Preparation method of purge plate for supporting supply of nitrogen to inside of forward open wafer transfer cassette and computing device using same

Abstract

The invention discloses a preparation method of a purge plate for supporting nitrogen supply to the interior of a forward opening type wafer transfer box and computing equipment using the method. The preparation method comprises the following steps: (a) providing a solid material at four parts on a predetermined plane, and then generating a first adhesive solid material by using a predetermined adhesive supplied from a predetermined stimulus, or the first adhesive solid material generated on the solid material by using the predetermined adhesive supplied from the predetermined stimulation source is supplied to four parts on the predetermined plane to generate four pipe fitting joint parts as four first adhesive layers having a first length, a first width, and a first height, four first internal spaces are formed in a first internal height portion where the four first adhesive layers are not formed in the first height, and predetermined through holes are formed in at least a part of a surface except an upper surface located at an upper portion corresponding to the first height to form the four pipe fitting joint portions; a first internal length and a first internal width of the four first internal spaces are smaller than the first length and the first width; (b) moving the joint parts of the four pipe fittings along the direction away from the predetermined stimulation source by a length corresponding to the first height, and then moving the joint parts of the four pipe fittings along the direction away from the predetermined stimulation source by a length corresponding to the first height; a second adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulation source after the solid material is supplied to the upper portions of the four pipe fitting coupling portions corresponding to the first height; or a second adhesive layer having a second height is generated by supplying the second adhesive solid material, which is generated on the solid material using the predetermined adhesive supplied from the predetermined stimulation source, to the upper portions of the four pipe fitting joining sections corresponding to the first height and laminating the second adhesive solid material, in a portion connected to the four first internal spaces of the four pipe fitting coupling portions, four first internal spaces are formed in a first internal height portion where the second adhesive layer is not formed at the second height, and an inner side surface is specified from among the surfaces of the second adhesive layer surrounding the four first internal spaces. Four gas ducts as four second internal spaces having a second internal length and a second internal width are formed in a second internal height portion where the second adhesive layer is not formed at the second height in a direction away from the four duct fitting joining portion; four first hollow parts defined by center positions spaced apart by a predetermined distance from distal ends of the four pipe fitting joining parts among both ends of the four gas pipes are formed so as to create the second adhesive layer, a first inner length and a second inner width of the four first inner spaces being smaller than the first length and the first width, and a second inner length and a second width of the four first hollow parts being smaller than the first length and the first width. The second internal height is smaller than the second internal height; and (c) moving the four pipe fitting joining parts and the second adhesive layer by a length corresponding to the second height in a direction away from the predetermined stimulus, providing the solid material on an upper portion of the second adhesive layer, and then generating a third adhesive solid material using the predetermined adhesive supplied from the predetermined stimulus, or the third adhesive solid material generated on the solid material by using the predetermined adhesive supplied from the predetermined stimulus is supplied to the upper part of the second adhesive layer and laminated to generate a third adhesive layer having a third height, and forming four front opening type wafer transfer box combination structures which have the third height and are provided with four second hollow parts limited by the central position on the upper sides of the four first hollow parts so as to generate the third bonding layer.

Description

Technical Field

[0001] This invention relates to a method for preparing a purge plate for supporting the supply of nitrogen gas inside a forward-opening wafer transfer box, and a computing device using the method. Background Technology

[0002] Front-opening unified PODs (FOUPs) are used as containers for storing and transporting wafers, which serve as substrates for semiconductor chip fabrication. They prevent external air from directly contacting the wafers during semiconductor fabrication processes.

[0003] However, process gases used in semiconductor fabrication processes on equipment may remain on the wafers and remain inside the front-opening wafer transfer box. Therefore, the fume generated by these residual process gases directly contaminates other wafers. This fume adheres to the inner wall of the front-opening wafer transfer box and may contaminate the equipment during subsequent processing runs. Alternatively, when new wafers are loaded into the front-opening wafer transfer box, they may be contaminated by the fume, resulting in reduced wafer yield. This problem has become even more pronounced with the recent trend of semiconductor devices shrinking in size and increasing integration.

[0004] Therefore, the traditional solution to this problem is to inject nitrogen into the front-opening wafer transfer box to remove the process gases remaining inside the front-opening wafer transfer box, and to replace the inside of the front-opening wafer transfer box with nitrogen to perform purging to prevent wafer contamination.

[0005] As an example, see Figure 1 At least a portion of the first front-opening wafer transfer cassettes 210 to 240 may be provided on the first load port 110 to the fourth load port 140 of the semiconductor process equipment 100. Additionally, a first purging device 310 to a fourth purging device 340 may be installed at the lower end of the first load port 110 to the fourth load port 140 to allow nitrogen gas to be introduced from the semiconductor production line into the interior of the first front-opening wafer transfer cassettes 210 to the fourth front-opening wafer transfer cassettes 240 for purging.

[0006] That is, in such a system, nitrogen gas supplied from the semiconductor production line through a nitrogen pipeline is introduced into at least a portion of the first purging device 310 to the fourth purging device 340. When it is detected that at least a portion of the first front-opening wafer transfer box 210 to the fourth front-opening wafer transfer box 240 is installed in at least a portion of the first loading port 110 to the fourth loading port 140, nitrogen gas is introduced into the interior of at least a portion of the first front-opening wafer transfer box 110 to the fourth front-opening wafer transfer box 340 through the operation of the corresponding first purging device 310 to the fourth purging device 340, thereby performing purging.

[0007] At this time, in the method of connecting the first to fourth purging devices 310 to 340 with the first front-opening wafer transfer box 210 to 240 during purging, a purging plate is being studied into the first gap space S1 between the mounting surface on the first loading port 110 and the lower surface of the first front-opening wafer transfer box 210 and the fourth gap space S4 between the mounting surface on the fourth loading port 140 and the lower surface of the fourth front-opening wafer transfer box 240. The first to fourth purging devices 310 to 340 and the purging plate are connected by a predetermined pipe, and at least a portion of the first to fourth front-opening wafer transfer boxes 210 to 240 are purged through the purging plate.

[0008] However, the height of the first to fourth interval spaces S4 into which each purge plate is inserted is typically about 3 mm to 10 mm. In each purge plate, multiple gas pipes and multiple nozzles need to be formed within the height range of the first to fourth interval spaces S1 to S4. The multiple gas pipes are used to transport nitrogen introduced into at least a portion of the first to fourth front-opening wafer transfer boxes 210 to 240 and exhaust gas discharged from at least a portion of the first to fourth front-opening wafer transfer boxes 210 to 240. The multiple nozzles are adjacent to the multiple gas pipes and in direct contact with the first to fourth front-opening wafer transfer boxes 210 to 240. However, it is very difficult to manufacture a purge plate that meets this requirement using traditional processing techniques such as molds.

[0009] As another example, by modifying any of the existing Side Track Buffer (STB), Over Head Buffer (OHB), and Stocker, a predetermined purging device and purging plate can be installed. This allows for the purging of the front-opening wafer transfer box mounted on any of the Side Track Buffer, Over Head Buffer, and Stocker using nitrogen. Similar to the examples of loading ports 110 to 140 described above, the height between the mounting surface of any of the Side Track Buffer, Over Head Buffer, and Stocker and the lower surface of the front-opening wafer transfer box is approximately 3 mm to 10 mm. Consequently, the problem of difficulty in fabricating the purging plate using conventional processing techniques such as molds also exists.

[0010] Therefore, an improved solution is needed to address the above problems. Summary of the Invention

[0011] Technical problems to be solved

[0012] The purpose of this invention is to solve all the above-mentioned problems.

[0013] Another object of the present invention is to prepare a purge plate that can be inserted into the space between the mounting surface of any one of the loading port, side rail buffer, top buffer and storage device and the lower surface of the front-opening wafer transfer box, and to include a gas conduit and a gas nozzle, wherein the gas conduit is a movable channel for nitrogen or exhaust gas, and the gas nozzle connects the gas conduit to the front-opening wafer transfer box.

[0014] Furthermore, another object of the present invention is to generate a first adhesive solid material by providing solid material at four locations on a predetermined plane and then using a predetermined adhesive supplied from a predetermined stimulus source, or to provide the first adhesive solid material generated by applying a predetermined adhesive from a predetermined stimulus source to the four locations on the predetermined plane to generate four first adhesive layers; after moving the four first adhesive layers in a direction away from the predetermined stimulus source, providing solid material on the upper part of the four first adhesive layers, and then generating a second adhesive solid material by applying a predetermined adhesive supplied from a predetermined stimulus source, or to generate a second adhesive solid material by applying a predetermined adhesive from a predetermined stimulus source to the four locations on the predetermined plane. A second adhesive solid material, formed by the adhesive on the solid material, is provided on top of four first adhesive layers to form a second adhesive layer. After moving the four first adhesive layers and the second adhesive layer in a direction away from the predetermined stimulus, a solid material is provided on top of the second adhesive layer. Then, a third adhesive solid material is formed using a predetermined adhesive supplied from the predetermined stimulus, or the third adhesive solid material formed by the predetermined adhesive on the solid material is provided on top of the second adhesive layer to form a third adhesive layer, thereby preparing a purge plate comprising four first adhesive layers, one second adhesive layer, and four third adhesive layers.

[0015] means of solving technical problems

[0016] The features of this invention are used to achieve the objectives of this invention described above and the characteristic effects of this invention described later, and its structure is as follows.

[0017] According to an embodiment of the present invention, a method for fabricating a purge plate for supporting nitrogen supply inside a forward-open wafer transfer cassette (FOUP) is provided, comprising: (a) providing solid material at four locations on a predetermined plane and then generating a first adhesive solid material using a predetermined adhesive supplied from a predetermined stimulus source, or providing the first adhesive solid material generated by applying the predetermined adhesive from the predetermined stimulus source to the solid material at the four locations on the predetermined plane to generate four pipe fitting joints having a first length, a first width, and a first height as four first adhesive layers, wherein the four joints are not generated in the first height. The first adhesive layer forms four first internal spaces at its first internal height portion, and a predetermined through hole is formed on at least a portion of the surface except for the upper surface located at the upper part corresponding to the first height to generate the four pipe fitting joints. The first internal length and first internal width of the four first internal spaces are smaller than the first length and the first width; (b) after moving the four pipe fitting joints along a direction away from the predetermined stimulus by a length corresponding to the first height, the solid material is provided at the upper part of the four pipe fitting joints corresponding to the first height, and then the material supplied from the predetermined stimulus is used. The predetermined adhesive generates a second adhesive solid material, or the second adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimuli source to the solid material is provided to the upper part of the four pipe fitting joints corresponding to the first height and laminated to generate a second adhesive layer having a second height, wherein, in the portions connected to the four first_1 internal spaces of the four pipe fitting joints, four first_2 internal spaces are formed in the first_2 internal height portions in the second height where the second adhesive layer is not generated, and specific internal spaces are formed from the surface of the second adhesive layer surrounding the four first_2 internal spaces. On the side, facing away from the joint of the four pipe fittings, in the second internal height portion where the second adhesive layer is not generated in the second height, four gas pipes are formed as four second internal spaces having a second internal length and a second internal width. Four first hollow portions are formed by a center position that is spaced apart by a predetermined distance from the far end of the joint of the four pipe fittings at both ends of the four gas pipes, so as to generate the second adhesive layer. The first internal length and first internal width of the four first-second internal spaces are smaller than the first length and the first width, and the second internal height is smaller than the first-second internal height.And (c) after moving the four pipe fitting joints and the second adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second height, after providing the solid material on the upper part of the second adhesive layer, using the predetermined adhesive supplied from the predetermined stimulus source to generate a third adhesive solid material, or providing the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the second adhesive layer and laminating it to generate a third adhesive layer having a third height, wherein four front-opening wafer transfer box joint structures having the third height and having four second hollow portions defined by the central position are formed on the upper side of the four first hollow portions to generate the third adhesive layer.

[0018] The preparation method is characterized in that, in step (a), the following processing is performed: (i) after providing the solid material to the four locations on the predetermined plane, a first 1_1 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the first 1_1 adhesive solid material generated by applying the predetermined adhesive to the solid material using the predetermined adhesive supplied from the predetermined stimulus source is provided to the four locations on the predetermined plane to generate four first 1_1 adhesive layers having the first length and the first width and having a first 1_1 height in the first height; (ii) the four After the first adhesive layer is moved along a length corresponding to the first height in a direction away from the predetermined stimulus, a first adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus after the solid material is provided on top of the four first adhesive layers. Alternatively, the first adhesive solid material generated by applying the predetermined adhesive from the predetermined stimulus to the solid material is provided on top of the four first adhesive layers and laminated to generate four first adhesive layers having a first height in the first height, wherein the first adhesive layer is... Four first through holes are formed in the structure corresponding to the first width at the first width, along the width direction; four first 1_1_a portion interior spaces are formed in the structure corresponding to the first width at the first width, along the width direction, among the four first 1_1 interior spaces; and four second through holes are formed in the structure corresponding to the first width at the first width, along the width direction, to generate the four first 1_2 adhesive layers; and (iii) after moving the four first 1_1 adhesive layers and the four first 1_2 adhesive layers along a direction away from the predetermined stimulus source by a length corresponding to the first 1_2 height, the four first 1_2 adhesive layers are formed in the structure corresponding to the first 1_2 width at the first width. After the solid material is provided on the upper part of the composite layer, a first-third adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the first-third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided on the upper part of the four first-second adhesive layers and laminated to generate four first-third adhesive layers having a first-third height in the first height, wherein four first-first-b portion interior spaces are formed in the structure corresponding to the first-second width to generate the four first-third adhesive layers.

[0019] The preparation method is characterized in that, in step (b), the following processing is performed: (i) after moving the four pipe fitting joints along a direction away from the predetermined stimulus source by a length corresponding to the first height, after providing the solid material to the upper part of the four pipe fitting joints corresponding to the first height, a second_1 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source; or the second_1 adhesive solid material generated by applying the solid material using the predetermined adhesive supplied from the predetermined stimulus source is provided to the upper part of the four pipe fitting joints and laminated to generate a second_1 material having a second_1 height in the second height. An adhesive layer, wherein four 1_2_a portion interior spaces of the four 1_2 interior spaces are formed in the structure corresponding to the 1_2 width in the upper part of the 1_2 width corresponding to the 1_2 height of the four pipe fitting joints, and a 2_1 adhesive layer having a 2_1 length, a 2_1 width and a 2_1 height is generated from the specific inner side surface of the side surface of the 2_1 adhesive layer surrounding the four 1_2 interior spaces, toward a direction away from the four pipe fitting joints, wherein the 2_1 length and the 2_1 width are greater than the 2 interior length and the 2 interior width; (ii) the four pipe fitting joints and the 1_2_a portion interior space are connected to the 1_2 width of ... After the 2_1 adhesive layer is moved along a length corresponding to the 2_1 height in a direction away from the predetermined stimulus source, a 2_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source after the solid material is provided on the upper part of the 2_1 adhesive layer, or the 2_2 adhesive solid material generated by applying the predetermined adhesive from the predetermined stimulus source to the solid material is provided to the upper part of the 2_1 adhesive layer and laminated to generate a 2_2 adhesive layer having a 2_2 height in the 2_1 height, wherein four of the four 1_2 internal spaces are formed in the structure corresponding to the 1_2 width at the 2_1 height. The 1_2_b portion of the internal space, from the specific inner side of the side of the 2_2 adhesive layer surrounding the four 1_2 internal spaces, toward a direction away from the four pipe fitting joints, forms four gas pipes as the four 2 internal spaces, having the 2nd internal length and the 2nd internal width, and forms four 1_1 hollow portions defined by the center positions spaced apart by the predetermined distance from the far ends of the four pipe fitting joints at both ends of the four gas pipes, to generate the 2_2 adhesive layer having the 2_2 length, the 2_2 width, and the 2_2 height, the 2_2 height corresponding to the 2nd internal height;(iii) After moving the four pipe fitting joints, the second-1 adhesive layer, and the second-2 adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second-2 height, and after providing the solid material on the upper part of the second-2 adhesive layer, using the predetermined adhesive supplied from the predetermined stimulus source to generate a second-3 adhesive solid material, or providing the second-3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the second-2 adhesive layer and laminating it to generate a second-3 adhesive layer having a second-3 height in the second height, wherein four first-2 hollow portions defined by the center positions spaced apart by the predetermined distance from the distal ends of the four pipe fitting joints at both ends of the four gas pipes are formed to generate the second-3 adhesive layer having a second-3 length, a second-3 width, and a second-3 height.

[0020] The preparation method is characterized in that, in step (c), the following processing is performed: (i) after moving the four pipe fitting joints and the second adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second height, after providing the solid material on the upper part of the second adhesive layer, a third_1 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the third_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the second adhesive layer and laminated to generate a third_1 adhesive layer having a third_1 height in the third height, wherein four first_1 front-opening wafer transfer box joint details having the third_1 height and having four second_1 hollow portions defined by the center position are formed on the upper side of the four first hollow portions to generate the third_1 adhesive layer; (ii) After moving the four pipe fitting joints, the second adhesive layer, and the third_1 adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the third_1 height, and after providing the solid material on the upper part of the third_1 adhesive layer, using the predetermined adhesive supplied from the predetermined stimulus source to generate a third_2 adhesive solid material, or providing the third_2 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the third_1 adhesive layer and stacking it to generate a third_2 adhesive layer having a third_2 height in the third height, wherein four first_2 front-opening wafer transfer box joint details having the third_2 height and having four second_2 hollow portions defined by the central position are formed on the upper side of the four first_1 front-opening wafer transfer box joint details to generate the third_2 adhesive layer.

[0021] The preparation method is characterized in that, in the process (i), four first-first front-opening wafer transfer box bonding details having a third-first radius and a third-first height from the center position are formed on the upper side of the second adhesive layer to generate the third-first adhesive layer, wherein a portion of the third-first radius corresponds to the outside of the four second-first hollow portions, and in the four first-first front-opening wafer transfer box bonding details, the four second-first hollow portions defined by the center position are formed on the upper side of the four first hollow portions. In (ii), four 1_2 front-opening wafer transfer box bonding details are formed on the upper side of the 3_1 adhesive layer, each having a 3_2 radius and a 3_2 height from the center position, to generate the 3_2 adhesive layer, wherein the 3_2 radius is smaller than the 3_1 radius, a portion of the 3_2 radius corresponds to the outside of the four 2_2 hollow portions, and in the four 1_2 front-opening wafer transfer box bonding details, the four 2_2 hollow portions defined by the center position are formed on the upper side of the four 2_1 hollow portions.

[0022] The preparation method is characterized in that, in step (c), the dimensions of the four second-first hollow portions are smaller than the dimensions of the four first hollow portions, and the dimensions of the four second-first hollow portions are the same as the dimensions of the four second-second hollow portions, serving as the third adhesive layer to form the four front-opening wafer transfer box bonding structures, i.e., four gas nozzles, which are composed of the four first-first front-opening wafer transfer box bonding details and the four first-second front-opening wafer transfer box bonding details.

[0023] The preparation method is characterized by further comprising: (d) performing at least a portion of the following processes: (i) surface treatment of the four pipe fitting joints, the second adhesive layer, and the third adhesive layer by grinding; (ii) cleaning the surface-treated four pipe fitting joints, the second adhesive layer, and the third adhesive layer with a cleaning solution, and then drying the four pipe fitting joints, the second adhesive layer, and the third adhesive layer by blowing in air; and (iii) subsequent curing of the four pipe fitting joints, the second adhesive layer, and the third adhesive layer using at least a portion of a predetermined curing agent, an additional light source, and hot air.

[0024] The preparation method is characterized in that, in step (b), three guide pin insertion portions with the same size as the guide pins and having a length corresponding to the second height are further formed at the three locations where guide pins for mounting the front-opening wafer transfer box are inserted, so as to generate the second adhesive layer.

[0025] The preparation method is characterized in that, in step (b), a corresponding opening pattern is further formed that matches a specific pattern formed on the mounting surface of any one of the loading port, side track buffer (STB), over head buffer (OHB), and stocker and has a length corresponding to the second height, in order to form the second adhesive layer.

[0026] The preparation method is characterized in that, in step (a), the predetermined through holes formed in the four pipe fitting joints are formed into structures for connecting external pipes to form the four pipe fitting joints, wherein the external pipes are used to introduce nitrogen into the interior of the front-opening wafer transfer box or to discharge waste gas from the front-opening wafer transfer box.

[0027] According to another embodiment of the present invention, a computing device is provided for fabricating a purge plate that supports nitrogen supply inside a forward-open wafer transfer cassette (FOUP), comprising: at least one memory for storing instructions; and at least one processor for executing the instructions, wherein the processor performs the following processing: (I) after providing solid material at four locations on a predetermined plane, generating a first adhesive solid material using a predetermined adhesive supplied from a predetermined stimulus source, or providing the first adhesive solid material generated by applying the predetermined adhesive to the solid material using the predetermined adhesive supplied from the predetermined stimulus source to the four locations on the predetermined plane to generate a workpiece having a first length, a first width, and a first height. Four pipe fitting joints with four first adhesive layers, wherein four first internal height portions in the first height where the four first adhesive layers are not formed form four first internal spaces, and predetermined through holes are formed on at least a portion of the surface except for the upper surface located at the upper part corresponding to the first height to form the four pipe fitting joints, wherein the first internal length and the first internal width of the four first internal spaces are less than the first length and the first width; (II) after moving the four pipe fitting joints along a direction away from the predetermined stimulus source by a length corresponding to the first height, the four pipe fitting joints corresponding to the first height are... After providing the solid material to the upper part of the first height, a second adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source; or the second adhesive solid material generated by applying the predetermined adhesive from the predetermined stimulus source to the solid material is provided to the upper part of the four pipe fitting joints corresponding to the first height and laminated to generate a second adhesive layer having a second height. In the portions connecting to the four first_1 internal spaces of the four pipe fitting joints, four first_2 internal spaces are formed in the first_2 internal height portions where the second adhesive layer is not generated in the second height. The second adhesive layer is formed from the portion surrounding the four first_2 internal spaces. On a specific inner side surface of the second adhesive layer, facing away from the joint of the four pipe fittings, four gas pipes with a second internal length and a second internal width are formed as four second internal spaces in the second internal height portion where the second adhesive layer is not generated in the second height. Four first hollow portions are formed by a center position spaced apart by a predetermined distance from the far end of the joint of the four pipe fittings at both ends of the four gas pipes to generate the second adhesive layer. The first internal length and first internal width of the four first internal spaces are smaller than the first length and the first width, and the second internal height is smaller than the first internal height.And (III) after moving the four pipe fitting joints and the second adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second height, after providing the solid material on the upper part of the second adhesive layer, using the predetermined adhesive supplied from the predetermined stimulus source to generate a third adhesive solid material, or providing the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the second adhesive layer and laminating it to generate a third adhesive layer having a third height, wherein four front-opening wafer transfer box joint structures having the third height and having four second hollow portions defined by the central position are formed on the upper side of the four first hollow portions to generate the third adhesive layer.

[0028] The computing device is characterized in that the processor performs the following sub-processes in the process (I): (i) after providing the solid material to the four locations on the predetermined plane, generating a first_1 adhesive solid material using the predetermined adhesive supplied from the predetermined stimulus source, or providing the first_1 adhesive solid material generated by applying the predetermined adhesive to the solid material using the predetermined adhesive supplied from the predetermined stimulus source to the four locations on the predetermined plane to generate four first_1 adhesive layers having the first length and the first width and having a first_1 height in the first height; (ii) ... After the four first adhesive layers are moved along a length corresponding to the first height in a direction away from the predetermined stimulus, a first second adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus after the solid material is provided on the upper part of the four first adhesive layers, or the first second adhesive solid material generated by applying the predetermined adhesive from the predetermined stimulus to the solid material is provided on the upper part of the four first adhesive layers and laminated to generate four first second adhesive layers having a first second height in the first height, wherein, in the four first second adhesive layers... Four first through holes are formed in the structure corresponding to the first width of the layer at the first width of the first _1 width, and four first _1_a portion interior spaces of the four first _1 interior spaces are formed in the structure corresponding to the first width of the first _2 width at the first width of the layer. Four second through holes are formed in the structure corresponding to the first width of the first _3 width at the first width of the layer, to generate the four first _2 adhesive layers; and (iii) after moving the four first _1 adhesive layers and the four first _2 adhesive layers along a direction away from the predetermined stimulus source by a length corresponding to the first _2 height, the four first _2 After the solid material is provided on the upper part of the adhesive layer, a first-third adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the first-third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided on the upper part of the four first-second adhesive layers and laminated to generate four first-third adhesive layers having a first-third height in the first height, wherein four first-first-b portion interior spaces are formed in the structure corresponding to the first-second width to generate the four first-third adhesive layers.

[0029] The processor performs the following sub-processes in process (II): (i) after moving the four pipe fitting joints along a direction away from the predetermined stimulus source by a length corresponding to the first height, after providing the solid material to the upper part of the four pipe fitting joints corresponding to the first height, using the predetermined adhesive supplied from the predetermined stimulus source to generate a second_1 adhesive solid material, or providing the second_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the four pipe fitting joints and laminating it to generate a second_1 adhesive layer having a second_1 height in the second height, wherein In the structure corresponding to the first width in the upper part of the first height of the four pipe fitting joints, four first-2_a portion internal spaces are formed in the structure of the first width corresponding to the first height. From the specific inner side of the side of the second-1 adhesive layer surrounding the four first-2 internal spaces, toward the direction away from the four pipe fitting joints, a second-1 adhesive layer having a second-1 length, a second-1 width, and a second-1 height is generated, wherein the second-1 length and the second-1 width are greater than the second internal length and the second internal width; (ii) the four pipe fitting joints and the second-1 adhesive layer are bonded together. After the adhesive layer is moved along a length corresponding to the second-first height in a direction away from the predetermined stimulus source, a second-second adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source after the solid material is provided on the upper part of the second-first adhesive layer, or the second-second adhesive solid material generated by applying the predetermined adhesive from the predetermined stimulus source to the solid material is provided to the upper part of the second-first adhesive layer and laminated to generate a second-second adhesive layer having a second-second height in the second height, wherein four first-second internal spaces are formed in the structure corresponding to the first-second width at the second-first height. 2_b portion of the internal space, from the specific inner side of the side of the second_2 adhesive layer surrounding the four first_2 internal spaces, toward a direction away from the four pipe fitting joints, forms four gas pipes as the four second internal spaces, having the second internal length and the second internal width, forming four first_1 hollow portions defined by the center positions spaced apart by the predetermined distance from the far ends of the four pipe fitting joints at both ends of the four gas pipes, to generate the second_2 adhesive layer having the second_2 length, the second_2 width, and the second_2 height, the second_2 height corresponding to the second internal height;(iii) After moving the four pipe fitting joints, the second-1 adhesive layer, and the second-2 adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second-2 height, and after providing the solid material on the upper part of the second-2 adhesive layer, using the predetermined adhesive supplied from the predetermined stimulus source to generate a second-3 adhesive solid material, or providing the second-3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the second-2 adhesive layer and laminating it to generate a second-3 adhesive layer having a second-3 height in the second height, wherein four first-2 hollow portions defined by the center positions spaced apart by the predetermined distance from the distal ends of the four pipe fitting joints at both ends of the four gas pipes are formed to generate the second-3 adhesive layer having a second-3 length, a second-3 width, and a second-3 height.

[0030] The processor performs the following sub-processes in process (III): (i) after moving the four pipe fitting joints and the second adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second height, after providing the solid material on the upper part of the second adhesive layer, using the predetermined adhesive supplied from the predetermined stimulus source to generate a third_1 adhesive solid material, or providing the third_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the second adhesive layer and stacking it to generate a third_1 adhesive layer having a third_1 height in the third height, wherein four first_1 front-opening wafer transfer box joint details having the third_1 height and having four second_1 hollow portions defined by the center position are formed on the upper side of the four first hollow portions to generate the third_1 adhesive layer; and (i) i) After moving the four pipe fitting joints, the second adhesive layer, and the third_1 adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the third_1 height, and then providing the solid material on the upper part of the third_1 adhesive layer, a third_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source; or the third_2 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the third_1 adhesive layer and laminated to generate a third_2 adhesive layer having a third_2 height in the third height, wherein four first_2 front-opening wafer transfer box joint details having the third_2 height and having four second_2 hollow portions defined by the central position are formed on the upper side of the four first_1 front-opening wafer transfer box joint details to generate the third_2 adhesive layer.

[0031] In subprocess (i), the processor forms four 1_1 front-opening wafer transfer cassette bonding details having a 3_1 radius and a 3_1 height from the center position on the upper side of the 2nd adhesive layer to generate the 3_1 adhesive layer, wherein a portion of the 3_1 radius corresponds to the outside of the four 2_1 hollow portions, and in the four 1_1 front-opening wafer transfer cassette bonding details, the four 2_1 hollow portions defined by the center position are formed on the upper side of the four 1 hollow portions. In subprocess (ii) In the process, four front-opening wafer transfer box bonding details are formed on the upper side of the third-first adhesive layer, each having a third-second radius and a third-second height from the center position, to generate the third-second adhesive layer. The third-second radius is smaller than the third-first radius, and a portion of the third-second radius corresponds to the outside of the four second-second hollow portions. In the four front-opening wafer transfer box bonding details, the four second-second hollow portions defined by the center position are formed on the upper side of the four second-first hollow portions.

[0032] In the process (III), the processor makes the size of the four second-first hollow portions smaller than the size of the four first hollow portions, and makes the size of the four second-first hollow portions the same as the size of the four second-second hollow portions, as the third adhesive layer, forming the four front-opening wafer transfer box bonding structures, i.e., four gas nozzles, which are composed of the four first-first front-opening wafer transfer box bonding details and the four first-second front-opening wafer transfer box bonding details.

[0033] The processor also performs the following processes: (IV) performing at least a portion of the following sub-processes: (i) surface treating the surfaces of the four pipe fitting joints, the second adhesive layer, and the third adhesive layer by polishing; (ii) cleaning the surface-treated four pipe fitting joints, the second adhesive layer, and the third adhesive layer with a cleaning solution, and then drying the four pipe fitting joints, the second adhesive layer, and the third adhesive layer by blowing in air; and (iii) subsequently curing the four pipe fitting joints, the second adhesive layer, and the third adhesive layer using at least a portion of a predetermined curing agent, an additional light source, and hot air.

[0034] In the process (II), the processor further forms three guide pin insertion portions with the same size as the guide pins and having a length corresponding to the second height at the three locations where guide pins for mounting the front-opening wafer transfer box are inserted, in order to generate the second adhesive layer.

[0035] In the process (II), the processor further forms a corresponding opening pattern that matches a specific pattern formed on the mounting surface of any one of the load port, side track buffer (STB), over head buffer (OHB), and stocker, and has a length corresponding to the second height, to form the second adhesive layer.

[0036] In the process (I), the processor forms the predetermined through holes formed in the four pipe fitting joints as structures for connecting external pipes to form the four pipe fitting joints, wherein the external pipes are used to introduce nitrogen into the interior of the front-opening wafer transfer box or to discharge exhaust gas from the front-opening wafer transfer box.

[0037] Invention Effects

[0038] The advantage of this invention is that it prepares a purge plate that can be inserted into the space between the mounting surface of any one of the loading port, side rail buffer, top buffer, and storage device and the lower surface of the front-opening wafer transfer box, and includes a gas pipe and a gas nozzle, wherein the gas pipe is a movable channel for nitrogen or exhaust gas, and the gas nozzle connects the gas pipe to the front-opening wafer transfer box.

[0039] Furthermore, the advantage of this invention is that, after providing solid material at four locations on a predetermined plane, a first adhesive solid material is generated using a predetermined adhesive supplied from a predetermined stimulus source, or the first adhesive solid material generated by applying a predetermined adhesive from a predetermined stimulus source to the solid material is provided to the four locations on the predetermined plane to generate four first adhesive layers; after moving the four first adhesive layers in a direction away from the predetermined stimulus source, solid material is provided on the upper part of the four first adhesive layers, and then a second adhesive solid material is generated using a predetermined adhesive supplied from a predetermined stimulus source, or the first adhesive solid material generated by applying a predetermined adhesive from a predetermined stimulus source to the solid material is provided to the four locations on the predetermined plane to generate four first adhesive layers; A second adhesive solid material, formed by the mixture on the solid material, is provided on top of four first adhesive layers to form a second adhesive layer. After moving the four first adhesive layers and the second adhesive layer in a direction away from the predetermined stimulus, a solid material is provided on top of the second adhesive layer. Then, a third adhesive solid material is formed using a predetermined adhesive supplied from the predetermined stimulus, or the third adhesive solid material formed by the mixture on the solid material using a predetermined adhesive supplied from the predetermined stimulus is provided on top of the second adhesive layer to form a third adhesive layer, thereby preparing a purge plate comprising four first adhesive layers, one second adhesive layer, and four third adhesive layers. Attached Figure Description

[0040] The accompanying drawings, which are used to explain the embodiments of the present invention, are only some embodiments of the present invention. Those skilled in the art to which this invention pertains (hereinafter referred to as "skilled persons") can obtain other drawings based on these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram of an existing system for purging the interior of a front-opening wafer transfer box mounted on a loading port.

[0042] Figure 2 This is a schematic diagram of a computing device according to an embodiment of the present invention for fabricating a purge plate that supports the supply of nitrogen gas inside a forward-opening wafer transfer box.

[0043] Figure 3 This is a flowchart illustrating the fabrication process of a purge plate for supporting the supply of nitrogen gas inside a forward-opening wafer transfer box, according to an embodiment of the present invention.

[0044] Figures 4A to 4D This is a schematic diagram illustrating the process of generating four pipe fitting joints as four first adhesive layers according to an embodiment of the present invention.

[0045] Figures 5A to 5D This is a schematic diagram of the process of generating a second adhesive layer on the upper part of the joint of four pipe fittings according to an embodiment of the present invention.

[0046] Figures 6A to 6C This is a schematic diagram illustrating the process of generating four front-opening wafer transfer box bonding structures on the upper part of the second adhesive layer according to an embodiment of the present invention.

[0047] Figure 7 This is an example of a purge plate constructed according to an embodiment of the present invention by generating a combination structure of four pipe fitting joints, a second adhesive layer, and four front-opening wafer transfer boxes. Detailed Implementation

[0048] To clarify the objectives, technical solutions, and advantages of this invention, the invention will be described in detail below with reference to the accompanying drawings, which illustrate specific embodiments in which the invention can be implemented. These embodiments will be described in detail to enable those skilled in the art to implement the invention.

[0049] Furthermore, in the detailed description and claims of this invention, the term "comprising" and its variations are not intended to exclude other technical features, additions, components, or steps. Other objects, advantages, and features of this invention will become apparent to those skilled in the art from this specification or from practice of the invention. The following examples and drawings are provided as illustrations and are not intended to limit the invention.

[0050] Furthermore, this invention covers all possible combinations of the embodiments shown in this specification. It should be understood that the various embodiments of the invention, while potentially different, are not necessarily mutually exclusive. For example, specific shapes, structures, and features described herein may be implemented in one embodiment without departing from the spirit and scope of the invention. Moreover, it should be understood that the position or arrangement of various components in each disclosed embodiment may be changed without departing from the spirit and scope of the invention. Therefore, the following detailed description should not be considered limiting, and the scope of the invention is defined only by the appended claims and includes all equivalents thereof, provided that they can be properly described. The same or similar reference numerals in the drawings indicate the same or similar functions in several respects.

[0051] Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings in order to enable those skilled in the art to readily implement the invention.

[0052] Figure 2 This is a schematic diagram of a computing device according to an embodiment of the present invention for fabricating a purge plate that supports the supply of nitrogen gas inside a forward-opening wafer transfer box.

[0053] See Figure 2 The computing device 400 may include a memory 410 storing instructions for preparing a purge plate that supports the supply of nitrogen gas inside a forward-opening wafer transfer cassette, and a processor 420 executing the actions for preparing the purge plate that supports the supply of nitrogen gas inside a forward-opening wafer transfer cassette, corresponding to the instructions stored in the memory 410. In this case, the computing device 400 may include various computing devices such as servers, personal computers (PCs), laptops, workstations, tablets, mobile computers, PDAs / EDAs, mobile phones, smartphones, and Internet of Things (IoT) devices.

[0054] Specifically, the computing device 400 typically uses a combination of computing devices (e.g., devices that may include computer processors, memory, storage devices, input devices and output devices, other components of existing computing devices, such as routers, switches, and other electronic communication devices, and electronic information storage systems such as network-connected storage (NAS) and storage area networks (SAN)) and computer software (i.e., instructions that enable the computing device to work in a particular way) to achieve the required system performance.

[0055] In addition, the processor of a computing device may include hardware configurations such as a microprocessor (MPU) or central processing unit (CPU), cache memory, and data bus. Furthermore, the computing device may also include an operating system and software that executes application programs for specific purposes.

[0056] However, this does not preclude the possibility that the computing device includes an integrated processor that incorporates a media processor and a memory for implementing the present invention.

[0057] On the other hand, the computing device 400 can support the preparation of the purge plate by being installed in the preparation apparatus for preparing the purge plate, or, for the sake of maintenance and convenience, by being implemented in the form of an external server (or cloud server), but is not limited thereto.

[0058] For reference, with a purging device installed below the mounting surface (e.g., the upper surface) of any one of the loading port, side rail buffer, top buffer, and storage container, which converts nitrogen supplied through an external gas pipeline into one of the input / output forms of 1 in-1 out, 3 in-1 out, and 2 in-2 out to support the introduction of nitrogen into the interior of a forward-opening wafer transfer box, the purging plate to be prepared in this invention is a structure mounted on the mounting surface of any one of the loading port, side rail buffer, top buffer, and storage container, during purging... The lower end of the plate forms four pipe fitting joints to allow external gas pipes to extend from the purging device toward at least a portion of the four first adhesive layers. The upper end of the purging plate forms four gas nozzle structures to directly and tightly connect with the lower surface of the front-opening wafer transfer box, allowing nitrogen gas to be introduced into the front-opening wafer transfer box through at least a portion of the four gas nozzles. Four gas pipes (so-called internal gas pipes, described in this specification as formed within the second adhesive layer) are formed between at least a portion of the four pipe fitting joints and at least a portion of the four gas nozzles, serving as a movable internal space for nitrogen or exhaust gas. That is, any part not specifically described below should be interpreted as applicable to a general configuration suitable for any of the loading ports, side rail buffers, top buffers, and storage tanks.

[0059] Figure 3 This is a flowchart illustrating the fabrication process of a purge plate for supporting the supply of nitrogen gas inside a forward-opening wafer transfer box, according to an embodiment of the present invention.

[0060] First, a first adhesive solid material can be generated by providing solid material at four locations on a predetermined plane and then using a predetermined adhesive supplied from a predetermined stimulus source. Alternatively, the first adhesive solid material generated by using a predetermined adhesive supplied from a predetermined stimulus source to the solid material can be provided to the four locations on the predetermined plane to generate four pipe fitting joints having a first length, a first width, and a first height as four first adhesive layers. In the first height, a first_1 internal height portion where the four first adhesive layers are not generated forms four first_1 internal spaces. A predetermined through hole is formed on at least a portion of the surface except for the upper surface located at the upper part corresponding to the first height to generate four pipe fitting joints. The first_1 internal length and the first_1 internal width of the four first_1 internal spaces are less than the first length and the first width (S10).

[0061] For example, (i) a first adhesive solid material is generated by coating four portions of a solid material such as metal, polymer, or ceramic in powder form on a predetermined plane within a preparation apparatus and providing the material with the coating. Then, ink liquefied by a predetermined stimulus is sprayed onto the coated solid material according to the shape of the four first adhesive layers, acting as a predetermined adhesive to bond the solid materials. This process is repeated up to a first height. Alternatively, (ii) a first adhesive solid material is generated by coating a solid material made of various materials such as paper, glass fiber, synthetic resin, clay, or metal in the form of a film or sheet with an adhesive generated by a predetermined stimulus. The first adhesive solid material is then placed on a predetermined plane within the preparation apparatus, and processed at the four portions using a tool or laser. This process is repeated up to a first height, thereby generating four pipe fitting joints that serve as the four first adhesive layers. In this case, the adhesive layer described in this invention (including not only the four first adhesive layers but also the second and third adhesive layers described later) is defined as a solid material layer bonded by a predetermined adhesive (i.e., including the solid material and the predetermined adhesive for bonding the solid material). Even if the above is omitted below, it should be understood to include this meaning.

[0062] Alternatively, the predetermined stimulus source can be an adhesive spraying unit that, (i) provides a solid material in powder form to four locations on a predetermined plane, uses a predetermined adhesive (e.g., an ink-type adhesive for bonding powders) supplied from the predetermined stimulus source to bond molecules in the powder corresponding to predetermined regions, thereby generating a first adhesive solid material (e.g., a powder-bonded state), or (ii) provides a first adhesive solid material (e.g., a film or sheet-bonded state) generated from a sheet-type solid material using a predetermined adhesive (e.g., an adhesive for bonding sheets) supplied from the predetermined stimulus source to the four locations on the predetermined plane. The same applies to the second and third adhesive solid materials, and therefore will not be described further.

[0063] On the other hand, when generating the four pipe fitting joints, if powder material is used as the solid material, a portion of the powder material that is not bonded by the adhesive can support the second adhesive layer in the subsequent processing S20. If film or sheet-shaped material is used as the solid material, it can be processed during processing to form a structure that can support the second adhesive layer. Therefore, it is not necessary to generate a separate first auxiliary adhesive layer for supporting the second adhesive layer with the same height as the four first adhesive layers, but it is not limited to this.

[0064] Next, after moving the four pipe fitting joints along a length corresponding to the first height in a direction away from the predetermined stimulus source, a second adhesive solid material is generated using a predetermined adhesive supplied from the predetermined stimulus source after providing solid material to the upper part of the four pipe fitting joints corresponding to the first height. Alternatively, the second adhesive solid material generated by applying the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the four pipe fitting joints corresponding to the first height and laminated to generate a second adhesive layer with a second height. In the portions connected to the four first_1 internal spaces of the four pipe fitting joints, the first_2 internal height portions where the second adhesive layer is not generated in the second height form four first_1 internal height portions. The _2 internal spaces (the 1_2 internal length and 1_2 internal width of the four 1_2 internal spaces are less than the 1 length and 1 width) are formed from a specific inner side surface of the surface of the second adhesive layer surrounding the four 1_2 internal spaces, toward a direction away from the four pipe fitting joints, in the second height (the second internal height is less than the 1_2 internal height) where the second adhesive layer is not formed, forming four gas pipes with a second internal length and a second internal width, and forming four first hollow portions defined by a center position spaced apart at a predetermined distance from the far end of the four pipe fitting joints at both ends of the four gas pipes, so as to form the second adhesive layer (S20).

[0065] That is, in order to generate a second adhesive layer on top of the four first adhesive layers when four first adhesive layers have already been generated, the computing device 400 can, in the case of first providing solid material and then using adhesive to generate adhesive solid material, keep the distance from the predetermined stimulus source for supplying adhesive to the solid material constant, or, in the case of providing adhesive solid material generated by using adhesive on solid material, move the four first adhesive layers along a direction away from the predetermined stimulus source by a length corresponding to the first height, so that the distance from the predetermined stimulus source for supplying adhesive to the provided adhesive solid material remains constant, and then on top of the four first adhesive layers... A solid material in powder form is stacked, and then ink supplied from a predetermined stimulus source is sprayed onto the solid material in powder form at a second height in the shape of the second adhesive layer to generate a second adhesive solid material, thereby generating a second adhesive layer. Alternatively, after the adhesive coated on the four first adhesive solid materials that have been generated as four first adhesive layers is made into a molten state using a heated roller, a solid material in film or sheet form is coated with adhesive supplied from a predetermined stimulus source to generate a second adhesive solid material, which is then stacked on top of the four first adhesive layers and processed using a tool or laser, thereby generating a second adhesive layer.

[0066] Finally, after moving the four pipe fitting joints and the second adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second height, a third adhesive solid material is generated by providing solid material on the upper part of the second adhesive layer using a predetermined adhesive supplied from the predetermined stimulus source, or the third adhesive solid material generated by using a predetermined adhesive supplied from the predetermined stimulus source to the upper part of the second adhesive layer is provided and laminated to generate a third adhesive layer with a third height, wherein a four front-opening wafer transfer box joint structure with a third height and having four second hollow portions defined by a central position is formed on the upper side of the four first hollow portions to generate the third adhesive layer (S30).

[0067] That is, in order to generate a third adhesive layer on top of the second adhesive layer when the second adhesive layer has been generated, the computing device 400 can either keep the distance from the predetermined stimulus source for supplying the adhesive to the solid material constant when the solid material is provided first and then the adhesive solid material is generated using the adhesive, or move the four first adhesive layers and the second adhesive layer by a length corresponding to the second height in the direction away from the predetermined stimulus source so that the distance from the predetermined stimulus source for supplying the adhesive to the provided adhesive solid material remains constant, and then repeat in the same / similar manner as the lamination method in process S20 to generate a third adhesive layer on top of the second adhesive layer, thereby preparing a purge plate.

[0068] The foregoing describes the sequential generation of four pipe fitting joints, a second adhesive layer, and four front-opening wafer transfer box joint structures by performing processes S10 to S30 in sequence. However, those skilled in the art can also apply this method to prepare a purge plate by sequentially generating four front-opening wafer transfer box joint structures, a second adhesive layer, and four pipe fitting joints by performing S30, S20, and S10 in the reverse order. It should be understood that preparation in this reverse order is also included within the scope of the present invention. However, in the case of preparation in the reverse order, the first auxiliary adhesive layer may not be necessary. After generating the third adhesive layer, an additional third auxiliary adhesive layer may be needed to support the subsequently generated second adhesive layer. However, due to the reasons described in process S10 above, the third auxiliary adhesive layer may not be necessary.

[0069] Reference Figures 4A to 6C The fabrication process of the purge plate, which includes four pipe fitting joints, a second adhesive layer, and four front-opening wafer transfer box joints, is described in more detail.

[0070] Figures 4A to 4D This is a schematic diagram illustrating the process of generating four pipe fitting joints as four first adhesive layers according to an embodiment of the present invention.

[0071] See Figure 4A The diagram shows the state of four pipe fitting joints 1100 formed as four first adhesive layers. Each pipe fitting joint 1100 has a first length L1, a first width W1, and a first height H1. It is formed by providing solid material at four locations on a predetermined plane and then using an adhesive supplied from a predetermined stimulus source to generate a first adhesive solid material, or by using an adhesive supplied from a predetermined stimulus source to generate a first adhesive solid material and then providing it to the four locations on a predetermined plane. It can be used as a structure for supplying nitrogen gas into a forward-opening wafer transfer cassette through predetermined through-holes 1121 and 1123 formed in the four pipe fitting joints 1100, or for allowing exhaust gas from the forward-opening wafer transfer cassette to be discharged to the outside through predetermined through-holes 1121 and 1123. (Refer to...) Figures 4B to 4D The detailed fabrication process of the four pipe fitting joints 1100 is described.

[0072] First, see Figure 4B , Figure 4B (a) through (c) show the following states in cross-sectional form: Figure 2The computing device 400 described herein supports the generation of a first_1 adhesive solid material using an adhesive supplied from a predetermined stimulus source after providing solid material to four locations on a predetermined plane within the preparation apparatus, or supports providing the first_1 adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the four locations on a predetermined plane within the preparation apparatus, such that the first_1 adhesive solid material is stacked with a first length L1 and a first width W1. Figure 4A A portion of the first height H1 shown, namely the first_1 height H 1_1 This generates four first adhesive layers 1110. At this point, due to... Figure 4B The four first adhesive layers 1110 identified in (a) all have the same shape, therefore Figure 4B (b) and Figure 4B (c) For convenience, one of the four first adhesive layers 1110 is shown representatively. To clearly describe the detailed structure of the four first adhesive layers 1110, [the following is omitted as the text is incomplete and cannot be translated]. Figure 4B The ratio of the first length L1 and the first width W1 in (a) is shown in an enlarged form. For reference, Figure 4B (a) shows the shape of the four first adhesive layers 1110 viewed from a vertically upward perspective. Figure 4B (b) shows Figure 4B The shape of section A-A' in (a) viewed towards direction B. Figure 4B (c) shows Figure 4B The shape of section B-B' in (a) when viewed in the direction of A'.

[0073] Next, see Figure 4C , Figure 4C Images (a) to (c) show the following state in cross-sectional form: with four first adhesive layers 1110 already formed, the computing device 400 moves the four first adhesive layers 1110 in a direction away from the predetermined stimulus source, corresponding to a first height H. 1_1 The length is such that the conditions for laminating the solid material remain constant. Then, after providing solid material on top of the four first adhesive layers 1110, support the generation of the first second adhesive solid material using an adhesive supplied from a predetermined stimulus source, or support the provision of the first second adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the top of the four first adhesive layers 1110, and laminating the first second adhesive solid material on top of the four first adhesive layers 1110. Figure 4A The other part of the first height H1 shown is the first_2 height H. 1_2This generates four first-second adhesive layers 1120. For example, if the four first-first adhesive layers 1110 are formed by stacking them vertically upwards, the computing device 400 can support moving the four generated first-first adhesive layers 1110 vertically downwards by a first-first height H. 1_1 At this time, due to Figure 4C The four first and second adhesive layers 1120 identified in (a) all have the same shape, therefore Figure 4C (b) and Figure 4C (c) For convenience, one of the four first-second adhesive layers 1120 is shown representatively. To clearly describe the detailed structure of the four first-second adhesive layers 1120, [the following is omitted as the text is incomplete and cannot be translated]. Figure 4C The ratio of the first length L1 and the first width W1 in (a) is shown in an enlarged form. For reference, Figure 4C (a) shows the shape of the four first and second adhesive layers 1120 viewed from a vertically upward perspective. Figure 4C (b) shows Figure 4C The shape of section A-A' in (a) viewed towards direction B. Figure 4C (c) shows Figure 4C The shape of section B-B' in (a) when viewed in the direction of A'.

[0074] Specifically, the computing device 400 can support the generation of a first second adhesive solid material using an adhesive supplied from a predetermined stimulus source after providing solid material to the upper part of the four first first adhesive layers 1110, or support the provision of the first second adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the upper part of the four first first adhesive layers 1110, generating a material with a first second height H. 1_2 When there are four first and second adhesive layers 1120, it is possible to support the first width W1 of the four first and second adhesive layers 1120 corresponding to the first width W1. 1_1 The structure forms four first through holes 1121 along the width direction, corresponding to the first and second widths W in the first width W1. 1_2 The structure forms four 1_1 internal spaces (including four 1_1_a part internal spaces 1122 and...) Figure 4D The four interior spaces of the first 1_1_a portion 1122 of the four interior spaces of the first 1_1_b portion 1132 shown correspond to the first 1_3 width W in the first width W1. 1_3 The structure forms four second through holes 1123 along the width direction. Therefore, it can be used as a structure for connecting pipe fittings via at least a portion of the four first through holes 1121 along the width direction and the second through holes 1123 along the width direction. For reference, Figure 4CThe diagram shows four through-holes along the width direction formed only on two surfaces of the four first-second adhesive layers 1120, but one or more can also be formed. In addition to the sides, they can also be formed through the lower surface towards the ground, having a first-first height H. 1_1 The structure has a certain thickness. However, when four through holes are formed along the width direction on the lower surface, Figure 4B The computing device 400 can support the formation of four through holes along the width direction while performing the process of generating four first adhesive layers 1110.

[0075] And see also Figure 4D , Figure 4D Images (a) to (c) show the following state in cross-sectional form: with four first-1 adhesive layers 1110 and four first-2 adhesive layers 1120 generated, the computing device 400 moves the four first-1 adhesive layers 1110 and four first-2 adhesive layers 1120 in a direction away from the predetermined stimulus source, corresponding to a first-2 height H. 1_2 The length is such that the conditions for laminating the solid material remain constant. Then, after providing solid material on top of the four first-second adhesive layers 1120, support the generation of the first-third adhesive solid material using an adhesive supplied from a predetermined stimulus source, or support the provision of the first-third adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the top of the four first-second adhesive layers 1120, so that the first-third adhesive solid material is laminated on top of the four first-second adhesive layers 1120, which is a portion of the first height H1, i.e., the first-third height H. 1_3 This generates four first-third adhesive layers 1130. For example, if four first-first adhesive layers 1110 and four first-second adhesive layers 1120 are formed by stacking them vertically upwards, the computing device 400 can support moving the generated four first-first adhesive layers 1110 and four first-second adhesive layers 1120 vertically downwards by a first-second height H. 1_2 At this time, due to Figure 4D The four first-third adhesive layers 1130 identified in (a) all have the same shape, therefore Figure 4D (b) and Figure 4D (c) For convenience, one of the four first-third adhesive layers 1130 is shown representatively. To clearly describe the detailed structure of the four first-third adhesive layers 1130, [the following is omitted as the text is incomplete and cannot be translated]. Figure 4D The ratio of the first length L1 and the first width W1 in (a) is shown in an enlarged form. For reference, Figure 4D (a) shows the shape of the four first-third adhesive layers 1130 viewed from a vertical upward perspective. Figure 4D (b) shows Figure 4D The shape of section A-A' in (a) viewed towards direction B. Figure 4D (c) shows Figure 4D The shape of section B-B' in (a) when viewed in the direction of A'.

[0076] Specifically, the computing device 400 can support the generation of a first-third adhesive solid material using an adhesive supplied from a predetermined stimulus source after providing solid material to the upper part of the four first-second adhesive layers 1120, or support the provision of the first-third adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the upper part of the four first-second adhesive layers 1120, generating a material with a first-third height H. 1_3 When there are four first-third adhesive layers 1130, it is possible to support the first width W1 of the four first-third adhesive layers 1130 corresponding to the first-second width W. 1_2 The structure forms four internal spaces 1132 of the four internal spaces 1102 of the first 1_1 internal space 1102.

[0077] Therefore, when the four first adhesive layers 1110, the four first adhesive layers 1120, and the four first adhesive layers 1130 are sequentially stacked, four pipe fitting joints 1100, which are the four first adhesive layers, are generated, including the four first adhesive layers 1110 to the four first adhesive layers 1130. The first height H1 inside the four pipe fitting joints 1100 is the first internal height H. 1_1_in The four first adhesive layers are not formed in some areas, thus allowing the formation of four first-first internal spaces 1102, including four first-first-first-second ...

[0078] Thus, after generating the four pipe fitting joints 1100, the computing device 400 can support the generation of a second adhesive solid material using an adhesive supplied from a predetermined stimulus source after providing solid material to the upper part of the four pipe fitting joints 1100, or support the provision of the second adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the upper part of the four pipe fitting joints 1100, thereby generating a second adhesive layer, as will be referred to Figures 5A to 5D Please provide an explanation.

[0079] Figures 5A to 5D This is a schematic diagram of the process of generating a second adhesive layer on top of four first adhesive layers according to an embodiment of the present invention.

[0080] See Figure 5A The following state is shown: after providing a solid material with a second height H2 on the upper part corresponding to the first height H1 of the four pipe fitting joints 1100, which are four first adhesive layers, a second adhesive solid material is generated using an adhesive supplied from a predetermined stimulus source; or after generating the second adhesive solid material on the solid material using an adhesive supplied from a predetermined stimulus source, it is provided with a second height H2 on the upper part corresponding to the first height H1 of the four pipe fitting joints 1100, thereby generating a second adhesive layer 1200. At this time, the second adhesive layer 1200 can serve as a support for nitrogen gas introduced into at least a portion of the predetermined through holes 1121, 1123 formed in the four pipe fitting joints 1100 through at least a portion of the four gas pipes (not shown) that form channels inside the second adhesive layer 1200, and introduced into the front-opening wafer transfer box through at least a portion of the four first hollow portions 1203_1 formed in the second height H2, or support for exhaust gas discharged from the front-opening wafer transfer box to be introduced into at least a portion of the four first hollow portions 1203_1 through at least a portion of the four gas pipes (not shown), and outward through at least a portion of the predetermined through holes 1121 formed in the four pipe fitting joints 1100 (i.e., Figure 1 The purging devices 310 to 340 shown are used for the structures discharged. (Refer to...) Figures 5B to 5D The detailed preparation process of the second adhesive layer 1200 is described.

[0081] First, see Figure 5B , Figure 5B (a) through (c) show the following states in cross-sectional form: Figure 2 The computing device 400 described herein, in a state where four pipe fitting joints 1100 as four first adhesive layers are generated, moves the four pipe fitting joints 1100 (i.e., the four first adhesive layers 1110, the four first adhesive layers 1120, and the four first adhesive layers 1130) along a direction away from a predetermined stimulus source by a length corresponding to a first height H1, so that the conditions for laminating the adhesive solid material remain constant. Then, after providing solid material to the upper part of the four pipe fitting joints 1100, it supports the generation of a second adhesive solid material using an adhesive supplied from the predetermined stimulus source, or supports the provision of the second adhesive solid material generated by using an adhesive supplied from the predetermined stimulus source to the upper part of the four pipe fitting joints 1100, and the second adhesive solid material is laminated at the upper part of the four pipe fitting joints 1100 corresponding to the first height H1. 2_1 The second_1 adhesive solid material is used to generate the second_1 adhesive layer 1210.

[0082] At this time, although Figure 5BThe second adhesive layer 1210 identified in (a) is a plate-like shape, but as Figure 5B (b) and Figure 5B As confirmed in (c), the upper part of the four pipe fitting joints 1100 has a second length L in a direction away from the four pipe fitting joints 1100. 2_1 and the width W of the 2nd _1st 2_1 At the same time, the stacked 2_1 height H 2_1 The second-to-first bonding solid material is thus joined together to form a plate-like shape. Figure 5B (b) and Figure 5B (c) For convenience, a portion of the second-first adhesive layer 1210 adjacent to one of the four pipe fitting joints 1100 is shown representatively. To clearly illustrate the detailed structure of the second-first adhesive layer 1210, [the following is omitted as it is not relevant to the main text]. Figure 5B In (a), the second-to-first length L 2_1 and the width W of the 2nd _1st 2_1 The scale is shown and enlarged. For reference, Figure 5B (a) shows the shape of the second adhesive layer 1210 viewed from a vertically upward perspective. Figure 5B (b) shows Figure 5B The shape of section A-A' in (a) viewed towards direction B. Figure 5B (c) shows Figure 5B The shape of section B-B' in (a) when viewed in the direction of A'.

[0083] Specifically, the computing device 400 can support the generation of a second_1 adhesive solid material using an adhesive supplied from a predetermined stimulus source after providing solid material to the upper part of the four pipe fitting joints 1100 corresponding to the first height H1, or support the provision of the second_1 adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the upper part of the four pipe fitting joints 1100 to generate the second_1 height H. 2_1 When the second adhesive layer 1210 is used, it can support the first width W1 corresponding to the first height H1 in the upper part of the four pipe fitting joints 1100, which corresponds to the first width W1. 1_2 The structure forms four internal spaces of type 1_2 (including internal space 1212 of part 1_2_a and...). Figure 5C The four inner spaces 1212 of the first 1_2_a portion (described later in the first 2_b portion inner space 1222) are formed from a specific inner side 1211 of the side of the second 1 adhesive layer 1210 surrounding the four first 2_b inner spaces (more specifically, the four first 2_a portion inner spaces 1212), in a direction away from the four pipe fitting joints 1100, having a second 2_1 length L. 2_1 Width W of the 2nd _1st2_1 and the 2_1 height H 2_1 The second adhesive layer 1210. At this time, the four first-second internal spaces refer to those spatially connected to the four first-first internal spaces 1102, and including the four first-second-a portion internal spaces 1212 and subsequent... Figure 5C The four internal spaces of part 1_2_b, as described in the text, have a length L of 2_1. 2_1 and the width W of the 2nd _1st 2_1 It can be greater than the subsequent Figure 5C The second internal length and second internal width are described herein. The second internal length and second internal width can refer to the length and width of a gas pipe through which nitrogen or exhaust gas can pass. Furthermore, considering the case where nitrogen is introduced from the outside into at least a portion of the four first through-holes 1121 and four second through-holes 1123, since nitrogen moves through the gas pipe sequentially through the four first-first internal spaces 1102 and the four first-second-a partial internal spaces 1212, the second internal width is formed to be smaller than the first-second width W. 1_2 If the length of the 2_1th term is L 2_1 If it is less than the second internal length, then due to the second_1 length L 2_1 The difference in length between the second and third inner layers may create a predetermined vertical opening in the second-first adhesive layer 1210, causing nitrogen gas to leak to the outside through the predetermined opening. To prevent this, the second-first length L can be... 2_1 It is greater than the second internal length.

[0084] Next, see Figure 5C , Figure 5C (a) to (c) show the following state in cross-sectional form: with four second-first adhesive layers 1210 already formed, the computing device 400 moves the four pipe fitting joints 1100 and the second-first adhesive layers 1210 in a direction away from the predetermined stimulus source, corresponding to the second-first height H. 2_1 The length is such that the conditions for laminating the solid material remain constant. Then, after providing solid material on top of the 2_1 adhesive layer 1210, support the generation of the 2_2 adhesive solid material using an adhesive supplied from a predetermined stimulus source, or support the provision of the 2_2 adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the top of the 2_1 adhesive layer 1210, and the 2_2 adhesive solid material is laminated to a 2_2 height H on top of the 2_1 adhesive layer 1210. 2_2This generates the second adhesive layer 1220. For example, if four pipe fitting joints 1100 and the second adhesive layer 1210 are formed by stacking them vertically upwards, the computing device 400 can support moving the four generated pipe fitting joints 1100 and the second adhesive layer 1210 vertically downwards by a second height H. 2_1 For reference, in order to clearly illustrate the detailed structure of the second adhesive layer 1220, [the following is omitted as it is not relevant to the main text]. Figure 5C In (a), the second _2nd length L 2_2 Width W of the 2nd rank 2_2 , second internal length L 2_in and the second inner width W 2_in The proportions are shown and enlarged. Figure 5C (a) shows the shape of the second adhesive layer 1220 viewed from a vertically upward perspective. Figure 5C (b) shows Figure 5C The shape of section A-A' in (a) viewed towards direction B. Figure 5C (c) shows Figure 5C The shape of section B-B' in (a) when viewed in the direction of A'.

[0085] Specifically, the computing device 400 can support the generation of a second adhesive solid material using an adhesive supplied from a predetermined stimulus source after providing a solid material to the upper part of the second adhesive layer 1210, or support the provision of the second adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the upper part of the second adhesive layer 1210 to generate a second height H. 2_2 When the second adhesive layer 1220 is at the second-first height H 2_1 The location corresponds to the width W of the 1st and 2nd positions. 1_2 The structure forms four first-second internal spaces 1202, four first-second-b portion internal spaces 1222, and from a specific inner side 1221 of the side of the second adhesive layer 1220 surrounding the four first-second internal spaces 1202, in a direction away from the four pipe fitting joints 1100, a second internal length L is formed. 2_in and the second inner width W 2_in The four gas pipes 1223, which serve as four second internal spaces, are formed by four first_1 hollow portions 1223_1 defined by a center position X spaced at a predetermined distance from the far end of the four pipe fitting joints 1100 at both ends of the four gas pipes 1223, thus generating a second_2 length L. 2_2 Width W of the 2nd rank 2_2 and the 2nd height H 2_2 The second adhesive layer 1220. For reference, due to... Figure 5C(b) is a cross-sectional view. The four hollow portions 1223_1 defined from the center position X are not shown in a hollow form. Therefore, for convenience, the area near the center position X is shown separately in an enlarged view. As can be seen from the enlarged area, in the second internal length L 2_in In the middle, the center position X, which is spaced at a predetermined distance from one end of the four pipe fitting joints 1100, forms a semi-circle with one end, so the four first hollow parts 1223_1 are hollow.

[0086] At this point, the four first-second internal spaces 1202 refer to the spaces including the four first-second-a internal spaces 1212 and the four first-second-b internal spaces 1222. The first-second internal length and the first-second internal width of the four first-second internal spaces 1202 can be less than the first length L1 and the first width W1. For example, the first-second internal length can correspond to the length of the first length L1 excluding the outer wall thickness of the four pipe fitting joints 1100, and the first-second internal width can correspond to the first-second width W1. 1_2 The first and second internal heights H 1_2_in This can correspond to height H of number 2_1. 2_1 and the 2nd height H 2_2 The sum of. Additionally, the four gas pipes 1223 in the second internal space, which are empty due to the absence of the second adhesive solid material in the second adhesive layer 1220 and serve as support for the movement of at least a portion of nitrogen and exhaust gas, have a second internal length L. 2_in and the second inner width W 2_in And form the second internal height H 2_in The second internal length L 2_in It can be equal to or less than the 2_1 length L 2_1 The second internal width W 2_in Less than the width W of the 1st and 2nd generations 1_2 The second internal height H 2_in This can correspond to height H of the 2_2nd level. 2_2 However, the second internal length L 2_in The nozzle insertion position can also vary depending on the specifications of the front-opening wafer transfer box, but is not limited to this.

[0087] Additionally, in order to form four gas channels 1223 in the second adhesive layer 1220, the computing device 400 can support the generation of a second adhesive solid material using an adhesive supplied from a predetermined stimulus source after providing solid material to the upper part of the second adhesive layer 1210, or support the provision of the second adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the upper part of the second adhesive layer 1210, having a second length and a second width on both sides of the four gas channels 1223 and being stacked with a second height. The second length L2_2 It can be equal to or greater than the second internal length L 2_in Width W of the 2nd _2nd 2_2 It can refer to the width W of the 2_1st line. 2_1 Remove the second inner width W 2_in Half the width of the subsequent portion. For reference, Figure 5C In (a), the second _2nd length L 2_2 The second internal length L is shown. 2_in It is longer because even if the second adhesive layer 1220 is a single layer, if the second adhesive layer 1220 is divided into four equal parts based on the portions corresponding to the four pipe fitting joints 1100, then the length L of the second adhesive layer is longer. 2_2 It can be regarded as corresponding to Figure 5C (a) Half of the outer perimeter line parallel to the A-A' section in the overall perimeter, but not limited to this, may also be considered as the outer wall formed by the perimeter of the four 1_1 hollow parts 1223_1 defined by the central position X, with a predetermined thickness.

[0088] Additionally, see Figure 5D , Figure 5D (a) to (c) show the following state in cross-sectional form: with four second-second adhesive layers 1220 already formed, the computing device 400 moves the four pipe fitting joints 1100, the second-first adhesive layer 1210, and the second-second adhesive layer 1220 in a direction away from the predetermined stimulus source, corresponding to the second-second height H. 2_2 The length is such that the conditions for laminating the solid material remain constant. Then, after providing solid material on top of the second adhesive layer 1220, the second adhesive solid material is supported for generating a second adhesive solid material using an adhesive supplied from a predetermined stimulus source, or the second adhesive solid material generated using an adhesive supplied from a predetermined stimulus source is supported for providing the second adhesive solid material generated on top of the second adhesive layer 1220, and the second adhesive solid material is laminated at a second height H on top of the second adhesive layer 1220. 2_3 This generates the second and third adhesive layers 1230. For example, if four pipe fitting joints 1100, the second and third adhesive layers 1210, and the second and fourth adhesive layers 1220 are formed by stacking them vertically upwards, the computing device 400 can support moving the four generated pipe fitting joints 1100, the second and third adhesive layers 1210, and the second and fourth adhesive layers 1220 vertically downwards by a second and fourth height H. 2_2 For reference, in order to clearly illustrate the detailed structure of the second and third adhesive layers 1230, [the following is omitted as it is not relevant to the main text]. Figure 5D In (a), the second and third lengths L 2_3 and the 2nd and 3rd width W 2_3 The proportions are shown and enlarged. Figure 5D(a) shows the shape of the second and third adhesive layers 1230 viewed from a vertically upward perspective. Figure 5D (b) shows Figure 5D The shape of section A-A' in (a) viewed towards direction B. Figure 5D (c) shows Figure 5D The shape of section B-B' in (a) when viewed in the direction of A'.

[0089] Specifically, the computing device 400 can support the generation of a second-third adhesive solid material using an adhesive supplied from a predetermined stimulus source after providing a solid material to the upper part of the second-second adhesive layer 1220, or support the provision of the second-third adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the upper part of the second-second adhesive layer 1220 to generate a second-third height H. 2_3 When the second and third adhesive layers 1230 are formed, four first and second hollow portions 1233_1 are formed, defined by a center position X spaced at a predetermined distance from the distal end of the four pipe fitting joints 1100 at both ends of the four gas pipes 1223, thus generating a second and third length L. 2_3 Width W of the 2nd and 3rd sections 2_3 and the 2nd and 3rd height H 2_3 The second and third adhesive layers 1230. That is, the four first-level hollow portions 1223_1 and the four second-level hollow portions 1233_1 are defined from the same four center positions X and interconnected, and the dimensions of the four first-level hollow portions 1223_1 and the four second-level hollow portions 1233_1 may be formed to be the same. This can be clearly understood by referring to an enlarged view including the area near the center position X.

[0090] After the four pipe fitting joints 1100 and the second adhesive layer 1200 are prepared in this way, nitrogen can be introduced through at least a portion of the predetermined through holes 1121 and 1123 of the four pipe fitting joints 1100 and moved to the four gas pipes 1223, which are the four second internal spaces. Nitrogen can be introduced into the front-opening wafer transfer box through the four first 1 hollow portions 1223_1 located at the ends of the four gas pipes 1223 and the four first 2 hollow portions 1233_1 connected to the four first 1 hollow portions 1223_1. Alternatively, waste gas discharged from the front-opening wafer transfer box can be introduced into the four first 2 hollow portions 1233_1 and then discharged to the outside in sequence through the four first 1 hollow portions 1223_1 connected to the four first 2 hollow portions 1233_1, the four gas pipes 1223, and at least a portion of the predetermined through holes 1121 and 1123 of the four pipe fitting joints 1100. However, since the four hollow portions 1123_1 of the first and second stages are difficult to bond tightly to the lower surface of the front-opening wafer transfer box, a third adhesive layer including four gas nozzles needs to be additionally formed on the upper part of the second and third adhesive layer 1230, or more precisely, on the upper part of the four hollow portions 1123_1 of the first and second stages, to support a tight bond with the lower surface of the front-opening wafer transfer box and prevent nitrogen and exhaust gas leakage. The specific process for forming the third adhesive layer will be discussed later. Figures 6A to 6C This will be discussed later.

[0091] On the other hand, see again Figure 5A The computing device 400 may further form three guide pin insertion portions 1204 with the same size as the guide pins and having a length corresponding to the second height H2 at the three locations formed on the mounting surface of any one of the insertion loading port, side rail buffer, top buffer and storage container for mounting the guide pins of the front-opening wafer transfer box, so as to generate the second adhesive layer 1200.

[0092] Furthermore, the computing device 400 can support the further formation of a corresponding opening pattern 1205 that matches a specific pattern formed on the mounting surface of any one of the loading port, side rail buffer, top buffer, and storage tank, and has a length corresponding to the second height H2, to form the second adhesive layer 1200. That is, since the various openings formed in the portion other than the four first hollow portions 1203_1 and three guide pin insertion portions 1204 formed on the upper part of the second adhesive layer 1200 are formed according to the different specifications of the loading port, side rail buffer, top buffer, or storage tank, by forming a corresponding opening pattern 1205 that matches the specific pattern on the second adhesive layer 1200, it can be easily installed on the mounting surface of any one of the loading port, side rail buffer, top buffer, and storage tank.

[0093] Figures 6A to 6CThis is a schematic diagram of the process of generating a third adhesive layer on top of a second adhesive layer according to an embodiment of the present invention.

[0094] See Figure 6A By forming four front-opening wafer transfer box bonding structures 1300 as a third adhesive layer on the upper part of the second adhesive layer 1200, the state of a blower plate 1000 including four pipe fitting joints 1100, the second adhesive layer 1200, and four front-opening wafer transfer box bonding structures 1300 is shown. Figure 5A The process described herein involves providing a solid material of a third height H3 to the upper part of the four first hollow portions 1203_1, then generating a third adhesive solid material using an adhesive supplied from a predetermined stimulus source; or generating a third adhesive solid material by using an adhesive supplied from a predetermined stimulus source to the solid material, and then providing a third height H3 to the upper part of the four first hollow portions 1203_1. Since four second hollow portions 1301 are formed with a central position (i.e., the same central position as the four first hollow portions 1203_1) as a reference, they can be used as four gas nozzles 1300, a structure that can be directly bonded to the lower surface of the front-opening wafer transfer box while facilitating the movement of nitrogen and exhaust gases. A detailed fabrication process for the four gas nozzles 1300 will be described in reference [link to documentation]. Figure 6B and Figure 6C Please provide an explanation.

[0095] Next, see Figure 6B , Figure 6B (a) to (c) show the following state in cross-sectional form: With the second adhesive layer 1210 already formed, the computing device 400 moves the four pipe fitting joints 1100 and the second adhesive layer 1200 along a direction away from the predetermined stimulus source by a length corresponding to the second height H2, so that the conditions for laminating the adhesive solid material remain constant. Then, after providing solid material on top of the second adhesive layer 1200, it supports the generation of a third_1 adhesive solid material using an adhesive supplied from the predetermined stimulus source, or supports providing the third_1 adhesive solid material generated by using an adhesive supplied from the predetermined stimulus source to the top of the second adhesive layer 1200, and adhesives the third_1 height H2 on top of the second adhesive layer 1200 corresponding to the second height H2. 3_1 The third_1 adhesive solid material is used to generate four first_1 front-opening wafer transfer box bonding details 1310 as the third_1 adhesive layer. For reference, in order to clearly illustrate the detailed structure of the four first_1 front-opening wafer transfer box bonding details 1310, the above-described details are maintained. Figure 5D The length and width ratio of the second adhesive layer 1200 shown in (b) and (c) is similar to... Figure 6B In (a), the 3rd radius r 3_1The proportions are shown and enlarged. Figure 6B (a) shows the shape of the four front-opening wafer transfer boxes combined with the detailed structure 1310 when viewed from a vertically upward perspective. Figure 6B (b) shows Figure 6B The shape of section A-A' in (a) viewed towards direction B. Figure 6B (c) shows Figure 6B The shape of section B-B' in (a) when viewed in the direction of A'.

[0096] Specifically, the computing device 400 can support the generation of a third_1 adhesive solid material using an adhesive supplied from a predetermined stimulus source after providing a solid material to the upper part of the second adhesive layer 1200, or support the provision of the third_1 adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the upper part of the second adhesive layer 1200, generating a third_1 height H. 3_1 When the four first-first front-opening wafer transfer boxes, which serve as the third-first adhesive layer, are combined with the detailed structure 1310, four second-first hollow portions 1311 defined by the center position X are formed on the upper side of the four first hollow portions 1203_1, reaching the third-first height H. 3_1 From the center position X, there is a radius r of the 3rd - 1st degree. 3_1 (3rd radius r) 3_1 A portion corresponds to the exterior of the four 2_1 hollow sections 1311 and forms the 3_1 height H. 3_1 Therefore, in the detailed structure 1310 of the four first-opening wafer transfer boxes, four second-opening hollow portions 1311 defined by the center position X can be formed on the upper side of the four first hollow portions 1203_1. Therefore, Figure 6B (c) has been omitted for convenience. Figures 4B to 4D (c) and Figures 5B to 5D The four pipe fitting joints 1100 shown in (c) are the four first adhesive layers.

[0097] Next, refer to Figure 6C , Figure 6C (a) to (c) show the following state in cross-sectional form: With four first-first front-opening wafer transfer box bonding details 1310 already formed as the third-first adhesive layer, the computing device 400 moves four pipe fitting joints 1100, the second adhesive layer 1200, and the four first-first front-opening wafer transfer box bonding details 1310 in a direction away from the predetermined stimulus source, corresponding to a third-first height H. 3_1The length is such that the conditions for laminating the solid material remain constant. Then, after providing solid material to the upper part of the four first_1 front-opening wafer transfer cassette bonding details 1310, support the generation of a third_2 bonding solid material using an adhesive supplied from a predetermined stimulus source, or support the provision of the third_2 bonding solid material generated using an adhesive supplied from a predetermined stimulus source to the upper part of the four first_1 front-opening wafer transfer cassette bonding details 1310, where the four first_1 front-opening wafer transfer cassette bonding details 1310 correspond to the third_1 height H. 3_1 The upper layer stacked at height H of the 3rd and 2nd layers 3_2 The third and second adhesive solid material is used to generate four first and second front-opening wafer transfer box bonding details 1320 as the third and second adhesive layers. For reference, in order to clearly illustrate the detailed structure of the four first and second front-opening wafer transfer box bonding details 1320, the above-described details are maintained. Figure 6B The third-1st radius r shown in (a) 3_1 and Figure 6C In (a), the 3rd-2nd radius r 3_2 The proportions are shown and enlarged. Figure 6C (a) shows a cross-section of the four front-opening wafer transfer boxes combined with the detailed structure 1320, viewed from a vertically upward perspective. Figure 6C (b) shows Figure 6C The shape of section A-A' in (a) viewed towards direction B. Figure 6C (c) shows Figure 6C The shape of section B-B' in (a) when viewed in the direction of A'.

[0098] Specifically, the computing device 400 can support the generation of a third_2 adhesive solid material using an adhesive supplied from a predetermined stimulus source after providing solid material to the upper part of the four first_1 front-opening wafer transfer box bonding details 1310, or support the provision of the third_2 adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the upper part of the four first_1 front-opening wafer transfer box bonding details 1310, generating a third_2 height H. 3_2 When the four first-second front-opening wafer transfer box bonding details 1320, which serve as the third-second adhesive layer, are combined, four second-second hollow portions 1321 defined by the center position X are formed on the upper side of the four first-second front-opening wafer transfer box bonding details 1310, reaching the third-second height H. 3_2 From the center position X, there is a radius r of the 3rd - 2nd degree. 3_2 (3rd-2nd radius r) 3_2 Less than the 3rd radius r 3_1 , the 3rd radius r 3_2A portion corresponds to the exterior of the four 2_2 hollow sections 1321 and forms the 3_2 height H. 3_2 Therefore, in the detailed structure 1320 of the four first-second front-opening wafer transfer boxes, four second-second hollow portions 1321 defined by the center position X can be formed on the upper side of the four second-first hollow portions 1311. At this time, the dimensions of the four second-second hollow portions 1321 and the four second-first hollow portions 1311 can be made identical. Therefore, with... Figure 6B Same, Figure 6C (c) has also been omitted for convenience. Figures 4B to 4D (c) and Figures 5B to 5D The four pipe fitting joints 1100 shown in (c) are the four first adhesive layers.

[0099] After generating the four first-second front-opening wafer transfer box bonding details 1320 as the third-second adhesive layer, the four first-first-second ... Figure 6A The four gas nozzles 1300 described herein are used. In addition, the center positions X of the four first hollow portions 1203_1 and the four second hollow portions 1301 are the same, and the size of the four second hollow portions 1301 can be smaller than the size of the four first hollow portions 1203_1.

[0100] On the other hand, even if through Figures 4A to 6C The process prepared a purge plate 1000. If, due to various variables, there are parts of the adhesive solid material with low rigidity during the lamination process, and / or due to structural problems, additional auxiliary adhesive layers are formed, these need to be removed by post-processing.

[0101] Specifically, at least a portion of the following post-processing steps may be performed: (i) surface treatment of the surfaces of the four pipe fitting joints 1100, the second adhesive layer 1200, and the four front-opening wafer transfer box joint structures 1300 as the third adhesive layer by polishing; (ii) cleaning the surface-treated four pipe fitting joints 1100, the second adhesive layer 1200, and the four front-opening wafer transfer box joint structures 1300 with a cleaning solution, and then drying the four pipe fitting joints 1100, the second adhesive layer 1200, and the four front-opening wafer transfer box joint structures 1300 by blowing in air; and (iii) subsequent curing of the four first pipe fitting joints 1100, the second adhesive layer 1200, and the four front-opening wafer transfer box joint structures 1300 using at least a portion of a predetermined curing agent, an additional light source, and hot air. Alternatively, the post-processing steps may be performed by… Figure 2 The computing device 400 shown supports execution, but it may also be a part that is performed manually by the operator.

[0102] Reference Figure 7 An example describing the completed purge plate 1000.

[0103] Figure 7 This is an example of a purge plate constructed according to an embodiment of the present invention by generating four first pipe fitting joints, a second adhesive layer, and four front-opening wafer transfer box joint structures.

[0104] Figure 7 (a) shows an example of the shape of the first purge plate 1000 viewed from above. Figure 7 (b) shows an example of the shape of the second purge plate 1000' viewed from above. Figure 7 In (a), the four pipe fitting joints 1100 are obscured by the second adhesive layer 1200 and cannot be identified, which is from Figure 6A Understandable, Figure 7 As can be confirmed in (b), four pipe fitting joints 1100 are formed at the lower end of the outer region of the second adhesive layer 1200, and the pipe fitting 2100 is attached to the four pipe fitting joints 1100. However, the pipe fitting 2100 is not formed by the manufacturing process of the present invention, but is manually attached by an operator after the completion of the first purge plate 1000 or the second purge plate 1000'.

[0105] Furthermore, when the purge plate 1000 is actually installed on the mounting surface of any one of the loading port, side rail buffer, top buffer, and storage tank, since the four pipe fitting joints 1100 are located outside the mounting surface of any one of the loading port, side rail buffer, top buffer, and storage tank, except... Figure 7 The P1 position shown in (a) or Figure 7In addition to the P2 position shown in (b), the four pipe fitting joints 1100 can also be formed at various positions. For reference, the second purge plate 1000' is an example of the four pipe fitting joints 1100 forming outside the boundary line of the second adhesive layer 1200, so the P2 position can also be formed outside the boundary line of the second adhesive layer 1200 (not shown).

[0106] In addition, when at least a portion of the four gas nozzles 1300 are engaged with the lower surface of the front-opening wafer transfer box, the seals 2200 used to prevent nitrogen or exhaust gas leakage can also be additionally engaged by the operator by hand.

[0107] on the other hand, Figure 7 (a) has a first corresponding pattern 1205_1 formed on the mounting surface of any one of the loading port, side rail buffer, top buffer, and accumulator to be installed, which matches the first pattern. Figure 7 (b) is formed with a second corresponding pattern 1205_2 that matches the second pattern on the mounting surface of any of the other loading ports, side rail buffers, top buffers and hoppers to be installed.

[0108] Furthermore, the embodiments described above according to the present invention can be implemented in the form of program instructions executable by various computer components and recorded in a computer-readable recording medium. The computer-readable recording medium may include program instructions, data files, data structures, etc., individually or in combination. The program instructions recorded in the computer-readable recording medium may be specifically designed and configured for the present invention, or may be known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media, such as hard disks, floppy disks, and magnetic tapes; optical recording media, such as CD-ROMs and DVDs; magneto-optical media, such as floppy disks; and hardware devices specifically configured to store and execute program instructions, such as ROMs, RAMs, and flash memory. Examples of program instructions include not only machine language code generated by a compiler, but also high-level language code executable by a computer using an interpreter, etc. The hardware device may be configured to operate as one or more software modules to perform the processing according to the present invention, and vice versa.

[0109] The present invention has been described above through specific components and other specific matters, as well as limited embodiments and accompanying drawings. However, this is only provided to help to understand the present invention more fully. The present invention is not limited to the above embodiments, and those skilled in the art can make various modifications and variations from these descriptions.

[0110] Therefore, the concept of the present invention should not be limited to the embodiments described above, but includes not only the following claims, but also all contents that are equivalent or modified to these claims and should fall within the scope of the present invention.

Claims

1. A method for preparing a purge plate for supporting the supply of nitrogen gas inside a forward-opening wafer transfer box, characterized in that, Includes the following steps: (a) After providing solid material at four locations on a predetermined plane, a first adhesive solid material is generated using a predetermined adhesive supplied from a predetermined stimulus source, or the first adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the four locations on the predetermined plane to generate four pipe fitting joints having a first length, a first width, and a first height as four first adhesive layers, wherein a first_1 internal height portion in the first height where the four first adhesive layers are not generated forms four first_1 internal spaces, and a predetermined through hole is formed on at least a portion of the surface except for the upper surface located at the upper part corresponding to the first height to generate the four pipe fitting joints, wherein the first_1 internal length and the first_1 internal width of the four first_1 internal spaces are less than the first length and the first width; (b) After moving the four pipe fitting joints along a direction away from the predetermined stimulus by a length corresponding to the first height, and after providing the solid material to the upper part of the four pipe fitting joints corresponding to the first height, a second adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus; or the second adhesive solid material generated by applying the solid material using the predetermined adhesive supplied from the predetermined stimulus is provided to the upper part of the four pipe fitting joints corresponding to the first height and laminated to generate a second adhesive layer having a second height, wherein, in the portions connected to the four first_1 internal spaces of the four pipe fitting joints, the first_2 internal height portion in which the second adhesive layer is not generated in the second height. Four first and second internal spaces are formed. From a specific inner side of the surface of the second adhesive layer surrounding the four first and second internal spaces, in a direction away from the four pipe fitting joints, four gas pipes with a second internal length and a second internal width are formed in the second internal height portion where the second adhesive layer is not formed in the second height. Four first hollow portions are formed by center positions spaced at predetermined distances from the far ends of the four pipe fitting joints at both ends of the four gas pipes to form the second adhesive layer. The first and second internal lengths and first and second internal widths of the four first and second internal spaces are smaller than the first length and the first width, and the second internal height is smaller than the first and second internal heights. (c) After moving the four pipe fitting joints and the second adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second height, after providing the solid material on the upper part of the second adhesive layer, a third adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the second adhesive layer and laminated to generate a third adhesive layer having a third height, wherein a four front-opening wafer transfer box joint structure having the third height and having four second hollow portions defined by the central position is formed on the upper side of the four first hollow portions to generate the third adhesive layer.

2. The preparation method according to claim 1, characterized in that, In step (a), the following processing is performed: (i) After providing the solid material to the four locations on the predetermined plane, a first 1_1 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the first 1_1 adhesive solid material generated by applying the solid material using the predetermined adhesive supplied from the predetermined stimulus source is provided to the four locations on the predetermined plane to generate four first 1_1 adhesive layers having the first length and the first width and having a first 1_1 height in the first height; (ii) the four first 1_1 adhesive layers are moved in a direction away from the predetermined stimulus source. After the length of the first _1 height, a first _2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source after the solid material is provided on top of the four first _1 adhesive layers. Alternatively, the first _2 adhesive solid material generated by applying the predetermined adhesive from the predetermined stimulus source to the solid material is provided on top of the four first _1 adhesive layers and laminated to generate four first _2 adhesive layers having a first _2 height in the first height, wherein the first width of the four first _2 adhesive layers corresponds to the first _1 width. The structure forms four first through holes along the width direction, and four first 1_1_a portion interior spaces are formed in the structure corresponding to the first 1_2 width at the first width. Four second through holes along the width direction are formed in the structure corresponding to the first 1_3 width at the first width to generate the four first 1_2 adhesive layers; and (iii) after moving the four first 1_1 adhesive layers and the four first 1_2 adhesive layers along a direction away from the predetermined stimulus source by a length corresponding to the first 1_2 height, a [missing information] is provided on the upper part of the four first 1_2 adhesive layers. After the solid material is described, the first 1_3 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the first 1_3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the four first 1_2 adhesive layers and laminated to generate four first 1_3 adhesive layers having a first 1_3 height in the first height, wherein four first 1_1_b portion interior spaces are formed in the structure corresponding to the first 1_2 width to generate the four first 1_3 adhesive layers.

3. The preparation method according to claim 1, characterized in that, In step (b), the following processing is performed: (i) After moving the four pipe fitting joints along a direction away from the predetermined stimulus source by a length corresponding to the first height, and after providing the solid material to the upper part of the four pipe fitting joints corresponding to the first height, a second_1 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source; or the second_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the four pipe fitting joints and laminated to generate a second_1 adhesive layer having a second_1 height in the second height, wherein, at the four pipe fitting joints corresponding to the first height... Four 1_2_a portion interior spaces are formed in the structure corresponding to the 1_2 width in the upper part of the 1_2 height. From the specific inner side of the side of the 2_1 adhesive layer surrounding the four 1_2 interior spaces, toward a direction away from the four pipe fitting joints, a 2_1 adhesive layer having a 2_1 length, a 2_1 width, and a 2_1 height is generated, wherein the 2_1 length and the 2_1 width are greater than the 2 internal length and the 2 internal width; (ii) the four pipe fitting joints and the 2_1 adhesive layer are arranged along a direction away from the predetermined stimulus. After the source is moved directionally corresponding to the length of the 2_1 height, a 2_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source after the solid material is provided on the upper part of the 2_1 adhesive layer, or the 2_2 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the 2_1 adhesive layer and laminated to generate a 2_2 adhesive layer having a 2_2 height in the 2 height, wherein four 1_2_b portions of the four 1_2 internal spaces are formed in the structure corresponding to the 1_2 width at the 2_1 height. An internal space, from a specific inner side of the side of the second adhesive layer surrounding the four first_2 internal spaces, toward a direction away from the four pipe fitting joints, forms four gas pipes as the four second internal spaces, having the second internal length and the second internal width, and forms four first_1 hollow portions defined by the center positions spaced apart by the predetermined distance from the far ends of the four pipe fitting joints at both ends of the four gas pipes, to generate the second_2 adhesive layer having the second_2 length, the second_2 width, and the second_2 height, the second_2 height corresponding to the second internal height;(iii) After moving the four pipe fitting joints, the second-1 adhesive layer, and the second-2 adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second-2 height, and after providing the solid material on the upper part of the second-2 adhesive layer, using the predetermined adhesive supplied from the predetermined stimulus source to generate a second-3 adhesive solid material, or providing the second-3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the second-2 adhesive layer and laminating it to generate a second-3 adhesive layer having a second-3 height in the second height, wherein four first-2 hollow portions defined by the center positions spaced apart by the predetermined distance from the distal ends of the four pipe fitting joints at both ends of the four gas pipes are formed to generate the second-3 adhesive layer having a second-3 length, a second-3 width, and a second-3 height.

4. The preparation method according to claim 1, characterized in that, In step (c), the following processing is performed: (i) After moving the four pipe fitting joints and the second adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second height, and after providing the solid material on the upper part of the second adhesive layer, using the predetermined adhesive supplied from the predetermined stimulus source to generate a third_1 adhesive solid material, or providing the third_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the second adhesive layer and laminating it to generate a third_1 adhesive layer having a third_1 height in the third height, wherein four first_1 front-opening wafer transfer box joint details having the third_1 height and having four second_1 hollow portions defined by the center position are formed on the upper side of the four first hollow portions to generate the third_1 adhesive layer; and (ii) connecting the four pipe fitting joints... After the joint, the second adhesive layer, and the third adhesive layer are moved along a direction away from the predetermined stimulus source by a length corresponding to the third height, a third adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source after the solid material is provided on the upper part of the third adhesive layer, or the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the third adhesive layer and laminated to generate a third adhesive layer having a third height in the third height, wherein four first-second front-opening wafer transfer box joint details having the third height and having four second-second hollow portions defined by the central position are formed on the upper side of the four first-second front-opening wafer transfer box joint details to generate the third adhesive layer.

5. The preparation method according to claim 4, characterized in that, In the process (i), Four first-opening wafer transfer box bonding details, each having a third-first radius and a third-first height, are formed on the upper side of the second adhesive layer to generate the third-first adhesive layer. A portion of the third-first radius corresponds to the exterior of the four second-first hollow portions. In the four first-opening wafer transfer box bonding details, the four second-first hollow portions defined by the central position are formed on the upper side of the four first hollow portions. In the process (ii), Four front-opening wafer transfer box bonding details are formed on the upper side of the third_1 adhesive layer, each having a third_2 radius and a third_2 height from the center position, to generate the third_2 adhesive layer, wherein the third_2 radius is smaller than the third_1 radius, and a portion of the third_2 radius corresponds to the outside of the four second_2 hollow portions. In the four front-opening wafer transfer box bonding details, the four second_2 hollow portions defined by the center position are formed on the upper side of the four second_1 hollow portions.

6. The preparation method according to claim 4, characterized in that, In step (c), The dimensions of the four second-first hollow portions are made smaller than the dimensions of the four first hollow portions, and the dimensions of the four second-first hollow portions are the same as the dimensions of the four second-second hollow portions. This serves as the third adhesive layer, forming the four front-opening wafer transfer box bonding structures, i.e., four gas nozzles, which are composed of the four first-first front-opening wafer transfer box bonding details and the four first-second front-opening wafer transfer box bonding details.

7. The preparation method according to claim 1, characterized in that, Also includes: (d) Perform at least a portion of the following processes: (i) perform surface treatment on the surfaces of the four pipe fitting joints, the second adhesive layer, and the third adhesive layer by sanding; (ii) clean the surface-treated four pipe fitting joints, the second adhesive layer, and the third adhesive layer with a cleaning solution, and then dry the four pipe fitting joints, the second adhesive layer, and the third adhesive layer by blowing in air; and (iii) perform subsequent curing on the four pipe fitting joints, the second adhesive layer, and the third adhesive layer using at least a portion of a predetermined curing agent, an additional light source, and hot air.

8. The preparation method according to claim 1, characterized in that, In step (b), At the three locations where the guide pins for mounting the front-opening wafer transfer box are inserted, three guide pin insertion portions of the same size as the guide pins and having a length corresponding to the second height are further formed to generate the second adhesive layer.

9. The preparation method according to claim 1, characterized in that, In step (b), Further forming a corresponding opening pattern that matches a specific pattern formed on the mounting surface of any one of the loading port, side rail buffer, top buffer, and storage tank, and has a length corresponding to the second height, to form the second adhesive layer.

10. The preparation method according to claim 1, characterized in that, In step (a), The predetermined through holes formed in the four pipe fitting joints are formed into structures for connecting external pipes to form the four pipe fitting joints, wherein the external pipes are used to introduce nitrogen into the interior of the front-opening wafer transfer box or to discharge exhaust gas from the front-opening wafer transfer box.

11. A computing device for fabricating a purge plate that supports the internal supply of nitrogen gas to a forward-opening wafer transfer box, characterized in that, include: At least one memory for storing instructions; as well as At least one processor for executing the instructions, The processor performs the following processing: (I) after providing solid material at four locations on a predetermined plane, it generates a first adhesive solid material using a predetermined adhesive supplied from a predetermined stimulus source, or it provides the first adhesive solid material generated by applying the predetermined adhesive from the predetermined stimulus source to the four locations on the predetermined plane to generate four pipe fitting joints having a first length, a first width, and a first height as four first adhesive layers, wherein the first internal height portion in which the four first adhesive layers are not generated forms four first internal spaces. (I) A predetermined through-hole is formed on at least a portion of the surface, excluding the upper surface located at the upper part corresponding to the first height, to generate the four pipe fitting joints, wherein the first internal length and the first internal width of the four first_1 internal spaces are less than the first length and the first width; (II) After moving the four pipe fitting joints along a direction away from the predetermined stimulus source by a length corresponding to the first height, a second adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source after providing the solid material at the upper part of the four pipe fitting joints corresponding to the first height. Alternatively, the second adhesive solid material, generated using the predetermined adhesive supplied from the predetermined stimulus, is provided to the upper portion of the four pipe fitting joints corresponding to the first height and laminated to generate a second adhesive layer having a second height. In the portions connecting to the four first_1 internal spaces of the four pipe fitting joints, four first_2 internal spaces are formed in the first_2 internal height portions where the second adhesive layer is not generated in the second height. These spaces extend from a specific inner side of the surface of the second adhesive layer surrounding the four first_2 internal spaces, toward a point away from the first_1 internal space. The direction of the four pipe fitting joints, in the second height where the second adhesive layer is not generated, forms four gas pipes having a second internal length and a second internal width as four second internal spaces, and forms four first hollow portions defined by a center position spaced apart at a predetermined distance from the far end of the four pipe fitting joints at both ends of the four gas pipes, to generate the second adhesive layer, the first second internal length and the first second internal width of the four first_2 internal spaces are smaller than the first length and the first width, and the second internal height is smaller than the first_2 internal height;And (III) after moving the four pipe fitting joints and the second adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second height, after providing the solid material on the upper part of the second adhesive layer, using the predetermined adhesive supplied from the predetermined stimulus source to generate a third adhesive solid material, or providing the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the second adhesive layer and laminating it to generate a third adhesive layer having a third height, wherein four front-opening wafer transfer box joint structures having the third height and having four second hollow portions defined by the central position are formed on the upper side of the four first hollow portions to generate the third adhesive layer.

12. The computing device according to claim 11, characterized in that, The processor performs the following sub-processes in process (I): (i) After providing the solid material to the four locations on the predetermined plane, a first 1_1 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the first 1_1 adhesive solid material generated by applying the solid material using the predetermined adhesive supplied from the predetermined stimulus source is provided to the four locations on the predetermined plane to generate four first 1_1 adhesive layers having the first length and the first width and having a first 1_1 height in the first height; (ii) the four first 1_1 adhesive layers are moved in a direction away from the predetermined stimulus source. After the length of the first _1 height, a first _2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source after the solid material is provided on top of the four first _1 adhesive layers. Alternatively, the first _2 adhesive solid material generated by applying the predetermined adhesive from the predetermined stimulus source to the solid material is provided on top of the four first _1 adhesive layers and laminated to generate four first _2 adhesive layers having a first _2 height in the first height, wherein the first width of the four first _2 adhesive layers corresponds to the first _1 width. The structure forms four first through holes along the width direction, and four first 1_1_a portion interior spaces are formed in the structure corresponding to the first 1_2 width at the first width. Four second through holes along the width direction are formed in the structure corresponding to the first 1_3 width at the first width to generate the four first 1_2 adhesive layers; and (iii) after moving the four first 1_1 adhesive layers and the four first 1_2 adhesive layers along a direction away from the predetermined stimulus source by a length corresponding to the first 1_2 height, a [missing information] is provided on the upper part of the four first 1_2 adhesive layers. After the solid material is described, the first 1_3 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the first 1_3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the four first 1_2 adhesive layers and laminated to generate four first 1_3 adhesive layers having a first 1_3 height in the first height, wherein four first 1_1_b portion interior spaces are formed in the structure corresponding to the first 1_2 width to generate the four first 1_3 adhesive layers.

13. The computing device according to claim 11, characterized in that, The processor performs the following sub-processes in process (II): (i) After moving the four pipe fitting joints along a direction away from the predetermined stimulus source by a length corresponding to the first height, and after providing the solid material to the upper part of the four pipe fitting joints corresponding to the first height, a second_1 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source; or the second_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the four pipe fitting joints and laminated to generate a second_1 adhesive layer having a second_1 height in the second height, wherein, at the four pipe fitting joints corresponding to the first height... Four 1_2_a portion interior spaces are formed in the structure corresponding to the 1_2 width in the upper part of the 1_2 height. From the specific inner side of the side of the 2_1 adhesive layer surrounding the four 1_2 interior spaces, toward a direction away from the four pipe fitting joints, a 2_1 adhesive layer having a 2_1 length, a 2_1 width, and a 2_1 height is generated, wherein the 2_1 length and the 2_1 width are greater than the 2 internal length and the 2 internal width; (ii) the four pipe fitting joints and the 2_1 adhesive layer are arranged along a direction away from the predetermined stimulus. After the source is moved directionally corresponding to the length of the 2_1 height, a 2_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source after the solid material is provided on the upper part of the 2_1 adhesive layer, or the 2_2 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the 2_1 adhesive layer and laminated to generate a 2_2 adhesive layer having a 2_2 height in the 2 height, wherein four 1_2_b portions of the four 1_2 internal spaces are formed in the structure corresponding to the 1_2 width at the 2_1 height. An internal space, from a specific inner side of the side of the second adhesive layer surrounding the four first_2 internal spaces, toward a direction away from the four pipe fitting joints, forms four gas pipes as the four second internal spaces, having the second internal length and the second internal width, and forms four first_1 hollow portions defined by the center positions spaced apart by the predetermined distance from the far ends of the four pipe fitting joints at both ends of the four gas pipes, to generate the second_2 adhesive layer having the second_2 length, the second_2 width, and the second_2 height, the second_2 height corresponding to the second internal height;(iii) After moving the four pipe fitting joints, the second-1 adhesive layer, and the second-2 adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second-2 height, and after providing the solid material on the upper part of the second-2 adhesive layer, using the predetermined adhesive supplied from the predetermined stimulus source to generate a second-3 adhesive solid material, or providing the second-3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the second-2 adhesive layer and laminating it to generate a second-3 adhesive layer having a second-3 height in the second height, wherein four first-2 hollow portions defined by the center positions spaced apart by the predetermined distance from the distal ends of the four pipe fitting joints at both ends of the four gas pipes are formed to generate the second-3 adhesive layer having a second-3 length, a second-3 width, and a second-3 height.

14. The computing device according to claim 11, characterized in that, The processor performs the following sub-processes in process (III): (i) After moving the four pipe fitting joints and the second adhesive layer along a direction away from the predetermined stimulus source by a length corresponding to the second height, and after providing the solid material on the upper part of the second adhesive layer, using the predetermined adhesive supplied from the predetermined stimulus source to generate a third_1 adhesive solid material, or providing the third_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the upper part of the second adhesive layer and laminating it to generate a third_1 adhesive layer having a third_1 height in the third height, wherein four first_1 front-opening wafer transfer box joint details having the third_1 height and having four second_1 hollow portions defined by the center position are formed on the upper side of the four first hollow portions to generate the third_1 adhesive layer; and (ii) connecting the four pipe fitting joints... After the joint, the second adhesive layer, and the third adhesive layer are moved along a direction away from the predetermined stimulus source by a length corresponding to the third height, a third adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source after the solid material is provided on the upper part of the third adhesive layer, or the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to the upper part of the third adhesive layer and laminated to generate a third adhesive layer having a third height in the third height, wherein four first-second front-opening wafer transfer box joint details having the third height and having four second-second hollow portions defined by the central position are formed on the upper side of the four first-second front-opening wafer transfer box joint details to generate the third adhesive layer.

15. The computing device according to claim 14, characterized in that, The processor in the subprocess (i) Four first-opening wafer transfer box bonding details, each having a third-first radius and a third-first height, are formed on the upper side of the second adhesive layer to generate the third-first adhesive layer. A portion of the third-first radius corresponds to the exterior of the four second-first hollow portions. In the four first-opening wafer transfer box bonding details, the four second-first hollow portions defined by the central position are formed on the upper side of the four first hollow portions. In the subprocess (ii), Four front-opening wafer transfer box bonding details are formed on the upper side of the third_1 adhesive layer, each having a third_2 radius and a third_2 height from the center position, to generate the third_2 adhesive layer, wherein the third_2 radius is smaller than the third_1 radius, and a portion of the third_2 radius corresponds to the outside of the four second_2 hollow portions. In the four front-opening wafer transfer box bonding details, the four second_2 hollow portions defined by the center position are formed on the upper side of the four second_1 hollow portions.

16. The computing device according to claim 14, characterized in that, In process (III), the processor The dimensions of the four second-first hollow portions are made smaller than the dimensions of the four first hollow portions, and the dimensions of the four second-first hollow portions are the same as the dimensions of the four second-second hollow portions. This serves as the third adhesive layer, forming the four front-opening wafer transfer box bonding structures, i.e., four gas nozzles, which are composed of the four first-first front-opening wafer transfer box bonding details and the four first-second front-opening wafer transfer box bonding details.

17. The computing device according to claim 11, characterized in that, The processor also performs the following processes: (IV) Perform at least a portion of the following sub-processes: (i) perform surface treatment on the surfaces of the four pipe fitting joints, the second adhesive layer, and the third adhesive layer by sanding; (ii) after cleaning the surface-treated four pipe fitting joints, the second adhesive layer, and the third adhesive layer with a cleaning solution, dry the four pipe fitting joints, the second adhesive layer, and the third adhesive layer by blowing in air; and (iii) perform subsequent curing on the four pipe fitting joints, the second adhesive layer, and the third adhesive layer using at least a portion of a predetermined curing agent, an additional light source, and hot air.

18. The computing device according to claim 11, characterized in that, In the process (II), the processor At the three locations where the guide pins for mounting the front-opening wafer transfer box are inserted, three guide pin insertion portions of the same size as the guide pins and having a length corresponding to the second height are further formed to generate the second adhesive layer.

19. The computing device according to claim 11, characterized in that, In the process (II), the processor Further forming a corresponding opening pattern that matches a specific pattern formed on the mounting surface of any one of the loading port, side rail buffer, top buffer, and storage tank, and has a length corresponding to the second height, to form the second adhesive layer.

20. The computing device according to claim 11, characterized in that, In the process (I), the processor The predetermined through holes formed in the four pipe fitting joints are formed into structures for connecting external pipes to form the four pipe fitting joints, wherein the external pipes are used to introduce nitrogen into the interior of the front-opening wafer transfer box or to discharge exhaust gas from the front-opening wafer transfer box.

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