Two-phase flow cooling cold plate device for data center cabinet

Abstract

The invention relates to the technical field of heat dissipation, and discloses a two-phase flow cooling cold plate device for a data center cabinet, the two-phase flow cooling cold plate device comprises an upper shell, a throttling structure and a lower shell, and the bottom of the upper shell is concavely provided with a pressure stabilizing cavity, a discharge cavity and a flow guide channel and is provided with a separation convex strip; the throttling structure comprises a plurality of throttling branches and a plurality of throttling stand columns, the throttling branches are concavely arranged from the bottoms of the separation convex strips, the two ends of each throttling branch are communicated with the pressure stabilizing cavity and the flow guide channel, the throttling stand columns extend from the inner top wall of the flow guide channel and are arranged opposite to the throttling branches, and gaps are formed between the throttling stand columns and the throttling branches; the lower shell is sealed corresponding to the bottom of the upper shell and abuts against the separation protruding strips and the throttling stand columns, and a heat exchange cavity communicating with the flow guide channel and the flow outlet cavity is formed in the lower shell. The refrigerant enters the gaps, is stopped by the throttling stand columns and is shunted along the two sides of the throttling stand columns.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more particularly to a two-phase flow cooling plate device for data center cabinets. Background Technology

[0002] With the rapid development of AI and the current state of transistor miniaturization approaching physical limits, in order to continuously improve computing power, the industry has shifted to the idea of ​​expanding chip area to integrate more transistors. A large number of electronic chips are developing towards large area, high power density, and high performance. The heat dissipation rate of single packaged chips has increased significantly, which has greatly increased the difficulty of component temperature control, thereby affecting its performance stability, service life and safety. Therefore, high-efficiency cooling technology has become the key to the normal operation of electronic devices.

[0003] However, traditional single-phase liquid cooling technology is difficult to meet the demand for high-efficiency cooling, and single-phase liquid cooling will cause problems such as leakage and easy blockage. Therefore, the industry has turned to two-phase liquid and vapor cooling technology for optimization. However, the boiling process caused by the change of liquid and vapor phases will cause uneven flow in the flow channel, resulting in disadvantages such as low temperature uniformity, large pressure loss and poor flow stability. Summary of the Invention

[0004] To address the aforementioned technical problems, the purpose of this application is to provide a two-phase flow cooling plate device for data center cabinets. This device utilizes the throttling process of the pressure stabilizing chamber flowing into the throttling manifold to achieve uniform refrigerant distribution. Furthermore, through the structure of the throttling manifold and throttling column, the liquid refrigerant is effectively and uniformly delivered to the guide channel, thereby enabling the two-phase flow cooling plate device to have the advantages of uniform temperature and flow rate, low pressure loss, and high flow stability.

[0005] To achieve the above objectives, this application provides a two-phase flow cooling cold plate device for data center cabinets, in which refrigerant circulates, comprising: The upper housing has a pressure stabilizing cavity, a drain cavity and a guide channel recessed at its bottom, and has at least one separating protrusion formed between the pressure stabilizing cavity and the guide channel; The throttling structure includes a plurality of throttling manifolds recessed at intervals from the bottom of the dividing protrusion and connected at both ends to the pressure stabilizing cavity and the guide channel, and a plurality of throttling columns extending from the inner top wall of the guide channel and disposed opposite to the plurality of throttling manifolds, with a gap between each of the throttling columns and each of the throttling manifolds; The lower housing is tightly sealed to the bottom of the upper housing and abuts against the at least one partition strip and the plurality of throttling columns. The lower housing contains a heat exchange chamber that connects only the guide channel and the outlet cavity. The heat dissipation fin assembly is housed in the heat exchange cavity; The refrigerant flows sequentially from the pressure stabilizing chamber, the plurality of throttling manifolds, the guide channel, and the heat exchange chamber to the outlet chamber. After entering each of the gaps, the refrigerant is blocked by each of the throttling columns and diverted along both sides of each of the throttling columns.

[0006] In some embodiments, there are two dividing ridges. The pressure stabilizing cavity includes a main chamber recessed from the bottom of the upper housing and arranged parallel to one side of the guide channel along its length, and two wedge-shaped manifolds communicating with the main chamber and arranged parallel to both sides of the guide channel along its width. Each dividing ridge is formed between each wedge-shaped manifold and the guide channel. The outlet cavity includes a longitudinal chamber recessed from the bottom of the upper housing and arranged parallel to the other side of the guide channel along its length, and two transverse chambers communicating with the longitudinal chamber and arranged parallel to both sides of the two wedge-shaped manifolds.

[0007] In some embodiments, the sidewalls at the junction of each wedge manifold and the main chamber extend into a constricted portion, and the width of each wedge manifold gradually decreases in the direction away from the constricted portion.

[0008] In some embodiments, the upper housing is provided with a liquid inlet that communicates only with the main chamber and a steam outlet that communicates only with the longitudinal chamber. The upper housing and the lower housing are provided with a plurality of heat source positioning holes arranged around the pressure stabilizing chamber, the outlet chamber and the heat exchange chamber.

[0009] In some embodiments, the lower housing includes a finned base plate, an upper partition plate, and a hollow partition plate. The upper partition plate seals the pressure stabilizing cavity, each of the throttling manifolds, the guide channel, and the outlet cavity below, and abuts against each of the partition protrusions and the plurality of throttling columns. The hollow partition plate is sandwiched between the upper partition plate and the finned base plate. The hollow partition plate has a perforation forming the heat exchange cavity. The upper partition plate has a first strip groove that connects only the guide channel and the perforation, and two second strip grooves that connect only each of the transverse chambers and the perforation, respectively.

[0010] In some embodiments, the first strip groove is arranged along the central axis of the guide channel, and each of the second strip grooves is arranged along the axial direction of the transverse chamber.

[0011] In some embodiments, the width of each of the second strip grooves is greater than the width of the first strip groove.

[0012] In some embodiments, the heat dissipation fin assembly includes a plurality of longitudinally spaced heat dissipation fins that extend upward from the fin base plate.

[0013] In some embodiments, a plurality of heat dissipation channels are formed between the plurality of heat dissipation fins, which are perpendicular to the first strip groove and the two second strip grooves.

[0014] In some embodiments, the height of the pressure stabilizing chamber is greater than the height of each of the throttling manifolds, and the height of each of the throttling manifolds is equal to the height of the guide channel.

[0015] In some embodiments, the volume of the outlet cavity is 2 to 4 times the volume of the voltage stabilizing cavity.

[0016] In some embodiments, the upper housing includes a receiving cavity disposed below the pressure stabilizing cavity and the outlet cavity, and the lower housing includes a finned base plate, an upper partition plate, and a hollow partition plate. The upper partition plate seals the pressure stabilizing cavity, each of the throttling manifolds, the guide channel, and the outlet cavity and abuts against each of the separating protrusions and the plurality of throttling columns. The hollow partition plate is sandwiched between the upper partition plate and the finned base plate. The hollow partition plate has a perforation forming the heat exchange cavity. The upper partition plate has a first strip groove that connects only the guide channel and the perforation, and two second strip grooves that connect only each of the transverse chambers and the perforation, respectively. The upper partition plate and the hollow partition plate are stacked together in the receiving cavity.

[0017] In some embodiments, the upper partition and the hollow partition are integrally formed.

[0018] Compared with the prior art, this application has at least the following beneficial effects: In this application, the refrigerant is throttled through the inlet of the throttling manifold, i.e., through the sudden narrow slit. This increases the refrigerant velocity and generates resistance loss. The high-speed refrigerant jet flowing through the slit impacts the throttling column, forming a local high-pressure stagnation zone. It is then split into two streams that bypass both sides of the throttling column. Under the action of the guide channel, the two streams impact each other at an oblique angle, creating sufficient fluid mixing disturbance. This causes the high-speed refrigerant to decelerate rapidly in a short area, preventing the low-pressure zone after throttling from affecting the flow distribution near the inlet of the guide channel. In other words, through the structure of the throttling manifold and the throttling column, a large pressure difference is formed between the pressure stabilizing chamber and the guide channel, which significantly reduces the impact of the increased back pressure caused by two-phase boiling on the flow distribution. This allows the refrigerant to flow steadily from the pressure stabilizing chamber to the guide channel, thereby enabling the two-phase flow cooling plate device in this application to have functions such as uniform temperature and flow rate, low pressure loss, and high flow stability. Attached Figure Description

[0019] The preferred embodiments will now be described in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of this application.

[0020] Figure 1 This is an exploded perspective view of another embodiment of the two-phase flow cooling plate device in this application; Figure 2 This is a perspective view of another embodiment of the upper housing in this application; Figure 3 yes Figure 2 Enlarged view of the area circled in the middle; Figure 4 This is a cross-sectional schematic diagram of another embodiment of the two-phase flow cooling plate device in this application; Figure 5 This is another cross-sectional schematic diagram of another embodiment of the two-phase flow cooling plate device in this application; Figure 6 This is yet another cross-sectional schematic diagram of another embodiment of the two-phase flow cooling plate device in this application; Figure 7 This is a three-dimensional assembly diagram of the liquid cooling heat dissipation system in this application; Figure 8 This is a top perspective exploded view of another embodiment of the two-phase flow cooling plate device in this application; Figure 9 This is a bottom perspective exploded view of another embodiment of the two-phase flow cooling plate device in this application; Figure 10 This is a cross-sectional schematic diagram of another embodiment of the two-phase flow cooling plate device in this application.

[0021] Reference numerals: 10: Two-phase flow cooling plate device; 1: Upper shell; 11: Pressure stabilizing chamber; 111: Main chamber; 112: Wedge-shaped manifold; 113: Narrowing section; 12: Outlet chamber; 121: Longitudinal chamber; 122: Transverse chamber; 13: Guide channel; 133: Separating ridge; 15: Liquid inlet; 16: Steam outlet; 2: Lower shell; 21: Heat exchange chamber; 22: Fin base plate; 23: Hollow partition; 231: Hollow opening; 24: Upper partition; 241: First strip groove; 242: Second strip groove; 3: Heat dissipation fins Plate group; 31: Heat dissipation fins; 32: Heat dissipation channel; 4: Heat source positioning hole; 20: Liquid storage tank; 30: Pump; 41: Liquid radiator; 50: Liquid inlet assembly; 51: Main liquid delivery pipe; 52: Flow divider; 53: Auxiliary liquid delivery pipe; 55: Outer sheath; 60: Steam outlet assembly; 61: Main steam delivery pipe; 62: Main bus; 63: Auxiliary steam delivery pipe; 7: Throttling structure; 71: Throttling manifold; 72: Throttling column; D: Axial direction; L: Central axis; G: Clearance; H3, H4, H5: Height; S4, S5, S6: Width. Detailed Implementation

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort.

[0023] To keep the drawings concise, each drawing only schematically shows the parts relevant to the application; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" can mean not only "only one" but also "more than one."

[0024] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0025] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0028] Please refer to Figures 1 to 7As shown, this application provides a two-phase flow cooling plate device for data center cabinets, in which a refrigerant circulates to dissipate heat from a heat source. The refrigerant is one that can undergo a phase change between a liquid and a gaseous state after being heated and cooled, and may include at least one of water, acetone, ammonia, methanol, tetrachloroethane, or hydrofluorocarbons, etc. This application does not impose further limitations on this. This two-phase flow cooling plate device 10 mainly includes an upper shell 1, a throttling structure 7, a lower shell 2, and a heat dissipation fin assembly 3.

[0029] like Figures 1 to 7 As shown, the upper housing 1 has a pressure stabilizing cavity 11, a drain cavity 12 and a guide channel 13 recessed at its bottom, and has one or more separating protrusions 133 formed between the pressure stabilizing cavity 11 and the guide channel 13.

[0030] The following is a detailed description: In this embodiment, there are two separating protrusions 133. The pressure stabilizing cavity 11 includes recesses from the bottom of the upper housing 1, arranged side by side on the left and right sides of the guide channel 13 (i.e., one side along the length of the guide channel 13, with the left and right sides only applicable to the adjacent surfaces). Figure 2 The upper housing 1 has a main chamber 111 (with orientation in the middle) and two wedge-shaped manifolds 112 connected to the main chamber 111 and arranged side by side along the width direction of the guide channel 13. Each of the dividing protrusions 133 is formed between each wedge-shaped manifold 112 and the guide channel 13. The outlet chamber 12 includes a longitudinal chamber 121 recessed from the bottom of the upper housing 1 and arranged side by side on the left and right sides of the guide channel 13, and two transverse chambers 122 connected to the longitudinal chamber 121 and arranged side by side on the front and rear outer sides of the two wedge-shaped manifolds 112. Each wedge-shaped manifold 112 has a constriction portion 113 extending from the side wall at the junction with the main chamber 111. The width S4 of each wedge-shaped manifold 112 gradually decreases away from the constriction portion 113. The upper housing 1 is provided with a liquid inlet 15 that only connects to the main chamber 111 and a steam outlet 16 that only connects to the longitudinal chamber 121. The refrigerant is introduced into the pressure stabilizing chamber 11 through the liquid inlet 15 to concentrate and stabilize its pressure. The outlet cavity 12 can ideally be two to four times larger than the pressure stabilizing cavity 11, thus significantly increasing the cross-sectional area of ​​the gas-liquid two-phase flow channel and significantly reducing the pressure loss of the two-phase fluid. Furthermore, because the outlet size is larger than the inlet size, the pressure loss of the two-phase fluid can be further reduced. (The length direction of the guide channel 13 is basically parallel to the length direction of the separating protrusion 133.) like Figures 2 to 6 As shown, the throttling structure 7 includes a plurality of throttling manifolds 71 ​​recessed at the bottom of the separating protrusion 133 and connected at both ends to the pressure stabilizing cavity 11 and the guide channel 13, and a plurality of throttling columns 72 extending from the inner top wall of the guide channel 13 and arranged opposite to the plurality of throttling manifolds 71, with a gap G between each throttling column 72 and each throttling manifold 71.

[0031] like Figure 1 , Figures 4 to 7As shown, the lower shell 2 is tightly sealed to the bottom of the upper shell 1 and abuts against two separating protrusions 133 and multiple throttling columns 72. The lower shell 2 has a heat exchange chamber 21 that connects only the guide channel 13 and the outlet chamber 12. It should be noted that the connection between the upper shell 1 and the upper shell 2 can be achieved by various processing methods, including but not limited to welding, hot fusion, laser welding, hot pressing and sealing, etc., and all of these should be considered within the scope of protection of this invention.

[0032] Further explanation is as follows: The lower shell 2 includes a finned bottom plate 22, an upper partition 24, and a hollow partition 23. The upper partition 24 seals the area below the pressure stabilizing chamber 11, each throttling manifold 71, the guide channel 13, and the outlet chamber 12, thus enclosing the area below these structures. The upper partition 24 abuts against two dividing protrusions 133 and multiple throttling columns 72. The hollow partition 23 is sandwiched between the upper partition 24 and the finned bottom plate 22. The hollow partition 23 has a perforated opening 231 that forms the heat exchange chamber 21. The upper partition 24 has a first strip groove 241 that connects only the guide channel 13 and the perforated opening 231, and two second strip grooves 242 that connect only the transverse chambers 122 and the perforated opening 231.

[0033] like Figure 1 , Figures 4 to 6 As shown, the heat dissipation fin assembly 3 is housed in the heat exchange cavity 21. The heat dissipation fin assembly 3 includes a plurality of heat dissipation fins 31 arranged at intervals. The plurality of heat dissipation fins 31 extend upward from the fin base plate 22 and abut against the upper partition plate 24. The hollow partition plate 23 surrounds the exterior of the plurality of heat dissipation fins 31 by passing through the hollow opening 231.

[0034] In addition, the first strip groove 241 is arranged along the central axis L of the guide channel 13, and each second strip groove 242 is arranged along the axial direction D of the transverse chamber 122. Multiple heat dissipation channels 32 are formed between the multiple heat dissipation fins and are arranged perpendicular to the first strip groove 241 and the two second strip grooves 242.

[0035] This causes the refrigerant to flow sequentially from the liquid inlet 15, the main chamber 111 of the pressure stabilizing chamber 11, the two constrictions 113, the two wedge-shaped manifolds 112 of the two pressure stabilizing chambers 11, multiple throttling manifolds 71, multiple gaps G, the guide channel 13, the first strip groove 241, the heat exchange chamber 21, multiple heat dissipation channels 32, the two second strip grooves 242, the two transverse chambers 122 of the outlet chamber 12, and the longitudinal chamber 121 of the outlet chamber 12 to the steam outlet 16. Furthermore, the refrigerant entering each gap G is stopped by each throttling column 72 and diverted along both sides of each throttling column 72 (e.g., Figures 4 to 6 (As indicated by the arrow).

[0036] Thus, the two-phase flow cooling plate device 10 can be assembled by stacking four layers: upper shell 1, upper partition 24, hollow partition 23 and fin bottom plate 22, so that the two-phase flow cooling plate device 10 has the advantages of simple structure and easy manufacturing.

[0037] In addition, the upper housing 1 and the lower housing 2 are provided with a plurality of heat source positioning holes 4 arranged around the voltage stabilizing cavity 11, the outlet cavity 12 and the heat exchange cavity 21. For example, heat sources such as chips can be fixed to the lower housing 2 by means of screws, pins or fasteners passing through the heat source positioning holes 4.

[0038] Furthermore, in this embodiment, the width S5 of each second strip groove 242 is greater than the width S6 of the first strip groove 241, the height H4 of the pressure stabilizing cavity is greater than the height H3 of the throttling manifold 71, and the height H3 of each throttling manifold 71 is equal to the height H5 of the guide channel 13.

[0039] Among them, such as Figures 4 to 5 As shown, the height H4 of the wedge-shaped manifold 112 of the pressure stabilizing chamber 11 is greater than the height H3 of each throttling manifold 71, so that when the refrigerant in the pressure stabilizing chamber 11 enters the throttling manifold 71 with a smaller cross-sectional area, it can be throttled to reduce the uneven flow distribution caused by its inertial flow, so that the refrigerant can flow evenly into multiple throttling manifolds 71.

[0040] After that, as Figures 2 to 3 , Figure 6 As shown, the refrigerant enters the pressure regulating chamber 11 and, after passing through the constriction section 113, is relatively evenly distributed into the two-wedge manifold 112. Because the width S4 of the wedge manifold 112 gradually decreases away from the constriction section 113, the tapering characteristic of the wedge manifold 112 weakens the uneven flow distribution caused by fluid inertia. The refrigerant then passes through the inlet of the throttling manifold 71, i.e., is throttled through the sudden constriction slit, which increases the refrigerant velocity and generates resistance loss. The high-speed refrigerant jet flowing through the slit impacts the throttling column 72, forming a local high-pressure stagnation zone, and is then diverted into... The two fluids bypassing the two sides of the throttling column 72 collide with each other at an oblique angle under the action of the guide channel 13, forming a sufficient fluid mixing disturbance. This causes the high-speed refrigerant to decelerate rapidly in a short region, preventing the low-pressure area after throttling from affecting the flow distribution near the inlet of the guide channel 13. That is, through the structure of the throttling manifold 71 and the throttling column 72, a large pressure difference is formed between the pressure stabilizing chamber 11 and the guide channel 13, which greatly reduces the impact of the increased back pressure caused by two-phase boiling on the flow distribution, allowing the refrigerant to flow steadily from the pressure stabilizing chamber 11 to the guide channel 13.

[0041] Furthermore, such as Figures 4 to 5As shown, since the height H4 of the pressure stabilizing chamber is greater than the height H3 of each throttling manifold 71, and the height H3 of each throttling manifold 71 is equal to the height H5 of the guide channel 13, the height of the throttling manifold 71 and the guide channel 13 is lower than the height of the wedge manifold 112. This results in a smaller cross-sectional area of ​​the jet cavity along the flow direction of the wedge manifold 112, ensuring that the coolant entering the jet orifice mainly comes from the adjacent throttling manifold 71, thus avoiding uneven flow caused by changes in the back pressure at the jet outlet.

[0042] Also, such as Figures 4 to 6 As shown, the first strip groove 241 and the two second strip grooves 242 are arranged perpendicularly to the multiple heat dissipation channels 32. The refrigerant located in the guide channel 13 is in a liquid state because it has not absorbed heat. The liquid refrigerant will flow downward into the heat dissipation channel 32 through the first strip groove 241 under the influence of gravity, and absorb the heat transferred to the heat dissipation fins 31 by the heat source, and change phase into a gaseous state. The gaseous refrigerant will naturally flow upward, and the heat dissipation channel 32 will guide the lateral expansion of the liquid refrigerant to the longitudinal expansion of the gaseous refrigerant. At the same time, because the width S5 of each second strip groove 242 is greater than that of the first strip groove 241, the refrigerant will flow downward into the heat dissipation channel 32. The width S6 of the strip groove 241 results in a larger outlet size than the inlet size, leading to a smaller pressure difference. Therefore, the vaporized refrigerant flows more smoothly into the two second strip grooves 242 compared to the first strip groove 241. This automatically guides the liquid refrigerant from the first strip groove 241 into the heat exchange chamber 21, and the vaporized refrigerant mainly flows out of the heat exchange chamber 21 from the two second strip grooves 242, further reducing the pressure loss in the boiling section. Finally, the vaporized refrigerant flows through the two second strip grooves 242 to the outlet chamber 12 and is discharged through the steam outlet 16, completing the heat exchange process.

[0043] Thus, the two-phase flow cooling plate device 10 achieves uniform refrigerant distribution through the slit throttling process from the pressure stabilizing chamber 11 to the throttling manifold 71. Furthermore, through the structure of the throttling manifold 71 and the throttling column 72, a large pressure difference is formed between the pressure stabilizing chamber 11 and the guide channel 13, which significantly reduces the back pressure effect of two-phase boiling. This effectively and uniformly delivers the liquid refrigerant to the guide channel 13, so that the two-phase flow cooling plate device 10 has the effects of uniform temperature and flow rate, low pressure loss and high flow stability.

[0044] The two-phase flow cooling plate device 10 uses a throttling structure 7 to ensure that the refrigerant flows evenly into each branch, so that changes in the branch load do not affect the flow distribution between the branches.

[0045] like Figure 7 As shown, the two-phase flow cooling plate device 10 can be one or more. In this embodiment, multiple two-phase flow cooling plate devices 10 are used to thermally attach multiple heat sources respectively. Each two-phase flow cooling plate device 10 is connected in series with a liquid storage tank 20, a pump 30, a liquid cooling radiator 41, a liquid inlet assembly 50 and a steam outlet assembly 60 to form a liquid cooling heat dissipation system, which is described in detail below.

[0046] The liquid storage tank 20 is hollow and used to store refrigerant. In this embodiment, the liquid storage tank 20 and the pump 30 are installed in a box (not labeled in the figure), thereby saving volume and reducing the number of connecting parts, and can effectively reduce the risk of refrigerant leakage and pollution. However, this application is not limited thereto.

[0047] In this embodiment, pump 30 is connected to liquid receiver 20 via an adapter (not labeled in the figure). However, in other embodiments, pump 30 may also be connected to liquid receiver 20 via a hose or other means. This application does not impose any restrictions on this. Pump 30 can be used to propel the flow of liquid refrigerant. In this embodiment, pump 30 is a miniature magnetic pump, which is small in size, low in noise, high in operating efficiency, low in driving power, low in energy consumption, long in service life, not prone to leakage, and easy to control. However, in other embodiments, pump 30 may be of other forms or styles, as long as it can effectively propel the flow of refrigerant.

[0048] Each two-phase flow cooling plate device 10 is set up corresponding to each heat source. The two-phase flow cooling plate device 10 can be attached to each heat source that needs to dissipate heat, thereby quickly absorbing the heat energy generated by the heat source and causing the liquid refrigerant entering the two-phase flow cooling plate device 10 to evaporate into a gaseous state.

[0049] In this embodiment, the liquid cooling radiator 41 is connected to the liquid storage tank 20 via an adapter (not labeled in the figure). However, in other embodiments, the liquid cooling radiator 41 may also be connected to the liquid storage tank 20 via a hose or other means. This application does not impose any restrictions on this.

[0050] Further explanation is provided below. Since the specific structure and technical principles of the liquid cooling radiator 41 are well-known to those skilled in the art, they will not be elaborated upon here. The liquid cooling radiator 41 can dissipate heat and cool the vaporized refrigerant, thereby causing it to quickly condense into a liquid state.

[0051] The liquid inlet assembly 50 connects the pump 30 and the liquid inlets 15 of each two-phase flow cooling plate device 10. Specifically, the liquid inlet assembly 50 mainly includes a main liquid delivery pipe 51, a flow divider 52, and multiple auxiliary liquid delivery pipes 53. The two ends of the main liquid delivery pipe 51 are connected to the pump 30 and the flow divider 52, respectively. The two ends of each auxiliary liquid delivery pipe 53 are connected to the flow divider 52 and the liquid inlets 15 of each two-phase flow cooling plate device 10, respectively. Therefore, liquid refrigerant enters the main liquid delivery pipe 51 from the pump 30, and then is distributed to each auxiliary liquid delivery pipe 53 through the flow divider 52, thereby entering each two-phase flow cooling plate device 10. In this embodiment, both ends of the main liquid delivery pipe 51 and both ends of each auxiliary liquid delivery pipe 53 are connected to the pump 30, the flow divider 52, and the liquid inlets 15 of each two-phase flow cooling plate device 10 through connectors (not labeled in the figure).

[0052] The steam outlet assembly 60 connects to the steam outlets 16 of each two-phase flow cooling plate device 10 and the liquid cooling radiator 41, and is connected to the liquid storage tank 20 via the liquid cooling radiator 41. Specifically, the steam outlet assembly 60 includes a main steam pipe 61, a main line 62, and multiple auxiliary steam pipes 63. The two ends of the main steam pipe 61 are connected to the main line 62 and the liquid cooling radiator 41, respectively. The two ends of each auxiliary steam pipe 63 are connected to the steam outlets 16 of each two-phase flow cooling plate device 10 and the main line 62, respectively. Therefore, the vaporized refrigerant enters the corresponding auxiliary steam pipe 63 from each two-phase flow cooling plate device 10, and then flows through the main line 62 to the main steam pipe 61, thereby entering the liquid cooling radiator 41. In this embodiment, both ends of the main steam pipe 61 and both ends of each auxiliary steam pipe 63 are connected to the liquid cooling radiator 41, the bus 62 and each steam outlet 16 of each two-phase flow cooling plate device 10 through connectors (not labeled in the figure).

[0053] In this way, the liquid refrigerant from the liquid storage tank 20 is driven by the pump 30 and diverted through the liquid inlet assembly 50 into each two-phase flow cooling plate device 10, so that the refrigerant flows sequentially from the liquid inlet 15, the pressure stabilizing chamber 11, multiple inlet manifolds 131, multiple heat dissipation channels 32, multiple outlet manifolds 132, and the outlet chamber 12 to the steam outlet 16 to dissipate heat to each heat source. After absorbing heat and evaporating into gaseous refrigerant, it is then collected by the steam outlet assembly 60 and cooled by the liquid cooling radiator 41, thereby recooling and condensing into liquid refrigerant and returning to the liquid storage tank 20 to form a cycle.

[0054] Please see Figures 8 to 10 The overall structure of the two-phase flow cooling plate device 10 is similar to... Figures 1 to 6 The previous embodiment shown is largely the same, also including an upper housing 1, a throttling structure 7, a lower housing 2, and a heat dissipation fin group 3, etc., and its specific structure, working principle and the technical effects it can achieve are the same as those of the previous embodiment, so they will not be described again here.

[0055] The difference between this embodiment and the previous embodiment is that the upper housing 1 further forms a receiving cavity 14 inside it. The receiving cavity 14 is located below the pressure stabilizing cavity 11 and the outlet cavity 12, and is used to accommodate a hollow partition 23 and an upper partition 24. In this embodiment, the hollow partition 23 and the upper partition 24 can be manufactured by processing methods, such as, but not limited to, mechanical cutting, so that they are integrally formed by stacking them on top of each other. However, if the previous embodiment is adopted, the hollow partition 23 and the upper partition 24 are independently separated from each other and are arranged together in the receiving cavity 12 in a stacked manner. This arrangement should also be included in the protection scope of this application.

[0056] In summary, the two-phase flow manifold cold plate device 10 provided in this application has the advantages of comprehensive pressure loss optimization, reduced system energy consumption, decoupling pressure loss from heat source power consumption, and suitability for two-phase parallel heat dissipation systems. Furthermore, the high aspect ratio microchannel increases the flow cross-sectional area, and combined with the expanded-capacity outlet cavity 12, significantly reduces the overall pressure loss of the boiling section. Simultaneously, the resistance loss of the throttling structure 7 has a flow equalization effect, without adding extra redundant energy consumption to the system. Compared to conventional two-phase parallel systems, this design optimizes energy consumption by achieving pressure loss and heat source power consumption through multiple methods. The overall volume of the outlet cavity 12 is two to four times that of the pressure-stabilizing cavity 11, significantly increasing the cross-sectional area of ​​the gas-liquid two-phase flow channel and significantly reducing the two-phase fluid pressure loss. Moreover, because the outlet size is larger than the inlet size, the two-phase fluid pressure loss can be further reduced. The single-phase pressure loss improvement brought about by the inlet throttling structure 7 significantly reduces the proportion of pressure loss increase caused by increased heat flow to the total pressure loss, achieving decoupling of pressure loss from heat source power consumption. This ensures that in high-power parallel cooling scenarios, changes in the power of a single branch will not significantly affect the flow rate of that branch, thus improving the operational stability of the high-power parallel cooling system.

[0057] It should be noted that the above embodiments can be freely combined as needed. The above are merely preferred embodiments of this application. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A two-phase flow cooling plate device for data center cabinets, characterized in that, The two-phase flow cooling plate device includes a refrigerant that can circulate therein. The upper housing has a pressure stabilizing cavity, a drain cavity and a guide channel recessed at its bottom, and has at least one separating protrusion formed between the pressure stabilizing cavity and the guide channel; The throttling structure includes a plurality of throttling manifolds recessed at intervals from the bottom of the dividing protrusion and connected at both ends to the pressure stabilizing cavity and the guide channel, and a plurality of throttling columns extending from the inner top wall of the guide channel and disposed opposite to the plurality of throttling manifolds, with a gap between each of the throttling columns and each of the throttling manifolds; The lower housing is tightly sealed to the bottom of the upper housing and abuts against the at least one partition strip and the plurality of throttling columns. The lower housing contains a heat exchange chamber that connects only the guide channel and the outlet cavity. The heat dissipation fin assembly is housed in the heat exchange cavity; The refrigerant flows sequentially from the pressure stabilizing chamber, the plurality of throttling manifolds, the guide channel, and the heat exchange chamber to the outlet chamber. After entering each of the gaps, the refrigerant is blocked by each of the throttling columns and diverted along both sides of each of the throttling columns.

2. The two-phase flow cooling plate device for data center cabinets according to claim 1, characterized in that, The number of the dividing protrusions is two. The pressure stabilizing cavity includes a main chamber recessed from the bottom of the upper housing and arranged on one side of the guide channel along its length direction, and two wedge-shaped manifolds communicating with the main chamber and arranged on both sides of the guide channel along its width direction. Each of the dividing protrusions is formed between each of the wedge-shaped manifolds and the guide channel. The outlet cavity includes a longitudinal chamber recessed from the bottom of the upper housing and arranged on the other side of the guide channel along its length direction, and two transverse chambers communicating with the longitudinal chamber and arranged on both sides of the two wedge-shaped manifolds.

3. The two-phase flow cooling plate device for data center cabinets according to claim 2, characterized in that, The sidewalls at the junction of each wedge-shaped manifold and the main chamber extend into a constricted portion, and the width of each wedge-shaped manifold gradually decreases in the direction away from the constricted portion.

4. The two-phase flow cooling plate device for data center cabinets according to claim 2, characterized in that, The upper shell is provided with a liquid inlet that communicates only with the main chamber and a steam outlet that communicates only with the longitudinal chamber. The upper shell and the lower shell are provided with a plurality of heat source positioning holes arranged around the pressure stabilizing chamber, the outlet chamber and the heat exchange chamber.

5. The two-phase flow cooling plate device for data center cabinets according to claim 2, characterized in that, The lower housing includes a finned bottom plate, an upper partition plate, and a hollow partition plate. The upper partition plate seals the pressure stabilizing cavity, each of the throttling manifolds, the guide channel, and the outlet cavity below, and abuts against each of the partition protrusions and the plurality of throttling columns. The hollow partition plate is sandwiched between the upper partition plate and the finned bottom plate. The hollow partition plate has a hollow opening forming the heat exchange cavity. The upper partition plate has a first strip groove that connects only the guide channel and the hollow opening, and two second strip grooves that connect only each of the transverse chambers and the hollow opening.

6. The two-phase flow cooling plate device for data center cabinets according to claim 5, characterized in that, The first strip groove is arranged along the central axis of the guide channel, and each of the second strip grooves is arranged along the axial direction of the transverse chamber.

7. The two-phase flow cooling plate device for data center cabinets according to claim 5, characterized in that, The width of each of the second strip grooves is greater than the width of the first strip groove.

8. The two-phase flow cooling plate device for data center cabinets according to claim 5, characterized in that, The heat dissipation fin assembly includes a plurality of longitudinally spaced heat dissipation fins, which extend upward from the fin base plate.

9. The two-phase flow cooling plate device for data center cabinets according to claim 8, characterized in that, Multiple heat dissipation channels are formed between the plurality of heat dissipation fins, which are perpendicular to the first strip groove and the two second strip grooves.

10. The two-phase flow cooling plate device for data center cabinets according to claim 1, characterized in that, The height of the pressure stabilizing chamber is greater than the height of each of the throttling manifolds, and the height of each of the throttling manifolds is equal to the height of the guide channel.

11. The two-phase flow cooling plate device for data center cabinets according to claim 1, characterized in that, The volume of the outlet cavity is 2 to 4 times that of the voltage stabilizing cavity.

12. The two-phase flow cooling plate device for data center cabinets according to claim 2, characterized in that, The upper housing includes a receiving cavity disposed below the pressure stabilizing cavity and the outlet cavity. The lower housing includes a finned base plate, an upper partition plate, and a hollow partition plate. The upper partition plate seals the pressure stabilizing cavity, each of the throttling manifolds, the guide channel, and the outlet cavity and abuts against each of the separating protrusions and the plurality of throttling columns. The hollow partition plate is sandwiched between the upper partition plate and the finned base plate. The hollow partition plate has a hollow opening forming the heat exchange cavity. The upper partition plate has a first strip groove that connects only the guide channel and the hollow opening, and two second strip grooves that connect only each of the transverse chambers and the hollow opening. The upper partition plate and the hollow partition plate are stacked together in the receiving cavity.

13. The two-phase flow cooling plate device for data center cabinets according to claim 12, characterized in that, The upper partition and the hollow partition are integrally formed.

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