Method for transforming connector and high-speed connector formed by same

Abstract

The invention discloses a method for transforming a connector and a high-speed connector formed by the same. The method comprises the following steps: respectively coating dielectric materials on partial line segments of signal terminals in a socket end and a matched plug end of the connector, and selectively combining with two modifications proposed on a circuit board in the plug end of the connector, so as to increase the transmission bandwidth of the connector and improve the data transmission rate of the connector.

Description

Technical Field

[0001] This invention relates to a method for modifying a connector and the resulting high-speed connector, particularly a high-speed connector that can improve the resonance problem of the connector in a specific frequency range and the method for forming the connector. Background Technology

[0002] In 2022, the European Parliament passed legislation formally standardizing charging interfaces for consumer electronics, allowing for easier interchangeability and consistent charging power between devices. The advantage of a unified charging interface is that a single cable can replace the various cables used in the past, significantly reducing electronic waste. Since the legislation mandated the use of USB Type-C as the charging interface for two years following 2022, it established USB Type-C as the future mainstream interface.

[0003] Compared to other USB interfaces, the smaller internal space of the USB Type-C connector results in very close spacing between the differential transmission lines (hereinafter referred to as "signal terminals"). This can cause coupling interference during transmission, leading to resonance and increased transmission loss. Furthermore, the mechanical design of the USB Type-C connector, to meet the insertion and extraction forces during connection or to support the signal terminals, requires bending of the signal terminals and the use of plastic materials and insulators within the connector. This causes parasitic effects on the signal terminals or changes in their equivalent circuit parameters, thus affecting the transmission bandwidth and signal transmission rate.

[0004] Because current USB Type-C connectors on the market only meet the USB 3.2 Gen2 specification, the signal terminals at the socket and plug ends of these connectors resonate between 8GHz and 15GHz, limiting their passband bandwidth to below 8GHz and making them unsuitable for high-speed data transmission. Therefore, the inventors of this paper propose a method to modify a general USB Type-C connector to solve the aforementioned resonance problem and enable the modified connector to meet the mandatory requirements of USB 4 Gen3 (as shown in Table 1 below), thereby achieving a higher transmission rate.

[0005] Table 1: Mandatory Specification Requirements for USB4 Gen3

[0006]

[0007] Summary of the Invention

[0008] One objective of this invention is to provide a high-speed connector that meets the mandatory requirements of the USB4 Gen3 specification.

[0009] Another objective of this invention is to provide a method for modifying a connector. This method uses a commercially available connector as the hardware base and makes minor modifications to form a high-speed connector. This solves the problem of unexpected resonance of the differential transmission line inside a conventional connector within a specific frequency range and reduces the insertion loss during signal transmission within that specific frequency range, thereby providing a wider signal transmission passband to achieve a faster data transmission rate.

[0010] To achieve the above objectives, the present invention provides a high-speed connector comprising a receptacle end and a plug end mated to the receptacle end. The receptacle end includes two adjacent first signal terminals and a first dielectric body, wherein each of the two adjacent first signal terminals includes two first line segments with a ramp structure, wherein a first gap exists between the two first line segments, and the first dielectric body at least covers the surfaces of the two first line segments and fills the first gap. The plug end has two adjacent second signal terminals and a second dielectric body, wherein each of the two adjacent second signal terminals includes two second line segments, wherein a second gap exists between the two second line segments, and the second dielectric body at least covers the surfaces of the two second line segments of the two adjacent second signal terminals and fills the second gap located between the surfaces of the two second line segments.

[0011] In one embodiment, the dielectric constant of the first dielectric and the second dielectric is 5 to 9, for example, 5 to 7, 5 or 7.

[0012] In one embodiment, when the dielectric constant of the first dielectric or the second dielectric is 5, its cross-section has a double-hole structure.

[0013] In one embodiment, when the dielectric constant of the first dielectric or the second dielectric is 7, its cross-section has an I-shaped structure.

[0014] On the other hand, the present invention also provides a method for modifying a connector, the method comprising: providing a connector, wherein the connector includes a receptacle end and a plug end that mates with the receptacle end, wherein the receptacle end includes two adjacent first signal terminals, each of the two adjacent first signal terminals including two first line segments having a ramp structure, wherein a first gap exists between the two first line segments, wherein the plug end includes two adjacent second signal terminals, each of the two adjacent second signal terminals including two second line segments, wherein a second gap exists between the two second line segments; providing a first dielectric for covering the surfaces of the two first line segments of the two adjacent first signal terminals and filling the first gap located between the surfaces of the two first line segments; and providing a second dielectric for covering the surfaces of the two second line segments of the two adjacent second signal terminals and filling the second gap located between the surfaces of the two second line segments.

[0015] In one embodiment, the step of providing the first dielectric material includes: when a dielectric material with a dielectric constant of 5 is selected as the first dielectric material, the first dielectric material fills two gaps between the two adjacent first signal terminals and the first ground terminals on both sides to form a double-hole structure; or when a dielectric material with a dielectric constant of 7 is selected as the first dielectric material, the cross-section of the first dielectric material forms an I-shaped structure.

[0016] In one embodiment, the step of providing the second dielectric includes: when a dielectric material with a dielectric constant of 5 is selected as the second dielectric, the second dielectric fills two gaps between the two adjacent second signal terminals and the second ground terminals on both sides to form a double-hole structure; or when a dielectric material with a dielectric constant of 7 is selected as the second dielectric, the cross-section of the second dielectric forms an I-shaped structure.

[0017] In one embodiment, each of the two second signal terminals at the plug end has one end connected to a circuit board via a solder pad, the circuit board having an internal ground plane. The method further includes selecting one of the following two designs for subsequent modification: reducing the area of ​​the solder pad; or forming a slot in a portion of the ground plane and positioning the slot directly below the solder joint between the second signal terminal and the solder pad.

[0018] Based on the above, the modification method of the present invention can solve the resonance problem encountered by commercially available connectors between 8GHz and 15GHz in a simple structural improvement and in a more time-saving and cost-effective manner, so that the data transmission rate of the modified high-speed connector can be improved to meet the level of USB4 Gen3 specification. Attached Figure Description

[0019] Figure 1This is a schematic flowchart of a method for modifying a connector according to one embodiment of the present invention.

[0020] Figure 2A This is a schematic diagram of the socket end structure of a high-speed connector according to one embodiment of the present invention before modification.

[0021] Figure 2B This is a schematic diagram of the plug end structure of a high-speed connector before modification, according to one embodiment of the present invention.

[0022] Figure 3 It is along Figure 2B A schematic diagram of the cross-sectional structure of the plug end cut by the AA cutting line.

[0023] Figure 4 This is a schematic diagram of the predetermined modification position of the plug end according to one embodiment of the present invention.

[0024] Figure 5A This invention illustrates the modified socket end structure according to one embodiment of the present invention; Figure 5B and Figure 5C The first dielectric (ε) on the signal terminal of the display socket. r =7) Its top and side view diagrams; Figure 5D This diagram shows the cross-section of the first dielectric material on the signal terminal of the display socket, which has an I-shaped structure.

[0025] Figure 6A This invention illustrates a modified plug end structure according to one embodiment of the present invention; Figure 6B Display plug terminal and second dielectric (ε) r Enlarged diagram of (=7); Figure 6C and Figure 6D Showing top and side views of the second dielectric on the signal terminal of the plug; Figure 6E The diagram shows the cross-section of the second dielectric on the signal terminal of the plug, which has an I-shaped structure.

[0026] Figure 7A This invention illustrates the modified socket end structure according to one embodiment of the present invention; Figure 7B and Figure 7C The first dielectric (ε) on the signal terminal of the display socket. r =5) Its top and side view diagrams; Figure 7D This diagram shows a double-hole structure in the cross-section of the first dielectric material on the signal terminal of the display socket.

[0027] Figure 8A This invention illustrates a modified plug end structure according to one embodiment of the present invention; Figure 8B for Figure 8A The top view includes the insulating plate attached to its bottom; Figure 8C Display plug terminal and second dielectric (ε) rEnlarged diagram of (=5); Figure 8D and Figure 8E Showing top and side views of the second dielectric on the signal terminal of the plug; Figure 8F The diagram shows a double-hole structure in the cross-section of the second dielectric on the signal terminal of the plug.

[0028] Figure 9A and Figure 9B This is a schematic diagram of the modified solder pad structure of the plug end according to one embodiment of the present invention.

[0029] Figures 10A to 10C This is a schematic diagram showing the modification of the ground plane layer of the circuit board on the plug end according to one embodiment of the present invention.

[0030] Figure 11 This is a cross-sectional view of the connector end of the plug, where the signal terminal connects to the circuit board, according to one embodiment of the present invention, showing the location of the slot in the ground plane.

[0031] Figure 12 This is a layered schematic diagram showing the modification of the circuit board ground plane layer of the plug end according to one embodiment of the present invention. Detailed Implementation

[0032] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of the embodiments in conjunction with the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, these directional terms are for illustrative purposes only and are not intended to limit the present invention.

[0033] This invention provides a method for modifying a connector, which modifies the hardware of a commercially available connector to form a high-speed connector that conforms to the USB4 Gen3 specification, thereby solving the problem of unexpected resonance in the frequency range of 8GHz to 15GHz and reducing the insertion loss during signal transmission in this frequency range, thereby providing a wider signal transmission passband to achieve a faster data transmission rate.

[0034] In the following description, the term "connector" refers to a kit consisting of a plug end and a socket end that mates with the plug end.

[0035] Please refer to Figure 1 The modification method of the present invention includes the following steps:

[0036] Step (S11): Cover a portion of the line segments of two adjacent signal terminals (also referred to as "signal transmission lines", "differential transmission lines" or "signal pins") inside the connector "socket end" with a dielectric material with a dielectric constant εr of 5 to 9 or preferably 5 to 7, and the dielectric material simultaneously fills the gap between the two portion of the line segments.

[0037] II. Step (S12): In this invention, in addition to providing a dielectric material at the socket end, the partial segments of two adjacent signal terminals inside the connector "plug end" must also be covered with a dielectric material with a dielectric constant εr of 5 to 9 or preferably a dielectric constant εr of 5 to 7, and the dielectric material simultaneously fills the gap between the two partial segments.

[0038] The dielectric constants of the two dielectrics provided to the socket end and the plug end can be the same or different.

[0039] 3. Step (S13): With dielectric material added to the signal terminal segments of both the socket and plug ends, further modifications are made to the circuit board connecting the "plug end". This can be achieved by choosing one of the following two modification methods (S21) and (S22):

[0040] 1. Modify solder pads (S21): Reduce the area of ​​the solder pads, for example: modify the width and / or length of the residual segments of the solder pads connecting the circuit board to the signal terminals; or

[0041] 2. Modify the ground plane layer of the circuit board (S22): Form a slot in the ground plane layer of the circuit board and position the slot directly below the solder joint between the circuit board and the signal terminal. For example, create a slot in the ground plane layer of the circuit board so that the slot exists only in the ground plane layer but does not penetrate the substrate layer above and below the ground plane layer.

[0042] Choosing either of the two modification methods (S21) and (S22) above to cooperate with steps (S11) and (S12) can achieve similar results, thereby solving the resonance problem of the signal terminal in the 8GHz to 15GHz frequency band and improving the transmission loss in this frequency band, so that the transmission passband of the signal terminal can be extended to the previous high frequency, thereby providing a wider signal transmission passband and achieving a faster data transmission rate.

[0043] Since the plug end of the USB Type-C interface connector conforming to the USB 3.2 Gen 2 specification is designed for plug-and-play operation and supports the connection of various devices, its main functions are to provide signal transmission and power supply. It plays a crucial role in signal transmission and is currently the most widely used connector type for high-speed data transmission. Therefore, the following embodiments use existing USB Type-C interface connectors conforming to the USB 3.2 Gen 2 specification as the modification object to more specifically illustrate the connector modification method of the present invention.

[0044] The following embodiments are all based on a commercially available USB Type-C interface connector that meets the USB 3.2 Gen 2 specification. Both the plug and socket ends of this connector have roughly symmetrical internal structures. This USB Type-C connector only achieves a data transfer rate of 10Gbps, which is only within the USB 3.2 Gen 2 specification. This invention addresses the resonance problem of this USB Type-C connector between 8GHz and 15GHz, making it meet the USB4 Gen 3 specification defined by the USB-IF. This results in transmission loss only becoming significant after 16GHz, allowing a data transfer rate of 40Gbps.

[0045] Figure 2A , 2B and Figure 3 The image shows the structure of a commercially available USB Type-C connector that meets the USB 3.2 Gen 2 specification (hereinafter also referred to as "commercial connector", "standard connector" or "commercial model") before modification. Figure 2A The circuit board showing the "socket end" of a commercially available connector and the signal terminal structure of its upper half. Figure 2B The circuit board showing the "plug end" of a commercially available connector and the signal terminal structure of its upper half. Figure 3 It is Figure 2B The plug end is filled with the lower half of the signal terminal, and then the cross section is cut along the AA cutting line.

[0046] Figure 2A The display shows two pairs of signal terminals 141S, 142S and 143S, 144S inside the socket 100. Each pair of adjacent signal terminals 141S, 142S is adjacent to two ground terminals 141G, 142G on its outer side, and these terminals are all connected to circuit board 120. This circuit board 120 is the circuit board inside the socket of a signal transmission destination device.

[0047] Figure 2BThe plug end 200 has an internal structure within its housing (not shown) that includes multiple terminals connected to a circuit board 220 via multiple solder pads 225 for high-speed data transmission with a computer or other device. These terminals include multiple signal terminals 241S, 242S, 243S, 244S and ground terminals 241G, 242G.

[0048] Figure 3 This displays the arrangement of layers within the circuit board 220 of the plug end 200 of a commercially available connector. The circuit board 220 includes a substrate 221, an upper ground plane layer 223a, a lower ground plane layer 223b, and solder pads 225. Both the upper ground plane layer 223a and the lower ground plane layer 223b are embedded within the substrate 221 and are electrically isolated from each other by the substrate 221. Solder pads 225 are disposed on the upper and lower surfaces of the substrate 221 for electrical connection with signal terminals 242. The solder pads 225 and the upper ground plane layer 223a are electrically isolated by a substrate material layer 221a of the substrate 221, and the solder pads 225 and the lower ground plane layer 223b are electrically isolated by another substrate material layer 221b of the substrate 221.

[0049] Figure 4 An insulating plate 210 is provided below the upper row of terminals inside the plug end 200 of a commercially available connector. The insulating plate 210 has a cutout 212, the boundary of which (shown in thick black lines) corresponds to the middle section of signal terminals 241S, 242S, 243S, and 244S and below their rear section away from the circuit board 220. This cutout 212 causes a sharp increase in the differential impedance value of the differential transmission line in this area. Therefore, the present invention covers a portion of the middle section of signal terminals 241S, 242S, 243S, and 244S with a dielectric material, for example, covering a portion of the line located in… Figure 4 A portion of the line segments within the designated modification area 1A is covered with a dielectric material to reduce the differential impedance value of the differential transmission line in that area, bringing the differential impedance value within an acceptable range. This improves the resonance problem in the aforementioned frequency band, resulting in a wider transmission passband and faster data transmission rate.

[0050] First embodiment: A dielectric constant (ε) is added to the signal terminals of both the socket and plug ends of the connector. r =7) dielectric

[0051] 1-1. Modification of the socket terminal

[0052] Figure 5A The modified socket terminal 100A displays signal terminals 141S and 142S responsible for high-speed data transmission. Each of these terminals has ramp segments 141A and 142A, which have a ramp structure similar to a slide. A portion of these two ramp segments 141A and 142A is connected to a dielectric constant ε. rThe dielectric 160A of 7 is used to cover and fill the gap between the two segments to improve the aforementioned resonance problem, thereby achieving a wider transmission passband and a faster data transmission rate.

[0053] Figure 5B for Figure 5A The front view shows the dielectric constant ε of a dielectric material of 160A. r When the value is 7, the length LR of dielectric 160A is, for example, 1 mm; the width WR of dielectric 160A is approximately equal to the sum of the two widths WR0 of signal terminals 141S and 142S inside socket terminal 100A, and the width WR1 of the gap 1412 between the two signal terminals 141S and 142S. For example, the width WR of dielectric 160A is 0.7 mm; the widths WR0 of the two signal terminals 141S and 142S are both 0.2 mm; and the width WR1 of the gap 1412 is 0.3 mm.

[0054] Figure 5C for Figure 5A The right-side view of the signal terminal 142S shows the upper and lower surfaces of the ramp segment 142A of the signal terminal 142S covered by the dielectric 160A, but the outer surface of the ramp segment 142A is still exposed. Figure 5D From Figure 5A The dielectric 160A is observed from the top or bottom of the diagram, and the upper or lower side or cross-section of the dielectric 160A is roughly I-shaped. Its left and right notches 161 cover the upper and lower surfaces and inner surfaces of the two signal terminals 141S and 142S, respectively, while the central part is filled in the gap 1412 between the inner surfaces of the two ramp segments 141A and 142A.

[0055] Figure 5C and Figure 5D The thickness HR of dielectric 160A is approximately equal to the sum of the thickness HR0 of signal terminal 141S or 142S and the two thicknesses HR1 of the upper and lower dielectric material layers. For example, the thickness HR of dielectric 160A is 0.42mm; the thickness HR0 of signal terminals 141S and 142S is 0.1mm; and the thickness HR1 of the upper and lower dielectric material layers is 0.16mm.

[0056] 1-2. Modification of the plug end

[0057] Figure 6A The modified plug terminal 200A is shown, which places two adjacent signal terminals 241S, 242S (or / and two adjacent signal terminals 243S, 244S) at... Figure 4 A portion of the line segments in the modified region 1A are connected by a dielectric constant ε. rThe dielectric 260A of 7 is covered and the gap 2412 between them is filled to improve the resonance problem in the above frequency band, so as to have a wider transmission passband and achieve a faster data transmission rate.

[0058] Figure 6B for Figure 6A A partial view showing the distance D between the initial covering position of dielectric 260A on signal terminals 241S, 242S of plug end 200A and the fixed end of the signal terminals 241S, 242S, for example, 4.6 mm. Figure 6C for Figure 6A The top view shows that the dielectric 260A has a length LT of, for example, 0.8 mm and a width WT of, for example, 0.7 mm.

[0059] Figure 6D From Figure 6B Looking at the upper and lower surfaces of the portion of the line segment covered by the dielectric 260A covering the signal terminal 242S from below the diagram, it is shown that the outer surface of the signal terminal 242S is still exposed. Figure 6D The thickness HT of dielectric 260A is approximately equal to the sum of the thickness HT0 of signal terminals 241S and 242S and the two thicknesses HT1 of the upper and lower dielectric material layers. For example, the thickness HT of dielectric 260A is 0.775mm; the thickness HT0 of signal terminals 241S and 242S is for example 0.225mm; and the thickness HT1 of the upper and lower dielectric material layers is for example 0.275mm.

[0060] Figure 6E for Figure 6B The right-side view of the figure shows that the side or cross-section of the dielectric 260A is approximately I-shaped, with the left and right notches 261 covering the upper and lower surfaces and inner surfaces of the two signal terminals 241S and 242S respectively, and the central part filling the gap 2412 between the inner surfaces of the two signal terminals 241S and 242S. Figure 6E This shows the dielectric constant ε of the dielectric material at 260A. r When the value is 7, the width WT of dielectric 260A is approximately equal to the sum of the widths WT0 of the two signal terminals 241S and 242S inside the plug end 200A and the width WT1 of the gap 2412. For example, the width WT of dielectric 260A is 0.7mm; the widths WT0 of the two signal terminals 241S and 242S are both 0.2mm; and the width WT1 of the gap 2412 is 0.3mm.

[0061] Second embodiment: A dielectric material with a dielectric constant (εr = 5) is added to the signal terminals of both the socket and plug ends of the connector.

[0062] like Figure 7A and Figure 7B ,and Figure 5A and Figure 5B Compared to dielectric 160A (εr = 7), dielectric 160B (εr = 5) in this embodiment has a lower dielectric constant, requiring a wider coverage area and a larger volume. Therefore, the shape of dielectric 160B is also different from that of dielectric 160A, in order to achieve the same effect as dielectric 160A. Figure 5A and Figure 5B Quite effective.

[0063] 2-1. Modification of the socket terminal

[0064] Figure 7A The display shows that inside the socket end 100B, a portion of the ramp segments 141A and 142A of its signal terminals 141S and 142S are covered by a dielectric 160B with a dielectric constant εr of 5, and fills the gap 1412 between the two signal terminals 141S and 142S, the gap 1413 between the signal terminal 141S and the ground terminal 141G, and the gap 1423 between the signal terminal 142S and the ground terminal 142G.

[0065] Figure 7B for Figure 7A The front view shows that when the dielectric constant εr of dielectric 160B is 5, the width WRB of dielectric 160B is approximately equal to the sum of the two widths WR0 of signal terminals 141S and 142S inside socket 100B, the width WR1 of gap 1412, and the two widths WR2 of gaps 1413 and 1423.

[0066] Figure 7C for Figure 7A The right-side view of the signal terminal 142S shows the upper, lower, and outer surfaces of the ramp segment 142A portion of the signal terminal 142S covered by the dielectric 160B. Figure 7D From Figure 7A Viewed from the top or bottom of the diagram, one side or cross-section of dielectric 160B is shown, revealing that this side or cross-section has two through-holes 162 that can respectively annularly cover two signal terminals 141S and 142S. The central portion and two sides of dielectric 160B are filled with three gaps 1412, 1413, and 1423, respectively. The thickness HRB of dielectric 160B is approximately equal to the sum of the thickness HR0 of signal terminals 141S and 142S and the two thicknesses HR1 of the upper and lower dielectric material layers. For example, the length LRB of dielectric 160B at socket end 100B is 1 mm; the width WRB of dielectric 160B is 1.25 mm; and the thickness HRB of dielectric 160B is 0.42 mm.

[0067] 2-2. Modification of the plug end

[0068] Figure 8A The display shows that the two signal terminals 241S, 242S (or / and the two adjacent signal terminals 243S, 244S) inside the plug end 200B are located in Figure 4 A portion of the line segments in the modified region 1A are connected by a dielectric constant ε. r The dielectric 260B of 5 is covered and filled with the gap 2412 between the two signal terminals 241S and 242S, the gap 2413 between the signal terminal 241S and the ground terminal 241G, and the gap 2423 between the signal terminal 242S and the ground terminal 242G.

[0069] Figure 8B In the middle, the dielectric 260B is positioned at... Figure 4 In the planned renovation area 1A.

[0070] Figure 8C for Figure 8A A partial view showing the distance D between the initial covering position of dielectric 260B on signal terminals 241S, 242S of plug end 200B and the fixed end of the signal terminals 241S, 242S. Figure 8D for Figure 8A The top view shows the dielectric constant ε of dielectric 260B. r When the value is 5, the width WTB of dielectric 260B is approximately equal to the sum of the two widths WT0 of signal terminals 241S and 242S inside plug end 200B, the width WT1 of gap 2412, and the two widths WT2 of gaps 2413 and 2423. Figure 8E From Figure 8B Observing the signal terminal 242S from one side, the dielectric 260B covering the signal terminal 242S shows that the outer surface of the signal terminal 242S is also covered. Figure 8F From Figure 8A Viewed from the right side of the diagram, one side or cross-section of dielectric 260B is shown, revealing that this side or cross-section has two through-holes 262 that can annularly enclose two signal terminals 241S and 242S. The central portion and two sides of dielectric 260B are filled with three gaps 2412, 2413, and 2423, respectively. The thickness HTB of dielectric 260B is approximately equal to the sum of the thickness HT0 of signal terminals 241S and 242S and the two thicknesses HT1 of the upper and lower dielectric material layers. For example, the length LTB of dielectric 260B at plug end 200B is 0.8 mm; the width WTB is 1.3 mm; and the thickness HTB is 0.775 mm.

[0071] In the above embodiments, the dielectric constants of the two dielectrics provided to the socket end and the plug end may be the same or different, but the volumes corresponding to dielectrics with different dielectric constants are different. The volume is related to the surface area of ​​the signal terminal covered by the dielectric, the number of gaps filled, and the size of the gaps.

[0072] Third embodiment: Add dielectric material to the signal terminal and reduce the width of the solder pad and the length of its residue.

[0073] like Figure 9A As shown, the third embodiment first adds a dielectric to the signal terminal according to the methods of the first two embodiments, and then further... Figure 2B The area of ​​the solder pads 225 connecting the signal terminals 241S, 242S, 243S, and 244S of the plug end 200 to the circuit board 220 is reduced. Figure 9B It is Figure 9A Signal terminals 243S and 244S are omitted, and the modified pad 225A is shown.

[0074] In this embodiment, the solder pad 225 is modified by reducing its width on both sides and shortening its remaining section, while retaining a larger width on both sides of the solder joint to form two protruding portions. These two protruding portions are referred to as two side wings 2252 in this embodiment. This is to prevent errors or misalignments from occurring during the assembly of the circuit board 220 with the signal terminals 241S, 242S, 243S, and 244S, which could affect the electrical connection. Furthermore, if the length of the remaining section of the solder pad 225 remains unchanged, only its width is narrowed, which is sufficient to change the equivalent circuit parameters of the differential transmission line in this area, thereby further improving the transmission loss problem caused by resonance in a specific frequency band. In one embodiment, the original solder pad 225 has a length of 1.45 mm and a width of 0.35 mm; the modified solder pad 225A has a length of 1.22 mm and a width of 0.2 mm, and the two side wings 2252 of the solder pad 225A have a length of 0.139 mm and a width of 0.075 mm.

[0075] Fourth embodiment: Add dielectric material to the signal terminals and form slots in the ground plane of the circuit board.

[0076] like Figure 10AAs shown, the fourth embodiment, based on the method of the first or second embodiment where dielectric material has already been added to the signal terminals, does not modify the area of ​​the solder pads 225. Instead, it further removes copper from the upper ground plane layer 223a of the circuit board 220. Specifically, copper is removed from a specific area of ​​the upper ground plane layer 223a or lower ground plane layer 223b of the circuit board 220 at the connector end 200A or 200B to form a slot 223h. For example, the slot 223h in the upper ground plane layer 223a does not penetrate the substrate 221 below the upper ground plane layer 223a or the substrate material layer 221a above it. This method can also change the equivalent circuit parameters of the differential transmission line in this area, thereby further improving the transmission loss problem caused by resonance in a specific frequency band.

[0077] Figure 10B The image shown is a top-enlarged view of the modified area 4 where the signal terminals 241S and 242S of the plug end 200A or 200B connect to the circuit board 220. To more clearly show the location of the slot 223h, [the image is cut off here]. Figure 10B and Figure 10C The substrate material layer 221a above the substrate 221 is omitted; and in Figure 10C The signal terminals 241S, 242S and solder pad 225 are further concealed. Figure 11 The side view clearly shows that the upper ground plane layer 223a of the circuit board 220 has a slot 223h (indicated by dashed lines) created by copper removal. It is located directly below the solder pad 225, but separated from the solder pad 225 by the substrate material layer 221a of the substrate 221. Figure 12 This displays an exploded view of each layer of the circuit board 220 at connector 200A or 200B. The solder pads 225 are embedded on the upper and lower surfaces of the substrate material layers 221a and 221b of the substrate 221; the upper ground plane layer 223a and the lower ground plane layer 223b are both inside the substrate 221; the lower solder pads 225 and the lower ground plane layer 223b are separated by another substrate material layer 221b of the substrate 221.

[0078] In the above embodiments, the shape and size of the dielectric can still achieve good spectral response even with variations within a certain range, and minor adjustments can be made according to design requirements.

[0079] To verify the effectiveness of this invention, the inventors researched and designed the TDR response diagram, spectrum response diagram, and ILfitatNq diagram of the signal terminals of the modified connector model and a commercially available connector model, and compared them. The TDR response diagram shows that after the overall modification by the method of this invention, the TDR impedance performance is more gradual compared to the commercially available model, making it less prone to reflection during transmission. The spectrum response diagram shows that in terms of transmission loss performance, it is clear that the modified model of this invention only shows significant loss after 16GHz. The ILfitatNq diagram shows that the modified model of this invention can meet the specification requirements of differential insertion loss fitting (ILfitatNq) at the Nyquist frequency in item 1 of Table 1. This specification is mainly achieved by selecting the insertion loss at several different frequency points and using Curve Fitting to obtain a smoother frequency response.

[0080] Table 2 below shows that the modified models according to the various embodiments of the present invention can all meet the specifications in items 2 to 7 of Table 1.

[0081] Table 2: Comparison of USB4 Gen3 Specification Requirements and Specifications Achievable by This Invention

[0082]

[0083]

[0084] The research results also show that the high-speed connector formed by modifying commercially available connectors using the method of this invention exhibits a different-to-common mode conversion parameter S. cd12 and S cd21 All meet the specifications in item 8 of Table 1, namely S cd12 and S cd21 The requirement is that the value must be less than -20dB in the frequency range of 100MHz to 10.0GHz.

[0085] In summary, the embodiments of this invention modify the existing hardware of a USB Type-C connector that meets the USB 3.2 Gen2 specification. By simply adding dielectric material to the existing differential transmission line and selectively modifying the solder pads on the PCB board at the connector end or introducing slots in its ground plane, the unexpected resonance problem within a specific frequency range can be solved, and the insertion loss during signal transmission within that specific frequency range can be reduced, thereby providing a wider signal passband and faster signal transmission speed. This invention does not damage the original differential transmission line structure and does not require additional costs for mold production. Modifying the solder pads on the PCB board or introducing slots in the ground plane does not increase production costs, thus simultaneously achieving cost savings and meeting the USB 4 Gen3 specification requirements set by the USB-IF.

[0086] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Any simple equivalent changes and modifications made in accordance with the claims and description of the invention are still within the scope of the patent. Furthermore, no embodiment or claim of the present invention needs to achieve all the objectives, advantages, or features disclosed in the invention. In addition, the abstract and headings are merely for assisting in patent document searches and are not intended to limit the scope of the invention.

[0087] [Symbol Explanation]

[0088] Socket end 100

[0089] The modified socket terminal is 100A.

[0090] Circuit board 120

[0091] Slope segments 141A, 142A

[0092] Signal terminals 141S, 142S, 143S, 144S

[0093] Grounding terminals 141G, 142G

[0094] The gap 1412 between the two signal terminals at the socket end

[0095] The gaps 1413 and 1423 between the signal terminal and the grounding terminal at the socket end

[0096] (Socket end) Dielectric 160A, 160B

[0097] (Socket end) Dielectric notch 161

[0098] (Socket end) Dielectric through hole 162

[0099] (Plug end) Planned renovation area 1A

[0100] Plug end 200

[0101] Modified plug terminals 200A, 200B

[0102] Insulating plate 210

[0103] Excavated section 212

[0104] Circuit board 220

[0105] Substrate 221

[0106] Substrate material layers 221a, 221b

[0107] Upper ground layer 223a

[0108] 223b below ground level

[0109] Slot 223h

[0110] solder pad 225

[0111] Modified solder pad 225A

[0112] flank 2252

[0113] Signal terminals 241S, 242S, 243S, 244S

[0114] Grounding terminals 241G, 242G

[0115] (Between the signal terminal and the ground terminal on the plug) Gap 2413, 2423 (Plug end) Dielectric 260A, 260B

[0116] (Plug end) Dielectric notch 261

[0117] Area 4 to be renovated

[0118] (D, the distance between the starting position of the dielectric material at the plug end and the fixed end of the signal terminal) (LR, LRB, the length of the dielectric material at the socket end)

[0119] (Plug end) Dielectric length LT, LTB

[0120] (Socket end) Dielectric width WR, WRB

[0121] (Plug end) Dielectric width WT, WTB

[0122] (Socket end) Signal terminal width WR0

[0123] (Plug end) Signal terminal width WT0

[0124] Width of the gap between the two signal terminals at the socket end (WR1); Width of the gap between the signal terminal and the ground terminal at the socket end (WR2); Width of the gap between the two signal terminals at the plug end (WT1); Width of the gap between the signal terminal and the ground terminal at the plug end (WT2); Dielectric thickness HR, HRB at the socket end.

[0125] (Plug end) Dielectric thickness HT, HTB

[0126] (Socket end) Signal terminal thickness HR0

[0127] (Plug end) Signal terminal thickness HT0

[0128] (Socket end) Dielectric material layer thickness HR1

[0129] (Plug end) Dielectric material layer thickness HT1

[0130] Steps S11-S13 and S21-S22 of the method for modifying the connector

Claims

1. A high-speed connector, comprising: A socket terminal has two adjacent first signal terminals and a first dielectric body, wherein the two adjacent first signal terminals each include two first line segments with a ramp structure, wherein there is a first gap between the two first line segments, and the first dielectric body at least covers the surface of the two first line segments and fills the first gap; as well as A plug end that can be matched with the socket end has two adjacent second signal terminals and a second dielectric body, wherein the two adjacent second signal terminals each include two second line segments, wherein there is a second gap between the two second line segments, and the second dielectric body at least covers the surfaces of the two second line segments of the two adjacent second signal terminals and fills the second gap located between the surfaces of the two second line segments.

2. The high-speed connector as claimed in claim 1, wherein the dielectric constant of the first dielectric and the second dielectric is 5 to 9 respectively.

3. The high-speed connector as claimed in claim 2, wherein the dielectric constant of the first dielectric and the second dielectric is 5 or 7 respectively.

4. The high-speed connector of claim 3, wherein when the dielectric constant of the first dielectric or the second dielectric is 5, its cross-section has a double-hole structure.

5. The high-speed connector of claim 3, wherein when the dielectric constant of the first dielectric or the second dielectric is 7, its cross-section has an I-shaped structure.

6. A method for modifying a connector, comprising: A connector is provided, wherein the connector includes a receptacle end and a plug end that mates with the receptacle end, wherein the receptacle end includes two adjacent first signal terminals, each of the two adjacent first signal terminals including two first line segments having a ramp structure, wherein a first gap is provided between the two first line segments, wherein the plug end includes two adjacent second signal terminals, each of the two adjacent second signal terminals including two second line segments, wherein a second gap is provided between the two second line segments; A first dielectric is provided for covering the two first line segment surfaces of the two adjacent first signal terminals and filling the first gap located between the two first line segment surfaces; as well as A second dielectric is provided for covering the two second line segment surfaces of the two adjacent second signal terminals and filling the second gap located between the two second line segment surfaces.

7. The method of claim 6, wherein the step of providing the first dielectric comprises: When a dielectric material with a dielectric constant of 5 is selected as the first dielectric, the first dielectric fills the gap between the two adjacent first signal terminals and the first ground terminals on both sides; or When a dielectric material with a dielectric constant of 7 is selected as the first dielectric, the cross-section of the first dielectric is made to form an I-shaped structure.

8. The method of claim 6, wherein the step of providing the second dielectric comprises: When a dielectric material with a dielectric constant of 5 is selected as the second dielectric, the second dielectric fills the gap between the two adjacent second signal terminals and the second ground terminals on both sides; or When a dielectric material with a dielectric constant of 7 is selected as the second dielectric, the cross-section of the second dielectric is made to form an I-shaped structure.

9. The method of claim 6, wherein each of the two second signal terminals of the plug end has one end connected to a circuit board via a solder pad, the circuit board having a ground plane inside, the method further comprising selecting one of the following two designs for subsequent modification: Reduce the width of the solder pad and the length of its remaining portion; or A slot is formed in a portion of the ground plane, and the slot is located directly below the solder joint between the second signal terminal and the solder pad.

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