Method for solving warping of ceramic-based printed board and related equipment

Abstract

The invention discloses a method for solving warping of a ceramic-based printed board and related equipment, and aims to overcome the defect of warping of a ceramic substrate caused by lack of an automatic copper foil balancing means in the prior art. The method comprises the following steps: firstly, acquiring copper area data of top and bottom layer patterns of the ceramic substrate and calculating a residual copper rate difference value; judging whether the difference value exceeds a preset threshold value or not; and if the residual copper rate exceeds the threshold value, automatically generating an auxiliary copper-clad pattern in a non-effective circuit area, then recalculating the difference value, and circulating the process until the residual copper rate difference value meets the threshold value requirement, thereby automatically balancing the stress of the inner layer and the outer layer, and fundamentally inhibiting the warping of the plate.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, specifically to a solution for warping of ceramic-based printed circuit boards and related equipment. Background Technology

[0002] Ceramic-based printed circuit boards (PCBs) have become key components in high-power electronics, aerospace, and automotive electronics due to their excellent thermal conductivity and insulation. However, during their manufacturing process, the significant difference in the coefficients of thermal expansion between metallic copper (approximately 17 ppm / ℃) and the ceramic substrate (approximately 7 ppm / ℃) generates substantial thermal stress within the PCB when subjected to high-temperature processes exceeding 300℃. Uneven distribution of copper foil across the top and bottom layer circuit patterns can lead to stress imbalance, ultimately causing PCB warping.

[0003] Actual measurements show that this type of warpage often exceeds 0.3 mm / m, while current high-precision surface mount equipment typically requires a warpage tolerance of less than 0.15 mm for printed circuit boards. Excessive warpage directly leads to laser cutting positioning deviations and component misalignment. According to industry data, the misalignment rate can be as high as 12%, severely restricting product yield and reliability.

[0004] To address this problem, existing technologies often employ the following methods: First, mechanical post-correction can easily damage the brittle ceramic matrix, leading to a significant drop in yield. Second, adding reinforcing materials such as steel sheets to the structure to suppress deformation significantly increases costs and worsens heat dissipation performance. Third, relying on the experience of process engineers to repeatedly adjust parameters lacks quantitative standards, resulting in long trial-and-error cycles and low efficiency. None of these solutions fundamentally optimize the design through automation to balance the stresses of the inner and outer layers, thus their effectiveness is limited and their costs are high. Summary of the Invention

[0005] The purpose of this invention is to provide a solution and related equipment for ceramic-based printed circuit board warping, so as to overcome the shortcomings of the prior art in causing ceramic substrate warping due to the lack of automated copper foil balancing methods.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: In a first aspect, the present invention provides a solution to the warping of ceramic-based printed circuit boards, including: Obtain the copper area data of the top and bottom layers of the ceramic-based printed circuit board to be processed; Based on copper area data, the difference in residual copper rate between the top and bottom layers is calculated to quantitatively assess the degree of internal stress imbalance caused by uneven distribution of copper foil between the top and bottom layers. Determine whether the difference in residual copper rate exceeds a preset threshold; If the residual copper rate difference exceeds the preset threshold, an auxiliary copper plating pattern is generated to adjust the copper foil distribution area of ​​the corresponding layer. The residual copper rate difference after generating the auxiliary copper plating pattern is calculated, and the residual copper rate difference is repeatedly checked to see if it exceeds the preset threshold until the residual copper rate difference does not exceed the preset threshold.

[0007] The calculation of the residual copper ratio difference between the top-level and bottom-level patterns includes: The copper area data of the top-level graphic is stored in the first temporary file; The copper area data of the underlying graphic is stored in a second temporary file; Based on the data stored in the first temporary file and the second temporary file, the difference between the residual copper rate of the top layer and the residual copper rate of the bottom layer is calculated to obtain the residual copper rate difference.

[0008] The calculation method for the residual copper rate of the top layer is as follows: Top layer residual copper ratio = (S1 + X) / d In the formula, S1 is the top copper area, X is the top auxiliary copper area, and d is the panel area.

[0009] The calculation method for the residual copper ratio of the bottom layer is as follows: Underlying copper residue ratio = (S2 + Y) / d In the formula, S2 is the area of ​​the bottom copper layer, Y is the area of ​​the bottom auxiliary copper layer, and d is the area of ​​the panel.

[0010] The preset threshold is 1%.

[0011] The auxiliary copper-clad pattern is generated in the non-functional circuit regions of the top layer pattern and / or the bottom layer pattern.

[0012] The auxiliary copper-clad pattern includes copper strips and / or cut channels.

[0013] In a second aspect, the present invention provides a ceramic-based printed circuit board warpage resolution system, comprising: The data acquisition module is used to acquire the copper area data of the top and bottom layers of the ceramic-based printed circuit board to be processed. The difference calculation module is used to calculate the difference in residual copper rate between the top layer and the bottom layer based on copper area data; The judgment module is used to determine whether the difference in residual copper rate exceeds a preset threshold. The pattern generation module is used to generate an auxiliary copper plating pattern if the residual copper rate difference exceeds a preset threshold, calculate the residual copper rate difference after generating the auxiliary copper plating pattern, and repeatedly judge whether the residual copper rate difference exceeds the preset threshold until the residual copper rate difference does not exceed the preset threshold.

[0014] Thirdly, the present invention provides a computer device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the ceramic-based printed circuit board warpage solution as described above.

[0015] Fourthly, the present invention provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the ceramic-based printed circuit board warpage solution as described above.

[0016] Compared with the prior art, the present invention has the following beneficial technical effects: Firstly, this invention provides a solution to warpage in ceramic-based printed circuit boards. It acquires copper area data from the top and bottom layers and calculates the residual copper ratio difference to quantify warpage risk. The system automatically compares this difference with a preset threshold. If the threshold is exceeded, an auxiliary copper-clad pattern is automatically generated for balancing, and the assessment is recalculated. This process is repeated until the requirements are met. The entire process requires no human intervention, achieving automatic monitoring, judgment, and dynamic adjustment of copper foil distribution, thus systematically solving the warpage problem caused by the lack of automated balancing methods.

[0017] Secondly, this invention provides a ceramic-based printed circuit board (PCB) warpage resolution system. Through a modular architecture, it achieves full automation of the copper foil balancing process. The data acquisition module automatically collects copper area data from the top and bottom layers; the difference calculation module automatically performs quantitative analysis of the residual copper rate difference; the judgment module automatically performs threshold comparison and decision-making; and the graphics generation module automatically performs graphics adjustment and iterative optimization based on the decision results. These modules work collaboratively to form a closed-loop control system that requires no manual intervention, achieving an automated and quantitative solution to the ceramic substrate warpage problem.

[0018] Thirdly, the present invention provides a computer device that, through a processor executing a specific computer program, can efficiently implement the steps of the method of the present invention. When performing data processing tasks, the computer device can accurately perform numerical calculations and logical judgments, avoiding errors caused by human factors. At the same time, since the computer program has high stability and reliability, it can ensure the accuracy and consistency of the data processing results.

[0019] Fourthly, the present invention provides a computer-readable storage medium. By programming the steps of the method of the present invention into a computer program and storing it on the computer-readable storage medium, users can easily load these programs onto any compatible computer device and execute them without rewriting or converting the code, which greatly improves the convenience and flexibility of program execution. Attached Figure Description

[0020] Figure 1 This is a flowchart illustrating a solution to the warping problem of a ceramic-based printed circuit board in an embodiment of the present invention.

[0021] Figure 2 This is a schematic diagram of the top layer of the ceramic substrate printing plate in an embodiment of the present invention. In the figure, (a) is the original engineering file template and (b) is the engineering file template using this method.

[0022] Figure 3 This is a schematic diagram of the bottom layer pattern of the ceramic substrate printing plate in an embodiment of the present invention. In the figure, (a) is the original engineering file template and (b) is the engineering file template using this method.

[0023] Figure 4 This is a schematic diagram of a ceramic-based printed circuit board warpage resolution system according to an embodiment of the present invention. Detailed Implementation

[0024] Ceramic-based printed circuit boards (PCBs) are widely used in high-end electronics due to their high thermal conductivity and insulation. However, because of the significant difference in the coefficients of thermal expansion between copper and ceramic materials, uneven distribution of copper foil on the top and bottom layers during manufacturing can lead to board warping due to stress imbalance, sometimes exceeding 0.3 mm / m. This fails to meet the stringent flatness requirements (typically <0.15 mm) of current surface mount technology (SMT) processes. Traditional methods such as mechanical straightening, adding reinforcing materials, or relying on experience-based parameter tuning have inherent drawbacks, including damaging the substrate, increasing costs, low efficiency, and inconsistent results. Therefore, there is an urgent need for a solution that can fundamentally and automatically optimize copper foil distribution to balance stress.

[0025] Based on the above background, this invention proposes a solution and related equipment for warpage in ceramic-based printed circuit boards. By acquiring and processing the copper area data of the top and bottom layers, the residual copper ratio difference is accurately calculated to achieve a quantitative assessment of warpage risk. The calculation results are compared with preset thresholds, and when the threshold is exceeded, the automatic generation and iterative optimization of auxiliary copper foil patterns are triggered. The entire process forms an autonomous monitoring, decision-making, and adjustment closed loop, eliminating reliance on manual experience and post-correction methods, thereby systematically achieving automated and precise balance of copper foil distribution.

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Reference Figure 1 The image shows a specific embodiment of the ceramic-based printed circuit board warpage solution provided by the present invention, which includes the following steps: Obtain the copper area data of the top and bottom layers of the ceramic-based printed circuit board to be processed; Based on copper area data, the difference in residual copper rate between the top and bottom layers is calculated to quantitatively assess the degree of internal stress imbalance caused by uneven distribution of copper foil between the top and bottom layers. Determine whether the difference in residual copper rate exceeds a preset threshold; If the residual copper rate difference exceeds the preset threshold, an auxiliary copper plating pattern is generated to adjust the copper foil distribution area of ​​the corresponding layer. The residual copper rate difference after generating the auxiliary copper plating pattern is calculated, and the residual copper rate difference is repeatedly checked to see if it exceeds the preset threshold until the residual copper rate difference does not exceed the preset threshold.

[0028] In this specific embodiment, obtaining the copper area data of the top and bottom layers of the ceramic-based printed circuit board to be processed is the fundamental prerequisite for performing all subsequent quantitative analysis and automated adjustment operations. Based on the obtained copper area data, the difference in residual copper rate between the top and bottom layers is calculated. The core function of this calculation is to directly quantify the degree of internal stress imbalance caused by the uneven distribution of copper foil between the top and bottom layers, transforming the originally qualitative description of warpage risk into a precise quantitative indicator, thereby directly and objectively reflecting the degree of uneven distribution of copper foil between the top and bottom layers.

[0029] Determining whether the residual copper rate difference exceeds a preset threshold constitutes the core decision-making step of this method. This preset threshold is a pre-set allowable limit for internal stress balance based on the material characteristics, process requirements, and warpage control targets of the ceramic-based printed circuit board. It directly determines whether the system needs to initiate a copper foil distribution balancing intervention procedure. If the residual copper rate difference is confirmed to exceed the preset threshold, an auxiliary copper plating pattern is generated. The direct technical effect of this auxiliary copper plating pattern is to increase the copper foil distribution in a specific area, adjusting the copper area composition ratio of the current layer (top or bottom layer). By adjusting the copper area composition of a specific layer, the identified internal stress imbalance is actively corrected, thereby improving the uneven distribution of copper foil between the top and bottom layers.

[0030] Subsequently, the difference in residual copper ratio between the top and bottom layers after generating the auxiliary copper-clad pattern is recalculated, and the step of "judging whether the difference in residual copper ratio exceeds the preset threshold" is repeated until the calculated difference in residual copper ratio does not exceed the preset threshold. This cyclical process realizes dynamic feedback and iterative optimization of the copper foil distribution between the top and bottom layers of the ceramic-based printed circuit board. Its synergistic effect is specifically manifested as follows: the initial execution of the "copper area data acquisition - residual copper ratio difference calculation - threshold judgment" process is used to identify the unbalanced state of the copper foil distribution between the top and bottom layers; while the closed-loop process consisting of "auxiliary copper-clad pattern generation - residual copper ratio difference recalculation - threshold re-judgment" continuously and automatically corrects the above-mentioned unbalanced state. The termination condition of the entire iterative process, that is, the difference in residual copper ratio does not exceed the preset threshold, essentially indicates that the internal stress of the top and bottom layers has reached a balanced state, thereby suppressing the warping deformation of the board from the root.

[0031] The above steps are sequentially linked and mutually supportive, forming a complete automated control loop. This automated control loop systematically replaces the traditional mode of relying on human experience and manual adjustment in existing technologies, ensuring that the stress within the ceramic-based printed circuit board can be automatically balanced during the manufacturing and design stage, thereby improving the structural stability and reliability of the ceramic-based printed circuit board.

[0032] In another specific embodiment of the present invention, the solution for warpage of ceramic-based printed circuit boards is further clarified, including the details of calculating the residual copper ratio difference, parameter definitions, auxiliary copper plating pattern requirements, and automated implementation scheme, as follows: When calculating the residual copper ratio difference between the top and bottom layers, the copper area data of the top layer pattern needs to be stored in a first temporary file. In this specific embodiment, the copper area data of the top layer pattern is stored in the temporary file "gtl.cu_t". At the same time, the copper area data of the bottom layer pattern is stored in a second temporary file. In this specific embodiment, the copper area data of the bottom layer pattern is stored in the temporary file "gbl.cu_t". Then, the residual copper ratio difference is calculated based on the data in these two temporary files, and this residual copper ratio difference is defined as the difference between the residual copper ratio of the top layer and the residual copper ratio of the bottom layer.

[0033] The residual copper rate of the top layer is calculated according to the formula "Residual copper rate of the top layer = (S1 + X) / d", where S1 is the copper area of ​​the top layer, X is the auxiliary copper area of ​​the top layer, and d is the panel area. The residual copper rate of the bottom layer is calculated according to the formula "Residual copper rate of the bottom layer = (S2 + Y) / d", where S2 is the copper area of ​​the bottom layer, Y is the auxiliary copper area of ​​the bottom layer, and d is the panel area, to ensure that the calculation basis of the top and bottom layers is consistent.

[0034] In this embodiment, the preset threshold is specifically 1%. The auxiliary copper plating pattern is only generated in non-effective circuit areas within the top and / or bottom layer patterns, and the auxiliary copper plating pattern includes copper strips and / or cut channels. The core principle of this invention is to balance the internal stress of the ceramic substrate by reducing the difference in residual copper rates between the top and bottom layers. Based on this principle, this invention also developed a dedicated script program based on Genesis2000. The execution flow of this program consists of three steps: The first step is to perform process-balanced copper pouring on the areas outside the effective areas of the top and bottom layers of the ceramic substrate according to the established rules. The second step is to calculate the copper area of ​​the top layer and record it in the temporary file "gtl.cu_t", calculate the copper area of ​​the bottom layer and record it in the temporary file "gbl.cu_t", and then calculate the residual copper rate of each layer according to the above calculation formulas for the residual copper rate of the top layer and the residual copper rate of the bottom layer. Then, these values ​​are substituted into the formula "(S1+X) / d-(S2+Y) / d<1%" for automatic checking and judgment, and the copper pouring amount is calculated in reverse to see if it meets the conditions. Where S1 is the copper area of ​​the top layer, S2 is the copper area of ​​the bottom layer, X is the copper pouring area of ​​the top layer with added process, Y is the copper pouring area of ​​the bottom layer with added process, and d is the panel area. The third step involves determining if the conditions are met, then the copper plating operation is stopped. If the conditions are not met, the existing copper plating is deleted, and the residual copper rate difference value reported by the system is fed back to the copper plating rules. The rule parameters are then readjusted, and the above operation is repeated until the conditions are met and the residual copper rate difference is reduced to below 1%. All parameters in this script have clearly defined input interfaces, and the entire process is fully automated, requiring no manual calculation or operation.

[0035] To make the solution to the warpage problem of ceramic-based printed circuit boards provided by the present invention and its beneficial effects clearer, a complete preparation process of a ceramic-based printed circuit board will be described below.

[0036] In this specific embodiment, when preparing the ceramic-based printed circuit board, the production process is carried out according to the following steps: material preparation, pattern transfer (negative phase film), acid etching, sandblasting, screen printing of solder resist, inkjet printing of characters, hot air leveling, flying probe testing, finished product cleaning, laser cutting, and finished product inspection. At the same time, the warpage solution of the present invention is introduced in the early stage of preparation to assist in production.

[0037] In the material preparation stage, standard copper foil sheets are selected or custom-cut according to design requirements; in the pattern transfer stage, negative film is used, and CCD exposure is used to ensure accuracy, while marking the front and back of the sheet to avoid confusion, and ensuring that the edge of the sheet does not enter the dotted line area of ​​the film; in the acid etching stage, the side etching amount is precisely controlled to form the required circuit pattern; in the sandblasting stage, the copper surface is roughened to enhance the adhesion of the subsequent solder mask layer; in the screen printing of solder mask, the alignment accuracy of the solder mask layer is ensured, the development is clean, and the solder mask layer does not fall off after curing and reaches the specified hardness requirements; in the inkjet printing stage, complete and clear text markings are processed on the surface of the printed circuit board; in the hot air leveling stage, the solderability and corrosion resistance of the copper surface are improved; in the flying probe testing stage, all electrical performance of the pattern on the board is ensured to pass the test; in the finished product cleaning stage, impurities are removed from the surface of the board; in the laser cutting stage, alignment accuracy is ensured to guarantee product dimensions; in the finished product inspection stage, all appearance indicators are ensured to meet the requirements.

[0038] Ceramic-based printed circuit boards prepared by traditional methods often suffer from warping problems due to uneven distribution of copper foil on the top and bottom layers, with residual copper rates varying by up to 12%. This is especially true for ceramic boards coated using electroless nickel-gold and hot air leveling methods, which result in poor production stability.

[0039] After introducing the method provided by this invention, the difference in residual copper rate can be stably controlled within 0.4% by automatically calculating and adjusting the copper pouring through the script program.

[0040] Reference Figure 2 and Figure 3 As shown, Figure 2 The top layer graphic of the ceramic substrate stencil is shown in Figure (a), which is the original project file template without using this method, and Figure (b) is the project file template after using this method. It can be seen that the non-effective area of ​​the top layer has been enhanced with a reasonable auxiliary copper-clad graphic. Figure 3 The bottom layer of the ceramic substrate printing plate is shown in Figure (a), which is the original project file template without using this method, and Figure (b) is the project file template after using this method. The bottom layer also achieves copper foil distribution balance through auxiliary copper plating.

[0041] To further verify the effectiveness, three batches of ceramic plates coated with the present invention, each consisting of 100 plates, were produced using the method of the present invention, for both electroless nickel-gold ceramic plates and hot air leveling ceramic plates. The statistical results are shown in the table below:

[0042] As can be seen from the comparison, the method of the present invention has significant advantages in terms of production efficiency, product qualification rate and cost control.

[0043] This invention addresses the warpage problem of ceramic-based printed circuit boards (PCBs) by dynamically matching process-assisted patterns to reduce the area difference between the top and bottom copper foil layers and balance internal stress. Based on an algorithm independently developed using the Genesis2000 platform, it automatically generates auxiliary copper-clad patterns according to the characteristics of the ceramic substrate, eliminating the need for human intervention and avoiding human error. The addition of copper-clad strips and cutting channels in the top and bottom templates achieves both uniform copper foil distribution and ensures synergy with subsequent processing steps. Compared to existing technologies, this invention, relying on automated programs to dynamically match copper foil distribution, reduces product warpage and effectively improves product structural stability. The entire copper foil adjustment process is fully automated, requiring no additional correction steps, simplifying the process flow and significantly shortening the production cycle. It is not limited by the thickness, size, or coating method of the ceramic substrate and is applicable to the production of various types of ceramic-based PCBs, making it widely applicable.

[0044] In a specific embodiment of the present invention, a ceramic-based printed circuit board warpage resolution system is also provided, referring to... Figure 4 As shown, it includes: The data acquisition module is used to acquire the copper area data of the top and bottom layers of the ceramic-based printed circuit board to be processed. The difference calculation module is used to calculate the difference in residual copper rate between the top layer and the bottom layer based on copper area data; The judgment module is used to determine whether the difference in residual copper rate exceeds a preset threshold. The pattern generation module is used to generate an auxiliary copper plating pattern if the residual copper rate difference exceeds a preset threshold, calculate the residual copper rate difference after generating the auxiliary copper plating pattern, and repeatedly judge whether the residual copper rate difference exceeds the preset threshold until the residual copper rate difference does not exceed the preset threshold.

[0045] In this specific embodiment, the data acquisition module automatically collects copper area data of the top and bottom layers of the ceramic substrate printed circuit board to be processed, providing an accurate input source for subsequent quantitative analysis. The difference calculation module, based on the copper area data provided by the data acquisition module, calculates the residual copper rate difference between the top and bottom layers, transforming the physical differences in copper foil distribution into a quantifiable and comparable single numerical indicator. The judgment module receives the residual copper rate difference output by the difference calculation module and compares it with a preset threshold, automatically deciding whether a balance adjustment is needed based on a clear numerical standard. The pattern generation module is triggered when the judgment module determines that the residual copper rate difference exceeds the preset threshold. This module generates an auxiliary copper-clad pattern and then recalculates the residual copper rate difference after generating the auxiliary copper-clad pattern, sending the new difference back to the judgment module for further judgment; this process is repeated until the residual copper rate difference does not exceed the preset threshold.

[0046] The modules work closely together through functional interconnection and result feedback: the data acquisition module is the starting point for information input; the difference calculation module is the core of quantitative evaluation; the judgment module is the decision-making hub controlling the flow of the process; and the graph generation module is the execution and feedback unit that performs specific balancing operations and drives iterative optimization. Through the coordinated operation of these modules, the entire system forms a complete and automated closed loop of "data acquisition - quantitative evaluation - intelligent decision-making - execution feedback," thus systematically achieving automatic balancing and solving the warpage problem of copper foil distribution on ceramic-based printed circuit boards without human intervention.

[0047] This invention also provides a computer device in specific embodiments. Specifically, the computer device includes a processor and a memory. The memory stores a computer program, which includes program instructions. The processor executes the program instructions stored in the computer storage medium. The processor may be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. It is the computing and control core of the terminal, suitable for implementing one or more instructions, specifically suitable for loading and executing one or more instructions to achieve corresponding method flows or corresponding functions. The processor described in this embodiment can be used to acquire copper area data of the top and bottom layers of the ceramic-based printed circuit board to be processed. Based on the copper area data, calculate the difference in residual copper rate between the top and bottom layers of the graphic; Determine whether the difference in residual copper rate exceeds a preset threshold; If the residual copper rate difference exceeds the preset threshold, an auxiliary copper plating pattern is generated. The residual copper rate difference after generating the auxiliary copper plating pattern is calculated, and the residual copper rate difference is repeatedly checked to see if it exceeds the preset threshold until the residual copper rate difference does not exceed the preset threshold.

[0048] This invention also provides a storage medium, specifically a computer-readable storage medium, which is a memory device in a terminal device used to store programs and data. It is understood that the computer-readable storage medium here can include both the built-in storage medium in the terminal device and extended storage media supported by the terminal device. The computer-readable storage medium provides storage space, which stores the terminal's operating system. Furthermore, the storage space also stores one or more instructions suitable for loading and execution by a processor. These instructions can be one or more computer programs (including program code). It should be noted that the computer-readable storage medium here can be a high-speed RAM memory or a non-volatile memory, such as at least one disk storage device. The processor can load and execute one or more instructions stored in the computer-readable storage medium to implement the corresponding steps of the methods in the above embodiments; the one or more instructions in the computer-readable storage medium are loaded and executed by the processor to perform the following steps: obtaining the copper area data of the top and bottom layers of the ceramic-based printed circuit board to be processed; Based on the copper area data, calculate the difference in residual copper rate between the top and bottom layers of the graphic; Determine whether the difference in residual copper rate exceeds a preset threshold; If the residual copper rate difference exceeds the preset threshold, an auxiliary copper plating pattern is generated. The residual copper rate difference after generating the auxiliary copper plating pattern is calculated, and the residual copper rate difference is repeatedly checked to see if it exceeds the preset threshold until the residual copper rate difference does not exceed the preset threshold.

[0049] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0050] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0051] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0052] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0053] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the scope of the invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0054] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that can be understood by those skilled in the art. The above content is only for illustrating the technical concept of the present invention and should not be construed as limiting the scope of protection of the present invention. Any modifications made based on the technical concept proposed in this invention shall fall within the scope of protection of the claims of this invention.

Claims

1. A solution to the warping of ceramic-based printed circuit boards, characterized in that, include: Obtain the copper area data of the top and bottom layers of the ceramic-based printed circuit board to be processed; Based on copper area data, the difference in residual copper rate between the top and bottom layers is calculated to quantitatively assess the degree of internal stress imbalance caused by uneven distribution of copper foil between the top and bottom layers. Determine whether the difference in residual copper rate exceeds a preset threshold; If the residual copper rate difference exceeds the preset threshold, an auxiliary copper plating pattern is generated to adjust the copper foil distribution area of ​​the corresponding layer. The residual copper rate difference after generating the auxiliary copper plating pattern is calculated, and the residual copper rate difference is repeatedly checked to see if it exceeds the preset threshold until the residual copper rate difference does not exceed the preset threshold.

2. The method for resolving warping of ceramic-based printed circuit boards according to claim 1, characterized in that, The calculation of the residual copper ratio difference between the top-level and bottom-level patterns includes: The copper area data of the top-level graphic is stored in the first temporary file; The copper area data of the underlying graphic is stored in a second temporary file; Based on the data stored in the first temporary file and the second temporary file, the difference between the residual copper rate of the top layer and the residual copper rate of the bottom layer is calculated to obtain the residual copper rate difference.

3. The method for resolving warping of ceramic-based printed circuit boards according to claim 2, characterized in that, The calculation method for the residual copper rate of the top layer is as follows: Top layer residual copper ratio = (S1 + X) / d In the formula, S1 is the top copper area, X is the top auxiliary copper area, and d is the panel area.

4. The method for resolving warping of ceramic-based printed circuit boards according to claim 2, characterized in that, The calculation method for the residual copper ratio of the bottom layer is as follows: Underlying copper residue ratio = (S2 + Y) / d In the formula, S2 is the area of ​​the bottom copper layer, Y is the area of ​​the bottom auxiliary copper layer, and d is the area of ​​the panel.

5. The method for resolving warping of ceramic-based printed circuit boards according to claim 1, characterized in that, The preset threshold is 1%.

6. The method for resolving warping of ceramic-based printed circuit boards according to claim 1, characterized in that, The auxiliary copper-clad pattern is generated in the non-functional circuit regions of the top layer pattern and / or the bottom layer pattern.

7. A method for resolving warping of ceramic-based printed circuit boards according to claim 6, characterized in that, The auxiliary copper-clad pattern includes copper strips and / or cut channels.

8. A ceramic-based printed circuit board warpage resolution system, characterized in that, include: The data acquisition module is used to acquire the copper area data of the top and bottom layers of the ceramic-based printed circuit board to be processed. The difference calculation module is used to calculate the difference in residual copper rate between the top layer and the bottom layer based on copper area data; The judgment module is used to determine whether the difference in residual copper rate exceeds a preset threshold. The pattern generation module is used to generate an auxiliary copper plating pattern if the residual copper rate difference exceeds a preset threshold, calculate the residual copper rate difference after generating the auxiliary copper plating pattern, and repeatedly judge whether the residual copper rate difference exceeds the preset threshold until the residual copper rate difference does not exceed the preset threshold.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the ceramic-based printed circuit board warpage solution as described in any one of claims 1 to 7.

10. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by the processor, it implements the steps of the ceramic-based printed circuit board warpage solution as described in any one of claims 1 to 7.

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