head. The limiting plate has a groove at the part that mates with the lever plate. A push assembly is also installed at the bottom of the slot. The push assembly includes a spring 2 installed in the middle of the bottom of the slot. A top plate is connected to the top of the spring 2. A heat dissipation mechanism is also installed together at the bottom of the circuit board body and the middle of the bottom of the mounting housing. The heat dissipation mechanism includes a silicone mesh pad installed at the bottom of the circuit board body. A heat-conducting aluminum plate is installed parallel to the bottom of the silicone mesh pad. A heat dissipation aluminum plate is connected to the bottom of the heat-conducting aluminum plate. An air jet cover is installed at the bottom of the mounting housing on the side of the heat dissipation rib plate on the heat dissipation aluminum plate. A nozzle is installed on the side wall of the air jet cover facing the heat dissipation aluminum plate. A blower is installed on the side wall of the air jet cover facing away from the heat dissipation aluminum plate.

[0007] Furthermore, a support column is installed at each of the four corners of the bottom of the mounting housing, and the support column is bolted to the mounting housing.

[0008] By adopting the above technical solution, the support column can not only support the mounting housing, but also allow for a certain gap between the bottom of the mounting housing and the mounting base surface, so as to facilitate convenient heat dissipation of the circuit board body.

[0009] Furthermore, the limiting plate is bolted to the mounting housing, the insertion rod is bolted to the circuit board body, and the bottom ends of the insertion rod have beveled structures on both sides.

[0010] By adopting the above technical solution, after the insertion rod is reliably connected to the circuit board body, it can be conveniently inserted into the limiting plate.

[0011] Furthermore, the mating part between the card head and the bottom of the insertion rod is also a beveled structure, and the card hole is opened on the side wall of the insertion rod, the size of the card hole matching the size of the card head.

[0012] By adopting the above technical solution, when the insertion rod is inserted into the slot, the inclined surface at the bottom of the insertion rod will squeeze the locking head, causing the locking head to retract into the sliding cavity. After the locking head retracts into the sliding cavity, as the insertion rod continues to move downward until the locking hole is aligned with the locking head, the locking head will be reset and inserted into the locking hole under the action of the spring. Thus, by means of the locking head cooperating with the locking hole, the insertion rod is reliably limited after being inserted into the slot.

[0013] Furthermore, the pull rod is welded to the clamp head, the pull rod passes through the spring, one end of the spring is welded to the clamp head, the other end of the spring is welded to the sliding cavity, and the clamp head slides in conjunction with the sliding cavity.

[0014] By adopting the above technical solution, the pull rod is mainly used to ensure the stable sliding of the chuck head, and the spring is mainly used to realize the automatic rebound and reset of the chuck head after retraction.

[0015] Furthermore, the pull rod is slidably engaged with the limiting plate, the lever plate is slidably engaged with the lever groove, and the lever plate is welded to the pull rod.

[0016] By adopting the above technical solution, the lever can be actively moved with the help of the dial plate, so as to facilitate the easy removal of the clip from the clip hole and make it convenient to quickly disassemble the circuit board body.

[0017] Furthermore, the top plate slides into the slot, and the height of the top plate after normal lifting is lower than the height of the sliding cavity. The top end of the second spring is welded to the top plate, and the bottom end of the second spring is welded to the slot.

[0018] By adopting the above technical solution, when the limiting position of the card head and the card hole is released, the top plate will be lifted up under the action of the second spring, so that the insertion rod will be lifted from the slot at the same time as the top plate is lifted, so as to facilitate the convenient disassembly of the circuit board body.

[0019] Furthermore, the silicone mesh pad is bonded to both the circuit board body and the thermally conductive aluminum plate. The silicone mesh pad has a porous structure. The thermally conductive aluminum plate is welded to the heat dissipation aluminum plate. The main body thickness of the heat dissipation aluminum plate is the same as the thickness of the mounting housing. The heat dissipation ribs on the heat dissipation aluminum plate are located on the outside of the mounting housing.

[0020] By adopting the above technical solution, the silicone pad ensures thermal conductivity while also taking into account compressibility and tolerance, ensuring full contact with the uneven back of the PCB, and enabling the heat on the circuit board body to be quickly transferred to the heat-conducting aluminum plate.

[0021] Furthermore, the jet shroud is bolted to the mounting housing, the blower is connected to the jet shroud via a pipe, and the heat dissipation ribs on the heat dissipation aluminum plate are located between two adjacent rows of nozzles.

[0022] By adopting the above technical solution, the blower blows air into the jet hood, so that the gas is blown into the gap between the heat dissipation aluminum plates through the nozzle on the jet hood, thereby accelerating the air flow between the heat dissipation fins on the heat dissipation aluminum plates and realizing the efficient heat dissipation of the heat dissipation aluminum plates, which facilitates the rapid dissipation of heat transferred to the circuit board body.

[0023] The beneficial effects of this invention are as follows:

[0024] 1. To address the current issue that multilayer printed circuit boards (PCBs) are typically secured to the housing or heat sink using multiple screws, requiring all screws to be tightened to ensure uniform pressure at the heat dissipation interface—a cumbersome and time-consuming process—this invention addresses these problems. The design utilizes a combination of a limiting component and a pushing component. When installing the PCB within the housing, simply press the insert rod into the slot on the limiting plate. The insert rod then engages with the locking mechanism. The locking holes enable quick positioning of the circuit board body, facilitating its rapid installation. Conversely, during disassembly, simply moving the two levers on the same limiting plate closer together allows the locking head to move out of the locking hole under the action of the levers and pull rod, causing the insertion rod to push outwards from the top plate and spring, thus achieving rapid disassembly of the circuit board body. Because the circuit board body is disassembled and assembled by direct pressing and levering, the cumbersome operation of external tools is avoided, resulting in higher disassembly and assembly efficiency and avoiding the drawbacks of screw installation, such as stripping and loss.

[0025] 2. To address the shortcomings of existing multilayer printed circuit boards (PCBs), which primarily rely on a single thermal pad to conduct heat from the PCB to the chassis, or use small, isolated onboard heat sinks, resulting in a single heat conduction path, insufficient lateral diffusion, and the formation of localized high-temperature zones below the heat source, leading to low overall heat dissipation efficiency, this invention utilizes a silicone mesh pad in the heat dissipation mechanism in conjunction with parallel-arranged thermally conductive aluminum plates. This not only ensures heat conduction while also considering compressibility and tolerance, guaranteeing full contact with the uneven back of the PCB, but also increases the heat dissipation area, providing both uniform heat distribution and structural support. This rapidly diffuses point heat sources into surface heat sources, efficiently guiding them to the bottom heat dissipation aluminum plates. The bottom heat dissipation aluminum plates then dissipate heat quickly under the action of a blower, air hood, and nozzles, thus preventing the formation of high-temperature zones below the circuit board and resulting in higher overall heat dissipation efficiency. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a multilayer printed PCB circuit board with high-efficiency heat dissipation according to the present invention;

[0027] Figure 2 This is a right sectional view of a multilayer printed PCB circuit board with high-efficiency heat dissipation as described in this invention.

[0028] Figure 3 This is a front cross-sectional view of a multilayer printed PCB circuit board with high-efficiency heat dissipation as described in this invention.

[0029] Figure 4 This is a top sectional view of the limiting plate in a multilayer printed PCB circuit board with high-efficiency heat dissipation as described in this invention.

[0030] Figure 5 This invention relates to a multilayer printed PCB circuit board with high-efficiency heat dissipation. Figure 2 Enlarged view of point A in the middle;

[0031] Figure 6 This invention relates to a multilayer printed PCB circuit board with high-efficiency heat dissipation. Figure 4 Enlarged view of point B in the middle;

[0032] Figure 7 This is a bottom view of the heat dissipation aluminum plate in a multilayer printed PCB circuit board with high-efficiency heat dissipation as described in this invention.

[0033] The annotations in the attached figures are explained as follows:

[0034] 1. Circuit board body; 2. Mounting housing; 3. Support column; 4. Heat dissipation mechanism; 401. Blower; 402. Jet hood; 403. Nozzle; 404. Heat dissipation aluminum plate; 405. Heat-conducting aluminum plate; 406. Silicone mesh pad; 5. Limiting assembly; 501. Slot; 502. Insert rod; 503. Locking hole; 504. Locking head; 505. Sliding cavity; 506. Spring one; 507. Pull rod; 508. Slot; 509. Slide plate; 6. Pushing assembly; 601. Top plate; 602. Spring two; 7. Limiting plate. Detailed Implementation

[0035] The present invention will be further described below with reference to the accompanying drawings:

[0036] like Figures 1-7 As shown, a high-efficiency heat dissipation multilayer printed PCB circuit board includes a mounting housing 2. A circuit board body 1 is mounted in the center of the mounting housing 2. Two limiting plates 7 are parallel to each other on both sides of the bottom end of the mounting housing 2. A limiting component 5 is installed between each limiting plate 7 and the bottom end of the circuit board body 1. The limiting component 5 includes slots 501 symmetrically opened on both sides of the top of the limiting plate 7. A plug rod 502 is installed at the bottom end of the circuit board body 1 where it mates with the slots 501. A locking hole 503 is opened on the lower part of one side wall of the plug rod 502. A locking head 504 is installed in the locking hole 503. A pull rod 507 is installed on the middle of the side wall of the locking head 504 facing away from the locking hole 503. A sliding cavity 505 is reserved on the limiting plate 7 where it mates with the locking head 504. A spring 506 is installed between the locking head 504 and the sliding cavity 505. A lever 509 is connected to the side of the pull rod 507 facing away from the locking head 504. The limiting plate 7 has a groove 508 at the part that mates with the lever plate 509. A push assembly 6 is also installed at the bottom of the slot 501. The push assembly 6 includes a second spring 602 installed in the middle of the bottom of the slot 501. The top of the second spring 602 is connected to a top plate 601. A heat dissipation mechanism 4 is also jointly installed at the bottom of the circuit board body 1 and the middle of the bottom of the mounting housing 2. The heat dissipation mechanism 4 includes a heat sink installed at the bottom of the circuit board body 1. A silicone mesh pad 406 is provided, with a thermally conductive aluminum plate 405 mounted parallel to its bottom end. A heat-dissipating aluminum plate 404 is connected to the bottom end of the thermally conductive aluminum plate 405. An air jet shroud 402 is mounted on the bottom end of the mounting housing 2, located on the side of the heat dissipating ribs on the heat dissipating aluminum plate 404. A nozzle 403 is mounted on the side wall of the air jet shroud 402 facing the heat dissipating aluminum plate 404, and a blower 401 is mounted on the side wall of the air jet shroud 402 facing away from the heat dissipating aluminum plate 404.

[0037] In this embodiment, a support column 3 is also installed at each of the four corners of the bottom of the mounting housing 2. The support column 3 is bolted to the mounting housing 2. The support column 3 can not only support the mounting housing 2, but also make a certain gap between the bottom of the mounting housing 2 and the mounting base surface, so as to facilitate the heat dissipation of the circuit board body 1.

[0038] In this embodiment, the limiting plate 7 is bolted to the mounting housing 2, and the insertion rod 502 is bolted to the circuit board body 1. The bottom ends of the insertion rod 502 have beveled structures on both sides. After the insertion rod 502 is reliably connected to the circuit board body 1, it can be conveniently inserted into the limiting plate 7.

[0039] In this embodiment, the mating part between the locking head 504 and the bottom of the insertion rod 502 is also a beveled structure. The locking hole 503 is formed on the side wall of the insertion rod 502. The size of the locking hole 503 matches the size of the locking head 504. When the insertion rod 502 is inserted into the slot 501, the beveled bottom of the insertion rod 502 will squeeze the locking head 504, causing the locking head 504 to retract into the sliding cavity 505. After the locking head 504 retracts into the sliding cavity 505, as the insertion rod 502 continues to move down until the locking hole 503 is directly opposite the locking head 504, the locking head 504 will be reset and inserted into the locking hole 503 under the action of the spring 506. Thus, by means of the locking head 504 and the locking hole 503, the reliable positioning of the insertion rod 502 after being inserted into the slot 501 is achieved.

[0040] In this embodiment, the pull rod 507 is welded to the clamp head 504, the pull rod 507 passes through the spring 506, one end of the spring 506 is welded to the clamp head 504, and the other end of the spring 506 is welded to the sliding cavity 505. The clamp head 504 and the sliding cavity 505 are slidably engaged. The pull rod 507 is mainly used to ensure the stable sliding of the clamp head 504, and the spring 506 is mainly used to realize the automatic springback reset of the clamp head 504 after retraction.

[0041] In this embodiment, the pull rod 507 is slidably engaged with the limiting plate 7, the dial plate 509 is slidably engaged with the dial groove 508, and the dial plate 509 is welded to the pull rod 507. With the help of the dial plate 509, the pull rod 507 can be actively moved so that the clip 504 can be easily removed from the clip hole 503, so as to facilitate the quick disassembly of the circuit board body 1.

[0042] In this embodiment, the top plate 601 is slidably engaged with the slot 501. The height of the top plate 601 after normal lifting is lower than the height of the sliding cavity 505. The top end of the second spring 602 is welded to the top plate 601, and the bottom end of the second spring 602 is welded to the slot 501. When the limiting at the locking head 504 and the locking hole 503 is released, the top plate 601 will be lifted up under the action of the second spring 602, so that the insertion rod 502 will be lifted out of the slot 501 at the same time as the top plate 601 is lifted, so as to facilitate the convenient disassembly of the circuit board body 1.

[0043] In this embodiment, the silicone mesh pad 406 is bonded to both the circuit board body 1 and the thermally conductive aluminum plate 405. The silicone mesh pad 406 has a porous structure. The thermally conductive aluminum plate 405 is welded to the heat dissipation aluminum plate 404. The main body thickness of the heat dissipation aluminum plate 404 is the same as the thickness of the mounting housing 2. The heat dissipation ribs on the heat dissipation aluminum plate 404 are located on the outside of the mounting housing 2. The silicone mesh pad 406 ensures thermal conductivity while also taking into account compressibility and tolerance, ensuring full contact with the uneven back of the PCB and enabling the heat from the circuit board body 1 to be quickly transferred to the thermally conductive aluminum plate 405.

[0044] In this embodiment, the jet hood 402 is bolted to the mounting housing 2, and the blower 401 is connected to the jet hood 402 via a pipe. The heat dissipation ribs on the heat dissipation aluminum plate 404 are located between two adjacent rows of nozzles 403. The blower 401 blows air into the jet hood 402 so that the air is blown into the gaps between the heat dissipation aluminum plates 404 through the nozzles 403 on the jet hood 402, thereby accelerating the airflow between the heat dissipation ribs on the heat dissipation aluminum plate 404, achieving efficient heat dissipation of the heat dissipation aluminum plate 404, and facilitating the rapid dissipation of heat transferred to the circuit board body 1.

[0045] A method for using a high-efficiency heat dissipation multilayer printed PCB circuit board: When installing the circuit board body 1 into the mounting housing 2, the insertion rod 502 is first inserted into the slot 501 on the limiting plate 7 by pressing. Simultaneously, the insertion rod 502 pushes the locking head 504 into the sliding cavity 505 until the locking hole 503 is aligned with the locking head 504. The locking head 504 then inserts into the locking hole 503 under the action of the spring 506, thus realizing the insertion rod 502's... 2. Reliable positioning in the slot 501. At this time, the second spring 602 is in a compressed state. When the circuit board body 1 is disassembled, the two levers 509 on the same limiting plate 7 are first moved closer to each other. As the levers 509 move closer to each other, the pull rod 507 will move the clip 504 out of the clip hole 503, thereby releasing the positioning of the insertion rod 502. After the positioning of the insertion rod 502 is released, the top plate 601 and the second spring 602 will push the insertion rod 502 outward. This allows for quick disassembly of the circuit board body 1. Since the circuit board body 1 is disassembled and assembled by direct pressing and lifting, the cumbersome operation using external tools is avoided, thus increasing the efficiency of disassembly and assembly and avoiding the drawbacks of screw installation, such as stripping and loss. Simultaneously, when the circuit board body 1 is in use, the silicone mesh pad 406 can quickly transfer heat from the circuit board body 1 to the heat-conducting aluminum plate 405, which then transfers the heat to the heat dissipation layer. When heat is transferred to the heat dissipation fins on the aluminum plate 404, it can be quickly dissipated to the outside. While the aluminum plate 404 is dissipating heat, the blower 401, the jet hood 402, and the nozzle 403 blow air onto the aluminum plate 404, thereby accelerating the rapid airflow at the heat dissipation fins on the lower side of the aluminum plate 404, so as to achieve rapid heat dissipation of the aluminum plate 404. This makes it less likely for a high-temperature area to form under the circuit board body 1, and the overall heat dissipation efficiency is higher.

[0046] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multilayer printed PCB circuit board with high-efficiency heat dissipation, characterized in that: The system includes a mounting housing (2), in which a circuit board body (1) is mounted in the center. Two limiting plates (7) are mounted parallel to each other on both sides of the bottom end of the mounting housing (2). A limiting component (5) is installed between each limiting plate (7) and the bottom end of the circuit board body (1). The limiting component (5) includes slots (501) symmetrically opened on both sides of the top of the limiting plate (7). A plug (502) is installed at the bottom end of the circuit board body (1) where it mates with the slot (501). A locking hole (503) is provided on the lower part of one side wall. A locking head (504) is installed in the locking hole (503). A pull rod (507) is installed on the middle part of the side wall of the locking head (504) opposite to the locking hole (503). A sliding cavity (505) is reserved on the limiting plate (7) at the part that mates with the locking head (504). A spring (506) is installed between the locking head (504) and the sliding cavity (505). A lever plate (509) is connected to the side of the pull rod (507) opposite to the locking head (504). The limiting plate (7) has... A groove (508) is provided at the part that mates with the dial plate (509). A push assembly (6) is also installed at the bottom of the slot (501). The push assembly (6) includes a second spring (602) installed in the middle of the bottom of the slot (501). The top of the second spring (602) is connected to a top plate (601). A heat dissipation mechanism (4) is also installed together at the bottom of the circuit board body (1) and the middle of the bottom of the mounting housing (2). The heat dissipation mechanism (4) includes a silicone mesh pad installed at the bottom of the circuit board body (1). (406) A thermally conductive aluminum plate (405) is installed parallel to the bottom end of the silicone mesh pad (406). A heat dissipation aluminum plate (404) is connected to the bottom end of the thermally conductive aluminum plate (405). An air jet hood (402) is installed on the side of the heat dissipation rib plate on the heat dissipation aluminum plate (404) at the bottom end of the mounting housing (2). A nozzle (403) is installed on the side wall of the air jet hood (402) facing the heat dissipation aluminum plate (404). A blower (401) is installed on the side wall of the air jet hood (402) facing away from the heat dissipation aluminum plate (404).

2. The high-efficiency heat dissipation multilayer printed PCB circuit board according to claim 1, characterized in that: At the four corners of the bottom of the mounting housing (2), a support column (3) is installed, and the support column (3) is bolted to the mounting housing (2).

3. The high-efficiency heat dissipation multilayer printed PCB circuit board according to claim 1, characterized in that: The limiting plate (7) is bolted to the mounting housing (2), the plug rod (502) is bolted to the circuit board body (1), and the bottom ends of the plug rod (502) are inclined structures on both sides.

4. The high-efficiency heat dissipation multilayer printed PCB circuit board according to claim 3, characterized in that: The part where the card head (504) and the bottom of the insertion rod (502) meet is also a beveled structure. The card hole (503) is opened on the side wall of the insertion rod (502), and the size of the card hole (503) matches the size of the card head (504).

5. The high-efficiency heat dissipation multilayer printed PCB circuit board according to claim 4, characterized in that: The pull rod (507) is welded to the clamp (504), the pull rod (507) passes through the spring (506), one end of the spring (506) is welded to the clamp (504), the other end of the spring (506) is welded to the slide cavity (505), and the clamp (504) and the slide cavity (505) are in sliding engagement.

6. The multilayer printed PCB circuit board with high-efficiency heat dissipation according to claim 5, characterized in that: The pull rod (507) is slidably engaged with the limiting plate (7), the dial plate (509) is slidably engaged with the dial groove (508), and the dial plate (509) is welded to the pull rod (507).

7. The multilayer printed PCB circuit board with high-efficiency heat dissipation according to claim 1, characterized in that: The top plate (601) is slidably engaged with the slot (501). The height of the top plate (601) after normal lifting is lower than the height of the sliding cavity (505). The top end of the second spring (602) is welded to the top plate (601), and the bottom end of the second spring (602) is welded to the slot (501).

8. The multilayer printed PCB circuit board with high-efficiency heat dissipation according to claim 1, characterized in that: The silicone mesh pad (406) is bonded to the circuit board body (1) and the thermally conductive aluminum plate (405). The silicone mesh pad (406) has a porous structure. The thermally conductive aluminum plate (405) is welded to the heat dissipation aluminum plate (404). The thickness of the main body of the heat dissipation aluminum plate (404) is the same as the thickness of the mounting housing (2). The heat dissipation ribs on the heat dissipation aluminum plate (404) are located on the outside of the mounting housing (2).

9. A multilayer printed PCB with high-efficiency heat dissipation according to claim 8, characterized in that: The jet hood (402) is bolted to the mounting housing (2), the blower (401) is connected to the jet hood (402) through a pipe, and the heat dissipation ribs on the heat dissipation aluminum plate (404) are located between two adjacent rows of nozzles (403).

10. A method of using a high-efficiency heat-dissipating multilayer printed PCB circuit board, applied to the high-efficiency heat-dissipating multilayer printed PCB circuit board according to any one of claims 1 to 9, characterized in that: When installing the circuit board body (1) into the mounting housing (2), the insert rod (502) is first inserted into the slot (501) on the limiting plate (7) by pressing. As the insert rod (502) is inserted into the slot (501), the locking head (504) is pressed into the sliding cavity (505). This continues until the locking hole (503) is aligned with the locking head (504). The locking head (504) is then inserted into the locking hole (503) under the action of the spring (506), thus allowing the insert rod (502) to be positioned within the slot (501). The reliable limit is in the circuit board body (1). At this time, the second spring (602) is in a compressed state. When the circuit board body (1) is disassembled, the two dial plates (509) on the same limiting plate (7) are first moved closer to each other. When the dial plates (509) move closer to each other, the pull rod (507) will move the clip (504) out of the clip hole (503) so that the limit at the insertion rod (502) is released. After the limit at the insertion rod (502) is released, the insertion rod (502) will be pushed outward by the top plate (601) and the second spring (602). This allows for the rapid disassembly of the circuit board body (1). Since the circuit board body (1) is disassembled and assembled by directly pressing and lifting, the cumbersome operation of using external tools is avoided, thus making the disassembly and assembly of the circuit board body (1) more efficient and avoiding the drawbacks of stripping and loss that exist with screw installation. At the same time, when the circuit board body (1) is in use, the silicone mesh pad (406) can quickly transfer the heat on the circuit board body (1) to the heat-conducting aluminum plate (405), and the heat-conducting aluminum plate (405) will transfer the heat to the heat dissipation aluminum plate. (404) When the heat is transferred to the heat dissipation fins on the heat dissipation aluminum plate (404), it can be quickly dissipated to the outside. While the heat dissipation aluminum plate (404) is dissipating heat, the blower (401), the jet hood (402) and the nozzle (403) will blow air onto the heat dissipation aluminum plate (404), thereby accelerating the rapid flow of air at the heat dissipation fins on the lower side of the heat dissipation aluminum plate (404) to achieve rapid heat dissipation of the heat dissipation aluminum plate (404), so that a high temperature area is not easily formed under the circuit board body (1), and the overall heat dissipation efficiency is higher.

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