Semiconductor refrigeration scheme-based efficient ice making device suitable for vehicle-mounted refrigerator

By combining a semiconductor refrigeration solution with the vehicle's air conditioning system and a liquid-cooled plate evaporator, the problem of ice-making difficulties in high-temperature environments for vehicle refrigerators has been solved, achieving efficient ice making and rapid ice removal.

CN121828979APending Publication Date: 2026-04-10ZHEJIANG HANHENG THERMOELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202511888465.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-15
Publication Date
2026-04-10

AI Technical Summary

Technical Problem

Existing vehicle refrigerators cannot make ice in high-temperature environments, and the ice-making time is long with low heat exchange efficiency.

Method used

A semiconductor refrigeration solution is adopted, which combines the vehicle's air conditioning compressor system and liquid-cooled plate evaporator. Heat exchange efficiency is improved by using heat conduction blocks and refrigeration fins, and ice-making efficiency is improved by using detachable ice-making box components and multi-shaped freezing swords.

Benefits of technology

It enables efficient ice making in high-temperature environments, shortens ice-making time, and improves heat exchange efficiency and ice extraction efficiency.

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Abstract

The invention relates to an efficient ice making device based on a semiconductor refrigeration scheme and suitable for a vehicle-mounted refrigerator. The technical problem that an existing vehicle-mounted refrigerator is low in refrigerating efficiency is solved. Comprising a refrigerator partition plate arranged on one side of a vehicle-mounted refrigerator, a semiconductor TEC is arranged on the side, away from the vehicle-mounted refrigerator, of the refrigerator partition plate, a liquid cooling plate evaporator is arranged on the side, away from the refrigerator partition plate, of the semiconductor TEC, and a refrigerant flow guide assembly connected with a whole vehicle air conditioner compressor system is connected into the liquid cooling plate evaporator. A cold conduction block is arranged on the side, close to and away from the refrigerator partition plate, of the semiconductor TEC and connected with an ice making box assembly on the side, located in the vehicle-mounted refrigerator, of the refrigerator partition plate. The invention has the advantages that the dual refrigeration design of the whole vehicle air conditioner compressor system and the semiconductor TEC can realize the deep refrigeration capability, the cold surface temperature of the semiconductor TEC can be controlled at-40 DEG C, and the ice-making capability of the semiconductor TEC is ensured; the heat transfer area can be increased through the freezing sword in various forms, and the ice making efficiency is improved.
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