Blue film chip stripping device and chip production equipment

Abstract

The invention belongs to the technical field of chip production equipment, and discloses a blue film chip stripping device and chip production equipment. The blue film chip stripping device comprises a plurality of ejector pin assemblies, a switching driving mechanism, a jacking mechanism and a positioning matching assembly. According to the blue film chip stripping device provided by the invention, a clamping structure in which the plurality of groove bodies and the plurality of matching pieces are in one-to-one correspondence is adopted, the plurality of groove bodies are positioned on the same horizontal plane, and the extending directions are distributed in a staggered manner, so that positioning constraint can be formed in a plurality of directions of the horizontal plane, and the problem of gap deviation easily generated by a single-direction positioning structure is avoided; meanwhile, the matching mode of adaptive clamping does not depend on strict pin hole clearance control, accurate limiting of the needle body on the horizontal plane is achieved through multi-directional staggered positioning, it is ensured that when the jacking mechanism pushes the needle body, the needle body is always aligned with the preset jacking position of the chip, and the chip jacking efficiency is improved. The problems that the rising position of the ejector pin assembly deviates and the chip is stripped unsuccessfully due to the fact that a gap of an existing structure is too large are effectively solved.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing equipment technology, and in particular to a blue film chip stripping device and chip manufacturing equipment. Background Technology

[0002] In automated production scenarios involving multi-size chip bonding, blue film chip stripping is a critical process for chip picking and subsequent bonding. It requires rapid switching of ejector pin assemblies based on different chip sizes, and precise coordination between the ejector pin assemblies and the lifting mechanism is essential to ensure positioning accuracy during chip stripping and prevent chip damage or stripping failure, thereby meeting the industry's demand for high precision and high efficiency.

[0003] The existing stripping device mainly consists of a lifting mechanism, multiple sets of pin assemblies, and a switching drive mechanism. The switching drive mechanism moves different pin assemblies above the lifting mechanism by rotating or moving horizontally. The lifting mechanism and the pin assemblies are positioned by a pin-hole engagement. The lifting mechanism moves upward to push the pin assemblies to contact the blue film. After the pin body of the pin assembly lifts the chip and the stripping is completed, the lifting mechanism resets, and the switching mechanism moves the next set of pin assemblies for subsequent operations.

[0004] However, the existing pin-hole mating positioning method can cause the pin assembly and the lifting mechanism to jam when the mating gap is too small, leading to switching failure. When the mating gap is too large, the repeat positioning accuracy is insufficient, causing the rising position of the pin assembly to deviate from the chip center, ultimately resulting in chip stripping failure. Furthermore, the collision and impact during the lifting process will accelerate the wear and aging of the components, which cannot meet the long-term high-precision stripping requirements.

[0005] Therefore, the above problems urgently need to be solved. Summary of the Invention

[0006] The purpose of this invention is to provide a blue film chip stripping device and chip production equipment to avoid the gap deviation problem that is easily caused by the single-direction positioning structure, and to solve the problem of chip stripping failure caused by the deviation of the rising position of the ejector assembly due to excessive gap in the existing structure. It also slows down the wear and aging of components and meets the long-term high-precision stripping requirements.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] A blue film chip stripping device, comprising:

[0009] Multiple sets of ejector pin assemblies, each set of ejector pin assemblies is adapted to chips of different sizes, and each set of ejector pin assemblies includes a needle body that can be raised and lowered;

[0010] The switching drive mechanism is configured to drive multiple sets of the ejector pin assemblies to rotate to a preset working position, so as to adapt to different ejector pin assemblies when peeling off chips of different sizes;

[0011] The lifting mechanism, corresponding to the preset working position, is configured to push the ejector pin assembly located at the preset working position toward the blue film direction, so as to lift the chip through the pin body;

[0012] The blue film chip stripping device also includes:

[0013] The positioning and mating assembly includes a groove and a mating part that can be adapted to snap into place, wherein the groove and the mating part are respectively disposed at the top of the lifting mechanism and the bottom of the ejector pin assembly;

[0014] The groove is provided in multiple ways and located in the same horizontal plane. The extension directions of each groove are staggered. Multiple mating parts are provided accordingly, and each of the multiple mating parts corresponds to one of the multiple grooves.

[0015] When the top of the lifting mechanism is attached to the bottom of the ejector assembly, the plurality of mating parts respectively engage with the corresponding grooves to restrict the ejector assembly in multiple degrees of freedom in the horizontal plane.

[0016] Preferably, the mating component includes a spherical mating surface, and the mating component is engaged with the corresponding groove through the spherical mating surface.

[0017] Preferably, the groove includes symmetrically inclined contact surfaces so that the spherical mating surface can form two-point contact with the contact surface to achieve a snap-fit.

[0018] Preferably, the plurality of grooves are evenly distributed along the same circumferential direction, and the extension direction of each groove points to the center of the circumference.

[0019] Preferably, the blue film chip stripping device further includes a pressure application component disposed on the lifting mechanism or the ejector assembly, the pressure application component being configured to apply pressure toward the groove to the mating member so that the mating member remains in contact with the groove when the chip is lifted.

[0020] Preferably, the pressure application component includes mutually adsorbing magnetic elements disposed at the top of the lifting mechanism or the bottom of the ejector assembly.

[0021] Preferably, the lifting mechanism includes a lifting body, a positioning seat, and a pushing member, wherein:

[0022] The lifting body is capable of rising and falling;

[0023] The positioning seat is disposed on the top of the lifting body. The positioning seat is used to support the groove or the mating part, and can fit against the bottom of the ejector pin assembly under the drive of the lifting body, so that the groove and the mating part are engaged.

[0024] The pusher is vertically slidably disposed on the lifting body. When the groove is engaged with the mating part, the pusher can lift the needle body.

[0025] Preferably, the lifting mechanism further includes a first drive component and a second drive component, wherein the first drive component is configured to drive the lifting body to rise and fall, and the second drive component is configured to lift the pusher.

[0026] Preferably, the first drive assembly further includes a rotating component and a transmission assembly, wherein:

[0027] The rotating component is configured to output rotational power;

[0028] The transmission assembly is connected between the rotating component and the lifting body to convert the rotational power into the lifting power of the lifting body.

[0029] A chip manufacturing apparatus includes a feeding mechanism and the aforementioned blue film chip stripping device, wherein:

[0030] The feeding mechanism is used to convey the blue film with the chip to be peeled attached, and to transfer the target chip on the blue film to a preset working station;

[0031] The blue film chip stripping device is configured to cooperate with the feeding mechanism to strip the target chip from the blue film.

[0032] The beneficial effects of this invention are:

[0033] The blue film chip stripping device provided by this invention adopts a snap-fit ​​structure with multiple slots and multiple mating parts corresponding one-to-one. The multiple slots are located on the same horizontal plane and their extension directions are staggered, thereby forming positioning constraints from multiple directions on the horizontal plane and avoiding the gap deviation problem that is easy to occur in single-direction positioning structures. At the same time, the mating method of the adaptive snap-fit ​​does not rely on strict pin hole gap control. Through multi-directional staggered positioning, the pin body is accurately limited on the horizontal plane, ensuring that when the lifting mechanism pushes the pin body, the pin body is always aligned with the preset lifting position of the chip. This effectively solves the problem of the pin assembly rising position deviation and chip stripping failure caused by excessive gap in the existing structure.

[0034] Meanwhile, the groove and the mating parts are a matching snap-fit ​​structure, and the multi-dimensional positioning formed by multiple staggered grooves and mating parts eliminates the need to reduce the mating gap to ensure positioning accuracy. This allows the lifting mechanism and the ejector assembly to move smoothly relative to each other after the ejector assembly is switched to the working position, solving the switching failure problem caused by improper gap in the existing structure.

[0035] In addition, the interlocking of multiple staggered grooves with their corresponding mating parts allows the force of the lifting mechanism to be evenly transmitted to the ejector pin assembly through multiple contact points. Compared with the point contact method of pin hole mating, the force distribution is more balanced, which can buffer the impact load generated during the lifting process, reduce hard collisions between parts, and thus slow down the wear and aging of parts, meeting the long-term high-precision peeling requirements. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the blue film chip stripping device provided by the present invention;

[0037] Figure 2 This is a structural schematic diagram of the ejector pin assembly and positioning mating assembly provided by the present invention;

[0038] Figure 3 This is a bottom view of the ejector pin assembly provided by the present invention;

[0039] Figure 4 This is a schematic diagram of the positioning and mating component provided by the present invention.

[0040] In the picture:

[0041] 1. Ejector pin assembly; 2. Switching drive mechanism; 3. Lifting mechanism; 31. Lifting body; 32. Positioning seat; 33. Pushing component; 4. Positioning mating assembly; 41. Groove; 411. Contact surface; 42. Mating component; 421. Spherical mating surface; 5. Pressing assembly; 51. Magnetic suction component; 6. First drive assembly; 61. Rotating component; 62. Transmission assembly; 7. Second drive assembly. Detailed Implementation

[0042] The invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the drawings, not the entire structure.

[0043] In the description of the invention, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the invention based on the specific circumstances.

[0044] In this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0045] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0046] Please see Figures 1 to 4 This embodiment provides a blue film chip stripping device, which includes multiple sets of ejector pin assemblies 1, a switching drive mechanism 2, and a lifting mechanism 3. Each set of ejector pin assemblies 1 is adapted to chips of different sizes, and each set of ejector pin assemblies 1 includes a needle body capable of lifting and lowering. The switching drive mechanism 2 is configured to drive multiple sets of ejector pin assemblies 1 to rotate to a preset working position, so as to adapt to different ejector pin assemblies 1 when stripping chips of different sizes. The lifting mechanism 3 is set to correspond to the preset working position and is configured to push the ejector pin assembly 1 at the preset working position toward the blue film, so as to lift the chip by the needle body.

[0047] The blue film chip stripping device also includes a positioning and mating assembly 4. The positioning and mating assembly 4 includes a groove 41 and mating parts 42 capable of being fitted and engaged. The groove 41 and mating parts 42 are respectively disposed at the top of the lifting mechanism 3 and the bottom of the ejector assembly 1. Multiple grooves 41 are provided and located in the same horizontal plane, with their extension directions staggered. Multiple mating parts 42 are correspondingly provided, and each mating part 42 corresponds one-to-one with a specific groove 41. When the top of the lifting mechanism 3 is attached to the bottom of the ejector assembly 1, the multiple mating parts 42 engage with their corresponding grooves 41 to restrict multiple degrees of freedom of the ejector assembly 1 in the horizontal plane.

[0048] During operation, the switching drive mechanism 2 first drives multiple sets of ejector pin assemblies 1 to rotate until the ejector pin assembly 1 that matches the size of the chip to be peeled moves to the preset working position, completing the switching and adaptation of the ejector pin assembly 1. When the target ejector pin assembly 1 reaches the working position, the lifting mechanism 3 starts and pushes the ejector pin assembly 1 upward, so that multiple slots 41 and multiple mating parts 42 are in one-to-one correspondence. As the lifting mechanism 3 continues to push upward, each mating part 42 is respectively engaged in the corresponding slot 41. Then, the lifting mechanism 3 pushes the pin body in the ejector pin assembly 1 to slide vertically towards the blue film, and finally lifts the chip by the pin body, completing the peeling action.

[0049] It is understandable that by adopting a snap-fit ​​structure with multiple slots 41 corresponding to multiple mating parts 42, and with the multiple slots 41 located on the same horizontal plane and their extension directions being staggered, positioning constraints can be formed from multiple directions on the horizontal plane, avoiding the gap deviation problem that is easily caused by a single-direction positioning structure. At the same time, the matching snap-fit ​​method does not rely on strict pin hole gap control. Through multi-directional staggered positioning, the pin body is accurately limited on the horizontal plane, ensuring that when the lifting mechanism 3 pushes the pin body, the pin body is always aligned with the preset lifting position of the chip. This effectively solves the problem of the pin assembly 1 deviating from its rising position and chip peeling failure caused by excessive gaps in the existing structure.

[0050] It is also understandable that the groove 41 and the mating part 42 are adapted snap-fit ​​structures, and the multi-dimensional positioning formed by multiple staggered grooves 41 and mating parts 42 does not require reducing the mating gap to ensure positioning accuracy. After the ejector assembly 1 is switched to the working position, the relative movement between the lifting mechanism 3 and the ejector assembly 1 is smooth, which solves the problem of switching failure caused by improper gap in the existing structure.

[0051] In addition, the interlocking engagement of multiple staggered grooves 41 with their corresponding mating parts 42 allows the force of the lifting mechanism 3 to be evenly transmitted to the ejector assembly 1 through multiple contact points. Compared with the point contact method of pin hole mating, the force distribution is more balanced, which can buffer the impact load generated during the lifting process, reduce hard collisions between parts, and thus slow down the wear and aging of parts, meeting the long-term high-precision peeling requirements.

[0052] Specifically, the mating component 42 includes a spherical mating surface 421, which engages with the corresponding groove 41. Thus, the spherical mating surface 421 of the mating component 42 forms a point-contact engagement with the groove 41. Compared to the surface contact of a pin-hole engagement, the spherical structure has adaptive fine-tuning capabilities. Even if there is a slight deviation in the relative position between the groove 41 and the mating component 42, attitude compensation can be achieved through the sliding of the spherical mating surface 421, avoiding motion jamming caused by rigid interference and ensuring smooth relative movement between the lifting mechanism 3 and the pin body after the pin assembly 1 is switched. Simultaneously, the spherical mating surface 421 guides the mating component 42 to quickly fall into the preset positioning position of the groove 41, reducing positioning deviation. Furthermore, the spherical contact avoids a decrease in positioning accuracy due to wear of the mating surface, ensuring that the pin body can accurately align with the preset lifting position of the chip during each lifting process.

[0053] Correspondingly, the groove 41 includes a symmetrically inclined contact surface 411, so that the spherical mating surface 421 can form a two-point contact with the contact surface 411 to achieve a snap-fit. This configuration, with the symmetrically inclined contact surface 411 and the spherical mating surface 421 forming a two-point contact, creates a stable horizontal positioning reference based on the symmetrical structure, avoiding the horizontal position offset problem that easily occurs with a single contact point or an asymmetrical structure. Each time the ejector assembly 1 switches to the working position, the spherical mating surface 421, guided by the symmetrically inclined contact surface 411, accurately falls into the preset horizontal positioning position, ensuring that the horizontal contact position between the mating part 42 and the groove 41 is always consistent. This, in turn, keeps the center horizontal alignment of the ejector body uniform, laying the foundation for the subsequent lifting mechanism 3 to push the ejector body to align with the chip center.

[0054] Meanwhile, compared with the unidirectional height limit of the pin hole fit, the two-point contact of the symmetrically inclined contact surface 411 can disperse the impact force to two contact points, which not only avoids the instantaneous displacement of the fit position due to impact, but also reduces the wear rate of the component in the horizontal direction, further ensuring the stability of the fit position during long-term use.

[0055] It should be noted that the mating part 42 can be a spherical component such as a ball, a spherical pin, or a hemisphere, and the groove 41 can be a Gothic arched groove, a V-shaped groove, a semi-circular groove, or a similar structure. This embodiment does not impose specific restrictions or requirements on these aspects.

[0056] To further enhance the fitting accuracy between the lifting mechanism 3 and the ejector pin assembly 1, multiple slots 41 are evenly distributed along the same circumferential direction, with the extension direction of each slot 41 pointing towards the center of the circumference. This ensures that the relative positions of each slot 41 and the circumferential center remain consistent. When the mating part 42 contacts each slot 41, it forms a symmetrical constraint around the center, avoiding the accumulation of positioning deviations easily caused by asymmetrical layouts. Simultaneously, the symmetrical distribution structure guides the mating part 42 to quickly converge towards the center. Combined with the self-adaptability of the spherical mating surface 421, gapless centering and positioning are achieved, effectively solving the problem of the ejector pin assembly 1 deviating from the chip center and failing to peel off due to excessive gaps in existing pin hole mating systems.

[0057] In this embodiment, there are three grooves 41 located at the top of the lifting mechanism 3. The included angle between any two grooves 41 is 120 degrees. The bottom of the ejector assembly 1 is provided with three mating parts 42. The grooves 41 and the mating parts 42 form a one-to-one matching positioning and mating structure.

[0058] Specifically, the blue film chip stripping device also includes a pressure application component 5 disposed on the lifting mechanism 3 or the ejector assembly 1. The pressure application component 5 is configured to apply pressure toward the groove 41 to the mating member 42 so that the mating member 42 and the groove 41 remain in contact when the chip is lifted.

[0059] Understandably, the pressure application component 5 applies continuous pressure to the mating part 42 toward the groove 41, which can completely eliminate the potential gap between the mating part 42 and the groove 41, ensuring that the two remain in contact throughout the entire dynamic process of lifting the chip, effectively resisting the positioning interference caused by lifting impact and equipment vibration, and ensuring that the needle is always accurately aligned with the preset lifting position of the chip.

[0060] Furthermore, the pressure application component 5 includes a magnetic suction element 51 that is mutually attracted to the top of the lifting mechanism 3 or the bottom of the ejector assembly 1. The magnetic suction element 51 has a flexible and adaptable attraction force. Compared with rigid pressure application methods such as cylinders and electric cylinders, it will not cause motion interference due to excessive constraint. During the switching of the ejector assembly 1 and the lifting mechanism 3, it can guide the mating part 42 to fit precisely with the groove 41 through the attraction force, and avoid the jamming that may be caused by rigid pressure.

[0061] In this embodiment, the magnetic suction component 51 includes several magnets distributed at the bottom of the ejector pin assembly 1. It generates continuous pressure by adsorbing the metal part at the top of the lifting mechanism 3, so that the bottom of the ejector pin assembly 1 and the top of the lifting mechanism 3 are kept in contact, that is, the mating part 42 and the groove 41 are precisely fitted to ensure positioning accuracy.

[0062] In other embodiments, in addition to the magnetic suction member 51, the pressure application component 5 may also adopt a structure driven by a cylinder, electric cylinder or motor to apply pressure toward the groove 41 to the mating member 42 to maintain the two in a close and positioned state.

[0063] Specifically, the lifting mechanism 3 includes a lifting body 31, a positioning seat 32, and a pushing member 33. The lifting body 31 is capable of lifting and lowering. The positioning seat 32 is disposed on the top of the lifting body 31. The positioning seat 32 is used to support the groove 41 or the mating part 42, and can fit against the bottom of the ejector pin assembly 1 under the drive of the lifting body 31, so that the groove 41 and the mating part 42 are engaged. The pushing member 33 is vertically slidably disposed on the lifting body 31. When the groove 41 and the mating part 42 are engaged, the pushing member 33 can lift the ejector pin.

[0064] It is understandable that the positioning seat 32 is used to support the groove 41 or the mating part 42 and fits against the bottom of the ejector pin assembly 1. The pusher 33 slides vertically to lift the pin body, realizing the separation of positioning and pushing functions and following the orderly action process of positioning first and then pushing. This avoids interference of the pushing force on the positioning structure, ensures the positioning accuracy and stability when the pin body is pushed, and optimizes the motion adaptability through step-by-step actions to ensure that the pushing force direction is accurate and the movement is smooth.

[0065] It is worth noting that in this embodiment, the multiple grooves 41 mentioned above are specifically disposed on the top of the positioning seat 32. The object attracted by the magnet at the bottom of the ejector assembly 1 is the positioning seat 32. The positioning seat 32 is made of a metal material that can be attracted by a magnet, thereby ensuring that the attraction generates continuous pressure and ensuring that the mating part 42 and the groove 41 are stably fitted together. It should be noted that the sliding structure between the lifting body 31 and the pushing part 33 can be any existing sliding structure, such as a slide rail structure.

[0066] Correspondingly, the lifting mechanism 3 also includes a first drive assembly 6 and a second drive assembly 7. The first drive assembly 6 is configured to drive the lifting body 31 to rise and fall, and the second drive assembly 7 is configured to lift the pusher 33. With this configuration, the independent control design of the first drive assembly 6 driving the lifting body 31 to rise and fall and the second drive assembly 7 lifting the pusher 33 allows for independent control of the positioning action of the positioning seat 32 against the ejector pin assembly 1 and the pushing action of the pusher 33 lifting the ejector pin body. This avoids action interference caused by a single drive and ensures the fitting accuracy between the positioning seat 32 and the ejector pin assembly 1 and the stroke accuracy of the pusher 33 pushing the ejector pin body.

[0067] Furthermore, the first drive assembly 6 also includes a rotating component 61 and a transmission assembly 62. The rotating component 61 is configured to output rotational power. The transmission assembly 62 is connected between the rotating component 61 and the lifting body 31 to convert the rotational power into the lifting power of the lifting body 31. Compared with the problem of a long structure and large space occupation of a direct lifting drive, the structure is shorter and the layout is more compact by converting rotational power into lifting power through the rotating component 61 and the transmission assembly 62, which can significantly save installation space and precisely adapt to the modular and miniaturized requirements of the device.

[0068] It should be noted that in this embodiment, the specific structures of the first drive component 6 and the second drive component 7 can be combined using existing components. For example, the first drive component 6 uses an existing rotary motor as the rotating component 61, and is equipped with an existing crank mechanism, a sliding plate, and a guide rail as the transmission component 62. After the rotary motor outputs rotational power, the rotational motion is converted into linear motion through the crank mechanism, driving the lifting body 31 on the sliding plate to slide smoothly along the guide rail, thereby driving the lifting body 31 to achieve lifting and lowering. The second drive component 7 can use an existing voice coil motor, in conjunction with the pusher 33 mentioned above. That is, after the voice coil motor starts, it drives the pusher 33 to slide vertically, and the pusher 33 pushes the pin body.

[0069] This embodiment also provides a chip manufacturing apparatus, including a feeding mechanism and the aforementioned blue film chip stripping device. The feeding mechanism is used to transport a blue film with a chip to be stripped adhered to it, and to transfer the target chip on the blue film to a preset working station. The blue film chip stripping device is configured to cooperate with the feeding mechanism to peel the target chip off the blue film.

[0070] It is understandable that chip production equipment including the aforementioned blue film chip stripping device can achieve automated and high-precision stripping of chips of various sizes through the cooperation of the feeding mechanism and the blue film chip stripping device, without the need to stop the machine to replace the ejector pin assembly 1, which greatly improves production efficiency and chip stripping stability, and is suitable for production scenarios of multi-size chip bonding.

[0071] It should be noted that the material suppliers are existing mature technologies in the semiconductor manufacturing field, and their specific models can be flexibly adapted and selected according to the chip size, production capacity requirements, etc. in the actual application scenario, so they will not be elaborated on.

[0072] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A blue film chip stripping device, comprising: Multiple sets of ejector pin assemblies (1), each set of ejector pin assemblies (1) is adapted to chips of different sizes, and each set of ejector pin assemblies (1) includes a needle body that can be raised and lowered; The switching drive mechanism (2) is configured to drive multiple sets of the ejector pin assemblies (1) to rotate to a preset working position so as to adapt different ejector pin assemblies (1) when peeling off chips of different sizes. The lifting mechanism (3), corresponding to the preset working position setting, is configured to push the pin assembly (1) in the preset working position to move towards the blue film direction so as to lift the chip through the pin body; The feature is that the blue film chip stripping device further includes: The positioning and fitting assembly (4) includes a groove (41) and a fitting part (42) that can be adapted to snap together. The groove (41) and the fitting part (42) are respectively disposed on the top of the lifting mechanism (3) and the bottom of the ejector assembly (1). The groove (41) is provided in multiple ways and located in the same horizontal plane. The extension directions of each groove (41) are staggered. The mating parts (42) are provided in multiple ways and each of the multiple mating parts (42) corresponds to one of the multiple grooves (41). When the top of the lifting mechanism (3) is attached to the bottom of the ejector assembly (1), the plurality of mating parts (42) respectively engage with the corresponding groove (41) to restrict the multiple degrees of freedom of the ejector assembly (1) in the horizontal plane.

2. The blue film chip stripping device according to claim 1, characterized in that, The mating part (42) includes a spherical mating surface (421), and the mating part (42) is engaged with the corresponding groove (41) through the spherical mating surface (421).

3. The blue film chip stripping device according to claim 2, characterized in that, The groove (41) includes a symmetrically inclined contact surface (411) so that the spherical mating surface (421) can form a two-point contact with the contact surface (411) to achieve a snap-fit.

4. The blue film chip stripping device according to claim 1, characterized in that, The multiple grooves (41) are evenly distributed along the same circumferential direction, and the extension direction of each groove (41) points to the center of the circumference.

5. The blue film chip stripping device according to claim 1, characterized in that, The blue film chip stripping device further includes a pressure application component (5) disposed on the lifting mechanism (3) or the ejector assembly (1), the pressure application component (5) being configured to apply pressure toward the groove (41) to the mating member (42) so that the mating member (42) and the groove (41) remain in contact when the chip is lifted.

6. The blue film chip stripping device according to claim 5, characterized in that, The pressure application assembly (5) includes mutually adsorbing magnetic elements (51) located at the top of the lifting mechanism (3) or at the bottom of the ejector assembly (1).

7. The blue film chip stripping device according to claim 6, characterized in that, The lifting mechanism (3) includes a lifting body (31), a positioning seat (32), and a pushing component (33), wherein: The lifting body (31) can be raised and lowered; The positioning seat (32) is disposed on the top of the lifting body (31). The positioning seat (32) is used to support the groove (41) or the mating part (42) and can fit against the bottom of the ejector assembly (1) under the drive of the lifting body (31), so that the groove (41) and the mating part (42) are engaged. The pusher (33) is vertically slidably disposed on the lifting body (31). When the groove (41) and the mating part (42) are engaged, the pusher (33) can lift the needle body.

8. The blue film chip stripping device according to claim 7, characterized in that, The lifting mechanism (3) further includes a first drive component (6) and a second drive component (7), wherein the first drive component (6) is configured to drive the lifting body (31) to rise and fall, and the second drive component (7) is configured to lift the pusher (33).

9. A blue film chip stripping device according to claim 8, characterized in that, The first drive assembly (6) further includes a rotating component (61) and a transmission assembly (62), wherein: The rotating component (61) is configured to output rotational power; The transmission assembly (62) is connected between the rotating component (61) and the lifting body (31) to convert the rotational power into the lifting power of the lifting body (31).

10. A chip manufacturing equipment, characterized in that, Includes a feeding mechanism and a blue film chip stripping device as described in any one of claims 1-9, wherein: The feeding mechanism is used to convey the blue film with the chip to be peeled attached, and to transfer the target chip on the blue film to a preset working station; The blue film chip stripping device is configured to cooperate with the feeding mechanism to strip the target chip from the blue film.

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