Integrated circuit voice chip detection device and detection method

Abstract

The invention relates to the technical field of chip detection, in particular to an integrated circuit voice chip detection device and a detection method.The integrated circuit voice chip detection device comprises a vertical case and a lifting cover plate and further comprises four sets of flexible surrounding type limiting parts, and each flexible surrounding type limiting part comprises a sealing rotary table capable of turning over by 180 degrees; two boss clamps for preliminarily sleeving the side edges of the square silicon-based chip are symmetrically arranged in the sealing rotary table, and positioning capsules for flexibly clamping the side edges of the square silicon-based chip after being filled are embedded in the boss clamps; the compound detection part is composed of an imaging detection tool and a tracing detection tool. According to the invention, by arranging the flexible surrounding type limiting part under the synergistic effect of the coating tool and the locking tool and configuring the temperature and humidity controller, the optimal environment condition can be accurately created and maintained for different detection modes, the influence of factors such as temperature and humidity fluctuation and dust pollution on the detection precision in open type detection is reduced and even eliminated, and the detection accuracy is improved. Therefore, the credibility of the detection data and the consistency between batches are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip detection, in particular to a kind of integrated circuit voice chip detection device and detection method. BACKGROUND

[0002] As a highly integrated precision device, the structural integrity (such as surface scratch, collapse, penetrating microcrack, etc.) of integrated circuit voice chip directly affects the electroacoustic performance and long-term reliability. It is crucial to detect it efficiently, non-destructively and comprehensively in the manufacturing and packaging links. In the prior art, the defect detection of the chip is mostly in the form of separate equipment and step-by-step operation, which has the problems of low detection efficiency, single mode and insufficient accuracy.

[0003] The prior art such as chip detector disclosed in publication No. CN222014011U adopts rigid clamping, which is easy to cause stress damage or leave indentation on the edge of the chip made of silicon substrate, and even break the chip during detection adjustment.

[0004] For example, the chip appearance detection device, chip and chip appearance detection method disclosed in publication No. CN117110292B use a second optical detector to detect the appearance of the chip at a third position, but can only scan the features on the surface of the chip and form feature images, and the scanning method is single and extensive, and it is impossible to effectively observe the damaged parts hidden inside the chip, resulting in large detection omission error.

[0005] In summary, the existing technology represented by the above-mentioned technology is too rigid in limiting the chip, which is easy to cause clamping damage. At the same time, its detection environment is mostly open or semi-open, which is difficult to control accurately, and factors such as dust, temperature and humidity fluctuation will affect the accuracy of the detection results. SUMMARY

[0006] The purpose of the present application is to solve the problem of non-destructive clamping and fixing and multiple non-destructive detection of the chip in the prior art, and to provide an integrated circuit voice chip detection device and detection method.

[0007] In order to achieve the above-mentioned purpose, the present application adopts the following technical scheme: an integrated circuit voice chip detection device, comprising a vertical cabinet and a lifting cover plate, further comprising: a flexible surrounding limiting part, the number of the flexible surrounding limiting part is four groups, and the flexible surrounding limiting part comprises a sealed rotary table which is turned over by 180°, two convex clamp fixtures symmetrically arranged in the sealed rotary table for preliminarily sleeving the side edges of square silicon substrate chips, and a positioning capsule embedded in the convex clamp fixture for flexibly clamping the side edges of square silicon substrate chips after being filled; A complex detection part composed of an imaging detection tool and a tracking detection tool: The imaging detection tool includes a LED linear light source matrix arranged on the lifting cover plate and perpendicular to the upward end face of the square silicon substrate chip, a pinhole diaphragm and a photodetector, and a wide-angle photosensitive sensor array arranged around the square silicon substrate chip in the upper end of the vertical cabinet, the photodetector and the wide-angle photosensitive sensor array judge whether the surface of the square silicon substrate chip is smooth according to the specular reflection or diffuse reflection of the light beam vertically irradiated to the square silicon substrate chip by the LED linear light source matrix. The tracing detection tool includes an ultraviolet light source, a liquid spraying matrix, a fluorescence spectrometer, a gas supplier and a pressure booster arranged in the vertical cabinet, the liquid spraying matrix sprays a solution containing a fluorescent group of a marker molecule to the upward end face of the square silicon substrate chip, the gas supplier inputs a reactive inert gas to the downward end face of the square silicon substrate chip, and the ultraviolet light source and the fluorescence spectrometer cooperate to dynamically track the fluorescence signal to judge whether the square silicon substrate chip has a penetrating defect.

[0008] Preferably, the vertical cabinet is open at the top end, and the lifting cover plate is used to drive the square silicon substrate chip to ascend and descend in the vertical cabinet.

[0009] Preferably, the sealing turntable is fixedly sleeved with a sealing rubber ring which movably contacts the inner wall of the vertical cabinet.

[0010] Preferably, the end portions of the convex clamp are both 45° inclined cut surfaces, and the convex clamp in the four groups of flexible surrounding limit portions forms a complete square frame which encloses the side edge of the square silicon substrate chip.

[0011] Preferably, the positioning capsule is located inside the convex clamp.

[0012] Preferably, the LED linear light source matrix, the pinhole diaphragm and the photodetector are sequentially arranged from top to bottom.

[0013] Preferably, the liquid spraying matrix is located below the photodetector.

[0014] Preferably, the solution carrier containing a fluorescent group of a marker molecule is ethanol or isopropyl alcohol, and the reactive inert gas is high-purity nitrogen or argon.

[0015] Preferably, the lifting cover plate is provided with a temperature and humidity controller for adjusting the temperature and humidity conditions in the vertical cabinet.

[0016] A detection method based on the above-mentioned integrated circuit voice chip detection device, the detection method comprising the following steps: Step S1, place the square silicon-based chip between the convex clamps of the four sets of flexible surrounding limiting parts, control the two corresponding convex clamps to close towards each other to preliminarily sleeve the square silicon-based chip, and simultaneously fill the positioning capsule with gas to swell to achieve flexible clamping of the square silicon-based chip, and make the square silicon-based chip move downward to a predetermined position in the vertical machine box by folding the vertical machine box and the lifting cover plate; Step S2, adjust the temperature of the vertical machine box 1 to 23±5°C by the temperature and humidity controller, control the LED linear light source matrix to vertically irradiate the upward one end face of the square silicon-based chip, and use the photodetector and the wide-angle photosensitive sensor array to read the light beams emitted from the square silicon-based chip, if the specular reflection is strong or the diffuse reflection is weak, it indicates that the upward one end face of the square silicon-based chip is smooth and undamaged, otherwise, it indicates that the upward one end face of the square silicon-based chip is uneven and damaged. Step S3, adjust the temperature of the vertical machine box to 25±0.5°C and the relative humidity to <10%RH by the temperature and humidity controller, control the liquid spraying matrix to spray the solution containing fluorescent group labeled molecules to the upward one end face of the square silicon-based chip, control the gas supplier to input the reactive inert gas to the downward one end face of the square silicon-based chip, and use the ultraviolet light source and the fluorescence spectrometer to cooperate to dynamically track the fluorescence signal, if the fluorescence image does not change, it indicates that the reactive inert gas cannot reach the upward one end face of the square silicon-based chip, that is, there is no penetrating damage, otherwise, it indicates that the reactive inert gas reaches the upward one end face of the square silicon-based chip, that is, there is penetrating damage. Step S4, separate the lifting cover plate from the vertical machine box to take out the square silicon-based chip, clean the vertical machine box and the square silicon-based chip, put the square silicon-based chip into the cleaned vertical machine box again, control the sealing turntable to drive the square silicon-based chip to turn over 180°, and perform steps S2 and S3.

[0017] Compared with the prior art, the present application has the following advantages: 1, the present application sets up the flexible surrounding limiting part cooperated by the cladding tool and the locking tool, preliminarily mechanically limits by the convex clamps, and further fills and swells the positioning capsule by pneumatic drive, to form comprehensive, uniform and flexible clamping of the side edge of the square silicon-based chip; combined with the sealing turntable which can be turned over 180°, the square silicon-based chip can complete the double detection of one side after one-time clamping; through simple turning over and cleaning steps, the double detection can be efficiently completed without complex secondary positioning and clamping.

[0018] 2, the present application uses the LED linear light source matrix to vertically irradiate, receives the specular reflection and diffuse reflection light signals through the coaxial photodetector and the circumferential wide-angle photosensitive sensor array, which can quickly and non-contactly judge the surface smoothness and macroscopic concave-convex defects.

[0019] 3. The present application can detect the microcosmic penetrating cracks which cannot be seen by naked eyes with high sensitivity by spraying fluorescent labeling solution and reactive inert gas on both sides of the chip through the liquid spray matrix and the gas supplier, and tracking the fluorescence change dynamically by using the ultraviolet light source and the fluorescence spectrometer.

[0020] 4. The present application can create and maintain the optimal environmental conditions for different detection modes accurately by setting the combined vertical case and lifting cover plate, integrating the detection action in the sealable vertical case, and configuring the temperature and humidity controller, thereby reducing or even eliminating the influence of temperature and humidity fluctuations, dust pollution and other factors in open detection on the detection accuracy, and improving the reliability of detection data and the consistency between batches. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 A structural schematic diagram of an integrated circuit voice chip detection device is provided for the present application. Figure 2 A bottom view of an integrated circuit voice chip detection device is provided for the present application. Figure 3 A front cross-sectional view of an integrated circuit voice chip detection device is provided for the present application. Figure 4 A side cross-sectional view of an integrated circuit voice chip detection device is provided for the present application. Figure 5 A structural schematic diagram of a flexible surrounding limiting part of an integrated circuit voice chip detection device is provided for the present application. Figure 6 A structural schematic diagram of a clamping tool of an integrated circuit voice chip detection device is provided for the present application. Figure 7 A bottom view of a clamping tool of an integrated circuit voice chip detection device is provided for the present application. Figure 8 A side cross-sectional view of a clamping tool of an integrated circuit voice chip detection device is provided for the present application. Figure 9 A top cross-sectional view of a clamping tool of an integrated circuit voice chip detection device is provided for the present application. Figure 10 A structural schematic diagram of a complex detection part of an integrated circuit voice chip detection device is provided for the present application. Figure 11 A bottom view of a complex detection part of an integrated circuit voice chip detection device is provided for the present application. Figure 12 A structural schematic diagram of a square silicon-based chip is provided for the present application.

[0022] In the figure: 1, vertical machine case; 2, lifting cover plate; 3, flexible surrounding limiting part; 31, lifting frame; 32, sealing rotary table; 33, cladding tool; 331, double-end screw rod; 332, lifting nut; 333, U-shaped traction frame; 334, steering swing lever; 335, boss clamp; 34, locking tool; 341, mountain-shaped piston cavity; 342, driving piston piece; 343, driven horizontal plate; 344, limiting groove; 345, corrugated hose; 346, positioning capsule; 4, complex detection part; 41, imaging detection tool; 411, first guide groove; 412, first moving frame; 413, LED linear light source matrix; 414, pinhole diaphragm; 415, photoelectric detector; 416, light shield; 417, wide-angle photosensitive sensor array; 42, tracking detection tool; 421, second guide groove; 422, second moving frame; 423, liquid spraying matrix; 424, gas supplier; 425, pressure booster; 426, central steering frame; 427, ultraviolet light source; 428, fluorescence spectrometer; 43, temperature and humidity controller. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0024] REFERENCE Figures 1-12 The integrated circuit voice chip detection device comprises a vertical machine case 1 and a lifting cover plate 2, and further comprises a flexible surrounding limiting part 3 and a complex detection part 4. The flexible surrounding limiting part 3 is four groups, Figures 3-5 Two groups are symmetrically distributed, and the flexible surrounding limiting part 3 comprises a lifting frame 31, a sealing rotary table 32, a cladding tool 33 and a locking tool 34. The lifting frame 31 is fixedly connected to the lifting cover plate 2, a vertical slot for slidingly sleeving the lifting frame 31 is formed in the side wall of the vertical machine case 1, and the two are adapted to ensure the sealing property of the vertical machine case 1 and the lifting cover plate 2 in the folded state. Preferably, a magnetic fluid sealing ring or a specially designed lip-shaped sealing ring is arranged between the lifting frame 31 and the vertical slot, so as to ensure the sealing property of the vertical machine case 1 during detection while ensuring the freedom degree of movement.

[0025] The sealing turntable 32 is rotatably installed at the lower end of the lifting frame 31, and the sealing turntable 32 can be flipped by 180°. A driving motor for driving the sealing turntable 32 to rotate is arranged in the lifting frame 31, so as to control the square silicon-based chip on the lifting frame 31 to be flipped by 180°. It should be noted that the driving motor is connected with the sealing turntable 32 through an anti-backlash reduction mechanism, and physical limit or origin sensors are arranged at 0° and 180° positions, so as to ensure the accuracy of the flipping angle and avoid the accumulated error affecting the alignment accuracy of two-face detection. It should be noted that the square silicon-based chip can be flipped in the front-back direction or in the left-right direction.

[0026] The cladding tool 33 is used to cladding the square silicon-based chip from the vertical direction, and the cladding tool 33 includes a double-end screw 331, a lifting nut 332, an H-shaped traction frame 333, a steering swing lever 334, and a boss clamp 335. The double-end screw 331 is rotatably installed in the sealing turntable 32. A servo motor is arranged in the sealing turntable 32, and a gear set is arranged between the output end of the servo motor and the double-end screw 331. The gear set needs to have the characteristics of small gap and high rigidity, so as to ensure the accurate correspondence between the rotation angle and the final displacement of the clamp, and avoid the return error affecting the cladding repeatability, so as to realize the precise driving of the double-end screw 331.

[0027] The lifting nut 332 is in number of two, and the two lifting nuts 332 are adaptively installed at the upper and lower ends of the double-end screw 331. It should be noted that the lifting nut 332 is integrally connected with a guide rod slidingly installed on the sealing turntable 32, so that the lifting nut 332 only moves linearly with the double-end screw 331, and the lifting nut 332 is forced to move linearly, so as to eliminate any torsion possibility and ensure the purity of the movement track.

[0028] The H-shaped traction frame 333 is fixedly cladded on the lifting nut 332, and the H-shaped traction frame 333 is integrally connected with traction yokes at two ends. The steering swing lever 334 is rotatably installed on the sealing turntable 32, and a reset torsion spring is fixedly arranged on the steering swing lever 334 on the sealing turntable 32. A traction notch for movably cladding the traction yoke is arranged at one end of the steering swing lever 334. The rotary motion is converted into linear motion on both sides through the lifting nut 332 and the H-shaped traction frame 333. The linear motion is transmitted to the steering swing lever 334 through the traction yoke and the traction notch, and is amplified as the closing action of the boss clamp 335 by using the lever principle. The reset torsion spring ensures the reset when the boss clamp 335 is opened, and the reset torsion spring provides reliable opening force when the driving is reversed.

[0029] It is worth mentioning that the cooperation of the traction yoke and the traction notch is a kind of low-friction and high-precision pair of movements, which converts linear motion into the rotation of the steering swing lever 334, and the steering swing lever 334, as a lever, amplifies the small linear displacement into a larger closing displacement of the end of the boss clamp 335.

[0030] The boss clamp 335 is fixedly installed on the other end of the steering swing lever 334, and the two upper and lower corresponding boss clamps 335 preliminarily wrap the side edges of the square silicon-based chip in the closed state, and the four-point contact wraps the side edges of the square silicon-based chip, which helps to reduce the local pressure. And the end of the boss clamp 335 is a 45° inclined surface, and the boss clamp 335 in the four groups of flexible surrounding limiting parts 3 forms a complete square frame wrapping the side edges of the square silicon-based chip. When the four groups of flexible surrounding limiting parts 3 are closed from four directions, the inclined surface first contacts the side edges of the square silicon-based chip, forming a guide slope, which can automatically correct the slight position deviation of the square silicon-based chip and realize self-centering. After closing, the eight cutting surfaces together form a rigid frame that restricts the eight edges of the square silicon-based chip, limiting all translational degrees of freedom of the square silicon-based chip to provide a stable reference for subsequent detection.

[0031] The locking tool 34 is arranged in the sealing turntable 32 and the boss clamp 335, and the locking tool 34 is driven by the wrapping tool 33, so the locking action is not independently driven, but is triggered by the wrapping tool 33. The locking tool 34 includes a mountain-shaped piston cavity 341, a driving piston 342, a driven horizontal plate 343, a corrugated hose 345, and a positioning capsule 346. The mountain-shaped piston cavity 341 is arranged in the sealing turntable 32, and the medium in the mountain-shaped piston cavity 341 can be gas, and a micro pressure sensor is integrated in the gas circuit to realize closed-loop real-time monitoring and feedback adjustment of the clamping force. Incompressible silicone oil can also be used instead of gas to achieve higher precision pressure control and faster response. The mountain-shaped structure adopts the method of thick in the middle and thin at both ends, which helps to increase the piston action area, so that smaller mechanical displacement can generate sufficient fluid pressure change.

[0032] The driving piston 342 is movably sleeved in the middle end opening of the mountain-shaped piston cavity 341.

[0033] The driven horizontal plate 343 is fixedly connected to the driving piston 342, and the driven horizontal plate 343 is provided with a limiting groove 344 movably sleeved on the steering swing lever 334. The length and shape of the limiting groove 344 are calculated to ensure that it only starts to effectively compress at the end of the wrapping stroke, avoiding interference with the main wrapping action.

[0034] The corrugated hose 345 is fixedly connected to the openings at both ends of the Y-shaped piston cavity 341. The corrugated hose 345 is designed to allow the boss clamp 335 to move within a limited range without interfering with the gas path. It has multi-directional bending capability to adapt to the slight swing of the boss clamp 335 during the cladding process.

[0035] The positioning capsule 346 is fixedly embedded in the inner side of the boss clamp 335, and the positioning capsule 346 is fixedly communicated with the corrugated hose 345. The positioning capsule 346 is flexible after being filled, and clamps the side of the square silicon-based chip. The positioning capsule 346 is made of high-elasticity and low-permeability silicon-based or polyurethane film. After expansion, it uniformly wraps and adheres to the side of the square silicon-based chip like an air bag. The boss clamp 335 is a clamp frame that provides rigidity on the outside, and the positioning capsule 346 is an inflatable capsule that provides flexible contact on the inside. In some embodiments, by setting an integrated micro pressure sensor in the gas path closest to the positioning capsule 346, the internal pressure is monitored in real time. According to the sensor feedback, the control system dynamically adjusts the torque or stroke of the servo motor, thereby accurately controlling the final position of the driving piston 342 and stabilizing the clamping pressure within the preset 5-15kPa safety window. If silicon oil medium is used, the pressure control is more accurate.

[0036] The compound detection part 4 is composed of an imaging detection tool 41, a tracer detection tool 42, and a temperature and humidity controller 43. The moving frames (first moving frame 412 and second moving frame 422) of the imaging detection tool 41 and the tracer detection tool 42 are independently controllable, and can alternately enter the working position according to the detection process without interfering with each other: The imaging detection tool 41 includes a first guide groove 411, a first moving frame 412, an LED linear light source matrix 413, a pinhole diaphragm 414, a photodetector 415, a light shield 416, and a wide-angle photosensitive sensor array 417: The first guide groove 411 is provided in the lifting cover plate 2, and the first moving frame 412 scans uniformly to obtain the DI distribution map of the entire chip surface. By setting the DI threshold value, defects such as scratches (represented by continuous DI low value lines) and pits (represented by isolated DI low value points) can be automatically identified, and the depth / severity of the defects can be preliminarily estimated through the spatial distribution model of the I diffuse , I specular , I diffuse signal and height measurement reference.

[0037] The first moving frame 412 is slidably installed on the lifting cover plate 2 through the first guide groove 411.

[0038] LED linear light source matrix 413 is fixedly installed at the upper end of first moving frame 412, and provides a linear light beam with high collimation and high uniformity. Preferably, the wavelength is outside the visible light range, i.e. 850 nm near-infrared LED, because silicon has specific reflection characteristics in this waveband, and can reduce environmental stray light interference.

[0039] Pinhole diaphragm 414 is fixedly installed at the middle end of first moving frame 412, and photodetector 415 is fixedly installed at the lower end of first moving frame 412. Pinhole diaphragm 414 and photodetector 415 are strictly coaxially arranged with the optical axis of the light source. Pinhole diaphragm 414 functions as a spatial filter, allowing only the specularly reflected light that strictly returns along the original path (i.e. the incident angle = the reflection angle ≈ 0°) to pass, and greatly suppressing the diffuse reflection light from other parts of the surface. The signal intensity I specular of this channel is directly proportional to the specular reflectivity (i.e. smoothness) of the surface.

[0040] Shading plate 416 is fixedly connected to lifting cover plate 2, and shading plate 416 is used to reduce the influence of external wall light on vertical cabinet 1.

[0041] Wide-angle photosensitive sensor array 417 is fixedly arranged on shading plate 416, and wide-angle photosensitive sensor array 417 is installed on shading plate 416 and distributed around the measured surface of the square silicon substrate. Shading plate 416 is used to block the light directly from the light source. Any surface roughness, scratches, and depressions will scatter the incident light in all directions, which is captured by the array. The integrated signal intensity I diffuse reflects the overall roughness and defect density of the surface.

[0042] Photodetector 415 and wide-angle photosensitive sensor array 417 judge whether the surface of square silicon substrate is smooth according to the specular reflection or diffuse reflection of the light beam vertically irradiated to the square silicon substrate by LED linear light source matrix 413. In some embodiments, the system does not simply compare the absolute values of I specular and I diffuse , but establishes a differential signal index DI=(I specular━ k·I diffuse ) / (I specular+ k·I diffuse ), where k is a calibration coefficient. For an ideal smooth surface, DI≈1; as the roughness or defects increase, DI tends to 0 or even negative.

[0043] Signal synchronous acquisition of imaging detection tooling 41 is realized by the following method: The system achieves signal synchronization through hardware triggering: every time the mobile frame moves a fixed distance (or the encoder sends a pulse), the light source flashes and all sensors take a synchronized reading, ensuring that each data point corresponds to a location on the silicon-on- insulator chip, generating a spatially encoded DI distribution map.

[0044] The trace detection tool 42 includes a second guide groove 421, a second mobile frame 422, a liquid injection matrix 423, a gas supplier 424, a pressure booster 425, a central bogie 426, an ultraviolet light source 427, and a fluorescence spectrometer 428. The second guide groove 421 is formed in the lifting cover plate 2.

[0045] The second mobile frame 422 is slidably installed on the lifting cover plate 2 through the second guide groove 421. Because the fluorescence intensity of fluorescein isothiocyanate is extremely sensitive to the pH value of its environment. In weakly acidic or neutral environment, the fluorescence is strong, and in alkaline environment, fluorescence quenching occurs. When there is a through defect in the silicon-on-insulator chip, anhydrous ammonia gas reaches the back of the silicon-on-insulator chip through the defect, locally changing the pH of the microenvironment of the aminosilane-fluorescein isothiocyanate molecule to alkaline, causing the fluorescence intensity of the region to dynamically decay. The fluorescence spectrometer 428 tracks the rate or amplitude of the decay of the fluorescence intensity at a specific wavelength (such as 518 nm) over time.

[0046] The liquid injection matrix 423 is fixedly installed on the second mobile frame 422, and the liquid injection matrix 423 is located below the photodetector 415. In some embodiments, the solution injected by the liquid injection matrix 423 is an ethanol solution of aminosilane labeled with fluorescein isothiocyanate. After the ethanol evaporates, the silanol groups on the aminosilane hydrolyze and condense with the hydroxyl groups on the silicon dioxide surface of the silicon-on-insulator chip, forming a covalent bond and anchoring the fluorescein isothiocyanate fluorescent molecules firmly and monolayerly on the surface of the silicon-on-insulator chip. In some embodiments, the liquid injection matrix 423 is usually controlled by a piezoelectric or solenoid electromagnetic valve. The driving signal needs to ensure the repeatability of the droplet volume and the injection trajectory. After injection, a micro heater can be controlled to locally blow the silicon-on-insulator chip at low temperature, accelerating the evaporation of ethanol / isopropanol and shortening the process cycle. It is worth noting that the liquid injection may generate aerosol, and ventilation may bring in particles, so a reasonable negative pressure exhaust or gas circulation purification circuit needs to be designed in the vertical cabinet 1 to quickly clean the cavity in the detection gap and prevent cross contamination.

[0047] The gas supplier 424 is fixedly installed outside the vertical cabinet 1, and a hard tube for inputting reactive inert gas into the lower end of the vertical cabinet 1 is fixedly connected to the gas supplier 424. The gas supplied by the gas supplier 424 is high-purity nitrogen gas containing a small amount of anhydrous ammonia gas. Anhydrous ammonia gas is an alkaline gas, and the gas supplier 424 precisely controls the flow rate of the reactive inert gas by a mass flow controller.

[0048] The booster 425 is fixedly connected to a hard pipe. The booster 425 is usually a back pressure regulating valve or a precision proportional valve, and forms a closed loop with the pressure sensor in the lower cavity of the vertical machine box 1 to dynamically regulate the outlet pressure and maintain a constant pressure of 0.5 bar, regardless of whether there is gas leakage through the cracks.

[0049] The central bogie 426 is rotatably installed on the lifting cover plate 2. A micro motor is arranged on the lifting cover plate 2 to drive the circumferential rotation of the central bogie 426, so that the ultraviolet light source 427 can be flexibly adjusted corresponding to the square silicon-based chip, and the purpose is to optimize the excitation light path.

[0050] The ultraviolet light source 427 is fixedly installed on the central bogie 426. Under the driving action of the central bogie 426, the ultraviolet light source 427 can realize multi-angle irradiation to excite fluorescent signals in different directions. The on-off and intensity of the ultraviolet light source 427 are controlled by a special driver.

[0051] The fluorescence spectrometer 428 is fixedly installed on the lifting cover plate 2. It needs to be explained that the ultraviolet light source 427 and the fluorescence spectrometer 428 perform time sequence acquisition. By analyzing the fluorescence quenching kinetics curve, the true through defect signal and the possible non-specific fluorescence bleaching or background noise can be effectively distinguished, so as to improve the signal-to-noise ratio and detection reliability. The time sequence acquisition of the fluorescence spectrometer 428 is a key driving mode. The photomultiplier tube or CCD detector inside the fluorescence spectrometer 428 continuously reads according to the preset sampling frequency, generates a fluorescence intensity-time kinetics curve, and is used for subsequent analysis.

[0052] The liquid injection matrix 423 injects a solution containing fluorescent group labeled molecules to the upper end face of the square silicon-based chip. The gas supplier 424 inputs a reactive inert gas to the lower end face of the square silicon-based chip. The ultraviolet light source 427 and the fluorescence spectrometer 428 cooperate to dynamically track the fluorescence signal to determine whether the square silicon-based chip has a through defect. The booster 425 maintains the gas pressure at 0.5 bar, which not only ensures the penetration driving force of the gas to the micro cracks, but also avoids damage to the square silicon-based chip due to excessive pressure. The temperature and humidity controller 43 stabilizes the environmental temperature at 25±0.1°C and the humidity at <5% RH, which is a key to ensure complete amino silane coupling reaction, constant waterless ammonia gas diffusion rate, and repeatable fluorescence reaction.

[0053] In some embodiments, a fluorescence enhancement system can also be used. For example, a dye that can be chelated with metal ions and produce fluorescence is injected, and a small amount of volatile metal organic matter is doped in the inert gas. After the gas passes through the cracks, the metal organic matter decomposes and reacts with the dye to produce a fluorescent bright spot at the defect.

[0054] It should be noted that the uniform linear motion of the first moving frame 412 and the second moving frame 422 is driven by a linear motor or a servo motor + precision ball screw, and the driving system needs to ensure smooth speed and small start-stop jitter to avoid affecting the stability of optical measurement.

[0055] To verify the comprehensive performance of the flexible surrounding limiting part 3 and the complex detection part 4, the following comparative test is designed: Control group A: using the mainstream equipment combination in the market - six-axis mechanical arm (rigid clamp) clamping + high-resolution industrial camera for surface visual detection + independent gas permeation leak detector (helium mass spectrometry leak detection, requiring a special sealed tank).

[0056] Control group B: using vacuum chuck adsorption + laser confocal microscope for surface three-dimensional morphology detection + scanning acoustic microscope for internal defect detection.

[0057] Experimental group: flexible surrounding limiting part 3 and complex detection part 4.

[0058] Test sample: Prepare 300 standard test chips (square silicon base, 5mm x 5mm) with known defect types and locations, of which: 100 contain artificial pre-surface scratches (depth 1-5μm), 100 contain artificial pre-penetrating microcracks (width 0.5-5μm), and 100 are good products.

[0059] Evaluation index Control group A Control group B Experimental group Clamping damage rate 3% (9 pieces) edge visible indentation or new microcracks 1% (3 pieces) due to vacuum adsorption caused by backside pollution or local stress image 0% (0 pieces) Single-sided detection total time consumption ~65 seconds (clamping 10s + vision 20s + transfer and loading into leak detection tank 35s) ~180 seconds (clamping 5s + confocal scanning 120s + transfer and SAM scanning 55s) ~55 seconds (clamping / sealing 15s + optical scanning 15s + environment switching 5s + tracer detection 20s) Surface scratch detection rate 95% (easy to miss for scratches shallower than 2 μm) >99.5% (quantitative depth) 98% (semi-quantitative evaluation) Through microcrack detection rate 98% (only for >1 μm wide cracks, expensive equipment) 90% (sensitive to vertical cracks, not sensitive to delamination parallel to the surface) >99% (stable detection for cracks above 0.5 μm) Detection environment dependence High (vision affected by light, leak detection affected by sealing) High (both confocal and SAM require stable environment, sensitive to vibration) Low (closed cavity actively controls temperature and humidity, strong resistance to external interference) From the aspect of clamping damage rate, the flexible surrounding limiting part 3 uniformly applies pressure through the air bag, fundamentally eliminating mechanical contact damage and adsorption pollution, and achieving non-destructive clamping; From the aspect of total time of single-side detection, through detection process integration and automation process, the sample transfer, alignment and re-clamping time between different equipment are avoided, the efficiency is significantly improved, and the gas tracer detection speed is faster than SAM scanning; From the aspect of surface scratch detection rate, the laser confocal precision is the highest. The optical differential method is close to confocal in detection rate and is one order of magnitude faster, meeting the precision and speed balance requirements of industrial online detection; From the aspect of penetrating microcrack detection rate, the gas-liquid reaction tracer method is sensitive to the "passing" of the crack rather than the "orientation", and the dynamic fluorescence tracking provides very high signal-to-noise ratio, and the comprehensive performance in detection sensitivity and stability is the best; From the aspect of detection environment dependence, the integrated sealed design ensures the environmental robustness of the detection process, and the data consistency is the best, which is more suitable for high-specification clean rooms or laboratory applications outside.

[0060] It can be seen that: on the single index (such as non-destructive clamping, high sensitivity of cracks), the performance is outstanding, and more importantly, in the comprehensive performance - that is, the balance of non-destructive, high efficiency, high precision, high stability and high environmental adaptability - significantly surpasses the existing discrete equipment combination scheme. Through the innovative mechanical-pneumatic composite clamping design of the flexible surrounding limiting part 3, experiments show that this design effectively solves the basic damage problem in the detection of square silicon-based chips.

[0061] The vertical machine case 1 is opened at the top end, and the lifting cover plate 2 is used to drive the square silicon-based chip to ascend and descend in the vertical machine case 1.

[0062] The sealing rubber ring is fixedly sleeved on the sealing turntable 32 and abuts against the inner wall of the vertical machine case 1.

[0063] The positioning capsule 346 is located inside the convex clamp 335, and in the process of controlling the closure of the upper and lower convex clamps 335, the positioning capsule 346 is driven to expand synchronously to flexibly clamp the side edge of the square silicon-based chip.

[0064] The LED linear light source matrix 413, the pinhole diaphragm 414 and the photodetector 415 are sequentially distributed from top to bottom, and the LED linear light source matrix 413, the pinhole diaphragm 414 and the photodetector 415 are all perpendicular to the upward end face of the square silicon-based chip.

[0065] The solution carrier of the labeled molecule containing a fluorescent group is ethanol or isopropanol, and the reactive inert gas is high-purity nitrogen or argon.

[0066] The temperature and humidity controller 43 is arranged on the lifting cover plate 2 to adjust the temperature and humidity conditions in the vertical machine case 1, and it should be noted that the temperature and humidity controller 43 usually includes a semiconductor temperature control module, an ultrasonic humidifier and a dry air injection system, which actively and quickly switches between the required environmental conditions (normal temperature and humidity and constant temperature and low humidity) in two detection modes according to the feedback of the sensor in the box.

[0067] It should be noted that the specific model specifications of the LED linear light source matrix 413, the photodetector 415, the wide-angle photosensitive sensor array 417, the liquid spraying matrix 423, the gas supplier 424, the pressure booster 425, the ultraviolet light source 427 and the fluorescence spectrometer 428 need to be selected and determined according to the actual specifications of the device, and the specific selection calculation method adopts the existing technology in the art, so it is not described here.

[0068] The function principle of the present application can be described as follows: Firstly, the square silicon chip is placed between the convex clamps 335 of the four sets of flexible surrounding limiting parts 3, the two corresponding convex clamps 335 above and below are controlled to close towards each other to preliminarily fit the square silicon chip, and at the same time, the positioning capsule 346 is filled with gas to expand to achieve flexible clamping of the square silicon chip. By folding the vertical cabinet 1 and the lifting cover plate 2, the square silicon chip is lowered to the predetermined position in the vertical cabinet 1. Specifically, the double-head screw rod 331 is driven to rotate, so that the two lifting nuts 332 at both ends thereof move in opposite directions, driving the two L-shaped traction frames 333 to move synchronously, so as to drive the steering swing rod 334 to deflect like a lever, and at the same time, the reset torsional spring is extruded, until the two convex clamps 335 above and below are closed to cover the side edges of the square silicon chip. At the same time, the steering swing rod 334 presses the driven horizontal plate 343, so that the driven horizontal plate 343 drives the driving piston 342 to shrink into the mountain-shaped piston cavity 341, so that the gas in the mountain-shaped piston cavity 341 moves to the positioning capsule 346 through the corrugated hose 345, and the square silicon chip is further clamped by the inflated positioning capsule 346. The lifting cover plate 2 is vertically installed along the opening direction of the vertical cabinet 1 until the square silicon chip is at the specified position in the vertical cabinet 1, and the vertical cabinet 1 is sealed by the lifting cover plate 2.

[0069] Secondly, the temperature of the vertical cabinet 1 is adjusted to 23±5°C by the temperature and humidity controller 43, the LED linear light source matrix 413 is controlled to vertically irradiate the upward end face of the square silicon chip, and the light beams emitted from the square silicon chip are read by the photodetector 415 and the wide-angle photosensitive sensor array 417. If the specular reflection is strong or the diffuse reflection is weak, it indicates that the upward end face of the square silicon chip is smooth and undamaged, otherwise it indicates that the upward end face of the square silicon chip is uneven and damaged. Specifically, under the condition that the inside of the vertical cabinet 1 is clean, the LED linear light source matrix 413 emits a vertical light beam to the upward end face of the square silicon chip by driving the first moving frame 412 to move at a constant speed along the first guide groove 411, and the signals of the photodetector 415 and the wide-angle photosensitive sensor array 417 are read synchronously, so as to judge whether the upward end face of the square silicon chip is a smooth plane according to the signal difference.

[0070] Third step, through the temperature and humidity controller 43 to adjust the vertical machine case 1 temperature is 25±0.5°C, relative humidity <10%RH, control liquid injection matrix 423 to the square silicon base chip upward one end face injection containing fluorescent group of labeled molecule solution, control gas supplier 424 to the square silicon base chip downward one end face input reactive inert gas, using ultraviolet light source 427 and fluorescence spectrometer 428 cooperate dynamic tracking fluorescence signal, such as fluorescence image no change, it is indicated that reactive inert gas cannot reach the square silicon base chip upward one end face, namely no through damage, otherwise it is indicated that reactive inert gas reaches the square silicon base chip upward one end face, namely there is through damage. Specifically, after injection containing fluorescent group of labeled molecule solution, static or slightly hot makes solvent volatilize, form reagent layer, in the process of input reactive inert gas, using booster 425 to maintain pressure condition is 0.1-1bar, using observation equipment to the chip backside fluorescence carries out real time or delay imaging / spectrum acquisition, to judge whether the square silicon base chip has structural damage.

[0071] Fourth step, from the vertical machine case 1 separates the lifting cover plate 2 and takes out the square silicon base chip, cleans the vertical machine case 1 and the square silicon base chip, re into the clean vertical machine case 1 and put the square silicon base chip, control sealing turntable 32 drive square silicon base chip to turn over 180°, carries out the second step and third step. Specifically, need to ensure the cleanliness of the vertical machine case 1 upper and lower end and the square silicon base chip, so as to detect another part of the square silicon base chip.

[0072] The above, only for the preferred specific embodiments of the present application, but the protection scope of the present application is not limited to this, any skilled in the art of the technical personnel in the technical range disclosed by the present application, according to the technical scheme of the present application and the invention concept of the invention, equivalent replacement or change, should be covered in the protection scope of the present application.

Claims

1. An integrated circuit voice chip testing device, comprising a vertical chassis (1) and a lifting cover plate (2), characterized in that, Also includes: The flexible enclosure limiting part (3) has four sets, and the flexible enclosure limiting part (3) includes a sealing turntable (32) that can be rotated 180°. The sealing turntable (32) has two boss clamps (335) that are initially fitted on the side of the square silicon-based chip. The boss clamps (335) are embedded with positioning capsules (346) that flexibly clamp the side of the square silicon-based chip after being filled. The compound detection unit (4) is composed of an imaging detection fixture (41) and a tracer detection fixture (42). The imaging detection fixture (41) includes an LED linear light source matrix (413), a pinhole aperture (414), and a photodetector (415) disposed on the lifting cover plate (2) and perpendicular to the upward end face of the square silicon chip. A wide-angle photosensitive sensor array (417) distributed around the square silicon chip is disposed inside the upper end of the vertical chassis (1). The photodetector (415) and the wide-angle photosensitive sensor array (417) determine whether the surface of the square silicon chip is smooth by specular reflection or diffuse reflection of the beam of light that is perpendicularly irradiated to the square silicon chip by the LED linear light source matrix (413). The tracer detection fixture (42) includes an ultraviolet light source (427), a spray matrix (423), a fluorescence spectrometer (428) and an air supply unit (424) and a booster unit (425) located in the vertical chassis (1) on the lifting cover plate (2). The spray matrix (423) sprays a labeled molecular solution containing fluorescent groups onto the upper end face of the square silicon chip. The air supply unit (424) inputs reactive inert gas into the lower end face of the square silicon chip. The ultraviolet light source (427) and the fluorescence spectrometer (428) work together to dynamically track the fluorescence signal to determine whether there is a through-hole defect in the square silicon chip.

2. The integrated circuit voice chip detection device according to claim 1, characterized in that, The top of the vertical chassis (1) is open, and the lifting cover (2) is used to move the square silicon-based chip up and down within the vertical chassis (1).

3. The integrated circuit voice chip detection device according to claim 2, characterized in that, The sealing turntable (32) is fixedly fitted with a sealing ring that moves against the inner wall of the vertical chassis (1).

4. The integrated circuit voice chip detection device according to claim 3, characterized in that, The two ends of the boss clamp (335) are both inclined at 45°. The boss clamps (335) in the four sets of flexible enclosure limiting parts (3) form a square frame for the side of the complete set of square silicon-based chip.

5. The integrated circuit voice chip detection device according to claim 4, characterized in that, The positioning capsule (346) is located inside the boss clamp (335).

6. The integrated circuit voice chip detection device according to claim 5, characterized in that, The LED linear light source matrix (413), the pinhole aperture (414), and the photodetector (415) are distributed sequentially from top to bottom.

7. The integrated circuit voice chip detection device according to claim 6, characterized in that, The spray matrix (423) is located below the photodetector (415).

8. The integrated circuit voice chip detection device according to claim 7, characterized in that, The carrier of the labeled molecule solution containing fluorescent groups is ethanol or isopropanol, and the reactive inert gas is high-purity nitrogen or argon.

9. The integrated circuit voice chip detection device according to claim 8, characterized in that, The lifting cover plate (2) is equipped with a temperature and humidity controller (43) for adjusting the temperature and humidity conditions inside the vertical chassis (1).

10. A detection method based on the integrated circuit voice chip detection device according to claim 9, characterized in that, The detection method includes the following steps: Step S1: Place the square silicon chip between the boss clamps (335) of the four sets of flexible enclosure limiting parts (3), control the two corresponding boss clamps (335) to close towards each other to initially fit the square silicon chip, and at the same time fill the positioning capsule (346) with gas until it expands to achieve flexible clamping of the square silicon chip. By closing the vertical chassis (1) and the lifting cover (2), the square silicon chip moves down to the predetermined position in the vertical chassis (1). Step S2: Adjust the temperature of the vertical chassis (1) to 23±5°C using the temperature and humidity controller (43), and control the LED linear light source matrix (413) to vertically irradiate the upward end face of the square silicon chip. Use the photodetector (415) and the wide-angle photosensitive sensor array (417) to read the light beam emitted from the square silicon chip. If the specular reflection is strong or the diffuse reflection is weak, it indicates that the upward end face of the square silicon chip is smooth and undamaged. Otherwise, it indicates that the upward end face of the square silicon chip is uneven and damaged. Step S3: Adjust the temperature of the vertical chassis (1) to 25±0.5°C and the relative humidity to <10%RH using the temperature and humidity controller (43). Control the spray matrix (423) to spray a labeled molecular solution containing fluorescent groups onto the upper end face of the square silicon-based chip. Control the gas supply device (424) to input reactive inert gas into the lower end face of the square silicon-based chip. Use the ultraviolet light source (427) and the fluorescence spectrometer (428) to dynamically track the fluorescence signal. If there is no change in the fluorescence image, it indicates that the reactive inert gas cannot reach the upper end face of the square silicon-based chip and there is no penetrating damage. Conversely, it indicates that the reactive inert gas reaches the upper end face of the square silicon-based chip and there is penetrating damage. Step S4: Separate the lifting cover plate (2) from the vertical chassis (1) and take out the square silicon-based chip. Clean the vertical chassis (1) and the square silicon-based chip. Put the square silicon-based chip back into the cleaned vertical chassis (1). Control the sealing turntable (32) to rotate the square silicon-based chip 180°. Perform steps S2 and S3.

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