Semiconductor chip manufacturing substrate processing equipment

Abstract

A semiconductor chip manufacturing substrate processing device disclosed by the present invention comprises a cleaning box and a core plate bearing mechanism located in the cleaning box, the core plate bearing mechanism comprises a supporting plate and a first fixing plate slidably connected with the supporting plate, and the top surface of the first fixing plate is fixedly bonded with a second fixing plate. A bearing plate is hinged to the top face of the second fixing plate, gas collecting grooves are formed in the opposite faces of the first fixing plate and the second fixing plate, a gas collecting cavity is defined by the gas collecting grooves in the first fixing plate and the second fixing plate, a piston plate is arranged in the gas collecting cavity, and an ejector rod is integrally formed on the top face of the piston plate. The top end of the ejector rod penetrates through the second fixing plate and makes contact with the bottom face of the bearing plate. The driving mechanism is arranged and can drive the core plate bearing mechanism to horizontally move in the cleaning box, so that the core plate on the core plate bearing mechanism can change relative positions to the electrode plate, uniform contact between the core plate and active particles is ensured, and the cleaning effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor chip manufacturing, in particular to a semiconductor chip manufacturing substrate processing device. BACKGROUND

[0002] The semiconductor chip substrate is the core carrier connecting the chip and the printed circuit board (PCB), and bears multiple functions such as electrical interconnection, heat conduction and mechanical support. The surface treatment quality of the substrate is directly related to the reliability of the solder joint, the stability of the interconnection resistance and the service life of the whole machine. With the development of chip packaging towards high-density interconnection, high-layer and fine line and fine pitch, higher requirements are put forward for the surface cleanliness, roughness and activation state of the multi-layer organic substrate before lamination, especially the efficient removal of surface organic contaminants and micro residues without damaging the circuit pattern, and the improvement of the infiltration and bonding capacity of the resin to the copper foil and the core plate.

[0003] The general production process of the existing organic substrate is substrate preparation, patterning, metallization, lamination, drilling and post-processing, etc. The lamination process usually involves combining and heating and pressing the multi-layer core plate and the prepreg in a hot press tank, so that the prepreg melts and flows, fills the gap and solidifies to form. In order to ensure the lamination quality, the core plate needs to be pretreated before entering the hot pressing process, including cleaning and preheating. At present, plasma cleaning method is widely used in engineering: the core plate is placed on a special fixture, and the whole is cleaned by parallel plate plasma equipment. Due to the power distribution and electrode structure of the plasma generator, the field strength distribution in the cavity of this type of equipment is not completely uniform, and the field strength at the edge is often lower than that in the center. When batch cleaning is carried out with a fixed fixture, there is a difference in cleaning intensity between the peripheral core plate and the central core plate, which can easily cause insufficient cleaning of the peripheral core plate, thereby affecting the subsequent lamination bonding effect.

[0004] On the other hand, during the plasma cleaning process, the oil stains, treatment agent residues and micro solvents to be removed are decomposed or volatilized, forming a certain amount of volatile pollutants and particulate matter. If the gas flow and exhaust organization are not proper, these pollutants may stay in the cavity and reattach to the surface of the core plate, reducing the effective contact of active particles with the substrate surface and reducing the actual cleaning effect. For high-density circuit core plates, there are a large number of small gaps and narrow grooves between the surface circuit patterns. When the core plate is in a stationary state on the fixture and only in a single orientation relative to the electrode plate, the probability of plasma active particles entering these gaps is limited, making it difficult to clean the deep residues in a timely and sufficient manner. It is easy to have problems such as incomplete cleaning of small gaps and local pollution residues. In summary, the existing fixed plasma cleaning device still has certain limitations in batch core plate cleaning uniformity, volatile pollutant removal and deep cleaning of small gaps in high-density circuits, and needs to be further improved and optimized. SUMMARY

[0005] The present application aims to at least solve one of the technical problems existing in the prior art or related art.

[0006] Therefore, the purpose of the present application is to provide a semiconductor chip manufacturing substrate processing equipment, comprising a cleaning box, and a core plate carrying mechanism located in the cleaning box, the inner wall of the top end of the cleaning box is provided with an electrode plate, and the front of the cleaning box is hinged with a sliding door.

[0007] The core plate carrying mechanism comprises a supporting plate, a first fixed plate in sliding connection with the supporting plate, the top surface of the first fixed plate is fixedly bonded with a second fixed plate, the top surface of the second fixed plate is hinged with a carrying plate, and the edge of the carrying plate is integrally formed with a surrounding strip.

[0008] The opposite side of the first fixed plate and the second fixed plate is provided with a gas collecting groove, the gas collecting grooves in the first fixed plate and the second fixed plate form a gas collecting cavity, a piston plate is arranged in the gas collecting cavity, the top surface of the piston plate is integrally formed with a top rod, the bottom surface of the piston plate is connected with the groove bottom of the gas collecting groove through an elastic spring, and the top end of the top rod penetrates through the second fixed plate and is in contact with the bottom surface of the carrying plate.

[0009] A driving mechanism for driving the horizontal movement of the supporting plate is arranged in the cleaning box, and an air charging mechanism for introducing gas into the gas collecting cavity is arranged in the cleaning box.

[0010] As a preferred technical solution:

[0011] The semiconductor chip manufacturing substrate processing equipment as described above, one end of the supporting plate is vertically provided with a side plate integrally formed therewith, the bottom end of the supporting plate extends downward vertically to form two groups of protrusions, two groups of the protrusions are penetrated with two guide columns, and the two ends of the guide columns are fixedly bonded with the inner wall of the cleaning box.

[0012] Through the above technical solution, the protrusions and the guide columns can slide relative to each other, and then the supporting plate can move linearly horizontally along the guide columns through the protrusions.

[0013] The semiconductor chip manufacturing substrate processing equipment as described above, the top surface of the supporting plate is fixedly bonded with a sliding rail, the sliding rail is in sliding connection with a sliding block, and the top surface of the sliding block is fixedly bonded with the bottom surface of the first fixed plate.

[0014] Through the above technical solution, two groups of sliding rails are arranged on the top surface of the supporting plate, thereby improving the stability of the sliding of the first fixed plate, and the sliding rail and the guide column are arranged vertically with each other, so that the first fixed plate can move linearly vertically, and it is convenient to pull out and take and place the core plate.

[0015] The semiconductor chip manufacturing substrate processing device comprises a first fixed plate and a second fixed plate, and the opposite sides of the first fixed plate and the second fixed plate are provided with a first main flow channel and a second main flow channel and a plurality of first branch flow channels and a plurality of second branch flow channels, the first main flow channel is communicated with the first branch flow channel, the second main flow channel is communicated with the second branch flow channel, and the first branch flow channel and the second branch flow channel are communicated with a gas collecting groove.

[0016] The cross sections of the first main flow channel, the second main flow channel, the first branch flow channel and the second branch flow channel are all semicircular arcs, and one end of the first main flow channel and the second main flow channel is communicated with one side end surface of the first fixed plate and the second fixed plate.

[0017] Through the above technical scheme, after the first fixed plate and the second fixed plate are combined into one, the first main flow channel and the first branch flow channel and the second main flow channel and the second branch flow channel can all form closed circular holes and grooves, and the two gas collecting grooves can form a cylindrical gas collecting cavity, so that the gas flow can enter the first branch flow channel through the first main flow channel and finally be distributed to the plurality of gas collecting cavities, and similarly, the gas flow can enter the second branch flow channel through the second main flow channel and finally be distributed to the plurality of gas collecting cavities.

[0018] The semiconductor chip manufacturing substrate processing device comprises a first fixed plate and a second fixed plate, and the opposite sides of the first fixed plate and the second fixed plate are provided with a first main flow channel and a second main flow channel and a plurality of first branch flow channels and a plurality of second branch flow channels, the first main flow channel is communicated with the first branch flow channel, the second main flow channel is communicated with the second branch flow channel, and the first branch flow channel and the second branch flow channel are communicated with a gas collecting groove.

[0019] Through the above technical scheme, there is a gap between the two bearing plates in each group, so that when the two bearing plates in turn drive the core plate to swing, the two bearing plates will not block each other.

[0020] The semiconductor chip manufacturing substrate processing device comprises a first fixed plate and a second fixed plate, and the opposite sides of the first fixed plate and the second fixed plate are provided with a first main flow channel and a second main flow channel and a plurality of first branch flow channels and a plurality of second branch flow channels, the first main flow channel is communicated with the first branch flow channel, the second main flow channel is communicated with the second branch flow channel, and the first branch flow channel and the second branch flow channel are communicated with a gas collecting groove.

[0021] The opposite ends of the outer cylinder are open, one end of the outer cylinder is fixedly bonded to the inner wall of the cleaning box, and a first communication pipe penetrates the wall body at the connection between the cleaning box and the outer cylinder.

[0022] Through the above technical scheme, the first communication pipe is sealingly bonded to the wall body of the cleaning box, so that when external gas enters the outer cylinder through the first communication pipe, leakage does not occur.

[0023] The semiconductor chip manufacturing substrate processing equipment has two air filling mechanisms symmetrically arranged inside the cleaning tank, each of which comprises an inner cylinder and a second piston ring arranged in the inner cylinder, one end of the inner cylinder is open, the other end of the inner cylinder is closed and connected with a second communication pipe, one end of the second communication pipe penetrates the wall of the cleaning tank, and a connecting column is fixedly connected to the inner circle of the second piston ring and axially provided with a gas guide groove.

[0024] The second communication pipe is sealingly connected to the wall of the cleaning tank, so that the gas in the outer cylinder is prevented from leaking, and the closed end of the inner cylinder is fixedly connected to the inner wall of the cleaning tank to improve the stability of the inner cylinder.

[0025] The inner cylinder is arranged in the outer cylinder, the inner cylinder and the outer cylinder have the same axis, and the outer wall of the inner cylinder is sealingly connected to the inner circle of the first piston ring.

[0026] The inner cylinder and the first piston ring are sealingly connected, so that the first piston ring can continuously and smoothly move under the action of the gas pressure.

[0027] The inner cylinder is arranged in the outer cylinder, the inner cylinder and the outer cylinder have the same axis, and the outer wall of the inner cylinder is sealingly connected to the inner circle of the first piston ring.

[0028] The connecting column, the gas guide pipe and the gas guide joint are sealingly connected to the movable block, and the gas guide joint is fixedly connected to the side plate, so that the stability of the gas guide pipe is improved, and the sealing connection can improve the sealing property of the gas transmission.

[0029] Compared with the prior art, the present application has at least the following advantages:

[0030] (1) Improve the uniformity of batch core plate cleaning, the core plate bearing mechanism composed of the supporting plate, slide rail and guide column is linked with the pneumatic driving mechanism arranged on both sides of the cleaning box, so that the core plates fixed on the multiple sets of bearing plates are changed from the fixed state to the periodic horizontal reciprocating motion along the direction of the electrode plate during the plasma cleaning process, and the whole assembly can be pulled out longitudinally to facilitate the loading and unloading of the core plates. The core plate continuously changes its position relative to the electrode plate in the cleaning box, and the gas inlet and vacuum device in the cleaning box maintains a stable plasma environment, so that the center and edge core plates repeatedly "walk through" the effective cleaning area under the same electric field and atmosphere conditions, thereby significantly weakening the inherent edge field strength decay effect of parallel plate plasma, improving the cleaning uniformity between core plates at different positions in the cleaning cavity, and overcoming the problem of insufficient cleaning of peripheral core plates under the existing fixed clamps.

[0031] (2) Realize the synergistic cleaning effect of multi-angle and deep decontamination, the multi-stage gas path network of main flow channel-branch flow channel-gas collection cavity is constructed on the opposite surfaces of the first fixed plate and the second fixed plate, the driving mechanism drives the reciprocating motion of the movable block, at the same time, the gas in the chamber is quantitatively extruded into the gas guide groove, the flow guide cavity and the gas guide pipe by the inner cylinder and the second piston ring, and then the gas is sequentially delivered to the first main flow channel and the second main flow channel by the gas guide joint according to the rhythm, so that the piston plates in each group of gas collection cavities are alternately lifted to different bearing plates, and the core plates in the same group are driven to produce left and right swing and angular overturning in turn. The core plate is horizontally reciprocated while being periodically swung, and cooperates with the limiting structure formed by the "U" shaped enclosing strip and the gas flow in the cleaning box, so that active particles can enter the high-density line gap and complex pattern groove from multiple directions and multiple paths; the slight mechanical disturbance introduced by the swing cooperates with the gas flow formed by the plasma bombardment and vacuum pumping to accelerate the stripping and timely removal of pollutants from the surface of the core plate and the small gap, effectively solving the technical problems of residual small gap difficult to completely remove and volatile pollutants easy to reattach under the traditional fixed cleaning mode.

[0032] (3) Integrated pneumatic drive and stable operation, suitable for engineering application, the present application adopts a double-cylinder pneumatic structure of coaxial arrangement of inner cylinder and outer cylinder, and sealing cooperation of first piston ring with inner wall of outer cylinder and outer wall of inner cylinder, integrates horizontal drive of the supporting plate and inflation action of the gas collection cavity in the same set of gas source and cavity system: the gas pressure change of the drive mechanism is used for not only pushing the first piston ring to drive the supporting plate to reciprocate, but also converting part of the gas into power for pushing the piston plate to lift the load plate through the connecting column and the gas guide network, realizing the integrated pneumatic linkage mechanism of "drive-gas supply-swing", reducing the number of independent executing elements and pipelines, and reducing the system complexity and leakage risk. In cooperation with the damping rubber ring on the outer side of the piston plate, the core plate load bearing mechanism and the pneumatic components of insulating material, the load plate is guaranteed to turn smoothly and avoid the core plate to shake, and the interference to the electric field distribution of the plasma is inhibited, so that the cleaning process is long-term stable and reliable from the aspects of structure and electric field, which is conducive to the large-scale integration and later maintenance of the present application in the existing plasma cleaning production line. BRIEF DESCRIPTION OF DRAWINGS

[0033] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings in which:

[0034] Figure 1 is an external perspective view of the present application;

[0035] Figure 2 is an internal perspective view of the present application;

[0036] Figure 3 is a perspective view of the first fixed plate and the second fixed plate of the present application;

[0037] Figure 4 is a sectional perspective view of the gas collection groove and the piston plate of the present application;

[0038] Figure 5 is a top perspective view of the supporting plate, the first fixed plate and the second fixed plate of the present application;

[0039] Figure 6 is a top perspective view of the supporting plate, the first fixed plate and the second fixed plate of the present application;

[0040] Figure 7 is a sectional view of the outer cylinder and the inner cylinder of the present application.

[0041] In the figure: 1, cleaning tank; 2, electrode plate; 3, support plate; 4, side plate; 5, bump; 6, guide post; 7, slide rail; 8, slider; 9, first fixing plate; 10, second fixing plate; 11, first main runner; 12, second main runner; 13, gas collecting groove; 14, piston plate; 15, elastic spring; 16, ejector rod; 17, bearing plate; 18, retaining strip; 19, outer cylinder; 20, first piston ring; 21, connecting rod; 22, first connecting pipe; 23, movable block; 24, inner cylinder; 25, second connecting pipe; 26, second piston ring; 27, connecting column; 28, hole groove; 29, diversion cavity; 30, air duct; 31, air duct joint; 32, sliding door; 33, first sub-runner; 34, second sub-runner. Detailed implementation manners

[0042] In order to more clearly understand the above objects, features and advantages of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.

[0043] Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention may be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited by the specific embodiments disclosed below. <--- 此处“

[0044] ”似乎无实际语义,保留原样 --->

[0044] As Figures 1-5 shown, an embodiment of the present invention discloses a semiconductor chip manufacturing substrate processing device, including a cleaning tank 1 and a core board carrying mechanism located inside the cleaning tank 1. An electrode plate 2 is provided on the top inner wall of the cleaning tank 1, and a sliding door 32 is hinged to the front surface of the cleaning tank 1.

[0045] The core board carrying mechanism includes a support plate 3 and a first fixing plate 9 slidably connected to the support plate 3. The top surface of the first fixing plate 9 is fixedly bonded to the second fixing plate 10. The top surface of the second fixing plate 10 is hinged to a bearing plate 17. A retaining strip 18 is integrally formed on the edge of the bearing plate 17. Two bearing plates 17 are in a group and multiple groups are evenly distributed on the top surface of the second fixing plate 10. The retaining strip 18 on the bearing plate 17 is in a "C" shape.

[0046] Gas collecting grooves 13 are formed on the opposite surfaces of the first fixing plate 9 and the second fixing plate 10. The gas collecting grooves 13 in the first fixing plate 9 and the second fixing plate 10 enclose to form a gas collecting cavity. A piston plate 14 is arranged in the gas collecting cavity. An ejector rod 16 is integrally formed on the top surface of the piston plate 14. The bottom surface of the piston plate 14 is connected to the bottom of the gas collecting groove 13 through an elastic spring 15. The top end of the ejector rod 16 penetrates through the second fixing plate 10 and contacts the bottom surface of the bearing plate 17.

[0047] The cleaning box 1 is provided with a driving mechanism for driving the horizontal movement of the supporting plate 3, and is provided with a gas filling mechanism for introducing gas into the gas collecting cavity.

[0048] Specifically, in implementation, the pull door 32 is opened, the core plate is fixed and supported by the multiple groups of bearing plates 17, and the surrounding blocking strips 18 on the two bearing plates 17 can be combined into a rectangular frame shape, so that the core plate can be limited and displacement of the core plate in the horizontal direction is avoided.

[0049] The electrode plate 2 ionizes the gas through a high-frequency high-voltage power supply to generate active particle groups containing electrons, ions and free radicals, and the active particles realize surface cleaning of the core plate through physical bombardment and chemical reaction, and in this process, the core plate can be kept in a fixed state.

[0050] When the core plate is cleaned in a fixed state for a certain period of time, the core plate supporting mechanism drives the core plate to move horizontally reciprocatingly through the bearing plate 17 under the action of the driving mechanism, so that when batch operation is performed, the relative position of the core plate and the electrode plate 2 changes constantly, ensuring that the active particles can be in uniform contact with the surface of the core plate, and the uniformity of the core plate cleaning is improved.

[0051] When the core plate is cleaned in a horizontal moving state for a certain period of time or in the process of horizontal moving cleaning, the gas is supplied to the gas collecting cavity through the gas filling mechanism, and after the gas pressure in the gas collecting cavity increases, the piston plate 14 is driven to move upward, the ejector rod 16 moves synchronously with the piston plate 14, the ejector rod 16 can push the bearing plate 17 upward and make the bearing plate 17 overturn by a certain angle, so that the bearing plate 17 can drive the core plate thereon to rotate, the two bearing plates 17 realize left and right swinging of the core plate by being rotated in sequence, and when the core plate swings, the gap on the core plate or the position of the complex structure on the surface of the core plate changes constantly, so that the active particles can enter and completely remove the residues through different angles, the cleaning effect is improved, and the core plate can generate mechanical disturbance through swinging, so that the pollutants can be separated from the surface of the core plate.

[0052] After cleaning is completed, the core plate on the bearing plate 17 is taken out by opening the cabinet door.

[0053] In one specific embodiment of the application, the supporting plate 3 is vertically provided at one end with a side plate 4 which is integrally formed with the supporting plate 3, and the supporting plate 3 is vertically extended downward at the bottom end to form two groups of protrusions 5, the two groups of protrusions 5 are penetrated by two guide columns 6, and the two ends of the guide columns 6 are fixedly bonded to the inner wall of the cleaning box 1.

[0054] The top surface of the supporting plate 3 is fixedly bonded with a sliding rail 7, the sliding rail 7 is slidingly connected with a sliding block 8, and the top surface of the sliding block 8 is fixedly bonded with the bottom surface of a first fixed plate 9.

[0055] Specifically, as shown in Figure 5 and Figure 6As shown, under the action of the driving mechanism, the supporting plate 3 moves horizontally along the guide column 6 through the protrusion 5, the supporting plate 3 can drive the first fixed plate 9 to move synchronously through the sliding rail 7 and the sliding block 8, the second fixed plate 10 moves synchronously with the first fixed plate 9, and the second fixed plate 10 can drive the core plate to move horizontally through the bearing plate 17.

[0056] Meanwhile, the first fixed plate 9 and the second fixed plate 10 can move longitudinally as a whole through the sliding rail 7 and the sliding block 8, so that after the sliding door 32 is opened, the first fixed plate 9 and the second fixed plate 10 can be pulled out as a whole, facilitating the taking and placing of the core plate on the bearing plate 17.

[0057] In one specific embodiment of the present application, two driving mechanisms are symmetrically arranged inside the cleaning box 1, and the driving mechanism comprises an outer cylinder 19 and a first piston ring 20 located in the outer cylinder 19, the side surface of the first piston ring 20 is integrally formed with a connecting rod 21, one end of the connecting rod 21 is fixedly bonded with a movable block 23, and the top end of the movable block 23 is fixedly bonded with the bottom surface of the supporting plate 3.

[0058] The two ends of the outer cylinder 19 are open, one end of the outer cylinder 19 is fixedly bonded with the inner wall of the cleaning box 1, and a first communication pipe 22 penetrates through the wall body at the connection between the cleaning box 1 and the outer cylinder 19.

[0059] Specifically, as shown in Figure 2 and Figure 7 the first communication pipes 22 on the two driving mechanisms are respectively connected with the gas inlet end and the gas outlet end of the diaphragm pump, when the diaphragm pump is running, gas can be filled into one driving mechanism and gas can be extracted from the other driving mechanism, and the diaphragm pump can switch the flow direction through the electromagnetic valve, so that the two driving mechanisms can be sequentially extracted or filled with gas through the switching.

[0060] The outer circular surface of the first piston ring 20 is sealed and fitted with the inner wall of the outer cylinder 19 through a rubber ring, and the inner circular surface of the first piston ring 20 is sealed and fitted with the outer wall of the inner cylinder 24 through a rubber ring, so that a closed cavity can be formed between the first piston ring 20, the inner wall of the outer cylinder 19, the outer wall of the inner cylinder 24 and the wall body of the cleaning box 1, when gas is gradually filled into the cavity through the first communication pipe 22, the air pressure in the cavity gradually increases, which pushes the first piston ring 20 to move linearly along the inner cylinder 24, and the first piston ring 20 drives the movable block 23 to move through the connecting rod 21, and the movable block 23 drives the supporting plate 3 to move synchronously.

[0061] For example, when gas is filled into the left driving mechanism, the supporting plate 3 moves towards the right side at this time, and when gas is filled into the right driving mechanism, the supporting plate 3 moves towards the left side at this time, and the diaphragm pump can realize the horizontal reciprocating movement of the supporting plate 3 through the switching.

[0062] In one specific embodiment of the present application, two air charging mechanisms are symmetrically arranged inside the cleaning tank 1, and each air charging mechanism comprises an inner cylinder 24 and a second piston ring 26 arranged in the inner cylinder 24, the inner cylinder 24 is open at one end and closed at the other end and is connected with a second communication pipe 25, one end of the second communication pipe 25 penetrates through the wall of the cleaning tank 1, and a connecting column 27 is fixedly connected with the inner circle of the second piston ring 26, and a gas guide groove 28 is axially arranged in the connecting column 27.

[0063] Two flow guide cavities 29 are arranged in the inner wall of the movable block 23, one end of the connecting column 27 penetrates through the movable block 23 and is connected with the flow guide cavities 29, and a gas guide pipe 30 is arranged in the wall of the movable block 23 at the back of the flow guide cavities 29, and a gas guide connector 31 is integrally formed at the top end of the gas guide pipe 30, and the gas guide connector 31 penetrates through the side plate 4.

[0064] Specifically, as shown in Figure 2 、 Figure 5 、 Figure 6 and Figure 7 , the outer circle of the second piston ring 26 is sealed and combined with the inner cylinder 24 through a rubber ring, so that a closed cavity is formed between the second piston ring 26 and the inner wall on one side of the closed end of the inner cylinder 24, and a certain amount of gas can be injected into the cavity through the second communication pipe 25.

[0065] When the driving mechanism drives the horizontal reciprocating movement of the supporting plate 3, the movable block 23 can drive the synchronous movement of the connecting column 27, and then the connecting column 27 can drive the movement of the second piston ring 26 in the inner cylinder 24, for example, when the movable block 23 moves to the right, the second piston ring 26 in the right air charging mechanism can extrude the gas in the cavity, the gas pressure is extruded into the gas guide groove 28 and enters the flow guide cavity 29 along the gas guide groove 28, and finally is sprayed out from the gas guide connector 31 through the gas guide pipe 30.

[0066] The gas guide connector 31 is provided with two gas guide connectors, one on the left and one on the right, when the movable block 23 moves to the right, the gas in the air charging mechanism will be extruded and sprayed out from the right gas guide connector 31, when the movable block 23 moves to the left, the gas in the air charging mechanism will be extruded and sprayed out from the left gas guide connector 31.

[0067] In one specific embodiment of the present application, the opposite sides of the first fixed plate 9 and the second fixed plate 10 are provided with a first main flow channel 11 and a second main flow channel 12, and a plurality of first branch flow channels 33 and a plurality of second branch flow channels 34, the first main flow channel 11 is connected with the first branch flow channel 33, the second main flow channel 12 is connected with the second branch flow channel 34, and the first branch flow channel 33 and the second branch flow channel 34 are both connected with a gas collecting groove 13.

[0068] The cross sections of the first main flow channel 11, the second main flow channel 12, the first sub-flow channel 33 and the second sub-flow channel 34 are all semicircular arc shapes, and one end of the first main flow channel 11 and the second main flow channel 12 is connected with one side end face of the first fixed plate 9 and the second fixed plate 10.

[0069] Specifically, as shown in Figure 3 、 Figure 4 and Figure 5 , the circular holes and grooves formed by the first main flow channel 11 and the second main flow channel 12 correspond to the two air guide joints 31 respectively, when the first fixed plate 9 and the second fixed plate 10 move longitudinally along the slide rail 7 through the sliding block 8, the left air guide joint 31 can be inserted into the circular hole and groove formed by the first main flow channel 11, and the right air guide joint 31 can be inserted into the circular hole and groove formed by the second main flow channel 12.

[0070] In this way, the gas sprayed by the left air guide joint 31 can enter the first main flow channel 11 and be distributed to the plurality of gas collection cavities through the first sub-flow channel 33, and the gas pressure in the gas collection cavities is increased to push the piston plate 14 to move upward, at this time, the piston plate 14 can push one of each group of bearing plates 17 to rotate upward through the jacking rod 16.

[0071] Similarly, the gas sprayed by the right air guide joint 31 can enter the second main flow channel 12 and be distributed to the plurality of gas collection cavities through the second sub-flow channel 34, and the gas pressure in the gas collection cavities is increased to push the piston plate 14 to move upward, at this time, the piston plate 14 can push the other of each group of bearing plates 17 to rotate upward through the jacking rod 16.

[0072] By driving the core plate to swing through a single bearing plate 17, the side of the core plate that swings upward is not blocked, ensuring that the active particles can fully contact the core plate.

[0073] In one specific embodiment of the present application, the inner cylinder 24 is located in the outer cylinder 19, the inner cylinder 24 and the outer cylinder 19 share the same center line, and the outer wall of the inner cylinder 24 is sealingly attached to the inner circle of the first piston ring 20.

[0074] Specifically, as shown in Figure 7 , the structure design of the inner cylinder 24 and the outer cylinder 19 allows the first piston ring 20 to move smoothly along the inner cylinder 24 under the push of the gas pressure.

[0075] In one specific embodiment of the present application, the cleaning tank 1 is also provided with an air inlet pipe and a vacuum equipment, the air inlet pipe can fill the cleaning tank 1 with reactive gas such as O2, and the vacuum equipment can extract the volatile pollutants generated during cleaning and promote the flow of gas inside the cleaning tank 1.

[0076] In one specific embodiment of the present application, the outer wall of the piston plate 14 is provided with a damping rubber ring, so that the piston plate 14 can move smoothly in the gas collecting cavity under the push of the air pressure or the pull of the elastic spring 15, avoiding the shaking of the core plate on the bearing plate 17 caused by too fast movement.

[0077] In one specific embodiment of the present application, the components in the core plate bearing mechanism, the driving mechanism and the inflating mechanism can be made of insulating materials, such as polytetrafluoroethylene, so as to avoid the interference with the uniform distribution of the plasma, and the insulating materials can maintain the stability of the electric field, ensuring that the plasma active particles uniformly act on the surface of the core plate.

[0078] In the description of the present specification, the terms of "connection", "installation", "fixation" and the like should be understood in a broad sense, for example, the "connection" can be fixed connection, or detachable connection, or integral connection; can be direct connection, or indirect connection through intermediate medium, and those skilled in the art can understand the specific meanings of the above terms in the present application according to the specific circumstances,

[0079] In the description of the present specification, the terms of "one embodiment", "some embodiments", "a specific embodiment" and the like mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application, and the illustrative description of the above terms in the present specification does not necessarily mean the same embodiment or example, and the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner,

[0080] The above is only the preferred embodiment of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A semiconductor chip manufacturing substrate processing device, comprising a cleaning tank (1) and a core board carrying mechanism located inside the cleaning tank (1). An electrode plate (2) is provided on the inner wall of the top surface of the cleaning tank (1), and a sliding door (32) is hinged to the front surface of the cleaning tank (1). Its features are: The core board carrying mechanism includes a support plate (3) and a first fixed plate (9) slidably connected to the support plate (3). The top surface of the first fixed plate (9) is fixedly bonded to a second fixed plate (10). A carrying plate (17) is hinged to the top surface of the second fixed plate (10). A retaining strip (18) is integrally formed on the edge of the carrying plate (17). An air collecting groove (13) is formed on the opposite surfaces of the first fixed plate (9) and the second fixed plate (10). The air collecting grooves (13) in the first fixed plate (9) and the second fixed plate (10) enclose to form an air collecting cavity. A piston plate (14) is arranged in the air collecting cavity. A push rod (16) is integrally formed on the top surface of the piston plate (14). The bottom surface of the piston plate (14) is connected to the bottom of the air collecting groove (13) through an elastic spring (15). The top end of the push rod (16) penetrates through the second fixed plate (10) and contacts the bottom surface of the carrying plate (17). A driving mechanism for driving the support plate (3) to move horizontally is arranged inside the cleaning tank (1), and an air charging mechanism for introducing gas into the air collecting cavity is arranged inside the cleaning tank (1).

2. The semiconductor chip manufacturing substrate processing equipment according to claim 1, characterized in that: One end of the support plate (3) is vertically provided with a side plate (4) integrally formed therewith. Two groups of bumps (5) are formed by the bottom end of the support plate (3) extending vertically downward. Two guide columns (6) penetrate through the two groups of bumps (5). The two ends of the guide columns (6) are fixedly bonded to the inner wall of the cleaning tank (1).

3. The semiconductor chip manufacturing substrate processing equipment according to claim 1, characterized in that: A slide rail (7) is fixedly bonded to the top surface of the support plate (3). A slider (8) is slidably connected to the slide rail (7). The top surface of the slider (8) is fixedly bonded to the bottom surface of the first fixed plate (9).

4. The semiconductor chip manufacturing substrate processing equipment according to claim 1, characterized in that: First main channels (11), second main channels (12), multiple first sub-channels (33) and multiple second sub-channels (34) are formed on the opposite surfaces of the first fixed plate (9) and the second fixed plate (10). The first main channel (11) is connected to the first sub-channels (33), and the second main channel (12) is connected to the second sub-channels (34). The first sub-channels (33) and the second sub-channels (34) are both connected to the air collecting groove (13).

5. The semiconductor chip manufacturing substrate processing equipment according to claim 4, characterized in that: The cross-sections of the first main channel (11), the second main channel (12), the first sub-channels (33) and the second sub-channels (34) are all semi-circular. One end of the first main channel (11) and the second main channel (12) is connected to the side end surfaces of the first fixed plate (9) and the second fixed plate (10).

6. The semiconductor chip manufacturing substrate processing equipment according to claim 1, characterized in that: Two carrying plates (17) form a group and are evenly distributed in multiple groups on the top surface of the second fixed plate (10). The retaining strip (18) on the carrying plate (17) is in the shape of a "匚".

7. The semiconductor chip manufacturing substrate processing equipment according to claim 1, characterized in that: Two drive mechanisms are symmetrically arranged inside the cleaning tank (1). Each drive mechanism includes an outer cylinder (19) and a first piston ring (20) located inside the outer cylinder (19). A connecting rod (21) is integrally formed on the side of the first piston ring (20). A movable block (23) is fixedly bonded to one end of the connecting rod (21). The top end of the movable block (23) is fixedly bonded to the bottom surface of the tray (3). The outer cylinder (19) has open ends. One end of the outer cylinder (19) is fixedly bonded to the inner wall of the cleaning tank (1). A first connecting pipe (22) runs through the wall at the connection between the cleaning tank (1) and the outer cylinder (19).

8. The semiconductor chip manufacturing substrate processing equipment according to claim 7, characterized in that: Two inflation mechanisms are symmetrically arranged inside the cleaning tank (1). The inflation mechanism includes an inner cylinder (24) and a second piston ring (26) located inside the inner cylinder (24). One end of the inner cylinder (24) is open, and the other end of the inner cylinder (24) is closed and connected to a second connecting pipe (25). One end of the second connecting pipe (25) penetrates the wall of the cleaning tank (1). A connecting column (27) is fixedly bonded to the inner circle of the second piston ring (26). The connecting column (27) has an axially opened air guide groove (28) that penetrates itself.

9. A semiconductor chip manufacturing substrate processing apparatus according to claim 8, characterized in that: The inner cylinder (24) is located inside the outer cylinder (19), the inner cylinder (24) and the outer cylinder (19) are coaxial, and the outer wall of the inner cylinder (24) is sealed and fitted with the inner circle of the first piston ring (20).

10. A semiconductor chip manufacturing substrate processing apparatus according to claim 8, characterized in that: Two flow guide cavities (29) are opened on the inner wall of the movable block (23). One end of the connecting column (27) passes through the movable block (23) and is connected to the flow guide cavity (29). The wall of the movable block (23) on the back of the flow guide cavity (29) is connected to the air guide pipe (30). The top end of the air guide pipe (30) is integrally formed with an air guide connector (31). The air guide connector (31) passes through the side plate (4).

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