Wafer cantilever cleaning mechanism and wafer cleaning equipment

Abstract

The invention provides a wafer cantilever cleaning mechanism and wafer cleaning equipment. The wafer cantilever cleaning mechanism comprises a mounting frame, a lifting driving assembly, a cantilever swinging unit and a fluid conveying channel, the mounting frame is used for fixing the wafer cantilever cleaning mechanism outside a cleaning cavity of the wafer cleaning equipment; the cantilever swing unit is connected to the power output end of the lifting driving assembly and comprises a hollow swing driver, a cantilever and a nozzle. The cantilever is in transmission connection with the power output end of the hollow swing driver. A nozzle is arranged on the cantilever; the fluid conveying channel is arranged in the hollow output shaft of the hollow swing driver in a penetrating mode and connected to the nozzle. The cleaning mechanism is arranged outside the cleaning cavity, so that the internal space of the cleaning cavity can be saved, and maintenance is convenient; meanwhile, according to the cleaning mechanism, the fluid conveying channel is integrated through the hollow swing driver, so that the cleaning mechanism is simpler and more compact in structure, light in weight and low in movement inertia, and the stability, precision and response speed of swing of the cantilever are remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and more specifically, to a wafer cantilever cleaning mechanism and a wafer cleaning device. Background Technology

[0002] The content in this section only provides background information related to this invention and may not constitute prior art.

[0003] In known wafer cleaning equipment, a wafer cleaning mechanism is typically used to spray a cleaning fluid composed of chemical solutions and other components onto the wafers on the support stage within the cleaning chamber to clean the wafers.

[0004] In related technologies, the wafer cleaning mechanism is usually placed directly inside the cleaning chamber. This not only occupies the limited space within the cleaning chamber but also makes maintenance of the wafer cleaning mechanism inconvenient. In addition, to achieve precise spraying of the cleaning fluid and to avoid the robotic arm used to transfer wafers when not in operation, such wafer cleaning mechanisms usually include complex lifting and swing drive components, fluid delivery pipeline systems, and nozzles. The integrated assembly of these components within the cleaning chamber can easily lead to a bulky and inefficient overall structure. During movement, especially when the swing arm performs high-precision reciprocating swings, the large structural inertia and complex transmission chain often result in unstable movements and slow response. Summary of the Invention

[0005] In view of this, the first objective of the present invention is to provide a wafer cantilever cleaning mechanism with a simpler and more compact structure, smoother movement, and external placement outside the cleaning chamber.

[0006] The second objective of this invention is to provide a wafer cleaning device employing the aforementioned wafer cantilever cleaning mechanism.

[0007] The objective of this invention is achieved through the following technical solution: In a first aspect, the present invention provides a wafer cantilever cleaning mechanism, comprising: Mounting bracket is used to fix the wafer cantilever cleaning mechanism to the outside of the cleaning chamber of the wafer cleaning equipment; A lifting drive assembly is mounted on the mounting bracket; A cantilever swing unit is connected to the power output end of the lifting drive assembly, and is driven to reciprocate vertically; the cantilever swing unit includes: Hollow oscillating actuator; The cantilever is connected to the power output end of the hollow swing actuator to be driven to swing back and forth between the avoidance position and the working position; the cantilever is provided with a nozzle. A fluid delivery channel is provided inside the hollow output shaft of the hollow swing drive and connected to the nozzle; In the avoidance position, the cantilever and the nozzle are located outside the cleaning chamber; in the working position, the cantilever extends into the cleaning chamber, and the nozzle is aligned with the upper surface of the wafer inside the cleaning chamber.

[0008] Optionally, the hollow swing driver is a hollow servo motor.

[0009] Optionally, the lifting drive assembly includes a lifting servo motor, a lead screw driven by the lifting servo motor, and a lifting seat threadedly engaged with the lead screw; The hollow swing actuator is fixedly connected to the lifting seat.

[0010] Optionally, the mounting bracket is provided with a first pipe clamp; the cantilever is provided with a second pipe clamp. The fluid delivery channel includes at least one fluid delivery pipe; the fluid delivery pipe has a vertical section and a horizontal section connected in sequence, the vertical section is limited by the first pipe clamp and passes through the hollow output shaft, and the horizontal section is limited by the second pipe clamp and extends along the cantilever to the nozzle.

[0011] Optionally, the vertical section and the first pipe clamp are in sliding engagement.

[0012] Optionally, the first tube clamp and / or the second tube clamp are slots.

[0013] Optionally, the cantilever is made of PEEK material.

[0014] Optionally, the portion of the fluid delivery channel that comes into contact with the cleaning fluid is made of PFA or PTFE material.

[0015] Optionally, the nozzle is a two-fluid nozzle.

[0016] In a second aspect, the present invention provides a wafer cleaning apparatus, including a cleaning chamber and a wafer cantilever cleaning mechanism as described above. The wafer cantilever cleaning mechanism is fixed outside the cleaning chamber by the mounting bracket; The sidewall of the cleaning chamber is provided with a clearance opening to allow the cantilever to swing back and forth between the clearance position and the working position, and to allow the cantilever in the working position to move back and forth vertically.

[0017] The technical solutions of the embodiments of the present invention have at least the following advantages and beneficial effects: This invention fundamentally avoids the space occupied by traditional built-in cleaning mechanisms by arranging the cleaning mechanism entirely outside the cleaning chamber, leaving ample space for wafer transfer and the installation of other process modules. At the same time, it allows the installation, debugging and maintenance of the cleaning mechanism itself to be performed directly outside the cleaning chamber, greatly improving the maintainability of the equipment.

[0018] Furthermore, this invention achieves decoupling and specialized drive between lifting and swinging functions by setting up an independent lifting drive component to drive the cantilever swinging unit to lift as a whole, combined with a design where the hollow swinging actuator directly drives the cantilever to reciprocate. In particular, the fluid delivery channel passes through the hollow output shaft of the hollow swinging actuator, creatively integrating power transmission and fluid delivery into a single rotating component. This greatly simplifies the structure of the cleaning mechanism, making it simpler, more compact, and lighter, effectively reducing the moment of inertia. Combined with a shortened transmission chain, this significantly improves the stability, positioning accuracy, and response speed of the cantilever during high-speed reciprocating swinging, fundamentally overcoming the problems of bulky structure and unstable operation in existing cleaning mechanisms. Simultaneously, the cantilever completely exits the cleaning chamber at the avoidance position, providing unobstructed operating space for wafer transfer. Attached Figure Description

[0019] Figure 1 A schematic diagram of the wafer cantilever cleaning mechanism provided in an embodiment of the present invention; Figure 2 for Figure 1 A cross-sectional view of the wafer cantilever cleaning mechanism is shown. Figure 3 A simplified diagram of a wafer cleaning apparatus provided for an embodiment of the present invention; it shows the cantilever in the working position.

[0020] Icons: 10-Mounting bracket, 20-Lifting drive assembly, 21-Lifting servo motor, 22-Screw, 23-Lifting seat, 24-Slide rail, 30-Cantilever swing unit, 31-Hollow swing driver, 32-Cantilever, 33-Nozzle, 34-Limiting part, 40-Fluid delivery channel, 41-Fluid delivery pipe, 50-Liquid supply pipe, 60-First pipe clamp, 70-Second pipe clamp, 100-Cleaning chamber, 101-Bearing platform, 102-Avoidance opening. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments. The same reference numerals in the accompanying drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the described embodiments of this invention without creative effort are within the scope of protection of this invention.

[0022] Compared to the embodiments shown in the accompanying drawings, feasible embodiments within the scope of protection of this invention may have fewer components, other components not shown in the drawings, different components, components with different arrangements, or components with different connections, etc. Furthermore, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0023] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components.

[0024] Please refer to Figures 1 to 3 As shown, an embodiment of the present invention provides a wafer cantilever cleaning mechanism for spraying cleaning fluid onto a wafer placed horizontally within a cleaning chamber 100 of a wafer cleaning equipment. The cleaning fluid described in this embodiment is a known cleaning fluid suitable for cleaning wafers in the prior art. Furthermore, the wafer located within the cleaning chamber 100 is typically placed on a horizontally rotatable support platform 101, so that the support platform 101 drives the wafer to rotate during the cleaning operation.

[0025] According to embodiments of the present invention, such as Figure 1 and Figure 2 As shown, the wafer cantilever cleaning mechanism includes a mounting frame 10, a lifting drive assembly 20, a cantilever swing unit 30, and a fluid delivery channel 40.

[0026] Mounting bracket 10 serves as the support structure for the entire wafer cantilever cleaning mechanism, used to fix the wafer cantilever cleaning mechanism outside the cleaning chamber 100 of the wafer cleaning equipment. In other words, unlike existing wafer cleaning mechanisms that are arranged inside the cleaning chamber 100, the wafer cantilever cleaning mechanism provided in this embodiment is an external cleaning mechanism used outside the cleaning chamber 100. This design directly avoids the cleaning mechanism occupying the limited space inside the cleaning chamber 100, and the external cleaning mechanism is easier to maintain.

[0027] The lifting drive assembly 20 is mounted on the mounting bracket 10 and is used to output reciprocating motion in the vertical direction. Specifically, the cantilever swing unit 30 is connected to the power output end of the lifting drive assembly 20 and is driven by the lifting drive assembly 20 to move reciprocally in the vertical direction. That is, the cantilever swing unit 30 in this embodiment of the invention has the ability to lift vertically.

[0028] Reference Figure 1 As shown, the cantilever swing unit 30 includes a hollow swing actuator 31, a cantilever 32, and a nozzle 33. The hollow swing actuator 31 includes a hollow output shaft that serves as a power output end for outputting horizontal rotational motion. The cantilever 32 extends horizontally and is connected to the power output end of the hollow swing actuator 31 for transmission, so as to be driven by the hollow swing actuator 31 to swing back and forth between a clearance position and a working position; the nozzle 33 is provided on the cantilever 32.

[0029] Preferably, one end of the cantilever 32 can be connected to the power output end of the hollow swing driver 31, and the nozzle 33 can be placed at the opposite end of the cantilever 32 to optimize the structural design of the cantilever swing unit 30. Meanwhile, the hollow swing driver 31 in this embodiment is a hollow servo motor, which fully utilizes the high precision, high response, and strong controllability of the servo motor, allowing for more precise control of the swing angle and speed of the cantilever 32, thereby enabling the achievement of more complex cleaning trajectories that better meet the requirements of the wafer cleaning process.

[0030] Reference Figure 2 As shown, the fluid delivery channel 40 passes through the hollow output shaft of the hollow swing driver 31 and is connected to the nozzle 33, enabling it to supply the aforementioned cleaning fluid to the nozzle 33. In an embodiment of the present invention, the cleaning fluid provided by the fluid delivery channel 40 comes from an external cleaning fluid supply system, which is a conventional module of wafer cleaning equipment known in the prior art, and will not be described in detail here.

[0031] In an embodiment of the present invention, when the cantilever 32 is in the avoidance position, the cantilever 32, the nozzle 33, and the entire wafer cantilever cleaning mechanism are located outside the cleaning chamber 100; when the cantilever 32 is in the avoidance position, the nozzle 33, the nozzle 33, and the entire wafer cantilever cleaning mechanism are located outside the cleaning chamber 100; when the cantilever 32 is in the avoidance position, the nozzle 32, the nozzle Figure 3 In the working position shown, the cantilever 32 extends into the cleaning chamber 100, and the nozzle 33 is aligned with the upper surface of the wafer in the cleaning chamber 100 so that the cleaning fluid provided by the fluid delivery channel 40 is sprayed onto the upper surface of the wafer through the nozzle 33.

[0032] Based on the above settings, the wafer cantilever cleaning mechanism provided in this embodiment of the invention can operate according to the following process to complete the wafer cleaning work.

[0033] Assuming the initial state, the cantilever 32 is in the clearance position to facilitate the transfer of the wafer to be cleaned into the cleaning chamber 100. After the wafer is placed on the horizontally rotatable support platform 101 in the cleaning chamber 100 and fixed, the hollow swing driver 31 drives the cantilever 32 to move from the clearance position to the working position so that the nozzle 33 is aligned with the upper surface of the wafer on the support platform 101.

[0034] Subsequently, the lifting drive assembly 20 can drive the cantilever swing unit 30 to move vertically, thereby changing the distance between the nozzle 33 and the upper surface of the wafer to meet the requirements of the wafer cleaning process. After the position of the nozzle 33 is determined, the support stage 101 drives the wafer to rotate horizontally. At the same time, the external cleaning fluid supply system supplies cleaning fluid to the nozzle 33 through the fluid delivery channel 40, so that the cleaning fluid is sprayed onto the upper surface of the wafer through the nozzle 33. Since the wafer is continuously rotating horizontally during the cleaning process, even if the nozzle 33 remains stationary, cleaning fluid can be sprayed onto all areas of the upper surface of the wafer.

[0035] After the cleaning operation is completed, the cantilever 32 is reset to the clearance position to facilitate the transfer of the cleaned wafers in the cleaning chamber 100.

[0036] The wafer cantilever cleaning mechanism provided in this embodiment of the invention achieves decoupling and specialized drive between lifting and swinging functions by setting an independent lifting drive component 20 to drive the cantilever swinging unit 30 to lift as a whole, and combining this with a design where the hollow swinging actuator 31 directly drives the cantilever 32 to reciprocate. In particular, the fluid delivery channel 40 passes through the hollow output shaft of the hollow swinging actuator 31, creatively integrating power transmission and the fluid delivery channel 40 into a single rotating component, thereby greatly simplifying the structure of the cleaning mechanism. This results in a simpler, more compact, and lighter structure, effectively reducing the moment of inertia. Combined with a shortened transmission chain, this significantly improves the stability, positioning accuracy, and response speed of the cantilever 32 during high-speed reciprocating swing, fundamentally overcoming the problems of bulky structure and unstable operation in existing cleaning mechanisms. At the same time, the cantilever 32 completely exits the cleaning chamber 100 at the avoidance position, providing unobstructed operating space for wafer transfer.

[0037] In some possible embodiments, the fluid delivery channel 40 includes at least one fluid delivery pipe 41. When the fluid delivery channel 40 consists of a single fluid delivery pipe 41, the fluid delivery pipe 41 provides a pre-configured cleaning fluid. Of course, the fluid delivery channel 40 may also include multiple fluid delivery pipes 41 to improve the cleaning effect.

[0038] Specifically, the fluid delivery channel 40 may include two fluid delivery pipes 41, one of which delivers liquid cleaning fluids such as chemical solutions, while the other delivers gaseous cleaning fluids such as nitrogen. Furthermore, the nozzle 33 may be a two-fluid nozzle. By employing a two-fluid nozzle, the liquid and gaseous cleaning fluids supplied by the two fluid delivery pipes 41 can be mixed, atomized, and then sprayed out. This atomized spraying produces finer and more uniform droplets, which not only improves the utilization rate and coverage uniformity of the liquid cleaning fluid but also enhances the cleaning effect on the microstructure of the wafer surface, and helps reduce the amount of liquid cleaning fluid used and the difficulty of subsequent drying.

[0039] In another embodiment of the invention, reference is made to Figure 1 or Figure 2 As shown, a separate supply pipe 50 for providing deionized water (DIW) can also be added. The arrangement of this supply pipe 50 is basically the same as that of the fluid delivery pipe 41; that is, the supply pipe 50 also passes through the hollow output shaft of the hollow swing actuator 31 and then extends along the cantilever 32 towards the nozzle 33. Unlike the fluid delivery pipe 41, the end of the supply pipe 50 (i.e., the water outlet end) is not connected to the nozzle 33. When the cantilever 32 is in the working position, the end of the supply pipe 50 is directly aligned with the upper surface of the wafer. This design enables the direct supply of deionized water to the upper surface of the wafer via the supply pipe 50 for DIW washing of the wafer, or provides deionized water as a cleaning solution when the cleaning chamber 100 of the wafer cleaning equipment needs to be cleaned.

[0040] In some possible embodiments, the cantilever 32 is made of PEEK material. By limiting the cantilever 32 to be made of PEEK material, the excellent properties of PEEK material—high strength, high rigidity, low density, chemical corrosion resistance, and high cleanliness—are fully utilized, achieving a lightweight design for the cantilever 32. The lightweight cantilever 32 significantly reduces the load and moment of inertia of the hollow swing actuator 31, which helps to further improve the swing response speed, reduce energy consumption, and lessen the burden on the support structure. Its corrosion resistance effectively improves its service life in chemical environments.

[0041] In some possible embodiments, the portion of the fluid delivery channel 40 that comes into contact with the cleaning fluid is made of PFA or PTFE material. Specifically, flexible tubing made of PFA or PTFE can be used as the fluid delivery pipe 41 and the supply pipe 50. This design ensures an extremely high standard of cleanliness for each pipeline. Both materials have extremely low leaching and exudation rates and excellent chemical corrosion resistance, preventing the cleaning fluid from being contaminated by the pipeline itself during delivery, thereby ensuring the high purity of the cleaning fluid reaching the wafer surface and meeting the extreme contamination control requirements of wafer manufacturing.

[0042] In some possible embodiments, refer to Figure 1 or Figure 2 As shown, the lifting drive assembly 20 includes a lifting servo motor 21, a lead screw 22 driven by the lifting servo motor 21, and a lifting seat 23 threadedly engaged with the lead screw 22. Exemplarily, the lead screw 22 extends vertically, and its bottom is connected to the power output end of the lifting servo motor 21.

[0043] In addition, a vertically extending slide rail 24 is fixedly installed on the mounting bracket 10. The lifting seat 23 is slidably connected to the slide rail 24, thereby providing limiting and guiding for the lifting seat 23 through the slide rail 24.

[0044] The lifting base 23 serves as the power output end of the lifting drive assembly 20, and the hollow swing driver 31 is fixedly connected to the lifting base 23. When the lifting servo motor 21 drives the lead screw 22 to rotate, based on the thread transmission principle, the lifting base 23 will drive the hollow swing driver 31 to move vertically along the axis of the lead screw 22, thereby realizing the vertical lifting of the entire cantilever swing unit 30.

[0045] By employing the aforementioned lifting drive assembly 20, high-precision and stable adjustment of the vertical position of the nozzle 33 can be achieved, thereby better meeting the stringent requirements of different wafer cleaning processes regarding the distance between the nozzle 33 and the upper surface of the wafer. Furthermore, compared to directly connecting the cantilever 32 to the lifting base 23, connecting the hollow swing actuator 31 to the lifting base 23 helps avoid the problem of unstable lifting caused by an unstable center of gravity.

[0046] In some possible embodiments, for better management of the fluid delivery pipe 41 and the supply pipe 50, refer to Figure 1 As shown, the mounting bracket 10 is provided with a first pipe clamp 60, and the cantilever 32 is provided with a second pipe clamp 70.

[0047] Each fluid delivery pipe 41 and supply pipe 50 has a vertical section and a horizontal section connected in sequence. The vertical section of each fluid delivery pipe 41 and supply pipe 50 passes through the first pipe clamp 60 from bottom to top and is limited by the first pipe clamp 60. The vertical section passing through the first pipe clamp 60 enters the hollow output shaft of the hollow swing actuator 31 and extends horizontally along the cantilever 32 after exiting the hollow output shaft, serving as a horizontal section. The horizontal section of each fluid delivery pipe 41 and supply pipe 50 passes through the second pipe clamp 70 and is limited by the second pipe clamp 70. The horizontal section passing through the second pipe clamp 70 extends along the cantilever 32 to the nozzle 33.

[0048] By setting a first pipe clamp 60 and a second pipe clamp 70 to limit the vertical and horizontal sections of the fluid delivery pipe 41 and the liquid supply pipe 50 respectively, the fluid delivery pipe 41 and the liquid supply pipe 50 can be managed in a standardized manner. This effectively prevents the fluid delivery pipe 41 and the liquid supply pipe 50 from getting tangled, rubbing against each other, and interfering with other components during the combined lifting and swinging motion, and greatly reduces the risk of leakage or damage caused by pipe loosening or wear.

[0049] In some possible embodiments, the vertical sections of both the fluid delivery pipe 41 and the supply pipe 50 are slidably fitted with the first pipe clamp 60. This design allows the fluid delivery pipe 41 and the supply pipe 50 a certain degree of relative displacement freedom in the vertical direction, effectively absorbing or compensating for pipeline stress caused by equipment vibration or lifting movements, and avoiding pipe bending, fatigue, or loosening at connections that may result from rigid fixing. While ensuring that the vertical sections of each pipeline are effectively limited, this increases the reliability of the system and extends the service life of the pipelines.

[0050] In some possible embodiments, the first pipe clamp 60 and / or the second pipe clamp 70 are slots. Furthermore, the second pipe clamp 70 corresponds one-to-one with the fluid delivery pipe 41 and with the liquid supply pipe 50. Using slots as pipe clamps allows the fluid delivery pipe 41 and the liquid supply pipe 50 to be easily inserted or removed, enabling rapid assembly and disassembly of the pipeline. Simultaneously, the slots provide good circumferential restraint for the pipeline, ensuring its stability.

[0051] In some possible embodiments, refer to Figure 1 As shown, the cantilever swing unit 30 may also include a limiting part 34 disposed on the lifting seat 23. The limiting part 34 is used to limit the swing stroke of the cantilever 32 so that the cantilever 32 can only reciprocate along an arc-shaped path between the avoidance position and the working position.

[0052] For example, the limiting part 34 may be two limiting blocks provided on the lifting seat 23, and the cantilever 32 is provided with a limiting engagement part that cooperates with the limiting part 34. When the cantilever 32 is in the avoidance position, the limiting engagement part on it abuts against one of the limiting blocks; when the cantilever 32 is in the working position, the limiting engagement part on it abuts against the other limiting block.

[0053] On the other hand, embodiments of the present invention also provide a wafer cleaning apparatus. (Refer to...) Figure 3 As shown, the wafer cleaning equipment includes a cleaning chamber 100 and the aforementioned wafer cantilever cleaning mechanism. The wafer cantilever cleaning mechanism is fixed to the outside of the cleaning chamber 100 by a mounting bracket 10.

[0054] With the above-mentioned configuration, the wafer cleaning equipment possesses at least the beneficial effects of the aforementioned wafer cantilever cleaning mechanism.

[0055] In addition, embodiments of the present invention further specify that: the side wall of the cleaning chamber 100 is provided with a clearance opening 102 communicating with the outside, so as to allow the cantilever 32 to swing back and forth between the clearance position and the working position, and to allow the cantilever 32 in the working position to move back and forth vertically.

[0056] Specifically, the avoidance opening 102 prevents interference between the swinging cantilever 32 and the cleaning chamber 100, and also prevents interference between the cantilever 32 and the cleaning chamber 100 when it is in the working position and is raised or lowered. This design further improves the structural compactness of the wafer cleaning equipment.

[0057] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A wafer cantilever cleaning mechanism, characterized in that, include: Mounting bracket is used to fix the wafer cantilever cleaning mechanism to the outside of the cleaning chamber of the wafer cleaning equipment; A lifting drive assembly is mounted on the mounting bracket; The cantilever swing unit is connected to the power output end of the lifting drive assembly, so as to be driven to move vertically reciprocatingly. The cantilever swing unit includes: Hollow oscillating actuator; The cantilever is connected to the power output end of the hollow swing actuator to be driven to swing back and forth between the avoidance position and the working position; the cantilever is provided with a nozzle. A fluid delivery channel is provided inside the hollow output shaft of the hollow swing drive and connected to the nozzle; In the avoidance position, the cantilever and the nozzle are located outside the cleaning chamber; in the working position, the cantilever extends into the cleaning chamber, and the nozzle is aligned with the upper surface of the wafer inside the cleaning chamber.

2. The wafer cantilever cleaning mechanism according to claim 1, characterized in that, The hollow swing actuator is a hollow servo motor.

3. The wafer cantilever cleaning mechanism according to claim 1 or 2, characterized in that, The lifting drive assembly includes a lifting servo motor, a lead screw driven by the lifting servo motor, and a lifting seat threadedly engaged with the lead screw; The hollow swing actuator is fixedly connected to the lifting seat.

4. The wafer cantilever cleaning mechanism according to claim 1, characterized in that, The mounting bracket is provided with a first pipe clamp; the cantilever is provided with a second pipe clamp. The fluid delivery channel includes at least one fluid delivery pipe; the fluid delivery pipe has a vertical section and a horizontal section connected in sequence, the vertical section is limited by the first pipe clamp and passes through the hollow output shaft, and the horizontal section is limited by the second pipe clamp and extends along the cantilever to the nozzle.

5. The wafer cantilever cleaning mechanism according to claim 4, characterized in that, The vertical section slides into contact with the first pipe clamp.

6. The wafer cantilever cleaning mechanism according to claim 4, characterized in that, The first tube clamp and / or the second tube clamp are slots.

7. The wafer cantilever cleaning mechanism according to claim 1, characterized in that, The cantilever is made of PEEK material.

8. The wafer cantilever cleaning mechanism according to claim 1, characterized in that, The portion of the fluid delivery channel that comes into contact with the cleaning fluid is made of PFA or PTFE material.

9. The wafer cantilever cleaning mechanism according to claim 1, characterized in that, The nozzle is a two-fluid nozzle.

10. A wafer cleaning device, characterized in that, Includes a cleaning chamber and a wafer cantilever cleaning mechanism as described in any one of claims 1 to 9; The wafer cantilever cleaning mechanism is fixed outside the cleaning chamber by the mounting bracket; The sidewall of the cleaning chamber is provided with a clearance opening to allow the cantilever to swing back and forth between the clearance position and the working position, and to allow the cantilever in the working position to move back and forth vertically.

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