Temperature and pressure integrated sensor

Abstract

The invention discloses a temperature and pressure integrated sensor, and the sensor comprises a temperature sensing module which comprises a sheath and a temperature sensing element, and the sheath wraps the temperature sensing element; the pressure sensing module comprises a pressure sensitive chip and is used for sensing a pressure signal; the adapter is arranged between the temperature sensing module and the pressure sensing module, a convex column is arranged on the side, close to the temperature sensing module, of the adapter, the convex column comprises a first part and a second part which are arranged in the axial direction, and a groove is formed between the first part and the second part; the first sealing ring is arranged between the groove and the sheath in a sleeving manner; the first part is provided with a buckle, the top end of the sheath is provided with a clamping groove, and the sheath is clamped with the buckle through the clamping groove. The first part is provided with the buckle, the top end of the sheath is provided with the clamping groove, rapid and reliable connection between the temperature sensing module and the adapter is achieved through cooperation of the buckle and the clamping groove, and the overall structural stability of the temperature and pressure integrated sensor is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sensors, in particular to a temperature and pressure integrated sensor. BACKGROUND

[0002] With the rapid development of automobile intelligence, electrification and energy storage systems, higher requirements are put forward for the accurate and reliable monitoring of key state parameters. The temperature and pressure integrated sensor, as an integrated device capable of synchronous measurement of temperature and pressure, has been widely used in vehicle thermal management systems (such as air conditioning, battery cooling) and energy storage equipment due to its advantages in space occupation, system integration and cost control.

[0003] In the structure of the temperature and pressure integrated sensor, the temperature sensing module needs to be reliably mechanically connected and electrically interconnected with the pressure sensing module. Among them, the installation and sealing of the temperature sensing module are the key to ensure the long-term stable operation of the sensor. The traditional connection method mainly relies on threaded fastening, gluing or interference fit. Although threaded connection is firm, it requires special tools and torque control during assembly, which is low in efficiency and has the risk of loosening in high-frequency vibration environment; gluing or interference fit has high requirements for part processing precision, and once the assembly is completed, it is difficult to disassemble and maintain, which is not conducive to product maintenance and recycling. SUMMARY

[0004] Therefore, the present application provides a temperature and pressure integrated sensor, aiming to solve the technical problems of low assembly efficiency and insufficient vibration resistance of the connection structure in the prior art.

[0005] The technical scheme provided by the present application is as follows: A temperature and pressure integrated sensor, comprising: a temperature sensing module, the temperature sensing module comprising a sheath and a temperature sensing element, the sheath covering the temperature sensing element 200; a pressure sensing module, the pressure sensing module comprising a pressure sensitive chip for sensing a pressure signal; an adapter, the adapter being arranged between the temperature sensing module and the pressure sensing module, the adapter being provided with a protruding column on the side close to the temperature sensing module, the protruding column comprising a first part and a second part arranged along the axial direction, and a groove being arranged between the first part and the second part; a first sealing ring, the first sealing ring being sleeved between the groove and the sheath; the first part being provided with a buckle, the top end of the sheath being provided with a clamping groove, and the sheath being clamped with the buckle through the clamping groove.

[0006] Furthermore, the sheath comprises a first-level sheath and a second-level sheath, wherein the first-level sheath is filled with thermally conductive adhesive and the second-level sheath is filled with potting compound.

[0007] Furthermore, the sheath is made of metal, the first-level sheath is thin and coated, and the second-level sheath is thick and uncoated.

[0008] Furthermore, the integrated temperature and pressure sensor also includes: a housing; The pressure sensing module is located inside the housing.

[0009] Furthermore, the integrated temperature and pressure sensor also includes: a connector; The connector is located on the side of the pressure sensing module away from the housing and is fixedly connected to the housing.

[0010] Furthermore, a flexible circuit board is provided between the pressure sensing module and the connector, and the flexible circuit board is electrically connected to the pressure sensing module.

[0011] Furthermore, the flexible circuit board is bent into a U-shape, with one end electrically connected to the temperature sensing module and the other end electrically connected to the pressure sensing module.

[0012] Furthermore, the integrated temperature and pressure sensor also includes: a second sealing ring; The second sealing ring is sandwiched between the pressure sensing module and the connector.

[0013] The integrated temperature and pressure sensor provided in this application achieves a quick and reliable connection between the temperature sensing module and the adapter by setting a buckle at the first part of the protrusion and a slot at the top of the sheath. The assembly process is simple and provides clear feedback (e.g., a "click"), ensuring assembly consistency. The mechanical locking of the buckle and slot prevents axial loosening of the integrated temperature and pressure sensor under vibration or impact, improving the overall structural stability of the sensor. By appropriately increasing the thickness of the second-stage sheath to enhance its strength, a good snap-fit ​​between the slot and buckle can be achieved. Simultaneously, the thickness of the first-stage sheath is appropriately reduced to address the decrease in heat conduction efficiency caused by increased sheath thickness, thus balancing both snap-fit ​​performance and heat conduction efficiency.

[0014] By setting a first sealing ring between the protrusion and the sheath, a good seal can be provided between the adapter and the sheath, preventing external fluids from entering the temperature and pressure sensor and causing contamination. In addition, the first sealing ring is made of corrosion-resistant and high-temperature-resistant material, which can better adapt to harsh environments and further improve the reliability and lifespan of the temperature and pressure sensor. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a cross-sectional schematic diagram of the integrated temperature and pressure sensor provided in an embodiment of this application.

[0017] Explanation of reference numerals in the attached figures: 100-First sealing ring; 200-Temperature sensing element; 300-Pressure sensing module; 400-Adapter; 401-Protrusion; 4011-First part; 4012-Second part; 500-Housing; 600-Plug-in part. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Generally, the components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0020] In the description of this application, the terms "inner", "outer", "upper", "lower", "vertical", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0021] It should be noted that, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

[0022] Please see Figure 1, Figure 1 This is a cross-sectional schematic diagram of the integrated temperature and pressure sensor provided in an embodiment of this application. The integrated temperature and pressure sensor includes: a temperature sensing module, a pressure sensing module 300, an adapter 400, and a first sealing ring 100.

[0023] The temperature sensing module includes a sheath and a temperature sensing element 200, with the sheath covering the temperature sensing element 200. The sheath comprises a first-stage sheath and a second-stage sheath connected sequentially along the axial direction. The top shape of the first-stage sheath matches the shape of the temperature sensing element 200, and the first-stage sheath covers the temperature sensing element 200. The second-stage sheath covers the lead terminals of the temperature sensing element 200. A tapered structure is used between the first-stage and second-stage sheaths to create a smooth transition, reducing stress and preventing the sheath from breaking due to stress. It also prevents moisture, dust, and other contaminants from entering the interior of the sheath and affecting the integrated temperature and pressure sensor. The sheath is made of metal.

[0024] The pressure sensing module 300 includes a pressure-sensitive chip for sensing pressure signals. The pressure-sensitive chip detects the pressure of the fluid and generates a pressure signal, which, after processing, can be transmitted to an external device. The pressure sensing module 300 also includes a signal amplification circuit for amplifying the pressure signal generated by the pressure-sensitive chip. This signal amplification circuit employs a low-noise design, effectively suppressing external electromagnetic interference and ensuring the accuracy and stability of the output signal.

[0025] The adapter 400 is disposed between the temperature sensing module and the pressure sensing module 300. The adapter 400 has a protrusion 401 on the side near the temperature sensing module. The protrusion 401 includes a first part 4011 and a second part 4012 arranged along the axial direction. A groove is provided between the first part 4011 and the second part 4012. The protrusion 401 is cylindrical in shape, with a first part 4011 and a second part 4012 along its axial direction. The first part 4011 and the second part 4012 have the same diameter, and a groove is provided between them. The groove is cylindrical, and its outer diameter is smaller than the diameter of the first part 4011 and the second part 4012. A first sealing ring 100 is fitted between the groove and the sheath. The first sealing ring 100 is an O-ring. The first sealing ring 100 is accommodated in the groove. When the sheath of the temperature sensing module is fitted onto the protrusion 401, the first sealing ring 100 is compressed between the inner wall of the sheath and the groove, forming a radial seal between them. The first sealing ring 100 is made of a high-temperature resistant and corrosion-resistant material, which can maintain good sealing performance under extreme conditions.

[0026] The first part 4011 of the protrusion 401 is provided with a buckle, and the top end of the sheath is provided with a slot. The sheath is engaged with the buckle through the slot. At least one buckle is provided on the outer periphery of the first part 4011 of the protrusion 401. The buckle includes an elastic arm extending from the outer peripheral wall of the first part 4011 and a hook at the end of the elastic arm. The top end of the sheath is provided with a slot that matches the hook. During assembly, the sheath is axially fitted onto the protrusion 401. When the sheath is pressed to a preset position, the hook is engaged in the slot under the elastic deformation of the elastic arm, thereby achieving axial locking between the temperature sensing module and the adapter 400.

[0027] In this embodiment, by setting the buckle on the first part 4011 of the protrusion 401 and the slot on the top of the sheath, the cooperation between the two achieves a quick and reliable connection between the temperature sensing module and the adapter 400. Furthermore, the assembly process is simple and provides clear feedback (e.g., a "click"), ensuring assembly consistency. The mechanical locking of the buckle and the slot also prevents the integrated temperature and pressure sensor from axially loosening under vibration or impact, improving the overall structural stability of the integrated temperature and pressure sensor. By setting the first sealing ring 100 between the protrusion 401 and the sheath, a good seal is provided between the adapter 400 and the sheath, preventing external fluids from entering the integrated temperature and pressure sensor and causing contamination. Moreover, the first sealing ring 100 is made of corrosion-resistant and high-temperature-resistant material, making it more adaptable to harsh environments and further improving the reliability and lifespan of the integrated temperature and pressure sensor.

[0028] The sheath includes a first-level sheath and a second-level sheath, and may also include a third-level sheath. If the sheath is a two-level structure, the slot is provided on the second-level sheath; if the sheath is a three-level structure, the slot is provided on the third-level sheath.

[0029] To achieve a better snap-fit ​​fit, the sleeve of the slot needs to have appropriate strength. In this invention, the sleeve is preferably made of stainless steel to improve its strength, and appropriately increasing the thickness of the sleeve can achieve a better snap-fit ​​fit. The specific thickness of the sleeve is not limited in this application, as long as a good snap-fit ​​fixing effect can be achieved.

[0030] Increasing the thickness of the stainless steel sheath leads to a decrease in the thermal response speed of the device. Preferably, the thickness of the first-stage sheath is less than that of the second-stage sheath, which can improve the snap-fit ​​effect without affecting heat conduction. Furthermore, the outer wall of the first-stage sheath is provided with a metal plating layer selected from a high thermal conductivity metal. The interior of the first-stage sheath is filled with thermally conductive adhesive. The metal plating layer, the first-stage sheath, and the thermally conductive adhesive work together to improve the thermal response speed of the integrated temperature and pressure sensor, and the metal plating layer also provides corrosion-resistant protection for the first-stage sheath. The outer wall of the second-stage sheath does not have this metal plating layer and its thickness is greater than that of the first-stage sheath to achieve a better snap-fit. The interior of the second-stage sheath is filled with potting compound, which has good insulation and sealing properties, effectively protecting the lead terminals of the temperature sensing element 200 from external environmental interference, while also enhancing the overall strength of the sheath. Furthermore, the potting compound possesses a certain degree of toughness, which can alleviate stress concentration and prevent the sheath from cracking or deforming when the integrated temperature and pressure sensor is subjected to external impact or drastic temperature changes. During preparation, thermally conductive adhesive is first injected into the interior of the first-stage sheath and cured, and then potting compound is injected from the tail end of the second-stage sheath. This step-by-step operation prevents the two adhesives from interfering with each other, and the potting compound can naturally fill from the bottom of the second-stage sheath, effectively expelling air and forming a dense sealing layer.

[0031] In one embodiment, the integrated temperature and pressure sensor further includes a housing 500, in which the pressure sensing module 300 is disposed within a cavity formed inside the housing 500. The housing 500 is made of metal, and a sensor port is defined at the bottom of the housing 500, which can receive fluid. A sealing ring is also provided between the housing 500 and the sheath to achieve radial sealing between them. The inner wall of the housing 500 is also provided with reinforcing ribs to enhance the overall strength and deformation resistance of the housing 500. The reinforcing ribs are evenly distributed along the inner wall of the housing 500, which can not only effectively disperse external impact forces, but also reduce the amount of material used in the housing 500 to a certain extent, thereby reducing the overall weight. The housing 500 is also provided with a heat sink structure, which can effectively dissipate the heat generated by the internal components and ensure the stability of the integrated temperature and pressure sensor under long-term operation.

[0032] In this embodiment, the housing 500 provides basic structural and environmental protection for the internal pressure sensing module 300 and other electronic components, protecting them from external impacts, dust, moisture and other contaminants, thus creating a stable and reliable working environment for the integrated temperature and pressure sensor.

[0033] In one embodiment, the integrated temperature and pressure sensor further includes a connector 600, which is disposed on the side of the pressure sensing module 300 away from the housing 500 and is fixedly connected to the housing 500 by means of threads, snaps, or welding. The connector 600 has multiple conductive terminals embedded inside, which are electrically connected to the temperature sensing module and the pressure sensing module 300 via internal wires. The connector 600 is made of high-temperature and corrosion-resistant materials to ensure long-term stability and reliability in harsh environments. The outer surface of the connector 600 also has anti-slip textures for easy installation and disassembly, while improving stability when connected to external devices.

[0034] In one embodiment, a flexible circuit board is further disposed between the pressure sensing module 300 and the connector 600, and the flexible circuit board is electrically connected to the pressure sensing module 300. The flexible circuit board is bent into a U-shape, with one end electrically connected to the temperature sensing module and the other end electrically connected to the pressure sensing module 300. The flexible circuit board has a first end, a second end, and a bent portion connecting the first end and the second end. The first end is electrically connected to the temperature sensing module through a solder pad thereon, and the second end is electrically connected to the pressure sensing module 300 through a solder pad thereon. The bent portion is in a relaxed state, leaving room for deformation. Setting the flexible circuit board into a U-shape not only saves internal space and enhances the tensile strength of the circuit, but also absorbs and releases the differences in material thermal expansion caused by temperature changes, or the small displacements caused by installation and vibration, avoiding fatigue cracking of solder joints that may be caused by rigid connections, and greatly improving the long-term reliability of the integrated temperature and pressure sensor.

[0035] In one embodiment, the integrated temperature and pressure sensor further includes a second sealing ring sandwiched between the pressure sensing module 300 and the connector 600. The second sealing ring is made of a high-temperature and corrosion-resistant elastic material, capable of maintaining excellent sealing performance under high pressure and high temperature environments. Its cross-sectional shape is designed to be circular or elliptical to enhance the fit with the contact surface and provide uniform elastic deformation under pressure. By providing the second sealing ring, fluid leakage from the connection between the pressure sensing module 300 and the connector 600 can be effectively prevented, further improving the overall sealing performance and reliability of the integrated temperature and pressure sensor.

[0036] Finally, it should be noted that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A temperature and pressure integrated sensor, the temperature and pressure integrated sensor comprising: A temperature sensing module, the temperature sensing module comprising a sheath and a temperature sensing element (200), the sheath covering the temperature sensing element (200). A pressure sensing module (300) includes a pressure-sensitive chip for sensing pressure signals; Its characteristic is that it further includes: A connector (400) is disposed between the temperature sensing module and the pressure sensing module (300). The connector (400) has a protrusion (401) on the side near the temperature sensing module. The protrusion (401) includes a first part (4011) and a second part (4012) arranged along the axial direction. A groove is provided between the first part (4011) and the second part (4012). A first sealing ring (100) is fitted between the groove and the sheath; The first part (4011) is provided with a buckle, and the top of the sheath is provided with a slot, and the sheath is engaged with the buckle through the slot.

2. The integrated temperature and pressure sensor according to claim 1, characterized in that, The sheath comprises a first-level sheath and a second-level sheath. The first-level sheath is filled with thermally conductive adhesive, and the second-level sheath is filled with potting compound.

3. The integrated temperature and pressure sensor according to claim 2, characterized in that, The sheath is made of metal. The first-level sheath is thin and coated, while the second-level sheath is thick and uncoated.

4. The integrated temperature and pressure sensor according to claim 1, characterized in that, The integrated temperature and pressure sensor also includes: a housing (500); The pressure sensing module (300) is disposed inside the housing (500).

5. The integrated temperature and pressure sensor according to claim 4, characterized in that, The integrated temperature and pressure sensor also includes: a connector (600). The connector (600) is located on the side of the pressure sensing module (300) away from the housing (500) and is fixedly connected to the housing (500).

6. The integrated temperature and pressure sensor according to claim 5, characterized in that, A flexible circuit board is also provided between the pressure sensing module (300) and the connector (600), and the flexible circuit board is electrically connected to the pressure sensing module (300).

7. The integrated temperature and pressure sensor according to claim 6, characterized in that, The flexible circuit board is bent into a U-shape, with one end electrically connected to the temperature sensing module and the other end electrically connected to the pressure sensing module (300).

8. The integrated temperature and pressure sensor according to claim 7, characterized in that, The integrated temperature and pressure sensor also includes: a second sealing ring; The second sealing ring is sandwiched between the pressure sensing module (300) and the connector (600).

Images