Touch control assembly
By employing curved wires and visual effect improvement structures in the touch module, the environmental pollution and high energy consumption problems of ITO transparent electrodes have been solved, achieving a high visual clarity effect with low pollution and low energy consumption.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-08
- Publication Date
- 2026-04-10
AI Technical Summary
Existing touch modules using indium tin oxide (ITO) transparent electrodes suffer from problems such as limited rare metal reserves, serious production pollution, and high energy consumption, and improper waste disposal can cause environmental pollution.
It employs a bent conductor structure, with the conductor consisting of a conductive inner core and an outer coating, manufactured using a winding technique. Combined with visual enhancement structures such as polarizers and retardation films, it reduces conductor gaps and improves visual effects.
It reduces production pollution and energy consumption, minimizes the visibility of wires, solves the problem of grid patterns in high-brightness environments, and improves visual clarity.
Smart Images
Figure CN121832797A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a touch assembly and its manufacturing method. Background Technology
[0002] With the diversified development of touch modules, they have been successfully applied in industrial and consumer electronics products. Touch products integrated with various medium-to-large-sized products will become increasingly common.
[0003] However, a current conventional process for touch modules uses indium tin oxide (ITO) as the transparent electrode. ITO production requires the rare metal indium. Indium reserves are limited, and its mining process causes environmental pollution. Furthermore, the aforementioned conventional process generates a large amount of ITO waste, which needs proper disposal to avoid further environmental pollution. Moreover, the conventional process requires high-temperature, high-pressure vacuum coating equipment, resulting in high energy consumption.
[0004] Therefore, how to propose a touch assembly and its manufacturing method that can solve the above problems is one of the issues that the industry is currently eager to invest research and development resources to address. Summary of the Invention
[0005] In view of this, one objective of this disclosure is to propose a touch assembly and a method for manufacturing the above-mentioned problems.
[0006] To achieve the above objectives, according to one embodiment of this disclosure, a touch assembly includes a protective cover, a first adhesive layer, a conductive layer, a second adhesive layer, and a visual enhancement structure. The first adhesive layer is disposed on the protective cover. The thickness of the first adhesive layer ranges from 20 μm to 200 μm. The conductive layer includes curved conductive lines disposed on the first adhesive layer. The curved conductive lines include a first group of conductive lines extending along a first direction and a second group of conductive lines extending along a second direction and overlapping the first group of conductive lines. Each curved conductive line includes a conductive inner core and an outer cover layer. The second adhesive layer covers the curved conductive lines and the first adhesive layer. The visual enhancement structure corresponds to the curved conductive lines in the stacking direction of the protective cover and the conductive layer.
[0007] In one or more embodiments disclosed herein, the visual enhancement structure is an anti-glare film layer disposed on a protective cover plate.
[0008] In one or more embodiments disclosed herein, the visual enhancement structure includes a polarizer.
[0009] In one or more embodiments disclosed herein, the visual enhancement structure is stacked on the side of the conductor layer near the protective cover.
[0010] In one or more embodiments disclosed herein, the visual enhancement structure is stacked on the side of the conductor layer away from the protective cover.
[0011] In one or more embodiments disclosed herein, the visual enhancement structure further includes a retardation film. The retardation film is disposed on a polarizer.
[0012] In one or more embodiments disclosed herein, each bent conductor is an enameled wire.
[0013] In one or more embodiments disclosed herein, the visual enhancement structure includes a polarizing layer. The polarizing layer covers the outer layer of each bent conductor.
[0014] In one or more embodiments disclosed herein, the visual enhancement structure further includes a retardation film. The retardation film covers the outer coating of each bent conductor. A polarizing layer covers the retardation film.
[0015] In one or more embodiments disclosed herein, the material of the outer coating is selected from the group consisting of polyvinyl alcohol formaldehyde, polyurethane, polyamide, polyester, polyester-polyimide, polyamide-polyimide and polyimide.
[0016] In summary, in the touch assembly disclosed herein, since each bent wire is a wire comprising a conductive inner core and an outer coating, it can be fabricated within the touch assembly using wire-winding technology. This eliminates the high pollution and high energy consumption problems associated with conventional complex processes using indium tin oxide (ITO) as transparent electrodes. By placing the bent wire between the first and second adhesive layers, the gaps between the bent wires can be filled by the first and second adhesive layers, effectively reducing the visibility of the bent wires when viewed from the side of the second adhesive layer (i.e., reducing shadow generation). By incorporating a visual enhancement structure corresponding to each bent wire in the touch assembly, the problem of grid patterns easily appearing when viewing the touch assembly in high-brightness environments can be effectively solved.
[0017] The above description is only used to illustrate the problem to be solved by this disclosure, the technical means to solve the problem, and the effects produced, etc. The specific details of this disclosure will be described in detail in the following implementation method and related drawings. Attached Figure Description
[0018] To make the above and other objects, features, advantages and embodiments disclosed herein more apparent and understandable, the accompanying drawings are described below:
[0019] Figure 1 A schematic diagram illustrating a touch assembly according to an embodiment of the present disclosure;
[0020] Figure 2 For illustration Figure 1 A partial cross-sectional view of some components;
[0021] Figure 3A flowchart illustrating a method for manufacturing a touch assembly according to an embodiment of the present disclosure;
[0022] Figure 4 A flowchart illustrating a method for manufacturing a touch assembly according to another embodiment of this disclosure;
[0023] Figures 5A to 5J Schematic diagrams illustrating intermediate steps of a method for manufacturing a touch assembly according to an embodiment of the present disclosure;
[0024] Figure 6 For illustration Figure 5I A partial cross-sectional view;
[0025] Figures 7A to 7H Schematic diagrams illustrating intermediate steps of a method for manufacturing a touch assembly according to an embodiment of the present disclosure;
[0026] Figure 8 A schematic diagram illustrating another embodiment of the touch assembly according to this disclosure;
[0027] Figure 9 A schematic diagram illustrating another embodiment of the touch assembly according to this disclosure;
[0028] Figure 10 A schematic diagram illustrating another embodiment of the touch assembly according to this disclosure;
[0029] Figure 11 A schematic diagram illustrating another embodiment of the touch assembly according to this disclosure;
[0030] Figure 12 A schematic diagram illustrating another embodiment of the touch assembly according to this disclosure;
[0031] Figure 13 A cross-sectional view is provided to illustrate a curved wire and visual improvement structure according to an embodiment of this disclosure.
[0032] [Symbol Explanation]
[0033] 100, 200, 300A, 300B, 300C, 400: Touchscreen Assembly
[0034] 110: Protective cover plate
[0035] 120: First adhesive layer
[0036] 13L: Conductor Layer
[0037] 130: Bending wire
[0038] 130A: Enamelled wire
[0039] 131: Conductive inner core
[0040] 132: Outer cladding
[0041] 140: Second adhesive layer
[0042] 140A: Water-based adhesive
[0043] 150: Circuit board
[0044] 151: Joint Pad
[0045] 152: Metal layer
[0046] 210, 310, 310A, 410: Visual Effects Improvement Structure
[0047] 311: Polarizing film
[0048] 312, 412: Phase retardation film
[0049] 411: Polarizing layer
[0050] 910: Winding machine
[0051] 920: Glue applicator
[0052] 930: Welding machine
[0053] 940: Pressure Plate
[0054] 950: Roller
[0055] 960: Cutting machine
[0056] D: Stacking direction
[0057] EW: Pre-embedded wire
[0058] G1: First group of conductors
[0059] G2: Second group of conductors
[0060] RF1, RF2, RF3: Release film
[0061] S110, S120, S130, S140, S210, S220, S230, S240: Steps Detailed Implementation
[0062] The following describes several embodiments of this disclosure with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is, in some embodiments of this disclosure, these practical details are not essential. Furthermore, for the sake of simplicity in the drawings, some conventional structures and elements will be shown in a simple schematic manner.
[0063] Please refer to Figure 1 as well as Figure 2 . Figure 1 A schematic diagram illustrating a touch assembly 100 according to an embodiment of the present disclosure is provided. Figure 2 For illustration Figure 1 A partial cross-sectional view of some components. For example... Figure 1 and Figure 2 As shown, in this embodiment, the touch assembly 100 includes a protective cover 110, a first adhesive layer 120, a plurality of bent wires 130, a second adhesive layer 140, and a circuit board 150. The first adhesive layer 120 is disposed on the protective cover 110. The bent wires 130 are disposed on the first adhesive layer 120 and include a first group of wires G1 and a second group of wires G2. The first group of wires G1 extends along a first direction and is spaced apart. The second group of wires G2 extends along a second direction and overlaps the first group of wires G1, and is spaced apart. In some embodiments, the first direction and the second direction are perpendicular to each other, for example, the X-axis direction and the Y-axis direction. The second adhesive layer 140 covers the bent wires 130 and the first adhesive layer 120. The circuit board 150 is electrically connected to the bent wires 130. The circuit board 150 is, for example, a flexible circuit board, but this disclosure is not limited thereto.
[0064] like Figure 2 As shown, specifically, each bent wire 130 includes a conductive inner core 131 and an outer covering layer 132. The outer covering layer 132 contains an insulating material. Therefore, the conductive inner cores 131 of the first group of wires G1 and the second group of wires G2 are electrically insulated from each other by the outer covering layers 132 of the first group of wires G1 and the second group of wires G2. In this way, touch signals (such as mutual capacitance sensing signals) between the first group of wires G1 and the second group of wires G2 can be extracted to the circuit board 150.
[0065] In this embodiment, each bent wire 130 is an enameled wire. Therefore, the bent wire 130 can be fabricated in the touch assembly 100 using a winding technique, thereby eliminating the high pollution and high energy consumption problems associated with conventional complex processes using indium tin oxide (ITO) as transparent electrodes.
[0066] In practical applications, the bent wire 130 can also be a combination of enameled wire and ITO transparent electrode. For example, one group of the first group of wires G1 and the second group of wires G2 of the bent wire 130 is enameled wire, while the other group of the first group of wires G1 and the second group of wires G2 is ITO transparent electrode.
[0067] In some embodiments, the conductive core 131 of the bent wire 130 is made of silver, copper, aluminum, tungsten, or similar metals.
[0068] In some embodiments, the material of the conductive core 131 of the bent wire 130 includes a palladium-copper alloy, a silver-palladium-copper alloy, a molybdenum-rhenium alloy, an aluminum alloy, a nickel alloy, or a similar alloy.
[0069] In this embodiment, the thickness of the first adhesive layer 120 is in the range of 20 μm to 200 μm. The initial tack of the first adhesive layer 120 is in the range of 1800 gf / in to 4000 gf / in. It should be noted that when the rigidity of the bent wire 130 is high (for example, the conductive core 131 of the bent wire 130 is made of an alloy), the bent wire 130 is prone to breakage stress when wound around the first adhesive layer 120, leading to jumper problems. By limiting the thickness and initial tack of the first adhesive layer 120 to the aforementioned specific range, jumper problems of the bent wire 130 relative to the first adhesive layer 120 during the winding process can be effectively avoided. Specifically, when either the thickness or the initial tack of the first adhesive layer 120 is less than the lower limit of the aforementioned range, jumper problems are likely to occur. When the thickness of the first adhesive layer 120 is greater than the upper limit of its range, it leads to an increase in the overall size, weight, and cost of the touch assembly 100. When the initial tack of the first adhesive layer 120 is greater than the upper limit of its range, not only is the material selectivity limited, but reworkability is also reduced.
[0070] In some embodiments, the material of the outer sheath 132 of the bent conductor 130 includes polyvinyl formal, polyurethane, polyamide, polyester, polyester-polyimide, polyamide-polyimide, or polyimide, but this disclosure is not limited thereto.
[0071] In some embodiments, the wire diameter of the conductive core 131 of the bent wire 130 is in the range of 2 μm to 20 μm. Preferably, the wire diameter of the conductive core 131 is in the range of 2 μm to 5 μm to improve the visibility of the touch assembly 100. That is, the visibility of the bent wire 130 can be reduced. In some embodiments, the thickness of the outer coating 132 of the bent wire 130 is in the range of 1 μm to 3 μm. For example, in one embodiment, the wire diameter of the conductive core 131 is about 5 μm, and the thickness of the outer coating 132 is about 2 μm (i.e., the wire diameter of the bent wire 130 is about 7 μm), but this disclosure is not limited thereto.
[0072] like Figure 2 As shown, in this embodiment, the first adhesive layer 120 and the second adhesive layer 140 fill the gaps between the first group of conductors G1 and the second group of conductors G2. This eliminates the gaps created by indentations between the bent conductor 130 and the first and second adhesive layers 120 and 140, effectively reducing the visibility of the bent conductor 130 when viewed from the side of the second adhesive layer 140 (i.e., reducing the generation of shadows).
[0073] In some embodiments, at least one of the first adhesive layer 120 and the second adhesive layer 140 is an optical clear adhesive (OCA) layer or a liquid optical clear adhesive (LOCA) layer, but this disclosure is not limited thereto.
[0074] In some embodiments, the thickness of the second adhesive layer 140 is in the range of 25 μm to 150 μm. When the thickness of the second adhesive layer 140 is less than the lower limit of the aforementioned range, the aforementioned gaps are not easily eliminated completely; when the thickness of the second adhesive layer 140 is greater than the lower limit of the aforementioned range, it will lead to an increase in the overall size, weight and cost of the touch assembly 100.
[0075] Please refer to Figure 3 A flowchart illustrating a method for manufacturing a touch assembly according to an embodiment of this disclosure is provided. Figure 3 As shown, and in conjunction with reference Figure 1 and Figure 2 In this embodiment, the manufacturing method of the touch assembly includes steps S110 to S140.
[0076] Step S110: Attach the first adhesive layer 120 to the protective cover plate 110.
[0077] In some embodiments, step S110 is performed by continuously laminating the first adhesive layer 120 onto the protective cover plate 110 at about 130 degrees Celsius for about 40 minutes, but this disclosure is not limited thereto.
[0078] In some embodiments, a black matrix (BM) layer may be formed on the protective cover plate 110 before step S110. After step S110, the first adhesive layer 120 comes into contact with the black matrix layer.
[0079] Step S120: A plurality of bent wires 130 are provided on the first adhesive layer 120.
[0080] In some embodiments, step S120 may include: using enameled wire 130A (see reference) Figure 5C and Figure 7B The wire is wound onto the first adhesive layer 120; and the enameled wire 130A is cut to form a bent conductor 130.
[0081] In some embodiments, the step of cutting the enameled wire 130A to form the bent conductor 130 is performed by a laser cutting process, but this disclosure is not limited thereto.
[0082] Step S130: Cover the curved wire 130 with the second adhesive layer 140 and the first adhesive layer 120.
[0083] In some embodiments, step S130 is performed by continuously laminating the second adhesive layer 140 onto the first adhesive layer 120 at about 130 degrees Celsius for about 40 minutes, but this disclosure is not limited thereto.
[0084] Step S140: Solder the circuit board 150 to the bent wire 130.
[0085] In some embodiments, step S140 is performed by a laser welding process, but this disclosure is not limited thereto.
[0086] Please refer to Figure 4 This is a flowchart illustrating a method for manufacturing a touch assembly according to another embodiment of this disclosure. Figure 4 As shown, and in conjunction with reference Figure 1 and Figure 2 In this embodiment, the manufacturing method of the touch assembly includes steps S210 to S240.
[0087] Step S210: A plurality of bent wires 130 are provided on the first adhesive layer 120.
[0088] In some embodiments, step S210 may include: using enameled wire 130A (see reference) Figure 5C and Figure 7B The wire is wound onto the first adhesive layer 120; and the enameled wire 130A is cut to form a bent conductor 130.
[0089] Step S220: Cover the second adhesive layer 140 onto the bent wire 130 and the first adhesive layer 120.
[0090] In some embodiments, step S220 is performed by continuously laminating the second adhesive layer 140 onto the first adhesive layer 120 at about 130 degrees Celsius for about 40 minutes, but this disclosure is not limited thereto.
[0091] Step S230: Solder the circuit board 150 to the bent wire 130.
[0092] In some embodiments, step S230 is performed by a laser welding process, but this disclosure is not limited thereto.
[0093] Step S240: Transfer the combination including the first adhesive layer 120, the bent wire 130, the second adhesive layer 140 and the circuit board 150 onto the protective cover plate 110.
[0094] Compared to Figure 3 The implementation method shown, Figure 4The embodiment shown transfers the combination of the first adhesive layer 120, the bent wire 130 and the second adhesive layer 140 to the protective cover plate 110 after the lamination process of the second adhesive layer 140, thus effectively avoiding the problem of damage to the black matrix layer on the protective cover plate 110 caused by the high temperature in the lamination process.
[0095] Please refer to Figures 5A to 5J . Figures 5A to 5J Schematic diagrams illustrating intermediate steps of a method for manufacturing a touch assembly according to one embodiment of this disclosure are provided. This embodiment is... Figure 4 A specific embodiment of the manufacturing method shown will be described in detail below.
[0096] like Figure 5A As shown, in this step, release films RF1 and RF2 are respectively attached to the opposite sides of the first adhesive layer 120.
[0097] like Figure 5B As shown, this step follows from Figure 5A The steps are shown below. In this step, the release film RF2 is peeled off, and then the embedded wire EW is placed on the surface of the first adhesive layer 120 where the release film RF2 was originally attached. The embedded wire EW can be wound onto the first adhesive layer 120 using a winding machine 910. The wound embedded wire EW is U-shaped, as shown below. Figure 5B As shown, but this disclosure is not limited thereto.
[0098] like Figure 5C As shown, this step follows from Figure 5B The steps are shown. In this step, the enameled wire 130A is wound onto the first adhesive layer 120. The winding method is, for example, to wind the wire onto the first adhesive layer 120 along a reciprocating, meandering path, such that the enameled wire 130A partially covers the embedded wire EW. Specifically, as shown... Figure 5C As shown, the enameled wire 130A after winding is set on the first adhesive layer 120 in a checkerboard pattern, and the three edges of the checkerboard pattern overlap the pre-embedded wire EW.
[0099] like Figure 5D As shown, this step follows from Figure 5C The steps are shown below. In this step, a single enameled wire 130A is cut to form a plurality of bent conductors 130. Specifically, this step can be performed by peeling the embedded wire EW from the first adhesive layer 120, causing the enameled wire 130A to break and form the bent conductors 130. The mechanism of peeling the embedded wire EW to break the enameled wire 130A is similar to the disassembly of the outer packaging of a cigarette box. Compared to cutting the enameled wire 130A with a knife, this step does not leave knife marks on the first adhesive layer 120. Therefore, step S210 can be performed sequentially. Figure 5B , Figure 5C and Figure 5D This is achieved by following the steps shown.
[0100] In some embodiments, the diameter of the embedded wire EW is larger than that of the enameled wire 130A. This allows the thicker embedded wire EW to have greater tensile strength than the thinner enameled wire 130A, thus preventing the embedded wire EW from breaking during the process of peeling off the enameled wire 130A. In one embodiment, the diameter of the embedded wire EW is approximately 20 μm, while the diameter of the enameled wire 130A is approximately 5 μm, but this disclosure is not limited thereto.
[0101] like Figure 5E As shown, this step follows from Figure 5D The steps are shown below. In this step, a water-based adhesive 140A can be applied to the first adhesive layer 120 using an adhesive applicator 920. Specifically, the water-based adhesive 140A is applied to the outer edge of the first adhesive layer 120. In some embodiments, the water-based adhesive 140A is a light-curing adhesive. For example, a light-curing adhesive can harden after being exposed to ultraviolet light. Therefore, by simultaneously exposing the adhesive to light in this step, the water-based adhesive 140A applied to the outer edge of the first adhesive layer 120 can be hardened into an exterior wall.
[0102] like Figure 5F As shown, this step follows from Figure 5E The steps are shown below. In this step, the water-based adhesive 140A can be further applied to the first adhesive layer 120 using the adhesive applicator 920 to cover the curved wire 130. That is, the water-based adhesive 140A is applied and filled into the space within the aforementioned exterior wall in this step. In other embodiments, this step may also employ a scraping, dotting, slittering, filling, or similar application methods.
[0103] like Figure 5G As shown, this step follows from Figure 5F The steps are shown below. In this step, the pressure plate 940 covers the water-based adhesive 140A, and the roller 950 rolls the pressure plate 940. Simultaneously, while being exposed to light in this step, the water-based adhesive 140A is hardened into a second adhesive layer 140 of uniform thickness.
[0104] like Figure 5H As shown, this step follows from Figure 5G The steps are shown. In this step, after the water-based adhesive 140A has hardened into the second adhesive layer 140, the pressure plate 940 can be removed. Therefore, step S220 can be performed sequentially. Figure 5E , Figure 5F , Figure 5G and Figure 5H This is achieved by following the steps shown.
[0105] like Figure 5I As shown, this step follows from Figure 5H The steps are shown. In this step, the circuit board 150 is soldered to the bent wire 130 (i.e., step S230).
[0106] Please refer to Figure 6 It is a drawing Figure 5I A partial cross-sectional view. For example... Figure 6 As shown, a soldering machine 930 can solder a circuit board 150 to a bent conductor 130. The circuit board 150 has bonding pads 151. The bonding pads 151 have a metal layer 152. For example, the metal layer 152 may contain tin, but this disclosure is not limited thereto. For example, the soldering machine 930 is a laser soldering machine. The laser can penetrate the first adhesive layer 120 and the second adhesive layer 140 and strike the bent conductor 130 in contact with the metal layer 152. In some embodiments, the melting point of the outer layer 132 of the bent conductor 130 is lower than the melting point of the metal layer 152. Therefore, the high temperature generated by the laser can first vaporize the outer layer 132, exposing the conductive core 131 of the bent conductor 130, and then melt the metal layer 152 to solder it to the conductive core 131.
[0107] like Figure 5J As shown, this step follows from Figure 5I The steps shown. In this step, the combination of the first adhesive layer 120, the bent wire 130, the second adhesive layer 140, and the circuit board 150 is transferred onto the protective cover 110 (i.e., step S240). Figure 5J In the illustrated embodiment, the aforementioned combination involves first peeling off the release film RF1, and then transferring it by attaching the first adhesive layer 120 to the protective cover plate 110. Furthermore, in this step, the release film RF3 can also be attached to the second adhesive layer 140 to protect the second adhesive layer 140.
[0108] Please refer to Figures 7A to 7H . Figures 7A to 7H Schematic diagrams illustrating intermediate steps of a method for manufacturing a touch assembly according to one embodiment of this disclosure are provided. This embodiment is... Figure 4 Another specific embodiment of the manufacturing method shown will be described in detail below.
[0109] like Figure 7A As shown, in this step, release films RF1 and RF2 are respectively attached to the opposite sides of the first adhesive layer 120.
[0110] like Figure 7B As shown, this step follows from Figure 7A The steps are shown below. In this step, the release film RF2 is peeled off, and then the enameled wire 130A is wound onto the first adhesive layer 120. The winding method is, for example, winding onto the first adhesive layer 120 along a reciprocating, meandering path. Specifically, as... Figure 7BAs shown, the enameled wire 130A after winding is set on the first adhesive layer 120 in a checkerboard pattern.
[0111] like Figure 7C As shown, this step follows from Figure 7B The steps are shown. In this step, a second adhesive layer 140 with release film RF3 is attached to the first adhesive layer 120. Specifically, the second adhesive layer 140 is attached to the first adhesive layer 120 with the side away from the release film RF3, to cover the first adhesive layer 120 and the enameled wire 130A. In other words, the combination of the first adhesive layer 120, the enameled wire 130A, and the second adhesive layer 140 is stacked between the release films RF1 and RF3. Compared to Figure 5H The second adhesive layer 140 shown is formed by curing water-based adhesive 140A. In this step, the second adhesive layer 140 is in the form of sheet adhesive.
[0112] like Figure 7D As shown, this step follows from Figure 7C The steps are shown below. In this step, the enameled wire 130A can be cut using a cutting machine 960 to form a plurality of bent conductors 130. For example, the cutting machine 960 is a laser cutting machine. While the enameled wire 130A is laser-cut to form bent conductors 130 (i.e., loop cutting), the first adhesive layer 120, the second adhesive layer 140, and the release films RF1 and RF3 are also simultaneously laser-cut (i.e., shape cutting). Compared to cutting the enameled wire 130A with a cutting tool, this step does not cause edge adhesive pulling at the cut points of the release films RF1 and RF3. Therefore, when performed sequentially... Figure 7B , Figure 7C and Figure 7D After the steps shown, steps S210 and S220 can be performed simultaneously.
[0113] In some embodiments, the laser used in the cutting machine 960 is a picosecond laser, femtosecond laser, CO2 laser or similar light source, but this disclosure is not limited thereto.
[0114] like Figure 7E As shown, this step follows from Figure 7D The steps shown are as follows. In this step, the circuit board 150 and the release film RF3 are aligned to expose a portion of the second adhesive layer 140, so that the circuit board 150 can contact the second adhesive layer 140.
[0115] like Figure 7F As shown, this step follows from Figure 7E The steps are shown below. In this step, the circuit board 150 is soldered to the bent wire 130 using a soldering machine 930. The soldering process can be referred to... Figure 6The details and related explanations are omitted here. Therefore, step S230 can be performed sequentially. Figure 7E and Figure 7F This is achieved by following the steps shown.
[0116] like Figure 7G As shown, this step follows from Figure 7F The steps shown. In this step, a protective varnish may be sprayed onto the soldered circuit board 150. The protective varnish is, for example, three-anti-glue, but this disclosure is not limited thereto. In some embodiments, in Figure 5I This step can be continued after the steps shown.
[0117] like Figure 7H As shown, this step follows from Figure 7G The steps shown. In this step, the combination of the first adhesive layer 120, the bent wire 130, the second adhesive layer 140, and the circuit board 150 is transferred onto the protective cover 110 (i.e., step S240). Figure 7H In the illustrated embodiment, the aforementioned combination involves first peeling off the release film RF1, and then transferring it by attaching the first adhesive layer 120 to the protective cover plate 110. The release film RF3 remains attached to the second adhesive layer 140 to protect the second adhesive layer 140.
[0118] Please refer to Figure 8 This is a schematic diagram illustrating a touch assembly 200 according to another embodiment of the present disclosure. Figure 8 As shown, in this embodiment, the touch assembly 200 includes a protective cover 110, a first adhesive layer 120, a conductive layer 13L, a second adhesive layer 140, and a visual enhancement structure 210. The first adhesive layer 120 is disposed on the protective cover 110. The thickness of the first adhesive layer 120 is in the range of 20 μm to 200 μm. The conductive layer 13L includes a bent conductive line 130 disposed on the first adhesive layer 120. The bent conductive line 130 is similar to... Figure 1 and Figure 2 The illustrated embodiment can therefore be referred to in conjunction with the foregoing description. As previously described, the bent conductor 130 includes a first group of conductors G1 extending along a first direction and a second group of conductors G2 extending along a second direction and overlapping the first group of conductors G1. Each bent conductor 130 includes a conductive inner core 131 and an outer covering layer 132. A second adhesive layer 140 covers the bent conductor 130 and the first adhesive layer 120.
[0119] Specifically, in this embodiment, the visual effect improvement structure 210 corresponds to the bent wire 130 in the stacking direction D of the protective cover plate 110 and the conductive layer 13L. More specifically, the visual effect improvement structure 210 is an anti-glare coating (AG) layer disposed on the protective cover plate 110, located on the side of the protective cover plate 110 away from the first adhesive layer 120. By providing the visual effect improvement structure 210 in the touch assembly 200, the problems of light color and blurred appearance when the user views the touch assembly 200 can be effectively improved.
[0120] In some embodiments, the image distinctiveness (DOI) of the visual enhancement structure 210 is about 0 to 2. In some embodiments, the gloss at 60° is about 15 to 35. In some embodiments, the haze of the visual enhancement structure 210 is about 20 to 40. In some embodiments, the transmittance (T%) of the visual enhancement structure 210 for light at a wavelength of 550 nm is greater than about 88%. In some embodiments, the arithmetic mean roughness (Ra) of the visual enhancement structure 210 is about 0.5 μm to about 1.1 μm. In some embodiments, the mean width of the profile element (RSm) of the visual enhancement structure 210 is less than about 250 μm.
[0121] Please refer to Figure 9 This is a schematic diagram illustrating a touch assembly 300A according to another embodiment of the present disclosure. Figure 9 As shown, in this embodiment, the touch assembly 300A includes a protective cover 110, a first adhesive layer 120, a conductive layer 13L, a second adhesive layer 140, and a visual enhancement structure 310, wherein the protective cover 110, the first adhesive layer 120, the conductive layer 13L, and the second adhesive layer 140 are the same as... Figure 8 The implementation methods shown are not described in detail here. Compared to Figure 8 In the illustrated embodiment, the visual enhancement structure 310 includes a polarizer 311. The visual enhancement structure 310 is stacked on the side of the conductive layer 13L near the protective cover plate 110. Specifically, the polarizer 311 is stacked between the protective cover plate 110 and the first adhesive layer 120. The polarizer 311 can convert ambient light, which originally has a chaotic direction of light wave vibration, into polarized light. The polarizer 311 can effectively filter out glare caused by light reflection, thereby improving visual clarity.
[0122] Please refer to Figure 10 This is a schematic diagram illustrating a touch assembly 300B according to another embodiment of the present disclosure. Figure 10As shown, in this embodiment, the touch assembly 300B includes a protective cover 110, a first adhesive layer 120, a conductive layer 13L, a second adhesive layer 140, and a visual enhancement structure 310, wherein the protective cover 110, the first adhesive layer 120, the conductive layer 13L, and the second adhesive layer 140 are the same as... Figure 9 The implementation methods shown are not described in detail here. Compared to Figure 9 In the embodiment shown, the visual enhancement structure 310 is stacked on the side of the conductor layer 13L away from the protective cover plate 110. Specifically, the visual enhancement structure 310 is stacked on the side of the second adhesive layer 140 away from the conductor layer 13L, but it can still achieve the effect of filtering out glare to improve visual clarity.
[0123] Please refer to Figure 11 This is a schematic diagram illustrating a touch assembly 300C according to another embodiment of the present disclosure. Figure 10 As shown, in this embodiment, the touch assembly 300C includes a protective cover 110, a first adhesive layer 120, a conductive layer 13L, a second adhesive layer 140, and a visual enhancement structure 310A, wherein the protective cover 110, the first adhesive layer 120, the conductive layer 13L, and the second adhesive layer 140 are the same as... Figure 9 The implementation methods shown are not described in detail here. Compared to Figure 9 In the illustrated embodiment, the visual enhancement structure 310A further includes a phase retardation film 312. The phase retardation film 312 is disposed on the polarizer 311. Specifically, the phase retardation film 312 is disposed on the side of the polarizer 311 furthest from the near-protective cover plate 110. Ambient light, after passing through the polarizer 311, becomes linearly polarized light with only one vibration direction. The phase retardation film 312, for example, is a quarter-wavelength plate, which allows two mutually perpendicular vibrational components of the transmitted light to generate a quarter-wavelength phase difference, thus converting the linearly polarized light into circularly polarized light. When ambient light passing through the visual enhancement structure 310A is reflected by the conductive layer 13L, it is filtered out again by the visual enhancement structure 310A, thereby effectively reducing ambient light reflection and improving the contract ratio of the image displayed by the touch assembly 300C.
[0124] Please refer to Figure 12 as well as Figure 13 . Figure 12 A schematic diagram illustrating a touch assembly 400 according to another embodiment of the present disclosure. Figure 13 A cross-sectional view of the bent conductor 130 and the visual improvement structure 410 according to an embodiment of this disclosure is shown. Figure 12 and Figure 13As shown, in this embodiment, the touch assembly 400 includes a protective cover 110, a first adhesive layer 120, a conductive layer 13L, a second adhesive layer 140, and a visual enhancement structure 410, wherein the protective cover 110, the first adhesive layer 120, the conductive layer 13L, and the second adhesive layer 140 are the same as... Figure 11 The implementation methods shown are not described in detail here. Compared to Figure 11 In the embodiment shown, the visual enhancement structure 410 includes a polarizing layer 411 and a retardation film 412. The retardation film 412 covers the outer coating 132 of each bent conductor 130. The polarizing layer 411 covers the retardation film 412. The polarizing layer 411 and the retardation film 412 have the same or similar functions. Figure 11 The polarizer 311 in the image is omitted here. In this way, when ambient light is reflected by the conductor layer 13L through the visual enhancement structure 410, it will be filtered out again by the visual enhancement structure 410, thereby effectively reducing the reflection of ambient light and improving the contrast of the image displayed by the touch assembly 400.
[0125] From the detailed description of the specific embodiments disclosed above, it is evident that in the touch assembly of this disclosure, since each bent wire is a wire containing a conductive inner core and an outer coating layer, it can be fabricated in the touch assembly using a winding technique, thereby eliminating the high pollution and high energy consumption problems of the conventional complex process using indium tin oxide (ITO) as a transparent electrode. By limiting the thickness and initial adhesion of the first adhesive layer within a specific range, the problem of skipping wires relative to the first adhesive layer during the winding process can be effectively avoided. In the manufacturing method of the touch assembly of this disclosure, by transferring the combination of the first adhesive layer, the bent wire, and the second adhesive layer to the protective cover plate after the lamination process of the second adhesive layer, the problem of high temperature during the lamination process damaging the black matrix layer on the protective cover plate can be effectively avoided. Furthermore, by laminating the bent wire between the first adhesive layer and the second adhesive layer, the gap between the bent wires can be filled by the first adhesive layer and the second adhesive layer, thereby effectively reducing the visibility of the bent wires when viewed from the side of the second adhesive layer (i.e., reducing the generation of shadows). By incorporating visual enhancement structures for each curved wire in the touch assembly, the problem of grid patterns appearing when viewing the touch assembly in high-brightness environments can be effectively solved.
[0126] Although the present disclosure has been described above with reference to embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various modifications and refinements without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the appended claims.
Claims
1. A touch assembly, characterized in that, Include: One protective cover; A first adhesive layer is disposed on the protective cover plate, wherein the thickness of the first adhesive layer is in the range of 20 μm to 200 μm; A conductor layer comprising a plurality of bent conductors disposed on the first adhesive layer, the plurality of bent conductors comprising a first group of conductors extending along a first direction and a second group of conductors extending along a second direction and overlapping the first group of conductors, wherein each of the plurality of bent conductors comprises a conductive inner core and an outer cover layer. A second adhesive layer covers the plurality of curved wires and the first adhesive layer; as well as A visually improved structure corresponds to each of the plurality of curved wires in a stacking direction of the protective cover and the wire layer.
2. The touch assembly as described in claim 1, characterized in that, The visual enhancement structure is an anti-glare film layer disposed on the protective cover.
3. The touch assembly as described in claim 1, characterized in that, The visual enhancement structure includes a polarizer.
4. The touch assembly as described in claim 3, characterized in that, The visual enhancement structure is stacked on the side of the conductor layer near the protective cover.
5. The touch assembly as described in claim 3, characterized in that, The visual enhancement structure is stacked on the side of the conductor layer away from the protective cover.
6. The touch assembly as described in claim 3, characterized in that, The visual enhancement structure further includes a retardation film disposed on the polarizer.
7. The touch assembly as described in claim 1, characterized in that, Each of the plurality of curved conductors is an enameled wire.
8. The touch assembly as described in claim 1, characterized in that, The visual enhancement structure includes a polarizing layer that covers the outer layer of each of the plurality of curved conductors.
9. The touch assembly as described in claim 8, characterized in that, The visual enhancement structure further includes a retardation film covering the outer layer of each of the plurality of curved conductors, and the polarizing layer covering the retardation film.
10. The touch assembly as claimed in claim 1, characterized in that, The material of the outer coating is selected from the group consisting of polyvinyl alcohol formaldehyde, polyurethane, polyamide, polyester, polyester-polyimide, polyamide-polyimide and polyimide.