A multi-electrode series type dynamic monitoring device

Abstract

The application relates to the technical field of interactive sensors, in particular to a multi-electrode series connection type dynamic monitoring device which comprises a sensor, the sensor is provided with a sensing end on one side, an electrode plate is arranged in the sensing end of the sensor, and a plurality of transparent conductive electrode pieces are arranged on the electrode plate. The transparent conductive electrode pieces arranged in a rectangular array are connected in series, the transparent conductive electrode pieces connected in series expand the effective range of electrode array sensing detection, the continuity and stability of sensing response signal collection are guaranteed, an airflow channel is arranged between the electrode plate and the sensing end of the sensor, a closed-loop airflow circulation is formed by matching an air inlet chamber and an airflow generating device, the width of an air outlet is set as 1 / 2 of the width of an air inlet, airflow uniformly sweeps the surface of the transparent conductive electrode pieces, interference such as sensing detection parameter drift caused by humidity and parasitic conductive paths among electrodes is avoided, and the precision of electrode array physical property characteristic sensing detection, the response sensitivity and the reliability of detection data are greatly improved.

Description

Technical Field

[0001] This invention relates to the field of interactive sensor technology, specifically to a multi-electrode series dynamic monitoring device. Background Technology

[0002] In the monitoring system of interactive devices such as holographic lockers and intelligent display cabinets, a sensing unit based on the principle of capacitance measurement is adopted. Its core is a capacitance sensor composed of transparent conductive electrodes. When a user's finger or object approaches the sensing area, it causes a change in the electric field distribution on the electrode surface, resulting in a change in the capacitance value between the electrodes of the sensing unit. By dynamically and with high sensitivity monitoring and analysis of this capacitance parameter, the occurrence and location information of interactive events can be inverted and calculated. Therefore, the material electrical properties of the transparent conductive electrodes, including their stability and consistency in the working environment and the signal-to-noise ratio of the output signal, directly determine the accuracy and reliability of the entire capacitance measurement system.

[0003] In actual deployment environments, especially in coastal areas, rainy seasons, or southern regions with large diurnal temperature variations, a significant humidity difference can easily form between the inside and outside of the storage cabinet. This can cause the surface temperature of the transparent conductive electrode, which serves as the sensitive unit of the capacitive sensor, to be lower than the dew point temperature of the ambient air. Consequently, water vapor or discrete droplets condense on its surface, forming uniform mist or discrete water droplets. This condensation phenomenon significantly interferes with the normal measurement of the capacitive sensor. First, as a conductive medium, water vapor can form additional parasitic capacitance parallel paths between the electrodes of the capacitive sensor, causing the intrinsic capacitance value collected by the system to drift, and even simulating false signals of capacitance changes similar to touch. Second, the random distribution and rolling of water droplets can cause local distortion and dynamic fluctuations in the electric field distribution between the electrodes, introducing unpredictable noise and jumps into the capacitance measurement signal, ultimately leading to touch detection failure or position resolution errors. Summary of the Invention

[0004] The purpose of this invention is to provide a multi-electrode series dynamic monitoring device to solve the problem of decreased interaction accuracy in scenarios with high humidity differences.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A multi-electrode series dynamic monitoring device includes a sensor. A sensing end is located on one side of the sensor. An electrode plate is located inside the sensing end of the sensor. Multiple transparent conductive electrode sheets are arranged in a rectangular pattern on the electrode plate, with a spacing of 1-2 mm between each sheet. The multiple transparent conductive electrode sheets are connected in series through the electrode plate. An airflow channel with a thickness of 3-5 mm is provided between the front sidewall of the electrode plate and the inner sidewall of the sensing end. An airflow channel is connected to the airflow channel at the end of the electrode plate opposite to the sensing end. An airflow generator is located on the outer side of the airflow chamber away from the electrode plate. An air inlet is located at the edge of the airflow chamber, and an exhaust port is located at the edge of the airflow chamber opposite to the air inlet. The width of the exhaust port is half the width of the air inlet. An air supply port and an air outlet are respectively located on opposite sides of the airflow generator. The air supply port is fixedly connected to the air supply port, and the air outlet is fixedly connected to the exhaust port.

[0007] By setting a dedicated electrode plate inside the sensor's sensing end, multiple transparent conductive electrode sheets arranged in a regular rectangular pattern are placed on the electrode plate, with the spacing between each transparent conductive electrode sheet precisely controlled to be 1-2mm. All transparent conductive electrode sheets are connected in series through the electrode plate, expanding the dynamic monitoring coverage of the electrodes and making the sensing range more comprehensive. This ensures the continuity and stability of signal transmission between electrodes. A 3-5mm thick airflow channel is set between the end of the electrode plate with the transparent conductive electrode sheets and the sensor's sensing end. The other end of the electrode plate, opposite to the sensing end, is connected to a matching air inlet chamber. An airflow generator is also installed on the outer side of the air inlet chamber away from the electrode plate. The air inlets and outlets on both sides of the airflow generator are fixedly connected to the air inlet and exhaust outlets on the edge of the air inlet chamber, respectively. The width of the exhaust outlet is designed to be half the width of the inlet. The airflow delivered by the airflow generator passes through the air inlet... After entering the air inlet, the air flows towards the exhaust outlet within the air inlet chamber. Due to the reduced diameter of the exhaust outlet, some airflow is blocked and diffuses towards the airflow channel. It flows evenly along the airflow channel across all the transparent conductive electrode sheets on the electrode plate surface before returning to the air inlet, merging with the newly entered airflow and repeating the above flow process. The airflow continuously sweeps the surface of the transparent conductive electrode sheets at an appropriate flow rate, fundamentally avoiding the problem of water condensation on the transparent conductive electrode sheets due to differences in ambient humidity. Furthermore, the reduced diameter design of the exhaust outlet increases the flow speed of the airflow within the channel, resulting in stronger sweeping force and more uniform coverage, significantly enhancing the anti-condensation effect. At the same time, the overall closed-loop airflow circulation can continuously maintain the dryness and stability of the working environment of the transparent conductive electrode sheets, effectively avoiding interference problems such as electrical parameter drift, parasitic conductive path formation, and short-circuit false signals caused by humidity issues, and effectively improving the overall accuracy, sensitivity, and operational reliability of the device's dynamic monitoring.

[0008] Preferably, a first guide rib is provided at the connection between the airflow channel and the air intake chamber near the exhaust port, and the first guide rib is fitted to the edge of the exhaust port. A second guide rib is provided at the connection between the airflow channel and the air intake chamber near the air intake port, and the second guide rib is fitted to the edge of the air intake port. Both the first guide rib and the second guide rib have an arc surface on the side near the airflow channel, and the edge of the arc surface is tangent to the edge of the airflow channel.

[0009] By setting a first guide rib that fits tightly against the edge of the exhaust port at the connection between the airflow channel and the air inlet chamber near the exhaust port, and setting a second guide rib that fits tightly against the edge of the air inlet at the connection between the airflow channel and the air inlet chamber near the air inlet, and designing the side of the first and second guide ribs near the airflow channel as an arc surface structure, and ensuring that the edge of the arc surface is tangential to the edge of the airflow channel, the smooth transition characteristics of the arc surface effectively prevent the formation of vortices and dead zones in the airflow at the connection point between the two locations. This allows the airflow blocked by the exhaust port's reduced diameter structure to be guided more smoothly and evenly along the arc surface into the airflow channel, while also ensuring that the returning airflow can smoothly and unobstructedly flow into the air inlet chamber from the airflow channel. This effectively improves the overall flow efficiency of the airflow in the channel and the uniformity of the blowing on the surface of the transparent conductive electrode sheet, further optimizing the stability of the airflow circulation inside the entire device.

[0010] Preferably, a fan is provided at one end of the airflow generating device near the air inlet, the fan outputs air towards the air inlet, a drying chamber is provided inside the airflow generating device, the drying chamber is connected to the air inlet and the air outlet, the drying chamber is filled with desiccant, and a drain hole is provided at the lower end of the drying chamber.

[0011] By installing a fan at one end of the airflow generator near the air outlet, directing airflow towards the air inlet, and simultaneously installing a drying chamber inside the airflow generator connected to the air outlet and air outlet, and filling the drying chamber with desiccant, and opening a drain hole at the bottom of the drying chamber, the fan provides stable and continuous power for the airflow circulation of the entire device, ensuring that the airflow can flow smoothly along the preset path. At the same time, the airflow is dried before entering the air inlet chamber, and the desiccant efficiently dries and dehumidifies the airflow, deeply removing moisture from the airflow and reducing the humidity of the airflow from the source. This fundamentally avoids the risk of condensation when humid airflow blows on the transparent conductive electrode sheet. The drain hole at the bottom of the drying chamber can promptly drain the water that accumulates after the desiccant absorbs moisture, effectively preventing water from accumulating in the drying chamber and affecting the dehumidification effect, continuously ensuring the stable dehumidification capacity of the drying chamber, and ensuring that the airflow entering the airflow channel is always dry, further enhancing the anti-condensation effect on the surface of the transparent conductive electrode sheet, and maintaining the dry state of the working environment of the transparent conductive electrode sheet for a long time.

[0012] Preferably, a semiconductor cooling chip is provided in the drying chamber, and the inner walls of the drying chamber are all made of hydrophobic material. The cooling end of the semiconductor cooling chip acts in the drying chamber, and the heating end of the semiconductor cooling chip acts in the air inlet chamber.

[0013] By installing a semiconductor cooling chip within the drying chamber, with its cooling end acting on the internal space of the drying chamber, and simultaneously using a single piece of hydrophobic material to construct the entire inner wall of the drying chamber, while the heating end of the semiconductor cooling chip acts on the air inlet chamber, the efficient cooling effect of the semiconductor cooling chip rapidly lowers the ambient temperature within the drying chamber. This causes the water vapor contained in the airflow flowing through the drying chamber to condense quickly into liquid water upon contact with the cold surface. Furthermore, the excellent hydrophobicity of the inner wall material allows the condensed water droplets to quickly slide off the wall surface and drain out through the drainage holes, fundamentally preventing water vapor from adhering to the internal components and walls of the drying chamber and forming residues. It effectively prevents moisture from adhering to the inner wall of the drying chamber, thus reducing the dehumidification effect and significantly improving the dehumidification efficiency and depth of the circulating airflow. At the same time, it makes full use of the heating effect of the semiconductor cooling chip to uniformly heat the airflow in the intake chamber, effectively increasing the overall temperature of the airflow in the intake chamber and thus significantly increasing the dew point value of the airflow. When the dried airflow flows through the transparent conductive electrode sheet on the surface of the electrode plate, it is less likely to condense due to the temperature difference with the environment. The dual protection formed by the two dimensions of cooling to reduce condensation and dehumidification, and heating to raise the dew point and prevent condensation, further enhances the overall drying and anti-condensation effect.

[0014] Preferably, a heat insulation sheet is provided between the air intake chamber and the airflow generating device. The heat insulation sheet acts between the heating end of the semiconductor refrigeration chip and the air intake chamber. The thickness of the heat insulation sheet is 2-3 mm. A heat-conducting copper sheet is provided between the heat insulation sheet and the semiconductor refrigeration chip. The heat-conducting copper sheet includes a heat-conducting section and a heat-transfer section. The heat-conducting section is attached to the heating end of the semiconductor refrigeration chip, and the heat-transfer section is attached to the inner wall of the air outlet. The heat-conducting section and the heat-transfer section are connected in an L-shape.

[0015] A heat insulation sheet with a thickness of 2-3 mm is installed at the connection between the air intake chamber and the airflow generator. This heat insulation sheet is applied to a critical position between the heating end of the semiconductor refrigeration chip and the air intake chamber. Simultaneously, an integrally formed L-shaped thermally conductive copper sheet is installed between the heat insulation sheet and the semiconductor refrigeration chip. This thermally conductive copper sheet consists of a heat-conducting section that is tightly fitted to the heating end of the semiconductor refrigeration chip and a heat-transferring section that is fitted to the inner wall of the air inlet. The heat insulation sheet fully utilizes its excellent heat insulation and heat-insulating properties to effectively prevent the heat generated during the operation of the semiconductor refrigeration chip from being directly conducted and diffused into the air intake chamber. This avoids excessively high temperatures inside the air intake chamber and prevents the high-temperature environment from adversely affecting the transparent conductive electrode sheet on the electrode plate, thus ensuring the original high sensitivity and stable sensing performance of the transparent conductive electrode sheet. Without damage, the L-shaped thermally conductive copper sheet, thanks to the excellent thermal conductivity of copper, efficiently and precisely conducts the heat generated by the heating end of the semiconductor cooling chip through the heat conduction section to the heat transfer section, and then directionally conducts it to the internal space of the air inlet. It only targets and directionally heats the airflow that is about to enter the air inlet chamber, thereby achieving precise control of the airflow heating temperature and the control of the heat conduction range. This effectively ensures that the dew point value of the airflow after directional heating is significantly improved, so that when the dried hot airflow flows over the surface of the transparent conductive electrode sheet, it is not easy for condensation to occur due to the temperature difference with the environment. It fully and efficiently plays the core role of heating and preventing condensation, and avoids the high temperature interference caused by disordered heat diffusion. It continuously ensures that the transparent conductive electrode sheet is always in a working state with a suitable temperature and stable environment.

[0016] Preferably, a first heat dissipation fin is provided on one side of the air intake chamber that is in contact with the heating end of the semiconductor cooling chip. The first heat dissipation fin is evenly distributed along the outer wall of the air intake chamber. The first heat dissipation fin is in contact with the outer wall of the air inlet. A second heat dissipation fin is provided inside the air intake.

[0017] By placing a first heat dissipation fin on the side of the intake chamber that is in contact with the heating end of the semiconductor cooling chip, and arranging this first heat dissipation fin evenly and densely along the outer wall of the intake chamber, while ensuring a tight fit between the first heat dissipation fin and the outer wall of the air inlet, and simultaneously incorporating a dedicated structure for a second heat dissipation fin inside the air inlet, the first heat dissipation fin can fully utilize the excellent characteristics of finned heat dissipation, efficiently absorbing and conducting excess heat from the intake chamber caused by the operation of the semiconductor cooling chip's heating end. Its evenly distributed structure along the outer wall of the intake chamber significantly increases the contact area with the outside air, effectively improving the heat exchange efficiency between heat and air, and accelerating the heat dissipation rate. Simultaneously, through its tight fit with the outer wall of the air inlet, some of the absorbed heat is conducted secondary to the outer wall of the air inlet for dispersion and release, preventing localized heat accumulation and overheating in the intake chamber. The second heat dissipation fin inside can efficiently assist in heat exchange of the heated airflow entering the air inlet from the air outlet. It can moderately adjust the temperature of the airflow about to enter the air inlet chamber according to actual working needs, accurately control the airflow temperature within a suitable range, and prevent excessive airflow temperature from adversely affecting the sensing sensitivity and performance of the transparent conductive electrode sheet on the electrode plate. It can also work together with the first heat dissipation fin to form a dual heat dissipation and protection structure on the outside of the air inlet and inside the air inlet. It controls the temperature balance of the air inlet chamber and the air inlet position from multiple angles, effectively avoiding the high temperature interference caused by excessive heat accumulation at the heating end of the semiconductor cooling chip. It continuously and stably ensures that the transparent conductive electrode sheet is always in a stable working state. At the same time, it makes the temperature distribution of the airflow that has been directionally heated in the air outlet more uniform after heat exchange, so that the temperature of the airflow entering the air inlet chamber and finally blowing on the surface of the transparent conductive electrode sheet is more in line with the working requirements.

[0018] Preferably, elastic sealing gaskets are provided between the air inlet and the air outlet, and between the air outlet and the exhaust outlet.

[0019] By incorporating elastic sealing gaskets at the connections between the air inlet and outlet, and between the outlet and exhaust port, the excellent elastic deformation characteristics and high sealing performance of the gaskets are fully utilized to seal the minute gaps caused by assembly at each connection point. This effectively prevents leakage of the closed-loop circulating airflow inside the device from these gaps, ensuring the overall sealing and integrity of the airflow circulation within the entire device. This ensures that the airflow can consistently and stably purge the transparent conductive electrode sheet on the electrode plate surface along the preset flow path. Simultaneously, it effectively prevents humid air from the external environment from seeping into the device through the gaps, avoiding the mixing of external humid air with the dry airflow inside the device, which would increase the humidity of the dry airflow and significantly reduce the device's anti-condensation effect. It also effectively reduces problems such as insufficient airflow purging force and uneven airflow distribution on the surface of the transparent conductive electrode sheet caused by airflow leakage.

[0020] Preferably, the air inlet, air outlet, and corners of the drying chamber of the airflow generating device are all designed to be arc-shaped.

[0021] By designing the air inlet, outlet, and corners of the drying chamber of the airflow generator as rounded arcs, the traditional right-angled corner structure can be replaced. This eliminates the obstruction and impact of airflow at the corners, allowing for smoother airflow through the inlet, outlet, and drying chamber. It reduces resistance and energy loss during airflow, ensuring the stability and smoothness of the airflow circulation speed. At the same time, it allows the airflow in the drying chamber to contact the desiccant and the cooling end of the semiconductor refrigeration chip more evenly, improving the efficiency of dehumidification and cooling condensation. It also makes the airflow delivery in the inlet and outlet more uniform, ensuring consistent airflow speed when entering the inlet chamber and more uniform coverage when blowing on the surface of the transparent conductive electrode sheet.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0023] 1. This invention connects rectangularly arranged transparent conductive electrode sheets in series, which expands the effective range of electrode array sensing and detection, ensuring the continuity and stability of sensing response signal acquisition. An airflow channel is set between the electrode plate and the sensor sensing end, forming a closed-loop airflow circulation with an air inlet chamber and an airflow generator. The exhaust port width is set to 1 / 2 of the air inlet, allowing the airflow to evenly sweep the surface of the transparent conductive electrode sheets, avoiding interference such as sensor parameter drift caused by humidity and parasitic conductive paths between electrodes, and significantly improving the accuracy, response sensitivity and reliability of the electrode array physicochemical property sensing and detection.

[0024] 2. This invention sets one side of the first and second guide ribs as an arc surface and connects them tangentially to the airflow channel. The corners of the airflow generating device are rounded. Various arc structures eliminate airflow eddies and dead angles, optimize the cooling airflow path, and set elastic sealing gaskets at the connection positions to prevent cooling airflow leakage and external hot air infiltration. The air inlet chamber is equipped with the first and second heat dissipation fins to form a dual heat dissipation structure, which improves heat dissipation efficiency. The dual heat dissipation structure precisely controls the temperature around the transparent conductive electrode sheet, ensuring its working temperature and sensing electrical performance are stable, avoiding the impact of temperature fluctuations on its sensing performance, and ensuring the long-term operation of the detection system.

[0025] 3. This invention incorporates a drying chamber and a semiconductor cooling chip within an airflow generator. The drying chamber is filled with a desiccant, its inner wall is made of a hydrophobic material, and a drain hole is provided at its lower end. A fan is located near the air inlet of the airflow generator, supplying air to the air inlet. The fan provides power for the circulation of the cooling airflow. As the airflow passes through the drying chamber, the desiccant first physically dehumidifies and optimizes the humidity of the cooling airflow. The cooling end of the semiconductor cooling chip then cools down and condenses water. Water droplets slide down the hydrophobic inner wall and are discharged through the drain hole, ensuring the dryness of the cooling airflow. The dry cooling airflow continuously sweeps the surface of the transparent conductive electrode sheet, preventing condensation from causing sensor monitoring failure and improving the heat dissipation stability and detection reliability of the monitoring device. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the multi-electrode series dynamic monitoring device of the present invention;

[0027] Figure 2 This is a front view of the multi-electrode series dynamic monitoring device of the present invention;

[0028] Figure 3 for Figure 2 Sectional view of AA;

[0029] Figure 4 for Figure 2 Sectional view of BB;

[0030] Figure 5 for Figure 3 Enlarged view of point C in the middle;

[0031] Figure 6 This is a right view of the multi-electrode series dynamic monitoring device of the present invention;

[0032] Figure 7 This is a top view of the multi-electrode series dynamic monitoring device of the present invention;

[0033] Figure 8 This is a schematic diagram of the electrode plate and transparent conductive electrode sheet structure.

[0034] In the diagram: 1. Sensor; 101. Sensing end; 102. Airflow channel; 103. Connecting end; 2. Electrode plate; 201. Transparent conductive electrode sheet; 3. Air inlet chamber; 301. Air inlet; 302. Exhaust port; 303. First guide rib; 304. Second guide rib; 305. Arc surface; 4. Airflow generating device; 401. Air outlet; 402. Air outlet; 403. Fan; 404. Drying chamber; 4041. Drain hole; 405. Semiconductor cooling chip; 5. Heat insulation sheet; 6. Thermally conductive copper sheet; 601. Thermally conductive section; 602. Heat transfer section; 7. First heat dissipation fin; 8. Second heat dissipation fin; 9. Elastic sealing gasket. Detailed Implementation

[0035] Please see Figures 1 to 8 This invention provides a multi-electrode series dynamic monitoring device, the technical solution of which is as follows:

[0036] For details, please refer to Figures 1 to 8A multi-electrode series dynamic monitoring device includes a sensor 1 with a sensing end 101 on one side and a connection end 103 at the lower end. An electrode plate 2 is disposed inside the sensing end 101, and multiple transparent conductive electrode sheets 201 are arranged in a rectangular pattern on the electrode plate 2, with a 1mm gap between each sheet. The multiple transparent conductive electrode sheets 201 are connected in series through the electrode plate 2. An airflow channel 102 with a thickness of 3mm is provided between the front wall of the electrode plate 2 and the inner wall of the sensing end 101. An air inlet chamber 3 is provided at the end of the electrode plate 2 opposite to the sensing end 101, and the airflow channel 102 is connected to the air inlet chamber 3. An airflow generating device 4 is provided on the outer side of the side away from the electrode plate 2. An air inlet 301 is provided on the edge of the air inlet chamber 3, and an exhaust port 302 is provided on the edge of the air inlet chamber 3 opposite to the air inlet 301. The width of the exhaust port 302 is 1 / 2 the width of the air inlet 301. A first guide rib 303 is provided at the connection between the airflow channel 102 and the air inlet chamber 3 near the exhaust port 302. The first guide rib 303 is fitted to the edge of the exhaust port 302. A second guide rib 304 is provided at the connection between the airflow channel 102 and the air inlet chamber 3 near the air inlet 301. The second guide rib 304 is fitted to the edge of the air inlet 301. Both the first guide rib 303 and the second guide rib 304 are provided with an arc surface 305 on the side near the airflow channel 102. The edges of 305 are tangent to the edges of the airflow channel 102. Air inlets 401 and outlets 402 are respectively provided on opposite sides of the airflow generator 4. Air inlets 401 are fixedly connected to inlets 301, and outlets 402 are fixedly connected to exhaust outlets 302. Elastic sealing gaskets 9 are provided between air inlets 401 and inlets 301, and between outlets 402 and exhaust outlets 302. A fan 403 is provided at one end of the airflow generator 4 near the air inlet 401, and the fan 403 blows air towards the inlet 301. A drying chamber 404 is provided inside the airflow generator 4, and the drying chamber 404 is connected to the air inlets 401 and outlets 402. Air inlets 401, outlets 402, and the corners of the drying chamber 404 are all equipped with... The drying chamber 404 is arc-shaped and filled with desiccant. A drain hole 4041 is located at the lower end of the drying chamber 404. A semiconductor cooling chip 405 is installed inside the drying chamber 404, and the inner walls of the drying chamber 404 are made of hydrophobic material. The cooling end of the semiconductor cooling chip 405 acts within the drying chamber 404, while the heating end acts on the air inlet chamber 3. A heat insulation sheet 5 is installed between the air inlet chamber 3 and the airflow generating device 4, acting between the heating end of the semiconductor cooling chip 405 and the air inlet chamber 3. The heat insulation sheet 5 has a thickness of 2mm. A thermally conductive copper sheet 6 is installed between the heat insulation sheet 5 and the semiconductor cooling chip 405. The thermally conductive copper sheet 6 includes a thermally conductive section 601 and a heat transfer section 602. The thermally conductive section 601 is attached to the heating end of the semiconductor cooling chip 405.The heat transfer section 602 is attached to the inner wall of the air inlet 401. The heat conduction section 601 and the heat transfer section 602 are connected in an L-shape. A first heat dissipation fin 7 is provided on one side of the air inlet chamber 3, which is attached to the heating end of the semiconductor cooling chip 405. The first heat dissipation fin 7 is evenly distributed along the outer wall of the air inlet chamber 3 and is attached to the outer wall of the air inlet 401. A second heat dissipation fin 8 is provided inside the air inlet 301.

[0037] Working principle: Refer to Figures 1 to 8 When the multi-electrode series dynamic monitoring device is working, the airflow generator 4 is activated, and its internal fan 403 supplies airflow power to the air inlet 301. The gas inside the airflow generator 4 passes through the drying chamber 404. The desiccant in the drying chamber 404 first physically dehumidifies the airflow, removing most of the water vapor. At the same time, the cooling end of the semiconductor cooling chip 405 in the drying chamber 404 is activated, rapidly reducing the temperature of the drying chamber 404. This causes the remaining water vapor in the airflow to condense into liquid water upon cooling. The inner wall of the drying chamber 404, made of hydrophobic material, allows the liquid water to slide down quickly and be discharged through the drain hole 4041, achieving deep dehumidification of the airflow. The dried airflow enters the air inlet 301 through the air outlet 401 and then enters the air inlet chamber 3. Because the width of the exhaust port 302 of the intake chamber 3 is half that of the intake port 301, the airflow is blocked by the narrowing and diffuses towards the airflow channel 102. Under the smooth guidance of the arc surface 305 of the first guide rib 303 and the second guide rib 304, the airflow enters the 3mm thick airflow channel 102 without turbulence or dead angles. It flows evenly along the airflow channel 102 over the surface of the transparent conductive electrode sheet 201 arranged in a rectangle on the electrode plate 2. It is continuously purged to avoid condensation on the surface of the transparent conductive electrode sheet 201 due to temperature and humidity difference. The purged airflow flows back to the intake chamber 3 and merges with the newly entered dry airflow. A portion of it flows back to the drying chamber 404 through the exhaust port 302 and the outlet 402 for dehumidification again, forming a closed-loop airflow circulation.

[0038] During this process, the heat generated by the heating end of the semiconductor cooling chip 405 is conducted through the heat-conducting section 601 of the L-shaped heat-conducting copper sheet 6 to the heat transfer section 602 that is in contact with the inner wall of the air outlet 401, thus directionally heating the airflow in the air outlet 401, increasing the dew point value of the airflow, and making it less prone to condensation when the airflow flows through the transparent conductive electrode sheet 201. The heat insulation sheet 5 between the air inlet chamber 3 and the airflow generating device 4 prevents the heat from the heating end from being directly conducted to the air inlet chamber 3. The first heat dissipation fin 7 and the second heat dissipation fin 8 efficiently dissipate excess heat, preventing the temperature of the air inlet chamber 3 from being too high and affecting the sensing performance of the transparent conductive electrode sheet 201. The air outlet 401 and the air inlet 301, the air outlet 402 and the exhaust port 302 are connected. The elastic sealing gasket 9 at the connection seals the gaps to prevent leakage of internal dry airflow and infiltration of external humid air, ensuring the dryness and stability of the closed-loop airflow circulation. When a user's finger or object approaches the sensing area of ​​the sensing end 101, the electric field on the surface of the transparent conductive electrode sheet 201 changes, causing changes in its electrical characteristic parameters such as capacitance and resistance. Multiple series-connected transparent conductive electrode sheets 201 transmit electrical signals to the sensor 1. The sensor 1, through high-sensitivity monitoring and calculation of these dynamic electrical signals, inverts the location and state of the interactive event, and then transmits the data to the holographic interactive projection device through the connection end 103, realizing accurate dynamic monitoring of the interactive actions of the holographic interactive projection device.

[0039] The specific embodiment of the present invention has been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the embodiments described above. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and ideas of the present invention should still fall within the protection scope of the present invention.

Claims

1. A multi-electrode series dynamic monitoring device, comprising a sensor (1), wherein a sensing end (101) is provided on one side of the sensor (1), characterized in that, An electrode plate (2) is provided inside the sensing end (101) of the sensor (1). Multiple transparent conductive electrode sheets (201) are disposed on the electrode plate (2), arranged in a rectangular pattern on the electrode plate (2), with a spacing of 1-2 mm between each sheet. The multiple transparent conductive electrode sheets (201) are connected in series through the electrode plate (2). An airflow channel (102) is provided between one end of the electrode plate (2) where the transparent conductive electrode sheets (201) are disposed and the sensing end (101) of the sensor (1). The thickness of the airflow channel (102) is 3-5 mm. The electrode plate (2) is opposite to the sensing end (101). An air inlet chamber (3) is provided at one end, and the airflow channel (102) is connected to the air inlet chamber (3). An airflow generating device (4) is provided on the outer side of the air inlet chamber (3) away from the electrode plate (2). An air inlet (301) is provided at the edge of the air inlet chamber (3), and an exhaust port (302) is provided at the edge of the air inlet chamber (3) opposite to the air inlet (301). The width of the exhaust port (302) is 1 / 2 of the width of the air inlet (301). An air supply port (401) and an air outlet (402) are respectively provided on both sides of the airflow generating device (4). The air supply port (401) is fixedly connected to the air inlet (301), and the air outlet (402) is fixedly connected to the exhaust port (302). The airflow generating device (4) is equipped with a fan (403) at one end near the air outlet (401). The fan (403) blows air towards the air inlet (301). The airflow generating device (4) is equipped with a drying chamber (404). The drying chamber (404) is connected to the air outlet (401) and the air outlet (402). The drying chamber (404) is filled with desiccant. The lower end of the drying chamber (404) is equipped with a drain hole (4041). The drying chamber (404) is provided with a semiconductor cooling chip (405), and the inner wall of the drying chamber (404) is made of hydrophobic material. The cooling end of the semiconductor cooling chip (405) acts inside the drying chamber (404), and the heating end of the semiconductor cooling chip (405) acts on the air inlet chamber (3).

2. The multi-electrode series dynamic monitoring device according to claim 1, characterized in that, A first guide rib (303) is provided at the connection between the airflow channel (102) and the air intake chamber (3) near the exhaust port (302). The first guide rib (303) is fitted to the edge of the exhaust port (302). A second guide rib (304) is provided at the connection between the airflow channel (102) and the air intake chamber (3) near the air intake port (301). The second guide rib (304) is fitted to the edge of the air intake port (301). Both the first guide rib (303) and the second guide rib (304) are provided with an arc surface (305) on the side near the airflow channel (102). The edge of the arc surface (305) is tangent to the edge of the airflow channel (102).

3. The multi-electrode series dynamic monitoring device according to claim 1, characterized in that, A heat insulation sheet (5) is provided between the air inlet chamber (3) and the airflow generating device (4). The heat insulation sheet (5) acts between the heating end of the semiconductor cooling chip (405) and the air inlet chamber (3). The thickness of the heat insulation sheet (5) is 2-3 mm. A heat-conducting copper sheet (6) is provided between the heat insulation sheet (5) and the semiconductor cooling chip (405). The heat-conducting copper sheet (6) includes a heat-conducting section (601) and a heat-transferring section (602). The heat-conducting section (601) is attached to the heating end of the semiconductor cooling chip (405), and the heat-transferring section (602) is attached to the inner wall of the air outlet (401). The heat-conducting section (601) and the heat-transferring section (602) are connected in an L-shape.

4. The multi-electrode series dynamic monitoring device according to claim 3, characterized in that, The air inlet chamber (3) is provided with a first heat dissipation fin (7) on one side of the heating end of the semiconductor cooling chip (405). The first heat dissipation fin (7) is evenly distributed along the outer wall of the air inlet chamber (3). The first heat dissipation fin (7) is attached to the outer wall of the air outlet (401). The air inlet (301) is provided with a second heat dissipation fin (8).

5. The multi-electrode series dynamic monitoring device according to claim 1, characterized in that, Elastic sealing gaskets (9) are provided between the air inlet (401) and the air outlet (301), and between the air outlet (402) and the exhaust outlet (302).

6. The multi-electrode series dynamic monitoring device according to claim 1, characterized in that, The corners of the air inlet (401), air outlet (402), and drying chamber (404) of the airflow generating device (4) are all rounded.

Images