Method and system for preventing high-temperature test probe mark offset of probe card

Abstract

The invention relates to the technical field of semiconductor wafer testing, and discloses a method and system for preventing a probe mark of a probe card from shifting during high-temperature testing, and the method comprises the steps: obtaining the temperature distribution information of the probe card during the high-temperature testing process; controlling a constant-temperature blowing device to output constant-temperature airflow to the front surface of the probe card according to the temperature distribution information; and dynamically adjusting the temperature parameter and the airflow distribution of the constant-temperature airflow according to the position change of the probe station chuck disc relative to the probe card. The problems of needle point deformation and needle mark offset caused by heat conduction interruption and environment temperature fluctuation in a high-temperature test are solved, the test precision and stability are improved, the product yield is improved, and the loss risk of a probe card is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer testing technology, and in particular to a method and system for preventing probe card high-temperature test pin mark displacement. Background Technology

[0002] With the rapid development of the semiconductor industry, wafer testing, as a critical step in chip manufacturing, directly impacts product yield and cost control through its testing accuracy and stability. Wafer testing is primarily achieved through the coordinated operation of a tester, probe station, and probe cards. The tester provides standardized test signals and performance verification, the probe station carries the wafer and achieves precise positioning via its movable chuck disk, and the probe cards serve as the electrical interface between the chip under test and the tester, performing preliminary screening of electrical performance before chip packaging.

[0003] Probe cards typically consist of a PCB substrate, probes, and functional components. Based on their structure, they can be categorized into cantilever probe cards, vertical probe cards, thin-film probe cards, and MEMS probe cards. Cantilever probe cards are widely used due to their cantilever beam structure, and their probes are often made of rhenium-tungsten, beryllium copper, or AH-NP alloys. The PCB substrate, as the platform supporting the probes and functional components, not only facilitates signal transmission between the probe tip and the testing machine, but its shape and size must also match the interface method, and its material must meet the requirements of the testing environment. Commonly, they are square or circular structures.

[0004] In high-temperature testing applications, probe cards are particularly susceptible to tip deformation due to the thermal expansion and contraction properties of materials, directly leading to probe mark misalignment and affecting test accuracy. Specifically: First, during continuous contact testing, the probe stage chuck disk acts as the sole heat source. When the probe leaves the wafer, heat conduction is interrupted, causing the probe body to deform due to temperature changes. Second, during wafer transfer, the chuck disk needs to move to the transfer position, deviating from directly above the probe. Temperature fluctuations within the probe stage cavity cause tip deformation. Third, when a test anomaly alarm occurs, the chuck disk descends to a safe area, increasing the distance from the probe. Changes in ambient temperature again cause tip displacement. These deformation problems repeatedly occur in high-temperature testing scenarios, resulting in inconsistent probe mark positions. In severe cases, this can prevent the probe from accurately contacting the chip electrodes, affecting the reliability of test data, reducing production efficiency, and increasing the risk of probe card wear.

[0005] Therefore, there is an urgent need to provide a technical solution to address the above problems. Summary of the Invention

[0006] To address the aforementioned technical problems, this invention provides a method and system for preventing probe mark displacement during high-temperature testing of probe cards.

[0007] In a first aspect, the present invention provides a method for preventing probe mark displacement during high-temperature testing of a probe card, the technical solution of which is as follows: Acquire temperature distribution information of the probe card during high-temperature testing; Based on the temperature distribution information, the constant temperature blowing device is controlled to output a constant temperature airflow to the front of the probe card; The temperature parameters and airflow distribution of the constant-temperature airflow are dynamically adjusted according to the position change of the probe station chuck disk relative to the probe card.

[0008] The beneficial effects of the method for preventing probe mark displacement during high-temperature testing of probe cards according to the present invention are as follows: The method of this invention obtains the temperature distribution information of the probe card, controls the constant temperature blowing device to output constant temperature airflow to the front of the probe card, and dynamically adjusts the airflow parameters according to the position change of the probe station chuck disk. This solves the problems of needle tip deformation and needle mark offset caused by heat conduction interruption and ambient temperature fluctuation in high temperature testing, improves testing accuracy and stability, increases product yield, and reduces the risk of probe card loss.

[0009] Based on the above solution, the method for preventing probe card high-temperature test needle mark displacement of the present invention can be further improved as follows.

[0010] In one alternative approach, the step of controlling the thermostatic blowing device to output a thermostatic airflow to the front of the probe card based on the temperature distribution information includes: The target temperature value of the constant-temperature airflow is determined based on the temperature distribution information. The constant temperature blowing device is controlled to output the constant temperature airflow to the front of the probe card according to the target temperature value.

[0011] The advantages of adopting the above optional methods are: further refining the temperature control process, determining the target temperature value based on temperature distribution information, making the constant temperature airflow output more consistent with the actual thermal state of the probe card, avoiding tip deformation caused by temperature fluctuations, and improving test stability.

[0012] In one alternative approach, the step of dynamically adjusting the temperature parameters and airflow distribution of the constant-temperature airflow based on the positional change of the probe station chuck disk relative to the probe card includes: Monitor the real-time position change of the probe station chuck disk relative to the probe card; Based on the real-time position changes and the preset mapping relationship, the adjustment amount of the temperature parameters and airflow distribution of the constant temperature airflow is determined; The constant temperature air blowing device is controlled to adjust the constant temperature airflow based on the adjustment amount.

[0013] The advantages of adopting the above optional method are: to further realize the dynamic adjustment of airflow parameters, by monitoring the real-time position of the chuck disk and combining it with the preset mapping relationship, the constant temperature airflow is adjusted in a timely manner according to the position change, maintaining the needle tip temperature constant and reducing the risk of needle mark deviation.

[0014] In one alternative approach, it also includes: Obtain multiple preset position information of the probe station chuck disk relative to the probe card; Determine the temperature parameter adjustment amount and airflow distribution adjustment amount of the constant temperature airflow corresponding to each preset location information; Establish a correspondence between each preset location information and the corresponding temperature parameter adjustment amount and airflow distribution adjustment amount to form the preset mapping relationship.

[0015] The advantages of adopting the above optional methods are: further improving the method of establishing preset mapping relationships, making dynamic adjustment pre-configurable by calibrating the adjustment amount corresponding to different positions, simplifying control logic, and enhancing the consistency and reproducibility of the testing process.

[0016] In one optional approach, the step of acquiring the temperature distribution information of the probe card during the high-temperature test includes: Temperature data from multiple areas of the probe card are collected in real time by an array of temperature sensors located on the front of the probe card.

[0017] The advantages of adopting the above-mentioned optional methods are: further clarifying the temperature acquisition methods, acquiring multi-region temperature data of the probe card in real time through the sensor array, making the temperature distribution information more comprehensive and accurate, providing reliable input for constant temperature airflow control, and optimizing temperature control accuracy.

[0018] In one alternative approach, the step of monitoring the real-time position change of the probe station chuck disk relative to the probe card includes: The system identifies the positional changes of the probe station chuck disk when it is located in the upper, middle, or lower half of the test wafer.

[0019] The advantages of adopting the above-mentioned optional methods are: further defining the position change recognition method, by distinguishing the position of the chuck disk in the upper half, middle and lower half of the wafer, the airflow distribution adjustment can better fit the actual test area changes, and improve the test stability of different areas.

[0020] In one alternative approach, the target temperature value is not lower than the heating temperature of the test wafer by the probe station chuck disk.

[0021] The advantages of using the above-mentioned optional methods are: further limiting the target temperature range, ensuring that the constant temperature airflow temperature is not lower than the wafer heating temperature, preventing the probe card from cooling down due to interruption of heat conduction, avoiding cold shrinkage deformation of the probe tip, and maintaining the consistency of the probe mark position.

[0022] Secondly, the present invention provides a system for preventing probe card high-temperature test needle mark displacement, the technical solution of which is as follows: The acquisition module is used to obtain temperature distribution information of the probe card during high-temperature testing; The control module is used to control the constant temperature blowing device to output a constant temperature airflow to the front of the probe card according to the temperature distribution information. The adjustment module is used to dynamically adjust the temperature parameters and airflow distribution of the constant temperature airflow based on the position change of the probe station chuck disk relative to the probe card.

[0023] The beneficial effects of the system for preventing probe mark displacement during high-temperature testing of probe cards according to the present invention are as follows: The system of this invention acquires the temperature distribution information of the probe card, controls the constant temperature blowing device to output constant temperature airflow to the front of the probe card, and dynamically adjusts the airflow parameters according to the position change of the probe station chuck disk. This solves the problems of needle tip deformation and needle mark offset caused by heat conduction interruption and ambient temperature fluctuation in high temperature testing, improves testing accuracy and stability, increases product yield, and reduces the risk of probe card loss.

[0024] Thirdly, the technical solution of an electronic device according to the present invention is as follows: The invention includes a memory, a processor, and a program stored in the memory and running on the processor, wherein the processor, when executing the program, implements the steps of the method for preventing probe card high-temperature test needle mark displacement as described in this invention.

[0025] Fourthly, the technical solution of a computer-readable storage medium provided by the present invention is as follows: The computer-readable storage medium stores instructions that, when read, cause the computer-readable storage medium to perform the steps of the method for preventing probe card high-temperature test needle mark displacement as described in this invention.

[0026] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0027] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 This is a flowchart illustrating an embodiment of a method for preventing probe mark displacement during high-temperature testing according to the present invention. Figure 2 This diagram illustrates the thermal deformation and pin mark offset of the probe card PCB caused by the probe station chuck disk at different test positions. Figure 3 This is a schematic diagram illustrating the principle of an embodiment of a method for preventing probe mark displacement during high-temperature testing of a probe card according to the present invention. Figure 4 This is a schematic diagram of an embodiment of a system for preventing probe card high-temperature test needle mark displacement according to the present invention; Figure 5 This is a schematic diagram of an embodiment of an electronic device according to the present invention. Detailed Implementation

[0028] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0029] Figure 1 This diagram illustrates a flowchart of an embodiment of a method for preventing probe card high-temperature test pin mark displacement provided by the present invention. This method can be executed by an electronic device such as a terminal device or a server. The terminal device can be any fixed or mobile terminal, such as user equipment (UE), mobile device, user terminal, terminal, cellular phone, cordless phone, personal digital assistant (PDA), handheld device, computing device, vehicle-mounted device, or wearable device. The server can be a single server or a server cluster consisting of multiple servers. Any electronic device can implement the method for preventing probe card high-temperature test pin mark displacement by having its processor call computer-readable instructions stored in its memory. Figure 1 As shown, it includes the following steps: S1. Obtain the temperature distribution information of the probe card during the high-temperature test.

[0030] A probe card, in particular, is a specialized device used in wafer testing to establish an electrical connection between the testing machine and the chip electrodes. It comprises a printed circuit board substrate, probes, and auxiliary functional components. For example, a cantilever probe card made of rhenium-tungsten material has a square printed circuit board substrate and is used for 300°C high-temperature testing of a certain type of processor wafer. High-temperature testing refers to the process of measuring and verifying the electrical performance of integrated circuit chips on a semiconductor wafer at a specific set temperature environment above room temperature. For example, the probe stage chuck holding the wafer is heated to 300°C and maintained at a stable temperature, and then the probe card is controlled to contact the chip electrodes for signal transmission testing. Temperature distribution information refers to the data set representing the temperature differences between different areas on the front of the probe card at the same point in time. For example, real-time data collected by a temperature sensor array shows that the upper half of the probe card has a temperature of 295°C, the middle half has a temperature of 300°C, and the lower half has a temperature of 298°C.

[0031] S2. Based on the temperature distribution information, control the constant temperature blowing device to output a constant temperature airflow to the front of the probe card.

[0032] A thermostatic air blowing device refers to a device capable of generating and outputting airflow at a constant temperature with precise control. For example, a device including a resistance heater, a high-precision temperature controller, and a centrifugal fan can heat and stabilize the intake air at 305°C before blowing it onto the front of the probe card. A thermostatic airflow refers to the flowing gas output by the thermostatic air blowing device, whose temperature remains constant. For example, an airflow with a stable temperature of 305°C and a uniform flow rate continuously blows onto the front of the probe card to maintain a stable temperature field.

[0033] S3. Based on the positional change of the probe station chuck disk relative to the probe card, dynamically adjust the temperature parameters and airflow distribution of the constant temperature airflow.

[0034] In this context, the probe station chuck refers to the working platform in a probe station device used to support, fix, and heat semiconductor wafers, and capable of performing precise movements. For example, a cermet disk that can move along the X, Y, and Z axes heats a 12-inch wafer to 300°C and precisely positions it below the probe during testing. Temperature parameters refer to physical quantities used to describe or control the thermodynamic state of the isothermal airflow. For example, the set target temperature of 305°C for the isothermal airflow and the actual temperature measured at the pipe outlet is 304.8°C. Airflow distribution refers to the range, direction, and intensity of the isothermal airflow covering the front space of the probe card. For example, the airflow is mainly concentrated in the upper half of the probe card, where the airflow velocity is higher, while the airflow velocity is lower in the lower half.

[0035] The technical solution of this embodiment obtains the temperature distribution information of the probe card, controls the constant temperature blowing device to output constant temperature airflow to the front of the probe card, and dynamically adjusts the airflow parameters according to the position change of the probe station chuck disk. This solves the problems of needle tip deformation and needle mark offset caused by heat conduction interruption and ambient temperature fluctuation in high temperature testing, improves test accuracy and stability, increases product yield, and reduces the risk of probe card loss.

[0036] In one alternative approach, S2 specifically includes: The target temperature value of the constant-temperature airflow is determined based on the temperature distribution information.

[0037] The target temperature value refers to the specific temperature that is pre-set for the constant-temperature airflow and is expected to be reached and maintained. For example, based on the surface temperature distribution information of the probe card, the target temperature value of the airflow output by the constant-temperature blowing device is set to 305℃.

[0038] The constant temperature blowing device is controlled to output the constant temperature airflow to the front of the probe card according to the target temperature value.

[0039] Among the above-mentioned optional methods, the temperature control process can be further refined. By determining the target temperature value based on temperature distribution information, the constant temperature airflow output can better match the actual thermal state of the probe card, avoid tip deformation caused by temperature fluctuations, and improve test stability.

[0040] In one alternative approach, S3 specifically includes: Monitor the real-time position change of the probe station chuck disk relative to the probe card.

[0041] Real-time position change refers to the continuous change in the spatial position of the probe station chuck disk relative to the stationary probe card over time. For example, during testing, the chuck disk moves from the upper half of the wafer to the lower half of the wafer, generating continuous coordinate change data.

[0042] Based on the real-time position changes and the preset mapping relationship, the adjustment amount of the temperature parameters and airflow distribution of the constant temperature airflow is determined.

[0043] The preset mapping relationship refers to a dataset that establishes a correspondence between the probe station chuck disk position information and the adjustment amount of the isothermal airflow control parameters in advance through experiments or calibration. For example, a lookup table records that when the chuck disk is located at the center coordinate of the upper half of the wafer, the corresponding isothermal airflow temperature needs to be increased by 2°C and the airflow intensity mainly distributed to the upper half of the probe card.

[0044] The constant temperature air blowing device is controlled to adjust the constant temperature airflow based on the adjustment amount.

[0045] In the above-mentioned optional methods, dynamic adjustment of airflow parameters is further realized. By monitoring the real-time position of the chuck disk and combining it with the preset mapping relationship, the constant temperature airflow is adjusted in a timely manner according to the position change, so as to keep the needle tip temperature constant and reduce the risk of needle mark deviation.

[0046] In one alternative approach, it also includes: Obtain multiple preset position information of the probe station chuck disk relative to the probe card.

[0047] The preset position information refers to the predefined and stored coordinates or area identifiers representing several key typical positions of the probe station chuck disk during the test cycle. For example, it could be three sets of two-dimensional coordinate data representing the center point of the upper half, the geometric center point, and the center point of the lower half of the test wafer, respectively.

[0048] Determine the temperature parameter adjustment amount and airflow distribution adjustment amount of the constant temperature airflow corresponding to each preset location information.

[0049] The temperature parameter adjustment refers to the specific temperature value that needs to be increased or decreased based on a preset mapping relationship, indicating the current target temperature of the isothermal airflow. For example, according to the mapping relationship, when the chuck disk is detected to have moved to the lower half of the wafer, the target temperature of the isothermal airflow needs to be increased by 1.5°C. The airflow distribution adjustment refers to the specific control amount that needs to be changed regarding the blowing range or relative intensity of the isothermal airflow on the front of the probe card, based on a preset mapping relationship. For example, according to the mapping relationship, when the chuck disk is detected to have moved to the upper half of the wafer, 70% of the total airflow needs to be directed to the upper half of the probe card.

[0050] Establish a correspondence between each preset location information and the corresponding temperature parameter adjustment amount and airflow distribution adjustment amount to form the preset mapping relationship.

[0051] Among the above-mentioned optional methods, the method for establishing the preset mapping relationship can be further improved. By calibrating the adjustment amount corresponding to different positions, the dynamic adjustment can be preset, the control logic can be simplified, and the consistency and reproducibility of the test process can be enhanced.

[0052] In one alternative approach, S1 specifically includes: Temperature data from multiple areas of the probe card are collected in real time by an array of temperature sensors located on the front of the probe card.

[0053] A temperature sensor array refers to a set of temperature sensors arranged in a specific pattern at multiple locations on the front of a probe card. For example, nine K-type thermocouples fixed in a 3x3 matrix at nine key monitoring points on the front of the probe card are used to synchronously acquire temperature signals. Temperature data refers to the raw electrical signal or converted digital signal directly detected and output by the temperature sensors, representing the temperature value of the measurement point. For example, the digital value obtained by a thermocouple at a specific moment after analog-to-digital conversion corresponds to a temperature of 298.7℃.

[0054] Among the above-mentioned optional methods, the temperature acquisition method is further clarified. The temperature data of multiple areas of the probe card is obtained in real time through the sensor array, so that the temperature distribution information is more comprehensive and accurate, providing a reliable input for constant temperature airflow control and optimizing the temperature control accuracy.

[0055] In one alternative approach, the step of monitoring the real-time position change of the probe station chuck disk relative to the probe card includes: The system identifies the positional changes of the probe station chuck disk when it is located in the upper, middle, or lower half of the test wafer.

[0056] In this context, a test wafer refers to a semiconductor wafer awaiting electrical performance testing. For example, a 12-inch silicon wafer with hundreds of identical processor chips fabricated on its surface is placed on a probe station chuck disk in preparation for testing.

[0057] Among the above-mentioned optional methods, the position change recognition method is further defined. By distinguishing the position of the chuck disk in the upper, middle and lower half of the wafer, the airflow distribution adjustment can better match the actual test area changes and improve the test stability in different areas.

[0058] In one alternative approach, the target temperature value is not lower than the heating temperature of the test wafer by the probe station chuck disk.

[0059] The heating temperature value refers to the target temperature set and maintained by the probe station chuck disk to heat the wafer to meet the requirements of high-temperature testing processes. For example, a certain testing process specification requires the probe station chuck disk to heat the wafer and stably maintain it at 300°C.

[0060] In the above-mentioned optional methods, the target temperature range is further defined. By ensuring that the temperature of the constant temperature airflow is not lower than the wafer heating temperature, the probe card is prevented from cooling down due to interruption of heat conduction, the tip is prevented from shrinking and deforming, and the position of the probe marks is maintained in a consistent manner.

[0061] In this embodiment, it should be noted that: During high-temperature wafer testing, the probe station chuck disk serves as the sole heat source for heating the test wafer and probe card. The probe card remains fixed during testing, while the probe station chuck disk moves in a zigzag pattern below the probe card, typically from top to bottom, depending on the testing direction. This change in relative position causes variations in the degree of heating exerted by the probe station chuck disk on different areas of the probe card, becoming a key factor in causing probe mark misalignment.

[0062] like Figure 2 As shown, when testing the upper half of the wafer, the probe station chuck is positioned below the probe card corresponding to the upper half of the wafer. The chuck primarily heats the lower half of the probe card's printed circuit board substrate. Based on the principle of thermal expansion and contraction, the heated lower half of the substrate expands, causing the center point of the probe card to shift upwards. When the probe presses down to contact the wafer chip pads, the probe tip's mark will be biased towards the top of the pads. When testing the middle area of ​​the wafer, the probe station chuck moves to the center position directly below the probe card, heating the middle part of the substrate. At this time, the center point of the probe card remains stable, and the probe tip's contact mark is centered on the pads. When testing the lower half of the wafer, the probe station chuck moves to the corresponding position on the lower half of the wafer, instead heating the upper half of the probe card's printed circuit board substrate. The expansion of the upper half of the substrate causes the center point of the probe card to shift downwards, thus causing the probe tip's mark to be biased towards the bottom of the pads.

[0063] To address the issues of uneven heating of the probe card, deformation of the printed circuit board substrate, and misalignment of probe marks caused by the movement of the probe station chuck disk, this embodiment proposes a solution involving the addition of a constant-temperature air blowing device. For example... Figure 3 As shown, the thermostatic air blowing device is configured to continuously blow a constant and controllable stream of hot air onto the front of the probe card. This thermostatic airflow covers the front of the probe card, maintaining a uniform and stable temperature environment for the front area of ​​the probe card and the printed circuit board substrate. Heat is transferred from the front of the probe card to the back of the probe via thermal conduction, helping to maintain the stability of the overall shape of the probe. This solution compensates for the temperature field fluctuations caused by the probe stage chuck disk acting as a single moving heat source by providing an independent and uniform auxiliary heat source, eliminating the probe card center point offset caused by non-uniform thermal expansion of the printed circuit board substrate, thereby solving the problem of abnormal probe tip contact marks.

[0064] To better illustrate the technical solution of this embodiment, the following complete example is used for explanation, specifically: S10. Install the cantilever probe card on the probe station and place the test wafer on the probe station chuck tray. Set the heating temperature value of the probe station chuck tray on the wafer. S20. Activate the temperature sensor array installed on the front of the probe card and start the constant temperature blowing device installed on the front of the probe card. S30. Execute the preset mapping relationship construction process to obtain multiple preset position information of the probe station chuck disk during the test process, and determine the temperature parameter adjustment amount and airflow distribution adjustment amount of the constant temperature airflow corresponding to each preset position information. S40. Start the high temperature test process, control the probe station chuck disk to heat the wafer to the set temperature, and at the same time collect temperature data of multiple areas of the probe card in real time through the temperature sensor array to form temperature distribution information. S50. Based on the currently collected temperature distribution information, determine the target temperature value of the constant temperature airflow, and control the constant temperature blowing device to output constant temperature airflow to the front of the probe card according to the target temperature value. S60. Monitor the real-time position change of the chuck disk on the monitoring probe station relative to the probe card. When a change in the position of the chuck disk is detected, determine the adjustment amount of the temperature parameters and airflow distribution of the constant temperature airflow based on the real-time position change and the preset mapping relationship. S70. Based on the determined adjustment amount, control the constant temperature blowing device to adjust the temperature parameters and airflow distribution of the output constant temperature airflow. S80: Throughout the high-temperature test, position monitoring and dynamic airflow adjustment are continuously performed to maintain the stability of the temperature field of the probe card.

[0065] Figure 4 A schematic diagram of an embodiment of a system 200 for preventing probe mark displacement during high-temperature testing of a probe card, provided by the present invention, is shown. Figure 4 As shown, the system 200 for preventing probe card high-temperature test needle mark displacement includes: The acquisition module 201 is used to acquire temperature distribution information of the probe card during the high-temperature test process; Control module 202 is used to control the constant temperature blowing device to output constant temperature airflow to the front of the probe card according to the temperature distribution information; The adjustment module 203 is used to dynamically adjust the temperature parameters and airflow distribution of the constant temperature airflow according to the position change of the probe station chuck disk relative to the probe card.

[0066] In an alternative embodiment, the control module 202 is specifically used for: The target temperature value of the constant-temperature airflow is determined based on the temperature distribution information. The constant temperature blowing device is controlled to output the constant temperature airflow to the front of the probe card according to the target temperature value.

[0067] In an alternative embodiment, the adjustment module 203 is specifically used for: Monitor the real-time position change of the probe station chuck disk relative to the probe card; Based on the real-time position changes and the preset mapping relationship, the adjustment amount of the temperature parameters and airflow distribution of the constant temperature airflow is determined; The constant temperature air blowing device is controlled to adjust the constant temperature airflow based on the adjustment amount.

[0068] In an alternative embodiment, the system further includes a calibration module; the calibration module is used for: Obtain multiple preset position information of the probe station chuck disk relative to the probe card; Determine the temperature parameter adjustment amount and airflow distribution adjustment amount of the constant temperature airflow corresponding to each preset location information; Establish a correspondence between each preset location information and the corresponding temperature parameter adjustment amount and airflow distribution adjustment amount to form the preset mapping relationship.

[0069] In one alternative embodiment, the acquisition module 201 is specifically used for: Temperature data from multiple areas of the probe card are collected in real time by an array of temperature sensors located on the front of the probe card.

[0070] In an alternative embodiment, the adjustment module 203 is specifically used for: The system identifies the positional changes of the probe station chuck disk when it is located in the upper, middle, or lower half of the test wafer.

[0071] In one alternative approach, the target temperature value is not lower than the heating temperature of the test wafer by the probe station chuck disk.

[0072] It should be noted that the beneficial effects of the system 200 for preventing probe card high-temperature test needle mark displacement provided in the above embodiments are the same as those of the method for preventing probe card high-temperature test needle mark displacement, and will not be repeated here. Furthermore, the system provided in the above embodiments is only illustrated by the division of the above functional modules. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the system can be divided into different functional modules according to the actual situation to complete all or part of the functions described above. In addition, the system and method embodiments provided in the above embodiments belong to the same concept, and their specific implementation process is detailed in the method embodiments, and will not be repeated here.

[0073] The system 200 for preventing probe card high-temperature test pin mark offset of the present invention can be a computer program (including program code) running on a computer device. For example, the system 200 for preventing probe card high-temperature test pin mark offset of the present invention is an application software that can be used to execute the corresponding steps in the method for preventing probe card high-temperature test pin mark offset of the present invention.

[0074] In some embodiments, the system 200 for preventing probe card high-temperature test pin mark offset of the present invention can be implemented in a combination of hardware and software. As an example, the system 200 for preventing probe card high-temperature test pin mark offset of the present invention can be a processor in the form of a hardware decoding processor, which is programmed to execute the method for preventing probe card high-temperature test pin mark offset of the present invention. For example, the processor in the form of a hardware decoding processor can be one or more application specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), complex programmable logic devices (CPLDs), field-programmable gate arrays (FPGAs), or other electronic components.

[0075] The modules described in the embodiments of this invention can be implemented in software or hardware. The names of the modules are not, in some cases, limiting the scope of the module itself.

[0076] An electronic device according to an embodiment of the present invention includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements any of the above-mentioned methods for preventing probe card high-temperature test pin mark displacement. That is, an electronic device according to an embodiment of the present invention may include, but is not limited to: a processor and a memory; the memory is used to store the computer program; the processor is used to execute the method for preventing probe card high-temperature test pin mark displacement shown in any embodiment of the present invention by calling the computer program.

[0077] In one alternative embodiment, an electronic device is provided, such as Figure 5 As shown, Figure 5The illustrated electronic device 4000 includes a processor 4001 and a memory 4003. The processor 4001 and the memory 4003 are connected, for example, via a bus 4002. Optionally, the electronic device 4000 may further include a transceiver 4004, which can be used for data interaction between the electronic device and other electronic devices, such as sending and / or receiving data. It should be noted that in practical applications, the transceiver 4004 is not limited to one type, and the structure of the electronic device 4000 does not constitute a limitation on the embodiments of the present invention.

[0078] Processor 4001 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It can implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this invention. Processor 4001 may also be a combination that implements computational functions, such as including one or more microprocessor combinations, a combination of a DSP and a microprocessor, etc.

[0079] Bus 4002 may include a path for transmitting information between the aforementioned components. Bus 4002 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. Bus 4002 can be divided into address bus, data bus, control bus, etc. For ease of representation, Figure 5 The bus 4002 is represented by only one thick line, but this does not mean that there is only one bus or one type of bus.

[0080] The memory 4003 may be ROM (Read Only Memory) or other types of static storage devices capable of storing static information and instructions, RAM (Random Access Memory) or other types of dynamic storage devices capable of storing information and instructions, or EEPROM (Electrically Erasable Programmable Read Only Memory), CD-ROM (Compact Disc Read Only Memory) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but not limited thereto.

[0081] The memory 4003 stores application code (computer program) for executing the present invention, and its execution is controlled by the processor 4001. The processor 4001 executes the application code stored in the memory 4003 to implement the content shown in the foregoing method embodiments.

[0082] Among them, electronic devices can also be terminal devices. A terminal device can be any terminal device that can install applications and access web pages through applications, including at least one of smartphones, tablets, laptops, desktop computers, smart speakers, smartwatches, smart TVs, and smart in-vehicle devices.

[0083] It should be noted that, Figure 5 The electronic device shown is merely an example and should not be construed as limiting the functionality and scope of use of the embodiments of the present invention.

[0084] An embodiment of the present invention provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements any of the above-mentioned methods for preventing probe card high-temperature test needle mark displacement.

[0085] Alternatively, the computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a compact disc read-only memory (CD-ROM), magnetic tape, a floppy disk, and an optical data storage device, etc.

[0086] In an exemplary embodiment, a computer program product or computer program is also provided, which includes computer instructions stored in a computer-readable storage medium. A processor of an electronic device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the electronic device to perform the method described above for preventing probe card high-temperature test needle mark displacement.

[0087] Computer program code for performing the operations of this invention can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0088] It should be understood that the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of methods and computer program products according to various embodiments of the present invention. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0089] The computer-readable storage medium provided in this invention can be, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this invention, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0090] The aforementioned computer-readable storage medium carries one or more programs, which, when executed by the electronic device, cause the electronic device to perform the method shown in the above embodiments.

[0091] The above description is merely a preferred embodiment of the present invention and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of disclosure in this invention is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-disclosed concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this invention.

[0092] It should be noted that the terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and represent a limitation on a specific order or sequence. Where appropriate, the order of use for similar objects can be interchanged so that the embodiments of this application described herein can be implemented in an order other than that shown or described.

[0093] Those skilled in the art will recognize that this invention can be implemented as a system, method, or computer program product. Therefore, this invention can be specifically implemented in the following forms: it can be entirely hardware, entirely software (including firmware, resident software, microcode, etc.), or a combination of hardware and software, generally referred to herein as a "circuit," "module," or "system." Furthermore, in some embodiments, this invention can also be implemented as a computer program product contained in one or more computer-readable media, which includes computer-readable program code.

[0094] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method for preventing probe card high temperature test needle mark shift, characterized in that, include: Acquire temperature distribution information of the probe card during high-temperature testing; Based on the temperature distribution information, the constant temperature blowing device is controlled to output a constant temperature airflow to the front of the probe card; The temperature parameters and airflow distribution of the constant-temperature airflow are dynamically adjusted according to the position change of the probe station chuck disk relative to the probe card.

2. The method of claim 1, wherein, The step of controlling the constant-temperature blowing device to output a constant-temperature airflow to the front of the probe card based on the temperature distribution information includes: The target temperature value of the constant-temperature airflow is determined based on the temperature distribution information. The constant temperature blowing device is controlled to output the constant temperature airflow to the front of the probe card according to the target temperature value.

3. The method of claim 2, wherein the method further comprises: The step of dynamically adjusting the temperature parameters and airflow distribution of the constant-temperature airflow based on the position change of the probe station chuck disk relative to the probe card includes: Monitor the real-time position change of the probe station chuck disk relative to the probe card; Based on the real-time position changes and the preset mapping relationship, the adjustment amount of the temperature parameters and airflow distribution of the constant temperature airflow is determined; The constant temperature air blowing device is controlled to adjust the constant temperature airflow based on the adjustment amount.

4. The method of claim 3, wherein the probe card is a probe card for testing a semiconductor wafer. Also includes: Obtain multiple preset position information of the probe station chuck disk relative to the probe card; Determine the temperature parameter adjustment amount and airflow distribution adjustment amount of the constant temperature airflow corresponding to each preset location information; Establish a correspondence between each preset location information and the corresponding temperature parameter adjustment amount and airflow distribution adjustment amount to form the preset mapping relationship.

5. The method of claim 1 to 4, wherein, The step of obtaining temperature distribution information of the probe card during high-temperature testing includes: Temperature data from multiple areas of the probe card are collected in real time by an array of temperature sensors located on the front of the probe card.

6. The method of claim 3, wherein the probe card is a probe card for testing a semiconductor wafer. The step of monitoring the real-time position change of the probe station chuck disk relative to the probe card includes: The system identifies the positional changes of the probe station chuck disk when it is located in the upper, middle, or lower half of the test wafer.

7. The method of claim 2, wherein the method further comprises: The target temperature value is not lower than the heating temperature value of the test wafer by the probe station chuck disk.

8. A system for preventing probe card high temperature test needle mark shift, comprising: include: The acquisition module is used to obtain temperature distribution information of the probe card during high-temperature testing; The control module is used to control the constant temperature blowing device to output a constant temperature airflow to the front of the probe card according to the temperature distribution information. The adjustment module is used to dynamically adjust the temperature parameters and airflow distribution of the constant temperature airflow based on the position change of the probe station chuck disk relative to the probe card.

9. An electronic device, comprising: The electronic device includes a processor coupled to a memory, the memory storing at least one computer program, the at least one computer program being loaded and executed by the processor to enable the electronic device to implement the method for preventing probe card high-temperature test needle mark displacement as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores at least one computer program, which, when executed by a processor, implements the method for preventing probe card high-temperature test needle mark displacement as described in any one of claims 1 to 7.

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