Packaging workpiece cleaning method, cleaning water gas path system, storage medium and cleaning equipment

Abstract

The embodiment of the invention provides a packaging workpiece cleaning method, a cleaning water gas path system, a storage medium and cleaning equipment, and relates to the field of semiconductor technologies. The packaging workpiece cleaning method comprises the steps that a packaging workpiece is installed; starting a water pump; the water pump pumps water flow into the nozzle, and whether the spraying direction of the nozzle faces the cutting channel on the surface of the packaged workpiece is observed; if yes, the water pressure of the water pump is adjusted through the variable-frequency driving unit, so that the water pump enters a high-pressure water cleaning and deburring mode; a nozzle is driven to spray a water column towards a cutting channel on the surface of the packaging workpiece, so that the cutting channel is deburred; acquiring a pressure signal of a pressure sensor arranged on the water pump pipeline; adjusting working parameters of the variable-frequency driving unit according to the pressure signal, and adjusting the water pressure of the water pump to keep the water pressure at a preset pressure value. High-pressure water columns are adopted to conduct directional spraying on the cutting channels, and metal burrs attached to the edge can be impacted and peeled off.

Description

Technical Field

[0001] This invention relates to the field of semiconductor process technology, and more specifically, to a method for cleaning packaged workpieces, a cleaning water and air circuit system, a storage medium, and cleaning equipment. Background Technology

[0002] Traditional QFN / SON packages have pins located on the bottom of the package, making it impossible to form visible solder joints from the side after soldering. Therefore, they cannot pass automated optical inspection (AVI) or X-ray inspection (X-ray inspection). (ray) to determine whether the package is effectively soldered. To better meet the needs of SMT automated assembly and inspection, wettable flank (WF) technology has emerged.

[0003] Currently, the main method used in the industry for separating wettable edge devices is cutting. During the cutting process, the friction between the copper and the cutting blade generates curled edges, which adhere to the leads and form burrs. If these burrs are not removed promptly after the first cut, they can easily cause tin whiskers during subsequent electroplating, leading to a risk of short circuits in the device during use. Existing methods for burr removal generally use chemical reactions, where burr debris is removed through a chemical reaction. However, this method is expensive and difficult to implement in industrial applications.

[0004] Therefore, how to effectively remove stubborn burrs and metal powder from grooves on cut workpieces while ensuring workpiece integrity and operational safety has become a pressing technical challenge. Summary of the Invention

[0005] This invention provides a method for cleaning packaged workpieces, a cleaning water and air system, a storage medium, and cleaning equipment, which can meet the cleanliness requirements of high-end products and effectively remove stubborn burrs and metal powder in grooves on workpieces after cutting.

[0006] The embodiments of the present invention can be implemented as follows: An embodiment of the present invention provides a method for cleaning packaged workpieces, comprising: Mount and package the workpiece; Start the water pump; The water pump pumps water into the nozzle, and it is observed whether the spray direction of the nozzle is toward the cut groove on the surface of the packaged workpiece; If so, the water pressure of the water pump is adjusted by the frequency converter drive unit so that the water pump enters the high-pressure water cleaning and deburring mode. The driving nozzle sprays a water jet toward the cutting groove on the surface of the packaged workpiece to deburr the cutting groove. Acquire the pressure signal from the pressure sensor installed on the water pump pipeline; The operating parameters of the variable frequency drive unit are adjusted according to the pressure signal, thereby adjusting the water pressure of the water pump so that the water pressure of the water pump is maintained at a preset pressure value.

[0007] Optionally, after the step of pumping water into the nozzle and observing whether the spray direction of the nozzle is towards the cut line on the surface of the packaged workpiece, the packaged workpiece cleaning method further includes: If not, turn off the water pump and align the spray direction of the nozzle with the location of the cut on the surface of the packaged workpiece using a microscope.

[0008] Optionally, after the step of starting the water pump, the method for cleaning the packaged workpiece further includes: The flow signal from the flow sensor installed on the water pump is acquired, and the presence of water flow in the water pump is determined based on the flow signal. If the flow sensor does not detect water flow in the water pump within a preset time, it sends a first flow signal and shuts down the water pump based on the first flow signal; if the flow sensor detects water flow in the water pump within a preset time, it sends a second flow signal and keeps the water pump running based on the second flow signal.

[0009] Optionally, the method for cleaning the packaged workpiece further includes: Obtain the leakage signal from the leakage sensor installed on the water pump, and determine whether there is a leak in the water pump based on the leakage signal; If so, the water pump will be shut down based on the leak signal.

[0010] Embodiments of the present invention also provide a cleaning water-air circuit system, comprising: The high-pressure water jet path includes a water pump, a frequency converter drive unit, and a nozzle. The water pump is connected to an external water source. The frequency converter drive unit is connected to the water pump and is used to adjust the water pressure of the water pump. The nozzle is connected to the water pump. The water pump pumps water into the nozzle, and the nozzle sprays a water jet toward the cutting channel, thereby performing high-pressure rinsing and deburring on the cutting channel. An annular low-pressure water circuit includes a flow regulating valve and a baffle plate. The baffle plate is connected to an external water source. The flow regulating valve is connected to the baffle plate. The flow regulating valve is used to regulate the amount of water entering the baffle plate. The baffle plate is provided with an annular outlet. The annular outlet is arranged around the periphery of the nozzle, thereby forming an annular water curtain around the nozzle.

[0011] Optionally, an accumulator is provided on the outlet pipe of the water pump. The accumulator is used to maintain a constant water pressure output by the water pump. The accumulator is equipped with a rupture disc, which is used to spontaneously explode when the pressure in the accumulator exceeds a preset maximum pressure value, so as to relieve pressure.

[0012] Optionally, the high-pressure water spray path further includes a cooling pipe, one end of which is connected to the water inlet pipe of the water pump, and the other end of which is connected to the water pump. The cooling pipe supplies water to the water pump during operation to cool the water pump.

[0013] Optionally, the cleaning water-air circuit system further includes an air intake circuit, which includes an air intake pipe, a first switching valve, a pressure gauge, and a pneumatic pressure relief valve. The first switching valve is located on the air intake pipe and is used to open or close the air intake pipe. One end of the air intake pipe is connected to an external air source, and the other end of the air intake pipe is connected to the water pump. The pneumatic pressure relief valve is located on the air intake pipe, and the pressure gauge is located on the water pump to detect the pressure value during the operation of the water pump. The first switching valve is used to open when the pressure value of the water pump exceeds the maximum pressure value, and gas enters the pneumatic pressure relief valve through the air intake pipe, thereby opening the pneumatic pressure relief valve to relieve pressure on the water pump.

[0014] Optionally, the high-pressure water spray path further includes a flow meter, which is installed on the inlet pipe of the water pump.

[0015] Embodiments of the present invention also provide a storage medium for storing a computer program for implementing a method for cleaning packaged workpieces.

[0016] Embodiments of the present invention also provide a cleaning device for performing cleaning operations using a packaged workpiece cleaning method.

[0017] The beneficial effects of the packaging workpiece cleaning method, cleaning water-air circuit system, storage medium, and cleaning equipment of the present invention include, for example: The method for cleaning packaged workpieces includes: installing the packaged workpiece; starting a water pump; the water pump pumping water into a nozzle, observing whether the nozzle's spray direction is towards the cut grooves on the surface of the packaged workpiece; if so, adjusting the water pressure of the water pump through a frequency converter drive unit, causing the water pump to enter a high-pressure water cleaning and deburring mode; driving the nozzle to spray water jets towards the cut grooves on the surface of the packaged workpiece, thereby deburring the cut grooves; acquiring the pressure signal from a pressure sensor installed on the water pump pipeline; adjusting the operating parameters of the frequency converter drive unit based on the pressure signal, thereby adjusting the water pressure of the water pump to maintain a preset pressure value. During operation, by using a high-pressure water jet to directionally spray the cut grooves, it can penetrate deep into the micro-grooves, powerfully impacting and peeling away metal burrs and difficult-to-remove copper powder and other residues attached to the edges. This improves the surface cleanliness of the packaged workpiece and product reliability. Furthermore, before officially entering the high-pressure cleaning mode, the system first performs a pre-rinse using ordinary water pressure to simulate the cleaning path, confirming accurate nozzle positioning and correct spray direction before switching to the high-pressure mode. This ensures the accuracy of the cleaning path and avoids damage to the surface of the packaged workpiece due to accidental spraying or positioning deviation, thus improving the process tolerance.

[0018] This cleaning water and air system includes a high-pressure water jet path and an annular low-pressure water path. The high-pressure water jet path includes a water pump, a variable frequency drive unit, and nozzles. The water pump is connected to an external water source, and the variable frequency drive unit is connected to the water pump to adjust the water pressure. The nozzles are connected to the water pump, and the water pump pumps water into the nozzles. The nozzles spray water jets towards the cutting surface, thereby performing high-pressure rinsing and deburring of the cutting surface. The annular low-pressure water path includes a flow regulating valve and a baffle plate. The baffle plate is connected to an external water source, and the flow regulating valve is connected to the baffle plate. The flow regulating valve is used to regulate the amount of water entering the baffle plate. The baffle plate has an annular outlet, which surrounds the nozzle, thus forming an annular water curtain around the nozzle. In use, the variable frequency drive unit is used to control the speed of the water pump, enabling the pump to respond quickly and operate stably at the set high pressure value, ensuring a constant water jet impact force at the nozzle outlet. Furthermore, the high-pressure water jet possesses sufficient kinetic energy to penetrate the tiny grooves at the edge of the cutting channel, peeling away and washing away embedded metal powder (such as copper powder) and broken burrs. This effectively removes stubborn burrs and metal powder from the grooves on the cut sheet. By setting up an annular low-pressure water path around the nozzle, a continuous, surrounding low-pressure water curtain is formed using the annular outlet on the baffle plate. This water curtain actively intercepts and adsorbs water mist and splashing particles generated during the spraying process, achieving a dual effect of physical barrier and wetting sedimentation, significantly reducing the diffusion range of pollutants. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a flowchart of the packaging workpiece cleaning method provided in this embodiment; Figure 2 The flowchart is for the cleaning water and air circuit system provided in this embodiment.

[0021] Icons: 100-High-pressure water spray path; 110-Water pump; 120-Variable frequency drive unit; 130-Nozzle; 140-Accumulator; 150-Rupture disc; 160-Cooling pipe; 170-Flow meter; 180-Second switching valve; 190-Filter; 200-Annular low-pressure water path; 210-Flow regulating valve; 220-Water baffle; 230-Third switching valve; 300-Air inlet path; 310-Air inlet pipe; 320-First switching valve; 330-Pressure gauge; 340-Pneumatic pressure relief valve; 400-Wastewater tank. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0025] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0026] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0027] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0028] Traditional QFN / SON packages have pins located on the bottom of the package, making it impossible to form visible solder joints from the side after soldering. Therefore, they cannot pass automated optical inspection (AVI) or X-ray inspection (X-ray inspection). (ray) to determine whether the package is effectively soldered. To better meet the needs of SMT automated assembly and inspection, wettable flank (WF) technology has emerged.

[0029] Currently, the main method used in the industry for separating wettable edge devices is cutting. During the cutting process, the friction between the copper and the cutting blade generates curled edges, which adhere to the leads and form burrs. If these burrs are not removed promptly after the first cut, they can easily cause tin whiskers during subsequent electroplating, leading to a risk of short circuits in the device during use. Existing methods for burr removal generally use chemical reactions, where burr debris is removed through a chemical reaction. However, this method is expensive and difficult to implement in industrial applications.

[0030] Therefore, how to effectively remove stubborn burrs and metal powder from grooves on cut workpieces while ensuring workpiece integrity and operational safety has become a pressing technical challenge.

[0031] Please refer to Figures 1-2 This embodiment provides a method for cleaning packaged workpieces, which can effectively improve the technical problems mentioned above, meet the cleanliness requirements of high-end products, and effectively remove stubborn burrs and metal powder in grooves on the workpiece after cutting.

[0032] The method for cleaning the packaged workpiece includes: S1: Install and package the workpiece.

[0033] Specifically, the packaged workpiece includes multiple half-cut channels, each with side edge grooves on both sides.

[0034] In this embodiment, the packaged workpiece refers to a packaged product with a wettable side edge structure. The packaged product with a wettable side edge structure forms a groove with an elliptical shape in the copper lead area. After the groove is first cut in the middle of the copper lead area, side edge grooves are formed on both sides of the half-cut kerf.

[0035] It's important to note that a half-cut scribe line is formed after the first cut of the packaged workpiece, creating a stepped structure at the edge of the wettable side of the workpiece to facilitate subsequent soldering. The second cut, called a full cut, is performed along the centerline of the half-cut scribe line, completely separating the chips. The width of a full-cut scribe line is much smaller than that of a half-cut scribe line to avoid excessive cutting and material waste, allowing for more chips to be obtained from the same area.

[0036] S2: Start water pump 110.

[0037] S3: Obtain the flow signal from the flow sensor installed on the water pump 110, and determine whether there is water flowing through the water pump 110 based on the flow signal.

[0038] If the flow sensor does not detect water flow in the water pump 110 within a preset time, it sends a first flow signal and shuts down the water pump 110 according to the first flow signal; if the flow sensor detects water flow in the water pump 110 within a preset time, it sends a second flow signal and turns the water pump 110 back on according to the second flow signal.

[0039] Specifically, a flow meter 170 is installed on the water pump 110. The flow meter 170 displays a value to determine whether water is flowing through the pump 110. If the flow meter 170 displays a value of 0, it is determined that no water is flowing through the pump 110, and the pump is automatically shut down to prevent it from operating without water. This mechanism effectively avoids the "dry burning" phenomenon common in traditional systems, protects the core components of the high-pressure water pump 110 (such as seals and impellers) from overheating damage, extends the service life of the equipment, and reduces maintenance costs. Furthermore, this judgment logic can be integrated into automated processes to achieve fault self-diagnosis and automatic shutdown, improving the overall safety and intelligence level of the machine.

[0040] S4: Obtain the leakage signal from the leakage sensor installed on the water pump 110, and determine whether there is a leak inside the water pump 110 based on the leakage signal; If so, shut down water pump 110 based on the leak signal.

[0041] Specifically, by installing a leakage sensor to monitor the water pump 110 and its pipelines for leaks in real time, and immediately triggering a shutdown command for the water pump 110 upon detection of a leak, proactive safety protection for the high-pressure water system is achieved. Especially when using ultra-high-pressure water, any minor leak could lead to accidents such as high-pressure jet injuries, electrical short circuits, or slippery surfaces. Through the acquisition and linkage control of leakage signals, the power source can be cut off at the initial stage of a leak, preventing the accident from escalating. Combined with flow anomaly detection, a dual safety assurance system of "normal water intake at the front end" and "integrity of the pipeline at the back end" is formed, greatly improving the safety and stability of the equipment in actual production environments.

[0042] S5: The water pump 110 pumps water into the nozzle 130 and observes whether the spray direction of the nozzle 130 is towards the cutting groove on the surface of the packaged workpiece.

[0043] Specifically, after the water pump 110 starts, water flows through the pipeline to the nozzle 130 port. At this time, the system enters the initial calibration stage, and the operator needs to observe whether the actual spray direction of the nozzle 130 is accurately pointing to the cutting area on the surface of the packaged workpiece. The purpose of this step is to avoid the high-pressure water jet accidentally hitting non-target areas due to nozzle 130 deviation, which could cause damage to the chip on the packaged workpiece or cleaning failure. If the spray direction is correct, the next step can be proceeded; otherwise, adjustments need to be made to ensure alignment accuracy.

[0044] S6: If not, turn off the water pump 110 and align the spray direction of the nozzle 130 with the location of the cut on the surface of the packaged workpiece using a microscope.

[0045] S7: If so, the water pressure of the water pump 110 is adjusted by the frequency converter drive unit 120 so that the water pump 110 enters the high-pressure water cleaning and deburring mode.

[0046] Specifically, the variable frequency drive unit 120 can increase the water pressure of the water pump 110, so that the water pressure of the water pump 110 is in a high-pressure state. The high-pressure state mentioned here refers to the numerical range of high-pressure water in the prior art, and is not specifically limited here.

[0047] S8: Drive nozzle 130 to spray water jet toward the cutting path on the surface of the packaged workpiece, thereby deburring the cutting path; Specifically, the nozzle 130 first flushes the upper edge of the cutting track with a Z-shaped motion trajectory, and then flushes the lower edge of the cutting track with a Z-shaped motion trajectory. This can effectively remove burrs from the edge of the cutting track and also flush the grooves on the wafer surface, thereby washing away the metal powder in the grooves.

[0048] In this embodiment, after confirming that the nozzle 130 is correctly aligned, the variable frequency drive unit 120 adjusts the operating state of the water pump 110, causing its output water pressure to gradually increase and enter the high-pressure water cleaning and deburring mode. The "high-pressure water cleaning and deburring mode" is defined as the state in which the water pump 110 operates in a higher pressure range, generating a water column with sufficient kinetic energy to impact and peel off tiny burrs attached to the cutting edge and impurities such as copper powder embedded in the pits. This design effectively removes stubborn contaminants that traditional ordinary water washing cannot handle, significantly improving cleaning quality.

[0049] S9: Obtain the pressure signal from the pressure sensor installed on the pipeline of water pump 110.

[0050] S10: Adjust the operating parameters of the variable frequency drive unit 120 according to the pressure signal, thereby adjusting the water pressure of the water pump 110 so that the water pressure of the water pump 110 is maintained at a preset pressure value.

[0051] It should be noted that currently, the industry commonly uses conventional water rinsing or low-pressure spraying to clean the cut pieces. These methods typically use deionized water, sprayed onto the workpiece surface through nozzles 130 at relatively low pressure (generally below 10 MPa), relying on the water flow to remove loosely attached particles. However, due to the stubborn nature of burrs and the tendency of metal powder to be trapped in narrow crevices by electrostatic adsorption or mechanical interlocking, low-pressure water flow cannot provide sufficient impact force to completely remove them, resulting in limited cleaning effectiveness. In practical applications, it has been found that traditional cleaning methods cannot meet the cleanliness requirements of high-end products, especially in devices with high-density wiring or multi-layered metal structures, where the problem of residual copper powder in grooves is particularly prominent. To address this technical problem, the encapsulated workpiece cleaning method provided in this embodiment uses a variable frequency drive unit 120 to control the speed of the water pump 110. Combined with a pressure sensor installed on the water pump 110 pipeline, a closed-loop feedback system is formed. This system can collect the actual pressure signal in the water circuit in real time and dynamically adjust the operating parameters of the frequency converter (such as output frequency and voltage) based on this signal, thereby precisely regulating the speed and output water pressure of the water pump 110. This effectively overcomes the water pressure fluctuation problem caused by load fluctuations and changes in pipeline resistance, enabling the water pump 110 to respond quickly and operate stably under the set high pressure value, ensuring a constant water jet impact force at the nozzle 130 outlet. This avoids the pressure lag, overshoot, or underpressure phenomena present in traditional open-loop control, greatly improving the process repeatability and batch consistency of the cleaning process. Furthermore, the high-pressure water jet has sufficient kinetic energy to penetrate the tiny grooves at the edge of the cutting channel, peeling away and flushing away embedded metal powder (such as copper powder) and broken burrs. Experiments show that using this method, over 90% of the copper powder on the surface of the packaged workpiece is effectively removed, and the burr removal rate can reach over 80%, significantly better than conventional low-pressure cleaning. Furthermore, because the water pressure is gradually built up and controlled through a program, pre-wetting and preliminary rinsing can be performed at a lower pressure before the formal high-pressure rinsing, avoiding the risk of chipping or damage to brittle materials caused by directly applying high pressure, thus balancing cleaning efficiency and workpiece safety.

[0052] An embodiment of the present invention also provides a cleaning water-air circuit system, including a high-pressure water spray circuit 100 and an annular low-pressure water circuit 200. The high-pressure water spray circuit 100 includes a second switching valve 180, a water pump 110, a frequency converter drive unit 120, and a nozzle 130. The water pump 110 is connected to an external water source, and the frequency converter drive unit 120 is connected to the water pump 110 for adjusting the water pressure of the water pump 110. The second switching valve 180 is located in the water inlet pipe of the water pump 110 for opening or closing the water inlet pipe of the water pump 110. The nozzle 130 is connected to the water pump 110, and the water pump 110 pumps water into the nozzle 130, with the nozzle 130 facing... The cutting channel is sprayed with water jets to perform high-pressure flushing of the cutting channel. The annular low-pressure water circuit 200 includes a third switch valve 230, a flow regulating valve 210, and a baffle plate 220. The baffle plate 220 is connected to an external water source. The flow regulating valve 210 is connected to the baffle plate 220. The flow regulating valve 210 is used to regulate the amount of water entering the baffle plate 220. The third switch valve 230 is set on the water inlet pipe of the baffle plate 220 and is used to open or close the water inlet pipe of the baffle plate 220. The baffle plate 220 is provided with an annular water outlet, which is arranged around the periphery of the nozzle 130, thereby forming an annular water curtain around the nozzle 130.

[0053] It should be noted that the cleaning water and air circuit system achieves an integrated design of efficient deburring operation and environmental control by constructing a collaborative working architecture of high-pressure water jet circuit 100 and annular low-pressure water circuit 200. Among them, the high-pressure water jet circuit 100 uses the frequency converter drive unit 120 to adjust the output pressure of the water pump 110, so that the nozzle 130 can accurately spray high-pressure water jets according to different working conditions, thereby effectively removing tiny burrs in the cutting channel.

[0054] Furthermore, because the nozzle 130 operates under high pressure and the water flow velocity is extremely high, it easily generates a large amount of fine water mist, splashing droplets, and dust carrying metal fragments after impacting the workpiece. This not only affects the reliability of the equipment's electrical components but may also endanger the health of the operators. The cleaning water-air circuit system provided in this embodiment sets up an annular low-pressure water circuit 200 around the high-pressure nozzle 130, and uses the annular water outlet on the baffle plate 220 to form a continuous surrounding low-pressure water curtain. This water curtain can actively intercept and adsorb the water mist and splashing particles generated during the spraying process, achieving a dual effect of physical barrier and wetting and sedimentation, significantly reducing the diffusion range of pollutants. The annular low-pressure water circuit 200 is directly integrated around the nozzle 130, and the water curtain is formed by using the same external water source and controlling the flow regulating valve 210. There is no need for a separate water supply pump 110 or water storage device, saving space and facilitating installation and commissioning. The flow regulating valve 210 can flexibly adjust the water curtain flow rate according to different processing conditions (such as material type and cutting speed), avoiding secondary splashing caused by excessive water flow or insufficient protection caused by insufficient water flow, thus enhancing the adaptability and controllability of the system.

[0055] In this embodiment, the baffle plate 220 has a bowl-shaped structure, and the baffle plate 220 is upside down above the nozzle 130, with an annular water outlet surrounding the outer periphery of the nozzle 130.

[0056] Specifically, because the nozzle 130 has an extremely small orifice, impurities in the water supplied from the external water source can clog the nozzle 130, causing it to malfunction, resulting in uneven spraying, pressure loss, or even complete failure. Therefore, a filter 190 is installed on the inlet pipe of the water pump 110. The filter 190 filters the water entering the water pump 110, effectively removing particulate impurities (such as silt, rust, etc.) that may be present in the external water source, preventing them from entering the water pump 110 and subsequent piping system, ensuring the stable operation of the entire high-pressure system, and extending the service life of the nozzle 130 and the pump body.

[0057] In this embodiment, the water pump 110 is a high-pressure plunger pump. The pump body and the motor are connected by a belt. The motor provides driving force, and the reciprocating motion of the piston inside the pump body provides high-pressure water. The water pressure is proportional to the motor speed.

[0058] Furthermore, an accumulator 140 is installed on the outlet pipe of the water pump 110. The accumulator 140 is used to maintain a constant water pressure output by the water pump 110. A rupture disc 150 is installed on the accumulator 140, which is used to self-destruct when the pressure in the accumulator 140 exceeds a preset maximum pressure value, thereby releasing pressure. The internal structure of the high-pressure plunger pump is similar to that of a car engine, containing three pistons. The pistons compress low-pressure water and output high-pressure water. Since the number of pistons is limited, the output water pressure fluctuates. To ensure stable output water pressure of the high-pressure plunger pump, the accumulator 140 absorbs the periodic pressure fluctuations caused by the reciprocating motion of the pistons, acting as a "pressure stabilizing buffer." Because the working principle of the high-pressure plunger pump is similar to that of a reciprocating engine, its output pressure exhibits pulsating characteristics, directly affecting the stability of the jet at the nozzle 130. As a hydraulic energy storage element, the accumulator 140 can store excess energy when the pressure rises and release it to compensate when the pressure drops, thereby enabling the nozzle 130 to obtain a more uniform and continuous high-pressure water flow and improving the consistency of deburring quality.

[0059] Furthermore, the rupture disc 150 can serve as an overpressure protection device. When the pressure in the accumulator 140 abnormally increases (exceeding 100 MPa) and the electronically controlled pressure relief mechanism fails, the rupture disc 150 will automatically rupture when it reaches its physical tolerance limit, achieving passive and rapid pressure relief. This mechanism provides a final physical safety guarantee for the system, preventing pipeline rupture or equipment damage due to continuous pressure increases, and ensuring the safety of personnel and equipment in extreme situations.

[0060] Furthermore, the high-pressure water spray path 100 also includes a flow meter 170, which is installed on the inlet pipe of the water pump 110. The flow meter 170 can monitor the actual water volume entering the system in real time and calculate the theoretical flow rate by combining the known nozzle orifice diameter 130 with the current pressure value. By comparing the deviation between the actual flow rate and the theoretical flow rate, it is possible to determine whether there are leaks, blockages, or other abnormalities in the system. For example, if the actual flow rate is significantly higher than the theoretical value, it may indicate backflow or bypass leakage; if it is lower than the theoretical value, it may indicate filter blockage or decreased pump efficiency.

[0061] It should also be noted that the high-pressure water spray path 100 includes a cooling pipe 160. One end of the cooling pipe 160 is connected to the inlet pipe of the water pump 110, and the other end is connected to the water pump 110. The cooling pipe 160 supplies water to the water pump 110 during operation to cool it down. Since the high-pressure plunger pump is prone to overheating during high-frequency operation, this system has an independent cooling water path for circulating cooling and is equipped with an accumulator 140 to buffer pressure fluctuations in the plunger pump output, ensuring stable pressure at the nozzle 130 end and reducing the impact of sudden pressure changes on pipe joints and seals, thereby extending the service life of the high-pressure components. Simultaneously, by jointly monitoring the difference between the theoretical and actual flow rates using a pressure gauge 330 and a flow meter 170, leaks can be detected promptly. Combined with a leak detection sensor, this forms a double-insurance monitoring mechanism, improving system reliability.

[0062] Furthermore, the cleaning water and air circuit system also includes an air intake circuit 300, which includes an air intake pipe 310, a first switching valve 320, a pressure gauge 330, and a pneumatic pressure relief valve 340. The first switching valve 320 is installed on the air intake pipe 310 and is used to open or close the air intake pipe 310. One end of the air intake pipe 310 is connected to an external air source, and the other end of the air intake pipe 310 is connected to the water pump 110. The pneumatic pressure relief valve 340 is installed on the air intake pipe 310, and the pressure gauge 330 is installed on the water pump 110 to detect the pressure value during the operation of the water pump 110. The first switching valve 320 is used to open when the pressure value of the water pump 110 exceeds the maximum pressure value. Gas enters the pneumatic pressure relief valve 340 through the air intake pipe 310, thereby opening the pneumatic pressure relief valve 340 to relieve pressure on the water pump 110. The pressure gauge 330 monitors the operating pressure of the water pump 110 in real time. Once the pressure approaches the danger threshold, the control system triggers the opening of the first switching valve 320, allowing compressed gas to be introduced into the pneumatic pressure relief valve 340 through the air inlet pipe 310, which then opens rapidly, thus achieving rapid pressure relief in the high-pressure water circuit. This mechanism offers fast response and reliable operation, representing a hardware-level safety protection measure that compensates for the potential delays or failures associated with purely software control. Compared to solutions relying solely on motor speed regulation or solenoid valve control, this pneumatic pressure relief method possesses stronger anti-interference capabilities and fault tolerance, making it a crucial element in ensuring the safe operation of high-pressure systems.

[0063] In addition, the high-pressure flushing system also includes a wastewater tank 400, which can collect the water jets sprayed from the nozzle 130, the water flow from the annular outlet, the water discharged after the rupture disc 150 explodes, the cooling water discharged from the cooling pipe 160, and the pressure relief water flowing from the water pump 110 after the pneumatic pressure relief valve 340 is opened, thereby achieving centralized drainage.

[0064] Based on the same inventive concept, embodiments of the present invention also provide a storage medium for storing a computer program, the computer program for implementing a method for cleaning packaged workpieces. Optionally, the storage medium includes ROM / RAM, magnetic disk, optical disk, USB flash drive, etc.

[0065] Based on the same inventive concept, this embodiment of the invention also provides a cleaning device for performing cleaning operations using a packaged workpiece cleaning method. The cleaning device in this embodiment can be a standalone high-pressure water deburring device, or a processing device integrating packaged workpiece cutting and deburring cleaning; this embodiment does not specifically limit it in this way.

[0066] In summary, this invention provides a method for cleaning packaged workpieces, a cleaning water-air circuit system, a storage medium, and cleaning equipment. The method includes: installing the packaged workpiece; starting a water pump 110; pumping water into a nozzle 130 using the water pump 110; observing whether the spray direction of the nozzle 130 is directed towards the cut surface of the packaged workpiece; if so, adjusting the water pressure of the water pump 110 via a frequency converter drive unit 120 to enter a high-pressure water cleaning and deburring mode; driving the nozzle 130 to spray water jets towards the cut surface of the packaged workpiece, thereby deburring the cut surface; acquiring the pressure signal from a pressure sensor installed on the water pump 110 pipeline; adjusting the operating parameters of the frequency converter drive unit 120 based on the pressure signal to adjust the water pressure of the water pump 110, maintaining the water pressure at a preset pressure value. During operation, by using a high-pressure water jet to directionally spray the cut surface, it can penetrate deep into the micro-groove area, powerfully impacting and peeling away metal burrs and difficult-to-remove copper powder and other residues attached to the edges. This improves the surface cleanliness of the packaged workpiece and product reliability. Before officially entering high-pressure cleaning mode, the system first performs a pre-rinse using ordinary water pressure to simulate the cleaning path, confirming that nozzle 130 is accurately positioned and the spray direction is correct before switching to high-pressure mode. This ensures the accuracy of the cleaning path and avoids damage to the surface of the packaged workpiece due to mis-spraying or positioning deviation, thus improving process fault tolerance.

[0067] The cleaning water and air circuit system includes a high-pressure water jet circuit 100 and an annular low-pressure water circuit 200. The high-pressure water jet circuit 100 includes a water pump 110, a frequency converter drive unit 120, and a nozzle 130. The water pump 110 is connected to an external water source. The frequency converter drive unit 120 is connected to the water pump 110 and is used to adjust the water pressure of the water pump 110. The nozzle 130 is connected to the water pump 110. The water pump 110 pumps water into the nozzle 130. The nozzle 130 sprays a water jet toward the cutting surface, thereby performing high-pressure rinsing and deburring of the cutting surface. The annular low-pressure water circuit 200 includes a flow regulating valve 210 and a baffle plate 220. The baffle plate 220 is connected to an external water source. The flow regulating valve 210 is connected to the baffle plate 220 and is used to regulate the amount of water entering the baffle plate 220. The baffle plate 220 is provided with an annular water outlet, which is arranged around the periphery of the nozzle 130, thereby forming an annular water curtain around the nozzle 130. During use, the variable frequency drive unit 120 is introduced to control the speed of the water pump 110, enabling the water pump 110 to respond quickly and operate stably under the set high pressure value, ensuring a constant water jet impact force at the nozzle 130 outlet. Furthermore, the high-pressure water jet has sufficient kinetic energy to penetrate the tiny grooves at the edge of the cutting channel, peeling away and washing away embedded metal powder (such as copper powder) and broken burrs, effectively removing stubborn burrs and metal powder from the grooves on the cut sheet. By setting an annular low-pressure water path 200 around the nozzle 130, a continuous surrounding low-pressure water curtain is formed using the annular outlet on the baffle plate 220. This water curtain actively intercepts and adsorbs water mist and splashing particles generated during the spraying process, achieving a dual effect of physical barrier and wetting sedimentation, significantly reducing the diffusion range of pollutants.

[0068] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for cleaning packaged workpieces, characterized in that, include: Mount and package the workpiece; Start the water pump (110); The water pump (110) pumps water into the nozzle (130), and observes whether the spray direction of the nozzle (130) is towards the cutting groove on the surface of the packaged workpiece. If so, the water pressure of the water pump (110) is adjusted by the frequency conversion drive unit (120) so that the water pump (110) enters the high-pressure water cleaning and deburring mode. The drive nozzle (130) sprays a water jet toward the cut surface of the packaged workpiece to deburr the cut surface; Obtain the pressure signal from the pressure sensor installed on the pipeline of the water pump (110); The operating parameters of the variable frequency drive unit (120) are adjusted according to the pressure signal, thereby adjusting the water pressure of the water pump (110) so that the water pressure of the water pump (110) is maintained at a preset pressure value.

2. The method for cleaning packaged workpieces according to claim 1, characterized in that, After the step of pumping water into the nozzle (130) and observing whether the spray direction of the nozzle (130) is towards the cutting groove on the surface of the packaged workpiece, the packaged workpiece cleaning method further includes: If not, turn off the water pump (110) and align the spray direction of the nozzle (130) with the location of the cut on the surface of the packaged workpiece using a microscope.

3. The method for cleaning packaged workpieces according to claim 1, characterized in that, After the step of starting the water pump (110), the method for cleaning the packaged workpiece further includes: Obtain the flow signal from the flow sensor installed on the water pump (110), and determine whether there is water flowing through the water pump (110) based on the flow signal; If the flow sensor does not detect water flow in the water pump (110) within a preset time, it sends a first flow signal and shuts down the water pump (110) according to the first flow signal; if the flow sensor detects water flow in the water pump (110) within a preset time, it sends a second flow signal and turns the water pump (110) back on according to the second flow signal.

4. The method for cleaning packaged workpieces according to claim 3, characterized in that, The method for cleaning the packaged workpiece also includes: Obtain the leakage signal from the leakage sensor installed on the water pump (110), and determine whether there is a leak in the water pump (110) based on the leakage signal; If so, the water pump (110) shall be shut down based on the water leakage signal.

5. A cleaning water and air circuit system, characterized in that, include: A high-pressure water jet path (100) includes a water pump (110), a variable frequency drive unit (120), and a nozzle (130). The water pump (110) is connected to an external water source. The variable frequency drive unit (120) is connected to the water pump (110) and is used to adjust the water pressure of the water pump (110). The nozzle (130) is connected to the water pump (110). The water pump (110) pumps water into the nozzle (130). The nozzle (130) sprays a water jet toward the cutting channel, thereby performing high-pressure flushing and deburring on the cutting channel. An annular low-pressure water circuit (200) includes a flow regulating valve (210) and a baffle plate (220). The baffle plate (220) is connected to an external water source. The flow regulating valve (210) is connected to the baffle plate (220). The flow regulating valve (210) is used to regulate the amount of water entering the baffle plate (220). The baffle plate (220) is provided with an annular outlet. The annular outlet is arranged around the periphery of the nozzle (130), thereby forming an annular water curtain around the nozzle (130).

6. The cleaning water and air circuit system according to claim 5, characterized in that, An accumulator (140) is provided on the outlet pipe of the water pump (110). The accumulator (140) is used to maintain a constant water pressure output by the water pump (110). A rupture disc (150) is provided on the accumulator (140). The rupture disc (150) is used to self-explode when the pressure of the accumulator (140) exceeds a preset maximum pressure value in order to release pressure.

7. The cleaning water and air circuit system according to claim 5, characterized in that, The high-pressure water spray path (100) also includes a cooling pipe (160), one end of which is connected to the water inlet pipe of the water pump (110), and the other end of which is connected to the water pump (110). The cooling pipe (160) supplies water to the water pump (110) during the operation of the water pump (110) to cool down the water pump (110).

8. The cleaning water and air circuit system according to claim 5, characterized in that, The cleaning water-air circuit system further includes an air intake circuit (300), which includes an air intake pipe (310), a first switching valve (320), a pressure gauge (330), and a pneumatically controlled pressure relief valve (340). The first switching valve (320) is located in the air intake pipe (310) and is used to open or close the air intake pipe (310). One end of the air intake pipe (310) is connected to an external air source, and the other end of the air intake pipe (310) is connected to the water pump (110). A pressure relief valve (340) is installed on the air inlet pipe (310), and a pressure gauge (330) is installed on the water pump (110) to detect the pressure value during the operation of the water pump (110). The first switch valve (320) is used to open when the pressure value of the water pump (110) exceeds the maximum pressure value. Gas enters the pneumatic pressure relief valve (340) through the air inlet pipe (310), thereby opening the pneumatic pressure relief valve (340) to relieve pressure on the water pump (110).

9. The cleaning water and air circuit system according to claim 5, characterized in that, The high-pressure water spray path (100) also includes a flow meter (170), which is installed on the inlet pipe of the water pump (110).

10. A storage medium, characterized in that, The storage medium is used to store a computer program for implementing the packaged workpiece cleaning method according to any one of claims 1-4.

11. A cleaning device, characterized in that, Used for cleaning operations performed by the packaging workpiece cleaning method according to any one of claims 1-4.

Images