Packaging device

Abstract

The invention relates to the technical field of LED packaging, and discloses a packaging device which comprises a substrate and a chip lead support fixed to the substrate, an LED chip is arranged on the chip lead support, the substrate is connected with a packaging surrounding frame, a plurality of semi-ring flow channels are formed in the inner wall of the bottom end of the packaging surrounding frame, a packaging glue layer used for wrapping the LED chip is poured into the packaging surrounding frame, and the packaging glue layer is connected with a plurality of semi-ring flow channels. Excess gas is exhausted through the exhaust holes, empty corners are avoided, bubbles are also avoided from appearing on a binding face during glue injection, and due to the arrangement of the multiple semi-ring flow channels, firstly, the contact area of the packaging glue layer can be increased, the adhesion compactness of the packaging glue layer after curing can be improved, and the service life of the packaging glue layer can be prolonged; the plurality of supporting legs are clamped in the semi-ring flow channel, so that the packaging adhesive layer is firmly positioned in the packaging surrounding frame, and under the condition that the packaging adhesive layer is integrally degummed, the packaging adhesive layer is ensured not to fall off, the LED chip is prevented from being driven to be separated together, and the whole LED can be ensured to be continuously used.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED packaging, in particular to a packaging device. BACKGROUND

[0002] The function of LED packaging is to provide sufficient protection for the chip to prevent the chip from failing due to long-term exposure to air or mechanical damage, so as to improve the stability of the chip, and the LED packaging is mostly packaged by resin material.

[0003] The resin packaging structure will release stress during long-term aging process, so that the adhesion between the resin film layer and the packaging substrate is poor, which easily causes the resin film layer and the packaging substrate to delaminate, and the LED is also easily caused to delaminate when used in some outdoor environments, such as large temperature fluctuations or high humidity, which further causes the chip to fall off, and when the packaging glue layer delaminates, a gap will appear at the connection between the packaging glue layer and the support, which makes the LED packaging device easy to enter dust and be damp, affecting the use of the LED.

[0004] Therefore, the present application provides a packaging device. SUMMARY

[0005] The present application aims to provide a packaging device to solve the above problems.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a packaging device, comprising a substrate and a chip lead frame fixed on the substrate, an LED chip is arranged on the chip lead frame, a packaging enclosure is connected to the substrate, a plurality of semi-ring flow channels are arranged on the inner wall of the bottom end of the packaging enclosure, a packaging glue layer for covering the LED chip is filled in the packaging enclosure, and a pressing assembly is arranged at the top end of the packaging enclosure. The pressing assembly comprises a sealing ring in pressure contact with the surface of the packaging glue layer, mounting struts fixed on the packaging enclosure and arranged in a ring shape, and a pressing ring sleeved on the mounting struts, the sealing ring is sleeved on the mounting struts, and the sealing ring and the pressing ring are axially displaced along the mounting struts, the pressing ring and the sealing ring are connected by a spring piece, a sealing ring is sleeved on the mounting struts, and the sealing ring and the pressing ring are axially displaced along the mounting struts, the pressing ring and the sealing ring are connected by a spring piece, the sealing ring is in pressure contact with the surface of the packaging glue layer, and the outer edge is sealed, the packaging glue layer is in pressure contact with the substrate at all times by means of pressing, which prevents the packaging glue layer from delaminating, and the outer ring is in pressure contact with the substrate, which effectively prevents moisture and dust while not affecting light transmission, thereby increasing the service life of the LED.

[0007] Preferably, the semi-annular flow channel groove wall is provided with exhaust holes for penetrating the packaging frame, and when the packaging glue layer is in the process of drop glue packaging, the semi-annular flow channel plays a guiding effect on the glue liquid, and the air at the junction of the bottom end of the packaging frame and the substrate is discharged through the exhaust holes when the glue liquid passes through the semi-annular flow channel, thereby avoiding the occurrence of empty angle and the appearance of bubbles on the bonding surface during glue injection.

[0008] Preferably, the inner wall of the bottom end of the closed ring is provided with a closed pad, and the closed ring is provided with a hole groove corresponding to the exhaust hole, and the hole groove is used for discharging excess gas when the hole groove is aligned with the exhaust hole, and the closed pad is used for closing the exhaust hole when the closed pad is bonded with the exhaust hole, thereby preventing dust and moisture from entering the exhaust hole.

[0009] Preferably, the lower end surface of the sealing ring is provided with a silica gel sealing ring, the silica gel sealing ring is bonded with the outer circle of the upper end surface of the packaging glue layer, and the silica gel sealing ring is pressed against the surface of the packaging glue layer, thereby effectively ensuring the bonding tightness, improving the sealing effect, and effectively preventing moisture.

[0010] Preferably, the limiting ring is provided with four clamping grooves, and the bottom end surface of the limiting ring is provided with four inclined blocks, the clamping grooves are used for pressing the ring downward, and the inclined blocks are used for gradually pressing the ring, thereby providing a fixed pressure for the ring.

[0011] Preferably, the outer wall of the pressing ring is extended and provided with four clamping plates, the clamping plates are matched with the clamping grooves, and the clamping plates are used for installing and limiting the ring, thereby improving the stability of the whole after assembly.

[0012] Preferably, the inner wall of the closed ring is provided with a semicircular protrusion, the outer wall of the packaging frame is provided with a circle of protrusions staggered with the semicircular protrusion, the semicircular protrusion is staggered with the protrusions on the outer wall of the packaging frame, thereby preventing the closed ring from being easily displaced after being closed, and improving the sealing stability.

[0013] Preferably, the LED chip is tin soldered with gold wires for connecting with the chip lead frame, thereby replacing the copper wires with gold wires to reduce the occurrence of overheating and blackening.

[0014] The technical effects and advantages of the present application are as follows: 1. The present application can discharge excess gas through the exhaust holes, avoid the occurrence of empty angle, and avoid the appearance of bubbles on the bonding surface during glue injection, and the setting of multiple semi-annular flow channels can first increase the contact area of the packaging glue layer, improve the adhesion tightness of the packaging glue layer after curing, and prolong the service life of the packaging glue layer, and secondly, when the packaging glue layer is delaminated, the multiple supporting feet are clamped in the semi-annular flow channel, so that the packaging glue layer is still firmly located in the packaging frame, and when the packaging glue layer is delaminated, the packaging glue layer will not fall off, thereby avoiding the LED chip from being separated together, and ensuring that the whole LED can continue to be used.

[0015] 2. The pressure ring of this invention uses a spring sheet to press the sealing ring, causing the sealing ring to press against the surface of the encapsulating adhesive layer, sealing the outer edge. By pressing, the encapsulating adhesive layer is kept pressed against the substrate, preventing delamination. The sealing method of pressing against the outer ring effectively prevents moisture and dust while not affecting light transmission, increasing the lifespan of the LED. At the same time, the sealing ring and the encapsulating adhesive layer are sealed together, and the pressure on the surface of the encapsulating adhesive layer is also generated to offset the stress caused by the aging of the encapsulating adhesive layer, preventing the encapsulating adhesive layer from separating outward due to aging stress and delamination. Furthermore, if the encapsulating adhesive layer delaminates completely, it can also act as a limit to prevent the encapsulating adhesive layer from falling off. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention; Figure 2 This is a half-sectional view of the encapsulation frame structure according to Embodiment 1 of the present invention; Figure 3 For the present invention Figure 2 Enlarged view of point A; Figure 4 This is a schematic diagram of the closed-loop structure of the present invention; Figure 5 This is a schematic diagram of the overall structure of Embodiment 2 of the present invention; Figure 6 This is an exploded view of the overall structure of Embodiment 2 of the present invention; Figure 7 This is an overall cross-sectional view of the spring clip in the compressed state of the present invention; Figure 8 For the present invention Figure 7 Enlarged view of point B; Figure 9 This is a schematic diagram of the pressure ring and limiting ring structure of the present invention.

[0017] In the diagram: 1. Substrate; 2. Chip lead frame; 3. Packaging enclosure; 31. Semi-circular flow channel; 311. Vent hole; 32. Sealing ring; 321. Groove; 322. Semi-circular bump; 33. Limiting ring; 331. Slot; 332. Angled block; 4. Encapsulation adhesive layer; 5. Pressing assembly; 51. Sealing ring; 511. Silicone sealing ring; 52. Mounting rod; 53. Pressure ring; 531. Spring; 532. Clamping plate. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Embodiment 1: Reference Figures 1-4 For the first embodiment of the application, a packaging device is provided, which comprises a substrate 1 and a chip lead frame 2 fixed on the substrate 1, and an LED chip is arranged on the chip lead frame 2. A packaging enclosure 3 is connected to the substrate 1, and a packaging glue layer 4 for covering the LED chip is filled in the packaging enclosure 3. A plurality of semi-ring flow channels 31 are formed on the inner wall of the bottom end of the packaging enclosure 3, and exhaust holes 311 for penetrating the packaging enclosure 3 are formed on the groove walls of the semi-ring flow channels 31. When the packaging glue layer 4 is being dropped and packaged, the semi-ring flow channels 31 have a draining effect on the glue liquid. When the air at the angle between the bottom end of the packaging enclosure 3 and the substrate 1 passes through the semi-ring flow channels 31, the excess gas is discharged through the exhaust holes 311, thereby avoiding the occurrence of an empty angle and the appearance of air bubbles on the bonding surface during glue injection. It should be noted that when the packaging glue layer 4 is affected by aging or external factors, delamination may occur, including overall delamination. For example, the packaging glue layer 4 is delaminated as a whole, so that the bottom end of the packaging glue layer 4 is delaminated from the substrate 1. When the outer wall of the packaging glue layer 4 is also not bonded to the inner wall of the packaging enclosure 3 as a whole, the packaging glue layer 4 will directly fall off and separate as a whole, which may also separate the LED chip. By integrally forming a plurality of semi-ring flow channels 31 on the inner wall of the bottom end of the packaging enclosure 3, the semi-ring flow channels 31 and the exhaust holes 311 cooperate to not only discharge excess gas when the packaging glue layer 4 is being dropped and packaged, but also form an integral solidification layer with the packaging glue layer 4 after the packaging glue in the plurality of semi-ring flow channels 31 is solidified. The solidified packaging glue in the plurality of semi-ring flow channels 31 is equivalent to a plurality of fixed feet of the packaging glue layer 4, which are positioned by the semi-ring flow channels 31. The plurality of semi-ring flow channels 31 can first increase the contact area of the packaging glue layer 4, improve the adhesion tightness of the packaging glue layer 4 after solidification, and prolong the service life of the packaging glue layer 4. Secondly, when the packaging glue layer 4 is delaminated as a whole, the plurality of feet are clamped in the semi-ring flow channels 31, so that the packaging glue layer 4 is still firmly located in the packaging enclosure 3. In the case of overall delamination of the packaging glue layer 4, the packaging glue layer 4 is prevented from falling off and the LED chip is prevented from being separated, thereby ensuring that the entire LED can continue to be used.

[0020] The number of semi-ring flow channels 31 on the inner wall of the packaging enclosure 3 can be adjusted according to specific packaging requirements. In order to ensure the overall stability of the packaging glue layer 4 after delamination, it is recommended that the number of semi-ring flow channels 31 be not less than two.

[0021] The gold wires for connecting the chip lead frame 2 are tin soldered on both ends of the LED chip. By replacing the copper wires with gold wires, the occurrence of overheating and blackening is reduced.

[0022] The outer surface of the packaging frame 3 is sleeved with a closing ring 32, the inner wall of the bottom end of the closing ring 32 is provided with a ring of closing pads, and a hole groove 321 corresponding to the exhaust hole 311 is formed on the closing ring 32. When the hole groove 321 is aligned with the exhaust hole 311, it is used for discharging excess gas. When the closing pad is combined with the exhaust hole 311, the exhaust hole 311 is closed, preventing the exhaust hole 311 from being directly in contact with air, so that the internal water vapor and dust are prevented from being in contact with the outside for a long time, thereby affecting the stability of the encapsulation adhesive layer 4 in the half-ring flow channel 31, and effectively preventing dust and water vapor from entering from the bottom end.

[0023] A semicircular convex point 322 is arranged on the inner wall of the closing ring 32, and a circle of convex points staggered with the semicircular convex point 322 is arranged on the outer wall of the packaging frame 3. The semicircular convex point 322 is staggered with the convex points on the outer wall of the packaging frame 3, preventing the closing ring 32 from being easily dislocated after being closed, and improving the closing stability.

[0024] In the embodiment 2, the encapsulation adhesive layer 4 may also be partially delaminated, for example, the encapsulation adhesive layer 4 is partially delaminated due to uneven heating, and is not bonded with the inner wall of the packaging frame 3, so that a gap is formed between the encapsulation adhesive layer 4 and the packaging frame 3. Since the LED is used in many environments, the gap between the encapsulation adhesive layer 4 and the packaging frame 3 is easy to enter water in an outdoor environment, which may cause damage to the LED circuit. In order to solve the above technical problems, the embodiment two is provided.

[0025] Referring to Figures 1-9For the second embodiment of the application, which is different from the first embodiment, the packaging enclosure 3 is provided with a compression assembly 5 at the top end, and an arc-shaped slot is formed at the top end of the packaging enclosure 3 for mounting the compression assembly 5. The compression assembly 5 includes a sealing ring 51 that is pressed against the surface of the packaging adhesive layer 4, mounting struts 52 that are fixed to the packaging enclosure 3 and are distributed in a ring shape, and a compression ring 53 that is sleeved on the mounting struts 52. The sealing ring 51 is sleeved on the mounting struts 52, and both the sealing ring 51 and the compression ring 53 are axially displaced along the mounting struts 52. The compression ring 53 and the sealing ring 51 are connected by a spring piece 531. The sealing ring 51 is pressed against the surface of the packaging adhesive layer 4 by the compression ring 53, and the outer edge is sealed. By means of compression, the packaging adhesive layer 4 is always pressed against the substrate 1, preventing delamination of the packaging adhesive layer 4. The sealing ring 51 is sealed to the packaging adhesive layer 4, effectively preventing moisture and dust while not affecting light transmission, increasing the service life of the LED. At the same time, the sealing ring 51 is sealed to the packaging adhesive layer 4, which can also generate a pressure on the surface of the packaging adhesive layer 4, offsetting the stress generated by aging of the packaging adhesive layer 4, preventing delamination caused by outward separation of the packaging adhesive layer 4 due to aging stress. In addition, if the packaging adhesive layer 4 is delaminated as a whole, the packaging adhesive layer 4 can also serve as a limiting function to prevent it from falling off.

[0026] A silica gel sealing ring 511 is mounted on the lower end face of the sealing ring 51, and the silica gel sealing ring 511 is attached to the outer ring of the upper end face of the packaging adhesive layer 4. The silica gel sealing ring 511 is pressed against the surface of the packaging adhesive layer 4, and the soft glue is pressed to effectively ensure the tightness of the attachment and improve the sealing effect, effectively preventing moisture. It should be noted that the silica gel sealing ring 511 is made of liquid silica gel material. Since the packaging adhesive layer 4 may have local edge collapse due to aging stress, the special fluidity of the liquid silica gel material can deform and fill the local edge collapse of the packaging adhesive layer 4 under compression, ensuring that the silica gel sealing ring 511 can still achieve sealing even in the case of uneven surface.

[0027] The limiting ring 33 is provided with four clamping grooves 331 on the upper end, and the limiting ring 33 is provided with four inclined blocks 332 on the bottom end surface. The clamping grooves 331 are used for limiting the downward pressing of the pressing ring 53. The inclined blocks 332 are used for gradually pressing the pressing ring 53, so as to provide a fixed pressure for the pressing ring 53. The pressing ring 53 is provided with four clamping plates 532 extending on the outer wall. The clamping plates 532 are matched with the clamping grooves 331. The clamping plates 532 are used for installing and limiting the pressing ring 53, so as to improve the stability of the whole after assembly. Through the rotation of the limiting ring 33, the inclined surface of the inclined block 332 is used for the downward axial movement of the pressing ring 53. In the case that the upper end of the pressing ring 53 is clamped by the limiting ring 33, the force of the elastic sheet 531 can only be used for pressing the sealing ring 51 and the encapsulation adhesive layer 4. Through the compression of the elastic force of the elastic sheet 531, the sealing ring 51 can always be in contact with the encapsulation adhesive layer 4.

[0028] Embodiment 3: Refer to Figures 1-9 Figures 1-9 For a third embodiment of the application, a use method of an encapsulated device is provided, comprising the following steps: S1: In the process of dropping the encapsulation adhesive layer 4 for sealing, the semi-ring flow channel 31 is used for guiding the glue liquid. The air at the included angle between the bottom end of the encapsulation frame 3 and the substrate 1 is discharged through the exhaust hole 311 when the glue liquid passes through the semi-ring flow channel 31, so as to avoid the appearance of an empty corner; S2: After the encapsulation adhesive layer 4 is solidified, the solidified encapsulation adhesive in the semi-ring flow channel 31 is a plurality of supporting legs of the encapsulation adhesive layer 4. The semi-ring flow channel 31 is used for limiting the supporting legs of the encapsulation adhesive layer 4, so as to prevent the encapsulation adhesive layer 4 from falling off; S3: The sealing ring 51 and the pressing ring 53 are sequentially sleeved and installed on the installation supporting rod 52. When the pressing ring 53 is installed, the clamping plate 532 on the outer wall is matched and installed with the clamping groove 331 provided on the limiting ring 33. The closed ring 32 is rotated, so that the hole groove 321 is misaligned with the exhaust hole 311. The closed pad is matched with the exhaust hole 311, which is used for closing the exhaust hole 311. The closed ring 32 is rotated, and the limiting ring 33 is rotated at the same time; S4: The limiting ring 33 is rotated, and the inclined surface at the lower end of the inclined block 332 is used for extruding the upper end of the clamping plate 532. When the most protruding part of the inclined block 332 is matched with the upper end of the clamping plate 532, the pressing ring 53 is compressed to the most tight state. The elastic sheet 531 extrudes the sealing ring 51, so that the silica gel sealing ring 511 on the sealing ring 51 is tightly pressed with the surface of the encapsulation adhesive layer 4; S5: When the closed ring 32 is rotated, the semi-circular convex points 322 provided on the inner wall of the closed ring 32 and the convex points 322 provided on the outer wall of the encapsulation frame 3 generate damping. When the closed ring 32 is rotated and matched, the semi-circular convex points 322 provided on the inner wall of the closed ring 32 and the convex points provided on the outer wall of the encapsulation frame 3 are staggered and embedded, so as to realize clamping and avoid the random displacement of the closed ring 32.

[0029] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art will appreciate that the technical solutions described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalent features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A packaging device, comprising a substrate (1) and a chip lead frame (2) fixed on the substrate (1), wherein an LED chip is disposed on the chip lead frame (2), characterized in that: The substrate (1) is connected to a packaging frame (3), and a plurality of semi-circular channels (31) are opened on the inner wall of the bottom end of the packaging frame (3). The packaging frame (3) is filled with a packaging adhesive layer (4) for covering LED chips, and a pressure-fixing component (5) is provided at the top of the packaging frame (3). The pressing assembly (5) includes a sealing ring (51) pressed against the surface of the encapsulation adhesive layer (4), a mounting support rod (52) fixed on the encapsulation frame (3) and distributed in a ring, and a pressure ring (53) sleeved on the mounting support rod (52). The sealing ring (51) is sleeved on the mounting support rod (52), and both the sealing ring (51) and the pressure ring (53) are axially displaced along the mounting support rod (52). The pressure ring (53) and the sealing ring (51) are connected by a spring piece (531). A closing ring (32) is sleeved on the outer surface of the encapsulation frame (3), and a limiting ring (33) for pressing the pressure ring (53) is connected to the upper end face of the closing ring (32).

2. The packaged device according to claim 1, characterized in that: The semi-circular channel (31) has an exhaust hole (311) on its groove wall for penetrating the encapsulation frame (3).

3. The packaged device according to claim 2, characterized in that: The inner wall of the bottom end of the sealing ring (32) is provided with a sealing pad, and the sealing ring (32) is provided with a groove (321) corresponding to the exhaust hole (311).

4. The packaged device according to claim 3, characterized in that: A silicone sealing ring (511) is installed on the lower end face of the sealing ring (51), and the silicone sealing ring (511) is attached to the outer ring of the upper end face of the encapsulation adhesive layer (4).

5. The packaged device according to claim 4, characterized in that: The limiting ring (33) has four slots (331) and four inclined blocks (332) are provided on the bottom surface of the limiting ring (33).

6. The packaged device according to claim 5, characterized in that: The outer wall of the pressure ring (53) is provided with four retaining plates (532), which are matched with the retaining grooves (331).

7. The packaged device according to claim 6, characterized in that: The inner wall of the closed ring (32) is provided with a semi-circular protrusion (322), and the outer wall of the encapsulation frame (3) is provided with a ring of protrusions that interlock with the semi-circular protrusion (322).

8. The packaged device according to claim 7, characterized in that: The LED chip has gold wires soldered to both ends for connection with the chip lead frame (2).

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