Component carrier with antenna and shielded cavity

Abstract

The component carrier (100) comprises: a stack (102) comprising a plurality of electrically conductive layer structures (150) and a plurality of electrically insulating layer structures (152); a cavity (104) formed in the stack (102), the cavity (104) being defined by a circumferential wall; a conductive shield (106) that covers a circumferential wall of the cavity (104); and an antenna (108) formed as part of the stack (102), in which the conductive shield (106) has an opening (110) located on a top end of the cavity (104) in the stacking direction (112), the opening (110) being vertically associated with the antenna (108) arranged on top of the opening (110) and / or an antenna arranged at the opening.

Description

Technical Field

[0001] The present invention relates to a component carrier and a method for dimensionalizing the component carrier. Background Technology

[0002] With the increasing functionality of products equipped with component carriers containing one or more electronic components, the miniaturization of these electronic components, and the growing number of electronic components to be mounted on component carriers, such as printed circuit boards, increasingly robust array-like components or packages with multiple electronic components are being adopted. These components or packages have multiple contacts or connections with increasingly smaller spacing between these contacts. Removing the heat generated by these electronic components and the component carrier itself during operation is becoming an increasingly important issue. Simultaneously, the component carrier must be mechanically robust and electrically reliable to operate even under harsh conditions.

[0003] Furthermore, artifacts may occur when high-frequency signals propagate along the wiring structure of component carriers. This phenomenon can significantly degrade the overall performance of communication systems and the like. Summary of the Invention

[0004] The purpose of this invention is to provide a component carrier with high performance, particularly in high-frequency signal transmission.

[0005] To achieve the above objectives, a component carrier according to the independent claims and a method for dimensionalizing the component carrier are provided.

[0006] According to an exemplary embodiment, a component carrier is provided, comprising: a stack including a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures; a cavity formed in the stack, the cavity being defined by a circumferential wall; a conductive shield covering the circumferential wall of the cavity; and an antenna formed as part of the stack, wherein the conductive shield has an opening located at the top end of the cavity along the stacking direction, the opening being vertically associated with an antenna disposed on top of the opening and / or an antenna disposed at the opening.

[0007] According to another exemplary embodiment of the present invention, a method for sizing a component carrier having the above-described features is provided, the method comprising: reducing the ratio between the height and width of a cavity until the bandwidth of electromagnetic wave transmission meets a predetermined bandwidth standard; and / or increasing the ratio between the height and width of the cavity until the return loss of electromagnetic wave transmission meets a predetermined return loss standard.

[0008] According to another exemplary embodiment of the present invention, the component carrier having the above features is used for high-frequency applications, particularly for conducting radio frequency (RF) signals, especially for conducting RF signals with frequencies higher than 1 GHz or even higher than 50 GHz.

[0009] In the context of this application, the term "component carrier" can specifically refer to any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, a component carrier can be configured as a mechanical and / or electronic carrier of a component. In particular, a component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. It can also be a hybrid board composed of different types of component carriers of the above types.

[0010] In the context of this application, the term "stacked structure" may specifically refer to an arrangement of multiple planar layers mounted one on top of the other in a parallel manner.

[0011] In the context of this application, the term "layer structure" may specifically refer to a continuous layer, a graphical layer, or a plurality of discontinuous islands in a common plane.

[0012] In the context of this application, the term "cavity" may specifically refer to a recess, groove, or hole (particularly a blind hole or through hole) extending into and / or into the stack. Preferably, all sides of the cavity may be defined by the layered structure of the stack. The cavity may be configured to function as a waveguide, such as an air-filled waveguide. In the context of this application, the term "waveguide" may specifically refer to a structure that guides waves, such as electromagnetic waves, in a manner that reduces energy loss by limiting energy transmission to a finite number of directions, particularly to one direction. Without the physical constraint of a waveguide, the amplitude of a wave attenuates more rapidly as it extends into three-dimensional space. For example, a waveguide may be a hollow conductive recess located in the stack of a component carrier, which can be used to transmit high-frequency radio waves. For example, the cross-section of a metallized recess used as a waveguide (i.e., the cavity with conductive shielding) may be rectangular or circular. For example, a signal may be coupled to a waveguide using a stripline, i.e., a transverse electromagnetic transmission line, such as a planar transmission line. Such a stripline can be positioned on one side of the cavity, such as at the bottom. Specifically, the signal can be coupled between the waveguide and the stripline at the transition point from the waveguide to the stripline. The stripline can be in direct contact with the waveguide, or it can be spatially spaced from the waveguide. Furthermore, at least one stripline, and in particular multiple striplines, can be associated with the waveguide.

[0013] In the context of this application, the term "conductive shield" can specifically refer to an electrically conductive material (e.g., a metal or conductive polymer, such as copper, titanium, silver, palladium, or gold, and such as graphene) that at least partially lines the circumferential wall that defines a cavity in the stack. Specifically, the conductive shield or coating can partially or preferably completely cover the circumferential wall of the cavity, except for openings (and optionally, second openings). For example, such a conductive shield or coating can be deposited on the circumferential wall of the cavity, for example, by plating or sputtering.

[0014] In the context of this application, the term "opening at the top end of the cavity of the conductive shield" can specifically refer to a hole (particularly a through hole) located in the conductive shield on the top side of the cavity. The hole can extend through the entire thickness of the electrically conductive material of the conductive shield in the thickness direction of the stacked component. In an example, the opening at the top end of the cavity of the conductive shield can have a circular and / or edged (e.g., polygonal) shape (in a cross-sectional view of the component carrier).

[0015] In the context of this application, the term "antenna" may specifically refer to a patterned electrically conductive structure that is shaped, sized, and configured to receive and / or transmit electromagnetic radiation signals, particularly radio frequency (RF) signals, such as RF signals of a specific frequency or frequency range. Through such antenna structures formed in and / or on (particularly as part of) a stack, signals can be coupled into or out of a cavity-based waveguide.

[0016] In the context of this application, the term "the opening of the conductive shield is vertically associated with an antenna disposed on top of the opening and / or an antenna disposed at the opening" can specifically refer to the spatial and functional correlation between the top-side opening of the conductive shield and an antenna located on the top side of its conductive shield and / or above the top side of the conductive shield. This correlation allows electromagnetic radiation to be coupled from the waveguide cavity toward the antenna through the opening for emission into the environment; and / or allows electromagnetic radiation captured by the antenna to be transmitted from the antenna toward the waveguide cavity through the opening for processing by the electrically conductive layer structure of the component carrier. In the example, at least a portion of the area of ​​the opening of the conductive shield overlaps with the projected area of ​​the antenna perpendicular to the thickness direction of the stack (i.e., the reference stack thickness direction).

[0017] In the context of this application, the term "method for dimensionalizing a component carrier" can specifically refer to the process of determining design rules for manufacturing a component carrier, wherein the geometric parameters of the cavity of the component carrier are determined to conform to one or more predetermined criteria related to the transmission of electromagnetic waves through the cavity. However, the method for dimensionalizing a component carrier may also include manufacturing a component carrier of correspondingly dimensional dimensions. The geometric parameters may include at least the horizontal width and vertical height of the cavity, wherein the vertical direction may correspond to the stacking direction of the layer structure of the stacked components, and the horizontal direction may be perpendicular to the vertical direction.

[0018] In the context of this application, the term "bandwidth of electromagnetic wave transmission" can specifically refer to the frequency range in which electromagnetic wave transmission is achieved by a component carrier having an antenna and a waveguide cavity. In short, the larger the frequency range of the transmitted wave and therefore the larger the bandwidth, the more data can be transmitted over the communication channel.

[0019] In the context of this application, the term "return loss of electromagnetic wave transmission" can specifically refer to a relative measurement of the power of a signal reflected in a transmission line—for example, reflected due to discontinuities in the transmission line. Such discontinuities may, for example, be caused by a mismatch between the termination or load connected to the transmission line and the characteristic impedance of the transmission line. Therefore, when a signal is transmitted through the transmission line, some of the signal power is reflected or returned to the source due to one or more discontinuities in the transmission line. Such discontinuities may, for example, be related to the system, another transmission line, and / or a connector. This measurement of reflected power can be referred to as return loss.

[0020] In the context of this application, the term "main surface" of a body can specifically refer to the two opposite largest surfaces of the body. The main surfaces can be connected by circumferential sidewalls. The thickness of the body, such as a stacked component, can be defined by the distance between the two opposite main surfaces.

[0021] According to an exemplary embodiment, a stacked component carrier (e.g., a PCB or IC substrate) can be provided, wherein a cavity is formed within the stack. The circumferential walls of the cavity may be partially covered by a conductive shield (e.g., a metal liner), allowing a low-loss hollow waveguide to be formed through the cavity and its conductive shield. Descriptively, the cavity defined by the conductive shield in the stacked component carrier can serve as a Faraday cage, thereby facilitating the transmission of radio frequency signals with low loss and high signal integrity. The conductive shield may be selectively open on the top side of the cavity for electromagnetic coupling of the cavity interior to a top-side antenna. Thus, the top-side opening may face the patterned structure forming the antenna to establish a vertical association between the opening and the antenna. Advantageously, the antenna may be integrally formed with the stack. Thus, a simple manufacturing process can be combined with efficient electromagnetic coupling and a compact design that integrates both the waveguide and the antenna within the stack. Furthermore, this design can achieve high bandwidth, good directivity, and / or high radiation efficiency. Exemplary implementations can provide an integrated solution where the waveguide cavity and antenna are combined in the same stack, eliminating the need to assemble separate components and thus avoiding alignment issues. Through a direct-feed architecture, losses can be reduced or even eliminated. High reliability can be combined with a small size.

[0022] In particular, the waveguide-antenna configuration of the component carrier according to the exemplary embodiment is fully compatible with very high frequencies, even above 50 GHz. In a preferred embodiment, an air-filled waveguide cavity can be combined with a slot antenna, both of which are integrated in a laminated stack. This allows the component carrier to have excellent high-frequency performance.

[0023] Preferably, the component carrier of the above configuration can be manufactured according to a height-advantageous sizing rule. Advantageously, the height-to-width ratio of the cavity can be reduced to increase bandwidth. Additionally or alternatively, the height-to-width ratio of the cavity can be increased to reduce return loss. Therefore, the aspect ratio can be selected to focus on bandwidth or return loss, or to achieve an appropriate trade-off between bandwidth and return loss. In sizing the cavity, one or more criteria can be considered, which may be related to target bandwidth characteristics and / or target return loss characteristics.

[0024] In the following sections, further exemplary embodiments of the component carrier and the method will be described.

[0025] In one embodiment, the antenna can be formed as a patterned metal structure. In another embodiment, the antenna can be formed as a dielectric resonant antenna structure.

[0026] In one embodiment, the stack includes an electrically insulating layer closure structure disposed at the top end of the cavity. Preferably, the electrically insulating layer closure structure may be disposed directly at the top end of the cavity. Preferably, the electrically insulating layer closure structure is configured to contact an external electrically conductive layer structure defining a portion of the conductive shielding surrounding the cavity. The electrically insulating layer closure structure may be a continuous or patterned dielectric layer.

[0027] Specifically, at least one electrically insulating layer structure (and particularly the electrically insulating layer enclosure structure) in the electrically insulating layer structure may comprise a low-Dk material. More specifically, the low-Dk material may be implemented along the radio frequency signal path (e.g., from the radio frequency integrated circuit through the stripline, including through the transition structure and waveguide cavity, and then through the antenna). In particular, the Dk value of a corresponding electrically insulating layer structure in the electrically insulating layer structure may be in the range of 1 to 10, preferably in the range of 1.1 to 4.

[0028] In this embodiment, the electrically insulating layer sealing structure covers the opening of the conductive shield. In other words, the electrically insulating layer sealing structure can seal the opening. This can seal the interior of the cavity, especially the conductive shield of the cavity, relative to the environment in an airtight manner. This can prevent the interior of the component carrier from being subjected to undesirable influences, such as corrosion and / or the ingress of dirt.

[0029] In another embodiment, the electrically insulating layer enclosure structure has an opening that is connected to the opening of the conductive shield. Therefore, it is possible to have an additional opening that is not connected to the first opening. Preferably, this opening overlaps with the shield opening; more preferably, the opening completely overlaps with or is flush with the shield opening. In this embodiment, pressure communication between the cavity and the outside of the component carrier can be achieved through the opening and the aperture, allowing pressure differences to be balanced without damaging the component carrier. If additional protection against corrosion and contaminants entering the cavity is required, the opening and aperture can be sealed using a flexible or elastic membrane.

[0030] In one embodiment, the opening opens to the outer side of the stack. Specifically, the opening can be configured to facilitate a slot antenna configuration. More specifically, the opening can be formed as an elongated slot in the conductive layer structure, thereby forming a slot antenna. In this context, the opening can additionally contribute to the functionality of the slot antenna.

[0031] In one embodiment, an additional opening is provided at the top of the first opening, and both openings are configured to increase the opening area towards the outer side of the stack. Specifically, the first and additional openings can contribute to a horn-shaped antenna configuration. For example, the additional opening can have a larger opening diameter than the first opening, and the first opening can have a larger opening diameter than the first opening, thus forming a horn-shaped stepped structure. The first and additional openings can form a stepped configuration that is wider at the outer joint of the component carrier compared to the inner joint of the cavity. Alternatively, tapered openings that increase towards the outer side of the stack can be provided to form a conical or frustoconical horn-shaped antenna. Therefore, the tapered opening can be configured as a frustoconical opening. This tapered opening arrangement can be wider at the outer joint of the component carrier compared to the inner joint of the cavity. This can provide the advantage of easily providing sufficient antenna delivery directivity for radio frequency by applying manufacturing processes associated with the component carrier.

[0032] In one embodiment, the stack includes at least one additional electrically insulating layer structure disposed on top of the electrically insulating layer enclosure structure. The characteristics of the antenna can be further improved, modified, or altered by such one or more additional electrically insulating layer structures. Furthermore, the shape of the external opening can be improved by patterning the at least one additional electrically insulating layer structure.

[0033] In one embodiment, additional openings are at least partially provided within the at least one additional electrical insulating layer structure. The openings and additional openings can be formed flush with each other, thereby affecting antenna functionality.

[0034] In one embodiment, the at least one additional electrical insulating layer structure seals the opening and / or other openings. This protects the cavity from external influences, such as moisture or dust.

[0035] In one embodiment, the stack includes an electrically conductive layer structure on top of the stacked portion that defines the cavity. Specifically, the electrically conductive layer structure may be disposed between the stacked portion and the electrically insulating closure structure. Preferably, the electrically conductive layer structure defines the top end of the conductive shield and / or the opening of the conductive shield. This can provide the advantage of further reducing frequency propagation loss within the cavity (especially radio frequency).

[0036] In one embodiment, the stack includes an additional electrically conductive layer structure located between the insulating layer enclosure structure and the at least one other electrically insulating layer structure. This can be advantageous in the case of using a slotted antenna for fine-tuning directivity, bandwidth, and radiation efficiency.

[0037] In one embodiment, the conductive layer structure located above the opening in the conductive shielding portion among the multiple conductive layer structures has a functional opening. This functional opening can facilitate the formation of a slotted antenna configuration for the antenna.

[0038] More generally, the antenna can be constructed as a slot antenna. A slot antenna can be formed as a structured metal surface, preferably a metal foil or deposited metal layer of a laminate, in which one or more slot-shaped openings are formed, wherein the structured metal defines the boundaries of the slot antenna. When the structured metal layer is driven as an antenna by an applied radio frequency signal, the slot radiates electromagnetic waves in a manner similar to a dipole antenna. The shape and size of the one or more slots, as well as the driving frequency, determine the radiation mode. Integrating a slot antenna into a laminated stack is a good fit because the planar characteristics of the slot antenna correspond to the planar characteristics of the stack.

[0039] In an embodiment, the conductive layer structure positioned above the opening of the conductive shield and adjacent conductive layer structures are connected to each other via at least one vertical through-connection. Specifically, the two conductive layer structures can be connected via multiple vertical through-connections arranged around a functional opening that facilitates the formation of a slot antenna configuration. Therefore, the conductive layer structure forming the top portion of the conductive shield can be connected to another conductive layer structure located on top of it. The conductive layer structures can be spaced apart by an electrically insulating layer enclosure, and the aforementioned electrical connections can be achieved via one or more vertical through-connections, such as copper-filled (e.g., laser) vias. Connecting the two conductive layer structures via vertical through-connections prevents floating potentials. This can have an additional positive impact on signal loss and signal integrity. The two conductive layer structures can be spaced apart vertically by an electrically insulating layer structure and interconnected via one or more vertical through-connections.

[0040] In this implementation, the circumferential walls of the opening and / or the circumferential walls of other openings are shielded by a conductive material (e.g., copper). Specifically, the openings and other openings can be flush with each other and can form a stepped configuration. The sidewalls of the openings coated with conductive material can realize a horn-shaped antenna.

[0041] More generally, antennas can be constructed as horn antennas. A horn antenna can represent an antenna configuration formed by a flared metal structure shaped to resemble a horn with a stepped or tapered geometry, thereby guiding radio waves in a beam-like manner. The advantages of horn antennas include moderate directivity, wide bandwidth, low loss, and simple structure and adjustment. Laminated stacks, along with options such as patterning available in printed circuit board technology and depositing metal on the sidewalls, provide an excellent basis for forming horn antennas incorporated within such laminated stacks.

[0042] In one embodiment, the component carrier includes an RF filter structure configured as the top portion of the stack. This frequency filter allows for precise adjustment of the target frequency or target frequency range, thereby enabling high-precision signal transmission.

[0043] In one embodiment, the component carrier includes an RF lens component, which is surface-mounted on top of the stack. The RF lens component may be an SMD (Surface Mount Device) component, rather than being integrated into the stack. This allows for the focusing of transmitted and / or received RF waves. This enables improved signal transmission. Alternatively, as an alternative to a surface-mount RF lens component, another embodiment may integrate the RF lens into the stack.

[0044] In this implementation, the opening is a slot, and the functional opening is another slot. Optionally, in a top view of the stack, the slot and the other slot are inclined relative to each other. By constructing the top-side opening in the conductive shield and the functional opening above it as slots (i.e., elongated holes, for example, having an aspect ratio of at least 1.5, preferably at least 3), the shape and size of the slots can be designed to adjust for desired RF characteristics. The inclination angle between the opening and the functional opening can be a powerful design parameter for fine-tuning the RF characteristics.

[0045] In one embodiment, the conductive shield has a plurality of openings located at the top end of the cavity along the stacking direction, the openings being vertically associated with an antenna disposed on top of the opening and / or an antenna disposed at the opening. Optionally, in a top view of the stack, these openings are inclined relative to each other. In particular, the number, shape, and mutual orientation of the plurality of openings located on the top side of the conductive shield can be adjusted to set the target characteristics of the waveguide and / or antenna.

[0046] In one embodiment, the conductive shield includes an additional opening located at the bottom end of the cavity along the stacking direction. This additional opening may form a feed structure or be part of a feed structure for feeding electromagnetic signals into the cavity for subsequent transmission of radio frequency waves by an antenna. Preferably, the additional opening is opposite to the opening at the top end. These openings may be functionally cooperative and / or geometrically aligned with each other. More generally, these openings may be aligned, misaligned, offset, and / or rotated relative to each other.

[0047] In this implementation, the opening is a slot, and the additional opening is another slot. Optionally, in a top view of the stack, the slot and the other slot are inclined relative to each other. By constructing the top-side opening and bottom-side opening in the conductive shield as slots (i.e., as elongated holes, for example, having an aspect ratio of at least 1.5, preferably at least 3), the shape and size of the slots can be designed to adjust for desired RF characteristics. The inclination angle between the opening and the other opening can be a powerful design parameter for fine-tuning the RF characteristics.

[0048] In this embodiment, the central portion of the cavity surface and the central portion of the opening surface are aligned according to a planar tolerance range of less than 100 μm, preferably less than 50 μm. This alignment can be relative to their respective centroids. Through the aligned openings located on the bottom and top sides of the conductive shield, radio frequency can be precisely coupled into and out of the cavity.

[0049] In one embodiment, the cavity has a stepped edge that extends the extent of the cavity (see [reference]). Figure 17 This can have a positive impact on the waveguide function of the cavity. The stepped shape can be located at at least one of the top and bottom ends of the cavity. Preferably, the cross-sectional extension occurs along the linear and planar extension of the cavity. In particular, the stepped edge can be located at the top end of the cavity.

[0050] In this implementation, the stepped edge is covered by an electrically conductive structure, particularly at least partially by a conductive shield. This electrically conductive structure ensures continuous metal coverage at the stepped edge, which can positively impact radio frequency losses.

[0051] In this implementation, the width of the cavity from one end of the stepped edge to the opposite end, minus the average width of the cavity (which can be the arithmetic mean of the horizontal extension of the cavity over its entire vertical extension), divided by the average width of the cavity, is in the range of 0.001% to 20%, particularly in the range of 0.1% to 10%. For example, the lateral extension of the cavity at the stepped edge (i.e., the extension beyond one corner of the rectangular cavity cross-section) has a maximum distance of no more than 250 μm, particularly no more than 100 μm. Even if the stepped region is small compared to the overall cavity size, the effect of the stepped region on the RF loss characteristics of the waveguide-antenna structure can be significant.

[0052] In an embodiment, the component carrier includes a conductive connection medium portion surrounding a circumferential portion of the cavity, particularly surrounding a circumferential portion that encloses the top end of the cavity. For example, the conductive connection medium portion may be made of a solder structure or a sintered structure. The conductive connection medium portion may be disposed on the top and / or bottom of the cavity, particularly in one or more corner regions of the cavity. Descriptively, the conductive connection medium portion may cover weak points related to the metal covering around the cavity. These weak points may be particularly present in the corners of the cavity, where the conductive shielding may not be unintentionally completely sealed, or there may be stepped edges. The more reliably the conductive structure is sealed in the corners, the better the radio frequency transmission. Therefore, additional conductive structures can reduce radio frequency losses.

[0053] In one embodiment, the conductive connecting medium is electrically connected along the stacking direction to two electrically conductive layer structures, specifically including an upper electrically conductive layer structure located at the vertical height of the upper end of the cavity. In one embodiment, the coupling can be direct. In another embodiment, the coupling can be indirect, via a portion of the conductive shield. The aforementioned electrical coupling can prevent floating potentials within the component carrier.

[0054] In one embodiment, the lateral extension of the stepped edge is at least partially defined by the conductive connection medium. In particular, the conductive connection medium may cover or define at least a portion of the edge and / or at least a portion of the corner of the conductive shield.

[0055] In this embodiment, the roughness Ra of the conductive shield covering the top and / or bottom ends of the cavity is less than the roughness of the sidewalls of the conductive shield covering the circumferential walls of the cavity. Specifically, the roughness Ra of the conductive shield covering the top and / or bottom ends of the cavity can be between 0.01 μm and 1 μm, preferably between 0.1 μm and 0.4 μm. In particular, the roughness of the conductive shield surrounding the cavity can be adjusted for waveguide-antenna arrangements (see reference...). Figures 20 to 22 The signal loss (especially insertion loss) and / or phase shift of the waveguide-antenna are significantly affected. Therefore, a sufficiently smooth inner surface of the conductive shield can have a positive impact on waveguide-antenna performance. Without being bound by specific theories, it is currently believed that achieving small surface roughness can significantly suppress the unintended damping effects on RF signal transmission caused by the skin effect.

[0056] In one embodiment, the horizontal width of the cavity is greater than its vertical height. The vertical extension can be measured along the stacking direction, while the horizontal extension can be calculated perpendicular to the stacking direction. In the cross-section of the cavity extending along the unfolding direction (in the x / y and z directions), the direction can, for example, have a straight, segmented, curved, and / or indefinite extension.

[0057] In one implementation, the width is at least twice the height. The width can be at least three times the height. Furthermore, the width can be less than ten times the height, preferably less than seven times the height. Adjusting the aspect ratio can affect important waveguide-antenna characteristics, such as return loss and bandwidth.

[0058] In one embodiment, the cavity is configured for frequencies of at least 75 GHz. For example, the cavity has a width of less than 3 mm and a height of less than 1.5 mm. In another embodiment, the cavity can be adapted for other frequencies, such as frequencies of at least 10 GHz or at least 50 GHz.

[0059] In this embodiment, the cavity is filled with a dielectric material. Preferably, the dielectric material can be air, such that the cavity can be an air-filled waveguide. Alternatively, the cavity can be filled with a sponge and / or a dielectric material.

[0060] In one embodiment, the electrically conductive layer structure located at the bottom of the cavity includes a feed structure for coupling signals therebetween into and / or out of the waveguide. Therefore, an electrical transition between the waveguide and the stacked metal can be achieved.

[0061] In this embodiment, the component carrier is used for high-frequency applications above 1 GHz, particularly for high-frequency applications around 50 GHz. Especially at such high frequencies, signal transmission is particularly sensitive to artifacts caused by surface roughness due to the skin effect. The high performance of the component carrier according to an exemplary embodiment of the invention allows for low-loss signal transmission, even at such high frequency values.

[0062] In an embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate formed, in particular, by applying mechanical pressure and / or heat to the aforementioned one or more electrically insulating layer structures and one or more electrically conductive layer structures. The aforementioned stack can provide a plate-like component carrier that can provide a large mounting surface for other components while remaining very thin and compact.

[0063] In this implementation, the component carrier is shaped as a plate. This contributes to a compact design in which the component carrier still provides a large base for mounting components. Furthermore, bare wafers, particularly examples of embedded electronic components, can be easily embedded into thin plates, such as printed circuit boards, due to their small thickness.

[0064] In one embodiment, the component carrier is configured as one of a printed circuit board, a substrate (particularly an IC substrate), and an interposer.

[0065] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a plate-shaped component carrier formed by laminating multiple electrically conductive layer structures and multiple electrically insulating layer structures, for example, by means of applied pressure and / or supplied heat. As preferred materials for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may include resin and / or glass fiber, i.e., so-called prepreg or FR4 material. The various electrically conductive layer structures can be connected to each other in a desired manner by forming holes through the laminate, for example, by laser drilling or mechanical drilling, and partially or completely filling the holes with an electrically conductive material (particularly copper), thereby forming vias or any other through-hole connections. The filled holes connect the entire stack (through-hole connections extending through multiple layers or the entire stack), or the filled holes can connect at least two electrically conductive layers, referred to as vias. Similarly, optical interconnects can be formed through the various layers of the stack to receive electro-optical circuit boards (EOCBs). In addition to being able to embed one or more components within a printed circuit board, printed circuit boards are typically configured to house one or more components on one main surface or two opposing main surfaces of a board-shaped printed circuit board. The one or more components can be soldered to their respective main surfaces. The dielectric portions of the PCB may include resin with reinforcing fibers, such as glass fiber.

[0066] In the context of this application, the term "substrate" may specifically refer to a small component carrier. A substrate can be a relatively small component carrier relative to a PCB, on which one or more components can be mounted, and which can serve as a connection medium between one or more chips and another PCB. For example, a substrate may have approximately the same dimensions as the components (particularly electronic components) to be mounted thereon (e.g., in the case of chip-scale packages (CSPs)). More specifically, a substrate can be understood as a carrier for electrical connections or electrical networks, and a component carrier with a relatively high density of lateral and / or vertically arranged connections, comparable to a printed circuit board (PCB). Lateral connections are, for example, conductive paths, while vertical connections can be, for example, drilled holes. These lateral and / or vertical connections are arranged within the substrate and can be used to provide electrical, thermal, and / or mechanical connections for accommodated or unaccommodated components (e.g., bare wafers), particularly IC chips, to printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrate." The dielectric portion of the substrate may include a resin having reinforcing particles (e.g., reinforcing spheres, particularly glass spheres).

[0067] The substrate or interlayer may include or be composed of at least one of the following: glass; silicon (Si); and / or an image-enhancing or dry-etchable organic material, such as an epoxy-based laminate (e.g., an epoxy-based laminate film); or a polymer compound (which may or may not include photosensitive and / or thermosensitive molecules), such as polyimide or polybenzoxazole.

[0068] In embodiments, the at least one electrically insulating layer structure comprises at least one of the following: resins or polymers, such as epoxy resins, cyanate ester resins, benzocyclobutene resins, bismaleimide triazine resins, polyphenylene derivatives (e.g., based on polyphenylene ether, PPE), polyimide (PI), polyamide (PA), liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE), and / or combinations thereof. Reinforcing layer structures, such as those made of glass (multilayer glass), such as meshes, fibers, spheres, or other types of filler particles, can also be used to form composite materials. The semi-cured resin combined with the reinforcing agent, such as fibers impregnated with the aforementioned resins, is called a prepreg. These prepregs are typically named according to their properties, such as FR4 or FR5, which describe their flame-retardant properties. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based laminates (e.g., laminated films) or photosensitive dielectrics, can also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate ester resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low, very low or ultra-low DK materials can be used as electrical insulation structures in component carriers.

[0069] In an embodiment, the at least one electrically conductive layer structure comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. While copper is generally preferred, other materials or their coating schemes, particularly those coated with superconducting materials or conductive polymers, are also possible, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT).

[0070] At least one component may be selected from the following: non-electrically conductive inlays, electrically conductive inlays (e.g., metallic inlays, preferably copper or aluminum), heat transfer units (e.g., heat pipes), optical guiding elements (e.g., optical waveguides or optical conductor connectors), electronic components, or combinations thereof. The inlay may be, for example, a metal block (IMS inlay) with or without an insulating material coating, which may be embedded or surface-mounted for heat dissipation purposes. Suitable materials are defined by their thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides, and / or ceramics, such as copper, alumina (Al₂O₃), or aluminum nitride (AlN). Other geometries with increased surface area are also frequently used to improve heat exchange capacity. In addition, components can be active electronic components (having at least one implemented pn junction), passive electronic components such as resistors, inductors, or capacitors, electronic chips, storage devices (e.g., DRAM or another data memory), filters, integrated circuits (e.g., field-programmable gate arrays (FPGAs), programmable array logic (PALs), general-purpose array logic (GALs), and complex programmable logic devices (CPLDs)), signal processing components, power management components (e.g., field-effect transistors (FETs), metal-oxide-semiconductor field-effect transistors (MOSFETs), complementary metal-oxide-semiconductor (CMOS) transistors, junction field-effect transistors (JFETs), or insulators. Gate field-effect transistors (IGFETs), all based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), and / or any other suitable inorganic compound, are used in optoelectronic interface elements, light-emitting diodes, optocouplers, voltage converters (e.g., DC / DC converters or AC / DC converters), cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components can be embedded in component carriers. For example, magnetic elements can be used as components. Such magnetic elements can be permanent magnets (e.g., ferromagnetic, antiferromagnetic, multiferroic, or ferrimagnetic elements, such as ferrite cores) or paramagnetic elements. However, components can also be IC substrates, interposers, or other component carriers, such as those in a board-in-board configuration. Components may be surface-mounted onto a component carrier and / or embedded within the component carrier. Furthermore, other components, particularly those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment, may also be used as components.

[0071] In one embodiment, the component carrier is a laminated component carrier. In this embodiment, the component carrier is a multilayered composition that is stacked and connected together by applying pressure and / or heat.

[0072] After the internal layer structure of the component carrier has been treated, one or more additional electrically insulating and / or electrically conductive layer structures can be used to cover one main surface or two opposite main surfaces of the treated layer structure in a symmetrical or asymmetrical manner (particularly by lamination). In other words, stacking can continue until the desired number of layers is obtained.

[0073] After the stacked structure of the electrical insulation layer and the electrical conductivity layer is formed, the surface of the obtained layer structure or component carrier can be treated.

[0074] Specifically, regarding surface treatment, an electrically insulating solder resist can be applied to one or both opposing main surfaces of the laminate or component carrier. For example, this solder resist can be formed over the entire main surface, and the resist layer can then be patterned to expose one or more electrically conductive surface portions that will be used to electrically connect the component carrier to electronic peripherals. The surface portions of the component carrier still covered with solder resist, particularly those containing copper, can be effectively protected against oxidation or corrosion.

[0075] Regarding surface treatment, a surface treatment portion can also be selectively applied to the exposed electrically conductive surface portion of the component carrier. This surface treatment portion can be an electrically conductive covering material on an exposed electrically conductive layer structure (such as pads, conductive traces, etc., particularly including or made of copper) on the surface of the component carrier. If this exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (especially copper) may be oxidized, resulting in lower reliability of the component carrier. The surface treatment portion can then be formed as a joint between, for example, a surface-mounted component and the component carrier. The surface treatment portion functions to protect the exposed electrically conductive layer structure (especially copper circuitry) and enables a connection process with one or more components, for example, by soldering. Examples of suitable materials for the surface treatment portion are organic solderable corrosion inhibitors (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (especially hard gold), electroless tin, nickel-gold, nickel-palladium, etc. Attached Figure Description

[0076] The above-defined aspects and other aspects of the present invention will become apparent from the examples of embodiments described below, and will be explained with reference to these examples of embodiments.

[0077] Figure 1 A cross-sectional view of a component carrier according to an exemplary embodiment of the present invention is shown.

[0078] Figure 2 A cross-sectional view of a component carrier according to another exemplary embodiment of the present invention is shown.

[0079] Figure 3 It shows according to Figure 2 A top view of a component carrier of an exemplary embodiment of the present invention.

[0080] Figure 4 A cross-sectional view of a component carrier according to another exemplary embodiment of the present invention is shown.

[0081] Figure 5 A cross-sectional view of a component carrier according to another exemplary embodiment of the present invention is shown.

[0082] Figure 6 A cross-sectional view of a component carrier according to another exemplary embodiment of the present invention is shown.

[0083] Figures 7 to 9 A cross-sectional view of a structure obtained during the execution of a method for manufacturing a component carrier according to an exemplary embodiment of the present invention is shown.

[0084] Figure 10 A three-dimensional view of a component carrier according to an exemplary embodiment of the present invention is shown.

[0085] Figure 11 A cross-sectional view of a component carrier according to another exemplary embodiment of the present invention is shown.

[0086] Figure 12 A cross-sectional view of a component carrier according to another exemplary embodiment of the present invention is shown.

[0087] Figure 13 A screenshot image of a component carrier according to an exemplary embodiment of the present invention is shown.

[0088] Figure 14 A screenshot image of a component carrier according to an exemplary embodiment of the present invention is shown.

[0089] Figure 15 A screenshot image of a component carrier according to an exemplary embodiment of the present invention is shown.

[0090] Figure 16 A screenshot image of a component carrier according to an exemplary embodiment of the present invention is shown.

[0091] Figure 17A three-dimensional view and cross-sectional view of the conductive shielding portion surrounding the cavity of a component carrier according to another exemplary embodiment of the present invention are shown.

[0092] Figure 18 A graph is shown indicating the return loss of a component carrier according to an exemplary embodiment of the present invention as a function of frequency.

[0093] Figure 19 A graph is shown indicating the return loss of a component carrier according to another exemplary embodiment of the present invention as a function of frequency.

[0094] Figure 20 A graph is shown indicating the insertion loss of a component carrier according to an exemplary embodiment of the present invention as a function of frequency.

[0095] Figure 21 A graph is shown indicating the phase shift of a component carrier according to an exemplary embodiment of the present invention as a function of frequency.

[0096] Figure 22 A graph is shown indicating the variation of wear of a component carrier with roughness according to an exemplary embodiment of the present invention.

[0097] Figure 23 A cross-sectional view of a component carrier according to another exemplary embodiment of the present invention is shown.

[0098] Figure 24 It shows according to Figure 23 A top view of the component carrier.

[0099] Figure 25 A cross-sectional view of a component carrier according to another exemplary embodiment of the present invention is shown. Detailed Implementation

[0100] The illustrations in the accompanying drawings are schematic. In different drawings, similar or identical elements are given the same reference numerals.

[0101] Before referring to the accompanying drawings, exemplary embodiments will be described in further detail, and some basic considerations that the exemplary embodiments of the present invention were developed based on these considerations will be summarized.

[0102] The push towards higher frequencies requires solutions that optimize loss performance and reduce structural size at the PCB level. However, conventional approaches primarily rely on molded polymer-based antennas (e.g., gapped antennas) that are subsequently metallized. These antennas are then assembled onto the PCB, thus requiring assembly and interconnect technologies.

[0103] According to an exemplary embodiment, a component carrier (e.g., a printed circuit board, PCB) can be formed based on a laminated stack, i.e., a laminated structure stack bonded by pressure and / or heat. A cavity can be formed as a hollow volume portion located within the stack, defined by circumferential walls (which may include side walls, a bottom wall, and a top wall). The circumferential walls may be partially lined with electrically conductive shielding for enhancing electromagnetic wave transmission. Preferably, the conductivity of the electrically conductive shielding is higher than 10. 7 S / m (at 20°C). The top-side opening of the shield facilitates electromagnetic coupling between the waveguide-cavity and the top-side antenna. Therefore, the opening and antenna can be vertically associated to achieve excellent electromagnetic coupling between them. This component carrier can be manufactured with low workload and small space consumption, and exhibits advantageous characteristics in terms of electromagnetic coupling. Further advantages, such as high bandwidth, well-defined directivity, and / or high radiation efficiency, can also be achieved. Thus, a component carrier with excellent high-frequency characteristics can be obtained. In short, exemplary embodiments of the present invention provide a waveguide antenna at the PCB level, i.e., the waveguide antenna is formed as part of a layered stack and coupled above the waveguide cavity.

[0104] In favorable configurations, the ratio between the cavity height and width can be adjusted to modify the bandwidth and / or return loss characteristics of the waveguide cavity. It has been found that a smaller cavity aspect ratio favors higher bandwidth, while a larger aspect ratio achieves lower return loss. By adjusting the cavity dimensions, the component carrier can be modified in terms of the cavity aspect ratio, which may affect bandwidth and / or return loss characteristics.

[0105] In particular, exemplary embodiments of the present invention provide a combination of a slotted waveguide antenna and a waveguide integrated with an air-filled substrate (see in particular). Figure 1 and Figure 2 However, other implementations provide horn-shaped antennas (see, for example...). Figure 6 Combinations are possible.

[0106] More specifically, exemplary embodiments of the present invention provide waveguide-based antennas at the PCB level as an integrated solution. In particular, both the cavity and the antenna can form components of a laminated stack of a component carrier according to an exemplary embodiment of the present invention. According to an exemplary embodiment of the present invention, separate SMD assembly of the antenna is not required because the antenna of the component carrier of the embodiment can be manufactured directly at the PCB level, i.e., in-situ fabrication within the stack. For example, the antenna of the component carrier of an exemplary embodiment of the present invention can be manufactured using slots or openings connected to the waveguide obtained in a hollow structure. Such waveguide-fed slot antennas may be preferred over conventional molded waveguide antennas. According to the exemplary embodiment, this can provide the advantages of improved loss performance and improved mechanical reliability, considering the absence of additional assembly techniques. Therefore, exemplary embodiments of the present invention can combine the antenna and feed structure by implementing a hollow structure in conjunction with slots and transition structures within a laminate of the component carrier. One or more slots that can be used as antennas can be obtained directly from the hollow structure (see reference...). Figure 1 Alternatively, the recess is applied to an additional copper layer separated from the hollow structure by a dielectric material (see [reference]). Figure 2 Preferably, but not necessarily, the latter embodiment may have a low-Dk material sandwiched between the hollow structure and / or an additional electrical layer.

[0107] Therefore, exemplary embodiments of the present invention can provide an integrated solution for antennas and waveguide cavities combined with stacked components, thereby allowing waveguide antennas to be fabricated at the component carrier (especially PCB) level, and further allowing for antenna miniaturization. In this context, a hollow structure with openings can be implemented inside the component carrier (e.g., PCB).

[0108] Exemplary embodiments can allow direct feeding of air-filled substrate-integrated waveguides (AFSIW) without loss due to the absence of transition. Furthermore, component carriers according to exemplary embodiments can exhibit high mechanical reliability, low-loss performance, and / or small size. Exemplary embodiments are also compatible with and scalable to millimeter-wave devices. In addition, component carriers according to exemplary embodiments of the present invention are compatible with embedded components, surface mount devices, and IC substrates. Due to the waveguide-cavity and stacked antenna design of the component carriers according to exemplary embodiments of the present invention, simple dielectric materials are sufficient. Compared to conventional methods, complex and expensive high-frequency optimized materials (such as low-Dk materials, Rogers materials, etc.) are significantly reduced. TM Materials (such as RO3003, etc.) may be unnecessary or can be reduced.

[0109] An exemplary application of the exemplary embodiments of the present invention is a millimeter-wave device, operating, for example, at 77 GHz or above, or even 140 GHz or above. For example, such a component carrier can be configured for 5G or 6G applications, radar applications, etc. Other advantageous applications of the exemplary embodiments may be component carriers with sensing and / or motion detection capabilities. When operating in lower millimeter-wave spectra, the waveguide cavity of the component carrier of the exemplary embodiments of the present invention can be implemented in a half-mode manner. A specific application of the component carrier according to the exemplary embodiments is a 77 GHz hollow waveguide-feed slot antenna for automotive radar devices.

[0110] Advantageously, the waveguide antenna of the exemplary embodiment can be integrated into a component carrier stack, for example, at the PCB level. The exemplary embodiment can provide an integrated solution with a radio frequency (RF) board, feed structure, and antenna integrated in a common component carrier stack.

[0111] According to an exemplary embodiment of the present invention, a slotted waveguide antenna with stacked components can be combined with an air-filled substrate-bonded waveguide. This can provide low radio frequency loss. For example, this may make the component carrier highly suitable for radar applications or other applications operating across multiple frequency ranges.

[0112] In one implementation, an air-filled substrate-integrated waveguide in the form of a cavity with conductive shielding can be combined with a slot antenna to achieve improved signal integrity and low loss. More specifically, a PCB-integrated slot antenna can allow for significant loss reduction. The integrated waveguide-type metallized cavity can provide very high power handling capability.

[0113] To transmit electromagnetic signals with high performance, the component carrier may include an antenna formed as part of a stack, rather than a surface-mount device. A particularly preferred option is a combination of a slot antenna and a metallized cavity in the form of an air-filled substrate combined with a waveguide. This allows for excellent antenna performance in terms of bandwidth, gain, radiation efficiency, and beam pattern. To form such a combination of antenna and air-filled substrate combined with a waveguide in the form of a metallized cavity, special high-frequency dielectric materials are not required (but may be selectively implemented to further improve performance). This is likely because the small amount of dielectric material surrounding the antenna is negligible. The antenna (preferably a slot antenna) can be formed during PCB manufacturing, for example, by an etching process or laser processing. Alternatively, additive processes, such as plating and / or physical or chemical vapor deposition, can be used. This allows for a simple manufacturing process.

[0114] Depending on the desired or required beam pattern, the antenna can be easily expanded by adjusting the number of radiating slots and / or the distance between them. This scalable system allows the antenna design to be freely adapted to various applications, such as automotive radar, telecommunications, etc.

[0115] High mechanical stability can be achieved because the transmitting and radiating components can be manufactured together in a single component carrier. When both the antenna and the metallized cavity are integrated into the same stack, an integrated solution for forming the RF front-end system can be provided.

[0116] Figure 1 A cross-sectional view of a component carrier 100 according to an exemplary embodiment of the present invention is shown. In the illustrated embodiment, the component carrier 100 is implemented as a printed circuit board (PCB). However, the component carrier 100 may also be an integrated circuit (IC) substrate, etc.

[0117] according to Figure 1 The component carrier 100 includes a laminated, layered stack 102 comprising multiple electrically conductive layer structures 150 and multiple electrically insulating layer structures 152. The electrically conductive layer structures 150 may include patterned copper layers that can form horizontal antenna structures, horizontal shielding structures, horizontal pads, and / or horizontal wiring structures. Furthermore, the electrically conductive layer structures 150 may include vertical through-holes, such as copper pillars and / or copper-filled laser vias. Additionally or alternatively, mechanically plated through-holes (PTHs) may also be used as vertical through-holes. Additionally, the stack 102 of the component carrier 100 may include one or more electrically insulating layer structures 152 (e.g., one or more prepreg sheets, resin sheets, or cores made of FR4). Ajinomoto Stacked Film® (ABF) material may also be used for at least a portion of the electrically insulating layer structures 152, particularly when the component carrier 100 is implemented as an IC substrate. Surface treatments (such as ENIG or ENEPIG, solder resist, etc.) may also be optionally applied to the top and / or bottom sides of the stack 102 (not shown).

[0118] For example, the electrically conductive layer structure 150, which can be implemented as a copper layer, can have a thickness in the range of 5 μm to 200 μm, such as 20 μm to 30 μm. Some electrically insulating layer structures in the electrically insulating layer structure 152 can be prepreg layers with a thickness in the range of 20 μm to 300 μm, such as 60 μm to 100 μm. Other electrically insulating layer structures in the electrically insulating layer structure 152 can be core layers made of FR4 with a thickness in the range of 50 μm to 1000 μm, such as 150 μm to 400 μm.

[0119] Furthermore, the cavity 104 is formed as a hollow volume portion filled with air within the stacked member 102. In the illustrated embodiment, the cavity 104 is filled with air. Therefore, according to Figure 1 An air-filled waveguide structure can be provided incorporating the stack 102. Alternatively, another medium, such as a dielectric solid or sponge, can be filled into the waveguide cavity 104. The cavity 104 can be defined from the stack 102 by circumferential walls, which may include circumferentially closed sidewalls as well as bottom and top walls. An electrically conductive shield 106, such as a copper-coated portion or a coating made of another metallic material, can cover the main portion of the circumferential walls of the cavity 104. More specifically, the electrically conductive shield 106 can cover the entire circumferential wall except for the bottom side opening 132 and the top side opening 110.

[0120] The cavity 104, having a metal liner according to reference numeral 106, can be formed into an air-filled waveguide to constitute a Faraday cage for electromagnetic radio frequency waves. Advantageously, the waveguide-type cavity 104 incorporated in the stack 102 achieves a compact design and high power handling capability.

[0121] In addition, an antenna 108 (or antenna structure) is provided, which is integrated into the stack 102. This further facilitates the compact design of the component carrier 100. Figure 1 In the middle, antenna 108 may be defined by the uppermost electrically conductive layer structure 122, which has an elongated slot (see, for example, see...). Figure 10 ) or more such elongated slots (see again) Figure 10 The graphical representation of the copper layer. (Still referencing...) Figure 1 As can be seen, the conductive shielding portion 106 has an opening 110 at the top end of the cavity 104 along the stacking direction 112. The top portion of the conductive shielding portion 106 can simultaneously form part of the antenna 108. The opening 110 is vertically associated with the antenna 108 disposed at the opening 110. In the illustrated configuration, the antenna 108 can be implemented as a slot antenna 108'. More specifically, the opening 110 can define an elongated slot having a length L greater than the width W of the elongated slot (see again). Figure 10 For example, the aspect ratio W / L of one or more slots can be at least 2, for example, at least 4. For example, the length L of the antenna slot can be in the range of 1 mm to 5 mm, for example, 2 mm. For example, the width W of the antenna slot can be in the range of 100 μm to 1 mm, for example, in the range of 200 μm to 700 μm. Forming the slot-shaped opening 110 can achieve low radiation loss. The combination of the described antenna design and waveguide design can realize a resonator configuration for high-frequency electromagnetic radiation. Figure 1The 108' slot antenna design allows for a significant reduction in losses. In short, Figure 1 The slotted antenna 108' is implemented as an open copper layer with one or more elongated slots.

[0122] exist Figure 1 During operation of the component carrier 100, high-frequency signals (e.g., having a frequency of 10 GHz or higher, such as 77 GHz) can be coupled into the cavity 104 via a feed structure 154, which forms part of the electrically conductive layer structure 150 and is disposed below the bottom wall of the cavity 104. Similarly... Figure 1 As shown, the conductive shielding portion 106 includes an additional opening 132 located at the bottom end of the cavity 104 along the stacking direction 112, and this additional opening 132 is associated with the feed structure 154. At the additional opening 132, the feed structure 154 is formed to couple electromagnetic waves into the waveguide cavity 104. In short, electromagnetic signals are fed into the cavity 104 at the bottom of the waveguide via the feed structure 154. The high-frequency signals coupled into the cavity 104 can be generated, for example, by at least one electronic component (not shown), such as one or more semiconductor chips, which can be embedded inside the stack 102 and / or surface-mounted on top of the stack 102. Such semiconductor chips can also be mounted on an IC substrate, which can be formed on the stack 102 or provided separately from the stack 102. After being coupled from the feed structure 154 into the cavity 104, the electromagnetic signals can be applied to the antenna 108 for wireless transmission into the environment of the component carrier 100.

[0123] Alternatively, high-frequency signals propagating in the environment of component carrier 100 can be captured by antenna 108, coupled into cavity 104, and further transmitted to an electrically conductive layer structure located at the bottom of cavity 104, and from said electrically conductive layer structure to a intended destination (e.g., an electronic component such as a semiconductor chip) for further processing.

[0124] Therefore, the component carrier 100 can be configured as an RF transmitter, an RF receiver, or an RF transceiver (i.e., a combined transmitter and receiver). Multiple cavity-antenna configurations can also be provided in the same stack 102, for example, arranged side by side and spaced laterally by the stack material.

[0125] Furthermore, the stack 102 includes an electrically insulating layer closure structure 114 (e.g., made of a core material such as FR4) disposed at the top end of the cavity 104. The electrically insulating layer closure structure 114 has an opening 116 that is directly connected to the opening 110 of the conductive shield 106. Figure 1In this configuration, the opening 116 has a diameter larger than that of the opening 110. As shown, the opening 116 leads to the outer side of the stack 102 and helps to form the slot antenna 108'.

[0126] Similarly, Figure 1 As shown, the opening 116 may be formed only in one electrically insulating layer structure 152 of the stack 102, and may have horizontal and vertical sidewalls defined by said electrically insulating layer structure 152. This avoids any problems with metal surface oxidation or corrosion regarding the opening 116 and its contribution to radio frequency wave processing. Alternatively, a portion of an adjacent electrically conductive layer structure 150 may also define the opening 116, which may be advantageous in terms of radiation performance.

[0127] As shown, the stack 102 includes an electrically conductive layer structure 122 located between the stacked portion and the electrically insulating layer enclosure structure 114 on top of the stacked portion defining the cavity 104. An opening 110 is formed in the electrically conductive layer structure 122 to form a slot antenna 108'.

[0128] Preferably, the central portions of the surfaces of cavity 104 and opening 110 are aligned in the horizontal direction according to a planar tolerance range of less than 50 μm. This allows for alignment according to... Figure 1 High performance of the combined waveguide-antenna structure with stacked components.

[0129] also, Figure 1 A conductive connecting medium portion 142 is shown in the circumferential portion surrounding the cavity 104. Figure 1 In this configuration, the conductive connection medium portion 142 is arranged to surround a circumferential portion that closes the top end of the cavity 104. Preferably, the conductive connection medium portion 142 is made of a solder structure (e.g., comprising tin and / or antimony and / or bismuth and / or silver and / or zinc) or a sintered structure (e.g., copper and / or silver and / or gold and / or oxides of the listed metals or combinations thereof). The conductive connection medium portion 142 should have high conductivity, particularly above 10. 6The conductivity S / m (at 20°C) is used to aid in the shielding function of the conductive shield 106. A dielectric structure 162 is arranged below the conductive connection medium 142 and laterally adjacent to the conductive shield 106. The dielectric structure 162 can be made of a stacked dielectric (e.g., a plug-in paste with a low coefficient of thermal expansion (CTE), but more generally, the stacked dielectric can be any material suitable for increasing height, such as prepreg for localized applications; copper can also be used as the stacking material). The conductive connection medium 142 is electrically connected, directly or indirectly via the conductive shield 106, to a plurality of electrically conductive layer structures stacked along the stacking direction 112 (see reference numerals 122, 144 in particular), including the upper electrically conductive layer structure 122 located at a vertical height at the upper end of the cavity 104.

[0130] Advantageously, the roughness Ra of the conductive shield 106 covering the horizontal top and bottom ends of the cavity 104 is less than the roughness of the vertical sidewalls of the conductive shield 106 covering the circumferential walls of the cavity 104. For example, the roughness Ra of the conductive shield 106 covering the top and bottom ends of the cavity 104 is in the range of 0.05 μm to 0.5 μm. This low roughness allows for low loss of the radio frequency signal. According to the skin effect, high-frequency signals propagate only in the thin skin layer of the electrically conductive structure. When the surface is very smooth, signal loss can be significantly reduced.

[0131] Figure 1 The advantages of the integrated slot antenna 108' and waveguide-cavity 104, formed by the component carrier 100 and its stacked components, are: ease of manufacture; no need for special cover materials; low workload manufacturability; and no air expansion issues. Furthermore, the various parts of the electrically conductive layer structure 150 and / or the electrically conductive shielding portion 106—especially those that may be in direct contact with the environment, such as air or water—can be covered with a protective structure, which can reduce or even prevent decomposition, such as oxidation. The protective structure can be a (e.g., continuous) layer of metal, such as silver or gold, and / or an electrically insulating material, such as glass or ceramic.

[0132] Figure 2 A cross-sectional view of a component carrier 100 according to another exemplary embodiment of the present invention is shown.

[0133] Figure 2 Implementation methods and Figure 1 The difference in the implementation method is particularly that, according to Figure 2The electrically insulating layer enclosure structure 114 covers and thereby closes the opening 110 of the conductive shielding portion 106. Preferably, the electrically insulating layer enclosure structure 114 may not contain reinforcing material, such as glass fiber or glass spheres (because this could cause losses between the waveguide and the antenna). Alternatively, if high mechanical strength is required, reinforcing material may be included in the electrically insulating layer structure. For example, Figure 2 The electrically insulating layer enclosure structure 114 is a continuous enclosure layer, rather than like... Figure 1 A patterned layer like the one in the diagram. However, when air expansion (e.g., during reflow) is a problem, additional venting openings can be formed in specific areas, which can then be covered with a membrane or the like to prevent corrosion. Thus, the electrically insulating sealing structure 114 completely encloses the cavity 104, thereby protecting it from environmental influences such as corrosion. Therefore, further improved signal loss protection can be achieved by completely enclosing the cavity 104 with a continuous electrically insulating sealing structure 114.

[0134] Accordingly, the uppermost conductive layer structure 126, which is positioned above the opening 110 of the conductive shield 106, has a functional opening 128. This can help form the slot antenna 108' configuration of the antenna 108. However, the conductive layer structure 122 with the slot opening 110 primarily defines the characteristics of the slot antenna 108'.

[0135] As shown, Figure 2 A slotted antenna 108' with full material coverage is provided. In the illustrated embodiment, the functional opening 128 has a larger extension than the opening 110. In addition to its low-loss performance, Figure 2 The implementation method also has the additional advantage of being very easy to manufacture.

[0136] Figure 3 The invention is shown Figure 2 A top view of a component carrier 100 of an exemplary embodiment of the type. According to... Figure 3Opening 110 is a slot, and functional opening 128 is another slot. As shown in the top view of the illustrated stack 102, the slot and the other slot are inclined relative to each other and (at least partially) overlap each other. A plurality of vertical through-connections 130, implemented here as copper-filled laser vias, are arranged around the functional opening 128 in the uppermost conductive layer structure 126. This can help form the slot antenna 108' configuration of the antenna 108. Preferably, the area of ​​opening 110 (in the top view of the illustrated stack 102) may not have vertical through-connections 130 (not shown). Alternatively, vias (or other vertical through-connections 130) may be arranged to provide a filtering function, for example, for frequency filtering of radio frequency waves.

[0137] Figure 4 A top view of a component carrier 100 according to another exemplary embodiment of the present invention is shown. Figure 5 A cross-sectional view of a component carrier 100 according to yet another exemplary embodiment of the present invention is shown.

[0138] exist Figure 4 In one embodiment, the conductive shield 106 has a plurality of openings 110 located at the top end of the cavity 104 along the stacking direction 112, the openings 110 being vertically associated with an antenna 108 disposed on top of the opening 110 and / or an antenna 108 disposed at the opening 110. The different openings in the openings 110 are inclined relative to each other. Furthermore, each opening in the openings 110 is a slot, and an additional opening 132 is another slot. As shown, in the top view of the illustrated stack 102, the slots and the additional slots are inclined relative to each other. In the illustrated embodiment, the bottom slot (i.e., the additional opening 132) and the top slot (i.e., the plurality of openings 110) do not necessarily have the same width and / or the same length, and can be inclined. Furthermore, the bottom slot can also be implemented as multiple slots, which may affect filtering characteristics. The nearest distance from the edge of the waveguide 104 to the opening 110 can be in the range of 100 μm to 400 μm.

[0139] Furthermore, the extension direction of opening 110 may not be parallel to the extension direction of functional opening 128 and / or antenna structure 108, but may be inclined relative to the extension direction of functional opening 128 and / or antenna structure 108 (see...). Figure 3 and Figure 4Alternatively, the extension direction of opening 110 may be parallel to the extension direction of functional opening 128 and / or antenna structure 108. Opening 110 and functional opening 128 may be laterally offset in the stacking direction 112 such that opening 110 and functional opening 128 overlap in a top view. The length and / or width and / or area of ​​cavity 104 perpendicular to the stacking direction 112 is smaller than the length and / or width and / or area of ​​the uppermost conductive layer structure 126. Alternatively, the length and / or width and / or area of ​​cavity 104 perpendicular to the stacking direction 112 may be equal to or greater than the length and / or width and / or area of ​​the uppermost conductive layer structure 126. Preferably, a plurality of vertical through-connections 130 may be arranged in the uppermost conductive layer structure 126 to at least partially surround functional opening 128 and / or opening 110.

[0140] Figure 4 , Figure 5 (as well as Figure 23 , Figure 24 The diagram illustrates a (waveguide-type) cavity 104 with a conductive shield 106. An opening 110 is present in the top layer of the conductive shield 106, functioning as a coupling slot. This opening 110 feeds a volume portion (optionally defined laterally by a vertical through-connection 130) located between the electrically conductive layer structure 122 and the uppermost electrically conductive layer structure 126, serving as a filter. The functional opening 128 (top slot) functions as an antenna (descriptively, as a radiating slot). The slots do not need to be vertically aligned; they can be offset to adjust performance. Typically, the opening 110 can be configured to function as a coupler and / or a filter.

[0141] Figure 6 A cross-sectional view of a component carrier 100 according to another exemplary embodiment of the present invention is shown.

[0142] Figure 6 Implementation methods and Figure 1 The difference in the implementation method is particularly that, according to Figure 6 An additional opening 118 is provided at the top of opening 116, and this additional opening 118 is connected to opening 116. Figure 6In this configuration, the opening 116 and the additional opening 118 are constructed to form a stepped structure, thereby increasing the opening area towards the outer side of the stack 102. This can form a horn antenna 108''' configuration for the antenna 108. The additional opening 118 is disposed in the uppermost additional electrical insulating layer structure 120. Furthermore, the circumferential walls of the opening 116 and the additional opening 118 are shielded by a conductive material portion 133, which forms a continuous stepped metal structure. Preferably, the conductive material portion 133 (which may be the same or different material as the material used for the conductive shielding portion 106) can cover the entire surface defining the openings 116, 118 in the electrical insulating enclosure structure 114 and the upper electrical insulating layer structure 120.

[0143] The stepped configuration of the described openings 116, 118 and the conductive material portion 133 thereon can... Figure 6 The antenna 108 is constructed as a horn-shaped antenna 108'''. This horn-shaped antenna 108''' can be used as a traveling wave antenna (instead of a resonator antenna). Figure 6 The implementation method can have a very large bandwidth. Therefore, Figure 6 The specific advantage of this implementation is the exceptionally high bandwidth supported by the design of the illustrated horn antenna 108'''.

[0144] In order to obtain a low-loss configuration, the exposed surface of the conductive material portion 133 should be very smooth. For example, the conductive material portion 133 should have a roughness Ra of less than 1 μm, preferably in the range of 0.1 μm to 0.4 μm.

[0145] Figure 6 Another advantageous option is shown: as illustrated, a membrane 166 (preferably a flexible or elastic membrane) can cover the opening 118. This protects the conductive shield 106 lining the cavity 104 from corrosion and prevents contaminants from entering the cavity 104. Simultaneously, the elastic or flexible properties of the membrane 166 allow pressure exchange between the inside and outside of the cavity 104. Without a membrane, according to... Figure 6 The exposed metal surfaces of the hollow volume portion within the component carrier 100 (e.g., the metal surfaces of structures shown by reference numerals 133 and 106 in the accompanying drawings) may be covered with a protective layer (not shown). This protective layer can provide corrosion protection and may advantageously be made of an electrically conductive material (e.g., nickel, gold, or silver). Alternatively, these surfaces may be covered with a thin glass layer. In other embodiments having an open cavity 104 (see...), Figure 1 It can also be equipped with a membrane 166 or a protective layer.

[0146] Figures 7 to 9A cross-sectional view of the structure obtained during the execution of a method for manufacturing a component carrier 100 according to an exemplary embodiment of the present invention is shown.

[0147] Reference Figure 7 This illustrates a series of partially unconnected layered structures that can be used to form Figures 1 to 6 The basis of the stacked component 102 in the implementation method. For example... Figure 7 As shown, the stack 102 can be composed of symmetrical lower sub-stacks 156 and symmetrical upper sub-stacks 158, and a low-flow or non-flowing prepreg layer 160 connecting the lower sub-stacks 156 and the upper sub-stacks 158. A symmetrical stack may be preferred for suppressing warping. However, asymmetrical sub-stacks can also be used to form a complete stack. Figure 7 The layer structure 150 of the upper sub-stack 158 and the layer structure 152 of the low-flow or non-flow prepreg layer 160 are pre-cut to pre-define the cavity 104.

[0148] Typically, prepreg materials can be at least partially uncured before lamination and can become flowable during lamination (i.e., when pressure and / or heat are applied) before permanent curing. However, this process can also cause flowable resin to undesirably flow into unwanted areas of the component carrier being constructed. Advantageously, when using a low-flow or non-flowable prepreg layer 160, this undesirable resin flow can be reduced or even completely prevented due to the chemical composition of such a low-flow or non-flowable prepreg layer 160.

[0149] After laminating the lower sub-staple 156 (formed from continuous layered structures 150, 152), the upper sub-staple 158, and the connecting low-flow or non-flowing prepreg layer 160 together, cavity 104 can be obtained.

[0150] Reference Figure 8The layer structures 150, 152 of each of the lower sub-stacking member 156, the upper sub-stacking member 158, and the connecting non-flowing prepreg layer 160 (or alternatively, a conventional prepreg layer) are continuous (i.e., may not be pre-cut). However, a non-adhesive layer 168, also referred to as a release layer, is formed on a portion of the top side of the lower sub-stacking member 156. Optionally, one or more overlapping reference portions 170 may be provided, for example, for alignment purposes. The dimensions of the non-adhesive layer 168 may correspond to the horizontal extension of the cavity 104 to be formed. After the lower sub-stacking member 156, the upper sub-stacking member 158, and the connecting low-flowing or non-flowing prepreg layer 160, having the non-adhesive layer 168, are laminated together, a laser beam or mechanical device can cut out a piece of the stack material above the non-adhesive layer 168 in the circumferential direction. Given the poor adhesion properties of the poor adhesion layer 168, the part can then be removed from the stack 102, and the cavity 104 can be obtained. The exposed poor adhesion layer 168 can then be removed, for example, by peeling.

[0151] Reference Figure 9 A stack 102 having a cavity 104 is shown, which can be, for example, by performing Figure 7 or Figure 8 The manufacturing process is as follows. Furthermore, the exposed surfaces of cavity 104—except for opening 132—can be coated with conductive shielding 106 to obtain… Figure 9 The structure shown is an example of this. This can be accomplished, for instance, by plating or sputtering.

[0152] Furthermore, one or more drill holes 172, 174 may be formed in the stack 102. For example, drill hole 172 may be formed by a local mechanical drilling process. For example, drill hole 174 may be obtained by global X-ray drilling.

[0153] Figure 10 A three-dimensional view of a component carrier 100 according to an exemplary embodiment of the present invention is shown. Figure 10 The implementation can be achieved as a design with a slotted antenna 108', as described above. Figure 1 or Figure 2As described. In the illustrated embodiment, four slot antennas 108' are formed. However, depending on the requirements of a particular application, any other number of slot antennas 108' may be formed in the component carrier 100. For example, the ratio L / W of the slot length L to the width W may be at least 2, for example, at least 4. For example, the length L may be in the range of 1 mm to 5 mm. For example, the width W may be in the range of 100 μm to 1 mm. In the example, the ratio L / W of the length L to the width W of all slots may be the same. Alternatively, each ratio may be different from one or more other ratios. Additionally and / or alternatively, Figure 10 The implementation can be achieved by a design with an opening 110, as described above. Figure 4 As described. Thus, one or more openings 110 can function as coupling slots and / or a portion of a filter.

[0154] Figure 11 A cross-sectional view of a component carrier 100 according to another exemplary embodiment of the present invention is shown.

[0155] like Figure 11 As shown, the uppermost conductive layer structure 126 and the adjacent conductive layer structure 122 located above the opening 110 of the conductive shielding section 106 are connected to each other through a vertical through-connection 130—which is implemented here as a copper-filled laser via.

[0156] For example, the vertical through-connection 130 may have a maximum diameter in the range of 20 μm to 250 μm, preferably in the range of 50 μm to 150 μm. Furthermore, the vertical through-connections 130 may be spaced apart from each other by a distance in the range of 50 μm to 500 μm (wherein the distance may refer to the distance from center to center between adjacent vertical through-connections 130 in a top view of the component carrier 100). Additionally, the vertical through-connection 130 may be at a distance from the functional opening 128 of the antenna structure, a distance in the range of 20 μm to 200 μm (particularly regarding the closest point between the edge of the antenna structure 128 and the vertical through-connection 130). Furthermore, the taper of the vertical through-connection 130 may face from the inside of the stack 102 towards the outside of the stack 102, or from the outside of the stack 102 towards the inside of the stack 102. Alternatively, a closed conductive structure (i.e., made of copper) can completely surround the antenna structure 128 circumferentially. Furthermore, alternatively, an open conductive structure can partially surround the antenna structure 128; said open conductive structure may include circumferential structures preferably separated at a single point, defining a space between two consecutive ends; alternatively, multiple substructures spaced apart from each other can be arranged around the antenna structure 128. The spacing between two ends or two adjacent substructures in a direction perpendicular to the stacking direction 112 is preferably at least 5 μm. The conductive structure or conductive substructure can have a straight shape, such as an "I" or "L" shape and / or tapered sidewalls. In other words, the circumferential structure can be arranged as a cage-like member with a small portion of non-conductive material. The above alternatives can reduce signal loss.

[0157] Multiple vertical through-connections 130 are arranged to surround a functional opening 128 located in the uppermost conductive layer structure 126, which facilitates the formation of a slotted antenna 108' configuration of the antenna 108. Therefore, in Figure 11 In this structure, the functional opening 128, spatially separated from the cavity 104 by a closed, electrically insulating enclosure 114, serves as a slot defining the characteristics of the slotted antenna 108', i.e., as part of the antenna 108'. According to... Figure 11 The upper portion of the conductive shield 106 with an opening 110 (larger than the functional opening 128) serves as a transition opening layer, thereby achieving loose alignment. Figure 11 The functional opening 128 (smaller than the opening 110) is used as a radiating element and thus forms a slot antenna 108'.

[0158] also, Figure 11The height H and width B of cavity 104 are specified. The inventors have discovered that the height H and width B of cavity 104 are meaningful design parameters for adjusting the performance characteristics of component carrier 100. Therefore, proper dimensionalization of height H and width B can have a functional impact on bandwidth and / or return loss. More specifically, it has been found that reducing the ratio of height H to width B of cavity 104 can increase bandwidth, allowing the ratio H / B to be reduced until the bandwidth of electromagnetic wave transmission meets a predetermined bandwidth standard (e.g., until a target bandwidth is achieved). Additionally or alternatively, it has been found that increasing the ratio of height H to width B of cavity 104 can reduce return loss, allowing the ratio H / B to be increased until the return loss of electromagnetic wave transmission meets a predetermined return loss standard (e.g., until a target return loss is achieved).

[0159] exist Figure 11 In this embodiment, the horizontal width B of the cavity 104 is greater than the vertical height H of the cavity 104. For example, the width B can be selected to be at least twice, and particularly at least four times, the height H.

[0160] Alternatively, the dimensions H and B of cavity 104 can be configured to set a target frequency, such as at least 75 GHz. In this case, a suitable choice could be that cavity 104 has a width B of less than 3 mm and a height H of less than 1.5 mm.

[0161] Although Figure 11 Not shown, but the lens can be positioned on top of the stack 102 and above the antenna 108. This can increase the directivity of the transmitted signal. This is in Figure 25 As shown in the image.

[0162] Figure 12 A cross-sectional view of a component carrier 100 according to another exemplary embodiment of the present invention is shown.

[0163] Figure 12 Implementation methods and Figure 11 The difference in the implementation method is particularly that, according to Figure 12 The opening 128', which is spatially separated from the cavity 104 by the closed electrical insulation enclosure structure 114, is larger than the opening 110 in the conductive shielding portion 106. Therefore, the opening 110 serves as a... Figure 12 The slot is defined by the characteristics of the slotted antenna 108', that is, it is used as part of the antenna 108'. According to Figure 12 The opening 110 is smaller than the aperture 128', which enables the opening 110 to function as a slot antenna and prevents loss reduction by acting as a fence to keep the signal inside.

[0164] Reference Figure 11 and Figure 12 In this implementation, the vertical through-connection 130 connects the two uppermost conductive layer structures 122 and 126 to prevent floating potentials, which may have an additional positive impact on signal loss and signal integrity.

[0165] Figures 13 to 16 Each shows a cross-sectional image of a component carrier 100 or a portion thereof according to an exemplary embodiment of the present invention. At the top end of cavity 104 (see...) Figures 13 to 15 ) or at the bottom end of cavity 104 (see Figure 16 The stepped edge 140 is shown. A conductive connecting medium portion 142 (e.g., a sintered structure) surrounds the top end of the cavity 104. This will be referred to... Figure 17 Further detailed description.

[0166] Figure 17 A three-dimensional view (left) and a cross-sectional view (right) of the conductive shielding portion 106 surrounding the cavity 104 of the component carrier 100 according to another exemplary embodiment of the present invention are shown.

[0167] As shown, cavity 104 has a stepped edge 140 that extends the range of cavity 104. The stepped edge 140 is located at the top end of cavity 104 (but additionally or alternatively, in other embodiments, it may be located at the bottom end of cavity 104). The stepped edge 140 is covered by a conductive shield 106. The width C of cavity 104 from one end of the stepped edge 140 to the opposite end, minus the average width of cavity 104 (which may be the arithmetic mean over the vertical extension of cavity 104), divided by the average width of cavity 104, can be in the range of 0.1% to 10%, for example, 1%. For example, the lateral extension 146 of cavity 104 at the stepped edge 140 can have a maximum distance D not greater than 250 μm, particularly a maximum distance D not greater than 100 μm. Although in Figure 17 Not shown, but the lateral extension 146 of the stepped edge 140 can be at least partially made of Figures 13 to 15 The conductive connection medium portion 142 shown is defined. Preferably, the conductive connection medium portion 142 may have a wedge shape.

[0168] Figure 18 Figure 200 is shown, which indicates the variation of the return loss RL (plotted in dB along the vertical axis 204) of the component carrier 100 according to an exemplary embodiment of the present invention with frequency f (plotted in GHz along the horizontal axis 202).

[0169] Line 206 indicates the bandwidth required at a frequency of 4 GHz. Line 208 indicates a margin of 1 GHz on each side. Impedance bandwidth 210 can be -10 dB. From Figure 18 As can be seen, the configuration of cavity 104 and conductive shield 106 shown achieves a relatively narrow bandwidth. As indicated by arrow 212, manufacturing tolerances may cause a shift in bandwidth. Figure 18 The cavity design is based on a cavity with dimensions B=3.1mm and H=1.55mm.

[0170] Figure 19 Figure 220 is shown, which illustrates the variation of the return loss RL (plotted in dB along the vertical axis 204) of the component carrier 100 according to an exemplary embodiment of the present invention with frequency f (plotted in GHz along the horizontal axis 202). Figure 19 The cavity design is based on B=3.1 mm and H=0.5 mm.

[0171] like Figure 19 As shown, the slotted waveguide antenna with reduced height achieves wider impedance matching. A wave impedance closer to that in air can be obtained, covering the entire bandwidth (-10 dB).

[0172] Figure 20 Figure 230 is shown, illustrating the variation of the insertion loss IL (plotted in dB along the vertical axis 234) of the component carrier 100 according to an exemplary embodiment of the present invention with frequency (plotted in GHz along the horizontal axis 202). Various curves are shown for different values ​​of the copper roughness "r" (corresponding to the Ra value) of the conductive shield 106. As shown, low roughness achieves low insertion loss.

[0173] Figure 21 Figure 240 is shown, illustrating the variation of the phase shift PS (plotted along the vertical axis 244 in deg / cm) of the component carrier 100 according to an exemplary embodiment of the present invention with frequency (plotted along the horizontal axis 202 in GHz). Various curves are shown for different values ​​of the copper roughness "r" (corresponding to the Ra value) of the conductive shield 106. As shown, low roughness achieves low phase shift.

[0174] Figure 22 Figure 250 is shown, illustrating the variation of the loss LO (plotted in dB along the vertical axis 254) of the component carrier 100 according to an exemplary embodiment of the present invention with the roughness Ra (plotted in μm along the horizontal axis 252). The target loss is plotted by reference numeral 256. As shown, lower loss can be obtained with lower roughness.

[0175] Figure 23 A cross-sectional view of a component carrier 100 according to another exemplary embodiment of the present invention is shown. Figure 24 It shows according to Figure 23 The diagram shows a top view of the component carrier 100. This embodiment achieves an RF filtering effect. More specifically, the component carrier 100 shown includes an RF filtering structure 180 configured as the top portion of a stack 102. The RF filtering structure 180 shown is formed of patterned metal layers, such as one or more electrically conductive layer structures 122, 126, 152 connected to each other by vertical through-connections 130. Alternatively, the filtering structure 180 may not have vertical through-connections 130. Design—particularly the number of electrically conductive layer structures and / or the location of the vertical through-connections—can affect the filtering efficiency of the filtering structure 180. Furthermore, the filtering structure may be able to filter one and / or at least two frequencies.

[0176] Figure 25 A cross-sectional view of a component carrier 100 according to another exemplary embodiment of the present invention is shown. This embodiment realizes a lens. More specifically, the component carrier 100 shown includes an RF lens component 182 surface-mounted on top of a stack 102. Since the RF lens component 182 may have significant dimensions to provide strong focusing of RF waves, it is preferable to surface-mount the RF lens component 182 onto the top main surface of the stack 102. Preferably, the lens component 182 is positioned such that it can cover the antenna 108 and / or the functional opening 128. This can provide the advantage of physical and / or chemical sealing and / or protection of the antenna 108 and / or the functional opening 128. In a direction perpendicular to the stacking direction 112, the extension range of the lens component 182 can be greater than the extension range of the antenna 108 and / or the functional opening 128 and / or the cavity 104.

[0177] It should be noted that the term "comprising" does not exclude other elements or steps, and "a" or "the" does not exclude multiple. Elements described in conjunction with different embodiments may also be combined.

[0178] It should also be noted that the reference numerals in the claims should not be interpreted as limiting the scope of the claims.

[0179] The present invention is not limited to the preferred embodiments shown in the figures and described above. Rather, various variations using the illustrated solutions and principles of the invention are possible, even in fundamentally different implementations.

Claims

1. A component carrier (100), wherein, The component carrier (100) includes: The stack (102) includes a plurality of electrically conductive layer structures (150) and a plurality of electrically insulating layer structures (152); A cavity (104) is formed in the stack (102), and the cavity (104) is defined by a circumferential wall; A conductive shielding portion (106) covers the circumferential wall of the cavity (104); and Antenna (108), said antenna (108) is formed as part of said stack (102); The conductive shield (106) has an opening (110) located at the top end of the cavity (104) along the stacking direction (112), the opening (110) being associated in the vertical direction with the antenna (108) disposed on the top of the opening (110) and / or the antenna (108) disposed at the opening (110).

2. The component carrier (100) according to claim 1, wherein, The stacked component (102) includes an electrically insulating layer closure structure (114), which is disposed at the top end of the cavity (104).

3. The component carrier (100) according to claim 2, wherein, The electrical insulation layer enclosure structure (114) covers the opening (110) of the conductive shield (106).

4. The component carrier (100) according to claim 2, wherein, The electrical insulation layer enclosure structure (114) has an opening (116) connected to the opening (110) of the conductive shield (106).

5. The component carrier (100) according to claim 4, wherein, The opening (116) leads to the outer side of the stack (102), and in particular, the opening (116) is configured to facilitate the slot antenna (108') configuration of the antenna (108).

6. The component carrier (100) according to claim 4 or 5, wherein, Another opening (118) is provided on the top of the opening (116). The opening (116) and the other opening (118) are configured to enlarge the opening area toward the outer side of the stack (102). In particular, the opening (116) and the other opening (118) are configured to facilitate the horn antenna (108''') configuration of the antenna (108).

7. The component carrier (100) according to any one of claims 2 to 6, wherein, The stack (102) includes at least one additional electrical insulation layer structure (120) disposed on top of the electrical insulation layer enclosure structure (114).

8. The component carrier (100) according to claim 7 when referring to claim 6, wherein, The additional opening (118) is at least partially disposed in the at least one additional electrical insulating layer structure (120).

9. The component carrier (100) according to claim 7 when referring to claim 6, wherein, The at least one additional electrical insulating layer structure (120) closes the opening (116) and / or the additional opening (118).

10. The component carrier (100) according to any one of claims 1 to 9, wherein, The stack (102) includes an electrically conductive layer structure (122) on top of the stacked portion that defines the cavity (104), and in particular, the electrically conductive layer structure (122) is disposed between the stacked portion and the electrically insulating layer enclosure structure (114).

11. The component carrier (100) according to any one of claims 7 to 10, wherein, The stack (102) includes an additional electrically conductive layer structure (124) located between the insulating layer closure structure (114) and the at least one additional electrically insulating layer structure (120).

12. The component carrier (100) according to any one of claims 1 to 11, wherein, The conductive layer structure (126) of the plurality of conductive layer structures disposed above the opening (110) of the conductive shield (106) has a functional opening (128) which helps to form a slot antenna (108') configuration of the antenna (108).

13. The component carrier (100) according to any one of claims 1 to 12, wherein, The conductive layer structure (126) disposed above the opening (110) of the conductive shield (106) and the adjacent conductive layer structure (122) of the plurality of conductive layer structures are connected to each other by at least one vertical through-connection (130). In particular, the conductive layer structure (126) disposed above the opening (110) of the conductive shield (106) and the adjacent conductive layer structure (122) of the plurality of conductive layer structures (126) are connected to each other by a plurality of vertical through-connections (130) arranged around a functional opening (128) that helps to form the slot antenna (108') configuration of the antenna (108).

14. The component carrier (100) according to any one of claims 4 to 13, wherein, The circumferential wall of the opening (116) and / or the circumferential wall of the other opening (118) are shielded by the conductive material section (133).

15. The component carrier (100) according to any one of claims 1 to 14, the component carrier (100) comprising an RF filter structure (180) configured as the top portion of the stack (102).

16. The component carrier (100) according to any one of claims 1 to 15, the component carrier (100) comprising a radio frequency lens component (182) which is surface-mounted on top of the stack (102).

17. The component carrier (100) according to any one of claims 12 to 16, wherein, The opening (110) is a slot, and the functional opening (128) is another slot, wherein optionally, in a top view of the stack (102), the slot and the other slot are inclined relative to each other.

18. The component carrier (100) according to any one of claims 1 to 17, wherein, The conductive shield (106) has a plurality of openings (110) located at the top end of the cavity (104) along the stacking direction (112), the openings (110) being vertically associated with the antenna (108) disposed on top of the openings (110) and / or the antenna (108) disposed at the openings (110), wherein optionally, in a top view of the stack (102), the openings (110) are inclined relative to each other.

19. The component carrier (100) according to any one of claims 1 to 18, wherein, The conductive shield (106) includes an additional opening (132) located at the bottom end of the cavity (104) along the stacking direction (112).

20. The component carrier (100) according to claim 19, wherein, The opening (110) is a slot, and the other opening (132) is another slot, wherein optionally, in a top view of the stack (102), the slots and the other slots are inclined relative to each other.

21. The component carrier (100) according to any one of claims 1 to 20, wherein, The central portion of the surface of the cavity (104) and the central portion of the surface of the opening (110) are aligned according to a planar tolerance range of less than 100 μm. Preferably, the central portion of the surface of the cavity (104) and the central portion of the surface of the opening (110) are aligned according to a planar tolerance range of less than 50 μm.

22. The component carrier (100) according to any one of claims 1 to 21, wherein, The cavity (104) has a stepped edge (140) that extends the extent of the cavity (104).

23. The component carrier (100) according to claim 22, wherein, The stepped edge (140) is located at the top end of the cavity (104).

24. The component carrier (100) according to claim 22 or 23, wherein, The stepped edge (140) is covered by an electrically conductive structure, and in particular, the stepped edge (140) is at least partially covered by the conductive shield (106).

25. The component carrier (100) according to any one of claims 22 to 24, wherein, The width (C) of the cavity (104) from one end of the stepped edge (140) to the opposite end, minus the average width of the cavity (104) divided by the average width of the cavity (104), is in the range of 0.001% to 20%. In particular, the width (C) of the cavity (104) from one end of the stepped edge (140) to the opposite end, minus the average width of the cavity (104) divided by the average width of the cavity (104), is in the range of 0.1% to 10%.

26. The component carrier (100) according to any one of claims 22 to 25, wherein, The cavity (104) has a maximum distance (D) of no more than 250 μm in its lateral extension (146) at the stepped edge (140), and in particular, the cavity (104) has a maximum distance (D) of no more than 100 μm in its lateral extension (146) at the stepped edge (140).

27. The component carrier (100) according to any one of claims 1 to 26, the component carrier (100) comprising a conductive connection medium portion (142) surrounding the circumferential portion of the cavity (104), particularly, the component carrier (100) comprising a conductive connection medium portion (142) surrounding the circumferential portion enclosing the top end of the cavity (104), particularly, the conductive connection medium portion (142) being made of a solder structure or a sintered structure.

28. The component carrier (100) according to claim 27, wherein, The conductive connecting medium (142) is electrically connected to two electrically conductive layer structures (122, 144) along the stacking direction (112). In particular, the two electrically conductive layer structures include an upper electrically conductive layer structure (122) located at the vertical height of the upper end of the cavity (104).

29. The component carrier (100) according to claim 27 or 28 of claim 26, wherein, The lateral extension (146) of the stepped edge (140) is at least partially defined by the conductive connecting medium (142).

30. The component carrier (100) according to any one of claims 1 to 29, wherein, The roughness Ra of the conductive shield (106) covering the top and / or bottom ends of the cavity (104) is less than the roughness of the sidewall of the conductive shield (106) covering the circumferential wall of the cavity (104). In particular, the roughness Ra of the conductive shield (106) covering the top and / or bottom ends of the cavity (104) is between 0.01 μm and 1 μm.

31. The component carrier (100) according to any one of claims 1 to 30, wherein, The horizontal width (B) of the cavity (104) is greater than the vertical height (H) of the cavity (104).

32. The component carrier (100) according to claim 31, wherein, The width (B) is at least twice the height (H).

33. The component carrier (100) according to any one of claims 1 and 32, wherein, The cavity (104) is configured for a frequency of at least 75 GHz.

34. The component carrier (100) according to claim 33, wherein, The cavity (104) has a width (B) of less than 3 mm and a height (H) of less than 1.5 mm.

35. The component carrier (100) according to any one of claims 1 to 34, wherein, The cavity (104) is filled with a medium, specifically, the cavity (104) is filled with air.

36. A method for dimensionalizing a component carrier (100) according to any one of claims 1 to 35, the method comprising: - Reduce the ratio between the height (H) and width (B) of the cavity (104) until the bandwidth of the electromagnetic wave transmission meets a predetermined bandwidth standard; and / or - Increase the ratio between the height (H) and width (B) of the cavity (104) until the return loss of electromagnetic wave transmission meets a predetermined return loss criterion.

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