Fabric with electronic components

Abstract

The invention relates to a fabric with an electronic component. A fabric may be formed and gaps created in the fabric using an interweaving apparatus. The fabric may include one or more electrically conductive strands. During interleaving operations, an insertion tool may be used to align electronic components with the conductive strands. Insulation may be removed from the conductive strand using a soldering tool to expose conductive sections on the conductive strand. The conductive section may be soldered to the electronic component using the soldering tool. The solder connection may be located in a recess in the electronic component. A packaging tool may dispense a packaging material in the recess to package the solder connection. After the electronic component is electrically connected to the conductive strand, the insertion tool may position and release the electronic component in the gap. When the interleaving operation continues, a component retention tool may be temporarily used to retain the electronic component in the gap.

Description

Related application citation

[0001] This application is a divisional application of Chinese national application number 202010148921.8, filed on March 5, 2020, entitled "Fabric with Electronic Components".

[0002] This application claims priority to U.S. Patent Application No. 16 / 809,445, filed March 4, 2020, which claims the benefit of U.S. Provisional Patent Application No. 62 / 815,923, filed March 8, 2019, and U.S. Provisional Patent Application No. 62 / 872,659, filed July 10, 2019, all of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present invention relates generally to articles having fabric, and more specifically to articles having both fabric and electronic components. Background Technology

[0004] It may be desirable to form bags, furniture, clothing, and other items from materials such as fabrics. Fabric items typically do not contain electronic components. However, it may be desirable to incorporate electronic components into the fabric to provide enhanced functionality for the user of the fabric item.

[0005] Integrating electronic components into fabric can be challenging. Fabric is soft, making it difficult to mount structures onto it. Electronic components must be coupled to signal paths (e.g., signal paths transmitting data signals, power, etc.), but these paths can be damaged or components may detach if care is not taken when bending and stretching the fabric.

[0006] Therefore, it is desirable to provide improved technologies for integrating electronic components into articles with fabrics. Summary of the Invention

[0007] Interlacing equipment (e.g., weaving equipment, knitting equipment, braiding equipment, etc.) may be equipped with individually adjustable components. The use of individually adjustable components allows electronic components to be inserted into and / or embedded in the fabric during fabric production or formation.

[0008] The interlacing device can create a gap between a first fabric portion and a second fabric portion during the interlacing operation. The gap can be a void between fabric portions, or a location or part between fabric portions. An insertion tool can insert electronic components into the gap, and the electronic components can be electrically coupled to conductive strands in the gap. If desired, the interlacing operation can be uninterrupted during the insertion process. After the electronic components are inserted and attached, the interlacing operation can continue and the electronic components can be enclosed in the fabric. In some arrangements, after the electronic components are enclosed in the fabric, the gap between the first and second fabric portions can be maintained in place. In other arrangements, after the electronic components are enclosed in the gap, the first and second fabric portions can be pulled together, thereby eliminating the gap. The fabric may have a protrusion where the electronic components are located, or the fabric may not have a protrusion where the electronic components are located (e.g., if desired, the fabric may have a substantially uniform thickness across the location with and without electronic components).

[0009] In one exemplary example, the weaving apparatus may include a weaving apparatus. The weaving apparatus may include a warp yarn positioning device for positioning warp yarns and a weft yarn positioning device for inserting weft yarns between the warp yarns to form a fabric. The fabric may include insulated yarns and conductive yarns. The conductive yarns may be coupled to electronic components.

[0010] During fabric formation (e.g., during interlacing operations, or when repositioning or temporarily pausing one or more interlacing sections), strand handling operations and component insertion operations may occur. Insulation removal tools can remove insulation from the conductive strands. Warp strand positioning devices can position the conductive strands away from other warp strands during insulation removal operations. Insulation removal tools may include a laser that ablates the outer insulating coating to expose the conductive core on each conductive strand.

[0011] After the insulation is removed, the weaving can continue and pockets (e.g., gaps) can be formed in the fabric. Conductive strands can pass through these pockets. When it is desired to insert electronic components, a warp strand positioning device can be used to create a shed adjacent to the conductive strands. An insertion tool can be used to insert the electronic components into the shed. The insertion tool aligns the conductive strands with a groove in the electronic components and allows the electronic components to slide along the conductive strands into the pocket until the groove overlaps with the exposed conductive core of the conductive strands.

[0012] While the insertion tool holds the electronic components in the pocket, a heating tool (such as an induction heating tool, hot air, or laser) can be used to recirculate solder between the electronic components and the conductive strands. If necessary, heat can also be applied to melt an encapsulating material, such as thermoplastic. The encapsulating material can cover the conductive strands and fill grooves to help encapsulate these solder connections. After the heating operation, weaving can continue and the pocket can be closed.

[0013] In some arrangements, certain processing operations may occur before the component is inserted into the fabric pocket. For example, insulation removal, electrical connection (e.g., soldering), encapsulation, and / or other processing operations may occur before the component is inserted into the fabric pocket. In this type of arrangement, an insertion tool aligns the component with conductive strands initially located outside the pocket. An extension tool extends the radial strands to create openings in the upper and / or lower portions of the shed. These openings in the shed provide visual accessibility to the component and also physical accessibility for processing equipment to reach it. For example, an electrical connection tool (such as a solder head) may reach the component through the shed opening to electrically connect the component to the conductive strands (e.g., by heating solder previously applied to the component, by dispensing and heating solder on the component, by applying conductive adhesive to the component, etc.). If necessary, the heat from the solder head can also be used to remove insulation from the conductive strands during soldering. An encapsulation tool may reach the component through the shed opening to dispense encapsulant around the electrical connection. If necessary, additional processing operations, such as electrical connection verification, can be performed before inserting the component into the pocket. Once the desired processing is complete, the insertion tool inserts and releases the component, along with the attached conductive strands, into the pocket. If necessary, a component holding tool can be used to hold the component in the pocket when the insertion tool is removed. The interleaving process can continue, the pocket can be closed, and the component holding tool can be removed.

[0014] As a supplement to or alternative to processing operations performed outside the pocket, processing operations can be performed after the component is inserted into the pocket. For example, the component may have electrical contact points on a side portion of the component that is exposed along the open side of the pocket before the pocket is closed. When this side of the component is exposed along the open side of the pocket, a thermoforming welder can be used to reflow solder onto the electrical contact points of the component. In other arrangements, a fabric opening machine can be used to create an opening in the fabric to provide access to the component in the pocket. The fabric opening machine can be used to loosen an already formed portion of the fabric, or it can be positioned in place while the strands are interwoven around it, thereby creating an opening. The opening can be closed when the desired processing operation is completed and access to the component is no longer required. If desired, an endoscope or other optical sensing device can be used to obtain visual accessibility to the component in the pocket. If desired, the endoscope can be a laser endoscope that generates a laser (e.g., to ablate insulation, melt solder, melt thermoplastics or other encapsulants, etc.).

[0015] The control circuit can independently control the warp strand positioning device, weft strand positioning device, component insertion device, reed, pulling device, warp tensioning device, clamping rod, insulation removal device, and heating device. Therefore, these devices will not necessarily move simultaneously and synchronously, but can be individually repositioned and / or restarted as needed to accommodate component insertion operations and other operations. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of an exemplary fabric article according to one embodiment.

[0017] Figure 2 A side view of an exemplary fabric according to one embodiment.

[0018] Figure 3 A side view of a material layer that can be incorporated into a fabric article according to one embodiment.

[0019] Figure 4 The illustration shows how an interlacing device can be used to produce fabric when an insertion tool is used to insert electronic components into the fabric, according to one embodiment.

[0020] Figure 5 This is a cross-sectional side view of an exemplary electronic component according to one embodiment.

[0021] Figure 6 A cross-sectional side view of an exemplary electronic component having an electronic device mounted on an interposer according to one embodiment.

[0022] Figure 7 A cross-sectional side view of an exemplary electronic component with a protective structure according to one embodiment.

[0023] Figure 8 This is a cross-sectional side view of an exemplary electronic component having a recess for receiving strands according to one embodiment.

[0024] Figure 9 A bottom view of an exemplary electronic component having a contact pad with a length spanning the width of the electronic component, according to one embodiment.

[0025] Figure 10 A bottom view of an exemplary electronic component having a contact pad spanning less than the full width of the electronic component, according to one embodiment.

[0026] Figure 11 This is a perspective view of an exemplary device that can be used to form a fabric with electronic components, according to one embodiment.

[0027] Figure 12 A cross-sectional side view of an exemplary fabric with electronic components according to one embodiment.

[0028] Figure 13 This is a diagram illustrating an exemplary knitting system according to one implementation scheme.

[0029] Figure 14A front view of an exemplary weft-knitted fabric with conductive strands according to one embodiment.

[0030] Figure 15 A front view of an exemplary warp-knitted fabric with conductive strands according to one embodiment.

[0031] Figure 16 A perspective view of an exemplary electronic component inserted from below into a knitted fabric during fabric formation, according to one embodiment.

[0032] Figure 17 A perspective view of an exemplary insertion tool that can be used to insert electronic components into fabric according to one embodiment.

[0033] Figure 18 A perspective view of an exemplary electronic component inserted from above into a knitted fabric during fabric formation, according to one embodiment.

[0034] Figure 19 A perspective view of an exemplary electronic component inserted into a braid during fabric formation, according to one embodiment.

[0035] Figure 20 A cross-sectional side view of an exemplary strand according to one embodiment shows how the insulation can be selectively removed to expose the conductive core.

[0036] Figure 21 A cross-sectional side view of an exemplary strand of wire from which insulation has been removed, according to one embodiment.

[0037] Figure 22 This is a top view of an exemplary strand according to one embodiment, the strands having portions from which insulation has been removed to expose conductive sections.

[0038] Figure 23 A perspective view of an exemplary insertion tool that can be used to insert electronic components into fabric according to one embodiment.

[0039] Figure 24 This is a perspective view of an exemplary insertion tool for aligning electronic components with conductive strands during fabric formation, according to one embodiment.

[0040] Figure 25 A perspective view of an exemplary insertion tool for inserting electronic components into a fabric pocket and a heating tool for soldering electronic components to conductive strands, according to one embodiment.

[0041] Figure 26A cross-sectional side view of an electronic component held in a fabric pocket by an insertion tool when a heating tool is used to melt solder and encapsulant materials, according to one embodiment.

[0042] Figure 27 A cross-sectional side view of an electronic component with conductive strands soldered into a fabric pocket according to one embodiment.

[0043] Figure 28 This is a flowchart illustrating the exemplary steps of using a device to incorporate electronic components into a fabric according to one embodiment.

[0044] Figure 29 A side view illustrating, according to one embodiment, how an insertion tool can be used to align the electronic component with the conductive strands before the electronic component is inserted into the fabric pocket.

[0045] Figure 30 The top view of an exemplary fabric according to one embodiment shows how a stretching tool can be used to create shed openings to provide access to electronic components.

[0046] Figure 31 The side view illustrates how an apparatus (such as a soldering and packaging apparatus) can access an electronic component through a shed opening held open by a stretching tool, according to one embodiment.

[0047] Figure 32 A side view illustrating how an insertion tool can insert electronic components into a fabric pocket and how the tool can retain electronic components in the fabric pocket when the insertion tool is removed, according to one embodiment.

[0048] Figure 33 A side view illustrating how a retaining tool can hold electronic components in a fabric pocket as the interlacing operation continues, according to one embodiment.

[0049] Figure 34 This is a side view of an exemplary electronic component according to one embodiment, which has used... Figures 29 to 33 The device and processing operation of the type shown are electrically coupled to conductive strands and inserted into a fabric pocket.

[0050] Figure 35 This is a perspective view of an exemplary device according to one embodiment, which can be used to electrically couple electronic components to conductive strands in a pocket by touching the electronic components along the open side of the pocket during an interleaving operation.

[0051] Figure 36 The top view is an exemplary device according to one embodiment, which can be used to create temporary openings in a fabric to provide access to electronic components in the fabric.

[0052] Figure 37 The image shows a cross-sectional side view of an exemplary device according to one embodiment, which can be used to temporarily hold a portion of a fabric loose during an interlacing operation to provide access to electronic components within the fabric.

[0053] Figure 38 The side view illustrates how an insertion tool can insert an electronic component into a fabric pocket when an endoscope laser is used to view the electronic component and the laser is used to weld the electronic component to conductive strands. Detailed Implementation

[0054] Electronic devices, housings, and other articles can be formed from fabrics, such as textiles. Textiles may include strands of insulating and conductive materials. Conductive strands can form signal paths through the fabric and can be coupled to electronic components, such as light-emitting diodes and other light-emitting devices, integrated circuits, sensors, haptic output devices, and other circuits.

[0055] Interlacing equipment (sometimes referred to as entanglement equipment) may include weaving equipment, knitting equipment, braiding equipment, or any other suitable equipment for interlacing, looping, overlapping, or otherwise coupling material strands together to form a strand network (e.g., a fabric). Interlacing equipment may be provided with individually adjustable components, such as warp strand positioning devices (e.g., heddles or other warp strand positioning devices), weft strand positioning devices, reeds, tensioning devices, warp feed devices (e.g., devices for individually distributing and tensioning warp strands), needle beds, feeders, guide rods, strand handling and component insertion devices, and other components for forming woven articles. The individual adjustability of these components allows interlacing operations (e.g., weaving, knitting, braiding, and / or other interlacing operations) to be performed without requiring continuous lockstep synchronization of each of these devices, thereby allowing the weaving of fabrics with desired properties. As an example, normal reed movement and other weaving operations can be periodically paused and / or periodically desynchronized with other components to accommodate component insertion operations, thereby inserting electronic components (sometimes referred to as nodes or smart nodes) into the fabric during fabric production or formation.

[0056] Items (such as Figure 1Article 10 may include fabric and may sometimes be referred to as a fabric article or a fabric-based article. Article 10 may be an electronic device or an accessory to an electronic device, such as a laptop computer; a computer monitor containing an embedded computer; a tablet computer; a cellular phone; a media player; or other handheld or portable electronic devices; smaller devices, such as wristwatches, hanging devices, headphones or handsets, devices embedded in glasses, or other devices worn on a user's head; or other wearable or micro-devices; a television set; a computer monitor that does not contain an embedded computer; a gaming device; a navigation device; an embedded system, such as a system in which the fabric article 10 is installed in a kiosk, car, airplane, or other means of transportation (e.g., autonomous or non-autonomous transportation); other electronic devices, or devices that perform the functions of two or more of these devices. If desired, item 10 may be a removable housing for an electronic device, may be a strip, may be a wristband or headband, may be a removable cover for a device, may be a shell or bag with a strip or other structure for receiving and carrying electronic devices and other items, may be a necklace or armband, may be a wallet, sleeve, pocket, or other structure into which electronic devices or other items may be inserted, may be part of a chair, sofa, or other seating (e.g., a cushion or other seating structure), may be part of clothing or other wearable items (e.g., a hat, belt, wristband, headband, etc.), or may be any other suitable item incorporating fabric.

[0057] Article 10 may include interwoven material strands such as monofilaments and yarns forming fabric 12. As used herein, "interwoven" and "entangled" material strands may refer to material strands that interlace with each other, loop together, overlap each other, or are otherwise coupled together (e.g., as part of a network of strands constituting a fabric). Fabric 12 may form all or part of a housing wall or other layer in an electronic device, may form an internal structure in an electronic device, or may form other fabric-based structures. Article 10 may be soft (e.g., article 10 may have a fabric surface that produces a slight touch), may be rigid (e.g., the surface of article 10 may be formed of a rigid fabric), may be rough, may be smooth, may have ribs or other patterned textures, and / or may be formed as part of a device having portions formed of non-woven structures of plastic, metal, glass, crystalline materials, ceramics, or other materials.

[0058] The material strands used to form fabric 12 can be monofilament strands (sometimes referred to as fibers), or they can be threads, yarns, or other strands formed by interlacing multiple material filaments together. The strands can be formed from polymers, metals, glass, graphite, ceramics, natural materials (such as cotton or bamboo), or other organic and / or inorganic materials, and combinations thereof. Conductive coatings, such as metallic coatings, can be formed on non-conductive strands (e.g., plastic cores) to make them conductive. Reflective coatings, such as metallic coatings, can be applied to the strands to make them reflective. The strands can also be formed from monofilament metal wires (e.g., bare metal wires), multifilaments, or combinations of different materials. The strands can be insulating or conductive.

[0059] The strands in fabric 12 may be conductive along their entire length, or may have conductive portions. The strands may have metallic portions selectively exposed by partially removing insulation (e.g., to form connections with other conductive strand portions and / or to electronic components). Strands may also be formed by selectively adding a conductive layer to a portion of a non-conductive strand. Threads and other multifilament yarns already formed from interlaced filaments may contain a mixture of conductive and insulating strands (e.g., metallic or metal-coated strands with or without an outer insulation layer may be used in combination with insulating solid plastic or natural strands). In some arrangements (sometimes described herein as an example), fabric 12 may be a woven fabric, and the strands constituting fabric 12 may include warp and weft strands.

[0060] Conductive and insulating strands can be woven, knitted, or otherwise interwoven to form conductive paths. These conductive paths can be used to form signal paths (e.g., signal buses, power lines for transmitting power), to form part of capacitive touch sensor electrodes, resistive touch sensor electrodes, or other input-output devices, or to form other patterned conductive structures. The conductive structures in fabric 12 can be used to transmit current (such as power), digital signals, analog signals, sensor signals, control signals, data, input signals, output signals, or other suitable electrical signals.

[0061] Article 10 may include additional mechanical structures 14, such as polymer adhesives for holding the strands of fabric 12 together, support structures (such as frame members), housing structures (e.g., electronic device housings), and other mechanical structures.

[0062] To enhance the mechanical robustness and conductivity of strand-to-strand connections and / or strand-to-component connections, additional structures and materials (e.g., solder, crimped metal connections, welded parts, conductive adhesives (such as anisotropic conductive films and other conductive adhesives), non-conductive adhesives, fasteners, etc.) may be used in the fabric 12. Strand-to-strand connections may be formed at locations where strands intersect perpendicularly to each other, or at intersections of other strands where a connection is desired. At locations where strand-to-strand connections are not desired, insulating material may be inserted between intersecting conductive yarns. The insulating material may be plastic or other dielectric, and may include insulated strands or conductive strands with insulating coatings or insulated conductive monofilaments, etc. Solder connections may be formed between conductive strands and / or between conductive strands and electronic components by melting solder to allow the solder to flow onto the conductive strands. The solder may be heated using an induction welding head, hot air, a reflow oven, a laser or thermoforming welder, or other welding equipment. In some arrangements, the outer dielectric coating (e.g., the outer polymer layer) can be melted away in the presence of molten solder, thereby allowing the underlying metal yarns to be welded together. In other arrangements, the outer dielectric coating can be removed prior to welding (e.g., using laser ablation equipment or other coating removal equipment).

[0063] Circuit 16 may be included in article 10. Circuit 16 may include electronic components coupled to fabric 12, electronic components housed within a housing formed of fabric 12, or electronic components attached to fabric 12 using welding, soldering, bonding (e.g., conductive adhesive bonding such as anisotropic conductive adhesive bonding or other conductive adhesive bonding), crimping, or other electronic and / or mechanical bonding. Circuit 16 may include metallic structures for carrying current, electronic components (such as integrated circuits), light-emitting diodes, sensors, and other electronic devices. Control circuitry in circuit 16 may be used to control the operation of article 10 and / or support communication with article 18 and / or other devices.

[0064] Article 10 can interact with electronic devices or other attached articles 18. Article 18 can be attached to article 10, or article 10 and article 18 can be separate articles configured to operate on each other (e.g., when one article is a housing and the other is a device housed within that housing, etc.). Circuitry 16 may include an antenna and other structures for supporting wireless communication with article 18. Article 18 may also interact with article 10 using a wired communication link or other connection that allows the exchange of information.

[0065] In some cases, article 18 may be an electronic device, such as a cellular phone, computer, or other portable electronic device, and article 10 may form a cover, housing, bag, or other structure that receives the electronic device in a pocket, internal cavity, or other part of article 10. In other cases, article 18 may be a wristwatch device or other electronic device, and article 10 may be a strip or other fabric article attached to article 18 (e.g., article 10 and article 18 may together form a fabric-based article, such as a wristwatch with a strap). In still other cases, article 10 may be an electronic device, fabric 12 may be used to form the electronic device, and attached article 18 may include accessories or other devices that interact with article 10. Signal paths formed by conductive yarns and monofilaments may be used to route signals in article 10 and / or article 18.

[0066] The fabric constituting article 10 may be formed from yarns and / or monofilaments interwoven using any suitable weaving equipment. Utilizing a suitable arrangement sometimes described herein as an example, fabric 12 may be a woven fabric formed using a loom. In this type of exemplary configuration, the fabric may have a plain weave, square weave, satin weave, twill weave, or variations thereof, may be a three-dimensional fabric, or may be other suitable fabrics. However, this is merely illustrative. If desired, fabric 12 may comprise knitted fabric, warp-knitted fabric, weft-knitted fabric, braided fabric, other suitable types of fabric, and / or any combination of two or more of these types of fabric.

[0067] Figure 2 A cross-sectional side view of an illustrative fabric 12 is shown. (See figure.) Figure 2 As shown, fabric 12 may include ply yarns 80. Ply yarns 80 may include warp ply yarns 20 and weft ply yarns 22. If desired, additional ply yarns that are neither warp nor weft ply yarns may be incorporated into fabric 12. Figure 2 The examples are merely illustrative. Figure 2 In the exemplary configuration, fabric 12 has a single layer of woven ply 80. If desired, a multi-layer fabric construction can be used for fabric 12.

[0068] Article 10 may include non-woven materials (e.g., structures formed from plastics, metals, glass, ceramics, crystalline materials such as sapphire). These materials may be formed using molding operations, extrusion, machining, laser processing, and other manufacturing techniques. In some configurations, part or all of article 10 may include one or more layers of material such as Figure 3 Layer 24 may include layers of polymers, metals, glass, fabrics, adhesives, crystalline materials, ceramics; a substrate on which components are mounted; a patterned material layer; a material layer containing patterned metal traces, thin-film devices (such as transistors); and / or other layers.

[0069] Figure 4 The diagram illustrates how electronic components can be inserted into fabric 12 during its formation. Figure 4 As shown, fabric 12 can be formed from fabric portions (such as fabric portions 12-1 and 12-2). Fabric portions 12-1 and 12-2 can be formed from interlaced ply yarns 80. For example, a first set of ply yarns 80 can be used to form fabric portion 12-1, and a second set of ply yarns 80 can be used to form fabric portion 12-2. Fabric portions 12-1 and 12-2 can be different parts of a single layer of fabric 12, or fabric portion 12-1 can form a first layer of fabric 12, and fabric portion 12-2 can form a second layer of fabric 12.

[0070] Using the interlacing device 120, the strands 80 can be interlaced to form fabric 12. The interlacing device 120 can be a weaving device, a knitting device, a braiding device, or other suitable interlacing device. The interlacing device 120 can be used to create one or more areas in fabric 12 for receiving electronic components, such as pockets 66 (sometimes referred to as gaps, spaces, cavities, voids, locations, sites, etc.). Areas in fabric 12 for receiving electronic components, such as pockets 66, can be formed by creating spaces or gaps between portions of fabric 12, such as fabric portion 12-1 and fabric portion 12-2. The term "pocket" can be used to refer to a gap between fabric portions, and / or can be used to refer to a location or site between fabric portions (e.g., the location between material strands in fabric 12).

[0071] Electronic components can be inserted into pocket 66 using a component insertion device (such as insertion tool 54) during fabric 12 formation. Insertion tool 54 can hold component 26 and can position component 26 in pocket 66 during interlacing operations (e.g., by moving component 26 toward pocket 66 in direction 140). If desired, component 26 can be electrically and mechanically connected to one or more conductive strands 80C in pocket 66. After component 26 is inserted and attached, interlacing device 120 can continue interlacing operations (which may include closing pocket 66 if desired) to continue forming fabric 12.

[0072] In some arrangements, processing steps may be performed after component 26 is inserted into pocket 66, such as alignment of component 26 with conductive strand 80C, electrical connection (e.g., soldering) of component 26 to conductive strand 80C, encapsulation of the electrical connection between component 26 and conductive strand 80C, and / or verification of the integrity of the electrical connection between component 26 and conductive strand 80C. For example, in Figure 25 An illustrative example of welding within the pocket is shown in (described subsequently). In other arrangements, one or more of these processing steps may be performed before inserting component 26 into pocket 66 to make component 26 more accessible. Figure 31(Also described below) An exemplary example of welding outside the pocket is shown.

[0073] In some arrangements, the gap between the first fabric portion 12-1 and the second fabric portion 12-2 can be maintained in place after the electronic component 26 is surrounded in the fabric 12 (e.g., a space may exist between fabric portions 12-1 and 12-2 after the fabric 12 is formed). In other arrangements, after the electronic component 26 is surrounded in the gap, the first fabric portion 12-1 and the second fabric portion 12-2 can be pulled together such that the gap 66 is eliminated (e.g., fabric portions 12-1 and 12-2 can contact each other without an intervening gap after the fabric 12 is formed). The fabric 12 may have a protrusion where the electronic component 26 is located, or the fabric 12 may not have a protrusion where the electronic component 26 is located (e.g., if desired, the fabric may have a substantially uniform thickness across the location with and without the electronic component 26).

[0074] Figure 5 The image shows a side view of an exemplary electronic component of a type that can be used in article 10. Electronic components in article 10 include, for example,... Figure 5 The exemplary electronic components 26 may include discrete electronic components such as resistors, capacitors, and inductors; may include connectors; may include batteries; may include input-output devices such as switches, buttons, light-emitting components (such as light-emitting diodes), audio components (such as microphones and speakers), vibrators (e.g., vibrating piezoelectric actuators), solenoids, electromechanical actuators, motors, and other electromechanical devices, microelectromechanical systems (MEMS) devices, pressure sensors, photodetectors, proximity sensors (light-based proximity sensors, capacitive proximity sensors, etc.), force sensors (e.g., piezoelectric sensors), strain gauges, humidity sensors, temperature sensors, accelerometers, gyroscopes, compasses, magnetic sensors (e.g., Hall effect sensors and magnetoresistive sensors such as giant magnetoresistive sensors), touch sensors, and other sensors, components forming a display, touch sensor arrays (e.g., an array of capacitive touch sensor electrodes forming a touch sensor that detects touch events in two dimensions), and other input-output devices, electronic components forming control circuitry such as non-volatile and volatile memories, microprocessors, application-specific integrated circuits, system-on-a-chip devices, baseband processors, wired and wireless communication circuits, and other integrated circuits.

[0075] Electronic components such as component 26 may be semiconductor dies (e.g., laser dies, LED dies, integrated circuits, etc.) or packaged components (e.g., semiconductor dies or other devices encapsulated in plastic, ceramic, or other package structures). One or more electronic terminals, such as contact pads 30, may be formed on the body 28 of component 26. The body 28 may be a semiconductor die (e.g., laser die, LED die, integrated circuit, etc.) or a package for the component (e.g., a plastic or other dielectric package containing one or more semiconductor dies or other electronic devices). Contacts for the body 28, such as pads 30, may be protruding leads, flat contacts, may be formed in an array, may be formed on any suitable surface of the body 28, or any other suitable contact used to form an electrical connection with component 26. For example, pads 30 may be metal solder pads.

[0076] like Figure 6 As shown in the example, the body 28 may be mounted on a support structure such as an interposer 36. The interposer 36 may be a printed circuit, a ceramic carrier, or another dielectric substrate. The interposer 36 may be larger than the body 28 or may have other suitable dimensions. The interposer 36 may have a planar shape with a thickness of 700 micrometers, greater than 500 micrometers, less than 500 micrometers, or other suitable thickness. The thickness of the body 28 may be 500 micrometers, greater than 300 micrometers, less than 1000 micrometers, or other suitable thickness. The occupied area (area seen from above) of the body 28 and the interposer 36 may be 10 micrometers x 10 micrometers, 100 micrometers x 100 micrometers, greater than 1 mm × 1 mm, less than 10 mm × 10 mm, and may be rectangular, square, L-shaped, or have other suitable shapes and dimensions.

[0077] The interposer 36 may include signal paths such as metal traces 38. Metal traces 38 may have portions forming contact points such as pads 34 and 40. Pads 34 and 40 may be formed on the upper surface of the interposer 36, on the lower surface of the interposer 36, or on the sides of the interposer 36. A conductive material such as conductive material 32 may be used to mount the body 28 to the interposer 36. The conductive material 32 may be solder (e.g., low-temperature or high-temperature solder), a conductive adhesive (isotropic conductive adhesive or anisotropic conductive film), which may be formed during soldering, or other conductive materials used to couple electronic device pads (body pads), such as pads 30 on the body 28, to the interposer pads 34. The metal traces 38 in the interposer 36 may couple pads 34 to other pads such as pads 40. If desired, pads 40 may be larger and / or wider spaced than pads 34, thereby facilitating the attachment of the interposer 36 to conductive yarns and / or other conductive paths in the article 10. Solder, conductive adhesive, or other conductive connectors may be used to couple pad 40 to conductive yarns, conductive monofilaments, printed circuit traces, or other conductive path materials in article 10.

[0078] Figure 7 An example of a component 26 including a protective structure (such as protective structure 130 on the inserter 36) is shown. Protective structure 130 may be, for example, a plastic structure that completely or partially encapsulates device 28 and inserter 36 to provide mechanical robustness, protection against moisture and other environmental contaminants, heat dissipation, and / or electrical insulation. Protective structure 130 may be formed from molding plastic (e.g., injection molded plastic, transfer molded plastic, low-pressure molded plastic, two-part molded plastic, etc.) that has been molded or pre-formed into a desired shape over device 28 and inserter 36 and subsequently attached to inserter 36; may be a layer of encapsulant material (e.g., thermoplastic) that has been melted to encapsulate device 28; may be a layer of polymer such as polyimide that has been cut or machined into a desired shape and subsequently attached to inserter 36; or may be formed using other suitable methods. Exemplary materials that can be used to form protective structure 130 include epoxy resins, polyamides, polyurethanes, silicones, other suitable materials, or any combination of two or more of these materials. The protective structure 130 may be formed on one or both sides of the inserter 36 (e.g., it may completely or partially surround the inserter 36).

[0079] The protective structure 130 may be completely opaque, completely transparent, or may have both opaque and transparent areas. The transparent portions of the protective structure 130 may allow light emitted from one or more devices 28 to pass through the protective structure 130, and / or may allow external light to reach (and be detected by) one or more devices 28. If desired, the protective structure 130 may have different thicknesses. The protective structure 130 has a uniform thickness across the intercalator 36. Figure 7 The examples provided are merely illustrative. In some arrangements, the protective structure 130 may be an encapsulating material, such as a thermoplastic, that has been melted to create a robust connection between the component 26 and the strands 80 of the fabric 12. For example, the protective structure 130 may surround portions of the strands 80, fill recesses, grooves, or other features in the component 26 to facilitate interlocking the component 26 to the strands 80, and / or fill gaps in the fabric 12.

[0080] If needed, the interposer 36 can be large enough to accommodate multiple electronic devices, each with its own body 28. For example, one or more light-emitting diodes, sensors, microprocessors, and / or other electronic devices can be mounted into a common interposer such as... Figure 7 The interposer 36. The light-emitting diode (LED) may be a miniature LED (e.g., an LED semiconductor die with an area of ​​approximately 10 μm × 10 μm, greater than 5 μm × 5 μm, less than 100 μm × 100 μm, or other suitable sizes). The LED may include LEDs of different colors (e.g., red, green, blue, white, etc.), infrared light, or ultraviolet light. Redundant LEDs or other redundant circuitry may be included on the interposer 36. Multiple electronic devices (each having a corresponding body 28) are mounted on a common interposer. Figure 7 In the configuration of the type shown, electronic component 26 may include any suitable combination of electronic devices (e.g., light-emitting diodes, sensors, integrated circuits, actuators, and / or combinations thereof). Figure 5 Other devices of the type described in electronic component 26).

[0081] Device 28 is located only on one side of intercalator 36 Figure 6 and Figure 7 The example is for illustrative purposes only. If needed, device 28 can be mounted on both sides of inserter 36.

[0082] Electronic component 26 may be coupled to fabric structures, individual strands, printed circuits (e.g., rigid printed circuits formed of epoxy resin or other rigid printed circuit board materials filled with glass fibers, or flexible printed circuits formed of sheets of polyimide substrate or other flexible polymer materials), metal or plastic components with signal traces, or other structures in article 10.

[0083] In some configurations, article 10 may include an electrical connection between component 26 and conductive paths in fabric 12. For example, as Figure 8As shown, component 26 can be coupled to conductive strands 80C of fabric 12. The conductive strands 80C (sometimes referred to as "lines") can be configured to deliver electrical signals (e.g., power, digital signals, analog signals, sensor signals, control signals, data, input signals, output signals, or other suitable currents) to and / or from component 26. The strands 80C can be warp strands in fabric 12 (e.g.,...). Figure 2 Meridian strand 20), latitudinal strand (e.g., Figure 2 The component 26 may be coupled to a single conductive strand 22 or other suitable strand 80. One or more of the strands 80C may be conductive. If desired, component 26 may be coupled to a single conductive strand 80C, to two conductive strands 80C, or to two or more conductive strands 80C. The arrangement of component 26 coupled to a pair of conductive strands 80C is sometimes described herein as an illustrative example.

[0084] Component 26 may have contact pads such as pad 40. Solder or other conductive material 82 may be used to couple pad 40 to conductive strand 80C. Figure 8 In this example, pad 40 is formed on the upper surface of insert 36 (e.g., the same surface of mounting device 28). Conductive material 82 may be used to electrically and mechanically couple component 26 to strands 80C of fabric 12. If desired, pad 40 may alternatively or additionally be formed on the lower surface of insert 36 (e.g., the surface opposite to the surface of mounting device 28). Figure 8 The examples are merely illustrative.

[0085] In some configurations, it may be desirable to provide component 26 (e.g., Figure 5 , Figure 6 , Figure 7 or Figure 8 A more robust mechanical connection between component 26 and fabric 12 ensures that component 26 does not loosen when fabric 12 is bent or stretched. To enhance the robustness of the connection between the strands 80C and component 26, component 26 may have one or more recesses for receiving strands 80C. For example, strands 80C may each pass through a portion of component 26 to help secure component 26 to fabric 12. Strands 80C may pass through recesses, openings, grooves, recesses, holes, and / or other engagement features of component 26. Recesses, openings, grooves, recesses, holes, or other engagement features may be formed in device 28, inserter 36, protective structure 130, and / or other portions of component 26. Figure 8 An example is shown where the conductive strand 80C is received within a groove (such as groove 50 formed in the protective structure 130). However, this is merely illustrative. If desired, groove 50 may alternatively or supplementally be formed in other portions of insert 36, device 28, and / or component 26. Figure 8The position, shape, and geometry of the groove 50 are merely illustrative.

[0086] The recess 50 in the protective structure 130 (sometimes referred to as a groove, opening, notch, recess, etc.) can be formed by removing a portion of the protective structure 130 (e.g., using a laser, mechanical saw, mechanical grinder, or other equipment), or by molding (e.g., injection molding) or otherwise forming the protective structure 130 into a shape including the recess 50. The recess 50 may have a width between 2 mm and 6 mm, between 0.3 mm and 1.5 mm, between 1 mm and 5 mm, between 3 mm and 8 mm, greater than 3 mm, less than 3 mm, or other suitable width. If desired, the groove 50 may have different depths (e.g., to expose the contact pad 40 at different surface heights of the inserter 36).

[0087] The recess 50 exposes the conductive pad 40 on the insert 36. Strands 80C can each pass through an associated recess 50 in the protective structure 130. Solder or other conductive material 82 can be used to electrically and mechanically couple the strands 80C to the conductive pad 40 in the recess 50 of the protective cover 130. Because the strands 80C are wedged between portions of the protective cover 130, they resist detachment from the insert 36. In addition to holding the strands 80C in place so that the component 26 remains attached to the fabric 12, the recess 50 also serves as a physical guide to align the component 26 relative to the fabric 12 during component insertion and attachment operations. This can be advantageous when inserting and attaching the component 26 to the fabric 12 without visual contact.

[0088] Each strand 80C can be aligned with an associated pad 40 on component 26. If desired, the pad 40 can be formed from an elongated strip of conductive material (e.g., metal) extending from one edge of insert 36 to the opposite edge of insert 36, such as... Figure 9 As shown in the example. This provides a large area for forming the mechanical and electrical connection between the insert 36 and the strand 80C. The elongated shape of the pad 40 allows the conductive material 82 to attach a longer portion of the strand 80C to the pad 40. The connection between the pad 40 and the strand 80C can, for example, span the width of the insert 36, thus providing a robust connection between the insert 36 and the strand 80C. However, this is only illustrative. If desired, the exposed conductive portions of the pad 40, the conductive material 82, and the strand 80C can span less than the entire width of the component 26, such as Figure 10 As shown in the example.

[0089] Figure 11 An illustrative interlacing device is shown. Figure 11 In one example, the interlacing device 120 includes weaving equipment for forming a fabric.

[0090] In the weaving arrangement, the interlacing device 120 includes a warp yarn source, such as a warp yarn source 44. Source 44 can supply warp yarns 20 from a warp beam, yarn carrier, tapered tube, bobbin, or other yarn distribution structure. Source 44 can distribute the warp yarns 20, for example, via an electrically controlled distribution roller or other warp yarn distribution and tensioning device (e.g., a drum, an electrically controlled actuator, a sensor, and / or other device for measuring, controlling, and / or regulating the yarn feed and tension of the warp yarns 20).

[0091] Control circuit 42 controls the operation of device 120. Control circuit 42 may include storage and processing circuitry for implementing control functions during weaving operations. The storage device may include, for example, random access memory, non-volatile memory (such as read-only memory), hard disk storage, etc. The processing circuitry may include a microprocessor, microcontroller, digital signal processor, application-specific integrated circuit, and other circuitry for executing software instructions obtained from the storage device.

[0092] The warp strands 20 can be positioned using warp strand positioning devices (such as heddles 46). Each heddle 46 may include an eye mounted on a line or other support structure extending between corresponding positioners (or between a positioner and an associated spring or other tensioner). In some arrangements, the heddles 46 may be mechanically driven (e.g., by a dobby loom). In other arrangements, the positioner moving the heddles 46 may be a motor (e.g., a stepper motor) or other electromechanical actuator, controlled by control circuitry 42 during weaving operations to position the warp strands 20 in a desired position during weaving. Specifically, control circuitry 42 may supply a control signal to move each heddle 46 up or down by a desired amount in direction 122. By raising and lowering the heddles 46 in various patterns (e.g., to different heights) in response to the control signals from control circuitry 42, different patterns of the shed 124 (gap) between the warp strands 20 can be produced to adjust the properties of the fabric produced by device 120.

[0093] Weft strands, such as weft strand 22, can be inserted into one or more sheds 124 during weaving to form fabric 12. A weft strand positioning device 68 can be used to position one or more weft strands 22 between the warp strands 20 forming each shed 124. The weft strand positioning device 68 of device 120 may include one or more shuttles and / or may include a shuttleless weft strand positioning device (e.g., a needle-punched weft strand positioning device, a rapier weft strand positioning device, or other weft strand positioning devices such as projectile-based, air-jet, or water-jet based devices, etc.). For example, the weft strand positioning device 68 of device 120 may include an electrically controllable rapier weft strand device or other weft strand insertion device controlled by control circuitry 42. If desired, the weft strand positioning device 68 can be controlled independently of other components in device 120. For example, the weft strand insertion operation can be temporarily suspended with or without pausing other weaving operations.

[0094] The weft ply positioning device 68 can insert the weft ply 22 across the fabric 12 into the shed 124 and can attach the weft ply 22 to the adhesive 60 on the opposite side of the fabric 12 (e.g., the ply sewn to the edge of the fabric 12). After each weft ply 22 passes through the shed 124, the reed positioner 48 can move the reed 52 (e.g., a reed member having a slot or other opening through which the corresponding warp ply 20 passes) in direction 126 to push the weft ply 22 just inserted into the shed 124 between the corresponding warp ply 20 against the previously woven fabric 12, thereby ensuring the production of a satisfactory dense fabric. The reed 52 can move linearly or can rotate back and forth about an axis in an approximately linear reciprocating motion. The reed positioner (positioner 48) can be, for example, a linear actuator controlled by a control signal from the control circuit 42 and moving the reed toward and away from the edge of the fabric 12.

[0095] The woven fabric 12 can be gathered on a fabric collecting device (such as a pull roller 56 or other pulling device). As the roller 56 rotates about a corresponding axis of rotation 74, it collects the woven fabric 12. Figure 11 As shown, the tensioning device 56 can collect the fabric 12 on multiple rollers, which can help protect the electronic components in the fabric 12 while maintaining an appropriate amount of tension in the fabric 12. For example, less tension can be applied to the portion of the fabric 12 where the electronic components 26 are located, while other portions of the fabric 12 that do not contain the electronic components can be kept under a higher amount of tension.

[0096] Device 120 may include a clamping bar, such as clamping bar 62, for applying pressure to the fabric 12 before it gathers onto the pulling device 56. To ensure that clamping bar 62 does not damage electronic components 26 in the fabric 12, clamping bar 62 may have an adjustable height. Specifically, control device 42 may move clamping bar 62 up and down in direction 128 to accommodate component 26. As the fabric 12 moves toward the pulling device 56 and component 26 approaches clamping bar 62, control circuitry 42 may move clamping bar 62 upward (away from fabric 12) to ensure that no pressure is applied to component 26 (or only moderate pressure is applied). When component 26 is no longer under clamping bar 62, control circuitry 42 may move clamping bar 62 downward to apply an appropriate amount of pressure to the fabric 12 where component 26 is not positioned. If necessary, the clamping rod 62 can move uniformly as a whole, or the clamping rod 62 may include individually controlled portions 150 (e.g., actively controlled portions, spring-loaded portions, etc.) that can move separately and independently along direction 128. In an arrangement in which the clamping rod 62 includes individually controlled portions 150, some portions 150 may remain on the surface of the fabric 12, while other portions (e.g., portions aligned with component 26) may be temporarily raised to accommodate component 26 as the fabric 12 is woven.

[0097] The warp yarn distribution and tensioning device 44, heald plate 46, reed 52 (including positioner 48), weft yarn insertion device 68, clamping rod 62, and pulling (decoupling) devices (such as roller 56) can each be independently controlled by the control circuit 42. Simultaneously, in coordination with the control of these components, the control circuit 42 can control the component insertion and yarn handling devices in device 120 (e.g., to allow light-emitting diodes, integrated circuits, sensors, and other electronic components (such as component 26) to be inserted into fabric 12).

[0098] For example, when the electric strand processing equipment performs processing operations on strands 20 and / or 22 and / or when the component insertion equipment inserts electronic components into fabric 12 (e.g., by soldering contact points on the electronic components to conductive strands 20 and / or 22), the control circuit 42 may temporarily suspend the weaving operation (e.g., the movement of weaving components such as warp strand distribution and tensioning equipment 44, heald 46, reed 52, weft strand insertion equipment 68, pressure bar 62, and pulling equipment 56 may be temporarily suspended).

[0099] The strand processing equipment may include an insulation removal tool 70 and a heating tool 64. The insulation removal tool 70 may include a laser, heating element, and / or other components that generate light, heat, and / or other energy to remove insulation from the outside of the insulated conductive strand 80C. The heating tool 64 may include a sensing head, heating element, hot air source, laser, and / or other components that generate heat and / or other energy to melt solder and / or melt encapsulant material on component 26. For example, it may cause solder 82 ( Figure 8 The flow reflows at contact point 40, thereby soldering component 26 to conductive strand 80C. A heating tool 64 may also be used to melt encapsulant material (such as portions of protective structure 130) to form a robust mechanical connection and provide encapsulation around the electrical connection. If desired, device 120 may include other strand handling equipment, such as components for applying coatings and / or other equipment for modifying strands 20 and / or 22. If desired, heating elements may be incorporated into other components of device 120 (such as clamping rod 62 and / or support structure 58).

[0100] If necessary, a single tool can be used to remove the insulation from the strands, reflow the solder, and melt the encapsulant material (e.g., a laser and / or heating element can be used to remove the insulation, reflow the solder, and melt the encapsulant material simultaneously and / or at different times). Arrangements using a first tool, such as an insulation removal tool 70 (e.g., a laser), to remove the insulation from strands 20 and / or 22 and using a second tool, such as a heating tool 64 (e.g., an induction heating tool, hot air, a laser, etc.), to reflow the solder and melt the encapsulant material are sometimes described herein as an illustrative example. If necessary, one or more sensors (e.g., a pyrometer 72) can be used to monitor the temperature of component 26, fabric 12, and / or other components during the insulation removal operation, during the solder reflow operation, and / or during the encapsulant material melting. Support structures that are not susceptible to induction heating, such as support structure 58 (e.g., a block of dielectric material, such as ceramic, plastic, etc.), can be used to provide support for component 26 under the fabric 12 where it will be mounted. If necessary, the conductive strands in fabric 12, such as conductive strand 80C, may include non-insulated conductive strands (e.g., strands without an outer insulator), and the insulation removal tool 70 may not be required.

[0101] Component insertion equipment for inserting components into fabric 12 during fabric 12 formation may include an insertion tool 54. Insertion tool 54 may include an insertion head 54A and an electrically controlled positioner 54B that positions the insertion head within a shed 124. Insertion tool 54 may be used to insert a component 26 (e.g., an electronic component) into fabric 12. For example, insertion tool 54 may position component 26 in shed 124, align a groove 50 in component 26 with a conductive strand 80C, and slide component 26 along the conductive strand 80C into a gap (such as pocket 66) in fabric 12 such that an exposed conductive segment of the conductive strand 80C in pocket 66 is received within the groove 50 and aligned with a pad 40 of component 26. In other arrangements, insertion tool 54 may align component 26 with a segment of strand 80C initially located outside pocket 66. In this type of scenario, component 26 can be aligned with strand 80C, electrically connected (e.g., welded) to strand 80C, and sealed (if desired) before component 26 is inserted into pocket 66. If desired, device 120 may include a stretching tool to stretch the radial strands to create a shed opening through which component 26 can be accessed for off-pocket processing. This type of off-pocket processing will combine... Figures 29 to 34 More detailed description.

[0102] If desired, fabric 12 may have multiple pockets 66 for multiple components 26, and / or may have multiple components 26 in each pocket 66. If desired, components 26 may be attached to portions of fabric 12 other than pockets 66 during fabric 12 formation (e.g., to the upper or lower surface of fabric 12, and / or to other portions of fabric 12). Pockets 66 may be staggered relative to each other or formed in a line. Multiple components 26 in a pocket 66 may be staggered relative to each other or formed in a line. If desired, multiple components 26 may be electrically connected to the same pair of conductive strands, and / or components may have a first terminal coupled to a portion of the strand and a second terminal coupled to a second portion of the same strand. Pockets 66 may be completely opaque, completely transparent, or may have both opaque and transparent areas. The transparent portions of pockets 66 may allow light emitted from one or more devices 28 to pass through fabric 12, and / or may allow external light to reach (and be detected by) one or more devices 28.

[0103] The insertion tool 54 may include one or more components for mounting the electronic component 26 in the fabric 12. For example, the insertion tool 54 may include an electronically controlled actuator for adjusting the release of the component 26 from the insertion tool 54 (e.g., when the component 26 is in the pocket 66), and may include sensors for monitoring the position of the strands 20 and / or 22, sensors for monitoring the position of the component 26, sensors for measuring temperature, sensors for measuring resistance, or other devices for acquiring input and / or data in the environment surrounding the insertion tool 54.

[0104] Figure 12 This is a cross-sectional side view of fabric 12, showing how component 26 can be installed in pocket 66 of fabric 12. Figure 12 As shown, pocket 66 may be formed by the gap between fabric portions 12-1 and 12-2. Component 26 may be located in pocket 66 and may be attached to conductive strands 80C within pocket 66. Encapsulant material 260 (e.g., thermoplastic, epoxy, polyamide, polyurethane, silicone, other suitable materials, or any combination of two or more of these materials) may encapsulate the solder joint between component 26 and conductive strands 80C. Encapsulant material 260 may be used to cover solder joints in each recess 50 by melting (e.g., as a bonding agent). Figure 26 and Figure 27 The protective structure 130 (as described) Figure 8 Part of the encapsulant material 260 may be dispensed into each recess 50 (e.g., as in combination). Figure 31 The encapsulant material 260 may be a separate encapsulant material. In some arrangements, the encapsulant material 260 may be formed of a dual-phase solder material (e.g., a solder material that releases encapsulant material during the soldering process). If desired, the component 26 may include both encapsulant dispensed in the recess 50 (e.g., on the upper and / or lower side of the component 26) and thermoplastic material that helps to secure the component 26 to the fabric 12 by melting (e.g., on the upper and / or lower side of the component 26).

[0105] The warp yarn 20 and weft yarn 22 may overlap with the opposing upper and lower surfaces of the component 26 in the pocket 66. If desired, the fabric portions 12-1 and 12-2 may contain a ratio of [missing information - likely a specific material or material]. Figure 12 The numbers 20 and 22 are shown as having more or fewer stock lines. Figure 12 The examples are merely illustrative. In some arrangements, the gap between the first fabric portion 12-1 and the second fabric portion 12-2 can be maintained in place after the electronic component 26 is surrounded by the fabric 12 (e.g., a space may exist between fabric portions 12-1 and 12-2 after the fabric 12 is formed, such as...). Figure 12(As shown in the example). In other arrangements, after the electronic component 26 is surrounded in the gap, the first fabric portion 12-1 and the second fabric portion 12-2 can be pulled together so that the gap 66 is eliminated (e.g., after the fabric 12 is formed, the fabric portions 12-1 and 12-2 can contact each other without an intervening gap). The fabric 12 may have a protrusion where the electronic component 26 is located (e.g., ...). Figure 12 (as shown in the example), or the fabric 12 may not have the protrusion where the electronic component 26 is located (e.g., if desired, the fabric may have a substantially uniform thickness across the location where the electronic component 26 is located and the location where the electronic component 26 is not located).

[0106] Component 26 is inserted into the fabric Figure 11 and Figure 12 The example is for illustrative purposes only. If needed, part 26 can be inserted into fabric knitted using a knitting machine. Figure 13 An exemplary knitting system for knitted fabric 12 is shown in the figure.

[0107] like Figure 13 As shown, the interlacing apparatus 120 for knitting arrangements may include a yarn source, such as a yarn source 182. The yarn source 182 may include a yarn frame with spools of yarn 80. A knitting element 184 may be used to knit the yarn 80 into a knitted fabric 12. The knitted fabric 12 may be gathered on a drum or other pulling device 56. If desired, the pulling device 56 may have [specific features related to...]. Figure 11 The traction device consists of 56 similar independently controlled rollers.

[0108] Knitting element 184 may include a yarn guiding structure, such as a feeder 188, that guides the yarn 80 toward the needle and other devices 190. Device 190 may include a latch needle or other type of needle. In some arrangements, device 190 may include multiple needle beds, such as a front needle bed and a rear needle bed. Device 190 may include a yarn positioning structure that moves the yarn 80 from one needle bed to another. Device 190 may also include hooks or other cam structures and other structures for manipulating the position of the needle. The needle, feeder, and other knitting elements 184 may be implemented as individually adjustable components, or the functions of two or more of these tools may be combined in device 184.

[0109] In some arrangements, Figure 13 The interlacing device 120 can be used to form Figure 14 The type of weft-knitted fabric shown is 12. For example... Figure 14 As shown, the weft-knitted fabric 12 can be formed from weft-ply yarns 22, which form loops extending across the width of the fabric. These loops can interweave to form the weft-knitted fabric 12. Conductive ply yarns 80C can be bonded to... Figure 14 In the weft-knitted fabric 12.

[0110] In some arrangements, Figure 13 The interlacing device 120 can be used to form Figure 15 The type of warp-knitted fabric 12 shown. In the warp-knitted fabric, warp yarns 20 form interlaced loops along the length of the fabric. These loops interweave to form the warp-knitted fabric 12. Conductive yarns 80C can be bonded to... Figure 15 In the warp-knitted fabric 12.

[0111] Figure 16 This illustrates how component 26 can be mounted to conductive strand 80C during the knitting process. Figure 13 The interlacing device 120 can be used to form a gap 66 between the first fabric portion 12-1 and the second fabric portion 12-2. Fabric portions 12-1 and 12-2 can be different parts of a single knitted layer, or fabric portions 12-1 and 12-2 can be located within a separate knitted layer. Figure 16 In the illustration, fabric sections 12-1 and 12-2 each use a single set of loops (e.g., along...). Figure 14 The cross-section of the loop extending from line 160 is indicated. However, it should be understood that fabric portions 12-1 and 12-2 may be formed by multiple loops or columns interwoven together. Figure 14 The type of weft knitted fabric shown or Figure 15 The type of warp-knitted fabric shown. For example, a first needle bed can be used for the loops of interlacing fabric portion 12-1, and a second needle bed can be used for the loops of interlacing fabric portion 12-2. If desired, a gap 66 can be located between these two needle beds.

[0112] like Figure 16 As shown, one or more conductive strands (such as conductive strand 80C) are located in the gap 66. An insertion tool 54 can be used to insert the component 26 into the gap 66 and onto the conductive strand 80C. The insertion tool 54 aligns the groove 50 on the component 26 with the conductive strand 80C.

[0113] If needed, strand processing equipment (such as...) Figure 11 Insulator removal tool 70 and heating tool 64 can be used to process strands 80 during the knitting process. For example, insulation removal tool 70 can be used to remove insulation from the outside of insulated conductive strands 80C during the knitting process. Heating tool 64 can be used to melt solder and / or melt encapsulant material on component 26 during the knitting process. For example, solder 82 ( Figure 8 The flow recirculates at contact point 40, thereby soldering component 26 to conductive strand 80C. A heating tool 64 can also be used to melt encapsulant material (such as protective structure 130). Figure 8 The package is designed to form a robust mechanical connection and provide electrical connections around it.

[0114] Figure 17 The perspective view of the illustrative insertion tool 54 is shown below. This insertion tool can be used when... Figure 13 When the interlacing device 120 knits the fabric 12, the component 26 is inserted into the gap 66 of the fabric 12. If desired, the insertion tool 54 may include a vertically extending body with an elongated shape, such that the insertion tool 54 allows the component 26 to slide into... Figure 16 In the gap 66.

[0115] The groove 50 is located on the upper surface of the component 26 so that the component 26 can be inserted into the gap 66 from below the conductive strand 80C. Figure 16 The example is merely illustrative. If needed, the groove 50 may be located in the lower surface of component 26 so that component 26 can be inserted from above the conductive strand 80C, as shown below. Figure 18 As shown in the example.

[0116] Figure 19 This illustration shows how component 26 can be inserted into the woven fabric during its formation. (See diagram for reference.) Figure 19 As shown, the interlacing device 120 in the braiding arrangement may include guide rods 196 for braiding the strands 80. Conductive strands 80C can be incorporated into the braid 12. For the braiding structure of the fabric 12, component 26 may have a first groove 50 in its upper surface and a second groove 50 in its lower surface. If desired, the grooves 50 may be oriented in different directions to receive strands 80C oriented in different directions in the fabric 12. For example, the upper and lower grooves 50 may be perpendicular to each other, oriented at 45 degrees relative to each other, oriented at 30 degrees relative to each other, or oriented at any other suitable angle relative to each other.

[0117] Figure 20 This is a cross-sectional side view of an exemplary conductive strand 80C that can be used in fabric 12. (See attached image.) Figure 20 As shown, the conductive strand 80 may have a conductive core 88 surrounded by an insulating coating 90. In Figure 11 In the arrangement of the tool 70 as a laser, the tool 70 can emit light 86 (e.g., ultraviolet, visible, and / or infrared light). The light 86 may, for example, have a wavelength that is absorbed by the insulating coating 90 but not by the conductive core 88. The light 86 can be emitted continuously (e.g., using a continuous-wave laser) or can be emitted in pulses (e.g., to perform a laser ablation operation). The tool 70 can emit light with a wavelength of 10... -15 -10 -12 seconds, 10 -15 -10 -9Laser pulses of duration ranging from one second to one picosecond, shorter than one picosecond, longer than one nanosecond, shorter than one nanosecond, between one femtosecond and one millisecond, or other suitable durations. Short pulses can have high energy density and are suitable for ablating (vaporizing) polymers and other materials without melting nearby structures. Short pulses, longer-duration pulses, and / or continuous-wave beams can be used to soften and / or melt polymers and other materials.

[0118] A computer-controlled positioner can be used to adjust the position of the laser 70, thereby adjusting the position of the laser beam 86 relative to the strand 80C. If needed, auxiliary beam-directing structures (such as an adjustable mirror 92) can be used to adjust the position of the laser beam 86. Figure 20 As shown, some lasers 86 can be directly aimed at the strand 80C to remove a portion of the insulating coating 90, while other lasers 86 can be aimed at the reflector 92 to remove another portion of the insulating coating 90. This ensures that all or almost all of the insulating coating 90 around the circumference of the conductive strand 80C is removed from the desired portion. However, this is only illustrative. If necessary, the strand 80C can be rotated during the laser ablation operation to ensure that the insulating coating 90 is removed from the desired portion of the conductive strand 80C.

[0119] Once the insulating coating 90 has been removed from the desired portion of strand 80C, the conductive core 88 can be exposed, such as Figure 21 As shown. If necessary, the insulating coating 90 can be removed from only a portion of the strand 80C, while the insulating coating 90 remains on the rest of the strand 80C, as shown. Figure 22 As shown. This creates an exposed conductive section 84 on strand 80C, while the rest of strand 80C remains insulated.

[0120] Figure 23 This is a perspective view of an illustrative insertion tool 54. The insertion tool 54 may be formed of an insulating material (e.g., ceramic, plastic, or other suitable insulating material) so that it will not be heated during induction heating operation. In other arrangements, the insertion tool 54 may function as a heating tool itself and may include a heating element that generates heat or a metallic element (such as a metal coil) that is heated during induction heating operation. If desired, the tool 54 may be compatible with interchangeable tool heads. For example, different insertion tool heads may be attached to the tool 54 (e.g., for parts 26 of different types, sizes, shapes, quantities, etc.), and / or heads that perform other functions (e.g., heating tool heads, machining tool heads, cutting tool heads, laser tool heads, heads containing mirrors (such as those used with laser 70)). Figure 20 The head of the reflector 92, etc., can be attached to the end of the tool 54.

[0121] like Figure 23As shown, the insertion tool 54 may include an end portion 94 for retaining the component 26 when it is inserted into the fabric 12 during weaving operations. If desired, a pick-and-place tool may be used to place one or more components 26 onto the end portion 94 of the tool 54. A releasable engagement structure, such as engagement structure 96, may hold the component 26 in place until it is desired to release the component 26 from the insertion tool 54. Engagement structure 96 may be a friction tab that folds inward and outward to hold and release the component 26. However, this is merely illustrative. Other suitable engagement structures may be used to hold the component 26 in place on the tool 54 and to release the component 26 from the tool 54 if desired.

[0122] Figure 24 This is a perspective view of the insertion tool 54 used to insert component 26 into fabric 12. Figure 24 As shown, when the insertion tool 54 moves to the shed 124 ( Figure 11 When in the pocket 66, the insertion tool 54 holds the component 26 on its upper surface. Once in the shed 124, the insertion tool 54 aligns the component 26 with the conductive strand 80C. Specifically, the insertion tool 54 aligns the conductive strand 80C with the groove 50 in the component 26. If necessary, the conductive strand 80C may initially be positioned suspended within the groove 50 to avoid contact with the solder paste 82 in the groove 50 until the component 26 is in the pocket 66. This positioning can be achieved by raising the conductive strand 80C (e.g., together with the heddle 46) and / or by using the insertion tool 54 to maintain a small gap between the solder 82 and the strand 80C until the component 26 has reached the proper position in the pocket 66.

[0123] Once the conductive strand 80C is aligned with the groove 50 in component 26, the insertion tool 54 moves component 26 in direction 98 while sliding component 26 along strand 80C until component 26 reaches the appropriate position in pocket 66. Specifically, the insertion tool 54 may continue in direction 98 until the pad 40 on component 26 is properly aligned with the exposed conductive section 84 of strand 80C, such as... Figure 25 As shown.

[0124] Once component 26 has reached the appropriate position in pocket 66, heating tool 64 can be used to reflow solder 82 and, if necessary, melt the protective structure 130 on component 26. Figure 25 As shown, the induction heating tool 64 can locally heat the solder 82 and / or the protective structure 130. Figure 8 This causes the solder 82 to reflow and melt the protective structure 130. This creates a robust electrical and mechanical connection between component 26 and strand 80C.

[0125] Figure 26A cross-sectional side view of fabric 12 shows how the insertion tool 54 can hold component 26 in pocket 66 during heating operation. Interlacing device 120 (e.g., Figure 11 weaving equipment, Figure 13 Knitting equipment, Figure 19 A weaving device or other suitable interlacing device can form pockets 66 by creating spaces between two or more sections of fabric 12 (e.g., between upper fabric section 12-1 and lower fabric section 12-2). Pockets 66 help orient the component 26 so that the solder pad 40 (and the solder 82 on the pad 40) is aligned with the corresponding conductive strands 80C. During operation of article 10, the conductive strands 80C can transmit signals between component 26 and other circuits in article 10.

[0126] like Figure 26 As shown, the protective structure 130 may comprise different materials, such as material 130A and material 130B. The groove 50 may extend through both material 130A and material 130B. If desired, material 130B may be formed of a thermoplastic with a melting temperature higher than that of material 130A, such that only material 130A melts during the heating operation. After heating using tool 64, solder 82 may be reflowed to form a mechanical and electrical connection between conductive strand 80C and component 26. Material 130A may cover the upper portion of strand 80C. After reflowing solder 82 and melting material 130A, insertion tool 54 may release component 26 and remove it from pocket 66. However, this is merely illustrative. If desired, encapsulant materials (such as protective structure 130) may be omitted, or may be melted using different tools and / or during different steps (e.g., before or after the solder reflow operation).

[0127] like Figure 27 As shown, material 130A can fill the gaps around strand 80C and within groove 50, thereby forming a robust mechanical connection, while also forming an encapsulation layer that protects the electrical connection from moisture and other contaminants.

[0128] exist Figure 27 In the example, pocket 66 is shown as a gap separating fabric portions 12-1 and 12-2. However, this is merely illustrative. If needed, after inserting the electronic component 26, the first fabric portion 12-1 and the second fabric portion 12-2 can be pulled together, thus eliminating the gap 66. Fabric 12 may have a protrusion where the electronic component 26 is located, or fabric 12 may not have a protrusion where the electronic component 26 is located (e.g., the fabric may have a substantially uniform thickness across the location with and without the electronic component 26, such as...). Figure 27 (as shown in the example).

[0129] Figure 28The illustration shows an exemplary operation involving the insertion of electronic components into the fabric during fabric formation. Figure 28 The steps for inserting electronic components into the fabric are shown as an illustrative example. However, it should be understood that similar methods, steps, and operations can be used to insert electronic components into knitted, woven, or other suitable fabrics during fabric formation.

[0130] During the operation of step 100, the control circuit 42 can position the heddle 46 to prepare for insulation removal by isolating a set of desired conductive strands 80C (e.g., wires) from other warp strands 20. The conductive strands 80C can be separated from other warp strands 20 by creating slits 124 above and below the strands 80C or by creating a single slit 124 below or above the strands 80C.

[0131] At step 102, the insulation can be removed from the appropriate portion of the conductive strand 80C using an insulation removal tool 70. This may include, for example, removing the reflector 92 ( Figure 20 The laser 70 is positioned relative to the strand 80C and the laser ablates the coating 90 to expose the conductive core 88 along the conductive section 84. The control circuit 42 can determine from which pick-up number the insulation removal operation begins based on the strand consumption in the fabric structure.

[0132] At step 104, control circuitry 42 may continue weaving and may begin forming one or more pockets 66 in fabric 12. This may include, for example, creating a gap between an upper fabric layer and a lower fabric layer. Control circuitry 42 may synchronize the timing of pocket 66 formation with respect to the position of conductive segment 84, such that conductive segment 84 is properly received within pocket 66 during pocket 66 formation.

[0133] At step 106, control circuitry 42 may reposition one or more components in device 120 in preparation for component insertion. This may include, for example, repositioning clamping lever 62. Clamping lever 62 as a whole may be raised away from fabric 12, or one or more individual portions 150 of clamping lever 62 may be raised to prepare for access to electronic component 26. Other components of device 120 may be repositioned if necessary (e.g., weft insertion and positioning device 68, reed 52, and / or other components in component 120 may be removed to prepare for component insertion).

[0134] At step 108, the insertion tool 54 can be used to insert component 26 into pocket 66. During the insertion operation in step 108, one or more components of the interlacing device can be repositioned or paused, or the interlacing device can continue interlacing without any change. Control circuitry 42 can position heddle 46 to isolate conductive strand 80C from other warp strands 20 in preparation for insulation removal. A first shed 124 can be created above strand 80C and a second shed 124 can be created below strand 80C, or a single shed 124 can be located below or above strand 80C. The position of the shed into which component 26 is inserted can be based on which side of component 26 will be attached to conductive strand 80C. If the upper surface of component 26 is to be attached to strand 80C, component 26 can be inserted into the shed 124 below strand 80C (e.g., as shown in the image). Figure 11 (As shown). If the lower surface of component 26 is to be attached to strand 80C, component 26 can be inserted into the shed 124 above strand 80C.

[0135] Insertion tool 54 can be moved into chute 124 and align conductive strand 80C with groove 50 in component 26. Insertion tool 54 then allows component 26 to slide along strand 80C into pocket 66 until conductive section 84 is positioned above solder 82 in groove 50. Control circuitry 42 can determine when to stop moving insertion tool 54 based on the amount of time elapsed since laser ablation of strand 80C.

[0136] At step 110, a heating tool (such as induction heating tool 64) may be used to induction heat and reflow the solder 82. If desired, the heating tool 64 may also be used to heat the protective structure 130 (e.g., portion 130A of the protective cap 130) to melt part or all of the protective structure 130. The solder reflow operation and the encapsulant material melting operation may be performed simultaneously or may be performed during separate steps. If desired, other heating techniques (e.g., hot air, conduction, heat from a lamp, or other energy) may be used to melt the solder and / or encapsulant material. The use of induction heating is illustrative only. If desired, the insertion tool 54 and / or the strand 80C may be vibrated during heating to enhance solder reflow and form a robust mechanical and electrical connection between the component 26 and the strand 80C.

[0137] At step 112, the insertion tool 54 releases the component 26 (e.g., by making...). Figure 23 The splice 96 is bent away from the part 26 and the insertion tool 54 is removed from the pocket 66.

[0138] At step 114, control circuitry 42 can resynchronize the components in device 120 (e.g., by adjusting the position, speed, tension control, or other characteristics of components such as warp yarn positioning devices, weft yarn positioning devices, component insertion devices, reeds, warp tensioning devices, pressure bars, pulling devices, insulation removal devices, and heating devices) and can resume weaving operations. This may include, for example, closing pocket 66 so that component 26 is completely enclosed within pocket 66 and lowering pressure bar 62 to its normal position.

[0139] In some scenarios, it may be desirable to perform certain processing operations with visual accessibility to component 26. For example, alignment of component 26 with conductive strand 80C (e.g., conductive segment 84 of strand 80C), soldering, encapsulation, electrical connection verification, and / or other processing operations may be performed when the electronic component is exposed or partially exposed to the outside of the fabric.

[0140] Figures 29 to 34 Exemplary apparatus and steps involving processing outside the pocket are shown, wherein insulation removal, alignment, soldering and encapsulation operations are performed before the component is inserted into the pocket, thereby allowing visual and physical accessibility to the electronic component during these processing operations.

[0141] like Figure 29 As shown, interleaving equipment (e.g., Figure 4 and / or Figure 11 The apparatus 120 can be used to produce fabric 12 and create pockets 66 in fabric 12. Pockets 66 may initially have an open side facing the shed 124. Fabric 12 may include one or more conductive strands 80C. The conductive strands 80C may be loose in pockets 66 (e.g., not bonded to or interwoven with fabric portions 12-1 or 12-2), or the conductive strands 80C may be interwoven with the upper portions 12-1 and / or the lower portions 12-2 of fabric 12 in pockets 66. Figure 29 In the example, strand 80C is incorporated into the lower fabric portion 12-2.

[0142] During the weaving operation, a warp strand positioning device can be used to position the warp strands 20 to create a shed 124 between upper warp strands 20A and lower warp strands 20B. The warp strand positioning device can also position conductive strands 80C, not yet bonded to the fabric 12, between the upper warp strands 20A and lower warp strands 20B. Strands 80C may include sections 84 for attaching members 26. Section 84 may be a section from which insulation has been removed (e.g., using a laser ablation tool to ablate the insulation and / or using a solder head that melts away the insulation) exposing the conductive portion of strand 80C, or section 84 may be an insulating section from which the outer insulation has not yet been removed.

[0143] Because segment 84 is outside pocket 66 when attachment part 26 is attached, insertion tool 54 can have better accessibility for aligning part 26 with segment 84. Insertion tool 54 can hold part 26 and align part 26 with segment 84 of conductive strand 80C while the warp positioning device positions conductive strand 80C between upper warp strand 20A and lower warp strand 20B. This may include, for example, aligning one or more grooves 50 on part 26 with segment 84 of strand 80C. An extension tool (such as extension tool 202) can be used to extend upper warp strand 20A, creating an opening in the upper portion of shed 124 through which processing equipment can access part 26. If desired, tool 202 can be used to extend lower warp strand 20B to create an opening in the lower portion of shed 124 (thus providing accessibility to part 26 from below). The arrangement of tool 202 in creating an opening in the upper shed warp strand 20A is sometimes described herein as an illustrative example.

[0144] Figure 30 The top view of fabric 12 shows how the stretching tool 202 can create openings, such as opening 206, in the upper shed warp strands 20A of the first and second groups. The stretching tool 202 may have a first portion (such as portion 202A) holding the first group of warp strands 20A to one side and a second portion (such as portion 202B) holding the second group of warp strands 20A to the other side. The stretching tool 202 may be formed of metal, plastic, or other suitable material and may include forks and / or hooks that can pull the strands apart in fabric 12. If desired, the stretching tool 202 may be part of the reed 52 or may be a separate component from the reed 52. The stretching tool 202 may be manually controlled by an equipment operator and / or controlled by a computer-controlled positioning device. Opening 206 exposes component 26 to the outside of fabric 12. This allows visual accessibility to component 26 through opening 206 (e.g., for equipment operators, cameras, and / or computer-controlled positioning devices). If necessary, tools (such as combs, clamps and / or a portion of clamping rods 62) can be used to hold portions of the fabric 12 in place when forming the opening 206 in the shed 124, thereby minimizing defects in the fabric 12.

[0145] In an arrangement where the insulation has been removed from section 84, the insertion tool 54 aligns component 26 with the exposed conductive section 84. In an arrangement where the insulation has not yet been removed from section 84, the insertion tool 54 aligns component 26 with the area of ​​the strand 80C where the insulation will be removed.

[0146] Once the insertion tool 54 has properly aligned the component 26 with the strand 80C (e.g., once the segment 84 is received within the recess 50 of the component 26) and / or once the stretching tool 202 has created the opening 206, additional processing steps can be performed before inserting the component 26 into the pocket 66. Figure 31 As shown, device 212 can be used to access component 26 through opening 206 in the upper shed strand 20A. Opening 206 provides visual accessibility of component 26 to observers such as observer 208 observing component 26 in direction 210 (or to a camera observing component 26 in direction 210).

[0147] The apparatus 212 may include insulation removal equipment (e.g., a solder head or other heating tool that melts the insulation, a laser ablation device that erodes the insulation, or other equipment for removing the outer insulation layer from the strand 80C), electrical connection equipment (e.g., a soldering tool for dispensing and / or heating solder, a conductive adhesive application device, etc.), encapsulation tools for dispensing the package, and / or may include other tools for processing the component 26 before inserting it into the pocket 66. If desired, the same heat application tool may be used for both insulation removal and soldering (e.g., in the same processing step or in a separate processing step).

[0148] exist Figure 31 In the example, device 212 includes a solder head 216 and a packaging material dispensing head 214. When the stretching tool 202 opens the radial strands 20A, the solder head 216 can reach the component 26 through the opening 206 and can heat the solder previously applied to the component 26 (or, if desired, simultaneously apply and heat solder to the component 26). This may include, for example, allowing the solder 82 in the groove 50 ( Figure 8 The flow is recirculated to create an electrical connection between the strand 80C and component 26. After the soldering operation, the encapsulant dispensing head 214 can reach component 26 through opening 206 and can dispense encapsulant material (e.g., Figure 12 The encapsulation material 260) is applied to the electrical connection between the strand 80C and the component 26. If necessary, additional processing operations can be performed on the component 26 when the stretching tool 202 opens the upper radial strand 20A. For example, if necessary, the integrity of the electrical connection between the component 26 and the strand 80C can be verified visually and / or using a measuring device that allows access to the component 26 through the opening 206.

[0149] Once the desired processing operations (such as alignment, soldering, encapsulation, and / or electrical connection verification) are completed, the stretching tool 202 can be removed, and the insertion tool 54 can be moved in direction 218 to insert the component 26 into the pocket 66. Since the component 26 is now attached to the strands 80C, the strands 80C can move into the pocket 66 along with the component 26. Therefore, when the component 26 is inserted into the pocket 66, some of the strands 80C can loop back onto themselves.

[0150] Figure 32 This illustrates how a retaining tool (such as a component retaining tool 220) can hold component 26 in pocket 66 before the insertion tool 54 releases component 26. Figure 32 In one example, the component holding tool 220 may have one or more prongs that extend through the fabric 12 (e.g., through the space between adjacent strands in the fabric 12) to hold the component 26 in the pocket 66. Once the component 26 is held by the component holding tool 220, the insertion tool 54 can release the component 26 and exit the shed 124 in the direction 222. In other arrangements, the component holding tool 220 may be a tool for holding the component 26 in place by applying external pressure to the fabric 12. For example, a clamping bar 62 may be used to apply external pressure and thus act as a component holding tool, or a separate tool (e.g., traveling with the clamping bar 62 if desired) may be used to apply external pressure to the fabric 12 to hold the component 26 in the pocket 66.

[0151] Figure 33 This illustrates how the component holding structure 220 can be held in place after the insertion tool 54 is removed, so that the component 26 remains within the pocket 66 while the weaving operation continues and the pocket 66 is closed. The component holding tool 220 can be removed when the pocket 66 is closed and the component 26 is held within the fabric pocket 66.

[0152] Figure 34 In order to combine Figures 29 to 33 A cross-sectional side view of component 26 in fabric 12 after the aforementioned processing steps. (See attached image.) Figure 34As shown, because component 26 is attached to the strands 80C outside pocket 66 and then component 26 is inserted into pocket 66, some conductive strands 80C can overlap themselves within pocket 66. If necessary, additional processing steps can be performed after component 26 is inserted into pocket 66 to prevent loose portions of the strands 80C from tangling within pocket 66. For example, encapsulant material 280 (e.g., thermoplastic) on one or more sides of component 26 (e.g., the bottom side of component 26 facing the loose portions of strands 80C) can be heated (e.g., using induction heating technology or other heat application devices). The molten encapsulant 280 can trap the loose portions of strands 80C in pocket 66 and can secure the bottom of component 26 to the other strands in pocket 66 of fabric 12.

[0153] Figure 35 Another illustrative example is shown, in which some processing operations associated with attaching component 26 to fabric 12 during fabric 12 formation are performed, provided that component 26 is visually accessible. Figure 35 In the example, component 26 is inserted into pocket 66 and electrically connected to strand 80C while in pocket 66. For visual accessibility, the electrical contact point 40 of component 26 may be located on the edge portion of component 26 exposed along the open side of pocket 66. Component 26 may have a T-shape with a first and a second protruding arm. A recess 50 may be located in the protruding arm of component 26. This T-shape ensures that the conductive strand 80C only needs to extend upwards over the protruding portion of component 26, rather than extending upwards over the entire length of component 26. However, this is merely illustrative. Component 26 may have other suitable shapes if desired.

[0154] When component 26 is in pocket 66 and strand 80C is in groove 50, a tool such as hot press welding tool 224 can be used to apply solder 82 ( Figure 8 The solder flows back onto the exposed contact point 40 at the edge of pocket 66. A rod 226 can be used to keep the radial strands (including strands 80C) away from part 26 so that the thermocompressor 224 can easily access part 26 without obstruction by strands 80C. If desired, the thermocompressor 224 may have elongated fork elements that engage within grooves 50 to facilitate solder backflow within the grooves 50. After the soldering operation, additional processing operations such as encapsulation and / or electrical connection verification operations can be performed while the edge of part 26 remains exposed at the edge of pocket 66. When the desired processing operations are completed, interleaving can continue and pocket 66 can be closed.

[0155] Figure 36 A top view providing another illustrative example of how the processing device can access component 26. Figure 36In the example, fabric opening tool 228 is used to create an opening 230 in fabric 12 by pulling apart the strands of fabric 12. The opening 230 provides access to component 26 in pocket 66. Processing devices such as insulation removal devices, electrical connection (e.g., welding) devices, encapsulation devices, electrical connection verification devices, and / or other devices can access component 26 in pocket 66 via the opening 230. When the desired processing operation is completed, tool 228 can be removed and opening 230 can be closed. If necessary, additional weaving operations can be performed after tool 228 is removed (e.g., device 120 can continue weaving).

[0156] exist Figure 37 In the example, the fabric loosening tool 240 is used to keep a portion of the fabric 12 loose during the interlacing operation. The tool 240 may have a tubular shape and may be arranged to align with the component 26 in the pocket 66. During the interlacing operation, strands of the upper fabric portion 12-1 may be interlaced around the tool 240, thereby creating a gap 250 in the upper fabric 12-1 aligned with the component 26. An observer, such as observer 232 observing the fabric 12 in direction 234 (or a camera observing the fabric 12 in direction 234), may be able to see the component 26 through the opening 250. When the tool 240 is in place, processing equipment such as insulation removal equipment, electrical connection (e.g., welding) equipment, encapsulation equipment, electrical connection verification equipment, and / or other equipment may access the component 26 in the pocket 66 via the opening 250 created by the tool 240. For example, laser 238 can emit laser 242 toward mirror 236, which in turn allows laser 242 to pass through opening 250 and be reflected toward solder 82 on component 26. Heat from laser 242 can cause solder 82 to flow back, thereby electrically coupling component 26 to fabric 12. When the desired processing operation is complete, tool 240 can be removed and the opening in fabric 12 can be closed. If necessary, additional weaving operations can be performed after tool 240 removal (e.g., device 120 can continue weaving).

[0157] Figure 38 A side view illustrating another illustrative example of using an endoscope to obtain visual accessibility to component 26 in pocket 66. (See also...) Figure 38As shown, the insertion tool 54 inserts component 26 into pocket 66. While the insertion tool 54 holds component 26 in pocket 66, optical devices (such as endoscope 244) can also be inserted into pocket 66. Endoscope 244 may have an optical fiber for acquiring endoscopic image data of component 26. An operator- and / or computer-controlled positioning device can receive the endoscopic image data, which can then be used during alignment operations, insulation removal operations, soldering operations, encapsulation operations, and / or other processing operations. If desired, endoscope 244 may be a laser endoscope, which can apply a laser to cause solder to flow back onto component 26 while also acquiring endoscopic images of component 26. When the desired processing operation is completed, endoscope 244 and insertion tool 54 can be removed, and the interleaving operation can continue to close pocket 66.

[0158] As described above, one aspect of this technology is the collection and use of data from specific and lawful sources. This disclosure envisions that, in some instances, the collected data may include personal information data that uniquely identifies or can be used to identify a specific person. Such personal information data may include demographic data, location-based data, online identifiers, telephone numbers, email addresses, home addresses, data or records related to a user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other personal information.

[0159] This disclosure recognizes that the use of such personal information data in the techniques of this invention can benefit users. For example, personal information data can be used to deliver targeted content that a user may be interested in based on their preferences. Therefore, the use of such personal information data enables users to have greater control over the content delivered. Furthermore, this disclosure also anticipates other uses of personal information data that are beneficial to users. For example, health and fitness data can be used according to user preferences to provide insights into their overall health status, or it can be used as positive feedback to individuals using the technology to pursue health goals.

[0160] This disclosure assumes that entities responsible for collecting, analyzing, disclosing, transmitting, storing, or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, it is expected that such entities will implement and consistently apply privacy practices generally recognized as meeting or exceeding industry or governmental requirements for protecting user privacy. Such information regarding the use of personal data should be highlighted and easily accessible to users, and should be updated as the collection and / or use of data changes. Users' personal information should be collected only for lawful use. Furthermore, such collection / sharing should only occur after receiving user consent or other lawful grounds provided for in applicable law. In addition, such entities should consider taking any necessary steps to protect and safeguard access to such personal information data and ensure that others with access to personal information data comply with their privacy policies and processes. Additionally, such entities may be subject to third-party assessments to demonstrate their compliance with widely accepted privacy policies and practices. Furthermore, policies and practices should be tailored to the specific types of personal information data collected and / or accessed, and made applicable to applicable laws and standards, including jurisdiction-specific considerations that may be used to impose higher standards. For example, in the United States, the collection or access to certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA); while health data in other countries may be subject to other regulations and policies and should be handled accordingly.

[0161] Regardless of the foregoing, this disclosure also envisions implementation schemes for users to selectively prevent the use or access to personal information data. That is, this disclosure anticipates providing hardware and / or software components to prevent or block access to such personal information data. For example, in the case of advertising delivery services, the inventive technology can be configured to allow users to opt-in or opt-out at any time during or after service registration to participate in the collection of personal information data. In another example, users can choose not to provide emotion-related data for a targeted content delivery service. Furthermore, users can choose to limit the duration for which emotion-related data is retained, or completely prevent the development of underlying emotional states. In addition to providing "opt-in" and "opt-out" options, this disclosure envisions providing notifications related to access to or use of personal information. For example, users can be notified when downloading an application that their personal information data will be accessed, and then reminded again just before the application accesses the personal information data.

[0162] Furthermore, the purpose of this disclosure is to manage and process personal information data to minimize the risk of unintentional or unauthorized access or use. Once data is no longer needed, this risk can be minimized by limiting data collection and deleting data. Additionally, and where applicable, including in certain health-related applications, data deidentification can be used to protect user privacy. Deidentification can be facilitated, where appropriate, by removing identifiers, controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than the address level), controlling how data is stored (e.g., aggregating data among users), and / or other methods such as differentiated privacy.

[0163] Therefore, while this disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, it is also contemplated that various embodiments can be implemented without access to such personal information data. That is, various embodiments of the present invention will not be rendered inoperable due to the absence of all or part of such personal information data. For example, content can be selected and delivered to the user based on aggregated non-personal information data or an absolute minimum amount of personal information, such as content processed only on the user's device or other non-personal information that can be used for content delivery services.

[0164] According to a first embodiment, an apparatus for forming a fabric having at least one conductive strand includes an interlacing device that interlacs a first strand and a second strand to form the fabric; a control circuit that controls the interlacing device to create a gap between the first strand and the second strand; and an insertion tool that positions an electronic component in the gap and on the at least one conductive strand, wherein the control circuit controls the interlacing device to continue interlacing the first strand and the second strand after the insertion tool has positioned the electronic component in the gap and on the at least one conductive strand.

[0165] According to the first embodiment, the fabric includes a knitted fabric and the interlacing device includes a knitting device that knits a first strand and a second strand to form the knitted fabric.

[0166] According to the first embodiment, the fabric includes a woven fabric and the interlacing device includes a weaving device that weaves a first strand and a second strand to form the woven fabric.

[0167] According to the first embodiment, the first strand includes a first warp strand, the second strand includes a second warp strand, and the weaving equipment includes a warp strand positioning device that positions the first and second warp strands to create a shed; and a weft strand positioning device that inserts the weft strand into the shed.

[0168] According to the first embodiment, the device includes a support structure on which a portion of a fabric is rested, wherein the support structure includes a dielectric material.

[0169] According to a first embodiment, the device includes a clamping bar resting on a fabric, wherein a control circuit is configured to adjust the height of at least a portion of the clamping bar relative to the fabric to accommodate electronic components.

[0170] According to the first embodiment, the clamping rod has a separately controlled portion that can be independently adjusted to different heights.

[0171] According to a first embodiment, the device includes a reed through which warp strands pass, wherein the reed moves toward and away from the fabric, and wherein control circuitry is configured to temporarily pause the movement of the reed when an insertion tool positions electronic components in the gap.

[0172] According to the first embodiment, the equipment includes a traction device with multiple independently controlled rollers.

[0173] According to a first embodiment, the device includes a laser that ablates an insulating coating on the at least one conductive strand to expose a conductive section on the at least one conductive strand.

[0174] According to the first embodiment, the interlacing device includes a strand positioning device that positions the at least one conductive strand away from the first and second strands when the laser ablates the insulating coating on the at least one conductive strand.

[0175] According to a first embodiment, the device includes a pyrometer that monitors the temperature of the fabric as a laser ablates the insulating coating on the at least one conductive strand.

[0176] According to a first embodiment, the device includes a heating tool that causes solder to flow back onto electronic components to attach the electronic components to conductive sections.

[0177] According to the first embodiment, the heating tool includes an induction heating tool.

[0178] According to a second embodiment, the method for forming a fabric includes removing insulation from a first strand and a second strand to expose conductive sections; after removing insulation from the first strand and the second strand, interlacing the first strand and the second strand with other strands to create a cavity; using an insertion tool to position an electronic component in the cavity and soldering the electronic component to the conductive sections in the cavity; and after inserting the electronic component into the cavity, interlacing the first strand and the second strand with other strands.

[0179] According to the second implementation scheme, removing the insulation from the first and second strands includes using a laser to ablate the insulation.

[0180] According to the second embodiment, positioning the electronic component in the cavity includes aligning the first wire and the second wire with corresponding first and second grooves in the electronic component.

[0181] According to the second embodiment, positioning the electronic component in the cavity includes sliding the electronic component along the first and second lines until the first and second grooves are aligned with the conductive sections in the cavity.

[0182] According to the second embodiment, the electronic component includes an encapsulant material, and soldering the electronic component to a conductive section in the pocket includes using an induction heating tool to reflow solder onto the electronic component and melt the encapsulant material.

[0183] According to a third embodiment, the fabric article includes a first fabric portion and a second fabric portion; a first conductive strand and a second conductive strand passing between the first fabric portion and the second fabric portion; an electronic component inserted between the first fabric portion and the second fabric portion, wherein the electronic component includes a protective structure having a first groove and a second groove, and wherein the electronic component is coupled to the first conductive strand and the second conductive strand via a first solder connection in the first groove and a second solder connection in the second groove; and an encapsulating agent material that at least partially encapsulates the first solder connection and the second solder connection.

[0184] According to the third embodiment, the encapsulant material includes a thermoplastic material having a first melting temperature, and the protective structure includes an additional thermoplastic material having a second melting temperature higher than the first melting temperature.

[0185] According to the third embodiment, the first conductive strand and the second conductive strand each have a conductive core surrounded by an insulating coating, and a portion of the insulating coating has been removed to expose the conductive core on portions of the first and second conductive strands that pass through the first and second grooves.

[0186] According to one embodiment, an apparatus for forming a fabric having at least one conductive strand is provided. The apparatus includes an interlacing device that interlacs a first strand and a second strand to form the fabric; a control circuit that controls the interlacing device to create a gap between the first strand and the second strand; and an insertion tool that aligns an electronic component with the at least one conductive strand and positions the electronic component into the gap after it is electrically coupled to the at least one conductive strand. The control circuit controls the interlacing device to continue interlacing the first strand and the second strand after the insertion tool has positioned the electronic component in the gap.

[0187] According to another embodiment, the fabric includes a woven fabric and the interlacing device includes a weaving device that weaves a first strand and a second strand to form the woven fabric.

[0188] According to another embodiment, the first strand includes a first warp strand, the second strand includes a second warp strand, and the weaving equipment includes a warp strand positioning device that positions the first and second warp strands to create a shed; and a weft strand positioning device that inserts the weft strand into the shed.

[0189] According to another embodiment, the device includes a stretching tool that stretches some of the first warp strands to create an opening in the shed.

[0190] According to another embodiment, electronic components are electrically coupled to conductive sections via solder connections, and the device further includes a soldering tool that passes through an opening to contact the electronic components to create a solder connection between the electronic components and the at least one conductive strand.

[0191] According to another embodiment, the at least one conductive strand has an insulating coating, and a welding tool applies heat to remove the insulating coating from a section of the at least one conductive strand.

[0192] According to another embodiment, the device includes a packaging tool that passes through an opening to contact electronic components to encapsulate solder connections.

[0193] According to another embodiment, the insertion tool positions and releases the electronic component in the gap after the soldering tool creates a solder joint, and the device includes a component holding tool that holds the electronic component in the gap after the insertion tool releases the electronic component into the gap.

[0194] According to another embodiment, the control circuit controls the interlacing device to continue interlacing while closing the gap, and removes the component retaining tool from the fabric after closing the gap.

[0195] According to another embodiment, the electronic component has a groove, and the solder joint is located in the groove.

[0196] According to another embodiment, the device includes a clamping bar resting on the fabric, and control circuitry is configured to adjust the height of at least a portion of the clamping bar relative to the fabric to accommodate electronic components.

[0197] According to another embodiment, the clamping rod has a separately controlled portion that can be independently adjusted to different heights.

[0198] According to another embodiment, the device includes a reed through which a first warp strand and a second warp strand pass, the reed moving toward and away from the fabric, and a control circuit configured to temporarily pause the movement of the reed when an insertion tool positions electronic components in the gap.

[0199] According to another embodiment, the device includes a traction device with multiple independently controlled rollers.

[0200] According to one embodiment, a method for forming a fabric is provided, the method comprising: interlacing a first strand and a second strand with other strands; removing insulation from the first strand and the second strand to expose conductive sections; electrically connecting electronic components to the conductive sections of the first strand and the second strand; inserting the electronic components into a position between a first portion and a second portion of the fabric; and after inserting the electronic components into the position, interlacing the first strand and the second strand with other strands.

[0201] According to another embodiment, electrically connecting the electronic component to the conductive sections of the first and second strands includes soldering the electronic component to the first and second strands using a soldering tool.

[0202] According to another embodiment, removing insulation from the first and second strands includes removing insulation from the first and second strands using a welding tool.

[0203] According to another embodiment, soldering electronic components to a first wire and a second wire using a soldering tool includes soldering the first wire into a first groove in the electronic component and soldering the second wire into a second groove in the electronic component.

[0204] According to another embodiment, the method includes depositing encapsulant material in a first groove and a second groove before inserting an electronic component into the location.

[0205] According to another embodiment, the location includes a cavity, and the conductive section for electrically connecting the electronic component to the first and second wires includes the conductive section for electrically connecting the electronic component to the first and second wires after inserting the electronic component into the cavity.

[0206] According to one embodiment, a fabric article is provided, the fabric article comprising a first fabric portion and a second fabric portion; a first conductive strand and a second conductive strand having corresponding first conductive segments and second conductive segments; an electronic component inserted between the first fabric portion and the second fabric portion, the electronic component including a protective structure having a first groove and a second groove, and the electronic component being coupled to the first conductive segment and the second conductive segment via a first solder connection in the first groove and a second solder connection in the second groove; and an encapsulating agent material that at least partially encapsulates the first solder connection and the second solder connection.

[0207] According to another embodiment, the first and second conductive strands each have a conductive core surrounded by an insulating coating, and a portion of the insulating coating has been removed to expose the conductive core along the first and second conductive sections.

[0208] The foregoing description is merely illustrative, and various modifications can be made by those skilled in the art without departing from the scope and substance of the described embodiments. The aforementioned embodiments can be implemented independently or in any combination.

Claims

1. A textile article comprising: First fabric section and second fabric section; A first conductive strand and a second conductive strand having corresponding first conductive section and second conductive section; An electronic component inserted between a first fabric portion and a second fabric portion, wherein the electronic component includes a protective structure having a first groove and a second groove, and wherein the electronic component is coupled to a first conductive segment and a second conductive segment via a first solder connection in the first groove and a second solder connection in the second groove; as well as Encapsulating agent material that at least partially encapsulates the first solder joint and the second solder joint.

2. The fabric article of claim 1, wherein the first conductive strand and the second conductive strand each have a conductive core surrounded by an insulating coating, and wherein a portion of the insulating coating has been removed to expose the conductive core along the first conductive section and the second conductive section.

3. The fabric article of claim 1, wherein the first fabric portion and the second fabric portion comprise a first woven portion and a second woven portion surrounding the pocket, and wherein the electronic component is located in the pocket.

4. The fabric article of claim 3, wherein at least one of the first conductive strand and the second conductive strand has a section that overlaps with itself within the pocket.

5. The fabric article of claim 4, further comprising an additional encapsulating agent material for capturing the segment in the pocket.

6. The fabric article of claim 1, wherein the encapsulant material comprises the thermoplastic material within the first groove and the second groove.

7. The fabric article of claim 6, wherein the protective structure comprises an additional thermoplastic material having a higher melting temperature than the thermoplastic material.

8. The fabric article of claim 1, wherein the electronic component comprises a printed circuit substrate, and wherein the first conductive strand and the second conductive strand are interposed between the printed circuit substrate and the encapsulant material.

9. The fabric article of claim 1, wherein the first fabric portion and the second fabric portion comprise a first knitted portion and a second knitted portion surrounding the pocket, and wherein the electronic component is located within the pocket.

10. The fabric article of claim 9, wherein the electronic components are concealed within the pocket and cannot be seen.

11. An article comprising: The first and second fabric layers surround the pocket; A conductive strand having insulated sections and exposed conductive sections; The electronic component in the pocket, wherein the electronic component has a groove and a contact point in the groove, and wherein the exposed conductive section is received within the groove and electrically coupled to the contact point; as well as The encapsulant material in the groove.

12. The article of claim 11, wherein the conductive strand has a section within the pocket that overlaps with itself.

13. The article of claim 12, further comprising an additional encapsulating agent material for capturing the segment in the pocket.

14. The article of claim 11, wherein the first fabric layer and the second fabric layer comprise fabrics selected from the group consisting of woven fabrics and knitted fabrics.

15. The article of claim 11, wherein the electronic component comprises a printed circuit substrate, an electronic device mounted on the printed circuit substrate, and a protective structure covering the electronic device, wherein the recess is formed in the protective structure.

16. A fabric-based article comprising: The fabric surrounding the cavity; Conductive strands passing through the cavity; as well as An electronic component is mounted on the conductive strand and hidden within the cavity, wherein the electronic component includes a printed circuit substrate and an encapsulant material, and wherein the conductive strand is inserted between the printed circuit substrate and the encapsulant material.

17. The fabric-based article of claim 16, wherein the electronic component comprises: Electronic devices mounted on the printed circuit substrate; as well as A protective structure covering the electronic device.

18. The fabric-based article of claim 17, wherein the protective structure includes a groove for receiving the conductive strands.

19. The fabric-based article of claim 18, wherein the conductive strands are soldered to the contact pad in the groove.

20. The fabric-based article of claim 16, wherein the conductive strand has a section that overlaps with itself within the cavity.

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