MCU and power supply integrated structure

Abstract

The invention relates to the technical field of motors, and discloses an MCU and power supply integrated structure which comprises a power supply device and an inverter device which are arranged in a layered mode, the power supply device and the inverter device are electrically connected through an expandable filtering assembly, and the expandable filtering assembly is used for transmitting electric energy and restraining electromagnetic interference. The charging and inversion device structure is integrated, the upper cavity and the lower cavity are adopted, the two parts are connected through the expandable filtering assembly, and installation is more convenient and simpler. Through the laminated layout of the layers, the reduction of the outline is controlled, and the experiment troubles such as vibration caused by the extension of a mounting fulcrum can also be reduced. The direct electrical connection between the power supply device and the inversion device is realized through the expandable filtering assembly, a complex high-voltage wiring harness is omitted, the installation space of the whole vehicle is obviously reduced, and the super-integration design is realized. The expandable filtering assembly has the functions of electric energy transmission and electromagnetic interference suppression, interference caused by wire harness introduction is effectively reduced, and the stability and power performance of a whole vehicle electronic system are improved.

Description

Technical Field

[0001] This invention relates to the field of motor control technology, and more specifically to an integrated MCU and power supply structure. Background Technology

[0002] Traditional new energy vehicles typically integrate the charging power module and motor controller separately within the vehicle, occupying significant installation space and requiring complex wiring harnesses. Due to space constraints, the motor system struggles to fully meet the vehicle's power performance requirements. Furthermore, the traditional motor controller and charging power module are separate, independent components that require high-voltage power transmission for power control and charging. Because of their physical separation, high-voltage wiring harnesses are necessary for power transmission, further increasing vehicle installation space, raising costs, compromising reliability, and hindering overall vehicle integration. Summary of the Invention

[0003] In view of this, the present invention provides an integrated MCU and power supply structure to solve the problem that the current charging power module and motor controller are installed separately in the vehicle and need to be connected by a high-voltage wiring harness, which increases the vehicle's installation space.

[0004] This invention provides an integrated MCU and power supply structure, including a power supply device and an inverter device arranged in layers. The power supply device and the inverter device are electrically connected through an expandable filter component, which is used to transmit electrical energy and suppress electromagnetic interference.

[0005] The beneficial effects of the aforementioned MCU and power supply integrated structure are as follows: This invention integrates the charging and inverter device structure, employing a two-layer cavity. The upper layer houses the power supply device, and the lower layer houses the inverter device. The two parts are connected via an expandable filter component, making installation more convenient and simpler. This layered layout reduces the overall size of the control unit and minimizes the extension of the mounting support point, thus reducing the challenges of vibration and other experimental issues. The expandable filter component enables direct electrical connection between the power supply device and the inverter device, eliminating complex high-voltage wiring harnesses, significantly reducing the overall vehicle installation space, and achieving a highly integrated design. The expandable filter component combines power transmission and electromagnetic interference suppression functions, effectively reducing interference introduced by the wiring harness and improving the stability and power performance of the vehicle's electronic system. The expandable filter component has a compact structure, making it easy to assemble on the inverter; the integrated layout reduces maintenance steps and improves troubleshooting efficiency.

[0006] In one optional implementation, the expandable filter assembly includes a multi-stage rectifier unit, which includes a magnetic ring assembly position and a rectifier element assembly position.

[0007] The beneficial effects of the above technical solution are as follows: This invention can flexibly adapt to magnetic rings and rectifier components of different specifications, and improve the versatility and expandability of the components through modular assembly; the multi-stage rectifier unit, combined with the electromagnetic suppression characteristics of the magnetic ring and the power regulation function of the rectifier component, can further optimize the power transmission efficiency, effectively suppress wide-band electromagnetic interference, and ensure the stability of power output; at the same time, the standardized assembly position design facilitates rapid assembly during the production process and subsequent maintenance and replacement, and is compatible with the compact layout of the overall integrated structure, further reducing space occupation and helping to achieve the goal of hyper-integrated design.

[0008] In one optional implementation, the scalable filtering component includes a first rectification unit and a second rectification unit; The first rectifier unit includes a first insulating bracket, a current bar, a battery input interface, a grounding plate, a first rectifier element, a second rectifier element, a third rectifier element, and a fourth rectifier element. The first insulating bracket is provided with a first assembly position, a second assembly position, a third assembly position, a fourth assembly position, and a fifth assembly position. The first assembly position is used to install the first rectifier element, the second assembly position is used to install the second rectifier element, the third assembly position is used to install the third rectifier element, and the fourth assembly position is used to install the fourth rectifier element. The second rectifier unit includes a second insulating bracket and a fifth rectifier element. The second insulating bracket is installed in a fifth assembly position, and a sixth assembly position is provided on the second insulating bracket. The fifth rectifier element is installed in the sixth assembly position. The first, third, and sixth assembly positions are magnetic ring mounting positions, and the second and fourth assembly positions are pinned rectifier mounting positions; the expandable filter component supports fifth-order rectification to achieve bidirectional interference blocking.

[0009] The beneficial effects of the above technical solution are as follows: the expandable filter component provides mounting positions for fifth-order rectifier elements, and its performance is far superior to traditional first- or second-order filter components. All rectifier elements are built into the rectifier unit, which has a precise and complex structure yet is compact in size. Five rectifier elements can be integrated into a highly integrated filter component, which not only has strong anti-interference performance but also facilitates installation on inverters due to its compact structure. At the same time, it can be customized for the electromagnetic environment of different vehicles, flexibly adjusting the number and configuration of rectifier elements to meet the requirements of different noise test levels for various vehicles, and has excellent compatibility, scalability, and economy.

[0010] In one optional embodiment, the rectifier element assembled in the magnetic ring mounting position is an annular magnetic ring, which is formed by winding a nanoscale crystalline thin film or by sintering a mixture of Mn-Zn and Ni-Zn powders.

[0011] The beneficial effects of the above technical solution are as follows: This invention utilizes its impedance characteristics to form a high-impedance path for common-mode current, effectively suppressing high-frequency common-mode interference (such as switching power supply noise). It can block the noise from the vehicle circuit to the inverter side, and also effectively isolate the noise from the inverter's high-frequency switching process from flowing to the vehicle, thus playing a role in bidirectional interference blocking.

[0012] In one optional embodiment, the first rectifier unit is further provided with a first charging port and a second charging port. The first charging port and the second charging port are disposed on the first insulating bracket and electrically connected to the current bar. The first charging port and the second charging port can be flexibly matched and added or removed according to the charging interface conditions of different vehicles to adapt to the charging needs of various vehicle models.

[0013] In one optional embodiment, the current strip is integrally injection molded with the first insulating bracket, and the bottom of the first insulating bracket is provided with a plurality of heat dissipation grooves, which are used to position the current strip and expand the heat dissipation area of ​​the current strip.

[0014] The beneficial effects of the above technical solution are as follows: the first charging port and the second charging port not only provide anti-interference performance, but can also be customized according to the different charging interfaces of different vehicles, and can be flexibly matched and added or removed, thus having strong compatibility, expandability and economy.

[0015] In one alternative embodiment, the first insulating bracket is further provided with a spare slot for expanding the rectifier unit module.

[0016] The beneficial effects of the above technical solution are as follows: While maintaining a compact main structure, the present invention can dynamically adjust the filtering strategy according to the electromagnetic environment, significantly improve the system's ability to suppress complex interference, and provide a scalable electromagnetic compatibility solution for the equipment.

[0017] In one optional embodiment, the grounding plate is a strip structure, and the grounding plate is provided with a U-shaped connection portion for connecting the pins of the leaded rectifier element; And / or, the third rectifier element in the magnetic ring mounting position includes an upper magnet and a lower magnet. The upper magnet has a mountain-shaped structure, and the lower magnet has a straight-line structure. The upper magnet is mounted on the lower magnet to form a through hole for the current bar to pass through. The third assembly position is provided with a top pressure plate. An elastic body is provided between the top pressure plate and the third rectifier element. The elastic body is used to buffer vibration. And / or, the current bar has a vertical U-shaped structure and multiple solder joints for connecting the pins of a leaded rectifier element.

[0018] In one optional embodiment, the power supply device and the inverter device are respectively provided with heat dissipation channels, and the heat dissipation channels of the power supply device and the heat dissipation channels of the inverter device are connected in series to form an integrated heat dissipation system.

[0019] In one optional embodiment, the power supply device includes a power supply enclosure, and the inverter device includes an inverter enclosure; the power supply enclosure is provided with an inlet, a first flow channel, and a first port; the inverter enclosure is provided with a second flow channel, a third flow channel, a second port, a third port, a fourth port, a cooling pool, and an output port; the cooling pool is located on the side of the inverter enclosure facing the power supply enclosure; the inlet is connected to the second flow channel through the first flow channel; the second flow channel is connected to the inlet of the cooling pool; and the outlet of the cooling pool is connected to the third flow channel.

[0020] In one alternative embodiment, the second flow channel is an upper and lower guide pipe, so that the cooling medium flows into the cooling pool from top to bottom.

[0021] In one optional embodiment, the first flow channel within the power supply device is a "U"-shaped pipe, with the two ends of the opening of the "U"-shaped pipe being the inlet and outlet of the heat dissipation flow channel, respectively.

[0022] In one alternative embodiment, the heat dissipation channel is composed of grooves and a cover plate on the housing, and the cover plate and groove are fixed together by welding or screws to form a closed cavity.

[0023] In one optional embodiment, the power supply unit is provided with a vent valve on its housing, and a through hole is provided at the junction of the power supply unit and the inverter unit. The vent valve and the through hole cooperate to realize air convection inside the dual housings.

[0024] The beneficial effects of the above technical solution are as follows: the power supply unit and the inverter unit achieve air circulation within the dual-chamber enclosure by sharing a single vent valve. Heat inside the inverter enclosure rises to the power supply enclosure through the through-hole and is discharged through the vent valve. Simultaneously, cool external air enters the power supply enclosure through the vent valve, and then flows back into the inverter enclosure, thus forming natural air convection. This design effectively improves heat dissipation efficiency through a large heat dissipation area, significantly reduces costs by decreasing the number of vent valves, and simplifies the assembly process.

[0025] In one optional embodiment, the inverter is provided with a plastic film capacitor, and the bottom of the plastic film capacitor is in direct contact with the casing of the inverter through an epoxy resin layer to form a heat conduction interface.

[0026] The beneficial effects of the above technical solution are as follows: the bottom of the plastic film capacitor is in direct contact with the box through an epoxy resin layer, forming a continuous heat conduction interface, which is especially suitable for high-frequency charge and discharge scenarios, effectively suppressing the local temperature rise of the capacitor and extending the life of the plastic film capacitor.

[0027] In one alternative embodiment, the power supply device has a maintenance cover on top, which is secured with tamper-proof screws, and a protective cover is provided below the maintenance cover.

[0028] In one optional embodiment, the protective cover is provided with a high-voltage safety detection port to prevent maintenance personnel from directly contacting live components. Attached Figure Description

[0029] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 An exploded view of the MCU and power supply integrated structure provided by this invention; Figure 2 An exploded view of the MCU and power supply integrated structure provided by this invention; Figure 3 This is a schematic diagram of the inverter device in the MCU and power supply integrated structure provided by the present invention. Figure 4 A schematic diagram of the power supply device in the MCU and power supply integrated structure provided by the present invention; Figure 5 This is a top view of the power supply enclosure in the MCU and power supply integrated structure provided by the present invention; Figure 6 A bottom view of the power supply enclosure in the MCU and power supply integrated structure provided by the present invention; Figure 7 This is a top view of the inverter enclosure in the MCU and power supply integrated structure provided by the present invention; Figure 8 A bottom view of the inverter enclosure in the MCU and power supply integrated structure provided by the present invention; Figure 9 This is a schematic diagram of the sealing cover plate in the MCU and power supply integrated structure provided by the present invention. Figure 10 A schematic diagram of the plastic film capacitor in the MCU and power supply integrated structure provided by the present invention; Figure 11 A schematic diagram of the cooling system flow domain for the MCU and power supply integrated structure provided by this invention; Figure 12 A schematic diagram of the air convection structure of the MCU and power supply integrated structure provided by the present invention; Figure 13 This is a schematic diagram of the cover protection structure for the MCU and power supply integrated structure provided by the present invention; Figure 14 An exploded view of the expandable filtering component of the MCU and power supply integrated structure provided by the present invention; Figure 15 A schematic diagram of the scalable filter component for the MCU and power supply integrated structure provided by the present invention; Figure 16 A schematic diagram of the assembly location structure of the expandable filter component in the MCU and power supply integrated structure provided by the present invention; Figure 17 A schematic diagram of the second filter element structure of the expandable filter component of the MCU and power supply integrated structure provided by the present invention; Figure 18 A schematic diagram of the current bar fixing slot structure of the expandable filter component of the MCU and power supply integrated structure provided by the present invention; Figure 19 A schematic diagram of the third rectifier element of the extended filter component of the MCU and power supply integrated structure provided by the present invention; Figure 20 A schematic diagram of the current bar structure of the expandable filter component of the MCU and power supply integrated structure provided by the present invention; Figure 21 A schematic diagram of the grounding plate structure of the expandable filter component in the MCU and power supply integrated structure provided by the present invention; Figure 22 A schematic diagram of the spare slot structure of the expandable filter component in the MCU and power supply integrated structure provided by the present invention; Figure 23 This is a schematic diagram of the open-cover protection structure of the MCU and power supply integrated structure provided by the present invention from another perspective.

[0031] Explanation of reference numerals in the attached figures: 1. Power supply unit; 101. Power supply housing; 102. First flow channel; 103. Inlet; 104. First port; 105. Power supply assembly; 106. Fuse assembly; 107. First flow channel cover; 108. Vent valve; 109. Through hole; 110. Anti-tamper screw; 111. Maintenance cover; 112. Protective cover; 113. Socket head cap screw; 114. Sealing cover; 115. Small cover; 116. Voltage detection port; 2. Inverter unit; 201. Inverter housing; 202. Second flow channel; 203. Third flow channel; 204. Second port; 205. Third port; 206. Fourth port; 207. Cooling pool; 208. Output port; 209. Plastic film capacitor; 2091. Fixing point; 2092. Bottom potting area; 2093. Side potting area; 210. Inverter assembly; 211. Output assembly; 212. Second flow channel cover plate; 213. Third flow channel cover plate; 3. Expandable filter assembly; 31. First rectifier unit; 310. First insulating bracket; 311. First assembly position; 312. Second assembly position; 313. Third assembly position; 314. Fourth assembly position; 315. Fifth assembly position; 316. First charging port; 317. Second charging port; 318. Battery input interface; 319. Current bar; 3191. First solder joint; 3192. Second solder joint; 3193. Third solder joint; 3194. Fourth solder joint; 3120. Grounding piece; 31201. First grounding plate. Grounding plate, 31202, second grounding plate, 31203, third grounding plate, 31204, fourth grounding plate, 3121, first rectifier element, 3122, second rectifier element, 3123, third rectifier element, 31231, upper magnet, 31232, lower magnet, 3124, fourth rectifier element, 3125, spare slot, 32, second rectifier unit, 321, sixth assembly position, 322, second insulating bracket, 323, fifth rectifier element, 330, heat dissipation slot, 340, top pressure plate, 350, elastomer. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Traditional new energy vehicles typically integrate the charging power module and motor controller separately within the vehicle, occupying significant installation space and requiring complex wiring harnesses. Due to space constraints, the motor system struggles to fully meet the vehicle's power performance requirements. Furthermore, the traditional motor controller and charging power module are separate, independent components that require high-voltage power transmission for power control and charging. Because of their physical separation, high-voltage wiring harnesses are necessary for power transmission, further increasing vehicle installation space, raising costs, compromising reliability, and hindering overall vehicle integration.

[0034] While the current mainstream discrete structure facilitates modular maintenance, integrated all-in-one designs still face significant challenges: disassembly is cumbersome and time-consuming, troubleshooting is difficult, and the overall cost of scrapping remains high. To overcome this bottleneck, there is an urgent need to develop an innovative integrated solution that can achieve rapid disassembly and assembly to improve maintenance efficiency, while highly integrating core functional modules such as DC-DC converters, on-board chargers (OBC), power distribution units (PDUs), and control units (MCUs) into a compact, integrated system. This design must balance structural strength with modular flexibility, and by optimizing connection interfaces and heat dissipation layout, it can significantly extend the equipment's lifespan while reducing the failure rate, ultimately achieving a dual improvement in cost-effectiveness and reliability.

[0035] Therefore, it is necessary to develop a hyper-integrated motor controller solution that combines the charging device and the inverter device into one, thereby reducing the installation space of the whole vehicle and realizing the hyper-integrated component of the controller.

[0036] In addition, traditional filter design faces two major problems: insufficient filtering level leads to limited electromagnetic compatibility performance, while low integration makes the system structure loose and maintenance inconvenient.

[0037] Based on this, another objective of this invention is to overcome the shortcomings of existing technologies by providing a filter component structure. This invention significantly improves EMC levels through a multi-stage filter architecture and achieves high functional integration through modular design. It is also compatible with multiple charging interfaces, adapting to the charging interface conditions of various vehicle models. Performance and reliability are optimized simultaneously within a compact structure, effectively addressing the shortcomings of traditional designs. The rectifier unit structure is precise and complex yet compact, integrating five rectifier elements into a highly integrated filter component. This results in a rectifier with strong anti-interference performance, a compact structure, and easier assembly into inverters. Furthermore, it can be flexibly matched and added or removed according to the different electromagnetic environments and charging interfaces of different vehicles, meeting the noise testing requirements of different vehicles and exhibiting strong compatibility, scalability, and economy.

[0038] According to an embodiment of the present invention, in a first aspect, an integrated MCU and power supply structure is provided for use in electric vehicles, combined with... Figures 1 to 23 As shown, it includes a power supply unit 1 and an inverter unit 2 arranged in layers. The power supply unit 1 and the inverter unit 2 are electrically connected through an expandable filter component 3, which is used to transmit electrical energy and suppress electromagnetic interference.

[0039] Compared to existing technologies that arrange power devices side-by-side, this invention integrates the charging and inverter structures, employing a two-layer cavity: the upper cavity houses the power supply unit 1, and the lower cavity houses the inverter unit 2. The two parts are connected via an expandable filter assembly, making installation more convenient and simpler. This layered layout reduces the overall size of the control unit and minimizes the extension of the mounting support point, thus reducing the challenges of vibration and other experimental issues. The expandable filter assembly enables direct electrical connection between the power supply unit and the inverter unit, eliminating complex high-voltage wiring harnesses, significantly reducing overall vehicle installation space, and achieving a highly integrated design. The expandable filter assembly combines power transmission and electromagnetic interference suppression functions, effectively reducing interference introduced by wiring harnesses and improving the stability and power performance of the vehicle's electronic systems. The compact structure of the expandable filter assembly facilitates easy assembly onto the inverter; the integrated layout reduces maintenance steps and improves troubleshooting efficiency.

[0040] In some embodiments, the expandable filter component 3 includes a multi-stage rectifier unit, which includes a magnetic ring assembly position and a rectifier element assembly position. It can flexibly adapt to magnetic rings and rectifier elements of different specifications, and improve the versatility and expandability of the component through modular assembly. The multi-stage rectifier unit combines the electromagnetic suppression characteristics of the magnetic ring with the power regulation function of the rectifier element, which can further optimize the power transmission efficiency, effectively suppress wide-band electromagnetic interference, and ensure the stability of power output. At the same time, the standardized assembly position design facilitates rapid assembly during the production process and subsequent maintenance and replacement, and is compatible with the compact layout of the overall integrated structure, further reducing space occupation and helping to achieve the goal of hyper-integrated design.

[0041] In some embodiments, the expandable filter component 3 includes a first rectifier unit 31 and a second rectifier unit 32.

[0042] The first rectifier unit 31 includes a first insulating bracket 310, a current bar 319, a battery input interface 318, a grounding plate 3120, a first rectifier element 3121, a second rectifier element 3122, a third rectifier element 3123, and a fourth rectifier element 3124. The battery input interface 318 is also called an electronic control input interface. The first insulating bracket 310 is provided with a first assembly position 311, a second assembly position 312, a third assembly position 313, a fourth assembly position 314, and a fifth assembly position 315. The first assembly position 311 is used to install the first rectifier element 3121, the second assembly position 312 is used to install the second rectifier element 3122, the third assembly position 313 is used to install the third rectifier element 3123, and the fourth assembly position 314 is used to install the fourth rectifier element 3124. The current bar 319 is provided with a first solder joint 3191, a second solder joint 3192, a third solder joint 3193, and a fourth solder joint 3194.

[0043] The device includes four grounding plates 3120 and two current bars 319. The two current bars 319 pass through the assembly position, and the grounding plate is located on both sides of the current bars 319.

[0044] The second rectifier unit 32 includes a second insulating bracket 322 and a fifth rectifier element 323. The second insulating bracket 322 is installed in the fifth assembly position 315. The second insulating bracket 322 has two fixed ears at both ends for fixing the second rectifier unit in the first insulating bracket. A sixth assembly position 321 is provided on the second insulating bracket 322. The fifth rectifier element 323 is installed in the sixth assembly position 321. Two current bars 319 can be designed to pass through the assembly position. The current bars 319 are relatively independent, which allows for flexible arrangement and is suitable for various back-end connection components.

[0045] like Figure 14 The exploded view of the expandable filter component structure shown indicates that the first assembly position 311, the third assembly position 313, and the sixth assembly position 321 are locations for mounting magnetic rings. These positions are waist-shaped, with high-permeability magnetic rings fitted through the current bar 319. The second assembly position 312 and the fourth assembly position 314 are locations for mounting rectifier elements with leads; both the second and fourth rectifier elements are connected to the current bar 319 and the grounding plate. The expandable filter component 3 supports fifth-order rectification to achieve bidirectional interference blocking.

[0046] like Figure 16 The diagram shows the assembly position structure of the expandable filter component. A second assembly position is located behind the first assembly position and is located outside the current bar 319. A third assembly position is located at the rear end of the second assembly position and the current bar 319 passes through the third assembly position. A fourth assembly position is located behind the third assembly position and is also located on both sides of the current bar 319. A fifth assembly position is located immediately following the fourth assembly position.

[0047] like Figure 17 The diagram shows the structure of the second filter element in the expandable filter assembly. The second filter element is positioned above the fifth assembly position.

[0048] In this embodiment, the expandable filter component 3 provides mounting positions for fifth-order rectifier elements, offering performance far superior to traditional first- or second-order filter components. All rectifier elements are built into the rectifier unit, which has a sophisticated and complex structure yet is compact in size. Five rectifier elements can be integrated into a highly integrated filter component, providing not only strong anti-interference performance but also easy assembly on inverters due to its compact structure. Furthermore, it can be customized for the electromagnetic environment of different vehicles, flexibly adjusting the number and configuration of rectifier elements to meet the requirements of various noise test levels for different vehicles, combining excellent compatibility, scalability, and economy.

[0049] By achieving bidirectional interference blocking through fifth-order rectification, the forward and reverse conducted interference between power supply unit 1 and inverter unit 2 can be suppressed simultaneously, effectively protecting the vehicle's electronic equipment from electromagnetic interference and significantly improving the operational stability of the power system and the overall vehicle performance.

[0050] The first insulating bracket 310 has multiple types of mounting positions (magnetic ring mounting position, pinned rectifier element mounting position) and the second rectifier unit 32 has an expandable design, which supports the flexible addition, reduction or replacement of rectifier elements according to the electromagnetic environment requirements of different vehicle models, adapts to diverse noise test levels, reduces customized development costs, and enhances the cross-vehicle versatility of products.

[0051] The integrated insulating bracket design highly integrates the first rectifier unit, the second rectifier unit, and various components, resulting in a compact size and clear layout (magnetic rings and leaded components are installed separately), which facilitates quick assembly onto the inverter, reduces installation space occupation, and improves the overall system integration of the vehicle.

[0052] The insulating bracket enhances electrical insulation performance, reducing the risk of short circuits or leakage; the modular component installation method facilitates fault diagnosis and component replacement, reduces maintenance time and costs, and extends equipment life.

[0053] In some embodiments, the rectifier element assembled in the magnetic ring mounting position is an annular magnetic ring, which is formed by winding a nanoscale crystal thin film or by sintering a mixture of Mn-Zn and Ni-Zn powders.

[0054] Specifically, both the first rectifier element 3121 and the fifth rectifier element 323 can be made of nanoscale crystalline thin film material or magnetic rings sintered from a mixture of Mn-Zn and Ni-Zn powders. The magnetic rings formed from nanoscale crystalline thin films possess high permeability and low hysteresis loss, enabling rapid response and attenuation of noise signals in the mid-to-high frequency range. The magnetic rings sintered from the mixture of Mn-Zn and Ni-Zn powders, with their wide-band impedance matching advantage, exhibit good suppression of multi-frequency interference from low to high frequencies. Therefore, this embodiment utilizes its impedance characteristics to form a high-impedance path for common-mode current, effectively suppressing high-frequency common-mode interference (such as switching power supply noise). This not only blocks the noise from the vehicle circuitry to the inverter side but also effectively isolates the noise from the inverter's high-frequency switching process from flowing to the vehicle, achieving bidirectional interference blocking.

[0055] In some embodiments, the first rectifier unit 31 is further provided with a first charging port 316 and a second charging port 317. The first charging port 316 and the second charging port 317 are disposed on the first insulating bracket 310 and electrically connected to the current bar 319. The first charging port 316 and the second charging port 317 can be flexibly matched and added or removed according to the charging interface conditions of different vehicles to adapt to the charging needs of various vehicle models. While providing anti-interference performance, the first charging port 316 and the second charging port 317 can also be customized according to the different charging interfaces of different vehicles, and can be flexibly matched and added or removed, thus having strong compatibility, expandability and economy.

[0056] The first charging port 316 is a slow charging port, and the second charging port 317 is a fast charging port. They provide a tighter connection method for the multi-in-one integration. The first charging port 316 and the second charging port 317 can be extended with additional connection points to provide services for compatibility with various usage environments.

[0057] In some embodiments, such as Figure 14 The exploded view of the expandable filter component structure shown indicates that the current strip 319 is integrally injection molded with the first insulating bracket. Specifically, the current strip 319 is encapsulated within the first insulating bracket. The bottom of the first insulating bracket has multiple heat dissipation grooves 330. The functions of the heat dissipation grooves 330 are twofold: first, to position the current strip 319 to prevent displacement during injection molding, which could lead to insulation failure; and second, to provide a heat dissipation area for the current strip 319, expanding the positioning space and increasing the heat dissipation area based on the positioning of the current strip 319. This allows for effective heat dissipation of the current strip 319 under high current conditions and also extends its service life. The current strip 319 can be a copper busbar.

[0058] In some embodiments, the first insulating support is further provided with a spare slot 3125, which is used to expand the rectifier unit module and realize multi-stage filtering function through flexible configuration. This design maintains a compact main structure while dynamically adjusting the filtering strategy according to the electromagnetic environment, significantly improving the system's ability to suppress complex interference and providing a scalable electromagnetic compatibility solution for the equipment.

[0059] In some embodiments, the grounding plate 3120 is a strip structure, and the grounding plate 3120 is provided with a U-shaped connection portion for connecting the pins of the leaded rectifier element. The grounding plate is provided with pins for connecting the second rectifier element 3122 and the fourth rectifier element 3124 in the second assembly position 312 and the fourth assembly position 314, and is connected with a capacitor to form an LC filter network, further reducing the conduction of common-mode noise.

[0060] like Figure 20 The schematic diagram of the current bar 319 shown illustrates that the current bar 319 has several vertical rectangular U-shaped structures. For example... Figure 21The schematic diagram of the grounding plate structure shows that each grounding plate has a circular mounting hole at its bottom, and a 90-degree vertical rectangular U-shaped structure around the circular mounting hole. Each current strip 319 has two rectangular U-shaped welding structures, namely the first welding point, the second welding point, the third welding point, and the fourth welding point. The grounding plate is strip-shaped and has pins for connecting the second rectifier element pin in the second assembly position and the fourth rectifier element pin in the fourth assembly position.

[0061] The second mounting positions 312 and the fourth mounting positions 314, located on both sides of the current bar 319 and at the rear of the rectifier element, are mounting positions for rectifier elements with leads. Both mounting positions are connected to the current bar 319 and the grounding plate. A large-capacity capacitor is connected in parallel at the input terminal, which can not only effectively smooth low-frequency ripples in the DC voltage and improve system stability, but also quickly absorb high-frequency spike noise generated by the switching power supply and reduce electromagnetic interference (EMI). There are four grounding plates 3120, namely the first grounding plate 31201, the second grounding plate 31202, the third grounding plate 31203, and the fourth grounding plate 31204.

[0062] In some embodiments, such as Figure 19 As shown, the third rectifier element 3123 in the magnetic ring mounting position includes an upper magnet 31231 and a lower magnet 31232. The upper magnet has a mountain-shaped structure, and the lower magnet has a straight-line structure. The upper magnet is mounted on the lower magnet to form a through hole for the current bar 319 to pass through, which can enhance the concentration of the magnetic field around the current bar 319. Through the cooperation of the mountain-shaped upper magnet and the straight-line lower magnet, an effective magnetic confinement is formed on the differential mode current in the current bar 319 passing through the through hole, further suppressing the transmission of differential mode noise.

[0063] In some embodiments, such as Figure 14 As shown, the third assembly position has fixed positions on both outer sides, and pre-embedded nuts are provided on the outer sides of the third assembly position. A top pressure plate 340 is provided at the fixed position of the third rectifier element. The top pressure plate 340 has two small ears at both ends for fixing to the first insulating bracket. An elastic body 350 is provided between the top pressure plate 340 and the third rectifier element, and the elastic body 350 is used to buffer vibration. After the third rectifier element is placed in the third assembly position, the elastic body 350 is pressed by the top pressure plate 340.

[0064] The surface of the top pressure plate 340 is provided with two concave pressure platforms, and a long strip-shaped stress relief feature is provided in the middle of the two concave pressure platforms.

[0065] In some embodiments, the current bar 319 has a vertical U-shaped structure and multiple solder joints for connecting the pins of a pinned rectifier element.

[0066] In some embodiments, the power supply unit 1 and the inverter unit 2 are respectively provided with heat dissipation channels. The heat dissipation channels of the power supply unit 1 and the inverter unit 2 are connected in series to form an integrated heat dissipation system, which allows the heat dissipation medium to flow continuously and efficiently through the heat-generating core areas of the two devices, fully removing the heat generated by the power supply unit 1 and the inverter unit 2 during operation and avoiding local overheating. At the same time, the series-connected channel design reduces the redundancy of the heat dissipation system's piping, optimizes the internal space layout of the equipment, and reduces the system's maintenance costs. In addition, the integrated heat dissipation control can achieve precise adjustment of the heat dissipation medium flow rate and temperature, improving the uniformity and stability of heat dissipation.

[0067] The power supply unit 1 includes a power supply housing 101, and the inverter unit 2 includes an inverter housing 201. The power supply housing 101 is provided with an inlet 103, a first flow channel 102, and a first port 104. Figure 6 As shown, the inverter enclosure is provided with a second flow channel 202, a third flow channel 203, a second port 204, a third port 205, a fourth port 206, a cooling pool 207, and an output port 208. The second port 204 is connected to the first port on the lower end face of the power supply enclosure. The cooling pool 207 is located on the side of the inverter enclosure 201 facing the power supply enclosure 101. The inlet 103 is connected to the inlet of the cooling pool 207 through the second flow channel 202, and the outlet of the cooling pool 207 is connected to the output port of the third flow channel 203.

[0068] The second flow channel 202 is an upper and lower drainage pipe. The inlet of the second flow channel 202 is located on one side of the inverter housing 201. The inlet of the second flow channel 202 is connected to the outlet of the first flow channel 102, and the outlet of the second flow channel 202 is connected to the inlet of the cooling pool 207. A second flow channel is provided on the right side of the inverter housing cavity. The position of the second flow channel is perpendicular to the side of the inverter housing so as to guide the water of the power supply unit to the cooling pool of the inverter unit.

[0069] The outlet of the third flow channel 203 is connected to the inlet of the cooling pool. The main body of the flow channel is located on one side and bottom of the inverter box and the power supply box, flowing into the cooling pool from top to bottom, which reduces flow resistance and improves heat dissipation capacity.

[0070] like Figure 7As shown in the top view of the inverter enclosure, the second and third flow channel covers are fixed to the underside of the second and third flow channels of the inverter enclosure via friction stir welding, forming a closed flow channel cavity. The inverter components are bolted to the inverter enclosure. Heat is conducted between the inverter components and the inverter enclosure via self-contained heat dissipation fins, transferring heat to the cooling pool for cooling. During operation, the coolant flows into the first flow channel from the inlet, then through the first port in the first flow channel to the second port inside the inverter enclosure. It then cools the power components through the first flow channel of the power supply enclosure before flowing out of the power supply unit from the first port. The coolant then flows from the first port through the second port back into the second flow channel, then from the second flow channel to the third port and finally into the cooling pool of the inverter enclosure. After cooling the inverter components, the coolant flows out from the fourth port back into the third flow channel, then through the fourth port back into the third flow channel, and finally out from the output port. This concludes the schematic diagram of the specific flow domains of the cooling system. Figure 10 As shown.

[0071] Compared with the prior art, this embodiment connects the heat dissipation areas of the inverter device 2 and the power supply device 1 in series to realize the integration of heat dissipation water channels for multiple power devices, forming an all-in-one heat dissipation system, giving full play to the potential of the heat dissipation system and optimizing the space in the engine compartment of the vehicle.

[0072] like Figure 5 As shown in the top view of the power supply enclosure, the first flow channel 102 inside the power supply unit 1 is a "U"-shaped pipe. The power supply magnetic component is installed in the middle of the flow channel and the magnetic component is encapsulated with heat-dissipating adhesive. In this way, the heat of the magnetic component is carried away by the first flow channel 102. The two ends of the opening of the "U"-shaped pipe are the inlet and outlet of the heat dissipation flow channel, which makes the coolant form a meandering flow path inside the power supply unit 1. It can fully flow through the main heat-generating components inside the power supply unit 1, maximize the heat exchange contact area, and improve the heat dissipation efficiency.

[0073] The first flow channel 102 and the second flow channel 202 are either curved or straight pipes. The third flow channel 203 is a long straight channel.

[0074] In some embodiments, the heat dissipation channel is formed by a combination of grooves and a cover plate on the housing. Specifically, the first channel 102, the second channel 202, and the third channel 203 are all formed by a combination of grooves and a cover plate on the housing. The cover plate and the groove are fixed by welding or screws to form a closed cavity.

[0075] In some embodiments, such as Figure 1As shown, the power supply unit 1 integrates a power supply housing 101, a power supply component 105, a fuse component 106, and a first flow channel cover 107. The inverter unit 2 integrates an inverter housing 201, an expandable filter component 3, a plastic film capacitor 209, an inverter component 210, an output component 211, a second flow channel cover 212, and a third flow channel cover 213. It has a high degree of integration and is easy to connect.

[0076] In some embodiments, the extendable filter component 3 is connected at one end to the power supply device 1 and forms a live circuit at the other end. It can filter the electrical energy output by the power supply device 1, suppress high-frequency interference signals and voltage and current fluctuations, and provide clean electrical energy input for the stable operation of the inverter component 210.

[0077] In some embodiments, such as Figure 12 As shown, the power supply unit 1 has a vent valve 108 on its casing, and a through hole 109 is provided at the junction of the power supply unit 1 and the inverter unit 2. Multiple through holes 109 can be provided. The power supply unit 1 and the inverter unit 2 share a single vent valve 108 to achieve air circulation within the dual casings. Heat from inside the inverter casing rises into the power supply casing through the through hole 109 and is discharged through the vent valve 108. Simultaneously, cool external air enters the power supply casing through the vent valve 108, and then flows back into the inverter casing, thus forming natural air convection. This design effectively improves heat dissipation efficiency through a large heat dissipation area, significantly reduces costs by decreasing the number of vent valves 108, and simplifies the assembly process.

[0078] In some embodiments, such as Figure 10 As shown in the schematic diagram of the plastic film capacitor structure, the inverter 2 contains a plastic film capacitor 209. The plastic film capacitor 209 is fixed to the inverter housing by four fixing points 2091. The plastic film capacitor 209 has a potting opening for conventional plastic film capacitor manufacturing. The bottom potting area 2092 of the plastic film capacitor 209 is open, and the side of the plastic film capacitor 209 has a side potting area 2093, allowing its epoxy resin to directly contact the inverter housing. That is, the bottom of the plastic film capacitor 209 and the housing are in direct contact using an epoxy resin layer, forming a continuous heat conduction interface. This is particularly suitable for high-frequency charge / discharge scenarios, effectively suppressing local temperature rise of the capacitor and extending the lifespan of the plastic film capacitor 209.

[0079] In some embodiments, such as Figure 13The schematic diagram of the cover protection structure shown illustrates the safety protection mechanism. The maintenance cover 111 is secured with tamper-evident screws 110. Below the maintenance cover 111 is a protective cover 112, secured with two hexagonal pan head screws 113. The protective cover 112 integrates a standardized voltage detection port 116, allowing maintenance personnel to test for high voltage before disassembly, preventing direct contact with live components. This facilitates safe testing while avoiding direct exposure of live parts. By combining mechanical protection with functional integration, the risk of accidental contact is effectively prevented, while simultaneously meeting rapid testing requirements and complying with electrical equipment safety regulations.

[0080] Furthermore, this embodiment features a dual-layer protection mechanism, with an upper small cover plate 115 and a protective cover 112 below the small cover plate 115. A high-voltage safety detection port is provided on the protective cover 112 to prevent maintenance personnel from directly contacting live components.

[0081] In some embodiments, such as Figure 9 The schematic diagram of the sealing cover structure shown indicates that sealing cover plates 114 are respectively provided at the ends of the power supply box 101. The sealing cover plate 114 is a square die-cast part. The surface of the sealing cover plate 114 is provided with reinforcing ribs to improve the strength and modality of the sealing cover plate 114. The sealing cover plate 114 is fixed to the power supply box to achieve sealing of the assembly.

[0082] The aforementioned MCU and power supply integration structure, through structural innovation, improves heat dissipation performance while taking cost-effectiveness into account, and provides multiple safety guarantees for maintenance operations, making it suitable for the field of high-reliability power electronic equipment.

[0083] According to an embodiment of the present invention, in a second aspect, a method for mounting an MCU and a power supply integrated structure is provided, the mounting process including the following steps: First, the inverter unit 2 is installed: the second and third flow channel cover plates inside the inverter enclosure are respectively connected to the second and third flow channels of the enclosure by friction stir welding to form a closed cooling channel; then the inverter assembly is connected to the cooling pool with bolts to achieve a seal in the cooling pool; simultaneously, the assembly of the expandable filter assembly is completed: the current bar 319 is encased in plastic inside the first insulating bracket. Next, the first, third, and fifth rectifier components are sequentially placed in the first, third, and fifth assembly positions; the second rectifier component is placed in the second assembly position, with its two terminals electrically connected to the first and second welding points of the current bar 319, and the other two terminals electrically connected to the first and second grounding plates respectively; the fourth rectifier component is placed in the fourth assembly position, with its two terminals electrically connected to the third and fourth welding points of the current bar 319, and the other two terminals electrically connected to the third and fourth grounding plates respectively. Next, the first, fourth, and fifth rectifier elements within the insulating bracket are potted and fixed. Then, the second rectifier unit is placed above the first rectifier unit and fixed. The lower magnet on the fourth rectifier element is placed above the lower magnet in the third assembly position, and an elastic body 350 is placed on top of the upper magnet for cushioning protection. Then, the top cover plate is pressed onto the first insulating bracket, ensuring its protrusion precisely presses against the upper magnet. Subsequently, the expandable filter assembly, output assembly, and other components are installed into the inverter enclosure. It is important to note that a sealing ring should be installed at the bottom of the inverter assembly before fixing it above the cooling pool to ensure efficient heat dissipation from the inverter assembly by the cooling pool's water cooling system.

[0084] Next is the installation of power supply unit 1: the first flow channel cover plate inside the power supply unit and the first flow channel of the power supply box are connected by friction stir welding to form a closed cooling channel to ensure the flow channel is sealed; then the fuse assembly (left side) and the power supply assembly (right side) are installed into the power supply box; finally, the power supply unit is fixed above the inverter unit, and the power input and other load power are electrically connected through the expandable filter assembly.

[0085] Finally, the sealing cover is installed: the sealing cover plate 114 is placed over the upper surface of the power supply unit and secured with bolts. Simultaneously, a vent valve is installed on the side wall of the upper power supply unit to achieve assembly sealing. At this point, the installation process of the integrated charging and inverter device is complete, achieving the preset heat dissipation and cooling effect. Subsequently, only water circuits need to be connected to the inlet and outlet, and the output components inside the inverter device need to be connected to the three-phase windings of the motor to realize all the preset functions of the electric vehicle MCU and power supply integrated structure described in this invention.

[0086] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. An integrated MCU and power supply structure, characterized in that, It includes a power supply unit (1) and an inverter unit (2) arranged in layers. The power supply unit (1) and the inverter unit (2) are electrically connected through an expandable filter component (3), which is used to transmit electrical energy and suppress electromagnetic interference.

2. The MCU and power supply integrated structure according to claim 1, characterized in that, The expandable filter component (3) includes a multi-stage rectifier unit, which includes a magnetic ring assembly position and a rectifier element assembly position.

3. The MCU and power supply integrated structure according to claim 2, characterized in that, The scalable filter component (3) includes a first rectifier unit (31) and a second rectifier unit (32); The first rectifier unit (31) includes a first insulating bracket (310), a current bar (319), a battery input interface (318), a grounding plate (3120), a first rectifier element (3121), a second rectifier element (3122), a third rectifier element (3123), and a fourth rectifier element (3124). The first insulating bracket (310) is provided with a first assembly position (311), a second assembly position (312), a third assembly position (313), a fourth assembly position (314), and a fifth assembly position (315). The first assembly position (311) is used to install the first rectifier element (3121), the second assembly position (312) is used to install the second rectifier element (3122), the third assembly position (313) is used to install the third rectifier element (3123), and the fourth assembly position (314) is used to install the fourth rectifier element (3124). The second rectifier unit (32) includes a second insulating bracket (322) and a fifth rectifier element (323). The second insulating bracket (322) is installed in a fifth assembly position (315). A sixth assembly position (321) is provided on the second insulating bracket (322). The fifth rectifier element (323) is installed in the sixth assembly position (321). The first assembly position (311), the third assembly position (313) and the sixth assembly position (321) are magnetic ring mounting positions, and the second assembly position (312) and the fourth assembly position (314) are pinned rectifier mounting positions; the expandable filter component (3) supports fifth-order rectification to achieve bidirectional interference blocking.

4. The MCU and power supply integrated structure according to claim 3, characterized in that, The rectifier element assembled in the magnetic ring mounting position is a ring magnetic ring, which is made by winding a nano-scale crystal thin film or sintering a mixture of Mn-Zn and Ni-Zn powders.

5. The MCU and power supply integrated structure according to claim 3, characterized in that, The first rectifier unit (31) is also provided with a first charging port (316) and a second charging port (317). The first charging port (316) and the second charging port (317) are disposed on the first insulating bracket (310) and electrically connected to the current bar. The first charging port (316) and the second charging port (317) can be flexibly matched and added or removed according to the charging interface conditions of different vehicles to adapt to the charging needs of various vehicle models.

6. The MCU and power supply integrated structure according to claim 3, characterized in that, The current bar and the first insulating bracket are integrally injection molded. The bottom of the first insulating bracket is provided with multiple heat dissipation grooves, which are used to position the current bar and expand the heat dissipation area of ​​the current bar.

7. The MCU and power supply integrated structure according to claim 3, characterized in that, The first insulating bracket is also provided with a spare slot, which is used to expand the rectifier unit module.

8. The MCU and power supply integrated structure according to claim 3, characterized in that, The grounding plate has a strip-shaped structure and is provided with a U-shaped connection part for connecting the pins of the leaded rectifier element; And / or, the third rectifier element in the magnetic ring mounting position includes an upper magnet and a lower magnet, the upper magnet is mounted on the lower magnet to form a through hole for the current bar to pass through, the third assembly position is provided with a top pressure plate, and an elastic body is provided between the top pressure plate and the third rectifier element, the elastic body being used to buffer vibration; And / or, the current bar has a vertical U-shaped structure and multiple solder joints for connecting the pins of a leaded rectifier element.

9. The MCU and power supply integrated structure according to claim 1, characterized in that, The power supply device (1) and the inverter device (2) are respectively provided with heat dissipation channels, and the heat dissipation channels of the power supply device (1) and the inverter device (2) are connected in series to form an integrated heat dissipation system.

10. The MCU and power supply integrated structure according to claim 9, characterized in that, The power supply device (1) includes a power supply box (101), and the inverter device (2) includes an inverter box (201). The power supply box (101) is provided with an inlet (103), a first flow channel (102) and a first port (104). The inverter box is provided with a second flow channel (202), a third flow channel (203), a second port (204), a third port (205), a fourth port (206), a cooling pool (207) and an output port (208). The cooling pool (207) is located on the side of the inverter box (201) facing the power supply box (101). The inlet (103) is connected to the second flow channel (202) through the first flow channel (102). The second flow channel (202) is connected to the inlet of the cooling pool (207). The outlet of the cooling pool (207) is connected to the third flow channel (203).

11. The MCU and power supply integrated structure according to claim 10, characterized in that, The second flow channel (202) is an upper and lower flow channel to allow the cooling medium to flow into the cooling pool from top to bottom; And / or, the first flow channel (102) in the power supply device (1) is a "U" shaped pipe, and the two ends of the opening of the "U" shaped pipe are the inlet and outlet of the heat dissipation flow channel, respectively.

12. The MCU and power supply integrated structure according to any one of claims 1-11, characterized in that, The power supply device (1) is equipped with a vent valve on its housing. The power supply device (1) and the inverter device (2) are connected by a through hole. The vent valve and the through hole work together to achieve air convection inside the dual housings.

13. The MCU and power supply integrated structure according to any one of claims 1-11, characterized in that, The inverter (2) is equipped with a plastic film capacitor. The bottom of the plastic film capacitor and the casing of the inverter (2) are in direct contact through an epoxy resin layer to form a heat conduction interface.

14. The MCU and power supply integrated structure according to any one of claims 1-11, characterized in that, The power supply device (1) is provided with a maintenance cover on the top, which is fixed with anti-disassembly screws, and a protective cover is provided below the maintenance cover; the protective cover is provided with a high-voltage safety detection port to prevent maintenance personnel from directly contacting live parts.

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