Blanking device for semiconductor element production

Abstract

The invention discloses a blanking device for semiconductor element production, and relates to the technical field of semiconductor element production. The blanking device for semiconductor element production comprises a workbench, and a vibration screening mechanism is arranged at the bottom of the workbench. According to the blanking device for semiconductor element production, through the arrangement of the vibration screening mechanism, after a semiconductor element is screened out of a screening cylinder, a second motor is started to drive the screening cylinder to rotate, a vibration block is polygonal, the screening cylinder can move downwards whenever the corner end of the vibration block touches a check block in the rotating process, and therefore vibration is achieved; the rotary plate can rotate in the annular track, the screening cylinder can screen punched waste into the collecting box at the bottom in the vibration and rotation process, semiconductor elements are left in the screening cylinder, in this way, automatic screening and collecting can be achieved, errors are avoided, the screening efficiency is high, and the quality is better compared with manual screening.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing technology, specifically to a punching device for semiconductor device manufacturing. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Today, most electronic products, such as computers, mobile phones or digital recorders, have core units that are closely related to semiconductors. Common semiconductor materials include silicon, germanium and gallium arsenide, among which silicon is the most influential in commercial applications. The cited patent number is CN212070273U, which discloses a punching device for semiconductor device manufacturing; The semiconductor component manufacturing process requires punching. Existing punching equipment cannot automatically load and unload materials, nor can it automatically screen the punched semiconductor components. Therefore, it is necessary to invent a punching device for semiconductor component manufacturing that can automatically load and unload materials and automatically screen components. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a punching apparatus for semiconductor device manufacturing, thereby solving the problems mentioned in the background section.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a punching device for semiconductor component production, comprising a worktable, a protective plate fixedly connected to the top of the worktable, a cylinder fixedly connected to the top of the protective plate, a push rod fixedly connected to the output end of the cylinder, a punching die fixedly connected to the bottom of the push rod, a feeding mechanism provided inside the protective plate, an feeding mechanism fixedly connected to the side of the feeding mechanism, and a vibration screening mechanism fixedly connected to the bottom of the worktable; the vibration screening mechanism includes a receiving pipe, a telescopic rod snapped into the bottom of the receiving pipe, and the... A transmission pipe is fixedly connected to the bottom of the telescopic rod. A rotating plate is fixedly connected to the bottom of the transmission pipe. An annular slide rail is slidably connected to the outer side of the rotating plate. A screening cylinder is fixedly connected to the side of the annular slide rail away from the rotating plate. A connecting rod two is fixedly connected inside the screening cylinder. An insert block is snapped into the inside of the connecting rod two. A rotating shaft five is fixedly connected to the inner side of the insert block. A motor two is fixedly connected to the end of the rotating shaft five near the transmission pipe. A moving block two is rotatably connected to the outer side of the rotating shaft five. A spring two is fixedly connected to the side of the moving block two. A component is fixedly connected to the end of the spring two away from the moving block two. A fixed frame is provided, with a stop block fixedly connected to its top. A vibrating block is located at the bottom of the stop block. The inner side of the vibrating block is fixedly connected to the outer side of the rotating shaft five. Two moving blocks are provided. A collection box is located at the bottom of the screening cylinder. When the semiconductor components enter the screening cylinder through the receiving pipe, motor two is started. Motor two drives the rotating shaft five to rotate. The rotating shaft five drives the connecting rod two to rotate through the insert block. The connecting rod two drives the screening cylinder to rotate. Because the vibrating block is polygonal, whenever the corner of the vibrating block hits the stop block during rotation, it causes the screening cylinder to move downward. When the screening cylinder moves downward, it drives the transmission pipe to move downward. The telescopic rod extends outward. When the corner of the vibrating block moves away from the stop, the screening cylinder will return to its original position under the action of spring two. At the same time, the telescopic rod retracts. Simultaneously, when the rotating shaft five rotates, the rotating plate will rotate within the circular track. This ensures that the semiconductor components in the transmission pipeline enter the screening cylinder stably without affecting the movement of the screening cylinder. During the vibration and rotation of the screening cylinder, the punched waste material can be screened into the collection box at the bottom, while the semiconductor components remain in the screening cylinder. This achieves automatic screening and collection without errors. Not only is the screening efficiency high, but the quality is also better than manual screening.

[0005] Preferably, the feeding mechanism includes a second rotating shaft, a turntable fixedly connected to the side of the second rotating shaft, an arc-shaped baffle on the top of the turntable, a feed pipe fixedly connected to the top of the arc-shaped baffle, a feeding bin fixedly connected to the top of the feed pipe, and a feeding pipe fixedly connected to the bottom of the arc-shaped baffle. The turntable has four storage holes inside. Semiconductor components are placed into the feeding bin, and the semiconductor components enter the storage holes through the feed pipe. A motor is started to rotate the turntable, which in turn rotates the storage holes. The storage holes are blocked by the arc-shaped baffle to prevent the semiconductor components from falling out. When the storage hole containing the semiconductor components reaches the bottom, the loaded semiconductor components fall into the feeding pipe, thus transporting them to the bottom of the punching die. This achieves automatic feeding of semiconductor components, avoiding the need for workers to manually place the semiconductor components under the punching die, preventing accidents and dangers during work, improving work efficiency, and reducing the workload of workers.

[0006] Preferably, the dispensing mechanism includes a motor, a rotating shaft fixedly connected to the output end of the motor, a gear fixedly connected to the end of the rotating shaft away from the motor, a gear two meshing with the bottom of the gear one, a rotating shaft three fixedly connected to the axis of the gear two, a gear three fixedly connected to the bottom of the rotating shaft three, a gear four meshing with the side of the gear three, a rotating shaft four fixedly connected to the axis of the gear four, a pressing tube fixedly connected to the bottom of the rotating shaft four, a protective sleeve provided on the outside of the motor, a connecting rod one fixedly connected to the outside of the protective sleeve, a fixing block fixedly connected to the outside of the rotating shaft three, and a stop bar provided at the end of the pressing tube away from the rotating shaft four. A movable block is fixedly connected to the main body. The outer side of the movable block is slidably connected to the outer side of the straight guide rail. After the semiconductor element is punched, the motor drives the gear to rotate, and the gear drives each gear to rotate. The fixed block on the outer side of the rotating shaft can fix the rotating shaft in this position. The rotation of the gear can drive the extrusion tube to rotate. The rotation of the extrusion tube can move the stop bar, thereby moving the movable block. In this way, after the semiconductor element is punched, the movable block can be pushed aside to put the punched semiconductor element and the punched waste into the subsequent mechanism for the next operation. There is no need for the worker to take out the punched semiconductor element by himself, avoiding the danger of the machine to people.

[0007] Preferably, the worktable has an internal cavity, and a spring is fixedly connected inside the cavity. A straight guide rail is fixedly connected to the side of the cavity. When the moving block moves into the cavity, since the moving block is lower than the worktable, it will squeeze the semiconductor component out of the moving block. At this time, the spring is in a compressed state. Then, the squeezing rod leaves the stop rod, and the spring will spring the moving block back to its original position under the action of elasticity. This allows the conveying mechanism to continue to put the semiconductor component onto the moving block. This can realize the automatic recovery of the moving block, thus completely realizing the storage and dropping of the semiconductor component.

[0008] This invention provides a punching apparatus for semiconductor device manufacturing. It has the following advantages: 1. This blanking device for semiconductor component production, through the setting of the feeding mechanism, puts semiconductor components into the feeding bin. The semiconductor components will enter the storage hole through the feeding pipe. When the motor is started, it drives the turntable to rotate, and the turntable drives the storage hole to rotate. The storage hole is blocked by the arc baffle to prevent the semiconductor components from falling out. When the storage hole containing semiconductor components is transported to the bottom, the loaded semiconductor components will fall into the feeding pipe, thereby transporting them to the bottom of the blanking die. This can realize the automatic feeding of semiconductor components, avoiding workers to place semiconductor components under the blanking die by themselves, avoiding accidents and dangers to workers during work, while improving work efficiency and reducing the workload of workers.

[0009] 2. This die-cutting device for semiconductor component production, through the setting of the feeding mechanism, after the semiconductor component is die-cut, motor one drives gear one to rotate, gear one drives each gear to rotate, and the fixing block on the outside of the rotating shaft three can fix the rotating shaft three in this position. The rotation of gear four can drive the extrusion tube to rotate, and the rotation of the extrusion tube can move the stop bar, thereby driving the moving block one to move. In this way, after the semiconductor component is die-cut, the die-cut semiconductor component and the die-cut waste can be put into the subsequent mechanism together by moving block one, so as to carry out the next step of operation. There is no need for workers to take out the die-cut semiconductor component themselves, avoiding the danger of the machine to people.

[0010] 3. The blanking device for semiconductor component production, through the setting of the cavity and spring one, when the moving block one moves into the cavity, because the moving block one is lower than the worktable, it will squeeze the semiconductor component out of the moving block one. At this time, the spring one is in a compressed state. Then the squeezing rod leaves the stop bar. At this time, the spring one will spring the moving block one back to its original position under the action of elastic force, so that the conveying mechanism can continue to put the semiconductor component onto the moving block one. This can realize the automatic restoration of the moving block one, thus completely realizing the storage and dropping of semiconductor components.

[0011] 4. This die-cutting device for semiconductor component production, through the setting of a vibration screening mechanism, when the semiconductor components enter the screening cylinder through the receiving pipe, motor two is started. Motor two drives shaft five to rotate, and shaft five drives connecting rod two to rotate through the insert block. Connecting rod two drives the screening cylinder to rotate. Since the vibrating block is set to polygonal shape, whenever the corner of the vibrating block hits the stop block during rotation, the screening cylinder will move down. When the screening cylinder moves down, it will drive the transmission pipe down. At this time, the telescopic rod extends outward. When the corner of the vibrating block moves away from the stop block, the screening cylinder will return to its original position under the action of spring two. At the same time, the telescopic rod retracts. Simultaneously, when shaft five rotates, the rotating plate will rotate in the circular track. This can ensure that the semiconductor components in the transmission pipe enter the screening cylinder stably without affecting the movement of the screening cylinder. During the vibration and rotation of the screening cylinder, the die-cutting waste can be screened into the collection box at the bottom, while the semiconductor components remain in the screening cylinder. This can achieve automatic screening and collection without errors. Not only is the screening efficiency high, but the quality is also better than manual screening. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall internal structure of the present invention; Figure 3 This is a schematic diagram of the internal structure of the workbench of the present invention; Figure 4 This is a schematic diagram of the feeding mechanism of the present invention; Figure 5 This is a schematic diagram of the internal structure of the feeding mechanism of the present invention; Figure 6 This is a schematic diagram of the dispensing mechanism of the present invention; Figure 7 This is a schematic diagram of the vibration screening mechanism of the present invention; Figure 8 This is a schematic diagram of the internal structure of the vibration screening mechanism of the present invention; Figure 9 For the present invention Figure 8 A magnified view of A in the middle.

[0013] In the diagram: 1. Workbench; 2. Protective plate; 3. Cylinder; 4. Push rod; 5. Stamping die; 6. Feeding mechanism; 601. Feeding bin; 602. Feeding pipe; 603. Turntable; 604. Arc-shaped baffle; 605. Rotating shaft two; 606. Storage hole; 607. Feeding pipe; 7. Dispensing mechanism; 701. Motor one; 702. Protective sleeve; 703. Connecting rod one; 704. Rotating shaft one; 705. Gear one; 706. Gear two; 707. Rotating shaft three; 708. Fixing block; 709. Gear three; 710. Gear four; 711. 712. Rotating shaft 4; 713. Extrusion tube; 714. Stop bar; 715. Moving block 1; 8. Vibrating screening mechanism; 801. Receiving pipe; 802. Telescopic rod; 803. Transmission pipe; 804. Motor 2; 805. Fixed frame; 806. Spring 2; 807. Moving block 2; 808. Stop block; 809. Vibrating block; 810. Rotating shaft 5; 811. Screening cylinder; 812. Insert block; 813. Collection box; 814. Connecting rod 2; 815. Rotating plate; 816. Circular slide rail; 9. Cavity; 10. Spring 1; 11. Straight guide rail. Detailed Implementation

[0014] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0015] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.

[0016] Please see Figure 1-9This invention provides a technical solution: a punching device for semiconductor component production, comprising a workbench 1, a protective plate 2 fixedly connected to the top of the workbench 1, a cylinder 3 fixedly connected to the top of the protective plate 2, a push rod 4 fixedly connected to the output end of the cylinder 3, a stamping die 5 fixedly connected to the bottom of the push rod 4, a feeding mechanism 6 provided inside the protective plate 2, an infeeding mechanism 7 fixedly connected to the side of the feeding mechanism 6, and a vibration screening mechanism 8 fixedly connected to the bottom of the workbench 1; the vibration screening mechanism 8 includes a receiving pipe 801, a telescopic rod 802 snapped into the bottom of the receiving pipe 801, a transmission pipe 803 fixedly connected to the bottom of the telescopic rod 802, a rotating plate 815 fixedly connected to the bottom of the transmission pipe 803, and a sliding connection on the outer side of the rotating plate 815. A circular slide rail 816 is connected to a screening cylinder 811, which is fixedly connected to the side of the circular slide rail 816 away from the rotating plate 815. A connecting rod 814 is fixedly connected inside the screening cylinder 811. An insert block 812 is snapped into the inside of the connecting rod 814. A rotating shaft 810 is fixedly connected to the inner side of the insert block 812. A motor 804 is fixedly connected to the end of the rotating shaft 810 near the transmission pipe 803. A moving block 807 is rotatably connected to the outer side of the rotating shaft 810. A spring 806 is fixedly connected to the side of the moving block 807. A fixed frame 805 is fixedly connected to the end of the spring 806 away from the moving block 807. A stop block 808 is fixedly connected to the top of the fixed frame 805. A vibrating block 809 is provided at the bottom of the stop block 808. The inner side of 9 and the outer side of the rotating shaft 810 are fixedly connected. Two moving blocks 807 are provided. A collection box 813 is provided at the bottom of the screening cylinder 811. When the semiconductor components enter the transmission pipe 803 through the receiving pipe 801 and then enter the screening cylinder 811 through the transmission pipe 803, the motor 804 is started. The motor 804 drives the rotating shaft 810 to rotate. The rotating shaft 810 drives the connecting rod 814 to rotate through the insert block 812. The connecting rod 814 drives the screening cylinder 811 to rotate. At the same time, the motor 804 will drive the vibrating block 809 to rotate. Since the vibrating block 809 is set in a polygonal shape, during the rotation, whenever the corner of the vibrating block 809 touches the stop block 808, it will cause the screening cylinder 811 to move down. When the screening cylinder 811 moves down, it will drive the vibration block 809 to rotate. As the transmission pipe 803 moves downward, the telescopic rod extends outward. When the corner of the vibrating block 809 moves away from the stop block 808, the screening cylinder 811 returns to its original position under the action of the second spring 806. At the same time, the telescopic rod retracts. Simultaneously, when the rotating shaft 810 rotates, the rotating plate 815 rotates within the circular track. This ensures that the semiconductor components in the transmission pipe 803 stably enter the screening cylinder 811 without affecting the movement of the screening cylinder 811. During the vibration and rotation process, the screening cylinder 811 can screen the punched waste into the collection box 813 at the bottom, while the semiconductor components remain in the screening cylinder 811. This achieves automatic screening and collection without errors, resulting in high screening efficiency and better quality compared to manual screening.

[0017] The feeding mechanism 6 includes a second rotating shaft 605, a turntable 603 fixedly connected to the side of the second rotating shaft 605, an arc-shaped baffle 604 on the top of the turntable 603, a feed pipe 602 fixedly connected to the top of the arc-shaped baffle 604, a feeding bin 601 fixedly connected to the top of the feed pipe 602, and a feeding pipe 607 fixedly connected to the bottom of the arc-shaped baffle 604. The turntable 603 has four storage holes 606 inside. When semiconductor components are placed into the feeding bin 601, they will enter the storage holes 606 along with the feed pipe 602. The motor 7 is then started. 01 drives the turntable 603 to rotate, which in turn drives the storage hole 606 to rotate. The storage hole 606 is blocked by the arc-shaped baffle 604 to prevent the semiconductor components from falling out. When the storage hole 606 containing the semiconductor components is transported to the bottom, the loaded semiconductor components will fall into the feeding pipe 607, thereby transporting them to the bottom of the punching die. This can realize the automatic feeding of semiconductor components, avoiding workers from placing the semiconductor components under the punching die themselves, avoiding accidents and dangers to workers during work, while improving work efficiency and reducing the workload of workers.

[0018] The dispensing mechanism 7 includes a motor 701, with a rotating shaft 704 fixedly connected to the output end of the motor 701. A gear 705 is fixedly connected to the end of the rotating shaft 704 away from the motor 701. A gear 706 meshes with the bottom of the gear 705. A rotating shaft 707 is fixedly connected to the axis of the gear 706. A gear 709 is fixedly connected to the bottom of the rotating shaft 707. A gear 710 meshes with the side of the gear 709. The axis of the gear 710... A rotating shaft 711 is fixedly connected, and a pressing tube 712 is fixedly connected to the bottom of the rotating shaft 711. A protective sleeve 702 is provided on the outside of the motor 701, and a connecting rod 703 is fixedly connected to the outside of the protective sleeve 702. A fixing block 708 is fixedly connected to the outside of the rotating shaft 707. A stop bar 713 is provided at the end of the pressing tube 712 away from the rotating shaft 711, and a moving block 714 is fixedly connected to the top of the stop bar 713. The outside of the moving block 714 and the straight guide rail 11... The outer sliding connection allows the following mechanism to be implemented: After the semiconductor element is punched, motor 701 drives shaft 704 to rotate, which in turn drives electric gear 705. Gear 705 drives gear 706, which in turn drives shaft 707, which in turn drives gear 709, which in turn drives gear 709. Gear 709 in turn drives gear 710, which in turn drives extrusion tube 712 and shaft 711. The fixing block 708 on the outer side of shaft 707 can fix shaft 707 in this position. The rotation of extrusion tube 712 can move stop lever 713, thereby moving moving block 714. After the semiconductor element is punched, the moving block 714 can be moved to allow the punched semiconductor element and the punched waste to be fed into the subsequent mechanism for the next operation. This eliminates the need for workers to remove the punched semiconductor element themselves, thus avoiding any danger to workers from the machine.

[0019] The workbench 1 has an internal cavity 9, and a spring 10 is fixedly connected inside the cavity 9. A straight guide rail 11 is fixedly connected to the side of the cavity 9. When the moving block 714 moves into the cavity 9 through the straight guide rail 11, since the moving block 714 is lower than the workbench 1, it will squeeze the semiconductor component out of the moving block 714. At this time, the spring 10 is in a compressed state. Then the squeezing rod leaves the stop bar 713. At this time, the spring 10 will spring the moving block 714 back to its original position under the action of elasticity, so that the conveying mechanism can continue to put the semiconductor component onto the moving block 714. This can realize the automatic restoration of the moving block 714, thus completely realizing the storage and dropping of the semiconductor component.

[0020] In use, semiconductor components are placed into the feeding bin 601. The components then enter the storage hole 606 via the feeding pipe 602. The starting motor 701 drives the turntable 603 to rotate, which in turn rotates the storage hole 606. The storage hole 606 is blocked by an arc-shaped baffle 604 to prevent the semiconductor components from falling out. When the storage hole 606 containing the semiconductor components reaches the bottom, the loaded components fall into the feeding pipe 607, thus transporting them to the bottom of the punching die. This achieves automatic feeding of semiconductor components, eliminating the need for workers to manually place them under the punching die, preventing accidents and hazards, improving work efficiency, and reducing worker workload. When the semiconductor components are punched... After completion, motor 701 drives shaft 704 to rotate, shaft 704 drives electric gear 705 to rotate, gear 705 drives gear 706 to rotate, gear 706 drives shaft 707 to rotate, shaft 707 drives gear 709 to rotate, gear 709 drives gear 710 to rotate, gear 710 drives extrusion tube 712 and shaft 711 to rotate. The fixing block 708 on the outside of shaft 707 can fix shaft 707 in this position. The rotation of extrusion tube 712 can move stop lever 713, thereby moving moving block 714. In this way, after the semiconductor component is punched, the punched semiconductor component and the punched waste can be fed together by moving block 714. The semiconductor components are then moved to the next stage of operation within the subsequent mechanism. Workers are not required to remove the punched semiconductor components themselves, preventing any potential danger from the machine. As the moving block 714 moves into the cavity 9 via the straight guide rail 11, because it is lower than the worktable 1, it will squeeze the semiconductor components off the moving block 714. At this time, the spring 10 is compressed, and the squeezing rod moves away from the stop bar 713. The spring 10, under its elastic force, will then spring the moving block 714 back to its original position, allowing the conveying mechanism to continue placing semiconductor components onto it. This automatic return of the moving block 714 ensures the complete storage and dropping of the semiconductor components. When the semiconductor components enter through the receiving pipe 801... After passing through the transmission pipe 803 and entering the screening cylinder 811, the second motor 804 is started. The second motor 804 drives the fifth rotating shaft 810 to rotate. The fifth rotating shaft 810 drives the second connecting rod 814 to rotate through the insert block 812. The second connecting rod 814 drives the screening cylinder 811 to rotate. At the same time, the second motor 804 drives the vibrating block 809 to rotate. Since the vibrating block 809 is polygonal, whenever the corner of the vibrating block 809 touches the stop block 808 during rotation, the screening cylinder 811 will move downward. When the screening cylinder 811 moves downward, it will drive the transmission pipe 803 downward. At this time, the telescopic rod extends outward. When the corner of the vibrating block 809 moves away from the stop block 808, the screening cylinder 811 will return to its original position under the action of the second spring 806, and the telescopic rod will retract.Simultaneously, as the rotating shaft 810 rotates, the rotating plate 815 rotates within the annular track. This ensures that the semiconductor components in the transmission pipe 803 stably enter the screening cylinder 811 without affecting the movement of the screening cylinder 811. During the vibration and rotation of the screening cylinder 811, the punched waste is screened into the collection box 813 at the bottom, while the semiconductor components remain in the screening cylinder 811. This achieves automatic screening and collection without errors, resulting in high screening efficiency and better quality compared to manual screening.

[0021] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A blanking device for semiconductor element production, comprising a table (1), characterized in that: The top of the workbench (1) is fixedly connected to a protective plate (2), the top of the protective plate (2) is fixedly connected to a cylinder (3), the output end of the cylinder (3) is fixedly connected to a push rod (4), the bottom of the push rod (4) is fixedly connected to a stamping die (5), the inside of the protective plate (2) is provided with a feeding mechanism (6), the side of the feeding mechanism (6) is fixedly connected to an infeeding mechanism (7), the bottom of the workbench (1) is fixedly connected to a vibration screening mechanism (8), the inside of the workbench (1) is provided with a cavity (9), a spring (10) is fixedly connected in the cavity (9), and a straight guide rail (11) is fixedly connected to the side of the cavity (9). The vibrating screening mechanism (8) includes a receiving pipe (801), a telescopic rod (802) is snapped into the bottom of the receiving pipe (801), a transmission pipe (803) is fixedly connected to the bottom of the telescopic rod (802), a rotating plate (815) is fixedly connected to the bottom of the transmission pipe (803), an annular slide rail (816) is slidably connected to the outside of the rotating plate (815), a screening cylinder (811) is fixedly connected to the side of the annular slide rail (816) away from the rotating plate (815), a connecting rod two (814) is fixedly connected inside the screening cylinder (811), and an insert is snapped into the inside of the connecting rod two (814). Block (812), the inner side of the insert block (812) is fixedly connected to a rotating shaft five (810), the end of the rotating shaft five (810) near the transmission pipe (803) is fixedly connected to a motor two (804), the outer side of the rotating shaft five (810) is rotatably connected to a moving block two (807), the side of the moving block two (807) is fixedly connected to a spring two (806), the end of the spring two (806) away from the moving block two (807) is fixedly connected to a fixed frame (805), the top of the fixed frame (805) is fixedly connected to a stop block (808), and the bottom of the stop block (808) is provided with a vibration block (809).

2. The punching apparatus for semiconductor device manufacturing according to claim 1, characterized in that: The inner side of the vibrating block (809) and the outer side of the rotating shaft five (810) are fixedly connected. There are two moving blocks two (807). The bottom of the screening cylinder (811) is provided with a collection box (813).

3. The punching apparatus for semiconductor device manufacturing according to claim 1, characterized in that: The feeding mechanism (6) includes a second rotating shaft (605), a turntable (603) is fixedly connected to the side of the second rotating shaft (605), an arc-shaped baffle (604) is provided on the top of the turntable (603), a feed pipe (602) is fixedly connected to the top of the arc-shaped baffle (604), a feeding bin (601) is fixedly connected to the top of the feed pipe (602), and a feeding pipe (607) is fixedly connected to the bottom of the arc-shaped baffle (604).

4. The punching apparatus for semiconductor device manufacturing according to claim 3, characterized in that: The turntable (603) has a material storage hole (606) inside.

5. A punching apparatus for semiconductor device manufacturing according to claim 4, characterized in that: The storage holes (606) are provided in four places.

6. The punching apparatus for semiconductor device manufacturing according to claim 1, characterized in that: The dispensing mechanism (7) includes a motor (701), the output end of which is fixedly connected to a rotating shaft (704), the end of which is away from the motor (701) is fixedly connected to a gear (705), the bottom of which is meshed with a gear (706), the shaft of which is fixedly connected to a rotating shaft (707), the bottom of which is fixedly connected to a gear (709), the side of which is meshed with a gear (710), the shaft of which is fixedly connected to a rotating shaft (711), and the bottom of which is fixedly connected to a pressing tube (712).

7. A punching apparatus for semiconductor device manufacturing according to claim 6, characterized in that: The outer side of the motor (701) is provided with a protective sleeve (702), and a connecting rod (703) is fixedly connected to the outer side of the protective sleeve (702). A fixing block (708) is fixedly connected to the outer side of the rotating shaft (707).

8. A punching apparatus for semiconductor device manufacturing according to claim 6, characterized in that: The end of the extrusion tube (712) away from the rotating shaft (711) is provided with a stop bar (713), and the top of the stop bar (713) is fixedly connected to a moving block (714). The outer side of the moving block (714) is slidably connected to the outer side of the straight guide rail (11).

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