SVG wind-liquid mixed heat dissipation system
By using the SVG air-liquid hybrid cooling system, combined with the dynamic airflow distribution and ventilation slot design of the airflow guide components and liquid-cooled heat exchanger, the problem of uneven heat dissipation in the SVG module is solved, achieving a more efficient and stable heat dissipation effect, and improving the long-term reliability and heat dissipation efficiency of the components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-28
- Publication Date
- 2026-04-10
AI Technical Summary
In existing SVG modules, traditional air-cooling systems cannot effectively regulate airflow inside the duct, resulting in uneven heat dissipation and localized overheating, especially when the auxiliary power board's heat dissipation is poor during high-power operation.
The system employs an SVG air-liquid hybrid cooling system, combining a two-stage adjustment mechanism of coarse overall displacement adjustment and fine blade angle adjustment. Through the flow guide component and liquid-cooled heat exchanger, it achieves dynamic and differentiated airflow distribution. A ventilation slot is added to the bottom of the auxiliary power plate to bypass the obstruction area and directly cool the system. The combination design of fixed and movable flow guide blades optimizes airflow organization.
Dynamic airflow distribution within the SVG module was achieved, which improved the problem of uneven heat dissipation, reduced peak temperature difference, and improved the long-term working stability and lifespan of the components. At the same time, aerodynamic noise was reduced, and heat dissipation efficiency and system adaptability were improved.
Smart Images
Figure CN121843090A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of SVG devices, and particularly relates to an SVG air-liquid mixed heat dissipation system. BACKGROUND
[0002] In the power electronic industry, with the development of devices in the direction of high power density and high integration, the heat dissipation of devices gradually becomes a bottleneck. SVG, i.e. static var generator, as a kind of reactive power compensation electrical equipment, plays an extremely important role in the field of power quality. In the SVG, the main heat generating components are MOS tubes, i.e. metal oxide semiconductor field effect tubes.
[0003] In the existing SVG module, the traditional air cooling system usually adopts a fixed air duct structure. The power board and the auxiliary source board are arranged in parallel in the same air duct. In this layout, the cooling air first flows through the main heat generating components on the power board, such as inverter inductors and power inductors, to perform forced heat dissipation. After that, the temperature of the air is significantly increased. When the air flows to the auxiliary source board, the heat dissipation efficiency is greatly reduced, which is not conducive to the temperature rise control of the auxiliary source board. Since the inverter inductors and the power inductors on the power board are the main heat sources in the SVG module, they generate a large amount of heat during operation and need to rely on strong air cooling for effective heat dissipation. The auxiliary source board is a secondary heat source. Under low power conditions, most of the air volume will be blown to the power board according to the amount of heat generated, and the remaining small amount of air volume will be blown to the auxiliary source board. Therefore, the conventional heat dissipation design usually arranges the power board and the auxiliary source board in layers, i.e. arranges the power board and the auxiliary source board in the SVG module in an up-down manner, to avoid mutual blocking between the components on the power board and the components on the auxiliary source board and to avoid affecting the heat dissipation of the components on the power board and the components on the auxiliary source board.
[0004] However, as the operating power of the module increases, the heat generated by the auxiliary source board itself also increases, and the heat generated by the high-power operation of the components on the bottom power board will be radiated to the bottom of the auxiliary source board, causing the temperature of the auxiliary source board to rise. At this time, if the original air volume distribution ratio is used for heat dissipation of the auxiliary source board and the power board, the auxiliary source board cannot be effectively cooled due to the additional heat, thereby affecting the use of the components on the auxiliary source board under high-power operation. SUMMARY
[0005] The application provides an SVG air-liquid mixed heat dissipation system, which solves the technical problem that the whole guide plate cannot directionally regulate the airflow in the air duct in the related art, thereby causing uneven heat dissipation and local overheating in the module.
[0006] The application provides an SVG wind and liquid mixed heat dissipation system, which comprises a case, a liquid cooling heat exchanger and a flow guide assembly, the case comprises a shell, a fan, a MOS tube, a capacitor, an inverter inductor and a power frequency inductor, the shell is internally provided with an upper cavity and a lower cavity, the upper cavity is located directly above the lower cavity, an auxiliary source board is installed in the upper cavity, a power board is installed in the lower cavity, the inverter inductor and the power frequency inductor are installed on the top of the power board, the liquid cooling heat exchanger, the fan, the MOS tube, the capacitor, the flow guide assembly and the upper cavity and the lower cavity are all arranged in the shell, and are sequentially arranged horizontally along the airflow direction of the air duct in the shell. The flow guide assembly comprises a guide plate, a second gear, a second rack and movable flow guide blades, the second rack is driven to slide in the guide plate, the second rack is engaged with the second gear, one end of the second gear is rotationally connected to the inner wall of the guide plate, and the other end is connected to one end of the movable flow guide blades.
[0007] In a preferred embodiment, the liquid cooling heat exchanger comprises a condenser, a liquid cooling plate, a micro pump, a liquid outlet pipe, a liquid outlet plate and a liquid return plate, the liquid outlet plate is fixedly installed on the upper surface of the condenser, the liquid return plate is fixedly installed on the lower surface of the condenser, the liquid outlet plate and the liquid return plate are both hollow and are in communication with the inside of the condenser, the micro pump is installed on the top of the liquid outlet plate and is in communication with the inside of the liquid outlet plate, the liquid outlet of the micro pump is connected with one end of the liquid outlet pipe and is in communication, the other end of the liquid outlet pipe is connected with the liquid cooling plate, the inside of the liquid cooling plate is hollow and the liquid outlet pipe and the liquid cooling plate are in communication, one end of the liquid return pipe is connected with the liquid return plate and is in communication with the inside of the liquid return plate, the other end is connected with the liquid cooling plate and is in communication with the inside of the liquid cooling plate, and the liquid cooling plate is provided with a plurality of liquid cooling plates, the adjacent liquid cooling plates are connected with each other through pipes and are in communication, the condenser and the capacitor are symmetrically arranged on the two sides of the fan, and each liquid cooling plate is connected with a MOS tube on the outside.
[0008] In a preferred embodiment, an arc-shaped turbulence column is arranged on the inner wall of the liquid cooling plate.
[0009] In a preferred embodiment, the condenser comprises a serpentine fin and a micro channel, the upper and lower ends of the micro channel are in communication with the liquid outlet plate and the liquid return plate respectively, and the serpentine fin is connected with the side of the micro channel.
[0010] In a preferred embodiment, the power board is fixedly connected to the inner bottom surface of the shell, the inverter inductor and the power frequency inductor are sequentially arranged along the air duct, and the inverter inductor is located on the air inlet side of the power frequency inductor.
[0011] In a preferred embodiment, the case further comprises an air inlet grille and an air outlet grille, the air inlet grille is fixedly connected to the air duct inlet position of the shell, the air outlet grille is fixedly connected to the air duct outlet position of the shell, and the capacitor is close to the side surface of the liquid cooling plate.
[0012] In a preferred embodiment, the other end of the second gear is connected to one end of the movable guide vane via a torsion spring. The movable guide vane has a rectangular groove at the end near the guide plate, and an electromagnetic pin is fixedly connected inside the rectangular groove. The output end of the electromagnetic pin and the inner side of the guide plate form a limiting abutment engagement.
[0013] In a preferred embodiment, the flow guiding assembly further includes a slide rail and a motor. The slide rail is obliquely fixed to the inner wall of the housing. A groove is provided on one side of the slide rail. A first rack is slidably connected inside the groove. A first gear is meshed with the tooth groove on the surface of the first rack. One end of the first gear is fixedly connected to the output end of the motor. The motor is fixedly connected to the top of the slide rail. The side of the first rack is fixedly connected to the side of the guide plate. An electric push rod is fixedly connected to one end of the outer side of the guide plate. The output end of the electric push rod passes through the outer wall of the guide plate and is fixedly connected to one end of the second rack.
[0014] In a preferred embodiment, the flow guiding assembly further includes a fixed flow guiding blade, which is hinged to the movable flow guiding blade by a pin. A fixing block is fixedly connected to one end of the fixed flow guiding blade, and the fixing block is fixed to the bottom surface of the guide plate. The movable flow guiding blade rotates relative to the fixed flow guiding blade around the pin.
[0015] In a preferred embodiment, a ventilation slot is fixedly connected to the bottom of the auxiliary power source plate. The ventilation slot has a hollow structure inside, and an arc-shaped air guide block is installed at the air outlet on one side of the ventilation slot and at the bottom of the ventilation slot.
[0016] In a preferred embodiment, the chassis further includes an air inlet grille, an air outlet grille, and a capacitor. The air inlet grille is fixedly connected to the air duct inlet of the housing, the air outlet grille is fixedly connected to the air duct outlet of the housing, and the capacitor is fixedly connected inside the housing and close to the side of the liquid cooling plate.
[0017] The beneficial effects of this invention are as follows: 1. This invention uses a two-stage adjustment mechanism of coarse overall displacement adjustment and fine blade angle adjustment, combined with the partition locking function of the electromagnetic pin, to dynamically and differentiate the air volume distribution between the upper and lower cavities. It can quickly respond to changes in overall heat dissipation demand and provide directional air supply to local overheated areas, effectively solving the problems of coarse adjustment and inability to cope with complex thermal field distribution of traditional integral guide vanes.
[0018] 2. To address the uneven heat dissipation caused by device obstruction in the lower cavity, this invention adds a ventilation slot with an arc-shaped air guide block. This structure can draw air from the upper layer, bypass the front obstruction, and directly cool the rear heat-generating components. This significantly improves the heat dissipation dead zones that traditional air ducts cannot cover, reduces the peak temperature difference inside the module, and improves the long-term working stability and lifespan of the power components.
[0019] 3. This invention separates basic airflow guidance from gear adjustment by combining fixed and movable guide vanes. The fixed vanes pre-sort the airflow, reducing the load and adjustment range of the movable vanes. This not only improves the adjustment response speed but also suppresses eddy current generation and reduces aerodynamic noise, achieving a quieter and more efficient airflow organization. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention.
[0021] Figure 2 This is a schematic diagram of the internal upper cavity structure of the present invention.
[0022] Figure 3 This is a schematic diagram of the liquid-cooled heat exchanger structure of the present invention.
[0023] Figure 4 This is a schematic diagram of the internal cross-sectional structure of the coolant plate of the present invention.
[0024] Figure 5 This is a schematic diagram of the internal lower cavity structure of the present invention.
[0025] Figure 6 This is a schematic diagram of the internal side view structure of the present invention.
[0026] Figure 7 This is one of the schematic diagrams of the flow guiding component structure of the present invention.
[0027] Figure 8 This is the present invention. Figure 7 Enlarged view of point A in the middle.
[0028] Figure 9 This is the second schematic diagram of the flow guiding component structure of the present invention.
[0029] Figure 10 This is the present invention. Figure 9 Enlarged view of section B in the middle.
[0030] In the diagram: 1. Chassis; 101. Outer shell; 102. Air inlet grille; 103. Air outlet grille; 104. Fan; 105. MOSFET; 106. Capacitor; 107. Inverter inductor; 108. Power frequency inductor; 2. Liquid-cooled heat exchanger; 201. Liquid outlet plate; 202. Micropump; 203. Condenser; 2031. Serpentine heat sink; 2032. Microchannel; 204. Liquid cooling plate; 205. Arc-shaped baffle column; 206. Liquid outlet pipe; 207. Liquid return pipe ; 208. Return plate; 3. Auxiliary power supply plate; 4. Power board; 5. Flow guide assembly; 501. Slide rail; 502. First rack; 503. First gear; 504. Motor; 505. Guide plate; 506. Second gear; 507. Second rack; 508. Fixed flow guide vane; 509. Movable flow guide vane; 510. Fixing block; 511. Electromagnetic pin; 512. Torsion spring; 513. Electric push rod; 514. Ventilation slot; 515. Arc-shaped air guide block. Detailed Implementation
[0031] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.
[0032] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 9 and Figure 10 As shown, an SVG air-liquid hybrid cooling system includes a chassis 1, a liquid-cooled heat exchanger 2, and a flow guiding assembly 5. The chassis 1 includes an outer shell 101, a fan 104, a MOSFET 105, and a capacitor 106. The outer shell 101 has an upper cavity and a lower cavity. The upper cavity is located directly above the lower cavity. An auxiliary power board 3 is installed in the upper cavity, and a power board 4 is installed in the lower cavity. The liquid-cooled heat exchanger 2, the fan 104, the MOSFET 105, the capacitor 106, and the flow guiding assembly 5 are all located inside the outer shell 101 and are arranged horizontally in sequence along the airflow direction of the air duct inside the outer shell 101. The flow guiding assembly 5 includes a guide plate 505, a second gear 506, a second rack 507, and a movable flow guiding blade 509. The second rack 507 is driven to slide inside the guide plate 505. The second rack 507 meshes with the second gear 506. One end of the second gear 506 is rotatably connected to the inner wall of the guide plate 505, and the other end is connected to one end of the movable flow guiding blade 509.
[0033] It should be added that, such as Figure 3As shown, the liquid-cooled heat exchanger 2 includes a condenser 203, a liquid-cooled plate 204, a micro pump 202, a liquid outlet pipe 206, a liquid outlet plate 201, and a liquid return plate 208. The liquid outlet plate 201 is fixedly installed on the upper surface of the condenser 203, and the liquid return plate 208 is fixedly installed on the lower surface of the condenser 203. Both the liquid outlet plate 201 and the liquid return plate 208 are hollow and connected to the interior of the condenser 203. The micro pump 202 is installed on the top of the liquid outlet plate 201, and the liquid inlet of the micro pump 202 is connected to the interior of the liquid outlet plate 201. The liquid outlet of the micro pump 202 is connected to one end of the liquid outlet pipe 206, and the other end of the liquid outlet pipe 206 is connected to the liquid-cooled plate 204. The liquid-cooled plate 204 contains... The coolant is hollow, with the outlet pipe 206 connected to the liquid cooling plate 204. The return plate 208 is connected to one end of the return pipe 207, which communicates with the interior of the return plate 208, and the other end is connected to the liquid cooling plate 204, communicating with the interior of the liquid cooling plate 204. Multiple liquid cooling plates 204 are provided, and adjacent liquid cooling plates 204 are interconnected via pipes. Driven by the micro pump 202, the coolant flows sequentially through the condenser 203, outlet plate 201, outlet pipe 206, liquid cooling plate 204, pipes, return pipe 207, and return plate 208, ultimately returning to the condenser 203 through the return plate 208, thus forming a coolant circulation loop. (The text repeats itself here, so the translation will only include the first instance.) Figure 2 As shown, the condenser 203 and capacitor 106 are symmetrically arranged on both sides of the fan 104, that is, the condenser 203 is located at the air inlet of the fan 104, and the capacitor 106 is located at the air outlet of the fan 104. Several liquid cooling plates 204 are divided into upper and lower layers. Each liquid cooling plate 204 has a MOSFET 105 connected to its outer side. The inner wall of the liquid cooling plate 204 is provided with arc-shaped baffles 205. The condenser 203 includes a serpentine heat sink 2031 and a microchannel 2032. The upper and lower ends of the microchannel 2032 are connected to the liquid outlet plate 201 and the liquid return plate 208, respectively. The serpentine heat sink 2031 is connected to the side of the microchannel 2032. The micro pump 202 drives the coolant to flow out from the liquid outlet plate 201 and distribute it to the upper and lower layers of multiple liquid cooling plates 204 through parallel pipelines. The MOSFET 105 produces... The generated heat is absorbed by the tightly fitted liquid cooling plate 204. The arc-shaped turbulence column 205 inside the liquid cooling plate 204 disrupts the laminar flow of the coolant, enhances turbulence, and greatly improves the convective heat transfer coefficient. The high-temperature coolant after absorbing heat collects to the return plate 208 and is then pumped into the microchannel 2032 of the condenser 203. At the same time, the cold air generated by the fan 104 continuously blows across the serpentine heat sink 2031 on the surface of the condenser 203. The serpentine heat sink 2031 greatly expands the contact area with the air, while the microchannel 2032 ensures efficient heat conduction between the coolant and the serpentine heat sink 2031. Here, the heat carried by the coolant is transferred to the air through the serpentine heat sink 2031 and carried away. The cooled liquid flows back to the outlet plate 201, completing one cycle. The power board 4 is fixedly connected to the inner bottom surface of the housing 101. An inverter inductor 107 and a power frequency inductor 108 are fixedly installed on the power board 4. The inverter inductor 107 and the power frequency inductor 108 are arranged sequentially along the air duct. The inverter inductor 107 is located on the air inlet side of the power frequency inductor 108. Both the inverter inductor 107 and the power frequency inductor 108 are existing technologies and will not be described in detail here. The chassis 1 also includes an air inlet grille 102 and an air outlet grille 103. The air inlet grille 102 is fixedly connected to the air duct inlet of the housing 101, and the air outlet grille 103 is fixedly connected to the air duct outlet of the housing 101. The air inlet grille 102 mainly serves as protection and preliminary airflow guidance to prevent foreign objects from entering. The air outlet grille 103 is the outlet for hot air. The capacitor 106 is close to the side of the liquid cooling plate 204. The capacitor 106 is existing technology and will not be described in detail here. The flow guiding assembly 5 also includes a slide rail 501 and a motor 504. The slide rail 501 is obliquely fixed to the inner wall of the housing 101. A groove is formed on one side of the slide rail 501, and a first rack 502 is slidably connected inside the groove. A first gear 503 is meshed with the tooth grooves on the surface of the first rack 502. One end of the first gear 503 is fixedly connected to the output end of the motor 504. The motor 504 is fixedly connected to the top of the slide rail 501. The side of the first rack 502 is fixedly connected to the side of the guide plate 505. An electric push rod 513 is fixedly connected to one end of the outer side of the guide plate 505. The output end of the electric push rod 513 passes through the outer wall of the guide plate 505 and is fixedly connected to one end of the second rack 507. The motor 504 drives the first gear 503 to rotate. Through gear meshing, the first rack 502 is driven to slide up and down along the inclined slide rail 501. Since the first rack 502 is fixedly connected to the side of the guide plate 505, the guide plate 505 and all the guide vane assemblies inside it will move as a whole along the slide rail 501. The movement of the guide assembly 5 within the outlet section of the fan 104 allows for overall position adjustment. This enables the adjustment of the initial airflow ratio between the upper and lower cavities based on changes in overall heat dissipation requirements. The electric push rod 513 independently drives the second rack 507 to move linearly within the guide plate 505, thereby controlling the angle of each movable guide blade 509 and guiding airflow within the duct section. By moving the guide assembly 5 at the height of the fan 104 outlet section, the basic airflow ratio between the upper and lower cavities can be quickly set. Moving the guide plate 505 upwards increases the duct opening area into the upper cavity while reducing the airflow into the lower cavity. When initially distributing the airflow between the upper and lower cavities, the motor 504 can be used for coarse adjustment to determine the approximate airflow distribution ratio, and then the electric push rod 513 can be used for fine adjustment of the angle of the movable guide blades 509 to optimize the local airflow distribution within the cavity.
[0034] In this embodiment, the other end of the second gear 506 is fixedly connected to one end of the movable guide vane 509, such as...Figure 7 and Figure 8 As shown, the guide plate 505 is arranged at an angle, and a guide groove is provided inside the guide plate 505. The second rack 507 is located inside the guide groove and forms a sliding guide engagement with the guide groove. The groove direction of the guide groove is consistent with the length direction of the guide plate 505. The second gear 506 is located inside the guide groove. Multiple movable guide vanes 509 are provided and are arranged at an angle from top to bottom on the air inlet side of the upper cavity and the lower cavity. When the SVG module is in low-power operation, the fan 104 draws the cooling airflow from outside the housing 101 through the air inlet grille 102. After initial cooling by the liquid-cooled heat exchanger 2, the cooling airflow reaches the guide assembly 5. The cooling airflow passes through the movable guide vanes 509, which are parallel to its direction, and blows the cooling airflow into the upper and lower cavities according to the airflow distribution ratio when the SVG module is operating at low power. That is, the upper cavity receives less airflow than the lower cavity when the SVG module is operating at low power. When the SVG module is in high-power operation, the electric push rod 513 pulls the second rack 507 along the guide groove, causing all the second gears 506 meshed on the second rack 507 to rotate. The movable guide vanes 509 rotate upwards simultaneously with the second gears 506, that is, the side of the movable guide vanes 509 closest to the upper cavity swings upwards. The cooling airflow is guided by multiple movable guide vanes 509 located on the air inlet sides of the upper and lower cavities, directing the cooling airflow towards... The upper cavity guides the airflow. This means that the movable guide vanes 509, located on the air inlet side of the lower cavity, rotate to guide the cooling airflow that originally entered the lower cavity into the upper cavity. The cooling airflow that originally entered the upper cavity remains unchanged. The addition of the cooling airflow that originally belonged to the lower cavity increases the airflow into the upper cavity. In this invention, at low power, the movable guide vanes 509 remain parallel to the airflow direction, maintaining the original airflow distribution ratio and ensuring sufficient cooling for the power board 4, which generates the most heat. At high power, the electric push rod 513 drives the rack and pinion mechanism to synchronously rotate the angle of all movable guide vanes 509, guiding more cooling airflow into the upper cavity and increasing the cooling airflow for the auxiliary power board 3. This solves the problem of increased heat generation from the auxiliary power board 3 itself and the combined heat radiation from the power board 4 during high-power operation. Simultaneously, by increasing the airflow into the upper cavity, the forced convection cooling of the auxiliary power board 3 is directly enhanced, preventing overheating from affecting its reliability.
[0035] In the above embodiments, such as Figure 8 , Figure 9 and Figure 10By rotating all the movable guide vanes 509 as a whole to adjust their angle with the cooling airflow direction, the airflow of the upper and lower cavities can be redistributed. However, when adjusting, all the vanes rotate synchronously, causing most of the airflow to be directed to the upper cavity, while the lower cavity can only obtain a small amount of airflow. It is impossible to achieve graded airflow distribution adjustment according to different power conditions. Therefore, in order to solve this problem, in another embodiment of the present invention, a torsion spring 512 is provided between the second gear 506 and the movable guide vane 509. One end of the torsion spring 512 is connected to one end of the second gear 506, and the other end of the torsion spring 512 is connected to the movable guide vane 509. A rectangular groove is opened at the end of the movable guide vane 509 near the guide plate 505. An electromagnetic pin 511 is fixedly connected inside the rectangular groove. The output end of the electromagnetic pin 511 and the limiting hole opened on the inner side of the guide plate 505 form a limiting abutment cooperation.
[0036] In this embodiment, after the fan 104 draws the cooling airflow into the housing 101, when the cooling airflow flows through the guide assembly 5, during low-power operation of the SVG module, one end of all electromagnetic pins 511 protrudes from the side opening of the rectangular slot and inserts into the corresponding limiting hole. Each limiting hole corresponds to one electromagnetic pin 511, and the number of electromagnetic pins 511 is the same as the number of second gears 506. All movable guide vanes 509 are locked at their initial angle, that is, the initial angle of the movable guide vanes 509 is parallel to the airflow direction. At this time, the electric push rod 513 can be activated to reciprocate along the extension direction of the guide groove to push the second rack 507 to slide in the guide groove. The movement of the rack 507 drives all the meshing second gears 506 to rotate, which in turn drives the movable guide vanes 509 connected to each second gear 506 to swing up and down periodically. The movable guide vanes 509 swing downward, that is, the side of the movable guide vanes 509 closest to the lower cavity swings downward. The heat dissipation airflow is alternately guided to the upper cavity and the lower cavity. Through the continuous swing of the movable guide vanes 509, the heat dissipation airflow is alternately delivered to the upper cavity and the lower cavity in an intermittent manner, which prolongs the residence time of the airflow in each cavity and forms a sweeping effect, thereby improving the uniformity of contact between the airflow and the heat dissipation surface and enhancing the overall heat dissipation efficiency under low power conditions. When the SVG module operates at high power, the auxiliary power board 3 inside the upper cavity generates more heat, and the heat generated by the high-power operation of the inverter inductor 107 and the power frequency inductor 108 in the lower cavity radiates upwards to the bottom of the auxiliary power board 3, causing the temperature of the auxiliary power board 3 to rise. This increases the heat dissipation requirement of the auxiliary power board 3. The system releases the locking of the electromagnetic pins 511 of one or more movable guide vanes 509 at corresponding positions. During this process, the electromagnetic pins 511 unlock sequentially from top to bottom. Subsequently, the second rack 507 is driven to slide within the guide plate 505, causing all the second gears 506 meshed on the second rack 507 to rotate. The unlocked movable guide vanes 509... The second gear 506 rotates upwards simultaneously, increasing the airflow into the upper cavity. The remaining movable guide vanes 509, still locked by the electromagnetic pins 511, remain stationary, ensuring the stability of airflow distribution in other areas. When power continues to increase, further increasing the airflow into the upper cavity is required. In this case, a corresponding number of blade electromagnetic pins 511 are released, and the movable guide vanes 509 rotate upwards sequentially from bottom to top. Specifically, the side of the movable guide vane 509 closest to the upper cavity swings upwards. Under the action of the torsion spring 512, the movable guide vane 509 rotates to the same angle as the previously rotated movable guide vane 509, further increasing the airflow into the upper cavity. This design... The design achieves selective control of airflow distribution within the duct cross-section. It dynamically adjusts the airflow distribution ratio based on the real-time heat load of different heating elements in the upper and lower cavities, rather than adjusting the entire system synchronously. This significantly improves the adaptability and energy efficiency of the heat dissipation system. By selectively unlocking the movable guide vanes 509 at specific locations, targeted airflow supplementation can be implemented for localized overheating areas in the upper and lower cavities caused by device layout and uneven heating. This significantly improves the heat dissipation effect and ensures that the duct structure in areas not affected by adjustment remains unchanged during the adjustment process, avoiding airflow turbulence caused by the reconstruction of the entire airflow field due to the adjustment of a single movable guide vane 509. The system addresses issues of erratic flow and pressure fluctuations, helping it maintain stable cooling performance under changing operating conditions. Simultaneously, the torsion spring 512 provides rapid reset torque, which, combined with the on / off control of the electromagnetic pin 511, enables the system to achieve rapid airflow adjustment response. This graded adjustment method allows the system to flexibly adapt to different heat dissipation requirements, ranging from mild to severe. The specifications of the torsion spring 512 are pre-calculated and selected to ensure that its reset torque is always greater than the aerodynamic drag torque experienced by the movable guide vane 509 at maximum wind speed. This guarantees that under any permissible operating condition, when the electromagnetic pin 511 is released, the torsion spring 512 can reliably drive the movable guide vane 509 to rotate to the target angle, overcoming airflow influences.In summary, the movable guide vanes 509 in this embodiment not only enable periodic up-and-down oscillation, creating a sweeping effect at low power, but also allow for zoned and graded angle locking and unlocking at high power, thereby achieving dynamic and on-demand spatial distribution of airflow.
[0037] In the above embodiments, such as Figure 8 , Figure 9 and Figure 10 The movable guide vane 509 achieves airflow distribution between the upper and lower cavities through angle adjustment. However, when the movable guide vane 509 forms a non-parallel angle with the main airflow direction in the duct, the airflow will directly impact the surface of the movable guide vane 509. This will not only significantly reduce the flow velocity and affect the heat dissipation efficiency due to increased wind resistance, but also induce unstable vortices on the leeward side of the movable guide vane 509, leading to disordered airflow organization, decreased adjustment accuracy, and potentially additional aerodynamic noise. Therefore, in order to solve this problem, in another embodiment of the present invention, the guide assembly 5 further includes a fixed guide vane 508. The fixed guide vane 508 and the movable guide vane 509 are hinged by a pin. A fixing block 510 is fixedly connected to one end of the fixed guide vane 508. The fixing block 510 is fixed to the bottom surface of the guide plate 505. One end of the second gear 506 is connected to the rotational connection between the fixed guide vane 508 and the movable guide vane 509.
[0038] In this embodiment, the fixed guide vane 508 is arranged horizontally. When the SVG module is running at low power, the movable guide vane 509, driven by the second gear 506, rotates to a position basically flush with the fixed guide vane 508. At this time, the overall guide vane assembly tends to be parallel to the main airflow direction, allowing the airflow to pass smoothly with minimal wind resistance. The airflow distribution follows a set basic ratio. When the SVG module enters a high-power state and needs to distribute more airflow to the upper cavity, the second gear 506 drives the movable guide vane 509 to rotate around the hinge point, making it form a certain angle with the fixed guide vane 508. 508 remains in a stable position. The cooling airflow first contacts the fixed guide vane 508, receiving initial guidance and acceleration, and then flows through the movable guide vane 509. This avoids the airflow directly impacting the surface of the movable guide vane 509, which would cause significant velocity loss. The presence of the fixed guide vane 508 can constrain the airflow separation on the leeward side of the movable guide vane 509, effectively reducing the generation of unstable vortices and making the airflow turn smoother and more orderly. By controlling the angle of the movable guide vane 509, more airflow can be guided smoothly and efficiently to the target area, achieving stepless or graded adjustment of the airflow distribution ratio while maintaining high aerodynamic stability.
[0039] In the above embodiments, such as Figure 6The movable guide vane 509 can dynamically control the airflow distribution between the upper and lower cavities by adjusting its deflection angle. When the airflow is guided and enters the lower cavity, the internal inverter inductor 107 is higher than the power frequency inductor 108 in the vertical direction and is located upstream of it in the airflow direction, thus forming a blockage in the air intake path. This causes the mainstream heat dissipation airflow entering the cavity to weaken and become unevenly distributed after passing through the inverter inductor 107, making it difficult to effectively penetrate and cover the power frequency inductor 108 located downstream and at a lower position, thereby forming a local heat dissipation blind zone, affecting the heat dissipation performance of the component and the overall thermal balance of the system. Therefore, in order to solve this problem, in another embodiment of the present invention, a ventilation slot 514 is fixedly connected to the bottom of the auxiliary power supply board 3. The ventilation slot 514 has a hollow structure inside, and an arc-shaped air guide block 515 is installed at the air outlet position on one side of the ventilation slot 514 and at the bottom of the ventilation slot 514.
[0040] In this embodiment, when the cooling airflow enters the lower cavity under the distribution of the movable guide vanes 509, part of the airflow first encounters the upstream, highly protruding inverter inductor 107. At this time, another part of the airflow can be introduced from the side or bottom opening of the ventilation slot 514. The ventilation slot 514 is arranged along the airflow entry direction, and its hollow internal structure forms an auxiliary air duct, allowing the airflow to bypass the positive blocking area of the inverter inductor 107. The airflow entering the ventilation slot 514 converges and accelerates inside it. Through the arc-shaped air guide blocks 515 arranged at the outlet and bottom of the ventilation slot 514, the airflow is smoothly guided and divided into two paths. The upper airflow is guided to the rear side and upper space of the inverter inductor 107 through the arc-shaped air guide blocks 515 at the side air outlet, that is, the cooling airflow acts on the top area of the power frequency inductor 108. The lower airflow is deflected downward through the arc-shaped air guide blocks 515 at the bottom of the ventilation slot 514 and flows directly to the bottom area of the power frequency inductor 108 located at a lower position. Since the inverter inductor 107 is relatively tall... Located upstream of the air intake, it would block the air intake of the power frequency inductor 108 behind it. The ventilation slot 514 can draw airflow from its side and bottom, and guide it with the arc-shaped air guide block 515, so that the airflow can bypass the obstruction in front and directly reach the surface of the blocked power frequency inductor 108. This effectively improves the heat dissipation problem caused by insufficient airflow in this area. By compensating for the airflow in the local heat dissipation dead corner, the temperature difference between the power frequency inductor 108 and the inverter inductor 107 can be significantly reduced, avoiding accelerated aging or performance degradation of the device caused by local continuous high temperature. This improves the thermal balance and long-term operational stability of the overall system. This structure does not require the addition of a fan 104 or an increase in the total airflow. It only guides the airflow to the lower-height power frequency inductor 108 behind it through airflow guidance and distribution, improving the airflow utilization efficiency of the existing air-cooling system. The ventilation slot 514 is set at the bottom of the auxiliary power source plate 3, using the original structural space to form an auxiliary air path without affecting the layout and flow area of the main air duct. It enhances the air-cooling function in a limited space.
[0041] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention.
Claims
1. An SVG air-liquid hybrid heat dissipation system, comprising a chassis (1), a liquid-cooled heat exchanger (2), and a flow guiding assembly (5), wherein the chassis (1) comprises a shell (101), a fan (104), a MOS transistor (105), and a capacitor (106), wherein the shell (101) is provided with an upper cavity and a lower cavity, the upper cavity being located directly above the lower cavity, an auxiliary power board (3) being installed in the upper cavity, and a power board (4) being installed in the lower cavity, wherein the liquid-cooled heat exchanger (2), the fan (104), the MOS transistor (105), the capacitor (106), and the flow guiding assembly (5) are all disposed inside the shell (101) and are arranged horizontally in sequence along the airflow direction of the air duct inside the shell (101); Its features are, The flow guiding assembly (5) includes a guide plate (505), a second gear (506), a second rack (507), and a movable flow guiding blade (509). The second rack (507) is driven to slide inside the guide plate (505). The second rack (507) meshes with the second gear (506). One end of the second gear (506) is rotatably connected to the inner wall of the guide plate (505), and the other end is connected to one end of the movable flow guiding blade (509).
2. The SVG air-liquid hybrid heat dissipation system according to claim 1, characterized in that, The liquid-cooled heat exchanger (2) includes a condenser (203), a liquid-cooled plate (204), a micro pump (202), a liquid outlet pipe (206), a liquid outlet plate (201), and a liquid return plate (208). The liquid outlet plate (201) is fixedly installed on the upper surface of the condenser (203), and the liquid return plate (208) is fixedly installed on the lower surface of the condenser (203). Both the liquid outlet plate (201) and the liquid return plate (208) are hollow and connected to the interior of the condenser (203). The micro pump (202) is installed on the top of the liquid outlet plate (201), and the liquid inlet of the micro pump (202) is connected to the interior of the liquid outlet plate (201). The liquid outlet of the micro pump (202) is connected to one end of the liquid outlet pipe (206). The liquid outlet pipe (206) is connected to the liquid cooling plate (204) at one end. The liquid cooling plate (204) is hollow inside. The liquid outlet pipe (206) is connected to the liquid cooling plate (204). The return plate (208) is connected to one end of the return pipe (207) and is connected to the inside of the return plate (208). The other end is connected to the liquid cooling plate (204) and is connected to the inside of the liquid cooling plate (204). There are multiple liquid cooling plates (204). Adjacent liquid cooling plates (204) are connected to each other through pipes. The condenser (203) and capacitor (106) are symmetrically arranged on both sides of the fan (104). Each liquid cooling plate (204) is connected to a MOS tube (105) on its outer side.
3. The SVG air-liquid hybrid heat dissipation system according to claim 2, characterized in that, The inner wall of the liquid cooling plate (204) is provided with an arc-shaped turbulence column (205).
4. The SVG air-liquid hybrid heat dissipation system according to claim 2, characterized in that, The condenser (203) includes a serpentine heat sink (2031) and a microchannel (2032). The upper and lower ends of the microchannel (2032) are connected to the liquid outlet plate (201) and the liquid return plate (208) respectively. The serpentine heat sink (2031) is connected to the side of the microchannel (2032).
5. The SVG air-liquid hybrid heat dissipation system according to claim 1, characterized in that, The power board (4) is fixedly connected to the inner bottom surface of the outer shell (101). An inverter inductor (107) and a power frequency inductor (108) are fixedly installed on the power board (4). The inverter inductor (107) and the power frequency inductor (108) are arranged sequentially along the air duct, wherein the inverter inductor (107) is located on the air inlet side of the power frequency inductor (108).
6. The SVG air-liquid hybrid heat dissipation system according to claim 1, characterized in that, The chassis (1) also includes an air inlet grille (102) and an air outlet grille (103). The air inlet grille (102) is fixedly connected to the air duct inlet of the outer shell (101), and the air outlet grille (103) is fixedly connected to the air duct outlet of the outer shell (101). The capacitor (106) is close to the side of the liquid cooling plate (204).
7. The SVG air-liquid hybrid heat dissipation system according to claim 1, characterized in that, A torsion spring (512) is provided between the second gear (506) and the movable guide vane (509). One end of the torsion spring (512) is connected to one end of the second gear (506), and the other end of the torsion spring (512) is connected to the movable guide vane (509). A rectangular groove is provided at one end of the movable guide vane (509) near the guide plate (505). An electromagnetic pin (511) is fixedly connected inside the rectangular groove. The output end of the electromagnetic pin (511) and the limiting hole opened on the inner side of the guide plate (505) form a limiting abutment cooperation.
8. The SVG air-liquid hybrid heat dissipation system according to claim 1, characterized in that, The flow guiding assembly (5) also includes a slide rail (501) and a motor (504). The slide rail (501) is inclined and fixed to the inner wall of the outer shell (101). A groove is provided on one side of the slide rail (501). A first rack (502) is slidably connected inside the groove. A first gear (503) is meshed with the tooth groove on the surface of the first rack (502). One end of the first gear (503) is fixedly connected to the output end of the motor (504). The motor (504) is fixedly connected to the top of the slide rail (501). The side of the first rack (502) is fixedly connected to the side of the guide plate (505). An electric push rod (513) is fixedly connected to one end of the outer side of the guide plate (505). The output end of the electric push rod (513) passes through the outer wall of the guide plate (505) and is fixedly connected to one end of the second rack (507).
9. The SVG air-liquid hybrid heat dissipation system according to claim 8, characterized in that, The flow guiding assembly (5) further includes a fixed flow guiding blade (508), which is hinged to the movable flow guiding blade (509) by a pin. A fixed block (510) is fixedly connected to one end of the fixed flow guiding blade (508), and the fixed block (510) is fixed to the bottom surface of the guide plate (505). One end of the second gear (506) is connected to the rotational connection between the fixed flow guiding blade (508) and the movable flow guiding blade (509).
10. The SVG air-liquid hybrid heat dissipation system according to claim 5, characterized in that, The auxiliary source plate (3) is fixedly connected to a ventilation slot (514) at the bottom. The ventilation slot (514) has a hollow structure inside, and an arc-shaped air guide block (515) is installed at the air outlet on one side of the ventilation slot (514) and at the bottom of the ventilation slot (514).