Power brick

Abstract

The invention relates to a power brick, and relates to the technical field of controller heat dissipation, and the power brick comprises a heat dissipation assembly, and a capacitor module and an IGBT module which are installed on the heat dissipation assembly. The heat dissipation assembly comprises a shell, the shell is provided with a mounting cavity, a first cooling flow channel and a preset mounting position, and the mounting position and the mounting cavity are located on the two sides of the first cooling flow channel correspondingly and are oppositely arranged; the capacitor module is arranged in the mounting cavity; the IGBT module is arranged on the mounting position; and the cooling medium flowing through the first cooling flow channel simultaneously dissipates heat of the capacitor module and the IGBT module. The first cooling flow channel can directly dissipate heat for the IGBT module and the capacitor module at the same time, a traditional passive heat dissipation mode of natural convection of a capacitor or a simple cooling fin is replaced, synchronous active cooling of two types of core devices is achieved, and the heat dissipation efficiency is remarkably improved compared with a discrete design.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of controller heat dissipation, and in particular to a power brick. BACKGROUND

[0002] With the rapid development of new energy vehicles in the direction of high power and high integration, the power density, heat dissipation performance and reliability of a dual-motor controller as a core power control unit directly affect the power output and running stability of the vehicle. The power brick as a core power module carrier of the dual-motor controller integrates IGBT (Insulated Gate Bipolar Transistor), capacitors and other key power devices, and the structural design and heat dissipation efficiency thereof become the core bottleneck restricting the performance improvement of the dual-motor controller.

[0003] In the prior art, the power brick of the dual-motor controller generally adopts a discrete structure design, specifically, the IGBT module and the capacitor module are independently arranged, and the heat dissipation systems are separated from each other. That is, the IGBT module is usually cooled by an independent water cooling plate, and the cooling water channel can only cover the bottom area of the IGBT module, and the heat dissipation coverage range is limited. The heat dissipation mode of the capacitor as a key energy storage element in the power brick mainly depends on natural convection or an additional simple heat sink, and lacks active cooling design, so that the heat generated by the capacitor core in the working process cannot be quickly dissipated, and the temperature distribution is uneven. Such a discrete heat dissipation structure not only makes the space utilization rate of the heat dissipation system low, but also causes the capacitor module to easily have a local over-temperature phenomenon, thereby causing the performance attenuation of the capacitor and even failure, and seriously affecting the service life and operation reliability of the power brick. SUMMARY

[0004] The application provides a power brick to solve the technical problem that the discrete heat dissipation structure of the IGBT module and the capacitor module in the prior art not only makes the space utilization rate of the heat dissipation system low, but also easily causes the capacitor module to have a local over-temperature phenomenon, thereby causing the performance attenuation of the capacitor.

[0005] The application provides a power brick, which comprises a heat dissipation assembly, and a capacitor module and an IGBT module mounted on the heat dissipation assembly. The heat dissipation assembly comprises a shell, the shell has a mounting chamber, a first cooling flow channel and a preset mounting position, and the mounting position and the mounting chamber are arranged opposite to each other on two sides of the first cooling flow channel. The capacitor module is arranged in the mounting chamber, and the IGBT module is arranged on the mounting position. The cooling medium flowing through the first cooling flow channel simultaneously dissipates heat of the capacitor module and the IGBT module.

[0006] In an alternative embodiment, a second cooling flow channel is formed in the side wall of the mounting chamber.

[0007] In an alternative embodiment, a first heat dissipation rib is arranged in the second cooling flow channel.

[0008] In an alternative embodiment, the distribution density of the first heat dissipation rib gradually increases along the flow direction of the cooling medium.

[0009] In an alternative embodiment, the first heat dissipation rib is a straight fin, and the first heat dissipation rib extends along the flow direction of the cooling medium.

[0010] In an alternative embodiment, the inlet of the first cooling flow channel and the inlet of the second cooling flow channel are in communication, and the outlet of the first cooling flow channel and the outlet of the second cooling flow channel are in communication.

[0011] In an alternative embodiment, a mounting groove is formed on the mounting site, and the mounting groove is arranged in communication with the first cooling flow channel. The IGBT module is arranged in the mounting groove, and the IGBT module is arranged in sealing with the mounting groove.

[0012] In an alternative embodiment, the IGBT module and the mounting groove are sealed by a sealing ring.

[0013] In an alternative embodiment, a second heat dissipation rib is arranged on the surface of the IGBT module, and the second heat dissipation rib is arranged in the first cooling flow channel.

[0014] In an alternative embodiment, the capacitor module includes a capacitor and positive and negative plates connected with the capacitor, and the positive and negative plates are formed with corresponding first connection ends after being outwardly extended from the mounting chamber, and the IGBT module has second connection ends, and the second connection ends are laser welded and fixed with the corresponding first connection ends.

[0015] Compared with the prior art, the above technical solutions provided by the embodiments of the present application have the following advantages: The power brick provided by the embodiments of the present application has the following advantages: The power brick provided by the embodiments of the present application has the following advantages:

[0016] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the present application and, together with the description, further serve to explain the principles of the application.

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the accompanying drawings required by the embodiments or the prior art description will be briefly introduced as follows. Obviously, those skilled in the art can obtain other drawings according to these drawings without any creative effort.

[0018] One or more embodiments are illustrated by way of example in the drawings that are not intended to be limiting of the application, and the same or similar reference numerals designate similar components throughout the drawings and specification. The drawings are not necessarily to scale, the emphasis instead being placed upon illustrating the principles of the embodiments.

[0019] Figure 1 A structural schematic diagram of one embodiment of a power brick provided by the embodiment of the present application; Figure 2 A partial structural schematic diagram of the power brick provided by the embodiment of the present application; Figure 3 A structural schematic diagram of one embodiment of a heat dissipation assembly provided by the embodiment of the present application; Figure 4 A partial cross-sectional structural schematic diagram of the heat dissipation assembly provided by the embodiment of the present application; Figure 5 A partial cross-sectional structural schematic diagram of the heat dissipation assembly provided by the embodiment of the present application; Figure 6 A top view of the heat dissipation assembly of the power brick provided by the embodiment of the present application; Figure 7 Another structural schematic diagram of the heat dissipation assembly provided by the embodiment of the present application from another perspective; Figure 8 A schematic diagram of the circulation mode of the cooling medium in the second cooling flow channel and the third cooling flow channel provided by the embodiment of the present application; Figure 9 A partial structural schematic diagram of the capacitor module and the IGBT module provided by the embodiment of the present application; Figure 10 A bottom view of the IGBT module provided by the embodiment of the present application.

[0020] Explanation of reference numerals: 100, heat dissipation assembly; 110, shell; 111, mounting chamber; 112, bottom plate; 113, side plate; 114, mounting groove; 115, sealing ring; 116, connecting channel; 117, adapter cover plate; 118, opening groove; 120, first cooling flow channel; 130, inlet channel; 131, inlet cover plate; 132, cooling medium inlet; 133, first flow-through opening; 134, flow distribution plate; 140, outlet channel; 141, outlet cover plate; 142, cooling medium outlet; 143, second flow-through opening; 150, second cooling flow channel; 151, first heat dissipation rib; 160, third cooling flow channel; 200, capacitor module; 210, positive plate; 220, negative plate; 230, capacitor core package; 300, IGBT module; 310, working main body; 311, mounting plate; 312, first terminal; 313, second terminal; 320, second heat dissipation rib; 400, first circuit board; 500, shielding plate; 600, second circuit board. DETAILED DESCRIPTION

[0021] In order to make the objects, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0022] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and arrangements of the specific examples are described in the following. Of course, they are only examples and are not intended to limit the present application. Furthermore, the present application can repeatedly refer to the reference numerals and / or letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides various specific examples of processes and materials, but a person of ordinary skill in the art can realize the applicability of other processes and / or the use of other materials.

[0023] For the convenience of description, spatial relative terms can be used in the specification to describe the relative position relationship or movement condition of one element or feature relative to another element or feature as shown in the drawings, such as "inner", "outer", "inboard", "outboard", "under", "below", "on", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientations depicted in the drawings. For example, if the device in the drawings is turned over or the posture is changed or the movement state is changed, the directional indications will also change accordingly, for example: the element described as "under" or "below" another element or feature will be oriented as "above" or "above" another element or feature. Therefore, the example term "below" can include both the upper and lower positions. The device can be additionally oriented (rotated by 90 degrees or in other directions) and the spatial relative relationship descriptors used in the specification are interpreted accordingly.

[0024] To solve the technical problem that the separate heat dissipation structure of the IGBT module and the capacitor module in the prior art not only makes the space utilization rate of the heat dissipation system low, but also easily causes the capacitor module to have local over-temperature and causes the performance of the capacitor to decay, the application provides a power brick, which can realize synchronous active cooling of the IGBT module and the capacitor module and effectively improve the overall heat dissipation efficiency.

[0025] Figure 1 And Figure 2 The power brick provided by the embodiment of the application comprises a heat dissipation assembly 100 and a capacitor module 200 and an IGBT module 300 mounted on the heat dissipation assembly 100.

[0026] The heat dissipation assembly 100 comprises a shell 110, the shell 110 has a mounting chamber 111, a first cooling flow channel 120 and a preset mounting position, and the mounting position and the mounting chamber 111 are oppositely arranged on two sides of the first cooling flow channel 120.

[0027] The capacitor module 200 is arranged in the mounting chamber 111; and the IGBT module 300 is arranged on the mounting position.

[0028] The cooling medium flowing through the first cooling flow channel 120 simultaneously dissipates heat for the capacitor module 200 and the IGBT module 300.

[0029] Specifically, as Figures 2 to 4As shown, the shell 110 is a cuboid in overall shape, and a mounting chamber 111 is formed in the interior of the shell 110. The mounting chamber 111 is adapted to the capacitor module 200, and an opening is provided on the bottom surface of the mounting chamber 111 to allow the capacitor module 200 to enter the mounting chamber 111. A bottom plate 112 is arranged at the opening to close the opening and protect the capacitor module 200 from loosening or falling out of the mounting chamber 111 during movement of the vehicle.

[0030] The first cooling flow channel 120 extends along the length direction of the shell 110. Figures 4 to 7 As shown, the shell 110 also has a cooling medium inlet 132 and a cooling medium outlet 142, which are respectively in communication with the first cooling flow channel 120. The cooling medium enters the first cooling flow channel 120 through the cooling medium inlet 132, flows through the first cooling flow channel 120, and flows out of the first cooling flow channel 120 through the cooling medium outlet 142. The cooling medium flowing through the first cooling flow channel 120 can cool the IGBT module 300 arranged in the mounting groove 114, and the cooling medium in the first cooling flow channel 120 can also cool the capacitor module 200 arranged in the mounting chamber 111. By actively cooling the IGBT module 300 and the capacitor module 200 with the cooling medium, the overall heat dissipation efficiency of the power brick can be effectively improved.

[0031] Referring to Figure 1 and Figure 3 In an exemplary manner, the first cooling flow channel 120 can be integrated on the top surface of the shell 110, and the mounting position can also be integrated on the top surface of the shell 110 and in communication with the first cooling flow channel 120. The IGBT module 300 is arranged in the mounting position, and the cooling medium flowing through the first cooling flow channel 120 directly cools the IGBT module 300. At the same time, the mounting chamber 111 is arranged below the first cooling flow channel 120, and the flowing low-temperature cooling medium can absorb and carry away the heat generated by the capacitor module 200 and conducted to the shell 110, replacing the passive heat dissipation mode of the traditional capacitor natural convection or simple heat sink, to realize synchronous active cooling of the two types of core devices, and the heat dissipation efficiency is significantly improved compared with the separate design.

[0032] In addition, by virtue of the layout of the mounting chamber 111 and the first cooling flow channel 120, the cooling medium can continuously cool the capacitor module 200, quickly carry away the accumulated heat generated by the capacitor module 200 during operation, effectively improve the temperature unevenness caused by the lack of active cooling of the capacitor in the traditional separate design, prevent the formation of local hot spots, and ensure the stable working temperature of the capacitor module 200.

[0033] In addition, the first cooling flow channel 120 is integrated with the mounting chamber 111 in the same housing 110 in the embodiment, and the independent cooling circuit for the IGBT module 300 and the capacitor module 200 does not need to be designed respectively. The heat dissipation requirements of the two types of core devices can be met only by the first cooling flow channel 120, the layout logic of the dual-motor controller management system is simplified, the redundant design of the cooling circuit is reduced, the heat dissipation system and the device installation space are highly integrated, the overall structure of the power brick is more compact, the volume is more compact, the space utilization is significantly improved, and the compact layout requirement of the installation space in the new energy vehicle is more adapted.

[0034] As shown in Figures 4 to 7 In the embodiment, the entering passage 130 and the flowing-out passage 140 are respectively arranged at the left and right opposite ends of the mounting chamber 111 in the housing 110. Specifically, the bottom of the entering passage 130 is open and is provided with an inlet cover plate 131 matched with the opening, and a cooling medium inlet 132 is arranged on the inlet cover plate 131. The bottom of the flowing-out passage 140 is also open and is provided with an outlet cover plate 141 matched with the opening, and a cooling medium outlet 142 is arranged on the outlet cover plate 141. As known from the above, the first cooling flow channel 120 is integrated on the top surface of the housing 110. Therefore, the top of the entering passage 130 is provided with a first flow-through opening 133, and the first flow-through opening 133 is in communication with the inlet of the first cooling flow channel 120. The top of the flowing-out passage 140 is provided with a second flow-through opening 143, and the second flow-through opening 143 is in communication with the outlet of the first cooling flow channel 120.

[0035] Therefore, the cooling medium is pumped out by the cooling system, flows into the entering passage 130 through the cooling medium inlet 132, and flows upward along the entering passage 130 under the driving force of the cooling system. After flowing upward to the top of the entering passage 130, the cooling medium enters the first cooling flow channel 120 through the first flow-through opening 133, continuously flows along the extension direction of the first cooling flow channel 120, enters the flowing-out passage 140 through the second flow-through opening 143, and finally flows out from the cooling medium outlet 142, forming a complete closed loop circulation. The flow path of the cooling medium is smooth without sharp bends, has less vortex and small resistance, and ensures that the cooling medium can flow smoothly.

[0036] In the above flow process, the cooling medium flows through the left and right end surfaces and the top surface of the capacitor module 200 in sequence, can absorb and take away the heat conducted by the capacitor module 200 to the three surfaces of the housing 110, and realizes effective cooling of the capacitor module 200. In addition, in the embodiment, the design of the water inlet and outlet at the bottom is consistent with the docking direction of the cooling pipe of the whole vehicle, which reduces the assembly difficulty.

[0037] In some embodiments, the second cooling flow channel 150 is formed in the side wall of the mounting chamber 111.

[0038] As shown in Figure 7 and Figure 8 The second cooling flow channel 150 is in communication with the cooling medium inlet 132 and the cooling medium outlet 142, respectively, and preferably, the second cooling flow channel 150 can be provided on both sides of the installation chamber 111. Here, for the sake of distinction, the cooling flow channel located on one side of the installation chamber 111 is referred to as the second cooling flow channel 150, and the cooling flow channel located on the other side of the installation chamber 111 is referred to as the third cooling flow channel 160. The third cooling flow channel 160 is also in communication with the cooling medium inlet 132 and the cooling medium outlet 142, respectively.

[0039] As shown in Figure 8 The second cooling flow channel 150 and the third cooling flow channel 160 both extend along the length direction of the side wall of the housing 110, and the two ends of the flow channel are in communication with the inlet passage 130 and the outlet passage 140, respectively. The second cooling flow channel 150 and the third cooling flow channel 160 are in the same extension direction as the first cooling flow channel 120, and in combination with the inlet passage 130 and the outlet passage 140, they can ultimately ensure that the cooling medium can effectively wrap the front, back, left, right, and top of the capacitor module 200, the five main heat-emitting surfaces, achieving multi-angle surrounding uniform heat dissipation of the capacitor module 200, and effectively significantly improving the comprehensiveness and effectiveness of the capacitor module 200 heat dissipation.

[0040] Because the cooling medium can uniformly act on the five main heat-emitting surfaces of the capacitor module 200, effectively eliminating the local hot spot problem caused by uneven heat dissipation in traditional designs, the overall temperature distribution of the capacitor module 200 is more uniform, and the working temperature is more stable, effectively avoiding the risk of capacitor performance degradation, shortened life, or even failure caused by local overheating, significantly improving the working reliability and stability of the capacitor module 200 and even the entire power brick.

[0041] Based on the above, the first cooling flow channel 120, the second cooling flow channel 150, and the third cooling flow channel 160 are all filled with cooling medium through the cooling medium inlet 132 and all discharge the cooling medium through the cooling medium outlet 142. Therefore, a plurality of equidistantly spaced flow distribution plates 134 can be arranged in the inlet channel 130 and the outlet channel 140. The flow distribution plates 134 can separate a single channel into a plurality of independent small channels. After the cooling medium enters the cooling medium inlet 132, it is uniformly distributed into the plurality of independent small channels under the guidance of the flow distribution plates 134 and then uniformly enters the plurality of cooling flow channels. This design effectively avoids the problem of uneven flow caused by the flow inertia of the cooling medium, i.e., the high flow rate in the center and the low flow rate at the edge. It ensures sufficient flow of the cooling medium through the first cooling flow channel 120, the second cooling flow channel 150, and the third cooling flow channel 160, thereby ensuring the heat dissipation conditions of the core device and solving the problem of insufficient local heat dissipation or excessive cooling caused by uneven flow distribution, and ensuring the uniformity of the overall temperature of the power brick.

[0042] In some embodiments, the first heat dissipation rib 151 is arranged in the second cooling flow channel 150.

[0043] As shown in FIG. 1, it can be understood that in the present embodiment, the first heat dissipation rib 151 is arranged in the second cooling flow channel 150 and the third cooling flow channel 160. The first heat dissipation rib 151 can increase the heat exchange area and effectively improve the heat exchange capacity of the cooling medium, so that the cooling medium can take away more heat and accelerate the cooling speed of the capacitor module 200. Figure 3

[0044] Preferably, the first heat dissipation rib 151 is integrally formed on the side wall of the flow channel, which fully utilizes the space resources of the second cooling flow channel 150 and the third cooling flow channel 160 without the need to additionally expand the volume of the flow channel, thereby meeting the compact design requirements of the power brick.

[0045] Further, in order to facilitate cleaning of the second cooling flow channel 150 and the third cooling flow channel 160, a notch can be arranged at a position corresponding to the second cooling flow channel 150 and the third cooling flow channel 160 on the outside of the shell 110, and a detachable side plate 113 can be matched at the notch.

[0046] In some embodiments, the distribution density of the first heat dissipation rib 151 gradually increases along the flow direction of the cooling medium.

[0047] As shown in FIG. 1, it can be understood that in the present embodiment, the first heat dissipation rib 151 is arranged in the second cooling flow channel 150 and the third cooling flow channel 160. The first heat dissipation rib 151 can increase the heat exchange area and effectively improve the heat exchange capacity of the cooling medium, so that the cooling medium can take away more heat and accelerate the cooling speed of the capacitor module 200. Figure 3 ​As shown, three groups of first heat dissipation ribs 151 are sequentially and spacedly arranged in the second cooling flow channel 150 along the flow direction of the cooling medium, and the three groups of first heat dissipation ribs 151 are sequentially defined as a first group of first heat dissipation ribs, a second group of first heat dissipation ribs and a third group of first heat dissipation ribs along the flow direction of the cooling medium, wherein the first group of first heat dissipation ribs is close to the inlet passage 130, the third group of first heat dissipation ribs is close to the outlet passage 140, and the second group of first heat dissipation ribs is arranged between the first group of first heat dissipation ribs and the third group of first heat dissipation ribs; the first group of first heat dissipation ribs includes two rib strips sequentially and spacedly arranged along the height direction of the mounting chamber 111, the second group of first heat dissipation ribs includes three rib strips sequentially and spacedly arranged along the height direction of the mounting chamber 111, and the third group of first heat dissipation ribs includes four rib strips sequentially and spacedly arranged along the height direction of the mounting chamber 111.

[0048] When the cooling medium flows along the second cooling flow channel 150, the temperature of the cooling medium gradually rises due to continuous heat absorption, and the cooling capacity of the cooling medium decreases. However, the design of the present application can balance the heat dissipation efficiency of the second cooling flow channel 150 by differentiating the layout of the first heat dissipation ribs 151 with increasing density, so that the low-temperature area at the front of the second cooling flow channel 150 can meet the basic heat dissipation requirements with fewer first heat dissipation ribs 151, and the high-temperature area at the rear can increase the heat exchange area with more first heat dissipation ribs 151 to compensate for the decrease in heat dissipation capacity caused by the temperature rise of the cooling medium.

[0049] By designing non-uniform first heat dissipation ribs 151 throughout the flow channel, the temperature of each part of the capacitor module 200 is more balanced, and local high-temperature accumulation caused by insufficient heat dissipation at the rear of the second cooling flow channel 150 is avoided, which can effectively reduce the risk of performance degradation and material aging of the capacitor module 200 caused by temperature fluctuations, ensure the long-term stability of the electrical performance parameters of the capacitor module 200, and prolong the overall service life of the power brick.

[0050] The distribution of the first heat dissipation ribs 151 in the third cooling flow channel 160 is the same as that in the second cooling flow channel 150, which will not be described here.

[0051] In some embodiments, the first heat dissipation ribs 151 are straight fins, and the first heat dissipation ribs 151 extend along the flow direction of the cooling medium.

[0052] As shown in the drawings, Figure 3 The first heat dissipation ribs 151 are long strip-shaped protrusions extending along the flow direction of the cooling medium, and the plurality of first heat dissipation ribs 151 in each group of first heat dissipation ribs 151 are arranged in parallel. The straight fins extend along the flow direction of the cooling medium, which can reduce the obstruction to the flowing cooling medium, reduce the flow resistance of the cooling medium, and avoid flow attenuation caused by excessive resistance.

[0053] Of course, the first heat dissipation rib 151 can also be needle-shaped, wave-shaped, etc. If it is needle-shaped, one end of the first heat dissipation rib 151 is fixed to the side wall of the flow channel, and the needle tip end faces the inside of the flow channel. If it is wave-shaped, the first heat dissipation rib 151 is a wave-shaped protrusion extending in the direction of the flow of the cooling medium as a whole.

[0054] In some embodiments, in order to facilitate positioning and installation of the IGBT module 300, mounting grooves 114 are formed on the mounting positions, and the mounting grooves 114 are arranged in communication with the first cooling flow channel 120.

[0055] The IGBT module 300 is arranged in the mounting groove 114, and the IGBT module 300 is arranged in sealing with the mounting groove 114.

[0056] As shown in Figs. 1 and 2, for example, Figure 4 and Figure 6 The mounting groove 114 is arranged on the top surface of the housing 110, and two are arranged in sequence in the direction of the flow of the cooling medium, and the IGBT module 300 corresponds to the mounting groove 114 one by one. Of course, the number of mounting grooves 114 is not fixed, and can be adjusted according to the installation requirements of the IGBT module 300. The sealing arrangement can prevent leakage of the cooling medium and avoid corrosion of the IGBT module 300 by the cooling medium.

[0057] In some embodiments, the IGBT module 300 and the mounting groove 114 can be sealed by a sealing ring 115.

[0058] As shown in Figs. 1 and 2, for example, Figures 4 to 6 The top surface of the mounting groove 114 is provided with an annular groove, and the sealing ring 115 is installed in the annular groove. The IGBT module 300 has a mounting plate 311 at the bottom, and when mounted, the bottom surface of the mounting plate 311 is attached to the top surface of the mounting groove 114. At this time, the top surface of the sealing ring 115 can be tightly attached to the bottom surface of the mounting plate 311 to form a continuous and gapless sealing interface, avoiding the penetration of the cooling medium from the joint between the two.

[0059] In some embodiments, the IGBT module 300 is provided with a second heat dissipation rib 320 on the surface, and the second heat dissipation rib 320 is arranged in the first cooling flow channel 120.

[0060] As shown in Figs. 1 and 2, for example, Figures 4 to 6As shown, in the embodiment, the two installation grooves 114 are in communication with each other, and the first communication opening is in communication with one of the installation grooves 114, and the second communication opening is in communication with the other installation groove 114, so that the two installation grooves 114 in communication with each other form the first cooling flow channel 120. The IGBT module 300 includes a working main body 310 and a second heat dissipation rib 320. The mounting plate 311 is arranged at the bottom of the working main body 310, one end of the second heat dissipation rib 320 is fixed to the bottom surface of the mounting plate 311, and the other end vertically extends into the installation groove 114 and directly contacts the cooling medium. Compared with the prior art of arranging a cooling water plate at the bottom of the IGBT module 300, the technical solution provided in the embodiment has more sufficient heat dissipation contact, can quickly take away the heat generated by the working main body 310 of the IGBT module 300 through the second heat dissipation rib 320, avoids the problems of thermal breakdown and thermal fatigue caused by local overheating, and improves the working reliability of the IGBT module 300.

[0061] The second heat dissipation ribs 320 are arranged in a staggered manner along the length direction and the width direction of the bottom surface of the IGBT module 300.

[0062] As shown in the figure, Figure 10 Preferably, the plurality of second heat dissipation ribs 320 are arranged in a staggered manner along the length direction and the width direction of the bottom surface of the IGBT module 300. Along the width direction, the second heat dissipation ribs 320 in the front row are uniformly and spacedly arranged, and each second heat dissipation rib 320 in the rear row corresponds to the middle position of two adjacent second heat dissipation ribs 320 in the front row, that is, the projection of the second heat dissipation rib 320 in the rear row falls in the spacing region between the two adjacent second heat dissipation ribs 320 in the front row, forming a staggered complementary arrangement structure.

[0063] The staggered arrangement of the second heat dissipation ribs 320 avoids the waste of the gap, effectively improves the effective contact area of the cooling medium with the second heat dissipation ribs 320, and significantly improves the heat exchange efficiency in a unit space.

[0064] Based on the above structure, the specific flow path of the cooling medium is as follows: the cooling medium enters from the cooling medium inlet 132, sequentially flows through the entering channel 130, one of the installation grooves 114, the connecting channel 116, the other installation groove 114, and the flowing-out channel 140, and finally flows out from the cooling medium outlet 142, forming a complete closed-loop cooling circuit. The heat generated by the working main body 310 of the IGBT module 300 is transferred to the second heat dissipation rib 320, and the flowing cooling medium quickly takes away the heat on the second heat dissipation rib 320 through heat conduction, thereby achieving heat dissipation of the IGBT module 300.

[0065] As shown in the figure, Figures 4 to 6As shown, in order to facilitate the flow of cooling medium between the two mounting grooves 114, a connecting channel 116 capable of connecting the two mounting grooves 114 is provided between the two mounting grooves 114. In the present embodiment, the connecting channel 116 is provided at the lower part of the groove wall shared by the two mounting grooves 114, but in actual production process, a notch needs to be formed at the position corresponding to the connecting channel 116 on the top surface of the shell 110 to realize the opening of the connecting channel 116. Therefore, in order to seal the notch, a transition cover plate 117 is covered at the notch, the bottom surface of the transition cover plate 117 is flush with the top surface of the mounting chamber 111, which does not affect the installation of the capacitor module 200; while the top surface of the transition cover plate 117 is slightly lower than the top surface of the shell 110, so as not to occupy the space of the connecting channel 116 and affect the flow of the cooling medium.

[0066] The groove wall of the mounting groove 114 can limit the front-to-back and left-to-right displacement of the IGBT module 300, avoid the position deviation of the IGBT module 300 due to vibration and impact during vehicle driving, and ensure that the relative positions of the mounting groove 114 and the IGBT module 300 and the connecting channel 116 and the cooling flow channel are always accurate, thereby ensuring the stable function of the heat dissipation system. The transition cover plate 117 can prevent the cooling medium from leaking into the mounting chamber 111 through the notch, and avoid the short circuit or performance degradation of the capacitor module 200 due to contact with the cooling medium.

[0067] In some embodiments, the capacitor module 200 includes a capacitor core package 230, and positive and negative electrode plates 210 and 220 connected with the capacitor core package 230. The positive and negative electrode plates 210 and 220 are formed with corresponding first connecting ends after extending outward from the mounting chamber 111. The IGBT module 300 has second connecting ends, and the second connecting ends are laser welded and fixed with the corresponding first connecting ends.

[0068] As shown in Figure 5 , Figure 6 and Figure 9 , the top surface of the shell 110 has an open groove 118, the open groove 118 is in communication with the mounting chamber 111, the capacitor core package 230 is arranged in the mounting chamber 111, and the positive and negative electrode plates 210 and 220 are L-shaped. One end of the horizontal section of the positive and negative electrode plates 210 and 220 is electrically connected with the corresponding electrode pin of the capacitor core package 230, the other end extends a certain distance in the horizontal direction and then continues to extend upward in the vertical direction, and finally extends out of the shell 110 from the open groove 118. The extended end of the positive and negative electrode plates 210 and 220 is the first connecting end.

[0069] The positive plate 210 and the negative plate 220 are led out only through the open slot 118 of the top surface of the shell 110, without additional openings in the side wall, bottom surface, and other key heat dissipation walls of the installation chamber 111. On the one hand, it avoids leakage of the cooling medium through the additional openings, and on the other hand, it also prevents impurities such as dust and water vapor from invading the installation chamber 111 to corrode the capacitor core package 230, thereby ensuring the protection performance of the capacitor module 200, without damaging the heat conduction path of the plurality of cooling flow channels, and ensuring that the cooling effect of the capacitor module 200 is not affected.

[0070] Preferably, the installation chamber 111 is filled with a filling material to fill the remaining space in the installation chamber 111. After the filling material fills the remaining space in the installation chamber 111, it forms a full-wrapped support for the capacitor core package 230, tightly fixes the capacitor core package 230, and eliminates the gap between the capacitor core package 230 and the installation chamber 111. Under the whole vehicle vibration, impact or jolt working condition, the filling material can absorb vibration energy through its elastic deformation, limit the displacement and shaking of the capacitor core package 230, avoid fatigue fracture or looseness of the core package pin, the positive plate 210 and the negative plate 220 connection points, and significantly improve the reliability of the capacitor module 200 under complex working conditions.

[0071] As shown in Figure 9 The working body 310 has a first terminal 312 and a second terminal 313. The first connecting end of the positive plate 210 is overlapped and laser welded with the first terminal 312, and the first connecting end of the negative plate 220 is overlapped and laser welded with the second terminal 313.

[0072] The overlapped connection mode effectively increases the contact area of the positive plate 210 and the first terminal 312, and the contact area of the negative plate 220 and the second terminal 313, which can effectively reduce the energy loss in the current transmission process and avoid local heating caused by poor contact, thereby ensuring the stability and reliability of the electrical connection under high current and high power working conditions. At the same time, the first connecting end of the positive plate 210 and the first connecting end of the negative plate 220 are overlapped and fixed with the first terminal 312 and the second terminal 313 of the working body 310 by laser welding. The high energy density characteristics of laser welding can form a narrow and deep weld, so that the metal atoms of the two are metallurgically combined, and the connection strength is significantly improved compared with traditional bolt connection. Laser welding can effectively solve the technical problem of large contact resistance caused by improper tightening torque and substandard overlapping flatness.

[0073] In addition, vibration, impact and temperature cycle during vehicle driving can cause traditional mechanical connection to loosen and age, while the weld of laser welding has excellent fatigue resistance and structural integrity, which can effectively resist the stress effect caused by vibration and impact.

[0074] As shown in Figure 1As shown, the power brick further comprises a first circuit board 400, a shielding plate 500 and a second circuit board 600, wherein the IGBT module 300, the first circuit board 400, the shielding plate 500 and the second circuit board 600 are sequentially stacked in the vertical direction at the upper portion of the housing 110.

[0075] The first circuit board 400 is a control integrated board, and the second circuit board 600 is a driving integrated board. The control integrated board is arranged in the shielding plate 500, and the shielding plate 500 and the second circuit board 600 are arranged with a spacing therebetween and have a plurality of support columns therebetween. The second circuit board 600 is connected to the first side of the housing 110. The IGBT module 300, the first circuit board 400, the shielding plate 500 and the second circuit board 600 are bolted to the housing 110. The mechanical fastening force of the bolt connection is significantly higher than that of the buckle, adhesive and other methods, and can effectively resist the vibration, impact and stress generated during the circulation of the cooling medium during the driving of the whole vehicle.

[0076] It should be understood that the terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises", "comprising", "includes", "including" and "has" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order in which they are described, unless specifically identified as an order dependent step. It is also to be understood that additional or alternative steps can be employed.

[0077] Although the terms first, second, third, and the like can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can be only used to differentiate one element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, terms such as "first", "second" and other numeric terms when used herein do not imply a sequence or order. Thus, a first element, component, region, layer or section discussed below can be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

[0078] The foregoing is considered as illustrative only of the principles of the application. Numerous modifications and changes will readily occur to those skilled in the art, and it is intended to embrace all such modifications and changes that fall within the scope of the application. Accordingly, the application is not to be restricted in scope to the specific embodiments disclosed herein but is to be accorded the full scope that the principles and novel features request appropriately granted.

Claims

1. A power brick, characterized in that, It includes a heat dissipation assembly (100) and a capacitor module (200) and an IGBT module (300) mounted on the heat dissipation assembly (100). The heat dissipation assembly (100) includes a housing (110), the housing (110) having a mounting chamber (111), a first cooling channel (120) and a preset mounting position, the mounting position and the mounting chamber (111) being respectively located on opposite sides of the first cooling channel (120); The capacitor module (200) is disposed within the mounting chamber (111); the IGBT module (300) is disposed at the mounting position; The cooling medium flowing through the first cooling channel (120) simultaneously dissipates heat from the capacitor module (200) and the IGBT module (300).

2. The power brick according to claim 1, characterized in that, A second cooling channel (150) is formed in the side wall of the mounting chamber (111).

3. The power brick according to claim 1, characterized in that, The second cooling channel (150) is provided with a first heat dissipation rib (151).

4. The power brick according to claim 3, characterized in that, The distribution density of the first heat dissipation rib (151) gradually increases along the flow direction of the cooling medium.

5. The power brick according to claim 3, characterized in that, The first heat dissipation rib (151) is a straight rib, and the first heat dissipation rib (151) extends along the flow direction of the cooling medium.

6. The power brick according to claim 2, characterized in that, The inlet of the first cooling channel (120) is connected to the inlet of the second cooling channel (150), and the outlet of the first cooling channel (120) is connected to the outlet of the second cooling channel (150).

7. The power brick according to claim 1, characterized in that, A mounting groove (114) is formed on the mounting position, and the mounting groove (114) is connected to the first cooling channel (120); The IGBT module (300) is disposed in the mounting slot (114), and the IGBT module (300) is sealed to the mounting slot (114).

8. The power brick according to claim 7, characterized in that, The IGBT module (300) and the mounting groove (114) are sealed by a sealing ring (115).

9. The power brick according to claim 7, characterized in that, The surface of the IGBT module (300) is provided with a second heat dissipation rib (320), which is located inside the first cooling channel (120).

10. The power brick according to claim 1, characterized in that, The capacitor module (200) includes a capacitor core (230) and a positive plate (210) and a negative plate (220) connected to the capacitor core (230). The positive plate (210) and the negative plate (220) extend outward from the mounting chamber (111) and form corresponding first connection ends. The IGBT module (300) has a second connection end, which is laser welded to the corresponding first connection end.

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