Super-large field-of-view tube lens and chip wafer alignment system

Abstract

The invention provides a super-large field-of-view tube lens and a chip wafer alignment system, and relates to the technical field of wafer bonding equipment, the super-large field-of-view tube lens sequentially comprises a first lens, a second lens, a third lens, a fourth lens, a fifth lens and a sixth lens from an emergent side to an object side; wherein the first lens and the second lens are glued to form a group of doublet lens, the third lens and the fourth lens are glued to form a group of doublet lens, and the fifth lens and the sixth lens are glued to form a group of doublet lens. According to the ultra-large-view-field near-infrared tube lens used in the chip and wafer bonding alignment visual system, due to the fact that the ultra-large-view-field near-infrared tube lens has a large view field, two infrared cameras with small target surfaces can be placed, and four mark points of a chip and a wafer can be shot at the same time in cooperation with a large-view-field dispersion microscope objective; therefore, the requirement for mark alignment in the bonding process of the chip and the wafer is met, and high-precision bonding and bonding efficiency of the chip and the wafer are guaranteed.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafer bonding equipment, and particularly relates to a super-large field-of-view barrel lens and a chip wafer alignment system. BACKGROUND

[0002] In a wafer bonding equipment, alignment precision is the most critical factor for ensuring wafer bonding quality, and a vision system plays a decisive role. In the latest high-precision bonding equipment, a near-infrared optical system has been used, and the near-infrared band can penetrate a semiconductor wafer to directly observe a mark point. A main direction of bonding application is wafer-to-wafer bonding (W2W, wafer to wafer bonding), and the wafer-to-wafer bonding can make mark points on the edges of each wafer, and then use two sets of vision systems to bond the mark points on the edges of the wafers. In the bonding process, an infrared system is used to observe mark points on the lower surface of an upper wafer first, then a piezoelectric ceramic driver is used to move the whole optical system downward, so that mark points on the upper surface of a lower wafer are observed, the positions of the mark points on the upper wafer and the lower wafer are recorded, and the position of the lower wafer is adjusted by a high-precision displacement platform to move the mark points on the lower wafer to the positions of the mark points on the upper wafer. In this process, since the infrared system can observe the positions of the mark points, the bonding precision is improved.

[0003] Another important application in bonding is die-to-wafer bonding (D2W, die to wafer bonding), that is, bonding a chip to a wafer. The die-to-wafer bonding usually needs two mark points to be aligned at the same time, that is, two mark points on a wafer are aligned with two mark points on a chip at the same time. Unlike W2W, the volume of the chip is usually very small, and the interval between the mark points that need to be aligned is between several millimeters and tens of millimeters. The distance between the two mark points corresponding to most samples is in the range of 6-11 mm. The existing wafer bonding system commonly uses a microscopic system, that is, a combination of an objective lens and a barrel lens. Since the field of view of the microscopic objective lens is small, the field of view of the corresponding barrel lens is limited, and is usually only about 20 mm. Some specially designed barrel lenses can cooperate with a large target objective lens to achieve a field of view of about 40 mm. In order to achieve a magnification of 10X and a target in the object field of 11 mm or less, even the largest barrel lens cannot meet the requirement of such a large field of view, and therefore the requirement of high magnification observation of adjacent mark points cannot be met. SUMMARY

[0004] In view of this, the embodiment of the present application provides a super large field of view barrel lens and a chip wafer alignment system, which solves the problem of how to align two mark points on a wafer with two mark points on a chip at the same time, especially in the case that the interval of the two marks exceeds the detection range of a single vision system. The large field of view near-infrared barrel lens used in the D2W bonding vision system has a large field of view, and the barrel lens can capture four mark points (two on a die and two on a wafer) at the same time by cooperating with a large field of view dispersion microscope objective, thereby meeting the requirement of mark alignment in the D2W bonding process.

[0005] The embodiment of the present application provides the following technical scheme: a super large field of view barrel lens, comprising: the super large field of view barrel lens sequentially comprises, from an exit side to an object side: a first lens, a second lens, a third lens, a fourth lens, a fifth lens and a sixth lens; wherein the first lens and the second lens are cemented into a set of double cemented lenses, the third lens and the fourth lens are cemented into a set of double cemented lenses, and the fifth lens and the sixth lens are cemented into a set of double cemented lenses.

[0006] The focal length of the first lens and the second lens cemented into a set of double cemented lenses is f 12 , the focal length of the third lens and the fourth lens cemented into a set of double cemented lenses is f 34 , the focal length of the fifth lens and the sixth lens cemented into a set of double cemented lenses is f 56 , the focal length of the super large field of view barrel lens is f, and the following relationship is satisfied:

[0007] 1.80≤f 12 / f≤2.50.

[0008] -0.65≤f 34 / f≤-0.50.

[0009] 0.35≤f 56 / f≤0.50.

[0010] Wherein, the field of view of the super large field of view barrel lens is 110 mm, and the working waveband λ is 1.1-1.3 μm.

[0011] According to an embodiment of the present application, the focal length of the super large field of view barrel lens is f, the numerical aperture of the super large field of view barrel lens is NA, and the following relationship is satisfied:

[0012] 12≤f*NA≤16.

[0013] According to an embodiment of the present application, the focal length f of the super large field of view barrel lens is 400 mm, and the numerical aperture NA is 0.035; the CRA angle of the super large field of view barrel lens is less than or equal to 10°, wherein the CRA angle is the maximum included angle between the light ray emitted from the object side of the barrel lens and the optical axis.

[0014] According to an embodiment of the present application, the first surface curvature radius of the first lens is r1, the cemented surface curvature radius of the second surface of the first lens and the first surface of the second lens is r2, the second surface curvature radius of the second lens is r3, the first surface curvature radius of the third lens is r4, the cemented surface curvature radius of the second surface of the third lens and the first surface of the fourth lens is r5, the second surface curvature radius of the fourth lens is r6, the first surface curvature radius of the fifth lens is r7, the cemented surface curvature radius of the second surface of the fifth lens and the first surface of the sixth lens is r8, and the second surface curvature radius of the sixth lens is r9, and the following relationship is satisfied:

[0015] 6.00≤(r1+r2) / (r1-r2)≤8.00;

[0016] -5.50≤(r2+r3) / (r2-r3)≤-4.00;

[0017] 4.70≤(r4+r5) / (r4-r5)≤7.00;

[0018] -16.00≤(r5+r6) / (r5-r6)≤-12.00;

[0019] 34.50≤(r7+r8) / (r7-r8)≤46.50;

[0020] -6.50≤(r8+r9) / (r8-r9)≤-4.80.

[0021] According to an embodiment of the present application, the thickness of the first lens is d1, the thickness of the second lens is d2, the thickness of the third lens is d3, the thickness of the fourth lens is d4, the thickness of the fifth lens is d5, the thickness of the sixth lens is d6, the total length of the super large field of view barrel lens from the first lens to the focusing position is TTL, and the following relationship is satisfied:

[0022] 0.02≤d1 / TTL≤0.03;

[0023] 0.03≤d2 / TTL≤0.04;

[0024] 0.03≤d3 / TTL≤0.04;

[0025] 0.02≤d4 / TTL≤0.03;

[0026] 0.03≤d5 / TTL≤0.04;

[0027] 0.01≤d6 / TTL≤0.02.

[0028] According to an embodiment of the present application, the interval between the double cemented lens formed by cementing the first lens and the second lens and the double cemented lens formed by cementing the third lens and the fourth lens is t1, the interval between the double cemented lens formed by cementing the third lens and the fourth lens and the double cemented lens formed by cementing the fifth lens and the sixth lens is t2, the total length of the super-wide field tube lens from the first lens to the focusing position is TTL, and the following relationship is satisfied:

[0029] 0.02≤t1 / TTL≤0.03;

[0030] 0.04≤t2 / TTL≤0.06.

[0031] According to an embodiment of the present application, the total length of the super-wide field tube lens from the first lens to the focusing position is TTL, the back intercept of the super-wide field tube lens is WD, and the following relationship is satisfied:

[0032] 0.7≤WD / TTL≤0.8.

[0033] According to an embodiment of the present application, the refractive index of the first lens is n1, the refractive index of the second lens is n2, the refractive index of the third lens is n3, the refractive index of the fourth lens is n4, the refractive index of the fifth lens is n5, and the refractive index of the sixth lens is n6, and the following relationship is satisfied:

[0034] 1.75≤n1≤2.15;

[0035] 1.40≤n2≤1.75;

[0036] 1.50≤n3≤1.80;

[0037] 1.60≤n4≤2.00;

[0038] 1.70≤n5≤2.10;

[0039] 1.35≤n6≤1.65.

[0040] According to an embodiment of the present application, the first lens is a meniscus negative lens, the second lens is a meniscus positive lens, the third lens is a biconvex positive lens, the fourth lens is a biconcave negative lens, the fifth lens is a biconvex positive lens, and the sixth lens is a biconcave negative lens.

[0041] The application also provides a chip wafer alignment system, comprising a dispersion microscope objective, two infrared cameras, and the super large field of view barrel lens as described above, the super large field of view barrel lens is arranged in the light path between the dispersion microscope objective and the two infrared cameras, the object light emitted from the dispersion microscope objective is incident to the super large field of view barrel lens, and after being emitted from the barrel lens, the object light is received by the two infrared cameras respectively, so as to simultaneously shoot four mark points on the chip and the wafer.

[0042] Compared with the prior art, the above at least one technical solution adopted by the embodiment of the present application can achieve the beneficial effects at least including: the embodiment of the present application is a large field of view near-infrared barrel lens used in a D2W bonding visual system, because of the large field of view, the barrel lens can be installed with two small field of view infrared cameras, the barrel lens cooperates with the large field of view dispersion microscope objective to simultaneously shoot four mark points (two mark points on the die and two mark points on the wafer), the positions of the four mark points can be observed in real time during the bonding process, and then the high-precision bonding and high efficiency of the chip and the wafer are realized. In addition, the position of the two cameras can be adjusted by the barrel lens, so as to adapt to mark points with different intervals, and meet the needs of various D2W bonding. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0044] Figure 1 is a structure diagram of the super large field of view barrel lens of the embodiment of the present application;

[0045] Figure 2 is a point list diagram of the super large field of view barrel lens of the embodiment of the present application;

[0046] Figure 3 is an MTF curve of the super large field of view barrel lens of the embodiment of the present application;

[0047] Figure 4 is a mirror distortion curve of the super large field of view barrel lens of the embodiment of the present application. DETAILED DESCRIPTION

[0048] The embodiments of the present application will be described in detail below with reference to the drawings.

[0049] Following, the embodiments of the present application are described through specific examples, and other advantages and effects of the present application can be easily understood by those skilled in the art from the disclosure. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific embodiments, and various modifications or changes can be made to the details in the specification based on different views and applications, without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0050] As shown in Figure 1 , the embodiment of the present application provides a super large field of view barrel lens, comprising: the super large field of view barrel lens sequentially comprises: a first lens L1, a second lens L2, a third lens L3, a fourth lens L4, a fifth lens L5, a sixth lens L6 from the exit side to the object side; wherein the first lens L1 and the second lens L2 are cemented into a group of double cemented lenses, the third lens L3 and the fourth lens L4 are cemented into a group of double cemented lenses, and the fifth lens L5 and the sixth lens L6 are cemented into a group of double cemented lenses.

[0051] The focal length of the first lens L1 and the second lens L2 cemented into a group of double cemented lenses is f 12 , the focal length of the third lens L3 and the fourth lens L4 cemented into a group of double cemented lenses is f 34 , the focal length of the fifth lens L5 and the sixth lens L6 cemented into a group of double cemented lenses is f 56 , the focal length of the super large field of view barrel lens is f, and the following relationship is satisfied:

[0052] 1.80≤f 12 / f≤2.50;

[0053] -0.65≤f 34 / f≤-0.50;

[0054] 0.35≤f 56 / f≤0.50;

[0055] Wherein, the field of view of the super large field of view barrel lens is 110mm, and the working waveband λ is 1.1-1.3μm.

[0056] In an actual wafer bonding alignment system, since the field of view of the infrared camera cannot cover the large field of view of the object side, the maximum field of view of the object side is 11 mm, the image side corresponds to 110 mm for a 10X system, and the diagonal line of the infrared camera has only an 8 mm field of view, so the conventional infrared barrel lens cannot meet the use requirements. Therefore, the barrel lens in the embodiment of the present application is designed by adopting a split light path design and optical structure and parameter design, that is, two cameras are used to receive two mark images through the barrel lens. In addition, different interval mark imaging observation can be realized by adjusting the interval between the two cameras (adjusting the interval between the two infrared cameras to correspond to different fields of view of the object side), and the alignment requirements of different types of D2W bonding mark points with intervals of 6-11 mm are compatible.

[0057] In the embodiment, it is verified that the effect of the super large field of view barrel lens is the best when the working wavelength band is 1.1-1.3 μm in the near-infrared transmission detection wafer, so the design wavelength band of the super large field of view barrel lens in the embodiment is 1.1-1.3 μm.

[0058] Therefore, the super large field of view near-infrared barrel lens for the D2W bonding visual system in the embodiment of the present application has a large field of view, and the barrel lens can be installed with two infrared cameras with small fields of view. The barrel lens can be used together with a large field of view dispersion microscope objective to simultaneously shoot four mark points (two for the die and two for the wafer), and the positions of the four mark points can be observed in real time during the bonding process, so that high-precision bonding and efficiency of the chip and the wafer can be realized. In addition, the position of the two cameras can be adjusted to adapt to mark points with different intervals, so that various D2W bonding requirements can be met.

[0059] In an embodiment, the first lens is a meniscus negative lens, the second lens is a meniscus positive lens, the third lens is a biconvex positive lens, the fourth lens is a biconcave negative lens, the fifth lens is a biconvex positive lens, and the sixth lens is a biconcave negative lens. The first lens and the second lens are cemented into a set of double cemented lenses, the third lens and the fourth lens are cemented into a set of double cemented lenses, and the fifth lens and the sixth lens are cemented into a set of double cemented lenses. The entire system is composed of three sets of double cemented lenses, adopts a positive-negative-positive structure, and is conducive to correcting off-axis aberrations.

[0060] In an embodiment, the focal length of the super large field of view barrel lens is f, the numerical aperture of the super large field of view barrel lens is NA, and the following relationship is satisfied:

[0061] 12≤f*NA≤16.

[0062] In specific implementation, the lens parameters of the super large field of view barrel lens are as follows:

[0063] 1) f = 400 mm (the focal length f is 400 mm, a 40 mm objective is matched, and the magnification is -10X)

[0064] 2) Numerical aperture NA: 0.035;

[0065] 3) Field of view: 110 mm (large field of view)

[0066] 4) Wavelength: 1.1-1.3 μm

[0067] 5) Distortion: ≤ 0.05%

[0068] 6) CRA angle ≤ 10° (when the field of view is large, the angle at which the off-axis field of view is incident on the camera is also larger, and this angle is too large to make the light receiving ability of the camera decrease, i.e., the central position of the camera with a smaller CRA (Chief Ray Angle) angle has a much larger gray scale than the edge position with a larger CRA angle, and thus the CRA angle needs to be controlled; wherein the CRA angle is the maximum included angle between the light ray emitted from the object side of the barrel lens and the optical axis.)

[0069] In one embodiment, the first surface of the first lens has a curvature radius of r1, the cemented surface of the second surface of the first lens and the first surface of the second lens has a curvature radius of r2, the second surface of the second lens has a curvature radius of r3, the first surface of the third lens has a curvature radius of r4, the cemented surface of the second surface of the third lens and the first surface of the fourth lens has a curvature radius of r5, the second surface of the fourth lens has a curvature radius of r6, the first surface of the fifth lens has a curvature radius of r7, the cemented surface of the second surface of the fifth lens and the first surface of the sixth lens has a curvature radius of r8, and the second surface of the sixth lens has a curvature radius of r9, and the following relationships are satisfied:

[0070] 6.00 ≤ (r1+r2) / (r1-r2) ≤ 8.00;

[0071] -5.50 ≤ (r2+r3) / (r2-r3) ≤ -4.00;

[0072] 4.70 ≤ (r4+r5) / (r4-r5) ≤ 7.00;

[0073] -16.00 ≤ (r5+r6) / (r5-r6) ≤ -12.00;

[0074] 34.50 ≤ (r7+r8) / (r7-r8) ≤ 46.50;

[0075] -6.50 ≤ (r8+r9) / (r8-r9) ≤ -4.80.

[0076] In a specific implementation, the radius of curvature r is specifically in the range of 53.5≤r1≤65.0, 39.5≤r2≤48.0, 60.0≤r3≤73.5, 85.0≤r4≤104.0, 59.0≤r5≤72.0, 69.0≤r6≤84.0, 130.0≤r7≤159.0, 115.0≤r8≤141.0, 165.5≤r9≤202.0.

[0077] In an embodiment, the thickness of the first lens is d1, the thickness of the second lens is d2, the thickness of the third lens is d3, the thickness of the fourth lens is d4, the thickness of the fifth lens is d5, the thickness of the sixth lens is d6, the total length of the super-wide field tube lens from the first lens to the focusing position is TTL, and the following relationship is satisfied:

[0078] 0.02≤d1 / TTL≤0.03;

[0079] 0.03≤d2 / TTL≤0.04;

[0080] 0.03≤d3 / TTL≤0.04;

[0081] 0.02≤d4 / TTL≤0.03;

[0082] 0.03≤d5 / TTL≤0.04;

[0083] 0.01≤d6 / TTL≤0.02.

[0084] In a specific implementation, the thickness d is specifically in the range of 9.0≤d1≤11.0, 13.5≤d2≤16.5, 13.5≤d3≤16.5, 7.0≤d4≤9.0, 14.5≤d5≤17.5, 6.0≤d6≤8.0. The total length of the super-wide field tube lens from the first lens to the focusing position TTL is in the range of 402-404 mm.

[0085] In an embodiment, the spacing between the double cemented lens formed by cementing the first lens and the second lens, and the double cemented lens formed by cementing the third lens and the fourth lens is t1, the spacing between the double cemented lens formed by cementing the third lens and the fourth lens, and the double cemented lens formed by cementing the fifth lens and the sixth lens is t2, the total length of the super-wide field tube lens from the first lens to the focusing position is TTL, and the following relationship is satisfied:

[0086] 0.02≤t1 / TTL≤0.03;

[0087] 0.04≤t2 / TTL≤0.06.

[0088] In one embodiment, the total length of the super-wide field tube lens from the first lens to the focus position is TTL, the back distance of the super-wide field tube lens is WD, and the following relationship is satisfied:

[0089] 0.7≤WD / TTL≤0.8.

[0090] In one embodiment, the refractive index of the first lens is n1, the refractive index of the second lens is n2, the refractive index of the third lens is n3, the refractive index of the fourth lens is n4, the refractive index of the fifth lens is n5, and the refractive index of the sixth lens is n6, and the following relationship is satisfied:

[0091] 1.75≤n1≤2.15; 1.40≤n2≤1.75; 1.50≤n3≤1.80; 1.60≤n4≤2.00; 1.70≤n5≤2.10; 1.35≤n6≤1.65.

[0092] Table 1 shows the design data of the super-wide field tube lens of the embodiment of the present application.

[0093] Table 1 Design data of the super-wide field tube lens

[0094]

[0095] As Figures 2-4 shown. Figure 2 is the spot diagram of the super-wide field tube lens of the embodiment of the present application; Figure 3 is the MTF curve of the super-wide field tube lens of the embodiment of the present application; Figure 3 In the figure, the horizontal axis spatial frequency in cycles per mm is the spatial frequency, and the vertical axis Modulus of the OTF is the optical transfer function value; Figure 4 is the lens distortion curve of the super-wide field tube lens of the embodiment of the present application. From Figure 2 it can be seen that the spot diagram of the super-wide field tube lens at all wavelengths is within the Airy disk, from Figure 3 it can be seen that the MTF curve of the super-wide field tube lens at all wavelengths is close to the diffraction limit, from Figure 4 it can be seen that the distortion value of the super-wide field tube lens at all wavelengths is less than 0.06%, which shows that the imaging quality of the super-wide field tube lens is close to the theoretical limit and the image is not distorted in the full field of view.

[0096] The chip wafer alignment system of the embodiment of the present application adopts the above-mentioned super large field of view tube lens, and since the tube lens has a large field of view, the tube lens can be matched with two infrared cameras with small fields of view, and the tube lens matched with the large field of view dispersion microscope can simultaneously capture four mark points on the chip and the wafer, so that the positions of the four mark points can be observed in real time during the bonding process, and high-precision bonding and efficiency of the chip and the wafer can be realized. In addition, the tube lens can adjust the positions of the two cameras so as to adapt to mark points with different intervals, and meet the bonding requirements of various chips and wafers.

[0097] The chip wafer alignment system of the embodiment of the present application adopts the above-mentioned super large field of view tube lens, and since the tube lens has a large field of view, the tube lens can be matched with two infrared cameras with small fields of view, and the tube lens matched with the large field of view dispersion microscope can simultaneously capture four mark points on the chip and the wafer, so that the positions of the four mark points can be observed in real time during the bonding process, and high-precision bonding and efficiency of the chip and the wafer can be realized. In addition, the tube lens can adjust the positions of the two cameras so as to adapt to mark points with different intervals, and meet the bonding requirements of various chips and wafers.

[0098] The above is merely a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which shall be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An ultra-wide field of view rod lens characterized in that, The super large field of view barrel lens comprises, from the exit side to the object side, a first lens, a second lens, a third lens, a fourth lens, a fifth lens and a sixth lens. The super large field of view barrel lens has a field of view of 110 mm and a working wave band of 1.1-1.3 microns. The focal length of the first lens and the second lens cemented into a double cemented lens group is f 12 The focal length of the third lens and the fourth lens cemented into a double cemented lens group is f 34 The focal length of the fifth lens and the sixth lens cemented into a double cemented lens group is f 56 The focal length of the super-wide field tube lens is f, and the following relationship is satisfied: 1.80 < f 12 f < 2.50; -0.65 < f 34 / f < -0.50; 0.35 < f 56 f < 0.50; The super large field of view barrel lens has a focal length f and a numerical aperture NA, and satisfies the following relationship:

2. The hyper-FOV rod lens of claim 1, wherein, 12≤f*NA≤16. The super large field of view barrel lens has a focal length f of 400 mm and a numerical aperture NA of 0.035, and a CRA angle of less than 10 degrees.

3. The hyper-FOV rod lens of claim 2, wherein, The first lens has a first face curvature radius r1, a second face curvature radius r3, a third face curvature radius r4, a fourth face curvature radius r6, a fifth face curvature radius r7 and a sixth face curvature radius r9, and satisfies the following relationship:

4. The hyper-FOV rod lens of claim 1, wherein, The first lens has a thickness d1, the second lens has a thickness d2, the third lens has a thickness d3, the fourth lens has a thickness d4, the fifth lens has a thickness d5, and the sixth lens has a thickness d6, and the super large field of view barrel lens has a total length TTL from the first lens to the focusing position, and satisfies the following relationship: 6.00≤(r1+r2) / (r1-r2)≤8.00； -5.50≤(r2+r3) / (r2-r3)≤-4.00； 4.70≤(r4+r5) / (r4-r5)≤7.00； -16.00≤(r5+r6) / (r5-r6)≤-12.00； 34.50≤(r7+r8) / (r7-r8)≤46.50； -6.50≤(r8+r9) / (r8-r9)≤-4.80。 5. The hyper-FOV rod lens of claim 1, wherein, 0.02≤d1 / TTL≤0.03; 0.03≤d2 / TTL≤0.04; 0.03≤d3 / TTL≤0.04; 0.02≤d4 / TTL≤0.03; 0.03≤d5 / TTL≤0.04; 0.01≤d6 / TTL≤0.

02. The first lens and the second lens are glued to form a double-glued lens, and the third lens and the fourth lens are glued to form a double-glued lens, and the third lens and the fourth lens are glued to form a double-glued lens, and the fifth lens and the sixth lens are glued to form a double-glued lens, and the super large field of view barrel lens has a total length TTL from the first lens to the focusing position, and satisfies the following relationship:

6. The hyper-FOV rod lens of claim 1, wherein, 0.02≤t1 / TTL≤0.03; The super large field of view barrel lens has a total length TTL from the first lens to the focusing position, and a back intercept WD, and satisfies the following relationship: 0.04 < t2 / TTL < 0.

06.

7. The hyper-FOV rod lens of claim 1, wherein, 0.7≤WD / TTL≤0.

8. ​ 8. The hyper-FOV rod lens of claim 1, wherein, The refractive index of the first lens is n1, the refractive index of the second lens is n2, the refractive index of the third lens is n3, the refractive index of the fourth lens is n4, the refractive index of the fifth lens is n5, the refractive index of the sixth lens is n6, and the following relationship is satisfied: 1.75≤n1≤2.15； 1.40≤n2≤1.75； 1.50≤n3≤1.80； 1.60≤n4≤2.00； 1.70≤n5≤2.10； 1.35≤n6≤1.65。 9. The hyper-FOV rod lens of claim 1, wherein, The first lens is a meniscus negative lens, the second lens is a meniscus positive lens, the third lens is a biconvex positive lens, the fourth lens is a biconcave negative lens, the fifth lens is a biconvex positive lens, and the sixth lens is a biconcave negative lens.

10. A chip wafer alignment system, characterized by, The super large field of view barrel lens is arranged in the light path between the dispersion microscope objective and the two infrared cameras, the object light emitted from the dispersion microscope objective is incident to the super large field of view barrel, and after being emitted from the variable magnification barrel, is received by the two infrared cameras respectively to simultaneously shoot four mark points on the chip and wafer, and the interval between the two cameras can be adjusted to correspond to different intervals of the marks.

Images