Light-emitting assembly, manufacturing method thereof and vehicle lamp

Abstract

The invention discloses a light-emitting assembly and a manufacturing method thereof and a vehicle lamp. The light-emitting assembly comprises a substrate and a light-emitting device. The light-emitting device comprises a first electrode, a light-emitting limiting layer, a light-emitting functional layer, a second electrode and an auxiliary electrode, the light-emitting limiting layer is arranged on the side, away from the substrate, of the first electrode and comprises a light-emitting opening exposing the first electrode, and the light-emitting functional layer is arranged on the side, away from the substrate, of the light-emitting limiting layer and comprises a light-emitting opening exposing the second electrode. The second electrode is arranged on one side of the light-emitting functional layer away from the first electrode, and the auxiliary electrode is arranged on one side of the second electrode away from the light-emitting functional layer. The light-emitting functional layer includes a light-emitting functional portion disposed in the light-emitting opening and in contact with the exposed first electrode. The auxiliary electrode comprises a light-transmitting opening, and the orthographic projection of the light-transmitting opening on the substrate body is overlapped with the orthographic projection of the light-emitting function part on the substrate body. The light transmittance and the reflectivity of the auxiliary electrode can be balanced through the design of the light-transmitting opening, and the service life and the luminance of the light-emitting assembly are guaranteed.

Description

Light-emitting assembly, manufacturing method thereof and vehicle lamp TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to a light-emitting assembly, a manufacturing method thereof and a vehicle lamp. BACKGROUND

[0002] With the development of Organic Light Emitting Diode (OLED) technology, its self-luminous technical principle and excellent picture quality effect are pursued by the majority of consumers, and have been widely applied to mainstream high-end mobile phones and large-size application fields such as TPC, NB, vehicle-mounted and aviation entertainment screens.

[0003] OLED technology has a pixel circuit that is self-controllable and has a pixel-level light-emitting unit, which can be applied to a tail lamp. OLED technology not only realizes the safety warning function of a traditional tail lamp, but also endows the tail lamp with the function of displaying text, greatly expanding the application effect of the tail lamp. A traditional tail lamp is generally composed of one or several large bulbs to realize the safety warning function. A pixel matrix tail lamp composed of many light-emitting units not only has the safety warning function, but also can display personalized patterns. The more light-emitting units, the higher the type and refinement of the displayed patterns.

[0004] SUMMARY

[0005] The present disclosure provides a light-emitting assembly, a manufacturing method thereof and a vehicle lamp. By providing a light-transmitting opening on the auxiliary cathode, the light-emitting assembly can balance the light transmittance and reflectivity of the auxiliary electrode, ensure the service life and luminous brightness of the light-emitting assembly, realize transparent effect, expand the application effect of the light-emitting assembly, and reduce the resistance and cross voltage to improve the service life of the light-emitting assembly.

[0006] At least one embodiment of the present disclosure provides a light-emitting assembly, comprising a substrate and a light-emitting device disposed on the substrate, wherein the light-emitting device comprises: a first electrode; a light-emitting limiting layer disposed on a side of the first electrode away from the substrate and comprising a light-emitting opening exposing the first electrode; a light-emitting functional layer disposed on a side of the light-emitting limiting layer away from the substrate; a second electrode disposed on a side of the light-emitting functional layer away from the first electrode; and

[0007] An auxiliary electrode is disposed on a side of the second electrode away from the light-emitting functional layer, wherein the light-emitting functional layer comprises a light-emitting functional part disposed in the light-emitting opening and in contact with the exposed first electrode; the auxiliary electrode comprises a light-transmitting opening, a projection of the light-transmitting opening on the substrate substrate overlaps a projection of the light-emitting functional part on the substrate substrate.

[0008] For example, in the light-emitting assembly provided in an embodiment of the present disclosure, a ratio of an area of the projection of the light-transmitting opening on the substrate substrate to an area of the projection of the light-emitting functional part on the substrate substrate is not less than 1 / 5.

[0009] For example, the light-emitting assembly provided in an embodiment of the present disclosure further comprises an electrode patterning structure, wherein the electrode patterning structure is configured to prevent the material of the auxiliary electrode from adhering to the electrode patterning structure, the light transmittance of the electrode patterning structure is not less than 50%, and the light-transmitting opening exposes at least a part of the electrode patterning structure.

[0010] For example, in the light-emitting assembly provided in an embodiment of the present disclosure, the material of the electrode patterning structure comprises an organic fluorine-containing material.

[0011] For example, in the light-emitting assembly provided in an embodiment of the present disclosure, a ratio of a dimension of the electrode patterning structure in a direction perpendicular to the substrate substrate to a dimension of the auxiliary electrode in the direction perpendicular to the substrate substrate is in a range of 0.7 to 1.3.

[0012] For example, in the light-emitting assembly provided in an embodiment of the present disclosure, a projection of the electrode patterning structure on the substrate substrate overlaps a projection of the light-emitting functional part on the substrate substrate.

[0013] For example, in the light-emitting assembly provided in an embodiment of the present disclosure, the reflectivity of the auxiliary electrode is greater than the reflectivity of the second electrode.

[0014] For example, in the light-emitting assembly provided in an embodiment of the present disclosure, the material of the second electrode comprises aluminum, the thickness of the second electrode is in a range of 50-300 angstroms, the material of the auxiliary electrode comprises a magnesium-silver alloy or a magnesium-aluminum alloy, and the thickness of the auxiliary electrode is in a range of 500-2000 angstroms.

[0015] For example, the light emitting component provided in an embodiment of the present disclosure further comprises: a buffer layer disposed on the substrate; a metal trace layer disposed on a side of the buffer layer away from the substrate; a passivation layer disposed on a side of the metal trace layer away from the substrate, and comprising a connection opening exposing the metal trace layer; and a metal connection line disposed in the connection opening and connected with the exposed metal trace layer, wherein the metal connection line is connected with the first electrode.

[0016] For example, in the light emitting component provided in an embodiment of the present disclosure, the metal trace layer comprises a plurality of metal traces, and a normal projection of the light transmission opening on the substrate does not overlap with a normal projection of the plurality of metal traces on the substrate.

[0017] For example, the light emitting component provided in an embodiment of the present disclosure further comprises an encapsulation layer disposed on a side of the auxiliary electrode away from the second electrode, wherein the encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer disposed in a stack, the organic encapsulation layer is disposed on a side of the first inorganic encapsulation layer away from the auxiliary electrode, the second inorganic encapsulation layer is disposed on a side of the organic encapsulation layer away from the first inorganic encapsulation layer, and a thickness uniformity of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer is not less than 60%.

[0018] For example, in the light emitting component provided in an embodiment of the present disclosure, a refractive index of the organic encapsulation layer is greater than a refractive index of the first inorganic encapsulation layer, and a refractive index of the second inorganic encapsulation layer is greater than a refractive index of the organic encapsulation layer.

[0019] For example, in the light emitting component provided in an embodiment of the present disclosure, a refractive index of the first inorganic encapsulation layer is greater than 1.4, a refractive index of the organic encapsulation layer is greater than 1.6, and a refractive index of the second inorganic encapsulation layer is greater than 1.7.

[0020] For example, in the light emitting component provided in an embodiment of the present disclosure, an incident angle of light incident to the first inorganic encapsulation layer, the organic encapsulation layer and the second inorganic encapsulation layer is θ, thicknesses of the first inorganic encapsulation layer, the organic encapsulation layer and the second inorganic encapsulation layer are d1, d2 and d3 respectively, d1, d2 and d3 satisfy the following formula: d1sinθ=d2sinθ=d3sinθ, and none of them is equal to ±(2k+1)λ / 2, where λ is a wavelength of light emitted by the light emitting functional part, θ is in a range of 0 degree to 90 degree, and k is an integer greater than or equal to 0.

[0021] For example, in the light emitting component provided in an embodiment of the present disclosure, d1, d2 and d3 satisfy the following formula: d1sinθ=d2sinθ=d3sinθ=±kλ.

[0022] For example, in the light emitting assembly provided by an embodiment of the present disclosure, the light emitting assembly further comprises: an optical adhesive disposed on a side of the encapsulation layer away from the second electrode; and a cover plate disposed on a side of the optical adhesive away from the encapsulation layer, wherein a refractive index of the optical adhesive is greater than or equal to a refractive index of the second inorganic encapsulation layer.

[0023] The light emitting assembly provided by any one of the preceding embodiments of the present disclosure can be used in a vehicle lamp.

[0024] The manufacturing method of the light emitting assembly provided by an embodiment of the present disclosure comprises: forming a first electrode on a substrate; forming a light emitting limiting layer on a side of the first electrode away from the substrate, the light emitting limiting layer comprising a light emitting opening exposing the first electrode; forming a light emitting functional layer on a side of the light emitting limiting layer away from the substrate; forming a second electrode on a side of the light emitting functional layer away from the light emitting limiting layer; and forming an auxiliary electrode on a side of the second electrode away from the light emitting functional layer, the first electrode, the light emitting limiting layer, the light emitting functional layer, the second electrode and the auxiliary electrode forming a light emitting device on the substrate, the light emitting functional layer comprising a light emitting functional part disposed in the light emitting opening and in contact with the exposed first electrode, the auxiliary electrode comprising a light transmitting opening, a normal projection of the light transmitting opening on the substrate overlapping a normal projection of the light emitting functional part on the substrate.

[0025] For example, in the manufacturing method provided by an embodiment of the present disclosure, the forming of the auxiliary electrode on a side of the second electrode away from the light emitting functional layer comprises: forming an electrode patterning structure on the second electrode; and forming the auxiliary electrode comprising the light transmitting opening on the second electrode, wherein the electrode patterning structure is configured to prevent the material of the auxiliary electrode from adhering to the electrode patterning structure, and a light transmittance of the electrode patterning structure is not less than 50%, the light transmitting opening exposing the electrode patterning structure.

[0026] For example, in the manufacturing method provided by an embodiment of the present disclosure, the light emitting assembly further comprises an encapsulation layer disposed on a side of the auxiliary electrode away from the second electrode, the encapsulation layer comprising a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer stacked, the organic encapsulation layer disposed on a side of the first inorganic encapsulation layer away from the auxiliary electrode, the second inorganic encapsulation layer disposed on a side of the organic encapsulation layer away from the first inorganic encapsulation layer, and the manufacturing method further comprises: forming at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer by using an atomic layer deposition process. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and not limit the present disclosure.

[0028] FIG. 1 is a structural schematic diagram of an OLED tail lamp;

[0029] FIG. 2 is a structural schematic diagram of another OLED tail lamp;

[0030] FIG. 3A is a structural schematic diagram of another OLED tail lamp;

[0031] FIG. 3B is a structural schematic diagram of another OLED tail lamp;

[0032] FIG. 4 is a structural schematic diagram of a light-emitting assembly provided by an embodiment of the present disclosure;

[0033] FIG. 5 is a schematic diagram of achieving electrode patterning by using an electrode patterning structure provided by an embodiment of the present disclosure;

[0034] FIG. 6 is a partial structural schematic diagram of the light-emitting assembly shown in FIG. 4, along another direction;

[0035] FIG. 7 is a structural schematic diagram of an encapsulation layer provided by an embodiment of the present disclosure;

[0036] FIG. 8 is a structural schematic diagram of another encapsulation layer provided by an embodiment of the present disclosure;

[0037] FIG. 9 is a reliability test result diagram of the encapsulation layer provided by an embodiment of the present disclosure;

[0038] FIG. 10A is a light path schematic diagram of the optical assembly shown in FIG. 4;

[0039] FIG. 10B is a schematic diagram of light intensity superposition and light intensity offset provided by an embodiment of the present disclosure;

[0040] FIG. 11 is a structural schematic diagram of another light-emitting assembly provided by an embodiment of the present disclosure;

[0041] FIG. 12 is a schematic diagram of a vehicle lamp provided by an embodiment of the present disclosure;

[0042] FIG. 13 is a structural schematic diagram of another vehicle lamp provided by an embodiment of the present disclosure; and

[0043] FIG. 14 is a manufacturing method of a light-emitting assembly provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0044] In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the following will be combined with the accompanying drawings for the embodiments of the present disclosure to make a clear and complete description of the technical solutions of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without any inventive effort fall within the protection scope of the present disclosure.

[0045] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meaning understood by a person of ordinary skill in the art to which the present disclosure pertains. The terms "first", "second" and similar terms used in the present disclosure do not denote any order, quantity or importance, but are used to distinguish different components. The terms "comprise", "contain" and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0046] Unless otherwise defined, the terms "parallel", "perpendicular" and "same" and the like used in the embodiments of the present disclosure include the cases of "strictly parallel", "strictly perpendicular", "strictly same" and the like, and the cases of "approximately parallel", "approximately perpendicular", "approximately same" and the like with certain errors. For example, the "approximately" above can mean that the difference between the compared objects is within 10% or 5% of the average value of the compared objects. In the following of the embodiments of the present disclosure, when the number of a component or element is not specifically indicated, it means that the component or element can be one or multiple, or can be understood as at least one. "At least one" means one or more, and "multiple" means at least two. In the embodiments of the present disclosure, "same layer" refers to the relationship between multiple film layers formed by the same material after the same step (for example, one patterning process). Here, "same layer" does not always mean that the thicknesses of the multiple film layers are the same or the heights of the multiple film layers in a cross-sectional view are the same.

[0047] At present, the matrix tail lamp is generally a light-emitting diode (LED) product. If the OLED product is widely used, the following problems need to be solved: 1. luminous brightness and service life; 2. flexible OLED packaging reliability; 3. OLED device heating problem.

[0048] FIG. 1 is a structural schematic diagram of an OLED tail lamp. As shown in FIG. 1, the OLED tail lamp includes a rigid substrate 11, and an anode 12, a light-emitting functional layer 13, a cathode 14 and an encapsulation layer 15 which are sequentially stacked on the rigid substrate 11. The rigid substrate 11 of the tail lamp shown in FIG. 1 is a glass substrate, and the encapsulation layer 15 adopts a frit seal. The glass substrate cannot realize a three-dimensional form, and it is difficult to meet the individual needs of the vehicle customers. The encapsulation effect of the frit seal technology is poor, and when the material of the cathode 14 is a magnesium-silver alloy, sulfides generated by automobile exhaust will react with the magnesium-silver alloy, resulting in corrosion of the magnesium-silver alloy and easy occurrence of dark spots and other adverse phenomena.

[0049] FIG. 2 is a structural schematic diagram of another OLED tail lamp. As shown in FIG. 2, the OLED tail lamp is different from the OLED tail lamp shown in FIG. 1 in that the encapsulation layer 15 of the OLED tail lamp shown in FIG. 2 is a thin-film encapsulation (TFE) layer formed by chemical vapor deposition (CVD). The encapsulation effect of the thin-film encapsulation (TFE) layer formed by chemical vapor deposition (CVD) is poor, and when the material of the cathode 14 is a magnesium-silver alloy, sulfides generated by automobile exhaust will react with the magnesium-silver alloy, resulting in corrosion of the magnesium-silver alloy and easy occurrence of dark spots and other adverse phenomena.

[0050] FIG. 3A is a structural schematic diagram of still another OLED tail lamp. As shown in FIG. 3A, the OLED tail lamp includes a flexible substrate 16, a buffer layer 17, an anode 12, a light-emitting functional layer 13, a cathode 14 and an encapsulation layer 15. The material of the cathode 14 of the OLED tail lamp shown in FIG. 3A is thin aluminum, and the OLED tail lamp is a bottom emitter, and light is emitted from the side of the flexible substrate 16. Due to the relatively low reflectivity of the thin aluminum, a part of the light source is transmitted from the cathode, thereby reducing the overall brightness and life of the OLED tail lamp.

[0051] FIG. 3B is a structural schematic diagram of still another OLED tail lamp. As shown in FIG. 3B, the OLED tail lamp is different from the OLED tail lamp shown in FIG. 3A in that the cathode of the OLED tail lamp shown in FIG. 3B is thickened. Although the reflectivity can be effectively improved by increasing the thickness of the aluminum layer, the evaporation time will be greatly affected, the production capacity will be seriously lost, and when the light transmittance of the cathode material is low, the cathode will also be severely heated, thereby reducing the life of the OLED tail lamp.

[0052] In addition, according to the design requirements of the tail lamp, it is hoped that the design of the back of the tail lamp can be seen when the tail lamp is not working to expand the application effect of the tail lamp.

[0053] The embodiment of the present disclosure provides a light-emitting assembly, a manufacturing method thereof and a vehicle lamp. The light-emitting assembly comprises a substrate and a light-emitting device arranged on the substrate. The light-emitting device comprises a first electrode, a light-emitting limiting layer, a light-emitting functional layer, a second electrode and an auxiliary electrode. The light-emitting limiting layer is arranged on a side of the first electrode away from the substrate, and comprises a light-emitting opening exposing the first electrode. The light-emitting functional layer is arranged on a side of the light-emitting limiting layer away from the substrate. The second electrode is arranged on a side of the light-emitting functional layer away from the first electrode. The auxiliary electrode is arranged on a side of the second electrode away from the light-emitting functional layer. The light-emitting functional layer comprises a light-emitting functional part arranged in the light-emitting opening and in contact with the exposed first electrode. The auxiliary electrode comprises a light-transmitting opening, and a projection of the light-transmitting opening on the substrate overlaps a projection of the light-emitting functional part on the substrate.

[0054] In the light-emitting assembly provided by the embodiment of the present disclosure, the side of the second electrode away from the light-emitting functional layer is provided with the auxiliary electrode. On the one hand, the provision of the auxiliary electrode can reduce the resistance and the cross voltage, and ultimately achieve the technical effect of reducing the temperature rise and improving the service life of the light-emitting assembly. On the other hand, the provision of the auxiliary electrode can also avoid forming a second electrode that is too thick, thereby reducing the time for forming the second electrode and reducing the production loss of forming the second electrode. On the other hand, the light-transmitting opening can be provided on the auxiliary electrode, thereby improving the service life and luminous brightness of the light-emitting assembly and expanding the application effect of the light-emitting assembly.

[0055] In the light-emitting assembly provided by the embodiment of the present disclosure, the light-transmitting opening is provided on the auxiliary electrode, and the projection of the light-transmitting opening on the substrate overlaps the projection of the light-emitting functional part on the substrate. Part of the light emitted by the light-emitting functional part can pass through the light-transmitting opening after passing through the second electrode. The provision of the light-transmitting opening can improve the light transmittance of the auxiliary electrode and reduce the electrode heating problem caused by the absorption of the light emitted by the light-emitting functional part by the auxiliary electrode, thereby reducing the influence of electrode heating on the service life of the light-emitting assembly. The auxiliary electrode can also reflect the light emitted by the light-emitting functional part at positions other than the light-transmitting opening, thereby ensuring the brightness of the light-emitting assembly. Therefore, the provision of the light-transmitting opening can balance the light transmittance and reflectivity of the auxiliary electrode, thereby ensuring the service life and luminous brightness of the light-emitting assembly. The light-transmitting opening increases the light transmittance of the auxiliary electrode, and when the light-emitting assembly does not emit light, the design on the side of the light-emitting assembly away from the substrate can be seen through the auxiliary electrode, thereby realizing a transparent effect and expanding the application effect of the light-emitting assembly.

[0056] In the following, the light-emitting assembly, the manufacturing method thereof and the vehicle lamp provided by the embodiment of the present disclosure will be described in detail with reference to the drawings.

[0057] The embodiment of the present disclosure provides a light emitting assembly. Figure 4 is a structural schematic diagram of a light emitting assembly provided by an embodiment of the present disclosure. As shown in Figure 4, the light emitting assembly 100 comprises a substrate 110 and a light emitting device 120 arranged on the substrate 110. The light emitting device 120 comprises a first electrode 121, a light emitting limiting layer 122, a light emitting functional layer 123, a second electrode 124 and an auxiliary electrode 125. The light emitting limiting layer 122 is arranged on the side of the first electrode 121 away from the substrate 110, and comprises a light emitting opening 1220 exposing the first electrode 121. The light emitting functional layer 123 is arranged on the side of the light emitting limiting layer 122 away from the substrate 110. The second electrode 124 is arranged on the side of the light emitting functional layer 123 away from the first electrode 121. The auxiliary electrode 125 is arranged on the side of the second electrode 124 away from the light emitting functional layer 123. The light emitting functional layer 123 comprises a light emitting functional part 1230, which is arranged in the light emitting opening 1220 and in contact with the exposed first electrode 121. The auxiliary electrode 125 comprises a light-transmitting opening 1250, and the orthogonal projection of the light-transmitting opening 1250 on the substrate 110 overlaps the orthogonal projection of the light emitting functional part 1230 on the substrate 110.

[0058] In the light emitting assembly 100 provided by the embodiment of the present disclosure, as shown in Figure 4, the side of the second electrode 124 away from the light emitting functional layer 123 is provided with the auxiliary electrode 125. On the one hand, the arrangement of the auxiliary electrode 125 can reduce the resistance and the cross voltage, and finally realize the technical effect of reducing the temperature rise and improving the service life of the light emitting assembly 100. On the other hand, the arrangement of the auxiliary electrode 125 can also avoid the formation of a second electrode 124 that is too thick, thereby reducing the time for forming the second electrode 124 and reducing the production capacity loss of forming the second electrode 124. On the other hand, the light-transmitting opening 1250 can be arranged on the auxiliary electrode 125, thereby improving the service life and light emitting brightness of the light emitting assembly 100 and expanding the application effect of the light emitting assembly 100.

[0059] As shown in FIG. 4, the auxiliary electrode 125 is provided with a light-transmitting opening 1250, a projection of the light-transmitting opening 1250 on the substrate 110 overlaps with a projection of the light-emitting functional part 1230 on the substrate 110, and part of the light emitted by the light-emitting functional part 1230 can pass through the light-transmitting opening 1250 after passing through the second electrode 124. The light-transmitting opening 1250 can improve the light-transmitting rate of the auxiliary electrode 125, reduce the electrode heating problem caused by the absorption of the light emitted by the light-emitting functional part 1230 by the auxiliary electrode 125, and thus reduce the influence of the electrode heating on the service life of the light-emitting component 100. The auxiliary electrode 125 can also reflect the light emitted by the light-emitting functional part 1230 at positions other than the light-transmitting opening 1250, thereby ensuring the brightness of the light-emitting component 100. Thus, the light-transmitting opening 1250 can balance the light-transmitting rate and the reflectivity of the auxiliary electrode 125, and ensure the service life and the light-emitting brightness of the light-emitting component 100. For example, by adjusting the size of the light-transmitting opening 1250, the light-emitting brightness can be improved as much as possible under the premise of ensuring the design service life, or the service life can be improved as much as possible under the premise of ensuring the design light-emitting brightness. For example, the light-emitting functional part 1230 emits light under the action of the first electrode 121, the second electrode 124, and the auxiliary electrode 124, and the light is emitted from the side of the substrate 110, which is also called bottom emission.

[0060] In the light-emitting component 100 provided in the embodiments of the present disclosure, the light-transmitting opening 1250 increases the light-transmitting rate of the auxiliary electrode 125, and when the light-emitting component 100 does not emit light, the design of the light-emitting component 100 on the side away from the substrate 110 can be seen through the auxiliary electrode 125, thereby realizing a transparent effect and expanding the application effect of the light-emitting component 100.

[0061] In some examples, as shown in FIG. 4, the ratio of the area of the projection of the light-transmitting opening 1250 on the substrate 110 to the area of the projection of the light-emitting functional part 1230 on the substrate 110 is not less than 1 / 5. For example, the size of the light-transmitting opening 1250 can be designed according to the light-emitting brightness, the service life, or the design of the light-emitting component 100, and the embodiments of the present disclosure do not make any limitation in this regard. For example, the ratio can be not less than 1 / 4. For example, the ratio can be not less than 1 / 3. For example, the ratio can be not less than 1 / 2. For example, the ratio can be equal to 1. For example, the ratio can be greater than 1. For example, when the ratio is less than 1, the projection of the light-transmitting opening 1250 on the substrate 110 can fall within the projection of the light-emitting functional part 1230 on the substrate 110. For example, when the ratio is greater than 1, the projection of the light-emitting functional part 1230 on the substrate 110 can fall within the projection of the light-transmitting opening 1250 on the substrate 110.

[0062] In some examples, as shown in FIG. 4, the orthographic projection of the light-transmissive opening 1250 on the substrate 110 overlaps with the orthographic projection of the first electrode 121 on the substrate 110. For example, the ratio of the area of the orthographic projection of the light-transmissive opening 1250 on the substrate 110 to the area of the orthographic projection of the first electrode 121 on the substrate 110 is not less than 1 / 5. For example, the ratio can be not less than 1 / 4. For example, the ratio can be not less than 1 / 3. For example, the ratio can be not less than 1 / 2. For example, the ratio can be equal to 1. For example, the ratio can be greater than 1. Embodiments of the present disclosure do not limit the value of the ratio. For example, when the ratio is less than 1, the orthographic projection of the light-transmissive opening 1250 on the substrate 110 can fall within the orthographic projection of the first electrode 121 on the substrate 110. For example, when the ratio is greater than 1, the orthographic projection of the first electrode 121 on the substrate 110 can fall within the orthographic projection of the light-transmissive opening 1250 on the substrate 110.

[0063] In some examples, as shown in FIG. 4, the orthographic projection of the light-transmissive opening 1250 on the substrate 110 overlaps with the orthographic projection of the light-emitting opening 1220 on the substrate 110. For example, the ratio of the area of the orthographic projection of the light-transmissive opening 1250 on the substrate 110 to the area of the orthographic projection of the light-emitting opening 1220 on the substrate 110 is not less than 1 / 5. For example, the ratio can be not less than 1 / 4. For example, the ratio can be not less than 1 / 3. For example, the ratio can be not less than 1 / 2. For example, the ratio can be equal to 1. For example, the ratio can be greater than 1. Embodiments of the present disclosure do not limit the value of the ratio. For example, when the ratio is less than 1, the orthographic projection of the light-transmissive opening 1250 on the substrate 110 can fall within the orthographic projection of the light-emitting opening 1220 on the substrate 110. For example, when the ratio is greater than 1, the orthographic projection of the light-emitting opening 1220 on the substrate 110 can fall within the orthographic projection of the light-transmissive opening 1250 on the substrate 110.

[0064] For example, the center of the orthographic projection of the light-transmissive opening on the substrate substantially coincides with the center of the orthographic projection of the light-emitting functional portion on the substrate. For example, the center of the orthographic projection of the light-transmissive opening on the substrate substantially coincides with the center of the orthographic projection of the first electrode on the substrate. For example, the center of the orthographic projection of the light-transmissive opening on the substrate substantially coincides with the center of the orthographic projection of the light-emitting opening on the substrate.

[0065] For example, the shape of the outer contour of the orthographic projection of the light-transmissive opening on the substrate is substantially the same as the shape of the outer contour of the orthographic projection of the light-emitting functional part on the substrate. For example, the shape of the outer contour of the orthographic projection of the light-transmissive opening on the substrate is substantially the same as the shape of the outer contour of the orthographic projection of the first electrode on the substrate. For example, the shape of the outer contour of the orthographic projection of the light-transmissive opening on the substrate is substantially the same as the shape of the outer contour of the light-emitting opening on the substrate.

[0066] For example, the shape of the orthographic projection of the light-transmissive opening on the substrate includes a square, a circle, an ellipse, a polygon, or a ring, etc. The embodiments of the present disclosure do not limit the shape and size of the light-transmissive opening.

[0067] In some examples, as shown in FIG. 4, the light-emitting component 100 further includes an electrode patterning structure 130, the electrode patterning structure 130 is configured to make the material of the auxiliary electrode 125 not adhere to the electrode patterning structure 130, and the light transmittance of the electrode patterning structure 130 is not less than 50%, and the light-transmissive opening 1250 at least exposes a part of the electrode patterning structure 130.

[0068] In this example, since the material of the auxiliary electrode 125 does not adhere to the electrode patterning structure 130, the material of the electrode patterning structure 130 does not stick to the material of the auxiliary electrode 125, and in the process of forming the auxiliary cathode 125, the material of the auxiliary electrode 125 is difficult to adhere at the position where the electrode patterning structure 130 is located, thereby realizing the patterning of the auxiliary electrode 125. The light-transmissive opening 1250 can be simply and conveniently formed at the position where the electrode patterning structure 130 is located through the electrode patterning structure 130, the process is simple, and the adverse effects of forming the light-transmissive opening 1250 on the auxiliary electrode 125 by using other methods are avoided. In addition, the electrode patterning structure 130 can make the film layer where the auxiliary electrode 125 is located more flat, so that the subsequent packaging process is more stable and reliable.

[0069] It should be noted that the material of the auxiliary electrode 125 not adhering to the electrode patterning structure 130 includes the case that the material of the auxiliary electrode 125 is difficult or not easy to adhere to the electrode patterning structure 130, at this time, there may be a little material of the auxiliary electrode 125 on the electrode patterning structure 130; also includes the case that the material of the auxiliary electrode 125 cannot adhere to the electrode patterning structure 130, at this time, there is no material of the auxiliary electrode 125 on the electrode patterning structure 130.

[0070] For example, the electrode patterning structure can be formed on the second electrode first, and then the auxiliary electrode is formed. Since the material of the auxiliary electrode does not adhere to the electrode patterning structure, a light-transmitting opening is formed at the position of the electrode patterning structure while the auxiliary electrode is formed. For example, the preparation process of the electrode patterning structure includes evaporation.

[0071] For example, as shown in FIG. 4, the light-transmitting opening 1250 can expose a portion of the electrode patterning structure 130. For example, the light-transmitting opening 1250 can completely expose the electrode patterning structure 130. For example, at least a portion of the electrode patterning structure 130 can be located within the light-transmitting opening 1250. For example, the electrode patterning structure 130 is completely located within the light-transmitting opening 1250. For example, the orthogonal projection of the electrode patterning structure on the substrate substrate can overlap with the orthogonal projection of the light-transmitting opening on the substrate substrate. For example, the orthogonal projection of the electrode patterning structure on the substrate substrate can fall within the orthogonal projection of the light-transmitting opening on the substrate substrate.

[0072] For example, as shown in FIG. 4, the orthogonal projection of the electrode patterning structure 130 on the substrate substrate 110 overlaps with the orthogonal projection of the light-emitting functional part 1230 on the substrate substrate 110. For example, the ratio of the area of the orthogonal projection of the electrode patterning structure 130 on the substrate substrate 110 to the area of the orthogonal projection of the light-emitting functional part 1230 on the substrate substrate 110 is not less than 1 / 5. For example, the ratio can be not less than 1 / 4. For example, the ratio can be not less than 1 / 3. For example, the ratio can be not less than 1 / 2. For example, the ratio can be equal to 1. For example, the ratio can be greater than 1. The present disclosure does not limit the value of the ratio. For example, when the ratio is less than 1, the orthogonal projection of the electrode patterning structure 130 on the substrate substrate 110 can fall within the orthogonal projection of the light-emitting functional part 1230 on the substrate substrate 110. For example, when the ratio is greater than 1, the orthogonal projection of the light-emitting functional part 1230 on the substrate substrate 110 can fall within the orthogonal projection of the electrode patterning structure 130 on the substrate substrate 110.

[0073] For example, as shown in FIG. 4, the orthographic projection of the electrode patterning structure 130 on the substrate 110 overlaps with the orthographic projection of the first electrode 121 on the substrate 110. For example, the ratio of the area of the orthographic projection of the electrode patterning structure 130 on the substrate 110 to the area of the orthographic projection of the first electrode 121 on the substrate 110 is not less than 1 / 5. For example, the ratio can be not less than 1 / 4. For example, the ratio can be not less than 1 / 3. For example, the ratio can be not less than 1 / 2. For example, the ratio can be equal to 1. For example, the ratio can be greater than 1. Embodiments of the present disclosure do not limit the value of the ratio. For example, when the ratio is less than 1, the orthographic projection of the electrode patterning structure 130 on the substrate 110 can fall within the orthographic projection of the first electrode 121 on the substrate 110. For example, when the ratio is greater than 1, the orthographic projection of the first electrode 121 on the substrate 110 can fall within the orthographic projection of the electrode patterning structure 130 on the substrate 110.

[0074] For example, as shown in FIG. 4, the orthographic projection of the electrode patterning structure 130 on the substrate 110 overlaps with the orthographic projection of the light-emitting opening 1220 on the substrate 110. For example, the ratio of the area of the orthographic projection of the electrode patterning structure 130 on the substrate 110 to the area of the orthographic projection of the light-emitting opening 1220 on the substrate 110 is not less than 1 / 5. For example, the ratio can be not less than 1 / 4. For example, the ratio can be not less than 1 / 3. For example, the ratio can be not less than 1 / 2. For example, the ratio can be equal to 1. For example, the ratio can be greater than 1. Embodiments of the present disclosure do not limit the value of the ratio. For example, when the ratio is less than 1, the orthographic projection of the electrode patterning structure 130 on the substrate 110 can fall within the orthographic projection of the light-emitting opening 1220 on the substrate 110. For example, when the ratio is greater than 1, the orthographic projection of the light-emitting opening 1220 on the substrate 110 can fall within the orthographic projection of the electrode patterning structure 130 on the substrate 110.

[0075] For example, the center of the orthographic projection of the electrode patterning structure on the substrate substantially coincides with the center of the orthographic projection of the light-emitting functional portion on the substrate. For example, the center of the orthographic projection of the electrode patterning structure on the substrate substantially coincides with the center of the orthographic projection of the first electrode on the substrate. For example, the center of the orthographic projection of the electrode patterning structure on the substrate substantially coincides with the center of the orthographic projection of the light-emitting opening on the substrate.

[0076] For example, the shape of the outer contour of the normal projection of the electrode patterning structure on the substrate is substantially the same as the shape of the outer contour of the normal projection of the light-emitting functional portion on the substrate. For example, the shape of the outer contour of the normal projection of the electrode patterning structure on the substrate is substantially the same as the shape of the outer contour of the normal projection of the first electrode on the substrate. For example, the shape of the outer contour of the normal projection of the electrode patterning structure on the substrate is substantially the same as the shape of the outer contour of the normal projection of the light-emitting opening on the substrate.

[0077] For example, the shape of the normal projection of the electrode patterning structure on the substrate includes a square, a circle, an ellipse, a polygon, or a ring, etc. The present embodiment does not limit the shape and size of the light-transmitting opening.

[0078] For example, when the material of the auxiliary electrode is magnesium, silver, or a magnesium-silver alloy, the material of the electrode patterning structure is not sticky to magnesium, silver, or a magnesium-silver alloy, and it is difficult or impossible for magnesium, silver, or a magnesium-silver alloy to adhere to the electrode patterning structure.

[0079] For example, the material of the electrode patterning structure can be referred to as an electrode patterning material, and the material of the electrode patterning structure includes an organic fluorine-containing material. Of course, the present embodiment does not limit the material of the electrode patterning structure.

[0080] For example, the light transmittance of the electrode patterning structure is not less than 50%. For example, the light transmittance of the electrode patterning structure is not less than 60%. For example, the light transmittance of the electrode patterning structure is not less than 70%. For example, the light transmittance of the electrode patterning structure is not less than 80%. For example, the light transmittance of the electrode patterning structure is not less than 85%. For example, the light transmittance of the electrode patterning structure is not less than 90%. For example, the light transmittance of the electrode patterning structure is not less than 95%.

[0081] For example, as shown in FIG. 4, the ratio of the size of the electrode patterning structure 130 in the direction perpendicular to the substrate 110 to the size of the auxiliary electrode 125 in the direction perpendicular to the substrate 110 is in the range of 0.7 to 1.3. For example, the ratio of the thickness of the electrode patterning structure 130 to the thickness of the auxiliary electrode 125 is in the range of 0.7 to 1.3.

[0082] For example, as shown in FIG. 4, the size of the electrode patterning structure 130 in the direction perpendicular to the substrate 110 can be equal to the size of the auxiliary electrode 125 in the direction perpendicular to the substrate 110. Of course, the present embodiment does not limit this. For example, the size of the electrode patterning structure in the direction perpendicular to the substrate can be smaller than the size of the auxiliary electrode in the direction perpendicular to the substrate. For example, the size of the electrode patterning structure in the direction perpendicular to the substrate can be larger than the size of the auxiliary electrode in the direction perpendicular to the substrate.

[0083] For example, the size of the electrode patterning structure in the direction perpendicular to the substrate is not less than 100 angstroms. For example, the size of the electrode patterning structure in the direction perpendicular to the substrate is not less than 150 angstroms. The size of the electrode patterning structure is not limited in the embodiments of the present disclosure. For example, the size can be designed according to the material and thickness of the auxiliary electrode, etc.

[0084] FIG. 5 is a schematic diagram of an electrode patterning structure for realizing electrode patterning according to an embodiment of the present disclosure. As shown in FIG. 5, the hexagonal opening is a light-transmitting opening 1250, the electrode patterning structure 130 is in the light-transmitting opening 1250, and the electrode is outside the light-transmitting opening 1250. For example, the material of the electrode is magnesium-silver alloy. Thus, the electrode patterning structure 130 can be used to conveniently and simply realize the patterning of the electrode.

[0085] In some examples, the reflectivity of the auxiliary electrode is greater than the reflectivity of the second electrode. The auxiliary electrode has greater reflectivity, which can improve the reflection of light by the auxiliary electrode; the auxiliary electrode is provided with a light-transmitting opening, which can transmit part of the light. Thus, by making the auxiliary electrode have greater reflectivity, the light-transmitting rate and the reflectivity of the auxiliary electrode can be better balanced.

[0086] For example, in the case of the same size of the light-transmitting opening, increasing the reflectivity of the auxiliary electrode can improve the luminous brightness of the light-emitting assembly. For example, under the premise of the same luminous brightness, increasing the reflectivity of the auxiliary electrode can correspondingly increase the light-transmitting opening, so that the service life of the light-emitting assembly can be improved, and the application effect of the light-emitting assembly can be better expanded.

[0087] For example, the auxiliary electrode is made of a material with greater reflectivity, and the thickness of the auxiliary electrode can be correspondingly reduced, so that the time for forming the auxiliary electrode can be reduced, and the production capacity loss for forming the auxiliary electrode can be reduced.

[0088] In some examples, the chemical stability of the second electrode is better than the chemical stability of the auxiliary electrode. By providing the second electrode with better chemical stability on the light-emitting functional layer as the main part of the cathode, the generation of dark spots caused by corrosion due to the evaporation process or external sulfides can be effectively avoided. For example, when the optical assembly is used for a car tail light, the problem of dark spots caused by corrosion due to sulfides generated in the exhaust gas can be effectively solved.

[0089] For example, the material of the second electrode includes aluminum. Of course, the material of the second electrode is not limited in the embodiments of the present disclosure. For example, the material of the second electrode can also be silver, magnesium, magnesium-silver alloy, magnesium-aluminum alloy, lithium, lithium-doped alloy, indium tin oxide (ITO), zinc tin oxide (ZnSnO), fluorine-doped tin oxide (FTO), etc.

[0090] For example, the thickness of the second electrode ranges from 50 to 300 angstroms.

[0091] For example, the material of the auxiliary electrode includes magnesium-silver alloy or magnesium-aluminum alloy. Of course, the material of the auxiliary electrode is not limited in the embodiments of the present disclosure. For example, the material of the auxiliary electrode can also be silver, magnesium, magnesium-silver alloy, magnesium-aluminum alloy, lithium, lithium-doped alloy, etc.

[0092] For example, the thickness of the auxiliary electrode ranges from 500 to 2000 angstroms.

[0093] For example, the material of the first electrode includes indium tin oxide (ITO).

[0094] For example, the first electrode can be an anode. For example, the second electrode can be a cathode. For example, the auxiliary electrode can be an auxiliary cathode.

[0095] For example, the light-emitting functional part is configured to emit red light. Of course, the embodiments of the present disclosure are not limited thereto, and can also emit light of other colors.

[0096] In some examples, as shown in FIG. 4, the light-emitting component 100 further includes a buffer layer 140, a metal trace layer 145, a passivation layer 150, and a metal connecting line 155. The buffer layer 140 is disposed on the substrate 110, the metal trace layer 145 is disposed on the side of the buffer layer 140 away from the substrate 110, the passivation layer 150 is disposed on the side of the metal trace layer 145 away from the substrate 110, and includes a connecting opening 1500 exposing the metal trace layer 145, and the metal connecting line 155 is disposed in the connecting opening 1500 and connected to the exposed metal trace layer 145. The metal connecting line 155 is connected to the first electrode 121. The metal trace layer 145 is connected to the first electrode 121 through the metal connecting line 155, so that the light-emitting control of the light-emitting component 100 can be realized through the metal trace layer 145 and the metal connecting line 155.

[0097] FIG. 6 is a partial structure schematic view of the light-emitting component shown in FIG. 4 along another direction. As shown in FIG. 6, the metal connecting line 155 of the light-emitting component 100 is connected to the first electrode 121.

[0098] For example, as shown in FIG. 6, the metal connecting line 155 and the first electrode 121 are formed by the same material through the same patterning process, thereby realizing the connection between the metal connecting line 155 and the first electrode 121. Of course, the embodiments of the present disclosure are not limited thereto.

[0099] In some examples, as shown in FIG. 4, the metal trace layer 145 includes a plurality of metal traces 1450, and the first electrode 121 is disposed spaced apart from the metal traces 1450.

[0100] In some examples, as shown in FIG. 4, the orthographic projection of the light-transmissive opening 1250 on the substrate 110 does not overlap with the orthographic projection of the plurality of metal traces 1450 on the substrate 110.

[0101] For example, the substrate can be a rigid substrate, such as a glass substrate, etc. For example, the substrate can also be a flexible substrate, such as a polyimide substrate, etc., which is not limited in the present disclosure.

[0102] In some examples, as shown in FIG. 4, the light-emitting assembly 100 further includes an encapsulation layer 160 disposed on the side of the auxiliary electrode 125 away from the second electrode 124, the encapsulation layer 160 includes a first inorganic encapsulation layer 161, an organic encapsulation layer 162, and a second inorganic encapsulation layer 163 stacked, the organic encapsulation layer 162 is disposed on the side of the first inorganic encapsulation layer 161 away from the auxiliary electrode 125, the second inorganic encapsulation layer 163 is disposed on the side of the organic encapsulation layer 162 away from the first inorganic encapsulation layer 161, and the thickness uniformity of at least one of the first inorganic encapsulation layer 161 and the second inorganic encapsulation layer 163 is not less than 60%.

[0103] FIG. 7 is a structural schematic diagram of an encapsulation layer according to an embodiment of the present disclosure. As shown in FIG. 7, the encapsulation layer 160 has a top edge thickness Dt at the top edge, a side edge thickness Ds at the side edge, and a bottom edge thickness Db at the bottom edge. The thickness uniformity of the encapsulation layer 160 includes the side edge thickness uniformity and the bottom edge thickness uniformity. The side edge thickness uniformity is the ratio of the side edge thickness Ds to the top edge thickness Dt, and the bottom edge thickness uniformity is the ratio of the bottom edge thickness Db to the top edge thickness Dt. When the side edge thickness uniformity and the bottom edge thickness uniformity are both not less than 60%, the thickness uniformity of the encapsulation layer 160 satisfies not less than 60%.

[0104] In this embodiment, by making the thickness uniformity of at least one of the first inorganic encapsulation layer 161 and the second inorganic encapsulation layer 163 not less than 60%, the encapsulation layer 160 has better filling and climbing properties, and the encapsulation layer 160 has better wrapping and covering properties. For example, the encapsulation layer can better wrap the particulate matter brought by the production line or the evaporation of the second electrode 124, and can effectively prevent the immersion corrosion of water and oxygen and sulfides in the external environment, thereby significantly improving the reliability of the encapsulation. For example, when the optical assembly is used for an automobile tail light, the better encapsulation effect can better prevent the immersion of automobile exhaust, thereby improving the service life of the optical assembly and the automobile tail light.

[0105] For example, the at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer includes the first inorganic encapsulation layer, the second inorganic encapsulation layer, and the first inorganic encapsulation layer and the second inorganic encapsulation layer, which will not be repeated here.

[0106] For example, the thickness uniformity of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer is not less than 70%. For example, the thickness uniformity of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer is not less than 80%. For example, the thickness uniformity of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer is not less than 90%. For example, the thickness uniformity of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer is not less than 95%.

[0107] For example, at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer can be formed by an atomic layer deposition (ALD) process. The atomic layer deposition process has better filling performance, and can evaporate a thin film layer with higher thickness uniformity and very high density on a non-flat surface. The thickness uniformity is significantly improved compared with a conventional encapsulation process, for example, the thickness uniformity can be more than 90%, for example, the thickness uniformity can be more than 95%.

[0108] FIG. 8 is a structural schematic diagram of another encapsulation layer provided by an embodiment of the present disclosure. As shown in FIG. 8, a thin film layer with uniform thickness and very high density is formed on the non-flat surface of the film layer 01. The encapsulation layer 02 not only has better thickness uniformity, but also can better fill the non-flat surface. For example, the encapsulation layer 02 can be the first inorganic encapsulation layer and / or the second inorganic encapsulation layer described above. For example, the film layer 01 can be the auxiliary electrode or the organic encapsulation layer described above. It should be noted that, in order to more clearly show the filling effect of the encapsulation layer, the film layer 01 and the encapsulation layer 02 in the figure are displayed by micro-particles.

[0109] For example, as shown in FIG. 8, the surface of the film layer 01 includes a micro-channel 011, and the encapsulation layer 02 is partially located in the micro-channel 011. Thus, the film layer 01 can better fill the micro-channel 011 on the non-flat surface. For example, the encapsulation layer further includes a third inorganic encapsulation layer arranged between the first inorganic encapsulation layer and the organic encapsulation layer. The embodiments of the present disclosure do not limit this.

[0110] FIG. 9 is a diagram of reliability test results of the encapsulation layer according to an embodiment of the present disclosure. As shown in FIG. 9, the encapsulation layer of scheme one includes inorganic encapsulation layer, organic encapsulation layer and inorganic encapsulation layer which are sequentially stacked, both of the inorganic encapsulation layers are thin film encapsulation layers formed by chemical vapor deposition, the organic encapsulation layer is formed by inkjet printing process and has a thickness of 8 μm; the encapsulation layer of scheme two includes first inorganic encapsulation layer, organic encapsulation layer and second inorganic encapsulation layer which are sequentially stacked, the first inorganic encapsulation layer is a thin film encapsulation layer formed by atomic layer deposition process, the second inorganic encapsulation layer is a thin film encapsulation layer formed by chemical vapor deposition, the material of the first inorganic encapsulation layer is aluminum oxide (Al2O3) and has a thickness of 50 nm, the material of the second inorganic encapsulation layer is silicon nitride (SiNx) and has a thickness of 600 nm, the organic encapsulation layer is formed by inkjet printing process and has a thickness of 8 μm; the encapsulation layer of scheme three includes first inorganic encapsulation layer, organic encapsulation layer and second inorganic encapsulation layer which are sequentially stacked, the first inorganic encapsulation layer is a thin film encapsulation layer formed by atomic layer deposition process, the second inorganic encapsulation layer is a thin film encapsulation layer formed by chemical vapor deposition, the material of the first inorganic encapsulation layer is silicon oxide (SiO2) and has a thickness of 50 nm, the material of the second inorganic encapsulation layer is silicon nitride (SiNx) and has a thickness of 600 nm, the organic encapsulation layer is formed by inkjet printing process and has a thickness of 8 μm; the encapsulation layer of scheme four includes first inorganic encapsulation layer, third inorganic encapsulation layer, organic encapsulation layer and second inorganic encapsulation layer which are sequentially stacked, the first inorganic encapsulation layer is a thin film encapsulation layer formed by atomic layer deposition process, the second inorganic encapsulation layer and the third inorganic encapsulation layer are both thin film encapsulation layers formed by chemical vapor deposition, the material of the first inorganic encapsulation layer is silicon oxide (SiO2) and has a thickness of 50 nm, the materials of the second inorganic encapsulation layer and the third inorganic encapsulation layer are both silicon nitride (SiNx) and have a thickness of 300 nm, the organic encapsulation layer is formed by inkjet printing process and has a thickness of 8 μm.

[0111] In this example, the first inorganic encapsulation layer of scheme one is a thin film encapsulation layer formed by chemical vapor deposition, and the first inorganic encapsulation layer of scheme two, scheme three and scheme four are all thin film encapsulation layers formed by atomic layer deposition process. As shown in FIG. 9, under the test conditions of 85 degrees Celsius high temperature and 85% high humidity, the failure time of scheme two, scheme three and scheme four are all higher than that of scheme one under the same test time. For example, under the same conditions, the failure time of scheme three is twice that of scheme one, which better improves the reliability of the encapsulation layer. For example, scheme four adds a third inorganic encapsulation layer relative to scheme three, and the failure time of scheme four is further improved compared with scheme three. For example, the material of the first inorganic encapsulation layer of scheme one is aluminum oxide (Al2O3), and the failure does not occur after the test time reaches 1000 hours. Thus, the encapsulation layer according to the embodiments of the present disclosure has better reliability.

[0112] In some examples, the refractive index of the organic encapsulation layer is greater than the refractive index of the first inorganic encapsulation layer, and the refractive index of the second inorganic encapsulation layer is greater than the refractive index of the organic encapsulation layer. The condition of total reflection of light, i.e., the propagation path of light from a low refractive index medium to a high refractive index medium, will produce the phenomenon of total reflection. Thus, not only can the light propagation reflectivity be improved, the luminous brightness and luminous efficiency of the light-emitting assembly can be improved, but also the temperature rise of the second electrode and the auxiliary electrode can be reduced, and the service life of the light-emitting assembly can be improved.

[0113] For example, the refractive index of the first inorganic encapsulation layer is greater than 1.4, the refractive index of the organic encapsulation layer is greater than 1.6, and the refractive index of the second inorganic encapsulation layer is greater than 1.7. The refractive index of the first inorganic encapsulation layer, the organic encapsulation layer and the second inorganic encapsulation layer is not limited in the embodiments of the present disclosure, and can be selected according to the material.

[0114] FIG. 10A is a schematic diagram of an optical path of the optical assembly shown in FIG. 4. As shown in FIG. 4 and FIG. 10A, the thickness of the first inorganic encapsulation layer 161 is d1, the incident angle of the light incident to the first inorganic encapsulation layer 161 is θ, and when d1sinθ=±kλ is satisfied, the interference of the light causes the light intensity to superimpose on each other, at this time, the reflected light is the strongest. λ is the wavelength of the light, θ is in the range of 0 degrees to 90 degrees, and k is an integer greater than or equal to 0. Thus, the thickness of the first inorganic encapsulation layer 161 can be set according to the wavelength of the light or the value of k, so that the reflected light is the strongest to improve the light propagation reflectivity, improve the luminous brightness and luminous efficiency of the light-emitting assembly 100. Of course, the present disclosure is not limited thereto. When d1sinθ=±(2k+1)λ / 2 is satisfied, the interference of the light causes the light intensity to cancel each other, and the reflected light is the weakest. For example, d1sinθ can not be equal to ±(2k+1)λ / 2 to set the thickness of the first inorganic encapsulation layer 161. For example, λ can be the wavelength of red light.

[0115] FIG. 10B is a schematic diagram of light intensity superposition and light intensity cancellation provided by an embodiment of the present disclosure. As shown in FIG. 10B, when two or more light rays meet, an interference phenomenon occurs. For example, as shown in (a) of FIG. 10B, when the phase difference between the light ray a1 and the light ray a2 is an integer multiple of the wavelength, the interference of the light causes the light intensity to superimpose, at this time, the light intensity of the interference light ray a3 is the strongest. For example, as shown in (b) of FIG. 10B, when the phase difference between the light ray b1 and the light ray b2 is (2k+1) / 2 times the wavelength, the interference of the light causes the light intensity to cancel, at this time, the light intensity of the interference light ray b3 is the weakest.

[0116] In some examples, as shown in FIG. 4 and FIG. 10A, the thickness of the organic encapsulation layer 162 is d2, the incident angle of the light incident to the organic encapsulation layer 162 is θ, and when d2sinθ = ±kλ is satisfied, the interference of the light causes the light intensity to superimpose on each other, at this time, the reflected light is the strongest. Therefore, the thickness of the organic encapsulation layer 162 can be set according to the wavelength of the light or the value of k, so that the reflected light is the strongest to improve the propagation reflectivity of the light, improve the luminous brightness and luminous efficiency of the light emitting component 100. Of course, the present embodiment is not limited to this. For example, d2sinθ can also be not equal to ±(2k+1)λ / 2 to set the thickness of the organic encapsulation layer 162.

[0117] In some examples, as shown in FIG. 4 and FIG. 10A, the thickness of the second inorganic encapsulation layer 163 is d3, the incident angle of the light incident to the second inorganic encapsulation layer 163 is θ, and when d3sinθ = ±kλ is satisfied, the interference of the light causes the light intensity to superimpose on each other, at this time, the reflected light is the strongest. Therefore, the thickness of the second inorganic encapsulation layer 163 can be set according to the wavelength of the light or the value of k, so that the reflected light is the strongest to improve the propagation reflectivity of the light, improve the luminous brightness and luminous efficiency of the light emitting component 100. Of course, the present embodiment is not limited to this. For example, d3sinθ can also be not equal to ±(2k+1)λ / 2 to set the thickness of the second inorganic encapsulation layer 163.

[0118] In some examples, as shown in FIG. 4 and FIG. 10A, for the light incident to the first inorganic encapsulation layer 161, the organic encapsulation layer 162, and the second inorganic encapsulation layer 163 at an incident angle of θ, d1sinθ = d2sinθ can be made, and both are not equal to ±(2k+1)λ / 2. For example, d1sinθ = d2sinθ = ±kλ can be made. Of course, the present embodiment is not limited to this. For example, d1sinθ = d3sinθ can also be made, and both are not equal to ±(2k+1)λ / 2. For example, d1sinθ = d3sinθ = ±kλ can be made. For example, d2sinθ = d3sinθ can also be made, and both are not equal to ±(2k+1)λ / 2. For example, d2sinθ = d3sinθ = ±kλ can be made.

[0119] In some examples, as shown in FIG. 4 and FIG. 10A, for the light incident to the first inorganic encapsulation layer 161, the organic encapsulation layer 162, and the second inorganic encapsulation layer 163 at an incident angle of θ, d1sinθ = d2sinθ = d3sinθ can be made, and all are not equal to ±(2k+1)λ / 2.

[0120] In some examples, as shown in FIG. 4 and FIG. 10A, for the light incident to the first inorganic encapsulation layer 161, the organic encapsulation layer 162, and the second inorganic encapsulation layer 163 at an incident angle of θ, d1sinθ = d2sinθ = d3sinθ = ±kλ can be made.

[0121] In some examples, as shown in FIG. 4 , the light emitting component 100 further includes an optical adhesive 170 and a cover plate 180 . The optical adhesive 170 is disposed on a side of the packaging layer 160 away from the second electrode 124 , and the cover plate 180 is disposed on a side of the optical adhesive 170 away from the packaging layer 160 .

[0122] For example, the refractive index of the optical adhesive is greater than or equal to the refractive index of the second inorganic encapsulation layer. For example, the refractive index of the optical adhesive can be greater than the refractive index of the second inorganic encapsulation layer, thereby utilizing the principle of total reflection of light to increase the propagation reflectivity of light and improve the luminous brightness and luminous efficiency of the light-emitting component 100.

[0123] FIG11 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present disclosure. As shown in FIG11 , the light-emitting assembly 100 includes a substrate 110 and a light-emitting device 120 disposed on the substrate 110. The light-emitting device 120 includes a first electrode 121, a light-emitting defining layer 122, a light-emitting functional layer 123, a second electrode 124, and an auxiliary electrode 125. The light-emitting defining layer 122 is disposed on a side of the first electrode 121 away from the substrate 110 and includes a light-emitting opening 1220 exposing the first electrode 121. The light-emitting functional layer 123 is disposed on a side of the light-emitting defining layer 122 away from the substrate 110. The second electrode 124 is disposed on a side of the light-emitting functional layer 123 away from the first electrode 121. The auxiliary electrode 125 is disposed on a side of the second electrode 124 away from the light-emitting functional layer 123. The light-emitting functional layer 123 includes a light-emitting functional portion 1230, which is disposed in the light-emitting opening 1220 and contacts the exposed first electrode 121. The auxiliary electrode 125 includes a light-transmitting opening 1250, the orthographic projection of the light-transmitting opening 1250 on the base substrate 110 overlaps with the orthographic projection of the light-emitting functional portion 1230 on the base substrate 110. The beneficial technical effects of the light-emitting component 100 are described above and will not be repeated here.

[0124] For example, the light-transmitting opening in this example is the same as the light-transmitting opening in the previous text, and will not be described again here.

[0125] For example, the auxiliary electrode may be formed first, and then the light-transmitting opening may be formed. The present disclosure does not limit the process for forming the light-transmitting opening. For example, the light-transmitting opening may be formed using an etching process. For example, the light-transmitting opening may be formed using a laser etching process.

[0126] An embodiment of the present disclosure also provides a vehicle lamp. Figure 12 is a schematic diagram of a vehicle lamp provided by an embodiment of the present disclosure. As shown in Figure 12, vehicle lamp 200 includes any of the aforementioned light-emitting assemblies 100. Thus, vehicle lamp 200 exhibits the same beneficial technical effects as those of the aforementioned light-emitting assemblies 100, which are not further detailed here.

[0127] For example, the vehicle lamp can be a tail lamp. For example, the vehicle lamp can be a car tail lamp. Of course, the embodiments of the present disclosure are not limited thereto.

[0128] FIG. 13 is a structural schematic diagram of another vehicle lamp according to an embodiment of the present disclosure. As shown in FIG. 13, the vehicle lamp 200 further includes a light-transmitting component 210 and a bottom plate 220, and the light-emitting component 100 is disposed between the light-transmitting component 210 and the bottom plate 220, and the first electrode of the light-emitting component 100 is located on the side of the substrate away from the light-transmitting component 210. The light emitted from the substrate passes through the light-transmitting component 210 and is emitted, so that the vehicle lamp 200 can emit light. It should be noted that the relative position relationship of the light-emitting component 100, the light-transmitting component 210 and the bottom plate 220 is only schematically shown, and the connection relationship, shape, distance, size, etc. of the light-emitting component 100, the light-transmitting component 210 and the bottom plate 220 are not limited.

[0129] In some examples, as shown in FIG. 13, the bottom plate 220 includes a texture 221. When the light-emitting component 100 does not emit light, since the auxiliary electrode of the light-emitting component 100 includes a light-transmitting opening, light from the outside of the vehicle lamp 200 can be incident on the bottom plate 220 in sequence via the light-transmitting component 210 and the light-transmitting opening of the light-emitting component 100, and the outside of the vehicle lamp 200 is the side of the light-transmitting component 210 away from the light-emitting component 100, so that the texture 221 of the bottom plate 220 can be seen from the outside of the vehicle lamp 200, thereby the application effect of the light-emitting component can be expanded. It should be noted that the bottom plate 220 includes the texture 221 is only schematically shown, and the shape, style, position on the bottom plate 220, etc. of the texture 221 are not limited.

[0130] The embodiments of the present disclosure further provide a manufacturing method of a light-emitting component. FIG. 14 is a manufacturing method of a light-emitting component according to an embodiment of the present disclosure. As shown in FIG. 14, the manufacturing method includes:

[0131] S100: forming a first electrode on a substrate;

[0132] S200: forming a light-emitting limiting layer on the side of the first electrode away from the substrate, and the light-emitting limiting layer includes a light-emitting opening exposing the first electrode;

[0133] S300: forming a light-emitting functional layer on the side of the light-emitting limiting layer away from the substrate;

[0134] S400: forming a second electrode on the side of the light-emitting functional layer away from the light-emitting limiting layer;

[0135] S500: forming an auxiliary electrode on a side of the second electrode away from the light-emitting functional layer, the first electrode, the light-emitting limiting layer, the light-emitting functional layer, the second electrode and the auxiliary electrode forming a light-emitting device on the substrate, the light-emitting functional layer comprising a light-emitting functional part, the light-emitting functional part being arranged in the light-emitting opening and in contact with the exposed first electrode, the auxiliary electrode comprising a light-transmitting opening, a normal projection of the light-transmitting opening on the substrate overlapping a normal projection of the light-emitting functional part on the substrate.

[0136] In the manufacturing method of the light-emitting assembly provided in the embodiments of the present disclosure, the second electrode is provided with an auxiliary electrode on a side away from the light-emitting functional layer. On the one hand, the auxiliary electrode can reduce the resistance and the cross voltage, and ultimately achieve the technical effect of reducing the temperature rise and improving the service life of the light-emitting assembly. On the other hand, the auxiliary electrode can also avoid forming a second electrode that is too thick, thereby reducing the time for forming the second electrode and reducing the production capacity loss of forming the second electrode. On the other hand, a light-transmitting opening can be provided on the auxiliary electrode, thereby improving the service life and luminous brightness of the light-emitting assembly and expanding the application effect of the light-emitting assembly.

[0137] In the manufacturing method of the light-emitting assembly provided in the embodiments of the present disclosure, the auxiliary electrode is provided with a light-transmitting opening, a normal projection of the light-transmitting opening on the substrate overlapping a normal projection of the light-emitting functional part on the substrate. Part of the light emitted by the light-emitting functional part can pass through the light-transmitting opening after passing through the second electrode. The provision of the light-transmitting opening can improve the light transmittance of the auxiliary electrode and reduce the electrode heating problem caused by the absorption of light emitted by the light-emitting functional part by the auxiliary electrode, thereby reducing the influence of electrode heating on the service life of the light-emitting assembly. The auxiliary electrode can also reflect the light emitted by the light-emitting functional part at positions other than the light-transmitting opening, thereby ensuring the brightness of the light-emitting assembly. Therefore, the provision of the light-transmitting opening can balance the light transmittance and reflectivity of the auxiliary electrode, thereby ensuring the service life and luminous brightness of the light-emitting assembly. For example, by adjusting the size of the light-transmitting opening, the luminous brightness can be improved as much as possible under the premise of ensuring the design service life, or the service life can be improved as much as possible under the premise of ensuring the design luminous brightness.

[0138] In the light-emitting assembly provided in the embodiments of the present disclosure, the light-transmitting opening increases the light transmittance of the auxiliary electrode. When the light-emitting assembly is not emitting light, the design on the side of the light-emitting assembly away from the substrate can be seen through the auxiliary electrode, thereby achieving a transparent effect and expanding the application effect of the light-emitting assembly.

[0139] In some examples, forming the auxiliary electrode on the side of the second electrode away from the light-emitting functional layer includes: forming an electrode patterning structure on the second electrode; and forming the auxiliary electrode including a light-transmitting opening on the second electrode, the electrode patterning structure being configured to cause the material of the auxiliary electrode to not adhere to the electrode patterning structure, and the light transmittance of the electrode patterning structure being not less than 50%, the light-transmitting opening exposing at least a portion of the electrode patterning structure.

[0140] In this example, since the material of the auxiliary electrode does not adhere to the electrode patterning structure, the material of the electrode patterning structure does not stick to the material of the auxiliary electrode, and the auxiliary electrode is difficult to adhere at the position of the electrode patterning structure, thereby achieving patterning of the auxiliary electrode. The light-transmitting opening can be formed at the position of the electrode patterning structure through the electrode patterning structure, and the process is simple, avoiding adverse effects on the auxiliary electrode caused by forming the light-transmitting opening on the auxiliary electrode by other methods. In addition, the electrode patterning structure can make the layer where the auxiliary electrode is located flat, so that the subsequent packaging process is more stable and reliable.

[0141] For example, the orthogonal projection of the electrode patterning structure on the substrate substrate overlaps the orthogonal projection of the light-emitting functional part on the substrate substrate. For example, the orthogonal projection of the electrode patterning structure on the substrate substrate overlaps the orthogonal projection of the first electrode on the substrate substrate.

[0142] For example, the second electrode layer can be evaporated first, then the electrode patterning structure can be evaporated on the second electrode layer, and finally the auxiliary electrode layer can be evaporated. Since the material of the auxiliary electrode does not adhere to the electrode patterning structure, there is no auxiliary electrode at the position of the electrode patterning structure, thereby forming a light-transmitting opening at the electrode patterning structure.

[0143] In some examples, forming the auxiliary electrode on the side of the second electrode away from the light-emitting functional layer includes: forming an auxiliary electrode material layer on the side of the second electrode away from the light-emitting functional layer; and performing opening on the auxiliary electrode material layer to form the auxiliary electrode including a light-transmitting opening. The forming process of the light-transmitting opening is not limited in the embodiments of the present disclosure. For example, an etching process can be used. For example, a laser etching process can be used.

[0144] In some examples, the light-emitting component further includes a packaging layer disposed on the side of the auxiliary electrode away from the second electrode, the packaging layer including a first inorganic packaging layer, an organic packaging layer, and a second inorganic packaging layer stacked, the organic packaging layer being disposed on the side of the first inorganic packaging layer away from the auxiliary electrode, and the second inorganic packaging layer being disposed on the side of the organic packaging layer away from the first inorganic packaging layer. The manufacturing method further includes: forming at least one of the first inorganic packaging layer and the second inorganic packaging layer by using an atomic layer deposition process.

[0145] In this example, the atomic layer deposition process has better filling performance, can evaporate a thin film layer with higher thickness uniformity and very high density on a non-flat surface, and the thickness uniformity is significantly improved compared with the conventional packaging process, for example, the thickness uniformity can reach more than 90%, for example, the thickness uniformity can reach more than 95%. The atomic layer deposition process has better wrapping and covering performance, not only can better wrap the particulate matter brought by the production line or the evaporation of the second electrode, but also can effectively prevent the immersion and corrosion of water and oxygen, sulfides in the external environment, thereby, the reliability of the packaging can be significantly improved.

[0146] For example, the first inorganic packaging layer can be formed by using an atomic layer deposition process, the organic packaging layer can be formed by using an ink jet printing (IJP) process, and the second inorganic packaging layer can be formed by using a chemical vapor deposition (CVD) process.

[0147] For example, the material of the first inorganic packaging layer includes aluminum oxide (Al2O3) or silicon oxide (SiO2). For example, the material of the second inorganic packaging layer includes silicon nitride (SiNx).

[0148] For example, the thickness of the first inorganic packaging layer is in the range of tens of nanometers. For example, the thickness of the first inorganic packaging layer is 50 nm. For example, the thickness of the second inorganic packaging layer is in the range of hundreds of nanometers. For example, the thickness of the second inorganic packaging layer is 600 nm. For example, the thickness of the organic packaging layer is in the range of several micrometers. For example, the thickness of the organic packaging layer is 8 μm.

[0149] For example, the packaging layer further includes a third inorganic packaging layer arranged between the first inorganic packaging layer and the organic packaging layer. For example, the first inorganic packaging layer can be formed by using an atomic layer deposition process, the third inorganic packaging layer can be formed by using a chemical vapor deposition process, the organic packaging layer can be formed by using an ink jet printing (IJP) process, and the second inorganic packaging layer can be formed by using a chemical vapor deposition process. For example, the thicknesses of the second inorganic packaging layer and the third inorganic packaging layer are 300 nm respectively.

[0150] The following points need to be explained:

[0151] (1) In the drawings of the embodiments of the present disclosure, only the structures related to the embodiments of the present disclosure are involved, and other structures can be referred to the general design.

[0152] (2) In the case of no conflict, the features in the same embodiment and different embodiments of the present disclosure can be combined with each other.

[0153] The above merely describes specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A light emitting assembly comprising a substrate and a light emitting device arranged on the substrate, wherein: The light emitting device comprises: a first electrode; a light-emitting defining layer, disposed on a side of the first electrode away from the base substrate, and comprising a light-emitting opening exposing the first electrode; A light-emitting functional layer is provided on a side of the light-emitting defining layer away from the base substrate; a second electrode, disposed on a side of the light-emitting functional layer away from the first electrode; and an auxiliary electrode, arranged on a side of the second electrode away from the light-emitting functional layer, Wherein, the light-emitting functional layer includes a light-emitting functional portion, and the light-emitting functional portion is arranged in the light-emitting opening and contacts the exposed first electrode; The auxiliary electrode includes a light-transmitting opening, and an orthographic projection of the light-transmitting opening on the base substrate overlaps with an orthographic projection of the light-emitting functional portion on the base substrate.

2. The light emitting assembly according to claim 1, wherein: The ratio of the area of ​​the orthographic projection of the light-transmitting opening on the base substrate to the area of ​​the orthographic projection of the light-emitting functional portion on the base substrate is not less than 1 / 5.

3. The light emitting assembly according to claim 1, further comprising: Electrode patterning structure, The electrode patterned structure is configured so that the material of the auxiliary electrode does not adhere to the electrode patterned structure, and the light transmittance of the electrode patterned structure is not less than 50%, and the light-transmitting opening exposes at least a portion of the electrode patterned structure.

4. The light emitting assembly according to claim 3, wherein: The material of the electrode patterned structure includes an organic fluorine-containing material.

5. The light emitting assembly according to claim 3, wherein: The ratio of the size of the electrode patterned structure in the direction perpendicular to the base substrate to the size of the auxiliary electrode in the direction perpendicular to the base substrate ranges from 0.7 to 1.

3. The light emitting assembly according to claim 3 , wherein: An orthographic projection of the electrode patterned structure on the base substrate overlaps with an orthographic projection of the light-emitting functional portion on the base substrate.

7. The light-emitting assembly according to any one of claims 1 to 6, wherein: The reflectivity of the auxiliary electrode is greater than the reflectivity of the second electrode.

8. The light emitting assembly according to any one of claims 1 to 7, wherein: The material of the second electrode includes aluminum, and the thickness of the second electrode ranges from 50 to 300 angstroms. The material of the auxiliary electrode includes magnesium-silver alloy or magnesium-aluminum alloy, and the thickness of the auxiliary electrode ranges from 500 to 2000 angstroms.

9. The light-emitting assembly according to any one of claims 1 to 8, further comprising: a buffer layer, disposed on the base substrate; a metal wiring layer, disposed on a side of the buffer layer away from the substrate; a passivation layer, disposed on a side of the metal wiring layer away from the substrate, and comprising a connection opening exposing the metal wiring layer; as well as a metal connecting line, disposed in the connecting opening and connected to the exposed metal wiring layer; Wherein, the metal connecting wire is connected to the first electrode.

10. The light emitting assembly according to claim 9, wherein: The metal wiring layer includes a plurality of metal wirings, and the orthographic projection of the light-transmitting opening on the base substrate does not overlap with the orthographic projection of the plurality of metal wirings on the base substrate.

11. The light emitting assembly according to any one of claims 1 to 10, further comprising an encapsulation layer provided on a side of the auxiliary electrode away from the second electrode, wherein: The encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, the organic encapsulation layer being arranged on a side of the first inorganic encapsulation layer away from the auxiliary electrode, and the second inorganic encapsulation layer being arranged on a side of the organic encapsulation layer away from the first inorganic encapsulation layer. The thickness uniformity of at least one of the first inorganic encapsulating layer and the second inorganic encapsulating layer is not less than 60%.

12. The light emitting assembly according to claim 11, wherein: The refractive index of the organic encapsulation layer is greater than that of the first inorganic encapsulation layer, and the refractive index of the second inorganic encapsulation layer is greater than that of the organic encapsulation layer.

13. The light emitting assembly according to claim 12, wherein: The refractive index of the first inorganic encapsulation layer is greater than 1.4, the refractive index of the organic encapsulation layer is greater than 1.6, and the refractive index of the second inorganic encapsulation layer is greater than 1.

7.

14. The light emitting assembly according to any one of claims 11 to 13, wherein: The incident angle of light incident on the first inorganic encapsulation layer, the organic encapsulation layer, and the second inorganic encapsulation layer is θ, and the thicknesses of the first inorganic encapsulation layer, the organic encapsulation layer, and the second inorganic encapsulation layer are d1, d2, and d3, respectively. d1, d2, and d3 satisfy the following formula: d1sinθ=d2sinθ=d3sinθ, and are not equal to ±(2k+1)λ / 2, Wherein, λ is the wavelength of light emitted by the light-emitting functional portion, θ is in the range of 0 degrees to 90 degrees, and k is an integer greater than or equal to 0.

15. The light emitting assembly according to claim 14, wherein: d1, d2 and d3 satisfy the following formula: d1sinθ=d2sinθ=d3sinθ=±kλ.

16. The light-emitting assembly according to any one of claims 11 to 15, further comprising: Optical adhesive, disposed on a side of the packaging layer away from the second electrode; as well as A cover plate is arranged on a side of the optical adhesive away from the packaging layer, Wherein, the refractive index of the optical adhesive is greater than or equal to the refractive index of the second inorganic encapsulation layer.

17. A vehicle lamp comprising the light-emitting assembly according to any one of claims 1 to 16.

18. A method for manufacturing a light-emitting component, comprising: forming a first electrode on the base substrate; forming a light-emitting defining layer on a side of the first electrode away from the base substrate, wherein the light-emitting defining layer includes a light-emitting opening exposing the first electrode; forming a light-emitting functional layer on a side of the light-emitting defining layer away from the base substrate; forming a second electrode on a side of the light-emitting functional layer away from the light-emitting defining layer; as well as An auxiliary electrode is formed on a side of the second electrode away from the light-emitting functional layer, The first electrode, the light-emitting defining layer, the light-emitting functional layer, the second electrode and the auxiliary electrode form a light-emitting device located on the base substrate, the light-emitting functional layer includes a light-emitting functional portion, and the light-emitting functional portion is arranged in the light-emitting opening and contacts the exposed first electrode. The auxiliary electrode includes a light-transmitting opening, and an orthographic projection of the light-transmitting opening on the base substrate overlaps with an orthographic projection of the light-emitting functional portion on the base substrate.

19. The production method according to claim 18, wherein: The forming of an auxiliary electrode on a side of the second electrode away from the light-emitting functional layer comprises: forming an electrode patterning structure on the second electrode; and forming the auxiliary electrode including the light-transmitting opening on the second electrode, The electrode patterned structure is configured so that the material of the auxiliary electrode does not adhere to the electrode patterned structure, and the light transmittance of the electrode patterned structure is not less than 50%, and the light-transmitting opening exposes the electrode patterned structure.

20. The production method according to claim 18 or 19, wherein: The light-emitting component further includes an encapsulation layer disposed on a side of the auxiliary electrode away from the second electrode, the encapsulation layer including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked together, the organic encapsulation layer being disposed on a side of the first inorganic encapsulation layer away from the auxiliary electrode, and the second inorganic encapsulation layer being disposed on a side of the organic encapsulation layer away from the first inorganic encapsulation layer. The production method further comprises: At least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer is formed by an atomic layer deposition process.

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