Optical connection assembly and installation method

Abstract

This optical connection assembly is provided with a first optical connection member (110) and a second optical connection member (120) including at least one optical waveguide (500). One of the first optical connection member and the second optical connection member has a protruding portion (150), and the other of the first optical connection member and the second optical connection member has a hole portion (120d). The first optical connection member and the second optical connection member form a positioning structure that maintains a relative position with respect to each other by insertion of the protruding portion into the hole portion. The first optical connection member includes: a first reference surface (110a) provided with a protruding portion or a hole portion; and an opening (110c) that is formed in the first reference surface and exposes the light input / output section on the main surface from the first reference surface. The second optical connection member includes: a second reference surface (120b) provided with a protruding portion or a hole portion and facing the first reference surface; and a connection end surface (120a) protruding from the second reference surface and disposed inside the opening, the connection end surface (120a) facing the main surface exposed from the opening, and the connection end surface (120a) exposing the tip of the optical waveguide and facing the optical input / output section on the main surface. The distance between the connection end surface and the main surface (30a) exposed from the opening is 50 [mu] m or less.

Description

Technical Field

[0001] This disclosure relates to optical connection components and installation methods. This application claims priority based on Japanese Application No. 2023-144202, filed on September 6, 2023, and invokes all the contents described in the said Japanese application. Background Technology

[0002] An optical communication module that enables optical communication via an optical transmission medium such as optical fiber has a structure in which a communication LSI (Large Scale Integration) and multiple optical IC (Integrated Circuit) substrates electrically connected to the communication LSI are mounted on the same substrate. An optical connection assembly for optically connecting the optical ICs to the optical transmission medium is mounted on the optical IC substrate. For example, Patent Document 1 discloses an optical connection assembly in which a socket disposed on the optical IC substrate and a ferrule holding the tip portion of an optical fiber are engaged using guide pins. In this optical connection assembly, the ferrule and the socket are configured to face each other at a distance. The optical fiber and the optical IC are optically connected via lenses respectively provided on the ferrule and the socket.

[0003] Existing technical documents Patent documents Patent Document 1: U.S. Patent Application Publication No. 2016 / 0370544 Summary of the Invention

[0004] The optical connection component disclosed herein includes: a first optical connection member disposed on the main surface of a circuit board including at least one optical input / output portion; and a second optical connection member including at least one optical waveguide connected to the first optical connection member. One of the first and second optical connection members has a protrusion, and the other of the first and second optical connection members has an aperture. The first and second optical connection members form a positioning structure that maintains their relative positions by inserting the protrusion into the aperture. The first optical connection member includes: a first reference surface having the protrusion or aperture; and an opening formed on the first reference surface, allowing the optical input / output portion on the main surface to be exposed from the first reference surface. The second optical connection member includes: a second reference surface having the protrusion or aperture opposite to the first reference surface; and a connection end face protruding from the second reference surface and disposed inside the opening. The connection end face is opposite to the main surface exposed from the opening. On the connection end face, the top end of the optical waveguide is exposed and opposite to the optical input / output portion on the main surface. The distance between the connection end face and the main surface exposed from the opening is less than or equal to 50 μm. Attached Figure Description

[0005] Figure 1AThis is a top view illustrating an example of an optical communication module to which the optical connection components of this disclosure can be applied.

[0006] Figure 1B It means Figure 1A A cross-sectional view of the optical connection component.

[0007] Figure 2 This is a perspective view of the optical connection component shown in Figure 1.

[0008] Figure 3 It is along Figure 2 A cross-sectional view of the optical connector assembly of line III-III.

[0009] Figure 4 It is an omission Figure 3 A cross-sectional view showing a portion of the optical connection component.

[0010] Figure 5 This is a cross-sectional view showing the situation where the second optical connection component is connected to the first optical connection component.

[0011] Figure 6 It is Figure 3 A magnified cross-sectional view of the main part of the optical connection component.

[0012] Figure 7 is a diagram illustrating one step of the installation method of this disclosure.

[0013] Figure 7B It means Figure 7A The diagram shows the subsequent processes.

[0014] Figure 8A It means Figure 7B The diagram shows the subsequent processes.

[0015] Figure 8B It means Figure 8A The diagram shows the subsequent processes.

[0016] Figure 9 This is a cross-sectional view showing the optical connection component of Modified Example 1.

[0017] Figure 10 This is a cross-sectional view showing the optical connection component of Modified Example 2.

[0018] Figure 11A This is a cross-sectional view showing the optical connection assembly of Modified Example 3.

[0019] Figure 11B This indicates that it will constitute Figure 11A A cross-sectional view of the second optical connection component of the optical connection assembly connected to the first optical connection component.

[0020] Figure 12AThis is a cross-sectional view showing the optical connection component of variant example 4.

[0021] Figure 12B This indicates that it will constitute Figure 12A A cross-sectional view of the second optical connection component of the optical connection assembly connected to the first optical connection component.

[0022] Figure 13A This is a cross-sectional view showing the optical connection assembly of Modified Example 5.

[0023] Figure 13B This indicates that it will constitute Figure 13A A cross-sectional view of the second optical connection component of the optical connection assembly connected to the first optical connection component. Detailed Implementation

[0024] [The problem this disclosure aims to solve] As with the optical connector assemblies described above, when optical fibers and optical ICs are optically connected via lenses, lenses need to be placed on both the ferrule and the socket, thus complicating the structure of the optical connector assembly. Furthermore, when using lenses that amplify the beam, the angle dependence of the beam on connection loss increases, thus amplifying the impact of lens angular deviation on connection loss. With the miniaturization of optical communication modules in recent years, as the optical IC substrate approaches the high-temperature conditions of communication LSIs, the optical connector assemblies on the optical IC substrate are exposed to high-temperature environments caused by the heat of the communication LSI. Therefore, strain occurs due to the difference in the linear thermal expansion coefficients between the ferrule and the optical IC substrate, resulting in lens angular deviation. Consequently, the connection loss between the optical fiber and the optical IC is likely to increase.

[0025] In cases where the optical fiber and optical IC are optically connected without a lens, for example, an adhesive structure can be considered to directly fix the ferrule to the optical IC substrate instead of a mating structure using guide pins. In this case, as mentioned above, when the optical connection assembly is exposed to a high-temperature environment, strain caused by the difference in the linear coefficients of thermal expansion between the ferrule and the optical IC substrate can lead to the ferrule peeling off from the optical IC substrate. Such peeling is also a major cause of increased connection loss between the optical fiber and the optical IC.

[0026] This disclosure provides an increased optical connection assembly with a simple configuration that reduces connection loss, as well as an installation method.

[0027] [Effects of this disclosure] According to the optical connection component and installation method disclosed herein, the increase in connection loss can be reduced with a simple configuration.

[0028] [Description of embodiments of this disclosure] First, the contents of the embodiments of this disclosure will be described.

[0029] (1) The optical connection component of the present disclosure comprises: a first optical connection component, disposed on the main surface of a circuit board including at least one optical input / output portion; and a second optical connection component, including at least one optical waveguide, connected to the first optical connection component, one of the first optical connection component and the second optical connection component having a protrusion, the other of the first optical connection component and the second optical connection component having an aperture, the first optical connection component and the second optical connection component forming a positioning structure for maintaining their relative positions to each other by inserting the protrusion into the aperture, the first optical connection component comprising: a first reference surface having a protrusion or an aperture; and an opening formed on the first reference surface, such that the optical input / output portion on the main surface is exposed from the first reference surface, the second optical connection component comprising: a second reference surface having a protrusion or an aperture, opposite to the first reference surface; and a connection end face protruding from the second reference surface and disposed inside the opening, the connection end face being opposite to the main surface exposed from the opening, wherein the top end of the optical waveguide is exposed on the connection end face and is opposite to the optical input / output portion on the main surface, and the distance between the connection end face and the main surface exposed from the opening is less than or equal to 50 μm.

[0030] In the aforementioned optical connection assembly, a connection end face protruding from the first reference surface of the first optical connection member is disposed inside an opening formed on the second reference surface of the second optical connection member, facing the main surface exposed from the opening. The top tip of the optical waveguide exposed from the connection end face faces the optical input / output portion on the main surface. The distance between the connection end face and the main surface of the circuit board exposed from the opening is less than or equal to 50 μm. If the distance between the connection end face and the main surface of the circuit board is reduced in this way, even when the optical waveguide is directly opposite the optical input / output portion without a lens, the connection loss between the optical waveguide and the optical input / output portion can be sufficiently reduced. That is, the optical waveguide and the optical input / output portion can be optically connected with low loss using a simple configuration without the use of a lens. Moreover, if the lens can be omitted in this way, even in high-temperature environments, the increase in connection loss due to lens angular displacement can be avoided. Furthermore, when the relative positions of the second optical connection member and the first optical connection member on the main surface of the circuit board are maintained by a positioning structure as described above, the first optical connection member can be fixed to the circuit board without adhesive. Therefore, the increased connection loss caused by the peeling of the first optical connection component from the circuit board can also be avoided. Thus, according to the above-described optical connection assembly, the increase in connection loss can be reduced with a simple configuration.

[0031] (2) In the optical connection assembly described in (1) above, a gap may be formed between the first reference surface and the second reference surface. To flatten the connection end face of the exposed optical waveguide, the connection end face is sometimes ground. In this case, the amount of grinding on the connection end face may result in a certain manufacturing error. Therefore, in the above configuration, a gap is formed between the first reference surface and the second reference surface. In this case, even if an error occurs in the amount of grinding on the connection end face, the gap can absorb that error. Thus, when the second optical connection component is connected to the first optical connection component, the first reference surface and the second reference surface can be prevented from contacting each other before the connection end face contacts the main surface. As a result, the connection end face can be brought sufficiently close to the main surface, thus more effectively reducing the increase in connection loss between the optical waveguide and the optical input / output section.

[0032] (3) In the optical connection assembly described in (2) above, the width of the gap from the first reference surface to the second reference surface may be greater than or equal to 20 μm and less than or equal to 1 mm. When the width of the gap is greater than or equal to 20 μm, the error amount of grinding on the connection end face can be absorbed more reliably through the gap. Moreover, when the width of the gap is less than or equal to 1 mm, the insertion length of the protrusion into the hole can be prevented from becoming excessively short. As a result, the relative position of the first optical connection member and the second optical connection member maintained by the insertion of the protrusion into the hole can be prevented from becoming unstable. Therefore, in the above configuration, the relative position of the first optical connection member and the second optical connection member can be maintained more stably, and the increase in connection loss between the optical waveguide and the optical input / output section can be reduced more effectively.

[0033] (4) In any of the optical connection components described in (1) to (3) above, the distance from the second reference surface to the connection end face may be longer than the distance from the first reference surface to the main surface. In this case, even if an error occurs in the grinding amount of the connection end face, when the second optical connection component is connected to the first optical connection component, it is possible to prevent the first reference surface from contacting the second reference surface before the connection end face contacts the main surface. As a result, the connection end face can be brought close enough to the main surface, thus more effectively reducing the increase in connection loss between the optical waveguide and the optical input / output section.

[0034] (5) In any one of (1) to (4) above, the second optical connection component may also be composed of a component having a diameter greater than or equal to 0.5 × 10⁻⁶. -5 [ / K] and less than or equal to 5 × 10 -5A resin material with a linear coefficient of thermal expansion of [ / K] is formed. In this case, even if a material such as glass or metal is chosen as the material for the first optical connector, the difference between the linear coefficient of thermal expansion of the second optical connector and that of such a material can be reduced. This reduces the likelihood of significant positional misalignment between the first and second optical connectors due to thermal stress caused by the difference in their linear coefficients of thermal expansion. It should be noted that examples of resin materials for the second optical connector include those with a coefficient of thermal expansion of less than or equal to 1 × 10⁻⁶. -5 LCPs (liquid crystal polymers) with a linear coefficient of thermal expansion of [ / K] and those with a coefficient of thermal expansion of less than or equal to 2.5 × 10⁻⁶ -5 The linear coefficient of thermal expansion of PPS (polyphenylene sulfide) is given by [ / K].

[0035] (6) In any of the optical connection components described in (1) to (5) above, an anti-reflective film may also be formed on the connection end face to prevent light reflection at the connection end face. When the top end of the optical waveguide exposed from the connection end face of the second optical connection component is directly opposite the optical input / output portion of the circuit board without passing through other components such as lenses and adhesives, due to manufacturing errors, sometimes the top end of the optical waveguide does not completely contact the optical input / output portion, thus forming a gap between the top end of the optical waveguide and the optical input / output portion. In the presence of such a gap, the effect of reflected light between the optical waveguide and the optical input / output portion may become a problem. In this regard, when an anti-reflective film is provided on the connection end face, even if a gap is formed between the top end of the optical waveguide and the optical input / output portion, the reflected light between the optical waveguide and the optical input / output portion can be effectively reduced, thus reducing the reduction in optical properties caused by reflected light.

[0036] (7) In any of the optical connection components described in (1) to (6) above, a spacer may be provided between the connection end face and the main surface exposed from the opening, and the thickness of the spacer is greater than or equal to 1 μm and less than or equal to 20 μm. In this case, by abutting the spacer against the connection end face of the second optical connection component and the main surface of the circuit board, the distance between the connection end face and the main surface can be maintained at greater than or equal to 1 μm and less than or equal to 20 μm. By making the thickness of the spacer less than or equal to 20 μm, the distance between the connection end face and the main surface can be shortened. As a result, the connection loss between the optical waveguide exposed from the connection end face and the optical input / output portion on the main surface can be reduced more effectively. Moreover, when a spacer is provided between the connection end face and the main surface in this way, a gap can be formed between the optical waveguide and the optical input / output portion. In this case, unlike the case where the optical waveguide directly abuts against the optical input / output portion, foreign matter such as dust that may exist between the optical waveguide and the optical input / output portion can be prevented from being crushed by the optical waveguide and covering the optical waveguide. As a result, it is possible to avoid the increase in connection loss between the optical waveguide and the optical input / output section caused by foreign objects.

[0037] (8) In any one of (1) to (7) above, the first optical connection component may also be composed of a component having a density greater than or equal to 1 × 10⁻⁶. -6 [ / K] and less than or equal to 7 × 10 -6 A metallic material with a linear coefficient of thermal expansion of [ / K] is formed. By selecting a metallic material as the material for the first optical connection component in this way, it is possible to reduce the occurrence of damage to the first optical connection component during the insertion of the protrusion into the hole. Moreover, a coefficient of thermal expansion greater than or equal to 1×10⁻⁶ is used. -6 [ / K] and less than or equal to 7 × 10 -6 The linear thermal expansion coefficient of [ / K] is similar to that of the material (e.g., silicon) constituting the circuit substrate on which the first optical connection component is mounted. Therefore, even when the optical connection component is used in a high-temperature environment, the occurrence of damage to the first optical connection component due to thermal stress caused by the difference between the linear thermal expansion coefficient of the first optical connection component and that of the circuit substrate can be reduced. Examples of metallic materials for the first optical connection component include those having a linear thermal expansion coefficient of less than or equal to 5 × 10⁻⁶. -6 Kovar (K-iron-nickel-cobalt alloy) has a linear thermal expansion coefficient of [ / K] and has a coefficient of less than or equal to 2 × 10⁻⁶. -6 The linear thermal expansion coefficient of Invar (Invar iron-nickel alloy) of [ / K].

[0038] (9) In any of the optical connection components described in (1) to (7) above, the first optical connection component may also be formed of a glass material. Glass materials are heat-resistant and have a small linear coefficient of thermal expansion, even in high-temperature environments of 85°C or higher, which are difficult for resins such as PPS (Poly Phenylene Sulfide) and PEI (Poly Ether Imide) commonly used in optical connectors. Therefore, as a component for connecting an optical waveguide to a circuit board located near a heat-generating semiconductor such as an ASIC (Application Specific Integrated Circuit), whose practical application is expected to advance in the future, the use of glass components can be expected to expand. Furthermore, the linear coefficient of thermal expansion of the glass material is similar to that of the material constituting the circuit board (e.g., silicon), thus reducing the likelihood of the first optical connection component breaking due to thermal stress caused by the difference between the linear coefficient of thermal expansion of the first optical connection component and that of the circuit board, even when the optical connection component is used in a high-temperature environment. Furthermore, by using a glass material that can transmit ultraviolet light, the first optical connection component can be easily fixed to the main surface of the circuit board using an ultraviolet-curable adhesive.

[0039] (10) In the optical connection assembly described in (9) above, the protrusion may be composed of a guide pin that is fixed to the first optical connection member when inserted into a guide hole formed on the first reference surface. Alternatively, the gap between the outer surface of the guide pin and the inner surface of the guide hole may be less than or equal to 2 μm. Alternatively, the guide pin may be formed of a material having a linear thermal expansion coefficient less than or equal to 10 times that of the glass material of the first optical connection member. By providing a gap of less than or equal to 2 μm between the inner surface of the guide hole of the first optical connection member and the outer surface of the guide pin, the thermal expansion of the guide pin can be absorbed through the gap even if thermal expansion occurs in a high-temperature environment. As a result, the occurrence of damage to the first optical connection member due to thermal expansion of the guide pin can be reduced. Furthermore, by making the material of the guide pin have a linear thermal expansion coefficient that is less than or equal to 10 times that of the glass material, even when using the optical connection assembly in a high-temperature environment, the following situation can be reduced: the first optical connection component is damaged due to thermal stress caused by the difference between the linear thermal expansion coefficient of the first optical connection component and the linear thermal expansion coefficient of the guide pin.

[0040] (11) In the optical connector assembly described in (10) above, a coating made of resin material may be provided on the inner surface of the guide hole. Since the glass material of the first optical connector is brittle, it is assumed that when the protrusion is inserted into the hole, the following problems may occur: the first optical connector may chip or break due to excessive force applied from the second optical connector to the first optical connector. In this regard, in the above configuration, a coating is formed on the inner surface of the guide hole of the first optical connector. Therefore, when the protrusion is inserted into the hole, the problems of chipping and breakage of the first optical connector can be reduced. Furthermore, by partially forming the coating on the glass first optical connector, the heat resistance of the glass material of the first optical connector can be effectively utilized, and the coating can strengthen the parts of the first optical connector prone to problems.

[0041] (12) In any of the optical connection components described in (1) to (11) above, the hole may be located on the second reference surface, the optical waveguide may be composed of an optical fiber held in the second optical connection component, an optical fiber insertion hole for inserting an optical fiber may be formed on the connection end face, or the optical fiber insertion hole may extend parallel to the hole. Assuming that the optical fiber insertion hole extends obliquely relative to the hole, during the grinding process of the connection end face, depending on the amount of grinding, the opening position of the optical fiber insertion hole and the opening position of the hole on the connection end face may shift significantly. Therefore, when the optical fiber insertion hole extends parallel to the hole, it is possible to prevent a significant positional shift in the opening position of the optical fiber insertion hole and the opening position of the hole due to the grinding process. This reduces the decrease in the positioning accuracy of the optical fiber caused by the positional shift in the opening position of the optical fiber insertion hole and the opening position of the hole.

[0042] (13) In any one of (1) to (12) above, the optical connection assembly may also include: a pair of protrusions disposed on the first reference surface; and a pair of holes disposed on the second reference surface. Alternatively, when the linear thermal expansion coefficient of the first optical connection component is set to C1 [ / K], the linear thermal expansion coefficient of the second optical connection component is set to C2 [ / K], the center-to-center distance between the pair of holes at room temperature is set to L1 [mm], and the ambient temperature is set to T [K], the relationship of formula (1) holds. By selecting the material and size of the first optical connector, the material and size of the second optical connector, and the temperature range of the ambient temperature in a manner that satisfies the above formula (1), even if the first and second optical connectors undergo thermal expansion in a high-temperature environment, the positional offset of the optical waveguide relative to the optical input / output section can be controlled within an allowable range.

[0043] (14) In any of the optical connection components described in (1) to (13) above, the positioning structure may include: a pair of protrusions provided on the first reference surface; and a pair of holes provided on the second reference surface. Alternatively, the pair of protrusions may be composed of a pair of guide pins fixed to the first optical connection component when inserted into a pair of guide holes formed on the first reference surface. Alternatively, when the linear thermal expansion coefficient of the first optical connection component is set to C1 [ / K], the linear thermal expansion coefficient of the second optical connection component is set to C2 [ / K], the center-to-center spacing of the pair of holes at room temperature is set to L1 [mm], the center-to-center spacing of the pair of guide holes at room temperature is set to L2 [mm], and the ambient temperature is set to T [K], the relationship of formula (2) holds. By selecting the material and size of the first optical connector, the material and size of the second optical connector, and the temperature range of the ambient temperature in a manner that satisfies the relationship of the above formula (2), even if the first and second optical connectors undergo thermal expansion in a high-temperature environment, the positional offset of the optical waveguide relative to the optical input / output section can be controlled within an acceptable range. Moreover, in this case, even if there is a difference in thermal expansion between the first and second optical connectors, the occurrence of damage to one or both of the first and second optical connectors due to the difference in thermal expansion can be reduced.

[0044] (15) Alternatively, the optical connection assembly described in any one of (1) to (14) above may further include a clamping member for gripping the first optical connection member and the second optical connection member. Alternatively, the clamping member may include: a base configured to face the first reference surface of the first optical connection member across the second optical connection member; a pair of arms extending from the base past the outside of the second optical connection member to positions opposite to a pair of side surfaces of the first optical connection member; and a pair of hooks protruding from the pair of arms toward the pair of side surfaces. Alternatively, a pair of stepped portions may be formed on the pair of side surfaces for engaging the pair of hooks respectively. In this case, the clamping member for gripping the first optical connection member and the second optical connection member is provided to address the possibility of the protrusion falling off the hole, thereby stably maintaining the connection state between the first optical connection member and the second optical connection member.

[0045] (16) The mounting method of this disclosure mounts the first optical connection component of the optical connection assembly as described in any one of (1) to (15) above onto the main surface of the circuit board. The mounting method includes the following steps: preparing a first wafer and a second wafer, wherein the first wafer is formed with a plurality of first optical connection components arranged in a two-dimensional manner, and the second wafer is formed with a plurality of circuit boards arranged in a two-dimensional manner; positioning the first wafer relative to the second wafer in such a way that the plurality of first optical connection components overlap with the plurality of circuit boards respectively; bonding the first wafer to the second wafer in the state where the first wafer is positioned relative to the second wafer; and cutting the first wafer and the second wafer to monolithize them, thereby forming a plurality of first optical connection components with circuit boards.

[0046] In the above-described mounting method, unlike the case where the first and second wafers are individually monolithized and each first optical connector is individually aligned with each circuit board, if the first wafer is positioned relative to the second wafer, each first optical connector can be aligned with each circuit board simultaneously. That is, in the above-described mounting method, if the alignment of each first optical connector with one circuit board is performed once, the alignment of the first optical connector with all circuit boards can be performed. Therefore, compared to the case where alignment is performed according to the number of circuit boards, the alignment process can be reduced to one step. Thus, according to the above-described mounting method, the mounting process of the first optical connector can be simplified.

[0047] [Details of the embodiments disclosed herein] The following detailed description, with reference to the accompanying drawings, provides specific examples of the optical connection components and installation methods of this disclosure. The invention is not limited to these examples, but is illustrated by the claims, which are intended to include all modifications within the meaning and scope equivalent to the claims. In the description of the drawings, the same reference numerals are used to refer to the same elements, and repeated descriptions are omitted.

[0048] Figure 1A This is a top view showing an example of an optical communication module 10 to which the optical connection component 100 of this embodiment can be applied. Figure 1B This is a cross-sectional view of the optical communication module 10. It should be noted that, for convenience, [the following text is incomplete and requires further context: "... "] Figure 1AThe shaded lines represent portions of the optical connection assembly 100. The optical communication module 10 performs optical communication via multiple optical fibers 500 (optical waveguides). The optical communication module 10 includes, for example, a communication LSI 20, multiple optical IC substrates 30 (circuit boards), and multiple optical connection assemblies 100. The optical communication module 10 has, for example, a structure in which the communication LSI 20 and multiple optical IC substrates 30 are mounted on the same substrate 50. Each optical IC substrate 30 is connected to the communication LSI 20 via electrical wiring 40. The substrate 50 is, for example, an interposer substrate. The electrical wiring 40 connects the optical IC substrates 30 to the communication LSI 20, for example, through the interior of the substrate 50. The electrical wiring 40 may also connect the optical IC substrates 30 to the communication LSI 20 through the surface of the substrate 50. In order to connect the optical input / output section 31 (see below) of the optical IC substrate 30... Figure 3 The optical connection components 100 are optically connected to the optical IC substrate 30 in a state that allows them to be detached from the optical IC substrate 30.

[0049] It should be noted that, in order to achieve effective utilization of storage space, the optical communication module 10 requires miniaturization. With the miniaturization of the optical communication module 10, such as... Figure 1A and Figure 1B As shown, the optical IC substrate 30 approaches the communication LSI 20, which becomes extremely hot. As a result, the optical connection components 100 on the optical IC substrate 30 are exposed to a high-temperature environment (e.g., greater than or equal to 85°C) caused by the heat emitted by the communication LSI 20. The optical communication module 10 of this embodiment is designed to be used under such a high-temperature environment.

[0050] Figure 2 This is a perspective view of the optical connection component 100. Figure 3 It is along Figure 2 A cross-sectional view of the optical connector assembly of line III-III. (See attached image.) Figure 2 and Figure 3 As shown, the optical connection assembly 100 includes, for example, a first optical connection member 110 and a second optical connection member 120. In the optical connection assembly 100, the first optical connection member 110 is placed on the main surface 30a of the optical IC substrate 30, and the second optical connection member 120 is disposed at a position opposite to the first optical connection member 110 in the vertical direction. Furthermore, the first optical connection member 110 and the second optical connection member 120 are positioned opposite each other in the vertical direction and are connected along the vertical direction.

[0051] like Figure 3As shown, each optical fiber 500 held in the second optical connection member 120 is optically connected to each optical input / output section 31 of the optical IC substrate 30 via the first optical connection member 110. The first optical connection member 110 and the second optical connection member 120 can also be positioned opposite each other in a horizontally opposite state, or they can be connected along the horizontal direction.

[0052] The optical fiber 500 held by the second optical connection component 120 is, for example, suitable for accommodating flexible bending shapes, and is preferably an optical fiber with low bending loss (hereinafter referred to as "low bending loss optical fiber"). That is, it is suitable that the optical fiber 500 has bending loss characteristics according to ITU-T international standard G.657.B3. The optical fiber 500 may also have bending loss characteristics lower than those according to the aforementioned standard. As a low bending loss optical fiber, it is suitable that the optical confinement function of the fiber core is enhanced. Low bending loss optical fiber is achieved, for example, by a structure in which the refractive index of the fiber core is higher than that of the fiber core in a typical optical fiber, or by a refractive index structure in which a trench layer with a refractive index lower than that of the cladding is provided between the fiber core and the cladding. In order to maintain the outer diameter of the optical fiber according to the aforementioned standard, a sheath layer is usually provided on the outer periphery of the cladding.

[0053] The composition of optical fiber 500 can be achieved by appropriately adding dopants to silica glass to control its refractive index. As an example, optical fiber 500 includes: a core, primarily composed of silica glass with added germanium dioxide (GeO2); a cladding, primarily composed of pure silica glass or silica glass with added fluorine (F); and a sheath, primarily composed of pure silica glass. This optical fiber composition yields optical fiber 500 with good economic efficiency and shape control. The sheath may or may not contain chlorine (Cl). GeO2 and F may also be added to the core. To improve the strength of optical fiber 500, during the manufacturing stage, methods such as coating the outer periphery of the glass portion with a carbon coating and adjusting the thermal process during fiber drawing to apply compressive strain to the outer periphery of the glass portion can be combined.

[0054] In addition, such as Figure 2As shown, the optical fiber 500 has a preheated bend. Heating methods for forming the bend include burners, CO2 lasers, arc discharges, and heaters. CO2 lasers allow for easy adjustment of irradiation intensity, range, and duration, thus enabling precise control of the curvature distribution of the bend. Near the typical wavelength of the CO2 laser (10 μm), the glass material is opaque; therefore, it is assumed that the irradiation energy of the CO2 laser is absorbed by the surface of the glass material and transferred through re-radiation and thermal conduction. If the power of the CO2 laser is too high, the surface temperature of the glass material rises rapidly to the glass evaporation temperature, making it impossible to maintain the shape of the glass component. Therefore, the irradiation power of the CO2 laser is appropriately adjusted such that the surface of the glass material does not evaporate, and the interior of the glass in the heated area rises to a temperature above the working point at fixed intervals, thereby removing internal strain. Suitablely, the cooling rate of the optical fiber 500 after drawing is less than or equal to 10... -4 ℃ / second.

[0055] The first optical connector 110 functions as an adapter for connecting the optical IC substrate 30 to the second optical connector 120. The first optical connector 110 is fixed to the main surface 30a of the optical IC substrate 30, for example, using a UV-curable adhesive. The first optical connector 110 is, for example, a glass substrate made of glass material. Such a glass-based first optical connector 110 is capable of transmitting ultraviolet light. Being capable of transmitting ultraviolet light means, for example, that the transmittance of ultraviolet light with a wavelength greater than or equal to 320 nm and less than or equal to 400 nm is greater than or equal to 10% when irradiating a material with a thickness of 10 mm. The transmittance of ultraviolet light can also be greater than or equal to 50%. The glass material of the first optical connector 110, for example, has a density greater than or equal to 0.3 × 10⁻⁶. -6 [ / K] and less than or equal to 5 × 10 -6 The linear coefficient of thermal expansion of [ / K]. Examples of glass materials used for the first optical connection component 110 include borosilicate glass, aluminosilicate glass, and aluminoborosilicate glass.

[0056] In the following description, the normal direction of the surface 110a (first reference plane) of the first optical connection member 110 is defined as the Z-axis direction, and the direction along the surface 110a is defined as the X-axis direction and the Y-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are, for example, orthogonal to each other. The first optical connection member 110 is, for example, a rectangular plate with the Y-axis direction defined as the long dimension direction, the X-axis direction defined as the short dimension direction, and the Z-axis direction defined as the thickness direction.

[0057] The surface 110a and back surface 110b of the first optical connector 110 are flat surfaces along the X-axis and Y-axis directions, and are arranged parallel in the Z-axis direction. The back surface 110b is in contact with the main surface 30a of the optical IC substrate 30. The main surface 30a of the optical IC substrate 30 is, for example, arranged parallel to the surface 110a and back surface 110b. The surface 110a faces the side opposite to the main surface 30a, opposite to the second optical connector 120. The distance d1 between the surface 110a and the main surface 30a in the Z-axis direction is equivalent to the thickness of the first optical connector 110 (i.e., the distance between the surface 110a and the back surface 110b in the Z-axis direction). The distance d1 is, for example, greater than or equal to 0.01 mm and less than or equal to 1.00 mm.

[0058] An opening 110c is formed on the surface 110a of the first optical connection member 110. The opening 110c extends from the surface 110a to the back surface 110b in the Z-axis direction, exposing a plurality of optical input / output sections 31 mounted on the main surface 30a. The opening 110c defines a space for propagating optical signals between the plurality of optical input / output sections 31 and the plurality of optical fibers 500. Figure 2 As shown, the shape of the opening 110c observed along the Z-axis is, for example, a rectangle with the Y-axis as the long dimension direction and the X-axis as the short dimension direction.

[0059] Furthermore, a pair of guide holes 110d are formed on the surface 110a of the first optical connection member 110. The pair of guide holes 110d are through holes extending from the surface 110a to the back surface 110b in the Z-axis direction, located at a position separated by the opening 110c in the Y-axis direction. The shape of each of the pair of guide holes 110d, viewed along the Z-axis direction, is, for example, circular. A pair of guide pins 150, corresponding to each of the pair of guide holes 110d, are inserted into the pair of guide holes 110d. The guide holes 110d need only be shaped to maintain a space for accommodating a portion of the guide pins 150, and are therefore not limited to through holes; for example, they could be other shapes such as recesses or grooves.

[0060] Each of the pair of guide pins 150 is, for example, cylindrical, extending along the Z-axis. A portion of the guide pin 150 is bonded and fixed to the inner surface of the guide hole 110d when inserted into it. The remaining portion of the guide pin 150 protrudes from the surface 110a in the Z-axis direction. Therefore, in this embodiment, the exposed portion of the guide pin 150 housed in the guide hole 110d that protrudes from the guide hole 110d constitutes an example of the "protrusion" of this disclosure.

[0061] exist Figure 3In this design, the difference (D1-D2) between the outer diameter D1 of the guide pin 150 and the inner diameter D2 of the guide hole 110d, i.e., the gap between the outer surface of the guide pin 150 and the inner surface of the guide hole 110d, can be less than or equal to 2 μm or less than or equal to 1 μm. An adhesive is filled in the gap between the outer surface of the guide pin 150 and the inner surface of the guide hole 110d. The guide pin 150 is fixed to the inner surface of the guide hole 110d by the adhesive. As the adhesive for fixing the guide pin 150, assuming use in a high-temperature environment, a heat-resistant adhesive is suitable. It should be noted that... Figure 3 The adhesive used to secure the guide pin 150 is omitted from the diagram.

[0062] The guide pin 150 can be made of a material with a linear thermal expansion coefficient that is less than or equal to 10 times that of the glass material used for the first optical connector 110. If a guide pin 150 with a significantly different linear thermal expansion coefficient from that of glass is inserted into and bonded to the guide hole 110d, thermal stress will occur at high temperatures due to the difference in linear thermal expansion coefficients between the guide pin 150 and the first optical connector 110. As a result, the first optical connector 110 may break. Therefore, by selecting a material with a linear thermal expansion coefficient less than or equal to 10 times that of glass for the guide pin 150, damage to the first optical connector 110 caused by thermal stress can be reduced.

[0063] The second optical connector 120 is mounted on the top end of the optical fiber 500. The second optical connector 120 is connected to the first optical connector 110 mounted on the optical IC substrate 30. That is, the second optical connector 120 is connected to the optical IC substrate 30 via the first optical connector 110. The second optical connector 120 is, for example, a ferrule made of resin material. The resin material for the second optical connector 120 is, for example, selected to have a density greater than or equal to 0.5 × 10⁻⁶. -5 [ / K] and less than or equal to 5 × 10 -5 A resin material with a linear coefficient of thermal expansion of [ / K]. Examples of resin materials used as the second optical connection component 120 include those with a coefficient of thermal expansion of less than or equal to 1 × 10⁻⁶. -5 Liquid crystal polymers with a linear thermal expansion coefficient of [ / K] and having a coefficient of thermal expansion less than or equal to 2.5 × 10⁻⁶ -5 The PPS of the linear thermal expansion coefficient of [ / K].

[0064] It should be noted that the second optical connection component 120 may also be a glass substrate in which multiple optical fibers 500 are embedded. Alternatively, the second optical connection component 120 may also be a glass substrate in which multiple refractive index variation regions (optical waveguides) are formed internally by laser drawing. As a glass substrate for embedding multiple optical fibers 500, a porous glass substrate having multiple through holes for inserting multiple optical fibers 500 may also be used, for example.

[0065] Such through-holes can be formed, for example, using a process combining photolithography and dry etching such as RIE (Reactive Ion Etching), or using laser-based aperture technology. However, any glass aperture technology can be used to achieve an error of less than or equal to 1 μm between the position of the through-hole and the specified design position, and an inner diameter of the through-hole relative to the target inner diameter of less than or equal to ±1 μm. Alternatively, the through-hole for fiber insertion on the glass substrate may not be perpendicular to the surface of the glass substrate. For example, by forming the through-hole at an angle of, for example, 8 degrees relative to a vertical line perpendicular to the surface of the glass substrate, reflected light can be effectively reduced.

[0066] The second optical connector 120 includes, for example, a connector end face 120a, exposing the top end of the optical fiber 500; and a stepped surface 120b (a second reference surface), recessed from the connector end face in the Z-axis direction. The connector end face 120a and the stepped surface 120b are, for example, flat surfaces along the X-axis and Y-axis directions. The connector end face 120a may also include an inclined surface tilted at 8 degrees relative to the XY plane. When viewed along the Z-axis direction, the connector end face 120a is, for example, located at the center of the second optical connector 120 and is rectangular. The stepped surface 120b is a rectangular ring surrounding the connector end face 120a. The stepped surface 120b is opposite to the surface 110a of the first optical connector 110 in the Z-axis direction. The connector end face 120a protrudes from the stepped surface 120b in the Z-axis direction and is disposed inside the opening 110c formed in the surface 110a. The connecting end face 120a is opposite to the main surface 30a of the optical IC substrate 30 in the Z-axis direction.

[0067] like Figure 3 As shown, a plurality of fiber optic insertion holes 120c are formed on the connection end face 120a of the second optical connection component 120 for inserting a plurality of optical fibers 500 respectively. The plurality of fiber optic insertion holes 120c extend from the connection end face 120a along the Z-axis direction and are arranged along the Y-axis direction. Each fiber optic insertion hole 120c viewed along the Z-axis direction is, for example, circular. The tip of each optical fiber 500 inserted into each fiber optic insertion hole 120c protrudes from the connection end face 120a. The tip of each optical fiber 500 is opposite to each optical input / output portion 31 on the main surface 30a exposed from the opening 110c in the Z-axis direction.

[0068] The connecting end face 120a can be in contact with or separate from the main surface 30a in the Z-axis direction. Therefore, the tips of each optical fiber 500 exposed from the connecting end face 120a can also be in contact with or separate from each optical input / output section 31 on the main surface 30a in the Z-axis direction. In this embodiment, an example is shown where the connecting end face 120a is separated from the main surface 30a, resulting in a small gap between the connecting end face 120a and the main surface 30a. In this case, each optical fiber 500 is optically connected to each optical input / output section 31 through the gap. The distance G1 in the Z-axis direction between the connecting end face 120a and the main surface 30a exposed from the opening 110c is, for example, greater than or equal to 0 μm and less than or equal to 50 μm. The distance G1 can also be, for example, greater than or equal to 0 μm and less than or equal to 20 μm.

[0069] The stepped surface 120b of the second optical connector 120 is separated from the surface 110a of the first optical connector 110 in the Z-axis direction, for example. That is, a gap is formed between the stepped surface 120b and the surface 110a in the Z-axis direction. The width of the gap from the stepped surface 120b to the surface 110a, i.e., the distance G2 in the Z-axis direction between the stepped surface 120b and the surface 110a, is, for example, greater than or equal to 20 μm and less than or equal to 1 mm. The protruding length of the connecting end face 120a from the stepped surface 120b in the Z-axis direction is longer than the thickness of the first optical connector 110 in the Z-axis direction. The protruding length of the connecting end face 120a from the stepped surface 120b is represented by the distance d2 in the Z-axis direction from the stepped surface 120b to the connecting end face 120a. The thickness of the first optical connector 110, as described above, is represented by the distance d1 in the Z-axis direction from the surface 110a to the main surface 30a. In this case, d2 is greater than d1. That is, by setting the distance d2 to be longer than the distance d1, the gap between the step surface 120b and the surface 110a is maintained.

[0070] A pair of guide holes 120d are formed on the stepped surface 120b of the second optical connector 120. The pair of guide holes 120d are positioned to overlap with a pair of guide holes 110d formed on the surface 110a of the first optical connector 110 in the Z-axis direction. The pair of guide holes 120d are through holes penetrating the second optical connector 120 in the Z-axis direction. The shape of the guide holes 120d as viewed along the Z-axis direction is, for example, circular. The inner diameter D3 of the guide holes 120d is, for example, the same as the inner diameter D2 of the guide holes 110d.

[0071] The guide pin 150, protruding from the surface 110a of the first optical connection member 110, is inserted into the guide hole 120d. Therefore, in this embodiment, the guide hole 120d is configured as an example of the "hole" of this disclosure for insertion of the exposed portion of the guide pin 150, which is a protrusion. The guide hole 120d can be shaped to maintain a space for receiving a portion of the guide pin 150. Therefore, the guide hole 120d is not limited to a through hole; for example, it can be other shapes such as a recess or a groove.

[0072] Figure 4 It is an omission Figure 3 A cross-sectional view of the optical connector assembly 100, including the guide pin 150 and the optical fiber 500, is shown. Figure 4 As shown, the central axis CL2 of guide hole 110d is located on the extension of the central axis CL1 of guide hole 120d. That is, when viewed along the Z-axis, the central axis CL1 and the central axis CL2 are aligned. Therefore, the Y-axis spacing L1 between the central axes CL1 of a pair of guide holes 120d is, for example, the Y-axis spacing L2 between the central axes CL2 of a pair of guide holes 110d.

[0073] When the linear thermal expansion coefficient of the material constituting the first optical connector 110 is set to C1 [ / K], the linear thermal expansion coefficient of the material constituting the second optical connector 120 is set to C2 [ / K], and the ambient temperature is set to T [K], the relationship of the aforementioned formula (1) holds true between the linear thermal expansion coefficients C1 [ / K], C2 [ / K], ambient temperature T [K], and interval L1 [mm]. Furthermore, the relationship of the aforementioned formula (2) holds true between the linear thermal expansion coefficients C1 [ / K], C2 [ / K], ambient temperature T [K], interval L1 [mm], and interval L2 [mm]. Here, intervals L1 and L2 are set to values ​​under normal temperature conditions.

[0074] Formula (1) shows the upper limit of the offset of the interval L1 when the first optical connector 110 and the second optical connector 120 undergo thermal expansion due to temperature changes, with the interval L1 of a pair of guide holes 120d at room temperature as a reference. That is, Formula (1) shows that the offset of the interval L1 at ambient temperature T relative to the interval L1 at room temperature is less than 0.01. Formula (2) shows the upper and lower limits of the offset between the intervals L1 and L2 when the first optical connector 110 and the second optical connector 120 undergo thermal expansion due to temperature changes, with the interval L1 of a pair of guide holes 120d and the interval L2 of a pair of guide holes 110d at room temperature as a reference. That is, Formula (2) shows that the offset between the intervals L1 and L2 at ambient temperature T relative to the intervals L1 and L2 at room temperature is greater than -0.005 and less than 0.005.

[0075] By selecting the material and dimensions of the first optical connector 110, the material and dimensions of the second optical connector 120, and the ambient temperature range in a manner that satisfies equations (1) and (2), the positional offset between the materials of the first optical connector 110 and the second optical connector 120 can be controlled within an allowable range. For example, when the material of the first optical connector 110 is Tempax (registered trademark) glass, the material of the second optical connector 120 is PPS (polyphenylene sulfide), and the ambient temperature T is set to be greater than or equal to 25°C and less than or equal to 85°C, equations (1) and (2) can be satisfied. It should be noted that the linear thermal expansion coefficient C1 of the first optical connector 110 is 3.25 × 10⁻⁶. -6 [ / K], the linear thermal expansion coefficient C2 of the second optical connection component 120 is 2×10. -5 [ / K].

[0076] like Figure 4 As shown, a plurality of fiber optic insertion holes 120c extend, for example, parallel to the guide hole 120d. That is, the central axis CL3 of the plurality of fiber optic insertion holes 120c is, for example, parallel to the central axis CL1 of the guide hole 120d. For example, the central axis CL3 and the central axis CL1 extend together along the Z-axis direction. The central axis CL3 of the plurality of fiber optic insertion holes 120c is, for example, perpendicular to the connection end face 120a. The plurality of fiber optic insertion holes 120c need not necessarily be formed perpendicular to the connection end face 120a; for example, they can also be formed at an angle of 8 degrees relative to the connection end face 120a.

[0077] Figure 5 This is a cross-sectional view showing the second optical connection member 120 connected to the first optical connection member 110. (Example) Figure 5 As shown, when the second optical connection component 120 is connected to the first optical connection component 110, the exposed portions of the pair of guide pins 150 of the pair of guide holes 110d of the first optical connection component 110 are inserted into the pair of guide holes 120d of the second optical connection component 120, so that the second optical connection component 120 approaches the first optical connection component 110 in the Z-axis direction.

[0078] By inserting the exposed portions of a pair of guide pins 150 corresponding to a pair of guide holes 120d of the second optical connector 120 into the pair of guide holes 120d, the second optical connector 120 is positioned relative to the first optical connector 110 in the Z-axis direction. In this state, the connecting end face 120a of the second optical connector 120 is opposite to the main surface 30a exposed from the opening 110c of the first optical connector 110 in the Z-axis direction, and the stepped surface 120b of the second optical connector 120 is opposite to the surface 110a of the first optical connector 110 in the Z-axis direction.

[0079] Then, the second optical connector 120 is brought closer to the first optical connector 110 in the Z-axis direction along a pair of guide pins 150 until the connection end face 120a of the second optical connector 120 abuts against the main surface 30a of the optical IC substrate 30 in the Z-axis direction, or the stepped surface 120b of the second optical connector 120 abuts against the surface 110a of the first optical connector 110 in the Z-axis direction. For example, it is also possible that, with the pair of guide pins 150 inserted into a pair of guide holes 120d, the second optical connector 120 is brought closer to the first optical connector 110 until the connection end face 120a abuts against the main surface 30a.

[0080] The result is, as Figure 3 As shown, the distance G1 between the connecting end face 120a and the main surface 30a is greater than or equal to 0 μm and less than or equal to 50 μm. Furthermore, the distance G2 between the stepped surface 120b and the surface 110a is, for example, greater than or equal to 20 μm and less than or equal to 1 mm. The tips of each optical fiber 500 exposed from the connecting end face 120a are opposite to each optical input / output portion 31 on the main surface 30a exposed from the opening 110c in the Z-axis direction, and are optically connected to each optical input / output portion 31. In this way, an optical connection assembly 100 is obtained where the second optical connection component 120 is connected to the first optical connection component 110.

[0081] In this embodiment, the first optical connector 110 and the second optical connector 120 are positioned relative to each other by inserting the exposed portions of a pair of guide pins 150 protruding from a pair of guide holes 110d of the first optical connector 110 into a pair of guide holes 120d of the second optical connector 120. Therefore, the exposed portions of the pair of guide pins 150 protruding from the pair of guide holes 110d of the first optical connector 110 and the pair of guide holes 120d of the second optical connector 120 constitute a positioning structure M (see reference) for maintaining the relative position of the first optical connector 110 and the second optical connector 120. Figure 2 and Figure 3 ).

[0082] Figure 6 It means Figure 3A cross-sectional view near the tip of the optical fiber 500 of the optical connector assembly 100. (See image) Figure 6 As shown, the tip of the optical fiber 500 directly faces the optical input / output section 31 on the main surface 30a without any other components such as lenses or adhesives. Therefore, if the distance G1 between the connection end face 120a and the main surface 30a is too large, the light beam B emitted from the optical fiber 500 will diffuse significantly before reaching the optical input / output section 31. As a result, there is a concern about increased connection loss between the optical fiber 500 and the optical input / output section 31. To address this, when the distance G1 is set to be less than or equal to 50 μm, the diffusion of the light beam B between the optical fiber 500 and the optical input / output section 31 can be sufficiently suppressed. In this case, the connection loss between the optical fiber 500 and the optical input / output section 31 can be controlled within an acceptable range, for example, about 1 dB. Therefore, a low-loss connection between the optical fiber 500 and the optical input / output section 31 can be achieved in the optical connection assembly 100.

[0083] Next, refer to Figure 7A , Figure 7B , Figure 8A as well as Figure 8B An example of the installation method of the first optical connection component 110 constituting the optical connection assembly 100 will be described. Figure 7A This is a diagram illustrating one step of the installation method of the first optical connection component 110. Figure 7B It means Figure 7A The diagram shows the subsequent processes. Figure 8A It means Figure 7B The diagram shows the subsequent processes. Figure 8B It means Figure 8A The diagram shows the subsequent processes.

[0084] First, such as Figure 7A As shown, an adapter wafer 11 (first wafer) is prepared to have multiple first optical connection components 110 forming as adapters. Furthermore, an optical IC wafer 3 (second wafer) is prepared to have multiple optical IC substrates 30 forming. In the adapter wafer 11, the multiple first optical connection components 110 are arranged in a two-dimensional configuration along the X-axis and Y-axis directions. When viewed along the Z-axis direction, the adapter wafer 11 has a shape with a notch 11a in a portion of a circle.

[0085] Furthermore, the adapter chip 11 is made to interact with a plurality of optical IC substrates 30 (e.g., reference 10) Figure 1A and Figure 1B The optical IC chip 3 overlaps in the Z-axis direction. In the optical IC chip 3, a plurality of optical IC substrates 30 are arranged in a two-dimensional manner along the X-axis and Y-axis directions in a manner corresponding to the arrangement of a plurality of first optical connection components 110. When viewed along the Z-axis direction, the optical IC chip 3 has a shape with a notch 3a in a portion of a circle.

[0086] The notch 3a of the optical IC chip 3 and the notch 11a of the adapter chip 11 serve as positioning references for determining the position of the adapter chip 11 relative to the optical IC chip 3. Therefore, the adapter chip 11 is aligned with the optical IC chip 3 so that the notch 11a coincides when viewed in the Z-axis direction, thereby positioning the adapter chip 11 relative to the optical IC chip 3. In this state, multiple optical input / output sections 31 of each optical IC substrate 30 are exposed from the openings 110c of each first optical connection member 110.

[0087] like Figure 7B As shown, with the optical IC chip 3 and adapter chip 11 aligned, each first optical connection component 110 and each optical IC substrate 30 are aligned. Specifically, a second optical connection component 120 holding multiple optical fibers 500 is connected to any one of the first optical connection components 110. Then, the position of the adapter chip 11 relative to the optical IC chip 3 is adjusted in a manner that minimizes the connection loss between each optical fiber 500 and each optical input / output section 31 exposed from the opening 110c of the first optical connection component 110. Alternatively, the position of the adapter chip 11 can be adjusted by connecting multiple second optical connection components 120 to multiple first optical connection components 110 respectively.

[0088] By adjusting the position of the adapter chip 11 relative to the optical IC chip 3 in this way, each of the first optical connection components 110 of the adapter chip 11 can be aligned with each of the optical IC substrates 30 of the optical IC chip 3. Then, with each of the first optical connection components 110 aligned with each of the optical IC substrates 30, the adapter chip 11 is bonded to the optical IC chip 3. For example, the adapter chip 11 can be bonded to the optical IC chip 3 using a resin adhesive, or it can be bonded to the optical IC chip 3 using laser cladding.

[0089] Next, as Figure 8A As shown, optical IC substrates 30 and first optical connectors 110, which are fixed to each other, are cut out one by one from the optical IC chip 3 and adapter chip 11 that are bonded to each other. These optical IC substrates 30 and first optical connectors 110 are then mounted on the substrate of the optical communication module 10. That is, the optical IC chip 3 and adapter chip 11 are cut to achieve monolithic assembly, thereby forming multiple first optical connectors 300 (first optical connectors with circuit boards) with optical IC substrates. Each first optical connector 300 with an optical IC substrate has a structure in which one first optical connector 110 is bonded to one optical IC substrate 30.

[0090] After that, as Figure 8BAs shown, a pair of guide pins 150, which are bonded and fixed to the first optical connection component 110, are used to connect the second optical connection component 120, which holds multiple optical fibers 500, to the first optical connection component 110. Thus, the following is obtained: Figure 3 The optical connection assembly 100 is shown. It should be noted that when glass material is selected as the first optical connection component 110 as in this embodiment, the glass material has high heat resistance, so the optical IC chip 3 and the adapter chip 11, which are aligned together, can withstand the reflow soldering process during bonding.

[0091] The effects of the optical connection assembly 100 and the installation method of this embodiment described above will be explained.

[0092] In this embodiment, a connection end face 120a protruding from the surface 110a of the first optical connection member 110 is disposed inside the opening 110c of the stepped surface 120b formed in the second optical connection member 120, facing the main surface 30a exposed from the opening 110c. The top end of the optical fiber 500 exposed from the connection end face 120a faces the optical input / output section 31 on the main surface 30a. The distance G1 between the connection end face 120a and the main surface 30a of the optical IC substrate 30 exposed from the opening 110c is less than or equal to 50 μm. If the distance G1 is reduced in this way, even when the optical fiber 500 is directly opposite the optical input / output section 31 without a lens, the connection loss between the optical fiber 500 and the optical input / output section 31 can be sufficiently reduced. That is, the optical fiber 500 and the optical input / output section 31 can be optically connected with low loss using a simple configuration without the use of a lens.

[0093] Furthermore, by omitting the lens in this way, even in high-temperature environments, the increase in connection loss due to lens angular displacement can be avoided. Moreover, when the positioning structure M maintains the relative position of the second optical connection member 120 and the first optical connection member 110 on the main surface 30a of the optical IC substrate 30, as in the optical connection assembly 100, the first optical connection member 110 can be fixed to the optical IC substrate 30 without adhesive. Therefore, the increase in connection loss due to the first optical connection member 110 being peeled off from the optical IC substrate 30 can also be avoided. Therefore, the optical connection assembly 100 according to this embodiment can reduce the increase in connection loss with a simple configuration.

[0094] As in this embodiment, a gap may be formed between surface 110a and step surface 120b. To flatten the connection end face 120a exposing the optical fiber 500, it is sometimes ground. In this case, the amount of grinding on the connection end face 120a may have manufacturing errors. Therefore, in this embodiment, a gap is formed between surface 110a and step surface 120b. In this case, even if an error occurs in the amount of grinding on the connection end face 120a, the gap can absorb this error. Thus, when the second optical connection member 120 is connected to the first optical connection member 110, it is possible to prevent surface 110a from contacting step surface 120b before the connection end face 120a contacts the main surface 30a. As a result, the connection end face 120a can be brought sufficiently close to the main surface 30a, thereby more effectively reducing the increase in connection loss between the optical fiber 500 and the optical input / output unit 31.

[0095] As in this embodiment, the width of the gap from surface 110a to step surface 120b, i.e., the distance G2 in the Z-axis direction between surface 110a and step surface 120b, can be greater than or equal to 20 μm and less than or equal to 1 mm. When the gap width (distance G) is greater than or equal to 20 μm, the error in the amount of polishing applied to the connection end face 120a can be absorbed more reliably through the gap. Moreover, when the gap width (distance G2) is less than or equal to 1 mm, the insertion length of the guide pin 150 into the guide hole 120d can be prevented from becoming excessively short. As a result, the relative position of the first optical connection member 110 and the second optical connection member 120 maintained by the insertion of the guide pin 150 into the guide hole 120d can be prevented from becoming unstable. Therefore, in the above configuration, the relative position of the first optical connection member 110 and the second optical connection member 120 can be maintained more stably, and the increase in connection loss between the optical fiber 500 and the optical input / output section 31 can be reduced more effectively.

[0096] As in this embodiment, the distance d2 from the step surface 120b to the connecting end surface 120a may be longer than the distance d1 from the surface 110a to the main surface 30a. In this case, even if an error occurs in the grinding amount of the connecting end surface 120a, when the second optical connection member 120 is connected to the first optical connection member 110, it is possible to prevent the surface 110a from contacting the step surface 120b before the connecting end surface 120a contacts the main surface 30a. As a result, the connecting end surface 120a can be brought sufficiently close to the main surface 30a, thus more effectively reducing the increase in connection loss between the optical fiber 500 and the optical input / output unit 31.

[0097] As in this embodiment, the second optical connection component 120 may also have a component having a size greater than or equal to 0.5 × 10⁻⁶.-5 [ / K] and less than or equal to 5 × 10 -5 The resin material has a linear coefficient of thermal expansion of [ / K]. In this case, even if a material such as glass or metal is chosen as the material for the first optical connector 110, the difference between the linear coefficient of thermal expansion of the second optical connector 120 and that of such a material can be reduced. Therefore, it is possible to reduce the occurrence of significant positional misalignment between the first optical connector 110 and the second optical connector 120 due to thermal stress caused by the difference between their linear coefficients of thermal expansion.

[0098] As in this embodiment, the first optical connection component 110 may also be formed of a glass material. Glass materials possess heat resistance and a small linear coefficient of thermal expansion, even at high temperatures of 85°C or higher, which are difficult for resins such as PPS (Poly Phenylene Sulfide) and PEI (Poly Ether Imide) commonly used in optical connectors. Therefore, as a component for connecting the optical fiber 500 to the optical IC substrate 30 located near heat-generating semiconductors such as ASICs (Application Specific Integrated Circuits) that will be commercialized in the future, the use of glass components can be expected to expand. Furthermore, the linear coefficient of thermal expansion of the glass material is similar to that of silicon constituting the optical IC substrate 30. Therefore, even when using the optical connection component 100 in high-temperature environments, the occurrence of thermal stress caused by the difference between the linear coefficient of thermal expansion of the first optical connection component 110 and that of the optical IC substrate 30 can be reduced. Furthermore, by using a glass material that can transmit ultraviolet light, the first optical connection component 110 can be easily fixed to the main surface 30a of the optical IC substrate 30 using an ultraviolet-curable adhesive.

[0099] As in this embodiment, the gap between the outer surface of the guide pin 150 and the inner surface of the guide hole 110d may be less than or equal to 2 μm. Alternatively, the guide pin 150 may be formed of a material having a linear thermal expansion coefficient less than or equal to 10 times that of the glass material of the first optical connector 110. By providing a gap of less than or equal to 2 μm between the inner surface of the guide hole 110d of the first optical connector 110 and the outer surface of the guide pin 150, the thermal expansion of the guide pin 150 can be absorbed through the gap even if thermal expansion occurs in a high-temperature environment. Therefore, the occurrence of damage to the first optical connector 110 due to thermal expansion of the guide pin 150 can be reduced. Furthermore, by making the material of the guide pin 150 have a linear thermal expansion coefficient that is less than or equal to 10 times that of the glass material, even when the optical connection assembly 100 is used in a high-temperature environment, the following situation can be reduced: the first optical connection component 110 is damaged due to thermal stress caused by the difference between the linear thermal expansion coefficient of the first optical connection component 110 and the linear thermal expansion coefficient of the guide pin 150.

[0100] As in this embodiment, the fiber optic insertion hole 120c and the guide hole 120d may extend parallel to each other. If the fiber optic insertion hole 120c extends obliquely relative to the guide hole 120d, during the grinding process on the connection end face 120a, depending on the amount of grinding, the opening positions of the fiber optic insertion hole 120c and the guide hole 120d on the connection end face 120a may shift significantly. Therefore, by having the fiber optic insertion hole 120c and the guide hole 120d extend parallel to each other, significant positional shifts in the opening positions of the fiber optic insertion hole 120c and the guide hole 120d due to the grinding process can be prevented. Thus, the reduction in the positioning accuracy of the fiber optic cable 500 caused by positional shifts in the opening positions of the fiber optic insertion hole 120c and the guide hole 120d can be reduced.

[0101] As in this embodiment, the aforementioned equation (1) holds true when the linear thermal expansion coefficient of the first optical connector 110 is set to C1 [ / K], the linear thermal expansion coefficient of the second optical connector 120 is set to C2 [ / K], the center-to-center spacing of the pair of guide holes 120d at room temperature is set to L1 [mm], and the ambient temperature is set to T [K]. By selecting the material and size of the first optical connector 110, the material and size of the second optical connector 120, and the temperature range of the ambient temperature in a manner that satisfies the relationship of equation (1), even if the first optical connector 110 and the second optical connector 120 undergo thermal expansion in a high-temperature environment, the positional offset of the optical fiber 500 relative to the optical input / output section 31 can be controlled within an acceptable range.

[0102] As in this embodiment, the aforementioned equation (2) holds true when the linear thermal expansion coefficient of the first optical connector 110 is set to C1 [ / K], the linear thermal expansion coefficient of the second optical connector 120 is set to C2 [ / K], the center-to-center spacing of the pair of guide holes 120d at room temperature is set to L1 [mm], the center-to-center spacing of the pair of guide holes 110d at room temperature is set to L2 [mm], and the ambient temperature is set to T [K]. By selecting the material and size of the first optical connector 110, the material and size of the second optical connector 120, and the temperature range of the ambient temperature in a manner that satisfies the relationship of equation (2), even if the first optical connector 110 and the second optical connector 120 undergo thermal expansion in a high-temperature environment, the positional offset of the optical fiber 500 relative to the optical input / output section 31 can be controlled within an acceptable range. Moreover, in this case, even if a difference in thermal expansion occurs between the first optical connection member 110 and the second optical connection member 120, the occurrence of damage to one or both of the first optical connection member 110 and the second optical connection member 120 due to the difference in thermal expansion can be reduced.

[0103] As in this embodiment, the mounting method for mounting the first optical connection component 110 on the main surface 30a of the optical IC substrate 30 includes the following steps: preparing an adapter chip 11 and an optical IC chip 3, wherein the adapter chip 11 is formed with a plurality of first optical connection components 110 arranged in a two-dimensional shape, and the optical IC chip 3 is formed with a plurality of optical IC substrates 30 arranged in a two-dimensional shape; positioning the adapter chip 11 relative to the optical IC chip 3 such that the plurality of first optical connection components 110 overlap with the plurality of optical IC substrates 30 respectively; bonding the adapter chip 11 to the optical IC chip 3 while the adapter chip 11 is positioned relative to the optical IC chip 3; and cutting the adapter chip 11 and the optical IC chip 3 to monolithize them, thereby forming a plurality of first optical connection components 300 with optical IC substrates.

[0104] The above-described installation method differs from the method where the adapter chip 11 and the optical IC chip 3 are individually monolithized, and each first optical connection component 110 is individually aligned with each optical IC substrate 30. In the above-described installation method, if the adapter chip 11 is positioned relative to the optical IC chip 3, each first optical connection component 110 can be aligned with each optical IC substrate 30 simultaneously. That is, in the above-described installation method, if the alignment of each first optical connection component 110 with one optical IC substrate 30 is performed once, the alignment of each first optical connection component 110 with all optical IC substrates 30 can be performed. Therefore, compared to the method of performing alignment work according to the number of optical IC substrates 30, the alignment process can be reduced to one time. Therefore, according to the above-described installation method, the installation process of the first optical connection component 110 can be simplified.

[0105] The optical connection component 100 and installation method of the present invention are not limited to the embodiments described above. The optical connection component 100 and installation method of the present invention can be modified in detail without departing from the spirit of the claims.

[0106] <Variation Example 1> Figure 9 The optical connection assembly 100A shown differs from the optical connection assembly 100 described above in that it includes a first optical connection member 110A formed of a metallic material. As the metallic material for the first optical connection member 110A, for example, considering its use on the optical IC substrate 30, a metallic material with a linear thermal expansion coefficient approximately the same as that of silicon constituting the optical IC substrate 30 is used. For example, as the metallic material for the first optical connection member 110A, a material with a linear thermal expansion coefficient greater than or equal to 1 × 10⁻⁶ is selected. -6 [ / K] and less than or equal to 7 × 10 -6 Materials with a linear coefficient of thermal expansion of [ / K]. For example, the metal material used as the first optical connection component 110A can be selected with a coefficient of thermal expansion of less than or equal to 5 × 10⁻⁶. -6 Kovar (Kovar iron-nickel-cobalt alloy) with a linear thermal expansion coefficient of [ / K] can also be selected with a coefficient of less than or equal to 2 × 10⁻⁶. -6 The linear thermal expansion coefficient of Invar (Invar iron-nickel alloy) is [ / K]. Alternatively, a metal-ceramic composite material can be selected as the metal material for the first optical connection component 110A.

[0107] As with optical connector 100A, by selecting a metallic material as the material for the first optical connector 110A, the occurrence of damage to the first optical connector 110A during the insertion of the guide pin 150 into the guide hole 120d can be reduced. Furthermore, a material greater than or equal to 1×10⁻⁶... -6 [ / K] and less than or equal to 7 × 10 -6The linear thermal expansion coefficient of [ / K] is similar to that of silicon in the optical IC substrate 30 on which the first optical connection component 110A is mounted. Therefore, even when the optical connection component 100A is used in a high-temperature environment, the following situation can be reduced: the first optical connection component 110A is damaged due to thermal stress caused by the difference between the linear thermal expansion coefficient of the first optical connection component 110A and the linear thermal expansion coefficient of the optical IC substrate 30.

[0108] <Variation Example 2> Figure 10 The optical connection assembly 100B shown differs from the optical connection assembly 100 described above in that an anti-reflective film 121 (AR coating) is provided on the connection end face 120a of the second optical connection component 120A. For example... Figure 10 As shown, the anti-reflective film 121 is provided, for example, on the connection end face 120a of the second optical connection member 120A, and is opposite to the main surface 30a exposed from the opening 110c in the Z-axis direction. The anti-reflective film 121 reduces the reflected light between the optical fiber 500 and the optical input / output section 31.

[0109] As described in the above embodiment, when the tip of the optical fiber 500 exposed from the connection end face 120a is directly opposite the optical input / output section 31 of the optical IC substrate 30 without passing through other components such as lenses and adhesives, it is difficult to ensure complete contact between the tip of the optical fiber 500 and the optical input / output section 31 due to manufacturing errors or the structure of the optical IC substrate 30. Therefore, a gap may occur between the tip of the optical fiber 500 and the optical input / output section 31. In the presence of such a gap, the effect of reflected light on the optical input / output section 31 may become a problem. To address this, in the optical connection assembly 100B, assuming a gap is formed between the tip of the optical fiber 500 and the optical input / output section 31, an anti-reflection film 121 is provided on the connection end face 120a. In this case, reflected light between the optical fiber 500 and the optical input / output section 31 can be effectively reduced, thus reducing the degradation of optical properties caused by reflected light.

[0110] <Variation Example 3> Figure 11A The optical connection assembly 100C shown differs from the optical connection assembly 100 described above in that a pair of spacers 122 are provided on the connection end face 120a of the second optical connection component 120B. For example... Figure 11AAs shown, the pair of spacers 122 are, for example, plate-shaped members with the Z-axis direction set as the thickness direction. The pair of spacers 122 are disposed at a pair of positions in the connection end face 120a, with openings in the Y-axis direction spaced apart by a plurality of fiber optic insertion holes 120c. The pair of spacers 122 are, for example, bonded to the connection end face 120a. The pair of spacers 122 may also be bonded to the main surface 30a exposed from the opening 110c. The pair of spacers 122 are used to maintain a distance G1 between the connection end face 120a and the main surface 30a exposed from the opening 110c. The thickness of each pair of spacers 122 in the Z-axis direction is, for example, greater than or equal to 1 μm and less than or equal to 20 μm.

[0111] like Figure 11B As shown, when connecting the second optical connector 120B to the first optical connector 110, starting from the state where a pair of spacers 122 fixed to the connecting end face 120a are opposite to the main surface 30a exposed from the opening 110c in the Z-axis direction, the guide pin 150 is inserted into the guide hole 110d and the guide hole 120d, and the second optical connector 120B is brought close to the first optical connector 110 until the pair of spacers 122 abut against the main surface 30a in the Z-axis direction. As a result, the pair of spacers 122 are sandwiched between the connecting end face 120a and the main surface 30a in the Z-axis direction. Therefore, the distance G1 between the connecting end face 120a and the main surface 30a is the same as the thickness of each of the pair of spacers 122.

[0112] In the case of optical connector assembly 100C, where a pair of spacers 122 are arranged between the connector end face 120a and the main face 30a, the distance G1 can be maintained more reliably by having the pair of spacers 122 abut against the connector end face 120a and the main face 30a. By making the thickness of each of the pair of spacers 122 less than or equal to 20 μm, the distance G1 can be shortened. As a result, the connection loss between each optical fiber 500 exposed from the connector end face 120a and each optical input / output section 31 on the main face 30a can be reduced more effectively.

[0113] Furthermore, when a pair of spacers 122 are provided between the connection end face 120a and the main face 30a, a gap can be formed between the optical fiber 500 and the optical input / output section 31. In this case, unlike the case where the optical fiber 500 directly abuts against the optical input / output section 31, foreign objects such as dust that may exist between the optical fiber 500 and the optical input / output section 31 can be prevented from being crushed by the optical fiber 500 and covering the fiber core. As a result, the increase in connection loss between the optical fiber 500 and the optical input / output section 31 caused by foreign objects can be avoided. Moreover, even when a gap exists between the optical fiber 500 and the optical input / output section 31 and a multi-core optical fiber is used, low-loss optical coupling can be achieved without large pressing force.

[0114] <Variation Example 4> Figure 12A The optical connector assembly 100D shown differs from the optical connector assembly 100 described above in that a resin coating 111 is formed on each of the pair of guide holes 110d of the first optical connector component 110B. The resin coating 111 is a coating formed of resin material. For example... Figure 12A and Figure 12B As shown, the resin coating 111 is formed to cover the inner surface of the guide hole 110d. The resin coating 111 can be, for example, a cured resin adhesive. As the material for the resin coating 111, a resin material with higher strength than the glass material of the first optical connection member 110B is selected. Examples of such resin coating materials include polyphenylene sulfide (PPS), polyetherimide (PEI), and polytetrafluoroethylene (PTFE). These resin materials exhibit excellent mechanical or physical strength, such as durability, abrasion characteristics, and slip resistance. Generally, the strength of glass is evaluated by its fracture toughness. Fracture toughness can be evaluated using the Vickers hardness test and the three-point bending test.

[0115] The resin coating 111 covers the entire inner surface of the guide hole 110d, for example, from the surface 110a to the back surface 110b of the first optical connection member 110B. The resin coating 111 may also cover a portion of the inner surface of the guide hole 110d. The outer diameter D1 of the guide pin 150 is greater than or equal to 0.3 mm and less than or equal to 0.7 mm, the inner diameter D2 of the guide hole 110d is greater than or equal to 0.3 mm and less than or equal to 0.7 mm, and correspondingly, the thickness T1 of the resin coating 111 is, for example, greater than or equal to 0.01 mm and less than or equal to 0.20 mm. In this case, the gap between the resin coating 111 and the outer surface of the guide pin 150 is maintained, for example, less than or equal to 2 μm or less than or equal to 1 μm.

[0116] When the resin coating 111 is formed on the inner surface of the guide hole 110d, for example, the guide pin 150 is pulled out of the guide hole 110d while the inner surface of the guide hole 110d is coated with a resin adhesive and the outer surface of the guide pin 150 is coated with a release agent. As a result, the cured resin adhesive remains as the resin coating 111 on the inner surface of the guide hole 110d. In this way, a resin coating 111 covering the inner surface of the guide hole 110d is obtained.

[0117] The first optical connector 110B, made of glass, is a brittle material. Therefore, it is assumed that when the second optical connector 120 is connected to the first optical connector 110B using the guide pin 150, the following problems may occur: the first optical connector 110B may crack or break due to excessive force applied from the second optical connector 120. To address this, in the optical connector assembly 100D, a resin coating 111 with a strength higher than that of the glass material is formed on the inner surface of the guide hole 110d of the first optical connector 110B. That is, the resin coating 111 protects the vulnerable parts of the first optical connector 110B from damage.

[0118] Therefore, in the optical connector assembly 100D, when the second optical connector 120 is connected to the first optical connector 110B using the guide pin 150, the occurrence of defects such as chipping and breakage of the first optical connector 110B can be reduced. Furthermore, by locally forming the resin coating 111 on the glass first optical connector 110B, the heat resistance of the glass material of the first optical connector 110B can be effectively utilized, and the resin coating 111 can strengthen the parts of the first optical connector 110B that are prone to defects.

[0119] <Variation Example 5> Figure 13A The optical connection assembly 100E shown, in addition to having the same structure as the optical connection assembly 100 described above, also includes a clamping member 130. In the optical connection assembly 100E, when the guide pins 150 are inserted into the guide holes 110d and 120d and the second optical connection member 120 is connected to the first optical connection member 110C, the pair of guide pins 150, which are bonded and fixed to the first optical connection member 110C, are engaged in the pair of guide holes 120d of the second optical connection member 120 in a detachable state. In this case, the guide pins 150 may accidentally detach from the guide holes 120d during use. Therefore, the optical connection assembly 100E includes the clamping member 130 as a structure for maintaining the connection between the first optical connection member 110C and the second optical connection member 120.

[0120] The clamping member 130 includes, for example, a base 131 and a pair of arms 132. The base 131 is, for example, a plate-like member extending along the Y-axis direction on the second optical connection member 120. The length of the base 131 in the Y-axis direction is longer than the width of the second optical connection member 120 in the Y-axis direction. The base 131 is positioned opposite the first optical connection member 110C in the Z-axis direction, separated by the second optical connection member 120. Specifically, the base 131 is disposed on the second optical connection member 120 in such a way that it overlaps with a pair of guide holes 120d in the Z-axis direction.

[0121] A pair of arms 132 are plate-shaped members extending along the Z-axis direction from both ends of the base 131 in the Y-axis direction toward the main surface 30a of the optical IC substrate 30. The pair of arms 132 extend linearly along the Z-axis direction at positions separated by the second optical connector 120 and the first optical connector 110C connected to each other. Specifically, the pair of arms 132 extend linearly along the Z-axis direction from a position opposite to a pair of side surfaces 120e of the second optical connector 120 in the Y-axis direction to a position opposite to a pair of side surfaces 110e of the first optical connector 110C in the Y-axis direction. The pair of side surfaces 120e are the end faces located at both ends of the second optical connector 120 in the Y-axis direction. The pair of side surfaces 110e are the end faces located at both ends of the first optical connector 110C in the Y-axis direction.

[0122] A pair of arms 132 are respectively configured to overlap with the guide hole 120d of the second optical connector 120, the guide hole 110d of the first optical connector 110C, and the guide pin 150 when viewed along the Y-axis. A hook 132a is formed at the top end of each pair of arms 132, facing the side surface 110e of the first optical connector 110C in the Y-axis direction. The hook 132a protrudes from the top end of the arm 132 toward the side surface 110e in the Y-axis direction. A stepped portion 110f is formed on the side surface 110e for the hook 132a to be inserted.

[0123] With the hook portion 132a embedded in the step portion 110f, the hook portion 132a abuts against the step portion 110f in the Z-axis direction. Thus, the clamping member 130 engages with the first optical connection member 110C in the Z-axis direction. Alternatively, in this state, the clamping member 130 presses the second optical connection member 120 toward the first optical connection member 110C. The clamping member 130 is made of a resin material that can elastically deform in the Y-axis direction under external force. Examples of resin materials selected for the clamping member 130 include liquid crystal polymer (LCP), polyphenylene sulfide (PPS), polyamides (PA46, PA6T, PA9T), polybutylene terephthalate (PBT), polyetheretherketone (PEEK), and polyetherimide (PEI). The clamping member 130 is detachably assembled to the second optical connecting member 120 and the first optical connecting member 110C, wherein the guide pin 150 is inserted into the guide hole 110d and the guide hole 120d and connected to each other. Alternatively, with the clamping member 130 assembled to the second optical connecting member 120 and the first optical connecting member 110C, the clamping member 130 may press the second optical connecting member 120 toward the first optical connecting member 110C with a pressing force of at least 5 N and less than or equal to 20 N. The clamping member 130 may also be made of metal, for example, a sheet metal. The material of the clamping member 130 may also be, for example, stainless steel, cold-rolled steel, or aluminum alloy.

[0124] like Figure 13B As shown, when assembling the clamping member 130 onto the second optical connecting member 120 and the first optical connecting member 110C, while spreading the pair of arms 132 of the clamping member 130 in the Y-axis direction, the second optical connecting member 120 and the first optical connecting member 110C are inserted into the inside of the clamping member 130 in the Z-axis direction until the pair of hooks 132a of the pair of arms 132 and the pair of side surfaces 110e of the first optical connecting member 110C are respectively positioned opposite each other in the Y-axis direction. Then, when the pair of arms 132 elastically recover and return to their original positions, the pair of arms 132 engage with the pair of stepped portions 110f of the first optical connecting member 110C.

[0125] In this state, a pair of hooks 132a abut against a pair of stepped portions 110f in the Z-axis direction. Thus, the clamping member 130 has a snap-fit ​​structure that utilizes the elasticity of the material to engage with the pair of stepped portions 110f of the first optical connecting member 110C. It should be noted that this structure is not limited to this one; a connector structure using an elastic spring can also be used. By engaging the clamping member 130 with the first optical connecting member 110C, the movement of the second optical connecting member 120 relative to the first optical connecting member 110C is restricted. That is, the connection between the first optical connecting member 110C and the second optical connecting member 120 is stably maintained.

[0126] When the clamping member 130 is removed from the first optical connection member 110C, the pair of arms 132 are spread open in the Y-axis direction, and the pair of hooks 132a are moved away from the pair of sides 110e of the first optical connection member 110C until the pair of hooks 132a and the pair of stepped portions 110f no longer abut in the Z-axis direction. This allows the clamping member 130 to be removed from the first optical connection member 110C. In this way, in the optical connection assembly 100E, the clamping member 130 can be used to stably maintain the connection between the first optical connection member 110C and the second optical connection member 120. In this way, the optical connection assembly 100E is provided with a clamping member that grips the first optical connection member 110C in case the guide pin 150 falls out of the guide hole 120d, thereby stably maintaining the connection between the first optical connection member 110C and the second optical connection member 120.

[0127] This disclosure is not limited to the embodiments and modifications described above, and various other modifications are possible. For example, the embodiments and modifications described above can be combined with each other within a non-contradictory scope, depending on the desired purpose and effect. Furthermore, the configuration of the optical connection assembly is not limited to the embodiments and modifications described above. For example, in the embodiments and modifications described above, the connection end face of the second optical connection member is separated from the main surface of the circuit board. However, it is also possible that the second optical connection member abuts against the main surface. In this case, the optical waveguide abuts against the optical input / output portion on the main surface. Alternatively, it is also possible that the first reference surface of the first optical connection member abuts against the second reference surface of the second optical connection member. In the embodiments and modifications described above, a protrusion is provided on the first reference surface of the first optical connection member and a hole is provided on the second reference surface of the second optical connection member. However, it is also possible that a hole is provided on the first reference surface of the first optical connection member and a protrusion is provided on the second reference surface of the second optical connection member.

[0128] Explanation of reference numerals in the attached figures 3: Optical IC chip (second chip); 3a, 11a: Notch; 10: Optical communication module; 11: Adapter chip (first chip); 20: LSI; 30: Optical IC substrate (circuit board); 30a: Main surface; 31: Optical input / output section; 40: Electrical wiring; 50: Substrate; 100, 100A, 100B, 100C, 100D, 100E: Optical connection components; 110, 110A, 110B, 110C: First optical connection component; 110a: Surface (first reference surface); 110b: Back surface; 110c: Opening; 110d, 120d: Guide holes; 110e, 120e: Side surface; 110f: Stepped portion; 111: Resin coating; 120, 1 20A, 120B: Second optical connection component; 120a: Connection end face; 120b: Stepped surface (second reference surface); 120c: Fiber optic insertion hole; 121: Anti-reflective film; 122: Spacer; 130: Clamping component; 131: Base; 132: Arm; 132a: Hook; 150: Guide pin; 300: First optical connection component with optical IC substrate (first optical connection component with circuit substrate); 500: Optical fiber (optical waveguide); B: Beam; C1, C2: Linear thermal expansion coefficient; CL2, CL1, CL3: Central axis; D1: Outer diameter; D2, D3: Inner diameter; d1, d2, G1, G2: Distance; L1, L2: Spacing; M: Positioning structure; T: Ambient temperature.

Claims

1. An optical connection component, comprising: A first optical connection component is mounted on the main surface of a circuit board including at least one optical input / output section; and The second optical connection component includes at least one optical waveguide and is connected to the first optical connection component. One of the first optical connection component and the second optical connection component has a protrusion. The other of the first optical connection component and the second optical connection component has a hole. The first optical connection component and the second optical connection component form a positioning structure that maintains their relative positions by inserting the protrusion into the hole. The first optical connection component includes: The first reference surface is provided with the protrusion or the hole; as well as An opening is formed on the first reference surface, allowing the light input / output portion on the main surface to be exposed from the first reference surface. The second optical connection component includes: The second reference surface is provided with the protrusion or the hole, and is opposite to the first reference surface; as well as A connecting end face protrudes from the second reference surface and is disposed inside the opening. The connecting end face is opposite to the main surface exposed from the opening. On the connecting end face, the top end of the optical waveguide is exposed and is opposite to the optical input / output portion on the main surface. The distance between the connecting end face and the main face exposed from the opening is less than or equal to 50 μm.

2. The optical connection component according to claim 1, wherein, A gap is formed between the first reference plane and the second reference plane.

3. The optical connection component according to claim 2, wherein, The distance between the first reference plane and the second reference plane is greater than or equal to 20 μm and less than or equal to 1 mm.

4. The optical connection assembly according to any one of claims 1 to 3, wherein, The distance from the second reference plane to the connecting end face is longer than the distance from the first reference plane to the main face.

5. The optical connection assembly according to any one of claims 1 to 4, wherein, The second optical connection component has a density greater than or equal to 0.5 × 10⁻⁶. -5 / K and less than or equal to 5×10 -5 Resin materials with a linear coefficient of thermal expansion of / K are formed.

6. The optical connection assembly according to any one of claims 1 to 5, wherein, A film is formed on the connection end face to prevent light from being reflected on the connection end face.

7. The optical connection assembly according to any one of claims 1 to 6, wherein, A spacer is disposed between the connecting end face and the main face exposed from the opening. The thickness of the spacer is greater than or equal to 1 μm and less than or equal to 20 μm.

8. The optical connection assembly according to any one of claims 1 to 7, wherein, The first optical connection component has a density greater than or equal to 1×10 -6 / K and less than or equal to 7×10 -6 Metallic materials with a linear thermal expansion coefficient of / K are formed.

9. The optical connection assembly according to any one of claims 1 to 7, wherein, The first optical connection component is made of glass.

10. The optical connection assembly according to claim 9, wherein, The protrusion is formed by a guide pin that is fixed to the first optical connection component when inserted into a guide hole formed on the first reference surface. The gap between the outer surface of the guide pin and the inner surface of the guide hole is less than or equal to 2 μm, and the guide pin is formed of a material having a linear thermal expansion coefficient less than or equal to 10 times that of the glass material of the first optical connection component.

11. The optical connection assembly according to claim 10, wherein, A coating made of resin material is provided on the inner surface of the guide hole.

12. The optical connection assembly according to any one of claims 1 to 11, wherein, The hole is located on the second reference plane. The optical waveguide is composed of an optical fiber held in place by the second optical connection component. An optical fiber insertion hole is formed on the connection end face for inserting the optical fiber. The fiber optic insertion hole extends parallel to the hole portion.

13. The optical connection assembly according to any one of claims 1 to 12, wherein, The positioning structure includes: A pair of the aforementioned protrusions are disposed on the first reference plane; and A pair of holes are provided on the second reference plane. When the linear thermal expansion coefficient of the first optical connector is set to C1, the linear thermal expansion coefficient of the second optical connector is set to C2, the center-to-center distance between the pair of holes at room temperature is set to L1, and the ambient temperature is set to T, the relationship of equation (1) holds, where the unit of C1 is / K, the unit of C2 is / K, the unit of L1 is mm, and the unit of T is K. 。 14. The optical connection assembly according to any one of claims 1 to 13, wherein, The positioning structure includes: A pair of the aforementioned protrusions are disposed on the first reference plane; and A pair of holes are provided on the second reference plane. The pair of protrusions are formed by a pair of guide pins that are fixed to the first optical connection component when inserted into a pair of guide holes formed on the first reference surface. When the linear thermal expansion coefficient of the first optical connector is set to C1, the linear thermal expansion coefficient of the second optical connector is set to C2, the distance between the centers of the pair of holes at room temperature is set to L1, the distance between the centers of the pair of guide holes at room temperature is set to L2, and the ambient temperature is set to T, the relationship of equation (2) holds true, where the unit of C1 is / K, the unit of C2 is / K, the unit of L2 is mm, and the unit of T is K. 。 15. The optical connection assembly according to any one of claims 1 to 14, wherein, The optical connection assembly also includes a clamping member for gripping the first optical connection component and the second optical connection component. The clamping component includes: The base is configured to face the first reference surface of the first optical connection component across the second optical connection component; A pair of arms extending from the base to positions opposite a pair of sides of the first optical connection member; and A pair of hooks protrude from the pair of arms toward the pair of sides. A pair of stepped portions are formed on the pair of sides for the pair of hooks to engage respectively.

16. A mounting method, comprising mounting the first optical connection component of an optical connection assembly as described in any one of claims 1 to 15 onto the main surface of the circuit board, the mounting method comprising the following steps: Prepare the first and second wafers, wherein... The first wafer is formed with a plurality of first optical connection components arranged in a two-dimensional shape, and the second wafer is formed with a plurality of circuit substrates arranged in a two-dimensional shape. The first wafer is positioned relative to the second wafer by overlapping the plurality of first optical connection components with the plurality of circuit substrates respectively; With the first wafer positioned relative to the second wafer, the first wafer is bonded to the second wafer; as well as The first wafer and the second wafer are cut to form monolithic components, thereby forming multiple first optical interconnect components with circuit substrates.

Images