Clamping platform for stacking and packaging semiconductor chips

Abstract

The invention discloses a clamping platform for semiconductor chip stacking packaging, and particularly relates to the technical field of semiconductor chip processing, the clamping platform comprises a sleeve frame body, a mounting body, a plurality of groups of clamping mechanisms and a bidirectional imaging assembly; the mounting body is rotationally arranged on the sleeve frame body; the multiple sets of clamping mechanisms are distributed in the circumferential direction of the installation body at intervals, and each set of clamping mechanism comprises clamping blocks which can synchronously move in the opposite directions or in the opposite directions and form a square installation area. The bidirectional imaging assembly is arranged on the clamping block; an active compensation clamping assembly is integrated on the clamping block; the active compensation clamping assembly comprises a pressure control cavity formed in the clamping block, a clamping pair arranged on the clamping block and a plurality of compensation blocks connected to the clamping pair in a sliding mode. The active compensation clamping assembly further comprises a sensor module. A set of multi-point and multi-degree-of-freedom active compensation clamping assembly is integrated in a clamping block of a clamping mechanism, and a set of high-precision vibration suppression and position compensation system is constructed in combination with all-directional visual feedback provided by a bidirectional imaging assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor chip processing, in particular to a clamping platform for semiconductor chip stacking packaging. BACKGROUND

[0002] Gold wire welding is a key process in chip packaging, which connects the pads on the chip body with external pins through extremely fine gold wires to realize electrical interconnection. In the prior art, a group of ultrasonic wire bonding machines is usually used to perform gold wire welding on the chip. During the welding process, the second welding point is formed, the gold wire is clamped and broken. At the moment when the gold wire is broken, a transient and small reaction force is generated on the chip. Although the reaction force is not large, the chip itself is extremely precise and thin, and a slight deviation of the chip will affect the subsequent gold wire welding, ultimately leading to the failure of the entire chip welding.

[0003] In addition, the existing wire bonding machine usually adopts a sequential operation method when processing such multi-layer chips, for example, all the gold wires on one side of the chip are welded first, then the chip is flipped 180 degrees by a flipping mechanism, and then the welding of the other side is performed. This method has obvious defects: first, the efficiency is low, and additional time is needed for flipping and repositioning; second, the welding points and gold wires on the first side completed first may be affected by heat, mechanical vibration or stress during the subsequent welding of the other side, which poses a reliability risk; third, the flipping process itself may also introduce alignment errors;

[0004] To solve the above problems, the Chinese invention patent document with publication number "CN114566456A" and the name "Packaging equipment for multi-layer stacked storage chip" proposes to use two groups of welding mechanisms that are symmetrically distributed about the chip, and the two groups of welding mechanisms operate synchronously to perform gold wire welding on the upper and lower surfaces of the chip. The welding actions (especially the gold wire breaking action) of the two groups of mechanisms have opposite trajectory directions. When the gold wires are broken simultaneously by the two groups of wire bonding, the reaction forces generated are equal in size and opposite in direction, symmetric about the center of the chip, and thus cancel each other out. In theory, the chip is not affected by the net reaction force, improving the welding stability and realizing double-sided simultaneous welding.

[0005] However, this solution still has shortcomings: its core idea is to passively cancel out vibrations through the symmetry of forces, but it lacks the ability to actively respond to the complex and diverse vibration sources in the actual production environment (such as vibrations from the equipment's own motors, environmentally transmitted vibrations, welding impacts, etc.). Its clamping mechanism is a rigid clamp, which does not have the ability to sense vibrations or chip offsets in real time, and it cannot perform active and flexible compensation adjustments. Once there is a slight deviation in the initial clamping due to asymmetrical external forces, clamp wear, or workpiece tolerances, or if the cancellation is incomplete, the chip may still have a slight displacement that accumulates, affecting the yield of ultra-high precision packaging. To address these issues, we propose a clamping platform for semiconductor chip stacking packaging. Summary of the Invention

[0006] The purpose of this invention is to provide a clamping platform for semiconductor chip stacking and packaging, so as to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a clamping platform for semiconductor chip stacking and packaging, including a frame body, a mounting body, multiple clamping mechanisms, and a bidirectional imaging component;

[0008] The mounting body is rotatably mounted on the frame body;

[0009] Multiple sets of clamping mechanisms are distributed at intervals along the circumference of the mounting body. Each set of clamping mechanisms includes clamping blocks that can move synchronously towards or away from each other and form a square mounting area for clamping semiconductor chips.

[0010] The bidirectional imaging component is mounted on the clamping block and is used to image the semiconductor chip, the semiconductor chip and the clamping block, as well as the mounting body and the clamping block located at the working station.

[0011] The clamping block is integrated with an active compensation clamping component;

[0012] The active compensation clamping assembly includes a pressure control cavity formed inside the clamping block, a clamping pair disposed on the clamping block and used to block the pressure control cavity, and a plurality of compensation blocks slidably connected to the clamping pair.

[0013] The pressure control chamber is provided with a pressure control hole, which is connected to an external pressure control system; the active compensation clamping assembly also includes a sensor module for monitoring the displacement of the compensation block and the pressure in the pressure control chamber.

[0014] Preferably, the clamping block has a clamping surface and a mating surface that are perpendicular to each other, as well as a toothed surface adjacent to the clamping surface and the mating surface;

[0015] A guide block is installed in the middle of the bonding surface. The guide block is slidably connected in the adjacent clamping pair, and the adjacent clamping surface is in surface contact with the bonding surface.

[0016] The sealing gasket is arranged between the clamping surface and the clamping pair.

[0017] Preferably, the clamping mechanism further comprises a linear guide rail installed in the mounting body, a sliding block connected to the linear guide rail, and a first driving unit arranged in the mounting body, the first driving unit being in transmission connection with the clamping block for driving the pair of clamping blocks to move synchronously, and the sliding block being installed at the bottom of the clamping block.

[0018] Preferably, the first driving unit comprises a motor one, a worm connected to the output shaft of the motor one, a worm gear engaged with the worm, a transmission shaft coaxially and fixedly connected with the worm gear, a gear two engaged with the toothed surface, and an inner tooth ring engaged with all the gear twos.

[0019] One end of the transmission shaft is fixedly connected with one of the gear twos.

[0020] The inner tooth ring is rotationally connected in the mounting body, and the gear two is connected to the inside of the mounting body through a shaft pin.

[0021] Preferably, a sliding cavity corresponding to the compensation block one is arranged on the clamping pair, the compensation block is slidingly connected in the sliding cavity, and a sealing rubber plug is arranged on the contact surface between the compensation block and the sliding cavity.

[0022] Preferably, a motor two is installed at the top of the mounting body, and a transmission assembly is arranged in the mounting body.

[0023] The transmission assembly comprises an outer tooth ring one fixedly connected to the mounting body, and a gear one connected to the output shaft of the motor two, the gear one being engaged with the outer tooth ring one.

[0024] Preferably, the pressure control cavity is formed by the closed space surrounded by the rear part of the compensation block in the sliding cavity and the end wall of the sliding cavity.

[0025] The pressure control hole is in communication with the pressure control cavity through the wall of the clamping block; the sensor module comprises a pressure sensor arranged in the pressure control cavity, and a displacement sensor arranged in the pressure control cavity for compensating the displacement of the compensation block.

[0026] Preferably, the bidirectional imaging assembly comprises at least one inward-looking imaging unit and at least one outward-looking imaging unit; the inward-looking imaging unit is used for imaging the upper surface of the semiconductor chip clamped by the clamping mechanism and the space between the semiconductor chip and the clamping block; and the outward-looking imaging unit is used for imaging the space between the clamping block and the mounting body.

[0027] Preferably, the platform further comprises a control system, the control system being electrically connected with the sensor module, the bidirectional imaging assembly, the first driving unit, the motor two, and the pressure control system connected with the pressure control hole.

[0028] The control system is configured to receive monitoring data of the sensor module and image data of the bidirectional imaging assembly, analyze the vibration state of the position deviation of the semiconductor chip and the position deviation of the clamp block, and generate a control instruction to adjust the pressure in the pressure control cavity or control the first driving unit or the motor to make a compensatory adjustment.

[0029] Preferably, the control system is further configured to dynamically track the position of the welding point and compensate for the positioning during the chip welding process according to the preset welding path and the real-time image feedback of the bidirectional imaging assembly.

[0030] Compared with the prior art, the present application has the following advantages:

[0031] 1. The semiconductor chip stack packaging clamping platform integrates a set of multi-point, multi-degree-of-freedom active compensation clamping assembly in the clamp block of the clamping mechanism, and combines the omnidirectional visual feedback provided by the bidirectional imaging assembly to build an intelligent, high-precision vibration suppression and position compensation system. The core of the active compensation system is to divide the traditional rigid, integral clamping surface into multiple independently controllable compensation blocks. Each compensation block is connected to a high-precision pressure control system through an independent pressure control cavity behind it and can be monitored in real time by a displacement sensor. When the chip is subjected to any direction, any form of vibration or external force impact during welding, the force will be transmitted to the specific compensation block in contact with the chip. The slight displacement of the compensation block will immediately change the volume and pressure of the corresponding pressure control cavity, and the sensor module will quickly capture these nanoscale changes. The control system dynamically and independently adjusts the air pressure in the pressure control cavity according to these real-time sensor data, thereby generating a precise, reverse force on the corresponding compensation block to offset the external disturbance.

[0032] 2. The semiconductor chip stack packaging clamping platform uniformly distributes multiple independent clamping mechanisms along the circumference of the rotatable multi-station mounting body to build a high-efficiency continuous operation platform. Each clamping mechanism constitutes an independent work unit and can be sequentially transferred through different stations such as feeding, alignment, welding, and detection. This rotary indexing design replaces the traditional single-station sequential operation or complex flipping process, enabling the production of semiconductor chip packaging, especially multi-layer stacked chip double-sided welding, through a single driving motor to accurately switch all stations, greatly reducing the waiting time and auxiliary operation time between processes, and significantly improving the chip processing capacity and overall production efficiency per unit time. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

[0034] Figure 1 Structure diagram of the present application;

[0035] Figure 2 Structure diagram of the present application;

[0036] Figure 3 Structure diagram of the present application;

[0037] Figure 4 Structure diagram of the present application;

[0038] Figure 5 Structure diagram of the present application;

[0039] Figure 6 Structure diagram of the present application;

[0040] Figure 7 Structure diagram of the present application;

[0041] Figure 8 Structure diagram of the present application;

[0042] Figure 9 Structure diagram of the present application.

[0043] In the drawings: 1, sleeve body;

[0044] 2, mounting body; 21, outer tooth ring one; 22, gear one;

[0045] 3, clamping mechanism; 31, clamping block; 32, linear guide rail; 33, gear two; 34, inner tooth ring; 35, transmission shaft; 36, worm gear; 37, worm; 38, motor one; 39, sliding block;

[0046] 311, clamping surface; 312, toothed surface; 313, fitting surface; 321, clamping pair; 322, guide block; 323, sealing gasket; 324, compensation block; 331, pressure control cavity; 332, pressure control hole; 333, sensor module; 3211, sliding cavity;

[0047] 4, motor two;

[0048] 5, connecting seat;

[0049] 6. A bidirectional imaging assembly. DETAILED DESCRIPTION

[0050] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0051] Embodiment: As shown in the figure, the present application provides a clamping platform for semiconductor chip stack packaging, which comprises a sleeve body 1, further comprises a mounting body 2, a plurality of clamping mechanisms 3 and a bidirectional imaging assembly 6. Figures 1-9 The mounting body 2 is rotatably arranged on the sleeve body 1.

[0052] The plurality of clamping mechanisms 3 are distributed along the circumference of the mounting body 2, each clamping mechanism 3 comprises a clamping block 31 which can be synchronously moved towards or away from each other and forms a square mounting area for clamping semiconductor chips.

[0053] The bidirectional imaging assembly 6 is arranged on the clamping block 31, which is used for imaging the semiconductor chips located in the working station, the semiconductor chips and the clamping block 31, and the mounting body 2 and the clamping block 31.

[0054] The clamping block 31 is integrated with an active compensation clamping assembly.

[0055] The active compensation clamping assembly comprises a pressure control cavity 331 formed in the clamping block 31, a clamping pair 321 arranged on the clamping block 31 and used for plugging the pressure control cavity 331, and a plurality of compensation blocks 324 slidingly connected to the clamping pair 321.

[0056] The pressure control cavity 331 is provided with a pressure control hole 332, which is in communication with an external pressure control system; the active compensation clamping assembly further comprises a sensor module 333 for monitoring the displacement of the compensation blocks 324 and the pressure in the pressure control cavity 331.

[0057] The clamping block 31 has mutually perpendicular clamping surfaces 311 and abutting surfaces 313, and toothed surfaces 312 adjacent to the clamping surfaces 311 and the abutting surfaces 313.

[0058] The abutting surfaces 313 are provided with guide blocks 322 in the middle, the guide blocks 322 are slidingly connected in the clamping pairs 321 adjacent thereto, and the adjacent clamping surfaces 311 and the abutting surfaces 313 are in surface contact.

[0059] The clamping surfaces 311 and the clamping pairs 321 are provided with sealing gaskets 323.

[0060] The clamping surfaces 311 and the clamping pairs 321 are provided with sealing gaskets 323.

[0061] Specifically, the clamping block 31 is the core component of the clamping mechanism. Its geometry is carefully designed to integrate multiple functions. The clamping surface 311 is the surface that ultimately comes into direct or indirect contact with the side of the semiconductor chip, requiring extremely high flatness and smoothness. The toothed surface 312 is mainly used for meshing with the gears of the drive system. The contact surface 313 is the surface where the supporting or guiding structures between the clamping blocks 31 come into contact. The guide block 322 provides additional guidance and constraint for the precise sliding of the clamping block 31 within the clamping pair 321, ensuring that the movement trajectory of the clamping block is accurate when subjected to driving or compensating forces. The sealing gasket 323, as an elastic medium, is located between the clamping surface 311 and the rigid clamping pair 321. It not only plays a sealing role to prevent leakage of the pressure control chamber 331, but more importantly, it acts as a flexible interface to absorb some high-frequency vibrations and protect the chip edges.

[0062] The clamping mechanism 3 also includes a linear guide rail 32 installed in the mounting body 2, a slider 39 slidably connected to the linear guide rail 32, and a first drive unit located in the mounting body 2. The first drive unit is connected to the clamping block 31 for driving a pair of clamping blocks 31 to move synchronously. The slider 39 is installed at the bottom of the clamping block 31. The linear guide rail 32 and the slider 39 constitute a precision guide and bearing base for the clamping block 31 to perform large-scale opening and closing movements (i.e., adapting to chips of different sizes). The linear guide rail 32 ensures the straightness and stability of the clamping block 31 during movement.

[0063] The first drive unit includes a motor 38, a worm 37 connected to the output shaft of the motor 38, a worm wheel 36 meshing with the worm 37, a transmission shaft 35 coaxially and fixedly connected with the worm wheel 36, a gear 33 meshing with the toothed surface 312, and an internal gear ring 34 meshing with all gears 33.

[0064] One end of the drive shaft 35 is fixedly connected to one of the gears 33;

[0065] The internal gear ring 34 is rotatably connected inside the mounting body 2, and the gear 2 33 is connected inside the mounting body 2 by a shaft pin;

[0066] The first drive unit is a precision mechanical transmission system that performs coarse adjustment of the clamping block 31 (to adapt to the chip size). Motor 38 provides power, and the meshing of the worm gear 37 and worm wheel 36 transmits and reduces motion. More importantly, the worm gear pair has a self-locking characteristic, effectively preventing the clamping block 31 from accidentally loosening due to external disturbances (such as chip stress) when motor 38 stops, ensuring the stability of the initial clamping force. Drive shaft 35 transmits the rotational motion of the worm wheel 36. A gear 33 and the fixed worm wheel 36 are on the same drive shaft 35, achieving synchronous drive. The internal gear ring 34 is a key synchronous element. All gears 33 mesh with the inner gear ring of the same internal gear ring 34. When one of the gears 33 rotates synchronously, it drives the internal gear ring 34 to generate a slight "revolutionary" tendency. However, since the internal gear ring 34 is constrained within the mounting body 2 (it can float slightly or has specific constraints), the result is that while one of the gears 33 drives the internal gear ring 34, the internal gear ring 34 applies an equal force to the other gears 33, thereby pushing the clamping blocks 31 meshing with the gears 33 (through the rack structure on the toothed surface 312) to move strictly synchronously towards or away from each other. This design ensures the absolute synchronicity of the movement between the clamping blocks 31, which is the basis for forming a high-precision square mounting area.

[0067] The clamping pair 321 has a sliding cavity 3211 that corresponds to the compensation block 324. The compensation block 324 is slidably connected in the sliding cavity 3211, and the contact surface between the compensation block 324 and the sliding cavity 3211 is provided with a sealing rubber plug.

[0068] The clamping pair 321 is a key structural component inside the clamping block 31 used to support the active compensation function. Multiple (e.g., 5-10 distributed along the length of the clamping surface) independent sliding cavities 3211 are machined on it. Each sliding cavity 3211 is fitted with a compensation block 324. The compensation block 324 is the actuator that directly applies compensation force to the chip. A precision sliding fit is used between the compensation block 324 and the sliding cavity 3211 to ensure smooth movement without radial wobble. Sealing plugs (typically O-rings or rectangular seals) on the contact surface achieve a sliding dynamic seal, allowing the space behind each compensation block 324 to form an independent sealed pressure-controlled cavity 331, while simultaneously allowing the compensation block 324 to perform small-stroke reciprocating motion under pneumatic drive.

[0069] Motor 2 4 is mounted on the top of the mounting body 2, and a transmission assembly is provided inside the mounting body 2;

[0070] The transmission assembly includes an external gear ring 21 fixed on the mounting body 2 and a gear 22 connected to the output shaft of the motor 4. The gear 22 meshes with the external gear ring 21.

[0071] Motor 2, part 4, is the drive source for the entire rotary table (mounting body 2). The output shaft of motor 2, part 4, is connected to gear 1, part 22 via a coupling. Gear 1, part 22 meshes with an external gear ring 1, part 21, which is much larger in diameter and is fixedly mounted on mounting body 2. Figure 2 , Figure 3 (As shown). This "small gear driving a large gear ring" structure is a classic rotary drive scheme. When the output shaft of motor 24 rotates, gear 22 rotates, thereby driving the external gear ring 21, which is fixed to the mounting body 2, to rotate relative to the sleeve body 1. This structure is compact and can provide stable rotary drive torque and precise angular indexing (usually achieved with an encoder).

[0072] The pressure control chamber 331 is a closed space formed by the rear part of the compensation block 324 in the sliding cavity 3211 and the end wall of the sliding cavity 3211;

[0073] The pressure control hole 332 penetrates the wall of the clamping block 31 and communicates with the pressure control cavity 331; the sensor module 333 includes a pressure sensor disposed in the pressure control cavity 331, and a displacement sensor disposed in the pressure control cavity 331 for compensating the displacement of the block 324.

[0074] The pressure control chamber 331 is the power source chamber for each independent compensation unit. Its volume varies with the position of the compensation block 324. The pressure control port 332 is a channel connecting the external high-precision pneumatic control system to each independent pressure control chamber 331, typically consisting of micro-tubes and micro-flow channels integrated within the clamping block 31. The sensor module 333 is the "sensory nerve" of the system. Pressure sensors (such as micro-differential pressure film sensors) monitor the absolute pressure or the difference relative to a reference pressure within the pressure control chamber 331 in real time. Displacement sensors (such as non-contact capacitive or eddy current micro-sensors, or micro-LVDTs integrated within the chamber) are used to directly measure the precise displacement of the compensation block 324 relative to the end wall of the sliding cavity 3211. The data from these two types of sensors are the direct basis for the control system to perform real-time closed-loop compensation control.

[0075] The bidirectional imaging assembly 6 includes at least one internal imaging unit and at least one external imaging unit; the internal imaging unit is used to image the upper surface of the semiconductor chip held by the clamping mechanism 3 and the space between the semiconductor chip and the clamping block 31; the external imaging unit is used to image the space between the clamping block 31 and the mounting body 2.

[0076] The bidirectional imaging component 6 is the system's "visual eye," providing both macroscopic and microscopic positional information. The internal imaging unit typically refers to an imaging system whose optical path can penetrate deep into the clamping area. For example, a camera can be directly mounted at a specific position on the clamping block 31, enabling high-precision positioning of the pads on the chip's upper surface (providing coordinates for the upper / lower wire bonding machine). It can also observe the contact gap and state between the chip's side and the clamping surface 311 (or sealing gasket 323), determining if there is tilting, foreign objects, or uneven contact. The external imaging unit is used to observe the relative positional relationship between the clamping mechanism 3 as a whole and the mounting body 2 from the outside. For example, it can detect the offset between specific reference features on the clamping block 31 and the corresponding reference on the mounting body 2, thereby determining the overall pose deviation of the clamping mechanism caused by long-term use, thermal deformation, etc.

[0077] The platform also includes a control system, which is electrically connected to the pressure control system connected to the sensor module 333, the bidirectional imaging component 6, the first drive unit, the second motor 4, and the pressure control port 332.

[0078] The control system is configured to receive monitoring data from sensor module 333 and image data from bidirectional imaging component 6, analyze the positional deviation of semiconductor chip and vibration state of clamp block 31, and generate control commands to adjust the pressure in pressure control chamber 331 or control the first drive unit or motor 4 to make compensatory adjustments.

[0079] The control system is also configured to dynamically track and compensate for the location of the solder joints during the chip wire bonding process, based on the preset wire bonding path and the real-time images fed back by the bidirectional imaging component 6.

[0080] In summary, the semiconductor chip stacking and packaging clamping platform allows for the packaging of semiconductor chips. During use, the output shaft of motor 4 drives gear 22 to rotate, which in turn rotates the external gear ring 21, causing the mounting body 2 to rotate. Through the rotation of the mounting body 2, the clamping mechanism 3 on the mounting body 2, which is in multiple positions, can switch positions, laying the foundation for continuous processing of semiconductor chip packaging.

[0081] Driven by the output shaft of motor 38, worm 37 rotates, which in turn drives worm wheel 36 to drive gear 33 to rotate via transmission shaft 35. Through the transmission of internal gear ring 34, internal gear ring 34 drives clamping block 31, enabling clamping blocks 31 to move synchronously and change the size of the square mounting area between clamping blocks 31 to accommodate semiconductor chips of different sizes.

[0082] When vibration occurs during semiconductor chip packaging, the bidirectional imaging component 6 can directly image the semiconductor chip. Firstly, it provides precise positioning for gold wire bonding; secondly, by imaging the clamping block 31 and the semiconductor chip, it analyzes and determines the positional deviation between the clamping block 31 and the semiconductor chip and performs compensation operations; thirdly, by imaging the clamping block 31 and the mounting body 2, it analyzes and determines the positional deviation of the clamping block 31 and performs compensation operations.

[0083] The distance sensor and air pressure sensor composed of sensor module 333 can determine the travel distance of sealing gasket 323 and the pressure change in pressure control chamber 331, and understand the slight positional deviation of semiconductor chip. The pressure in pressure control chamber 331 is controlled by pressure control hole 332, so that sealing gasket 323 is finely aligned with semiconductor chip. At the same time, the clamping method of pressure control chamber 331 forms flexible clamping of semiconductor chip, reducing the damage to semiconductor chip caused by vibration. In addition, part of sealing gasket 323 abuts against guide block 322 to suppress the offset of clamping block 31.

[0084] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A clamping platform for semiconductor chip stacking and packaging, comprising a frame (1), characterized in that: It also includes a mounting body (2), multiple clamping mechanisms (3) and a bidirectional imaging assembly (6); The mounting body (2) is rotatably mounted on the frame body (1); Multiple sets of clamping mechanisms (3) are distributed circumferentially along the mounting body (2). Each set of clamping mechanisms (3) includes clamping blocks (31) that can move synchronously towards or away from each other and form a square mounting area for clamping semiconductor chips. The bidirectional imaging component (6) is disposed on the clamp (31) and is used to image the semiconductor chip, the semiconductor chip and the clamp (31) located at the working station, as well as the mounting body (2) and the clamp (31); The clamping block (31) is equipped with an active compensation clamping component; The active compensation clamping assembly includes a pressure control cavity (331) formed inside the clamping block (31), a clamping pair (321) disposed on the clamping block (31) and used to block the pressure control cavity (331), and a plurality of compensation blocks (324) slidably connected to the clamping pair (321). The pressure control chamber (331) is provided with a pressure control hole (332), which is connected to an external pressure control system; the active compensation clamping assembly also includes a sensor module (333) for monitoring the displacement of the compensation block (324) and the pressure in the pressure control chamber (331).

2. The clamping platform for semiconductor chip stacking and packaging according to claim 1, characterized in that: The clamping block (31) has a clamping surface (311) and a mating surface (313) that are perpendicular to each other, and a toothed surface (312) adjacent to the clamping surface (311) and the mating surface (313). A guide block (322) is installed in the middle of the bonding surface (313). The guide block (322) is slidably connected in the adjacent clamping pair (321), and the adjacent clamping surface (311) is in surface contact with the bonding surface (313). A sealing gasket (323) is provided between the clamping surface (311) and the clamping pair (321).

3. The clamping platform for semiconductor chip stacking and packaging according to claim 2, characterized in that: The clamping mechanism (3) further includes a linear guide rail (32) installed in the mounting body (2), a slider (39) slidably connected to the linear guide rail (32), and a first drive unit provided in the mounting body (2). The first drive unit is connected to the clamping block (31) for driving a pair of clamping blocks (31) to move synchronously. The slider (39) is installed at the bottom of the clamping block (31).

4. The clamping platform for semiconductor chip stacking and packaging according to claim 3, characterized in that: The first drive unit includes a motor (38), a worm (37) connected to the output shaft of the motor (38), a worm wheel (36) meshing with the worm (37), a transmission shaft (35) coaxially and fixedly connected with the worm wheel (36), a gear (33) meshing with the toothed surface (312), and an internal gear ring (34) meshing with all gears (33). One end of the drive shaft (35) is fixedly connected to one of the gears (33); The internal gear ring (34) is rotatably connected inside the mounting body (2), and the second gear (33) is connected inside the mounting body (2) by a shaft pin.

5. The clamping platform for semiconductor chip stacking and packaging according to claim 4, characterized in that: The clamping pair (321) has a sliding cavity (3211) corresponding to the compensation block (324) one by one. The compensation block (324) is slidably connected in the sliding cavity (3211). The contact surface between the compensation block (324) and the sliding cavity (3211) is provided with a sealing rubber plug.

6. The clamping platform for semiconductor chip stacking and packaging according to claim 5, characterized in that: The top of the mounting body (2) is equipped with a motor (4), and the mounting body (2) is provided with a transmission assembly; The transmission assembly includes an external gear ring (21) fixed on the mounting body (2) and a gear (22) connected to the output shaft of the motor (4), wherein the gear (22) meshes with the external gear ring (21).

7. The clamping platform for semiconductor chip stacking and packaging according to claim 6, characterized in that: The pressure control chamber (331) is a closed space formed by the rear part of the compensation block (324) in the sliding cavity (3211) and the end wall of the sliding cavity (3211); The pressure control hole (332) penetrates the wall of the clamping block (31) and communicates with the pressure control cavity (331); the sensor module (333) includes a pressure sensor installed in the pressure control cavity (331) and a displacement sensor installed in the pressure control cavity (331) for compensating the displacement of the block (324).

8. The clamping platform for semiconductor chip stacking and packaging according to claim 7, characterized in that: The bidirectional imaging assembly (6) includes at least one internal imaging unit and at least one external imaging unit; the internal imaging unit is used to image the upper surface of the semiconductor chip held by the clamping mechanism (3) and the space between the semiconductor chip and the clamping block (31); the external imaging unit is used to image the space between the clamping block (31) and the mounting body (2).

9. The clamping platform for semiconductor chip stacking and packaging according to claim 8, characterized in that: The platform also includes a control system, which is electrically connected to the pressure control system connected to the sensor module (333), the bidirectional imaging component (6), the first drive unit, the second motor (4), and the pressure control port (332); The control system is configured to: receive monitoring data from the sensor module (333) and image data from the bidirectional imaging component (6), analyze the positional deviation of the semiconductor chip and the vibration state of the positional deviation of the clamp (31), and generate control commands to adjust the pressure in the pressure control chamber (331) or control the first drive unit or motor (4) to make compensatory adjustments.

10. The clamping platform for semiconductor chip stacking and packaging according to claim 9, characterized in that: The control system is also configured to dynamically track and compensate for the location of the solder joint during the chip wire bonding process, based on the preset wire bonding path and the real-time image fed back by the bidirectional imaging component (6).

Images