Laser alignment cleaning device

Abstract

A laser alignment cleaning device comprises a base unit, a driving unit, a spraying seat unit and a laser unit. The base unit is used for limiting a wafer. The driving unit comprises a left-right sliding seat, a left-right sliding table set, an up-down sliding seat, an up-down sliding table set and a carrying plate. The spray seat unit is connected to the bottom side of the carrier plate and comprises a spray seat body and at least one nozzle piece. And the nozzle piece is connected to the spray seat body. The laser unit is connected to the left sliding seat and the right sliding seat, and the part, projected on the wafer, of laser emitted by the laser unit is overlapped with the part, in contact with the wafer, of the medicament sprayed by the nozzle piece. According to the wafer cleaning device, the laser unit and the spraying seat unit move synchronously, so that the laser emitted by the laser unit is ensured to mark the medicament sprayed by the nozzle piece, and the cleaning process of the wafer can be confirmed more easily.

Description

Technical Field

[0001] This invention relates to a cleaning apparatus, and more particularly to a laser alignment cleaning apparatus. Background Technology

[0002] In recent years, with the advancement of wafer packaging technology, electronic components located on the wafer surface have become increasingly sophisticated. Once contaminants such as dust and particles adhere to these components, they can easily cause damage. Therefore, cleaning the wafers with chemicals using an existing cleaning device is a necessary step.

[0003] However, most of the cleaning agents used to clean the wafers are transparent, making it difficult for operators to confirm whether the agents are following the intended cleaning path when cleaning the wafers using existing cleaning equipment. This raises concerns about the cleaning process itself. Clearly, existing cleaning equipment still has room for improvement. Summary of the Invention

[0004] The purpose of this invention is to provide a laser alignment and cleaning device that overcomes the above-mentioned disadvantages.

[0005] This invention relates to a laser alignment and cleaning device suitable for cleaning wafers. The laser alignment and cleaning device includes a base unit, a drive unit, a spray unit, and a laser unit. The base unit is used to position the wafer. The drive unit includes left and right slides, left and right slide groups slidably disposed on the left and right slides in a left-right direction, an upper and lower slides fixedly connected to the left and right slide groups, an upper and lower slide group slidably disposed on the upper and lower slides in a vertical direction perpendicular to the left and right directions, and a carrier plate fixedly connected to the upper and lower slide groups. The spray unit is connected to the bottom side of the carrier plate and includes a spray body and at least one nozzle. The nozzle is connected to the spray body and is used to spray a reagent toward the wafer. The laser unit is connected to the left and right slides and is used to emit a laser toward the wafer. The portion of the laser emitted by the laser unit projected onto the wafer overlaps with the portion of the reagent sprayed by the nozzle that contacts the wafer.

[0006] The laser alignment and cleaning apparatus of the present invention further includes an image capturing unit fixedly connected to the spray base unit, the image capturing unit being used to generate an image set facing the wafer.

[0007] The laser alignment and cleaning device of the present invention includes a base unit comprising a base body defining a plurality of openings and a plurality of vacuum adsorption parts respectively disposed in the openings.

[0008] The laser alignment and cleaning device of the present invention further includes a front and rear slide block assembly and a front and rear slide table assembly slidably disposed on the front and rear slide block assembly along a front-back direction perpendicular to the left-right direction and the up-down direction, wherein the left and right slide blocks are fixedly connected to the front and rear slide table assembly.

[0009] The laser alignment and cleaning apparatus of the present invention has a carrier plate having a main plate portion, a base plate portion connected to the bottom side of the main plate portion, and two extension plate portions connected to the bottom side of the base plate portion. The spray base body is rotatably disposed between the extension plate portions, and the nozzle component surrounds and defines an axis, which is used to define an included angle with the wafer.

[0010] The laser alignment and cleaning device of the present invention further includes at least one auxiliary nozzle component fixedly connected to the base plate, the auxiliary nozzle component being used to spray the reagent toward the wafer.

[0011] The laser alignment and cleaning device of the present invention includes a laser unit comprising a laser mounting base connected to the left and right slides, and a laser emitter fixedly connected to the laser mounting base. The laser mounting base has a fixed plate portion fixedly connected to the left and right slides, two connecting plate portions rotatably connected to the fixed plate portion, and a mounting part portion rotatably connected to the connecting plate portion on the side opposite to the fixed plate portion. The mounting part portion defines a mounting hole, and the laser emitter passes through the mounting hole and is fixedly connected to the mounting part portion.

[0012] The beneficial effects of the present invention are as follows: by setting the laser unit connected to the left and right slides and the spray unit connected to the bottom side of the carrier plate, the laser unit and the spray unit move together, thereby ensuring that the laser emitted by the laser unit marks the agent sprayed by the nozzle, and thus making it easier to confirm the cleaning process of the wafer. Attached Figure Description

[0013] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, wherein:

[0014] Figure 1 This is a perspective view of an embodiment of the laser alignment and cleaning device of the present invention;

[0015] Figure 2 This is another perspective view of the described embodiment and the wafer;

[0016] Figure 3 This is an incomplete enlarged schematic diagram of the embodiment described;

[0017] Figure 4 This is a top perspective view of the embodiment and the wafer described;

[0018] Figure 5 It is along Figure 4 The cross-sectional view obtained by the VV line. Detailed Implementation

[0019] See Figure 1 and Figure 2 An embodiment of the laser alignment cleaning device of the present invention is applicable to cleaning a wafer 9 and includes a base unit 1, a driving unit 2, a spray base unit 3, a laser unit 4 and an image capturing unit 5.

[0020] The base unit 1 includes a base body 11 defining six openings 111, and six vacuum adsorption portions 12 respectively disposed in the openings 111. The vacuum adsorption portions 12 of the base unit 1 are used to limit the wafer 9 by vacuum adsorption. The number of openings 111 and vacuum adsorption portions 12 can be adjusted according to needs, and is not limited to six.

[0021] The drive unit 2 includes a front and rear slide block assembly 21 connected above a base frame (not shown), a front and rear slide platform assembly 22 slidably disposed on the front and rear slide block assembly 21 along a front-rear direction D1, a left and right slide block 23 fixedly connected to the front and rear slide platform assembly 22, a left and right slide platform assembly 24 slidably disposed on the left and right slide blocks 23 along a left and right direction D2 perpendicular to the front-rear direction D1, an upper and lower slide block 25 fixedly connected to the left and right slide platform assembly 24, an upper and lower slide platform assembly 26 slidably disposed on the upper and lower slide block 25 along an upper and lower direction D3 perpendicular to the front-rear direction D1 and the left and right direction D2, and a carrier plate 27 fixedly connected to the upper and lower slide platform assembly 26.

[0022] The front and rear slide block assembly 21 has two front and rear slide blocks 211 spaced apart along the left and right direction D2, and the front and rear slide block assembly 22 is slidably disposed on the front and rear slide blocks 211.

[0023] See Figure 3 The carrier plate 27 has a main plate portion 271, a bottom plate portion 272 connected to the bottom side of the main plate portion 271, and two extension plate portions 273 connected to the bottom side of the bottom plate portion 272.

[0024] The spray base unit 3 is connected to the bottom side of the carrier plate 27 and includes a spray base body 31, two nozzle elements 32, and two auxiliary nozzle elements 33 fixedly connected to the base plate portion 272. In this embodiment, both the nozzle elements 32 and the auxiliary nozzle elements 33 are fan-shaped nozzle elements. In other variations of this embodiment, the nozzle elements 32 and the auxiliary nozzle elements 33 may also be conical nozzle elements, direct current nozzle elements, or atomizing nozzle elements.

[0025] The spray nozzle body 31 is rotatably disposed between the extension plates 273 and is used to receive the agent via a hose (not shown).

[0026] The nozzle element 32 is connected to and communicates with the spray base body 31. The nozzle element 32 is used to receive the agent through the spray base body 31 and spray the agent toward the wafer 9. In this embodiment, the agent is standard cleaning solution 1 (SC-1), standard cleaning solution 2 (SC-2), or other chemical formula solutions for cleaning.

[0027] See Figure 4 and Figure 5 Each nozzle element 32 defines an axis L1, and each axis L1 together with the wafer 9 defines an angle θ, which corresponds to the rotation of the nozzle body 31 relative to the carrier plate 27 (e.g., Figure 5 (As shown). More precisely, the spray nozzle body 31 is operated to rotate relative to the carrier plate 27 so that its respective axis L1 and the wafer 9 jointly define the included angle θ, and then operated to be fixedly connected to the carrier plate 27.

[0028] It is worth mentioning that the number of the nozzle element 32 and the auxiliary nozzle element 33 can be adjusted according to needs, and is not limited to two. In other variations of this embodiment, the number of the nozzle element 32 and the auxiliary nozzle element 33 may also be one or more.

[0029] See Figure 2 , Figure 4 and Figure 5 The laser unit 4 is connected to the left and right slides 23 and includes a laser mounting base 41 connected to the left and right slides 23 and a laser emitter 42 fixedly connected to the laser mounting base 41.

[0030] The laser mounting base 41 has a fixed plate portion 411 fixedly connected to the left and right slide blocks 23, two connecting plate portions 412 rotatably connected to the fixed plate portion 411, and a mounting member portion 413 rotatably connected to the connecting plate portion 412 on the side opposite to the fixed plate portion 411. The mounting member portion 413 defines a mounting hole 414. More precisely, the mounting member portion 413 is operated to swing relative to the fixed plate portion 411 to a predetermined position via the connecting plate portion 412, and then operated to be fixedly connected to the left and right slide blocks 23.

[0031] The laser emitter 42 passes through the mounting hole 414 and is fixedly connected to the mounting part 413. In this embodiment, the laser emitter 42 is a red laser diode.

[0032] The laser unit 4 is used to emit a laser towards the wafer 9, and the portion of the laser emitted by the laser unit 4 that is projected onto the wafer 9 overlaps with the portion of the agent sprayed by the nozzle 32 that contacts the wafer 9, so that an operator can inspect it on-site.

[0033] The image capturing unit 5 is fixedly connected to the spray base unit 3 and is used to generate an image set facing the wafer 9. The image set indicates the overlapping situation where the part of the laser emitted by the laser unit 4 projected on the wafer 9 and the part of the agent sprayed by the nozzle 32 that contacts the wafer 9 (i.e. the cleaning process of the wafer 9), so that the operator can confirm the cleaning process of the wafer 9 afterwards.

[0034] Therefore, during actual inspection, whether on-site or after confirmation, the laser emitted by the laser unit 4 marks the agent sprayed by the nozzle 32, making it easier for the operator to confirm the cleaning process of the wafer 9 based on the laser emitted by the laser unit 4.

[0035] In summary, this embodiment achieves the following effects:

[0036] (i) By setting the laser unit 4 connected to the left and right slide blocks 23 and the spray unit 3 connected to the bottom side of the carrier plate 27, the laser unit 4 and the spray unit 3 move together, thereby ensuring that the laser emitted by the laser unit 4 marks the agent sprayed by the nozzle 32, and thus more easily confirming the cleaning process of the wafer 9.

[0037] (ii) The image capturing unit 5 is configured to generate the image set facing the wafer 9, so that the operator can subsequently confirm the cleaning process of the wafer 9.

[0038] Therefore, the laser alignment and cleaning device of the present invention can easily confirm the cleaning process of the wafer 9 and can indeed achieve the purpose of the present invention.

[0039] The above description is merely an embodiment of the present invention and should not be construed as limiting the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the claims and description of the present invention shall still fall within the scope of the present invention.

Claims

1. A laser alignment cleaning device, suitable for cleaning a wafer, characterized by: The laser alignment and cleaning device includes a base unit, a drive unit, a spray unit, and a laser unit. The base unit is used to position the wafer. The drive unit includes left and right slides, left and right slide groups slidably disposed on the left and right slides in the left and right direction, upper and lower slides fixedly connected to the left and right slide groups, upper and lower slide groups slidably disposed on the upper and lower slides in the up and down direction perpendicular to the left and right direction, and a carrier plate fixedly connected to the upper and lower slide groups. The spray unit is connected to the bottom side of the carrier plate and includes a spray body and at least one nozzle. The nozzle is connected to the spray body and is used to spray a reagent toward the wafer. The laser unit is connected to the left and right slides and is used to emit a laser toward the wafer. The portion of the laser emitted by the laser unit that is projected onto the wafer overlaps with the portion of the reagent sprayed by the nozzle that contacts the wafer.

2. The laser alignment and cleaning device according to claim 1, characterized in that: The laser alignment and cleaning device further includes an image capturing unit fixedly connected to the spray base unit, the image capturing unit being used to generate an image set facing the wafer.

3. The laser alignment and cleaning device according to claim 1, characterized in that: The base unit includes a base body defining a plurality of openings, and a plurality of vacuum adsorption sections respectively disposed in the openings.

4. The laser alignment and cleaning device according to claim 1, characterized in that: The drive unit further includes a front and rear slide block assembly, and a front and rear slide platform assembly slidably disposed on the front and rear slide block assembly along a front-back direction perpendicular to the left-right direction and the up-down direction, wherein the left and right slide blocks are fixedly connected to the front and rear slide platform assembly.

5. The laser alignment and cleaning device according to claim 1, characterized in that: The carrier has a main board portion, a base plate portion connected to the bottom side of the main board portion, and two extension plate portions connected to the bottom side of the base plate portion. The spray base body is rotatably disposed between the extension plate portions. The nozzle component surrounds and defines an axis, which is used to define an included angle together with the wafer.

6. The laser alignment and cleaning device according to claim 5, characterized in that: The spray unit further includes at least one auxiliary nozzle component fixedly connected to the base plate, the auxiliary nozzle component being used to spray the agent toward the wafer.

7. The laser alignment and cleaning device according to claim 1, characterized in that: The laser unit includes a laser mounting base connected to the left and right slides, and a laser emitter fixedly connected to the laser mounting base. The laser mounting base has a fixed plate portion fixedly connected to the left and right slides, two connecting plate portions rotatably connected to the fixed plate portion, and a mounting part portion rotatably connected to the connecting plate portion on the side opposite to the fixed plate portion. The mounting part portion defines a mounting hole, and the laser emitter passes through the mounting hole and is fixedly connected to the mounting part portion.

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