Organic silica gel for Micro-LED seal repair and preparation method and application thereof

Abstract

The invention relates to organic silica gel for Micro-LED seal repair as well as a preparation method and application of the organic silica gel. The organic silica gel for Micro-LED seal repair is prepared from the following components in parts by weight: 35 to 45 parts of polyvinyl silicone oil, 5 to 15 parts of vinyl-terminated silicone oil, 5 to 15 parts of hydrogen-terminated silicone oil, 3 to 5 parts of end-side hydrogen-containing silicone oil, 10 to 15 parts of vinyl MQ resin, 5 to 15 parts of methyl hydrogen-containing MQ resin, 5 to 10 parts of fumed silica, 0.03 to 5 parts of catalyst and 0.03 to 1 part of inhibitor. The organic silicon elastomer material formed by curing the organic silica gel for Micro-LED seal repair has excellent initial adhesion performance, proper hardness and lower thermal expansion coefficient, can well pick up a chip during transfer repair, does not remain residual glue on the chip, is not easy to generate irreversible deformation, can be repeatedly used for many times, and has good application prospects. The service life is long.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mass transfer of Micro-LED, in particular to a kind of Micro-LED repair stamping organic silicone adhesive and its preparation method and application. BACKGROUND

[0002] Micro-LED (Micro Light Emitting Diode) has significant application prospects in the field of virtual / augmented reality devices, intelligent wearable devices and high-definition screens due to its high transparency, high brightness, high contrast, low energy consumption, fast response and long service life. The core bottleneck of its industrialization is the mass transfer process, which requires transferring millions of Micro-LED chips from the growth substrate to the receiving substrate accurately. However, all mass transfer technologies result in yield loss, and even the most advanced laser transfer technology cannot meet the commercial requirement of 99.9999% yield.

[0003] In the mainstream mass transfer scheme, stamp transfer technology is the first choice for industry due to its high efficiency and high yield, but its yield still depends on the subsequent stamp repair link, which replaces the failed chips (bad points) generated after mass transfer to improve the panel yield to a commercial level. The essence is a secondary selective transfer process, which relies on the programmable adhesion properties of the stamp head material (adhesion force can be dynamically controlled by adjusting the peeling speed, voltage or air pressure).

[0004] Micro-LED stamp transfer repair technology mainly achieves through the following strategies: (1) Detection and positioning: high-resolution optical scanning (such as CMOS camera, positioning accuracy ±0.5 μm) or non-contact EL (electroluminescence) testing combined with beam positioning (BAR) technology is used to identify electrical defects (open / short circuit) and position offset chips (for example, 4K screen needs to detect about 24 million); (2) Remove failed chips: mechanical arm is positioned to the defect point, and the failed chip is picked up accurately to ensure that the surrounding normal chips are not disturbed; (3) Replace new chips: the stamp head carries new chips to the empty position, and completes electrode connection through thermal compression bonding (about 200℃) or laser instantaneous welding (pulse width <10 ns), the bonding strength needs to be >10 MPa, forming a complete repair closed loop.

[0005] However, the materials used in the Micro-LED repair stamp currently have the following problems: (1) The stamp needs to go through high temperature or high pressure conditions in the use process, so the mechanical properties, shrinkage rate and thermal expansion coefficient of the material have higher requirements, and the conventional polydimethylsiloxane (PDMS) material is difficult to meet the requirements; (2) In the use process of the stamp material, it is necessary to ensure that the initial adhesion between the stamp material and the chip is relatively high, and it is required to be less than the initial adhesion between the chip and the repair substrate (i.e. the receiving layer), so as to avoid the generation of residual glue residue; (3) After repeated use for many times, the stamp head is prone to irreversible deformation, so the stamp head needs to be frequently replaced, which increases the repair cost.

[0006] Therefore, it is necessary to develop a material that can meet the performance requirements of the Micro-LED repair stamp. SUMMARY

[0007] To solve the above technical problems, the present application provides a kind of Micro-LED repair stamp with silicone glue and its preparation method and application.The Micro-LED repair stamp with silicone glue formed by curing has excellent initial adhesion, appropriate hardness and low thermal expansion coefficient, can pick up the chip well during transfer repair, and will not leave residual glue on the chip, is not prone to irreversible deformation, can be used repeatedly, and has long service life.

[0008] To achieve this purpose, the present application adopts the following technical solutions:

[0009] In a first aspect, the present application provides a Micro-LED repair stamp organic silicone adhesive, which comprises the following components by weight fraction: 35-45 parts (for example, 36 parts, 37 parts, 38 parts, 39 parts, 40 parts, 41 parts, 42 parts, 43 parts, or 44 parts, etc.) of polyvinyl silicone oil, 5-15 parts (for example, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, or 14 parts, etc.) of end-vinyl silicone oil, 5-15 parts (for example, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, or 14 parts, etc.) of end-hydrogen-containing silicone oil, 3-5 parts (for example, 3.2 parts, 3.4 parts, 3.6 parts, 3.8 parts, 4.0 parts, 4.2 parts, 4.4 parts, 4.6 parts, or 4.8 parts, etc.) of end-side hydrogen-containing silicone oil, 10-15 parts (for example, 10.5 parts, 11 parts, 11.5 parts, 12 parts, 12.5 parts, 13 parts, 13.5 parts, 14 parts, or 14.5 parts, etc.) of vinyl MQ resin, 5-15 parts (for example, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, or 14 parts, etc.) of methyl hydrogen-containing MQ resin, 5-10 parts (for example, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts, or 9.5 parts, etc.) of fumed silica, 0.03-5 parts (for example, 0.5 parts, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, or 4.5 parts, etc.) of catalyst, and 0.03-1 parts (for example, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, or 0.9 parts, etc.) of inhibitor.

[0010] In the present application, the polyvinyl silicone oil and end-vinyl silicone oil serve as the main component, which constitutes the main skeleton of the molecular chain segment of the Micro-LED repair stamp organic silicone adhesive, has good acid and alkali resistance, and provides basic elastomer mechanical properties; the addition of end-vinyl silicone oil mainly helps to increase toughness and initial adhesion; the end-hydrogen-containing silicone oil and end-side hydrogen-containing silicone oil serve as curing agents, crosslink with the polyvinyl silicone oil and end-vinyl silicone oil through a silicon-hydrogen addition reaction to form a three-dimensional network structure, and the addition of end-side hydrogen-containing silicone oil mainly helps to improve hardness; the vinyl MQ resin and methyl hydrogen-containing MQ resin, due to their unique structural characteristics (having a cage-like or network three-dimensional structure composed of monofunctional siloxane “M unit” and tetrafunctional siloxane “Q unit”), serve as reinforcing materials, which can significantly improve the comprehensive performance of the system; it not only can effectively improve hardness, elastic modulus, tensile strength, and tear strength, reduce loss modulus, reduce thermal expansion coefficient, improve hardness, and improve dimensional stability, but also can maintain or even improve thermal stability, high temperature resistance, and light transmittance; the fumed silica helps to improve hardness and reduce thermal expansion coefficient.

[0011] In the present application, the multi-vinyl silicone oil, the end-vinyl silicone oil, the end-hydrogen-containing silicone oil, the end-side hydrogen-containing silicone oil, the vinyl MQ resin, the methyl hydrogen-containing MQ resin, the fumed silica, the catalyst and the inhibitor are compounded in specific weight proportions, so that the prepared Micro-LED repair stamp organic silicone glue has excellent initial adhesion, appropriate loss modulus and hardness, and low thermal expansion coefficient. When the stamp head is used for Micro-LED chip transfer repair, the chip can be well picked up, and no residual glue is left on the chip, which can ensure the yield of the Micro-LED chip in the subsequent supplementary welding process, the stamp head is not easy to irreversibly deform, can be repeatedly used, has long service life, and can effectively reduce the requirements for repair equipment and process.

[0012] In the present application, the Micro-LED repair stamp organic silicone glue has excellent fluidity, dimensional stability and moldability (easy to mold and demold), can quickly solidify to form a stamp head in a short time through a mold, and can cooperate with the precise positioning of a precise repair mechanical platform. Compared with a two-component organic silicone glue, the Micro-LED repair stamp organic silicone glue does not need an A glue and B glue mixing step, has long operation time, simple curing process, and can realize rapid iteration of the stamp head.

[0013] Preferably, the multi-vinyl silicone oil includes multi-vinyl silicone oil A and / or multi-vinyl silicone oil B.

[0014] Preferably, the mass percentage content of the vinyl group in the multi-vinyl silicone oil A is 8% to 10%, for example, 8.2%, 8.4%, 8.6%, 8.8%, 9.0%, 9.2%, 9.4%, 9.6% or 9.8%, etc.

[0015] Preferably, the mass percentage content of the vinyl group in the multi-vinyl silicone oil B is 3% to 5%, for example, 3.2%, 3.4%, 3.6%, 3.8%, 4.0%, 4.2%, 4.4%, 4.6% or 4.8%, etc.

[0016] Preferably, the mass ratio of the multi-vinyl silicone oil A to the multi-vinyl silicone oil B is (1 to 3):1, for example, 1.2:1, 1.4:1, 1.6:1, 1.8:1, 2.0:1, 2.2:1, 2.4:1, 2.6:1 or 2.8:1, etc.

[0017] In this invention, as the mass ratio of vinyl silicone oil A to polyvinyl silicone oil B increases, the initial tack, hardness, and elongation at break all increase, but the coefficient of thermal expansion also increases. If the mass ratio of vinyl silicone oil A to polyvinyl silicone oil B is too high, the coefficient of thermal expansion will be too high, making the stamp head prone to irreversible deformation when used for Micro-LED chip transfer and repair. If the mass ratio of vinyl silicone oil A to polyvinyl silicone oil B is too low, the initial tack and hardness will be low, resulting in poor adhesion to the chip when the stamp head is used for Micro-LED chip transfer and repair. Furthermore, the stamp head will deform significantly under pressure, leading to positional deviations during chip placement and potentially causing abnormalities in subsequent welding. By adjusting the mass ratio of vinyl silicone oil A to polyvinyl silicone oil B to (1~3):1, the overall performance can be effectively improved, resulting in a longer service life for the stamp head.

[0018] Preferably, the vinyl content in the vinyl-terminated silicone oil is 0.8% to 1.8% by mass, for example, 0.9%, 1.0%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6% or 1.7%.

[0019] Preferably, the hydrogen content of the end-hydrogen silicone oil is 0.1wt% to 0.3wt%, for example, 0.12wt%, 0.14wt%, 0.16wt%, 0.18wt%, 0.2wt%, 0.22wt%, 0.24wt%, 0.26wt%, or 0.28wt%.

[0020] Preferably, the hydrogen content of the end-side hydrogen-containing silicone oil is 0.6wt% to 1.2wt%, such as 0.7wt%, 0.8wt%, 0.9wt%, 1.0wt%, or 1.1wt%.

[0021] Preferably, the M / Q ratio of the vinyl MQ resin is 0.6 to 1.2, for example, 0.7, 0.8, 0.9, 1.0 or 1.1.

[0022] Preferably, the vinyl MQ resin contains 1.7% to 2.2% vinyl by mass, such as 1.8%, 1.9%, 2.0%, or 2.1%.

[0023] Preferably, the M / Q ratio of the methyl hydrogen MQ resin is 0.6 to 1.2, for example, 0.7, 0.8, 0.9, 1.0 or 1.1.

[0024] Preferably, the hydrogen content of the methyl hydrogen MQ resin is 0.1wt% to 0.5wt%, for example, 0.15wt%, 0.2wt%, 0.25wt%, 0.3wt%, 0.35wt%, 0.4wt%, or 0.45wt%.

[0025] In this invention, the vinyl MQ resin can participate in the hydrosilylation reaction, chemically bond with the base adhesive, reduce phase separation, and improve the reinforcing effect, thereby increasing tensile strength and elongation at break; the methyl hydrogen MQ resin can participate in the hydrosilylation reaction for reinforcement, improving tensile strength and elongation at break, while also improving the initial tack of the system.

[0026] In this invention, the M / Q ratio of the vinyl MQ resin and the methyl hydrogen MQ resin is preferably 0.6 to 1.2. If the M / Q ratio is too high, the reinforcing effect will decrease and the improvement in hardness and tensile strength will be limited. If the M / Q ratio is too low, the compatibility will decrease, the elongation at break will be low, and the toughness and tear resistance will be reduced.

[0027] Preferably, the fumed silica comprises hydrophobically modified fumed silica.

[0028] Preferably, the catalyst comprises a transition metal catalyst.

[0029] Preferably, the transition metal catalyst includes any one or a combination of at least two of platinum catalysts, palladium catalysts, or rhodium catalysts.

[0030] For example, the catalyst includes any one or a combination of at least two of the following: Karstedt catalyst, chloroplatinic acid, bis(1,3-divinyl-1,1,3,3-tetramethyldisiloxane)platinum, platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane, platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane, (trimethyl)methylcyclopentadiene platinum, or rhodium acetylacetonate.

[0031] In this invention, the catalyst is an initiator for hydrosilylation reaction. Its core function is to reduce the activation energy of the reaction, accelerate the formation of Si-C bonds, and suppress side reactions. Different catalysts can be used to adjust the curing speed and slightly adjust the hardness, toughness and other properties of the final cured product.

[0032] Preferably, the inhibitor includes any one or a combination of at least two of the following: alkynyl alcohol inhibitors, alkynyl ester inhibitors, nitrogen-containing inhibitors, phosphorus-containing inhibitors, sulfur-containing inhibitors, or heavy metal ion inhibitors.

[0033] Preferably, the alkynol inhibitors include 1-ethynylcyclohexanol and / or 3-phenyl-1-butyn-3-ol.

[0034] Preferably, the acetylacetic ester inhibitors include dimethyl butyrylate and / or diethyl butyrylate.

[0035] Preferably, the nitrogen-containing inhibitor comprises tetramethylethylenediamine.

[0036] Preferably, the phosphorus-containing inhibitor comprises triphenylphosphine.

[0037] Preferably, the heavy metal ion inhibitor comprises dibutyltin dilaurate and / or zinc octanoate.

[0038] In this invention, the inhibitor is an additive that inhibits curing crosslinking. Its function is to inhibit the activity of the catalyst, keep the catalyst inert at room temperature, prevent the mixed adhesive from gelling prematurely during processing, ensure sufficient working time, improve storage stability, and achieve long-term storage (usually >6 months). It can also control reaction kinetics, adjust the curing rate curve, avoid local overheating, bubble formation or stress cracking caused by excessively rapid exothermic reaction, improve the curing uniformity of thick products or complex structures, inhibit side reactions, reduce competitive side reactions in hydrosilylation, such as hydrosilylation (isomerization) or excessive crosslinking, and ensure the structural regularity and performance consistency of the cured product.

[0039] In a second aspect, the present invention provides a method for preparing silicone rubber for Micro-LED repair stamps as described in the first aspect, the method comprising the following steps: mixing polyvinyl silicone oil, terminal vinyl silicone oil, terminal hydrogen-containing silicone oil, terminal side hydrogen-containing silicone oil, vinyl MQ resin, methyl hydrogen-containing MQ resin, fumed silica, catalyst and inhibitor to obtain the silicone rubber for Micro-LED repair stamps.

[0040] Preferably, the preparation method includes the following steps: (1) adding a portion of inhibitor to a mixture of a portion of polyvinyl silicone oil and a portion of terminal vinyl silicone oil and stirring for the first time, adding a catalyst and stirring for the second time to obtain a first premix; (2) mixing the remaining polyvinyl silicone oil, the remaining terminal vinyl silicone oil, vinyl MQ resin, methyl hydrogen MQ resin and fumed silica to obtain a second premix; (3) stirring the first premix obtained in step (1) and the second premix obtained in step (2) for the first time, adding the remaining inhibitor and stirring for the second time to obtain a third premix; (4) adding terminal hydrogen silicone oil and end-side hydrogen silicone oil dropwise to the third premix obtained in step (3) under the first stirring state, stirring for the second time, filtering, and obtaining the silicone for Micro-LED repair stamps.

[0041] In this invention, step (1) involves mixing a portion of polyvinyl silicone oil, a portion of terminal vinyl silicone oil, a portion of inhibitor, and the catalyst to form a "pre-coordinated protective layer," thereby inhibiting catalyst activity. Step (2) ensures good dispersion of fumed silica, and the addition of the remaining inhibitor in step (3) helps enhance delayed curing stability. In step (4), the terminal hydrogen-containing silicone oil and the end-side hydrogen-containing silicone oil are added dropwise to avoid localized high concentrations that could lead to side reactions.

[0042] Preferably, based on the total mass of the polyvinyl silicone oil as 100%, the mass of the polyvinyl silicone oil in step (1) is 40% to 60%, for example, 42%, 44%, 46%, 48%, 50%, 52%, 54%, 56%, or 58%.

[0043] Preferably, based on the total mass of the vinyl-terminated silicone oil as 100%, the mass of the vinyl-terminated silicone oil in step (1) is 30% to 50%, for example, 32%, 34%, 36%, 38%, 40%, 42%, 44%, 46%, or 48%.

[0044] Preferably, based on the total mass of the inhibitor as 100%, the mass of the inhibitor in the part described in step (1) is 30% to 70%, for example, 35%, 40%, 45%, 50%, 55%, 60% or 65%.

[0045] Preferably, in step (1), the rotation speed of the first stirring and the second stirring is 500~800 rpm (e.g., 550 rpm, 600 rpm, 650 rpm, 700 rpm or 750 rpm, etc.), and more preferably 600~700 rpm.

[0046] Preferably, the time for the first stirring and the second stirring in step (1) is ≥1 h each, for example, 1.5 h, 2 h, 2.5 h, 3 h, 3.5 h, 4 h, 4.5 h or 5 h, etc.

[0047] Preferably, the addition of catalyst in step (1) includes dropwise addition of catalyst.

[0048] Preferably, the catalyst addition time in step (1) is 15 to 45 min (e.g., 20 min, 25 min, 30 min, 35 min or 40 min, etc.), and more preferably 25 to 35 min.

[0049] Preferably, the mixing in step (2) includes stirring, and the stirring speed is 1500~3000 rpm (e.g., 1700 rpm, 1900 rpm, 2100 rpm, 2300 rpm, 2500 rpm, 2700 rpm or 2900 rpm, etc.), and more preferably 1500~2500 rpm.

[0050] Preferably, the mixing time in step (2) is 8 to 12 hours (e.g., 8.5 hours, 9 hours, 9.5 hours, 10 hours, 10.5 hours, 11 hours or 11.5 hours, etc.), and more preferably 10 to 12 hours.

[0051] Preferably, in step (3), the rotation speed of the first stirring and the second stirring is 500~800 rpm (e.g., 550 rpm, 600 rpm, 650 rpm, 700 rpm or 750 rpm, etc.), and more preferably 600~700 rpm.

[0052] Preferably, the stirring time in step (3) is ≥4 h, for example 4.5 h, 5 h, 5.5 h, 6 h, 6.5 h or 7 h.

[0053] Preferably, the stirring time in step (3) is ≥2 h, for example 2.5 h, 3 h, 3.5 h, 4 h, 4.5 h or 5 h.

[0054] Preferably, in step (4), the rotation speed of the first stirring and the second stirring is independently 300~500 rpm (e.g., 320 rpm, 340 rpm, 360 rpm, 380 rpm, 400 rpm, 420 rpm, 440 rpm, 460 rpm or 480 rpm, etc.), and more preferably 250~350 rpm.

[0055] Preferably, the dripping time in step (4) is 1 to 3 hours (e.g., 1.3 hours, 1.6 hours, 1.9 hours, 2.2 hours, 2.5 hours or 2.8 hours), and more preferably 1.5 to 2.5 hours.

[0056] Preferably, the temperature of the first stirring in step (4) is ≤35℃, such as 20℃, 22℃, 24℃, 26℃, 28℃, 30℃, 32℃ or 34℃, etc.

[0057] Preferably, the stirring time in step (4) is 1 to 7 hours (e.g., 2 hours, 3 hours, 4 hours, 5 hours or 6 hours), and more preferably 2 to 5 hours.

[0058] Preferably, the filtration in step (4) includes a first filter, a second filter, and a third filter.

[0059] Preferably, the average pore size of the filter element of the first filter is 5~10 μm, such as 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm or 9.5 μm.

[0060] Preferably, the average pore size of the filter element of the second filter is 1~2 μm, such as 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm or 1.9 μm.

[0061] Preferably, the average pore size of the filter element of the third filter is 0.2~0.3 μm, such as 0.41 μm, 0.42 μm, 0.43 μm, 0.44 μm, 0.45 μm, 0.46 μm, 0.47 μm, 0.48 μm or 0.49 μm.

[0062] Thirdly, the present invention provides an application of the silicone silicone for Micro-LED stamp repair as described in the first aspect in the transfer and repair of Micro-LED stamps.

[0063] Preferably, the method of application includes the following steps:

[0064] (I) Spin-coating a release agent onto the stamp head mold and curing it to form a stamp head mold with a release agent coating;

[0065] (II) The Micro-LED repair stamp is spin-coated onto a carrier with silicone, and then covered with the stamp head mold containing the release agent coating obtained in step (I). The mold is closed, cured, cooled, and then demolded to obtain the stamp head.

[0066] (III) The stamp head obtained in step (II) is used to remove the failed chip, pick up the repair chip, place the repair chip, solder the repair chip, remove the stamp head, and complete the Micro-LED stamp transfer and repair.

[0067] Preferably, the curing in step (I) is heat curing.

[0068] Preferably, the temperature for heat curing is 100~120℃ (e.g., 102℃, 104℃, 106℃, 108℃, 110℃, 112℃, 114℃, 116℃ or 118℃, etc.), and the time for heat curing is 5~10 min (e.g., 5.5 min, 6 min, 6.5 min, 7 min, 7.5 min, 8 min, 8.5 min, 9 min or 9.5 min, etc.).

[0069] Preferably, the mold closing in step (II) is a pressure mold closing.

[0070] Preferably, the pressure of the pressurized mold closing is 0.5~1 MPa (e.g., 0.55 MPa, 0.6 MPa, 0.65 MPa, 0.7 MPa, 0.75 MPa, 0.8 MPa, 0.85 MPa, 0.9 MPa or 0.95 MPa, etc.).

[0071] Preferably, the curing in step (II) is heat-pressurized curing.

[0072] Preferably, the temperature for heating and pressurizing curing is 180~200℃, the pressure for heating and pressurizing curing is 0.5~1MPa (e.g., 0.55 MPa, 0.6 MPa, 0.65 MPa, 0.7 MPa, 0.75 MPa, 0.8 MPa, 0.85 MPa, 0.9 MPa or 0.95 MPa, etc.), and the time for heating and pressurizing curing is 20~40 min (e.g., 22 min, 24 min, 26 min, 28 min, 30 min, 32 min, 34 min, 36 min or 38 min, etc.).

[0073] Compared with the prior art, the present invention has at least the following beneficial effects:

[0074] This invention utilizes a specific weight ratio of polyvinyl silicone oil, terminal vinyl silicone oil, terminal hydrogen-containing silicone oil, terminal side hydrogen-containing silicone oil, vinyl MQ resin, methyl hydrogen-containing MQ resin, fumed silica, catalyst, and inhibitor to create a Micro-LED repair stamp. The resulting silicone elastomer material, after curing with silicone, possesses excellent initial adhesion, appropriate hardness, a low coefficient of thermal expansion, and high elongation at break. During transfer repair, it effectively picks up the chip without leaving residue, ensuring high yield in subsequent micro-LED chip soldering processes. It is also less prone to irreversible deformation, can be reused multiple times, and has a long service life. The silicone elastomer material formed after curing the Micro-LED repair stamp has an initial tack of 0.5~0.8 N, a Shore A hardness of 30~36, a loss modulus of 125~188 Pa, an elongation at break of 88%~180%, and a coefficient of thermal expansion of 175×10⁻⁶. -6 / K~200×10 -6 / K. Attached Figure Description

[0075] Figure 1 A process flow diagram for preparing a stamp head using the Micro-LED repair silicone provided by this invention;

[0076] Among them, 1-stamp head mold; 2-release agent coating; 3-micro-LED silicone for stamp repair; 4-carrier sheet; 5-stamp head;

[0077] Figure 2 This is a process flow diagram for removing failed chips using a stamp head made of silicone material for Micro-LED repair stamps provided by the present invention.

[0078] Among them, 4-carrier; 5-stamp head; 6-failed chip; 7-normal chip; 8-glass substrate;

[0079] Figure 3 This is a process flow diagram of picking up repair chips using a stamp head made of silicone material for Micro-LED repair stamps provided by the present invention.

[0080] Among them, 4-carrier chip; 5-stamp head; 9-repair chip; 10-carrier board for repair chip;

[0081] Figure 4 This is a process flow diagram of installing a repair chip using a stamp head made of silicone material for Micro-LED repair stamps provided by this invention.

[0082] Among them, 4-carrier; 5-stamp head; 7-normal chip; 8-glass substrate; 9-repair chip. Detailed Implementation

[0083] To facilitate understanding of the present invention, the following embodiments are provided. Those skilled in the art should understand that these embodiments are merely illustrative and should not be construed as limiting the scope of the invention.

[0084] Unless otherwise specified, the materials and equipment involved in the following detailed embodiments are all conventional materials and equipment in the art and will not affect the technical effects of the present invention.

[0085] The sources of some of the raw materials used in the following examples and comparative examples are as follows:

[0086] Polyvinyl silicone oil A: Vinyl content is 10% by mass, viscosity at 25℃ is 10000 mPa·s, manufacturer is Shanghai Silicon Power Advanced Materials Co., Ltd.;

[0087] Polyvinyl silicone oil B: Vinyl content is 3% by mass, viscosity at 25℃ is 7000 mPa·s, manufacturer is Shanghai Silicon Power Advanced Materials Co., Ltd.;

[0088] Vinyl-terminated silicone oil: vinyl content is 1% by mass, viscosity at 25℃ is 5000 mPa·s, manufacturer is Shandong Dayi Chemical Co., Ltd.

[0089] Hydrogen-containing silicone oil: hydrogen content is 0.2wt%, viscosity at 25℃ is 80 mPa·s. Manufacturer is Shanghai Silicon Power Advanced Materials Co., Ltd.

[0090] Hydrogen-containing silicone oil with end side: hydrogen content of 1wt%, viscosity of 100 mPa·s at 25℃, manufactured by Shanghai Silicon Power Materials Co., Ltd.

[0091] Vinyl MQ resin: M / Q ratio is 0.7, vinyl content is 2.2% by mass, viscosity at 25℃ is 8000 mPa·s, manufacturer is Shanghai Silicon Power Advanced Materials Co., Ltd.;

[0092] Methyl hydrogen-containing MQ resin: M / Q ratio is 0.7, hydrogen content is 0.1wt%, manufacturer is Shandong Dayi Chemical Co., Ltd.;

[0093] Hydrophobic modified fumed silica: Model number HB-612, manufactured by Hubei Huifu Nanomaterials Co., Ltd.

[0094] Karstedt catalyst: model FDW25, active ingredient content 5000 ppm, manufacturer: Wuhan Lanabai Pharmaceutical Chemical Co., Ltd.

[0095] Example 1

[0096] This embodiment provides a silicone seal for Micro-LED repair of stamps and its preparation method. The silicone seal for Micro-LED repair of stamps comprises the following components by weight: 40 parts of polyvinyl silicone oil, 10 parts of terminal vinyl silicone oil, 15 parts of terminal hydrogen-containing silicone oil, 5 parts of terminal side hydrogen-containing silicone oil, 15 parts of vinyl MQ resin, 10 parts of methyl hydrogen-containing MQ resin, 5 parts of hydrophobically modified fumed silica, 0.1 parts of catalyst (Karstedt catalyst), and 0.2 parts of inhibitor (1-ethynylcyclohexanol).

[0097] The aforementioned polyvinyl silicone oils are polyvinyl silicone oil A and polyvinyl silicone oil B with a mass ratio of 1.67:1.

[0098] The preparation method of the silicone rubber for Micro-LED repair stamps includes the following steps:

[0099] (1) Add a portion of terminal vinyl silicone oil and a portion of inhibitor to a portion of polyvinyl silicone oil, and stir at 650 rpm for 1 h. The mass of the polyvinyl silicone oil is 50% of the total mass of polyvinyl silicone oil; the mass of the terminal vinyl silicone oil is 50% of the total mass of terminal vinyl silicone oil; and the mass of the inhibitor is 50% of the total mass of inhibitor. Then, add the catalyst dropwise using a peristaltic pump while stirring for 30 min, and continue stirring at 650 rpm for 1 h to obtain the first premix.

[0100] (2) The remaining polyvinyl silicone oil, the remaining terminal vinyl silicone oil, vinyl MQ resin, methyl hydrogen MQ resin and hydrophobic modified fumed silica are stirred and mixed at a speed of 2000 rpm for 12 h. The adhesive solution is completely transparent and free of particles, thus obtaining the second premix.

[0101] (3) Stir the first premix obtained in step (1) and the second premix obtained in step (2) at a speed of 600 rpm for 4 hours, add the remaining inhibitor and continue stirring at the same speed for 2 hours to obtain the third premix.

[0102] (4) While stirring at 300 rpm, a mixture of end-containing hydrogen silicone oil and end-side hydrogen silicone oil is added dropwise to the third premix obtained in step (3) using a peristaltic pump. The dropwise addition time is 2 h. During the dropwise addition, the system is cooled by passing cooling water to control the temperature within the system to ≤35℃ in order to avoid local high temperature and high concentration leading to side reactions. After the dropwise addition is completed, stirring is continued for 3 h. The mixture is then filtered sequentially using filter elements with average pore sizes of 5 μm, 1 μm and 0.22 μm to obtain the silicone for repairing Micro-LED stamps.

[0103] Example 2

[0104] This embodiment provides a silicone rubber for Micro-LED stamp repair and its preparation method. The silicone rubber for Micro-LED stamp repair comprises the following components by weight: 45 parts of polyvinyl silicone oil, 5 parts of terminal vinyl silicone oil, 15 parts of terminal hydrogen-containing silicone oil, 3 parts of terminal side hydrogen-containing silicone oil, 13 parts of vinyl MQ resin, 12 parts of methyl hydrogen-containing MQ resin, 7 parts of hydrophobically modified fumed silica, 0.1 parts of catalyst (Karstedt catalyst), and 0.2 parts of inhibitor (1-ethynylcyclohexanol).

[0105] The polyvinyl silicone oil is polyvinyl silicone oil A and polyvinyl silicone oil B with a mass ratio of 1.25:1.

[0106] The preparation method of the silicone rubber for Micro-LED repair stamps includes the following steps:

[0107] (1) Add a portion of terminal vinyl silicone oil and a portion of inhibitor to a portion of polyvinyl silicone oil, and stir at 600 rpm for 1 h. The mass of the polyvinyl silicone oil is 60% of the total mass of polyvinyl silicone oil; the mass of the terminal vinyl silicone oil is 40% of the total mass of terminal vinyl silicone oil; and the mass of the inhibitor is 50% of the total mass of inhibitor. Then, add the catalyst dropwise using a peristaltic pump while stirring for 30 min, and continue stirring at 600 rpm for 1 h to obtain the first premix.

[0108] (2) The remaining polyvinyl silicone oil, the remaining terminal vinyl silicone oil, vinyl MQ resin, methyl hydrogen MQ resin and hydrophobic modified fumed silica are stirred and mixed at a speed of 1500 rpm for 12 h. The adhesive solution is completely transparent and free of particles, and the second premix is ​​obtained.

[0109] (3) Stir the first premix obtained in step (1) and the second premix obtained in step (2) at a speed of 500 rpm for 4 hours, add the remaining inhibitor and continue stirring at the same speed for 2 hours to obtain the third premix.

[0110] (4) While stirring at 300 rpm, a mixture of end-containing hydrogen silicone oil and end-side hydrogen silicone oil is added dropwise to the third premix obtained in step (3) using a peristaltic pump. The dropwise addition time is 2 h. During the dropwise addition, the system is cooled by passing cooling water to control the temperature within the system to ≤35℃ in order to avoid local high temperature and high concentration leading to side reactions. After the dropwise addition is completed, stirring is continued for 3 h. The mixture is then filtered sequentially using filter elements with average pore sizes of 1 μm, 0.45 μm and 0.22 μm to obtain the silicone for repairing Micro-LED stamps.

[0111] Example 3

[0112] This embodiment provides a silicone seal for Micro-LED repair of stamps and its preparation method. The silicone seal for Micro-LED repair of stamps comprises the following components by weight: 35 parts of polyvinyl silicone oil, 15 parts of terminal vinyl silicone oil, 5 parts of terminal hydrogen-containing silicone oil, 4 parts of terminal side hydrogen-containing silicone oil, 12 parts of vinyl MQ resin, 15 parts of methyl hydrogen-containing MQ resin, 10 parts of hydrophobically modified fumed silica, 0.1 parts of catalyst (Karstedt catalyst), and 0.2 parts of inhibitor (1-ethynylcyclohexanol).

[0113] The polyvinyl silicone oil is polyvinyl silicone oil A and polyvinyl silicone oil B with a mass ratio of 2.5:1.

[0114] The preparation method of the silicone rubber for Micro-LED repair stamps includes the following steps:

[0115] (1) Add a portion of terminal vinyl silicone oil and a portion of inhibitor to a portion of polyvinyl silicone oil, and stir at 700 rpm for 1 h. The mass of the polyvinyl silicone oil is 40% of the total mass of the polyvinyl silicone oil; the mass of the terminal vinyl silicone oil is 30% of the total mass of the terminal vinyl silicone oil; and the mass of the inhibitor is 70% of the total mass of the inhibitor. Then, add the catalyst dropwise using a peristaltic pump while stirring for 30 min, and continue stirring at 700 rpm for 1 h to obtain the first premix.

[0116] (2) The remaining polyvinyl silicone oil, the remaining terminal vinyl silicone oil, vinyl MQ resin, methyl hydrogen MQ resin and hydrophobic modified fumed silica are stirred and mixed at a speed of 3000 rpm for 8 h. The adhesive solution is completely transparent and free of particles, thus obtaining the second premix.

[0117] (3) Stir the first premix obtained in step (1) and the second premix obtained in step (2) at a speed of 800 rpm for 4 hours, add the remaining inhibitor and continue stirring at the same speed for 2 hours to obtain the third premix.

[0118] (4) While stirring at 500 rpm, a mixture of end-containing hydrogen silicone oil and end-side hydrogen silicone oil is added dropwise to the third premix obtained in step (3) using a peristaltic pump. The dropwise addition time is 2 h. During the dropwise addition, the system is cooled by passing cooling water to control the temperature within the system to ≤35℃ in order to avoid local high temperature and high concentration leading to side reactions. After the dropwise addition is completed, stirring is continued for 3 h. The mixture is then filtered sequentially using filter elements with average pore sizes of 1 μm, 0.45 μm and 0.22 μm to obtain the silicone for repairing the Micro-LED stamp.

[0119] Example 4

[0120] This embodiment provides an organosilicon for Micro-LED repair stamps and its preparation method. The difference between this embodiment and Embodiment 1 is that the polyvinyl silicone oil is polyvinyl silicone oil A and polyvinyl silicone oil B with a mass ratio of 1:1, and the other conditions are the same as in Embodiment 1.

[0121] Example 5

[0122] This embodiment provides an organosilicon for Micro-LED repair of stamps and its preparation method. The difference between this embodiment and Embodiment 1 is that the polyvinyl silicone oil is polyvinyl silicone oil A and polyvinyl silicone oil B with a mass ratio of 3:1, and the other conditions are the same as in Embodiment 1.

[0123] Example 6

[0124] This embodiment provides an organosilicon for Micro-LED repair of stamps and its preparation method. The difference between this embodiment and Example 1 is that the catalyst (Karstedt catalyst) is replaced with a catalyst ((trimethyl)methylcyclopentadiene platinum), while the other conditions are the same as in Example 1.

[0125] Example 7

[0126] This embodiment provides an organosilicon for Micro-LED repair of stamps and its preparation method. The difference between this embodiment and Example 1 is that the catalyst (Karstedt catalyst) is replaced with a catalyst (chloroplatinic acid), while the other conditions are the same as in Example 1.

[0127] Example 8

[0128] This embodiment provides an organosilicon for Micro-LED repair of stamps and its preparation method. The difference between this embodiment and Example 1 is that the catalyst (Karstedt catalyst) is replaced with a catalyst (rhodium acetylacetone), while the other conditions are the same as in Example 1.

[0129] Comparative Example 1

[0130] This comparative example provides a silicone rubber for Micro-LED repair of stamps and its preparation method. The difference between this example and Example 1 is that no end vinyl silicone oil is added, while the other conditions are the same as in Example 1.

[0131] Comparative Example 2

[0132] This comparative example provides a Micro-LED repair silicone seal and its preparation method. The difference between this example and Example 1 is that no end-side hydrogen-containing silicone oil is added, while other conditions are the same as in Example 1.

[0133] Comparative Example 3

[0134] This comparative example provides a silicone seal for Micro-LED repair of stamps and its preparation method. The difference between this example and Example 1 is that vinyl MQ resin is not added, while other conditions are the same as in Example 1.

[0135] Comparative Example 4

[0136] This comparative example provides a Micro-LED repair silicone seal and its preparation method. The difference between this example and Example 1 is that no methyl hydrogen MQ resin is added, while the other conditions are the same as in Example 1.

[0137] Comparative Example 5

[0138] This comparative example provides an organosilicon for Micro-LED repair of stamps and its preparation method. The difference between this example and Example 1 is that hydrophobic modified fumed silica is not added, while other conditions are the same as in Example 1.

[0139] For example, the method of using the silicone rubber prepared above for the transfer and repair of Micro-LED stamps includes the following steps.

[0140] (I) Spin-coat the mold release agent onto the stamp head mold, heat and cure it at a temperature of 100°C for 10 minutes to form a mold head mold with a mold release agent coating.

[0141] (II) such as Figure 1 As shown, the Micro-LED repair stamp is spin-coated with silicone 3 onto the carrier sheet 4, and then covered with the stamp head mold 1 containing the release agent coating 2 obtained in step (I). The mold is then pressed and closed with a pressure of 0.1 MPa. The stamp head 5 is then cured by heating and pressurizing at a temperature of 200℃ and a pressure of 0.1 MPa for 20 min. After cooling, the stamp head 5 is demolded.

[0142] (III) such as Figure 2 As shown, the stamp head 5 obtained in step (II) is used to remove the failed chip 6; as Figure 3 As shown, the stamp head 5 obtained in step (II) is used to pick up the repair chip 9; as Figure 4 As shown, the repair chip 9 is placed and soldered, the stamp head 5 is removed, and the Micro-LED stamp transfer and repair is completed.

[0143] The silicone materials for Micro-LED repair stamps provided in Examples 1-8 and Comparative Examples 1-5 were placed in a PTFE-lined steel mold and cured by baking in an oven at 200°C for 2 hours to form silicone elastomer materials. The following performance tests were then performed.

[0144] (1) Initial adhesion: The silicone elastomer sample was fixed using an electronic universal testing machine. The machine fixture was controlled to slowly press the sample downward at a speed of 0.5 cm / min until the pressing depth was 0.1 cm. The pressure was held for 1 min, and then the sample surface was quickly peeled off at a speed of 50 cm / min. The maximum adhesion force during the process was recorded.

[0145] (2) Hardness: The Shore A hardness tester was used for testing. The test method was in accordance with ASTM D2240, "Standard Test Method for Hardness of Hardness Tester".

[0146] (3) Loss modulus: The dynamic thermomechanical analyzer (DMA) was used for testing. The test method was in accordance with GB / T 40396-2021 "Test method for glass transition temperature of polymer-based composite materials - dynamic mechanical analysis method".

[0147] (4) Elongation at break: The test was conducted using an electronic universal testing machine. The test method was in accordance with GB / T-528 "Determination of tensile stress-strain properties of vulcanized rubber or thermoplastic rubber".

[0148] (5) Coefficient of thermal expansion: The thermomechanical analyzer (TMA) was used for testing. The test method was in accordance with GB / T 36800.2-2018 "Thermomechanical analysis of plastics (TMA) Part 2: Determination of linear coefficient of thermal expansion and glass transition temperature".

[0149] The test results are shown in Table 1 below.

[0150] Table 1

[0151]

[0152] According to the test results in Table 1, the initial tack of the silicone elastomer materials formed after curing the Micro-LED repair stamps provided in Examples 1-8 is 0.5-0.8 N, the Shore A hardness is 30-36, the loss modulus is 125-188 Pa, the elongation at break is 88%-180%, and the coefficient of thermal expansion is 175-200 × 10⁻⁶. -6 / K possesses excellent initial adhesion properties, appropriate hardness, and a low coefficient of thermal expansion, ensuring that it can pick up the chip well during transfer repair without leaving any adhesive residue on the chip.

[0153] Compared with Examples 1, 4, and 5, as the mass ratio of vinyl silicone oil A to polyvinyl silicone oil B increases, the initial tack increases, the hardness increases, the elongation at break increases, the loss modulus decreases, but the coefficient of thermal expansion increases.

[0154] Compared with Example 1, if no end-vinyl silicone oil is added (Comparative Example 1), the initial tack of the silicone elastomer material formed after curing the prepared Micro-LED repair stamp with silicone is significantly reduced, the elongation at break decreases, and the toughness decreases. When the stamp head is made for Micro-LED chip transfer and repair, the adhesion effect on the chip is poor, which makes the chip easy to fall off during the picking and placing process.

[0155] Compared with Example 1, if no end-side hydrogen-containing silicone oil is added (Comparative Example 2), the hardness of the silicone elastomer material formed after curing the prepared Micro-LED repair stamp with silicone is reduced; when the stamp head is made for Micro-LED chip transfer and repair, the stamp head has a large deformation after being subjected to pressure, which can easily lead to positional deviation when the repaired chip is placed. During the welding process, insufficient support may also cause the solder joints to not be firmly contacted, resulting in welding abnormalities.

[0156] Compared with Example 1, if vinyl MQ resin is not added (Comparative Example 3), the hardness of the silicone elastomer material formed after curing the Micro-LED repair stamp with silicone is reduced, the loss modulus is increased, and the coefficient of thermal expansion is increased. When the stamp head is made for Micro-LED chip transfer and repair, the stamp head has a large deformation under pressure. When the repaired chip is placed, positional deviation is likely to occur. During the welding process, the deformation may increase due to heat, causing welding abnormalities. It may also cause irreversible deformation of the stamp head, reducing its service life.

[0157] Compared with Example 1, if methyl hydrogen MQ resin (Comparative Example 4) is not added, the hardness of the silicone elastomer material formed after curing the prepared Micro-LED repair stamp with silicone is reduced and the coefficient of thermal expansion is increased. When the stamp head is made for Micro-LED chip transfer and repair, the adhesion effect on the chip is poor, which makes the chip easy to fall off during the picking and placing process.

[0158] Compared to Example 1, without the addition of hydrophobically modified fumed silica (Comparative Example 5), the hardness of the silicone elastomer material formed after curing the Micro-LED repair stamp with silicone is reduced, the coefficient of thermal expansion is significantly increased, and the elongation at break is decreased. When the stamp head is used to transfer and repair Micro-LED chips, the stamp head deforms significantly under pressure, which can easily lead to positional deviations when placing the repaired chip. During the welding process, the deformation may increase due to heat, causing welding abnormalities and irreversible deformation of the stamp head, thus reducing its service life.

[0159] The applicant declares that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention fall within the protection and disclosure scope of the present invention.

Claims

1. A type of silicone rubber for Micro-LED repair of stamps, characterized in that, The Micro-LED repair seal silicone comprises the following components by weight: 35-45 parts of polyvinyl silicone oil, 5-15 parts of terminal vinyl silicone oil, 5-15 parts of terminal hydrogen-containing silicone oil, 3-5 parts of terminal side hydrogen-containing silicone oil, 10-15 parts of vinyl MQ resin, 5-15 parts of methyl hydrogen-containing MQ resin, 5-10 parts of fumed silica, 0.03-5 parts of catalyst, and 0.03-1 part of inhibitor.

2. The silicone sealant for Micro-LED repair of stamps according to claim 1, characterized in that, The polyvinyl silicone oil includes polyvinyl silicone oil A and / or polyvinyl silicone oil B; Preferably, the vinyl content in the polyvinyl silicone oil A is 8% to 10% by mass; Preferably, the vinyl content in the polyvinyl silicone oil B is 3% to 5% by mass.

3. The silicone sealant for Micro-LED repair of stamps according to claim 2, characterized in that, The mass ratio of the polyvinyl silicone oil A to the polyvinyl silicone oil B is (1~3):

1.

4. The silicone sealant for Micro-LED repair of stamps according to any one of claims 1 to 3, characterized in that, The vinyl group content in the vinyl-terminated silicone oil is 0.8% to 1.8% by mass. Preferably, the hydrogen content of the end-hydrogen-containing silicone oil is 0.1wt%~0.3wt%; Preferably, the hydrogen content of the end-side hydrogen-containing silicone oil is 0.6wt%~1.2wt%.

5. The silicone sealant for Micro-LED repair of stamps according to any one of claims 1 to 4, characterized in that, The M / Q ratio of the vinyl MQ resin is 0.6~1.2; Preferably, the vinyl MQ resin contains 1.7% to 2.2% vinyl by mass. Preferably, the M / Q ratio of the methyl hydrogen MQ resin is 0.6 to 1.2; Preferably, the hydrogen content of the methyl hydrogen MQ resin is 0.1wt%~0.5wt%; Preferably, the fumed silica comprises hydrophobically modified fumed silica; Preferably, the catalyst comprises a transition metal catalyst; Preferably, the transition metal catalyst includes any one or a combination of at least two of platinum catalysts, palladium catalysts, or rhodium catalysts; Preferably, the inhibitor includes any one or a combination of at least two of the following: alkynol inhibitors, alkynyl ester inhibitors, nitrogen-containing inhibitors, phosphorus-containing inhibitors, sulfur-containing inhibitors, or heavy metal ion inhibitors; Preferably, the alkynyl alcohol inhibitor comprises 1-ethynylcyclohexanol and / or 3-phenyl-1-butyn-3-ol; Preferably, the acetylacetic ester inhibitors include dimethyl butyronitrile and / or diethyl butyronitrile; Preferably, the nitrogen-containing inhibitor comprises tetramethylethylenediamine; Preferably, the phosphorus-containing inhibitor comprises triphenylphosphine; Preferably, the heavy metal ion inhibitor comprises dibutyltin dilaurate and / or zinc octanoate.

6. A method for preparing silicone rubber for Micro-LED repair stamps as described in any one of claims 1 to 5, characterized in that, The preparation method includes the following steps: mixing polyvinyl silicone oil, terminal vinyl silicone oil, terminal hydrogen-containing silicone oil, terminal side hydrogen-containing silicone oil, vinyl MQ resin, methyl hydrogen-containing MQ resin, fumed silica, catalyst and inhibitor to obtain the organosilicon for Micro-LED repair stamps.

7. The preparation method according to claim 6, characterized in that, The preparation method includes the following steps: (1) Add a portion of inhibitor to a mixture of a portion of polyvinyl silicone oil and a portion of terminal vinyl silicone oil and stir for the first time, add a catalyst and stir for the second time to obtain a first premix; (2) The remaining polyvinyl silicone oil, the remaining terminal vinyl silicone oil, vinyl MQ resin, methyl hydrogen MQ resin and fumed silica are mixed to obtain a second premix; (3) The first premix obtained in step (1) and the second premix obtained in step (2) are stirred for the first time, and the remaining inhibitor is added and stirred for the second time to obtain the third premix. (4) Add end-containing hydrogen silicone oil and end-side hydrogen silicone oil to the third premix obtained in step (3) under the first stirring state, perform the second stirring, filter, and obtain the organic silicone for Micro-LED repair stamp.

8. The preparation method according to claim 7, characterized in that, Based on the total mass of polyvinyl silicone oil being 100%, the mass of the polyvinyl silicone oil in step (1) is 40%~60%; Preferably, based on the total mass of the vinyl-terminated silicone oil being 100%, the mass of the vinyl-terminated silicone oil in step (1) is 30% to 50%; Preferably, based on the total mass of the inhibitor being 100%, the mass of the inhibitor in step (1) is 30% to 70%; Preferably, in step (1), the rotation speed of the first and second stirring is independently 500~800 rpm; Preferably, the time for the first stirring and the second stirring in step (1) is ≥1 h each independently; Preferably, the addition of catalyst in step (1) includes dropwise addition of catalyst; Preferably, the catalyst addition time in step (1) is 15~45 min; Preferably, the mixing in step (2) includes stirring, and the stirring speed is 1500~3000 rpm; Preferably, the mixing time in step (2) is 8~12 h; Preferably, in step (3), the rotation speeds of the first and second stirring are each independently 500~800 rpm; Preferably, the stirring time in step (3) is ≥4 h; Preferably, the stirring time in step (3) is ≥2 h; Preferably, in step (4), the rotation speeds of the first and second stirring are each 300~500 rpm independently; Preferably, the dripping time in step (4) is 1~3 h; Preferably, the temperature of the first stirring in step (4) is ≤35℃; Preferably, the stirring time in step (4) is 1~7 h; Preferably, the filtration in step (4) includes a first filter, a second filter, and a third filter; Preferably, the average pore size of the filter element of the first filter is 5~10 μm; Preferably, the average pore size of the filter element in the second filter is 1~2 μm; Preferably, the average pore size of the filter element of the third filter is 0.2~0.3 μm.

9. The application of the silicone organosilicon for Micro-LED stamp repair as described in any one of claims 1 to 5 in the transfer and repair of Micro-LED stamps.

10. The application according to claim 9, characterized in that, The method of application includes the following steps: (I) Spin-coating a release agent onto the stamp head mold and curing it to form a stamp head mold with a release agent coating; (II) The Micro-LED repair stamp is spin-coated onto a carrier with silicone, and then covered with the stamp head mold containing the release agent coating obtained in step (I). The mold is closed, cured, cooled, and then demolded to obtain the stamp head. (III) The stamp head obtained in step (II) is used to remove the failed chip, pick up the repair chip, place the repair chip, solder the repair chip, remove the stamp head, and complete the Micro-LED stamp transfer and repair.

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