Display module and display device

Abstract

The invention discloses a display module and a display device, and belongs to the technical field of display, the display module comprises a display panel and a bonding pad, the display panel comprises a display part and a binding part, the binding part is arranged on the backlight side of the display part, and the binding part is provided with a through first opening; the bonding pad is arranged on the binding part and is spaced from the first opening; the display panel at least comprises a first film layer and a heat insulation layer, the first film layer comprises a first sub-section and a second sub-section which are integrally connected, the binding part comprises the first sub-section, the display part comprises the second sub-section, and a plurality of concave parts are formed in the face, away from the second sub-section, of the first sub-section; the heat insulation layer continuously covers the plurality of concave parts, the bonding pad is located on the side, away from the first sub-segment, of the heat insulation layer, and the orthographic projection of at least part of the heat insulation layer on the first sub-segment is located between the orthographic projection of the bonding pad on the first sub-segment and the first opening. The stability of the display module structure can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] In related technologies, to further reduce the overall thickness of the device, the display hole (O-cut hole) originally located near the top side of the display module needs to be moved to the bottom side of the display module. This allows the display hole of the display unit to overlap and align with the bonding hole (COP hole or COF hole) of the bonding unit, forming a hole area. This hole area provides clearance for camera mounting, thus achieving the goal of reducing the overall thickness of the device.

[0003] However, in this structure, the distance between the driver chip and the via area is small. The heat dissipated by the driver chip will be transferred along the bonding portion to the bonding via, causing the ambient temperature at the bonding via to rise and significantly increasing the risk of encapsulation failure at the bonding via. After encapsulation failure at the bonding via, the film layer inside the bonding portion will peel off, and external water and oxygen will also invade the bonding portion through the area of ​​encapsulation failure, affecting the stability of the display module structure.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a display module and display device that can improve the stability of the display module structure.

[0006] To solve the above problems, the technical solution of this application is as follows: In a first aspect, this application proposes a display module, comprising: A display panel includes a display section and a mounting section, the mounting section being disposed on the backlight side of the display section, and the mounting section having a through first opening in the thickness direction of the display module; and The pads are located on the side of the bonding portion away from the display portion and are spaced apart from the first opening; The display panel includes at least: A first film layer, comprising an integrally connected first sub-segment and a second sub-segment, the display portion comprising the second sub-segment, wherein a plurality of recesses are formed on the side of the first sub-segment away from the second sub-segment; and A heat insulation layer is located on the side of the first sub-segment away from the second sub-segment and continuously covers a plurality of the recesses. The thermal conductivity of the heat insulation layer is less than that of the first film layer. The bonding portion includes the first sub-segment and the heat insulation layer. The solder pad is located on the side of the heat insulation layer away from the first sub-segment. The first opening penetrates the first sub-segment and the heat insulation layer. At least a portion of the orthographic projection of the heat insulation layer on the first sub-segment is located between the orthographic projection of the solder pad on the first sub-segment and the first opening.

[0007] In one embodiment of this application, the pad is located on one side of the first opening in the first direction, and the plurality of the recesses are arranged along the first direction.

[0008] In one embodiment of this application, the depth of the recess is less than or equal to the thickness of the first sub-segment.

[0009] In one embodiment of this application, the display panel further includes a planarization layer, the planarization layer including a first planar portion and a second planar portion integrally connected, the bonding portion including the first planar portion, and the display portion including the second planar portion; The first flat portion is located on the side of the first sub-segment away from the second sub-segment and covers the heat insulation layer; the second flat portion is located on the side of the second sub-segment away from the first sub-segment. The pad is located on the side of the first flat portion away from the first sub-segment, and the thermal conductivity of the insulation layer is less than that of the planarization layer. The planarization layer has a first groove, and the orthographic projection of the first groove on the first sub-segment is located between the orthographic projection of the pad on the first sub-segment and the first opening.

[0010] In one embodiment of this application, in a top view of the side of the binding portion away from the display portion, a plurality of the recesses are arranged around the first opening, and the heat insulation layer is arranged around the first opening.

[0011] In one embodiment of this application, in a top view of the side of the binding portion away from the display portion, the first groove is disposed around the first opening, and the first groove overlaps with the heat insulation layer.

[0012] In one embodiment of this application, in a top view of the side of the binding portion away from the display portion, The first groove is disposed around the first opening; The heat insulation layer is interrupted at the first groove to form a first heat insulation sub-part and a second heat insulation sub-part; The first heat insulation sub-part is located between the first opening and the first groove, and is disposed around the first opening. The first heat insulation sub-part covers the plurality of recesses located between the first opening and the first groove. The second heat insulation sub-part is located on the outside of the first groove away from the first opening and is disposed around the first groove. The second heat insulation sub-part covers the plurality of recesses located on the outside of the first groove away from the first opening.

[0013] In one embodiment of this application, the display panel further includes a second film layer, the material of the second film layer being a metallic material or an inorganic material, the second film layer including a third sub-segment and a fourth sub-segment, the bonding portion including the third sub-segment, and the display portion including the fourth sub-segment; The third sub-segment is disposed between the heat insulation layer and the first sub-segment, and the fourth sub-segment is located between the second flat portion and the second sub-segment.

[0014] In one embodiment of this application, the display panel includes a substrate, the substrate includes a first substrate portion and a second substrate portion integrally connected, the bonding portion includes the first substrate portion, and the display portion includes the second substrate portion; The substrate is the first film layer, the first substrate portion is the first sub-segment, and the second substrate portion is the second sub-segment; The first substrate portion has a plurality of recesses on the side away from the second substrate portion, and the heat insulation layer is located between the first substrate portion and the first flat portion.

[0015] In one embodiment of this application, the display panel includes: The substrate includes a first substrate portion and a second substrate portion integrally connected; The first inorganic layer includes an integrally connected first inorganic sub-part and second inorganic sub-part; The bonding portion includes the first substrate portion and the first inorganic sub-portion, wherein the first inorganic sub-portion is disposed between the first substrate portion and the first flat portion; The display portion includes a second substrate portion and a second inorganic sub-portion, wherein the second inorganic sub-portion is disposed between the second substrate portion and the second planar portion; The first inorganic layer is the first film layer, the first inorganic sub-part is the first sub-segment, and the second inorganic sub-part is the second sub-segment; The first inorganic sub-part has a plurality of recesses on the side away from the first substrate, and the heat insulation layer is located between the first inorganic sub-part and the first flat part.

[0016] In one embodiment of this application, the display panel includes: The substrate includes a first substrate portion and a second substrate portion integrally connected; The first metal layer includes an integrally connected first metal sub-part and second metal sub-part; The bonding portion includes the first substrate portion and the first metal sub-portion, wherein the first metal sub-portion is disposed between the first substrate portion and the first flat portion; The display portion includes a second substrate portion and a second metal sub-portion, wherein the second metal sub-portion is disposed between the second substrate portion and the second planar portion; The first metal layer is the first film layer, the first metal sub-part is the first sub-segment, and the second metal sub-part is the second sub-segment; The first metal sub-part has a plurality of recesses on the side away from the first substrate, and the heat insulation layer is located between the first metal sub-part and the first flat part.

[0017] In one embodiment of this application, the heat insulation layer is in direct contact with the first film layer.

[0018] In one embodiment of this application, the display portion has a through second opening in the thickness direction of the display module, the first opening overlaps with the second opening and communicates to form a hole area; In a top view of the side of the bonding portion away from the display portion, a plurality of the recesses are located between the pads and the via area.

[0019] Secondly, this application proposes a display device, including a display module, the display module comprising: A display panel includes a display section and a mounting section, the mounting section being disposed on the backlight side of the display section, and the mounting section having a through first opening in the thickness direction of the display module; and The pads are located on the side of the bonding portion away from the display portion and are spaced apart from the first opening; The display panel includes at least: A first film layer, comprising an integrally connected first sub-segment and a second sub-segment, wherein the bonding portion comprises the first sub-segment, the display portion comprises the second sub-segment, and a plurality of recesses are formed on the side of the first sub-segment away from the second sub-segment; and A heat insulation layer is located on the side of the first sub-segment away from the second sub-segment and continuously covers a plurality of the recesses. The thermal conductivity of the heat insulation layer is less than that of the first film layer. The pad is located on the side of the heat insulation layer away from the first sub-segment. The first opening penetrates the first sub-segment and the heat insulation layer. At least a portion of the orthographic projection of the heat insulation layer on the first sub-segment is located between the orthographic projection of the pad on the first sub-segment and the first opening.

[0020] In this application, a first opening is provided on the bonding portion, and a pad is used to bond the chip. After the chip is bonded to the pad, at least a portion of the heat insulation layer is located between the chip and the first opening. This application forms a terrain with depth along the thickness direction of the display module by providing multiple recesses on the side of the first sub-segment near the pad. When the heat insulation layer continuously covers the recesses, the heat insulation layer can be distributed not only perpendicular to the thickness direction of the display module (lateral direction) to achieve heat insulation in the thickness direction of the display module (longitudinal direction), but also parallel to the thickness direction of the display module (longitudinal direction) to achieve heat insulation in the direction perpendicular to the thickness direction of the display module (lateral direction). Since the heat insulation layer can insulate heat in the direction perpendicular to the thickness of the display module, and at least part of the heat insulation layer is located between the chip and the first opening, when the heat dissipated by the chip is transferred to the first opening along the direction perpendicular to the thickness of the display module, it will be blocked by the heat insulation layer, thereby reducing the heat reaching the first opening, lowering the ambient temperature at the first opening, reducing the risk of encapsulation failure at the first opening, thereby reducing the intrusion of external water and oxygen into the bonding part through the encapsulation failure part, and improving the stability of the display module structure. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0023] Figure 1 This is a schematic diagram of a display module in related technologies; Figure 2 This is a schematic diagram of a display module according to this application; Figure 3 yes Figure 2 An enlarged view of point A in the middle; Figure 4 This is a schematic diagram showing how the heat dissipated by the chip in the bonding section of this application is transferred along the thickness direction of the display module toward the first opening; Figure 5 This is a schematic diagram showing how the heat dissipated by the chip in the bonding section of this application is transferred along the thickness direction of the display module toward the first film layer; Figure 6 This is a top view of the side of the binding part away from the display part in this application; Figure 7 for Figure 6 Sectional view at section line B-B'; Figure 8 yes Figure 7 A schematic diagram of heat transfer in the binding section shown; Figure 9 This is a schematic diagram of the binding part of this application; Figure 10 This is another schematic diagram of the binding part of this application; Figure 11 This is another top view of the side of the binding part away from the display part in this application; Figure 12 This is a top view of the side of the binding part away from the display part in the first embodiment of this application; Figure 13 This is a schematic diagram of the binding part in the second embodiment of this application; Figure 14 This is a schematic diagram of a binding part in the third embodiment of this application; Figure 15 This is a schematic diagram of a binding part in the fourth embodiment of this application; Figure 16 This is a schematic diagram of a binding part in the fifth embodiment of this application; Figure 17 This is a schematic diagram of a binding part in the sixth embodiment of this application; Figure 18 This is a schematic diagram of the binding part in the seventh embodiment of this application.

[0024] Explanation of reference numerals in the attached figures: 100. Display Module 1. Display panel; 2. Solder pads; K, heat; Z, thickness direction; D1, first direction; P1, Binding part; P11, First opening; P2, Display part; P21, Second opening; P3, Bending part; P4, Hole area; 10. First film layer; 11. First sub-segment; 111. Recess; 12. Second sub-segment; 20. Insulation layer; 21. First insulation sub-section; 22. Second insulation sub-section; 30. Planarization layer; 31. First groove; 32. First planarization layer; 33. Second planarization layer; 40. First substrate; 50. First inorganic sub-sub ... Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0026] Please see Figure 1 In related technologies, to further reduce the overall thickness of the device, the display hole P21a (O-cut hole), originally located near the top side of the display module 100a, needs to be moved to the ground side of the display module 100a. This allows the display hole P21a of the display unit P2a to overlap and align with the bonding hole P11a (COP hole or COF hole) of the bonding unit P1a, forming a hole area P4a. The hole area P4a can provide space for the mounting of cameras or sensors, thus achieving the goal of reducing the overall thickness of the device.

[0027] However, in this structure, the distance between the driver chip 2a and the via region P4a is small. The heat dissipated by the driver chip 2a will be transferred along the bonding portion P1a to the bonding via P11a, causing the ambient temperature at the bonding via P11a to rise, significantly increasing the risk of encapsulation failure at the bonding via P11a. After encapsulation failure at the bonding via P11a, the film layer inside the bonding portion P1a will peel off, and external water and oxygen will also invade the bonding portion P1a through the encapsulation failure site, affecting the stability of the display module 100a structure.

[0028] This application discloses a display device, which can be a tablet computer, e-reader, electronic display screen, laptop computer, mobile phone, augmented reality (AR) / virtual reality (VR) device, media player, wearable device, digital camera, car navigation system, etc. The display device includes a display module 100.

[0029] Please see Figure 2 This application proposes a display module 100, which includes a display panel 1 and pads 2.

[0030] The display panel 1 includes a display section P2 and a mounting section P1. The mounting section P1 is located on the backlight side of the display section P2. The mounting section P1 has a first through opening P11 in the thickness direction Z of the display module 100.

[0031] The pad 2 is located on the side of the bonding part P1 away from the display part P2, and is spaced apart from the first opening P11.

[0032] In this application, the display panel 1 further includes a bending portion P3. The bending portion P3 is located between the display portion P2 and the bonding portion P1, and connects the display portion P2 and the bonding portion P1. The display portion P2, the bending portion P3, and the bonding portion P1 are integrally formed. The bonding portion P1 is bent towards the backlight side of the display portion P2 via the bending portion P3, thereby reducing the bezel size of the display module 100, achieving a narrow bezel display module 100 design, and improving the display effect.

[0033] Optionally, the display section P2 has a through second opening P21 in the thickness direction Z of the display module 100. The first opening P11 overlaps with the second opening P21 and connects to form the hole area P4.

[0034] In this embodiment, the hole area P4 can be a clearance space for the assembly of the camera or sensor, thereby achieving the effect of reducing the overall thickness of the device.

[0035] The display panel 1 includes at least a first film layer 10 and a heat insulation layer 20.

[0036] The first film layer 10 includes an integrally connected first segment 11 and second segment 12. The display part P2 includes the second segment 12. A plurality of recesses 111 are formed on the side of the first segment 11 away from the second segment 12.

[0037] Please see Figure 3 The heat insulation layer 20 is located on the side of the first sub-segment 11 away from the second sub-segment 12 and continuously covers a plurality of recesses 111. The thermal conductivity of the heat insulation layer 20 is less than that of the first film layer 10. The bonding portion P1 includes the first sub-segment 11 and the heat insulation layer 20. The solder pad 2 is located on the side of the heat insulation layer 20 away from the first sub-segment 11. The first opening P11 penetrates the first sub-segment 11 and the heat insulation layer 20. At least a portion of the orthographic projection of the heat insulation layer 20 on the first sub-segment 11 lies between the orthographic projection of the solder pad 2 on the first sub-segment 11 and the first opening P11.

[0038] In this application, a first opening P11 is provided on the bonding portion P1, and the pad 2 is used to bond the chip. After the chip is bonded to the pad 2, at least a portion of the heat insulation layer 20 is located between the chip and the first opening P11. This application forms a terrain with depth along the thickness direction Z of the display module 100 by providing multiple recesses 111 on the side of the first sub-segment 11 near the pad 2. When the heat insulation layer 20 continuously covers the recesses 111, the heat insulation layer 20 can not only be distributed perpendicular to the thickness direction Z (lateral) of the display module 100 to achieve the effect of heat insulation in the thickness direction Z (longitudinal) of the display module 100, but also distributed parallel to the thickness direction Z (longitudinal) of the display module 100 to achieve the effect of heat insulation in the thickness direction Z (lateral) of the display module 100. Since the heat insulation layer 20 can provide heat insulation in the thickness direction Z perpendicular to the display module 100, and at least a portion of the heat insulation layer 20 is located between the chip and the first opening P11, when the heat K emitted by the chip during operation is transferred along the thickness direction Z perpendicular to the display module 100 toward the first opening P11, it will be blocked by the heat insulation layer 20, thereby reducing the heat K reaching the first opening P11, lowering the ambient temperature at the first opening P11, reducing the risk of encapsulation failure at the first opening P11, thereby reducing the intrusion of external water and oxygen into the bonding portion P1 through the encapsulation failure site, and improving the stability of the display module 100 structure.

[0039] For details, please refer to Figure 4 When the heat K emitted by the chip is transferred along the thickness direction Z perpendicular to the display module 100 toward the first opening P11, it will be blocked by the heat insulation layer 20, thereby reducing the heat K reaching the first opening P11, lowering the ambient temperature at the first opening P11, reducing the risk of encapsulation failure at the first opening P11, thereby reducing the intrusion of external water and oxygen into the bonding part P1 through the encapsulation failure part, and improving the stability of the display module 100 structure.

[0040] For details, please refer to Figure 5 When the heat K emitted by the chip is transferred along the thickness direction Z parallel to the display module 100 toward the first film layer 10, it will be blocked by the heat insulation layer 20, thereby reducing the heat K that reaches the first opening P11 through the first film layer 10, lowering the ambient temperature at the first opening P11, reducing the risk of encapsulation failure at the first opening P11, thereby reducing the intrusion of external water and oxygen into the bonding part P1 through the encapsulation failure part, and improving the stability of the display module 100 structure.

[0041] In this embodiment, the thermal conductivity of the heat insulation layer 20 is less than that of the first film layer 10. The first film layer 10 has a relatively high thermal conductivity, so the heat K emitted by the chip will be transferred to the first opening P11 through the first film layer 10, causing the ambient temperature at the first opening P11 to rise. Since the thermal conductivity of the heat insulation layer 20 is less than that of the first film layer 10, the heat insulation layer 20 can block the heat K emitted by the chip from being transferred along the first film layer 10, reducing the ambient temperature at the first opening P11, reducing the risk of encapsulation failure at the first opening P11, thereby reducing the intrusion of external water and oxygen into the bonding portion P1 through the encapsulation failure site, and improving the stability of the display module 100 structure.

[0042] Optionally, the insulation layer 20 is made of aerogel felt (SiO2). The thermal conductivity of the aerogel felt is in the range of 0.013 W / (m·K) to 0.025 W / (m·K). The aerogel felt can provide insulation in an environment of 600 degrees Celsius, has high temperature resistance, and is relatively thin overall, providing good insulation per unit volume, which can further reduce the thickness of the display module 100.

[0043] Optionally, the insulation layer 20 is made of ceramicized foam. The thermal conductivity of the ceramicized foam is in the range of 0.1 W / (m·K) to 0.2 W / (m·K). The ceramicized foam can provide insulation in environments up to 800 degrees Celsius, exhibiting high-temperature resistance. Furthermore, as a flexible material, the ceramicized foam can also cushion the display module 100, improving its impact resistance.

[0044] Optionally, the insulation layer 20 is made of mica sheet. The thermal conductivity of the mica sheet is in the range of 0.2 W / (m·K) to 0.3 W / (m·K). The mica sheet can provide insulation in an environment of 850 degrees Celsius and has high-temperature resistance. The breakdown strength of the mica sheet is greater than 20 kV / mm. It can also resist external static electricity, improving the antistatic performance of the display module 100.

[0045] Optionally, the insulation layer 20 is made of insulating silicone foam. The thermal conductivity of the insulating silicone foam is in the range of 0.05 W / (m·K) to 0.10 W / (m·K). The insulating silicone foam can provide insulation in environments up to 500 degrees Celsius and has high-temperature resistance. The insulating silicone foam has high elasticity and a compression deformation of less than 5%, which acts as a buffer for the display module 100 and improves the impact resistance of the display module 100.

[0046] Please see Figure 6 In a top view of the bonding portion P1 on the side away from the display portion P2, a plurality of recesses 111 are located between the pad 2 and the hole area P4.

[0047] In this embodiment, multiple recesses 111 are located between the pads 2 and the via P4, and the heat insulation layer 20 continuously covers the multiple recesses 111. Since the heat insulation layer 20 can reduce the heat K transferred along the thickness direction Z perpendicular to the display module 100 towards the first opening P11, the more recesses 111 there are, the larger the longitudinal heat insulation area of ​​the heat insulation layer 20 becomes, and the better the heat insulation effect on the via P4. When the chip bonded to the pads 2 heats up, the heat K emitted by the chip is blocked when it is transferred to the heat insulation layer 20, thereby reducing the heat K reaching the via P4, lowering the ambient temperature at the via P4, reducing the risk of encapsulation failure at the via P4, and thus reducing the intrusion of external water and oxygen into the bonding portion P1 and the display portion P2 through the encapsulation failure site, thereby improving the stability of the display module 100 structure.

[0048] Please see Figure 7 Optionally, the pad 2 is located on one side of the first opening P11 in the first direction D1, and a plurality of recesses 111 are arranged along the first direction D1.

[0049] Please see Figure 8 In this embodiment, when the heat insulation layer 20 covers the recess 111, the heat K needs to pass through portions of the heat insulation layer 20 covering the recess 111 multiple times during the transfer along the first direction D1. The more recesses 111 there are, the more times the heat K needs to pass through the heat insulation layer 20 along the first direction D1. Each time the heat K passes through the heat insulation layer 20, a portion is lost, resulting in a significant reduction in the amount of heat K reaching the first opening P11. This lowers the ambient temperature at the first opening P11, reduces the risk of encapsulation failure at the first opening P11, and thus reduces the intrusion of external water and oxygen into the bonding portion P1 through the encapsulation failure site, improving the stability of the display module 100 structure.

[0050] Please see Figure 9 The depth H1 of the recess 111 is equal to the thickness H2 of the first segment 11.

[0051] When the material of the first film layer 10 is a metallic material, the depth H1 of the recess 111 can be equal to the thickness H2 of the first segment 11. Metallic materials have good thermal conductivity but poor thermal insulation performance. Therefore, the depth of the recess 111 will be relatively deep to improve the thermal insulation effect of the insulation layer 20.

[0052] Please see Figure 10 The depth H1 of the recessed portion 111 is less than the thickness H2 of the first sub-segment 11.

[0053] When the material of the first film layer 10 is an inorganic material, the depth H1 of the recess 111 can be less than the thickness H2 of the first sub-segment 11. The inorganic material can effectively block the intrusion of external water and oxygen. The first sub-segment 11 can cover the film layer located on the side of the first sub-segment 11 closest to the display part P2, thereby blocking the intrusion of external water and oxygen from the side of the pad 2 and improving the stability of the display module 100 structure.

[0054] Please see Figure 10 Optionally, the display panel 1 further includes a planarization layer 30. The planarization layer 30 includes a first planar portion and a second planar portion integrally connected. The bonding portion P1 includes the first planar portion. The display portion P2 includes the second planar portion.

[0055] The first flat portion is located on the side of the first sub-segment 11 away from the second sub-segment 12 and is covered by the heat insulation layer 20. The second flat portion is located on the side of the second sub-segment 12 away from the first sub-segment 11.

[0056] The pad 2 is located on the side of the first planar portion away from the first sub-segment 11. The thermal conductivity of the insulation layer 20 is less than that of the planarization layer 30.

[0057] The planarization layer 30 is provided with a first groove 31. The orthographic projection of the first groove 31 on the first sub-segment 11 is located between the orthographic projection of the pad 2 on the first sub-segment 11 and the first opening P11.

[0058] In this embodiment, the planarization layer 30 can improve the flatness above the first film layer 10. In the display unit P2, since the sub-pixels above the first planarized portion have higher flatness, the light extraction efficiency of the display unit P2 can be improved. In the bonding unit P1, since the devices above the second planarized portion have higher flatness, the phenomenon of incomplete bonding caused by unevenness can be reduced, and the stability of the device connection above the bonding unit P1 can be improved.

[0059] In this embodiment, the material of the first planar portion is an organic material, and the thermal conductivity of the heat insulation layer 20 is less than that of the planarization layer 30, resulting in poor heat insulation performance of the first planar portion. Since the first planar portion is located on the side of the heat insulation layer 20 closer to the pad 2, the heat insulation layer 20 can only block heat K from being transferred from the first planar portion along the thickness direction Z parallel to the display module 100 to the first film layer 10. The heat insulation layer 20 cannot block heat K from being transferred in the first planar portion along the first direction D1 to the first opening P11.

[0060] To reduce the transfer of heat K along the first direction D1 to the first opening P11 in the first planarization portion, this embodiment provides a first groove 31 in the planarization layer 30. Since the first groove 31 hollows out at least a portion of the planarization layer 30, when heat K is transferred along the first direction D1 to the first groove 31, the path of heat K extending towards the first opening P11 is narrowed. Therefore, the amount of heat K transferred to the first opening P11 is also reduced, thereby lowering the ambient temperature at the first opening P11, reducing the risk of encapsulation failure at the first opening P11, reducing the intrusion of external water and oxygen into the bonding portion P1 through the encapsulation failure site, and improving the stability of the display module 100 structure.

[0061] Optionally, the planarization layer 30 can be a single-layer film or a multi-layer film. This embodiment uses a double-layer planarization layer 30 as an example for illustration, but the actual number of film layers in the planarization layer 30 is not limited.

[0062] Optionally, the planarization layer 30 includes a first planarization layer 32 and a second planarization layer 33. A portion of the first planarization layer 32 and a portion of the second planarization layer 33 are located between the pad 2 and the first sub-segment 11, and another portion of the first planarization layer 32 and another portion of the second planarization layer 33 are located on the side of the second sub-segment 12 away from the first sub-segment 11. As the number of film layers in the planarization layer 30 increases, the display module 100 exhibits better planarization.

[0063] Please see Figure 11 Optionally, in a top view of the side of the binding part P1 away from the display part P2, a plurality of recesses 111 are provided around the first opening P11, and the heat insulation layer 20 is provided around the first opening P11.

[0064] In this embodiment, on one hand, multiple recesses 111 and a heat insulation layer 20 are arranged around the first opening P11. Since the heat insulation layer 20 can reduce the heat K transferred along the thickness direction Z perpendicular to the display module 100 towards the first opening P11, the more recesses 111 there are, the larger the longitudinal heat insulation area of ​​the heat insulation layer 20 is, and the better the heat insulation effect on the hole area P4. When the chip bonded to the pad 2 heats up, the heat K emitted by the chip is blocked when it is transferred to the heat insulation layer 20, thereby reducing the heat K reaching the hole area P4, lowering the ambient temperature at the hole area P4, reducing the risk of encapsulation failure at the hole area P4, thereby reducing the intrusion of external water and oxygen into the bonding part P1 and the display part P2 through the encapsulation failure site, and improving the stability of the display module 100 structure.

[0065] On the other hand, the heat insulation layer 20 is arranged around the first opening P11, which can not only block the heat K directly transferred from the direction of the pad 2 through the first film layer 10 to the first opening P11, but also block the heat K indirectly transferred from other directions through the first film layer 10 to the first opening P11, further reducing the heat K reaching the hole area P4, lowering the ambient temperature at the hole area P4, reducing the risk of encapsulation failure at the hole area P4, thereby reducing the intrusion of external water and oxygen into the bonding part P1 and the display part P2 through the encapsulation failure part, and improving the stability of the display module 100 structure.

[0066] In the first embodiment of this application: Please see Figure 12 Optionally, in a top view of the side of the binding part P1 away from the display part P2, the first groove 31 is provided around the first opening P11, and the first groove 31 overlaps with the heat insulation layer 20.

[0067] In this embodiment, the first groove 31 is arranged around the first opening P11, which can not only block the heat K directly transferred from the direction of the pad 2 through the planarization layer 30 to the first opening P11, but also block the heat K indirectly transferred from other directions through the planarization layer 30 to the first opening P11, further reducing the heat K reaching the hole area P4, lowering the ambient temperature at the hole area P4, reducing the risk of encapsulation failure at the hole area P4, thereby reducing the intrusion of external water and oxygen into the bonding part P1 and the display part P2 through the encapsulation failure part, and improving the stability of the display module 100 structure.

[0068] In the second embodiment of this application: Please see Figure 13 In a top view of the side of the binding part P1 away from the display part P2, the first groove 31 is provided around the first opening P11.

[0069] The heat insulation layer 20 is interrupted at the first groove 31 to form a first heat insulation sub-section 21 and a second heat insulation sub-section 22.

[0070] The first heat insulation sub-part 21 is located between the first opening P11 and the first groove 31, and is disposed around the first opening P11. The first heat insulation sub-part 21 covers a plurality of recesses 111 located between the first opening P11 and the first groove 31.

[0071] The second heat insulation sub-part 22 is located on the outer side of the first groove 31 away from the first opening P11, and is disposed around the first groove 31. The second heat insulation sub-part 22 covers a plurality of recesses 111 located on the outer side of the first groove 31 away from the first opening P11.

[0072] In this embodiment, during the process of forming the first groove 31 by etching, the etching depth is increased so that the first groove 31 penetrates the heat insulation layer 20 and the first film layer 10. At this time, both the first film layer 10 and the heat insulation layer 20 are separated at the first groove 31, thereby further blocking the path of heat K from the pad 2 to the first opening P11 along the first direction D1, further reducing the heat K reaching the hole area P4, lowering the ambient temperature at the hole area P4, reducing the risk of encapsulation failure at the hole area P4, thereby reducing the intrusion of external water and oxygen into the bonding part P1 and the display part P2 through the encapsulation failure site, and improving the stability of the display module 100 structure.

[0073] In the third embodiment of this application: Please see Figure 14 Optionally, the heat insulation layer 20 is in direct contact with the first membrane layer 10.

[0074] In this embodiment, after the process of forming the first film layer 10, the heat insulation layer 20 is formed directly on the side of the first sub-segment 11 away from the second sub-segment 12. At this time, the heat insulation layer 20 is in direct contact with the first sub-segment 11, and the heat insulation layer 20 can fit the undulating terrain of the first sub-segment 11 well, thereby achieving a better heat insulation effect.

[0075] In the fourth embodiment of this application: Please see Figure 15 Optionally, the display panel 1 further includes a second film layer 70. The material of the second film layer 70 is a metallic material or an inorganic material. The second film layer 70 includes a third sub-segment and a fourth sub-segment. The bonding portion P1 includes the third sub-segment. The display portion P2 includes the fourth sub-segment.

[0076] The third sub-segment is located between the insulation layer 20 and the first sub-segment 11. The fourth sub-segment is located between the second flat section and the second sub-segment 12.

[0077] In the fourth embodiment, after the formation of the first film layer 10, the heat insulation layer 20 is not directly fabricated; instead, the second film layer 70 is fabricated first. The material of the second film layer 70 is either metallic or inorganic. Since the material of the second film layer 70 is not organic, it lacks leveling properties and can better adhere to the recessed portion 111 on the upper surface of the first segment 11. This results in the heat insulation layer 20 covering the second film layer 70 having a better depth structure, reducing the heat K reaching the first opening P11, lowering the ambient temperature at the first opening P11, and reducing the risk of encapsulation failure at the first opening P11. This, in turn, reduces the intrusion of external water and oxygen into the bonding portion P1 through the encapsulation failure site, improving the stability of the display module 100 structure.

[0078] In the fifth embodiment of this application: Please see Figure 16The display panel 1 includes a substrate. The substrate includes a first substrate portion 40 and a second substrate portion integrally connected. The bonding portion P1 includes the first substrate portion 40. The display portion P2 includes the second substrate portion.

[0079] The substrate is a first film layer 10. The first substrate portion 40 is a first sub-segment 11. The second substrate portion is a second sub-segment 12.

[0080] The first substrate portion 40 has a plurality of recesses 111 formed on the side away from the second substrate portion. The heat insulation layer 20 is located between the first substrate portion 40 and the first flat portion.

[0081] In this embodiment, the substrate is the first film layer 10, and the substrate is a flexible substrate. The substrate material can be polyimide. The recessed portion 111 is formed on the side of the first substrate portion 40 away from the second substrate portion. The heat insulation layer 20 can prevent the heat K in the first substrate portion 40 from being transferred along the first direction D1 to the first opening P11, thereby reducing the ambient temperature at the first opening P11, reducing the risk of encapsulation failure at the first opening P11, reducing the intrusion of external water and oxygen into the bonding portion P1 through the encapsulation failure site, and improving the stability of the display module 100 structure.

[0082] On the other hand, during the formation of the first opening P11, the recess 111 can block the extension of cracks at the first opening P11, thereby preventing crack propagation and improving the encapsulation effect at the first opening P11.

[0083] In the sixth embodiment of this application: Please see Figure 17 The display panel 1 includes a substrate and a first inorganic layer.

[0084] The substrate includes a first substrate portion 40 and a second substrate portion integrally connected.

[0085] The first inorganic layer includes an integrally connected first inorganic sub-section 50 and second inorganic sub-section.

[0086] The bonding portion P1 includes a first substrate portion 40 and a first inorganic sub-portion 50. The first inorganic sub-portion 50 is disposed between the first substrate portion 40 and the first flat portion.

[0087] The display unit P2 includes a second substrate portion and a second inorganic sub-portion. The second inorganic sub-portion is disposed between the second substrate portion and the second planar portion.

[0088] The first inorganic layer is the first film layer 10. The first inorganic sub-section 50 is the first sub-segment 11. The second inorganic sub-section is the second sub-segment 12.

[0089] The first inorganic sub-part 50 has a plurality of recesses 111 formed on the side away from the first substrate 40. The heat insulation layer 20 is located between the first inorganic sub-part 50 and the first flat part.

[0090] In this embodiment, the first inorganic layer is a first film layer 10, which can be the same film layer as the gate insulating layer of the display panel 1. The first inorganic layer can also be the same film layer as the interlayer dielectric layer of the display panel 1. The first inorganic layer can also be the same film layer as the buffer layer of the display panel 1. A recessed portion 111 is formed on the side of the first inorganic sub-part 50 away from the first substrate portion 40. The heat insulation layer 20 can prevent heat K in the first inorganic sub-part 50 from being transferred along the first direction D1 to the first opening P11, thereby reducing the ambient temperature at the first opening P11, reducing the risk of encapsulation failure at the first opening P11, reducing the intrusion of external water and oxygen into the bonding portion P1 through the encapsulation failure site, and improving the structural stability of the display module 100.

[0091] On the other hand, during the formation of the first opening P11, the recess 111 can block the extension of cracks at the first opening P11, thereby preventing crack propagation and improving the encapsulation effect at the first opening P11.

[0092] In the seventh embodiment of this application: Please see Figure 18 The display panel 1 includes a substrate and a first metal layer.

[0093] The substrate includes a first substrate portion 40 and a second substrate portion integrally connected.

[0094] The first metal layer includes an integrally connected first metal sub-part 60 and a second metal sub-part.

[0095] The bonding portion P1 includes a first substrate portion 40 and a first metal sub-portion 60. The first metal sub-portion 60 is disposed between the first substrate portion 40 and the first flat portion.

[0096] The display portion P2 includes a second substrate portion and a second metal sub-portion. The second metal sub-portion is disposed between the second substrate portion and the second planar portion.

[0097] The first metal layer is the first film layer 10. The first metal sub-section 60 is the first sub-segment 11. The second metal sub-section is the second sub-segment 12.

[0098] The first metal sub-part 60 has a plurality of recesses 111 formed on the side away from the first substrate 40. The heat insulation layer 20 is located between the first metal sub-part 60 and the first flat part.

[0099] In this embodiment, the first metal layer is a first film layer 10, which can be the same film layer as the gate of the display panel 1. The first metal layer can also be the same film layer as the source and drain of the display panel 1. The first metal layer can also be the same film layer as the light-shielding metal layer of the display panel 1. A recessed portion 111 is formed on the side of the first metal sub-part 60 away from the first substrate portion 40. The heat insulation layer 20 can prevent heat K in the first metal sub-part 60 from being transferred along the first direction D1 to the first opening P11, thereby reducing the ambient temperature at the first opening P11, reducing the risk of encapsulation failure at the first opening P11, reducing the intrusion of external water and oxygen into the bonding portion P1 through the encapsulation failure site, and improving the stability of the display module 100 structure.

[0100] On the other hand, during the formation of the first opening P11, the recess 111 can block the extension of cracks at the first opening P11, thereby preventing crack propagation and improving the encapsulation effect at the first opening P11.

[0101] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0102] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0103] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0104] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display module, characterized in that, include: The display panel includes a display part and a mounting part, the mounting part being disposed on the backlight side of the display part, and the mounting part having a through first opening in the thickness direction of the display module; and The pads are located on the side of the bonding portion away from the display portion and are spaced apart from the first opening; The display panel includes at least: A first film layer, comprising an integrally connected first sub-segment and a second sub-segment, the display portion comprising the second sub-segment, wherein a plurality of recesses are formed on the side of the first sub-segment away from the second sub-segment; and A heat insulation layer is located on the side of the first sub-segment away from the second sub-segment and continuously covers a plurality of the recesses. The thermal conductivity of the heat insulation layer is less than that of the first film layer. The bonding portion includes the first sub-segment and the heat insulation layer. The solder pad is located on the side of the heat insulation layer away from the first sub-segment. The first opening penetrates the first sub-segment and the heat insulation layer. At least a portion of the orthographic projection of the heat insulation layer on the first sub-segment is located between the orthographic projection of the solder pad on the first sub-segment and the first opening.

2. The display module as described in claim 1, characterized in that, The pad is located on one side of the first opening in the first direction, and the plurality of recesses are arranged along the first direction.

3. The display module as described in claim 1, characterized in that, The depth of the recess is less than or equal to the thickness of the first sub-segment.

4. The display module as described in claim 1, characterized in that, The display panel further includes a planarization layer, which includes an integrally connected first planar portion and a second planar portion. The bonding portion includes the first planar portion, and the display portion includes the second planar portion. The first flat portion is located on the side of the first sub-segment away from the second sub-segment and covers the heat insulation layer; the second flat portion is located on the side of the second sub-segment away from the first sub-segment. The pad is located on the side of the first flat portion away from the first sub-segment, and the thermal conductivity of the insulation layer is less than that of the planarization layer. The planarization layer has a first groove, and the orthographic projection of the first groove on the first sub-segment is located between the orthographic projection of the pad on the first sub-segment and the first opening.

5. The display module as described in claim 4, characterized in that, In a top view of the side of the binding portion away from the display portion, a plurality of recesses are arranged around the first opening, and the heat insulation layer is arranged around the first opening.

6. The display module as described in claim 5, characterized in that, In a top view of the side of the binding portion away from the display portion, the first groove is disposed around the first opening, and the first groove overlaps with the heat insulation layer.

7. The display module as described in claim 5, characterized in that, In the top view of the side of the binding part away from the display part, The first groove is disposed around the first opening; The heat insulation layer is interrupted at the first groove to form a first heat insulation sub-part and a second heat insulation sub-part; The first heat insulation sub-part is located between the first opening and the first groove, and is disposed around the first opening. The first heat insulation sub-part covers the plurality of recesses located between the first opening and the first groove. The second heat insulation sub-part is located on the outside of the first groove away from the first opening and is disposed around the first groove. The second heat insulation sub-part covers the plurality of recesses located on the outside of the first groove away from the first opening.

8. The display module as described in any one of claims 4-7, characterized in that, The display panel further includes a second film layer, the material of which is a metallic material or an inorganic material. The second film layer includes a third sub-segment and a fourth sub-segment. The bonding portion includes the third sub-segment, and the display portion includes the fourth sub-segment. The third sub-segment is disposed between the heat insulation layer and the first sub-segment, and the fourth sub-segment is located between the second flat portion and the second sub-segment.

9. The display module as described in any one of claims 4-7, characterized in that, The display panel includes a substrate, the substrate includes a first substrate portion and a second substrate portion integrally connected, the bonding portion includes the first substrate portion, and the display portion includes the second substrate portion; The substrate is the first film layer, the first substrate portion is the first sub-segment, and the second substrate portion is the second sub-segment; The first substrate portion has a plurality of recesses on the side away from the second substrate portion, and the heat insulation layer is located between the first substrate portion and the first flat portion.

10. The display module as described in any one of claims 4-7, characterized in that, The display panel includes: The substrate includes a first substrate portion and a second substrate portion integrally connected; The first inorganic layer includes an integrally connected first inorganic sub-part and second inorganic sub-part; The bonding portion includes the first substrate portion and the first inorganic sub-portion, wherein the first inorganic sub-portion is disposed between the first substrate portion and the first flat portion; The display portion includes a second substrate portion and a second inorganic sub-portion, wherein the second inorganic sub-portion is disposed between the second substrate portion and the second planar portion; The first inorganic layer is the first film layer, the first inorganic sub-part is the first sub-segment, and the second inorganic sub-part is the second sub-segment; The first inorganic sub-part has a plurality of recesses on the side away from the first substrate, and the heat insulation layer is located between the first inorganic sub-part and the first flat part.

11. The display module as described in any one of claims 4-7, characterized in that, The display panel includes: The substrate includes a first substrate portion and a second substrate portion integrally connected; The first metal layer includes an integrally connected first metal sub-part and second metal sub-part; The bonding portion includes the first substrate portion and the first metal sub-portion, wherein the first metal sub-portion is disposed between the first substrate portion and the first flat portion; The display portion includes a second substrate portion and a second metal sub-portion, wherein the second metal sub-portion is disposed between the second substrate portion and the second planar portion; The first metal layer is the first film layer, the first metal sub-part is the first sub-segment, and the second metal sub-part is the second sub-segment; The first metal sub-part has a plurality of recesses on the side away from the first substrate, and the heat insulation layer is located between the first metal sub-part and the first flat part.

12. The display module as described in any one of claims 1-7, characterized in that, The heat insulation layer is in direct contact with the first film layer.

13. The display module as described in any one of claims 1-7, characterized in that, The display section has a through second opening in the thickness direction of the display module, and the first opening overlaps with the second opening and communicates to form a hole area; In a top view of the side of the bonding portion away from the display portion, a plurality of the recesses are located between the pads and the via area.

14. A display device, characterized in that, Includes the display module as described in any one of claims 1-13.

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