Integrated welding device and method for hemispherical resonator gyroscope

By designing a hemispherical resonator gyroscope welding device that includes a base, sleeve, and conductor, the simultaneous welding of the hemispherical resonator, plate electrode, and base was achieved, solving the problems of slow manufacturing progress and low reliability in the existing technology, simplifying the process and reducing costs.

CN121870324APending Publication Date: 2026-04-17XIAN FLIGHT SELF CONTROL INST OF AVIC
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Patent Information

Application Number
CN202511965753.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-24
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

Existing technologies cannot simultaneously weld hemispherical resonators, flat plate electrodes, and bases, resulting in slow manufacturing progress, long processes, and high costs. Furthermore, the welded parts are susceptible to thermal shock, leading to decreased reliability.

Method used

An integrated welding device for hemispherical resonator gyroscopes is used, including a base, a sleeve, and a conductor. By precisely adjusting the temperature gradient and heat conduction path, the hemispherical resonator, the flat plate electrode, and the base can be welded simultaneously.

Benefits of technology

It simplifies the manufacturing process, reduces costs, improves welding reliability, avoids the impact of thermal shock on welded parts, and improves assembly efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The integrated welding device comprises a base, a sleeve and a conductor, the base is of a cylindrical structure, a cylindrical cavity is formed in the base and used for containing the sleeve, threaded holes are formed in the side wall of the base, and the conductor is fixed through screws; the base is located at the bottommost part of the welding device, supports the whole welding device and transmits heat to the sleeve and the conductor in a conduction mode. The sleeve is of an annular columnar structure, the inner diameter of the sleeve is matched with the outer diameter of the plate electrode, and full contact is guaranteed. The sleeve is located on the base, and the plate electrode and the hemispherical harmonic oscillator assembly are placed in the sleeve; the conductor is of a thin-wall bent plate structure, the lower end of the conductor makes close contact with the side wall of the base, a square groove is formed in the conductor, and the conductor and the base are fixed through screws. A cylindrical groove is formed in the upper end of the conductor and is in close contact with the welding pin of the base; the distance between the upper end of the conductor and a welding spot can be adjusted by controlling the vertical position of the square groove in the lower end of the conductor and the threaded hole of the base.
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Description

Technical Field

[0001] This invention belongs to the field of hemispherical resonant gyroscope technology, specifically relating to an integrated welding device and method for a hemispherical resonant gyroscope. Background Technology Hemispherical resonator gyroscopes have high C-SWaP characteristics and have become the most popular core sensor for inertial navigation both domestically and internationally. They have been extensively studied and applied in aerospace, aviation, and maritime fields.

[0002] The mainstream design of a hemispherical resonator gyroscope comprises three components: a hemispherical resonator, a planar electrode, and a base. The hemispherical resonator is the core sensing element of the gyroscope. Its surface is coated with a metal film, and the angular velocity of the inertial navigation system is sensed by detecting and controlling the antiaxial wave of the hemispherical resonator. The planar electrode is primarily a quartz glass substrate with a specially patterned metal film coated on its surface. The planar electrode and the hemispherical resonator form a capacitor, and the oscillation of the resonator is detected and controlled based on changes in capacitance. The base is the supporting structure of the hemispherical resonator gyroscope. Metal pins on the base contact the gold film on the planar electrode, enabling electrical conduction.

[0003] In a hemispherical resonator gyroscope product, the hemispherical resonator is connected to a flat plate electrode, which in turn is connected to a base. The anchor structure of the hemispherical resonator is inserted into the central through-hole of the flat plate electrode to achieve a hole-axis fit, and then fixed by welding. The gold film on the surface of the flat plate electrode is also connected to the base pins by welding, thus assembling the overall structure of the hemispherical resonator gyroscope. In traditional manufacturing processes, this requires at least two steps, resulting in slow manufacturing progress, long processes, and high costs. Furthermore, the connected components are exposed to high and low temperature variations, causing thermal shock at the welded joints and leading to a decrease in reliability. Current technological research focuses on one of the two connection requirements mentioned above. For example, Chinese patent CN115592289 A mentions a temperature gradient-based indium welding device and process method for hemispherical resonator gyroscopes, which can only complete the welding of the hemispherical resonator and the flat plate electrode. No related technology has yet been found that can simultaneously complete the connection of the hemispherical resonator, flat plate electrode, and base—a complete "three-piece set." Summary of the Invention

[0004] This invention proposes an integrated welding device and method for hemispherical resonator gyroscopes, which solves the problem that existing technologies cannot simultaneously weld the hemispherical resonator, plate electrodes, and base. This application significantly shortens the gyroscope manufacturing process, simplifies procedures, reduces costs, and avoids the impact of thermal shock on the welded parts.

[0005] Technical solution: In a first aspect, this application provides an integrated welding device for a hemispherical resonant gyroscope, comprising a base 1, a sleeve 2, and a conductor 3, wherein: The base 1 is a cylindrical structure with an internal cylindrical cavity to accommodate the sleeve 2. Threaded holes 1-3 are located on its side wall for fixing the conductor 3 with screws. The base 1 is located at the bottom of the welding device, supporting the entire device and transferring heat to the sleeve 2 and conductor 3 via conduction. The sleeve 2 is an annular cylindrical structure with its inner diameter matching the outer diameter of the flat electrode to ensure full contact. The sleeve 2 is located on the base 1, and the flat electrode and hemispherical resonator assembly are placed inside. The conductor 3 is a thin-walled bent plate structure. The lower end of the conductor 3 is in close contact with the side wall of the base 1. A square groove (3-1) is located on the conductor 3, which is fixed to the base 1 with screws. A cylindrical groove (3-2) is located at the upper end of the conductor 3, which is in close contact with the base welding pin. The distance between the upper end of the conductor 3 and the welding point can be adjusted by controlling the vertical position of the square groove at the lower end of the conductor 3 and the threaded holes 1-3 on the base, which facilitates precise temperature control of the welding point.

[0006] Specifically, the base 1 has a cylindrical structure; the upper surface of the base 1 is recessed to form a cylindrical cavity, which is coaxial with the base 1; multiple threaded through holes 1-3 are opened on the side of the base 1; the threaded through holes 1-3 are evenly distributed circumferentially on the side of the base 1, and the center of all the threaded through holes 1-3 is at the same height from the bottom of the base 1.

[0007] Specifically, the sleeve 2 is a cylindrical ring structure, and the sleeve 2 and the flat plate electrode 5 are made of the same material; the flat plate electrode 5 and the hemispherical resonator 4 are located inside the sleeve, and the inner diameter of the sleeve 2 matches the outer diameter of the flat plate electrode 5 to ensure full contact; the sleeve 2 is located above the base 1, and the lower bottom surface (2-1) of the sleeve 2 contacts the upper bottom surface (1-1) of the base 1; the sleeve 2 and the base 1 are coaxial.

[0008] Specifically, there is a small gap t between the outer sidewall 2-4 of the sleeve 2 and the inner sidewall (1-2) of the base 1, and a suitable amount of thermally conductive adhesive is filled in part of the gap; by controlling the area A of the thermally conductive adhesive distributed on the inner sidewall (1-2) of the base 1 and the outer sidewall 2-4 of the sleeve, the heat conduction rate q between the base 1 and the sleeve 2 is adjusted, thereby controlling the temperature of the welding area between the hemispherical resonator 4 and the flat plate electrode 5.

[0009] Specifically, the conductor 3 is a thin-walled curved plate pure copper structure with an overall L-shaped structure; the conductor 3 has a square long slot 3-1 and a cylindrical slot 3-2; the square long slot 3-1 of the conductor 3 is located on one side of the L-shaped structure, and the square long slot 3-1 is completely open along the thickness direction of the conductor 3; the square long slot 3-1 is longer than the pin length of the base 6; the width of the square long slot 3-1 is greater than the diameter of the threaded through hole 1-3 of the base 1.

[0010] Specifically, the cylindrical groove 3-2 of the conductor 3 is located at the end of the other side of the L-shaped structure. The cylindrical groove 3-2 has the same axis of symmetry as the entire structure of the conductor 3, and the height of the cylindrical groove 3-2 is the same as the thickness of the conductor. The size of the cylindrical groove 3-2 of the conductor 3 matches the outer diameter of the pin to ensure full contact. The conductor 3 is tightly fixed to the base 1 through the square long groove 3-1, and the cylindrical groove 3-2 part is in full contact with the welding pin of the base 6. The position of the contact point between the conductor 3 and the welding pin of the base 6 is controlled by adjusting the relative position of the square long groove 3-1 and the threaded hole 1-3 on the side wall of the base 1, thereby controlling the heat conduction and temperature of the welding point between the base 6 and the flat electrode 5.

[0011] Specifically, there are eight conductors 3 in the entire welding device, which are evenly distributed around the circumference. The cylindrical grooves 3-2 on the conductors 3 contact the sides of the eight welding pins of the base 6 to form a conduction path to meet the welding requirements of the eight welding pins of the base 6.

[0012] Specifically, the assembly structure formed by the hemispherical resonator 4 and the flat plate electrode 5 is located inside the sleeve 2; the mushroom top 4-1 of the hemispherical resonator 4 contacts the upper surface 2-2 of the bottom end of the sleeve 2, and a small amount of thermally conductive adhesive is applied to the upper surface 2-2 of the bottom end of the sleeve 2 to fix the hemispherical resonator 4. The inner wall 2-3 of the side of the sleeve 2 fits tightly with the side of the flat plate electrode 5 to ensure thermal conductivity and take into account the overall structural stability.

[0013] Specifically, the base 6 is placed above the flat plate electrode 5, and the welding pin of the base 6 contacts the gold film of the flat plate electrode 5. The contact position is the welding position between the base 6 and the flat plate electrode 5.

[0014] Secondly, this application provides an integrated welding method for a hemispherical resonant gyroscope, the method being implemented using the aforementioned integrated welding device for hemispherical resonant gyroscopes, the method comprising: Step 1: Install the welding device. Place the entire welding device on the heating platform. Place a temperature sensor in the welding area between the hemispherical resonator 4 and the flat plate electrode 5, and place another sensor in the welding area between the flat plate electrode 5 and the base (6). Step 2: Heat the area in a vacuum environment and check the temperature of the two welding areas; if the welding requirements are met, proceed to Step 3; if the welding requirements are not met, proceed to Step 4. Step 3: Replace the positions of the two temperature sensors with the first solder (7) and the second solder (8), and set appropriate heating parameters for welding; Step 4: Adjust the relevant parameters that affect the heat conduction of the overall welding device to control the welding temperature at different welding positions.

[0015] In summary, this invention proposes an integrated welding device and method for hemispherical resonant gyroscopes, improving the assembly efficiency of the gyroscopes. In existing hemispherical resonant gyroscope manufacturing technologies, the welding of the hemispherical resonator to the plate electrode and the welding of the plate electrode to the base are completed in two separate processes. The integrated welding method of this invention combines these two processes into one, simplifying the manufacturing process and improving welding reliability. Combining the welding of the hemispherical resonator, plate electrode, and base into a single process avoids thermal shock to the welding positions from the previous process during the subsequent welding process, thus preventing damage to welding quality. The integrated welding method provided by this invention can adjust the welding temperature gradient of the overall gyroscope structure through various means, such as the conductor height, the distribution area of ​​the thermally conductive adhesive, and the material or dimensional parameters of the welding device structure, and meets the welding requirements of various solder combinations, greatly improving the environmental adaptability of the welding process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the integrated welding device for a hemispherical resonant gyroscope according to the present invention; Figure 2 This is an exploded view of the integrated welding device structure of the present invention; Figure 3 This is a schematic diagram of the conductor assembly of the integrated welding device of the present invention; Figure 4 This is a schematic diagram of the base assembly of the integrated welding device of the present invention; Figure 5 This is a schematic diagram of the sleeve assembly of the integrated welding device of the present invention; Figure 6 This is the welding heating process curve; Among them, 1-base, 2-sleeve, 3-conductor, 4-hemispherical resonator, 5-flat plate electrode, 6-base, 7-first solder, 8-second solder, 1-1-bottom upper surface of base, 1-2-inner side wall of base, 1-3-threaded hole of base side wall, 2-1-bottom lower surface of sleeve, 2-2-bottom upper surface of sleeve, 2-3-inner side wall of sleeve, 2-4-outer side wall of sleeve, 3-1-square long groove of conductor, 3-2-cylindrical groove of conductor, 4-1 mushroom top of resonator. Detailed Implementation

[0017] To better understand the features of the present invention, the present invention will be further described in detail through specific embodiments.

[0018] Example 1 like Figure 1 As shown, the integrated welding device for a hemispherical resonant gyroscope provided in this embodiment includes a base 1, a sleeve 2, and a conductor 3, wherein: The base 1 is a cylindrical structure with an internal cylindrical cavity to accommodate the sleeve 2. Threaded holes 1-3 are located on its side wall, allowing screws to secure the conductor 3. The base 1 is located at the bottom of the welding device, supporting the entire assembly and transferring heat to the sleeve 2 and conductor 3 via conduction. The sleeve 2 is an annular cylindrical structure, with its inner diameter matching the outer diameter of the flat electrode to ensure full contact. The sleeve 2 sits on the base 1, housing the assembled flat electrode and hemispherical resonator assembly. The conductor 3 is a thin-walled curved plate structure. Its lower end is in close contact with the side wall of the base 1, and it has a square groove (3-1) for securing it to the base 1 with screws. A cylindrical groove (3-2) is located at the upper end of the conductor 3, which is in close contact with the welding pin of the base. The distance between the upper end of the conductor 3 and the weld point can be adjusted by controlling the vertical position of the square groove at the lower end of the conductor 3 and the threaded holes 1-3 on the base, facilitating precise temperature control of the weld point.

[0019] Specifically, the base 1 is made of a high thermal conductivity material such as pure copper, which has good thermal conductivity.

[0020] Specifically, base 1 is a cylindrical structure, 15mm high and 40mm in diameter.

[0021] Specifically, the upper surface of the base 1 is recessed to form a cylindrical cavity, which is coaxial with the base 1 and is 13mm deep.

[0022] Specifically, the base 1 has eight threaded through holes 1-3 on its side.

[0023] Specifically, eight threaded through holes 1-3 are evenly distributed circumferentially on the side of the base 1, and the center of all threaded through holes 1-3 is at the same height from the bottom of the base 1, which is 7mm.

[0024] Specifically, base 1 is located at the very bottom of the entire welded structure. Specifically, sleeve 2 is a cylindrical annular structure with a height of 18mm.

[0025] Specifically, the sleeve 2 and the flat electrode 5 are made of the same material, usually quartz glass, to avoid stress concentration damage caused by the inconsistency of their thermal expansion coefficients.

[0026] Specifically, the sidewall of sleeve 2 is thinner than 2mm, which helps to improve the efficiency of heat conduction.

[0027] Specifically, the flat plate electrode 5 and the hemispherical resonator 4 are located inside the sleeve, and the inner diameter of the sleeve 2 matches the outer diameter of the flat plate electrode 5 to ensure full contact.

[0028] Specifically, the sleeve 2 is located above the base 1, and the bottom surface (2-1) of the sleeve 2 is in contact with the bottom upper surface (1-1) of the base 1.

[0029] Specifically, sleeve 2 is coaxial with base 1.

[0030] Specifically, there is a small gap t between the outer sidewall 2-4 of the sleeve 2 and the inner sidewall (1-2) of the base 1, and a portion of the gap is filled with an appropriate amount of thermally conductive adhesive. By controlling the area A of the thermally conductive adhesive distributed on the inner sidewall (1-2) of the base 1 and the outer sidewall 2-4 of the sleeve, the heat conduction rate q between the base 1 and the sleeve 2 is adjusted, thereby controlling the temperature of the welding area between the hemispherical resonator 4 and the flat plate electrode 5.

[0031]

[0032] Where k is the thermal conductivity related to the materials of base 1 and sleeve 2. It is the temperature gradient between base 1 and sleeve 2.

[0033] Specifically, such as Figures 2-3 As shown, conductor 3 is made of a material with high thermal conductivity, such as pure copper.

[0034] Specifically, the conductor 3 is a thin-walled bent plate pure copper structure with an overall "L" shape and a thickness of 2mm.

[0035] Specifically, the conductor 3 has a square long slot 3-1 and a cylindrical slot 3-2. Specifically, the square long slot 3-1 of the conductor 3 is located on one side of the "L"-shaped structure, and the square long slot 3-1 is completely open along the thickness direction of the conductor 3.

[0036] Specifically, the square groove 3-1 is 5mm long, which is greater than the pin length of the base 6; and 3mm wide, which is slightly larger than the diameter of the threaded through hole 1-3 of the base 1.

[0037] Specifically, the cylindrical groove 3-2 of the conductor 3 is located at the end of the other side of the "L"-shaped structure. The cylindrical groove 3-2 has the same axis of symmetry as the entire structure of the conductor 3. The diameter of the cylindrical groove 3-2 is about 0.8 mm, and its height is the same as the thickness of the conductor.

[0038] Specifically, the dimensions of the cylindrical groove 3-2 of the conductor 3 match the outer diameter of the pin to ensure full contact.

[0039] Specifically, the conductor 3 is tightly fixed to the base 1 via a square elongated groove 3-1, and the cylindrical groove 3-2 is in full contact with the welding pin of the base 6. The position of the contact point between the conductor 3 and the welding pin of the base 6 is controlled by adjusting the relative position of the square elongated groove 3-1 and the threaded hole 1-3 on the side wall of the base 1, thereby controlling the heat conduction and temperature at the welding point between the base 6 and the flat electrode 5.

[0040] Specifically, there are eight conductors 3 in the entire welding device, which are evenly distributed around the circumference. The cylindrical grooves 3-2 on the conductors 3 contact the sides of the eight welding pins of the base 6 to form a conduction path to meet the welding requirements of the eight welding pins of the base 6.

[0041] Specifically, the assembly structure formed by the hemispherical resonator 4 and the flat plate electrode 5 is located inside the sleeve 2.

[0042] Specifically, the mushroom-shaped top 4-1 of the hemispherical resonator 4 contacts the upper surface 2-2 of the bottom end of the sleeve 2. A small amount of thermally conductive adhesive is applied to the upper surface 2-2 of the bottom end of the sleeve 2 to fix the hemispherical resonator 4. The inner wall 2-3 of the side of the sleeve 2 fits tightly with the side of the flat plate electrode 5 to ensure thermal conductivity and take into account the overall structural stability.

[0043] Specifically, the base 6 is placed above the flat plate electrode 5, and the welding pin of the base 6 contacts the gold film of the flat plate electrode 5. The contact position is the welding position between the base 6 and the flat plate electrode 5.

[0044] It should be noted that the gap control and assembly method between the hemispherical resonator 4 and the flat plate electrode 5 can be accomplished using existing technologies, and will not be elaborated upon in this embodiment.

[0045] It should be noted that the hemispherical resonator 4, the flat plate electrode 5, and the base 6 in this embodiment are all common hemispherical resonator gyroscope components in the prior art. The geometric and material characteristics of these components and their interconnections are not described in detail in this embodiment.

[0046] In summary, the integrated welding device for hemispherical resonator gyroscopes provided by this invention comprises three parts: a base, a sleeve, and a conductor. The base is a cylindrical structure with an internal cylindrical cavity to accommodate the sleeve, and threaded holes on its sidewalls for fixing the conductor. The base, made of a high thermal conductivity material such as pure copper, is located at the bottom of the welding device, supporting the entire device and transferring heat to the sleeve and conductor via conduction. The sleeve is an annular cylindrical structure, made of the same material as the flat electrode, typically quartz glass, with its inner diameter matching the outer diameter of the flat electrode to ensure sufficient contact. The sleeve is located on the base, and the assembled flat electrode and hemispherical resonator assembly are placed inside. The sidewalls of the sleeve are thin (less than 2mm), which improves heat conduction efficiency. The conductor is a thin-walled curved plate structure made of a high thermal conductivity material such as pure copper. The lower end of the conductor is in close contact with the sidewall of the base, and a square groove is formed on the conductor, allowing it to be fixed to the base with screws. The upper end of the conductor has a cylindrical groove that matches the size of the welding pin on the base, increasing the contact area between the conductor and the welding pin and improving heat conduction efficiency. The distance between the upper end of the conductor and the welding point can be adjusted by controlling the vertical position of the square groove at the lower end of the conductor and the threaded hole in the base, which is beneficial for precise regulation of the welding point temperature.

[0047] The integrated welding device provided by this invention has the following advantages: The three components of the integrated welding device provided by this invention have simple geometric structures, low manufacturing costs, and are easy to obtain.

[0048] The present invention provides a small assembly gap between the base and the sleeve, and the heat conduction rate can be controlled by controlling the area of ​​the thermally conductive adhesive filled in the assembly gap.

[0049] The thermal conductivity of the base and conductor in this invention can be controlled by material selection, thereby adjusting the spatial temperature gradient of the overall structure to meet the requirements of integrated welding.

[0050] The sleeve provided by this invention has an inner diameter that matches the outer diameter of the flat electrode, and is made of the same material as the flat electrode, typically quartz glass. This avoids stress concentration damage caused by the inconsistency in their thermal expansion coefficients. Simultaneously, the thinner sidewalls (less than 2mm) also improve heat conduction efficiency.

[0051] Example 2 like Figure 1 As shown, the integrated welding method for a hemispherical resonant gyroscope provided in this embodiment is implemented using the integrated welding device for the hemispherical resonant gyroscope provided in the above embodiment. The method includes: Step 1: Install the welding equipment.

[0052] Specifically, step 1 includes: Step 11: Install the integrated welding device of the present invention according to the description of Example 1. After installation, place the entire welding device on the heating platform.

[0053] Step 12: Place one temperature sensor in the welding area between the hemispherical resonator 4 and the plate electrode 5, and place another sensor in the welding area between the plate electrode 5 and the base (6).

[0054] Step 2: Heat the area in a vacuum environment and check the temperature of the two welding areas; if the welding requirements are met, proceed to Step 3; if the welding requirements are not met, proceed to Step 4. Step 3: Replace the positions of the two temperature sensors with the first solder (7), which is indium, and the second solder (8), which is tin, and set appropriate heating parameters for soldering. The heating temperature parameters of the heating platform are as follows: Figure 6 As shown.

[0055] Specifically, when the overall structure is heated to a certain temperature, it needs to be kept at that temperature for a period of time to ensure the temperature stability of different welding positions.

[0056] Specifically, before the welding heating temperature reaches the melting point of the solder, a reducing gas is introduced into the welding environment to remove the oxide layer of the solder and improve the wettability of the solder.

[0057] Specifically, during the welding process, the entire structure is placed in a vacuum environment, avoiding solder joint oxidation and component contamination. The entire structure is placed on a heating plate, the temperature of which can be precisely adjusted, thereby achieving precise temperature control at the welding location.

[0058] Specifically, the welding cooling process should be controlled at a relatively high rate to avoid excessive growth of intermetallic compounds, which would affect the welding quality.

[0059] Step 4: Adjust the relevant parameters that affect the heat conduction of the overall welding device to control the welding temperature at different welding positions.

[0060] Specifically, step 4 includes: Step 41: Adjust the height of the conductor 3 by fixing the square groove of the conductor 3 with screws, control the distance between the cylindrical groove (3-2) of the conductor 3 and the welding area, thereby controlling the temperature of the welding area between the base (6) and the flat electrode (5).

[0061] Specifically, the height adjustment of the conductor 3 does not affect the contact between the cylindrical groove (3-2) of the conductor 3 and the welding pin of the base (6).

[0062] Step 42: Adjust the distribution area and size of the thermally conductive adhesive filled between the inner side wall (1-2) of the base 1 and the outer side wall (2-4) of the sleeve 2, thereby controlling the temperature of the welding area between the hemispherical resonator (4) and the flat plate electrode (5).

[0063] Step 43: Adjust the material properties and geometric dimensions of the base 1 and the conductor 3 to control the temperature gradient distribution of the overall welding device. For example, adjust the side wall thickness of the base 1, and the conductor 3 can be made of graphite or other high thermal conductivity materials.

[0064] It should be noted that, through the above adjustments, a temperature gradient distribution that meets the requirements for integrated welding of hemispherical resonant gyroscopes can be obtained, thus completing the integrated welding of hemispherical resonant gyroscopes.

[0065] In summary, the integrated welding method for hemispherical resonant gyroscopes provided by this invention: Apply a suitable amount of thermally conductive adhesive to the outer sidewall of the sleeve. The coverage area of ​​the thermally conductive adhesive layer can be adjusted according to the actual heat conduction requirements. Then, slowly insert the sleeve into the cylindrical cavity of the base and gently rotate the sleeve to ensure that the thermally conductive adhesive fully fills the gap between the sleeve and the base. Gently place the resonator and flat electrode assembly into the sleeve, with the resonator mushroom-shaped tip facing down, in contact with the upper surface of the bottom of the sleeve. A small amount of thermally conductive adhesive is applied to the upper surface of the bottom of the sleeve to fix the hemispherical resonator. The gap between the flat electrode and the resonator can be controlled using existing technology such as ultra-thin gaskets, which will not be described separately in this invention. Place the base above the flat electrode, with the base pins in contact with the electrode gold film. Fix the eight conductors to the outer sidewall of the base with screws, controlling the height of the conductors according to the actual heat conduction requirements and ensuring that the height of the eight conductors is consistent. During the fixing of the conductors, adjust the position of the base pins to ensure that the pins are in full contact with the cylindrical grooves at the upper end of the conductors. The entire structure is placed in a vacuum environment, with the base placed on the heating plane. One temperature sensor is placed on the upper end of the flat plate electrode, making contact with the chamfer of the hemispherical resonator anchor and the central through-hole of the flat plate electrode. The base pin of another temperature sensor contacts the gold film of the flat plate electrode. A heating temperature profile is set according to the solder properties. During the heating process, the temperature at the two welding positions is checked to see if it meets the welding requirements. If it does, the temperature sensor is removed, and the solder is replaced to complete the welding process. If it does not meet the requirements, the height of the conductor, the distribution area of ​​the thermally conductive adhesive, and the material or dimensional parameters of the welding device structure are adjusted until the welding temperature requirements are met. The two types of solder are placed at their respective welding positions, and welding is performed according to the set heating profile. After the solder fully fills the required welding positions and solidifies, the entire integrated welding process is completed.

[0066] Note that this embodiment is one of the specific forms of the present invention and does not mean that the present invention is limited to the implementation forms described in the embodiment. The present invention aims to solve the integrated welding problem that has not been broken through in the prior art but is of great significance to the manufacturing of hemispherical resonant gyroscopes, based on the principle of heat conduction and through the design of integrated welding device and the research of temperature gradient adjustment method. Other simple changes to the structure and method of welding device in the present invention are all within the scope of the core idea of ​​the present invention.

Claims

1. An integrated welding device for a hemispherical resonator gyroscope, characterized in that, Includes a base (1), a sleeve (2), and a conductor (3), wherein: The base (1) is a cylindrical structure with a cylindrical cavity inside to accommodate the sleeve (2). Threaded holes (1-3) are opened on the side wall for fixing the conductor (3) with screws. The base (1) is located at the bottom of the welding device, supporting the entire welding device and transferring heat to the sleeve (2) and conductor (3) through conduction. The sleeve (2) is an annular cylindrical structure, with its inner diameter matching the outer diameter of the flat electrode to ensure full contact. The sleeve (2) is located on the base (1), and a flat electrode is placed inside. Plate electrode and hemispherical resonator assembly; the conductor (3) is a thin-walled curved plate structure, the lower end of the conductor (3) is in close contact with the side wall of the base (1), the conductor (3) has a square groove (3-1) and the conductor (3) is fixed to the base (1) by screws; the upper end of the conductor (3) has a cylindrical groove (3-2) and the cylindrical groove is in close contact with the base welding pin; the distance between the upper end of the conductor (3) and the welding point can be adjusted by controlling the vertical position of the square groove at the lower end of the conductor (3) and the threaded hole (1-3) of the base.

2. The integrated welding device of claim 1, wherein, The base (1) is a cylindrical structure; the upper surface of the base (1) is recessed to form a cylindrical cavity, which is coaxial with the base (1); multiple threaded through holes (1-3) are opened on the side of the base (1); the threaded through holes (1-3) are evenly distributed circumferentially on the side of the base (1), and the center of all the threaded through holes (1-3) is at the same height from the bottom of the base (1).

3. The integrated welding device of claim 1, wherein, Specifically, the sleeve (2) is a cylindrical ring structure. The sleeve (2) and the flat plate electrode (5) are made of the same material. The flat plate electrode (5) and the hemispherical resonator (4) are located inside the sleeve. The inner diameter of the sleeve (2) matches the outer diameter of the flat plate electrode (5) to ensure full contact. The sleeve (2) is located above the base (1). The bottom surface (2-1) of the sleeve (2) is in contact with the bottom upper surface (1-1) of the base (1). The sleeve (2) and the base (1) are coaxial.

4. The integrated welding device of claim 1, wherein, There is a small gap t between the outer sidewall (2-4) of the sleeve (2) and the inner sidewall (1-2) of the base (1), and a suitable amount of thermally conductive adhesive is filled in part of the gap. By controlling the area A of the thermally conductive adhesive distributed on the inner sidewall (1-2) of the base (1) and the outer sidewall (2-4) of the sleeve, the heat conduction rate q between the base (1) and the sleeve (2) is adjusted, thereby controlling the temperature of the welding area between the hemispherical resonator (4) and the plate electrode (5).

5. The integrated welding device of claim 1, wherein, The conductor (3) is a thin-walled bent plate pure copper structure with an overall L-shaped structure. The conductor (3) has a square long slot (3-1) and a cylindrical slot (3-2). The square long slot (3-1) of the conductor (3) is located on one side of the L-shaped structure. The square long slot (3-1) is completely open along the thickness direction of the conductor (3). The square long slot (3-1) is larger than the pin length of the base (6). The width of the square long slot (3-1) is larger than the diameter of the threaded through hole (1-3) of the base (1).

6. The integrated welding device of claim 1, wherein, The cylindrical groove (3-2) of the conductor (3) is located at the end of the other side of the L-shaped structure. The cylindrical groove (3-2) has the same axis of symmetry as the entire structure of the conductor (3). The height of the cylindrical groove (3-2) is the same as the thickness of the conductor. The size of the cylindrical groove (3-2) of the conductor (3) matches the outer diameter of the pin to ensure full contact. The conductor (3) is tightly fixed to the base (1) through the square long groove (3-1). The cylindrical groove (3-2) part is in full contact with the welding pin of the base (6). The position of the welding pin contact point between the conductor (3) and the base (6) is controlled by adjusting the relative position of the square long groove (3-1) and the side wall threaded hole (1-3) of the base (1), thereby controlling the heat conduction and temperature of the welding point between the base (6) and the flat electrode (5).

7. The integrated welding device of claim 1, wherein, There are eight conductors (3) in the entire welding device, which are evenly distributed around the circumference. The cylindrical grooves (3-2) on the conductors (3) contact the sides of the eight welding pins of the base (6) to form a conduction path to meet the welding requirements of the eight welding pins of the base (6).

8. The integrated welding apparatus according to claim 1, characterized in that, The assembly structure formed by the hemispherical resonator (4) and the flat plate electrode (5) is located inside the sleeve 2; the mushroom top (4-1) of the hemispherical resonator (4) contacts the upper surface (2-2) of the bottom end of the sleeve (2), and a small amount of thermally conductive adhesive is applied to the upper surface (2-2) of the bottom end of the sleeve (2) to fix the hemispherical resonator (4). The inner wall (2-3) of the side of the sleeve (2) is tightly fitted with the side of the flat plate electrode (5) to ensure thermal conductivity and take into account the overall structural stability.

9. The integrated welding device of claim 1, wherein, The base (6) is placed above the plate electrode (5), and the welding pin of the base (6) contacts the gold film of the plate electrode (5). The contact position is the welding position between the base (6) and the plate electrode (5).

10. A method of integrated welding of a hemispherical resonator gyroscope, characterized by, The method is implemented using an integrated welding device for the hemispherical resonant gyroscope according to any one of claims 1 to 9, and the method includes: Step 1: Install the welding device. Place the entire welding device on the heating platform. Place one temperature sensor in the welding area between the hemispherical resonator (4) and the flat plate electrode (5), and place another sensor in the welding area between the flat plate electrode (5) and the base (6). Step 2: Heat the area in a vacuum environment and check the temperature of the two welding areas; if the welding requirements are met, proceed to Step 3; if the welding requirements are not met, proceed to Step 4. Step 3: Replace the positions of the two temperature sensors with the first solder (7) and the second solder (8), and set appropriate heating parameters for welding; Step 4: Adjust the relevant parameters that affect the heat conduction of the overall welding device to control the welding temperature at different welding positions.

Citation Information

Patent Citations

  • Hemispherical resonator gyroscope indium welding device and process method based on temperature gradient

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