Two-phase flow manifold cold plate device for data center cabinet

Abstract

The invention relates to the technical field of heat dissipation, and discloses a two-phase flow manifold cold plate device for a data center cabinet, the two-phase flow manifold cold plate device comprises an upper shell, a throttling structure and a lower shell, and the bottom of the upper shell is concavely provided with a pressure stabilizing cavity, a flow guide channel and an outlet cavity and is provided with separation convex strips; the diversion channel comprises a plurality of inlet manifolds of which one ends are arranged to the bottoms of the separation convex strips and the other ends are closed, and a plurality of outlet manifolds of which one ends are only communicated with the outlet cavity and the other ends are closed and which are arranged among the plurality of inlet manifolds in parallel; the throttling structure comprises a plurality of throttling branches and a plurality of throttling stand columns, wherein the throttling branches are concavely arranged from the bottoms of the separation protruding strips, the two ends of each throttling branch are communicated with the corresponding inlet manifold and the corresponding flow guide channel, the throttling stand columns extend from the inner top walls of the inlet manifolds and are arranged opposite to the throttling branches, and gaps are formed between the throttling stand columns and the throttling branches. And the lower shell is hermetically sealed corresponding to the bottom of the upper shell.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more particularly to a two-phase flow manifold cold plate device for data center cabinets. Background Technology

[0002] With the rapid development of AI and the current state of transistor miniaturization approaching physical limits, in order to continuously improve computing power, the industry has shifted to the idea of ​​expanding chip area to integrate more transistors. A large number of electronic chips are developing towards large area, high power density, and high performance. The heat dissipation rate of single packaged chips has increased significantly, which has greatly increased the difficulty of component temperature control, thereby affecting its performance stability, service life and safety. Therefore, high-efficiency cooling technology has become the key to the normal operation of electronic devices.

[0003] However, traditional single-phase liquid cooling technology is difficult to meet the demand for high-efficiency cooling, and single-phase liquid cooling will cause problems such as leakage and easy blockage. Therefore, the industry has turned to two-phase liquid and vapor cooling technology for optimization. However, the boiling process caused by the change of liquid and vapor phases will cause uneven flow in the flow channel, resulting in disadvantages such as low temperature uniformity, large pressure loss and poor flow stability. Summary of the Invention

[0004] To address the aforementioned technical problems, the purpose of this application is to provide a two-phase flow manifold cold plate device for data center cabinets. This device utilizes the throttling process of the pressure stabilizing chamber flowing into the throttling manifold to achieve uniform refrigerant distribution. Furthermore, through the structure of the throttling manifold and throttling column, the liquid refrigerant is effectively and uniformly delivered to the guide channel. As a result, the two-phase flow manifold cold plate device provided by this application has the functions of uniform temperature and flow rate, low pressure loss, and high flow stability.

[0005] To achieve the above objectives, this application provides a two-phase flow manifold cold plate device for a data center cabinet, in which refrigerant can circulate. The two-phase flow manifold cold plate device includes: an upper housing, the bottom of which is recessed and arranged in sequence with a pressure stabilizing chamber, a flow guide channel and an outlet chamber, and has a partition strip formed between the pressure stabilizing chamber and the flow guide channel. The flow guide channel includes a plurality of inlet manifolds recessed from the bottom of the upper housing and opened at one end to the bottom of the partition strip and closed at the other end, and a plurality of outlet manifolds connected at one end to the outlet chamber and closed at the other end and arranged in parallel between the plurality of inlet manifolds. The throttling structure includes a plurality of throttling manifolds recessed at intervals from the bottom of the dividing protrusion and connected at both ends to the pressure stabilizing chamber and each of the inlet manifolds, and a plurality of throttling columns extending from the inner top wall of each of the inlet manifolds and arranged opposite to the plurality of throttling manifolds, with a gap between each of the throttling columns and each of the throttling manifolds. The lower housing is tightly sealed to the bottom of the upper housing and abuts against the partition strip and the plurality of throttling columns. The lower housing has an internal heat exchange chamber communicating with the flow channel. The heat dissipation fin assembly is housed in the heat exchange cavity; The refrigerant flows sequentially from the pressure stabilizing chamber, the plurality of throttling manifolds, the plurality of inlet manifolds, the heat exchange chamber, and the plurality of outlet manifolds to the outlet chamber. The refrigerant entering each of the gaps is blocked by each of the throttling columns and is diverted along both sides of each of the throttling columns.

[0006] In some embodiments, each inlet manifold extends to one end of the bottom of the dividing ridge to form a gradually widening channel whose width gradually increases away from each throttling manifold.

[0007] In some embodiments, each of the expanding channels has a flared groove on its sidewall adjacent to each of the throttling manifolds, and each throttling column extends from the inner top wall of each of the expanding channels and is erected in the middle of each flared groove.

[0008] In some embodiments, the end of each inlet manifold away from each of the expanding channels forms a narrowing channel whose width gradually decreases in the direction away from each of the expanding channels, and the width of each outlet manifold gradually increases in the direction approaching the outlet cavity.

[0009] In some embodiments, the upper housing extends with a serrated fin disposed between the dividing ridge and the outlet cavity, the tapering channel of the plurality of inlet manifolds is formed on the side of the serrated fin adjacent to the dividing ridge, and the plurality of outlet manifolds are formed on the side of the serrated fin adjacent to the outlet cavity.

[0010] In some embodiments, the lower housing is sealed below the pressure stabilizing chamber, each of the throttling manifolds, each of the diverging channels and the outlet chamber, and the heat exchange chamber is recessed from the top of the lower housing and is disposed opposite to each of the contracting channels and each of the outlet manifolds.

[0011] In some embodiments, the heat dissipation fin assembly includes a plurality of heat dissipation fins spaced apart and arranged side by side, the plurality of heat dissipation fins abutting against the serrated fins, and a plurality of heat dissipation channels are formed between the plurality of heat dissipation fins perpendicular to the plurality of tapered channels and the plurality of outlet manifolds.

[0012] In some embodiments, the lower housing includes a finned base plate and a hollow partition. The plurality of heat dissipation fins extend upward from the finned base plate. The hollow partition is sandwiched between the upper housing and the finned base plate. A portion of the hollow partition has a perforation that is configured opposite to each of the tapered channels and each of the outlet manifolds to form the heat exchange cavity. Another portion is blocked below the pressure stabilizing cavity, each of the throttling manifolds, each of the expanding channels and the outlet cavity and abuts against the partition strip and the plurality of throttling columns.

[0013] In some implementations, the height of each outlet manifold is greater than the height of each inlet manifold, and the height of each throttling manifold is equal to the height of each inlet manifold.

[0014] In some implementations, the height of the pressure regulating chamber is greater than the height of each of the throttling manifolds.

[0015] In some embodiments, the upper housing is provided with a liquid inlet communicating with the pressure stabilizing chamber and a steam outlet communicating with the outlet chamber. The upper housing and the lower housing are provided with a plurality of heat source positioning holes arranged around the pressure stabilizing chamber, the outlet chamber and the heat exchange chamber.

[0016] In some implementations, the height of each outlet manifold is two to four times greater than the height of each inlet manifold.

[0017] In some implementations, the width of each outlet manifold is two to four times greater than the width of each inlet manifold.

[0018] Compared with the prior art, this application has at least the following beneficial effects: In this application, the refrigerant is throttled through the inlet of the throttling manifold, i.e., through the sudden narrow slit. This increases the refrigerant velocity and causes resistance loss. However, a buffer chamber is formed behind the slit. The high-speed refrigerant jet flowing through the slit impacts the throttling column in the buffer chamber, creating a local high-pressure stagnation zone. It is then split into two streams that bypass both sides of the throttling column. Under the action of the buffer chamber, the two streams impact each other in oblique directions, creating sufficient fluid mixing disturbance. This causes the high-speed refrigerant to decelerate rapidly in a short area, preventing the low-pressure zone after throttling from affecting the flow distribution near the inlet of the guide channel. In other words, through the structure of the throttling manifold and the throttling column, a large pressure difference is created between the pressure stabilizing chamber and the guide channel, which significantly reduces the impact of the increased back pressure caused by two-phase boiling on the flow distribution. This allows the refrigerant to flow steadily from the pressure stabilizing chamber to the guide channel. Thus, the two-phase flow manifold cold plate device of this application has the effects of uniform temperature and flow velocity, low pressure loss, and high flow stability. Attached Figure Description

[0019] The preferred embodiments will now be described in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of this application.

[0020] Figure 1 This is an exploded perspective view of the two-phase flow manifold cold plate device in this application; Figure 2 This is a three-dimensional schematic diagram of the upper shell in this application; Figure 3 yes Figure 2 Enlarged view of the area circled in the middle; Figure 4 This is a three-dimensional assembly diagram of the two-phase flow manifold cold plate device in this application; Figure 5 This is a cross-sectional schematic diagram of the two-phase flow manifold cold plate device in this application; Figure 6 This is another cross-sectional schematic diagram of the two-phase flow manifold cold plate device in this application; Figure 7 This is another cross-sectional schematic diagram of the two-phase flow manifold cold plate device in this application; Figure 8 It is in this application Figure 7 Enlarged view of the area selected by the rectangle; Figure 9 This is another cross-sectional schematic diagram of the two-phase flow manifold cold plate device in this application; Figure 10 This is a three-dimensional assembly diagram of the liquid cooling heat dissipation system in this application.

[0021] Reference numerals: 10: Two-phase flow manifold cold plate assembly; 1: Upper shell; 11: Pressure stabilizing chamber; 12: Outlet chamber; 13: Flow guide channel; 131: Inlet manifold; 132: Outlet manifold; 133: Separating ridge; 134: Diverging channel; 135: Contracting channel; 136: Flaring groove; 14: Serrated fins; 15: Liquid inlet; 16: Steam outlet; 2: Lower shell; 21: Heat exchange chamber; 22: Finned base plate; 23: Hollow partition; 2 31: Hollowed-out opening; 3: Heat dissipation fin assembly; 31: Heat dissipation fin; 32: Heat dissipation channel; 4: Heat source positioning hole; 20: Liquid storage tank; 30: Pump; 41: Liquid radiator; 50: Liquid inlet assembly; 51: Main liquid delivery pipe; 52: Diverter; 53: Auxiliary liquid delivery pipe; 55: Outer sheath; 60: Steam outlet assembly; 61: Main steam delivery pipe; 62: Main bus; 63: Auxiliary steam delivery pipe; 7: Throttling structure; 71: Throttling manifold; 72: Throttling column. Detailed Implementation

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort.

[0023] To keep the drawings concise, each drawing only schematically shows the parts relevant to the application; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" can mean not only "only one" but also "more than one."

[0024] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0025] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0028] Please refer to Figures 1 to 10 As shown, this application provides a two-phase flow manifold cold plate device for data center cabinets, in which a refrigerant circulates to dissipate heat and cool the heat source. The refrigerant is a refrigerant that can undergo phase change between liquid and gaseous states after being heated and cooled, and may include at least one of water, acetone, ammonia, methanol, tetrachloroethane, or hydrofluorocarbons, etc. This application does not impose further limitations on this. This two-phase flow manifold cold plate device 10 mainly includes an upper shell 1, a throttling structure 7, a lower shell 2, and a heat dissipation fin assembly 3.

[0029] like Figures 1 to 9 As shown, the upper housing 1 has a pressure stabilizing cavity 11, a flow channel 13 and a draining cavity 12 arranged in sequence at its bottom, and has a separating protrusion 133 formed between the pressure stabilizing cavity 11 and the flow channel 13.

[0030] The detailed description is as follows: the pressure stabilizing chamber 11 and the outlet chamber 12 are arranged on the left and right sides of the guide channel 13. The dividing strip 133 is formed between the pressure stabilizing chamber 11 and the guide channel 13 arranged side by side on the left and right. The guide channel 13 includes a plurality of inlet manifolds 131 and a plurality of outlet manifolds 132 recessed from the bottom of the upper housing 1. The plurality of outlet manifolds 132 are arranged in parallel between the plurality of inlet manifolds 131. One end of each inlet manifold 131 is opened to the bottom of the dividing strip 133 and the other end is closed. One end of each outlet manifold 132 is connected only to the outlet chamber 12 and the other end is closed. The upper housing 1 is provided with a liquid inlet 15 that is connected only to the pressure stabilizing chamber 11 and a steam outlet 16 that is connected only to the outlet chamber 12. The refrigerant is introduced into the pressure stabilizing chamber 11 through the liquid inlet 15 to concentrate and stabilize its pressure.

[0031] Furthermore, the number of inlet manifolds 131 and outlet manifolds 132 in this embodiment is multiple, but this is not a limitation. The number of inlet manifolds 131 and outlet manifolds 132 can also be adjusted to one depending on the actual application.

[0032] like Figures 2 to 3 , Figure 5 , Figures 7 to 8 As shown, the throttling structure 7 includes a plurality of throttling manifolds 71 ​​recessed at intervals from the bottom of the separating protrusion 133 and connected at both ends to the pressure stabilizing chamber 11 and each inlet manifold 131 respectively, and a plurality of throttling columns 72 extending from the inner top wall of each inlet manifold 131 and arranged opposite to the plurality of throttling manifolds 71, with a gap G between each throttling column 72 and each throttling manifold 71.

[0033] Furthermore, each inlet manifold 131 extends to the bottom of the dividing ridge 133 and connects to one end of each throttling manifold 71, forming a gradually widening channel 134 that gradually increases in width S3 away from each throttling manifold 71. Each widening channel 134 has a flared groove 136 adjacent to each throttling manifold 71 on its sidewall. Each throttling column 72 extends from the inner top wall of each widening channel 134 and is vertically positioned in the middle of each flared groove 136. Additionally, each inlet manifold 131, except for the remaining end of each widening channel 134, forms a narrowing channel 135 whose width S1 gradually decreases away from each widening channel 134. The outlet manifold 132's width S2 gradually increases towards the outlet cavity 12, allowing the cross-sectional shapes of each widening channel 134, each narrowing channel 135, and each outlet manifold 132 to be either a long trapezoidal shape or a long triangular shape (e.g., Figures 7 to 8 As shown), the width S2 of each outlet manifold 132 is two to four times greater than the width of each inlet manifold, that is, the width S2 of each outlet manifold 132 is two to four times greater than the width S3 of each dilator 134 or the width S1 of each converging channel 135.

[0034] Furthermore, the upper housing 1 extends with a serrated fin 14 disposed between the separating protrusion 133 and the outlet cavity 12. The serrated fin 14 and the separating protrusion 133 separate the pressure stabilizing cavity 11 and the outlet cavity 12, preventing the pressure stabilizing cavity 11 and the outlet cavity 12 from being directly connected. The tapering channel 135 of the plurality of inlet manifolds 131 is formed on the side of the serrated fin 14 adjacent to the separating protrusion 133, and the plurality of outlet manifolds 132 are formed on the side of the serrated fin 14 adjacent to the outlet cavity 12.

[0035] Furthermore, the height H4 of the pressure stabilizing chamber 11 is greater than the height H3 of each throttling manifold 71, the height H3 of each throttling manifold 71 is equal to the height H1 of each inlet manifold 131, and the depth of each outlet manifold 132 from the bottom of the upper housing 1 is greater than the depth of each outlet manifold 132 from the bottom of the upper housing 1, so that the height H2 of each outlet manifold 132 is greater than the height H1 of each inlet manifold 131, wherein the height H2 of each outlet manifold 132 is two to four times greater than the height H1 of each inlet manifold 131 is the optimal implementation.

[0036] In this embodiment, the height H3 of each throttling manifold 71 is equal to the height H1 of each inlet manifold 131, but this is not a limitation. For flow distribution, the height H3 of each throttling manifold 71 and the height H1 of each inlet manifold 131 may not be equal.

[0037] like Figure 1 , Figures 4 to 9 As shown, the lower shell 2 is welded to the bottom of the upper shell 1 and abuts against the partition strip 133 and the plurality of throttling columns 72. The lower shell 2 is provided with a heat exchange chamber 21 that is only connected to the guide channel 13.

[0038] Further explanation is as follows: In this embodiment, the lower housing 2 is sealed below the pressure stabilizing chamber 11, each throttling manifold 71, each expanding channel 134 and the outlet chamber 12. The heat exchange chamber 21 is recessed from the top of the lower housing 2 and is only configured opposite to each contracting channel 135 and each outlet manifold 132, so that the heat exchange chamber 21 is only connected to the plurality of contracting channels 135 and the plurality of outlet manifolds 132.

[0039] like Figure 1 , Figures 5 to 9 As shown, the heat dissipation fin assembly 3 is housed in the heat exchange cavity 21. The heat dissipation fin assembly 3 includes a plurality of heat dissipation fins 31 arranged at intervals. The plurality of heat dissipation fins 31 abut against the serrated fins 14. A plurality of heat dissipation channels 32 are formed between the plurality of heat dissipation fins 31, which are arranged perpendicularly to the plurality of tapered channels 135 and the plurality of outlet manifolds 132.

[0040] The following is a detailed description: In this embodiment, the lower housing 2 includes a finned base plate 22 and a hollow partition 23. A plurality of heat dissipation fins 31 extend upward from the finned base plate 22. The hollow partition 23 is sandwiched between the upper housing 1 and the finned base plate 22 by welding. A portion of the hollow partition 23 has a hollow opening 231 that is configured to be opposite to each tapered channel 135 and each outlet manifold 132 and forms a heat exchange cavity 21. The other portion of the hollow partition 23 blocks the area below the pressure stabilizing cavity 11, each throttling manifold 71, each expanding channel 134 and the outlet cavity 12, thus sealing the area below them. The hollow partition 23 also abuts against the dividing protrusion 133 and the plurality of throttling columns 72. The hollow partition 23 surrounds the exterior of the plurality of heat dissipation fins 31 by passing through the hollow opening 231.

[0041] This causes the refrigerant to flow sequentially from the liquid inlet 15, pressure stabilizing chamber 11, multiple throttling manifolds 71, multiple gaps G, the expanding channel 134 of multiple guide channels 13, the contracting channel 135 of multiple guide channels 13, heat exchange chamber 21, multiple heat dissipation channels 32, multiple outlet manifolds 132, and the outlet chamber 12 to the steam outlet 16. Furthermore, the refrigerant entering each gap G is stopped by each throttling column 72 and diverted along both sides of each throttling column 72 (e.g., Figures 5 to 9 (As indicated by the arrow).

[0042] Thus, the two-phase flow manifold cold plate device 10 can be assembled by stacking three layers: the upper shell 1, the hollow partition 23, and the finned bottom plate 22, giving the two-phase flow manifold cold plate device 10 the advantages of simple structure and easy manufacturing.

[0043] In addition, the upper housing 1 and the lower housing 2 are provided with a plurality of heat source positioning holes 4 arranged around the voltage stabilizing cavity 11, the outlet cavity 12 and the heat exchange cavity 21. For example, heat sources such as chips can be fixed to the lower housing 2 by screws, pins or fasteners passing through the heat source positioning holes 4.

[0044] Among them, such as Figure 5 As shown, the height H4 of the pressure stabilizing chamber 11 is greater than the height H3 of each throttling manifold 71, so that when the refrigerant in the pressure stabilizing chamber 11 enters the throttling manifold 71 with a smaller cross-sectional area, it can be throttled to reduce the uneven flow distribution caused by its inertial flow, so that the refrigerant can flow evenly into the plurality of throttling manifolds 71.

[0045] After that, as Figures 7 to 8As shown, the refrigerant is throttled through the inlet of the throttling manifold 71, which increases the refrigerant velocity and causes resistance loss. However, the flared groove 136 behind the slit forms a buffer chamber. The high-speed refrigerant jet flowing through the slit impacts the throttling column 72 in the buffer chamber, forming a local high-pressure stagnation zone. It is then split into two streams that bypass the two sides of the throttling column 72. Under the action of the buffer chamber, the two streams impact each other in oblique directions, forming sufficient fluid mixing disturbance. This causes the high-speed refrigerant to decelerate rapidly in a short area, preventing the low-pressure zone after throttling from affecting the flow distribution near the inlet of the guide channel 13. In other words, through the structure of the throttling manifold 71 and the throttling column 72, a large pressure difference is formed between the pressure stabilizing chamber 11 and the guide channel 13, which greatly reduces the impact of the increased back pressure caused by two-phase boiling on the flow distribution, allowing the refrigerant to flow steadily from the pressure stabilizing chamber 11 to the guide channel 13.

[0046] In one embodiment, such as Figures 5 to 9 As shown, a plurality of heat dissipation fins 31 abut against serrated fins 14. A plurality of heat dissipation channels 32 are vertically arranged with the tapered channels 135 of a plurality of inlet manifolds 131 and a plurality of outlet manifolds 132. The refrigerant in the tapered channel 135 is in a liquid state because it has not absorbed heat. The liquid refrigerant will flow downward into the heat dissipation channel 32 under the influence of gravity, and absorb the heat transferred from the heat source to the heat dissipation fins 31, changing its phase into a vapor state. The vapor refrigerant will naturally flow upward, and guided by the heat dissipation channel 32, the lateral expansion of the liquid refrigerant will be changed to the longitudinal expansion of the vapor refrigerant. At the same time, because the width S1 of the tapered channel 135 gradually decreases in the direction away from the pressure regulating chamber 11, the vapor refrigerant enters the tapered channel 135. 5. Due to the compression of the liquid refrigerant, the width S2 of each outlet manifold 132 gradually increases towards the outlet cavity 12, and the height H2 of the outlet manifold 132 is greater than the height H1 of the inlet manifold 131, making the outlet size larger than the inlet size and having a smaller pressure difference. Therefore, the vapor refrigerant will flow into the outlet manifold 132 more smoothly than the converging channel 135, thereby automatically guiding the liquid refrigerant to mainly flow in the inlet manifold 131 and the vapor refrigerant to mainly flow in the outlet manifold 132, further reducing the pressure loss in the boiling section. Finally, the vapor refrigerant flows through the multiple outlet manifolds 132 to the outlet cavity 12 and is discharged through the steam outlet 16 to complete the heat exchange process.

[0047] Thus, the two-phase flow manifold cold plate device 10 achieves uniform refrigerant distribution through the slit throttling process from the pressure stabilizing chamber 11 to the throttling manifold 71. Furthermore, through the structure of the throttling manifold 71 and the throttling column 72, a large pressure difference is formed between the pressure stabilizing chamber 11 and the inlet manifold 131, which greatly reduces the back pressure effect of two-phase boiling. This effectively and uniformly delivers the liquid refrigerant to the guide channel 13, so that the two-phase flow manifold cold plate device 10 has functions such as uniform temperature and flow rate, low pressure loss and high flow stability.

[0048] In this way, the two-phase flow manifold cold plate device 10 uses the throttling structure 7 to make the refrigerant flow evenly into each branch, so that changes in the branch load will not affect the flow distribution between the branches.

[0049] Furthermore, the two-phase flow manifold cold plate device 10 has multiple inlet manifolds 131, one end of which is connected only to the pressure regulating chamber 11 and the other end is closed; multiple outlet manifolds 132 have multiple outlet manifolds 132, one end of which is connected only to the outlet chamber 12 and the other end is closed; the multiple outlet manifolds 132 are arranged in parallel between the multiple inlet manifolds 131; and multiple heat dissipation channels 32 are arranged below the tapered channels 135 of the multiple inlet manifolds 131 and the multiple outlet manifolds 132. The multiple heat dissipation channels 32 are arranged perpendicularly to the multiple tapered channels 135 and the multiple outlet manifolds 132. These structural features result in the lateral expansion of the liquid refrigerant being converted into a vapor state. The longitudinal expansion of the refrigerant, the automatic guidance of liquid refrigerant flowing mainly in the inlet manifold 131 and vapor refrigerant flowing mainly in the outlet manifold 132, etc., that is, the inlet manifold 131 can guide the liquid refrigerant to flow laterally to the heat dissipation channel 32 of the heat dissipation fin assembly 3, the heat dissipation channel 32 then guides the vapor refrigerant to flow longitudinally to the outlet manifold 132, and finally the outlet manifold 132 guides the vapor refrigerant to flow laterally to the outlet cavity 12, so as to achieve the characteristics of reducing pressure loss in the boiling section, enhancing flow stability and uniformity, and improving heat dissipation efficiency in the two-phase flow manifold cold plate device 10.

[0050] like Figure 10 As shown, the two-phase flow manifold cold plate device 10 can also be one or more. In this embodiment, multiple two-phase flow manifold cold plate devices 10 are used to thermally attach multiple heat sources respectively. Each two-phase flow manifold cold plate device 10 is connected in series with a liquid storage tank 20, a pump 30, a liquid cooling radiator 41, a liquid inlet assembly 50 and a steam outlet assembly 60 to form a liquid cooling heat dissipation system, which is described in detail below.

[0051] The liquid storage tank 20 is hollow and used to store refrigerant. In this embodiment, the liquid storage tank 20 and the pump 30 are installed in a box (not labeled in the figure), thereby saving volume and reducing the number of connecting parts, and can effectively reduce the risk of refrigerant leakage and pollution. However, this application is not limited thereto.

[0052] In this embodiment, pump 30 is connected to liquid receiver 20 via an adapter (not labeled in the figure). However, in other embodiments, pump 30 may also be connected to liquid receiver 20 via a hose or other means. This application does not impose any restrictions on this. Pump 30 can be used to propel the flow of liquid refrigerant. In this embodiment, pump 30 is a miniature magnetic pump, which is small in size, low in noise, high in operating efficiency, low in driving power, low in energy consumption, long in service life, not prone to leakage, and easy to control. However, in other embodiments, pump 30 may be of other forms or styles, as long as it can effectively propel the flow of refrigerant.

[0053] Each two-phase flow manifold cold plate device 10 is set to correspond to each heat source. The two-phase flow manifold cold plate device 10 can be attached to each heat source that needs to dissipate heat, thereby quickly absorbing the heat energy generated by the heat source and causing the liquid refrigerant entering the two-phase flow manifold cold plate device 10 to evaporate into a gaseous state.

[0054] In this embodiment, the liquid cooling radiator 41 is connected to the liquid storage tank 20 via an adapter (not labeled in the figure). However, in other embodiments, the liquid cooling radiator 41 may also be connected to the liquid storage tank 20 via a hose or other means. This application does not impose any restrictions on this.

[0055] Further explanation is provided below. Since the specific structure and technical principles of the liquid cooling radiator 41 are well-known to those skilled in the art, they will not be elaborated upon here. The liquid cooling radiator 41 can dissipate heat and cool the vaporized refrigerant, thereby causing it to quickly condense into a liquid state.

[0056] The liquid inlet assembly 50 connects to the pump 30 and the liquid inlets 15 of each two-phase flow manifold cold plate device 10. Specifically, the liquid inlet assembly 50 mainly includes a main liquid delivery pipe 51, a flow divider 52, and a plurality of auxiliary liquid delivery pipes 53. The two ends of the main liquid delivery pipe 51 are connected to the pump 30 and the flow divider 52, respectively. The two ends of each auxiliary liquid delivery pipe 53 are connected to the flow divider 52 and the liquid inlets 15 of each two-phase flow manifold cold plate device 10, respectively. Therefore, liquid refrigerant enters the main liquid delivery pipe 51 through the pump 30, and then is distributed to each auxiliary liquid delivery pipe 53 through the flow divider 52, thereby entering each two-phase flow manifold cold plate device 10. In this embodiment, both ends of the main infusion pipe 51 and both ends of each auxiliary infusion pipe 53 are connected to the pump 30, the diverter 52 and each inlet 15 of each two-phase flow manifold cold plate device 10 via connectors (not labeled in the figure).

[0057] The steam outlet assembly 60 connects to the steam outlets 16 of each two-phase flow manifold cold plate device 10 and the liquid cooling radiator 41, and is connected to the liquid storage tank 20 via the liquid cooling radiator 41. Specifically, the steam outlet assembly 60 includes a main steam pipe 61, a main line 62, and a plurality of auxiliary steam pipes 63. The two ends of the main steam pipe 61 are connected to the main line 62 and the liquid cooling radiator 41, respectively. The two ends of each auxiliary steam pipe 63 are connected to the steam outlets 16 of each two-phase flow manifold cold plate device 10 and the main line 62, respectively. Therefore, the vaporized refrigerant enters the corresponding auxiliary steam pipes 63 from each two-phase flow manifold cold plate device 10, and then flows through the main line 62 to the main steam pipe 61, thereby entering the liquid cooling radiator 41. In this embodiment, both ends of the main steam pipe 61 and both ends of each auxiliary steam pipe 63 are connected to the liquid cooling radiator 41, the bus 62 and each steam outlet 16 of each two-phase flow manifold cold plate device 10 through connectors (not labeled in the figure).

[0058] In this way, the liquid refrigerant from the liquid storage tank 20 is driven by the pump 30 and diverted through the liquid inlet assembly 50 into each two-phase flow manifold cold plate device 10, so that the refrigerant flows sequentially from the liquid inlet 15, the pressure stabilizing chamber 11, the multiple inlet manifolds 131, the multiple heat dissipation channels 32, the multiple outlet manifolds 132, the outlet chamber 12 to the steam outlet 16 to dissipate heat to each heat source. After absorbing heat and evaporating into vaporized refrigerant, it is then collected by the steam outlet assembly 60 and cooled by the liquid cooling radiator 41, thereby cooling and condensing back into liquid refrigerant and returning to the liquid storage tank 20 to form a cycle.

[0059] Therefore, the two-phase flow manifold cold plate device 10 has the advantages of comprehensive pressure loss optimization, reduced system energy consumption, decoupling pressure loss from heat source power consumption, and suitability for two-phase parallel heat dissipation systems. Furthermore, the high aspect ratio microchannel increases the flow cross-sectional area, and combined with the expanded outlet manifold 132, significantly reduces the overall pressure loss of the boiling section. Simultaneously, the resistance loss of the throttling structure 7 has a flow equalization effect, without adding extra redundant energy consumption to the system. Compared to conventional two-phase parallel systems, this design optimizes energy consumption by achieving pressure loss and heat source power consumption through multiple methods. The height H2 of each outlet manifold 132 is designed to be two to four times greater than the height H1 of each inlet manifold 131, significantly increasing the cross-sectional area of ​​the gas-liquid two-phase flow channel and significantly reducing the two-phase fluid pressure loss. Moreover, the outlet size is larger than the inlet size, further reducing the two-phase fluid pressure loss. The single-phase pressure loss improvement brought about by the inlet throttling structure 7 significantly reduces the proportion of pressure loss increase caused by increased heat flow to the total pressure loss, achieving decoupling of pressure loss from heat source power consumption. This ensures that in high-power parallel cooling scenarios, changes in the power of a single branch will not significantly affect the flow rate of that branch, thus improving the operational stability of the high-power parallel cooling system.

[0060] It should be noted that the above embodiments can be freely combined as needed. The above are merely preferred embodiments of this application. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A two-phase flow manifold cold plate device for a data center cabinet, characterized in that, It allows refrigerant to circulate therein, including: The upper housing has a bottom recessed area with a pressure stabilizing chamber, a flow channel and an outlet chamber arranged in sequence, and has a partition strip formed between the pressure stabilizing chamber and the flow channel. The flow channel includes a plurality of inlet manifolds that are recessed from the bottom of the upper housing and open at one end to the bottom of the partition strip and closed at the other end, and a plurality of outlet manifolds that are connected at one end to the outlet chamber and closed at the other end and arranged in parallel between the plurality of inlet manifolds. The throttling structure includes a plurality of throttling manifolds recessed at intervals from the bottom of the dividing protrusion and connected at both ends to the pressure stabilizing chamber and each of the inlet manifolds, and a plurality of throttling columns extending from the inner top wall of each of the inlet manifolds and arranged opposite to the plurality of throttling manifolds, with a gap between each of the throttling columns and each of the throttling manifolds. The lower housing is tightly sealed to the bottom of the upper housing and abuts against the partition strip and the plurality of throttling columns. The lower housing has an internal heat exchange chamber communicating with the flow channel. The heat dissipation fin assembly is housed in the heat exchange cavity; The refrigerant flows sequentially from the pressure stabilizing chamber, the plurality of throttling manifolds, the plurality of inlet manifolds, the heat exchange chamber, and the plurality of outlet manifolds to the outlet chamber. The refrigerant entering each of the gaps is blocked by each of the throttling columns and is diverted along both sides of each of the throttling columns.

2. The two-phase flow manifold cold plate device for data center cabinets according to claim 1, characterized in that, Each of the inlet manifolds extends to the bottom of the dividing strip, forming a gradually widening channel whose width increases in the direction away from each of the throttling manifolds.

3. The two-phase flow manifold cold plate device for data center cabinets according to claim 2, characterized in that, Each of the expanding channels has a flared groove on its sidewall adjacent to each of the throttling channels, and each throttling column extends from the inner top wall of each of the expanding channels and is erected in the middle of each of the flared grooves.

4. The two-phase flow manifold cold plate device for data center cabinets according to claim 2, characterized in that, The inlet manifold at the end furthest from the expansion channel forms a narrowing channel whose width gradually decreases in the direction away from the expansion channel, while the outlet manifold's width gradually increases in the direction approaching the outlet cavity.

5. The two-phase flow manifold cold plate device for data center cabinets according to claim 4, characterized in that, The upper housing extends with a serrated fin disposed between the dividing ridge and the outlet cavity. The tapering channel of the plurality of inlet manifolds is formed on the side of the serrated fin adjacent to the dividing ridge, and the plurality of outlet manifolds are formed on the side of the serrated fin adjacent to the outlet cavity.

6. The two-phase flow manifold cold plate device for data center cabinets according to claim 5, characterized in that, The lower housing is sealed below the pressure stabilizing chamber, each of the throttling manifolds, each of the expanding channels and the outlet chamber. The heat exchange chamber is recessed from the top of the lower housing and is arranged opposite to each of the contracting channels and each of the outlet manifolds.

7. The two-phase flow manifold cold plate device for data center cabinets according to claim 6, characterized in that, The heat dissipation fin assembly includes multiple heat dissipation fins arranged at intervals, which abut against the serrated fins. Multiple heat dissipation channels are formed between the multiple heat dissipation fins, which are perpendicular to the multiple tapered channels and the multiple outlet manifolds.

8. The two-phase flow manifold cold plate device for data center cabinets according to claim 7, characterized in that, The lower housing includes a finned base plate and a hollow partition. The plurality of heat dissipation fins extend upward from the finned base plate. The hollow partition is sandwiched between the upper housing and the finned base plate. A portion of the hollow partition has a perforated opening that is configured opposite to each of the tapered channels and each of the outlet manifolds to form the heat exchange cavity. Another portion is blocked below the pressure stabilizing cavity, each of the throttling manifolds, each of the expanding channels and the outlet cavity and abuts against the partition protrusion and the plurality of throttling columns.

9. The two-phase flow manifold cold plate device for data center cabinets according to claim 1, characterized in that, The height of each outlet manifold is greater than the height of each inlet manifold, and the height of each throttling manifold is equal to the height of each inlet manifold.

10. The two-phase flow manifold cold plate device for data center cabinets according to claim 1, characterized in that, The height of the pressure stabilizing cavity is greater than the height of each of the throttling manifolds.

11. The two-phase flow manifold cold plate device for data center cabinets according to claim 1, characterized in that, The upper housing is provided with a liquid inlet communicating with the pressure stabilizing chamber and a steam outlet communicating with the outlet chamber. The upper housing and the lower housing are provided with a plurality of heat source positioning holes arranged around the pressure stabilizing chamber, the outlet chamber and the heat exchange chamber.

12. The two-phase flow manifold cold plate device for data center cabinets according to claim 1, characterized in that, The height of each outlet manifold is two to four times greater than the height of each inlet manifold.

13. The two-phase flow manifold cold plate device for data center cabinets according to claim 1, characterized in that, The width of each outlet manifold is two to four times greater than the width of each inlet manifold.

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