Radio frequency switch chip, radio frequency front-end module and electronic equipment
By setting an outer ring of ground traces on the substrate of the RF switch chip to form ground isolation, the problem of signal crosstalk in the RF switch chip is solved, and the quality of RF signal transmission is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-19
- Publication Date
- 2026-04-10
Smart Images
Figure CN121841380A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of radio frequency technology, and in particular to a radio frequency switch chip, a radio frequency front-end module, and an electronic device. Background Technology
[0002] The radio frequency (RF) front-end module is an important component of a wireless transceiver system. With the development of technology, the RF front-end module needs to support more and more frequency bands, which means that the number of switching units that need to be set in the RF switch chip is also increasing. Due to the high integration of the RF switch chip, crosstalk can easily exist between different signals inside the RF switch chip, affecting the quality of RF signal transmission.
[0003] Therefore, how to control RF switch chips and ensure their performance while supporting more frequency bands has been a problem that those skilled in the art have been eager to solve. Summary of the Invention
[0004] This application provides an RF switch chip, an RF front-end module, and an electronic device, aiming to control the area of the RF switch chip and ensure its performance.
[0005] In a first aspect, embodiments of this application provide a radio frequency switch chip, including: A substrate having opposing first and second sides, and at least one ground point is provided on the substrate; A switching circuit module, comprising at least two switching circuits, wherein the two different switching circuits operate at different frequency bands; The control circuit module is disposed on the substrate and close to the first side. The control circuit module and the switch circuit module are disposed at intervals and electrically connected. The switching circuit module and the first side surround to form a target area, and at least part of the control circuit module is located within the target area; Furthermore, the substrate is provided with grounding traces connected to the grounding point. The grounding traces include at least an outer ring of grounding traces connected to the grounding point, and at least a portion of the outer ring of grounding traces is disposed between the switching circuit module and the control circuit module and surrounds the edge of the control circuit module near the switching circuit module.
[0006] The switching circuit module includes at least a first switching circuit module and a second switching circuit module, which are spaced apart along a second side. The first switching circuit module includes a first switching circuit, and the second switching circuit module includes a second switching circuit.
[0007] Secondly, embodiments of this application also provide a radio frequency front-end module, characterized in that it includes a radio frequency switch chip as provided in any embodiment of this application.
[0008] Thirdly, embodiments of this application also provide an electronic device, including a radio frequency switch chip as provided in any embodiment of this application or a radio frequency front-end module as provided in any embodiment of this application.
[0009] In summary, this application provides an RF switch chip, an RF front-end module, and an electronic device. The RF switch chip includes: a substrate having opposing first and second sides, and at least one ground point disposed on the substrate; a switch circuit module including at least two switch circuits, with the two different switch circuits operating at different frequency bands; and a control circuit module disposed on the substrate and close to the first side, the control circuit module and the switch circuit module being spaced apart and electrically connected; wherein the switch circuit module and the first side surround to form a target area, and at least a portion of the control circuit module is located within the target area; furthermore, the substrate is provided with ground traces connected to the ground point, the ground traces including at least an outer ring ground trace connected to the ground point, and at least a portion of the outer ring ground traces being disposed between the switch circuit module and the control circuit module and surrounding the edge of the control circuit module close to the switch circuit module. By setting an outer ring ground trace connected to a ground point on the substrate, and placing at least a portion of the outer ring ground trace between the switching circuit module and the control circuit module, ground isolation is formed between the switching circuit module and the control circuit module, reducing crosstalk between the RF signals transmitted on the switching circuit module and the RF signals transmitted on the control circuit module. This can improve the RF signal transmission quality while ensuring the integration of the RF switch chip and controlling the size of the RF switch chip. Attached Figure Description
[0010] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0011] Figure 1 This is a schematic diagram of the layout of a radio frequency switch chip provided in an embodiment of this application; Figure 2 This is a schematic diagram of another layout of a radio frequency switch chip provided in an embodiment of this application; Figure 3 A schematic diagram of the layout of a radio frequency front-end module provided in an embodiment of this application; Figure 4 This is a schematic diagram of another layout of a radio frequency switch chip provided in an embodiment of this application; Figure 5 This is a schematic diagram of another layout of a radio frequency switch chip provided in an embodiment of this application; Figure 6 This is a schematic diagram of another layout of a radio frequency switch chip provided in an embodiment of this application; Figure 7 A schematic diagram of a module structure of a radio frequency front-end module provided in an embodiment of this application; Figure 8 This is a schematic diagram of a module structure of an electronic device provided in an embodiment of this application.
[0012] Figure label: 100. RF switch chip; 10. Substrate; 11. First side; 12. Second side; 13. Third side; 14. Fourth side; 20. Control circuit module; 21. Main body; 22. Stepped section; 23. Clearance space; 50. Switch circuit module; 51. Switch circuit; 30. First switch circuit module; 31. First switch setting section; 32. Second switch setting section; 33. First switch circuit; 40. Second switch circuit module; 41. Third switch setting section; 42. Fourth switch setting section; 43. Second switch circuit; 60. Grounding trace; 61. First trace; 62. Second trace; 621. Third... Sub-segment; 622, Fourth sub-segment; 623, Fifth sub-segment; 624, Sixth sub-segment; 64, Outer ring grounding trace; 641, First outer ring segment; 6411, First sub-segment; 6412, Second sub-segment; 642, Second outer ring segment; 70, Grounding point; 71, First grounding point; 72, Second grounding point; 73, Third grounding point; 74, Fourth grounding point; 75, Fifth grounding point; 81, First RF input terminal; 82, Second RF input terminal; 91, First RF transmission line; 911, First sub-transmission line; 912, Second sub-transmission line; 913, Third sub-transmission line; 92, Second RF transmission line; 200. RF front-end module; 210. Substrate; 220. Filter; 300. Electronic devices; 400. Target area. Detailed Implementation
[0013] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be decomposed, combined, or partially merged; therefore, the actual execution order may change according to the actual situation.
[0014] Radio frequency (RF) front-end modules are a crucial component of wireless transceiver systems. With technological advancements, RF front-end modules need to support an increasing number of frequency bands, leading to a greater number of switching units required in RF switch chips. Due to the high integration density of RF switch chips, crosstalk can easily occur between different signals within the chip, affecting the quality of RF signal transmission. Therefore, controlling the RF switch chip area and ensuring its performance while supporting more frequency bands has been a persistent problem for those skilled in the art.
[0015] To address the aforementioned problems, this application provides an RF switch chip 100, an RF front-end module 200, and an electronic device 300. The technical solution of this application will be described below with reference to the accompanying drawings.
[0016] like Figures 1 to 2 As shown, this application embodiment provides an RF switch chip 100, which has a plurality of switch circuits 51, including those described in this application. Figure 4 The circuit includes at least two first switching circuits 33 and at least two second switching circuits 43, each with a corresponding operating frequency band. Radio frequency signals corresponding to the operating frequency bands can be transmitted through the switching circuits. In some embodiments, the two different switching circuits 51 operate at different frequency bands.
[0017] like Figure 3 As shown, the RF switch chip 100 can be disposed in the RF front-end module 200. For example, the RF front-end module 200 includes a substrate 210, and the RF switch chip 100 can be disposed on the substrate 210 of the RF front-end module 200.
[0018] The radio frequency switch chip 100 includes at least a substrate 10, a switch circuit module 50, and a control circuit module 20. The following is a detailed description of each circuit component in the radio frequency switch chip 100.
[0019] Specifically, the substrate 10 has opposing first sides 11 and second sides 12, and at least one ground point 70 is provided on the substrate 10. As one embodiment, the substrate 10 also has opposing third sides 13 and fourth sides 14, with the third side 13 connected to the first side 11 and second side 12, and the fourth side 14 also connected to the first side 11 and second side 12. By way of example and not limitation, the substrate 10 is quadrilateral; for example, the substrate 10 can be rectangular, trapezoidal, or parallelogram-shaped. In this case, the first side 11, second side 12, third side 13, and fourth side 14 correspond to the outer contours of the four sides of the substrate 10. In the embodiments of this application, the outer contours of the substrate 10 can also be set to other polygonal shapes. The aforementioned outer contours are merely the boundaries of the substrate 10, and the shape of the boundaries can be adjusted according to different products, all within the scope of protection of this application. The following embodiments use a quadrilateral outer contour of the substrate as an example for illustration.
[0020] like Figure 1 As shown, specifically, the switching circuit module 50 is disposed on the substrate 10, and the switching circuit module 50 has multiple switching circuits 51. By way of example and not limitation, each switching circuit has a corresponding operating frequency band, and the radio frequency of the corresponding operating frequency band can be controlled by the switching circuit. Specifically, the operating frequencies of two different switching circuits 51 may be the same or different. As an example, some switching circuits 51 operate in the mid-to-high frequency band (e.g., greater than or equal to 2 GHz), while other switching circuits 51 operate in the low frequency band (e.g., less than 2 GHz).
[0021] Specifically, the control circuit module 20 is disposed on the substrate 10 and close to the first side 11. The control circuit module 20 and the switch circuit module 50 are disposed at intervals and electrically connected.
[0022] It should be noted that the control circuit module 20 is electrically connected to each switch circuit 51 and is used to control the conduction and shutdown of each switch circuit 51. When a switch circuit 51 is on, it can transmit radio frequency signals; when a switch circuit 51 is off, it does not transmit radio frequency signals. In some embodiments, the control circuit module 20 is provided with a control signal port. The control circuit module 20 is used to receive control signals through the control signal port and control the conduction and shutdown of each switch circuit according to the control signals. Specifically, the control signal port is also called a MIPI port (Mobile Industry Processor Interface), which receives control signals based on the MIPI RFFE (MIPI RF Front-end) interface standard.
[0023] like Figure 2 and Figure 4As shown, the switch circuit module 50 and the first side 11 surround and form a target area 400, and at least a portion of the control circuit module 20 is located within the target area 400. As an example, the switch circuit module 50 and the first side 11 surround and form a quadrilateral or near-quadrilateral target area 400, so that at least a portion of the control circuit module 20 is housed within the target area 400. It should be noted that when arranged in an L-shape, a portion of the first switch circuit 33 within the first switch circuit module 30 is arranged along one side of the target area 50, and another portion of the first switch circuit 33 is arranged along the other side of the target area 50. These two sides are adjacent sides. The second switch circuit module 40 and the second switch circuit 34 are also mentioned. It should also be noted that, for example, in... Figure 1 In the middle, the target area 50 is formed by the line connecting the outer edge of the first switch circuit module 30, the outer edge of the second switch circuit module 40, and the first side 11.
[0024] It should be noted that the switching circuit module 50 and a portion of the first side 11 surround and form the target region 400, and at least a portion of the control circuit module 20 is disposed within the target region 400. This ensures that the control circuit module 20 and the switching circuit module 50 are spaced apart. Simultaneously, this spacing reduces crosstalk, fully utilizes the area on the substrate 10, reduces the overall area footprint, and ensures that each switching circuit 51 on the switching circuit module 50 is not too far from the control circuit module 20, facilitating electrical connection between the control circuit module 20 and each switching circuit 51, further reducing the size. In some embodiments, the control circuit module 20 is entirely located within the target region 400 to further improve the integration of the RF switch chip 100 and reduce its area.
[0025] Furthermore, a grounding trace 60 connected to the grounding point 70 is also provided on the substrate 10. The grounding trace 60 includes at least an outer ring grounding trace 64, and at least a portion of the outer ring grounding trace 64 is disposed between the switching circuit module 50 and the control circuit module 20 and surrounds the edge of the control circuit module 20 on the side closer to the switching circuit module 50.
[0026] It should be noted that grounding point 70 is used for grounding. For example, when the RF switch chip 100 is disposed on the substrate 210 of the RF front-end module 200, the grounding point 70 is connected to the grounding port on the substrate 210 so that the grounding trace 60 is grounded through the grounding point 70 and the grounding port on the substrate. It should also be noted that the grounding point 70 can be set to one, two or more, and the setting position of the grounding point 70 can be adjusted according to the actual layout of the RF switch chip 100. For example, some grounding points 70 can be set between the switch circuit module 50 and the control circuit module 20, so that the outer ring grounding trace 64 between the switch circuit module 50 and the control circuit module 20 can be connected to the grounding point 70. Moreover, the grounding point 70 set here can also form ground isolation between the first switch circuit module 30 and the second switch circuit module 40, reduce crosstalk in the RF signal transmission on the first switch circuit 33 and the second switch circuit 43, and improve the RF signal transmission quality. Another part of the grounding point 70 can be set along the side of the substrate 10, which is convenient for connection with the grounding port on the substrate 210, and also facilitates the routing of the outer ring grounding trace 64.
[0027] like Figure 1 As shown, in some embodiments, the routing shape of the outer grounding trace 64 matches the outer contour or side of the control circuit module 20 near the switch circuit module 50. Specifically, the extension method of the outer grounding trace 64 is the same as the extension method of the side of the control circuit module 20 near the switch circuit module 50. This reduces the area occupied by the RF switch chip 100 while establishing ground isolation.
[0028] As one embodiment, a partial grounding point 70 is provided along the first side 11, for example, it is provided on the first side 11 and located on at least one side of the control circuit module 20 in the direction of extension of the first side 11.
[0029] By setting a ground trace 60 connected to the ground point 70 on the substrate 10, and setting at least a portion of the outer ring ground trace 66 between the switch circuit module 50 and the control circuit module 20, ground isolation is formed between the switch circuit 51 of the switch circuit module 50 and the control circuit module 20, reducing the crosstalk between the radio frequency signals transmitted on different circuits on both sides. This effectively improves the quality of radio frequency signal transmission while ensuring the integration of the radio frequency switch chip 100 and reducing the size of the radio frequency switch chip 100.
[0030] like Figure 2 and Figure 4As shown, in some embodiments, the switch circuit module 50 includes at least a first switch circuit module 30 and a second switch circuit module 40, which are spaced apart along the second side 12. The first switch circuit module 30 also includes a first switch circuit 33, and the second switch circuit module 40 also includes a second switch circuit 43.
[0031] Specifically, both the first switch circuit module 30 and the second switch circuit module 40 are disposed on the substrate 10. As one embodiment, the first switch circuit module 30 includes at least two first switch circuits 33, and the second switch circuit module 40 includes at least two second switch circuits 43. By way of example and not limitation, each switch circuit 51 has a corresponding operating frequency band, and radio frequency signals of the corresponding operating frequency band can be transmitted through the switch circuit 51.
[0032] In some implementations, the first switching circuit 33 and the second switching circuit 43 operate at different frequencies. The two different first switching circuits 33 may operate at the same or different frequency bands. Similarly, the two different second switching circuits 43 may operate at the same or different frequency bands.
[0033] In some embodiments, the operating frequency bands of at least two first switching circuits 33 are both within a first frequency band set, and the operating frequency bands of at least two second switching circuits 43 are both within a second frequency band set, wherein the center frequency of the operating frequency of any frequency band in the first frequency band set is greater than the center frequency of the operating frequency of any frequency band in the second frequency band set. For example, the operating frequency band of the first switching circuit 33 is in the mid-to-high frequency band, and the operating frequency band of the second switching circuit 43 is in the low frequency band; for instance, the operating frequency band of the first switching circuit 33 is greater than or equal to 2 GHz, and the operating frequency band of the second switching circuit 43 is less than 2 GHz.
[0034] like Figure 2 and Figure 4As shown, the first switch circuit module 30 and the second switch circuit module 40 are arranged at intervals along the extending direction of the second side 12. The first switch circuit module 30, the second switch circuit module 40, and the first side 11 surround to form a target area 400, and at least a portion of the control circuit module 20 is located within the target area 400. As an example, one or both of the first switch circuit module 30 and the second switch circuit module 40 are arranged in an L-shape, and the first switch circuit module 30, the second switch circuit module 40, and the second side 12 surround to form a quadrilateral or near-quadrilateral target area 400, so that at least a portion of the control circuit module 20 is accommodated within the target area 400. This layout design aims to ensure that the control circuit module 20, the first switch circuit module 30, and the second switch circuit module 40 are spaced apart to ensure mutual isolation and reduce crosstalk. The first switch circuit module 30 and the second switch circuit module 40 are arranged around the outer periphery of the control circuit module 20, making the arrangement of different switch circuit modules more compact and fully utilizing the area on the substrate 10, reducing the overall area occupied. It also ensures that each switch circuit on the first switch circuit module 30 and the second switch circuit module 40 is not too far from the control circuit module 20, facilitating the electrical connection between the control circuit module 20 and each switch circuit 51, further reducing the size.
[0035] like Figure 2 As shown, in some embodiments, the grounding point 70 includes at least a first grounding point 71 and a second grounding point 72 disposed along the first side 11. The first grounding point 71 is located between the control circuit module 20 and the first switching circuit module 30, and the second grounding point 72 is located between the control circuit module 20 and the second switching circuit module 40. The outer ring grounding trace 64 is connected to both the first grounding point 71 and the second grounding point 72. Specifically, one end of the outer ring grounding trace 64 is connected to the first grounding point 71, and the other end is connected to the second grounding point 72, thereby enabling the outer ring grounding trace 64 to be conductive to ground in multiple areas, further enhancing its isolation effect. Furthermore, in this embodiment, the main signal type transmitted within the control circuit module 20 is a control signal (MIPI), while the signal type transmitted within each switching circuit module is a radio frequency signal. By setting the outer ring grounding trace 64, the different transmitted signals can be effectively isolated, further improving the isolation effect between the control circuit module 20 and each switching circuit module.
[0036] Specifically, the outer grounding trace 64 is disposed between the control circuit module 20 and the first switch circuit module 30, and between the control circuit module 20 and the second switch circuit module 40 to form ground isolation. For example, the routing shape of the outer grounding trace 64 is adapted to the side of the control circuit module 20 closest to the first switch circuit module 30 and the second switch circuit module 40, so as to reduce the area required by the RF switch module while forming ground isolation.
[0037] As one embodiment, the grounding trace 60, besides forming ground isolation between the control circuit module 20 and the switch circuit module 50, can also be used to connect to each switch circuit 51. For example, the first switch circuit 33 in the first switch circuit module 30 is connected to the grounding trace 60 through a corresponding grounding switch transistor, and the second switch circuit 43 in the second switch circuit module 40 is connected to the grounding trace 60 through a corresponding grounding switch transistor. Each switch circuit can have its input terminal connected to the grounding trace 60 through a corresponding grounding switch transistor, or its output terminal connected to the grounding trace 60 through a corresponding grounding switch transistor. When the control circuit module 20 controls any switch circuit 51 to turn off, it also controls the corresponding grounding switch transistor of that switch circuit 51 to turn on, ensuring that the corresponding switch circuit 51 is turned off and does not transmit radio frequency signals.
[0038] like Figure 2 and Figure 4 As shown, in some embodiments, the first switch circuit module 30 includes a first switch setting part 31 and a second switch setting part 32. The first switch setting part 31 is disposed along the second side 12, and the second switch setting part 32 is disposed along the third side 13. The first switch setting part 31 and the second switch setting part 32 are adjacent to each other. The third side 13 is a side on the substrate 10 that is connected to the first side 11 and the second side 12 and is close to the first switch setting part 31.
[0039] It should be noted that the first switch setting part 31 and the second switch setting part 32 are adjacent to each other, meaning that the first switch setting part 31 and the second switch setting part 32 abut against each other, and one side of the first switch setting part 31 is connected to one side of the second switch setting part 32. Other descriptions of adjacent parts in the following text can also refer to this definition.
[0040] Specifically, the first switch circuit module 30 is L-shaped, and both the first switch setting part 31 and the second switch setting part 32 are respectively provided with first switch circuits 33. The first switch setting part 31 is positioned along the second side 12, and the second switch setting part 32 is positioned along the third side 13. This facilitates full utilization of the area on the substrate 10 for the placement of the first switch circuits 33, and also facilitates the electrical connection between the control circuit module 20 and each of the first switch circuits 33, further reducing the size. Simultaneously, combined with... Figure 3In the layout structure, multiple filter chips, such as a first filter chip, a second filter chip, and a third filter chip, are arranged at corresponding positions on the left and upper sides of the first switch circuit module 30. In this embodiment, the first switch circuit module 30 is configured as an L-shape. This shortens the distance between the L-shaped first switch circuit module 30 and the filter chips on the side closer to the second and third filter chips, thus facilitating electrical connection between them. Correspondingly, the distance between the first switch circuit module 30 and each filter 220 on the side closer to the filter 220 is also shorter, facilitating electrical connection and allowing the first switch circuit module 30 to better cooperate with different filter chips.
[0041] In this embodiment of the application, the arrangement of the aforementioned plurality of filter chips is not limited to... Figure 3 The layout of the first, second, and third filter chips shown is not limited. Different filter chips can also be placed in other corresponding areas or locations. All different filter chip arrangement schemes are within the protection scope of this application and are not limited by the isolation scheme between control signals and radio frequency signals described in this application.
[0042] like Figure 2 As shown, in some embodiments, the outer ring grounding trace 64 includes at least a first outer ring segment 641 and a second outer ring segment 642 connected together. The first outer ring segment 641 is located between the first switch circuit module 30 and the control circuit module 20, and the second outer ring segment 642 is located between the second switch circuit module 40 and the control circuit module 20. Specifically, the first outer ring segment 641 includes a first sub-segment 6411 and a second sub-segment 6412. The first sub-segment 6411 is located between the first switch setting part 31 and the control circuit module 20 and is connected to the second outer ring segment 642. The second sub-segment 6412 is located between the second switch setting part 32 and the control circuit module 20, with one end connected to the first sub-segment 6411 and the other end extending towards the first side 11.
[0043] Specifically, the first outer ring segment 641 forms a ground isolation between the first switching circuit module 30 and the control circuit module 20 to reduce signal crosstalk between the first switching circuit 31 and the control circuit module 20. The second outer ring segment 642 forms a ground isolation between the second switching circuit module 40 and the control circuit module 20 to reduce signal crosstalk between the second switching circuit 42 and the control circuit module 20. Moreover, through the shape design of the first sub-segment 6411 and the second sub-segment 6412, the first outer ring segment 641 can adapt to the edge shape of both the first switching circuit module 30 and the control circuit module 20, forming a ground isolation between the first switching circuit module 30 and the control circuit module 20, and providing good ground isolation for the entire area.
[0044] like Figure 2 As shown, in some embodiments, grounding point 70 includes at least a third grounding point 73, which is located on the first sub-segment 611 and / or the second sub-segment 612. For example, in Figure 4 In the layout shown, the third grounding point 73 is located at the corner where the first sub-segment 611 and the second sub-segment 612 connect.
[0045] In some embodiments, the width of the second switch mounting portion 32 is greater than the width of the control circuit module 20 along the extending direction of the third side 13. It should be understood that the width of the second switch mounting portion 32 is greater than the width of the control circuit module 20, so that the second switch mounting portion 32 covers the control circuit module 20 in the opposite direction of the first side 11 and the second side 12, so that the first switch circuit module 30, the second switch circuit module 40 and the first side 11 can surround the control circuit module 20.
[0046] like Figure 4 and Figure 5 As shown, in some embodiments, the RF switch chip 100 further includes a first RF input terminal 81 and a first RF transmission line 91 disposed on the substrate 10. The first RF input terminal 81 is disposed along a fourth side 14, which is a side of the substrate 10 connected to the first side 11 and the second side 12 and close to the second switch setting part 32. The first RF transmission line 91 is connected to the first RF input terminal 81 and each of the first switch circuits 33, and is used to transmit the RF signal input from the first RF input terminal 81 to the corresponding first switch circuit 33.
[0047] Furthermore, the first RF transmission line 91 and the control circuit module 20 are located on opposite sides of the outer grounding trace 64. Specifically, the outer grounding trace 64 forms ground isolation between the first RF transmission line 91 and the control circuit module 20, reducing signal crosstalk between the first RF transmission line 91 and the control circuit module 20.
[0048] As an example and not a limitation, the spacing between the outer ground trace 64 and the first RF transmission line 91 is 15µm-80µm. Optionally, the spacing between the outer ground trace 64 and the first RF transmission line 91 is set to between 25µm-50µm. This distance not only ensures that the signal of the first RF transmission line 91 will not leak directly through the outer ground trace 64, but also minimizes the area occupied by the RF switch chip 100.
[0049] In some embodiments, the grounding trace 60 further includes a first trace 61, at least a portion of which is located between the first radio frequency transmission line 91 and the second switching circuit module 40. The output terminal of the second switching circuit 43 on the second switching circuit module 40 can be grounded through the first trace 61. When the output terminal of the second switching circuit 43 is grounded, the second switching circuit 43 does not transmit the corresponding radio frequency signal.
[0050] It should be noted that the first line segment 61 can be directly connected to the grounding point 70, or it can be connected to the grounding point 70 through other lines in the grounding line 60.
[0051] As described above, part of the grounding trace 60 (including the first trace 61) extends to the side of the first switching circuit module 30 away from the control circuit module 20. This arrangement also facilitates the routing of the first radio frequency transmission line 91 between the second switching circuit module 40 and the control circuit module 20, thereby reducing the size of the radio frequency switch chip 100.
[0052] like Figure 5 and Figure 6 As shown, in some embodiments, the grounding trace 60 includes a first trace 61, at least a portion of which is located on the side of the first switching circuit module 30 away from the control circuit module 20, and the first trace 61 is arranged around at least a portion of the outer edge of the first switching circuit module 30. The distance between the first switch setting portion 31 and the first trace 61 is equal to the distance between the second switch setting portion 32 and the first trace 61.
[0053] It should be understood that each of the first switch circuits 33 (including the first switch circuit 33 located in the first switch setting part 31 and the first switch circuit 33 located in the second switch setting part 32) is connected to the first line 61 through a corresponding grounding switch tube. The distance between the first switch setting part 31 and the first line 61 and the distance between the second switch setting part 32 and the first line 61 are set to be equal, so as to facilitate the placement of grounding switch tubes of the same size between the first switch circuits 33 and the first line 61 at different locations.
[0054] like Figure 3As shown, specifically, when the RF switch chip 100 is disposed in the RF front-end module 200, the first trace 61 can be used to form ground isolation between at least a portion of the first switch circuit module 30 and the filter 220 on the RF front-end module 200, avoiding signal crosstalk between the filter 220 and at least a portion of the first switch circuit 33. The filter 220 is, for example, disposed in a filter 220 chip located on the substrate 210. As one embodiment, each first switch circuit 33 is electrically connected to the first trace 61 through a corresponding grounding switch transistor, so that each first switch circuit 33 is grounded when turned off. The configuration and function of the grounding switch transistor have been described above and will not be repeated here.
[0055] Furthermore, in some embodiments, a portion of the first wiring 61 is located between the second switch setting part 32 and the third side 13 (e.g., Figure 5 (as shown) or located between the second switch setting unit 32 and the control circuit module 20 (e.g. Figure 6 (As shown).
[0056] Specifically, when the RF switch chip 100 is disposed in the RF front-end module 200, a portion of the first trace 61 is disposed between the second switch setting section 32 and the third side 13. This can be used to form ground isolation between at least a portion of the first switch circuit module 30 and the filter 220 on the RF front-end module 200, preventing signal crosstalk between the filter 220 and at least a portion of the first switch circuit 33. The filter 220 is, for example, disposed in a filter 220 chip located on the substrate 210. As one embodiment, each first switch circuit 33 is electrically connected to the first trace 61 through a corresponding grounding switch transistor, so that each first switch circuit 33 is grounded when turned off. The function of the grounding switch transistor has been described above and will not be repeated here.
[0057] On the other hand, by placing a portion of the first trace 61 between the second switch setting part 32 and the control circuit module 20, it can work with the outer ring ground trace 64 to form enhanced isolation between the second switch setting part 32 and the control circuit module 20, further reducing crosstalk between the second switch circuit 43 on the second switch setting part 32 and the radio frequency signal transmission on the control circuit module 20.
[0058] As an example, the spacing between the first trace 61 and the first RF transmission line 91 is 15um-80um. Optionally, the spacing between the first trace 61 and the first RF transmission line 91 is set to 20um-55um. The above distance not only ensures that the signal of the first RF transmission line 91 will not leak directly through the first trace 61, but also minimizes the area occupied by the RF switch chip 100.
[0059] like Figure 4As shown, in some embodiments, the first radio frequency transmission line 91 includes a first sub-transmission line 911, a second sub-transmission line 912, and a third sub-transmission line 913. One end of the first sub-transmission line 911 is connected to the first radio frequency input terminal 81, and the other end extends towards the side close to the first switch module and is connected to the second sub-transmission line 912 and the third sub-transmission line 913 respectively, so that the second sub-transmission line 912 and the third sub-transmission line 913 form a branch. The second sub-transmission line 912 is arranged along the extension direction of the first switch setting part 31, and the third sub-transmission line 913 is arranged along the extension direction of the second switch setting part 32.
[0060] Both the first switch setting unit 31 and the second switch setting unit 32 are provided with a first switch circuit 33. The first radio frequency input terminal 81 is connected to the first switch circuit 33 on the first switch setting unit 31 through the first sub-transmission line 911 and the second sub-transmission line 912, and is connected to the first switch circuit 33 on the second switch setting unit 32 through the first sub-transmission line 911 and the third sub-transmission line 913.
[0061] Specifically, through the branched second sub-transmission line 912 and third sub-transmission line 913, the first radio frequency transmission line 91 can be connected to the first switch circuit 33 on the first switch setting unit 31 and the first switch circuit 33 on the second switch setting unit 32, respectively. As one embodiment, the second sub-transmission line 912 extends along the extension direction of the second side 12 to shorten the distance between the second sub-transmission line 912 and the first switch circuit 33 on the first switch setting part 31, facilitating the connection between the second sub-transmission line 912 and the first switch circuit 33 on the first switch setting part 31. Furthermore, the shortest distance between the input terminals of each first switch circuit 33 on the first switch setting part 31 and the second sub-transmission line 912 is the same, facilitating the wiring of the first radio frequency transmission line 91. Similarly, the third sub-transmission line 913 extends along the extension direction of the third side 13 to shorten the distance between the third sub-transmission line 913 and the first switch circuit 33 on the second switch setting part 32, facilitating the connection between the third sub-transmission line 913 and the first switch circuit 33 on the second switch setting part 32. Furthermore, the shortest distance between the input terminals of each first switch circuit 33 on the second switch setting part 32 and the second sub-transmission line 912 is the same, facilitating the wiring of the first radio frequency transmission line 91.
[0062] In one embodiment, the first switch circuit 33 on the first switch setting unit 31 is connected to the second sub-transmission line 912 via a corresponding connecting line, and the first switch circuit 33 on the second switch setting unit 32 is connected to the third sub-transmission line 913 via a corresponding connecting line.
[0063] In some embodiments, the spacing between the first switch setting part 31 and the second sub-transmission line 912 is equal to the spacing between the second switch setting part 32 and the second sub-transmission line 912. Furthermore, the shortest distance between the first switch circuit 33 and the first radio frequency transmission line 91 is the same at different locations. It should be understood that setting the shortest distance between the first switch circuit 33 and the first radio frequency transmission line 91 at different locations facilitates the routing of the connection line between the first switch circuit 33 and the first radio frequency transmission line 91, thereby limiting the difference in link length between the radio frequency signal transmitted from the first radio frequency input terminal 81 to the first switch circuit 33 at different locations, and improving the stability and consistency of signal transmission.
[0064] In some embodiments, the first radio frequency transmission line 91 and the grounding trace 60 are symmetrically arranged on both sides of the first switching circuit 33. In some embodiments, multiple first switching circuits 33 are spaced apart, and the distance from the first switching circuit 33 to the first radio frequency transmission line 91 and the shortest distance to the grounding trace 60 are the same. Specifically, when the first switch setting part 31 and the second switch setting part 32 are arranged, along the direction of the first side 11, the distance between the second switch setting part 32 and the third sub-transmission line 913 is the same as the distance between the second switch setting part 32 and the first trace 61, and the first trace 61 is arranged on the side closer to the third side 13. In this way, the third sub-transmission line 913 and the first trace 61 can be symmetrically arranged relative to the second switch setting part 32, thereby making the layout of different traces with the second switch setting part 32 more reasonable, and ensuring the transmission distance between the second switch setting part 32 and other components, thus ensuring signal transmission quality.
[0065] Specifically, the shortest distance from the first switch circuit 33 on the first switch setting unit 31 to the second sub-transmission line 912 and the shortest distance to the second sub-segment 622 are the same; similarly, the shortest distance from the first switch circuit 33 on the second switch setting unit 32 to the third sub-transmission line 913 and the shortest distance to the third sub-segment 621 are the same. Furthermore, in this embodiment, along the direction of the third side 13, the distance between the first switch setting unit 31 and the second sub-transmission line 912 is the same as the distance between the first switch setting unit 31 and the first trace 61. This allows the second sub-transmission line 912 and the first trace 61 to be symmetrically arranged relative to the first switch setting unit 31, resulting in a more rational layout of different traces with respect to the first switch setting unit 31, ensuring the transmission distance between the first switch setting unit 31 and other components, and guaranteeing signal transmission quality.
[0066] like Figure 4 As shown, in some embodiments, at least one grounding point 70 includes at least a second grounding point 72 disposed along the first side 11, the second grounding point 72 being located between the control circuit module 20 and the second switch circuit module 40, and the outer ring grounding trace being connected to the second grounding point.
[0067] By way of example and not limitation, the distance between the second ground point 72 and the first RF input terminal 81 in the extension direction of the first side 11 is 50um-200um, such as 50um, 70um, 80um, 100um, 120um, 150um, 180um, or other acceptable values within this range. It should be understood that the above distance not only ensures that the RF signal input from the first RF input terminal 81 will not leak directly through the second ground point 72 and the outer ground trace 64, but also minimizes the area occupied by the RF switch chip 100.
[0068] like Figure 5 As shown, in some embodiments, the control circuit module 20 includes a main body 21 and a stepped portion 22. The main body 21 and the stepped portion 22 are disposed along the first side 11 and adjoin each other. The stepped portion 22 is located on the side of the main body 21 near the fourth side 14. Along the extending direction of the fourth side 14, the width of the main body 21 is greater than the width of the stepped portion 22, and the side of the stepped portion 22 near the second side 12 and the side of the main body 21 near the stepped portion 22 form a clearance space 23. Furthermore, in this embodiment, the distance from the bottom of the stepped portion 22 to the first side 11 is the same as the distance from the bottom of the main body 21 to the first side 11, thereby arranging and planning the components more reasonably and effectively, and reducing the chip size.
[0069] Specifically, along the extension direction of the fourth side 14, the step portion 22 narrows towards the side closer to the first side 11 near the edge of the second side 12 to form the aforementioned clearance space 23, and the clearance space 23 is at least used for the second switch circuit module 40 of the set portion, so that the second switch circuit module 40 and the control circuit module 20 are positioned closer together.
[0070] In some embodiments, the second switch circuit module 40 includes a third switch setting part 41 and a fourth switch setting part 42. The third switch setting part 41 is disposed along the second side 12, and the fourth switch setting part 42 is disposed along the fourth side 14. The side of the fourth switch setting part 42 near the second side 12 is adjacent to the third switch setting part 41, and the side of the fourth switch setting part 42 near the first side 11 extends to the clearance space 23.
[0071] Specifically, both the third switch setting section 41 and the fourth switch setting section 42 are respectively provided with a second switch circuit 43. The second switch circuit module 40 is L-shaped so that the second switch circuit module 40 and the side adjacent to the control circuit module 20 are mutually adapted. It should be understood that the arrangement of the clearance space 23 can make full use of the area on the substrate 10 to set the second switch circuit module 40 and the control circuit module 20, and also facilitates the electrical connection between the control circuit module 20 and each of the second switch circuits 43, further reducing the area of the switch control module.
[0072] like Figure 5 As shown, in some embodiments, the grounding trace 60 further includes a second trace 62. In some embodiments, the grounding trace 60 further includes a second trace 62 connected to the first segment 61, and at least a portion of the second trace 62 is located between the second switching circuit module 40 and the control circuit module 20. It should be understood that the second trace 62 can form ground isolation between the second switching circuit module 40 and the control circuit module 20, reducing crosstalk between the second switching circuit 43 and the control circuit module 20.
[0073] In some embodiments, the second trace 62 includes a third sub-segment 621, a fourth sub-segment 622, and a fifth sub-segment 623. The third sub-segment 621 is located between the main body 21 and the third switch setting part 41. The fourth sub-segment 622 is located between the main body 21 and the fourth switch setting part 42 and is connected to the third sub-segment 621. The fifth sub-segment 623 is located between the step part 22 and the fourth switch setting part 42 and is connected to the fourth sub-segment 622. The first radio frequency input terminal 81 is located on the side of the fifth sub-segment 623 near the step part 22.
[0074] Specifically, by setting a third sub-segment 621, a fourth sub-segment 622, and a fifth sub-segment 623 in the clearance space 23, the second trace 62 can adapt to the edge shapes of both the second switching circuit module 40 and the control circuit module 20, forming ground isolation between the second switching circuit module 40 and the control circuit module 20. Since the first RF input terminal 81 is located on the side of the fifth sub-segment 623 near the step portion 22, the first RF input terminal 81 and the second switching circuit module 40 are separated on both sides of the fifth sub-segment 623. This also facilitates at least a portion of the first RF transmission line 91 and the second switching circuit module 40 being separated on both sides of the second trace 62, thereby avoiding crosstalk between the RF signals transmitted on the first RF transmission line 91 and the second switching circuit 43. Simultaneously, an outer ground trace 64 is also provided between the first RF transmission line 91 and the control circuit module 20. This outer ground trace 64 can also avoid signal crosstalk between the first RF transmission line 91 and the control circuit module 20, thus forming double isolation and ensuring isolation.
[0075] like Figure 4 and Figure 5 As shown, in some embodiments, a fourth ground point 74 is further provided on the substrate 10, the fourth ground point 74 being located within the clearance space 23, and at least one of the fourth sub-segment 622 and the fifth sub-segment 623 being connected to the fourth ground point 74. For example, in Figure 4 and Figure 5 In the layout shown, the fourth grounding point 74 is located at the corner where the fourth sub-segment 622 and the fifth sub-segment 623 connect.
[0076] Specifically, the step portion 22 forms a clearance space 23, which is also used to set the fourth grounding point 74. As one embodiment, at least some of the grounding points 70 on the RF switch chip 100 are bumps disposed on the surface of the substrate 10, which have a certain cross-sectional area, that is, they need to occupy a sufficient area on the surface of the substrate 10. As an example, the aforementioned first grounding point 71, second grounding point 72, third grounding point 73, fourth grounding point 74, and the fifth grounding point 75, which will appear later, are all bumps disposed on the surface of the substrate 10.
[0077] like Figure 5 As shown, in some embodiments, a fifth ground point 75 is also provided on the substrate 10. The fifth ground point 75 is provided along the first side 11 and located on the side close to the second switch circuit module 40. The second trace 62 also includes a sixth sub-segment 624. One end of the sixth sub-segment 624 is connected to the third sub-segment 621, and the other end extends in the direction of the first side 11 and is connected to the fifth ground point 75.
[0078] It should be noted that, based on the third sub-segment 621, the fourth sub-segment 622, the fifth sub-segment 623, and the fourth grounding point 74, the additional provision of a fifth grounding point 75 and a sixth sub-segment 624 can further reduce signal crosstalk between the second switching circuit 43 and the control circuit module 20. Compared to the second trace 62 extending only to the area between the step portion 22 and the fourth switch setting portion 42, i.e., the position of the fifth sub-segment 623, the sixth sub-segment 624 is provided on the side of the step portion 22 near the fourth edge (see...). Figure 5 This allows the grounding line 60 to surround the control circuit module 20 from more directions, further improving the isolation between the second switching circuit 43 and the control circuit module 20.
[0079] As an example, compared to the scheme of setting the third sub-segment 621, the fourth sub-segment 622, the fifth sub-segment 623 and the fourth grounding point 74, the additional setting of the fifth grounding point 75 and the sixth sub-segment 624 can increase the isolation between the second switching circuit 43 and the control circuit module 20 by at least 3dB, which brings a significant improvement to the quality of radio frequency signal transmission.
[0080] like Figure 4 and Figure 5 As shown, in some embodiments, a plurality of grounding points 70 are provided on the substrate 10, and the plurality of grounding points 70 coincide with the routing path of the outer ring grounding trace 64. The outer ring grounding trace 64 can then be directly connected to the plurality of grounding points 70 along its routing path without requiring excessive additional line segments. Furthermore, based on the routing position of the outer ring grounding trace 70, the plurality of grounding points 70 coinciding with the routing path of the outer ring grounding trace 64 are located between the control circuit module 20 and the switch circuit module 50. The grounding points 70 themselves can also form ground isolation between the control circuit module 20 and the switch circuit module 50, reducing crosstalk in the radio frequency signal transmission on the control circuit module 20 and the switch circuit module 50, thereby improving the quality of radio frequency signal transmission.
[0081] In some embodiments, the first switch circuit module 30 and the second switch circuit module 40 are flush with one edge of the second side 12, and in the opposite direction of the first side 11 and the second side 12, the width of the first switch circuit module 30 is greater than the width of the control circuit module 20, the width of the second switch circuit module 40 is greater than the width of the control circuit module 20, and the width of the first switch circuit module 30 is greater than the width of the second switch circuit module 40.
[0082] Specifically, the relative directions of the first side 11 and the second side 12 mentioned above can be understood as the extension direction of the third side 13 or the extension direction of the fourth side 14. In the extension direction of the third side 13, the first switch circuit module 30 covers the control circuit module 20, and the second switch circuit module 40 also covers the control circuit module 20, so that the first switch module, the second switch module, and the first side 11 can surround the control circuit module 20. On the other hand, since part of the second switch circuit module 40 extends into the clearance space 23, and is limited by the control circuit module 20, in the extension direction of the third side 13 or the fourth side 14, the width of the first switch circuit module 30 is greater than the width of the second switch circuit module 40, so as to flexibly adapt to the outer contour of the control circuit module 20, thereby making full use of the area on the substrate 10, reducing the overall size and achieving miniaturization.
[0083] like Figure 4 and Figure 5As shown, in some embodiments, the RF switch chip 100 further includes a second RF input terminal 82 and a second RF transmission line 92. Specifically, the second RF input terminal 82 is connected to each of the second switch circuits 43 on the second switch circuit module 40 via the second RF transmission line 92 to transmit RF signals to the second switch circuits 43. As one embodiment, the second RF input terminal 82 is disposed along the third side 13, the second RF transmission line 92 is connected to the second RF input terminal 82, and a portion of the second RF transmission line 92 is disposed along the third side 13, while another portion of the second RF transmission line 92 is disposed along the second side 12.
[0084] In some embodiments, a portion of the second radio frequency transmission lines 92 are disposed on the side of the second switching circuit 43 near the second side 12 (i.e., the side away from the first side 11) and near the fourth side 14, while another portion of the second radio frequency transmission lines 92 are disposed on the side of the second switching circuit 43 near the fourth side 14 and near the second side 12.
[0085] As an example, a second radio frequency transmission line 92 disposed on the side of the second switch circuit 43 near the second side 12 is connected to the second switch circuit 43 on the third switch setting section 41 to transmit radio frequency signals to the second switch circuit 43 on the third switch setting section 41. On the other hand, a second radio frequency transmission line 92 disposed on the side of the second switch circuit 43 near the fourth side 14 is connected to the second switch circuit 43 on the fourth switch setting section 42 to transmit radio frequency signals to the second switch circuit 43 on the fourth switch setting section 42. It should be understood that the above arrangement makes full use of the edge positions on the substrate 10, that is, the positions between the second switch circuit module 40 and the second side 12 and the second switch circuit module 40 and the fourth side 14, and shortens the distance from the second radio frequency input terminal 82 to each second switch circuit 43, thereby improving the stability and consistency of signal transmission.
[0086] like Figure 7 As shown, this application embodiment also provides an RF front-end module 200, including an RF switch chip 100 as provided in any embodiment of this application.
[0087] like Figure 8 As shown, this application embodiment also provides an electronic device 300, including any of the radio frequency front-end modules 200 provided in this application embodiment or any of the radio frequency switch chips 100 provided in this application embodiment.
[0088] The electronic device 300 can be a mobile phone, tablet computer, vehicle terminal, or other communication device. Of course, it can also be other communication devices with communication functions. This application does not limit the specific type of electronic device 300. Furthermore, with the development of 5G technology, the performance requirements for radio frequency front-end modules are becoming increasingly stringent. The technical solution of this application can be applied to 5G radio frequency front-end modules to improve the communication performance of 5G communication devices.
[0089] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the scope of the technology disclosed in this application. These modifications or substitutions should all be covered within the scope of protection of this application, and the scope of protection of this application should be determined by the scope of the claims.
[0090] It should be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection via an intermediate medium; or a connection within two elements. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances. As used in this specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a," "an," and "the" are intended to include the plural forms. It should also be understood that the term "and / or" as used in this specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations. In this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system.
Claims
1. A radio frequency switch chip, characterized in that, The radio frequency switch chip includes: A substrate having opposing first and second sides, wherein at least one grounding point is provided on the substrate; A switching circuit module, comprising at least two switching circuits, wherein the two different switching circuits operate at different frequency bands; A control circuit module is disposed on the chip substrate and close to the first side. The control circuit module and the switch circuit module are disposed at intervals and electrically connected. The switching circuit module and the first side surround to form a target area, and at least a portion of the control circuit module is located within the target area; Furthermore, the substrate is provided with a grounding trace connected to the grounding point. The grounding trace includes at least an outer ring grounding trace, which is connected to the grounding point. At least a portion of the outer ring grounding trace is disposed between the switching circuit module and the control circuit module and surrounds the edge of the control circuit module near the switching circuit module.
2. The radio frequency switch chip as described in claim 1, characterized in that, The switching circuit module includes at least a first switching circuit module and a second switching circuit module, which are spaced apart along the second side. The first switching circuit module includes a first switching circuit, and the second switching circuit module includes a second switching circuit.
3. The radio frequency switch chip as described in claim 2, characterized in that, The grounding point includes at least a first grounding point and a second grounding point disposed along the first side, wherein the first grounding point is located between the control circuit module and the first switch circuit module, and the second grounding point is located between the control circuit module and the second switch circuit module; The outer grounding trace is connected to the first grounding point and the second grounding point, respectively.
4. The radio frequency switch chip as described in claim 2, characterized in that, The first switch circuit module includes a first switch setting part and a second switch setting part. The first switch setting part is disposed along the second side, and the second switch setting part is disposed along the third side. The first switch setting part and the second switch setting part are adjacent to each other. The third side is a side on the substrate that is connected to the first side and the second side and is close to the first switch setting part.
5. The radio frequency switch chip as described in claim 4, characterized in that, The outer ring grounding trace includes at least a first outer ring segment and a second outer ring segment connected together. The first outer ring segment is located between the first switching circuit module and the control circuit module, and the second outer ring segment is located between the second switching circuit module and the control circuit module. The first outer ring segment includes a first sub-segment and a second sub-segment. The first sub-segment is located between the first switch setting part and the control circuit module and is connected to the second outer ring segment. The second sub-segment is located between the second switch setting part and the control circuit module, with one end connected to the first sub-segment and the other end extending toward the first side.
6. The radio frequency switch chip as described in claim 5, characterized in that, The grounding point includes at least a third grounding point, which is located on the first sub-segment or the second sub-segment.
7. The radio frequency switch chip as described in claim 4, characterized in that, Along the extending direction of the third side, the width of the second switch setting part is greater than the width of the control circuit module.
8. The radio frequency switch chip as described in claim 2, characterized in that, The radio frequency switch chip further includes a first radio frequency input terminal and a first radio frequency transmission line disposed on the substrate. The first radio frequency input terminal is disposed along a fourth side, which is a side on the substrate that is connected to the first side and the second side and is close to the second switch setting part. The first radio frequency transmission line is connected to the first radio frequency input terminal and each of the first switch circuits and is used to transmit the radio frequency signal input from the first radio frequency input terminal to the corresponding first switch circuit. The first radio frequency transmission line and the control circuit module are located on opposite sides of the outer grounding trace, respectively.
9. The radio frequency switch chip as described in claim 8, characterized in that, The distance between the outer grounding trace and the first radio frequency transmission line is 15um-80um.
10. The radio frequency switch chip as described in claim 8, characterized in that, The grounding trace also includes a first trace, at least a portion of which is located between the first radio frequency transmission line and the second switching circuit module. The output terminal of the second switching circuit on the second switching circuit module can be grounded through the first trace. When the output terminal of the second switching circuit is grounded, the second switching circuit does not transmit the corresponding radio frequency signal.
11. The radio frequency switch chip as described in claim 10, characterized in that, The spacing between the first trace and the first radio frequency transmission line is 15um-80um.
12. The radio frequency switch chip as described in claim 8, characterized in that, The first switch circuit module includes a first switch setting part and a second switch setting part. The first switch setting part is disposed along the second side, and the second switch setting part is disposed along the third side. The first switch setting part and the second switch setting part are adjacent to each other. The third side is a side on the substrate that is connected to the first side and the second side and is close to the first switch setting part. Both the first switch setting part and the second switch setting part are provided with the first switch circuit.
13. The radio frequency switch chip as described in claim 12, characterized in that, The first radio frequency transmission line includes a first sub-transmission line, a second sub-transmission line, and a third sub-transmission line. One end of the first sub-transmission line is connected to the first radio frequency input terminal, and the other end extends towards the side close to the first switch module and is connected to the second sub-transmission line and the third sub-transmission line respectively, so that the second sub-transmission line and the third sub-transmission line form a branch. The second sub-transmission line is arranged along the extension direction of the first switch setting part, and the third sub-transmission line is arranged along the extension direction of the second switch setting part. Both the first switch setting part and the second switch setting part are provided with the first switch circuit. The first radio frequency input terminal is connected to the first switch circuit on the first switch setting part through the first sub-transmission line and the second sub-transmission line, and is also connected to the first switch circuit on the second switch setting part through the first sub-transmission line and the third sub-transmission line.
14. The radio frequency switch chip as described in claim 12, characterized in that, The distance between the first switch setting part and the second sub-transmission line is equal to the distance between the second switch setting part and the second sub-transmission line.
15. The radio frequency switch chip as described in claim 12, characterized in that, The grounding trace also includes a first trace, at least a portion of which is located on the side of the first switching circuit module away from the control circuit module, and the first trace is arranged around at least a portion of the outer edge of the first switching circuit module; The distance between the first switch setting part and the first trace is equal to the distance between the second switch setting part and the first trace.
16. The radio frequency switch chip as described in claim 8, characterized in that, The at least one grounding point includes at least a second grounding point disposed along the first side, the second grounding point being located between the control circuit module and the second switch circuit module, and the outer ring grounding trace being connected to the second grounding point; The distance between the second grounding point and the first radio frequency input terminal in the extension direction of the first side is 50um-200um.
17. The radio frequency switch chip as described in claim 2, characterized in that, The control circuit module includes a main body and a step portion. The main body and the step portion are arranged along the first side and are adjacent to each other. The main body is located on the side of the step portion near the third side. Along the extension direction of the third side, the width of the main body is greater than the width of the step portion, and the side of the step portion near the second side and the side of the main body portion near the step portion form a clearance space.
18. The radio frequency switch chip as described in claim 17, characterized in that, The second switch circuit module includes a third switch setting part and a fourth switch setting part. The third switch setting part is disposed along the second side, and the fourth switch setting part is disposed along the fourth side. The fourth side is a side on the substrate that is connected to the first side and the second side and is close to the second switch setting part. The side of the fourth switch setting part close to the second side is adjacent to the third switch setting part, and the side of the fourth switch setting part close to the first side extends into the clearance space.
19. The radio frequency switch chip as described in claim 18, characterized in that, The grounding trace also includes a second trace, which includes a third sub-segment, a fourth sub-segment, and a fifth sub-segment. The third sub-segment is located between the main body and the third switch setting part. The fourth sub-segment is located between the main body and the fourth switch setting part and is connected to the third sub-segment. The fifth sub-segment is located between the stepped part and the fourth switch setting part and is connected to the fourth sub-segment. The first radio frequency input terminal is located on the side of the fifth sub-segment closer to the stepped part.
20. The radio frequency switch chip according to any one of claims 17-19, characterized in that, A fourth grounding point is also provided on the substrate, the fourth grounding point is located within the clearance space, and at least one of the fourth sub-segment and the fifth sub-segment is connected to the fourth grounding point.
21. The radio frequency switch chip as described in claim 20, characterized in that, A fifth grounding point is also provided on the substrate, which is located along the first side and close to the second switching circuit module. The second routing also includes a sixth sub-segment, one end of which is connected to the third sub-segment, and the other end extends toward the first side and connects to the fifth grounding point.
22. The radio frequency switch chip as described in claim 2, characterized in that, The operating frequency bands of the at least two first switching circuits are all within the first frequency band set, and the operating frequency bands of the at least two second switching circuits are all within the second frequency band set, wherein the center frequency of any frequency band in the first frequency band set is greater than the center frequency of any frequency band in the second frequency band set.
23. The radio frequency switch chip as described in claim 1, characterized in that, The substrate has a plurality of grounding points, and the plurality of grounding points coincide with the routing path of the outer ring grounding trace.
24. A radio frequency front-end module, characterized in that, Includes the radio frequency switch chip as described in any one of claims 1-23.
25. An electronic device, characterized in that, Includes the RF switch chip as described in any one of claims 1-23 or the RF front-end module as described in claim 24.