High-precision integrated circuit chip wafer bonding device

Abstract

The invention relates to the technical field of chip wafer bonding, and discloses a high-precision integrated circuit chip wafer bonding device which comprises a bonding table, a vacuum seat, a first wafer seat and a second wafer seat, the vacuum seat is installed on the bonding table, and the first wafer seat and the second wafer seat are distributed in an aligned mode from bottom to top. The first wafer seat and the second wafer seat are respectively provided with a groove matched with a wafer, and the two grooves are upwards distributed in an aligned manner. The grooves of the first wafer seat and the second wafer seat are distributed upwards, so that an operator and a manipulator can visually observe the relative positions of the notches and the grooves of the wafer in the wafer loading stage, accurate alignment and matching of the notches and the grooves can be conveniently completed, the state of the wafer can be conveniently detected, and meanwhile, the wafer loading efficiency is improved. The upward design of the groove provides a sufficient loading and unloading operation space for the wafer, and the wafer can be stably loaded or taken out from the upper part, thereby effectively avoiding the problems of mechanical arm loading interference, wafer scratching and falling caused by the traditional downward design of the groove.

Description

Technical Field

[0001] This invention relates to the field of chip wafer bonding technology, specifically a high-precision integrated circuit chip wafer bonding device. Background Technology

[0002] Integrated circuit chip wafer bonding equipment is used to bond two or more wafers together tightly through physical or chemical processes. The main function of wafer bonding equipment is to align and bond the wafers. Through a precise alignment system, the chip positions on the wafers to be bonded are accurately matched. Then, appropriate pressure, temperature, and time conditions are applied to form a strong bonding interface between the wafers, such as covalent bonds or metallic bonds, to meet the process requirements of integrated circuit chip manufacturing.

[0003] In the existing technology, mainstream wafer bonding equipment generally adopts a groove structure that matches the wafer notch / outer circle contour to complete the pre-positioning in the dual wafer clamping process, which aims to provide a stable initial alignment reference for subsequent bonding processes.

[0004] However, because the grooves on the upper wafer are arranged downwards, during wafer loading, operators and robotic arms cannot directly observe the relative positions of the wafer notch and the grooves, making it difficult to accurately align them. At the same time, the orientation of the grooves greatly restricts the operating space, hindering the wafer loading and unloading process. This not only increases the risk of scratches and breakage of fragile components such as ultra-thin wafers, but also introduces additional positioning errors due to loading deviations, which adversely affects the accuracy and yield of subsequent bonding processes.

[0005] To address the problems mentioned above, those skilled in the art have proposed a high-precision integrated circuit chip wafer bonding device. Summary of the Invention

[0006] The purpose of this invention is to provide a high-precision integrated circuit chip wafer bonding device to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A high-precision integrated circuit chip wafer bonding apparatus includes a bonding stage, a vacuum holder, a first wafer holder, and a second wafer holder. The vacuum holder is mounted on the bonding stage, and the first and second wafer holders are aligned from bottom to top. The bottom of the first wafer holder is connected to the vacuum holder via several support rods. Rotary shafts are mounted at the center of both ends of the second wafer holder. Both the first and second wafer holders have grooves adapted to the wafer, and both grooves are aligned and facing upwards. The grooves are used for pre-positioning the wafer. The grooves include arc-shaped portions and flat edges. The apparatus also includes:

[0009] The horizontal flipping component is connected to the rotating shaft. During the process of the second wafer pedestal descending and docking with the first wafer pedestal to perform wafer bonding, the second wafer pedestal can be driven to perform horizontal flipping, so that the groove of the originally upward-facing second wafer pedestal rotates to a downward-facing state, so that the bonding surfaces of the wafers adsorbed and fixed in the two grooves can be in a relative state.

[0010] An elastic guiding component is disposed inside the vacuum seat and connected to the horizontal flipping component. It is used to provide elastic support and guidance for the horizontal flipping component. After the second wafer seat completes the horizontal flipping, it can maintain a horizontal state and continue to descend until the two wafers complete the bonding operation.

[0011] A limiting component is disposed inside the vacuum seat and connected to the horizontal flipping component. After the second wafer seat descends and completes the horizontal flipping, the limiting component will automatically limit the second wafer seat.

[0012] A bonding assembly is disposed within a vacuum chamber and is used to drive the second wafer pedestal to descend, causing it to flip horizontally, and then perform the wafer bonding operation.

[0013] A negative pressure adsorption component is disposed at the bottom of the first wafer pedestal and the second wafer pedestal, and is used to adsorb and fix the wafer placed in the groove.

[0014] A sealing assembly is disposed on the bonding stage and is used to seal the wafer bonding area in conjunction with the vacuum holder to facilitate vacuuming.

[0015] As a preferred embodiment of the present invention, the horizontal flipping assembly includes movable frames symmetrically distributed on both sides of the second wafer pedestal, a plurality of movable rods are installed in the movable frames, movable frames are slidably arranged on the movable rods, the rotating shaft is rotatably connected to the movable frames, and a gear is installed at the end of the rotating shaft, and a rack that meshes with the gear is installed on the movable frames.

[0016] As a preferred embodiment of the present invention, the elastic guide assembly includes two symmetrically distributed guide frames installed in the vacuum seat. The guide frames have guide grooves that slide with the movable frame. The bottom of the movable frame is equipped with a slide rod that slides with the guide frame. A stop block is installed at the bottom end of the slide rod. A spring sleeved on the slide rod is provided between the bottom of the movable frame and the bottom of the guide frame.

[0017] As a preferred embodiment of the present invention, the limiting component includes sleeves installed on both sides of the movable frame, with pins slidably connected inside the sleeves, and two slots that cooperate with the pins are opened on both sides of the second wafer base, with the pins connected to a driving component.

[0018] As a preferred technical solution of the present invention, the driving member includes two symmetrically distributed driving frames installed in the vacuum seat. Both sides of the inner wall of the driving frame are provided with driving grooves, and the driving grooves are Z-shaped. A pulley that is slidably engaged with the driving groove is rotatably provided on the outer side of the plug pin.

[0019] As a preferred technical solution of the present invention, the bonding component includes two symmetrically distributed mounting frames installed in the vacuum seat, and a first telescopic member connected to the movable frame is installed on the mounting frame.

[0020] As a preferred technical solution of the present invention, the negative pressure adsorption component includes a plurality of annularly distributed adsorption holes opened in the groove, and adsorption discs connected to the adsorption holes are provided at the bottoms of the first wafer seat and the second wafer seat, and the adsorption discs are connected to negative pressure adsorption tubes.

[0021] As a preferred technical solution of the present invention, the sealing component includes a plurality of support rods installed on both sides of the bonding table. The top of the support rod is installed with a top plate. A sealing cover that cooperates with the vacuum seat is slidably provided on the support rod, and a second telescopic member is provided between the sealing cover and the top plate.

[0022] As a preferred technical solution of the present invention, a vacuum pumping device is provided in the vacuum seat.

[0023] The present invention has the following advantages: By making the grooves of the first wafer seat and the second wafer seat face upward, the operator and the manipulator can directly observe the relative positions of the wafer notch and the groove during the wafer loading stage, conveniently complete the accurate alignment and cooperation between the two, and it is also convenient to detect the state of the wafer. At the same time, the upward groove design provides sufficient space for loading and unloading the wafer. The wafer can be smoothly loaded or taken out from above, effectively avoiding problems such as manipulator loading interference, wafer scratching and dropping caused by the traditional downward groove design. In addition, the present invention does not require a separate driving and control module for flipping and limiting, but relies on the downward power of the bonding component to achieve linkage, simplifies the mechanical structure and control system logic of the equipment, reduces the failure points, and reduces the manufacturing and later maintenance costs of the equipment. The flipping action is synchronized with the downward process, avoiding the risk of attitude deviation caused by step-by-step operation; cooperating with the automatic limit component, the horizontal attitude of the second wafer seat can be firmly fixed before bonding and pressing, completely eliminating the problem of uneven pressure distribution caused by the tilt of the wafer seat, ensuring uniform bonding of the upper and lower wafer bonding surfaces, effectively reducing the interface void ratio, and improving the bonding yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic structural diagram of a high-precision integrated circuit chip wafer bonding device.

[0025] Figure 2This is a top view of the bonding stage in a high-precision integrated circuit chip wafer bonding device.

[0026] Figure 3 This is a schematic diagram of the internal structure of a vacuum socket in a high-precision integrated circuit chip wafer bonding device.

[0027] Figure 4 This is a schematic diagram of the structure of the first wafer mount and the second wafer mount in a high-precision integrated circuit chip wafer bonding device.

[0028] Figure 5 This is a schematic diagram of the negative pressure adsorption component in a high-precision integrated circuit chip wafer bonding device.

[0029] Figure 6 This is a schematic diagram of one side of the horizontal flipping assembly in a high-precision integrated circuit chip wafer bonding device.

[0030] Figure 7 This is a schematic diagram of the other side of a horizontal flipping assembly in a high-precision integrated circuit chip wafer bonding device.

[0031] Figure 8 This is a schematic diagram of the structure of an elastic guiding component in a high-precision integrated circuit chip wafer bonding device.

[0032] Figure 9 This is a schematic diagram of the pin and slot mating structure in a high-precision integrated circuit chip wafer bonding device.

[0033] Figure 10 This is a schematic diagram of the structure of a driving component in a high-precision integrated circuit chip wafer bonding device.

[0034] Figure 11 This is a schematic diagram of the drive frame in a high-precision integrated circuit chip wafer bonding device.

[0035] In the diagram: 101, bonding stage; 102, vacuum seat; 201, first wafer seat; 202, second wafer seat; 203, groove; 204, arc-shaped part; 205, flat edge; 206, support rod; 207, rotating shaft; 3, negative pressure adsorption assembly; 301, adsorption hole; 302, adsorption plate; 303, negative pressure adsorption tube; 4, horizontal flipping assembly; 401, movable frame; 402, movable rod; 403, movable frame; 404, gear; 405, rack; 5, elastic guide. Components; 501, guide frame; 502, guide groove; 503, slide rod; 504, stop block; 505, spring; 6, limit assembly; 601, sleeve; 602, pin; 603, slot; 604, pulley; 605, drive frame; 606, drive groove; 7, bonding assembly; 701, mounting bracket; 702, first telescopic component; 8, sealing assembly; 801, support rod; 802, sealing cover; 803, top plate; 804, second telescopic component; 9, vacuum equipment. Detailed Implementation

[0036] The technical solution of the present invention will be further described in detail below with reference to specific embodiments.

[0037] Please see Figures 1-11 A high-precision integrated circuit chip wafer bonding apparatus includes a bonding stage 101, a vacuum seat 102, a first wafer seat 201, and a second wafer seat 202. The vacuum seat 102 is mounted on the bonding stage 101, and the first wafer seat 201 and the second wafer seat 202 are aligned from bottom to top. The bottom of the first wafer seat 201 is connected to the vacuum seat 102 via several support rods 206. Rotating shafts 207 are mounted at the center of both ends of the second wafer seat 202. Both the first wafer seat 201 and the second wafer seat 202 have grooves 203 adapted to the wafer, and both grooves 203 are aligned and facing upwards. The grooves 203 are used for pre-positioning the wafer. Each groove 203 has an arc-shaped portion 204 and a flat edge portion 205. The arc-shaped portion 204 corresponds to the arc edge of the wafer, and the flat edge portion 205 corresponds to the notch position of the wafer. The apparatus also includes:

[0038] The horizontal flipping component 4 is connected to the rotating shaft 207. During the process of the second wafer seat 202 descending and docking with the first wafer seat 201 to perform wafer bonding, the second wafer seat 202 can be driven to perform horizontal flipping, so that the groove 203 of the originally upward second wafer seat 202 rotates to the downward state, so that the bonding surfaces of the wafers adsorbed and fixed in the two grooves 203 can be in a relative state.

[0039] The elastic guide component 5 is disposed in the vacuum seat 102 and connected to the horizontal flipping component 4. It is used to provide elastic support and guidance for the horizontal flipping component 4. After the second wafer seat 202 completes the horizontal flipping, it can maintain the horizontal state and continue to descend until the two wafers complete the bonding operation.

[0040] The limiting component 6 is disposed inside the vacuum seat 102 and connected to the horizontal flipping component 4. After the second wafer seat 202 descends and completes the horizontal flipping, it will automatically limit the second wafer seat 202.

[0041] Bonding assembly 7 is disposed inside vacuum seat 102 and is used to drive the second wafer seat 202 to descend, so that it is flipped horizontally and the wafer bonding operation is performed.

[0042] The negative pressure adsorption component 3 is disposed at the bottom of the first wafer holder 201 and the second wafer holder 202, and is used to adsorb and fix the wafer placed in the groove 203.

[0043] The sealing component 8 is disposed on the bonding stage 101 and is used to cooperate with the vacuum seat 102 to seal the wafer bonding area, so as to facilitate vacuuming.

[0044] In one instance of this embodiment, please refer to Figure 3 , Figure 6 and Figure 7 The horizontal flipping assembly 4 includes movable frames 401 symmetrically distributed on both sides of the second wafer pedestal 202. Several movable rods 402 are installed in the movable frames 401. Movable frames 403 are slidably arranged on the movable rods 402. The rotating shaft 207 is rotatably connected to the movable frame 403. A gear 404 is installed at the end of the rotating shaft 207. A rack 405 that meshes with the gear 404 is installed on the movable frame 401.

[0045] In the initial state, the movable frame 401 is located at its initial highest position under the elastic limit of the elastic guide component 5, and the movable frame 403 is located at the top of the movable rod 402. At this time, the grooves 203 of the first wafer seat 201 and the second wafer seat 202 are both distributed upwards.

[0046] After the robotic arm loads the wafer into the groove 203 and the negative pressure adsorption component 3 completes the adsorption and fixation of the wafer, the bonding component 7 starts to drive the movable frame 403 to descend along the movable rod 402. Simultaneously, the second wafer holder 202 on the rotating shaft 207 also descends synchronously, and the second wafer holder 202 gradually approaches the first wafer holder 201.

[0047] During the descent of the movable frame 403, the gear 404 meshes and rotates along the rack 405, causing the rotating shaft 207 to rotate synchronously, thereby driving the second wafer holder 202 to flip. When the movable frame 403 moves to the bottom of the movable rod 402, the second wafer holder 202 is in a horizontal state, and the groove 203 on it is facing downward. In this way, the horizontal flipping of the second wafer holder 202 can be automatically completed during the process of driving the second wafer holder 202 to move down to bond the wafer, and the bonding surfaces of the wafers in the two grooves 203 are in a relative state, which facilitates the bonding operation.

[0048] In one instance of this embodiment, please refer to Figure 3 , Figure 6 and Figure 8 The elastic guide assembly 5 includes two symmetrically distributed guide frames 501 installed in the vacuum seat 102. The guide frames 501 have guide grooves 502 that slide with the movable frame 401. The bottom of the movable frame 401 is equipped with a slide rod 503 that slides with the guide frame 501. A stop block 504 is installed at the bottom end of the slide rod 503. A spring 505 is sleeved on the slide rod 503 between the bottom of the movable frame 401 and the bottom of the guide frame 501.

[0049] In the initial state, under the elastic force of the spring 505, the movable frame 401 is located at the top of the guide groove 502. When the bonding assembly 7 drives the second wafer pedestal 202 to start moving downward, under the elastic force of the spring 505, the movable frame 401 will not slide down along the guide groove 502. Instead, the movable frame 403 will first move down along the movable rod 402. This design ensures that the second wafer pedestal 202 completes a 180° horizontal flip before descending and docking, avoiding interference between the flipping and downward movement.

[0050] When the movable frame 403 moves to the bottom of the movable rod 402, the second wafer base 202 completes the horizontal flipping. Subsequently, the movable frame 403 will start to push the movable frame 401, causing the movable frame 401 to start to move down along the guide groove 502. During this process, the relative position of the movable frame 403 and the movable frame 401 remains unchanged, so that the second wafer base 202 remains in a horizontal state, which facilitates docking with the first wafer base 201 and performing bonding operations, and also facilitates limiting operations.

[0051] In one instance of this embodiment, please refer to Figures 9-11 The limiting component 6 includes sleeves 601 installed on both sides of the movable frame 403. A pin 602 is slidably connected inside the sleeve 601. Two slots 603 that cooperate with the pin 602 are opened on both sides of the second wafer base 202. The pin 602 is connected to a driving component.

[0052] Furthermore, the driving component includes two symmetrically distributed driving frames 605 installed in the vacuum seat 102. Both sides of the inner wall of the driving frame 605 are provided with driving grooves 606, which are Z-shaped. The outer side of the pin 602 is rotatably provided with a pulley 604 that slides with the driving groove 606.

[0053] During the process of the bonding assembly 7 driving the movable frame 403 to move down along the movable rod 402 and driving the rotating shaft 207 to rotate, causing the second wafer pedestal 202 to flip horizontally, the pulley 604 will slide along the vertical groove inside the Z-shaped drive groove 606, so that the pin 602 is located outside the slot 603, avoiding the pin 602 from affecting the flipping of the second wafer pedestal 202.

[0054] After the second wafer pedestal 202 completes its horizontal flipping, driven by the bonding assembly 7, the movable frame 403 pushes the movable frame 401 to continue moving downward along the guide groove 502. During the downward movement, the pulley 604 begins to slide along the inclined groove of the Z-shaped drive groove 606, causing the pin 602 to slide along the sleeve 601 and gradually approach the slot 603. When the pulley 604 passes the inclined groove of the Z-shaped drive groove 606, the pin 602 will be fully inserted into the slot 603. Afterward, the pulley 604 will slide along the vertical groove on the outside of the Z-shaped drive groove 606, thereby maintaining the state of the pin 602 inserted into the slot 603. This can firmly fix the horizontal posture of the second wafer pedestal 202 before bonding pressure is applied, completely eliminating the problem of uneven pressure distribution caused by the tilt of the wafer pedestal, and ensuring that the upper and lower wafer bonding surfaces are evenly bonded.

[0055] In one instance of this embodiment, please refer to Figure 3 The bonding assembly 7 includes two symmetrically distributed mounting brackets 701 installed in the vacuum seat 102, and a first telescopic member 702 connected to the movable frame 403 is installed on the mounting brackets 701.

[0056] During the bonding process of wafers in the grooves 203 of the first wafer holder 201 and the second wafer holder 202, the movable frame 403 is driven to move downward by the first telescopic member 702, thereby synchronously driving the second wafer holder 202 to move downward, which facilitates the alignment and bonding of the wafers in the two grooves 203. A pressure sensor is also provided between the first telescopic member 702 and the movable frame 403 to monitor the bonding pressure.

[0057] It should be noted that the specific structure of the first telescopic member 702 is not limited. Preferably, the first telescopic member 702 is set as a hydraulic rod.

[0058] In one instance of this embodiment, please refer to Figure 4 and Figure 5The negative pressure adsorption component 3 includes a plurality of adsorption holes 301 arranged in a ring in the groove 203, and the bottom of the first wafer seat 201 and the second wafer seat 202 are both provided with adsorption disks 302 connected to the adsorption holes 301, and the adsorption disks 302 are connected to negative pressure adsorption tubes 303.

[0059] Adsorption holes 301 are distributed in the edge area of ​​groove 203, and the bonding surface is suspended to avoid the formation of suction cup marks.

[0060] After the robotic arm precisely loads the wafer into the groove 203, the vacuum pump connected to the negative pressure adsorption tube 303 extracts the air from the adsorption hole 301 and the adsorption plate 302, thereby generating negative pressure. This negative pressure adsorption can then be used to adsorb the wafer in the groove 203, completing the adsorption and fixation of the wafer. This facilitates the horizontal flipping of the wafer in the groove 203 of the second wafer holder 202 and the wafer bonding operation.

[0061] In one instance of this embodiment, please refer to Figure 1 The sealing assembly 8 includes several support rods 801 installed on both sides of the bonding table 101. A top plate 803 is installed on the top of the support rods 801. A sealing cover 802 that cooperates with the vacuum seat 102 is slidably disposed on the support rods 801, and a second telescopic member 804 is disposed between the sealing cover 802 and the top plate 803.

[0062] Furthermore, a vacuum pumping device 9 is provided inside the vacuum seat 102. The vacuum pumping device 9 adopts a rotary vane vacuum pump to provide a vacuum environment for the bonding chamber.

[0063] After the wafer is loaded, a vacuum environment needs to be set up for bonding operations. The sealing cover 802 is driven to descend by the second telescopic component 804 and dock with the vacuum seat 102 to achieve regional sealing. Then, the vacuum pumping device 9 is used to evacuate the area, and then the wafer bonding operation can be performed.

[0064] The working principle of this invention is as follows: a robotic arm precisely loads the wafers to be bonded into the grooves 203 of the first wafer holder 201 and the second wafer holder 202. Since the grooves 203 of the two wafer holders are both upward-facing, it is convenient for the robotic arm to load the wafers into the grooves 203. At the same time, the robotic arm also has sufficient operating space. During the wafer loading stage, the operator and the robotic arm can also directly observe the relative position of the wafer notch and the groove 203, which facilitates the precise alignment and matching of the two. Then, the negative pressure adsorption component 3 applies negative pressure adsorption to the wafer in the groove 203, so that the wafer can be fixed in the groove 203, which facilitates the horizontal flipping of the second wafer holder 202 and the bonding operation of the wafer. Thus, the wafer loading is completed.

[0065] Subsequently, the sealing assembly 8, together with the vacuum holder 102, seals the wafer bonding area, and the vacuum device 9 evacuates the area. The heating device built into the vacuum holder 102 then heats the wafer to the bonding temperature.

[0066] The heating device is embedded inside the first wafer pedestal 201 and the second wafer pedestal 202, and supports zoned temperature control to ensure uniform temperature of the bonding surface.

[0067] Subsequently, the bonding assembly 7 begins to drive the second wafer pedestal 202 to descend and approach the first wafer pedestal 201. During this process, the horizontal flipping assembly 4 begins to drive the rotating shaft 207 to rotate, causing the second wafer pedestal 202 to be horizontally flipped, so that the groove 203 of the second wafer pedestal 202, which was originally facing upward, rotates to a downward state and is in a relative state with the groove 203 of the first wafer pedestal 201.

[0068] As the second wafer pedestal 202 continues to descend, it begins to move along the elastic guide component 5, thereby facilitating precise docking of the first wafer pedestal 201 and the second wafer pedestal 202. The limiting component 6 automatically limits the second wafer pedestal 202, thus firmly fixing its horizontal orientation before bonding pressure is applied, completely eliminating the problem of uneven pressure distribution caused by wafer pedestal tilt, and ensuring uniform bonding of the upper and lower wafer bonding surfaces.

[0069] As the second wafer pedestal 202 continues to descend after being flipped and limited, the built-in vision alignment system compensates for positioning errors through a piezoelectric micro-displacement platform (achieving X / Y / θ three-dimensional micro-adjustment) connected to the groove 203. The piezoelectric micro-displacement platform is installed at the bottom of the first wafer pedestal 201, so that the wafers in the two grooves 203 can be precisely aligned. Under the pressure of the bonding component 7, the first wafer pedestal 201 and the second wafer pedestal 202 dock and perform bonding operations on the two wafers in the grooves 203.

[0070] The power supply and control of the electrical equipment in this application are all existing technologies and will not be elaborated upon here. The control of each component can be achieved using a PLC controller disclosed in the prior art, and the model and circuit connection of each component are not specifically limited. All electrical equipment involved are existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The scope of protection of this invention does not involve improvements to the software and methods.

[0071] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0072] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A high precision integrated circuit chip wafer bonding apparatus comprising a bonding stage, a vacuum chuck, a first wafer chuck and a second wafer chuck, characterized by, The vacuum mount is mounted on the bonding stage, and the first wafer mount and the second wafer mount are aligned from bottom to top. The bottom of the first wafer mount is connected to the vacuum mount via several support rods. A rotating shaft is installed at the center of both ends of the second wafer mount. Both the first and second wafer mounts have grooves adapted to the wafer, and both grooves are aligned and facing upwards. The grooves are used for pre-positioning the wafer. The grooves include an arc-shaped portion and a flat edge portion. The device also includes: The horizontal flipping component is connected to the rotating shaft. During the process of the second wafer pedestal descending and docking with the first wafer pedestal to perform wafer bonding, the second wafer pedestal can be driven to perform horizontal flipping, so that the groove of the originally upward-facing second wafer pedestal rotates to a downward-facing state, so that the bonding surfaces of the wafers adsorbed and fixed in the two grooves can be in a relative state. An elastic guiding component is disposed inside the vacuum seat and connected to the horizontal flipping component. It is used to provide elastic support and guidance for the horizontal flipping component. After the second wafer seat completes the horizontal flipping, it can maintain a horizontal state and continue to descend until the two wafers complete the bonding operation. A limiting component is disposed inside the vacuum seat and connected to the horizontal flipping component. After the second wafer seat descends and completes the horizontal flipping, the limiting component will automatically limit the second wafer seat. A bonding assembly is disposed within a vacuum chamber and is used to drive a second wafer pedestal to descend, causing it to flip horizontally, and then perform wafer bonding operations.

2. The high precision integrated circuit chip-to-wafer bonding apparatus according to claim 1, wherein The horizontal flipping assembly includes movable frames symmetrically distributed on both sides of the second wafer pedestal. Several movable rods are installed inside the movable frames, and movable frames are slidably mounted on the movable rods. The rotating shaft is rotatably connected to the movable frames, and a gear is installed at the end of the rotating shaft. A rack that meshes with the gear is installed on the movable frames.

3. The high-precision integrated circuit chip wafer bonding apparatus according to claim 2, characterized in that, The elastic guide assembly includes two symmetrically distributed guide frames installed inside the vacuum seat. The guide frames have guide grooves that slide with the movable frame. The bottom of the movable frame is equipped with a slide rod that slides with the guide frame. A stop block is installed at the bottom end of the slide rod. A spring is sleeved on the slide rod between the bottom of the movable frame and the bottom of the guide frame.

4. The high-precision integrated circuit chip wafer bonding apparatus according to claim 3, characterized in that, The limiting component includes sleeves installed on both sides of the movable frame, with pins slidably connected inside the sleeves. Two slots that cooperate with the pins are opened on both sides of the second wafer base, and the pins are connected to a driving component.

5. The high-precision integrated circuit chip wafer bonding apparatus according to claim 4, characterized in that, The driving component includes two symmetrically distributed driving frames installed inside the vacuum seat. Both sides of the inner wall of the driving frame are provided with driving grooves, which are Z-shaped. The outer side of the pin is provided with a pulley that slides with the driving groove.

6. The high-precision integrated circuit chip wafer bonding apparatus according to claim 5, characterized in that, The bonding assembly includes two symmetrically distributed mounting brackets installed within a vacuum mount, with a first telescopic member connected to a movable bracket mounted on the mounting bracket.

7. The high-precision integrated circuit chip wafer bonding apparatus according to claim 1, characterized in that, The bottom of both the first wafer holder and the second wafer holder is provided with a negative pressure adsorption component for adsorbing and fixing the wafer placed in the groove. The component includes several adsorption holes arranged in a ring in the groove. The bottom of both the first wafer holder and the second wafer holder is provided with an adsorption plate connected to the adsorption holes. The adsorption plate is connected to a negative pressure adsorption tube.

8. The high-precision integrated circuit chip wafer bonding apparatus according to claim 1, characterized in that, The bonding platform is provided with a sealing assembly that cooperates with the vacuum seat, including several support rods installed on both sides of the bonding platform, a top plate installed on the top of the support rods, a sealing cover that cooperates with the vacuum seat slidably installed on the support rods, and a second telescopic member is provided between the sealing cover and the top plate.

9. The high-precision integrated circuit chip wafer bonding apparatus according to claim 8, characterized in that, The vacuum seat is equipped with a vacuum pumping device.

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