Manufacturing method of multi-layer precise thick copper circuit board
The fabrication equipment for multi-layer precision thick copper circuit boards enables efficient screening, positioning, and dust removal of circuit boards, solving the problems of circuit board yield and drilling accuracy, improving production efficiency, and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-31
- Publication Date
- 2026-04-07
AI Technical Summary
In the existing technology, circuit boards that are not sized properly cannot be detected in time during the blanking process, which leads to a decrease in yield, affects drilling accuracy, and causes drilling position to deviate, increasing costs and wasting time.
A fabrication apparatus for multilayer precision thick copper circuit boards was designed, including positioning, screening, collection, dust removal, and drilling devices. A transport device screens qualified and unqualified circuit boards, a positioning device prevents drilling position deviation, and a dust removal device removes debris to improve drilling accuracy.
It improved the yield of circuit boards, reduced industrial cost waste, increased work efficiency and drilling accuracy, and reduced personnel costs and time waste.
Smart Images
Figure CN121815562A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board manufacturing technology, specifically to a method for manufacturing a multilayer precision thick copper circuit board. Background Technology
[0002] Circuit boards, or PCBs for short, are one of the most important components of electronic products. Due to the repeatability and consistency of their patterns, PCBs reduce wiring and assembly errors, saving time on equipment maintenance, debugging, and inspection. Their designs can be standardized, facilitating interchangeability; their high wiring density, small size, and light weight contribute to the miniaturization of electronic devices; they also facilitate mechanized and automated production, improving labor productivity and reducing the cost of electronic equipment. Ultra-thick copper circuit boards refer to circuit boards with an inner conductive circuit layer thickness greater than or equal to 100µm. Ultra-thick copper circuit boards offer advantages such as the ability to carry high currents and excellent heat dissipation, better meeting the demands of high-end markets such as the automotive electronics industry, and possess significant market development potential.
[0003] In the existing technology, during the circuit board cutting process, circuit boards that are not the right size cannot be inspected in time, which leads to unqualified circuit boards being drilled directly, resulting in a decrease in the yield of the circuit boards. If unqualified circuit boards are not sorted and packaged in time, it will reduce the work efficiency of personnel, increase labor costs and waste time. Furthermore, if qualified circuit boards are not fixed in position, the position will be offset during the drilling process, affecting the drilling accuracy. Since a large amount of debris will be generated during drilling, it will further affect the drilling accuracy, making the circuit boards unusable and increasing product costs. Summary of the Invention
[0004] To address the shortcomings of existing technologies, the technical solution adopted by this invention is as follows: a fabrication device for multilayer precision thick copper circuit boards, comprising a box, a packaging device fixedly connected to the outer surface of the box, a collection device fixedly connected to the upper surface of the packaging device, a transport device fixedly connected to the upper surface of the box, an adsorption device at the bottom of the transport device, a dust removal device fixedly connected to the upper surface of the adsorption device, a positioning device slidably connected to the outer surface of the dust removal device, a drilling device at the top of the positioning device, and a motor at the bottom of the drilling device; The positioning device includes a turntable, a fixing block fixedly connected to the lower surface of the turntable, a spring fixedly connected to the inner surface of the fixing block, the outer surface of the spring slidably connected to the lower surface of the turntable, a fixedly connected sliding block fixedly connected to the outer surface of the spring, a pull rod fixedly connected to the lower surface of the sliding block, an arc-shaped plate provided at the top of the pull rod, the outer surface of the arc-shaped plate fixedly connected to the outer surface of the sliding block, a slide rail provided in the wall of the turntable, the outer surface of the slide rail slidably connected to the outer surface of the sliding block, and the outer surface of the arc-shaped plate slidably connected to the upper surface of the turntable. The pull rod drives the sleeve to rotate on the sleeve, one end of the pull rod is connected to the sliding block, and the arc-shaped plate moves along the slide rail through the sliding block. The circuit board is positioned together by the baffle and the arc-shaped plate.
[0005] Preferably, the housing contains a generator box, the inner surface of which is rotatably connected to a rotating shaft. A cylinder is fixedly connected to the outer surface of the rotating shaft, and a lifting platform is fixedly connected to the outer surface of the cylinder. A slanted wheel is fixedly connected to the outer surface of the rotating shaft. A driven wheel is located at the bottom of the lifting platform, and its outer surface meshes with the outer surface of the slanted wheel. The housing contains four round rods, the outer surfaces of which are fixedly connected to the lifting platform. A fixed plate is located on top of the lifting platform, and a bracket is located on top of the fixed plate. The outer surface of the bracket is fixedly connected to the outer surface of the round rods. The rotating shaft drives the cylinder to move up and down, causing the cylinder to move the lifting platform together. This allows the round rods to pass through a groove on the fixed plate, which in turn drives the bracket to move up and down. The slanted wheel meshes with the outer surface of the driven wheel, generating power to rotate the worm gear. The worm gear meshes with the outer surface of the worm, causing the bracket to reciprocate.
[0006] Preferably, a screening plate is fixedly connected to the upper surface of the support, a worm gear is provided at the bottom of the screening plate, a worm is fixedly connected to the inner surface of the support, and the outer surface of the worm meshes with the outer surface of the worm gear. The packaging device includes a recycling bin, a transport roller is rotatably connected to the outer surface of the recycling bin, a rotating roller is rotatably connected to the outer surface of the transport roller, the outer surface of the rotating roller is rotatably connected to the inner surface of the recycling bin, a drive wheel is fixedly connected to the outer surface of the rotating roller, a hand crank is fixedly connected to the outer surface of the rotating roller, and a bidirectional screw is provided inside the recycling bin. The outer surface of the screw meshes with the outer surface of the drive wheel. The outer surface of the bidirectional screw is slidably connected to a clamping plate. Under the weight of the circuit board, the lifting plate drives the telescopic rod to move downward together. The telescopic rod drives the coil spring to slide downward together. When a certain degree is reached, the electric push rod drives the push plate to move, pushing the unqualified circuit board on the lifting plate onto the transport roller in the packaging device. The hand crank generates power to drive the rotating roller, which in turn drives the transport roller to move, transporting the circuit board to the recycling box. The drive wheel on the rotating roller drives the bidirectional screw to rotate, and the bidirectional screw drives the clamping plate to package the circuit board.
[0007] Preferably, the collecting device includes a telescopic rod, with a circular spring slidably connected to the outer surface of the telescopic rod, and a lifting plate fixedly connected to the outer surface of the telescopic rod, with the lifting plate located inside the collecting box. An electric push rod is fixedly connected to the inner surface of the collecting box, and a push plate is fixedly connected to the outer surface of the electric push rod. The drilling device includes a lifting rod, with a semi-circular ring fixedly connected to the lower surface of the lifting rod. A disc is slidably connected to the outer surface of the semi-circular ring, and a handle is fixedly connected to the outer surface of the disc. A locking pin is provided inside the disc, and a drill rod is provided at the bottom of the locking pin. The semi-circular ring is moved up and down by the lifting rod, and the position of the disc is adjusted by the handle. The position of the disc is fixed by the locking pin contacting the locking groove inside the semi-circular ring. Multiple locking pins correspond to multiple drill rods, and the drill rods of different diameters can be adjusted according to requirements.
[0008] Preferably, the transport device includes gears, the outer surface of which meshes with a track; a transmission roller is fixedly connected to the inner surface of the gears; a conveyor belt is rotatably connected to the outer surface of the transmission roller; an adsorption device is provided at the bottom of the conveyor belt; the adsorption device includes a dust collection box; a nylon plate is provided inside the dust collection box; the outer surface of the nylon plate contacts the outer surface of the glass rod; a motor is provided at the bottom of the dust collection box; a dust removal device is fixedly connected to the upper surface of the dust collection box; the dust removal device includes a vacuum cleaner; a hose is fixedly connected to the inner surface of the vacuum cleaner; a suction head is fixedly connected to the outer surface of the hose; a baffle is fixedly connected to the outer surface of the suction head; a roller is fixedly connected to the inner surface of the motor; and a... A glass rod is included. A turntable is fixedly connected to the outer surface of the roller. A sleeve is provided at the bottom of the turntable. A tube is rotatably connected to the outer surface of the sleeve. The inner surface of the tube is threaded to the outer surface of the roller. A limit plate is fixedly connected to the outer surface of the tube. A hydraulic rod is fixedly connected to the lower surface of the limit plate. A U-shaped tube is fixedly connected to the lower surface of the hydraulic rod. A buffer box is fixedly connected to the outer surface of the U-shaped tube. A qualified circuit board is transported to the surface of the turntable. The generator box drives the roller to rotate. While the roller drives the turntable to rotate, the roller drives the tube to move upward. Hydraulic oil is introduced into the hydraulic rod through the U-shaped tube by the spring in the buffer box. The limit plate on the hydraulic rod limits the tube and prevents the tube from rotating. The tube drives the pull rod to move through the sleeve.
[0009] A method for manufacturing a multilayer precision thick copper circuit board includes the following steps: Step 1: Material preparation. The raw copper-clad laminate is cut into boards that can be manufactured on the production line.
[0010] Step 2: Drill holes and fix the circuit board using a positioning device. Adjust the distance between the drill rod and the circuit board using the lifting platform on the drilling device. Drill holes in the circuit board using the drill rod to create through holes between the PCB layers, thereby achieving the purpose of connecting the layers.
[0011] Step 3: Copper Plating. After drilling, the circuit board undergoes an oxidation-reduction reaction in the copper plating tank, forming a copper layer that metallizes the holes. This deposits copper onto the surface of the originally insulating substrate, achieving interlayer electrical connectivity.
[0012] Step four involves lamination. After lamination, a layer of blue dry film is pressed onto the PCB board. The dry film serves as a carrier and is crucial in the circuit manufacturing process. Compared to wet film, dry film offers higher stability and better quality, and can be directly used to create non-metallic vias.
[0013] Step 5: Exposure. Align the film and the substrate with the pressed dry film, place the aligned substrate on the flip plate, and complete the double-sided exposure.
[0014] Step 6: Development. Use the weak alkalinity of the developer to dissolve and wash away the unexposed dry or wet film, leaving the exposed parts intact.
[0015] Step 7: Electroplating. Place the PCB board into the electroplating equipment. The copper-containing parts will be electroplated, while the parts blocked by the film will not react.
[0016] Step 8: Soldering – This is a preparatory step to remove the copper portion protected by the film.
[0017] Step 9: Remove the exposed dry film protecting the copper surface using a sodium hydroxide solution to expose the circuit pattern.
[0018] Step 10: After etching, the unexposed dry or wet film is removed by the developer, exposing the copper surface. This exposed copper surface is then dissolved and etched away with acidic copper chloride to obtain the desired circuitry.
[0019] Step 11: Remove the solder. Use solder remover to remove the solder from the circuit, restoring the circuit to its original copper color. Step 12: Optical Inspection (AOI) works by first taking a quick picture with a high-definition camera, and then comparing the picture with the original file. This fundamentally solves the problems of open circuits, short circuits, and micro-openings or micro-short circuits.
[0020] Step 13: Print solder resist. Apply a layer of solder resist to the board surface by screen printing or coating with solder resist ink. After exposure and development, expose the disks and holes to be soldered. Cover other areas with solder resist to prevent short circuits during soldering.
[0021] Step Fourteen: Solder Mask Exposure. First, place the solder mask film on a board completely covered with green solder mask. The areas where windows need to be opened are black, and the areas where windows don't need to be opened are transparent. Then, place the film on an exposure machine for exposure. The areas where windows need to be opened are not exposed because the film is black, and the black color blocks the light. The exposure changes as the state of the green solder mask changes.
[0022] Step 15: Print the required text, trademarks, parts and other symbols onto the PCB board using screen printing, and then expose the board surface to ultraviolet light.
[0023] Step Sixteen: Surface treatment to ensure good solderability or electrical properties. Common surface treatments include: tin plating, immersion gold, OSP, immersion tin, immersion silver, nickel-palladium-gold, electroplated hard gold, electroplated gold fingers, etc.
[0024] Step 17: Shaping and cutting the PCB into the required dimensions.
[0025] Step 18: Perform electrical tests and simulate the state of the circuit board. Power on the circuit board to check for open circuits or short circuits.
[0026] Step nineteen involves random sampling and inspection of the circuit board's appearance, dimensions, hole diameter, board thickness, markings, etc., to ensure it meets customer requirements. Qualified products are then packaged for easy storage and transportation.
[0027] The beneficial effects of this invention are as follows: 1. This invention, through the installation of a transport device, first screens the circuit boards by placing them on the upper surface of a conveyor belt. Gears drive the track to rotate, generating power to rotate the transmission rollers, which in turn drive the conveyor belt. Simultaneously, a motor within the housing drives a rotating shaft, which in turn drives a cylinder to move up and down. The cylinder, in turn, moves the lifting platform, causing a round rod to pass through a groove on a fixed plate. The round rod then drives a support frame to move up and down. A slanted wheel meshes with the outer surface of a driven wheel, generating power to rotate a worm gear. The worm gear meshes with the outer surface of a worm, causing the support frame to reciprocate. This process transports defective circuit boards through a screening plate to a collection box, while qualified circuit boards are transported to the surface of a positioning device, completing the screening process and improving the yield rate of the circuit boards.
[0028] 2. This invention uses a collection device to collect defective circuit boards for reuse, reducing industrial waste. Defective circuit boards are screened and transported to a collection box. At this point, the lifting plate, under the weight of the circuit boards, moves a telescopic rod downwards. The telescopic rod, along with a spring, slides downwards. At a certain point, an electric push rod drives a push plate, pushing the defective circuit boards onto a transport roller in a packaging device. A hand crank generates power to drive a rotating roller, which in turn moves the transport roller, transporting the circuit boards to a recycling box. The drive wheel on the rotating roller drives a bidirectional screw, which in turn drives a clamping plate to package the circuit boards. This recycling and packaging process reduces the workload of workers and improves work efficiency.
[0029] 3. This invention, by setting up a positioning device, transports qualified circuit boards to the surface of a turntable. A generator drives a roller to rotate, which in turn rotates the turntable and simultaneously moves a sleeve upwards. Hydraulic oil is pumped through a U-shaped tube into a hydraulic rod via a spring in a buffer box, causing a limiting plate on the hydraulic rod to limit the sleeve's rotation. The sleeve then drives a pull rod via a sleeve sleeve, which in turn rotates the sleeve sleeve. One end of the pull rod is connected to a sliding block, which drives an arc-shaped plate along a slide rail. The baffle and arc-shaped plate together position the circuit board, preventing positional shift during drilling. This prevents the circuit board from becoming unusable, resulting in wasted resources. After drilling, the circuit board is directly removed, and the sliding block is reset by a spring on a fixed block, ensuring it doesn't affect the positioning and drilling of the next circuit board. This improves equipment efficiency, reduces personnel costs and time waste, and prevents circuit board positional shifts.
[0030] 4. By incorporating a dust removal device, this invention addresses the issue of a large amount of debris affecting drilling accuracy during the drilling process. A vacuum cleaner generates suction, drawing the debris through a suction head into a flexible tube. The debris then enters a dust collection box via the tube. A roller rotates a glass rod, and static electricity is generated through friction between the glass rod and the nylon plate in the adsorption device, adsorbing the debris after drilling and further improving drilling accuracy.
[0031] 5. This invention, by setting up a drilling device, uses a lifting rod to move a semi-circular ring up and down. The position of the disc is adjusted by a handle, and the position of the disc is fixed by a locking pin contacting a groove inside the semi-circular ring. By setting multiple locking pins to correspond to multiple drill rods, drill rods of different diameters can be adjusted according to requirements, allowing for timely adjustment of the drill rods. The operation is simple and expands the application range of the equipment. Attached Figure Description
[0032] Figure 1 This is a flowchart of the manufacturing process of the present invention.
[0033] Figure 2 This is a front view of a fabrication apparatus for a multilayer precision thick copper circuit board according to the present invention.
[0034] Figure 3 This is a cross-sectional view of a fabrication apparatus for a multilayer precision thick copper circuit board according to the present invention.
[0035] Figure 4 This is a schematic diagram of the structure at point C of a multilayer precision thick copper circuit board manufacturing apparatus according to the present invention.
[0036] Figure 5 This is a schematic diagram of the transport device structure of a multilayer precision thick copper circuit board manufacturing apparatus according to the present invention.
[0037] Figure 6 This is a schematic diagram of the screening plate and external structure of a multilayer precision thick copper circuit board manufacturing device according to the present invention.
[0038] Figure 7 This is a schematic diagram of the collection and packaging device of a multilayer precision thick copper circuit board manufacturing apparatus according to the present invention.
[0039] Figure 8 This is a schematic diagram of section A of the fabrication apparatus for a multilayer precision thick copper circuit board according to the present invention.
[0040] Figure 9 This is a schematic diagram of the dust removal device structure of a multilayer precision thick copper circuit board manufacturing apparatus according to the present invention.
[0041] Figure 10This is a schematic diagram of section B of the fabrication apparatus for a multilayer precision thick copper circuit board according to the present invention.
[0042] Figure 11 This is a schematic diagram of the positioning device structure of a multilayer precision thick copper circuit board manufacturing apparatus according to the present invention.
[0043] Figure 12 This is a schematic diagram of the drill rod device structure of a multilayer precision thick copper circuit board manufacturing apparatus according to the present invention.
[0044] In the diagram: 1. Box body; 2. Packing device; 201. Recycling bin; 202. Transport roller; 203. Rotating roller; 204. Drive wheel; 205. Hand crank; 206. Clamping plate; 207. Screw; 3. Collection device; 301. Telescopic rod; 302. Coil spring; 303. Lifting plate; 304. Electric push rod; 305. Push plate; 306. Collection bin; 4. Transport device; 41. Gear; 42. Track; 43. Drive roller; 44. Conveyor belt; 5. Positioning device; 51. Turntable; 52. Fixing block; 53. Spring; 54. Sliding block; 55. Pull rod; 56. Arc plate; 57. Slide rail; 6. Drilling device; 61. Lifting mechanism 62. Rod; 63. Semicircular ring; 64. Disc; 65. Handle; 66. Locking pin; 67. Drill rod; 78. Dust removal device; 79. Vacuum cleaner; 70. Hose; 71. Suction head; 72. Baffle; 83. Adsorption device; 84. Ash collection box; 85. Nylon sheet; 86. Glass rod; 9. Motor; 10. Shaft; 11. Slanted wheel; 12. Driven wheel; 13. Cylinder; 14. Lifting platform; 15. Round rod; 16. Fixing plate; 17. Bracket; 18. Screening plate; 19. Worm gear; 20. Worm; 21. Sleeve; 22. Sleeve; 23. Limiting plate; 24. Roller; 25. Hydraulic rod; 26. Buffer box; 27. Generator box; 28. U-tube. Detailed Implementation
[0045] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.
[0046] Example: Please refer to Figure 1 - Figure 12The present invention provides a technical solution: a manufacturing device for multilayer precision thick copper circuit boards, including a box 1, a packaging device 2 fixedly connected to the outer surface of the box 1, a collecting device 3 fixedly connected to the upper surface of the packaging device 2, a transport device 4 fixedly connected to the upper surface of the box 1, an adsorption device 8 provided at the bottom of the transport device 4, a dust removal device 7 fixedly connected to the upper surface of the adsorption device 8, a positioning device 5 slidably connected to the outer surface of the dust removal device 7, a drilling device 6 provided at the top of the positioning device 5, and a motor 9 provided at the bottom of the drilling device 6. The positioning device 5 includes a turntable 51. A fixing block 52 is fixedly connected to the lower surface of the turntable 51. A spring 53 is fixedly connected to the inner surface of the fixing block 52. The outer surface of the spring 53 is slidably connected to the lower surface of the turntable 51. A fixed sliding block 54 is fixedly connected to the outer surface of the spring 53. A pull rod 55 is fixedly connected to the lower surface of the sliding block 54. An arc-shaped plate 56 is provided at the top of the pull rod 55. The outer surface of the arc-shaped plate 56 is fixedly connected to the outer surface of the sliding block 54. A slide rail 57 is provided in the wall of the turntable 51. The outer surface of the slide rail 57 is slidably connected to the outer surface of the sliding block 54. The outer surface of the arc-shaped plate 56 is slidably connected to the upper surface of the turntable 51.
[0047] The housing 1 contains a generator box 27. A rotating shaft 10 is rotatably connected to the inner surface of the generator box 27. A cylinder 13 is fixedly connected to the outer surface of the rotating shaft 10. A lifting platform 14 is fixedly connected to the outer surface of the cylinder 13. A slanted wheel 11 is fixedly connected to the outer surface of the rotating shaft 10. A driven wheel 12 is provided at the bottom of the lifting platform 14. The outer surface of the driven wheel 12 meshes with the outer surface of the slanted wheel 11. The housing 1 contains four round rods 15. The lifting platform 14 is fixedly connected to the outer surface of the round rods 15. A fixing plate 16 is provided at the top of the lifting platform 14. A bracket 17 is provided at the top of the fixing plate 16. The outer surface of the bracket 17 is fixedly connected to the outer surface of the round rods 15.
[0048] A screening plate 18 is fixedly connected to the upper surface of the support 17. A worm gear 19 is provided at the bottom of the screening plate 18. A worm 20 is fixedly connected to the inner surface of the support 17. The outer surface of the worm 20 meshes with the outer surface of the worm gear 19. The packaging device 2 includes a recycling box 201. A transport roller 202 is rotatably connected to the outer surface of the recycling box 201. A rotating roller 203 is rotatably connected to the outer surface of the transport roller 202. The outer surface of the rotating roller 203 is rotatably connected to the inner surface of the recycling box 201. A drive wheel 204 is fixedly connected to the outer surface of the rotating roller 203. A hand crank 205 is fixedly connected to the outer surface of the rotating roller 203. A bidirectional screw 207 is provided inside the recycling box 201. The outer surface of the bidirectional screw 207 meshes with the outer surface of the drive wheel 204. A clamping plate 206 is slidably connected to the outer surface of the bidirectional screw 207.
[0049] The collecting device 3 includes a telescopic rod 301, with a coil spring 302 slidably connected to the outer surface of the telescopic rod 301. A lifting plate 303 is fixedly connected to the outer surface of the telescopic rod 301, and the lifting plate 303 is located inside the collecting box 306. An electric push rod 304 is fixedly connected to the inner surface of the collecting box 306, and a push plate 305 is fixedly connected to the outer surface of the electric push rod 304. The drilling device 6 includes a lifting rod 61, with a semi-circular ring 62 fixedly connected to the lower surface of the lifting rod 61. A disc 63 is slidably connected to the outer surface of the semi-circular ring 62, and a handle 64 is fixedly connected to the outer surface of the disc 63. A locking pin 65 is provided inside the disc 63, and a drill rod 66 is provided at the bottom of the locking pin 65.
[0050] The transport device 4 includes a gear 41, the outer surface of which meshes with a track 42. A transmission roller 43 is fixedly connected to the inner surface of the gear 41. A conveyor belt 44 is rotatably connected to the outer surface of the transmission roller 43. An adsorption device 8 is installed at the bottom of the conveyor belt 44. The adsorption device 8 includes a dust collection box 81. A nylon plate 82 is installed inside the dust collection box 81. The outer surface of the nylon plate 82 is in contact with the outer surface of the glass rod 83. A motor 9 is installed at the bottom of the dust collection box 81. A dust removal device 7 is fixedly connected to the upper surface of the dust collection box 81. The dust removal device 7 includes a vacuum cleaner 71. A hose 72 is fixedly connected to the inner surface of the vacuum cleaner 71. The outer surface of the hose 72 is fixedly connected to... A suction head 73 is connected to the outer surface of the suction head 73, a baffle 74 is fixedly connected to the outer surface of the motor 9, a roller 24 is fixedly connected to the inner surface of the roller 24, a glass rod 83 is fixedly connected to the outer surface of the roller 24, a turntable 51 is fixedly connected to the outer surface of the roller 24, a sleeve 22 is provided at the bottom of the turntable 51, a sleeve 21 is rotatably connected to the outer surface of the sleeve 22, the inner surface of the sleeve 21 is threadedly connected to the outer surface of the roller 24, a limit plate 23 is fixedly connected to the outer surface of the sleeve 21, a hydraulic rod 25 is fixedly connected to the lower surface of the limit plate 23, a U-shaped tube 28 is fixedly connected to the lower surface of the hydraulic rod 25, and a buffer box 26 is fixedly connected to the outer surface of the U-shaped tube 28.
[0051] A method for manufacturing a multilayer precision thick copper circuit board includes the following steps: Step 1: Material preparation. The raw copper-clad laminate is cut into boards that can be manufactured on the production line.
[0052] Step 2: Drill holes and fix the circuit board using a positioning device. Adjust the distance between the drill rod and the circuit board using the lifting platform on the drilling device. Drill holes in the circuit board using the drill rod to create through holes between the PCB layers, thereby achieving the purpose of connecting the layers.
[0053] Step 3: Copper Plating. After drilling, the circuit board undergoes an oxidation-reduction reaction in the copper plating tank, forming a copper layer that metallizes the holes. This deposits copper onto the surface of the originally insulating substrate, achieving interlayer electrical connectivity.
[0054] Step four involves lamination. After lamination, a layer of blue dry film is pressed onto the PCB board. The dry film serves as a carrier and is crucial in the circuit manufacturing process. Compared to wet film, dry film offers higher stability and better quality, and can be directly used to create non-metallic vias.
[0055] Step 5: Exposure. Align the film and the substrate with the pressed dry film, place the aligned substrate on the flip plate, and complete the double-sided exposure.
[0056] Step 6: Development. Use the weak alkalinity of the developer to dissolve and wash away the unexposed dry or wet film, leaving the exposed parts intact.
[0057] Step 7: Electroplating. Place the PCB board into the electroplating equipment. The copper-containing parts will be electroplated, while the parts blocked by the film will not react.
[0058] Step 8: Soldering – This is a preparatory step to remove the copper portion protected by the film.
[0059] Step 9: Remove the exposed dry film protecting the copper surface using a sodium hydroxide solution to expose the circuit pattern.
[0060] Step 10: After etching, the unexposed dry or wet film is removed by the developer, exposing the copper surface. This exposed copper surface is then dissolved and etched away with acidic copper chloride to obtain the desired circuitry.
[0061] Step 11: Remove the solder. Use solder remover to remove the solder from the circuit, restoring the circuit to its original copper color. Step 12: Optical Inspection (AOI) works by first taking a quick picture with a high-definition camera, and then comparing the picture with the original file. This fundamentally solves the problems of open circuits, short circuits, and micro-openings or micro-short circuits.
[0062] Step 13: Print solder resist. Apply a layer of solder resist to the board surface by screen printing or coating with solder resist ink. After exposure and development, expose the disks and holes to be soldered. Cover other areas with solder resist to prevent short circuits during soldering.
[0063] Step Fourteen: Solder Mask Exposure. First, place the solder mask film on a board completely covered with green solder mask. The areas where windows need to be opened are black, and the areas where windows don't need to be opened are transparent. Then, place the film on an exposure machine for exposure. The areas where windows need to be opened are not exposed because the film is black, and the black color blocks the light. The exposure changes as the state of the green solder mask changes.
[0064] Step 15: Print the required text, trademarks, parts and other symbols onto the PCB board using screen printing, and then expose the board surface to ultraviolet light.
[0065] Step Sixteen: Surface treatment to ensure good solderability or electrical properties. Common surface treatments include: tin plating, immersion gold, OSP, immersion tin, immersion silver, nickel-palladium-gold, electroplated hard gold, electroplated gold fingers, etc.
[0066] Step 17: Shaping and cutting the PCB into the required dimensions.
[0067] Step 18: Perform electrical tests and simulate the state of the circuit board. Power on the circuit board to check for open circuits or short circuits.
[0068] Step nineteen involves random sampling and inspection of the circuit board's appearance, dimensions, hole diameter, board thickness, markings, etc., to ensure it meets customer requirements. Qualified products are then packaged for easy storage and transportation.
[0069] Working principle: In use, the circuit boards are first screened by the transport device 4 and placed on the upper surface of the conveyor belt 44. At this time, the gear 41 drives the track 42 to rotate, which generates power to drive the transmission roller 43 to rotate. The transmission roller 43 drives the conveyor belt 44 to rotate. At this time, the motor 9 in the housing 1 drives the rotating shaft 10 to rotate. The rotating shaft 10 drives the cylinder 13 to move up and down. The cylinder 13 drives the lifting platform 14 to move together, so that the round rod 15 passes through the groove opened on the fixed plate 16. The round rod 15 drives the bracket 17 to move up and down. The inclined wheel 11 meshes with the outer surface of the driven wheel 12, which generates power to drive the worm gear 19 to rotate. The worm gear 19 meshes with the outer surface of the worm 20, which drives the bracket 17 to reciprocate. The unqualified circuit boards are transported to the collection box 306 through the screening plate 18, and the qualified circuit boards are normally transported to the surface of the positioning device 5, thus completing the screening of the circuit boards. In use, by setting up the collection device 3, unqualified circuit boards are collected for reuse, reducing industrial cost waste. Unqualified circuit boards are screened and transported to the collection box 306. At this time, the lifting plate 303, under the action of the weight of the circuit board, drives the telescopic rod 301 to move downward together. The telescopic rod 301 drives the coil spring 302 to slide downward together. When a certain degree is reached, the electric push rod 304 drives the push plate 305 to move, pushing the unqualified circuit board on the lifting plate 303 onto the transport roller 202 in the packaging device 2. The hand crank 205 is rotated to generate power to drive the rotating roller 203. The rotating roller 203 drives the transport roller 202 to move, so that the circuit board is transported to the recycling box 201. The drive wheel 204 on the rotating roller 203 drives the bidirectional screw 207 to rotate. The bidirectional screw 207 drives the clamping plate 206 to pack the circuit board, and the unqualified circuit board is recycled and packed. In use, the positioning device 5 transports qualified circuit boards to the surface of the turntable 51. The generator box 27 drives the roller 24 to rotate. While the roller 24 drives the turntable 51 to rotate, it also drives the sleeve 21 to move upward. The spring in the buffer box 26 sends hydraulic oil through the U-shaped tube 28 into the hydraulic rod 25, causing the limiting plate 23 on the hydraulic rod 25 to limit the sleeve 21 and prevent it from rotating. The sleeve 21 drives the pull rod 55 to move through the sleeve 22, and the pull rod 55 drives the sleeve 22 to rotate on the sleeve 21. The lever 55 is connected to a sliding block 54 at one end. The sliding block 54 drives the arc plate 56 to move along the slide rail 57. The baffle 74 and the arc plate 56 together position the circuit board to prevent the position from shifting during drilling, which would affect the drilling accuracy of the circuit board and make it unusable, resulting in cost waste. After drilling, the circuit board can be directly removed. The sliding block 54 is reset by the spring 53 on the fixed block 52. This will not affect the positioning of the next circuit board, thus improving the efficiency of the equipment to a certain extent and reducing personnel costs and time waste. In use, by setting up the drilling device 6, the semi-circular ring 62 is raised and lowered by the lifting rod 61, the position of the disc 63 is adjusted by the handle 64, and the position of the disc 63 is fixed by the locking pin 65 contacting the locking groove in the semi-circular ring 62. By opening multiple locking pins 65 to correspond to multiple drill rods 66, the drill rods 66 of different hole diameters can be adjusted according to the requirements. During use, by setting up the dust removal device 7, a large amount of debris will be generated during the drilling process, affecting the drilling accuracy. The vacuum cleaner 71 is used to draw out the debris through the suction head 73 into the hose 72. The debris enters the dust collection box 81 through the hose 72. The roller 24 drives the glass rod 83 to rotate. The glass rod 83 generates static electricity through friction with the nylon plate 82 in the adsorption device 8, which adsorbs the debris after drilling.
[0070] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating devices not specifically described and explained in the present invention are implemented according to conventional means in the art unless otherwise specified or limited.
Claims
1. A fabrication apparatus for multilayer precision thick copper circuit boards, comprising a housing (1), characterized in that: A packing device (2) is fixedly connected to the outer surface of the box (1). A collecting device (3) is fixedly connected to the upper surface of the packing device (2). A transport device (4) is fixedly connected to the upper surface of the box (1). An adsorption device (8) is provided at the bottom of the transport device (4). A dust removal device (7) is fixedly connected to the upper surface of the adsorption device (8). A positioning device (5) is slidably connected to the outer surface of the dust removal device (7). A drilling device (6) is provided at the top of the positioning device (5). A drilling device (6) is provided at the bottom of the drilling device (6). The motor (9) and the positioning device (5) include a turntable (51), a fixed block (52) is fixedly connected to the lower surface of the turntable (51), a spring (53) is fixedly connected to the inner surface of the fixed block (52), the outer surface of the spring (53) is slidably connected to the lower surface of the turntable (51), a fixed connecting sliding block (54) is fixedly connected to the outer surface of the spring (53), a pull rod (55) is fixedly connected to the lower surface of the sliding block (54), an arc plate (56) is provided at the top of the pull rod (55), the outer surface of the arc plate (56) is fixedly connected to the outer surface of the sliding block (54), a slide rail (57) is provided in the wall of the turntable (51), the outer surface of the slide rail (57) is slidably connected to the outer surface of the sliding block (54), and the outer surface of the arc plate (56) is slidably connected to the upper surface of the turntable (51).
2. The apparatus for manufacturing multilayer precision thick copper circuit boards according to claim 1, characterized in that: The housing (1) is equipped with a generator box (27) inside. The inner surface of the generator box (27) is rotatably connected to a rotating shaft (10). The outer surface of the rotating shaft (10) is fixedly connected to a cylinder (13). The outer surface of the cylinder (13) is fixedly connected to a lifting platform (14). The outer surface of the rotating shaft (10) is fixedly connected to a slanted wheel (11). The bottom of the lifting platform (14) is equipped with a driven wheel (12). The outer surface of the driven wheel (12) meshes with the outer surface of the slanted wheel (11).
3. The apparatus for manufacturing multilayer precision thick copper circuit boards according to claim 1, characterized in that: The box (1) is provided with four round rods (15) inside. The outer surface of the round rods (15) is fixedly connected to a lifting platform (14). The top of the lifting platform (14) is provided with a fixing plate (16). The top of the fixing plate (16) is provided with a bracket (17). The outer surface of the bracket (17) is fixedly connected to the outer surface of the round rods (15).
4. The apparatus for manufacturing multilayer precision thick copper circuit boards according to claim 3, characterized in that: A screening plate (18) is fixedly connected to the upper surface of the support (17), and a worm wheel (19) is provided at the bottom of the screening plate (18). A worm (20) is fixedly connected to the inner surface of the support (17), and the outer surface of the worm (20) meshes with the outer surface of the worm wheel (19).
5. The apparatus for manufacturing multilayer precision thick copper circuit boards according to claim 1, characterized in that: The packaging device (2) includes a recycling bin (201), a transport roller (202) is rotatably connected to the outer surface of the recycling bin (201), a rotating roller (203) is rotatably connected to the outer surface of the transport roller (202), the outer surface of the rotating roller (203) is rotatably connected to the inner surface of the recycling bin (201), a drive wheel (204) is fixedly connected to the outer surface of the rotating roller (203), a hand crank (205) is fixedly connected to the outer surface of the rotating roller (203), a bidirectional screw (207) is provided inside the recycling bin (201), the outer surface of the bidirectional screw (207) meshes with the outer surface of the drive wheel (204), and a clamping plate (206) is slidably connected to the outer surface of the bidirectional screw (207).
6. The apparatus for manufacturing multilayer precision thick copper circuit boards according to claim 1, characterized in that: The collecting device (3) includes a telescopic rod (301), a circular spring (302) is slidably connected to the outer surface of the telescopic rod (301), a lifting plate (303) is fixedly connected to the outer surface of the telescopic rod (301), and the lifting plate (303) is located inside the collecting box (306). An electric push rod (304) is fixedly connected to the inner surface of the collecting box (306), and a push plate (305) is fixedly connected to the outer surface of the electric push rod (304).
7. The apparatus for manufacturing multilayer precision thick copper circuit boards according to claim 1, characterized in that: The drilling device (6) includes a lifting rod (61), a semi-circular ring (62) is fixedly connected to the lower surface of the lifting rod (61), a disc (63) is slidably connected to the outer surface of the semi-circular ring (62), a handle (64) is fixedly connected to the outer surface of the disc (63), a locking pin (65) is provided inside the disc (63), and a drill rod (66) is provided at the bottom of the locking pin (65).
8. The apparatus for manufacturing multilayer precision thick copper circuit boards according to claim 1, characterized in that: The transport device (4) includes a gear (41), the outer surface of which meshes with a track (42). A transmission roller (43) is fixedly connected to the inner surface of the gear (41). A conveyor belt (44) is rotatably connected to the outer surface of the transmission roller (43). An adsorption device (8) is provided at the bottom of the conveyor belt (44). The adsorption device (8) includes a dust collection box (81). A nylon plate (82) is provided inside the dust collection box (81). The outer surface of the nylon plate (82) is in contact with the outer surface of the glass rod (83). A motor (9) is provided at the bottom of the dust collection box (81). A dust removal device (7) is fixedly connected to the upper surface of the dust collection box (81). The dust removal device (7) includes a vacuum cleaner (71). A hose (72) is fixedly connected to the inner surface of the vacuum cleaner (71). A suction head (73) is fixedly connected to the outer surface of the hose (72). A baffle (74) is fixedly connected to the outer surface of the suction head (73).
9. The apparatus for manufacturing a multilayer precision thick copper circuit board according to claim 8, characterized in that: A roller (24) is fixedly connected to the inner surface of the motor (9), a glass rod (83) is fixedly connected to the outer surface of the roller (24), a turntable (51) is fixedly connected to the outer surface of the roller (24), a sleeve (22) is provided at the bottom of the turntable (51), a sleeve (21) is rotatably connected to the outer surface of the sleeve (22), the inner surface of the sleeve (21) is threadedly connected to the outer surface of the roller (24), a limit plate (23) is fixedly connected to the outer surface of the sleeve (21), a hydraulic rod (25) is fixedly connected to the lower surface of the limit plate (23), a U-shaped tube (28) is fixedly connected to the lower surface of the hydraulic rod (25), and a buffer box (26) is fixedly connected to the outer surface of the U-shaped tube (28).
10. A method for manufacturing a multilayer precision thick copper circuit board, characterized in that, Includes the following steps: Step 1: Material preparation. Cut the raw copper-clad laminate into boards that can be manufactured on the production line. Step 2: Drill holes and fix the circuit board with the positioning device (5). Adjust the distance between the drill rod (66) and the circuit board with the lifting platform (61) on the drilling device (6). Drill holes in the circuit board with the drill rod (66) to create through holes between the layers of the PCB board, so as to achieve the purpose of connecting the layers. Step 3: Copper plating. After drilling, the circuit board undergoes an oxidation-reduction reaction in the copper plating tank to form a copper layer that metallizes the holes, depositing copper on the surface of the originally insulating substrate to achieve interlayer electrical connectivity. Step 4: Lamination. A layer of blue dry film is pressed onto the PCB board after lamination. The dry film is a carrier and is very important in the circuit process. Compared to wet films, dry films have higher stability and better quality, and can be used directly for non-metallic vias. Step 5: Expose the film and align the film and the substrate with the dry film pressed on. Place the aligned substrate on the flip plate to complete the double-sided exposure. Step 6: Development. Use the weak alkalinity of the developer to dissolve and wash away the unexposed dry or wet film, leaving the exposed parts intact. Step 7: Electroplating. Place the PCB board into the electroplating equipment. The copper parts will be electroplated, while the parts blocked by the film will not react. Step 8: Soldering – This is a preparatory step to remove the copper protected by the film. Step 9: Remove the exposed dry film protecting the copper surface using a sodium hydroxide solution to expose the circuit pattern. Step 10: After etching, the unexposed dry or wet film is removed by the developer, exposing the copper surface. Acidic copper chloride is used to dissolve and etch away this exposed copper surface to obtain the desired circuit. Step 11: Remove the solder. Use solder remover to remove the solder from the circuit, restoring the circuit to its original copper color. Step 12 Optical Inspection (AOI) works by first taking a quick picture with a high-definition image camera, and then comparing the picture with the original file. This fundamentally solves the problems of open and short circuits, as well as micro-open and micro-short circuits. Step 13: Print solder resist. Apply a layer of solder resist to the board surface by screen printing or coating with solder resist ink. Expose and develop the surface to expose the disks and holes to be soldered. Cover other areas with solder resist to prevent short circuits during soldering. Step Fourteen: Solder Resist Exposure. First, place the solder resist film on a board completely covered with green solder mask, then place it on an exposure machine for exposure. For the part that needs to be exposed, because the film is black, the black color blocks the light and it is not exposed. The exposure will change as the state of the green solder mask changes. Step 15: Print the required text, trademarks, parts and other symbols onto the PCB board using screen printing, and then expose the board surface to ultraviolet light. Step Sixteen: Surface treatment to ensure good solderability or electrical properties; Common surface treatments include: tin plating, immersion gold, OSP, immersion tin, immersion silver, nickel-palladium-gold, electroplated hard gold, and electroplated gold fingers. Step 17: Shaping and cutting the PCB into the required dimensions; Step 18: Perform electrical tests and simulate the state of the circuit board. Power on the circuit board to check for open circuits or short circuits. Step 19: Sampling and inspection of the circuit board's appearance, dimensions, hole diameter, board thickness, markings, etc., to ensure it meets customer requirements; Pack qualified products for easy storage and transportation.