Ejector pin and ejector pin switching mechanism

By eliminating the central ventilation structure of the ejector pin and using a sealed connection between the airflow channel on the support and the vacuum chamber of the pin cap, the problem of excessively large ejector pin size was solved, enabling adaptation to miniaturized equipment and improving chip stripping efficiency.

CN121816009APending Publication Date: 2026-04-07SUZHOU BOZHONG SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-30
Publication Date
2026-04-07

AI Technical Summary

Technical Problem

The existing ejector pin switching mechanism is large in size due to its central ventilation structure, making it unsuitable for miniaturized equipment and compact production scenarios.

Method used

The structure adopts an air passage on the bracket that matches the vacuum chamber of the needle cap, eliminating the through air passage between the guide shaft and the central axis of the needle seat. A stable negative pressure environment is achieved through the air passage on the bracket and the vacuum chamber of the needle cap in a sealed fit.

Benefits of technology

The radial and axial dimensions of the ejector pins have been reduced, improving space utilization and making them suitable for miniaturized equipment and compact production scenarios, while ensuring the stability of vacuum sealing and chip stripping efficiency.

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Abstract

The invention belongs to the technical field of ejector pin switching mechanisms, and discloses an ejector pin and an ejector pin switching mechanism. The ejector pin comprises a support, a guide shaft, a pin body, a pin seat and a pin cap. The guide shaft is slidably arranged on the support. The needle body is arranged on the guide shaft in the axial direction through the needle base. The needle cap is arranged on the support and comprises a vacuum cavity. The upper side of the needle base can movably extend into the vacuum cavity, and the needle base is in sealing fit with the needle cap. A ventilation flow channel communicated with the vacuum cavity is formed in the support. The vacuum channel of the ejector pin is of a structure that the ventilation flow channel on the support is matched with the vacuum cavity of the pin cap, a through type air channel does not need to be formed in the center axis of the guide shaft and the center axis of the pin base, and therefore the guide shaft and the pin base do not need to reserve extra structure space for containing the air channel, the radial size and the axial size of the ejector pin are reduced, and the machining efficiency is improved. The space utilization rate is improved, and miniaturization equipment and compact production scenes are effectively adapted.
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Description

Technical Field

[0001] This invention relates to the field of ejector pin switching mechanism technology, and more particularly to an ejector pin and ejector pin switching mechanism. Background Technology

[0002] In semiconductor chip packaging and bonding production, the automated removal of blue film chips is a key process to ensure production continuity. Typically, a pin switching mechanism is used to switch the pins to adapt to the removal requirements of chips of different sizes.

[0003] Existing ejector pin switching mechanisms generally adopt a central ventilation structure, that is, a through-type air channel is opened on the central axis of the ejector pin, and the vacuum airflow passes through the needle seat, guide shaft and other components along the central axis, and finally connects to the needle cap suction port.

[0004] However, the central ventilation structure requires the reservation of a through air channel, which inevitably increases the radial and axial dimensions of the ejector pin, resulting in bulky components and extremely low space utilization, making it unsuitable for miniaturized equipment and compact production scenarios.

[0005] Therefore, the above problems urgently need to be solved. Summary of the Invention

[0006] The purpose of this invention is to provide an ejector pin and an ejector pin switching mechanism to reduce the radial and axial dimensions of the ejector pin, improve space utilization, and effectively adapt to miniaturized equipment and compact production scenarios.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] A needle pin includes a support, a guide shaft, a needle body, a needle base, and a needle cap, wherein:

[0009] The guide shaft is slidably mounted on the bracket;

[0010] The needle body is mounted on the guide shaft along its axial direction via the needle seat;

[0011] The needle cap is disposed on the bracket, and the needle cap includes a vacuum chamber;

[0012] The upper side of the needle hub can extend movably into the vacuum cavity, and the needle hub and the needle cap are sealed together.

[0013] The support has an air passage that connects to the vacuum chamber.

[0014] Preferably, the support includes:

[0015] The air passage plate has a first channel.

[0016] A fixed plate has a receiving groove on one side facing the gas passage plate. The upper side of the gas passage plate extends into the receiving groove and seals the opening of the receiving groove, so that the gas passage plate and the groove wall of the receiving groove form a ring.

[0017] The fixed plate has a second channel that connects the vacuum cavity and the annular channel, so that the first channel, the annular channel, and the second channel are connected in sequence to form the air passage.

[0018] Preferably, the bracket has a hollow hole, and the guide shaft slides axially through the hollow hole;

[0019] A sealing plate is embedded at the bottom of the hollow hole, the guide shaft passes through the sealing plate and extends outward, and the guide shaft and the sealing plate slide together to form a seal.

[0020] A pin switching mechanism includes a carrier, a drive mechanism, a lifting mechanism, and the aforementioned pin, wherein:

[0021] The ejector pins are provided in multiple ways, and the multiple ejector pins are distributed on the carrier;

[0022] The drive mechanism is configured to drive the carrier to move so that any of the ejector pins can move to a preset working position;

[0023] The lifting mechanism is set in relation to the working station. The lifting mechanism is configured to drive the pin in the working station to move toward the blue film so that the pin cap fits into the blue film. It is also configured to drive the guide shaft to rise so that the pin body lifts the chip.

[0024] Preferably, the lifting mechanism has an internal transfer air passage, one end of which is used to connect to an external vacuum source, and the other end is a docking port;

[0025] When the lifting mechanism is in contact with the bottom of the ejector pin, the docking port connects to the air passage.

[0026] Preferably, the docking port is provided with a suction nozzle to connect to the adapter air passage;

[0027] When the lifting mechanism is in contact with the ejector pin, the suction nozzle abuts against the port of the air passage.

[0028] Preferably, the ejector pin switching mechanism further includes a positioning component disposed between the lifting mechanism and the ejector pin, the positioning component being configured to guide the lifting mechanism to align with the ejector pin and form a positioning.

[0029] Preferably, the positioning component includes a groove and a mating part that can be adapted to snap into place, wherein the groove and the mating part are respectively disposed at the top of the lifting mechanism and the bottom of the ejector pin;

[0030] The groove is provided in multiple ways and located in the same horizontal plane. The extension directions of each groove are staggered. Multiple mating parts are provided accordingly, and each of the multiple mating parts corresponds to one of the multiple grooves.

[0031] When the top of the lifting mechanism is attached to the bottom of the ejector pin, the plurality of mating parts are respectively engaged with the corresponding grooves to restrict the ejector pin's multiple degrees of freedom in the horizontal plane.

[0032] Preferably, the support member is provided with a guide component, and the ejector pin cooperates with the support member through the guide component so that when the lifting mechanism releases the drive of the ejector pin, the ejector pin can slide relative to the support member under its own weight and be hung on the support member by being guided by the guide component.

[0033] Preferably, the guide assembly includes a pin and a guide bearing, wherein:

[0034] The guide bearing is disposed on the carrier corresponding to the sliding path of the ejector pin;

[0035] The pin is mounted on the support member. When the ejector pin is guided to slide to the preset position by the guide bearing, it is hung on the pin.

[0036] The beneficial effects of this invention are:

[0037] The vacuum channel of the ejector pin provided by the present invention is a structure in which the air passage on the support and the vacuum cavity of the needle cap are matched. There is no need to open a through air passage on the central axis of the guide shaft and the needle seat, so that the guide shaft and the needle seat do not need to reserve extra structural space to accommodate the air passage, thereby reducing the radial and axial dimensions of the ejector pin, improving space utilization, and effectively adapting to miniaturized equipment and compact production scenarios. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the ejector pin switching mechanism provided by the present invention;

[0039] Figure 2 This is a cross-sectional view of the ejector pin provided by the present invention;

[0040] Figure 3 This is a partial structural diagram of the ejector pin, lifting mechanism, and positioning components provided by the present invention;

[0041] Figure 4 This is a schematic diagram of the structure of the guiding component provided by the present invention.

[0042] In the picture:

[0043] 1. Support; 11. Airflow channel; 12. Airflow plate; 13. Fixing plate; 14. First channel; 15. Circular channel; 16. Second channel; 17. Hollow hole; 2. Guide shaft; 3. Needle body; 4. Needle seat; 5. Needle cap; 51. Vacuum chamber;

[0044] 100, Supporting component; 200, Drive mechanism; 300, Lifting mechanism; 301, Adapter air passage; 302, Suction nozzle; 400, Ejector pin; 500, Positioning assembly; 501, Groove; 502, Mating component; 600, Guide assembly; 601, Pin; 602, Guide bearing. Detailed Implementation

[0045] The invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the drawings, not the entire structure.

[0046] In the description of the invention, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the invention based on the specific circumstances.

[0047] In this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0048] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0049] Please see Figures 1 to 4 This embodiment provides a needle, including a support 1, a guide shaft 2, a needle body 3, a needle seat 4, and a needle cap 5. The guide shaft 2 is slidably disposed on the support 1. The needle body 3 is axially disposed on the guide shaft 2 via the needle seat 4. The needle cap 5 is disposed on the support 1 and includes a vacuum chamber 51. The upper side of the needle seat 4 can extend movably into the vacuum chamber 51, and the needle seat 4 and the needle cap 5 are sealed together. An air passage 11 communicating with the vacuum chamber 51 is provided on the support 1.

[0050] During peeling, the air passage 11 on the support 1 is connected to a vacuum source and delivers negative pressure to the vacuum chamber 51 of the needle cap 5. Since the upper side of the needle seat 4 extends into the vacuum chamber 51 and the two are sealed together, the vacuum chamber 51 can form a stable negative pressure environment to adsorb the blue film. The guide shaft 2, which is slidably set on the support 1, slides along its axial direction, and simultaneously drives the needle body 3, which is fixed along the axial direction through the needle seat 4, to move axially. The needle body 3 extends upward out of the needle cap 5 to push the chip. Under the combined action of the adsorption of the blue film by the negative pressure provided by the needle cap 5 through the vacuum chamber 51 and the pushing force of the needle body 3, the chip is peeled off from the blue film. After peeling is completed, the guide shaft 2 drives the needle body 3 to retract in the opposite direction, the air passage 11 stops delivering negative pressure, and the needle cap 5 releases the adsorption of the blue film.

[0051] With this configuration, the vacuum channel is a structure in which the air passage 11 on the support 1 and the vacuum chamber 51 of the needle cap 5 cooperate. There is no need to open a through air passage on the central axis of the guide shaft 2 and the needle seat 4, so that the guide shaft 2 and the needle seat 4 do not need to reserve extra structural space to accommodate the air passage. This reduces the radial and axial dimensions of the ejector pin, improves space utilization, and effectively adapts to miniaturized equipment and compact production scenarios.

[0052] Specifically, the support 1 includes an air passage plate 12 and a fixing plate 13. The air passage plate 12 has a first channel 14. The fixing plate 13 has a receiving groove on the side facing the air passage plate 12, and the upper side of the air passage plate 12 extends into the receiving groove and seals the opening of the groove, so that the air passage plate 12 and the groove wall of the receiving groove enclose and form an annular channel 15. The fixing plate 13 has a second channel 16 connecting the vacuum chamber 51 and the annular channel 15, so that the first channel 14, the annular channel 15, and the second channel 16 are sequentially connected to form an airflow channel 11.

[0053] It is understandable that the air passage 11 is formed by the sequential connection of the first hole 14 of the air passage plate 12, the annular channel 15 enclosed by the air passage plate 12 and the fixed plate 13, and the second hole 16 of the fixed plate 13. There is no need to open a through air passage on the central axis of the moving parts such as the guide shaft 2. This avoids the need for the moving parts to reserve extra structural space to accommodate the air passage. Furthermore, the enclosed design of the air passage plate 12 and the fixed plate 13 makes the flow channel layout more compact, further reducing the radial and axial dimensions of the ejector pin and enhancing the adaptability to miniaturized equipment and compact production scenarios.

[0054] It is also understandable that the upper side of the gas path plate 12 extends into the receiving groove and seals the groove opening, so that the ring channel 15 forms a closed space. Most of the sealing surfaces of the air passage 11 are concentrated at the static contact point between the gas path plate 12 and the fixed plate 13. There are fewer dynamically matched sealing structures, and the fit gap of the static sealing surface is easier to control, resulting in higher sealing reliability. This ensures the negative pressure stability of the vacuum chamber 51 of the needle cap 5 and ensures the adsorption effect of the blue film.

[0055] Furthermore, the gas flow plate 12 and the fixed plate 13 adopt a split design. The processing of the first channel 14, the receiving groove, and the second channel 16 can be completed independently on the two components, reducing the processing difficulty of complex flow channels. At the same time, the air passage 11 is formed by the sequential connection of the first channel 14 of the gas flow plate 12, the annular channel 15 enclosed by the gas flow plate 12 and the receiving groove, and the second channel 16 of the fixed plate 13. The flow path presents a staggered distribution rather than a straight line, which requires the vacuum airflow to flow along a preset tortuous path. This allows the airflow to break through the constraints of multiple sealing contact surfaces during transmission. Even if there are small gaps, the airflow leakage path is greatly extended and blocked by the staggered structure, further blocking the leakage channel and ultimately achieving a stable vacuum sealing effect.

[0056] To further optimize the sealing performance and motion stability of the guide shaft 2 during the sliding process, a hollow hole 17 is provided in the bracket 1, and the guide shaft 2 slides axially through the hollow hole 17. A sealing plate is embedded at the bottom of the hollow hole 17, the guide shaft 2 passes through the sealing plate and extends outward, and the guide shaft 2 and the sealing plate slide and cooperate to form a seal.

[0057] With this configuration, the hollow hole 17 provides an axial sliding channel for the guide shaft 2. The guide shaft 2 slides axially through the hollow hole 17. The sealing plate embedded at the bottom of the hollow hole 17 forms a sliding seal with the through guide shaft 2. This not only continuously blocks the leakage of negative pressure from the gap between the guide shaft 2 and the hollow hole 17 in the vacuum chamber 51, ensuring the stability of the negative pressure of the blue film adsorbed by the needle cap 5, but also reduces the radial offset of the guide shaft 2 through double constraints, improving the positioning accuracy of the pin body 3 pushing the chip. Moreover, the embedded sealing plate design does not increase the radial and axial dimensions of the ejector pin, which meets the adaptation requirements of miniaturized equipment and compact production scenarios.

[0058] This embodiment also provides a pin switching mechanism, including a carrier 100, a drive mechanism 200, a lifting mechanism 300, and the aforementioned pins 400. Multiple pins 400 are provided, distributed on the carrier 100. The drive mechanism 200 is configured to drive the carrier 100 to move, so that any pin 400 can move to a preset working position. The lifting mechanism 300 is set corresponding to the working position, and is configured to drive the pin 400 at the working position to move towards the blue film, so that the pin cap 5 fits against the blue film, and is configured to drive the guide shaft 2 to rise to lift the chip with the pin body 3.

[0059] During the switching process, the drive mechanism 200 starts and drives the carrier 100 to move according to the adaptation requirements of the chip to be peeled. Since multiple ejector pins 400 are distributed on the carrier 100, the carrier 100 drives all ejector pins 400 on it to move synchronously until the target matching ejector pin 400 is precisely moved to the preset working position. The lifting mechanism 300 set at the corresponding working position is then started. First, it drives the ejector pin 400 in the working position to move towards the blue film, so that the pin cap 5 of the ejector pin 400 is in close contact with the blue film. Then, the lifting mechanism 300 switches the object of the driving force and drives the guide shaft 2, which is slidably set on the bracket 1 in the ejector pin 400, to move upward. The guide shaft 2 synchronously drives the needle body 3, which is fixed axially through the needle seat 4, to push the chip upward, completing the peeling preparation action after the ejector pin 400 is switched.

[0060] It is understood that the ejector pin switching mechanism, including the aforementioned ejector pin 400, features miniaturization and modularity, enabling ejector pin 400 switching without machine downtime. This effectively improves chip stripping efficiency and reduces costs, making it suitable for compact production scenarios involving multi-chip bonding. It should be noted that the drive mechanism 200 is existing technology, and the specific model can be selected according to the actual application scenario; this embodiment will not elaborate on it. It should also be noted that the drive structure of the lifting mechanism 300 can employ any one or two linear drive structures from existing technologies to achieve the overall drive of the ejector pin 400 and the lifting drive of the pin body 3, such as linear guides or cylinders.

[0061] Specifically, the lifting mechanism 300 has an internal transfer air passage 301, one end of which is used to connect to an external vacuum source, and the other end is a docking port. When the lifting mechanism 300 is in contact with the bottom of the ejector pin 400, the docking port connects to the air passage 11.

[0062] This configuration enables a seamless connection between the external vacuum source and the air passage 11 of the ejector pin 400 through the transfer air passage 301 inside the lifting mechanism 300. This simplifies the air path layout and connection process, eliminating the need for separate air path adjustments when the ejector pin 400 is switched, and improving the coordination efficiency between the ejector pin 400 switching and the blue film adsorption action.

[0063] Furthermore, a suction nozzle 302 is provided at the docking port to connect to the transition air passage 301. When the lifting mechanism 300 is in contact with the ejector pin 400, the suction nozzle 302 abuts against the port of the air passage 11. This not only enhances the sealing fit at the air passage docking point, effectively reduces vacuum leakage, and ensures the negative pressure stability of the vacuum chamber 51 of the needle cap 5, but also compensates for minor deviations during the docking process through the abutment and adaptation of the suction nozzle 302, improving the accuracy of air passage connection. Moreover, the setting of the suction nozzle 302 does not increase the radial and axial dimensions of the ejector pin 400 or the lifting mechanism 300, further improving the convenience and efficiency of air passage docking when switching the ejector pin 400.

[0064] To further ensure the accuracy and stability of the docking between the lifting mechanism 300 and the ejector pin 400, the ejector pin switching mechanism also includes a positioning component 500 disposed between the lifting mechanism 300 and the ejector pin 400. The positioning component 500 is configured to guide the lifting mechanism 300 and the ejector pin 400 to align and form a position, thereby effectively reducing the deviation when the two are docked, avoiding the ejector pin 400 from deviating from the center position of the chip due to misalignment, thus preventing peeling failure. At the same time, it reduces the collision and impact during the docking process, reduces component wear and extends service life.

[0065] In addition, precise positioning can ensure stable connection between the transfer air passage 301 of the lifting mechanism 300 and the air passage 11 of the ejector pin 400, further enhancing the vacuum sealing effect. Moreover, the setting of the positioning component 500 does not increase the overall structural volume, which meets the design requirements of miniaturization and efficient switching, and improves the overall reliability and efficiency of ejector pin 400 switching and chip stripping.

[0066] In this embodiment, the positioning component 500 includes a groove 501 and a mating member 502 that can be fitted and engaged. The groove 501 and the mating member 502 are respectively disposed on the top of the lifting mechanism 300 and the bottom of the ejector pin 400. Multiple grooves 501 are provided and located in the same horizontal plane, with their extension directions staggered. Multiple mating members 502 are correspondingly provided, and each mating member 502 corresponds one-to-one with a groove 501. When the top of the lifting mechanism 300 is in contact with the bottom of the ejector pin 400, the multiple mating members 502 engage with their respective grooves 501 to restrict multiple degrees of freedom of the ejector pin 400 in the horizontal plane.

[0067] This configuration, by placing multiple staggered grooves 501 on the same horizontal plane and corresponding mating parts 502 on the top of the lifting mechanism 300 and the bottom of the ejector pin 400, respectively, achieves precise engagement when the two parts are in contact. This restricts multiple degrees of freedom of the ejector pin 400 in the horizontal plane, effectively preventing peeling failure caused by misalignment of the ejector pin 400 from the center of the chip. Simultaneously, the adaptive engagement of the staggered grooves 501 and mating parts 502 has a self-centering guiding effect, reducing collisions and impacts during the docking process between the lifting mechanism 300 and the ejector pin 400, reducing component wear and extending service life. Furthermore, precise positioning ensures stable alignment and communication between the transfer air passage 301 of the lifting mechanism 300 and the air passage 11 of the ejector pin 400, further enhancing the vacuum sealing effect.

[0068] Three grooves 501 are provided, distributed at 120° and on the same horizontal plane, specifically arranged on the top of the lifting mechanism 300. Three corresponding mating parts 502 are provided, and the three grooves 501 and three mating parts 502 form a one-to-one fitting relationship. The structure of the groove 501 is not limited to a V-shaped groove; it can also be a Gothic arched groove, a semi-circular groove, etc. Correspondingly, the structure of the mating parts 502 is not limited to a spherical pin; it can also be a spherical part such as a ball or a hemisphere.

[0069] Specifically, the support member 100 is provided with a guide component 600. The ejector pin 400 and the support member 100 cooperate through the guide component 600 so that when the lifting mechanism 300 releases the drive of the ejector pin 400, the ejector pin 400 can slide relative to the support member 100 under its own weight and be hung on the support member 100 by being guided by the guide component 600.

[0070] With this configuration, when the lifting mechanism 300 releases its drive on the ejector pin 400, it can guide the ejector pin 400 to slide smoothly relative to the carrier 100, avoiding impact vibration during the sliding process that could cause the internal components of the ejector pin 400 to loosen or shift position. At the same time, it ensures that the ejector pin 400 is stably hung on the carrier 100, preventing it from detaching from the carrier 100 and causing damage or affecting the subsequent switching accuracy.

[0071] Specifically, the guide assembly 600 includes a pin 601 and a guide bearing 602. The guide bearing 602 is mounted on the support member 100 corresponding to the sliding path of the ejector pin 400. The pin 601 is mounted on the support member 100, and when the ejector pin 400 is guided by the guide bearing 602 to slide to a preset position, it is hooked onto the pin 601. The guide bearing 602, positioned on the support member 100 corresponding to the sliding path of the ejector pin 400, can accurately guide the ejector pin 400 to slide smoothly along a preset trajectory, significantly reducing friction and wear between the ejector pin 400 and the support member 100, while also buffering impact vibrations during the sliding process, preventing loosening or positional displacement of internal components of the ejector pin 400, and providing a stable positioning basis for subsequent chip stripping.

[0072] In addition, the pin 601 is located on the carrier 100. When the ejector pin 400 is guided to slide to the preset position by the guide bearing 602, the pin 400 is fixed firmly without the need for an additional complex locking structure, preventing it from falling off the carrier 100. This simplifies the limit design and ensures the stability of the ejector pin 400 during storage.

[0073] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A type of ejector pin, characterized in that, It includes a support (1), a guide shaft (2), a needle body (3), a needle base (4), and a needle cap (5), wherein: The guide shaft (2) is slidably mounted on the bracket (1); The needle body (3) is mounted on the guide shaft (2) along its axial direction via the needle seat (4); The needle cap (5) is disposed on the bracket (1), and the needle cap (5) includes a vacuum chamber (51). The upper side of the needle seat (4) can extend movably into the vacuum cavity (51), and the needle seat (4) and the needle cap (5) are sealed together. The support (1) has an air passage (11) that connects to the vacuum chamber (51).

2. The ejector pin according to claim 1, characterized in that, The support (1) includes: The air passage plate (12) has a first channel (14); The fixed plate (13) has a receiving groove on one side facing the gas passage plate (12). The upper side of the gas passage plate (12) extends into the receiving groove and seals the opening of the receiving groove, so that the gas passage plate (12) and the groove wall of the receiving groove form an annular channel (15). The fixed plate (13) has a second channel (16) that connects the vacuum cavity (51) and the annular channel (15), so that the first channel (14), the annular channel (15) and the second channel (16) are connected in sequence to form the air passage (11).

3. The ejector pin according to claim 1, characterized in that, The bracket (1) has a hollow hole (17) inside, and the guide shaft (2) slides axially through the hollow hole (17); A sealing plate is embedded at the bottom of the hollow hole (17), the guide shaft (2) passes through the sealing plate and extends outward, and the guide shaft (2) and the sealing plate slide together to form a seal.

4. A pin switching mechanism, characterized in that, It includes a carrier (100), a drive mechanism (200), a lifting mechanism (300), and a ejector pin (400) as described in any one of claims 1-3, wherein: Multiple ejector pins (400) are provided, and the multiple ejector pins (400) are distributed on the carrier (100); The drive mechanism (200) is configured to drive the carrier (100) to move so that any of the ejector pins (400) can move to a preset working position; The lifting mechanism (300) is set in relation to the working station. The lifting mechanism (300) is configured to drive the pin (400) in the working station to move toward the blue film so that the pin cap (5) fits against the blue film. It is also configured to drive the guide shaft (2) to rise so as to drive the pin body (3) to lift the chip.

5. The ejector pin switching mechanism according to claim 4, characterized in that, The lifting mechanism (300) has a transfer air passage (301) inside. One end of the transfer air passage (301) is used to connect to an external vacuum source, and the other end is a docking port. When the lifting mechanism (300) is in contact with the bottom of the ejector pin (400), the docking port is connected to the air passage (11).

6. The ejector pin switching mechanism according to claim 5, characterized in that, A suction nozzle (302) is provided at the docking port to connect to the adapter airway (301) through the suction nozzle (302). When the lifting mechanism (300) is in contact with the ejector pin (400), the suction nozzle (302) abuts against the port of the air passage (11).

7. The ejector pin switching mechanism according to claim 4, characterized in that, The ejector pin switching mechanism further includes a positioning component (500) disposed between the lifting mechanism (300) and the ejector pin (400), the positioning component (500) being configured to guide the lifting mechanism (300) to align with the ejector pin (400) and form a positioning.

8. The ejector pin switching mechanism according to claim 7, characterized in that, The positioning component (500) includes a slot (501) and a mating part (502) that can be adapted to snap together. The slot (501) and the mating part (502) are respectively disposed on the top of the lifting mechanism (300) and the bottom of the ejector pin (400). The groove (501) is provided in multiple ways and located in the same horizontal plane. The extension directions of each groove (501) are staggered. The mating parts (502) are provided in multiple ways, and the multiple mating parts (502) correspond one-to-one with the multiple grooves (501). When the top of the lifting mechanism (300) is attached to the bottom of the ejector pin (400), the plurality of mating parts (502) respectively engage with the corresponding groove (501) to restrict the ejector pin (400) in multiple degrees of freedom in the horizontal plane.

9. A pin switching mechanism according to claim 4, characterized in that, The support member (100) is provided with a guide component (600). The ejector pin (400) and the support member (100) cooperate through the guide component (600) so that when the lifting mechanism (300) releases the drive of the ejector pin (400), the ejector pin (400) can slide relative to the support member (100) under its own weight and be hung on the support member (100) by being guided by the guide component (600).

10. A pin switching mechanism according to claim 9, characterized in that, The guide assembly (600) includes a pin (601) and a guide bearing (602), wherein: The guide bearing (602) is disposed on the carrier (100) corresponding to the sliding path of the ejector pin (400); The pin (601) is mounted on the support member (100). When the ejector pin (400) is guided and slid to the preset position by the guide bearing (602), it is hung on the pin (601).