Universal array clamp for automatic bonding of metal ceramic packaging integrated circuit and bonding method

Abstract

The invention discloses a universal array clamp for automatic bonding of a metal ceramic packaging integrated circuit and a bonding method. The universal array clamp comprises a clamp main board, a clamp universal part and a clamp special part, the clamp universal part comprises a linear sliding rail fixed to the clamp main plate, a sliding blocking piece arranged on the linear sliding rail in a sliding mode, and an elastic system providing elastic reset for the sliding blocking piece. The clamp special part is a loading tray which is detachably mounted on the clamp main board, and the loading tray is provided with a placing groove for accommodating a metal ceramic packaging integrated circuit of a specific series and a specific model; the linear sliding rail provides mechanical transmission support for the sliding blocking piece, so that the sliding blocking piece moves along a linear track to press or release the metal ceramic packaging integrated circuit placed on the loading tray. The clamp has the advantages of being compatible with multi-series and multi-model metal ceramic packaging integrated circuits, reducing the abrasion of the clamp and prolonging the service life.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of integrated circuit packaging, in particular to a metal ceramic packaging integrated circuit automatic bonding universal array clamp and a bonding method. BACKGROUND

[0002] As the core component of electronic technology, the packaging form and bonding technology of integrated circuits are crucial to the performance of products. Metal ceramic packaging, as a high-performance packaging method, is widely used in the fields of aerospace, military electronics and high-end communications. Metal ceramic packaging integrated circuits can be divided into CSOP (ceramic small outline package), CDIP (ceramic dual in-line package), CFP (ceramic flat package), CLCC (ceramic leadless chip carrier) and other series according to their appearance and packaging form, and further divided into multiple models according to the number of external leads. Different series and models of metal ceramic packaging integrated circuits differ in appearance size, pin layout, etc., which poses compatibility and universality requirements for the design of bonding clamps.

[0003] At present, there are relatively few bonding clamp designs for metal ceramic packaging integrated circuits on the market, especially automatic bonding universal array clamps that can accommodate multiple series and multiple models of metal ceramic packaging integrated circuits. In the prior art, there are several relatively close bonding clamp solutions, but they all have certain limitations: for example, the lead frame bonding clamp disclosed in Chinese Patent CN 216097243 U mainly clamps and fixes lead frame integrated circuits through the cooperation of the bottom plate and the pressing plate. However, this design is mainly aimed at plastic-encapsulated lead frame integrated circuits, and its structural characteristics make it unsuitable for fixing metal ceramic packaging integrated circuits, because metal ceramic packaging differs significantly from plastic-encapsulated lead frames in material, shape and size. For example, the aluminum wire bonding array clamp disclosed in Chinese Patent CN 215342550 U clamps multiple workpieces at the same time by pushing the narrow plate with a threaded rod. Although this design improves production efficiency to some extent, the lack of mechanical transmission support components causes the moving parts to wear out and jam after long-term use, affecting bonding accuracy and stability. The dual-in-line integrated circuit bonding clamp disclosed in Chinese Patent CN 209150059 U uses a spring to retract and push the stop plate, achieving the fixation of a single CDIP packaging series of metal ceramic packaging integrated circuits. Although this design performs well in the bonding of specific series of metal ceramic packaging integrated circuits, it can only fix integrated circuits of a single series or a small number of models, and has poor universality. Moreover, the spring system also lacks mechanical transmission support, and long-term use can cause wear and jamming.

[0004] In summary, the bonding clamp in the prior art has obvious deficiencies in compatibility with multiple series and multiple models of metal ceramic packaging integrated circuits, and generally has problems of easy wear and tear and jamming. SUMMARY

[0005] In view of the problems in the prior art, the present application provides a metal ceramic packaging integrated circuit automatic bonding universal array clamp and a bonding method, which have the advantages of compatibility with multiple series and multiple models of metal ceramic packaging integrated circuits, reduced clamp wear and tear and prolonged service life.

[0006] To solve the above technical problems, the present application is implemented by the following technical solutions: According to a first aspect of the present application, a metal ceramic packaging integrated circuit automatic bonding universal array clamp is provided, comprising a clamp main plate, the clamp further comprising a clamp universal part and a clamp special part; The clamp universal part comprises a linear slide rail fixed to the clamp main plate, a sliding stopper plate slidably arranged on the linear slide rail, and an elastic force system providing elastic return for the sliding stopper plate; The clamp special part is a loading tray detachably mounted on the clamp main plate, and the loading tray is provided with a placing groove for accommodating a metal ceramic packaging integrated circuit of a specific series and model; The linear slide rail provides mechanical transmission support for the sliding stopper plate, so that the sliding stopper plate moves along a linear trajectory to press or release the metal ceramic packaging integrated circuit placed on the loading tray.

[0007] In a possible implementation form of the first aspect, a lower chamfer is arranged at the front end of the sliding stopper plate, and the lower chamfer is configured to generate downward and forward components of force when in contact with the ceramic short side of the metal ceramic packaging integrated circuit.

[0008] In a possible implementation form of the first aspect, an inclined push block is arranged at the rear end of the sliding stopper plate for force application and pushing.

[0009] In a possible implementation form of the first aspect, the elastic force system is a spring; the front surface of the clamp main plate is provided with an array of spring placing grooves, and the spring is accommodated in the spring placing groove.

[0010] In a possible implementation form of the first aspect, the clamp universal part further comprises a cushion block connected between the sliding stopper plate and the slider of the linear slide rail, and the rear end of the cushion block is in contact with the spring.

[0011] In a possible implementation form of the first aspect, a sunken platform is arranged on the front surface of the clamp main plate, and the loading tray is fixed to the sunken platform by screws.

[0012] In a possible implementation manner of the first aspect, a lead insertion hole is further formed in the sinking platform, and is used for allowing an external lead of a CDIP series metal ceramic packaged integrated circuit to pass through.

[0013] In a possible implementation manner of the first aspect, a fixing baffle for limiting the metal ceramic packaged integrated circuit is further arranged on the loading tray, the fixing baffle is fixed on the loading tray by a screw, and a mounting position of the fixing baffle is set according to a length of the metal ceramic packaged integrated circuit to be fixed.

[0014] In a possible implementation manner of the first aspect, the clamp universal part further comprises a cover plate, the cover plate is mounted on the clamp main plate and covers the linear slide rail and the elastic system, and is used for sealing and protecting the linear slide rail and the elastic system.

[0015] According to the second aspect of the present application, a method for bonding the metal ceramic packaged integrated circuit by using the universal array clamp for automatically bonding the metal ceramic packaged integrated circuit is provided, and the method comprises the following steps: mounting a loading tray adapted to a target metal ceramic packaged integrated circuit model on a clamp main plate; placing a plurality of metal ceramic packaged integrated circuits into corresponding placing slots of the loading tray; loosening an external force on the sliding baffle, and under the pushing of the elastic system, the sliding baffle moves linearly along the linear slide rail, and the metal ceramic packaged integrated circuit is compressed to complete the fixing; sending the clamp with the fixed circuit into an automatic bonding device to perform bonding processing; after the bonding is completed, the sliding baffle is pushed outward to overcome the resistance of the elastic system, and the sliding baffle moves reversely along the linear slide rail, the fixing on the metal ceramic packaged integrated circuit is released, and the processed circuit is taken out.

[0016] Compared with the prior art, the present application has at least the following beneficial effects: The metal ceramic packaging integrated circuit automatic bonding universal array clamp provided by the application has the modular structure composed of the standardized universal part and the replaceable special part, and the linear slide rail is introduced into the universal part to provide mechanical transmission support for the sliding stop piece, so that the comprehensive performance of the clamp is comprehensively improved. Specifically, the design not only realizes the wide compatibility of the CSOP, CDIP, CFP, CLCC and other series and models of metal ceramic packaging integrated circuits through the flexible design of the special part loading tray, significantly enhances the universality of the clamp and reduces the clamp cost caused by product model change; at the same time, the use of the linear slide rail ensures the smooth movement of the sliding stop piece along the linear track under the driving of the elastic system, effectively eliminates the common jamming and shaking phenomenon in the traditional clamp, makes the fixing of the integrated circuit more stable and reliable, greatly improves the bonding precision and process stability, significantly reduces the wear of the moving parts, and further prolongs the overall service life of the clamp.

[0017] In order to make the above-mentioned purposes, characteristics and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the specific embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the specific embodiments. Obviously, the drawings described below are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creating laborious work.

[0019] Figure 1 It is a whole schematic diagram of the metal ceramic packaging integrated circuit automatic bonding universal array clamp of the present application.

[0020] Figure 2 It is a schematic diagram of the universal part of the metal ceramic packaging integrated circuit automatic bonding universal array clamp of the present application.

[0021] Figure 3 It is a schematic diagram of the clamp main plate in the metal ceramic packaging integrated circuit automatic bonding universal array clamp of the present application.

[0022] Figure 4 It is a schematic diagram of the sliding stop piece in the metal ceramic packaging integrated circuit automatic bonding universal array clamp of the present application.

[0023] Figure 5 It is a schematic diagram of the cushion block in the metal ceramic packaging integrated circuit automatic bonding universal array clamp of the present application.

[0024] Figure 6 It is a schematic diagram of the linear slide rail in the metal ceramic packaging integrated circuit automatic bonding universal array clamp of the present application.

[0025] Figure 7 The figure is the assembly schematic diagram of the slide stop, the cushion block, the linear slide rail and the spring in the metal ceramic package integrated circuit automatic bonding universal array clamp of the present application.

[0026] Figure 8 The figure is the loading tray schematic diagram of the part metal ceramic package integrated circuit of the present application.

[0027] Figure 9 The figure is the loading tray schematic diagram of the CDIP series metal ceramic package integrated circuit of the present application.

[0028] Figure 10 The figure is the placement slot schematic diagram of the CDIP series metal ceramic package integrated circuit of the present application.

[0029] Figure 11 The figure is the loading tray schematic diagram of the CSOP, CFP, CLCC and other series metal ceramic package integrated circuit of the present application.

[0030] Figure 12 The figure is the placement slot schematic diagram of the CSOP, CFP, CLCC and other series metal ceramic package integrated circuit of the present application.

[0031] Figure 13 The figure is the unfixed schematic diagram of the metal ceramic package integrated circuit of the present application.

[0032] Figure 14 The figure is the fixed schematic diagram of the metal ceramic package integrated circuit of the present application.

[0033] In the figure: 1, clamp main plate; 2, loading tray; 3, slide stop; 5, cover plate; 6, cushion block; 7, linear slide rail, 8, spring; 11, sunken platform; 12, rectangular recess; 13, spring placement slot; 14, lead insertion hole; 21, placement slot; 22, fixed stop; 31, lower chamfer; 32, inclined push block. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme of the present application will be described clearly and completely below in combination with the drawings. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person of ordinary skill in the art without making creative labor belong to the protection scope of the present application.

[0035] As Figure 1As shown, the metal ceramic packaging integrated circuit automatic bonding universal array clamp of the present application comprises a clamp main plate 1, a clamp universal part and a clamp special part. The clamp universal part provides general mechanical transmission and elastic reset functions for the clamp, and the clamp special part is customized according to different series and types of metal ceramic packaging integrated circuits.

[0036] As shown in the Figure 3 , the clamp main plate 1 is the basic support component of the entire clamp. The front surface of the clamp main plate 1 is provided with a sunken platform 11, a rectangular groove 12 and an array of spring placing grooves 13. The sunken platform 11 is used to install the loading tray 2, and the loading tray 2 is fixed on the sunken platform 11 by screws to ensure the stability of the loading tray 2. The rectangular groove 12 is used to install the linear slide rail 7, providing installation space and positioning for the linear slide rail 7. The spring placing groove 13 is used to place the spring 8, effectively limiting the spring 8, and facilitating the installation and replacement of the spring 8. The front surface of the sunken platform 11 is also provided with lead insertion holes 14 matched with the spacing of the external leads of the CDIP series metal ceramic packaging, which are used for the insertion of the external leads of the CDIP series metal ceramic packaging integrated circuit shell, ensuring that the external leads can pass accurately during the bonding process without affecting the bonding operation.

[0037] As shown in the Figure 6 , the linear slide rail 7 is a customized small-distance linear slide rail with high-precision bearing balls built-in between the tracks. The linear slide rail 7 is fixed in the rectangular groove 12 of the clamp main plate 1, serving as a mechanical transmission support component of the clamp fixing system, providing an accurate linear motion trajectory for the sliding baffle 3, ensuring the stability of the sliding baffle 3 during movement, reducing wear and tear, and prolonging the service life of the clamp.

[0038] As shown in the Figure 4 and Figure 7 , the sliding baffle 3 is slidably arranged on the linear slide rail 7. The sliding baffle 3 is provided with a 45° lower chamfer 31 at the front end. When the metal ceramic packaging integrated circuit is fixed, the ceramic short side of the metal ceramic packaging integrated circuit shell contacts the lower chamfer 31 at the front end of the sliding baffle 3 under force, and at the same time, the lower chamfer 31 generates downward and forward components, avoiding the situation that the metal ceramic packaging integrated circuit cannot be recognized or bonded due to poor force during the fixing process. The rear end of the sliding baffle 3 is provided with an inclined push block 32, which facilitates the pushing of the sliding baffle 3 by the operator, achieving effective fixing and unfixing of the metal ceramic packaging integrated circuit. The front surface of the sliding baffle 3 is provided with a countersunk hole for assembling the spacer 6.

[0039] As shown in the Figure 5 , the spacer 6 is provided with screw holes and countersunk holes for connecting the sliding baffle 3 and the slider of the linear slide rail 7 by screws. The rear end of the spacer 6 contacts the spring 8, which can push the spacer 6 and the sliding baffle 3 to move when the spring 8 is stretched and contracted under force, achieving effective fixing and unfixing of the metal ceramic packaging integrated circuit.

[0040] The spring 8 is accommodated in the spring placing groove 13 on the front of the clamp main plate 1 as a spring system. The spring 8 provides an elastic reset force for the sliding stop piece 3, and when the external force on the sliding stop piece 3 is released, the spring 8 pushes the sliding stop piece 3 to move linearly along the linear slide rail 7 to press the metal ceramic packaged integrated circuit; when the sliding stop piece 3 is pushed outward, the spring 8 is compressed, and the sliding stop piece 3 moves reversely to release the fixation on the metal ceramic packaged integrated circuit.

[0041] As shown in Figure 2 , the cover plate 5 is installed on the upper end of the rectangular groove 12 and the spring placing groove 13 of the clamp main plate 1, covers the linear slide rail 7 and the spring 8, and forms a sealing protection for the linear slide rail 7 and the spring 8 to prevent dust, impurities and the like from entering to affect the normal movement of the linear slide rail 7 and the performance of the spring 8.

[0042] The clamp special part is a loading tray 2 which is detachably installed on the sunken platform 11 of the clamp main plate 1. The loading tray 2 is provided with sunken head holes which are matched with the screw holes of the sunken platform 11 of the clamp main plate 1, so as to be fixed with the clamp main plate 1. Since the appearances of the metal ceramic packaged integrated circuit shells of different series and different models are quite different, the loading tray 2 is provided with an array of metal ceramic packaged integrated circuit placing grooves 21 which are matched with the appearance sizes of the corresponding metal ceramic packaged integrated circuit shells. Therefore, the metal ceramic packaged integrated circuit placing grooves 21 of the loading tray 2 are designed individually, so that the clamp can meet the automatic bonding fixation of metal ceramic packaged integrated circuits of different series and different models, as shown in Figure 8 .

[0043] The CDIP series metal ceramic packaged integrated circuit loading tray is provided with a slot which is matched with the CDIP series metal ceramic package, as shown in Figure 9 , Figure 10 . Meanwhile, the loading tray 2 is provided with a fixed stop piece 22 for positioning the metal ceramic packaged integrated circuit. The fixed stop piece 22 is fixed with the loading tray 2 by a screw, and the screw hole position is opened according to the length L1 of the CDIP series metal ceramic shell, as shown in the local enlargement Figure 10 , Figure 13 , Figure 14 . The CDIP series metal ceramic packaged integrated circuit shell is limited by the fixed stop piece 22, and the sliding stop piece 3 is pushed upward to release the fixation of the metal ceramic packaged integrated circuit, and the sliding stop piece 3 is released to fix the metal ceramic packaged integrated circuit.

[0044] The CSOP, CFP, CLCC and other series ceramic package shell loading tray is provided with a slot which is matched with the CSOP, CFP, CLCC and other series ceramic package shell, as shown in Figure 11 , Figure 12As shown, the loading tray 2 is provided with a placing card slot 21 matched with the CSOP, CFP, CLCC and other series of ceramic packaging metal ceramic packaging integrated circuit shell, the width of the metal ceramic packaging integrated circuit placing card slot 21 is consistent with the width of the metal ceramic packaging integrated circuit shell, so that the metal ceramic packaging integrated circuit can be effectively recognized by the automatic equipment. The method for metal ceramic packaging integrated circuit bonding by using the metal ceramic packaging integrated circuit automatic bonding universal array clamp of the application comprises the following steps: According to the type of the target metal ceramic packaging integrated circuit, the appropriate loading tray 2 is selected and installed on the sunken platform 11 of the clamp main plate 1, and the loading tray 2 and the clamp main plate 1 are accurately fixed by screws.

[0045] The plurality of metal ceramic packaging integrated circuits are placed in the corresponding placing slots 21 of the loading tray 2, so that the integrated circuits are accurately and stably placed.

[0046] The external force on the sliding stop piece 3 is released, the sliding stop piece 3 moves linearly along the linear slide rail 7 under the pushing of the spring 8, the metal ceramic packaging integrated circuit is pressed tightly, and the fixing is completed. At this time, the lower chamfer 31 at the front end of the sliding stop piece 3 is in contact with the ceramic short side of the integrated circuit, a downward and forward component force is generated, and the fixing effect is ensured.

[0047] The clamp with the fixed circuit is sent into the automatic bonding equipment for bonding processing, and the automatic bonding equipment performs bonding operation on the integrated circuit.

[0048] After the bonding is completed, the inclined push block 32 of the sliding stop piece 3 is pushed outward to overcome the resistance of the spring 8, the sliding stop piece 3 moves reversely along the linear slide rail 7, the fixing on the metal ceramic packaging integrated circuit is released, and then the processed circuit is taken out.

[0049] In the description of the application, it should be understood that the terms "upper", "lower", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0050] In addition, the terms "first", "second", etc. are used only for the purpose of description and do not imply or imply relative importance or imply the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0051] In the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected or in communication with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0052] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be the first feature directly above or obliquely above the second feature, or it can only mean that the first feature is higher than the second feature in horizontal height. The first feature "below", "below" and "below" the second feature can be the first feature directly below or obliquely below the second feature, or it can only mean that the first feature is lower than the second feature in horizontal height.

[0053] In the present application, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present specification and the features of different embodiments or examples without contradiction.

[0054] Finally, it should be noted that the above-described embodiments are merely specific embodiments of the present application, which are used to illustrate the technical solutions of the present application, but not to limit the present application, the protection scope of the present application is not limited thereto, although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art within the technical range disclosed by the present application, the technical solutions recorded in the foregoing embodiments can still be modified or easily thought of changes, or equivalent replacement of part of the technical features, and these modifications, changes or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be covered in the protection scope of the present application.

Claims

1. A cermet package integrated circuit automatic bonding universal array clamp, comprising a clamp main plate (1), characterized in that, The clamp further comprises a clamp general part and a clamp special part; The clamp general part comprises a linear slide rail (7) fixed on the clamp main plate (1), a slide stopper (3) slidably arranged on the linear slide rail (7), and an elastic force system providing elastic return for the slide stopper (3); The clamp special part is a loading tray (2) detachably mounted on the clamp main plate (1), and the loading tray (2) is provided with a placing groove (21) for accommodating a metal ceramic packaging integrated circuit of a specific series and model. The linear slide rail (7) provides mechanical transmission support for the slide stopper (3), so that the slide stopper (3) moves along a linear track to press or release the metal ceramic packaging integrated circuit placed on the loading tray (2).

2. The cermet packaged integrated circuit automated bonding universal array fixture of claim 1, wherein, The front end of the slide stopper (3) is provided with a lower chamfer (31), which is configured to generate downward and forward components when in contact with the ceramic short side of the metal ceramic packaging integrated circuit.

3. The cermet packaged integrated circuit automated bonding universal array fixture of claim 2, wherein, The rear end of the slide stopper (3) is provided with an inclined push block (32) for force pushing.

4. The cermet packaged integrated circuit automated bonding universal array fixture of claim 1, wherein, The elastic force system is a spring (8); the front surface of the clamp main plate (1) is provided with an array of spring placing grooves (13), and the spring (8) is accommodated in the spring placing groove (13).

5. The cermet packaged integrated circuit automated bonding universal array fixture of claim 4, wherein, The clamp general part further comprises a cushion block (6) connected between the slide stopper (3) and the slider of the linear slide rail (7), and the rear end thereof is in contact with the spring (8).

6. The cermet packaged integrated circuit automated bonding universal array fixture of claim 1, wherein, The front surface of the clamp main plate (1) is provided with a sunken platform (11), and the loading tray (2) is fixed on the sunken platform (11) by screws.

7. The cermet packaged integrated circuit automated bonding universal array fixture of claim 6, wherein, The sunken platform (11) is further provided with a lead insertion hole (14) for the outer lead of the CDIP series metal ceramic packaging integrated circuit to pass through.

8. The cermet packaged integrated circuit automated bonding universal array fixture of claim 1, wherein, The loading tray (2) is further provided with a fixing stopper (22) for limiting the metal ceramic packaging integrated circuit, the fixing stopper (22) is fixed on the loading tray (2) by screws, and the installation position of the fixing stopper (22) is set according to the length of the metal ceramic packaging integrated circuit to be fixed.

9. The cermet packaged integrated circuit automated bonding universal array fixture of claim 1, wherein, The clamp general part further comprises a cover plate (5) mounted on the clamp main plate (1) and covering the linear slide rail (7) and the elastic force system, for sealing and protecting the linear slide rail (7) and the elastic force system.

10. A method of bonding a cermet packaged integrated circuit using the cermet packaged integrated circuit automatic bonding universal array clamp of any one of claims 1-9, wherein, The method comprises the following steps: Install the loading tray (2) of the target metal ceramic packaging integrated circuit model on the clamp main plate (1); Put a plurality of metal ceramic packaging integrated circuits into the corresponding placing grooves (21) of the loading tray (2); Loosen the external force on the slide stopper (3), and under the pushing of the elastic force system, the slide stopper (3) moves linearly along the linear slide rail (7) to press the metal ceramic packaging integrated circuit and complete the fixing; Send the clamp with the fixed circuit to the automatic bonding equipment for bonding processing; After the keying is completed, the sliding baffle (3) is pushed outward to overcome the resistance of the elastic system, so that the sliding baffle (3) moves reversely along the linear sliding rail (7), the fixation on the metal ceramic packaged integrated circuit is released, and the processed circuit is taken out.

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