Graphene heat dissipation device with packaging structure

Abstract

The invention discloses a graphene heat dissipation device with a packaging structure, and relates to the field of graphene heat dissipation, the graphene heat dissipation device comprises a graphene heat dissipation layer, the packaging structure, a bonding layer, a heat leading-out path, a heat dissipation fan and a temperature sensor, the surface of the graphene heat dissipation layer is provided with a co-doped region, the packaging structure is provided with a base surface, the base surface is provided with a concave-convex texture region, and the packaging structure is provided with a heat dissipation layer. The fins of the packaging structure are arranged in an inclined mode, the bonding layer is located between the graphene heat dissipation layer and the base face of the packaging structure, one end of the heat leading-out path is connected with the co-doping area of the graphene heat dissipation layer, and the other end of the heat leading-out path is connected with the concave-convex texture area of the packaging structure. According to the graphene heat dissipation device with the packaging structure, the edge co-doped region and the concave-convex texture region reduce the connection thermal resistance, and double conduction paths improve the heat transfer efficiency; fin parameters optimize airflow circulation, precise temperature measurement of the sensor is matched with adaptive air outlet of the fan, and efficient heat dissipation and energy-saving operation are achieved.

Description

Technical Field

[0001] This invention relates to the field of graphene heat dissipation technology, and in particular to a graphene heat dissipation device with an encapsulation structure. Background Technology

[0002] With the rapid development of electronic technology, the heat dissipation requirements of high-power, high-density electronic devices are becoming increasingly urgent. Graphene, due to its excellent thermal conductivity, has become one of the core materials for heat dissipation devices. Existing graphene heat dissipation devices generally consist of a graphene heat dissipation layer, encapsulation structure, adhesive layer, and auxiliary components such as fans and sensors.

[0003] However, existing technologies have several shortcomings that urgently need to be addressed: First, the connection interface between the graphene heat dissipation layer and the heat conduction path and encapsulation structure lacks targeted optimization, easily leading to high thermal resistance and severe heat loss during heat transfer, thus hindering the improvement of thermal conductivity. Second, the fins of the encapsulation structure mostly adopt conventional straight or randomly tilted designs without coordinated optimization of the tilt angle and spacing, resulting in high airflow resistance between the fins and poor convective heat dissipation. Third, the temperature sensor installation position is poorly designed and easily affected by the temperature interference of surrounding components such as the adhesive layer and encapsulation structure, resulting in insufficient temperature measurement accuracy. This leads to inaccurate start / stop and speed adjustment of the cooling fan, making it difficult to balance heat dissipation effect and energy consumption, and failing to meet the stable and efficient heat dissipation requirements of high-power electronic devices. Summary of the Invention

[0004] The purpose of this invention is to provide a graphene heat dissipation device with an encapsulation structure. The edge co-doped region and the textured region reduce the connection thermal resistance, and the dual conduction path improves the heat transfer efficiency. The fin parameters optimize airflow, and the sensor accurately measures the temperature and the fan adapts to the airflow, achieving efficient heat dissipation and energy-saving operation.

[0005] This invention provides a graphene heat dissipation device with an encapsulation structure, including a graphene heat dissipation layer, an encapsulation structure, an adhesive layer, a heat conduction path, a cooling fan, and a temperature sensor. The surface of the graphene heat dissipation layer has a co-doped region, the encapsulation structure has a base surface with a textured region, the fins of the encapsulation structure are inclined, the adhesive layer is located between the graphene heat dissipation layer and the base surface of the encapsulation structure, one end of the heat conduction path is connected to the co-doped region of the graphene heat dissipation layer, and the other end of the heat conduction path is connected to the textured region of the encapsulation structure.

[0006] Preferably, the co-doped region is located at the edge of the graphene heat dissipation layer.

[0007] Preferably, the textured area is located at the junction of the base surface and the heat dissipation path.

[0008] Preferably, the fin tilt angle of the encapsulation structure is 30-45° and the spacing between adjacent fins is 5-8mm.

[0009] Preferably, the temperature sensor is attached to the side of the graphene heat dissipation layer facing away from the adhesive layer.

[0010] Preferably, the airflow direction at the exhaust port of the cooling fan is adapted to the tilt direction of the fins in the packaging structure.

[0011] Preferably, the temperature sensor is attached to the surface of the graphene heat dissipation layer, and the cooling fan is correspondingly disposed on the outside of the encapsulation structure, with the air outlet of the cooling fan facing the fin gap of the encapsulation structure.

[0012] Therefore, the present invention employs a graphene heat dissipation device with an encapsulation structure as described above. The edge co-doped region and the textured region reduce the connection thermal resistance, and the dual conduction path improves the heat transfer efficiency. The fin parameters optimize airflow, and the sensor accurately measures the temperature in conjunction with the fan to adapt the airflow, thereby achieving efficient heat dissipation and energy-saving operation.

[0013] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of a graphene heat dissipation device with an encapsulation structure according to the present invention. Figure 2 This is a schematic diagram of the heat dissipation path of a graphene heat dissipation device with an encapsulation structure according to the present invention.

[0015] Figure Labels 1. Graphene heat dissipation layer; 2. Encapsulation structure; 21. Base surface; 22. Fins; 3. Adhesive layer; 4. Heat dissipation path; 5. Cooling fan; 6. Temperature sensor; 7. Co-doped region; 8. Textured region. Detailed Implementation

[0016] The technical solution of the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains.

[0018] The terms "first," "second," and similar words used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0019] Example 1 like Figures 1-2 As shown, this invention discloses a graphene heat dissipation device with an encapsulation structure, comprising a graphene heat dissipation layer 1, an encapsulation structure 2, an adhesive layer 3, a heat conduction path 4, a cooling fan 5, and a temperature sensor 6. The graphene heat dissipation layer 1 serves as the core substrate and has a sheet-like structure. Its edge region is pre-formed with nitrogen-boron co-doped regions, which serve as connection nodes with the heat conduction path. Co-doped regions 7 are located on the surface of the graphene heat dissipation layer 1 at its edge. The graphene heat dissipation layer 1 itself possesses high thermal conductivity, providing the core foundation for heat conduction in the device. The co-doped regions 7 at the edge optimize the local thermal conductivity and interface compatibility of the graphene heat dissipation layer 1 through a doping process, solving the problem of high thermal resistance at the connection between the graphene heat dissipation layer 1 and the heat conduction path 4. This achieves efficient heat convergence and conduction to the conduction path, preventing localized heat accumulation within the graphene heat dissipation layer 1.

[0020] The encapsulation structure 2 has a base surface 21 with a textured area 8 located at the connection between the base surface 21 and the heat dissipation path 4. The textured area 8 of the base surface 21 increases the contact area with the heat dissipation path 4, reduces the interfacial thermal resistance at the connection point, and improves the efficiency of heat transfer from the dissipation path to the encapsulation structure. The fins 22 of the encapsulation structure 2 are inclined at an angle of 30-45°, with a spacing of 5-8 mm between adjacent fins. This increases the heat exchange area between the encapsulation structure 2 and the air, optimizes the airflow path between the fins 22, reduces airflow resistance, and lays the structural foundation for the forced convection cooling of the subsequent cooling fan 5.

[0021] The adhesive layer 3 is a sandwich connection structure, completely adhering to the outer surface of the graphene heat dissipation layer 10 and located between the graphene heat dissipation layer 10 and the finned encapsulation structure 20, serving as the connection medium between the two. The adhesive layer 3 is situated between the graphene heat dissipation layer 10 and the base surface 21 of the encapsulation structure 2. One end of the heat conduction path 4 is connected to the co-doped region 7 of the graphene heat dissipation layer 1, and the other end is connected to the textured region 8 of the encapsulation structure 2. The adhesive layer 3 fills the gap between the graphene heat dissipation layer 1 and the base surface 21 of the encapsulation structure, eliminating the thermal resistance caused by air gaps and achieving continuous, low-resistance main conduction of heat from the heat dissipation layer to the encapsulation structure.

[0022] The heat conduction path 4 connects the co-doped region 7 to the textured region 8 across components, forming an auxiliary heat conduction path. This, together with the main conduction path of the adhesive layer 3, forms a dual-path heat dissipation, solving the problem of insufficient heat conduction efficiency of a single path and significantly improving the overall heat transfer speed.

[0023] Temperature sensor 6 is attached to the side of graphene heat dissipation layer 1 facing away from adhesive layer 3. This avoids temperature interference from adhesive layer 3 and encapsulation structure 2, and can accurately collect the core temperature of graphene heat dissipation layer 1, providing a reliable signal basis for intelligent adjustment of cooling fan 5. The airflow direction of cooling fan 5 outlet is adapted to the tilt direction of fins 22 of encapsulation structure 2.

[0024] Temperature sensor 6 is attached to the surface of graphene heat dissipation layer 1, and cooling fan 5 is correspondingly disposed on the outside of encapsulation structure 2, with the air outlet of cooling fan 5 facing the gap between fins 22 of encapsulation structure 2. Cooling fan 5 is positioned on the outside of fins 22, and its airflow direction matches the tilt direction of fins 22, allowing airflow to smoothly pass through the gaps between fins 22, maximizing forced convection heat transfer efficiency and quickly removing heat from the surface of fins 22. Based on the signal feedback from temperature sensor 6, cooling fan 5 can adaptively start / stop and adjust its speed, ensuring heat dissipation while avoiding ineffective operation and reducing overall device energy consumption.

[0025] Heat reception and initial conduction: When a heat source adapted to the device, such as an electronic chip or a heat-generating component of a precision device, generates heat, the heat is first directly transferred to the graphene heat dissipation layer 1. The pre-designed co-doped region 7 at the edge of the graphene heat dissipation layer 1, with its optimized thermal conductivity due to the doping process, can quickly gather and conduct heat, avoiding localized heat accumulation on the surface of the graphene heat dissipation layer 1, thus laying the foundation for subsequent cross-component heat transfer. The heat generated by the heat source is directly transferred to the graphene heat dissipation layer 1. The co-doped region 7 at its edge, optimized by the doping process, has better thermal conductivity than the main body of the graphene heat dissipation layer 1, allowing it to quickly gather and evenly diffuse heat, avoiding localized heat accumulation, and providing a stable heat source foundation for subsequent cross-component heat transfer.

[0026] Low-resistance heat transfer across components: heat from the graphene heat dissipation layer 1 is transferred seamlessly to the base surface 21 of the encapsulation structure 2 via the adhesive layer 3. The adhesive layer 3 is completely bonded between the graphene heat dissipation layer 1 and the base surface 21. The seamless bonding design of the adhesive layer eliminates the thermal resistance caused by interlayer air gaps, achieving continuous heat conduction.

[0027] Meanwhile, heat conduction path 4 plays an auxiliary role in heat conduction: one end is connected to the co-doped region 7 of the graphene heat dissipation layer 1, receiving concentrated heat from the high thermal conductivity region. The other end is connected to the textured region 8 of the base surface 21, utilizing the increased contact area from the textured surface to efficiently transfer heat to the interior of the encapsulation structure 2. This forms a dual-path heat transfer mode of the main conductive adhesive layer 3 and the auxiliary conductive heat conduction path 4, significantly improving heat transfer efficiency.

[0028] Heat is transferred to the encapsulation structure 2 simultaneously through two paths. The first is the main conduction path, where the adhesive layer 3 is completely bonded to the base surface 21 of the graphene heat dissipation layer 1 and the encapsulation structure 2, eliminating the thermal resistance of the interlayer air gap and achieving continuous, low-loss heat conduction. The second is the auxiliary conduction path, where the heat outlet path connects the co-doped region 7 of the graphene heat dissipation layer 1 to the textured region 8 of the base surface 21. The textured surface increases the contact area, further reducing the interfacial thermal resistance. The dual paths work together to significantly improve heat transfer efficiency.

[0029] The fins 22 utilize directional convection heat dissipation, allowing heat transferred to the encapsulation structure 2 to rapidly diffuse to the surface of the fins 22. The fins 22 are distributed at an angle of 30-45° and a spacing of 5-8mm. This structural design ensures that heat is evenly distributed along the fin extension direction. Simultaneously, the cooling fan 5 is positioned corresponding to the outer side of the fins 22, and the airflow direction at the outlet matches the fin tilt direction, allowing airflow to smoothly pass through the fin gaps and quickly remove heat from the fin surface, achieving forced convection heat dissipation.

[0030] The heat transferred to the encapsulation structure 2 is diffused to the surface of the fins 22, which are distributed at an angle of 30-45° and a spacing of 5-8mm. This structure optimizes the airflow path. At the same time, the exhaust port of the cooling fan 5 faces the gap between the fins 22 and the airflow direction is adapted to the tilt direction of the fins 22. The airflow can smoothly pass through the gap between the fins and quickly remove heat through forced convection, achieving efficient heat exchange.

[0031] Intelligent temperature dynamic adjustment: Throughout the entire operation, temperature sensor 6 is attached to the surface of the graphene heat dissipation layer 1 facing away from the adhesive layer 3. This installation position avoids temperature interference from the adhesive layer 3 and the encapsulation structure 2, allowing for accurate and real-time acquisition of the core temperature data of the heat dissipation layer. Based on the temperature signal fed back by temperature sensor 6, the cooling fan 5 can dynamically adjust its operation. When the temperature is below a preset threshold, passive convection by the fins 22 is sufficient to meet the heat dissipation requirements, and the cooling fan 5 stops operating to save energy. When the temperature reaches the preset threshold, the cooling fan 5 starts and operates at an appropriate speed to enhance airflow convection. As the temperature continues to rise, the fan speed increases synchronously to maximize heat dissipation efficiency and ensure that the heat source is always within a safe temperature range. The above steps are repeated cyclically, forming a closed-loop working mode. Through the coordinated cooperation of various components, low-loss, high-efficiency, and energy-saving operation is achieved throughout the entire process from heat generation to dissipation.

[0032] Temperature sensor 5 is attached to the side of graphene heat dissipation layer 1 away from adhesive layer 3, avoiding temperature interference from surrounding components and accurately collecting core temperature. The sensor feeds the temperature signal back to the control module, which dynamically adjusts the start / stop and speed of cooling fan 5 according to preset thresholds. At low temperatures, it relies on passive convection for energy saving, and at high temperatures, it starts the cooling fan to enhance heat dissipation, forming a closed-loop control of "temperature measurement-regulation-heat dissipation" to ensure efficient and energy-saving operation of the device.

[0033] The heat conduction efficiency from the graphene heat dissipation layer 1 to the encapsulation structure 2 is improved, the convective heat dissipation efficiency of the fin area 22 is enhanced, and the temperature sensor 6 has higher acquisition accuracy.

[0034] Therefore, the present invention employs a graphene heat dissipation device with an encapsulation structure as described above. The edge co-doped region and the textured region reduce the connection thermal resistance, and the dual conduction path improves the heat transfer efficiency. The fin parameters optimize airflow, and the sensor accurately measures the temperature in conjunction with the fan to adapt the airflow, thereby achieving efficient heat dissipation and energy-saving operation.

[0035] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the technical solutions of the present invention, and these modifications or equivalent substitutions cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A graphene heat dissipation device with an encapsulation structure, characterized in that, The device includes a graphene heat dissipation layer, an encapsulation structure, an adhesive layer, a heat dissipation path, a cooling fan, and a temperature sensor. The graphene heat dissipation layer has a co-doped region on its surface. The encapsulation structure has a base surface with a textured area. The fins of the encapsulation structure are tilted. The adhesive layer is located between the graphene heat dissipation layer and the base surface of the encapsulation structure. One end of the heat dissipation path is connected to the co-doped region of the graphene heat dissipation layer, and the other end of the heat dissipation path is connected to the textured area of ​​the encapsulation structure.

2. A graphene heat dissipation device with an encapsulation structure according to claim 1, characterized in that, The co-doped region is located at the edge of the graphene heat dissipation layer.

3. A graphene heat dissipation device with an encapsulation structure according to claim 1, characterized in that, The textured area is located at the junction of the base surface and the heat dissipation path.

4. A graphene heat dissipation device with an encapsulation structure according to claim 1, characterized in that, The fin tilt angle of the encapsulation structure is 30-45° and the spacing between adjacent fins is 5-8mm.

5. A graphene heat dissipation device with an encapsulation structure according to claim 1, characterized in that, The temperature sensor is attached to the side of the graphene heat dissipation layer that is away from the adhesive layer.

6. A graphene heat dissipation device with an encapsulation structure according to claim 1, characterized in that, The airflow direction at the exhaust port of the cooling fan is matched with the tilt direction of the fins in the packaging structure.

7. A graphene heat dissipation device with an encapsulation structure according to claim 1, characterized in that, The temperature sensor is attached to the surface of the graphene heat dissipation layer, and the cooling fan is correspondingly set on the outside of the package structure, with the air outlet of the cooling fan facing the fin gap of the package structure.

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