A micro-nano satellite module rapid integration method

Abstract

A kind of micro-nano satellite module rapid integration method belongs to the field of relay satellite platform, there is standardization backplane and standardization module, standardization backplane is provided with bus area and slot area, bus area includes uniform specification power bus and data bus, slot area is arranged with multiple standardization slots, standardization module is inserted into standardization slot.The structure of standardization slot is uniform, and a uniform standard data electrical interface is provided inside, each standardization slot corresponds to fixed physical port and logical address / node number, or unified address configuration is realized through slot coding, according to functional task requirement, select the standardization module that meets functional task requirement, and build the satellite system that meets functional task requirement.The present application significantly shortens the development cycle, greatly reduces the development cost, greatly improves the system flexibility and scalability, improves the system reliability and maintainability, and promotes standardization and industrialization.

Description

Technical Field

[0001] This invention belongs to the field of relay satellite platforms, specifically relating to a rapid integration method for micro-nano satellite modules. Background Technology

[0002] Microsatellites and nanosatellites (typically referring to small satellites weighing between 1 and 100 kilograms) have been widely used in Earth observation, communication relay, scientific experiments, and technology verification due to their advantages such as low development cost, flexible launch, and rapid technological updates. With the rise of commercial spaceflight, microsatellites and nanosatellites are transforming from technology verification platforms to operational application systems, placing higher demands on satellite development efficiency, cost control, and reliability.

[0003] However, the development of microsatellites and nanosatellites currently faces severe challenges: on the one hand, the market demands shorter development cycles and lower manufacturing costs; on the other hand, increasingly diversified mission requirements necessitate stronger on-orbit reconfiguration and upgrade capabilities. Traditional customized design models are no longer sufficient to meet these conflicting demands.

[0004] Currently, some modular design attempts have emerged in the field of micro- and nano-satellites, the most representative of which is the subsystem-level modular approach. This approach divides the satellite system into several large subsystem modules according to their functions, such as attitude control subsystem, power supply subsystem, and communication subsystem.

[0005] The specific implementation methods include: in terms of mechanical structure, each subsystem adopts an independent encapsulation structure and is mechanically fixed by screws; in terms of electrical connection, customized cable bundles are used for interconnection, but the interface definitions are not uniform; in terms of data communication, some use CAN bus or SpaceWire bus, but the protocol stack implementations are different; in terms of system integration, special interface adaptation and driver development are required for each module.

[0006] This approach improves design reusability to some extent, but due to the lack of a unified interface standard and plug-and-play mechanism, the compatibility and interchangeability between modules are limited, and the system integration complexity remains high. It fails to truly achieve the design goals of "rapid construction" and "on-orbit reconfiguration," thus hindering the mass production and large-scale application of micro- and nano-satellites. Specifically, the above approach has the following problems:

[0007] 1. Insufficient standardization of interfaces: Existing modular solutions lack unified standards in terms of mechanical interfaces, electrical interfaces and data protocols. Modules from different manufacturers and models cannot be directly interchanged, which limits the universality and selection range of modules.

[0008] 2. Lack of plug-and-play functionality: After the module is connected to the system, it requires manual configuration and driver installation, and cannot achieve automatic recognition and plug-and-play functionality, which increases the complexity of system integration and subsequent maintenance.

[0009] 3. High integration testing complexity: Due to inconsistent interfaces, the integration of each new module requires extensive interface adaptation and compatibility testing, which significantly extends the system integration cycle.

[0010] 4. Limited on-orbit maintenance capability: The existing design makes it difficult to support on-orbit module replacement and upgrades, which limits the satellite's mission life and functional expansion capabilities.

[0011] 5. Difficulty in achieving economies of scale: The modules are still highly customized, making it impossible to effectively reduce costs through large-scale mass production. Summary of the Invention

[0012] To address the aforementioned problems, this invention provides a rapid integration method for micro / nano satellite modules. The aim is to establish a complete modular and universal design system for micro / nano satellites. Through unified interface standards, plug-and-play mechanisms, and standardized components, this method achieves rapid construction, low-cost manufacturing, convenient on-orbit maintenance, and flexible functional expansion of micro / nano satellites. The technical solution adopted is as follows:

[0013] A rapid integration method for micro / nano satellite modules includes a standardized backplane and standardized modules. The standardized backplane has a bus area and a slot area. The bus area includes a power bus and a data bus of uniform specifications. The slot area has multiple standardized slots, and the standardized modules are inserted into the standardized slots.

[0014] The standardized slot has a uniform structure and is equipped with a standardized data electrical interface. Its main body is a square groove with a positioning hole at the center of the bottom of the groove. The data electrical interface is located next to the positioning hole. Guide grooves are provided on two opposite groove walls, and locking components are provided on two other opposite groove walls. The two locking components are symmetrically arranged near the groove opening.

[0015] The standardized module has guide ribs on its two opposite sides, which are inserted into two guide slots respectively. The bottom of the standardized module is equipped with a positioning pin, and a standardized connector is located next to the positioning pin. The positioning pin is inserted into the positioning hole, and the connector is connected to the data electrical interface.

[0016] Each standardized slot corresponds to a fixed physical port and logical address / node number, or a unified address configuration is achieved through slot coding.

[0017] The standardized modules include attitude control module, power management module, communication processing module, and payload module. Based on the functional mission requirements, standardized modules that meet the functional mission requirements are selected and inserted into standardized slots to quickly build a satellite system that meets the functional mission requirements.

[0018] Furthermore, the aforementioned method for rapid integration of micro-nano satellite modules further includes a data electrical interface with a unified standard for power supply voltage, pin definitions, connectors, and power supply redundancy and protection strategies. The data interface adopts the spacecraft bus standard as the underlying protocol for data communication between modules, specifying unified address allocation, communication frame format, and data transmission rules.

[0019] The data appliance interface is a J30J socket, and the connector is a J30J plug, which is inserted into the socket.

[0020] Furthermore, in the aforementioned method for rapid integration of micro-nano satellite modules, the positioning pins are conical or stepped, and the shape of the positioning holes is adapted to the positioning pins.

[0021] The positioning components include positioning pins and positioning holes, preferably positioned near the insertion endpoint and rearward relative to the guide components, to achieve precise alignment in the final stage of module insertion. The positioning components are preferably connected via a transition fit or a guide fit, using their mating end face or slot reference surface as a stop and limiting surface. Through physical contact, they jointly define the final axial and radial positioning of the module, ensuring consistent automatic engagement depth of the electrical connector.

[0022] Furthermore, in the aforementioned method for rapid integration of micro-nano satellite modules, the locking component is equipped with a retractable spring clip. When the standardized module is inserted downwards, the spring clip retracts. After the standardized module is docked with the standardized slot, the spring clip springs back and presses against the top of the standardized module.

[0023] The locking component can also be a standard screw locking mechanism, in which a spring clip quickly locks the module once it is pushed into place.

[0024] The aforementioned rapid integration method for micro / nano satellite modules further defines pins into unified power pin groups, return ground / shield ground pin groups, control / discrete quantity pin groups, and data signal pin groups, and sets redundant backup pins and wiring rules for critical power supplies and critical links. These wiring rules include: physical isolation of primary / backup pins within the connector matrix to prevent the propagation of single-point failures; equal-length symmetrical wiring for primary / backup links to maintain impedance consistency; and seamless switching of critical power supplies through parallel redundant circuits, thereby ensuring the module's electrical robustness in aerospace environments.

[0025] Furthermore, in the aforementioned method for rapid integration of micro-nano satellite modules, the standardized backplane is made of thick aluminum substrate or aluminum alloy.

[0026] Furthermore, in the aforementioned method for rapid integration of micro-nano satellite modules, the power bus is a 28V power bus with primary / backup redundant circuits, and the data bus is SpaceWire with a star or mesh topology.

[0027] Furthermore, in the aforementioned method for rapid integration of micro-nano satellite modules, the standardized module shell is made of carbon fiber composite material or aluminum alloy.

[0028] Furthermore, following the aforementioned rapid integration method for micro / nano satellite modules, system-level testing is conducted after the satellite system components are successfully integrated.

[0029] S1: Interface connectivity test: Verify the correctness of all electrical connections using dedicated test equipment.

[0030] S2: Power-on self-test and module identification test: When the system is powered on, the communication processing module should be able to enumerate and identify all online modules through the bus.

[0031] S3: Functional Joint Test: Simulates on-orbit processes to test attitude control and attitude determination accuracy, power distribution, communication link establishment and data transmission, and payload imaging and data downlink functions.

[0032] S4: Environmental adaptability test: Conduct thermal vacuum cycle test and mechanical vibration test to verify the system's working stability under extreme environments.

[0033] Furthermore, in the aforementioned method for rapid integration of micro-nano satellite modules, the mechanical vibration test is either sinusoidal or random vibration.

[0034] The beneficial effects of this invention are:

[0035] 1. Significantly improved development efficiency: Based on standard module libraries and unified interfaces, the construction of new satellites is like "building blocks", eliminating the need for repetitive customized design, interface coordination and debugging. The development cycle of micro and nano satellites is shortened and the overall efficiency is improved.

[0036] 2. Significantly reduced manufacturing costs: Standardized modules enable mass production on a large scale, fully leveraging economies of scale and reducing the manufacturing cost per satellite. Simultaneously, module reuse greatly reduces the investment in non-repetitive design, development, testing, and verification.

[0037] 3. Revolutionary Enhancement in System Flexibility: Thanks to a unified interface protocol and mechanical structure, the system can flexibly select and quickly combine the required modules from the module library according to different mission requirements, achieving "one satellite, multiple uses." More importantly, it supports "functional reconfiguration" in orbit by replacing modules, greatly enhancing the satellite's mission adaptability and application value.

[0038] 4. Enhanced Systemic Reliability: The modular design naturally creates fault isolation barriers, effectively limiting the failure of a single module to its own scope and preventing the entire satellite from failing. Overall system reliability is expected to improve by over 30%. Simultaneously, standardized production and testing processes ensure the consistency and high reliability of the modules themselves.

[0039] 5. On-orbit maintenance becomes possible: This invention is the first to systematically realize true on-orbit module replacement and maintenance capabilities at the micro-nano satellite level. Faults can be repaired or functions upgraded through simple plug-and-play operations, significantly extending the satellite's on-orbit lifespan and improving the value output of the entire mission cycle.

[0040] 6. Industrialization Promotion Effect: The unified interface standard proposed in this invention provides a foundation for collaboration between upstream and downstream industries, enabling different manufacturers to produce and provide compatible modules based on the standard, forming healthy competition and substitution, thereby promoting technological progress and cost optimization in the entire micro-nano satellite industry.

[0041] 7. Accelerated Technological Iteration: Because each functional module is relatively independent, the verification and application of new technologies can focus on a single module without redesigning the entire satellite. This greatly reduces the threshold and cost of on-orbit verification of new technologies, significantly accelerating the iterative innovation cycle of aerospace technology. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the standardized back panel main view structure;

[0043] Figure 2 This is a schematic diagram of the cross-sectional structure of standardized modules and standardized slots;

[0044] Figure 3 This is a schematic diagram of the tapered locating pin and locating hole structure;

[0045] Figure 4 This is a schematic diagram of the stepped locating pin and locating hole structure;

[0046] Figure 5 This is a top view diagram of the standardized slot structure;

[0047] Figure 6 yes Figure 2 Enlarged view of the center circle;

[0048] Among them, 1-standardized backplate, 2-busbar area, 3-standardized slot, 4-standardized module, 5-guide groove, 6-guide rib, 7-locking part, 8-positioning pin, 9-connector, 10-positioning hole, 11-data electrical interface. Detailed Implementation

[0049] The present invention will be described in detail with reference to specific embodiments.

[0050] A rapid integration method for micro / nano satellite modules, such as Figure 1 As shown, there are standardized backplanes and standardized modules. The standardized backplane is divided into a bus area and a slot area. The slot area has multiple standardized slots, and the bus area integrates printed power buses and data buses.

[0051] like Figure 2 , Figure 6 As shown, the standardized slots have a unified structure and are equipped with a unified data electrical interface. Each standardized slot corresponds to a fixed physical port and logical address / node number, or a unified address configuration is achieved through slot coding, thereby avoiding address conflicts caused by module replacement. At the same time, the data interface uniformly defines the meaning of data dictionaries / fields, heartbeat / status reporting mechanisms, error detection and retransmission / fault tolerance mechanisms, and timing constraints, enabling different functional modules to interoperate, be replaceable, and expandable under the same bus.

[0052] The standardized slot has a uniform structure and is equipped with a uniform standard data electrical interface. Its main body is a square groove with a positioning hole at the center of the bottom of the groove. The data electrical interface is located next to the positioning hole. Guide grooves are provided on two opposite groove walls, and locking components are provided on two other opposite groove walls. The two locking components are symmetrically arranged near the groove opening.

[0053] The standardized module has guide ribs on its two opposite sides, which are inserted into two guide slots respectively. The bottom of the standardized module is equipped with a positioning pin, and a standardized connector is located next to the positioning pin. The positioning pin is inserted into the positioning hole, and the connector is connected to the data electrical interface.

[0054] The data electrical interface features a unified standard for power supply voltage, pin definitions, connectors, and power supply redundancy and protection strategies. The data interface adopts the spacecraft bus standard as the underlying protocol for inter-module data communication, specifying unified address allocation, communication frame format, and data transmission rules.

[0055] The standardized modules include an attitude control module, a power management module, a communication processing module, and a payload module. All standardized modules have the same external structure and are inserted into standardized slots.

[0056] Based on different functional mission requirements, standardized modules that meet the functional mission requirements are selected and inserted into standardized slots. Standardized modules with different functions can be freely combined to quickly build a satellite system that meets the functional mission requirements.

[0057] Standardized slots and standardized modules adopt the same insertion and removal direction, the same docking reference, and the same positioning criteria, so that when the standardized module is inserted into place, it can simultaneously complete mechanical positioning, electrical connection engagement and data link establishment, thereby realizing the standardization, serialization and plug-and-play of modular systems.

[0058] Standardized modules unify standard external dimensions and envelope, mounting point positions and hole systems, guiding and positioning structures, and quick-locking mechanisms to ensure the accuracy, consistency, and convenience of connections between standardized modules. Standardized slots uniformly include guiding components, positioning components, locking components, and limiting / error-prevention components. Each component forms a coordinated "guiding-positioning-locking" relationship in the insertion and extraction direction to achieve repeatable positioning and reliable retention under blind-mating assembly conditions.

[0059] The insertion attitude defines the trajectory and orientation constraints of the module when it enters the slot: through the sliding engagement of the guide ribs on both sides of the module and the guide groove, the module's movement is confined to a single linear insertion axis, forcibly constraining the module's pitch, yaw, and lateral swing degrees of freedom during propulsion. The assembly coordinate system is the geometric reference for determining the module's precise position and vector direction in the entire satellite space: this coordinate system takes the geometric center of the slot or the center of the positioning hole as its origin, its Z-axis (depth direction) is defined by the physical contact surface between the module's reference surface and the backplate stop limiting surface, and its X / Y axes (planar direction) are determined by the line connecting the centers of the positioning pin holes and the backplate bus route. The critical interface positioning condition is the physical criterion for determining the completion of integration actions and the establishment of link synchronization: it is manifested by zero-gap contact between the module's reference surface and the stop limiting surface and the positioning pin fully entering the positioning hole; the standardized module shell is made of carbon fiber composite material or aluminum alloy, and a unified reference surface is formed through precision CNC machining; the flatness of the reference surface is specified to be no less than 0.02mm, and the perpendicularity error of the positioning feature relative to the reference surface should be less than 0.03mm. By strictly controlling geometric tolerances and surface roughness requirements, we ensure that different modules can achieve micron-level repeatability in the same standardized slot, thereby guaranteeing assembly consistency and on-orbit interchangeability between modules.

[0060] The guiding components include guide ribs (or guide rails) and guide grooves (or guide surfaces). The guide grooves are located on both sides of the standardized slot, and the guide ribs are located on both sides of the standardized module, with the guide ribs inserted into the guide grooves. The guiding components are located at the beginning of the insertion stroke and are used to complete coarse alignment, attitude constraint, and anti-skew support in the early stage of module insertion, thereby improving blind insertion capability and reducing the probability of assembly jamming. The guiding components can limit the rotational degree of freedom and lateral swing degree of freedom of the module around the insertion / removal axis, so that the module maintains a stable attitude during the advancement process.

[0061] The positioning components include positioning pins and positioning holes, such as... Figure 3 As shown, the locating pin is tapered, and the shape of the locating hole is adapted to the locating pin; as Figure 4 As shown, the locating pin is stepped, and the shape of the locating hole is adapted to the locating pin. Their positional relationship is preferably set near the insertion endpoint and positioned behind the guide member, for precise positioning during the module's positioning phase. The connection relationship of the locating member is preferably a transition fit or a guide fit, and it defines the final positioning position together with the stop and limit surface. This ensures the repeatability of the module's positioning accuracy in three-dimensional space (especially along the insertion / removal direction and the lateral direction), avoiding cumulative errors caused by relying solely on the screw hole system.

[0062] The locking mechanism uses a spring clip. When the standardized module is inserted downwards, the spring clip retracts. After the standardized module is aligned with the standardized slot, the spring clip springs back and presses against the top of the standardized module. After the standardized module is pushed into place, the spring clip quickly locks it in place, creating a retaining force.

[0063] The limiting / error-prevention components preferably include a slot travel limiting surface and a module stop surface to limit the insertion stroke and engagement depth. Furthermore, anti-reverse insertion and anti-misalignment assembly can be achieved through asymmetrical arrangement of guide rails / positioning components, staggered pins, key structures, etc., to improve assembly safety and consistency. Thus, the mechanical interface achieves "insertionability and controlled posture" through guiding components, "precise and repeatable positioning" through positioning components, and "position retention and vibration resistance reliability" through locking components, collectively ensuring the accuracy, consistency, and convenience of the mechanical connection.

[0064] The data electrical interface uses a unified standard for power supply voltage, pin definitions, connector types, and power supply redundancy and protection strategies to achieve consistency and standardization in module power supply and electrical connection. The data electrical interface uses J30J series rectangular connectors. J30J series plugs (e.g., J30J-41TK) are installed on standardized modules, and J30J series sockets are installed on standardized backplanes for automatic engagement and connection completion when the module is inserted into position. To eliminate manual intervention and improve integration accuracy, the connector's mounting reference, mating direction, and mating depth are strictly consistent with the insertion / removal direction and positioning criteria of the mechanical guide / positioning system. Physically, the connector's mounting coordinate system is precisely aligned with the module's mechanical guide coordinate system, and its insertion / removal center axis is strictly parallel to the center axes of the guide ribs and guide grooves, ensuring that the connector pins do not skew when the module is pushed in along the guide rail. Simultaneously, the connector's rated engagement length is highly matched to the mechanical positioning stroke. When the module's reference surface touches the stop limit surface and reaches the mechanical positioning state, the connector simultaneously reaches its rated engagement depth, ensuring the reliability of the electrical connection and the effectiveness of power supply redundancy protection. This automatic engagement mechanism utilizes a two-stage precision control of "guidance and positioning" provided by the mechanical interface, enabling the connector to automatically align and engage before the insertion endpoint as the module is pushed in. This simplifies complex cable connections into a single module insertion and removal action, significantly reducing manual wiring, lowering the probability of mis-insertion, and improving integration convenience. Furthermore, in addition to the J30J series rectangular connectors, other circular or high-density connectors meeting the reliability requirements of aerospace environments can be used for the electrical connectors. Besides SpaceWire, CAN, and 1553B, Ethernet or other aerospace data link standards can be used for the data bus, but all must meet the slot-based standard and plug-and-play management mechanism consistent with the mechanical and electrical data interfaces.

[0065] If the data electrical interface is a custom design, the following standardization method is preferred without changing the framework of "unified connector carrier + unified pin definition": use the backplane slot as a unified electrical port, solidify the partitioning, numbering and mapping rules of power / ground / data / redundant pins to form a unified interface specification; the interface specification is consistent across different modules, and can be set with universal reserved pins to be compatible with module upgrades; at the same time, the power interface specifies redundant power supply topology (e.g., main / backup power supply), power integrity requirements such as current limiting / surge suppression / overvoltage protection, as well as shielding grounding and return path rules to meet electromagnetic compatibility, so that any module that complies with the specification can achieve consistent power supply and consistent electrical connection in any slot.

[0066] The data interface adopts the mature spacecraft bus standard as the underlying protocol for data communication between modules, covering but not limited to SpaceWire, CAN or 1553B, and clearly defines the unified address allocation, communication frame format and data transmission rules.

[0067] The data electrical interface includes a data interface and an electrical interface. The data interface and the electrical interface share the same connector carrier and fixed pin grouping, and also share the same slot insertion and removal direction and positioning conditions with the mechanical interface. In other words, once the module is pushed into place and mechanically locked, the physical connection of the data link is naturally formed, which lays the foundation for bus enumeration, module identification, and automatic configuration after power-on.

[0068] The plug-and-play mechanism is implemented through the aforementioned unified interface: After the system is powered on, the main control module (usually the communication processing module) automatically identifies the newly connected module based on a unified identification and enumeration process, completes the binding or allocation according to the unified address rules, automatically loads the corresponding driver and configuration parameters, and incorporates them into system management and task scheduling, thereby realizing rapid module-level replacement, flexible combination configuration and unified operation and maintenance.

[0069] The standardized backplane serves as the physical carrier and interconnection core for the aforementioned unified interface definition. Its structure preferably includes a carrier substrate, slot array, connector array, power bus, and data bus. Furthermore, the backplane uses a thick aluminum substrate or aluminum alloy structure as a load-bearing and rigidity-ensuring component, and integrates / prints the power bus and data bus on it. The power bus is preferably a 28V power bus with primary / backup redundancy circuits, and the data bus is preferably SpaceWire and can adopt a star or mesh topology (or CAN or 1553B topology) to achieve unified power supply and unified interconnection for multiple modules.

[0070] Multiple J30J series sockets are precisely installed on the standardized backplane, corresponding one-to-one with each slot. Each slot also has pre-drilled mounting screw holes and locating pin holes, ensuring standardized guidance, positioning, and locking of the modules on the backplane. Therefore, the uniformity of the standardized backplane is superior in that: the guiding / positioning / locking relationships of its slots are consistent; its power and data bus definitions are consistent; and its connector models, mounting references, and pin mappings are consistent. This allows different functional modules to be interchangeably assembled and consistently connected on the same backplane, and the module load is transferred to the satellite platform structure through the backplane.

[0071] During system integration, the selected module is preferably pushed into the corresponding slot on the backplane along the guide rail and locked in place. The connector will then automatically engage to complete the electrical connection and establish the data link. After integration, interface connectivity tests, power supply self-tests, and bus enumeration identification tests can be performed to verify the effectiveness of the standardized backplane and unified interface, and to support the rapid replacement and expansion of subsequent modules.

[0072] In addition to spring clips and screws, locking components can also be rotary clamping, lever quick lock, magnetic locking, shape memory alloy actuation locking, or electromagnetic locking; in addition to guide rails and positioning pins, guiding and positioning can also be conical positioning, keyway positioning, magnetic guidance, or vision-assisted positioning, but all should meet the requirements of unified benchmark, unified positioning criterion, and repeatable positioning.

[0073] Attitude control module manufacturing: Utilizing a ten-layer high-density PCB, it integrates a three-axis magnetometer HMC1043, a fiber optic gyroscope, an ARM Cortex-R5 core-based flight control processor, and drive circuitry. The reaction wheel and magnetic torque converter serve as external actuators, connecting to the module via a standard interface. The module housing is made of carbon fiber composite material, precision-machined using CNC machining, and features stainless steel rails and standard J30J-41TK rectangular electrical connectors mounted on the sides.

[0074] Power management module manufacturing: The core PCB integrates a GaN-based MPPT circuit, a battery management chip, and a multi-output power distribution switch. The battery pack uses high-energy-density 18650 lithium-ion cells and is connected to the motherboard via a flexible circuit board. The casing features heat dissipation fins and is made of aluminum alloy. The interface also uses J30J series connectors, providing main and backup power outputs.

[0075] Communication processing module manufacturing: A SoC (such as Xilinx Zynq-7000) is used as the main processor, integrating an S-band transceiver chip (such as AD9361). The PCB features a 12-layer blind / buried via design. The casing is made of aluminum alloy with a conductive anodizing treatment to meet electromagnetic compatibility requirements.

[0076] Standardized backplane manufacturing: The backplane uses a thick aluminum substrate with the power bus (28V) and data bus (SpaceWire) printed on it. The data bus uses a star or mesh topology. Multiple J30J series sockets are precisely mounted on the backplane, and mounting screw holes and locating pin holes are reserved for each module.

[0077] System integration and testing:

[0078] Based on the requirements of the remote sensing imaging mission, a high-resolution CMOS area array camera was selected as the payload module. All selected modules (attitude control, power supply, communication, and payload) were precisely pushed into the corresponding slots on the backplate along the guide rails. After hearing a locking sound, the auxiliary locking screws were tightened. The connectors then automatically engaged, completing the electrical connection.

[0079] After integration, perform system-level testing:

[0080] 1. Interface connectivity test: Verify the correctness of all electrical connections using dedicated testing equipment.

[0081] 2. Power-on self-test and module identification test: When the system is powered on, the communication processing module should be able to enumerate and identify all online modules through the bus.

[0082] 3. Functional Joint Testing: Simulate on-orbit processes to test attitude control and attitude determination accuracy, power distribution, communication link establishment and data transmission, payload imaging and data downlink, and other functions.

[0083] 4. Environmental adaptability test: Conduct thermal vacuum cycle test and mechanical vibration test (sinusoidal vibration, random vibration) to verify the system's working stability under extreme environments.

[0084] Test results show that all modules of the system work together normally, and the functional performance indicators meet the requirements of the task specification. The integration process is smooth, which verifies the effectiveness and superiority of this design method.

Claims

1. A method for rapid integration of micro / nano satellite modules, characterized in that, It has a standardized backplane and standardized modules. The standardized backplane is set with a bus area and a slot area. The bus area includes a power bus and a data bus of uniform specifications. The slot area has multiple standardized slots. Standardized modules are inserted into standardized slots. The standardized slot has a uniform structure and is equipped with a standardized data electrical interface. The main body of the standardized slot is a square groove with a positioning hole at the center of the bottom of the groove. The data electrical interface is located next to the positioning hole. Guide grooves are provided on two opposite groove walls, and locking components are provided on two other opposite groove walls. The two locking components are symmetrically arranged near the groove opening. The standardized module has guide ribs on its two opposite sides, which are inserted into two guide grooves respectively. The bottom of the standardized module is equipped with a positioning pin, and a standardized connector is set next to the positioning pin. The positioning pin is inserted into the positioning hole, and the connector is connected to the data electrical interface. Each standardized slot corresponds to a fixed physical port and logical address / node number, or a unified address configuration is achieved through slot coding; The standardized modules include attitude control module, power management module, communication processing module, and payload module. Based on the functional mission requirements, standardized modules that meet the functional mission requirements are selected and inserted into standardized slots to construct a satellite system that meets the functional mission requirements.

2. The rapid integration method for micro / nano satellite modules according to claim 1, characterized in that, The data electrical interface has a unified standard for power supply voltage, pin definitions, connectors, and power supply redundancy and protection strategies; the data interface adopts the spacecraft bus standard as the underlying protocol for data communication between modules, and specifies unified address allocation, communication frame format and data transmission rules; The data appliance interface is a J30J socket, and the connector is a J30J plug, which is inserted into the socket.

3. The rapid integration method for micro / nano satellite modules according to claim 1, characterized in that, The locating pin is conical or stepped, and the shape of the locating hole is adapted to the locating pin.

4. The rapid integration method for micro / nano satellite modules according to claim 1, characterized in that, The locking component has a retractable spring clip. When the standardized module is inserted downwards, the spring clip retracts. After the standardized module is aligned with the standardized slot, the spring clip springs back and presses against the top of the standardized module.

5. The rapid integration method for micro / nano satellite modules according to claim 2, characterized in that, The pins are defined as a unified power pin group, return ground / shield ground pin group, control / discrete quantity pin group, and data signal pin group, and redundant backup pins for critical power supplies and critical links and their wiring rules are set.

6. The rapid integration method for micro / nano satellite modules according to claim 1, characterized in that, The standardized backplate is made of thick aluminum substrate or aluminum alloy.

7. The rapid integration method for micro / nano satellite modules according to claim 1, characterized in that, The power bus is a 28V power bus with primary / backup redundant circuits, and the data bus is SpaceWire with a star or mesh topology.

8. The rapid integration method for micro / nano satellite modules according to claim 1, characterized in that, The standardized module housing is made of carbon fiber composite material or aluminum alloy.

9. The rapid integration method for micro / nano satellite modules according to claim 1, characterized in that, After the satellite system components are successfully assembled, system-level testing will be conducted: S1: Interface connectivity test: Verify the correctness of all electrical connections using dedicated test equipment; S2: Power-on self-test and module identification test: When the system is powered on, the communication processing module should be able to enumerate and identify all online modules through the bus; S3: Functional Joint Test: Simulates on-orbit process to test attitude control and attitude determination accuracy, power distribution, communication link establishment and data transmission, payload imaging and data downlink functions; S4: Environmental adaptability test: Conduct thermal vacuum cycle test and mechanical vibration test to verify the system's working stability under extreme environments.

10. A rapid integration method for micro / nano satellite modules according to claim 9, characterized in that, Mechanical vibration tests involve sinusoidal or random vibrations.

Images