Bearing pin assembly and deposition equipment

Abstract

The embodiment of the invention relates to the field of semiconductor manufacturing, provides a bearing pin assembly and deposition equipment, and at least can solve the problem of thermal expansion angle deviation caused by high temperature in the semiconductor manufacturing process. The bearing pin assembly comprises a rod body; one end of the rod body penetrates through the balancing weight; the compensation structure is located between the balancing weight and the rod body; wherein a spherical groove is formed in the inner side of the balancing weight, the compensation structure at least comprises a ball, the ball is located between the spherical groove and the rod body, the rod body penetrates through the ball, and the ball and the spherical groove are used for compensating inclination of the rod body.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor manufacturing, and in particular to a carrier pin assembly and deposition equipment. Background Technology

[0002] In the PECVD (Plasma Enhanced Chemical Vapor Deposition) wafer manufacturing process, the pin component (carrier pin component) plays a role in lifting and supporting the wafer during automatic loading and unloading. Its stability directly affects the wafer positioning accuracy and equipment uptime.

[0003] The current mainstream Pin components adopt a "rigid rod body + fixed bottom connection" structure. Considering the changes in the hole-axis gap after thermal expansion of different materials such as Pin components and AlNHeater (alumina heater), a series of problems may occur, which in turn affect the non-uniformity of the film layer deposited on the final wafer surface and affect the wafer yield. Summary of the Invention

[0004] This disclosure provides a carrier pin assembly and a deposition apparatus, which at least helps to improve the offset problem of the carrier assembly, thereby ensuring the yield of the wafer.

[0005] According to some embodiments of this disclosure, one aspect of this disclosure provides a load-bearing pin assembly, including: a rod; a counterweight, one end of the rod passing through the counterweight; and a compensation structure located between the counterweight and the rod; wherein the inner side of the counterweight has a spherical groove, and the compensation structure includes at least one ball, the ball being located between the spherical groove and the rod, the rod penetrating the ball, and the ball and the spherical groove being used to compensate for the tilt of the rod.

[0006] In some embodiments, the first depth of the spherical groove is greater than or equal to the radius of the ball.

[0007] In some embodiments, the radius of the ball is in the range of 3mm to 4mm.

[0008] In some embodiments, the clearance between the spherical groove and the ball is in the range of 0.03mm to 0.1mm.

[0009] In some embodiments, at least one of the rod, the counterweight, and the compensation structure is made of alumina ceramic.

[0010] In some embodiments, the rod and the compensation structure are integrally formed.

[0011] In some embodiments, the surface of the rod has protrusions.

[0012] In some embodiments, the height of the protrusion ranges from 0.3 mm to 0.7 mm.

[0013] In some embodiments, the spherical groove has a polished surface, and the surface roughness Ra of the polished surface is ≤0.5μm.

[0014] According to some embodiments of this disclosure, another aspect of this disclosure also provides a deposition apparatus, including: a carrier pin assembly as described in any of the above embodiments.

[0015] The technical solutions provided in this disclosure have at least the following advantages: This disclosure provides a support pin assembly, which includes a rod, a counterweight, and a compensation structure. One end of the rod passes through the counterweight; the compensation structure is disposed between the counterweight and the rod. The counterweight has a spherical groove on its inner side, and the compensation structure includes at least one ball bearing located between the spherical groove and the rod, with the rod passing through the ball bearing. Through the movement of the ball bearing within the spherical groove, the rod can adaptively adjust when subjected to tilting forces, thereby compensating for angular deviations caused by installation errors or deformation under stress, adjusting the pin tip's orientation, ensuring the tip always maintains horizontal contact with the wafer, avoiding stress concentration in the rod to reduce localized stress concentration and wear, and improving connection reliability and service life. Furthermore, based on the ball bearing's own rolling motion, it can lift the wafer as the pin assembly rises. The rotatable nature of the ball bearing can absorb lateral forces caused by wafer feed position deviations (±0.1mm), reducing impact. When the pin rod elongates due to heat, the gap between the guide sleeve within the counterweight and the rod can accommodate axial displacement, preventing the rod from bending and deforming. Attached Figure Description

[0016] One or more embodiments are illustrated by way of example with corresponding pictures in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the pictures in the accompanying drawings do not constitute a limitation on scale. In order to more clearly illustrate the technical solutions in the embodiments of this disclosure or the conventional technology, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a carrier pin assembly provided in one embodiment of the present disclosure; Figure 2 for Figure 1 A sectional view along section AA; Figure 3 for Figure 1 A sectional view along section BB; Figure 4 A partially enlarged view of a carrier pin assembly provided in an embodiment of this disclosure; Figure 5 This is a displacement diagram of a lifting and lowering cycle bearing pin assembly; Figure 6 It is a simulation diagram; Figure 7 This is a schematic diagram of a deposition apparatus provided in one embodiment of the present disclosure. Detailed Implementation

[0018] As can be seen from the background technology, there is a problem of thermal expansion angle deviation caused by high temperature in the current semiconductor manufacturing process.

[0019] Analysis revealed that one of the reasons for the thermal expansion angle deviation problem caused by high temperatures during semiconductor manufacturing is that the current mainstream pin components adopt a "rigid rod + fixed bottom connection" structure. Combining simulation data comparing the hole-axis clearance of the pin components and AlN Heaters after thermal expansion, the following key issues are exposed in practical applications: 1. Thermal expansion causes changes in gap and angle: During the high-temperature PECVD process (typically 400℃), the pin component (mostly made of ceramic) itself undergoes thermal expansion, and the AlN heater that it is paired with also expands due to the increased temperature. According to simulations, during the heating process of the pin (φ3.28), at the two extreme dimensions within the tolerance range of the hole and shaft, the minimum gap decreases by about 0.012mm. Although this is negligible compared to the initial gap, thermal expansion will still cause a change in the relative position of the pin component and the heater. If the pin is a rigid structure, angular stress will inevitably be generated due to "positional mismatch," which will disrupt the horizontal support state of the wafer.

[0020] 2. Angular deviation leads to high-frequency fracture: Angular deviation will cause stress concentration at the connection between the pin and the root. After long-term exposure to the weight of the wafer and the impact of lifting, the pin fracture rate is as high as 30%-50%, and the average life is only 3 to 6 months, which is far from meeting the "high uptime" requirements of semiconductor production lines.

[0021] 3. High maintenance costs and impact on production: After a pin breaks, the machine needs to be shut down to disassemble and replace the heater. After the vacuum environment is destroyed, it takes 4 to 6 hours to re-vacuum. A single maintenance takes more than 8 hours, resulting in a 5% to 8% decrease in equipment uptime. At the same time, the ceramic particles generated by the break may also contaminate the chamber, increasing the risk of wafer scrap.

[0022] 4. Existing improvement solutions have limitations: Some patents propose "spring buffer pin components" to cope with thermal expansion, but the spring can only compensate for axial displacement (such as the expansion of the pin rod due to heat) and cannot solve the problem of angle deviation; moreover, the spring is prone to elastic fatigue decay at a high temperature of 400℃, and the failure probability within 3 months exceeds 60%, which does not fundamentally solve the problem of breakage.

[0023] In summary, existing pin components cannot address the core issue of "coordinated thermal expansion of AlN Heater and Pin leading to gap changes and angle shifts" under the high-temperature PECVD process. There is an urgent need for a fracture-resistant structural design that can actively compensate for angle deviations and withstand high temperatures.

[0024] This disclosure provides a support pin assembly and a deposition device. The assembly includes a rod, a counterweight, and a compensation structure. One end of the rod passes through the counterweight; the compensation structure is disposed between the counterweight and the rod. The counterweight has a spherical groove on its inner side. The compensation structure includes at least one ball bearing, which is located between the spherical groove and the rod, with the rod passing through the ball bearing. The movement of the ball bearing within the spherical groove allows the rod to adaptively adjust when subjected to tilting forces, thereby compensating for angular deviations caused by installation errors or deformation under stress, effectively reducing local stress concentration and wear, and improving the reliability and service life of the connection.

[0025] It should be noted that the terminology used herein is for the purpose of describing particular implementations only and is not intended to limit the exemplary implementations according to embodiments of this disclosure. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0026] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this disclosure. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0027] In the description of the embodiments of this disclosure, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this disclosure and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of the embodiments of this disclosure; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0028] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0029] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this disclosure.

[0030] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this disclosure to facilitate a better understanding of the disclosure. However, the technical solutions claimed in this disclosure can be implemented even without these technical details and various variations and modifications based on the following embodiments.

[0031] Figure 1 This is a schematic diagram of a carrier pin assembly provided in one embodiment of the present disclosure; Figure 2 for Figure 1 A sectional view along section AA; Figure 3 for Figure 1 A sectional view along section BB; Figure 4 This is a partially enlarged view of a carrier pin assembly provided in one embodiment of the present disclosure.

[0032] refer to Figures 1-4 According to some embodiments of this disclosure, one aspect of this disclosure provides a support pin assembly, including: a rod 11; a counterweight 12, one end of the rod 11 passing through the counterweight 12; and a compensation structure 13 located between the counterweight 12 and the rod 11; wherein the inner side of the counterweight 12 has a spherical groove 120, and the compensation structure 13 includes at least one ball, the ball being located between the spherical groove 120 and the rod 11, the rod 11 penetrating the ball, and the ball and the spherical groove 120 being used to compensate for the tilt of the rod 11.

[0033] The support pin assembly provided in this embodiment includes a rod 11, a counterweight 12, and a compensation structure 13. One end of the rod 11 passes through the counterweight 12; the compensation structure 13 is disposed between the counterweight 12 and the rod 11. The inner side of the counterweight 12 is provided with a spherical groove 120, and the compensation structure 13 includes at least one ball bearing, which is located between the spherical groove 120 and the rod 11, with the rod 11 passing through the ball bearing. Through the movement of the ball bearing within the spherical groove 120, the rod 11 can adaptively adjust when subjected to tilting force, thereby compensating for angular deviations caused by installation errors or deformation under stress, adjusting the pin tip posture, ensuring that the tip always maintains horizontal contact with the wafer, avoiding stress concentration in the rod 11 to reduce local stress concentration and wear, and improving the reliability and service life of the connection. Secondly, based on the rolling of the ball bearing itself, it can lift the wafer when the pin assembly rises, and the rotatable characteristics of the ball bearing can absorb the lateral force caused by the wafer feed position deviation (±0.1mm), reducing impact. When the pin rod 11 is heated and elongated, the gap between the guide sleeve inside the counterweight block 12 and the rod 11 can accommodate axial displacement, thus preventing the rod 11 from bending and deforming.

[0034] The carrier pin assembly provided in the above embodiments will be described in detail below with reference to the accompanying drawings.

[0035] The carrier pin assembly can be any carrier pin assembly within a deposition apparatus. The carrier pin assembly is mainly used to control the wafer to bear the lifting and support functions during automatic wafer loading and unloading. Among them, any deposition apparatus includes, but is not limited to, PECVD and LPCVD (Low Pressure Chemical Vapor Deposition).

[0036] In some embodiments, the support pin assembly mainly includes a rod 11 and a counterweight 12 in a top-to-bottom order. The rod 11 is connected to the wafer stage, and the other end of the rod 11 is connected to the counterweight 12. The rod 11 is responsible for connecting the counterweight 12 and bearing the weight. The counterweight 12 itself has a large mass and can be used to balance the center of gravity of the entire mechanical system.

[0037] In some embodiments, the rod 11 is made of alumina ceramic. The purity of the alumina ceramic is greater than or equal to 99.5%. Alumina ceramic has high hardness, resulting in almost no wear during ball rotation, greatly extending the service life of the rod 11, maintaining long-term stable dimensional accuracy, and avoiding increased clearance, vibration, and noise due to wear. Secondly, alumina ceramic is an inert material with excellent resistance to strong acids, strong alkalis, salt spray, and organic solvents; it does not rust and therefore exhibits good high-temperature resistance, providing stable support strength against plasma corrosion. Alumina ceramic maintains its mechanical properties at temperatures above 1000℃ without oxidation, and its coefficient of thermal expansion matches the high-temperature environment of PECVD (200℃~400℃, coefficient of thermal expansion 8.1×10⁻⁶). -6 ( / ℃), which can still maintain a reasonable gap with the Heater hole after thermal expansion.

[0038] In some embodiments, the diameter of the rod 11 ranges from 3mm to 5mm. The diameter of the rod 11 can be 3mm, 3.3mm, 3.5mm, 3.7mm, 4.1mm, 4.5mm, 4.7mm or 5mm.

[0039] In some embodiments, the surface of the rod 11 has bumps. These bumps can reduce the contact area with the wafer (<2mm²), reducing particle contamination. Secondly, these bumps can maintain a reasonable gap with the Heater hole after thermal expansion, avoiding the large friction caused by the two sticking together, which makes angle compensation difficult and improves the success rate of angle compensation.

[0040] In some embodiments, the height of the protrusion ranges from 0.3mm to 0.7mm. The height of the protrusion can be 0.3mm, 0.4mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, or 0.7mm.

[0041] The counterweight 12 is made of alumina ceramic. The purity of the alumina ceramic is greater than or equal to 99.5%. Alumina ceramic has high hardness, resulting in almost no wear during ball bearing rotation, greatly extending the service life of the counterweight 12 and maintaining long-term stable dimensional accuracy, avoiding increased clearance, vibration, and noise caused by wear. Furthermore, alumina ceramic has excellent resistance to strong acids, strong alkalis, salt spray, and organic solvents, and maintains its mechanical properties at temperatures above 1000℃ without oxidation.

[0042] In some embodiments, the diameter of the counterweight 12 ranges from 25mm to 50mm. The diameter of the counterweight 12 can be 25mm, 28mm, 30mm, 33mm, 35mm, 38mm, 42mm or 50mm.

[0043] The weight of counterweight 12 ranges from 15g to 20g. The surface roughness Ra of counterweight 12 is ≤0.8μm. This range is used to ensure the coaxiality of the Pin assembly's lifting and lowering (deviation ≤0.02mm) and reduce friction on the rod 11.

[0044] In some embodiments, the spherical groove 120 has a polished surface with a surface roughness Ra ≤ 0.5 μm. The polished surface is used to ensure that the ball can rotate more easily within the spherical groove 120, reducing friction.

[0045] It should be noted that the spherical groove 120 refers to a groove with a spherical surface, not a standard sphere. It can be approximately spherical, as long as the ball can rotate smoothly within it.

[0046] The compensation structure 13 is used to compensate for angular deviations caused by installation deviations or stress deformations, including stress deformations caused by thermal expansion.

[0047] The compensation structure 13 includes a ball bearing located between the spherical groove 120 and the rod 11. Through the movement of the ball bearing within the spherical groove 120, the rod 11 can adaptively adjust when subjected to tilting force, thereby compensating for angular deviations caused by installation deviations or force deformation, effectively reducing local stress concentration and wear, and improving the reliability and service life of the connection.

[0048] Therefore, the bottom ball-shaped structure and the hemispherical groove 120 of the counterweight 12 are in "surface contact" fit, and the inner wall of the groove is provided with a 0.5μm polished layer to ensure smooth rotation of the ball; the Pin rod 11 and the counterweight 12 are in "clearance fit", which not only ensures the stability of lifting, but also reserves 0.2mm~0.3mm of margin for the axial thermal expansion of the rod 11, realizing the dual functions of "angle compensation + axial compensation".

[0049] In some embodiments, the compensation structure 13 is made of alumina ceramic, wherein the purity of the alumina ceramic is greater than or equal to 99.5%. Alumina ceramic has high hardness, resulting in almost no wear during ball rotation, greatly extending the service life of the compensation structure 13, maintaining long-term stable dimensional accuracy, and avoiding increased clearance, vibration, and noise due to wear. Furthermore, alumina ceramic exhibits excellent resistance to strong acids, strong alkalis, salt spray, and organic solvents, and maintains its mechanical properties at temperatures above 1000°C without oxidation.

[0050] In some embodiments, the radius of the ball is in the range of 3mm to 4mm. The radius of the ball can be 3mm, 3.1mm, 3.2mm, 3.4mm, 3.5mm, 3.6mm, 3.8mm or 4mm.

[0051] In some embodiments, the first depth of the spherical groove 120 is greater than or equal to the radius of the ball. Thus, the spherical groove 120 engages with the ball, and this gap ensures smooth ball rotation.

[0052] In some embodiments, the clearance between the spherical groove 120 and the ball is in the range of 0.03mm to 0.1mm. This allows the ball to rotate freely within the groove at ±0.5° to ±2°, compensating for thermal expansion angle shifts; there is no rigid connection or stress concentration.

[0053] The clearance between the spherical groove 120 and the ball can be 0.03mm, 0.05mm, 0.08mm or 0.1mm.

[0054] In some embodiments, the rod 11 and the compensation structure 13 are integrally formed. This allows the rod 11 and the compensation structure 13 to be manufactured in the same process, eliminating an assembly step and reducing offset issues caused by assembly tolerances.

[0055] It should be noted that the above descriptions of the diameter of the rod 11, the diameter and weight of the counterweight 12, and the radius of the ball bearing are examples, and those skilled in the art can modify them according to their needs.

[0056] The working principle of the bearing pin assembly to improve the angle offset can include: 1. High temperature angle compensation: Under the process of 400℃, the AlN Heater and the Pin rod 11 expand thermally together. According to simulation, the gap between the Pin hole and the Pin will change slightly, which will lead to angle offset. At this time, the bottom ball can rotate adaptively in the hemispherical groove 120 to adjust the Pin top posture and keep the top in horizontal contact with the wafer, so as to avoid stress concentration in the rod 11; 2. Wafer lifting buffer: When the robotic arm feeds the wafer, the Pin assembly rises and lifts the wafer. The rotatable characteristics of the ball can absorb the lateral force caused by the wafer feeding position deviation (±0.1mm) and reduce impact; 3. Axial thermal expansion adaptation: When the Pin rod 11 is heated and elongated, the gap between the guide sleeve and the rod 11 can accommodate axial displacement and prevent the rod 11 from bending and deforming.

[0057] Therefore, the bearing pin assembly provided by this solution can solve the problem of pin assembly angle displacement caused by the gap change due to the synergistic thermal expansion of AlNHeater and Pin under the high temperature (400℃) process of PECVD. It eliminates stress concentration from the structural design level, reducing the pin breakage rate by more than 90%; improves the high temperature stability of the pin assembly, avoids the high temperature fatigue failure of buffer structures such as springs, and extends the service life to 12-18 months; maintains compatibility with existing PECVD equipment, and can be directly replaced without modifying the drive mechanism, reducing the technical transformation cost for enterprises; reduces maintenance downtime and particulate contamination, and improves equipment uptime and wafer yield.

[0058] The carrier pin assembly provided in the above embodiments will be described below with reference to a specific example.

[0059] (I) Taking a 12-inch silicon-based wafer PECVD deposition equipment (process temperature 400℃, AlN Heater thermal expansion characteristics conform to simulation data) as an example, a φ3.28 pin component is selected. The specific implementation parameters and verification results are as follows: 1. Pin body: made of alumina ceramic, 3.28mm in diameter, 47mm in length, and 0.5mm in height of the micro-bumps; the surface is polished, Ra=0.4μm, and the coaxiality deviation of the micro-bumps is ≤0.01mm.

[0060] 2. Counterweight: The material is alumina ceramic, with a diameter of about 30mm and a height of 8mm. It has a spherical groove in the center to fit the ball bearing. The inner wall of the groove is polished to Ra=0.2μm, and the gap between the groove and the ball bearing is 0.05mm.

[0061] 3. Compensation structure (ball): The material is alumina ceramic, the ball diameter is 8mm, and the depth of the hemispherical groove is 4mm.

[0062] (II) The assembly process is as follows: 1. Align the bottom ball bearing structure with the hemispherical groove of the counterweight to ensure smooth and unobstructed rotation of the ball bearings; 2. Install the pin rod into the pin hole of the Heater, and calibrate the coaxiality of the guide sleeve using a dial indicator; 3. Insert the pin rod into the counterweight so that the bottom ball is embedded in the groove, and adjust the height of the pin top to be flush with the heater surface; 4. Adjust the height of the three sets of pins to complete the overall assembly.

[0063] (III) Process Validation Results: The wafer lifting and lowering cycles (each cycle includes "rising the wafer top - robotic arm picking up the wafer - robotic arm placing the wafer - falling back to its original position") were continuously run 1000 times in a 400℃ PECVD deposition process. The results, combined with simulations of the gap changes caused by the synergistic thermal expansion of the AlN Heater and the pin, are as follows: Figure 5 This is a displacement diagram of a lifting and lowering cycle bearing pin assembly; Figure 6 This is a simulation diagram.

[0064] from Figure 5 It can be seen that the structural stability is as follows: the pin component is free from breakage and obvious wear, the ball bearings still rotate smoothly, and the top level deviation is ≤0.02mm; the positioning accuracy is as follows: the center offset after the wafer is lifted is ≤0.03mm, which meets the positioning requirements of PECVD process (≤0.05mm).

[0065] Figure 6 The simulation uses an aluminum nitride (AlN) heater, heated from room temperature to 400°C. The positional change of the pin due to temperature increase is: 0.2 mm radially outward from the center of the pin along the center of the heater. The reduction in the pin diameter due to temperature increase is: 0.1995 - 0.2065 = -0.007 mm (the change in the outer edge of the pin radially along the center of the heater - the change in the inner edge of the pin).

[0066] Based on the chamber particle detection results, the number of particles ≥0.1μm decreased from 15-20 per test in traditional Pin components to 5-8 per test.

[0067] Based on lifespan simulation: After accelerated aging test (500 hours of continuous operation at 450℃), the Pin component remained intact, and its actual service life is expected to reach 15 months.

[0068] Based on the above data, the carrier pin assembly provided in the disclosed embodiments can have the following effects: 1. Significantly improved fracture resistance: Through bottom ball bearing angle compensation, the stress concentration of the Pin module is reduced by more than 95% under the 400℃ process, the fracture rate is reduced from 30%-50% to <5%, and the service life is extended from 1-3 months to 12-18 months; 2. High temperature stability: The core components (alumina rod and ball bearings) can work stably for a long time at 400℃ without elastic fatigue or material degradation, which is superior to the traditional spring buffer structure; 3. Excellent compatibility and economy: It can directly replace the pin components of existing PECVD equipment without modifying the drive mechanism, and is compatible with pins of different diameters (such as φ3.28, φ3.7, etc.). The technical modification cost per unit is reduced by more than 80%; after the maintenance cycle is extended, the equipment uptime is increased by 5%-8%. 4. Superior particle contamination control: The silicon nitride ceramic tip and polishing guide sleeve design reduce particle generation by 60% during the lifting and lowering of the pin component, and improve wafer yield by 0.5%-1%.

[0069] Accordingly, according to some embodiments of this disclosure, another aspect of this disclosure also provides a deposition apparatus, including the carrier pin assembly of any of the above embodiments. Technical features that are the same as or corresponding to those in the above embodiments will not be described in detail here.

[0070] Figure 7 This is a schematic diagram of a deposition apparatus provided in one embodiment of the present disclosure.

[0071] refer to Figure 7 The deposition equipment may include the carrier pin assembly of any of the above embodiments.

[0072] The deposition apparatus may include a chamber 20; a base 22 disposed at the bottom of the chamber 20 for supporting the wafer; an exhaust port disposed in a portion of the bottom region of the chamber; an intake mechanism 21 and a gas distribution structure, wherein the intake mechanism 21 is disposed at the top of the chamber 20 and faces the base 22, and the gas distribution structure is located inside the chamber 20.

[0073] The deposition equipment may include a lifting connector 23 connected to a support pin assembly 10; and a heater 24 located at the bottom of a base 22 for heating the base 22.

[0074] Those skilled in the art will understand that the above embodiments are specific examples of implementing this disclosure, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of this disclosure. Any person skilled in the art can make their own modifications and alterations without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure should be determined by the scope defined in the claims.

Claims

1. A load-bearing pin assembly, characterized in that, include: Rod body; A counterweight, with one end of the rod passing through the counterweight; A compensation structure is located between the counterweight and the rod. The counterweight has a spherical groove on its inner side, and the compensation structure includes at least one ball bearing located between the spherical groove and the rod. The rod penetrates the ball bearing, and the ball bearing and the spherical groove are used to compensate for the tilt of the rod.

2. The bearing pin assembly according to claim 1, characterized in that, The first depth of the spherical groove is greater than or equal to the radius of the ball.

3. The bearing pin assembly according to claim 2, characterized in that, The radius of the ball bearing is in the range of 3mm to 4mm.

4. The bearing pin assembly according to claim 2, characterized in that, The clearance between the spherical groove and the ball is in the range of 0.03mm to 0.1mm.

5. The bearing pin assembly according to claim 1, characterized in that, At least one of the rod, the counterweight, and the compensation structure is made of alumina ceramic.

6. The bearing pin assembly according to claim 1, characterized in that, The rod and the compensation structure are integrally formed.

7. The bearing pin assembly according to claim 1, characterized in that, The surface of the rod has protrusions.

8. The bearing pin assembly according to claim 7, characterized in that, The height of the protrusion ranges from 0.3mm to 0.7mm.

9. The bearing pin assembly according to claim 1, characterized in that, The spherical groove has a polished surface with a surface roughness Ra≤0.5μm.

10. A deposition apparatus, characterized in that, include: The carrier pin assembly as described in any one of claims 1 to 9.

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