Wafer Map analysis method, wafer Map analysis device and wafer Map analysis equipment

Abstract

The invention discloses a wafer Map analysis method, device and equipment, and belongs to the technical field of Map analysis. The method comprises the following steps: acquiring a Map file of a wafer array; according to the file features of the Map file, identifying the file format type of the Map file; extracting a position identifier of the wafer array through an analysis strategy corresponding to the file format type, so as to divide the wafers in the wafer array into effective wafers and edge-invalid wafers, and determining a state mark of each wafer, the state mark of the effective wafer area being pickable, and the state mark of the edge-invalid wafer being non-pickable; and mapping the state mark corresponding to the position identifier into a state category so as to generate wafer Map data in an internal unified format, in the internal unified format, representing one wafer by two characters, separating adjacent wafers by comma, and corresponding state category and grade information of each wafer. According to the method, the system compatibility is improved, and the maintenance cost is reduced.

Description

Technical Field

[0001] This application belongs to the field of map analysis technology, and particularly relates to a wafer map analysis method, apparatus and equipment. Background Technology

[0002] In semiconductor manufacturing and packaging testing, wafers are shipped with a map file describing the status of each wafer. This map file records overall wafer parameters, including the total number of wafers, the number of good wafers, the number of defects, grade distribution, and the specific location and status of each wafer on the wafer disk. Wafer pick-up equipment relies on this map file to determine which wafers can be safely picked up, thereby avoiding the picking of defective wafers or physically incomplete edge wafers, ensuring the yield and efficiency of subsequent mounting processes.

[0003] However, there is currently no unified standard for map files in the industry, and different wafer manufacturers use significantly different file formats and content structures. Common file types include plain text (.txt), binary (.bin), Extensible Markup Language (.xml), and structured data (.json). Among them, the binary format is a proprietary format used by some manufacturers, which is difficult to parse; the plain text format varies in its internal layout, some include a detailed file header, and some directly represent the wafer layout with a character matrix, and there is no unified standard for the starting position, valid area identifier, and status symbols.

[0004] Therefore, this format fragmentation requires equipment manufacturers to develop dedicated parsing modules for each source, resulting in poor system compatibility and high maintenance costs. Summary of the Invention

[0005] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a wafer mapping analysis method, apparatus, and device, which improves system compatibility and reduces maintenance costs.

[0006] In a first aspect, this application provides a wafer map parsing method, applied to a wafer pickup device, the method comprising: Obtain the map file of the wafer array; Based on the file characteristics of the Map file, the file format type of the Map file is identified; By using the parsing strategy corresponding to the file format type, the position identifier of the wafer array is extracted to divide the wafers in the wafer array into valid wafers and edge invalid wafers, and the status marker of each wafer is determined. The status marker of the valid wafer area is "pickable", and the status marker of the edge invalid wafer is "unpickable". The location identifier is mapped to the corresponding status tag to generate a wafer map data in an internally unified format. In this internally unified format, a wafer is represented by two characters, adjacent wafers are separated by commas, and each wafer has a corresponding status category and level information.

[0007] According to one embodiment of this application, the file format type includes text format, binary format, Extensible Markup Language format, and structured data format. The step of identifying the file format type of the Map file based on its file characteristics includes: If an Extensible Markup Language (XML) declaration or tag structure is detected in the initial content of the Map file, the file format type of the Map file is determined to be the XML format. If the starting character of the Map file is a left curly brace, then the file format type of the Map file is determined to be the structured data format. When the Map image file contains a preset invisible byte sequence, the file format type of the Map image is determined to be the binary format; Excluding the binary format, Extensible Markup Language format, and structured data format, the file format type of the Map file is determined to be the text format.

[0008] According to one embodiment of this application, extracting the location identifier of the wafer array using the parsing strategy corresponding to the file format type includes: When the file format type is Extensible Markup Language (EXPLAIN), Structured Data (SMD), or Binary, the location identifier is extracted according to the internal field definition of the Map file; If the file format is text, skip the header non-layout content of the Map file and locate the starting line of the Map file to extract the position identifier. The starting line is determined by consecutively appearing edge identifiers, which include at least one of spaces, dots, underscores, wavy lines, or asterisks.

[0009] According to one embodiment of this application, dividing the wafers in the wafer array into valid wafers and edge-invalid wafers includes: When the geometric layout of the wafer array is circular, the wafers located on the outer ring of the wafer array and carrying the edge identifier are marked as edge invalid wafers; When the geometric layout type is rectangular, the effective wafer is determined based on the effective row and column range.

[0010] According to one embodiment of this application, before dividing the wafers in the wafer array into valid wafers and edge-invalid wafers, the method further includes: The characters in the first and subsequent lines of the Map file are parsed line by line, with each character corresponding to a wafer status marker; Verify the consistency of the number of characters in each line. If the number of characters in each line is inconsistent, the Map file is deemed invalid. When the number of characters in each line is consistent, the geometric layout type of the Map file is determined based on user configuration or file context, and the geometric layout type is either circular or rectangular.

[0011] According to one embodiment of this application, the state categories include pickable but not picked up, defective pixels not pickable, edge not pickable, and picked up. Mapping the state tag corresponding to the location identifier to the state category includes: The characters representing defects or failures in the original markings of the wafer are mapped to bad pixels that cannot be picked up; The characters corresponding to the starting reference point are retained as coordinate bases and do not participate in the picking decision; Update the status of the picked-up wafer to "picked"; The valid level markers retain level information and are categorized as pickable or unpickable.

[0012] According to one embodiment of this application, after generating the wafer map data in an internally uniform format, the method further includes: Receive instructions to select the target level; In response to the selection instruction, wafers of the corresponding level and whose status category is pickable but not picked up are filtered out from the internal unified format, and a pick-up task list is generated for the wafer pick-up device to execute.

[0013] Secondly, this application provides a wafer map parsing apparatus, the apparatus comprising: The acquisition module is used to acquire the map file of the wafer array; The first processing module is used to identify the file format type of the Map file based on its file characteristics; The second processing module is used to extract the position identifier of the wafer array through the parsing strategy corresponding to the file format type, so as to divide the wafers in the wafer array into valid wafers and edge invalid wafers, and determine the status mark of each wafer. The status mark of the valid wafer area is "pickable", and the status mark of the edge invalid wafer is "unpickable". The third processing module is used to map the status marker corresponding to the location identifier to a status category in order to generate wafer Map data in an internally unified format. In the internally unified format, a wafer is represented by two characters, adjacent wafers are separated by commas, and each wafer has a corresponding status category and level information.

[0014] Thirdly, this application provides a wafer picking device for performing the wafer map parsing method as described in the first aspect.

[0015] Fourthly, this application provides an electronic device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the wafer map parsing method as described in the first aspect above.

[0016] Fifthly, this application provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the wafer map parsing method as described in the first aspect above.

[0017] In a sixth aspect, this application provides a chip including a processor and a communication interface, the communication interface being coupled to the processor, the processor being used to run programs or instructions to implement the wafer map parsing method as described in the first aspect.

[0018] In a seventh aspect, this application provides a computer program product, including a computer program that, when executed by a processor, implements the wafer map parsing method as described in the first aspect above.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application.

[0020] The wafer map analysis method, apparatus, and device provided in this application have the following advantages over the prior art: (1) Through adaptive format recognition based on file features, intelligent starting line positioning of text map, effective area division of geometric layout perception, and accurate mapping from original markers to unified state categories, it realizes universal wafer picking control across manufacturers, formats, and process scenarios, and fully automatic compatible parsing of multi-manufacturer and multi-format map files; it supports automatic filtering of edge single wafers, bad pixel avoidance, level screening and batch use status tracking, which solves the problems of picking errors, equipment downtime and material waste caused by format fragmentation, inaccurate edge recognition and state semantic confusion, improves the automation level of wafer picking, process reliability and production efficiency, improves compatibility and reduces maintenance costs.

[0021] (2) By using the feature recognition mechanism based on the XML declaration, left curly brace, private magic number and other features of the file start content, the content-driven automatic judgment of the Map file format is realized instead of relying on the file extension, which improves the accuracy of format recognition. It is suitable for scenarios in industrial sites where the file naming is not standardized, the extension is missing or has been modified incorrectly, and can avoid parsing failure or data misalignment caused by format misjudgment. Attached Figure Description

[0022] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic flowchart of the wafer map parsing method provided in the embodiments of this application; Figure 2 This is a schematic diagram of the wafer map parsing device provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0024] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0025] The wafer map parsing method, wafer map parsing device, electronic device, and readable storage medium provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0026] The wafer map parsing method provided in this application embodiment is applied to a wafer pickup device (hereinafter referred to as "device").

[0027] like Figure 1As shown, the wafer map parsing method includes: Step 110: Obtain the map file of the wafer array; It is understandable that a wafer array is a circular or rectangular wafer disk composed of multiple individual wafers arranged according to specific geometric rules, and each individual wafer has a unique location identifier.

[0028] Map files are data files provided by wafer manufacturers along with wafer arrays. They are used to record the status, level, and location information of each individual wafer on the wafer array. There is no unified industry standard for their format, and the types include text format, binary format, Extensible Markup Language format, and structured data format, etc.

[0029] In step 110, after the wafer pick-up device is started, it reads the Map file corresponding to the current wafer batch from the local memory, network interface or host computer system as the raw input data for subsequent parsing.

[0030] Step 120: Identify the file format type of the Map file based on its file characteristics; Understandably, file characteristics are discriminative identifiers that map files exhibit at the byte level or in their content structure, used to distinguish different format types.

[0031] File format types include text format, binary format, Extensible Markup Language (XML) format, and structured data format, each corresponding to different parsing logic.

[0032] In step 120, the first few bytes of the Map file are read. If an XML declaration or a valid XML tag structure is detected, it is determined to be in Extensible Markup Language format; if the first character is a left curly brace "{", it is determined to be in structured data format; if it contains a preset invisible byte sequence, such as the manufacturer's proprietary magic number 0x5A5A, it is determined to be in binary format; if none of the above features appear, it is determined to be in text format by default.

[0033] Step 130: Extract the position identifier of the wafer array through the parsing strategy corresponding to the file format type, so as to divide the wafers in the wafer array into valid wafers and edge invalid wafers, and determine the status mark of each wafer. The status mark of the valid wafer area is picked up, and the status mark of the edge invalid wafer is not picked up. Understandably, a position identifier is a combination of characters used to uniquely represent the coordinates of each individual wafer on a wafer. It can use pairs of numbers and letters to represent row and column positions, such as 1A, 2B.

[0034] A valid wafer is a single wafer located in the physically intact area of ​​the wafer and available for pickup; an edge invalid wafer is a single wafer located on the outer edge of the wafer that is unusable due to incomplete cutting or being marked as faulty.

[0035] Status markers are raw characters used in the Map file to characterize the status of individual wafers. For example, G indicates a good wafer, X indicates a bad wafer, and Z indicates the starting reference point.

[0036] In step 130, if the file format is Extensible Markup Language, Structured Data, or binary format, the coordinates of individual wafers and the original status characters are directly extracted based on their internal field definitions. If it is a text format, the comments or metadata lines at the beginning of the file are skipped, and the line starting with an edge identifier such as a consecutive space, dot, underscore, tilde, or asterisk is located to be the Map starting line. Each character is parsed line by line as the status marker of the corresponding individual wafer. According to the wafer geometry layout type, the individual wafers represented by edge identifiers on the outer ring are marked as edge invalid wafers, and the rest are marked as valid wafers and assigned a preliminary status. The status marker of valid wafers is "pickable", and the status marker of edge invalid wafers is "unpickable".

[0037] Step 140: Map the status markers corresponding to the location identifiers to status categories to generate wafer Map data in an internally unified format. In the internally unified format, a wafer is represented by two characters, adjacent wafers are separated by commas, and each wafer corresponds to a status category and level information.

[0038] Understandably, the state categories are a standardized set of states defined internally by the device, including four categories: pickable but not picked up, defective pixels cannot be picked up, edge pixels cannot be picked up, and picked up, which are used to unify the control logic.

[0039] The internal unified format is a common data representation format within the device. Each wafer is represented by two characters (such as 1A) to indicate its position, adjacent wafers are separated by commas, and each wafer is associated with its status category and original level information.

[0040] In step 140, the original status markers are mapped according to preset rules, and defect characters such as X, F, and D are mapped as bad pixels that cannot be picked up; Z is retained as the coordinate reference and does not participate in the picking decision; the individual wafers that were successfully picked up in the previous operation are updated to be picked up; the remaining valid grade characters such as G, 1, and A+ retain their original values ​​as grade information and are classified as pickable and unpicked; finally, all wafers are converted into strings in the form of "1A, 1B, 1C..." in row and column order, and the status category and grade are attached to form wafer Map data with a unified internal format.

[0041] According to the wafer map parsing method provided in the embodiments of this application, through adaptive format recognition based on file features, intelligent starting line positioning of text map, effective area division with geometric layout awareness, and accurate mapping from original markers to unified state categories, it achieves universal wafer picking control across vendors, formats, and process scenarios, and fully automatic compatible parsing of multi-vendor and multi-format map files; it supports automatic edge single wafer filtering, bad pixel avoidance, grade screening, and batch usage status tracking, solving the problems of picking errors, equipment downtime, and material waste caused by format fragmentation, inaccurate edge recognition, and chaotic state semantics, improving the automation level of wafer picking, process reliability, and production efficiency, improving compatibility, and reducing maintenance costs.

[0042] In some embodiments, the file format type includes text format, binary format, Extensible Markup Language format, and structured data format. Identifying the file format type of the Map file based on its file characteristics includes: If an Extensible Markup Language (XML) declaration or tag structure is detected in the initial content of the Map file, the file format type of the Map file is determined to be the XML format. If the starting character of the Map file is a left curly brace, then the file format type of the Map file is determined to be the structured data format. When the Map image file contains a preset invisible byte sequence, the file format type of the Map image is determined to be the binary format; Excluding the binary format, Extensible Markup Language format, and structured data format, the file format type of the Map file is determined to be the text format.

[0043] Understandably, an Extensible Markup Language (XML) declaration refers to a document type declaration that begins with "xml", and a tag structure refers to paired elements enclosed in angle brackets, for example, <die> … <die>, for organizing structured data.

[0044] The left curly brace refers to the character "{" with an ASCII code of 123, which is a typical starting symbol of structured data formats such as JSON.

[0045] The preset invisible byte sequence refers to a private magic number defined by the wafer manufacturer, located at the head of the file, consisting of several non-printable bytes, and is used to identify a specific binary protocol. For example, 0xDEAD, 0x5A5A, 0x88FF, etc.

[0046] The text format refers to a pure text file composed of readable characters, without containing structured syntax or private byte headers, and is often used for simple Map diagram representation.

[0047] In actual execution, read the first 256 bytes of the Map diagram file. If it is found to contain the string "<xml version=" or a legal XML root element tag, it is determined that the file is in the Extensible Markup Language format, and an XML parser is loaded for subsequent processing; check the first non-whitespace character of the Map diagram file. If it is "{", it is determined that it is in the structured data format, and a JSON parsing engine is called to extract the field content therein; compare whether the first 4 to 8 bytes of the Map diagram file match the pre-stored binary magic number library. If the match is successful, it is determined to be in the binary format, and the corresponding binary parsing module is enabled; when the Map diagram file is not recognized as any of the above three formats, regardless of its file extension being ".txt" or not, it is classified as the text format and enters the parsing process based on the character matrix.

[0048] In this embodiment, through the feature recognition mechanisms such as XML declarations, left curly braces, and private magic numbers based on the starting content of the file, the content-driven automatic discrimination of the Map diagram file format is achieved, rather than relying on the file extension, which improves the accuracy of format recognition and is applicable to scenarios where file naming is not standardized, file extensions are missing, or are wrongly modified in industrial sites, and can avoid parsing failures or data misalignment caused by incorrect format judgments.

[0049] In some embodiments, extracting the position identifier of the wafer array through the parsing strategy corresponding to the file format type includes: In the case where the file format type is the Extensible Markup Language format, the structured data format, or the binary format, extract the position identifier according to the internal field definition of the Map diagram file; If the file format is text, skip the header non-layout content of the Map file and locate the starting line of the Map file to extract the position identifier. The starting line is determined by consecutively appearing edge identifiers, which include at least one of spaces, dots, underscores, wavy lines, or asterisks.

[0050] It is understandable that internal fields are data structures agreed upon by the manufacturer in structured data, such as "" in XML. <die X="3" Y="C" Status="G" / > "or in JSON {"row": "3", "col": "C", "grade": "G"}.

[0051] The header non-layout content refers to the comment lines or key-value pairs in the Map file used to describe metadata such as wafer type, production batch, and equipment parameters, and does not include individual wafer layout data.

[0052] The starting line is the first line that truly begins to represent the state of a single wafer in the form of a character matrix, characterized by the consecutive appearance of multiple identical edge identifiers.

[0053] In actual execution, based on the pre-configured vendor schema template, the row number, column number, and status character of each individual wafer are extracted from the parsed data object and combined to generate standard location identifiers and their original status markers; the text file is read line by line, ignoring content that starts with "#", ";", "Header:", or blank lines, until a line is found with at least three consecutive identical characters and the character belongs to the preset edge identifier set, including spaces, dots, underscores, tildes, or asterisks. This line is taken as the starting line of the Map diagram, and the location identifier is extracted character by character starting from this line.

[0054] In this embodiment, field-oriented extraction is used for structured formats to ensure efficient and accurate acquisition of chip data; for unstructured text formats, by skipping header metadata and automatically locating the starting line of the Map with continuous edge identifiers, it can automatically adapt to non-standard .txt files, greatly reducing dependence on vendor documentation and improving compatibility and deployment efficiency for diverse text Map diagrams.

[0055] In some embodiments, dividing the wafers in the wafer array into valid wafers and edge-invalid wafers includes: When the geometric layout of the wafer array is circular, the wafers located on the outer ring of the wafer array and carrying the edge identifier are marked as edge invalid wafers; When the geometric layout type is rectangular, the effective wafer is determined based on the effective row and column range.

[0056] It is understandable that a circular geometric layout means that the individual wafers are arranged according to the outline of the actual wafer, the effective area is circular, and there are a large number of incomplete individual wafers at the edge.

[0057] Edge identifiers in circular maps are typically used to fill invalid areas and are represented by consecutive special characters in the start and end rows.

[0058] The effective row and column range is the range of available single-wafer rows and columns that the user has preset or read from the file metadata, for example, row 2 to row 49 and column B to column AY.

[0059] In actual execution, individual wafers represented by edge identifiers such as spaces or dots in the outermost 1-2 rings of the Map are automatically marked as invalid edge wafers, and their status category is set to edge unpickable, prohibiting subsequent picking operations; the Map data is cropped according to this range, and only individual wafers within the range are retained as valid wafers, while individual wafers outside the range are considered invalid and marked as unpickable, regardless of their original marking.

[0060] In this embodiment, by dynamically dividing the effective area based on the actual geometric layout of the wafer, the outer edge identifier area of ​​the circular wafer is automatically masked, and the rectangular wafer is cut according to preset rows and columns, thereby accurately identifying physically unusable edge chips. This avoids the equipment from trying to pick up incomplete or missing single wafers, reduces the risk of mechanical collisions, protects the life of the nozzle, and prevents process interruptions or yield losses caused by picking up invalid chips.

[0061] In some embodiments, prior to dividing the wafers in the wafer array into valid wafers and edge-invalid wafers, the method further includes: The characters in the first and subsequent lines of the Map file are parsed line by line, with each character corresponding to a wafer status marker; Verify the consistency of the number of characters in each line. If the number of characters in each line is inconsistent, the Map file is deemed invalid. When the number of characters in each line is consistent, the geometric layout type of the Map file is determined based on user configuration or file context, and the geometric layout type is either circular or rectangular.

[0062] Understandably, the state marker exists as a single character in the text map, directly mapping to the state of the corresponding individual wafer.

[0063] Consistency in the number of characters is an important criterion for determining whether a map is complete and has not been truncated.

[0064] User configuration refers to the wafer type manually selected by the operator in the device interface; file context refers to keywords that may be contained in the Map file, such as "Layout=Circular".

[0065] In actual execution, starting from the first line, each character is assigned to a single wafer in order from left to right and from top to bottom, forming a character matrix that corresponds one-to-one with the physical wafers; the number of characters N in the first line is recorded, and each subsequent line is compared with N after reading; if the length of any line is not equal to N, the file is determined to be corrupted or the format is abnormal, the parsing is terminated and an error is reported; if the user has specified a layout type, it is used first; otherwise, the layout description field is scanned in the file header. If it is still not determined, it is processed as a circle by default to be compatible with mainstream wafer forms.

[0066] In this embodiment, by parsing characters line by line and verifying line width consistency, invalid Map diagrams such as corrupted, truncated, or abnormally formatted files can be quickly identified in the early stages of parsing, avoiding the import of erroneous data into the control system that could cause coordinate offsets or omissions. At the same time, the geometric layout type is dynamically determined based on user configuration or file context, which can adapt to different wafer forms without hard coding, enhancing the algorithm's versatility and field adaptability.

[0067] In some embodiments, the state categories include pickable but not picked up, defective pixels not pickable, edge not pickable, and picked up. Mapping the state marker corresponding to the location identifier to the state category includes: The characters representing defects or failures in the original markings of the wafer are mapped to bad pixels that cannot be picked up; The characters corresponding to the starting reference point are retained as coordinate bases and do not participate in the picking decision; Update the status of the picked-up wafer to "picked"; The valid level markers retain level information and are categorized as pickable or unpickable.

[0068] Understandably, defective characters in the original markup vary from manufacturer to manufacturer, such as "X", "F", "D", "-", etc.

[0069] The starting reference point is represented by the character "Z" and is used to define the origin of the wafer coordinate system, for example, in the first row and first column.

[0070] The "picked up" status is the process status recorded by the device after successfully picking up a chip in the previous operation, used to support the batch use of wafers.

[0071] Valid grade markings include characters such as "G", "1", "A+", and "S" that indicate good quality or grade.

[0072] In actual implementation, a defect character mapping table is maintained to uniformly convert all matching items into the "unpickable bad pixel" status category, ensuring that the device skips such chips. After identifying the location of "Z", the row and column numbers of other chips are calculated based on it, but no picking status is assigned to them, that is, neither listed as pickable nor as bad pixel. When loading the map file, the historical picking log is compared, and the chip positions that have been picked are forcibly overwritten with the "picked" status category to prevent duplicate picking. These characters are retained as grade information and their status category is uniformly set to "pickable but not picked up" for subsequent grade-based filtering.

[0073] In this embodiment, cross-vendor semantic alignment is achieved by mapping the manufacturer-defined original state markers to four unified state categories within the device; the level information is retained to support subsequent hierarchical use; the starting reference point is isolated to avoid coordinate interference; and the "picked" status is dynamically updated to support wafer batch operations. This ensures both the determinism of the control logic and the flexibility of the process, thereby improving the accuracy of picking decisions and material utilization.

[0074] In some embodiments, after generating the wafer map data in an internally uniform format, the method further includes: Receive instructions to select the target level; In response to the selection instruction, wafers of the corresponding level and whose status category is pickable but not picked up are filtered out from the internal unified format, and a pick-up task list is generated for the wafer pick-up device to execute.

[0075] Understandably, the target grade refers to the chip quality grade that the user intends to pick up, such as Grade 1, Grade 2, or a specific customer grade code.

[0076] The selection command is a filtering condition entered by the operator through the human-machine interface, used to specify that only chips of a specific quality level should be picked up in this operation.

[0077] The pick-up task list is a queue of instructions containing the coordinates of the wafers to be picked up and their execution order, used to drive the robotic arm or pick-up head to complete automated operations.

[0078] The pick task list is a queue of wafer locations arranged in execution order, containing the coordinates and control parameters of each chip to be picked.

[0079] In actual operation, the operator selects the target level through the human-machine interface (HMI). The equipment listens for HMI events, obtains the level code selected by the user, traverses all wafers in the internal unified format data, filters out chips whose level information matches and whose status category is "pickable but not picked up," generates a pick-up task list according to the optimized path or row and column order, and sends it to the motion control system to execute the pick-up action; traverses the internal unified format data, filters out wafers whose level information matches the target level and whose status category is "pickable but not picked up," sorts them according to row and column order or path optimization algorithm, generates a pick-up task list, and sends it to the motion controller to drive the pick-up head to complete the operation.

[0080] In this embodiment, by receiving the target grade instruction specified by the user and filtering out matching but unpicked wafers from a unified format data, a customized picking task list is generated, which realizes flexible sorting according to quality grade, meets differentiated production needs, maximizes wafer value, and avoids manual intervention, thereby achieving a fully automated and highly efficient graded production process.

[0081] The wafer map parsing method provided in this application can be executed by a wafer map parsing device. This application uses the wafer map parsing device executing the wafer map parsing method as an example to illustrate the wafer map parsing device provided in this application.

[0082] This application also provides a wafer map parsing device.

[0083] like Figure 2 As shown, the wafer map resolution device includes: Module 210 is used to acquire the Map file of the wafer array; The first processing module 220 is used to identify the file format type of the Map file based on the file characteristics of the Map file; The second processing module 230 is used to extract the position identifier of the wafer array through the parsing strategy corresponding to the file format type, so as to divide the wafers in the wafer array into valid wafers and edge invalid wafers, and determine the status mark of each wafer. The status mark of the valid wafer area is "pickable", and the status mark of the edge invalid wafer is "unpickable". The third processing module 240 is used to map the status marker corresponding to the location identifier to a status category in order to generate wafer Map data in an internally unified format. In the internally unified format, a wafer is represented by two characters, adjacent wafers are separated by commas, and each wafer has a corresponding status category and level information.

[0084] The wafer map parsing device provided in this application realizes universal wafer picking control across vendors, formats, and process scenarios through adaptive format recognition based on file features, intelligent starting line positioning of text map, effective area division based on geometric layout perception, and accurate mapping from original markers to unified state categories. It also achieves fully automatic compatible parsing of map files from multiple vendors and formats. It supports automatic filtering of edge-separated wafers, bad pixel avoidance, grade screening, and batch usage status tracking. This solves the problems of picking errors, equipment downtime, and material waste caused by format fragmentation, inaccurate edge recognition, and confused state semantics. It improves the automation level of wafer picking, process reliability, and production efficiency, enhances compatibility, and reduces maintenance costs.

[0085] The wafer map parsing device in this application embodiment can be an electronic device or a component within an electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal or other devices besides a terminal. For example, the electronic device can be a laptop computer, a mobile internet device (MID), an ultra-mobile personal computer (UMPC), a server, network attached storage (NAS), a personal computer (PC), etc., and this application embodiment does not specifically limit the scope.

[0086] The wafer map parsing device in this application embodiment can be a device with an operating system. This operating system can be Android, iOS, or other possible operating systems; this application embodiment does not specifically limit the specific operating system used.

[0087] The wafer map parsing apparatus provided in this application embodiment can implement the various processes implemented in the wafer map parsing method embodiment as described above. To avoid repetition, these processes will not be repeated here.

[0088] This application also provides a wafer pickup device for performing the wafer map parsing method as described in any of the above embodiments.

[0089] In some embodiments, such as Figure 3 As shown, this application embodiment also provides an electronic device 300, including a processor 301, a memory 302, and a computer program stored on the memory 302 and executable on the processor 301. When the program is executed by the processor 301, it implements the various processes of the above-described wafer map parsing method embodiment and can achieve the same technical effect. To avoid repetition, it will not be described again here.

[0090] It should be noted that the electronic devices in the embodiments of this application include the mobile electronic devices and non-mobile electronic devices described above.

[0091] This application also provides a non-transitory computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the various processes of the above-described wafer map parsing method embodiments and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0092] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.

[0093] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described wafer map parsing method.

[0094] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.

[0095] This application also provides a chip, which includes a processor and a communication interface. The communication interface and the processor are coupled. The processor is used to run programs or instructions to implement the various processes of the above-described wafer map parsing method embodiments and achieve the same technical effect. To avoid repetition, it will not be described again here.

[0096] It should be understood that the chip mentioned in the embodiments of this application may also be referred to as a system-on-a-chip, system chip, chip system, or system-on-a-chip, etc.

[0097] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one…" does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0098] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the wafer map parsing method of the various embodiments of this application.

[0099] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0100] In the description of this application, "multiple" means two or more.

[0101] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

[0102] In the description of this specification, the references to "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0103] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.< / die> < / die>

Claims

1. A method for analyzing wafer map diagrams, characterized in that, Applied to wafer pick-up equipment, the method includes: Obtain the map file of the wafer array; Based on the file characteristics of the Map file, the file format type of the Map file is identified; By using the parsing strategy corresponding to the file format type, the position identifier of the wafer array is extracted to divide the wafers in the wafer array into valid wafers and edge invalid wafers, and the status marker of each wafer is determined. The status marker of the valid wafer area is "pickable", and the status marker of the edge invalid wafer is "unpickable". The location identifier is mapped to the corresponding status tag to generate a wafer map data in an internally unified format. In this internally unified format, a wafer is represented by two characters, adjacent wafers are separated by commas, and each wafer has a corresponding status category and level information.

2. The wafer map parsing method according to claim 1, characterized in that, The file format types include text format, binary format, Extensible Markup Language (XML) format, and structured data format. Identifying the file format type of the Map file based on its file characteristics includes: If an Extensible Markup Language (XML) declaration or tag structure is detected in the initial content of the Map file, the file format type of the Map file is determined to be the XML format. If the starting character of the Map file is a left curly brace, then the file format type of the Map file is determined to be the structured data format. When the Map image file contains a preset invisible byte sequence, the file format type of the Map image is determined to be the binary format; Excluding the binary format, Extensible Markup Language format, and structured data format, the file format type of the Map file is determined to be the text format.

3. The wafer map parsing method according to claim 1, characterized in that, The step of extracting the location identifier of the wafer array using the parsing strategy corresponding to the file format type includes: When the file format type is Extensible Markup Language (EXPLAIN), Structured Data (SMD), or Binary, the location identifier is extracted according to the internal field definition of the Map file; If the file format is text, skip the header non-layout content of the Map file and locate the starting line of the Map file to extract the position identifier. The starting line is determined by consecutively appearing edge identifiers, which include at least one of spaces, dots, underscores, wavy lines, or asterisks.

4. The wafer map parsing method according to claim 3, characterized in that, The step of dividing the wafers in the wafer array into valid wafers and edge invalid wafers includes: When the geometric layout of the wafer array is circular, the wafers located on the outer ring of the wafer array and carrying the edge identifier are marked as edge invalid wafers; When the geometric layout type is rectangular, the effective wafer is determined based on the effective row and column range.

5. The wafer map parsing method according to claim 4, characterized in that, Before dividing the wafers in the wafer array into valid wafers and edge-invalid wafers, the method further includes: The characters in the first and subsequent lines of the Map file are parsed line by line, with each character corresponding to a wafer status marker; Verify the consistency of the number of characters in each line. If the number of characters in each line is inconsistent, the Map file is deemed invalid. When the number of characters in each line is consistent, the geometric layout type of the Map file is determined based on user configuration or file context, and the geometric layout type is either circular or rectangular.

6. The wafer map parsing method according to claim 1, characterized in that, The status categories include pickable but not picked up, bad pixels and not pickable, edge pixels and not pickable, and picked up. Mapping the status marker corresponding to the location identifier to the status category includes: The characters representing defects or failures in the original markings of the wafer are mapped to bad pixels that cannot be picked up; The characters corresponding to the starting reference point are retained as coordinate bases and do not participate in the picking decision; Update the status of the picked-up wafer to "picked"; The valid level markers retain level information and are categorized as pickable or unpickable.

7. The wafer map parsing method according to claim 1, characterized in that, After generating the wafer map data in an internally uniform format, the method further includes: Receive instructions to select the target level; In response to the selection instruction, wafers of the corresponding level and whose status category is pickable but not picked up are filtered out from the internal unified format, and a pick-up task list is generated for the wafer pick-up device to execute.

8. A wafer map parsing device, characterized in that, include: The acquisition module is used to acquire the map file of the wafer array; The first processing module is used to identify the file format type of the Map file based on its file characteristics; The second processing module is used to extract the position identifier of the wafer array through the parsing strategy corresponding to the file format type, so as to divide the wafers in the wafer array into valid wafers and edge invalid wafers, and determine the status mark of each wafer. The status mark of the valid wafer area is "pickable", and the status mark of the edge invalid wafer is "unpickable". The third processing module is used to map the status marker corresponding to the location identifier to a status category in order to generate wafer Map data in an internally unified format. In the internally unified format, a wafer is represented by two characters, adjacent wafers are separated by commas, and each wafer has a corresponding status category and level information.

9. A wafer pickup device, characterized in that, Used to perform the wafer map parsing method as described in any one of claims 1-7.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the wafer map parsing method as described in any one of claims 1-7.

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