PCB micropore electroplating structure based on multi-field coupling and electroplating copper liquid circulation control system

Abstract

The invention discloses a PCB micropore electroplating structure based on multi-field coupling and an electroplating copper liquid circulation control system, and belongs to the technical field of PCB micropore electroplating. The PCB micropore electroplating structure specifically comprises an electroplating bearing base, lifting guide column supports are arranged at the corners of the top of the electroplating bearing base in a sleeving mode, and symmetrical air injection guide frames are arranged in the center of the interior of the electroplating bearing base in a sliding mode; the outer wall of the lifting guide column support is sleeved with a partition type lifting box in a sliding mode. Through parallel processing of multiple sets of board body clamping frames and combination of automatic clamping, plating solution circulation and cleaning processes, the electroplating efficiency of a single-batch PCB is remarkably improved compared with a traditional technology, the electroplating device is adaptive to high-precision micropore electroplating scenes such as HDI boards, and the miniaturization and integration production requirements of electronic components are met; the electroplating copper liquid circulation control system monitors plating liquid and environmental parameters in real time, and after data processing, automatic early warning and linkage response of process parameter abnormity are achieved, and environmental risks are prevented and controlled.

Description

Technical Field

[0001] This invention relates to the field of PCB micro-hole electroplating technology, specifically to a PCB micro-hole electroplating structure based on multi-field coupling and a copper plating solution circulation control system. Background Technology

[0002] As electronic products become smaller and more high-performance, the aspect ratio of PCB microvias is constantly increasing. When the diameter of the microvia is less than 0.1 mm and the aspect ratio exceeds 6:1, the flow of the plating solution in the microvia is severely restricted in the traditional electroplating process. Due to the slow flow of the liquid in the hole, copper ions cannot diffuse evenly to the bottom of the hole, resulting in a significantly lower copper ion concentration at the bottom of the hole than at the opening. This leads to insufficient filling at the bottom of the hole, which can easily cause void defects or problems such as wrinkles / covering defects caused by air bubbles.

[0003] The PCB micro-hole electroplating process involves the interaction of multiple physical fields such as electric field, temperature field, and flow field. There are complex coupling relationships between the parameters of these physical fields. For example, a small change in current density will cause changes in the temperature and flow rate of the electroplating solution, and the changes in temperature and flow rate will in turn affect the deposition rate of copper ions and the coating quality. In traditional processes, due to a lack of effective understanding and control of the synergistic effects of multiple physical fields, the adjustment of process parameters often relies on a large number of trial and error, resulting in low production efficiency and poor product quality stability. Therefore, a solution is proposed. Summary of the Invention

[0004] The purpose of this invention is to provide a PCB micro-hole electroplating structure and a copper plating solution circulation control system based on multi-field coupling to solve the problems mentioned above.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a PCB micro-hole electroplating structure based on multi-field coupling, including an electroplating receiving base, a lifting guide column bracket sleeved on the top corner of the electroplating receiving base, a symmetrical air jet guide frame slidably arranged in the center of the electroplating receiving base, and a partitioned lifting box slidably sleeved on the outer wall of the lifting guide column bracket. The inner wall of the lifting guide column bracket is slidably fitted with a lower support return frame and a plate clamping frame from bottom to top. The plate clamping frame is composed of an upper frame and a lower frame spliced ​​together. A return circulation frame for a graded partitioned lifting box is erected at one corner of the top of the electroplating base. A plating solution storage box is sleeved on the top of the partitioned lifting box. A circulating plating solution pump and a circulating air pump are respectively installed at both ends inside the plating solution storage box.

[0006] Furthermore, the electroplating base has a recessed groove in the center, a drain plate is attached to the surface of the groove, and side guide cylinders connected to the jet guide are symmetrically arranged on the top of both sides of the groove. A set of brush plates is arranged on the side of the jet guide facing the end face of the groove. A collection bin that cooperates with the brush plates is recessed on the inner wall of the end face of the groove, and a slag discharge valve is arranged at the bottom of the groove.

[0007] Furthermore, the outer wall of the lifting guide column bracket is provided with an external lifting cylinder that works in conjunction with the partitioned lifting box, and the inner wall of the lifting guide column bracket is provided with an internal combined lifting cylinder that works in conjunction with the plate clamping frame and the lower support return frame.

[0008] Furthermore, an upper cover plate is sleeved inside the upper frame, and a lower support plate is sleeved inside the lower frame. A limiting groove is recessed on the inner wall of the side of the lower frame facing the upper frame, and a detachable limiting plate is fitted inside the limiting groove. Several sets of side sliders are symmetrically arranged at the corners of the outer walls of the upper and lower frames, and several sets of connecting ports are symmetrically arranged on the upper cover plate and the lower support plate.

[0009] Furthermore, the lower support return rack is provided with metal fasteners at its corners that cooperate with the lifting guide column bracket, a return valve connected to the return circulation rack is provided at the bottom of one end of the lower support return rack, a transfer valve connected to the circulating plating solution pump pipeline is provided at the top of the return circulation rack, and several sets of return holes that cooperate with the connecting port are provided on the surface of the lower support return rack.

[0010] Furthermore, a rectangular groove is provided on the inner wall of the bottom of the partitioned lifting box, and the top of the rectangular groove extends into the inner wall of the partitioned lifting box to form an inner sleeve groove. The plating solution storage box is fitted inside the partitioned lifting box and located in the area above the inner sleeve groove.

[0011] Furthermore, a plating solution tank is provided in the center of the plating solution storage box, a plating solution heater is provided side by side on the side of the circulating plating solution pump, and an air purifier is provided side by side on the side of the circulating air pump. The top of the plating solution storage tank is provided with a tank cover, and the four corners of the bottom of the plating solution storage tank are symmetrically provided with a pressing cylinder. The bottom of the pressing cylinder is provided with a liquid guiding cover plate facing the plate clamping frame, and the bottom surface of the liquid guiding cover plate is provided with several sets of liquid injection pipes.

[0012] The present invention also proposes a copper plating solution circulation control system based on a multi-field coupling PCB micro-hole electroplating structure. The copper plating solution circulation control system includes a circulation monitoring platform, and the circulation monitoring platform is communication-connected to a plating hole data acquisition module for collecting plate hole plating solution and the environment inside the tank. The plating data acquisition sensor marks and classifies the raw data it collects, constructs plating solution parameter files and plating environment parameter files, and sends them to the microporous plating solution analysis module and the anomaly risk module, respectively. Micro-pore plating solution analysis module: Based on the plating solution parameter file provided by the plating hole data acquisition module, it assesses the electroplating status, generates abnormal flow rate plating hole signals, and sends them to the circulation monitoring platform; Anomaly Risk Module: Based on the plating environment parameter file provided by the plating hole data acquisition module, it analyzes the changes in the sealing environment during electroplating, generates a humid risk environment signal, and sends it to the circulation monitoring platform.

[0013] The beneficial effects of this invention are: 1. This invention uses an external lifting cylinder to slide the partitioned lifting box upwards, which can accurately expose the board clamping frame and realize the one-by-one placement of PCB boards; the internal combination lifting cylinder drives the upper and lower closing frames to separate, so that the PCB board can be quickly positioned on the lower support plate. After closing, it is fixed by the limiting structure, which greatly shortens the clamping time and is suitable for batch processing of multiple PCB boards. Multiple sets of board clamping frames are attached to form a connected micro-hole plating solution limiting plate group. With the docking of the lower support return frame and the liquid guide cover plate, a closed-loop plating solution circulation trajectory is constructed to ensure that the micro-holes of each PCB board can fully contact the plating solution, providing a uniform fluid environment for subsequent electroplating.

[0014] 2. This invention maintains a constant temperature for the electroplating solution using a plating bath heater. A circulating plating bath pump draws hot fluid plating solution and injects it into micropores under high pressure through an injection pipe. The fluid pressure ensures that the plating solution fully adheres to the inner wall of the micropores, preventing uneven plating or missed plating. It is particularly suitable for electroplating requirements of complex structures such as semi-micropores. The lower reflux rack is connected to the reflux circulation rack through pipelines. The used plating solution is filtered by a liquid purification filter to remove impurities, prevent contamination of unused plating solution, extend the service life of the plating solution, and reduce production costs.

[0015] 3. This invention uses a circulating air pump to draw in purified air and mix it with a small amount of plating solution. The gas pressure carries the fluid to flush the micropores, removing residual plating solution from the inner wall, avoiding excessive plating thickness or local accumulation, and precisely controlling the plating thickness. At the same time, the "air brush flushing" is used to re-inspect the inner wall of the micropores, improving the plating consistency of PCB boards in the same batch.

[0016] 4. This invention uses a plating solution data acquisition module to monitor plating solution parameters and the environment inside the tank in real time. After processing such as Kalman filtering, a dynamic file is constructed. The micro-hole plating solution analysis module and the abnormal risk module combine preset standards and historical data analysis to realize automatic early warning of abnormal process parameters such as copper ion concentration and flow rate, as well as linkage response such as plating solution replenishment and pump pressurization. At the same time, it prevents environmental risks such as gas leakage and excessive humidity, thereby improving the uniformity of the plating layer at the bottom of the hole and reducing the void defect rate. Compared with traditional processes, the response speed is improved and the cost of manual intervention is reduced. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a perspective view of the overall structure of the present invention; Figure 2 This is a schematic diagram of the electroplating support base and the lifting guide column bracket of the present invention; Figure 3 This is a schematic diagram of the structure of the trench of the present invention; Figure 4 This is a schematic diagram of the structure of the lifting guide column bracket and the plate clamping frame of the present invention; Figure 5 This is a schematic diagram of the plate clamping frame of the present invention; Figure 6 This is a schematic diagram of the structure of the lower support plate of the present invention; Figure 7 This is a schematic diagram of the structure of the partitioned lifting box and plating solution storage box of the present invention; Figure 8 This is a schematic diagram of the structure of the plating solution storage box of the present invention; Figure 9 This is a flowchart of the system of the present invention.

[0019] Reference numerals: 1. Electroplating receiving base; 101. Stencil; 102. Ground tank; 103. Brush plate; 104. Air jet guide; 105. Side guide cylinder; 2. Lifting guide column bracket; 201. External lifting cylinder; 202. Internal combined lifting cylinder; 3. Partitioned lifting box; 301. Inner sleeve tank; 4. Plating solution storage box; 401. Plating solution tank; 402. Circulating plating solution pump; 403. Plating solution heater; 40 4. Circulating air pump; 405. Box cover; 406. Air purifier; 407. Liquid guide cover plate; 408. Downward pressure cylinder; 5. Return circulation frame; 6. Plate clamping frame; 601. Upper closing frame; 602. Lower closing frame; 603. Upper cover plate; 604. Lower support plate; 605. Side slider; 606. Limiting slot; 607. Limiting plate; 608. Connecting port; 7. Lower support return frame; 701. Return valve. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figure 1 - Figure 8 As shown, this embodiment is a PCB micro-hole electroplating structure based on multi-field coupling, including an electroplating receiving base 1, a lifting guide column bracket 2 sleeved on the top corner of the electroplating receiving base 1, a symmetrical air jet guide 104 slidably arranged in the center inside the electroplating receiving base 1, and a partitioned lifting box 3 slidably sleeved on the outer wall of the lifting guide column bracket 2. The inner wall of the lifting guide column bracket 2 is slidably fitted with a lower support return frame 7 and a board clamping frame 6 from bottom to top. The board clamping frame 6 is composed of an upper frame 601 and a lower frame 602. The lower support return frame, lower support plate, upper cover plate and liquid guide cover plate are replaced in advance according to the PCB board to be processed, so as to match the micro-hole arrangement position on the PCB board of this batch.

[0022] The electroplating base 1 has a recessed groove 102 inside. A drain plate 101 is snapped onto the surface of the groove 102. Side guide cylinders 105, which are connected to the jet guide 104, are symmetrically arranged on the top of both sides of the groove 102. A set of brush plates 103 is arranged on the side of the jet guide 104 facing the end face of the groove 102. A collection bin that cooperates with the brush plates 103 is recessed on the inner wall of the end face of the groove 102. A slag discharge valve is arranged at the bottom of the groove 102.

[0023] An external lifting cylinder 201 is provided on the outer wall of the lifting guide column bracket 2, which works in conjunction with the partitioned lifting box 3 for transmission. An internal combined lifting cylinder 202 is provided on the inner wall of the lifting guide column bracket 2, which works in conjunction with the plate clamping frame 6 and the lower support return frame 7 for transmission.

[0024] The upper frame 601 is fitted with an upper cover plate 603, and the lower frame 602 is fitted with a lower support plate 604. A limiting groove 606 is recessed on the inner wall of the side of the lower frame 602 facing the upper frame 601. A detachable limiting plate 607 is fitted inside the limiting groove 606. Several sets of side sliders 605 are symmetrically arranged at the corners of the outer walls of the upper frame 601 and the lower frame 602. Several sets of connecting ports 608 are symmetrically arranged on the plates of the upper cover plate 603 and the lower support plate 604.

[0025] After a batch of PCB boards is electroplated, the lifting guide column bracket 2 drives the partition lifting box 3 to open and disassemble the micro-hole plating solution limiting plate group connected to it, thereby removing the electroplated PCB boards. If there is residual plating solution on the surface of the lower support return rack 7, it can be cleaned manually, or before the device stops, some of the internal combination lifting cylinders 202 will drive the lower support return rack 7 to slide down into the ground tank 102. Here, the metal fasteners can be adjusted in advance to ensure that the lower support return rack 7 can enter without obstruction. The side guide cylinder 105 drives the jet guide rack 104 to move towards the center. The jet guide rack 104 is connected to the circulating air pump 404 through the telescopic air pipe and guides the high-pressure air to flush the lower support return rack 7. The brush rack brushes synchronously with the jet guide rack 104. The solidified electroplating liquid falls along the edge of the lower support return rack 7 into the ground tank 102, waiting for subsequent centralized cleaning.

[0026] The lifting guide column bracket 2 drives the partitioned lifting box 3 to slide upward through the external lifting cylinder 201 until the partitioned lifting box 3 is raised to a certain distance, causing the board clamping frame 6 to be fully exposed, so that the PCB boards can be installed and placed one by one into the single board clamping frame 6. The inner combination lifting cylinder 202 works with the board clamping frame 6 to separate the upper frame 601 and the lower frame 602 of the single board clamping frame 6, so that the PCB boards can be placed into the lower support plate 604. After the upper frame 601 and the lower frame 602 are closed to limit the PCB board, and after multiple sets of PCB boards are limited, several sets of board clamping frames 6 are driven to fit together one by one to construct a connecting micro-hole plating solution limiting plate group. The connecting micro-hole limiting plate group is driven to slide up and approach the liquid guide cover plate 407 by a partial combination of lifting cylinders 202. The lower support return frame 7 is driven to slide up by a partial combination of lifting cylinders 202. The device is attached to the bottom of the connecting micro-hole limiting plate group to realize the preliminary steps of PCB semi-micro-hole plating solution treatment.

[0027] The lifting guide column bracket 2 drives the partition lifting box 3 to slide down through the external lifting cylinder 201 until it closes with the top of the electroplating base 1, completely sealing the connecting microporous plating liquid limiting plate group. After the partition lifting box 3 and the electroplating base 1 are closed, a closed space is formed to prevent the electroplating liquid from evaporating or leaking. In conjunction with the air purifier 406, the circulating gas is treated to reduce the emission of harmful gases in the workshop, which complies with environmental protection and safe operation specifications.

[0028] The lower support return rack 7 has metal fasteners at its corners that cooperate with the lifting guide column bracket 2. One end of the lower support return rack 7 has a return valve 701 that is connected to the return circulation rack 5. The top of the return circulation rack 5 has a transfer valve that is connected to the pipeline of the circulating plating solution pump 402. The surface of the lower support return rack 7 has several sets of return holes that cooperate with the connecting port 608.

[0029] Example 2: This example is a PCB micro-hole electroplating structure based on multi-field coupling, including an electroplating receiving base 1 with a reflux circulation frame 5 vertically installed at one corner of the top of the grading partition type lifting box 3, and a plating solution storage box 4 sleeved on the top of the partition type lifting box 3. A circulating plating solution pump 402 and a circulating air pump 404 are respectively installed at both ends inside the plating solution storage box 4.

[0030] A rectangular groove is provided on the inner wall of the bottom of the partition-type lifting box 3. The top of the rectangular groove extends into the inner wall of the partition-type lifting box 3 and forms an inner sleeve groove 301. The plating solution storage box 4 is sleeved inside the partition-type lifting box 3 and located in the area above the inner sleeve groove 301.

[0031] The plating solution storage tank 4 has a plating solution tank 401 in the center inside, a plating solution heater 403 arranged side by side on the side of the circulating plating solution pump 402, and an air purifier 406 arranged side by side on the side of the circulating air pump 404. The plating solution storage tank 4 draws the plating solution from the plating solution tank 401 through the circulating plating solution pump 402. The circulating plating solution pump 402 is connected to the liquid injection pipe on the liquid guide cover 407 via a telescopic fitting. The downward pressure cylinder 408 drives the liquid guide cover 407 to slide down until it contacts the top of the connecting microporous plating solution limiting plate group. The liquid injection pipe is inserted into the connecting port 608 on the connecting microporous plating solution limiting plate group. Combined with the return liquid hole on the lower support return frame 7 and the bottom connecting port 608 of the connecting microporous plating solution limiting plate group, a socket-type connection is formed to form a circulating flow trajectory of the electroplating solution.

[0032] The top of the plating solution storage tank 4 is provided with a tank cover 405, and the bottom of the plating solution storage tank 4 is symmetrically provided with four pressure cylinders 408. The bottom of the pressure cylinder 408 is provided with a liquid guide cover plate 407 facing the plate clamping frame 6. Several sets of liquid injection pipes are provided on the bottom surface of the liquid guide cover plate 407. The electroplating solution inside the plating bath 401 is kept at a certain temperature with the assistance of the plating solution heater 403. The circulating plating solution pump 402 draws the electroplating solution from the hot fluid structure into the telescopic hose and flows along the circulation trajectory. This causes the inner wall of the micropores of the PCB board to be pressurized by the hot fluid electroplating solution, resulting in some of the hot fluid electroplating solution remaining on the micropores and adhering to them, thus achieving the electroplating treatment of the micropores.

[0033] During micropore electroplating, the lower reflux rack 7 is connected to the reflux valve 701 and the reflux circulation rack 5 via a telescopic hose to reflux the used electroplating solution. The reflux circulation rack 5 is equipped with a liquid purification filter or filter plate for the used hot fluid electroplating solution to prevent impurities remaining inside the micropores from being carried away by the hot fluid electroplating solution and affecting other unused electroplating solutions. The top of the reflux circulation rack 5 is connected to the valve on the tank cover 405 via a telescopic hose, and the valve on the tank cover 405 is connected to the circulating plating solution pump 402.

[0034] After the microporous preliminary electroplating process is completed, the circulating air pump 404 draws in external air through the grille on the box cover 405, and uses the air purifier 406 to purify the drawn air. The air purifier 406 is equipped with a mixing box connected to the circulating plating solution pump 402 on its side, which is used to control the purified gas to be mixed with a small amount of electroplating solution and then delivered to the circulating flow path again. By using gas to carry a portion of the hot fluid electroplating solution to flush the micropores, excessive hot fluid electroplating solution residue is avoided on the inner wall of the micropores. This ensures the coupled electroplating treatment of multiple sets of micropores in the same batch of PCB boards, controls the thickness of the electroplating layer on the inner wall of the micropores, ensures that the inner wall of the micropores is flushed by a re-inspection air brush, and improves the overall efficiency of micropore electroplating on PCB boards.

[0035] Example 3: Reference Figure 9 As shown, this embodiment is a copper plating solution circulation control system based on a multi-field coupled PCB micro-hole electroplating structure. The copper plating solution circulation control system includes a circulation monitoring platform, and the circulation monitoring platform is connected to a plating hole data acquisition module for collecting plate hole plating solution and tank environment data. The plating data acquisition sensor marks and classifies the raw data it collects, constructs plating solution parameter files and plating environment parameter files, and sends them to the microporous plating solution analysis module and the anomaly risk module, respectively. The circulating monitoring platform pre-stores standard parameters of the electroplating process (plating solution temperature threshold, current density range, pH range, etc.) and equipment operation logic plans. At the same time, it stores historical electroplating data based on a time-series database (including changes in plating solution composition, occupational exposure limits, temperature and humidity curves, fault records, etc. for each batch of PCB boards). It supports retrieval and trend analysis by batch and process parameter dimensions, and builds a database for the circulating control system of copper plating solution. The plate hole data acquisition module uses a miniature conductivity sensor, temperature sensor, pH electrode and other sensors installed on the plate clamping frame 6 to collect the copper ion concentration, temperature, conductivity and pH value of the plating solution in the micro-holes. The flow meter and pressure sensor set at the outlet of the circulating plating solution pump 402 are used to acquire the flow rate and pressure of the circulating plating solution to construct the raw data of the plate hole plating solution parameters. By using gas sensors installed on the inner wall of the partitioned lifting box 3, the concentration of acidic gas and humidity inside the partitioned lifting box 3 are collected to construct the raw data of the environmental parameters inside the box. Kalman filtering was applied to the raw data to eliminate interference and miscellaneous parameters. Normalization was used to map data of different ranges to a unified range. The plate hole plating solution parameters and tank environment parameters of the raw data were processed repeatedly to construct plating solution parameter files and plating environment parameter files. Micro-hole plating solution analysis module: Retrieves copper concentration thresholds and preset flow rate critical values ​​from pre-stored electroplating process standard parameters within the circulation monitoring platform, and parses the plating solution parameter file provided by the plating hole data acquisition module, retrieving the real-time recorded copper ion concentration and comparing it with the copper concentration threshold. If the copper ion concentration remains below the copper concentration threshold, it is determined that the plating solution is consumed too quickly or not replenished enough, and a plating solution replenishment signal is generated. The copper concentration threshold is 80-100 g / L. After the plating solution replenishment signal is sent to the circulation monitoring platform, the circulation monitoring platform will parse the signal and generate a "plating solution replenishment alarm" text message and send it to the communication device of the on-duty supervisor, along with the collection and analysis data of the plating solution. Meanwhile, the microporous plating solution analysis module re-analyzes the plating solution parameter file, extracts the real-time detection and recording of the plating solution flow rate within the micropores, and compares it with the preset flow rate threshold value: If the flow rate of the plating solution in the micropore is lower than the preset flow rate threshold and the duration exceeds 5 minutes, it is determined that copper ions are scarce at the bottom of the hole, generating an abnormal flow rate plating hole signal. The preset flow rate threshold is 0.1 m / s. After the abnormal flow rate plating hole signal is sent to the circulation monitoring platform, the circulation plating solution pump 402 is triggered to increase the pressure, thereby accelerating the extraction of the electroplating solution inside the plating solution tank 401 and alleviating the abnormality.

[0036] Anomaly Risk Module: Based on the plating environment parameter file provided by the plating hole data acquisition module, the module analyzes the temperature, acid gas concentration, and humidity data one by one. Simultaneously, it retrieves pre-stored occupational exposure limits, temperature limits, and humidity limits from historical electroplating data within the circulation monitoring platform and compares them with the temperature, acid gas concentration, and humidity data for analysis. If the concentration of acidic gas inside the partitioned lifting box 3 exceeds the occupational exposure limit, the air pressure sensor installed on the inner wall of the partitioned lifting box 3 will collect the current air pressure data. When the air pressure data shows a downward trend, it will be determined that there is a sealing failure, and a gas leakage environmental signal will be generated and sent to the circulation monitoring platform. This will trigger the start of the exhaust gas treatment device connected to the external pipeline to actively extract the gas environment inside the device. The circulating air pump 404 will draw in the externally filtered air and replace the gas inside the device through the pressure relief valve at the bottom of the circulating air pump 404 and the jet guide 104. If the humidity data inside the partitioned lifting box 3 exceeds the humidity limit value, and is accompanied by a decrease in temperature data, analysis may indicate that condensation may occur on the PCB board surface, generating a humid risk environment signal. This signal is sent to the circulation monitoring platform, triggering a pre-set processing plan and driving the circulation air pump 404 to introduce dry air.

[0037] As can be seen from Examples 1, 2 and 3, by using multiple sets of board clamping frames 6 in parallel processing, combined with automated clamping, plating solution circulation and cleaning processes, the electroplating efficiency of a single batch of PCB boards is improved compared with traditional processes. It is especially suitable for high-precision micro-hole electroplating scenarios such as high-density interconnect (HDI) boards, meeting the production needs of miniaturization and integration of electronic components. The copper plating solution circulation control system monitors plating solution parameters and the tank environment in real time through a plating hole data acquisition module. After processing such as Kalman filtering, a dynamic file is constructed. The micro-hole plating solution analysis module and the abnormal risk module combine preset standards and historical data analysis to realize automatic early warning of abnormal process parameters such as copper ion concentration and flow rate, as well as linkage response such as plating solution replenishment and pump pressurization. At the same time, it prevents environmental risks such as gas leakage and excessive humidity, thereby improving the uniformity of the plating layer at the bottom of the hole and reducing the void defect rate. Compared with traditional processes, the response speed is improved and the cost of manual intervention is reduced.

[0038] The above description is merely an example and illustration of the structure of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described, or use similar methods to replace them, as long as they do not deviate from the structure of the invention or exceed the scope defined in the claims, all of which should fall within the protection scope of the present invention.

Claims

1. A PCB microvia electroplating structure based on multi-field coupling, comprising an electroplating receiving base (1), characterized in that, The electroplating base (1) is fitted with a lifting guide column bracket (2) at the top corner. A symmetrical jet guide frame (104) is slidably installed in the center of the electroplating base (1). A partitioned lifting box (3) is slidably fitted on the outer wall of the lifting guide column bracket (2). The inner wall of the lifting guide column bracket (2) is slidably fitted with a lower support return frame (7) and a plate clamping frame (6) from bottom to top. The plate clamping frame (6) is composed of an upper frame (601) and a lower frame (602) spliced ​​together. The electroplating receiving base (1) has a reflux circulation frame (5) of the graded partition lifting box (3) erected at one corner of the top. The partition lifting box (3) is fitted with a plating solution storage box (4) on the top. The plating solution storage box (4) is equipped with a circulating plating solution pump (402) and a circulating air pump (404) at both ends inside.

2. The PCB microvia electroplating structure based on multi-field coupling according to claim 1, characterized in that, The electroplating base (1) has a recessed groove (102) inside. A drain plate (101) is snapped onto the surface of the groove (102). Side guide cylinders (105) that are symmetrically connected to the jet guide (104) are arranged on the top of both sides of the groove (102). A set of brush plates (103) is arranged on the side of the jet guide (104) facing the end face of the groove (102). A storage compartment that cooperates with the brush plate (103) is recessed on the inner wall of the end face of the groove (102).

3. The PCB microvia electroplating structure based on multi-field coupling according to claim 1, characterized in that, The outer wall of the lifting guide column bracket (2) is provided with an external lifting cylinder (201) that works in conjunction with the partitioned lifting box (3) for transmission. The inner wall of the lifting guide column bracket (2) is provided with an internal combined lifting cylinder (202) that works in conjunction with the plate clamping frame (6) and the lower support return frame (7) for transmission.

4. The PCB microvia electroplating structure based on multi-field coupling according to claim 1, characterized in that, The upper frame (601) is fitted with an upper cover plate (603), the lower frame (602) is fitted with a lower support plate (604), and a limiting groove (606) is recessed on the inner wall of the side of the lower frame (602) facing the upper frame (601). A detachable limiting plate (607) is fitted inside the limiting groove (606). Several sets of side sliders (605) are symmetrically arranged at the corners of the outer walls of the upper frame (601) and the lower frame (602), and several sets of connecting ports (608) are symmetrically arranged on the plates of the upper cover plate (603) and the lower support plate (604).

5. The PCB microvia electroplating structure based on multi-field coupling according to claim 4, characterized in that, The lower support return rack (7) is provided with metal fasteners at its corners that cooperate with the lifting guide column bracket (2). One end of the lower support return rack (7) is provided with a return valve (701) connected to the return circulation rack (5). The top of the return circulation rack (5) is provided with a transfer valve connected to the pipeline of the circulating plating solution pump (402). The surface of the lower support return rack (7) is provided with several sets of return holes that cooperate with the connecting port (608).

6. The PCB microvia electroplating structure based on multi-field coupling according to claim 1, characterized in that, The partitioned lifting box (3) has a rectangular groove on the inner wall of the bottom box. The top of the rectangular groove extends into the inner wall of the partitioned lifting box (3) and forms an inner sleeve groove (301). The plating solution storage box (4) is fitted inside the partitioned lifting box (3) in the area above the inner sleeve groove (301).

7. The PCB microvia electroplating structure based on multi-field coupling according to claim 1, characterized in that, The plating solution storage box (4) has a plating solution tank (401) in the center, the circulating plating solution pump (402) has a plating solution heater (403) arranged side by side, and the circulating air pump (404) has an air purifier (406) arranged side by side. The top of the plating solution storage box (4) is provided with a box cover (405), and the bottom of the plating solution storage box (4) is symmetrically provided with a pressing cylinder (408). The bottom of the pressing cylinder (408) is provided with a liquid guiding cover plate (407) facing the plate clamping frame (6). The bottom of the surface of the liquid guiding cover plate (407) is provided with several sets of liquid injection pipes.

8. A copper plating solution circulation control system for a PCB microvia electroplating structure based on multi-field coupling, used in the PCB microvia electroplating structure based on multi-field coupling as described in any one of claims 1-7, characterized in that, The copper plating solution circulation control system includes a circulation monitoring platform, which is equipped with a data acquisition module for collecting plating solution data and the environment inside the tank. The plating data acquisition sensor marks and classifies the raw data it collects, constructs plating solution parameter files and plating environment parameter files, and sends them to the microporous plating solution analysis module and the anomaly risk module, respectively. Micro-pore plating solution analysis module: Based on the plating solution parameter file provided by the plating hole data acquisition module, it assesses the electroplating status, generates abnormal flow rate plating hole signals, and sends them to the circulation monitoring platform; Anomaly Risk Module: Based on the plating environment parameter file provided by the plating hole data acquisition module, it analyzes the changes in the sealing environment during electroplating, generates a humid risk environment signal, and sends it to the circulation monitoring platform.

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