Electroplating system and electroplating method
By designing a stirring device in the electroplating system, the problem of uneven distribution of the electroplating solution was solved, achieving uniform distribution of electroplating ions and improving the electroplating effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-28
- Publication Date
- 2026-04-17
AI Technical Summary
Existing electroplating systems cannot agitate the electroplating solution during the electroplating process, resulting in uneven electroplating of ions onto the metal to be plated, thus affecting the electroplating effect.
An electroplating system was designed, comprising an electroplating liquid storage chamber, a supporting circular plate, a vertical sliding rod, a lifting frame plate, and a conductive cylinder. The supporting circular plate is rotated and the lifting frame plate is slid by a geared motor to achieve stirring treatment of the electroplating liquid and ensure uniform distribution of electroplating ions.
Stirring improves the uniformity of plating ions in the plating solution, enhances the plating effect on the metal to be plated, and ensures a uniform and firm coating.
Smart Images
Figure CN121874891A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of metal processing technology, and more specifically to an electroplating system and electroplating method. Background Technology
[0002] Electroplating is the process of depositing a thin layer of another metal or alloy onto the surface of certain metals using the principle of electrolysis. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation, improving wear resistance, conductivity, reflectivity, corrosion resistance, and enhancing aesthetics. The outer layer of many coins is also electroplated. During electroplating, the plating metal or other insoluble material acts as the anode, and the workpiece to be plated acts as the cathode. The cations of the plating metal are reduced on the surface of the workpiece to form the plating layer. In order to eliminate the interference of other cations and to make the plating layer uniform and firm, a solution containing the plating metal cations is needed as the electroplating solution to keep the concentration of the plating metal cations constant. However, existing electroplating systems cannot stir the electroplating solution during the electroplating process, and therefore cannot guarantee that the electroplating ions are uniformly electroplated onto the metal to be plated. Summary of the Invention
[0003] The purpose of this invention is to provide an electroplating system and electroplating method. This system can stir the electroplating solution during the electroplating process to further enhance the electroplating effect on the metal to be plated.
[0004] An electroplating system includes an electroplating liquid storage chamber and a supporting circular plate rotatably connected within the electroplating liquid storage chamber. A vertical square slide rod is fixedly connected above the supporting circular plate, and a lifting frame plate is slidably connected to the vertical slide rod. Two conductive cylinders are fixedly connected to the lifting frame plate.
[0005] Furthermore, a horizontal drain pipe is fixedly connected to the electroplating storage chamber.
[0006] Furthermore, a geared motor is fixedly connected to the electroplating storage chamber, and the output shaft of the geared motor is fixedly connected to the supporting circular plate.
[0007] Furthermore, multiple supporting legs are fixedly connected to the electroplating liquid storage cavity.
[0008] Furthermore, a top-fixed square plate is fixedly connected to the vertical square slide rod, and a lifting screw is rotatably connected to the top-fixed square plate. The lifting screw is connected to the lifting frame plate through a threaded transmission.
[0009] Furthermore, both ends of the lifting frame plate are fixedly connected with multiple limiting slide grooves, and each of the two sets of multiple limiting slide grooves is slidably connected with a pressing slide plate.
[0010] Furthermore, both ends of the lifting frame plate are rotatably connected to linkage circular plates, two conductive cylinders pass through the two linkage circular plates respectively, and multiple linkage strips are rotatably connected to the two linkage circular plates respectively. The two sets of multiple linkage strips are rotatably connected to the two sets of multiple extrusion slide plates respectively.
[0011] Furthermore, two rotating curved plates are fixedly connected to the lifting frame plate, and each of the two rotating curved plates is rotatably connected to a pressing screw. The two pressing screws are respectively connected to two pressing slide plates located above through threaded transmission.
[0012] Furthermore, each of the two conductive cylinders is fixedly connected to a conductive frame plate, and each of the two conductive frame plates is slidably connected to two extrusion contact plates.
[0013] Furthermore, the electroplating method of the aforementioned electroplating system includes the following steps:
[0014] Step 1: Slide the lifting frame plate to the top, then place the electroplating solution into the electroplating storage chamber;
[0015] Step 2: Fix the electroplated metal and the metal to be plated at both ends of the lifting frame plate, so that the electroplated metal and the metal to be plated are in contact with the two conductive cylinders respectively;
[0016] Step 3: Adjust the connection positions of the two conductive cylinders to the power supply according to the positions of the electroplating metal and the metal to be plated, so that the plating metal is in contact with the conductive cylinder of the anode and the metal to be plated is in contact with the conductive cylinder of the cathode.
[0017] Step 4: The lifting frame slides down, thereby immersing the electroplated metal and the metal to be plated into the electroplating solution;
[0018] Step 5: Powering on the two conductive cylinders energizes the metal to be plated, transferring ions from the metal to the plating solution and then onto the metal to be plated, thus completing the electroplating process. Attached Figure Description
[0019] The present invention will now be described in further detail with reference to the accompanying drawings and specific implementation methods.
[0020] Figure 1 This is a schematic diagram of the overall structure of an electroplating system according to the present invention;
[0021] Figure 2 This is a schematic diagram of the structure of an electroplating system according to the present invention;
[0022] Figure 3 This is a schematic diagram of another aspect of the electroplating system of the present invention;
[0023] Figure 4 This is a schematic diagram of an embodiment for fixing electroplated metal and metal to be plated;
[0024] Figure 5 This is a partial structural schematic diagram of an embodiment for fixing electroplated metal and metal to be plated;
[0025] Figure 6 This is a structural schematic diagram of an embodiment that provides a space for placing electroplated metal and metal to be plated;
[0026] Figure 7 This is a schematic diagram of an embodiment of extruding and fixing electroplated metal and metal to be plated;
[0027] Figure 8 This is a schematic diagram of another aspect of an embodiment of extruding and fixing electroplated metal and metal to be plated;
[0028] Figure 9 This is a schematic diagram of a specific structure for fixing the electroplated metal and the metal to be plated in an embodiment;
[0029] Figure 10 This is a schematic diagram of a structural embodiment for realizing current transmission. Detailed Implementation
[0030] The following is in conjunction with the appendix Figure 1-10 The present invention will be described in further detail below.
[0031] The following is in conjunction with the appendix Figure 1-8 According to 10, an electroplating system includes an electroplating liquid storage chamber 101 and a supporting circular plate 102 rotatably connected to the electroplating liquid storage chamber 101 via a shaft. A vertical square slide rod 103 is fixedly connected above the supporting circular plate 102 by welding. A lifting frame plate 104 is slidably connected to the vertical slide rod 103 via a slide groove. Two conductive cylinders 105 are fixedly connected to the lifting frame plate 104 via a flange plate.
[0032] Furthermore, the electroplating reservoir 101 stores electroplating solution, which serves as the medium for electroplating. Electroplating ions can move within the solution, detaching from the metal to be plated and transferring to the metal to be plated. The electroplating reservoir 101 provides space for the rotating support plate 102 and is sealed to prevent leakage of the electroplating solution through the connection between the reservoir 101 and the support plate 102. The support plate 102 provides a fixed space for the vertical sliding rod 103, which in turn provides space for the sliding of the lifting frame plate 104. The lifting frame plate 104 is made of plastic and is non-conductive. The lifting frame 104 provides space for placing the electroplated metal and the metal to be plated. The two conductive cylinders 105 will contact the electroplated metal and the metal to be plated respectively, so that the plating metal contacts the anode and the metal to be plated contacts the cathode. According to the position of the electroplated metal and the metal to be plated, the connection position of the two conductive cylinders 105 and the power supply is adjusted. As long as the plating metal contacts the conductive cylinder 105 of the anode and the metal to be plated contacts the conductive cylinder 105 of the cathode, it is sufficient. The power supply is placed on the lifting frame 104 to ensure that the power supply can rotate with the lifting frame 104, thereby ensuring the fixed position of the power supply and the two conductive cylinders 105.
[0033] Slide the lifting frame 104 to its highest position. At this point, place the electroplating solution into the electroplating storage chamber 101. Then, fix the electroplating metal and the metal to be plated at both ends of the lifting frame 104, ensuring that the electroplating metal and the metal to be plated are in contact with the two conductive cylinders 105 respectively. Adjust the connection positions of the two conductive cylinders 105 to the power supply according to the positions of the electroplating metal and the metal to be plated. The plating metal contacts the conductive cylinder 105 of the anode, and the metal to be plated contacts the conductive cylinder 105 of the cathode. Then, slide the lifting frame 104... Slide downwards, thereby immersing the electroplated metal and the metal to be plated into the electroplating solution. When the power is turned on, the two conductive cylinders 105 are energized, which transfers the ions on the electroplated metal into the electroplating solution, thereby transferring them to the metal to be plated. During the electroplating process, the supporting circular plate 102 can be rotated. The vertical square slide rod 103 and the lifting frame plate 104 can drive the electroplated metal and the metal to be plated to rotate, which can realize the stirring treatment of the electroplating solution, ensuring that the electroplating solution is evenly filled with electroplating ions, and further improving the electroplating effect on the metal to be plated.
[0034] The following is in conjunction with the appendix Figure 1-3 In detail, a horizontal drain pipe 106 is fixedly connected to the electroplating liquid storage chamber 101 by welding.
[0035] Furthermore, a valve is provided on the horizontal drain pipe 106. When the valve on the horizontal drain pipe 106 is opened, the electroplating solution in the electroplating storage chamber 101 will be discharged through the horizontal drain pipe 106, thereby realizing the replacement of the electroplating solution in the electroplating storage chamber 101.
[0036] The following is in conjunction with the appendix Figure 1-3 In detail, a geared motor 107 is fixedly connected to the electroplating liquid storage chamber 101 via a flange plate, and the output shaft of the geared motor 107 is fixedly connected to the supporting circular plate 102 via a keyway and a snap ring.
[0037] Furthermore, after starting the geared motor 107, the supporting circular plate 102 can be driven to rotate, which ultimately drives the electroplating metal and the metal to be plated to rotate in the electroplating storage chamber 101, thereby agitating the electroplating solution in the electroplating storage chamber 101, ensuring that the electroplating solution is uniformly filled with electroplating ions, which can improve the electroplating effect on the metal to be plated.
[0038] According to the instruction manual Figure 1-3 In detail, the electroplating liquid storage cavity 101 is fixedly connected to multiple supporting legs 108 by welding.
[0039] Furthermore, with multiple supporting legs 108, the electroplating liquid storage chamber 101 can be firmly placed on the ground. Moreover, the multiple supporting legs 108 can protect the geared motor 107, prevent the geared motor 107 from contacting the ground, prevent irreversible damage to the geared motor 107, and avoid economic losses.
[0040] According to the instruction manual Figure 1-4 In detail, the vertical square slide bar 103 is fixedly connected to a top fixed square plate 201 by multiple screws, and the top fixed square plate 201 is rotatably connected to a lifting screw 202 through a bearing hole. The lifting screw 202 is connected to the lifting frame plate 104 by a threaded transmission.
[0041] Furthermore, the top plate 201 can provide space for the lifting screw 202 to rotate. When the lifting screw 202 rotates, it can drive the lifting frame plate 104 to rise and fall. When the lifting frame plate 104 is at the high point, the electroplated metal and the metal to be plated are fixed on the lifting frame plate 104. When electroplating is performed, the lifting frame plate 104 needs to be moved downward to ensure that the electroplated metal and the metal to be plated can be immersed in the electroplating solution in the electroplating storage chamber 101, thereby completing the electroplating.
[0042] According to the instruction manual Figure 1 , 4 As detailed in sections 5 and 7-9, both ends of the lifting frame plate 104 are fixedly connected to multiple limiting slide grooves 301 by multiple screws, and each of the two sets of multiple limiting slide grooves 301 is slidably connected to a pressing slide plate 302 through the slide groove.
[0043] Furthermore, the two sets of multiple limiting slide grooves 301 can provide sliding space for the two sets of multiple extrusion slide plates 302. When the electroplated metal and the metal to be plated come into contact with the two ends of the lifting frame plate 104, the two sets of multiple extrusion slide plates 302 can slide inward at the same time to achieve the fixing treatment of the electroplated metal and the metal to be plated, so that the electroplated metal and the metal to be plated can respectively contact the two conductive cylinders 105.
[0044] According to the instruction manual Figure 1 , 4 Detailed descriptions of sections 5 and 7-10: Both ends of the lifting frame plate 104 are rotatably connected to a linkage circular plate 401 via a shaft. Two conductive cylinders 105 pass through the two linkage circular plates 401 respectively. Multiple linkage strips 402 are rotatably connected to the two linkage circular plates 401 via a shaft. The two sets of multiple linkage strips 402 are rotatably connected to the two sets of multiple extrusion slide plates 302 via a shaft.
[0045] Furthermore, both linkage circular plates 401 are made of plastic and are not conductive. When the two linkage circular plates 401 rotate, they can drive two sets of multiple linkage strips 402 to move. When the two sets of multiple linkage strips 402 move, they can drive two sets of multiple extrusion slides 302 to move inward or outward simultaneously, thus completing the fixing process of the electroplated metal and the metal to be plated.
[0046] According to the instruction manual Figure 1 and 4 -9 Detailed description: Two rotating support plates 501 are fixedly connected to the lifting frame plate 104 by multiple screws. Each of the two rotating support plates 501 is rotatably connected to a pressing screw 502 through a bearing hole. The two pressing screws 502 are respectively connected to the two pressing slide plates 302 located above by threaded transmission.
[0047] Furthermore, the two rotating curved plates 501 provide rotation space for the two extrusion screws 502. When the two extrusion screws 502 rotate, they can drive the two extrusion slide plates 302 located above to rise and fall. When the two extrusion slide plates 302 located above rise and fall, they can drive the two linkage circular plates 401 to rotate through the two linkage strips 402 located above. The rotating linkage circular plates 401 will drive the other multiple extrusion slide plates 302 to slide through the other multiple linkage strips 402, thereby ensuring that the two sets of multiple extrusion slide plates 302 can move inward or outward at the same time to achieve the fixing treatment of electroplated metal and metal to be plated.
[0048] According to the instruction manual Figure 1 , 4Detailed descriptions of sections 5 and 10: Each of the two conductive cylinders 105 is fixedly connected to a conductive frame plate 601 by welding, and each of the two conductive frame plates 601 is slidably connected to two extrusion contact plates 602 by a cylinder.
[0049] Furthermore, current can be transmitted to two conductive cylinders 105 through two conductive frame plates 601, and springs are fitted on two sets of two pressing contact plates 602. The outer ends of the four springs are in contact with the two conductive frame plates 601 respectively. The elastic force generated by the four springs acts on the two sets of two pressing contact plates 602, causing the two sets of two pressing contact plates 602 to move inward. The power cord can be placed between the two sets of two pressing contact plates 602. The current is transmitted to the two conductive cylinders 105 through the two sets of two pressing contact plates 602 and the two conductive frame plates 601, and finally the plating metal ions are transferred to the electroplated metal, completing the electroplating treatment of the metal to be plated.
[0050] An electroplating method for an electroplating system, the electroplating method comprising the following steps:
[0051] Step 1: Slide the lifting frame plate 104 to the top, and then place the electroplating solution into the electroplating storage chamber 101.
[0052] Step 2: Fix the electroplated metal and the metal to be plated at both ends of the lifting frame plate 104, so that the electroplated metal and the metal to be plated are in contact with the two conductive cylinders 105 respectively.
[0053] Step 3: Adjust the connection position of the two conductive cylinders 105 to the power supply according to the positions of the electroplated metal and the metal to be plated. The plated metal is in contact with the conductive cylinder 105 of the anode, and the metal to be plated is in contact with the conductive cylinder 105 of the cathode.
[0054] Step 4: The lifting frame plate 104 slides downward, thereby immersing the electroplated metal and the metal to be plated into the electroplating solution;
[0055] Step 5: Powering on the two conductive cylinders 105 will transfer ions from the electroplated metal into the electroplating solution, thereby transferring them to the metal to be plated and completing the electroplating process.
Claims
1. An electroplating system, characterized in that: It includes an electroplating liquid storage chamber (101) and a supporting circular plate (102) rotatably connected in the electroplating liquid storage chamber (101). A vertical square slide rod (103) is fixedly connected above the supporting circular plate (102). A lifting frame plate (104) is slidably connected on the vertical square slide rod (103). Two conductive cylinders (105) are fixedly connected on the lifting frame plate (104).
2. The electroplating system according to claim 1, characterized in that: A horizontal drain pipe (106) is fixedly connected to the electroplating liquid storage chamber (101).
3. The electroplating system according to claim 1, characterized in that: A geared motor (107) is fixedly connected to the electroplating storage chamber (101), and the output shaft of the geared motor (107) is fixedly connected to the supporting circular plate (102).
4. The electroplating system according to claim 1, characterized in that: Multiple support legs (108) are fixedly connected to the electroplating liquid storage chamber (101).
5. The electroplating system according to claim 1, characterized in that: A top-fixed square plate (201) is fixedly connected to the vertical square slide bar (103), and a lifting screw (202) is rotatably connected to the top-fixed square plate (201). The lifting screw (202) and the lifting frame plate (104) are connected by threaded transmission.
6. The electroplating system according to claim 1, characterized in that: Both ends of the lifting frame plate (104) are fixedly connected with multiple limiting slide grooves (301), and each of the two sets of multiple limiting slide grooves (301) is slidably connected with a pressing slide plate (302).
7. The electroplating system according to claim 6, characterized in that: Both ends of the lifting frame plate (104) are rotatably connected to the linkage circular plate (401). Two conductive cylinders (105) pass through the two linkage circular plates (401) respectively. Multiple linkage strips (402) are rotatably connected to the two linkage circular plates (401). The two sets of multiple linkage strips (402) are rotatably connected to the two sets of multiple extrusion slide plates (302) respectively.
8. The electroplating system according to claim 7, characterized in that: Two rotating support plates (501) are fixedly connected to the lifting frame plate (104). Each of the two rotating support plates (501) is rotatably connected to a pressing screw (502). The two pressing screws (502) are respectively connected to the two pressing slide plates (302) located above through threaded transmission.
9. The electroplating system according to claim 1, characterized in that: A conductive frame plate (601) is fixedly connected to each of the two conductive cylinders (105), and two extrusion contact plates (602) are slidably connected to each of the two conductive frame plates (601).
10. An electroplating method using the electroplating system of claim 1, characterized in that, The electroplating method includes the following steps: Step 1: Slide the lifting frame plate (104) to the top, and then place the electroplating solution into the electroplating storage chamber (101); Step 2: Fix the electroplated metal and the metal to be plated at both ends of the lifting frame plate (104), so that the electroplated metal and the metal to be plated are in contact with the two conductive cylinders (105) respectively; Step 3: Adjust the connection position of the two conductive cylinders (105) to the power supply according to the position of the electroplated metal and the metal to be plated. The plated metal is in contact with the conductive cylinder (105) of the anode, and the metal to be plated is in contact with the conductive cylinder (105) of the cathode. Step 4: The lifting frame plate (104) slides downward, thereby immersing the electroplated metal and the metal to be plated into the electroplating solution; Step 5: Powering on the two conductive cylinders (105) will transfer ions from the electroplated metal into the electroplating solution, thereby transferring them to the metal to be plated and completing the electroplating process.