Loudspeaker and vehicle
By introducing a heat dissipation section of the spider assembly into the speaker and directly connecting it to the voice coil for thermal conduction, and combining it with the frame and chassis to form a dual-channel heat dissipation path, the problem of high voice coil temperature caused by insufficient heat dissipation in the speaker is solved, improving the reliability and lifespan of the speaker and ensuring the stable output of the vehicle audio system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-23
- Publication Date
- 2026-04-14
AI Technical Summary
When a loudspeaker operates at high power, insufficient heat dissipation causes the voice coil temperature to rise rapidly, leading to aging of the enameled wire insulation, deformation or burnout of the voice coil. This reduces the loudspeaker's lifespan and reliability, and limits the increase in rated power.
The heat dissipation section of the spider assembly is directly connected to the voice coil for thermal conduction. The heat dissipation section increases the heat dissipation area, and combined with the frame assembly and chassis, a dual-channel heat dissipation path is formed to achieve effective heat dissipation of the voice coil and avoid heat accumulation.
It significantly reduces voice coil temperature, avoids aging of enameled wire and deformation or burnout of the voice coil, improves the reliability and lifespan of the speaker under high-power continuous operation, and ensures stable output of the vehicle audio system.
Smart Images

Figure CN121865176A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of telecommunications technology, and more specifically to a loudspeaker and a vehicle having the loudspeaker. Background Technology
[0002] In related technologies, only about 1% to 2% of the input electrical power of a loudspeaker is converted into useful acoustic energy, while the majority of the rest generates ineffective heat energy. The heat flux density is highest in the voice coil coil, causing the voice coil temperature to rise rapidly when operating at high power continuously. Long-term overheating of the voice coil leads to aging of the enameled wire insulation, deformation of the voice coil, or even burnout, significantly reducing the lifespan and reliability of the loudspeaker. The heat dissipation bottleneck limits the increase of rated power and makes it impossible to achieve high dynamic range and clear transient response. Summary of the Invention
[0003] The present invention aims to solve the technical problem of insufficient speaker lifespan in the prior art.
[0004] On one hand, the present invention proposes a loudspeaker, characterized in that it comprises: Framework components; A magnetic circuit assembly for generating a magnetic field, the magnetic circuit assembly being fixedly connected to the frame assembly; A voice coil is used to cooperate with the magnetic circuit assembly to move relative to the frame assembly in a first direction via electromagnetic action; A diaphragm, connecting the frame assembly and the voice coil, vibrates under the drive of the voice coil; A spider assembly connects the frame assembly and the voice coil to elastically support the voice coil, and the spider assembly has a heat dissipation part that is thermally connected to the voice coil.
[0005] The magnetic circuit assembly generates a stable magnetic field. The voice coil is placed in the magnetic field and moves in the first direction with the input electrical signal. The diaphragm connects the voice coil and the frame assembly, radiating sound waves as the voice coil vibrates. The spider assembly elastically supports the voice coil and achieves direct thermal connection with the voice coil through the heat dissipation part. This breaks the structural limitation of traditional spiders, which only serve as mechanical elastic support and do not have heat conduction capabilities. The heat generated by the voice coil during operation can be conducted to the heat dissipation part, increasing the heat dissipation area. Through heat exchange with the air, the temperature of the voice coil is significantly reduced, preventing the enameled wire insulation layer from aging due to high temperature, and the voice coil from deforming or burning out. This greatly improves the reliability and lifespan of the loudspeaker under high-power continuous operation.
[0006] In one embodiment, the heat dissipation part is provided with a first heat dissipation hole.
[0007] In one embodiment, the first heat dissipation hole is formed along the first direction.
[0008] In one embodiment, the wave assembly includes an elastic portion that connects the frame assembly and the heat dissipation portion.
[0009] In one embodiment, the heat dissipation portion is bonded to the elastic portion.
[0010] In one embodiment, the heat dissipation portion has a first connecting portion and a second connecting portion, the elastic portion has a third connecting portion and a fourth connecting portion, the first connecting portion is connected to the voice coil, the fourth connecting portion is connected to the frame assembly, and the second connecting portion is bonded to the third connecting portion.
[0011] In one embodiment, the elastic portion and the heat dissipation portion are arranged along a second direction, which is orthogonal to the first direction.
[0012] In one embodiment, the frame assembly includes a frame body and a chassis, the frame body surrounding the voice coil, and the chassis connecting the frame body and the magnetic circuit assembly.
[0013] In one embodiment, the frame body and / or the magnetic circuit assembly are provided with a second heat dissipation hole.
[0014] In one embodiment, the wave assembly and the chassis are respectively connected to opposite sides of the frame body.
[0015] In one embodiment, the diaphragm is at least partially sandwiched between the frame body and the chassis.
[0016] In one embodiment, the heat dissipation section is provided with heat dissipation fins.
[0017] In one embodiment, the heat dissipation fins extend along the first direction.
[0018] In one embodiment, the heat dissipation part is annular, the inner hole of the heat dissipation part is connected to the voice coil, and the heat dissipation part is provided with a plurality of heat dissipation fins, which are arranged radially along the heat dissipation part.
[0019] In one embodiment, the heat dissipation part is provided with at least one first heat dissipation hole, which is disposed between two adjacent heat dissipation fins.
[0020] In one embodiment, the speaker includes a dust cap disposed on the heat dissipation portion and covering the inner hole of the heat dissipation portion.
[0021] On the other hand, the present invention proposes a method characterized by including the aforementioned loudspeaker.
[0022] The vehicle environment places high demands on the reliability of speakers, requiring them to withstand high temperatures, high humidity, vibration, and prolonged continuous playback. The speaker's heat dissipation structure enables stable output within the vehicle environment, significantly enhancing the listening experience and brand value of the in-vehicle audio system. Attached Figure Description
[0023] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 A perspective view of a loudspeaker according to one embodiment; Figure 2 for Figure 1 A stereoscopic view of the speaker from another perspective; Figure 3 for Figure 1 The diagram shown is an exploded view of the loudspeaker. Figure 4 for Figure 1 The speaker shown is a cross-sectional view. Figure 5 This is a cross-sectional view of a speaker according to another embodiment.
[0024] Figure label: Speaker 1, First direction A, Second direction B; Frame component 11, frame body 111, overlapping plate 1111, chassis 112, second heat dissipation hole 1121; Magnetic circuit assembly 13; Voice coil 15; Diaphragm 17; Spindle assembly 18, heat dissipation part 181, first heat dissipation hole 1811, first connecting part 1813, second connecting part 1814, elastic part 182, third connecting part 1823, and fourth connecting part 1824; Dust cap 19. Detailed Implementation
[0025] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.
[0026] In the description of this invention, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.
[0027] Before describing the embodiments in detail, it should be understood that the present invention is not limited to the detailed structures or element arrangements described below or in the accompanying drawings. The present invention may be implemented in other ways. Furthermore, it should be understood that the wording and terminology used herein are for descriptive purposes only and should not be construed as limiting. The terms "comprising," "including," "having," and similar expressions used herein mean to include the items listed thereafter, their equivalents, and other additional items. In particular, when describing "an element," the present invention does not limit the number of elements to one, but may include multiple elements.
[0028] This application provides a speaker 1, such as... Figure 1-4 As shown, the loudspeaker 1 includes: a frame assembly 11, a magnetic circuit assembly 13, a voice coil 15, a diaphragm 17, and a spider assembly 18. The frame assembly 11 supports and secures other components. The magnetic circuit assembly 13 generates a magnetic field and is fixedly connected to the frame assembly 11. The voice coil 15 cooperates with the magnetic circuit assembly 13 to move relative to the frame assembly 11 along a first direction A via electromagnetic interaction. The diaphragm 17 connects the frame assembly 11 and the voice coil 15 to vibrate under the influence of the voice coil 15, thereby generating sound waves. The spider assembly 18 connects the frame assembly 11 and the voice coil 15 to elastically support the voice coil 15, helping it to reset and limiting lateral displacement.
[0029] The spider assembly 18 has a heat dissipation part 181 that is thermally connected to the voice coil 15. The magnetic circuit assembly 13 generates a stable magnetic field. The voice coil 15 is placed in the magnetic field and moves in the first direction A with the input electrical signal. The diaphragm 17 connects the voice coil 15 and the frame assembly 11 and radiates sound waves as the voice coil 15 vibrates. The spider assembly 18 elastically supports the voice coil 15 and achieves direct thermal connection with the voice coil 15 through its heat dissipation part 181. This breaks the structural limitation of traditional spiders that only serve as mechanical elastic support and do not have heat conduction capabilities. The heat generated by the voice coil 15 during operation can be conducted to the heat dissipation part 181, increasing the heat dissipation area. Through heat exchange with the air, the temperature of the voice coil 15 is significantly reduced, avoiding the aging of the enameled wire insulation layer due to high temperature, deformation or burnout of the voice coil 15, thereby greatly improving the reliability and lifespan of the speaker 1 under high-power continuous operation.
[0030] In some embodiments, the heat dissipation part 181 is provided with a first heat dissipation hole 1811. The first heat dissipation hole 1811 is a through hole that penetrates the heat dissipation part 181. Its function is to enhance the convective heat transfer efficiency between the heat dissipation part 181 and the surrounding air, so that after the heat is conducted to the heat dissipation part 181, the hot air can be accelerated through the hole to improve the heat dissipation efficiency.
[0031] In some embodiments, the first heat dissipation hole 1811 is formed along the first direction A. The first direction A is the axial movement direction of the voice coil 15, that is, the vibration direction of the speaker 1, which means that the first heat dissipation hole 1811 is arranged in an axial through-hole manner, which is conducive to the rapid passage of air through the first heat dissipation hole 1811 and improves the heat dissipation efficiency.
[0032] In some embodiments, the spider assembly 18 includes an elastic portion 182, which connects the frame assembly 11 and the heat dissipation portion 181. The elastic portion 182 is made of a highly elastic polymer material (such as polyurethane or rubber composite material), providing the axial elastic restoring force required by the voice coil 15. It also forms a separate structure with the heat dissipation portion 181, decoupling the elastic function from the heat dissipation function and avoiding structural stress concentration due to differences in material thermal conductivity. This design allows the heat dissipation portion 181 to use a highly thermally conductive metal (such as aluminum or copper), while the elastic portion 182 retains its original flexibility, balancing mechanical and thermal performance. The thickness of the elastic portion 182 is 0.8 mm to 1.5 mm, and its resilience modulus is controlled between 1.2 MPa and 2.5 MPa, ensuring linear recovery characteristics within a displacement range of ±2 mm and preventing voice coil 15 eccentricity or frictional noise due to insufficient elasticity.
[0033] In the illustrated embodiment, the heat dissipation portion 181 is bonded to the elastic portion 182. The elastic portion 182 and the heat dissipation portion 181 are arranged along a second direction B, which is orthogonal to the first direction A. In this embodiment, the speaker 1 is generally circular, the first direction A is the axial direction of the speaker 1, and the second direction B is the radial direction of the speaker 1. Both the heat dissipation portion 181 and the elastic portion 182 are annular. The heat dissipation portion 181 has a first connecting portion 1813 and a second connecting portion 1814. The first connecting portion 1813 is the inner edge of the heat dissipation portion 181, and the second connecting portion 1814 is the outer edge of the heat dissipation portion 181. The elastic portion 182 has a third connecting portion 1823 and a fourth connecting portion 1824. The third connecting portion 1823 is the inner edge of the elastic portion 182, and the fourth connecting portion 1824 is the outer edge of the elastic portion 182. The first connecting portion 1813 is connected to the voice coil 15, the fourth connecting portion 1824 is connected to the frame assembly 11, and the second connecting portion 1814 is bonded to the third connecting portion 1823. The adhesive layer thickness is controlled within 0.1mm, and air bubbles are eliminated through a vacuum degassing process to ensure a void-free bonding interface. After high temperature and high humidity aging test (85℃ / 85%RH, 1000 hours), the adhesive strength retention rate is greater than 95%, and no delamination or cracking occurs, verifying its long-term reliability in the harsh automotive environment.
[0034] In the illustrated embodiment, the spider assembly 18 includes a heat dissipation part 181 and an elastic part 182, which respectively realize the heat dissipation function and the elastic function. It should be understood that this is only one embodiment of the present invention. In other embodiments, the elastic part 182 may be omitted. The heat dissipation part 181 is made of a material with high thermal conductivity and elasticity and is directly connected to the voice coil 15 and the frame assembly 11. The heat dissipation part 181 realizes both the heat dissipation function and the elastic function, so that the heat generated when the voice coil 15 is working can be conducted to the heat dissipation part 181, increasing the heat dissipation area. It can also quickly transfer the heat to the frame assembly 11 through the heat dissipation part 181, and further dissipate heat through the frame assembly 11, significantly reducing the temperature of the voice coil 15.
[0035] In some embodiments, the frame assembly 11 includes a frame body 111 and a chassis 112. The frame body 111 surrounds the voice coil 15 assembly, and the chassis 112 connects the frame body 111 and the magnetic circuit assembly 13. The frame body 111 is a metal or high-strength engineering plastic structure, forming a guide cavity for the movement of the voice coil 15. The chassis 112 serves as a mounting base for the magnetic circuit assembly 13 and can also serve as the end of a heat dissipation path. For example, a heat dissipation section 181 can simultaneously achieve heat dissipation and elasticity. The heat dissipation section 181 is directly connected to the voice coil 15 and the frame assembly 11. This structure enables the entire loudspeaker 1 to form a three-layer heat conduction path of "upper-middle-lower": voice coil 15 → heat dissipation section 181 → frame body 111 → external environment, or voice coil 15 → heat dissipation section 181 → chassis 112 → external environment, achieving dual-channel heat dissipation. The main frame 111 is made of die-cast aluminum alloy with a wall thickness of 1.2mm to 2.0mm. The inner wall is anodized to enhance corrosion resistance. The chassis 112 is made of cold-rolled steel sheet and stamped with a thermally conductive and insulating coating to ensure the stability of the magnetic circuit and avoid the risk of short circuit.
[0036] In some embodiments, the frame body 111 and / or the magnetic circuit assembly 13 are provided with second heat dissipation holes 1121. The second heat dissipation holes 1121 are formed on the side wall of the frame body 111 or the bottom of the chassis 112, creating a convection channel with the first heat dissipation hole 1811 to promote natural convection between hot air inside the speaker 1 and cold air outside. The diameter of the second heat dissipation holes 1121 on the chassis 112 is 2mm to 4mm, and the number is 6 to 12. Multiple second heat dissipation holes 1121 are distributed around the magnetic circuit assembly 13, allowing the airflow flowing through the second heat dissipation holes 1121 to dissipate heat from the magnetic circuit assembly 13, further improving the overall heat dissipation performance of the speaker 1.
[0037] In some embodiments, the spring assembly 18 and the chassis 112 are respectively connected to opposite sides of the frame body 111. For example... Figure 4As shown, the spinner assembly 18 is located above the speaker 1, and the heat dissipation part 181 can directly exchange heat with the outside air, further improving the heat dissipation efficiency of the voice coil 15. The chassis 112 is located below the speaker 1, allowing the magnetic circuit assembly 13 to directly exchange heat with the outside air, further improving the heat dissipation efficiency of the magnetic circuit assembly 13.
[0038] In this embodiment, the spider assembly 18 and the chassis 112 are respectively connected to opposite sides of the frame body 111, and the diaphragm 17 is located between the spider assembly 18 and the magnetic circuit assembly 13, which can further improve the overall heat dissipation performance of the speaker 1. However, this is only one embodiment of the present invention. Figure 5 In the embodiment shown, the diaphragm 17 is disposed on the upper part of the frame assembly 11, the magnetic circuit assembly 13 is disposed on the lower part of the frame assembly 11, and the spider assembly 18 is disposed between the diaphragm 17 and the magnetic circuit assembly 13. The spider assembly 18 has a heat dissipation part 181 that is thermally connected to the voice coil 15, which can also improve the heat dissipation efficiency of the voice coil 15 by increasing the heat dissipation area through heat conduction. The present invention does not limit the placement of the spider assembly 18, the magnetic circuit assembly 13, and the diaphragm 17, as long as the heat dissipation efficiency of the voice coil 15 can be improved through the heat dissipation part 181 of the spider assembly 18.
[0039] exist Figure 1-4 In the illustrated embodiment, the spring assembly 18 and the chassis 112 are respectively connected to opposite sides of the frame body 111. The chassis 112 is connected to the side of the frame body away from the spring assembly 18, for example, by welding or bolting. The frame assembly 11 has a radially inwardly arranged overlapping plate 1111 for the diaphragm 17 to connect to, for example, by bonding the diaphragm 17 to the overlapping plate 1111. This allows the chassis 112 and the diaphragm 17 to be connected to different parts of the frame body 111 without affecting each other. It should be understood that this is only one embodiment of the present invention. In other embodiments, the chassis 112 and the diaphragm 17 may also be connected to the end face of the frame assembly 11 away from the spring assembly 18. For example, the frame body 111 is fixed to the end face of the frame assembly 11 away from the spring assembly 18 by screws, and the diaphragm 17 is at least partially clamped between the frame body 111 and the chassis 112. The edge of the diaphragm 17 is clamped and fixed, and the mechanical coupling is stable.
[0040] like Figure 4 As shown, the heat dissipation unit 181 is equipped with heat dissipation fins. The heat dissipation fins are thin metal sheets, increasing the heat dissipation surface area and improving convective heat dissipation. The fins are formed by stamping or CNC machining, with a thickness controlled between 0.3 and 0.8 mm and a height between 2 and 5 mm, ensuring maximum heat dissipation efficiency within a limited space. The fin surface undergoes micro-roughening treatment, increasing the surface emissivity to above 0.85, enhancing radiative heat dissipation. In thermal simulation, after adding 12 fins, the total heat dissipation area of the heat dissipation unit 181 increased by 2.8 times, and the heat flux density per unit area decreased to 35% of the original structure.
[0041] Furthermore, the heat dissipation fins extend along the first direction A. That is, the fins extend along the axial direction of the voice coil 15, consistent with the direction of heat flow, avoiding airflow disturbance and increased thermal resistance caused by the transverse fins. This structure allows hot air to rise naturally along the fin gaps, forming a chimney effect, achieving passive heat dissipation without the need for an additional fan.
[0042] In this embodiment, the heat dissipation part 181 is annular, and its inner hole is connected to the voice coil 15. The heat dissipation part 181 is provided with multiple heat dissipation fins, which are arranged radially along the heat dissipation part 181. The annular structure fits tightly against the cylindrical outer wall of the voice coil 15, achieving 360° all-round heat conduction and avoiding local hot spots. The radially arranged fins make the heat dissipation area uniformly expanded radially. The gap between the inner diameter of the heat dissipation part 181 and the outer diameter of the voice coil 15 is controlled between 0.1mm and 0.3mm, and is filled with an interference fit or a thermally conductive pad to achieve efficient heat transfer. It should be understood that the annular shape of the heat dissipation part 181 enables 360° all-round heat conduction, but this is only one embodiment of the present invention. In other embodiments, the heat dissipation part 181 can also be other shapes, such as fan-shaped, and can be one or multiple arranged at intervals along the circumference, as long as the heat dissipation area of the voice coil 15 is increased by setting the heat dissipation part 181. The present invention does not limit the specific form of the heat dissipation part 181.
[0043] In this embodiment, the heat dissipation unit 181 is provided with at least one first heat dissipation hole 1811, which is disposed between two adjacent heat dissipation fins. This design integrates the ventilation hole with the heat dissipation fin structure, allowing the airflow channel and the heat dissipation surface to coexist. The airflow can directly pass through the fin gaps to carry away heat, achieving the dual function of "heat dissipation + ventilation" and improving the heat dissipation efficiency per unit area by more than 40%. The edges of the first heat dissipation hole 1811 are rounded to avoid fatigue cracking caused by stress concentration.
[0044] In this embodiment, the speaker 1 includes a dust cap 19, which is disposed on the heat dissipation part 181 and covers the inner hole of the heat dissipation part 181. This prevents external impurities from entering the voice coil 15. The dust cap is made of metal, such as aluminum or copper, forming an "upper outlet" for heat conduction, allowing heat from inside the voice coil 15 to be quickly radiated into the air. The thickness of the dust cap is controlled between 0.1 and 0.3 mm, ensuring sufficient thermal conductivity without affecting acoustic transmission characteristics. The surface of the dust cap is anodized or nickel-plated to improve corrosion resistance and oxidation resistance. In high-frequency (above 5kHz) sound pressure response tests, the sound transmission loss of the metal dust cap is less than 0.3 dB, far lower than the 1.2 dB of the traditional plastic dust cap, significantly improving high-frequency clarity and detail. After continuously playing a 120W music signal for 24 hours, the surface temperature of the metal dust cap is 28°C lower than that of the traditional structure, effectively preventing dust adsorption and material aging, and maintaining long-term sound quality stability.
[0045] This application also provides a vehicle including the aforementioned speaker 1. The vehicle environment places extremely high demands on the reliability of the speaker 1, requiring it to withstand high temperatures, high humidity, vibration, and prolonged continuous playback. The heat dissipation structure of this application enables the speaker 1 to maintain stable output even in high-temperature environments inside the vehicle (such as dashboard temperatures reaching 70°C under direct sunlight in summer), significantly improving the listening experience and brand value of the in-vehicle audio system.
[0046] In summary, the present invention provides a loudspeaker 1 and a vehicle including the loudspeaker 1. The loudspeaker 1 includes: a frame assembly 11, a magnetic circuit assembly 13, a voice coil 15, a diaphragm 17, and a spider assembly 18. The frame assembly 11 is used to support and fix other components, the magnetic circuit assembly 13 is used to generate a magnetic field, the magnetic circuit assembly 13 is fixedly connected to the frame assembly 11, and the voice coil 15 is used to cooperate with the magnetic circuit assembly 13 to move relative to the frame assembly 11 in a first direction A through electromagnetic action. The spider assembly 18 has a heat dissipation part 181 that is thermally connected to the voice coil 15. The spider assembly 18 elastically supports the voice coil 15 and achieves direct thermal connection with the voice coil 15 through the heat dissipation part 181. This breaks the structural limitation of traditional spiders that only serve as mechanical elastic supports and lack thermal conductivity. The heat generated by the voice coil 15 during operation can be conducted to the heat dissipation part 181, increasing the heat dissipation area. Through heat exchange with the air, the temperature of the voice coil 15 is significantly reduced, preventing the enameled wire insulation layer from aging due to high temperature, and preventing the voice coil 15 from deforming or burning out. This greatly improves the reliability and lifespan of the speaker 1 under high-power continuous operation. The vehicle includes the speaker 1, which can output stably in the in-vehicle environment, significantly improving the listening experience of the in-vehicle audio system. The concepts described herein can be implemented in other forms without departing from their spirit and characteristics. The specific embodiments of the invention should be considered illustrative rather than restrictive. Therefore, the scope of the invention is determined by the appended claims, not by the foregoing description. Any changes within the literal meaning and equivalent scope of the claims should fall within the scope of these claims.
[0047] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0048] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention without departing from the principles and spirit of the present invention.
Claims
1. A loudspeaker, characterized in that, include: Framework components; A magnetic circuit assembly for generating a magnetic field, the magnetic circuit assembly being fixedly connected to the frame assembly; A voice coil is used to cooperate with the magnetic circuit assembly to move relative to the frame assembly in a first direction via electromagnetic action; A diaphragm, connecting the frame assembly and the voice coil, vibrates under the drive of the voice coil; A spider assembly connects the frame assembly and the voice coil to elastically support the voice coil, and the spider assembly has a heat dissipation part that is thermally connected to the voice coil.
2. The loudspeaker according to claim 1, characterized in that, The heat dissipation section is provided with a first heat dissipation hole.
3. The loudspeaker according to claim 2, characterized in that, The first heat dissipation hole is formed along the first direction.
4. The loudspeaker according to claim 1, characterized in that, The wave assembly includes an elastic part that connects the frame assembly and the heat dissipation part.
5. The loudspeaker according to claim 4, characterized in that, The heat dissipation part is bonded to the elastic part.
6. The loudspeaker according to claim 1, characterized in that, The frame assembly includes a frame body and a chassis, the frame body surrounds the voice coil, and the chassis connects the frame body and the magnetic circuit assembly.
7. The loudspeaker according to claim 6, characterized in that, The frame body and / or the magnetic circuit assembly are provided with a second heat dissipation hole.
8. The loudspeaker according to claim 6, characterized in that, The wave assembly and the chassis are respectively connected to opposite sides of the frame body.
9. The loudspeaker according to claim 6, characterized in that, The diaphragm is at least partially clamped between the frame body and the chassis.
10. The loudspeaker according to any one of claims 1-9, characterized in that, The heat dissipation section is equipped with heat dissipation fins.
11. The loudspeaker according to claim 10, characterized in that, The heat dissipation fins extend along the first direction.
12. The loudspeaker according to claim 10, characterized in that, The heat dissipation part is annular, and the inner hole of the heat dissipation part is connected to the voice coil. The heat dissipation part is provided with a plurality of heat dissipation fins, which are arranged radially along the heat dissipation part.
13. The loudspeaker according to claim 12, characterized in that, The heat dissipation part is provided with at least one first heat dissipation hole, which is disposed between two adjacent heat dissipation fins.
14. The loudspeaker according to claim 12, characterized in that, The speaker includes a dust cap, which is disposed on the heat dissipation part and covers the inner hole of the heat dissipation part.
15. A vehicle, characterized in that, The loudspeaker includes any one of claims 1-14.