Method and system for detecting production quality of patch magnet display screen soft module

Abstract

The invention relates to the technical field of display screens, in particular to a patch magnet display screen soft module production quality detection method and a patch magnet display screen soft module production quality detection system, the method is based on surface mounting process behavior information and takes the surface mounting process behavior information as an important priori condition for analyzing a magnetic flux distribution state after surface mounting, so that the surface mounting quality is comprehensively judged; the behavior description reflecting the contact state change of the magnet and the soft module is constructed in the mounting process to form the risk state identifier of the mounting process, so that the detection after the mounting is completed does not depend on the result characteristics in an isolated manner any more, and the judgment is performed in combination with the stability of the mounting process; the method comprises the following steps: acquiring magnetic flux distribution characteristics of a patch magnet on a soft module in a non-contact manner, analyzing magnetic flux distribution under the constraint of a risk state in a mounting process, and distinguishing fitting abnormity caused by process instability and result abnormity caused by spatial position deviation; through fusion of the risk state in the mounting process and the magnetic flux state after mounting, clear judgment and result output of the mounting quality of the patch magnet are realized.

Description

Technical Field

[0001] This invention relates to the technical field of display screens, and more particularly to a method and system for quality inspection in the production of surface mount magnetic display screen soft modules. Background Technology

[0002] With the continuous maturation of flexible display technology, flexible display modules are widely used in smart terminals and wearable devices due to their bendability and thinness.

[0003] In such flexible module structures, surface-mount magnets typically serve as crucial connecting and fixing components between the module and external structures. Their mounting quality directly impacts the overall assembly accuracy and reliability. Due to the inherent flexibility of flexible modules, magnets undergo material deformation, springback, and changes in contact state during mounting, resulting in significant dynamic characteristics that easily lead to issues such as incomplete mounting, insufficient adhesion, positional misalignment, or post-mount instability. Existing production inspection methods primarily focus on post-mount result inspection, such as visually identifying magnet positions or judging adhesion status using single physical quantities. However, these methods often fail to reflect the true behavioral characteristics during the mounting process and are more prone to misjudgment when the flexible module surface is deformed, reflective, or structurally complex. Furthermore, without supporting process information, it is difficult to accurately distinguish the causes of abnormal results after mounting—whether they are due to instability during the mounting process or deviations in magnet position or posture—thus limiting the reliability and interpretability of the inspection conclusions.

[0004] Therefore, in the automated production process of soft module patch magnets, there is an urgent need for a quality inspection method that can simultaneously acquire information on the behavior of the mounting process and correlate it with the post-mounting state detection results, so as to achieve effective identification and accurate judgment of mounting defects. Summary of the Invention

[0005] The purpose of this invention is to provide a method and system for quality inspection of patch magnet display screen soft modules, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] A method for quality inspection of a patch magnet display screen soft module, characterized by comprising the following steps:

[0008] When the mounting head begins to move toward the soft module and prepares to press the magnet, the contact response data output by the sensing structure inside the mounting head is collected and collected throughout the entire mounting action until the mounting action ends and the magnet enters a stable bonding state. By recording the contact response data in chronological order, the contact behavior sequence of the entire mounting process is obtained, and the bonding behavior curve is obtained after relativizing it.

[0009] During the mounting process of the display soft module patch magnet, the transient change sequence of elastic rebound or local unstable contact generated by the soft module during the pressing process and the mounting process risk score are calculated by the bonding behavior curve, and the mounting process risk status indicator is output. Then, the risk status indicator along with the corresponding mounting sequence number is written into the detection record of the current station.

[0010] The risk status identifier is read by the magnetic flux detection station, the magnetic flux data of the same soft module is analyzed, and then the post-mount status analysis quantity is constructed to output the post-mount magnetic flux status judgment result.

[0011] Combining the risk status identification and magnetic flux status determination results, a placement quality score is calculated to comprehensively reflect the combined impact of the placement process and the placement result. The placement quality score is then mapped into a structured placement quality result code, and the placement quality result is output.

[0012] Preferably, the contact behavior sequence is represented as a bonding behavior curve, which is used to reflect the overall contact state changes between the mounting head and the magnet and soft module in real time.

[0013] More preferably, the relativization process includes using the contact response values ​​corresponding to the start stage of the mounting action and the completion of the mounting action and the entry into the stable bonding stage as references to map the bonding behavior curve to obtain a relative bonding behavior curve.

[0014] Preferably, the transient change sequence is used to characterize the average fluctuation level at the end of the mounting process, and to measure whether the system smoothly enters a stable bonding state. The mounting process risk score is used to quantify the phenomenon of edge asymmetry or local poor bonding in the magnetic flux distribution.

[0015] Preferably, a placement process risk status identifier is output based on the placement process risk score. The placement process risk status identifier is generated by comparing the placement process risk score with the risk threshold in the process formula. The threshold is determined by the distribution of qualified samples of the soft module of this model and the patch magnet of this specification. When the placement process risk score is greater than the risk threshold, the output placement process risk status identifier is 1, indicating that there is a risk in the placement process; otherwise, the output placement process risk status identifier is 0, indicating that there is no risk in the placement process.

[0016] Preferably, the magnetic flux data is acquired by a magnetic flux sensing array, which consists of multiple magnetic sensing units fixedly mounted on a detection fixture in a two-dimensional grid manner. The soft module is positioned on the fixture by a positioning structure, and the area where the patch magnet is located corresponds one-to-one with the array sampling area. During acquisition, the soft module remains in a natural and flat state on the fixture, and the array synchronously outputs the magnetic flux response at each sampling position to form a two-dimensional magnetic flux distribution.

[0017] Preferably, the determination step for the magnetic flux state determination result after mounting specifically includes:

[0018] The status resolution is compared with the judgment range of the product model. When the status resolution falls into the normal range, it indicates that the magnetic flux status is normal after mounting. When the status resolution falls into the offset-dominant range, it indicates that the mounting position or posture deviation is significant. When the status resolution increases significantly and the asymmetry term dominates when the magnetic flux status judgment result is a risky state after mounting, it indicates that the magnetic flux morphology is abnormal due to insufficient bonding.

[0019] Preferably, in the process of mapping the placement quality score to a structured placement quality result code, the mapping relationship is as follows:

[0020] ;

[0021] in, Code the mounting quality results; and These are the quality assessment thresholds, corresponding to the dividing points of stable compliance, existence of risk, and clear failure, respectively.

[0022] Better At this time, the corresponding magnet can directly proceed to the next process; At that time, the corresponding status needs to be recorded or enter the further inspection process; This corresponds to a failure state that needs to be marked or offloaded.

[0023] In another aspect of the present invention, a production quality inspection system for patch magnet display soft modules is also provided, comprising:

[0024] The contact behavior data acquisition module is used to acquire contact response data output by the sensing structure inside the placement head when the placement head starts to move towards the soft module and prepares to press the magnet. The acquisition continues throughout the entire placement action until the placement action ends and the magnet enters a stable bonding state. By recording the contact response data in chronological order, the contact behavior sequence of the entire placement process is obtained, and the bonding behavior curve is obtained after relativization.

[0025] The chip magnet mounting process risk assessment module is used to calculate the transient change sequence of elastic rebound or local unstable contact generated by the soft module during the pressing process and the mounting process risk score through the bonding behavior curve during the mounting process of chip magnets of display soft module. It outputs the mounting process risk status indicator and then writes the risk status indicator along with the corresponding mounting sequence number into the detection record of the current station.

[0026] The patch magnet flux distribution detection module is used to read the risk status indicator through the flux detection station, analyze the flux data of the same soft module, and then construct the post-mount status analysis quantity to output the post-mount flux status judgment result.

[0027] The quality result judgment output module is used to combine the risk status identifier and the magnetic flux status judgment result to calculate the placement quality score, which comprehensively reflects the combined influence of the placement process and the placement result, and maps the placement quality score into a structured placement quality result code to output the placement quality result.

[0028] Compared with the prior art, the beneficial effects of the present invention are:

[0029] This invention proposes a production quality inspection method and system for the mounting of surface mount magnets in flexible display modules. This method is based on behavioral information from the mounting process, using it as a crucial prior condition for analyzing the magnetic flux distribution after mounting, thereby achieving a comprehensive judgment of mounting quality. By constructing a behavioral description reflecting the changes in the contact state between the magnet and the flexible module during the mounting process, a risk status indicator for the mounting process is formed. This ensures that post-mount inspection no longer relies solely on result features but incorporates the stability of the mounting process for judgment. Furthermore, this invention utilizes a non-contact method to acquire the magnetic flux distribution characteristics of the surface mount magnet on the flexible module and analyzes the magnetic flux distribution under the constraint of the risk status during the mounting process, thereby distinguishing between bonding anomalies caused by process instability and result anomalies caused by spatial position deviations. Finally, by unifying and integrating the risk status of the mounting process and the magnetic flux state after mounting, a clear judgment and result output of the surface mount magnet mounting quality are achieved. Attached Figure Description

[0030] Figure 1 This is a flowchart of a production quality inspection method for a patch magnet display soft module according to a specific embodiment of the present invention;

[0031] Figure 2 A diagram illustrating the composition of a production quality inspection system for a patch magnet display soft module according to a specific embodiment of the present invention. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] refer to Figure 1 As shown, this invention proposes a method for quality inspection in the production of surface-mount magnet display screen soft modules, comprising:

[0034] S1: When the placement head begins to move towards the soft module and prepares to press the magnet, contact response data output by the sensing structure inside the placement head is collected and collected throughout the entire placement process until the placement process ends and the magnet enters a stable bonding state. By recording the contact response data in chronological order, a contact behavior sequence of the entire placement process is obtained. After relativization, a bonding behavior curve is obtained, which specifically includes:

[0035] In actual production, surface mount magnets are typically picked up by the mounting head of the mounting equipment and pressed onto predetermined positions on the flexible display module. Because the flexible module itself has significant flexibility, its surface deforms over time when subjected to pressure. This deformation directly affects the contact state of the magnets during the mounting process. Therefore, the contact response sensed by the mounting head throughout the pressing process is not instantaneous or static, but a continuously changing process signal. This step utilizes the contact response signal naturally generated by the mounting equipment during the mounting operation to construct data.

[0036] The internal sensing structure of the mounting head is a sensing unit used to sense changes in the contact state during the mounting process. It can sense the contact state between the mounting head and the magnet and the display soft module based on changes in pressure, displacement, or strain.

[0037] During the process of mounting the magnet onto the flexible module, as the contact state between the mounting head and the magnet and the flexible module changes from initial contact, gradual pressing, to stable bonding, the contact response signal output by the sensing structure changes continuously. The contact response signal can be a continuously changing analog signal or a sampled digital signal, and its trend reflects the dynamic changes in the contact state during the mounting process.

[0038] By recording the contact response signals in chronological order, a contact behavior sequence reflecting the entire mounting process is formed. After processing, the contact behavior sequence yields a bonding behavior curve, which is used to characterize the changes in contact state over time during the mounting process.

[0039] Specifically, when the placement head begins to move towards the flexible module and prepares to press the magnet, contact response data output by the sensing structure inside the placement head is collected. This data collection continues throughout the entire placement process until the placement is completed and the magnet reaches a stable bonding state. By recording the contact response data in chronological order, a complete sequence of contact behaviors describing the entire placement process can be obtained.

[0040] This contact behavior sequence is represented as an adhesion behavior curve. , This represents the sequence of contact behavior responses over time, continuously collected by the mounting equipment during the mounting process of the chip magnet in the flexible module of the display screen; It indicates the time sequence of the mounting action, used to maintain the order of changes in contact behavior. The specific values ​​are derived from the contact sensing structure inside the placement head, which reflects the changes in the overall contact state between the placement head, the magnet, and the soft module in real time during the placement process.

[0041] Under different mounting equipment or different production cycle conditions The absolute amplitude may vary, and this difference does not directly reflect the mounting quality itself, but rather stems from changes in equipment status or process conditions. To avoid these non-essential factors interfering with subsequent analysis, this step relativizes the bonding behavior curve, ensuring it retains only the changing trend of the contact state during the mounting process.

[0042] The specific processing method is to use the contact response values ​​corresponding to the start stage of the mounting action and the completion of mounting and entering the stable bonding stage as references to map the entire bonding behavior curve, thereby obtaining a relative bonding behavior curve:

[0043] ;

[0044] in, This represents the fitting behavior curve after relativization. This represents the contact response value at the beginning of the placement process. This value is taken from the response state when the placement head has not yet effectively pressed the magnet. This indicates the contact response value corresponding to the end of the mounting process and the stable bonding state between the magnet and the soft module. This value reflects the final contact state after the mounting process is completed.

[0045] Through the above processing, the bonding behavior curves obtained from different devices and batches can be compared on the same scale, while the key features caused by the deformation of the soft module and the change of the magnetic pressing state during the bonding process are still completely preserved.

[0046] For example, under normal mounting conditions, The curve typically exhibits a smooth and continuous change pattern; however, when there are problems such as insufficient pressing, localized springback, or unstable contact, the curve is more likely to show abnormal fluctuations, sudden changes in the rate of change, or premature entry into the unstable region. Step S1 obtains the relative bonding behavior curve of the patch magnet during the display soft module mounting process. This curve fully records the contact characteristics of a single mounting operation in a soft module scenario.

[0047] S2: During the mounting process of the display screen flexible module patch magnet, the transient change sequence of elastic rebound or local unstable contact generated by the flexible module during the pressing process and the mounting process risk score are calculated through the bonding behavior curve. The mounting process risk status indicator is then output and written into the current station's inspection record along with the corresponding mounting sequence number. Specifically, this includes:

[0048] In the mounting process of the display screen soft module patch magnet, the flexible deformation of the soft module will cause the mounting process to exhibit two types of process characteristics that are most sensitive to quality: one is the instantaneous instability that occurs during the pressing process (such as local rebound, contact break); the other is the "convergence quality" (i.e. whether it can smoothly enter the stable section) when the pressing end enters the stable bonding.

[0049] These characteristics are often difficult to accurately attribute based solely on the final appearance or a single measurement after mounting. Therefore, the goal of S2 is to transform a process curve into a process risk status that can be used for process judgment. By performing risk judgment on the mounting process for soft module scenarios and using the judgment results as an important prior condition for the next step of analyzing the post-mounted state, the subsequent interpretation of magnetic flux distribution characteristics can distinguish between instability caused by the process and deviation caused by spatial position.

[0050] Fitting Behavior Curve A complete record of the entire process corresponding to one placement action. The sampling order of the placement actions increases sequentially. The effective range of the placement action is naturally determined by the cycle time of the placement equipment, and is used to capture the entire time period from when the placement head enters the laminating chamber to when it leaves the laminating chamber. This range is defined by... This indicates that the specific acquisition method is the set of sampling indices corresponding to the start and end time markers output by the mounting equipment when performing the pressing action.

[0051] The first source of risk in the mounting process is the elastic rebound or localized unstable contact of the soft module during the lamination process. This phenomenon occurs in... This often manifests as "reverse changes within a short period" or "jitter before reaching a stable phase." To highlight this type of risk, this step decomposes the changes between adjacent sampling points, giving "reverse changes" a higher weight in the risk measurement. The transient change sequence of the mounting process is defined as follows:

[0052] ;

[0053] in, Indicates the intensity of transient changes between adjacent sampling points; and All are curves; This indicates the magnitude of a "reverse change" in the bonding behavior, which corresponds to contact retraction or local instability caused by the rebound of the soft module. The weighting coefficient is used to amplify the reverse change in risk assessment, so that the most critical rebound instability in the soft module scenario can be stably captured. As set by the process, among which To amplify the contribution of "reverse change" to the intensity of transient changes, the value range is set to... The preferred range is , The value of α is determined through trial production calibration: sample data of the same model of soft module and the same specification of chip magnet are taken, including normal mounting samples and known springback / false mounting samples. Within the candidate interval, α is traversed at a fixed step size, and the corresponding transient change intensity sequence and risk score are calculated respectively. The value of α that prevents misjudgment of the reverse change of normal mounting samples while significantly highlighting the reverse change characteristics of springback / false mounting samples is selected, and this value of α is written into the parameter configuration file of the equipment or detection system for subsequent mass production. The process in this application refers to the set of production parameter configurations related to the mounting of chip magnets for display soft modules, including mounting cycle time, pressing stroke, pressing stage division, and corresponding data processing parameters.

[0054] The calibration was based on trial production data from the same model of soft module and the same specification of surface mount magnet. The calibration method was to select a range of values ​​in normal mounting samples that would prevent reverse changes from being misjudged and that would significantly distinguish reverse changes in known poor mounting or springback samples, and then solidify these values ​​in the equipment formulation file.

[0055] The second source of risk in the mounting process is the convergence quality during the stable bonding phase. In soft module scenarios, even without significant reverse changes at the end of the pressing stage, continuous small fluctuations may occur, causing the magnet to be pressed into place but the bonding edge to remain unstable. This type of risk typically manifests in engineering as subsequent magnetic flux distribution issues such as edge asymmetry and localized incomplete bonding. To illustrate this, this step... Stable candidate interval for the final stage of placement The method of obtaining it is: in Internal selection The last sampling window that enters and holds the high bit (e.g., taking) (A set of sampling points after the initial entry into and sustained high-level intervals), this window is determined by the mounting cycle time and curve shape. Subsequently, the transient change sequence is summarized at the entire process and at the end to construct a process risk score:

[0056] ;

[0057] in, Risk score for the mounting process; It can depict the most serious unstable event in the entire pressing process, and is used to capture sudden risks such as springback, instantaneous breakage, and slippage. The average fluctuation level at the end of the mounting process is used to measure whether the system smoothly enters a stable bonding state. This represents the number of sampling points in the final sampling window; This is a weighting coefficient used to adjust the proportion of "final convergence quality" in the overall risk. Similarly, this process is incorporated into the formulation and calibrated by comparing normal mounting samples with known edge-laden mounting samples. Specifically, during the trial production phase, a batch of normally mounted parts (confirmed by magnetic flux testing after mounting to be in the correct position and with proper bonding) and a batch of parts with confirmed edge-laden mounting (confirmed by rework / disassembly to have poor edge bonding) are selected. For each part, the entire pressing segment and the final segment window of the bonding behavior curve are extracted according to the same rules. Then, two fixed quantities are calculated: the first is the maximum value of transient change intensity in the entire pressing segment, and the second is the average value of transient change intensity in the final segment window. Subsequently, the median of the "maximum value" and the median of the "final segment average value" of the normal samples are taken, and the ratio of the two is used as the weighting coefficient. This ensures that under normal mounting conditions, the magnitudes of the two terms in the risk score are at the same level, preventing the final segment term from being completely submerged or excessively dominant. The confirmed edge-laden mounting samples are then used for verification to confirm that under this value, the contribution of the final segment average value to the total risk score increases steadily, and the maximum value term still reflects sudden unstable events. Finally, this weighting coefficient is written as a parameter configuration into the device or testing system configuration file, loaded with model switching, and used permanently in mass production.

[0058] To ensure that the final stage fluctuations contribute steadily to the risk score without masking sudden risks, β is used to adjust the proportion of "final stage convergence quality" (final stage average fluctuations) in the risk score. Its value can be set from 0.5 to 3.00, preferably from 1.5 to 3.0. When β is smaller, the risk score is more inclined to capture sudden unstable events; when β is larger, the risk score is more sensitive to sustained small fluctuations in the final stage, and more easily reflects the risk of "incomplete convergence in the final stage of compression."

[0059] Based on risk score Output risk status indicators for the mounting process The risk status labeling during the mounting process. The generation method is to use risk scores The risk score is obtained by comparing it with the risk threshold in the process formulation. The threshold is determined by the distribution of qualified samples of the soft module and the patch magnet of the specified specification, and is loaded as the equipment formulation changes with the product model. When the risk score of the mounting process is greater than the risk threshold, the output mounting process risk status identifier is 1, indicating that there is a risk in the mounting process; otherwise, the output mounting process risk status identifier is 0, indicating that there is no risk in the mounting process.

[0060] In terms of engineering implementation, the placement equipment immediately receives [data / information] after each placement operation. Calculated based on this and And generate risk status identifiers Then the risk status will be marked. The corresponding placement serial number is written into the detection record of the current station for use in the next step when analyzing the magnetic flux distribution after placement, so that when the same magnetic flux anomaly characteristics appear, it can be distinguished whether it is more likely to be caused by process instability or position deviation.

[0061] S3: By reading the risk status identifier through the magnetic flux detection station, the magnetic flux data of the same soft module is analyzed, and then a post-mount status resolution value is constructed to output the post-mount magnetic flux status judgment result, specifically including:

[0062] The goal of S3 is to analyze the spatial state of the surface mount magnets after they have been mounted, using magnetic flux distribution detection to determine the state results that can be used for quality assessment.

[0063] In the context of flexible display modules, the abnormal sources of magnetic flux distribution typically present two paths: one is related to the geometric position and orientation deviation of the magnet on the flexible module; the other is related to insufficient bonding caused by deformation and springback of the flexible module during the mounting process. The risk assessment derived from the mounting process curve naturally carries information about "whether the process is stable". This step uses it as a constraint condition for magnetic flux distribution analysis, so that magnetic flux anomalies are not only detected, but also automatically enhanced sensitivity to anomalies such as "insufficient bonding caused by process risks" during analysis, thus better aligning with the actual failure mechanism of the patch magnet-soft module.

[0064] Risk status identification in production line implementation. The magnetic flux detection station reads the identifier associated with the placement operation and stores it along with the placement cycle time. Then, it analyzes the magnetic flux data for the same soft module. The magnetic flux data is acquired by a magnetic flux sensing array, which consists of multiple magnetic sensing units fixedly mounted on a testing fixture in a two-dimensional grid. The soft module is positioned on the fixture using a positioning structure, and the area where the patch magnet is located corresponds one-to-one with the array's sampling area.

[0065] During data acquisition, the soft module remains naturally flat on the fixture, and the array synchronously outputs the magnetic flux response at each sampling position, forming a two-dimensional magnetic flux distribution. . The spatial index of the array is represented by the corresponding relationship, which is fixed by the fixture positioning structure during the equipment assembly and adjustment stage to ensure that the sampling area of ​​the same model of soft module is consistent in each test.

[0066] Magnetic flux distribution Under normal mounting conditions, surface mount magnets typically exhibit stable spatial structure characteristics. When the magnet shifts as a whole, it will manifest as a shift in the overall center of gravity of the spatial distribution. When the magnet is tilted or there is insufficient local bonding, it is more likely to manifest as local enhancement / weakening and asymmetrical distribution.

[0067] To capture both types of features simultaneously within a unified analytical framework, step S3 decomposes the magnetic flux distribution into a combination of a position term and an asymmetry term, where the asymmetry term is associated with the risk state identifier. Adaptive enhancement automatically increases the focus on local fitting anomalies during the analysis of process risk samples. Specifically, it first... Calculate the spatial centroid of magnetic flux distribution and the second-order morphological matrix around the center of gravity Both are used to describe "overall offset" and "morphological asymmetry":

[0068] ;

[0069] ;

[0070] in, Indicates the magnetic flux sensing array at the index position The acquired magnetic flux response value; The spatial centroid of magnetic flux distribution is used to reflect the overall spatial offset trend after the patch magnet is mounted. Indicates surrounding The second-order morphological matrix is ​​used to reflect the extent of expansion and symmetry differences of magnetic flux distribution in different directions. and Completely through the acquisition of two-dimensional magnetic flux distribution The calculation shows that the summation range required is the array sampling window corresponding to the magnet, which is fixed by the fixture positioning structure.

[0071] Risk status identification Under constraints, construct the state resolution after mounting. The first part uses Reference Center The offset measures the overall positional deviation, and the second part uses... The anisotropy characterizes the asymmetric magnetic flux distribution pattern, and is correlated with risk status indicators. The multiplicative weighting terms transform "process risk" into an enhancing factor for asymmetric features, thus better reflecting the reality in soft module scenarios where "process instability is more likely to lead to insufficient local fit":

[0072] ;

[0073] in, The reference magnetic flux center of gravity position is obtained by solidifying the statistical results of qualified samples of the same type of soft module and the same specification of patch magnet on the testing fixture; and They are respectively The maximum and minimum eigenvalues ​​are used to measure the morphological differences of magnetic flux distribution in different directions. The closer the morphology is to symmetry, the smaller the ratio. To identify the risk status of the mounting process, used to enhance sensitivity to asymmetry when process risks exist; This is a process formulation coefficient used to balance the effects of the "overall offset term" and the "morphological asymmetry term"; This is a stabilizing term used to prevent unstable calculations in the denominator under certain conditions. and All are provided by the device file and are loaded as the model changes.

[0074] λ and ε are parameter configuration items of the detection system. λ is used to balance the weights of the "overall offset term" and "morphological asymmetry term" in the resolution, while ε is used to maintain calculation stability when the denominator is close to zero or the sample response is extremely weak. The method for determining λ and ε is as follows: during the trial production phase of the same model of soft module and the same specification of patch magnet, magnetic flux distribution data of qualified samples are collected and the corresponding resolution is calculated. A value of λ is selected that ensures stable resolution distribution of qualified samples and distinguishes the asymmetry term from locally dummy samples. Simultaneously, ε is set to a fixed small constant to avoid unstable calculations. Finally, λ and ε are written into the parameter configuration file of the magnetic flux detection station and are automatically loaded and called by the detection system when switching product models.

[0075] Based on resolution Output the magnetic flux status determination result after mounting In engineering implementation, the detection system will... Compare with the judgment range of this product model: when the resolution When the magnetic flux status falls within the normal range, the result of the magnetic flux status determination after mounting is obtained. This indicates that the magnetic flux status is normal after mounting; when the resolution... When falling into the offset-dominant region, the result of the magnetic flux state determination after mounting. This indicates a significant deviation in mounting position / or orientation; when the resolution... Magnetic flux status determination results after mounting When the risk level is significantly increased and the asymmetry term dominates, the result of the magnetic flux status determination after mounting is as follows: This indicates an abnormal magnetic flux morphology caused by insufficient bonding. This range is given by the process formula and is derived from the statistical boundary of samples of the same type of soft module under this fixture and array configuration, and can be solidified in the production line as configuration parameters.

[0076] S4: Combine the risk status identifier and the magnetic flux status determination result, calculate the mounting quality score to comprehensively reflect the combined influence of the mounting process and the mounting result, and map the mounting quality score to a structured mounting quality result code, and output the mounting quality result, specifically including:

[0077] The goal of this step S4 is to convert the results obtained in the previous steps into a mounting quality conclusion that can be directly understood and used on the production line. For the patch magnets of the display soft module, what the production site really cares about is not whether the "process is stable" or "whether the magnetic flux is abnormal" itself, but whether this magnet can be judged as qualified, whether there is a risk that needs further processing, or whether it has been clearly failed. This step precisely focuses on this actual need to conduct a combined determination of the risk status of the mounting process and the magnetic flux status after mounting.

[0078] In practical applications, different combinations of the magnetic flux status determination results after mounting and the risk status identifier correspond to different engineering meanings. For example, when the mounting process is stable and the magnetic flux status is abnormal, it is more likely that the magnet has deviated in position or attitude after mounting; when there is a risk in the mounting process and the magnetic flux status is also abnormal, it usually means that there are problems such as poor adhesion or local warping of the magnet on the surface of the soft module; and when there is a risk in the mounting process but the magnetic flux status is still within the acceptable range, it is closer to the state of "potential risks not yet manifested". It is often difficult to uniformly handle such differences through simple logical judgments. Therefore, this step adopts a unified quality scoring method to integrate the two types of states into the same determination scale.

[0079] Specifically, this step takes and as input quantities, and calculates the mounting quality score , which is used to comprehensively reflect the combined influence of the mounting process and the mounting result:

[0080] ;

[0081] Among them, represents the magnetic flux status determination result after mounting, and its value comes from the analysis of the magnetic flux distribution; represents the risk status identifier of the mounting process, and its value comes from the risk determination of the mounting process curve; and are weight coefficients, which are used to adjust the relative influence of the magnetic flux status and the process risk in the final score. These two coefficients are set by the process parameters of the corresponding model before the equipment is put into production and remain unchanged during the production process; is the interaction enhancement coefficient, which is used to emphasize the compound failure situation when the mounting process risk and the magnetic flux abnormality occur simultaneously.

[0082] By introducing interactive items The quality score not only reflects the impact of a single factor, but also gives higher weight to situations where "process instability leads to abnormal bonding" in the specific scenario of soft module patch magnets. For example, when there is obvious rebound or unstable behavior during the mounting process, even if the deviation of the magnetic flux state has not yet reached the individual failure threshold, the interaction item will significantly increase the score, thus reflecting this potential risk in the final judgment.

[0083] After obtaining a quality score Then, it is further mapped into a structured mounting quality result code. The mapping process uses a fixed interval determination method. The interval boundaries are determined by historical sample data of the corresponding model display soft module and patch magnet, and are fixed in the configuration table of the detection system. The mapping relationship is as follows:

[0084] ;

[0085] in, Code the mounting quality results; and These are the quality assessment thresholds, corresponding to the dividing points of "stable and qualified," "risky," and "clearly failed," respectively. In actual production, Typically, the corresponding magnet can proceed directly to the next process. The corresponding status needs to be recorded or proceed to further inspection; This corresponds to a failure state that needs to be marked or offloaded. In engineering implementation, the system completes this within the same detection cycle. Calculation and The system generates the data and outputs the results, along with the current soft module's identification information, to the production line control system or quality record system.

[0086] refer to Figure 2 As shown, in the second invention of this invention, a production quality inspection system for patch magnet display soft modules is proposed, comprising:

[0087] The contact behavior data acquisition module is used to acquire contact response data output by the sensing structure inside the placement head when the placement head starts to move towards the soft module and prepares to press the magnet. The acquisition continues throughout the entire placement action until the placement action ends and the magnet enters a stable bonding state. By recording the contact response data in chronological order, the contact behavior sequence of the entire placement process is obtained, and the bonding behavior curve is obtained after relativization.

[0088] The chip magnet mounting process risk assessment module is used to calculate the transient change sequence of elastic rebound or local unstable contact generated by the soft module during the pressing process and the mounting process risk score through the bonding behavior curve during the mounting process of chip magnets of display soft module. It outputs the mounting process risk status indicator and then writes the risk status indicator along with the corresponding mounting sequence number into the detection record of the current station.

[0089] The patch magnet flux distribution detection module is used to read the risk status indicator through the flux detection station, analyze the flux data of the same soft module, and then construct the post-mount status analysis quantity to output the post-mount flux status judgment result.

[0090] The quality result judgment output module is used to combine the risk status identifier and the magnetic flux status judgment result to calculate the placement quality score, which comprehensively reflects the combined influence of the placement process and the placement result, and maps the placement quality score into a structured placement quality result code to output the placement quality result.

[0091] The above embodiments are merely descriptions of preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A method for quality inspection in the production of a patch magnet display screen soft module, characterized in that, Includes the following steps: When the mounting head begins to move toward the soft module and prepares to press the magnet, the contact response data output by the sensing structure inside the mounting head is collected and collected throughout the entire mounting action until the mounting action ends and the magnet enters a stable bonding state. By recording the contact response data in chronological order, the contact behavior sequence of the entire mounting process is obtained, and the bonding behavior curve is obtained after relativizing it. During the mounting process of the display soft module patch magnet, the transient change sequence of elastic rebound or local unstable contact generated by the soft module during the pressing process and the mounting process risk score are calculated by the bonding behavior curve, and the mounting process risk status indicator is output. Then, the risk status indicator along with the corresponding mounting sequence number is written into the detection record of the current station. The risk status identifier is read by the magnetic flux detection station, the magnetic flux data of the same soft module is analyzed, and then the post-mount status analysis quantity is constructed to output the post-mount magnetic flux status judgment result. Combining the risk status identification and magnetic flux status determination results, a placement quality score is calculated to comprehensively reflect the combined impact of the placement process and the placement result. The placement quality score is then mapped into a structured placement quality result code, and the placement quality result is output.

2. The method for quality inspection of a patch magnet display screen soft module according to claim 1, characterized in that, The contact behavior sequence is represented as a bonding behavior curve, which is used to reflect the overall contact state changes between the mounting head and the magnet and soft module in real time.

3. The method for quality inspection of a patch magnet display screen soft module according to claim 2, characterized in that, The relativization process includes mapping the bonding behavior curve to obtain a relative bonding behavior curve by using the contact response values ​​corresponding to the start stage of the mounting action and the completion of the mounting and entering the stable bonding stage as references.

4. The method for quality inspection of a patch magnet display screen soft module according to claim 1, characterized in that, The transient change sequence is used to characterize the average fluctuation level at the end of the mounting process, and is used to measure whether the system smoothly enters a stable bonding state. The mounting process risk score is used to quantify the phenomenon of edge asymmetry or local poor bonding in the magnetic flux distribution.

5. The method for quality inspection of a patch magnet display screen soft module according to claim 1, characterized in that, The risk status identifier of the mounting process is output based on the risk score of the mounting process. The risk status identifier of the mounting process is generated by comparing the risk score of the mounting process with the risk threshold in the process formula. The threshold is determined by the distribution of qualified samples of the soft module of this model and the chip magnet of this specification. When the risk score of the mounting process is greater than the risk threshold, the output risk status identifier of the mounting process is 1, indicating that there is a risk in the mounting process. Conversely, the output risk status identifier of the mounting process is 0, indicating that there is no risk in the mounting process.

6. The method for quality inspection of a patch magnet display screen soft module according to claim 1, characterized in that, The magnetic flux data is acquired by a magnetic flux sensing array, which consists of multiple magnetic sensing units fixedly mounted on a detection fixture in a two-dimensional grid. The soft module is positioned on the fixture by a positioning structure, and the area where the patch magnet is located corresponds one-to-one with the array sampling area. During acquisition, the soft module remains in a natural and flat state on the fixture, and the array synchronously outputs the magnetic flux response at each sampling position to form a two-dimensional magnetic flux distribution.

7. The method for quality inspection of a patch magnet display screen soft module according to claim 1, characterized in that, The specific steps for determining the magnetic flux state after mounting include: The status resolution is compared with the judgment range of the product model. When the status resolution falls into the normal range, it indicates that the magnetic flux status is normal after mounting. When the status resolution falls into the offset-dominant range, it indicates that the mounting position or posture deviation is significant. When the status resolution increases significantly and the asymmetry term dominates when the magnetic flux status judgment result is a risky state after mounting, it indicates that the magnetic flux morphology is abnormal due to insufficient bonding.

8. The method for quality inspection of a patch magnet display screen soft module according to claim 1, characterized in that, In the process of mapping placement quality scores to structured placement quality result codes, the mapping relationship is as follows: ； in, Code the mounting quality results; and These are the quality assessment thresholds, corresponding to the dividing points of stable compliance, existence of risk, and clear failure, respectively.

9. A method for quality inspection of a patch magnet display screen soft module according to claim 8, characterized in that, At this time, the corresponding magnet can directly proceed to the next process; At that time, the corresponding status needs to be recorded or enter the further inspection process; This corresponds to a failure state that needs to be marked or offloaded.

10. A quality inspection system for the production of surface-mount magnetic display screen soft modules, characterized in that, include: The contact behavior data acquisition module is used to acquire contact response data output by the sensing structure inside the placement head when the placement head starts to move towards the soft module and prepares to press the magnet. The acquisition continues throughout the entire placement action until the placement action ends and the magnet enters a stable bonding state. By recording the contact response data in chronological order, the contact behavior sequence of the entire placement process is obtained, and the bonding behavior curve is obtained after relativization. The chip magnet mounting process risk assessment module is used to calculate the transient change sequence of elastic rebound or local unstable contact generated by the soft module during the pressing process and the mounting process risk score through the bonding behavior curve during the mounting process of chip magnets of display soft module. It outputs the mounting process risk status indicator and then writes the risk status indicator along with the corresponding mounting sequence number into the detection record of the current station. The patch magnet flux distribution detection module is used to read the risk status indicator through the flux detection station, analyze the flux data of the same soft module, and then construct the post-mount status analysis quantity to output the post-mount flux status judgment result. The quality result judgment output module is used to combine the risk status identifier and the magnetic flux status judgment result to calculate the placement quality score, which comprehensively reflects the combined influence of the placement process and the placement result, and maps the placement quality score into a structured placement quality result code to output the placement quality result.

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