Coil component

Abstract

The invention provides a coil assembly. The coil component includes: a body having first and second side surfaces opposite to each other in a first direction and third and fourth side surfaces opposite to each other in a second direction; the coil is arranged in the main body and comprises a lead wire extending to the first side surface; and a lead frame including a side surface portion on the first side surface of the main body and connected to the lead. The side surface portion has an inner surface facing the main body and an outer surface opposite the inner surface. The lead wire includes a contact portion in contact with the inner surface of the side surface portion and a bent portion located above the contact portion. The bent portion is positioned closer to the main body than the outer surface of the side surface portion.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0139641, filed on October 14, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a coil assembly. Background Technology

[0003] An inductor (a type of coil assembly) can be a representative passive electronic component used in electronic devices along with resistors and capacitors.

[0004] Recently, the market for power inductors used in high-current applications such as artificial intelligence (AI), automotive electronic components and robotics has increased. In particular, automotive electronic components may require high reliability technologies to improve safety and may need to be vibration resistant while meeting high current characteristics. Summary of the Invention

[0005] One aspect of this disclosure is to provide a coil assembly that can have improved vibration resistance and prevent bonding defects between the lead frame and the coil.

[0006] According to one aspect of this disclosure, a coil assembly includes: a body including a first side surface and a second side surface opposite to each other in a first direction, and a third side surface and a fourth side surface opposite to each other in a second direction, and comprising a magnetic material; a coil disposed in the body and including a lead extending to the first side surface of the body; and a lead frame including a side surface portion disposed on the first side surface of the body and connected to the lead, wherein the side surface portion includes an inner surface facing the first side surface of the body and an outer surface opposite to the inner surface, and wherein the lead includes a contact portion contacting the inner surface of the side surface portion and a bent portion disposed on the upper part of the contact portion, and the bent portion is configured to be closer to the body than the outer surface of the side surface portion. Attached Figure Description

[0007] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a perspective view showing a coil assembly according to a first embodiment of the present disclosure; Figure 2 It is shown Figure 1 A diagram of the lead frame and leads; Figure 3A It shows along Figure 2A cross-sectional view taken from line II-II' in the diagram; Figure 3B It is shown Figure 3A A comparative example diagram; Figure 4 It is shown Figure 1 A diagram of the lead frame in the diagram; Figure 5 This shows the view along the second direction. Figure 1 A diagram of the coil assembly; Figure 6 It is along Figure 1 A cross-sectional view taken from line I-I' in the diagram; Figure 7 This is a diagram illustrating a method of joining a lead frame and leads according to a first embodiment of the present disclosure; Figure 8 This is a perspective view showing a coil assembly according to a second embodiment of the present disclosure; Figure 9 It is shown Figure 8 A diagram of the lead frame and leads; Figure 10 It is shown Figure 8 A diagram of the lead frame in the diagram; Figure 11 It is along Figure 8 A cross-sectional view taken from line III-III' in the diagram; Figure 12 This is a perspective view showing a coil assembly according to a third embodiment of the present disclosure; Figure 13 It is shown Figure 12 A diagram of the lead frame and leads; Figure 14 It is shown Figure 12 A diagram of the lead frame in the diagram; Figure 15 It is along Figure 12 A cross-sectional view taken from line IV-IV' in the diagram; Figure 16 This is a perspective view showing a coil assembly according to a fourth embodiment of the present disclosure; Figure 17 This is a perspective view showing a coil assembly according to a fifth embodiment of the present disclosure; and Figure 18 It is along Figure 17 The cross-sectional view taken from line V-V' in the diagram. Detailed Implementation

[0008] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0009] However, this disclosure may be exemplified in many different forms and should not be construed as limiting oneself to the specific embodiments set forth herein. Unless the meaning is clearly different in the context, expressions used in the singular include plural expressions. The terms “comprising,” “including,” “constructed as,” etc., in the specification are used to indicate the presence of features, quantities, steps, operations, elements, parts, or combinations thereof, and do not preclude the possibility of combining or adding one or more features, quantities, steps, operations, elements, parts, or combinations thereof. Furthermore, the expression “on” the setting of an element may indicate that the element may be positioned above or below the target portion, and does not necessarily indicate that the element is positioned above the target portion in the direction of gravity.

[0010] It will be understood that when an element is "combined" with / "attached to" another element or "connected to" / "linked to" another element, the element may be directly combined with / attached to / linked to the other element, or there may be an intermediate element between the element and the other element. Conversely, it will be understood that when an element is "directly combined" with / attached to / linked to another element or "directly connected to" / linked to another element, there is no intermediate element between the element and the other element.

[0011] For example, the structures, shapes, and dimensions described as examples in the embodiments of this disclosure may be implemented in another embodiment without departing from the spirit and scope of this disclosure.

[0012] In the accompanying drawings, the X direction can be defined as a first direction or a length direction, the Y direction can be defined as a second direction or a width direction, and the Z direction can be defined as a third direction or a thickness direction.

[0013] In the accompanying drawings, the same elements will be represented by the same reference numerals. Furthermore, redundant descriptions that might unnecessarily obscure the gist of this disclosure, as well as detailed descriptions of known functions and elements, will not be provided.

[0014] Various types of electronic components are used in electronic devices, and various types of coil assemblies can be appropriately used between these electronic components for the purpose of noise removal.

[0015] In other words, in electronic devices, coil assemblies can be used as power inductors, high-frequency inductors, ordinary ferrite beads, high-frequency ferrite beads (e.g., ferrite beads suitable for the GHz band), common-mode filters, etc.

[0016] (First embodiment) Figure 1 This is a perspective view showing a coil assembly according to the first embodiment. Figure 2 It is shown Figure 1The diagram shows the lead frame and leads. Figure 3A It shows along Figure 2 The cross-sectional view taken from line II-II' in the diagram. Figure 3B It is shown Figure 3A A comparative example diagram. Figure 4 It is shown Figure 1 A diagram of the lead frame in the diagram. Figure 5 This shows the view along the second direction. Figure 1 A diagram of the coil assembly. Figure 6 It is along Figure 1 The cross-sectional view taken from line I-I' in the diagram. Figure 7 This is a diagram illustrating a method for joining a lead frame and leads according to a first embodiment.

[0017] Reference Figure 1 The coil assembly 1000 may include: a body 100, comprising a magnetic material; a coil 300 disposed in the body 100; and lead frames 400 and 500, respectively disposed on a first side surface 101 and a second side surface 102 of the body 100.

[0018] In one embodiment, the body 100 may form the overall appearance of the coil assembly 1000, and the coil 300 may be embedded in the body 100.

[0019] The main body 100 may have a hexahedral shape. (See reference...) Figure 1 The main body 100 may include a first side surface 101 and a second side surface 102 opposite to each other in a first direction (X direction), a third side surface 103 and a fourth side surface 104 opposite to each other in a second direction (Y direction), and a fifth side surface 105 (i.e., lower surface 105) and a sixth side surface 106 (i.e., upper surface 106) opposite to each other in a third direction (Z direction). The first side surface 101, the second side surface 102, the third side surface 103 and the fourth side surface 104 of the main body 100 may be the side surfaces of the main body 100 that connect the lower surface 105 of the main body 100 to the upper surface 106.

[0020] The body 100 may include a magnetic material. The body 100 may be formed by filling a mold with a magnetic material, or by filling a mold with a composite material comprising a magnetic material and an insulating resin. A molding process in which high temperature and high pressure are applied to the mold of the magnetic material or composite material may also be performed, but exemplary embodiments thereof are not limited thereto.

[0021] The magnetic material included in the main body 100 may be ferrite or metallic magnetic particles.

[0022] Ferrites can be at least one of the following: spinel-type ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites), garnet-type ferrites (such as Y-based ferrites), and Li-based ferrites.

[0023] The metallic magnetic particles may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic particles may be at least one selected from pure iron particles, Fe-Si based alloy particles, Fe-Si-Al based alloy particles, Fe-Ni based alloy particles, Fe-Ni-Mo based alloy particles, Fe-Ni-Mo-Cu based alloy particles, Fe-Co based alloy particles, Fe-Ni-Co based alloy particles, Fe-Cr based alloy particles, Fe-Cr-Si based alloy particles, Fe-Si-Cu-Nb based alloy particles, Fe-Ni-Cr based alloy particles, and Fe-Cr-Al based alloy particles.

[0024] The metallic magnetic particles can be amorphous or crystalline. For example, the metallic magnetic particles can be Fe-Si-B-Cr based amorphous alloy particles, but the embodiments are not limited to this.

[0025] Each of the ferrite and metallic magnetic particles may have an average diameter of about 0.1 μm to about 30 μm, but embodiments thereof are not limited thereto.

[0026] The body 100 may include two or more different types of magnetic materials dispersed in a resin. Here, different types of magnetic materials may mean that the magnetic materials dispersed in the resin can be distinguished from each other by at least one of average diameter, composition, crystallinity, and shape. For example, the body 100 may include two or more magnetic particles with different average diameters.

[0027] The insulating resin may include, alone or in combination, epoxy resin, polyimide, liquid crystal polymer, etc., but its embodiments are not limited thereto.

[0028] The body 100 may include a core 110. The core 110 may refer to the portion of the body 100 that penetrates the coil 300 described below. The core 110 may be disposed in the internal region of the coil 300 forming at least one turn, and the cross-section of the core 110 may have a circular or elliptical shape.

[0029] The coil 300 can be disposed in the main body 100 and can exhibit the characteristics of the coil assembly 1000. For example, when the coil assembly 1000 according to the embodiment is used as a power inductor, the coil 300 can store the electric field as a magnetic field and can maintain the output voltage, thereby stabilizing the power of the electronic device.

[0030] The coil 300 may include: a winding portion 310 forming at least one turn relative to the core 110; and leads 331 and 332 connected to the winding portion 310 and the lead frames 400 and 500 described below.

[0031] Reference Figure 1 and Figure 6 The winding portion 310 can form multiple turns from the core 110 toward the outside of the body 100 in a first direction (X direction) and a second direction (Y direction). The winding portion 310 can be configured to be parallel to the lower surface 105 of the body 100, and the winding axis of the winding portion 310 can be formed to be parallel to a third direction (Z direction).

[0032] The winding portion 310 can be wound into a circular or elliptical shape, and the core 110 can be located in the center of the winding portion 310.

[0033] The first lead 331 and the second lead 332 can be connected to the two ends of the winding section 310, respectively, and can be connected to the lead frames 400 and 500 in the main body 100. That is, relative to Figure 5 Specifically, the first lead 331 can be connected to the first lead frame 400, and the second lead 332 can be connected to the second lead frame 500.

[0034] Reference Figure 3A The cross-section of the first lead 331 may have a rectangular shape. When the first lead 331 is rolled and disposed on the first lead frame 400, the surface of the first lead 331 and the surface of the first lead frame 400 may be engaged with each other. That is, the first lead 331 and the first lead frame 400 may perform surface bonding.

[0035] At least a portion of the first lead 331 and at least a portion of the second lead 332 may be disposed in the main body 100. (Refer to...) Figure 5 The first lead 331 and the second lead 332 may be disposed in the body 100 and may extend to the first side surface 101 and the second side surface 102, respectively. The first lead 331 and the second lead 332 may not protrude from the first side surface 101 and the second side surface 102 of the body 100. For this purpose, the body 100 may form grooves to accommodate the first lead 331 and the second lead 332.

[0036] The first lead 331 and the second lead 332 may include contact portions that contact the side surface portions 420 and 520 described below, and a bent portion disposed on the upper part of the contact portion. (Refer to...) Figure 2 The first lead 331 can be bent in the bend and can contact the first lead frame 400 in the contact portion. (Refer to...) Figure 5 The bent portion may not contact the lead frame, and the bent portion may not protrude outward from the main body.

[0037] Coil 300 may be a hollow coil, may be constructed as a metal wire (MW) with a circular cross-section, and may be constructed as a flat coil, but its embodiments are not limited thereto.

[0038] The coil 300 can be formed by winding conductive metal wire, and the portion of the coil 300, except for the portion that contacts the lead frames 400 and 500 described below, can be coated with an insulating film. Specifically, the coil 300 can be formed by winding a metal wire (MW) (such as copper wire (Cu wire)) comprising conductive metal wire and an insulating film covering the surface of the conductive metal wire into a spiral shape. Additionally, the coil 300 can be wound around an axis extending in a third direction (Z direction).

[0039] Reference Figure 5 The first lead 331 can extend to the first side surface 101 in a region where the height is higher than the center line M parallel to the upper surface 106 and the lower surface 105 in the third direction (Z direction) of the body 100. That is, the first lead 331 can be a high center terminal structure formed in a region where the height is higher than the center line M.

[0040] Reference Figures 1 to 3A as well as Figures 4 to 6 The lead frames 400 and 500 can be disposed on the first side surface 101 and the second side surface 102 of the body 100 from the internal region of the body 100, and can serve as the external electrodes of the coil assembly according to the embodiment.

[0041] The lead frames 400 and 500 may include a first lead frame 400 disposed on a first side surface 101 of the body 100 and a second lead frame 500 disposed on a second side surface 102 of the body 100. The first lead frame 400 may be connected to a first lead 331 in the body 100, and the second lead frame 500 may be connected to a second lead 332 in the body 100.

[0042] The first lead frame 400 will be described in detail, but the same description can be applied to the second lead frame 500, and a repeated detailed description of the second lead frame 500 may not be provided.

[0043] The first lead frame 400 may include: an anchoring portion 410 having at least a portion disposed in the body 100; a side surface portion 420 disposed at a first side surface 101 of the body 100; and a lower surface portion 430 disposed at a lower surface 105 of the body 100.

[0044] At least a portion of the anchoring part 410 may be disposed in the body 100, and the anchoring effect can increase the bonding strength between the lead frame 400 and the body 100, and prevent the lead frame 400 from falling off.

[0045] The anchoring portion 410 may include a first anchoring portion 411 and a second anchoring portion 412 spaced apart from each other in a second direction. The first anchoring portion 411 and the second anchoring portion 412 may be spaced apart from the first lead wire 331. That is, the first anchoring portion 411 and the second anchoring portion 412 may be spaced apart from each other and the first lead wire 331 is located between the first anchoring portion 411 and the second anchoring portion 412. Furthermore, the distance between the first anchoring portion 411 and the second anchoring portion 412 in the second direction (Y direction) may be greater than the width of the first lead wire 331. Here, the width of the first lead wire 331 may refer to the dimension of the first lead wire 331 in the second direction (Y direction).

[0046] By forming the first anchoring portion 411 and the second anchoring portion 412 to be spaced apart from each other in the second direction (Y direction), the anchoring effect can be maximized without affecting the area of ​​the winding portion 310.

[0047] The first lead frame 400 may have a structure that extends to the first side surface 101 of the body 100 through the anchoring portion 410, and may be bent toward the lower surface 105 of the body 100 through the side surface portion 420 and the lower surface portion 430.

[0048] The side surface portion 420 may be provided on the first side surface 101 of the main body 100. The side surface portion 420 may include an inner surface facing the first side surface 101 and an outer surface opposite to the inner surface.

[0049] Figure 3A It shows along Figure 2 The cross-sectional view taken from line II-II' in the diagram. According to the first embodiment, the first lead 331 of the coil assembly 1000 may have a contact portion that contacts the inner surface of the side surface portion 420. In this case, the contact portion of the first lead 331 may not be exposed to the outer surface of the side surface portion 420.

[0050] Similarly, the bend in the first lead 331 may not be exposed on the outer surface of the side surface portion 420. That is, the bend may be positioned closer to the body 100 than the outer surface of the side surface portion 420, and the bend may not be coplanar with the outer surface of the side surface portion 420.

[0051] In summary, the first lead 331 may not be coplanar with the outer surface of the side surface portion 420. Therefore, the stress generated on the substrate mounting surface may not be directly transmitted to the first lead 331, thereby enabling a coil assembly with high vibration resistance.

[0052] Reference Figure 5 Leads 331 and 332 may extend along the inner surfaces of lead frames 400 and 500 to the lower surface 105 of the body 100. In this case, the contact portion of the first lead 331 may engage with the surface of the first lead frame 400, such that the first lead 331 and the first lead frame 400 may have a T-shaped configuration. For example, the first lead 331 and the first lead frame 400 may contact each other, and the surface of the first lead 331 and the surface of the first lead frame 400 define a T-shaped terminal structure (e.g., as shown in the image). Figure 3A As shown, the cross-section formed by the first lead 331 and the side surface portion 420 is T-shaped. Therefore, the stress applied to the leads 331 and 332 due to vibration can be effectively dispersed, and a coil assembly with high vibration resistance can be achieved.

[0053] Figure 3B This is a comparative example in which the lead 331' is exposed on the outer surface of the side surface portion 420'. When the lead 331' is exposed on the outer surface of the side surface portion 420', the stress generated on the substrate mounting surface can be directly transmitted to the lead 331', thereby making the lead 331' susceptible to vibration.

[0054] In typical coil assemblies, the two ends of the coil in the main body can be soldered to the two ends of the lead frame as points or lines, and open circuit defects may frequently occur due to alignment errors. Furthermore, coil assemblies may be susceptible to vibration due to stress concentration applied to the joints or connecting lines.

[0055] According to an embodiment, the leads and lead frames can be joined to each other on the outer surface of the body, and the leads and lead frames can be surface-jointed. Therefore, joining defects between the leads and lead frames can be prevented, and a coil assembly with high vibration resistance can be achieved.

[0056] Reference Figure 4 The side surface portion 420 may include an opening O that penetrates the first lead frame 400. The opening O penetrates the first lead frame 400 and allows the inner and outer surfaces of the side surface portion 420 to communicate with each other. By forming the opening O, the side surface portion 420 can be smoothly bent from the anchor portion 410 toward the first side surface 101 of the body 100.

[0057] The bent portion of the first lead 331 may not be exposed to the outer surface of the body 100 through the opening O. More specifically, the bent portion of the first lead 331 may not be provided in the opening O. Therefore, the first lead 331 may not be coplanar with the outer surface of the first lead frame 400, and may be provided inside the first lead frame 400.

[0058] The lower surface portion 430 may be provided on the lower surface 105 of the main body 100, and may serve as an electrode surface connected to the substrate when mounted on the substrate. (Refer to...) Figure 5 The first lead 331 may also contact the lower surface portion 430. In this case, similar to the side surface portion 420 described above, the first lead 331 may not be exposed on the outer surface of the lower surface portion 430.

[0059] Lead frames 400 and 500 may include metals such as copper (Cu), silver (Ag), palladium (Pd) and nickel (Ni), and there are no restrictions on the type of material, as long as the material is a conductive metal.

[0060] The coil assembly 1000 according to the first embodiment may further include metal layers 440 and 540. (See also...) Figure 3A And in conjunction with what will be described later Figure 7 Metal layers 440 and 540 may cover the inner and outer surfaces of side surface portions 420 and 520, as well as leads 331 and 332.

[0061] Metal layers 440 and 540 may be configured to bond leads 331 and 332 to lead frames 400 and 500, and may be formed by processes such as dipping or soldering. Metal layers 440 and 540 may include nickel (Ni), tin (Sn), copper (Cu), etc., and may include multiple layers. For example, a tin (Sn) cladding may cover the T-shaped terminal structure defined by the surfaces of leads 331 and 332 and the surfaces of lead frames 400 and 500.

[0062] In addition, similar to anchoring portion 410, anchoring portion 510 may include a first anchoring portion 511 and a second anchoring portion 512 spaced apart from each other in a second direction.

[0063] Figure 7 This is a diagram illustrating a method for joining a lead frame and leads according to a first embodiment.

[0064] Lead frames 400 and 500 and coil 300 can be prepared. In this case, for coil 300, the insulating film formed on leads 331 and 332 can be removed to bond leads 331 and 332 to lead frames 400 and 500. The leads 331 and 332 of coil 300, after the insulating film has been removed, can be roll-formed, and the roll-formed coil leads can have a rectangular cross-section as described above. Furthermore, the thickness of roll-formed leads 331 and 332 can be from 0.15 mm to 0.2 mm. The thickness of lead frames 400 and 500 can be greater than or equal to 0.2 mm. The thickness of lead frames 400 and 500 can be greater than the thickness of roll-formed leads 331 and 332, in which case the stress reduction effect can be maximized.

[0065] The width of the rolled leads 331 and 332 can be greater than or equal to 0.1 mm. The width of the lead frames 400 and 500 can be greater than or equal to 2.5 mm. Similarly, the width of the lead frames 400 and 500 can be greater than the width of the rolled leads 331 and 332.

[0066] Subsequently, processes such as impregnation or soldering can be used to bond the lead frames 400 and 500 to the surfaces of the leads 331 and 332 using metal layers 440 and 540. The bonded lead frames 400 and 500, as well as the leads 331 and 332, may have a shape similar to a T-beam.

[0067] (Second Embodiment) Figure 8 This is a perspective view showing a coil assembly according to a second embodiment. Figure 9 It is shown Figure 8 The diagram shows the lead frame and leads. Figure 10 It is shown Figure 8 A diagram of the lead frame in the diagram. Figure 11 It is along Figure 8 The cross-sectional view taken from line III-III' in the diagram.

[0068] In the coil assembly 2000 according to the second embodiment, the shapes of the anchoring portions 410 and 510 may differ from those in the first embodiment.

[0069] The differences between the coil assembly according to the second embodiment and the first embodiment will be described in detail below.

[0070] Reference Figures 8 to 11 According to the second embodiment, the anchoring portion 410 of the coil assembly 2000 may have a triangular prism shape. Furthermore, the first anchoring portion 411 and the second anchoring portion 412 may include a through-hole H penetrating the anchoring portion, and a portion of the body 100 may be disposed in the through-hole H. By disposing a portion of the body 100 in the through-hole H, the anchoring effect can be maximized, and the circulation of magnetic flux can be promoted.

[0071] The description of other components may be the same as that of the first embodiment, and may not be repeated.

[0072] (Third embodiment) Figure 12 This is a perspective view showing a coil assembly according to a third embodiment. Figure 13 It is shown Figure 12 The diagram shows the lead frame and leads. Figure 14 It is shown Figure 12 A diagram of the lead frame in the diagram. Figure 15 It is along Figure 12 The cross-sectional view taken from line IV-IV' in the diagram.

[0073] In the coil assembly 3000 according to the third embodiment, the shapes of the anchoring portions 410 and 510 may differ from those in the first embodiment.

[0074] The differences between the coil assembly according to the third embodiment and the first embodiment will be described in detail below.

[0075] Reference Figures 12 to 15 According to the third embodiment, the first lead frame 400 of the coil assembly 3000 may have an anchoring portion 410. That is, in the case of the coil assembly 3000 according to the third embodiment, the anchoring portion may be configured to connect the plurality of anchoring portions (first anchoring portion and second anchoring portion) in the first embodiment to each other.

[0076] The anchoring portion 410 can contact the first lead wire 331. Specifically, the first lead wire 331 can be disposed on the lower surface of the anchoring portion 410 (the surface opposite to the lower surface of the main body), and the first lead wire 331 can extend along the lower surface of the anchoring portion 410 to the inner surface of the side surface portion 420.

[0077] Since the lower surface of the anchoring part 410 is in contact with the first lead 331, the joint area between the first lead 331 and the first lead frame 400 can be increased, and open circuit defects can be improved.

[0078] An opening O penetrating the first lead frame 400 may be formed between the anchoring portion 410 and the side surface portion 420. The first lead 331 may not be disposed in the opening O, and the first lead 331 may not be exposed to the outer surface of the lead frame 400 through the opening O.

[0079] The description of other components may be the same as that of the first embodiment, and may not be repeated.

[0080] (Fourth embodiment) Figure 16 This is a perspective view showing a coil assembly according to a fourth embodiment.

[0081] In the coil assembly 4000 according to the fourth embodiment, the positions of leads 331 and 332 may differ from those in the first embodiment.

[0082] Reference Figure 16 According to the fourth embodiment, the leads 331 and 332 of the coil assembly 4000 can be configured to be biased toward one of the third side surface 103 and the fourth side surface 104. Alternatively, the leads 331 and 332 can be configured to be biased toward one of the first anchor portion 411 and the second anchor portion 412. In this way, by adjusting the positions of the leads 331 and 332, the number of turns of the winding portion 310 can be controlled, and the DC resistance (Rdc) can be designed to a desired value.

[0083] The description of other components may be the same as that of the first embodiment, so repeated descriptions are not required.

[0084] (Fifth Embodiment) Figure 17 This is a perspective view showing a coil assembly according to the fifth embodiment. Figure 18 It is along Figure 17 The cross-sectional view taken from line V-V' in the diagram.

[0085] In the coil assembly 5000 according to the fifth embodiment, the heights of leads 331 and 332 may differ from those in the first embodiment.

[0086] The differences between the coil assembly according to the fifth embodiment and the first embodiment will be described in detail below.

[0087] According to the fifth embodiment, the leads 331 and 332 of the coil assembly 5000 may extend to the side surfaces 101 and 102 in a region at a height equal to or lower than the height of the center line M parallel to the upper surface 106 and the lower surface 105 in the third-order direction of the body 100. In other words, the leads 331 and 332 may be low-center terminal structures formed in a region at a height equal to or lower than the height of the center line M.

[0088] Furthermore, leads 331 and 332 may extend only to the side surfaces 420 and 520, and may not contact the lower surfaces 430 and 530.

[0089] The description of other components may be the same as that of the first embodiment, and may not be repeated.

[0090] According to the foregoing embodiments, a coil assembly with improved vibration resistance can be provided.

[0091] In addition, a coil assembly that can distribute the stress applied to the lead frame can be provided.

[0092] In addition, a coil assembly that can improve the bonding defects between the lead frame and the coil can be provided.

[0093] While embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A coil assembly, comprising: The body includes a first side surface and a second side surface that are opposite to each other in a first direction, and a third side surface and a fourth side surface that are opposite to each other in a second direction, and includes a magnetic material; A coil is disposed in the body and includes a lead extending to the first side surface of the body; as well as A lead frame includes a side surface portion disposed on the first side surface of the body and connected to the lead. The side surface portion includes an inner surface facing the first side surface of the body and an outer surface opposite to the inner surface. The lead wire includes a contact portion that contacts the inner surface of the side surface portion and a bent portion disposed on the upper part of the contact portion, wherein the bent portion is configured to be closer to the body than the outer surface of the side surface portion.

2. The coil assembly according to claim 1, wherein, The bent portion is not coplanar with the outer surface of the side surface portion.

3. The coil assembly according to claim 1, in, The side surface portion includes an opening penetrating the lead frame, and The bent portion is not exposed to the outer surface of the side surface portion through the opening.

4. The coil assembly according to claim 1, wherein, The lead frame further includes a first anchoring portion and a second anchoring portion, at least a portion of the first anchoring portion and at least a portion of the second anchoring portion being disposed in the body and spaced apart from each other in the second direction.

5. The coil assembly according to claim 4, wherein, The first anchoring portion and the second anchoring portion are spaced apart from the lead wire.

6. The coil assembly according to claim 4, wherein, The distance between the first anchoring part and the second anchoring part in the second direction is greater than the width of the lead wire.

7. The coil assembly according to claim 4, wherein, Each of the first anchoring portion and the second anchoring portion includes a through hole, and A portion of the main body is disposed in the through hole.

8. The coil assembly according to claim 1, in, The main body also includes a lower surface and an upper surface that are opposite to each other in a third-party direction and connect the first side surface to the second side surface, and The coil is wound around an axis extending in the third direction.

9. The coil assembly according to claim 8, wherein, The lead frame also includes a lower surface portion, which is connected to the side surface portion and disposed on the lower surface of the body.

10. The coil assembly according to claim 8, wherein, The lead extends to the first side surface and the second side surface in a region at a height higher than the center line parallel to the upper and lower surfaces in the third direction of the body.

11. The coil assembly according to claim 8, wherein, The lead extends to the first side surface and the second side surface in a region at a height equal to or lower than that of the body, at the height of a center line parallel to the upper and lower surfaces in the third direction.

12. The coil assembly according to claim 4, wherein, The lead wire is positioned close to one of the first anchoring part and the second anchoring part.

13. The coil assembly of claim 1, further comprising: A metal layer covering the inner and outer surfaces of the side surface portion and the lead wire.

14. The coil assembly according to claim 1, in, The lead frame further includes an anchoring portion, at least a portion of which is disposed in the body and contacts the lead wire. The lead wire is disposed on the lower surface of the anchoring part.

15. The coil assembly according to claim 1, wherein, The thickness of the lead frame is greater than or equal to 0.2 mm.

16. The coil assembly according to claim 1, wherein, The thickness of the lead wire is greater than or equal to 0.15 mm and less than or equal to 0.2 mm.

17. The coil assembly according to claim 1, wherein, The lead wire and the lead frame are in contact with each other, and the surface of the lead wire and the surface of the lead frame define a T-shaped terminal structure.

18. The coil assembly of claim 17, further comprising a tin (Sn) coating covering the T-terminal structure.

19. The coil assembly according to any one of claims 1 to 18, the coil assembly further comprising another lead frame, the coil further comprising another lead extending to the second side surface of the body, and the other lead frame comprising another side surface portion disposed on the second side surface of the body and connected to the other lead.

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